Process equipment for vapor phase reflow soldering of printed board

Abstract

The invention discloses technological equipment for vapor phase reflow soldering of a printed board, and belongs to the technical field of vapor phase reflow soldering of the printed board, the technological equipment comprises a bottom plate and supporting columns, the supporting columns are fixedly mounted on the bottom plate, the supporting columns are inserted into mounting holes in the printed board and used for supporting and fixing the printed board, and the bottom plate is a latticed composite stone plate with holes. Mounting holes for mounting the supporting columns are formed in the bottom plate according to the interval which is multiple of 2.54 cm, and for a special printed board, the mounting holes in the bottom plate are formed according to the interval of the mounting holes in the special printed board. According to the process equipment, printed board design and process edge reserving are not needed, supporting and fixing are conducted through installation holes of the printed board, the process equipment can adapt to printed boards of various hole diameters and hole pitches by selecting different supporting columns, use is flexible and efficient, cost is saved, and the process equipment is suitable for large-scale popularization and application. For a special printed board, the supporting columns can be processed and holes can be formed in the bottom plate according to the hole diameters and the hole distances of the printed board mounting holes so as to adapt to the printed board with the special hole diameters and the hole distances.

Description

Technical Field

[0001] This invention belongs to the field of printed circuit board vapor phase reflow soldering technology, and particularly relates to a process equipment for printed circuit board vapor phase reflow soldering. Background Technology

[0002] During vapor phase reflow soldering of printed circuit boards, process equipment is needed to place the printed circuit board to be soldered into the soldering equipment. The process equipment plays the role of supporting and fixing the printed circuit board.

[0003] Currently, printed circuit board (PCB) designs are mostly double-sided reflow soldering. When soldering the second side, since components are already soldered on the first side, process equipment must be used to support the PCB to prevent additional external forces from acting on the components soldered on the first side. Otherwise, the components on the first side risk disturbance, displacement, or even falling off, affecting the soldering quality.

[0004] Currently, the common method is to fabricate process edges on the printed circuit board (PCB) and clamp or support these edges during soldering. However, when process edges cannot be designed or reserved on the PCB for various reasons, reliable soldering of the second side of the PCB cannot be performed during vapor phase reflow soldering.

[0005] It should be noted that the above content falls within the inventor's technical knowledge and does not necessarily constitute prior art. Summary of the Invention

[0006] To address the aforementioned problems, the present invention aims to provide a process equipment for vapor phase reflow soldering of printed circuit boards (PCBs). This equipment enables double-sided soldering of PCBs without process edges, ensuring high-quality soldering on both sides. The invention comprises a base plate and support columns. Support columns are installed on the base plate using through holes such as mounting holes on the PCB. These support columns are then inserted into the mounting holes to support and fix the PCB, eliminating the need for designing or pre-reserving process edges on the PCB.

[0007] To achieve the above objectives, the present invention proposes a process equipment for vapor phase reflow soldering of printed circuit boards. The process equipment includes a base plate and a support column. The support column is fixedly installed on the base plate and inserted into the mounting hole on the printed circuit board to support and fix the printed circuit board.

[0008] Preferably, the base plate is a synthetic stone slab with a grid-like perforation.

[0009] Preferably, the base plate has mounting holes for installing support columns at intervals that are multiples of 2.54 cm.

[0010] Preferably, the depth of the mounting holes on the base plate is a first fixed value.

[0011] Preferably, for special printed circuit boards, the mounting holes on the base plate are drilled according to the mounting hole spacing on the special printed circuit board.

[0012] Preferably, the support column is a T-shaped column, with the upper diameter matching the diameter of the mounting hole on the printed circuit board and the lower diameter matching the space around the mounting hole on the printed circuit board.

[0013] Preferably, the support column does not contact the surrounding components and pads.

[0014] Preferably, the length of the support column is a second fixed value.

[0015] The process equipment for vapor phase reflow soldering of printed circuit boards proposed in this invention can bring the following beneficial effects:

[0016] 1. The process equipment of this invention does not require printed circuit board design or reserved process edges; it utilizes the mounting holes on the printed circuit board itself for support and fixation. By selecting different support columns, the process equipment can be adapted to printed circuit boards with various hole diameters and hole spacings, making it flexible, efficient, and cost-effective.

[0017] 2. The process equipment of this invention can process support columns and open holes in the base plate according to the hole diameter and hole spacing of the mounting holes of the printed circuit board, so as to adapt to the printed circuit board with special hole diameter and hole spacing. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:

[0019] Figure 1 This is a front view of a process equipment for vapor phase reflow soldering of printed circuit boards according to the present invention.

[0020] Figure 2 This is a top view of a process equipment for vapor phase reflow soldering of printed circuit boards according to the present invention.

[0021] Figure 3 This is a schematic diagram of the structure of a process equipment for vapor phase reflow soldering of printed circuit boards according to the present invention, which is used to install printed circuit boards.

[0022] Figure 4 This is a schematic diagram of the structure of various support columns of the present invention. Detailed Implementation

[0023] To more clearly illustrate the overall concept of the present invention, a detailed description will be provided below with reference to the accompanying drawings and examples.

[0024] An embodiment of the present invention provides a process equipment for vapor phase reflow soldering of printed circuit boards, the process equipment including a base plate and support columns, such as... Figure 1 , Figure 2 As shown, a support column is fixedly installed on the base plate, and the support column is inserted into the mounting hole on the printed circuit board, as follows. Figure 3 As shown, it is used to support and fix the printed circuit board, eliminating the need for designing and reserving process edges on the printed circuit board.

[0025] The base plate is a perforated synthetic stone slab with a grid pattern, which is conducive to the uniform condensation of vapor and liquid vapor on the printed circuit board.

[0026] The base plate has mounting holes for the support columns spaced at multiples of 2.54 cm, with the hole depth set to a fixed value to accommodate the mounting hole spacing of various printed circuit boards. For special printed circuit boards, the mounting holes on the base plate can be made according to the mounting hole spacing on the special printed circuit board.

[0027] The supporting columns are T-shaped columns, such as... Figure 4 As shown, the upper diameter matches the diameter of the mounting hole on the printed circuit board, and the lower diameter matches the space around the mounting hole, ensuring that the support post does not contact surrounding components and pads. The length of the support post is a second fixed value. Appropriate T-shaped support posts are configured according to different printed circuit board mounting hole diameters.

[0028] This equipment can ensure that printed circuit boards of the same thickness have a consistent height and that the welding temperature is consistent during vapor phase reflow soldering.

[0029] This process equipment can be adapted to various printed circuit boards, improving tooling utilization and saving costs.

[0030] Select and process suitable support columns and base plates according to the mounting hole dimensions of the printed circuit board (PCB). Install the support columns onto the base plate, ensuring the upper surfaces of the support columns are flush. Align the mounting holes of the PCB to be soldered with the support columns and place it on the fixture. Then, place it in the vapor phase reflow oven for soldering. After soldering is complete, wait for the PCB temperature to drop before removing it from the oven.

[0031] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A process equipment for vapor phase reflow soldering of printed circuit boards, characterized in that, The process equipment includes a base plate and support columns. The support columns are fixedly installed on the base plate and inserted into the mounting holes on the printed circuit board to support and fix the printed circuit board.

2. The process equipment for vapor phase reflow soldering of printed circuit boards according to claim 1, characterized in that, The base plate is a synthetic stone slab with a grid-like perforation.

3. The process equipment for vapor phase reflow soldering of printed circuit boards according to claim 2, characterized in that, The base plate has mounting holes for installing support columns at intervals of multiples of 2.54 cm.

4. The process equipment for vapor phase reflow soldering of printed circuit boards according to claim 3, characterized in that, The depth of the mounting holes on the base plate is a first fixed value.

5. The process equipment for vapor phase reflow soldering of printed circuit boards according to claim 4, characterized in that, For special printed circuit boards, the mounting holes on the base plate are drilled according to the mounting hole spacing on the special printed circuit board.

6. The process equipment for vapor phase reflow soldering of printed circuit boards according to claim 5, characterized in that, The support column is a T-shaped column, with the upper diameter matching the diameter of the mounting hole on the printed circuit board and the lower diameter matching the space around the mounting hole on the printed circuit board.

7. The process equipment for vapor phase reflow soldering of printed circuit boards according to claim 6, characterized in that, The support column does not contact the surrounding components and pads.

8. The process equipment for vapor phase reflow soldering of printed circuit boards according to claim 7, characterized in that, The length of the support column is a second fixed value.

Images