Step golden finger chamfering process method

Abstract

The invention discloses a step golden finger chamfering process method, and belongs to the technical field of printed circuit board manufacturing, and the method comprises the steps: obtaining a non-functional substrate as a raw material for manufacturing a step golden finger chamfering jig through a step golden finger printed circuit board; drilling a plurality of holes in the non-functional substrate, wherein the holes are used as positioning holes when the chamfering jig for the stepped golden fingers is manufactured; a part of width of the non-functional substrate is cut off through the positioning holes by adopting an edge fishing machine, and the machined stepped golden finger chamfering jig is obtained; and placing the processed stepped golden finger chamfering jig on the stepped golden finger printed circuit board to complete a stepped golden finger chamfering process. According to the chamfering device, the problem of deviation caused by insufficient support during chamfering due to plate thickness difference caused by steps can be solved.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board manufacturing technology, and in particular to a method for a stepped gold finger chamfering process. Background Technology

[0002] Due to the fixed slot size limitations of high-speed serial computer expansion bus standards, stepped gold fingers need to be designed to meet the assembly requirements for signal input and output. Currently, in the chamfering process for stepped gold fingers, the non-stepped positions are conventionally far from the gold finger positions. During chamfering, the force of the edge grinding machine can easily cause them to shift, resulting in angles that do not meet requirements, or even uneven edges, making them defective products. Summary of the Invention

[0003] The purpose of this invention is to provide a method for chamfering stepped gold fingers. First, a stepped gold finger chamfering fixture is manufactured using existing equipment and processes. Then, the stepped gold finger chamfering fixture assists in completing the stepped finger chamfering process, which can improve the situation where insufficient support and misalignment occur during chamfering due to thickness differences caused by the steps. This invention is achieved through the following technical solution.

[0004] This invention provides a method for a stepped gold finger chamfering process, comprising: Non-functional substrates are obtained from stepped gold finger printed circuit boards and used as raw materials for manufacturing stepped gold finger chamfering fixtures. Multiple holes are drilled in the non-functional substrate to serve as positioning holes when manufacturing the stepped gold finger chamfering fixture. The non-functional substrate is partially cut off using an edge trimming machine through the positioning hole to obtain a processed stepped gold finger chamfering fixture. The processed stepped gold finger chamfering fixture is placed on the stepped gold finger printed circuit board to complete the stepped gold finger chamfering process.

[0005] Optionally, the stepped gold finger printed circuit board includes a stepped area and a non-stepped area, wherein the stepped area includes gold fingers.

[0006] Optionally, placing the processed stepped gold finger chamfering fixture on the stepped gold finger printed circuit board includes placing the processed stepped gold finger chamfering fixture in the stepped area.

[0007] The finished stepped gold finger chamfering fixture is placed in the stepped area, ensuring that the top and bottom surfaces of the fixture are at a uniform height. Since the raw material for the stepped gold finger chamfering fixture is derived from printed circuit boards (PCBs), its size and height are highly compatible with the stepped PCBs. The top and bottom surfaces refer to the height from the top of the stepped gold finger chamfering fixture to the bottom of the stepped PCB, which is consistent with the height of the PCB in the non-stepped areas.

[0008] Optionally, the diameter of the positioning hole is consistent with the size of the pin used for positioning by the edge-removing machine.

[0009] The drilled positioning holes are used for upper positioning when the edge trimming machine is making the stepped gold finger chamfering fixture, to ensure that the non-functional substrate will not shift during the edge trimming machine operation, causing errors in size.

[0010] Optionally, the diameter of the positioning hole is 1.1mm-6.2mm.

[0011] Optionally, cutting off a portion of the width of the non-functional substrate using an edge trimming machine through the positioning hole includes cutting off a portion of the width of the non-functional substrate near the gold finger using an edge trimming machine through the positioning hole.

[0012] Optionally, the width of the portion is smaller than the width of the gold finger.

[0013] In this invention, the width of the cut-off portion is greater than the near-side distance of the gold finger from the forming edge and less than the far-side distance of the gold finger from the forming edge. This ensures that the chamfering process is not affected, while minimizing the area of ​​the height difference caused by the steps.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: The stepped gold finger chamfering process method provided by this invention can improve the yield and quality of stepped gold finger printed circuit boards by addressing the insufficient support and misalignment caused by thickness differences in the board during chamfering due to the stepped design. Furthermore, the stepped gold finger chamfering process method provided by this invention is implemented with the assistance of a stepped gold finger chamfering fixture, which can be manufactured using existing equipment and processes, requiring no additional equipment or raw material purchases. This method is highly operable and saves social resources. Attached Figure Description

[0015] Figure 1 The diagram shown is a schematic flowchart of the stepped gold finger chamfering process in one embodiment of the present invention; Figure 2 The diagram shown is a schematic diagram of a stepped gold finger printed circuit board structure in one embodiment of the present invention. Figure 3 The diagram shown is a schematic diagram of a non-functional substrate structure in one embodiment of the present invention; Figure 4 The diagram shown is a schematic diagram of non-functional substrate cutting in one embodiment of the present invention; Figure 5 The diagram shown is a schematic diagram of a stepped gold finger chamfering fixture structure in one embodiment of the present invention. Detailed Implementation

[0016] The following description, in conjunction with the accompanying drawings and specific embodiments, provides further details. In this description, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0017] Example 1 This embodiment provides a method for a stepped gold finger chamfering process, including: Non-functional substrates are obtained from stepped gold finger printed circuit boards and used as raw materials for manufacturing stepped gold finger chamfering fixtures. Multiple holes are drilled in the non-functional substrate to serve as positioning holes when manufacturing the stepped gold finger chamfering fixture. The non-functional substrate is partially cut off using an edge trimming machine through the positioning hole to obtain a processed stepped gold finger chamfering fixture. The processed stepped gold finger chamfering fixture is placed on the stepped gold finger printed circuit board to complete the stepped gold finger chamfering process.

[0018] Example 2 Based on Example 1, this example describes the specific implementation process of a stepped gold finger chamfering process, such as... Figure 1 As shown, it specifically includes the following: In one specific embodiment of the present invention, such as Figure 2 As shown, the stepped gold finger printed circuit board includes a stepped area and a non-stepped area, wherein the stepped area includes gold fingers.

[0019] In practical applications, such as Figure 5 As shown, the processed stepped gold finger chamfering fixture is placed on the stepped gold finger printed circuit board, specifically the processed stepped gold finger chamfering fixture is placed in the stepped area.

[0020] The processed stepped gold finger chamfering fixture is placed in the stepped area to restore the top and bottom surfaces to a uniform height. Since the fixture is taken from the printed circuit board, its size and height match with the stepped printed circuit board is very high.

[0021] In one specific embodiment of the present invention, the diameter of the positioning hole is consistent with the pin used for positioning by the edge-removing machine.

[0022] The drilled positioning holes are used for upper positioning when the edge trimming machine is making the stepped gold finger chamfering fixture, to ensure that the non-functional substrate will not shift during the edge trimming machine operation, causing errors in size.

[0023] In one specific embodiment of the present invention, such as Figures 3-4 As shown, Figure 3 The raw material for the fixture is a non-functional substrate. Three holes are drilled on the non-functional substrate as positioning holes for making the chamfered fixture for the stepped gold fingers. The diameter of the positioning holes is 1.1mm-6.2mm.

[0024] In one specific embodiment of the present invention, the non-functional substrate is partially cut off using an edge trimming machine through the positioning hole. Specifically, the non-functional substrate is partially cut off from the side closest to the gold finger using an edge trimming machine through the positioning hole.

[0025] The width of the cut-off portion is greater than the near-side distance of the gold finger from the forming edge and less than the far-side distance of the gold finger from the forming edge. This ensures that the chamfering process is not affected, while minimizing the area affected by the height difference caused by the steps.

[0026] In one specific embodiment of the present invention, the stepped gold finger printed circuit board is designed with 34 layers, wherein layers L19 to L34 are stepped gold finger layers, and the thickness of the stepped gold finger layers is the thickness of a standard PCIe interface slot. The non-functional substrate portion removed during blind drilling from layers L1 to L18 is used as the raw material for the stepped gold finger chamfering fixture.

[0027] Three holes, each 3.2 mm in diameter, were drilled inside the non-functional substrate. Figure 4 As shown, these three holes are non-through holes, used for positioning on the edge trimming machine. Two of them are aligned with one edge c, while the third is located at any position on the other edge a, used for foolproofing and fixation.

[0028] Use an edge trimming machine to trim the edge near the gold finger ( Figure 4 Cut a portion of the width of the non-functional substrate (edge ​​d) off: After fixing the non-functional substrate with a needle on the edge-removing machine, perform edge-removing processing on the gold finger edge d, trimming it by 10mm to form a chamfered edge. Figure 5 As shown.

[0029] Place the stepped gold finger chamfering fixture back into the stepped area, exposing a portion of the gold fingers and completing the chamfering process. Placing the stepped gold finger chamfering fixture in the stepped area compensates for height differences and prevents movement during chamfering due to unevenness of the printed circuit board. In practical applications, the chamfering process requires fixing the circuit board, using clamps to hold the printed circuit board in its numerical direction. If there is a height difference, the clamps may not be tight enough, causing movement and misalignment during chamfering.

[0030] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims. All of these forms are within the protection scope of the present invention.

Claims

1. A method for chamfering stepped gold fingers, characterized in that, include: Non-functional substrates are obtained from stepped gold finger printed circuit boards and used as raw materials for manufacturing stepped gold finger chamfering fixtures. Multiple holes are drilled in the non-functional substrate to serve as positioning holes when manufacturing the stepped gold finger chamfering fixture. The non-functional substrate is partially cut off using an edge trimming machine through the positioning hole to obtain a processed stepped gold finger chamfering fixture. The processed stepped gold finger chamfering fixture is placed on the stepped gold finger printed circuit board to complete the stepped gold finger chamfering process.

2. The method for chamfering stepped gold fingers according to claim 1, characterized in that, The stepped gold finger printed circuit board includes stepped areas and non-stepped areas.

3. The method for chamfering stepped gold fingers according to claim 2, characterized in that, The stepped area includes the gold finger.

4. The method for chamfering stepped gold fingers according to claim 2, characterized in that, Placing the processed stepped gold finger chamfering fixture on the stepped gold finger printed circuit board includes placing the processed stepped gold finger chamfering fixture in the stepped area.

5. The method for chamfering stepped gold fingers according to claim 1, characterized in that, The diameter of the positioning hole is consistent with the size of the pin used for positioning by the edge trimming machine.

6. The method for chamfering stepped gold fingers according to claim 5, characterized in that, The diameter of the positioning hole is 1.1mm-6.2mm.

7. The method for chamfering stepped gold fingers according to claim 3, characterized in that, Using an edge trimming machine through the positioning hole, a portion of the width of the non-functional substrate is cut off, including cutting off a portion of the width of the non-functional substrate near the gold finger through the positioning hole.

8. The method for chamfering stepped gold fingers according to claim 7, characterized in that, The width of the portion is smaller than the width of the gold finger.

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