Inverter assembly, electric drive assembly and vehicle

Abstract

The invention provides an inverter assembly, an electric drive assembly and a vehicle. The inverter assembly comprises: an inverter housing, wherein the inverter housing is provided with a capacitor encapsulation cavity; the capacitor assembly is located in the capacitor potting cavity, the capacitor assembly is connected with the inverter shell through pouring sealant, the inverter shell is provided with a heat dissipation channel, the heat dissipation channel is used for circulation of cooling liquid, and at least part of the side wall of the heat dissipation channel is adjacent to the side wall of the capacitor potting cavity. Therefore, the capacitor assembly exchanges heat with the cooling liquid in the heat dissipation channel through the side wall of the capacitor encapsulation cavity. According to the inverter assembly disclosed by the invention, the capacitor encapsulation cavity and the heat dissipation channel are formed in the inverter shell, so that the mounting and fixing space for independently packaging the capacitor and the heat dissipation glue coating link are effectively saved, the size and the weight of the inverter assembly are reduced, and the problem of overlarge size of the inverter assembly in the prior art is solved; therefore, the inverter assembly occupies a small space in the whole vehicle assembling process.

Description

Technical Field

[0001] This invention relates to the field of electric drive assemblies, and more specifically, to an inverter assembly, an electric drive assembly, and a vehicle. Background Technology

[0002] The inverter is a control component of the electric drive system, significantly impacting the performance of new energy vehicles and the overall vehicle space. In existing technologies, when assembling the inverter housing with other components, taking capacitor installation as an example, the pre-encapsulated capacitors are typically coated with thermal adhesive before being installed onto the inverter housing. Because the capacitors themselves are relatively large, and the thermal adhesive also adds volume, the inverter housing requires a relatively large assembly space to accommodate the capacitors. This increases the size of the inverter housing, resulting in an increase in the final size and weight of the inverter assembly. An excessively large inverter assembly occupies a significant amount of space during vehicle assembly, hindering overall vehicle layout. Summary of the Invention

[0003] The main objective of this invention is to provide an inverter assembly, an electric drive assembly, and a vehicle to solve the problem of excessively large inverter assemblies in the prior art.

[0004] To achieve the above objectives, according to one aspect of the present invention, an inverter assembly is provided, comprising: an inverter housing having a capacitor potting cavity; a capacitor assembly located within the capacitor potting cavity and connected to the inverter housing via potting compound; wherein the inverter housing has a heat dissipation channel for circulating coolant, and at least a portion of the sidewall of the heat dissipation channel is adjacent to the sidewall of the capacitor potting cavity, so that the capacitor assembly exchanges heat with the coolant in the heat dissipation channel through the sidewall of the capacitor potting cavity.

[0005] Furthermore, the inverter housing also has a module mounting section and a module cooling cavity, which are connected to the heat dissipation channel. The inverter assembly also includes a power module with heat dissipation components. The power module is connected to the inverter housing through the module mounting section. The power module blocks the opening of the module cooling cavity, and the heat dissipation components are located inside the module cooling cavity.

[0006] Furthermore, the inverter housing includes: a main enclosure, a capacitor potting cavity, a module cooling cavity, and a module mounting section on the first side of the main enclosure, a water storage tank assembly on the second side of the main enclosure, an inlet and an outlet on the side wall of the water storage tank assembly, and an opening; the first side and the second side of the main enclosure are positioned opposite each other along the height direction of the main enclosure; a cover assembly connected to the main enclosure to seal the opening, and the water storage tank assembly and the cover assembly forming a heat dissipation channel; wherein, along the height direction of the main enclosure, the module cooling cavity and the water storage tank assembly at least partially overlap, and a through-hole assembly is provided at the bottom of the module cooling cavity, which communicates with the water storage tank assembly through the through-hole assembly.

[0007] Furthermore, the water storage tank assembly includes a first water storage tank and a second water storage tank, which are set independently of each other. The first water storage tank has an outlet on its side wall, and the second water storage tank has an inlet on its side wall. Along the height direction of the main body, the module cooling chamber is at least partially overlapped with the first water storage tank and the second water storage tank. The through hole assembly includes a first through hole and a second through hole set at intervals. The module cooling chamber is connected to the first water storage tank through the first through hole, and the module cooling chamber is connected to the second water storage tank through the second through hole.

[0008] Furthermore, the opening includes a first opening of the first water storage tank and a second opening of the second water storage tank, and the cover assembly includes a first cover plate and a second cover plate. The first cover plate is connected to the main body to block the first opening, and the second cover plate is connected to the main body to block the second opening.

[0009] Furthermore, the bottom of the capacitor potting cavity is provided with multiple heat dissipation protrusions.

[0010] Furthermore, the capacitor potting cavity includes a first potting cavity and a second potting cavity, and the capacitor assembly includes a bus capacitor and a filter capacitor. The bus capacitor is located in the first potting cavity, and the filter capacitor is located in the second potting cavity. The first potting cavity and the second potting cavity are connected and arranged in communication. The first potting cavity is adjacent to the module cooling cavity. A copper busbar support is provided on a portion of the inverter housing located between the first potting cavity and the module cooling cavity. The copper busbar support is used to support the capacitor copper busbar of the bus capacitor, and / or, the copper busbar support is used to support the module copper busbar of the power module.

[0011] Furthermore, the inverter housing also has a low-voltage connector mounting section, a DC connector mounting section, a DC wiring cavity, and an AC sensor mounting section, wherein the DC wiring cavity and the low-voltage connector mounting section are both arranged adjacent to the capacitor potting cavity.

[0012] According to another aspect of the present invention, an inverter assembly is provided, the inverter assembly being the inverter assembly described above, the electric drive assembly further comprising: a motor having a motor housing, the motor housing being connected to the inverter housing.

[0013] According to another aspect of the present invention, a vehicle is provided having at least one of an inverter assembly and an electric drive assembly, wherein the inverter assembly is the aforementioned inverter assembly and the electric drive assembly is the aforementioned electric drive assembly.

[0014] Using the technical solution of this application, the capacitor assembly is directly connected to the inverter housing via potting compound. The capacitor assembly is encapsulated simultaneously with its installation, avoiding the increased inverter assembly size caused by the need for separate encapsulation of the capacitor assembly before installation in existing technologies. This saves the installation and fixing space required for separate capacitor encapsulation, thereby reducing the volume of the inverter housing. Furthermore, by creating heat dissipation channels, the capacitor assembly can exchange heat with the coolant within the channels through the sidewalls of the capacitor potting cavity, more quickly transferring the heat generated during operation to the coolant, thus lowering the capacitor assembly temperature and improving its performance. For stability and lifespan, the capacitor assembly is installed onto the inverter housing using potting compound, allowing heat dissipation through the heat dissipation channels on the inverter housing. This eliminates the need for applying thermal paste after encapsulation in existing technologies, further reducing the size of the capacitor assembly and saving assembly steps. In this embodiment, the inverter assembly, by creating capacitor potting cavities and heat dissipation channels on the inverter housing, effectively saves the installation and fixing space for independently packaged capacitors and the thermal paste application process, reducing the size and weight of the inverter assembly. This solves the problem of excessively large inverter assemblies in existing technologies, allowing the inverter assembly to occupy less space in the vehicle assembly. Attached Figure Description

[0015] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0016] Figure 1 A schematic diagram of the structure of a first embodiment of the inverter assembly according to the present invention is shown;

[0017] Figure 2 A schematic diagram of a second embodiment of the inverter assembly according to the present invention is shown;

[0018] Figure 3 A schematic diagram of a third embodiment of the inverter assembly according to the present invention is shown;

[0019] Figure 4 A schematic diagram of a fourth embodiment of the inverter assembly according to the present invention is shown;

[0020] Figure 5 A schematic diagram of a fifth embodiment of the inverter assembly according to the present invention is shown;

[0021] Figure 6 A schematic diagram of a sixth embodiment of the inverter assembly according to the present invention is shown;

[0022] Figure 7 A schematic diagram of a seventh embodiment of the inverter assembly according to the present invention is shown;

[0023] The above figures include the following reference numerals:

[0024] 1. Inverter housing;

[0025] 11. Main tank; 111. Water storage tank assembly; 1111. First water storage tank; 1112. Second water storage tank; 1113. Side wall ribs;

[0026] 112. Inlet; 113. Outlet; 114. Opening; 1141. First opening; 1142. Second opening;

[0027] 12. Cover plate assembly; 121. First cover plate; 122. Second cover plate;

[0028] 101. Capacitor potting cavity; 1010. Heat dissipation protrusion; 1011. First potting cavity; 1012. Second potting cavity; 1013. Bus capacitor heat dissipation surface;

[0029] 102. Heat dissipation channel; 103. Module mounting section;

[0030] 104. Module cooling chamber; 1040. Through-hole assembly; 1041. First through-hole; 1042. Second through-hole;

[0031] 105. Copper busbar support section;

[0032] 106. Low-voltage connector installation section;

[0033] 107. DC connector mounting section;

[0034] 108. DC wiring cavity;

[0035] 109. AC Sensor Installation Department;

[0036] 2. Capacitor assembly;

[0037] 21. Busbar capacitor; 210. Capacitor copper busbar; 211. Capacitor core;

[0038] 22. Filter capacitor;

[0039] 3. Power module; 31. Module copper busbar;

[0040] 4. Circuit board;

[0041] 5. Capacitor potting compound;

[0042] 6. DC copper busbar;

[0043] 7. DC connectors;

[0044] 8. AC copper busbar;

[0045] 9. Low-voltage connectors;

[0046] 10. Shielding plate. Detailed Implementation

[0047] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0048] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0049] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0050] Exemplary embodiments according to this application will now be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. It should be understood that these embodiments are provided so that the disclosure of this application is thorough and complete, and that the concept of these exemplary embodiments is fully conveyed to those skilled in the art. In the drawings, for clarity, the thickness of layers and regions may be exaggerated, and the same reference numerals are used to denote the same devices, and therefore their description will be omitted. An inverter assembly, characterized in that it comprises:

[0051] Combination Figures 1 to 7 As shown, according to a specific embodiment of this application, an inverter assembly structure is provided.

[0052] The inverter assembly includes: an inverter housing 1, which has a capacitor potting cavity 101; and a capacitor assembly 2, which is located inside the capacitor potting cavity 101 and is connected to the inverter housing 1 by potting compound. The inverter housing 1 has a heat dissipation channel 102 for circulating coolant. At least a portion of the sidewall of the heat dissipation channel 102 is adjacent to the sidewall of the capacitor potting cavity 101 so that the capacitor assembly 2 can exchange heat with the coolant in the heat dissipation channel 102 through the sidewall of the capacitor potting cavity 101.

[0053] In this embodiment, the capacitor assembly 2 is directly connected to the inverter housing 1 via potting compound. The capacitor assembly 2 is encapsulated simultaneously with its installation, avoiding the increased inverter assembly size caused by the need for separate encapsulation of the capacitor assembly 2 before installation onto the inverter housing 1 in existing technologies. This saves installation and fixing space required for separate capacitor encapsulation, thereby reducing the volume of the inverter housing 1. By creating a heat dissipation channel 102, the capacitor assembly 2 can exchange heat with the coolant within the heat dissipation channel 102 through the sidewall of the capacitor potting cavity 101, more quickly transferring the heat generated during operation of the capacitor assembly 2 to the coolant, thus lowering the temperature of the capacitor assembly 2 and improving its performance. For stability and lifespan, the capacitor assembly 2 is installed onto the inverter housing 1 using potting compound, and heat dissipation is achieved through the heat dissipation channel 102 on the inverter housing 1. This eliminates the step of applying thermal adhesive after encapsulating the capacitor assembly 2 in the prior art, further reducing the volume of the capacitor assembly 2 and saving assembly steps for the inverter assembly. In this embodiment, the inverter assembly, by opening the capacitor potting cavity 101 and the heat dissipation channel 102 on the inverter housing 1, effectively saves the installation and fixing space of the independently packaged capacitors and the thermal adhesive application step, reducing the volume and weight of the inverter assembly. This solves the problem of excessively large inverter assembly volume in the prior art, allowing the inverter assembly to occupy less space in the vehicle assembly.

[0054] Specifically, the inverter housing also has a module mounting section 103 and a module cooling cavity 104. The module cooling cavity 104 is connected to the heat dissipation channel 102. The inverter assembly also includes a power module 3, which has a heat dissipation component. The power module 3 is connected to the inverter housing 1 through the module mounting section 103. The power module 3 blocks the opening of the module cooling cavity 104, and the heat dissipation component is located inside the module cooling cavity 104.

[0055] In this embodiment, the heat dissipation components of the power module 3 are located directly within the module cooling cavity 104, enabling heat exchange with the coolant in the heat dissipation channels of the inverter housing. This significantly improves the heat dissipation efficiency of the power module 3. The integrated design of the module mounting section 103 and the module cooling cavity 104 reduces the need for additional heat dissipation structures and mounting accessories, making the inverter assembly more compact, saving installation space, and helping to optimize the layout and structure of the entire power system.

[0056] Furthermore, the inverter housing 1 includes: a main casing 11, a capacitor potting cavity 101, a module cooling cavity 104, and a module mounting part 103 on the first side of the main casing 11, and a water storage tank assembly 111 on the second side of the main casing 11. The side wall of the water storage tank assembly 111 has a water inlet 112 and a water outlet 113, and the water storage tank assembly 111 has an opening 114. The first side and the second side of the main casing 11 are aligned along the height direction of the main casing 11. The enclosure includes a cover plate assembly 12 connected to the main housing 11 to seal the opening 114, and a water storage tank assembly 111 and the cover plate assembly 12 forming a heat dissipation channel 102. Along the height direction of the main housing 11, the module cooling chamber 104 and the water storage tank assembly 111 are at least partially overlapped. A through-hole assembly 1040 is provided at the bottom of the module cooling chamber 104, and the module cooling chamber 104 communicates with the water storage tank assembly 111 through the through-hole assembly 1040.

[0057] In this embodiment, the partial overlap of the module cooling cavity 104 and the water storage tank assembly 111 in the height direction allows the coolant to flow from the water storage tank assembly 111 through the through-hole assembly 1040 of the module cooling cavity 104, directly contacting the heat dissipation components of the power module, thereby achieving efficient heat conduction and cooling. By providing the through-hole assembly 1040 at the bottom of the module cooling cavity 104, the coolant can flow freely between the water storage tank assembly 111 and the module cooling cavity 104, increasing the heat exchange area and further improving the cooling effect of the power module and capacitor. The integrated design of various chambers and components of the inverter housing reduces the overall volume of the inverter and optimizes the spatial layout.

[0058] It should be noted that the water storage tank assembly 111 includes a first water storage tank 1111 and a second water storage tank 1112. The first water storage tank 1111 and the second water storage tank 1112 are set independently. The side wall of the first water storage tank 1111 is provided with a water outlet 113, and the side wall of the second water storage tank 1112 is provided with a water inlet 112. Along the height direction of the main body 11, the module cooling chamber 104 is at least partially overlapped with the first water storage tank 1111 and the second water storage tank 1112. The through hole assembly 1040 includes a first through hole 1041 and a second through hole 1042 set at intervals. The module cooling chamber 104 is connected to the first water storage tank 1111 through the first through hole 1041, and the module cooling chamber 104 is connected to the second water storage tank 1112 through the second through hole 1042.

[0059] In this embodiment, by setting the coolant inlet and outlet in different water tanks, the coolant can be distributed more evenly to the key heat-generating areas of the inverter, ensuring that each part can be properly cooled. By designing the first through hole 1041 and the second through hole 1042, the coolant is allowed to enter directly and flow around the heat dissipation components of the power module 3, increasing the heat exchange area and thus improving the cooling efficiency.

[0060] Specifically, the opening 114 includes a first opening 1141 of the first water storage tank 1111 and a second opening 1142 of the second water storage tank 1112. The cover plate assembly 12 includes a first cover plate 121 and a second cover plate 122. The first cover plate 121 is connected to the main body 11 to block the first opening 1141, and the second cover plate 122 is connected to the main body 11 to block the second opening 1142.

[0061] In this embodiment, by subdividing the opening 114 into the first opening 1141 of the first water tank 1111 and the second opening 1142 of the second water tank 1112, and correspondingly designing the first cover plate 121 and the second cover plate 122 for sealing, the independent cover plate design can better ensure the sealing of each water tank and help the inverter maintain good thermal stability. The subdivision of the opening 114 makes the flow path of the coolant in the first water tank 1111 and the second water tank 1112 more controllable, which helps to better distribute and circulate the coolant, ensure uniform cooling of various parts of the inverter, and improve cooling efficiency.

[0062] Preferably, the bottom of the capacitor potting cavity 101 is provided with a plurality of heat dissipation protrusions 1010. The provision of a plurality of heat dissipation protrusions 1010 increases the surface area of ​​the bottom of the capacitor potting cavity 101 in contact with the inverter housing material, thereby improving the heat transfer efficiency.

[0063] Furthermore, the capacitor potting cavity 101 includes a first potting cavity 1011 and a second potting cavity 1012. The capacitor assembly 2 includes a bus capacitor 21 and a filter capacitor 22. The bus capacitor 21 is located in the first potting cavity 1011, and the filter capacitor 22 is located in the second potting cavity 1012. The first potting cavity 1011 and the second potting cavity 1012 are connected and disposed in communication. The first potting cavity 1011 is adjacent to the module cooling cavity 104. A copper busbar support part 105 is provided on the part of the inverter housing 1 between the first potting cavity 1011 and the module cooling cavity 104. The copper busbar support part 105 is used to support the capacitor copper busbar 210 of the bus capacitor 21, and / or, the copper busbar support part 105 is used to support the module copper busbar 31 of the power module 3.

[0064] In this embodiment, by arranging the first potting cavity 1011 adjacent to the module cooling cavity 104, the coolant can simultaneously cool the power module and the bus capacitor during the flow process, realizing an integrated heat dissipation design and improving the overall heat dissipation efficiency of the inverter. The first potting cavity 1011 is connected to the second potting cavity 1012, and the coolant can circulate between the two cavities, ensuring that both the bus capacitor and the filter capacitor can be effectively cooled. The design of the copper busbar support 105 increases the mechanical connection between the bus capacitor 21 or the power module 3 and the inverter housing, improving the stability of the entire structure. By subdividing the capacitor potting cavity 101 into the first potting cavity 1011 and the second potting cavity 1012, which are tightly integrated with the inverter housing structure, it helps to make the inverter assembly design more compact.

[0065] Furthermore, the inverter housing 1 also has a low-voltage connector mounting section 106, a DC connector mounting section 107, a DC wiring cavity 108, and an AC sensor mounting section 109, wherein the DC wiring cavity 108 and the low-voltage connector mounting section 106 are both arranged adjacent to the capacitor potting cavity 101.

[0066] In this embodiment, the adjacent arrangement contributes to a compact design, allowing the inverter housing to accommodate more components within a limited space. This is particularly important for space-constrained applications such as electric vehicles, as it helps improve vehicle loading efficiency and overall performance.

[0067] In one exemplary embodiment of this application, such as Figure 7As shown, the inverter assembly also includes a circuit board 4, capacitor potting compound 5, DC copper busbar 6, DC connector 7, AC copper busbar 8, low-voltage connector 9, and shielding plate 10. The DC connector 7 is connected to the inverter housing 1 via a DC connector mounting part 107, and the low-voltage connector 9 is connected to the inverter housing 1 via a low-voltage connector mounting part 106. The inverter housing 1 also has a DC wiring cavity 108 and an AC sensor mounting part 109 for mounting related wiring harnesses and sensors. After installation, the shielding plate 10 is located between the circuit board 4 and the inverter housing 1 to avoid current signal interference.

[0068] According to another embodiment of this application, an electric drive assembly is provided, which includes an inverter assembly, the inverter assembly being the inverter assembly described above, and the electric drive assembly further includes a motor having a motor housing, the motor housing being connected to the inverter housing.

[0069] The technical solution of this embodiment provides a highly integrated, compact, and efficient heat dissipation housing through integrated housing design, reducing the inverter volume to 3.6L and weight to 6.5kg, thus increasing the usable space in the vehicle. The addition of a water reservoir through water channels reduces cooling water pressure drop and flow rate, resulting in uniform cross-sectional flow distribution and improved cooling effect for the modules and capacitors. Capacitor potting lowers capacitor core temperature, improving capacitor stability and lifespan. The inverter assembly and motor are integrated into the electric drive assembly, with the motor housing directly connected to the inverter housing. This design effectively utilizes limited space, reducing the physical volume required for the entire system. The shared housing reduces the weight of additional structures, contributing to a lighter overall weight of the electric drive assembly.

[0070] According to another embodiment of this application, a vehicle is also provided, the vehicle having at least one of an inverter assembly and an electric drive assembly, the inverter assembly being the inverter assembly described above, and the electric drive assembly being the electric drive assembly described above.

[0071] By combining the housings of the motor and inverter, the required installation space is significantly reduced, improving the utilization rate of the vehicle's interior space. The direct connection between the motor housing and the inverter housing makes heat exchange between the two more efficient, thereby improving the thermal efficiency and reliability of the system.

[0072] This application also provides a preferred embodiment of an inverter assembly, which is mainly applied in the field of new energy vehicle technology.

[0073] Specifically, the inverter housing 1 incorporates modules with cooling channels, capacitor potting surfaces, and component mounting points. Through integration and reduced installation space for filter capacitors and bus capacitors, the design saves space previously required for independent capacitor encapsulation and the need for thermal adhesive application, thus reducing size and weight. The aluminum housing features built-in cooling channels, and the capacitor potting adhesive is directly attached to the inner wall of the housing. This replaces the previous bottom-surface heat dissipation with a three-dimensional 1013 cooling system for the five bus capacitors, improving the heat dissipation of both bus capacitors and filter capacitors. The cooling efficiency is higher than that of independently encapsulated plastic capacitors with thermal adhesive. The housing incorporates water reservoirs at the water inlet and outlet of the channels via friction stir welding, providing heat dissipation for the filter components and capacitors. Evenly distributed protrusions on the bottom of the housing enhance the connection strength between the housing and the potting adhesive, increasing the heat dissipation area.

[0074] The inverter housing 1 consists of a second cover plate 122, a first cover plate 121, and a main housing 11. The first cover plate 121 and the second cover plate 122 are connected to the main housing 11 by friction stir welding to form an independent cooling water channel cavity. The capacitor assembly 2 includes capacitor potting compound 5, copper busbars, capacitor cores 211, and filter capacitors. The copper busbars, capacitor cores 211, and filter capacitors are fixed inside the inverter housing 1 by capacitor potting compound 5 and dissipate heat through the side wall of the inverter housing 1.

[0075] The main enclosure 11 is equipped with a first water storage tank 1111 and a second water storage tank 1112. Both the first water storage tank 1111 and the second water storage tank 1112 are cooling water storage tanks. The cooling water storage tanks can reduce the flow resistance of the coolant, make the cooling of different parts of the module more even, and improve the overall heat dissipation efficiency and stability of the inverter. One side wall of the second water storage tank 1112 is adjacent to the capacitor tank cover, which allows the cooling water to flow through the heat dissipation side wall of the capacitor, which can greatly improve the heat dissipation effect of the capacitor and extend the life of the capacitor. The main enclosure is equipped with a water outlet 113 and a water inlet 112, which are connected to the first water storage tank 1111 and the second water storage tank 1112 respectively. The water inlet and outlet are equipped with fixing points and sealing structures to connect to different water pipe interfaces.

[0076] The main housing 11 is provided with a potting cavity for bus capacitor 21 (i.e., the aforementioned first potting cavity 1011) and a potting cavity for filter capacitor 22 (i.e., the aforementioned second potting cavity 1012). The bus capacitor 21 and the filter capacitor 22 are installed in the cavity by capacitor potting adhesive 5, without the need for screw fixation, which can save installation space. The capacitor potting adhesive 5 is directly attached to the inner wall of the housing, changing the original bottom surface coating for heat dissipation to the current three-dimensional heat dissipation of the capacitor mounting surface, which improves the heat dissipation effect of the bus capacitor 21 and the filter capacitor 22. The heat dissipation efficiency is higher than that of independent plastic-encapsulated capacitors with thermal adhesive coating, reducing the core temperature and improving the capacitor life. The direct fixation of the capacitor potting adhesive 5 can also save thermal adhesive and coating processes, saving materials and assembly costs.

[0077] The main housing 11 is provided with a module cooling cavity 104 and a module mounting point, which can complete the fixed installation of the module and provide a heat dissipation path; a copper busbar welding support point (i.e. the aforementioned copper busbar support part 105) is provided between the module cooling cavity 104 and the capacitor pot cover, which can support the capacitor copper busbar and the module copper busbar 31 to complete laser welding and achieve a reliable connection. This connection method can save the space required for screw connection between copper busbars and reduce the overall volume.

[0078] The main enclosure 11 is equipped with AC sensor mounting points, low-voltage connector mounting ports, and DC connector mounting locations, which can make full use of space to achieve compact installation of AC sensors, low-voltage connectors 9, and DC connectors 7, thereby reducing the size of the inverter.

[0079] The integrated housing and capacitor assembly technical solution of this application has the following advantages:

[0080] 1) The cavity is made of materials including but not limited to aluminum alloy and magnesium alloy. The inverter housing 1 has no cover plate and is installed and sealed by sharing the housing with the motor. When magnesium alloy is used, the water channel is treated with micro-arc oxidation or nano-coating to improve corrosion resistance.

[0081] 2) The first cover plate 121 and the second cover plate 122 are connected to the cavity by means of friction welding to form a cooling water tank and water channel. The water channel is provided with staggered side wall ribs 1113, which can increase the heat dissipation area. The inverter housing 1 is provided with cooling medium inlet and outlet, which are respectively connected to the cooling water channel. The cooling water channel can simultaneously dissipate heat from heat-generating components such as capacitors, power modules 3, and filter capacitors 22.

[0082] 3) The integrated inverter housing is provided with a capacitor potting cavity 101, and the capacitor can dissipate heat through the side wall and bottom of the housing;

[0083] 4) The bottom of the integrated inverter housing is evenly distributed with heat dissipation protrusions 1010, which can improve the connection strength between the housing and the potting compound and increase the heat dissipation area.

[0084] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, rotated 90 degrees, or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.

[0085] In addition to the above, it should be noted that the terms "one embodiment," "another embodiment," and "embodiment" used in this specification refer to specific features, structures, or characteristics described in connection with that embodiment, which are included in at least one embodiment described in the general description of this application. The appearance of the same expression in multiple places in the specification does not necessarily refer to the same embodiment. Furthermore, when a specific feature, structure, or characteristic is described in connection with any embodiment, the intention is to suggest that implementing such a feature, structure, or characteristic in conjunction with other embodiments also falls within the scope of this invention.

[0086] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0087] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An inverter assembly, characterized in that, include: Inverter housing (1), wherein the inverter housing (1) has a capacitor potting cavity (101). The capacitor assembly (2) is located inside the capacitor potting cavity (101) and is connected to the inverter housing (1) by potting compound. The inverter housing (1) is provided with a heat dissipation channel (102) for circulating coolant. At least a portion of the sidewall of the heat dissipation channel (102) is arranged adjacent to the sidewall of the capacitor potting cavity (101) so that the capacitor assembly (2) exchanges heat with the coolant in the heat dissipation channel (102) through the sidewall of the capacitor potting cavity (101).

2. The inverter assembly according to claim 1, characterized in that, The inverter housing (1) also has a module mounting section (103) and a module cooling cavity (104), the module cooling cavity (104) being connected to the heat dissipation channel (102), and the inverter assembly further includes: The power module (3) has a heat dissipation component and is connected to the inverter housing (1) through the module mounting part (103). The power module (3) blocks the opening of the module cooling cavity (104), and the heat dissipation component is located inside the module cooling cavity (104).

3. The inverter assembly according to claim 2, characterized in that, The inverter housing (1) includes: The main housing (11) has a capacitor potting cavity (101), a module cooling cavity (104), and a module mounting part (103) on its first side. A water storage tank assembly (111) is provided on the second side of the main housing (11). The side wall of the water storage tank assembly (111) has a water inlet (112) and a water outlet (113). The water storage tank assembly (111) has an opening (114). The first side and the second side of the main housing (11) are arranged opposite to each other along the height direction of the main housing (11). The cover plate assembly (12) is connected to the main box (11) to block the opening (114), and the water storage tank assembly (111) and the cover plate assembly (12) form the heat dissipation channel (102). Along the height direction of the main housing (11), the module cooling cavity (104) and the water storage tank assembly (111) are at least partially overlapped. A through hole assembly (1040) is provided at the bottom of the module cooling cavity (104), and the module cooling cavity (104) is connected to the water storage tank assembly (111) through the through hole assembly (1040).

4. The inverter assembly according to claim 3, characterized in that, The water storage tank assembly (111) includes a first water storage tank (1111) and a second water storage tank (1112). The first water storage tank (1111) and the second water storage tank (1112) are arranged independently of each other. The first water storage tank (1111) has an outlet (113) on its side wall, and the second water storage tank (1112) has an inlet (112) on its side wall. Along the height direction of the main housing (11), the module cooling chamber (104) and The first water storage tank (1111) and the second water storage tank (1112) are at least partially overlapped. The through hole assembly (1040) includes a first through hole (1041) and a second through hole (1042) spaced apart. The module cooling chamber (104) is connected to the first water storage tank (1111) through the first through hole (1041) and the module cooling chamber (104) is connected to the second water storage tank (1112) through the second through hole (1042).

5. The inverter assembly according to claim 4, characterized in that, The opening (114) includes a first opening (1141) of the first water storage tank (1111) and a second opening (1142) of the second water storage tank (1112). The cover plate assembly (12) includes a first cover plate (121) and a second cover plate (122). The first cover plate (121) is connected to the main body (11) to block the first opening (1141), and the second cover plate (122) is connected to the main body (11) to block the second opening (1142).

6. The inverter assembly according to claim 1, characterized in that, The bottom of the capacitor potting cavity (101) is provided with multiple heat dissipation protrusions (1010).

7. The inverter assembly according to claim 2, characterized in that, The capacitor potting cavity (101) includes a first potting cavity (1011) and a second potting cavity (1012). The capacitor assembly (2) includes a bus capacitor (21) and a filter capacitor (22). The bus capacitor (21) is located in the first potting cavity (1011), and the filter capacitor (22) is located in the second potting cavity (1012). The first potting cavity (1011) and the second potting cavity (1012) are connected and disposed in communication. The potting cavity (1011) is arranged adjacent to the module cooling cavity (104). A copper busbar support (105) is provided on the part of the inverter housing (1) between the first potting cavity (1011) and the module cooling cavity (104). The copper busbar support (105) is used to support the capacitor copper busbar (210) of the bus capacitor (21), and / or, the copper busbar support (105) is used to support the module copper busbar (31) of the power module (3).

8. The inverter assembly according to claim 1, characterized in that, The inverter housing (1) is also provided with a low-voltage connector mounting part (106), a DC connector mounting part (107), a DC wiring cavity (108), and an AC sensor mounting part (109), wherein the DC wiring cavity (108) and the low-voltage connector mounting part (106) are both arranged adjacent to the capacitor potting cavity (101).

9. An electric drive assembly, characterized in that, The inverter assembly includes an inverter assembly as described in any one of claims 1-8, and the electric drive assembly further includes: The motor has a motor housing, which is connected to the inverter housing (1).

10. A vehicle, characterized in that, The vehicle has at least one of an inverter assembly and an electric drive assembly, wherein the inverter assembly is the inverter assembly according to any one of claims 1-8, and the electric drive assembly is the electric drive assembly according to claim 9.

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