Cutting and edge sealing process, circuit board and cutting and edge sealing equipment

By using laser beam splitting technology to create cutting and sealing zones at the edges of fiberglass cloth, the problem of edge instability caused by fuzz is solved, achieving flush and stable edges and reducing material waste.

CN121665458APending Publication Date: 2026-03-13HANS CNC SCI & TECH
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-09
Publication Date
2026-03-13

AI Technical Summary

Technical Problem

During the production process, fiberglass cloth develops fuzz at the edges, resulting in an unstable edge structure that is difficult to ensure evenness. Furthermore, the fuzz tends to spread out after being removed, affecting the use of adhesive materials in subsequent processes.

Method used

Using laser beam splitting technology, a cutting area and an edge sealing area are formed by a first laser beam and a second laser beam, respectively. The energy density of the first laser beam is higher than that of the second laser beam. The first laser beam moves along the edge of the workpiece to cut and seal the edge, forming a stable edge.

Benefits of technology

This achieves flush edges on the fiberglass cloth, improves the structural stability of the edges, reduces waste of adhesive materials, and lowers subsequent processing costs.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN121665458A_ABST
    Figure CN121665458A_ABST
Patent Text Reader

Abstract

The invention relates to the technical field of laser processing, and provides a cutting and edge-sealing process, a circuit board and cutting and edge-sealing equipment, the cutting and edge-sealing process comprises a laser beam splitting step and a cutting and edge-sealing step, in the laser beam splitting step, the cutting and edge-sealing equipment is controlled to emit a first laser beam and a second laser beam which are arranged at an interval along a first direction, and in the cutting and edge-sealing step, the cutting and edge-sealing equipment is controlled to emit a second laser beam. The first laser beam and the second laser beam are controlled to move relative to the workpiece in the first direction, the first laser beam forms a cutting area with the first energy density at the to-be-cut area of the workpiece, the second laser beam forms an edge sealing area with the second energy density at the to-be-cut area of the workpiece, and the first energy density is larger than the second energy density; the to-be-cut area of the workpiece sequentially passes through the cutting area and the edge sealing area in the first direction. The cutting and edge sealing equipment comprises the workbench and the laser device, and the cutting and edge sealing technology and the cutting and edge sealing equipment are beneficial to guaranteeing that the edges of workpieces are flush.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application relates to the field of laser processing technology, specifically to a cutting and sealing process, a circuit board, and cutting and sealing equipment. Background Technology

[0002] In circuit board manufacturing, fiber-reinforced materials such as fiberglass cloth are commonly used to achieve barrier, support, and strength enhancement for different circuit board layers. Taking fiberglass cloth as an example, fuzz is generated at the edges during the production process. Currently, this fuzz is usually removed to reduce waste of adhesive materials in subsequent processes. However, after removing the fuzz, the edge structure of the fiberglass cloth lacks stability, making it prone to fiber unraveling and difficult to ensure the flatness of the fiberglass cloth. Summary of the Invention

[0003] In order to overcome the problems existing in the prior art, the main purpose of this application is to provide a cutting and sealing process that can cut and seal the edges of fiberglass cloth, which is beneficial to ensuring the flatness of the edges of the fiberglass cloth.

[0004] This application also proposes a circuit board for a workpiece processed using the above-mentioned cutting and sealing process.

[0005] This application also proposes a cutting and sealing device for carrying out the above-described cutting and sealing process.

[0006] To achieve the above objectives, this application specifically adopts the following technical solution: According to a first aspect of the embodiments of this application, a cutting and sealing process is provided for controlling a cutting and sealing equipment to process a workpiece. The cutting and sealing process includes laser beam splitting and cutting and sealing steps. Laser beam splitting: Controlling the cutting and sealing equipment to emit a first laser beam and a second laser beam that are spaced apart along a first direction; Cutting and sealing: The first laser beam and the second laser beam are controlled to move relative to the workpiece along the first direction. The first laser beam forms a cutting area with a first energy density in the area to be cut of the workpiece, and the second laser beam forms a sealing area with a second energy density in the area to be cut of the workpiece. The first energy density is greater than the second energy density. The area to be cut of the workpiece passes through the cutting area and the sealing area in sequence along the first direction.

[0007] The cutting and sealing process according to the embodiments of this application has at least the following beneficial effects: by emitting a first laser beam and a second laser beam, a cutting area and a sealing area corresponding to the workpiece to be cut can be formed, and the energy density of the cutting area is higher than that of the sealing area. Thus, the workpiece passes through the cutting area and the sealing area in sequence, and the workpiece to be cut and sealed in sequence can be cut and sealed in sequence, which is beneficial to ensuring the structural stability of the workpiece edge and making the edge of the workpiece more neat.

[0008] Optionally, in the laser beam splitting step, the cutting and sealing equipment is controlled to emit a third laser beam, and the third laser beam, the first laser beam, and the second laser beam are arranged sequentially at intervals along the first direction; In the cutting and sealing step, the third laser beam forms a softening zone with a third energy density in the area to be cut on the workpiece, and the third energy density is less than the second energy density. The workpiece passes through the softening zone, the cutting zone and the sealing zone in sequence along the first direction.

[0009] Optionally, the energy of the first laser beam, the second laser beam, and the third laser beam decreases sequentially.

[0010] Optionally, in the cutting and sealing step, a real-time image scan is performed on the area to be cut on the workpiece to obtain position information, and the coverage position of the first laser beam on the workpiece is adjusted according to the position information until the cutting area coincides with the pre-cutting position of the area to be cut on the workpiece.

[0011] Optionally, position information is obtained before the area to be cut of the workpiece enters the cutting area; And / or, while adjusting the coverage position of the first laser beam on the workpiece, the real-time image scanning area is simultaneously adjusted so that the real-time image scanning area covers the area of ​​the workpiece to be cut.

[0012] Optionally, during the cutting and sealing step, the workpiece is pulled along the first direction at both the input and output ends.

[0013] Optionally, during the edge-sealing step, the areas to be cut on opposite sides of the edge-sealing workpiece are cut simultaneously.

[0014] Optionally, when the first laser beam cuts the area to be cut of the workpiece, waste generated by laser cutting is collected in the cutting area.

[0015] Optionally, during the cutting and sealing step, the area of ​​the workpiece to be cut is suspended in the air when the workpiece is being transported.

[0016] According to a second aspect of the present application, a circuit board is provided, including a conductive layer and a workpiece processed in the above-described cutting and sealing process, wherein the conductive layer and the workpiece are stacked together.

[0017] The circuit board according to the embodiments of this application has at least the following beneficial effects: the workpiece can provide mechanical support for the conductive layer to increase the strength of the conductive layer, and the workpiece can also be disposed between two conductive layers to ensure mutual insulation between each conductive layer.

[0018] According to a third aspect of the embodiments of this application, a cutting and sealing device is provided for implementing the cutting and sealing process in any of the above embodiments, the cutting and sealing device including a worktable and a laser device; The worktable is used to support the workpiece; The laser device is used to emit a first laser beam and a second laser beam that are spaced apart along a first direction, and is capable of moving relative to the workpiece along the first direction; The first laser beam is used to form a cutting area in the area to be cut of the workpiece, and the second laser beam is used to form an edge sealing area in the area to be cut of the workpiece. The temperature of the cutting area is higher than the temperature of the edge sealing area.

[0019] The cutting and sealing device according to the embodiments of this application has at least the following beneficial effects: the first laser beam and the second laser beam can form a cutting area and a sealing area with different temperatures in the area to be cut of the workpiece. As the workpiece moves relative to the laser device, the area to be cut of the workpiece can be cut and sealed sequentially along the first direction, which is beneficial to ensuring the structural stability of the area to be cut of the workpiece and making the area to be cut of the workpiece more neat.

[0020] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0021] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a front view of the cutting and sealing equipment according to an embodiment of this application; Figure 2 This is a side view of the cutting and sealing equipment according to an embodiment of this application; Figure 3 This is a side view of the laser device according to an embodiment of this application; Figure 4 This is a side view of a laser device according to another embodiment of this application; Figure 5 This is a schematic diagram of the first type of internal optical path of the laser device according to an embodiment of this application; Figure 6 This is a schematic diagram of a second type of internal optical path of the laser device according to an embodiment of this application; Figure 7 This is a schematic diagram of the third type of internal optical path of the laser device according to an embodiment of this application; Figure 8 This is a schematic diagram illustrating laser beam splitting achieved by diffractive optical elements in this application.

[0022] Reference numeral: Workbench 100; Conveying device 200, conveying platform 210, and guiding mechanism 220; Laser device 300, first emitting unit 310, second emitting unit 320, third emitting unit 330, first beam splitter 340, second beam splitter 350, reflector 360; Positioning device 400; Dust collection device 500, dust collection pipe 510, dust collection port 511. Detailed Implementation

[0023] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0024] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0025] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0026] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0027] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0028] refer to Figures 1 to 7Fiber-reinforced materials such as fiberglass cloth often have fuzzy edges during production. For example, fiberglass cloth provides mechanical support and strength enhancement for circuit boards and ensures insulation between conductive layers. However, the fuzzy edges of the fiberglass cloth lead to waste of adhesives, resins, and other materials in subsequent processes. Therefore, the edges of the fiberglass cloth need to be trimmed. In this application, a cutting and sealing device is used to cut and seal the fuzzy edges of the fiberglass cloth. The cutting and sealing device includes a worktable 100, a conveying device 200, and a laser device 300. The 0 is used to carry the conveying device 200, which is used to transport the workpiece, and the laser device 300 is used to emit laser. Based on this, the cutting and sealing process of this application controls the conveying device 200 to transport the workpiece and controls the laser device 300 to emit a first laser beam and a second laser beam, so that the first laser beam and the second laser beam act on the edge of the glass fiber cloth in sequence. The first laser beam is used to cut the fuzz on the edge of the glass fiber cloth with a first energy density, and the second laser beam is used to seal the edge of the glass fiber cloth with a second energy density. The first energy density is greater than the second energy density.

[0029] It should be noted that when cutting a workpiece, the area to be cut can be the edge of the workpiece or a non-edge area of ​​the workpiece. The non-edge area can form a new edge after cutting.

[0030] The embodiments of this application are described below with reference to the accompanying drawings: refer to Figures 1 to 4 According to a first aspect of the embodiments of this application, a cutting and sealing process is proposed, which includes a laser beam splitting step and a cutting and sealing step. In the laser beam splitting step, the cutting and sealing equipment is controlled to emit a first laser beam and a second laser beam arranged at intervals along a first direction. In the cutting and sealing step, the first laser beam and the second laser beam are controlled to move relative to the workpiece along the first direction. The first laser beam forms a cutting area with a first energy density at the area to be cut on the workpiece, and the second laser beam forms a sealing area with a second energy density at the area to be cut on the workpiece, wherein the first energy density is greater than the second energy density. The area to be cut on the workpiece passes through the cutting area and the sealing area sequentially along the first direction. As a result, the temperature of the cutting area is higher than the temperature of the sealing area. When the workpiece is conveyed along the first direction, the first laser beam removes the fuzz in the area to be cut on the workpiece within the cutting area, which can speed up the cutting speed and help ensure the cutting accuracy. The second laser beam heats the cut area of ​​the workpiece at a lower temperature within the sealing area, thereby sealing the edge of the area to be cut on the workpiece to prevent the edge of the workpiece from spreading out and helping to ensure the neatness of the workpiece edge, thus reducing the subsequent processing cost of the workpiece.

[0031] Specifically, the first laser beam and the second laser beam propagate along a second direction, which may be perpendicular to the first direction. The cutting and sealing equipment can split the incident laser beam into the first laser beam and the second laser beam. The splitting of the incident laser beam can be achieved by a beam splitter, for example, a beam splitter with a built-in diffractive optical element (DOE). (See reference...) Figure 8 A diffractive optical element (DOE) is an optical element that operates based on the principle of light diffraction. It utilizes surface micro / nano structures and specific optical materials to distribute incident light in multiple directions through diffraction, thus achieving beam splitting. For example, the surface of a DOE consists of micron- to nanon-scale diffractive structures or refractive index modulation regions. Each microstructure unit acts as a local phase modulator. When laser light is incident, these micro / nano structures alter the wavefront phase of the light wave, causing diffraction during propagation and ultimately forming a predetermined intensity distribution. The DOE comprises a substrate material and a thin film material. A thin film material is deposited on the substrate material and etched onto it. The substrate material can be a high laser damage threshold material such as fused silica, zinc selenide, or sapphire to ensure the stability of the DOE under high-power laser conditions. The thin film material can be materials such as silicon dioxide, silicon nitride, or photoresist.

[0032] The laser beam splitting principle based on diffractive optical elements involves arranging diffractive optical elements in the optical path system. After the incident beam passes through the diffractive optical elements, it is split into multiple laser beams with uniform or non-uniform energy. The energy density of the multiple laser beams can be preset through the design of micro-nano structures to match the energy requirements of cutting and sealing. Those skilled in the art can select different diffractive optical elements to achieve laser beam splitting according to their needs.

[0033] Alternatively, the incident laser beam can be split by combining a beam splitter and a reflector 360. For example, the materials of the beam splitter and reflector 360 can be selected according to the wavelength of the incident laser, specific material coatings can be applied to the beam splitter and reflector 360, and the laser beam can be split by adjusting the coating thickness and lens thickness. Furthermore, the angle of the incident laser can be adjusted by changing the relative position of the beam splitter and reflector 360, thereby achieving equal or non-equal splitting of a single incident laser beam. This can be achieved by combining existing beam splitters and reflectors 360 based on the characteristics of those skilled in the art. The laser beam splitting principle will not be elaborated here.

[0034] In addition, field lenses can be used to adjust the focal length of the first laser beam and the second laser beam, thereby adjusting the focal position of the first laser beam and the second laser beam. The closer the focal point of each laser beam is to the workpiece, the higher the energy density of the area formed by focusing on the workpiece, and the higher the corresponding temperature. Thus, this application can control the energy density of the cutting area and the sealing area in a variety of ways, so that the temperature of the cutting area is higher than the temperature of the sealing area, thereby achieving cutting and sealing of the area to be cut on the workpiece, and ensuring that the edges of the workpiece are flush.

[0035] The incident laser beam can be divided into a first laser beam and a second laser beam with uniform energy, meaning that the energy of the first laser beam and the second laser beam are equal. Along the second direction, the distance between the emission position of the first laser beam and the surface of the workpiece is equal to the focal length of the first laser beam, so that the focal point of the first laser beam is located at the workpiece, forming a cutting zone. The distance between the emission position of the second laser beam and the surface of the workpiece is less than the focal length of the second laser beam, so that the second laser beam forms a sealing zone on the surface of the workpiece. The distribution range of the sealing zone is greater than the distribution range of the cutting zone, so that the temperature in the sealing zone is lower than the temperature in the cutting zone.

[0036] For example, a laser device with 300 different emitting sections can be matched with different field lenses, so that the focal lengths of the field lenses at different emitting sections can be the same or different. For example, reference... Figure 3 The first emitting part 310 and the second emitting part 320 are matched with field lenses of the same focal length. Based on the same focal length, by adjusting the vertical distance between the first emitting part 310 and the second emitting part 320 relative to the cutting area of ​​the workpiece, the first laser beam is smaller than the spot of the second laser beam on the workpiece surface, thereby changing the energy density of the first laser beam and the second laser beam on the workpiece.

[0037] For example, refer to Figure 4 The first emitting part 310 and the second emitting part 320 are at the same vertical distance from the area to be cut on the workpiece. The first emitting part 310 and the second emitting part 320 are matched with field lenses of different focal lengths. The first emitting part 310 is matched with a field lens with a shorter focal length, and the second emitting part 320 is matched with a field lens with a longer focal length. This makes the spot size of the first laser beam smaller than that of the second laser beam on the workpiece surface, so that the energy density of the first laser beam is greater than that of the second laser beam on the workpiece. This forms a first energy density region with higher energy and a second energy density region with lower energy.

[0038] Alternatively, the incident laser can be divided into a first laser beam and a second laser beam with non-uniform energy, that is, the energy of the first laser beam is greater than that of the second laser beam, the distance between the emission position of the first laser beam and the workpiece surface is equal to the distance between the emission position of the second laser beam and the workpiece surface, the coverage area of ​​the first laser beam and the second laser beam on the workpiece surface is equal, that is, the distribution range of the edge sealing area is equal to the distribution range of the cutting area. Since the energy of the first laser beam is greater than that of the second laser beam, the temperature in the edge sealing area is lower than the temperature in the cutting area.

[0039] refer to Figures 1 to 4 In the laser beam splitting step, the cutting and sealing equipment is controlled to emit a third laser beam. Along the first direction, the third laser beam, the first laser beam, and the second laser beam are arranged alternately. In the cutting and sealing step, the third laser beam forms a softening zone with a third energy density in the area to be cut of the workpiece. The third energy density is less than the second energy density. The workpiece passes through the softening zone, the cutting zone, and the sealing zone in sequence along the first direction. The temperature of the softening zone is lower than the temperature of the sealing zone, and the temperature of the sealing zone is lower than the temperature of the cutting zone. The third laser beam can be formed by splitting the incident laser beam. The third laser beam is used to heat and soften the hairs in the area to be cut of the workpiece, so that the loose and messy hairs will form a temporary adhesive structure, which can reduce the dust generated when cutting the hairs. The softening and adhesion of the hairs can enable the subsequent cutting laser to act more accurately on the root of the connection between the hairs and the substrate, and the cutting path is more regular, which helps to further improve the flatness of the cutting edge.

[0040] For example, refer to Figure 3 The first emitting part 310, the second emitting part 320 and the third emitting part 330 are matched with field lenses of the same focal length. The vertical distance between the first emitting part 310, the second emitting part 320 and the third emitting part 330 and the workpiece decreases sequentially, so that the light spots of the first laser beam, the second laser beam and the third laser beam on the workpiece surface increase sequentially to form a first energy density region, a second energy density region and a third energy density region.

[0041] Or, refer to Figure 4 The first emitting part 310, the second emitting part 320 and the third emitting part 330 are at the same vertical distance from the workpiece. The focal lengths of the matching field lenses of the first emitting part 310, the second emitting part 320 and the third emitting part 330 are increased sequentially, so that the light spots of the first laser beam, the second laser beam and the third laser beam on the workpiece surface are increased sequentially to form a first energy density region, a second energy density region and a third energy density region.

[0042] It should be noted that, similar to the energy density adjustment principle of the cutting area and the sealing area, the energy density control of the softening area can be achieved by splitting the incident laser beam into the energy of the third laser beam, or by adjusting the position of the focal point of the third laser beam relative to the workpiece. The specific principle will not be elaborated here.

[0043] refer to Figures 1 to 4 The incident light is split into a first laser beam, a second laser beam, and a third laser beam. Along a first direction, the third laser beam, the first laser beam, and the second laser beam are arranged sequentially. The first laser beam, the second laser beam, and the third laser beam are all transmitted to the cutting area of ​​the workpiece along a second direction. By splitting the beams, a softening area, a cutting area, and an edge-sealing area are formed sequentially along the first direction. The energy of the first laser beam, the second laser beam, and the third laser beam decreases sequentially, so that the temperature of the cutting area, the edge-sealing area, and the softening area decreases sequentially. The temperature difference between different areas can be achieved by adjusting the energy of each laser beam. Since each laser beam is formed by splitting the incident laser beam, only the emission parameters of the incident laser need to be changed to simultaneously change the energy of the first laser beam, the second laser beam, and the third laser beam, which helps to simplify the temperature adjustment steps.

[0044] Specifically, the incident laser beam is split into a first laser beam, a second laser beam, and a third laser beam. This splitting can be achieved using diffractive optical elements, which modulate the phase of the incident light through surface micro / nano structures. This results in the incident laser beam being spatially split into beams with sequentially decreasing energy. Alternatively, the incident laser beam can be achieved using a combination of a beam splitter and a 360° reflector. Thus, in the laser beam splitting step, adjusting the energy parameters of the incident laser to form beams with sequentially decreasing energy densities results in sequentially decreasing temperatures in the cutting area, the sealing area, and the softening area. This allows for temperature adjustment of different areas simply by adjusting the incident laser parameters, without changing the individual emission parameters or positions of the first, second, and third laser beams, which helps reduce the complexity of the cutting and sealing process.

[0045] refer to Figures 1 to 4 In the above-mentioned cutting and sealing steps, the real-time image scan of the area to be cut on the workpiece is used to obtain position information, and the coverage position of the first laser beam on the workpiece is adjusted according to the position information until the cutting area coincides with the pre-cut position in the area to be cut on the workpiece, which is beneficial to further improve the cutting accuracy of the workpiece edge.

[0046] Specifically, the workpiece has a length direction, a thickness direction, and a width direction. The length direction can be extended along a first direction, the thickness direction can be extended along a second direction, and the width direction can be extended along a third direction. The first direction, the second direction, and the third direction are perpendicular to each other. During the cutting and sealing operation, the workpiece is conveyed along the first direction. Along the second direction, the workpiece includes opposite side edges. The workpiece edge has scattered fuzz. When conveying the workpiece, a CCD (charge coupled device) is used to perform real-time image scanning on the edge of the workpiece to obtain image information of the workpiece edge. The deviation information of the workpiece edge from the image of the workpiece edge is obtained as position information. Based on the position information, the coverage position of the first laser beam along the third direction on the edge of the workpiece is adjusted so that the cutting area coincides with the pre-cutting position at the edge of the workpiece.

[0047] For example, the root of the workpiece edge fuzz can be selected as the pre-cutting position. When the workpiece edge deviates from the preset position by a first distance in a third direction, the first laser beam is adjusted to deviate by the first distance so that the cutting area formed by the first laser beam on the workpiece corresponds to the boundary between the workpiece edge fuzz and the non-fuzz area, which is beneficial to improving the cutting accuracy of the workpiece edge.

[0048] Alternatively, during the cutting and sealing step, the second and third laser beams can be synchronously adjusted. During adjustment, real-time position information at the workpiece edge is first obtained using a CCD image sensor. Based on this information, the coverage positions of the second and third laser beams on the workpiece are adjusted respectively. While adjusting the second and third laser beams, the position of the first laser beam can also be adjusted simultaneously, ensuring that the position adjustments of the three laser beams are synchronized. This ensures that the cutting area formed by the first laser beam, the sealing area formed by the second laser beam, and the softening area formed by the third laser beam are simultaneously aligned with the edge of the workpiece, achieving multi-process collaborative processing of the workpiece edge. This helps ensure the accuracy of the collaborative processes of softening, cutting, and sealing, and improves the processing quality of the workpiece edge.

[0049] refer to Figures 1 to 4 Position information is acquired before the workpiece's area to be cut enters the cutting zone, and / or, while adjusting the coverage position of the first laser beam on the workpiece, the real-time image scanning area is simultaneously adjusted so that the real-time image scanning area covers the workpiece's area to be cut. This is beneficial for further correcting the relative positional deviation between the workpiece's area to be cut and the first laser beam, thereby further improving the overall cutting and sealing quality.

[0050] Specifically, before the edge of the workpiece enters the cutting zone, a pre-image scan is performed on the edge of the workpiece to obtain the position information of the workpiece edge. Based on the position information, the position of the first laser beam is adjusted in advance so that the focus of the first laser beam is pre-aligned with the boundary between the fuzzy and non-fuzzy areas of the workpiece edge. This avoids positional deviation of the workpiece after it enters the cutting zone, which helps to ensure the positional accuracy of the workpiece when it enters the cutting zone, thereby further ensuring the cutting precision.

[0051] Furthermore, while adjusting the coverage position of the first laser beam on the workpiece, the real-time image scanning area can be adjusted simultaneously, ensuring that the real-time image scanning area always corresponds to the edge of the workpiece. This guarantees a clearer image scan of the workpiece edge even if the workpiece shifts position. The real-time image scanning area can also cover the cutting area, enabling real-time monitoring of the removal of burrs from the workpiece edge. When a deviation occurs between the cutting area and the pre-cut area of ​​the workpiece, a signal can be promptly sent to adjust the position of the first laser beam, or to stop emitting the first laser beam and trigger an alarm. This helps to correct deviations in a timely manner and further improves the overall cutting and sealing quality.

[0052] refer to Figures 1 to 4 In the cutting and sealing step, the workpiece is pulled along the first direction at both the input and output ends. This helps ensure the consistency and flatness of the workpiece surface height, thereby improving the quality and consistency of the cutting and sealing process.

[0053] Specifically, in the cutting and sealing step, conveying roller structures are set as pulling components at the input and output ends of the workpiece along the first direction. The conveying rollers are driven to rotate by a motor. The edge of the input end of the workpiece is attached to the roller surface of the input end conveying roller, and the edge of the output end is attached to the roller surface of the output end conveying roller. The conveying rollers drive the workpiece to move along the first direction through the friction between the roller surface and the workpiece. At the same time, a uniform pulling force is applied through synchronous rotation, so that the workpiece is always in a taut state during the conveying process. This effectively avoids wrinkles, warping or positional displacement of the workpiece caused by its own weight, conveying resistance or uneven force, thereby ensuring the consistency and flatness of the workpiece surface height.

[0054] refer to Figures 1 to 4 In the edge-sealing step, cutting the areas to be cut on both sides of the edge-sealing workpiece at the same time is beneficial to improving the overall efficiency of edge-sealing and ensuring the consistency of edge treatment on both sides of the workpiece.

[0055] Specifically, along a third direction, the workpiece includes two opposing sides. The edges of the workpiece are arranged parallel to each other along a first direction. Along a second direction, a first laser beam and a second laser beam are respectively arranged above the edges of the opposing sides of the workpiece. The first laser beam and the second laser beam are arranged at intervals along the first direction, so that a cutting area and an edge sealing area are formed on the opposing edges of the corresponding workpiece. The edges of the workpiece pass through the cutting area and the edge sealing area in sequence to achieve cutting and edge sealing. By simultaneously cutting and sealing the opposing edges of the workpiece, the consistency of the edge processing technology on both sides of the workpiece can be ensured while improving the work efficiency.

[0056] In addition, a third laser beam can be set on the edges of opposite sides of the workpiece. Along the second direction, the third laser beam is located above the edge of the workpiece and covers the edge of the workpiece to form a softening zone. Along the first direction, the softening zone, the cutting zone and the sealing zone are arranged in sequence at intervals to achieve softening, cutting and sealing of the edge of the workpiece.

[0057] refer to Figures 1 to 4 When the first laser beam cuts the area to be cut of the workpiece, the waste generated by laser cutting is collected simultaneously in the cutting area. This helps to improve the cleanliness of the cutting operation, making the surface of the cut workpiece cleaner. At the same time, it helps to reduce the interference of waste on the cutting operation and ensure the accuracy of the cutting operation.

[0058] Specifically, the waste includes burrs from the cutting process and dust generated during the cutting process. The waste can be collected by using a dust collection pipe 510 in conjunction with a suction pump. The suction pump is connected to the dust collection pipe 510, and a negative pressure environment is created inside the dust collection pipe 510 to suck up the waste in the cutting area. This allows the burrs and dust generated by the first laser beam to be collected in real time, preventing burrs from accumulating on the workpiece surface or around the cutting area and preventing dust from spreading into the working environment. This helps improve the cleanliness of the cutting operation. In addition, the real-time collection of waste can prevent burrs from blocking the transmission path of the first laser beam, which helps to ensure the accuracy of the cutting operation.

[0059] refer to Figures 1 to 4 In the cutting and sealing step, when the workpiece is transported, the area to be cut is suspended in the air. By suspending the edge of the workpiece, it is beneficial to avoid damage to the structure supporting the workpiece during the cutting and sealing process.

[0060] Specifically, the non-cutting area of ​​the workpiece is in contact with the conveying device 200, and the two sides of the workpiece to be cut along the width direction extend beyond the conveying device 200, forming a suspended state. When the first laser beam cuts the edge of the workpiece, the laser only acts on the suspended edge of the workpiece, avoiding contact with the conveying support component or the worktable 100 below. This avoids damage such as ablation and melting caused by laser energy to the support structure, which is beneficial to extending the service life of the support structure.

[0061] refer to Figures 1 to 7 According to a second aspect of the embodiments of this application, a circuit board is provided, including a conductive layer and the aforementioned workpiece. The conductive layer may be a copper-clad laminate, and the aforementioned workpiece may be a glass fiber cloth. By stacking the conductive layer and the glass fiber cloth, mechanical support can be provided for the conductive layer to increase the strength of the conductive layer. Furthermore, the workpiece may be disposed between the two conductive layers to ensure mutual insulation between the conductive layers.

[0062] refer to Figures 1 to 7 According to a third aspect of the embodiments of this application, a cutting and sealing device is provided for implementing the cutting and sealing process in any of the above embodiments. The cutting and sealing device includes a worktable 100 and a laser device 300. The worktable 100 is used to carry a workpiece (such as fiberglass cloth). The laser device 300 is used to emit a first laser beam and a second laser beam spaced apart along a first direction, and is capable of moving relative to the workpiece along the first direction. During processing, either the workpiece or the laser device 300 can move along the first direction. The first laser beam is used to form a cutting area in the area to be cut of the workpiece, and the second laser beam is used to form a sealing area in the area to be cut of the workpiece. The temperature of the cutting area is higher than the temperature of the sealing area. Taking the movement of the workpiece along the first direction as an example, the cutting and sealing equipment may include a conveying device 200. When the conveying device 200 conveys the workpiece along the first direction, the first laser beam and the second laser beam can act on the area to be cut of the workpiece in sequence. The first laser beam is used to cut the area to be cut of the workpiece to remove the fuzz on the edge of the workpiece. The second laser beam is used to seal the edge of the cut workpiece to strengthen the edge of the workpiece, ensure the neatness of the edge of the workpiece, and help reduce the subsequent processing cost of the workpiece.

[0063] The aforementioned cutting and sealing equipment may further include a positioning device 400 and a dust collection device 500. Specifically, the laser device 300 includes a first emitting part 310, a second emitting part 320, and a third emitting part 330. Along a first direction, the third emitting part 330, the first emitting part 310, and the second emitting part 320 are arranged sequentially. The first emitting part 310 is used to emit a first laser beam, the second emitting part 320 is used to emit a second laser beam, and the third emitting part 330 is used to emit a third laser beam. The positioning device 400 is connected to the laser device 300 and is used to acquire an image at the edge of the workpiece. The dust collection device 500 includes a dust collection pipe 510, which has a dust collection port 511 facing the first emitting part 310. The third laser beam is used to form a third energy density region at the edge of the workpiece. The first energy density is greater than the second energy density, and the second energy density is greater than the third energy density. Therefore, when the workpiece is conveyed along the first direction, the third laser beam, the first laser beam, and the second laser beam can act on the edge of the workpiece in sequence. The third laser beam is used to soften the fuzz on the edge of the workpiece, so that the loose and messy fuzz will form a temporary adhesive structure. The first laser beam is used to cut the edge of the workpiece to remove the fuzz on the edge of the workpiece. The second laser beam is used to seal the edge of the cut workpiece to strengthen the edge of the workpiece, ensure the neatness of the edge of the workpiece, and help reduce the subsequent processing cost of the workpiece.

[0064] The first direction can be perpendicular to the second direction. The conveying device 200 adopts a conveying roller group structure, which includes multiple conveying rollers. The multiple conveying rollers are parallel to each other and arranged at equal intervals along the first direction. Each conveying roller is used to support and convey the workpiece at a uniform speed along the first direction. The width of the conveying device 200 is configured to be smaller than the width of the workpiece, so that the edge of the workpiece extends beyond the edge of the conveying device 200. Under the support of the conveying device 200, the edge of the workpiece is suspended relative to the worktable 100 along the second direction, thereby avoiding damage to the worktable 100 or the conveying device 200 during laser cutting and edge sealing.

[0065] The laser device 300 can be connected to the worktable 100 via a connecting frame. The laser device 300 may include a beam splitter, which has a built-in diffractive optical element. The diffractive optical element is arranged on the laser delivery path. Based on the principle of light diffraction, the diffractive optical element modulates the incident laser through a micro-nano structure preset on its surface, thereby splitting a single incident laser beam into multiple laser beams with uniform or non-uniform energy. The energy density of the multiple laser beams can be preset through the design of the micro-nano structure to match the energy requirements of cutting and sealing respectively. Based on this principle, if the incident laser beam is divided into a first laser beam, a second laser beam, and a third laser beam with uniform energy, then along the second direction, there is a first distance between the first emitting part 310 and the worktable 100, a second distance between the second emitting part 320 and the worktable 100, and a third distance between the third emitting part 330 and the worktable 100. The first distance is greater than the second distance, the second distance is greater than the third distance, the second direction is perpendicular to the first direction, and the distance between the first emitting part 310 and the workpiece is equal to the focal length of the first laser beam, so that the focal point of the first laser beam is located on the edge surface of the workpiece, and the focal points of the second and third laser beams are located on the side of the workpiece edge facing the worktable 100.

[0066] It should be noted that, along the second direction, the focal point of the first laser beam is located on the plane of the workpiece surface, the focal point of the second laser beam is located on the side of the workpiece facing the worktable 100, and the focal point of the third laser beam is located on the side of the workpiece away from the worktable 100. This results in the first laser beam having a smaller spot area on the workpiece surface than the second laser beam, and the second laser beam having a smaller spot area on the workpiece surface than the third laser beam. Consequently, the first laser beam forms a first energy density region (cutting zone) at the workpiece edge, the second laser beam forms a second energy density region (sealing zone) at the workpiece edge, and the third laser beam forms a third energy density region (softening zone) at the workpiece edge. The first energy density is greater than the second energy density, and the second energy density is greater than the third energy density. The temperatures of the cutting zone, the sealing zone, and the softening zone decrease sequentially.

[0067] refer to Figures 2 to 4 If the incident laser beam is divided into a first laser beam, a second laser beam, and a third laser beam with non-uniform energy, then the energy of the first laser beam is greater than that of the second laser beam, and the energy of the second laser beam is greater than that of the third laser beam. Then, along the second direction, there is a first distance between the first emitting part 310 and the worktable 100, a second distance between the second emitting part 320 and the worktable 100, and a third distance between the third emitting part 330 and the worktable 100. The first distance, the second distance, and the third distance are all equal. At the same distance, the first laser beam can form a first energy density region with higher energy at the edge of the workpiece.

[0068] Or, refer to Figures 2 to 5The beam splitter in the laser device 300 in the above embodiments may include a beam splitter mirror and a reflector mirror 360. The materials of the beam splitter mirror and the reflector mirror 360 can be selected according to the wavelength of the incident laser, and the beam splitter mirror and the reflector mirror 360 can be coated with specific materials. The laser beam can be split by adjusting the coating thickness and the lens thickness. The angle of the incident laser can be adjusted by changing the relative position of the beam splitter mirror and the reflector mirror 360 to achieve equal or non-equal beam splitting of a single incident laser beam. The specific principle can be adjusted by those skilled in the art according to the requirements, and will not be described in detail here.

[0069] Alternatively, the beam splitter in the laser device 300 in the above embodiments may include a field lens. The field lens is arranged at the output end of the first emitting part 310, the second emitting part 320 and the third emitting part 330. The field lens is used to adjust the focal position of the first laser beam, the second laser beam and the third laser beam, so that the size of the light spot irradiated by the first laser beam, the second laser beam and the third laser beam on the edge of the workpiece is different, forming a coverage area with different energy densities.

[0070] refer to Figures 4 to 6 The laser device 300 includes a first beam splitter 340, a second beam splitter 350, and a reflector 360. The first beam splitter 340, the second beam splitter 350, and the reflector 360 are arranged sequentially at intervals along the laser delivery direction. The first beam splitter 340 is used to split the incident laser beam into a first reflected beam and a first transmitted beam. The second beam splitter 350 is used to receive the first transmitted beam and split the first transmitted beam into a second reflected beam and a second transmitted beam. The reflector 360 is used to receive the second transmitted beam and reflect the second transmitted beam to form a third reflected beam.

[0071] Or, refer to Figure 4 and Figure 7 The first beam splitter 340, the reflector 360, and the second beam splitter 350 are arranged sequentially at intervals along the laser delivery direction. The first beam splitter 340 is used to split the incident laser beam into a first reflected beam and a first transmitted beam. The reflector 360 is used to receive the first transmitted beam and reflect the first transmitted beam to form a second reflected beam. The second beam splitter 350 is used to receive the second reflected beam and split the second reflected beam into a second transmitted beam and a third reflected beam.

[0072] Specifically, refer to Figures 4 to 7 The center line connecting the first beam splitter 340, the second beam splitter 350, and the reflector 360 can be a straight line, a triangle, or other shapes. By combining the first beam splitter 340, the second beam splitter 350, and the reflector 360, the beam splitting and energy distribution can be realized more flexibly, making the internal spatial layout of the laser device 300 more flexible.

[0073] refer to Figures 1 to 4 The aforementioned laser device 300 may have two laser devices 300 arranged at intervals along a third direction. The first direction, the second direction, and the third direction are mutually perpendicular. Specifically, along the third direction, the conveying device 200 includes opposite sides. One laser device 300 projects along the second direction to cover one side edge of the conveying device 200, and the other laser device 300 projects along the second direction to cover the opposite side edge of the conveying device 200. Each laser device 300 includes a first emitting part 310 and a second emitting part 320 arranged at intervals along the first direction, so that the two laser devices 300 can simultaneously cut and seal the opposite side edges of the workpiece, which is beneficial to further improve work efficiency.

[0074] Alternatively, each laser device 300 may include a third emitting part 330, a first emitting part 310 and a second emitting part 320 arranged sequentially at intervals along the first direction, thereby enabling the softening, cutting and sealing of the edge of the workpiece, and further improving the neatness of the sealing.

[0075] refer to Figures 1 to 4 The cutting and sealing equipment also includes a positioning device 400, which is connected to the laser device 300. Along a third direction, the laser device 300 is movably connected to the worktable 100. The positioning device 400 can move synchronously with the laser device 300, with the first direction, second direction, and third direction being mutually perpendicular. The positioning device 400 is used to acquire an image of the workpiece edge. The laser device 300 is configured to adjust its position along the third direction based on the image acquired by the positioning device 400, ensuring that each laser beam is aligned with the edge of the workpiece. This further improves the accuracy of cutting and sealing, resulting in neater edges on the workpiece.

[0076] Specifically, the positioning device 400 can employ charge-coupled device imaging. The lens of the positioning device 400 faces the edge of the workpiece, and the lens coverage corresponds to the laser's effective area. The positioning device 400 converts the light signal from the workpiece edge into an electrical signal through an internal photosensitive element, forming an image of the laser processing area. The positioning device 400 is electrically connected to the control module of the laser device 300, transmitting the acquired image signal to the control module in real time. The control module analyzes the image to identify the deviation between the actual position of the workpiece edge and the preset benchmark, driving the laser device 300 to move and adjust along a third direction to ensure that each laser beam is always aligned with the workpiece edge. This helps correct the deviation along the third direction caused by the conveying device 200 when conveying the workpiece, further improving the accuracy of laser operations.

[0077] refer to Figures 1 to 4Along the first direction, the positioning device 400 is located on the side of the first emitting part 310 away from the second emitting part 320, so that the position of the workpiece edge is scanned before cutting and sealing, and the position of the laser device 300 along the third direction can be adjusted based on the scanned image of the positioning device 400, so that cutting and sealing are more accurate.

[0078] The aforementioned laser device 300 also includes a third emitting part 330, a first emitting part 310, and a second emitting part 320 arranged sequentially at intervals along a first direction. The positioning device 400 is located on the side of the third emitting part 330 away from the first emitting part 310. During the conveying process, the edge of the workpiece passes sequentially through the coverage area of ​​the positioning device 400, the coverage area of ​​the third emitting part 330, the coverage area of ​​the first emitting part 310, and the coverage area of ​​the second emitting part 320. Thus, before softening the edge of the workpiece, the position of the laser device 300 along the third direction can be adjusted according to the recognition image of the positioning device 400, and then the edge of the workpiece can be cut and sealed, which is beneficial to further improve the working accuracy and make the edge of the workpiece more neat.

[0079] refer to Figures 1 to 4 The conveying device 200 includes a conveying platform 210 and a guide mechanism 220. Along the first direction, guide mechanisms 220 are provided on both opposite sides of the conveying platform 210. The guide mechanism 220 can be a guide roller structure. The workpiece is clamped by the upper roller and the lower roller. The guide mechanism 220 is provided on both opposite sides of the conveying platform 210 to keep the workpiece tensioned when conveying the workpiece, so that the conveying of the workpiece is more stable and to ensure the neatness of the edge sealing of the workpiece.

[0080] The aforementioned guide structure also includes a limiting part located along the third direction. The limiting part is located on opposite sides of the upper and lower rollers to restrict the movement of the workpiece along the third direction, so as to ensure the positional accuracy of the workpiece along the third direction, thereby making the edge of the workpiece after sealing more neat.

[0081] refer to Figures 1 to 4 The cutting and sealing equipment also includes a dust collection device 500, which includes a dust collection pipe 510 arranged along a second direction, spaced apart from the laser device 300. A dust collection port 511 is provided on the side of the dust collection pipe 510 facing the laser device 300, with the first direction perpendicular to the second direction. The dust collection port 511 is used to collect lint and dust from laser cutting, which helps ensure the cleanliness of the laser cutting operation and its continuous operation.

[0082] Specifically, along the second direction, the distance between the dust collection port 511 and the worktable 100 is less than the distance between the side of the conveying device 200 facing the laser device 300 and the worktable 100. The side of the conveying device 200 facing the laser device 300 is used to carry and convey the workpiece. When the edge of the workpiece is laser-cut, the workpiece is located on the side of the dust collection port 511 close to the laser device 300, that is, above the dust collection port 511. The dust collection device 500 includes a suction pump, which is connected to a dust collection pipe 510. When the suction pump is started, it can form a suction force at the dust collection port 511. The dust collection port 511 can collect the fuzz and dust generated by the edge of the cut workpiece to ensure the cleanliness of the area covered by the laser device 300.

[0083] Alternatively, the aforementioned conveying device 200 may be provided with a through groove extending along the second direction. Along the second direction, a laser device 300 is provided on one side of the through groove, and a dust collection pipe 510 is provided on the opposite side of the through groove. The dust collection port 511 of the dust collection pipe 510 is arranged facing the through groove. During laser operation, the edge of the workpiece extends to the location of the through groove, thereby softening, cutting, and sealing the edge of the workpiece. The fuzz generated during cutting can fall into the dust collection port 511 through the through groove. The through groove can prevent the laser from acting on the conveying device 200, which is beneficial to ensuring the integrity of the conveying device 200 and can ensure the collection of fuzz and dust.

[0084] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A cutting and edge-sealing process for controlling the processing of workpieces by cutting and edge-sealing equipment, characterized in that, Includes the following steps: Laser beam splitting: Controlling the cutting and sealing equipment to emit a first laser beam and a second laser beam that are spaced apart along a first direction; Cutting and sealing: The first laser beam and the second laser beam are controlled to move relative to the workpiece along the first direction. The first laser beam forms a cutting area with a first energy density in the area to be cut of the workpiece, and the second laser beam forms a sealing area with a second energy density in the area to be cut of the workpiece. The first energy density is greater than the second energy density. The area to be cut of the workpiece passes through the cutting area and the sealing area in sequence along the first direction.

2. The cutting and sealing process according to claim 1, characterized in that, In the laser beam splitting step, the cutting and sealing device is controlled to emit a third laser beam, and the third laser beam, the first laser beam, and the second laser beam are arranged sequentially at intervals along the first direction; In the cutting and sealing step, the third laser beam forms a softening zone with a third energy density at the area to be cut on the workpiece, and the third energy density is less than the second energy density. The workpiece passes through the softening zone, the cutting zone and the sealing zone in sequence along the first direction.

3. The cutting and sealing process according to claim 2, characterized in that, The energy of the first laser beam, the second laser beam, and the third laser beam decreases sequentially.

4. The cutting and sealing process according to claim 1, characterized in that, In the cutting and sealing step, a real-time image scan is performed on the area to be cut of the workpiece to obtain position information, and the coverage position of the first laser beam on the workpiece is adjusted according to the position information until the cutting area coincides with the pre-cut position within the area to be cut of the workpiece.

5. The cutting and sealing process according to claim 4, characterized in that, The position information is obtained before the area to be cut of the workpiece enters the cutting area; And / or, while adjusting the coverage position of the first laser beam on the workpiece, the real-time image scanning area is simultaneously adjusted so that the real-time image scanning area covers the area of ​​the workpiece to be cut.

6. The cutting and sealing process according to claim 1, characterized in that, In the cutting and sealing step, the workpiece is pulled along the first direction at the input and output ends of the workpiece.

7. The cutting and sealing process according to claim 1, characterized in that, In the cutting and sealing step, the areas to be cut on opposite sides of the workpiece are cut and sealed simultaneously.

8. The cutting and sealing process according to claim 1, characterized in that, When the first laser beam cuts the area to be cut of the workpiece, waste generated by laser cutting is collected in the cutting area.

9. The cutting and sealing process according to any one of claims 1 to 8, characterized in that, In the cutting and sealing step, when the workpiece is conveyed, the area of ​​the workpiece to be cut is suspended in the air.

10. A circuit board, characterized in that, include: Conductive layer; The workpiece according to any one of claims 1 to 9, wherein the conductive layer is stacked with the workpiece.

11. A cutting and edge-sealing device for implementing the cutting and edge-sealing process according to any one of claims 1 to 9, characterized in that, include: The worktable is used to support the workpiece; A laser device for emitting a first laser beam and a second laser beam spaced apart along the first direction, and capable of moving relative to the workpiece along the first direction; The first laser beam is used to form a cutting area in the area to be cut on the workpiece, and the second laser beam is used to form an edge sealing area in the area to be cut on the workpiece. The temperature of the cutting area is higher than the temperature of the edge sealing area.