Special-shaped transparent heating element based on resistance compensation and preparation method
By designing a transparent heating element based on resistance compensation, the problems of uneven heating and sensor interference in irregularly shaped ADAS areas were solved, achieving a uniform heating and low-cost heating solution.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-20
- Publication Date
- 2026-03-13
AI Technical Summary
In existing technologies, it is difficult to achieve full-area coverage for the heating function of ADAS areas with irregular structures. The metal wire heating method will interfere with the sensor's field of vision and the heating is uneven, and it is also costly.
The design incorporates a transparent heating element based on resistance compensation. By setting up multiple transparent heating units and introducing resistive elements in series, voltage compensation is achieved to ensure uniform heating. Flexible circuit boards and anisotropic conductive adhesive film layers are used to ensure conductivity and insulation.
Uniform heating of irregularly shaped regions was achieved, avoiding interference with the sensor's optical path, reducing costs, and improving the uniformity and stability of heating.
Smart Images
Figure CN121665387A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of irregularly shaped transparent heating technology, specifically to an irregularly shaped transparent heating element based on resistance compensation and its preparation method. Background Technology
[0002] Advanced Driver Assistance Systems (ADAS) are active safety technologies that use onboard sensors (such as cameras, radar, and lidar) to collect environmental data and analyze it to identify potential hazards, thereby improving driving safety and comfort. The areas on a car equipped with ADAS are often irregularly shaped structures. These areas need to be kept clear, and in cold, foggy regions, they require heating functions for de-icing, defrosting, and defogging.
[0003] Currently, heating functionality requires a carrier, such as metal wires or a transparent conductive film. Positive and negative electrodes are located around the perimeter of the carrier. Applying a DC voltage across the positive and negative electrodes allows current to flow through the carrier, thus achieving heating. However, the irregular shape of the structure makes the design of the positive and negative electrodes extremely difficult, making it hard to achieve heating across the entire ADAS area, especially in corners. Furthermore, the ADAS area is relatively small, typically around 100*100 millimeters, representing a very small proportion of the entire windshield. Using a transparent conductive film coating across the entire windshield for heating would be extremely costly.
[0004] Furthermore, currently, heating in ADAS areas primarily utilizes metal wires for de-icing, defrosting, and defogging. These metal wires are mainly implemented through equipment wiring or screen printing. However, using metal wires for heating in ADAS areas presents the following problems: (1) The physical scale of the metal wire is visible, which will interfere with the sensor's field of vision, especially the optical path of high-definition cameras and lidar, resulting in a decrease in detection accuracy. (2) The heating temperature around the metal wire is higher, and the wires rely on heat radiation, resulting in a problem of low heating temperature, which makes it impossible to remove ice, frost and fog evenly. (3) Long-term alternation of hot and cold makes the metal wires easy to break and lose their heating function. Summary of the Invention
[0005] The purpose of this invention is to improve and innovate upon the shortcomings and problems existing in the prior art, and to provide an irregularly shaped transparent heating element based on resistance compensation and its preparation method.
[0006] According to a first aspect of the present invention, an irregularly shaped transparent heating element based on resistance compensation is provided, comprising: A transparent heating element includes a plurality of transparent heating units spaced apart, the transparent heating units differing at least in length; the plurality of transparent heating units share a common negative electrode or a common positive electrode, when the plurality of transparent heating units share a common negative electrode, the positive electrodes of each transparent heating unit are independent of each other; when the plurality of transparent heating units share a common positive electrode, the negative electrodes of each transparent heating unit are independent of each other; A flexible circuit board, the flexible circuit board including several independent terminals, the terminals being used to conduct electricity to the positive or negative electrode of the transparent heating unit; The control medium is used to introduce the power supply voltage and multiple resistive elements. Each resistive element corresponds to a transparent heating unit, and the resistive elements are connected in series with their corresponding transparent heating units so that the shorter the length of the transparent heating unit, the smaller the voltage applied to it.
[0007] A further embodiment is that the transparent heating unit includes a substrate and a transparent conductive film layer. The substrate is made of a transparent material, the transparent conductive film layer is made of a transparent conductive film, and the transparent conductive film layers are separated from each other by a first insulating layer.
[0008] A further embodiment is that conductive colloid layers are provided at both ends of the transparent conductive film layer corresponding to the transparent heating unit to form the positive and negative electrodes of the transparent heating unit; wherein the conductive colloid layers corresponding to the common positive or negative electrode are interconnected; and the conductive colloid layers corresponding to the independent positive or negative electrode are separated from each other by a second insulating layer.
[0009] A further embodiment is that the first insulating layer is prepared by laser etching of a transparent conductive thin film layer, and the second insulating layer is prepared by laser etching of a conductive colloid layer and a transparent conductive thin film layer below it.
[0010] A further embodiment is that the flexible circuit board is bonded together with an anisotropic conductive adhesive film layer and a conductive adhesive layer, wherein the anisotropic conductive adhesive film layer is anisotropic conductive adhesive film; the anisotropic conductive adhesive film layer is used to conduct the wiring terminals on the flexible circuit board to the corresponding conductive adhesive layer, and the anisotropic conductive adhesive film layers corresponding to each transparent heating unit are mutually insulated.
[0011] A further embodiment is that the conductive colloid layer on the common positive or common negative side of the transparent heating unit extends along the edge of the transparent heating element to the side corresponding to the independent positive or negative electrode of the transparent heating element.
[0012] A further option is to provide an encapsulation layer on the transparent conductive film layer corresponding to the transparent heating unit.
[0013] A further option is to use glass, PET, PC, or PI as the substrate.
[0014] A further approach is to connect each transparent heating unit and its corresponding resistive element in series, resulting in equal resistance values.
[0015] According to a second aspect of the present invention, a method for fabricating an irregularly shaped transparent heating element based on resistance compensation is provided, specifically comprising the following steps: Step S101: A transparent conductive thin film layer is deposited on the substrate using vacuum deposition. Step S102: Laser etching is used to divide the transparent conductive film layer into multiple transparent heating units; the transparent heating units are separated from each other by a first insulating layer. Step S103: Print the conductive colloid layer onto the edge of the transparent conductive film layer; Step S104: Using laser etching, the conductive colloid layer on one side of the transparent conductive film layer and the transparent conductive film layer below it are etched to form a second insulating layer, so that multiple transparent heating units can form independent positive or negative electrodes. Step S105: Attach the anisotropic conductive adhesive film layer to the conductive adhesive layer at the laser etching location, and attach the flexible circuit board to the anisotropic conductive adhesive film layer; so that the independent terminals on the flexible circuit board are connected to the corresponding conductive adhesive layer. Step S106: Connect the end of the flexible circuit board away from the transparent heating unit to the control medium. Introduce the power supply voltage and multiple resistive elements through the control medium. Each resistive element corresponds to a transparent heating unit. Connect the resistive elements in series with the corresponding transparent heating units so that the shorter the length of the transparent heating unit, the smaller the voltage applied to it. Step S107: Attach the transparent heating unit to the glass corresponding to the ADAS area through the encapsulation layer.
[0016] Compared with existing technologies, the beneficial effects of this invention are as follows: This invention provides an irregularly shaped transparent heating element based on resistance compensation and its preparation method. By setting multiple transparent heating units with differences in length, the transparent heating element can adapt to the irregularly shaped heating area, satisfying the heating function of the entire ADAS area. Simultaneously, the transparent heating units will not interfere with the optical paths of the high-definition cameras and lidar of the advanced driver assistance system, and will not cause a decrease in detection accuracy. Furthermore, the control medium introduces a supply voltage and multiple resistive elements, with each resistive element corresponding to a transparent heating unit in a one-to-one manner, and the resistive elements are connected in series with their corresponding transparent heating units. This ensures that the shorter the length of the corresponding transparent heating unit, the smaller the voltage applied to it, thereby achieving uniform heating of each transparent heating unit and thus uniform heating of the entire irregularly shaped heating area. Furthermore, by setting an anisotropic conductive adhesive film layer between the flexible circuit board and the conductive colloid layer, it is convenient to bond the flexible circuit board and the conductive colloid layer together. When the flexible circuit board is bonded to the conductive colloid layer through the anisotropic conductive adhesive film layer, the anisotropic conductive adhesive film layer above the conductive colloid layer will be in a conductive state under pressure. However, the anisotropic conductive adhesive film layer above the second insulating layer will not be squeezed by pressure, so that the anisotropic conductive adhesive film layer above the second insulating layer will be in an insulating state. Therefore, by setting the anisotropic conductive adhesive film layer, it is possible to ensure that the flexible circuit board and the transparent heating element are firmly bonded together, and to ensure the conductivity between the flexible circuit board and each transparent heating unit, as well as the insulation between each transparent heating unit. Attached Figure Description
[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of the structure of an irregularly shaped transparent heating element based on resistance compensation provided in the first embodiment of the present invention; Figure 2 Provided by the first embodiment of the present invention Figure 1 A magnified schematic diagram of the structure at point B in the middle; Figure 3 This is a schematic diagram of the structure of the control medium provided in the first embodiment of the present invention; Figure 4 This is a schematic diagram of the cross-sectional structure of the independent positive or negative electrode of the transparent heating element provided in the first embodiment of the present invention. Figure 5 This is a schematic cross-sectional view of the transparent heating element at point AA provided in the first embodiment of the present invention. Figure 6 This is a schematic diagram of a method for preparing an irregularly shaped transparent heating element based on resistance compensation, provided in the second embodiment of the present invention.
[0019] Reference numerals: 1. Transparent heating element; 101. Transparent heating unit; 102. Positive electrode; 103. Negative electrode; 104. First insulating layer; 105. Second insulating layer; 1011. Substrate; 1012. Transparent conductive film layer; 1013. Conductive colloid layer; 1014. Anisotropic conductive adhesive film layer; 1015. Encapsulation layer; 2. Flexible circuit board; 201. Terminal block; 3. Control medium; 301. Power input terminal; 302. Resistor element; 303. Socket; 304. Control chip. Detailed Implementation
[0020] To make the objectives, features, and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0022] Example 1 Please see Figure 1-5 This invention provides an irregularly shaped transparent heating element based on resistance compensation, comprising: A transparent heating element 1 includes a plurality of transparent heating units 101 spaced apart, the plurality of transparent heating units 101 differing at least in length. The plurality of transparent heating units 101 share a common negative electrode 103 or a common positive electrode 102. When the plurality of transparent heating units 101 share a common negative electrode 103, the positive electrodes 102 of each transparent heating unit 101 are independent; when the plurality of transparent heating units 101 share a common positive electrode 102, the negative electrodes 103 of each transparent heating unit 101 are independent.
[0023] In practical applications, the transparent heating element 1 can be used for heating in automotive driver assistance systems (ADAS). Because the transparent heating element 1 is transparent, it will not interfere with the sensor's field of view, especially the optical path of high-definition cameras and lidar, thus preventing a decrease in detection accuracy.
[0024] The flexible circuit board 2 includes a plurality of terminals 201, which are used to conduct to the positive electrode 102 or the negative electrode 103 of the transparent heating unit 101. The control medium 3 is used to introduce multiple resistive elements 302, each of which corresponds to a transparent heating unit 101. The resistive elements 302 are connected in series with the transparent heating unit 101 so that the shorter the length of the transparent heating unit 101, the smaller the voltage applied to it.
[0025] For example, each transparent heating unit 101 has a corresponding length L and width W, and the resistance values of the transparent heating units 101 are R10, R20, R30, R40, R50, R60, R70, R80, R90, and R100, respectively. Due to their irregular shapes, it is difficult to keep the resistance values of the transparent heating units 101 consistent. Therefore, under the same input voltage, the shorter the length L of the transparent heating unit 101, the greater its heat generation, resulting in uneven heating of the Advanced Driver Assistance Systems (ADAS) area. Multiple resistive elements 302 are introduced into the control medium 3, and the resistance values of each resistive element 302 are R1, R2, R3, R4, R5, R6, R7, R8, R9, and R10, respectively. When the corresponding resistive element 302 is connected in series with the transparent heating unit 101, R1 + R10 = R2 + R20 = ... = R10 + R100 can be achieved. R10, R20, ..., R100 can be calculated using the sheet resistance of the transparent heating unit 101, the width W of the transparent heating unit 101, and the length L of the transparent heating unit. When the voltage applied to each transparent heating unit 101 and the resistive element 302 as a whole is equal, the shorter the length of the transparent heating unit 101, the larger the resistance value of the corresponding resistive element 302 should be, and the larger the voltage drop across the resistive element 302; thus, the shorter the length L of the transparent heating unit, the smaller the voltage applied to it; thereby achieving uniform heating of the entire irregularly shaped heating area.
[0026] The transparent heating unit 101 includes a substrate 1011, a transparent conductive thin film layer 1012, and an encapsulation layer 1015. The substrate 1011 can be made of transparent materials such as glass, PET, or PC. The transparent conductive thin film layer 1012 is a transparent conductive film, a thin film material that combines high conductivity with high visible light transmittance, mainly used in transparent electrodes for optoelectronic devices, covering fields such as displays, photovoltaics, and flexible electronics. The encapsulation layer 1015 uses encapsulating adhesive; a layer of encapsulating adhesive is attached to the surface of the transparent heating unit 101 to facilitate attachment of the transparent heating element 1 to the glass corresponding to an advanced driver assistance system in automobiles.
[0027] It should be noted that the transparent conductive film layers 1012 corresponding to each transparent heating unit 101 are separated from each other by the first insulating layer 104, so that the transparent conductive film layers 1012 are insulated from each other.
[0028] Furthermore, each transparent heating unit 101 has a conductive colloid layer 1013 at both ends of its corresponding transparent conductive thin film layer 1012 to form the positive electrode 102 and negative electrode 103 of the transparent heating unit 101. As described above, the multiple transparent heating units 101 have independent positive electrodes 102 or negative electrodes 103. To achieve insulation between the independent positive electrodes 102 or negative electrodes 103 of the multiple transparent heating units 101, the conductive colloid layers 1013 located on the side of the independent positive electrodes 102 or negative electrodes 103 of the transparent heating units 101 are separated from each other by a second insulating layer 105. However, the conductive colloid layers 1013 located on the side of the common negative electrode 103 or common positive electrode 102 of the transparent heating units 101 are interconnected.
[0029] In order to ensure that both the positive electrode 102 and the negative electrode 103 of the transparent heating unit 101 are connected to the terminals 201 of the flexible circuit board 2, the conductive colloid layer 1013 located on the side of the transparent heating unit 101 with the common negative electrode 103 or the common positive electrode 102 extends through the edge of the transparent heating element 1 to the side of the independent positive electrode 102 or negative electrode 103; thus, it is convenient for some terminals 201 on the flexible circuit board 2 to be connected to the positive electrode 102 of the transparent heating unit 101, and for some terminals 201 to be connected to the negative electrode 103 of the transparent heating unit 101.
[0030] For example, such as Figure 1 As shown, the positive electrode 102 and negative electrode 103 of the transparent heating unit 101 are respectively located on the left and right sides of the transparent heating element 1, and the transparent heating unit 101 shares a negative electrode 103. In order to enable the terminals 201 on the flexible circuit board 2 to be simultaneously connected to both the positive electrode 102 and the negative electrode 103 of the transparent heating unit 101, a conductive colloid layer 1013 on the negative electrode 103 side of the transparent heating unit 101 extends from the upper and lower sides of the transparent heating element 1 to the left side of the transparent heating element 1. Since the conductive colloid layer 1013 extends along the upper and lower sides of the transparent heating element 1, the conductive colloid layer 1013 will not affect the sensor's field of view, especially it will not interfere with the optical path of the high-definition camera or the lidar, thus preventing a decrease in detection accuracy.
[0031] It should be noted that both the first insulating layer 104 and the second insulating layer 105 are prepared by laser etching. The first insulating layer 104 is formed by laser etching of the transparent conductive thin film layer 1012; the second insulating layer 105 is formed by laser etching of the conductive colloid layer 1013 and the transparent conductive thin film layer 1012 below it. That is, each transparent heating unit 101 is spaced apart by a certain distance, and the conductive colloid layer 1013 corresponding to the independent positive electrode 102 or negative electrode 103 of each transparent heating unit 101 is also spaced apart by a certain distance.
[0032] Preferably, the width of the second insulating layer 105 is greater than the width of the first insulating layer 104, and the width of the second insulating layer 105 is 40-60 micrometers.
[0033] Preferably, an anisotropic conductive adhesive film layer 1014 is disposed between the flexible circuit board 2 and the conductive colloid layer 1013. The anisotropic conductive adhesive film layer 1014 facilitates the bonding of the flexible circuit board 2 and the conductive colloid layer 1013 together. The anisotropic conductive adhesive film layer 1014 is anisotropic conductive film containing conductive particles. When the conductive particles remain in a circular state, it is insulating. When the conductive particles are compressed into a "flower-shaped" opening under certain pressure, the anisotropic conductive adhesive film becomes conductive, allowing the flexible circuit board 2 and the conductive colloid layer 1013 to conduct electricity. When the conductive particles on the anisotropic conductive adhesive film are not compressed into a "flower-shaped" opening, the anisotropic conductive adhesive film remains insulating, thus isolating the independent positive electrode 102 or negative electrode 103 of the transparent heating unit 101 from each other. Because the second insulating layer 105 is perforated, when the flexible circuit board 2 is bonded to the conductive colloid layer 1013 via the anisotropic conductive adhesive film layer 1014, the anisotropic conductive adhesive film layer 1014 above the conductive colloid layer 1013 will be in a conductive state under pressure; while the anisotropic conductive adhesive film layer 1014 above the second insulating layer 105 will not be squeezed by pressure, thus keeping the anisotropic conductive adhesive film layer 1014 above the second insulating layer 105 in an insulating state. Therefore, by setting the anisotropic conductive adhesive film layer 1014, it is possible to ensure that the flexible circuit board 2 and the transparent heating element 1 are firmly bonded together, and also to ensure the conductivity between the flexible circuit board 2 and each transparent heating unit 101, as well as the insulation between each transparent heating unit 101.
[0034] Furthermore, the control medium 3 also includes a power input terminal 301, a socket 303, and a control chip 304. The socket 303 is used to connect to the end of the flexible circuit board 2 away from the transparent heating element 1. The control chip 304 is used to apply the power supply voltage input from the power input terminal 301 to the resistive element 302 and the transparent heating unit 101.
[0035] Example 2 Please see Figure 6 This invention provides a method for preparing an irregularly shaped transparent heating element based on resistance compensation, used to prepare the irregularly shaped transparent heating element described in Example 1, specifically including the following steps: Step S101: A transparent conductive thin film layer 1012 is deposited on the substrate 1011 by vacuum deposition.
[0036] The substrate 1011 can be made of transparent materials such as glass, PET, or PC; preferably, the substrate 1011 is made of flexible PET, PC, or PI. The transparent conductive thin film layer 1012 is a transparent conductive thin film, which is prepared by physical vacuum deposition. In a vacuum environment, a transparent conductive thin film is deposited on the surface of the substrate 1011 using a specific target material in a plasma atmosphere.
[0037] Step S102: Laser etching is used to divide the transparent conductive thin film layer 1012 into multiple transparent heating units 101; the transparent heating units 101 are separated from each other by the first insulating layer 104.
[0038] It should be noted that after laser etching of the transparent conductive film layer 1012, the transparent conductive film layer 1012 corresponding to the laser-etched area will be removed, thereby dividing the transparent conductive film layer 1012 into multiple transparent heating units 101; each transparent heating unit 101 is spaced a certain distance from each other; since each transparent heating unit 101 is hollowed out from each other, the transparent heating units 101 are insulated from each other, that is, the transparent heating units 101 are separated from each other by the first insulating layer 104.
[0039] In this embodiment, the plurality of transparent heating units 101 differ at least in length, thereby enabling the plurality of transparent heating units 101 to adapt to the irregularly shaped ADAS region.
[0040] Step S103: Print the conductive colloid layer 1013 onto the edge of the transparent conductive film layer 1012.
[0041] Specifically, a screen is used, and under the pressure of a squeegee, the conductive colloid is printed onto the edge of the transparent conductive film layer 1012 through the pre-set holes on the screen. Then, after curing under specific temperature conditions, a conductive colloid layer 1013 is formed.
[0042] Step S104: Using laser etching, the conductive colloid layer 1013 on one side of the transparent conductive thin film layer 1012 and the transparent conductive thin film layer 1012 below it are etched to form a second insulating layer 105, so that the multiple transparent heating units 101 form independent positive electrodes 102 or negative electrodes 103.
[0043] Specifically, after laser etching of the conductive colloid layer 1013 and the transparent conductive film layer 1012 on one side of the transparent conductive film layer 1012, the conductive colloid layer 1013 and the transparent conductive film layer 1012 corresponding to the laser-etched area are removed, so that the conductive colloid layers 1013 corresponding to each transparent heating unit 101 are spaced apart by a certain distance. Since the corresponding conductive colloid layers 1013 are hollowed out from each other, the conductive colloid layers 1013 on that side of the transparent heating unit 101 are insulated from each other, that is, the conductive colloid layers 1013 are separated from each other by the second insulating layer 105; thus, multiple transparent heating units 101 form independent positive electrodes 102 or negative electrodes 103.
[0044] Preferably, the width of the second insulating layer 105 is greater than the width of the first insulating layer 104, and the width of the second insulating layer 105 is set to 40-60 micrometers.
[0045] Step S105: Attach the anisotropic conductive adhesive film layer 1014 to the conductive adhesive layer 1013 at the laser etching location, and attach the flexible circuit board 2 to the anisotropic conductive adhesive film layer 1014; so that the independent terminals 201 on the flexible circuit board 2 are connected to the corresponding conductive adhesive layer 1013.
[0046] In this embodiment, the anisotropic conductive adhesive film layer 1014 is made of anisotropic conductive adhesive film. On one hand, the anisotropic conductive adhesive film can bond the flexible circuit board 2 to the conductive adhesive layer 1013; on the other hand, when the flexible circuit board 2 is bonded to the conductive adhesive layer 1013 via the anisotropic conductive adhesive film layer 1014, the anisotropic conductive adhesive film layer 1014 above the conductive adhesive layer 1013 will be in a conductive state under pressure. Since the second insulating layer 105 is perforated, the anisotropic conductive adhesive film layer 1014 above the second insulating layer 105 will not be compressed by pressure, thus ensuring that the anisotropic conductive adhesive film layer 1014 above the second insulating layer 105 is in an insulating state. Therefore, this embodiment can ensure that the flexible circuit board 2 and the transparent heating element 1 are firmly bonded together, and can also ensure the conductivity between the flexible circuit board 2 and each transparent heating unit 101, as well as the insulation between each transparent heating unit 101.
[0047] Step S106: Connect the end of the flexible circuit board 2 away from the transparent heating unit 101 to the control medium 3. Introduce the power supply voltage and multiple resistor elements 302 through the control medium 3. The resistor elements 302 correspond one-to-one with the transparent heating unit 101. Connect the resistor elements 302 and the corresponding transparent heating unit 101 in series so that the shorter the length of the transparent heating unit 101, the smaller the voltage applied to it.
[0048] Specifically, the end of the flexible circuit board 2 furthest from the transparent heating unit 101 is plugged into the socket 303 on the control medium 3. Since each transparent heating unit 101 has a corresponding length L and width W, the resistance values of each transparent heating unit 101 are different. For example, the resistance values of the transparent heating units 101 are R10, R20, R30, R40, R50, R60, R70, R80, R90, and R100, respectively. Due to their irregular shape, it is difficult to maintain consistent resistance values among the transparent heating units 101. Therefore, under the same input voltage, the shorter the length L of the transparent heating unit 101, the greater its heat generation, resulting in uneven heating of different areas of the ADAS system when it is applied to the area of the Advanced Driver Assistance System (ADAS).
[0049] In this embodiment, multiple resistive elements 302 are introduced into the control medium 3, and the resistance values of each resistive element 302 are R1, R2, R3, R4, R5, R6, R7, R8, R9, and R10, respectively. When the corresponding resistive element 302 is connected in series with the transparent heating unit 101, R1 + R10 = R2 + R20 = ... = R10 + R100 can be achieved. When the voltage applied to each transparent heating unit 101 and the corresponding resistive element 302 as a whole is equal, the shorter the length of the transparent heating unit 101, the larger the resistance value of the corresponding resistive element 302, and the larger the voltage drop across the resistive element 302. Thus, the shorter the length L of the transparent heating unit, the smaller the voltage applied to it, thereby achieving uniform heating of the entire irregular heating area.
[0050] Step S107: Attach the transparent heating unit 101 to the glass corresponding to the ADAS area through the encapsulation layer 1015.
[0051] The encapsulation layer 1015 is an adhesive double-sided tape. After the encapsulation layer 1015 is automatically attached to the transparent heating unit 101 by the attachment machine, the encapsulation layer 1015 is then attached to the glass corresponding to the ADAS area by the attachment machine.
[0052] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims. Parts not described in detail in this specification are prior art known to those skilled in the art.
Claims
1. A uniquely shaped transparent heating element based on resistance compensation, characterized in that, include: A transparent heating element (1) includes a plurality of transparent heating units (101) spaced apart, the transparent heating units (101) differing at least in length; the plurality of transparent heating units (101) share a common negative electrode (103) or a common positive electrode (102); when the plurality of transparent heating units (101) share a common negative electrode (103), the positive electrodes (102) of each transparent heating unit (101) are independent of each other; when the plurality of transparent heating units (101) share a common positive electrode (102), the negative electrodes (103) of each transparent heating unit (101) are independent of each other; The flexible circuit board (2) includes several independent terminals (201), which are used to conduct to the positive electrode (102) or negative electrode (103) of the transparent heating unit (101); The control medium (3) is used to introduce the power supply voltage and multiple resistive elements (302). The resistive elements (302) correspond one-to-one with the transparent heating unit (101). The resistive elements (302) are connected in series with the corresponding transparent heating unit (101) so that the shorter the length of the transparent heating unit (101), the smaller the voltage applied to it.
2. The irregularly shaped transparent heating element based on resistance compensation according to claim 1, characterized in that: The transparent heating unit (101) includes a substrate (1011) and a transparent conductive film layer (1012). The substrate (1011) is made of a transparent material, and the transparent conductive film layer (1012) is made of a transparent conductive film. The transparent conductive film layers (1012) are separated from each other by a first insulating layer (104).
3. The irregularly shaped transparent heating element based on resistance compensation according to claim 2, characterized in that: The transparent conductive thin film layer (1012) corresponding to the transparent heating unit (101) is provided with conductive colloid layer (1013) at both ends to form the positive electrode (102) and negative electrode (103) of the transparent heating unit (101); wherein, the conductive colloid layer (1013) corresponding to the common positive electrode (102) or negative electrode (103) is interconnected; the conductive colloid layer (1013) corresponding to the independent positive electrode (102) or negative electrode (103) is separated from each other by a second insulating layer (105).
4. The irregularly shaped transparent heating element based on resistance compensation according to claim 3, characterized in that: The first insulating layer (104) is prepared by laser etching of a transparent conductive thin film layer (1012), and the second insulating layer (105) is prepared by laser etching of a conductive colloidal layer (1013) and a transparent conductive thin film layer (1012) below it.
5. The irregularly shaped transparent heating element based on resistance compensation according to claim 4, characterized in that: The flexible circuit board (2) is bonded together with the conductive adhesive layer (1013) through an anisotropic conductive adhesive film layer (1014). The anisotropic conductive adhesive film layer (1014) is made of anisotropic conductive adhesive film. The anisotropic conductive adhesive film layer (1014) is used to conduct the connection between the terminal (201) on the flexible circuit board (2) and the corresponding conductive adhesive layer (1013). The anisotropic conductive adhesive film layers (1014) corresponding to each transparent heating unit (101) are mutually insulated.
6. The irregularly shaped transparent heating element based on resistance compensation according to claim 4, characterized in that: The conductive colloid layer (1013) on the side of the common positive electrode (102) or common negative electrode (103) of the transparent heating unit (101) extends along the edge of the transparent heating element (1) to the side corresponding to the independent positive electrode (102) or negative electrode (103) of the transparent heating element (1).
7. The irregularly shaped transparent heating element based on resistance compensation according to claim 2, characterized in that: An encapsulation layer (1015) is provided on the transparent conductive film layer (1012) corresponding to the transparent heating unit (101).
8. The irregularly shaped transparent heating element based on resistance compensation according to claim 2, characterized in that: The substrate (1011) is made of glass, PET, PC, or PI.
9. The irregularly shaped transparent heating element based on resistance compensation according to claim 1, characterized in that: The resistance values of each transparent heating unit (101) and its corresponding resistive element (302) are equal after being connected in series.
10. A method for fabricating an irregularly shaped transparent heating element based on resistance compensation, characterized in that, Specifically, the following steps are included: Step S101: A transparent conductive thin film layer (1012) is deposited on the substrate (1011) by vacuum deposition. Step S102: Laser etching is used to etch a transparent conductive thin film layer (1012) to divide the transparent conductive thin film layer (1012) into multiple transparent heating units (101); the transparent heating units (101) are separated from each other by a first insulating layer (104); Step S103: Print the conductive colloid layer (1013) onto the edge of the transparent conductive film layer (1012); Step S104: Using laser etching, the conductive colloid layer (1013) on one side of the transparent conductive thin film layer (1012) and the transparent conductive thin film layer (1012) below it are etched to form a second insulating layer (105), so that multiple transparent heating units (101) form independent positive electrodes (102) or negative electrodes (103). Step S105: Attach the anisotropic conductive adhesive film layer (1014) to the conductive adhesive layer (1013) at the laser etching location, and attach the flexible circuit board (2) to the anisotropic conductive adhesive film layer (1014); so that the independent terminals (201) on the flexible circuit board (2) are connected to the corresponding conductive adhesive layer (1013); Step S106: Connect the end of the flexible circuit board (2) away from the transparent heating unit (101) to the control medium (3). Introduce the power supply voltage and multiple resistor elements (302) through the control medium (3). The resistor elements (302) correspond one-to-one with the transparent heating unit (101). Connect the resistor elements (302) in series with the corresponding transparent heating unit (101) so that the shorter the length of the transparent heating unit (101), the smaller the voltage applied to it. Step S107: The transparent heating unit (101) is attached to the glass corresponding to the ADAS area through the encapsulation layer (1015).