Heat dissipation piece and electronic device

Abstract

The invention discloses a heat dissipation piece and an electronic device. The heat dissipation piece comprises a body and a matching part, the body comprises a heat dissipation area and a contact area, the contact area is connected to the heat dissipation area, and the contact area is configured to abut against the heat conduction piece and be attached to the heat conduction piece. The matching part is arranged on the body and is configured to reduce the pressure of the heat dissipation piece on the heat conduction piece when the contact area abuts against the heat conduction piece. According to the heat dissipation piece and the electronic device, due to the arrangement of the matching part, it can be ensured that when the contact area abuts against the heat conduction piece, the contact area makes close contact with the heat conduction piece, the heat transfer performance between the contact area and the heat conduction piece is improved, and the pressure applied to the heat conduction piece by the heat dissipation piece can be reduced when the contact area abuts against the heat conduction piece; therefore, the pressure applied to the heat dissipation target by the heat conduction piece can be reduced, the possibility that the heat dissipation target is damaged due to stress extrusion of the heat conduction piece is reduced, the service life of the circuit board is prolonged, the use performance of the heat dissipation target is guaranteed, and the working stability and reliability of the circuit board are improved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation device technology, specifically to a heat dissipation component and an electronic device. Background Technology

[0002] A thermally conductive component is a material or structural part that efficiently transfers heat. During use, the thermally conductive component must be placed between a heat sink and the target heat sink (such as electronic components on a circuit board), and in close contact with both surfaces to conduct heat from the target heat sink to the heat sink, thereby achieving effective heat dissipation. Currently, to ensure a tight fit, the distance between the heat sink and the target heat sink must be less than the thickness of the thermally conductive component, allowing the component to deform moderately under pressure. However, when the thermally conductive component deforms under pressure, it applies reverse pressure to both the heat sink and the target heat sink, potentially damaging the target heat sink due to stress compression, affecting its lifespan, and causing performance degradation under the stress compression of the thermally conductive component. Summary of the Invention

[0003] This application provides a heat sink and an electronic device that can solve at least one of the technical problems mentioned above.

[0004] The heat sink provided in this application is used in an electronic device. The electronic device includes a circuit board and a heat-conducting component. The heat sink is stacked on top of the circuit board, and the heat-conducting component is disposed between the heat sink and the circuit board. The heat sink includes a body and a mating portion. The body includes a heat dissipation area and a contact area. The contact area is connected to the heat dissipation area and is configured to abut against and fit against the heat-conducting component. The mating portion is disposed on the body and is configured to reduce the pressure exerted by the heat sink on the heat-conducting component when the contact area abuts against the heat-conducting component.

[0005] In some embodiments, the mating portion is disposed in the contact area, and the mating portion is configured to reduce the contact area between the contact area and the heat-conducting element, so as to reduce the pressure exerted by the heat dissipation element on the heat-conducting element.

[0006] In some embodiments, the mating portion is located in the heat dissipation area, and the mating portion is configured to cause at least a portion of the body to deform in a direction away from the heat conductor when it abuts against the heat conductor in the contact area, so as to reduce the pressure exerted by the heat dissipation element on the heat conductor.

[0007] In some embodiments, the mating portion is disposed in the contact area, and the mating portion is configured to reduce the contact area between the contact area and the heat-conducting element, thereby reducing the pressure exerted by the heat dissipation element on the heat-conducting element. The mating portion is disposed in the heat dissipation area, and the mating portion is configured to cause at least a portion of the body to deform in a direction away from the heat-conducting element when the contact area abuts against the heat-conducting element, thereby reducing the pressure exerted by the heat dissipation element on the heat-conducting element.

[0008] In some embodiments, the mating portion is disposed in the contact area, and the mating portion is configured to reduce the contact area between the contact area and the heat-conducting element, thereby reducing the pressure exerted by the heat sink on the heat-conducting element. The contact area includes opposing contact surfaces and non-contact surfaces, and the contact surface is configured to abut against the heat-conducting element. The body has a through hole that penetrates the contact surface and the non-contact surface, and the mating portion includes the through hole; and / or, the body has a groove that recesses from the contact surface toward the non-contact surface, and the mating portion includes the groove.

[0009] In some embodiments, the body includes a first sidewall and a second sidewall facing away from each other, the first sidewall being opposite to the heat-conducting element, and a portion of the second sidewall being recessed and extending along the direction from the second sidewall to the first sidewall to form the contact area.

[0010] In some embodiments, the mating portion is located in the heat dissipation area. The mating portion is configured to cause at least a portion of the body to deform in a direction away from the heat conductor when it abuts against the heat conductor in the contact area, thereby reducing the pressure exerted by the heat dissipation element on the heat conductor. The heat dissipation area includes a main body area and a connecting area. The connecting area is configured to connect to the housing of the circuit board or electronic device. The heat dissipation area has a through groove that is arranged around a portion of the connecting area to disconnect the connection between the portion of the connecting area and the main body area. The mating portion includes the through groove.

[0011] In some embodiments, the through groove includes a first sub-groove and a second sub-groove, both of which are arranged around a portion of the connecting area, with the second sub-groove being further away from the connecting area than the first sub-groove. There are two first sub-grooves, symmetrically arranged with respect to the connecting area and not connected to each other. Similarly, there are two second sub-grooves, symmetrically arranged with respect to the connecting area and not connected to each other. The line connecting the centers of the two first sub-grooves intersects the line connecting the centers of the two second sub-grooves.

[0012] In some embodiments, the through groove includes a first sub-groove and at least one second sub-groove, the first sub-groove being disposed around a portion of the connecting area outside the first sub-groove, and the second sub-groove extending from one end of the first sub-groove in a direction away from the connecting area.

[0013] In some embodiments, the connection area is located at the corner of the heat dissipation area, the second sub-slot includes one, the first sub-slot is arranged around a portion of the connection area outside, and one end of the first sub-slot communicates with the second sub-slot, while the other end is spaced apart from or communicates with the side edge of the heat dissipation area.

[0014] In some embodiments, the second sub-slot includes two sub-slots, the extension directions of which are parallel or intersecting.

[0015] In some embodiments, the mating portion is disposed in the heat dissipation area, and the mating portion is configured to cause at least a portion of the body to deform in a direction away from the heat conductor when the contact area abuts against the heat conductor, thereby reducing the pressure exerted by the heat dissipation element on the heat conductor. A through groove is provided on the heat dissipation area, and the through groove is arranged around the outside of a portion of the contact area to disconnect the connection between the portion of the contact area and the heat dissipation area; the mating portion includes the through groove.

[0016] In some embodiments, the heat dissipation area includes a first side and a second side facing away from each other, and the through groove passes through the first side and the second side of the heat dissipation area. The contact area includes a bending area and a pressing area. The bending area bends and extends from the heat dissipation area in a direction away from the first side of the heat dissipation area, and the pressing area bends and extends from one end of the bending area away from the heat dissipation area relative to the bending area. The bending area is configured to cause deformation of the contact area in a direction away from the heat conductor when the contact area abuts against the heat conductor.

[0017] The electronic device according to the embodiments of this application includes a circuit board, a heat-conducting component, and a heat sink as described in any of the above embodiments. The heat sink is stacked with the circuit board, and the heat-conducting component is disposed between the heat sink and the circuit board. The heat-conducting component is configured to conduct heat from a heat source on the circuit board to the heat sink.

[0018] In the heat sink and electronic device of this application embodiment, the contact area is connected to the heat sink area and is configured to abut against and fit against the heat conductor. A mating portion is provided on the body, and the mating portion is configured to reduce the pressure exerted by the heat sink on the heat conductor when the contact area abuts against the heat conductor. That is, the mating portion not only ensures close contact between the contact area and the heat conductor when they abut, improving the heat transfer performance between them, but also reduces the pressure exerted by the heat sink on the heat conductor when the contact area abuts against the heat conductor. This reduces the pressure exerted by the heat conductor on the heat dissipation target (such as a heat source on a circuit board), lowering the possibility of damage to the heat dissipation target due to stress compression from the heat conductor, thereby extending the service life of the circuit board, ensuring the performance of the heat dissipation target, and improving the stability and reliability of the circuit board operation.

[0019] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, wherein: Figure 1 This is a three-dimensional structural diagram of a portion of the structure of an electronic device according to some embodiments of this application; Figure 2 yes Figure 1 The diagram shows a planar structural schematic of the electronic device. Figure 3 This is a planar structural schematic diagram of a heat sink in an electronic device according to some embodiments of this application; Figure 4 This is a schematic diagram of the planar structure of a heat sink in an electronic device according to other embodiments of this application; Figure 5 This is a schematic diagram of the planar structure of a heat sink in an electronic device according to some embodiments of this application; Figure 6 This is a three-dimensional structural diagram of a portion of the electronic device according to other embodiments of this application; Figure 7 yes Figure 6 The diagram shows a planar structural schematic of the electronic device. Figure 8 This is a three-dimensional structural diagram of a portion of the electronic device according to certain embodiments of this application; Figure 9 This is a planar structural schematic diagram of a portion of the structure of the heat sink body in certain embodiments of this application; Figure 10 This is a three-dimensional structural diagram of a portion of the structure of an electronic device according to some embodiments of this application; Figure 11 yes Figure 10 A schematic diagram of a planar structure of one embodiment of the electronic device shown; Figure 12 yes Figure 10 A schematic diagram of a planar structure of another embodiment of the electronic device shown.

[0021] The reference numerals in the detailed embodiments are as follows: 1000 Electronic devices; 100 Heat sink; 300 Circuit board; 310 Heat source; 330 Base; 500 Thermally conductive component; 700 Housing; 10 Body, 101 Through hole, 102 Groove, 103 First sidewall, 104 Second sidewall, 11 Heat dissipation area, 111 Main body area, 112 Connection area, 113 Through slot, 1131 First sub-slot, 1133 Second sub-slot, 114 First side, 115 Second side, 13 Contact area, 131 Contact surface, 132 Non-contact surface, 133 Bending area, 134 Pressing area; 30. Coordination Department. Detailed Implementation

[0022] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0023] In the description of this application, it should be understood that the terms "center", "length", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0025] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0026] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0027] A thermally conductive component is a material or structural part that efficiently transfers heat. During use, the thermally conductive component must be placed between a heat sink and a heat dissipation target (such as electronic components on a circuit board), and in close contact with both surfaces to conduct heat from the target to the heat sink, thus achieving effective heat dissipation. Currently, to ensure a tight fit, the distance between the heat sink and the heat dissipation target must be less than the thickness of the thermally conductive component, allowing for moderate deformation under compression. However, when the thermally conductive component deforms under compression, it applies reverse pressure to both the heat sink and the heat dissipation target, potentially damaging the target due to stress compression, affecting its lifespan, and causing performance degradation. To address these issues, please refer to [link to relevant documentation]. Figure 1 , Figure 6 or Figure 10 This application provides a heat sink 100 and an electronic device 1000.

[0028] Please see Figure 1 and Figure 2 , Figure 6 and Figure 7 ,or Figure 10 The electronic device 1000 of this application includes a circuit board 300, a heat-conducting component 500 and a heat sink 100. The heat sink 100 and the circuit board 300 are stacked together. The heat-conducting component 500 is disposed between the heat sink 100 and the circuit board 300. The heat-conducting component 500 is configured to conduct heat from the heat source 310 on the circuit board 300 to the heat sink 100.

[0029] Electronic device 1000 is a device or system that uses electronic technology to achieve a specific function. Electronic technology refers to the science and technology of processing, transmitting, and storing information using electronic signals such as current, voltage, and resistance. Electronic device 1000 can be applied in fields such as home, industry, medical, communications, and entertainment. Electronic device 1000 includes, but is not limited to, mobile phones, computers, wearable devices, robots, cameras, and audio equipment.

[0030] A printed circuit board (PCB) is a carrier that forms conductive lines on an insulating substrate through printing, enabling electrical connections between electronic components (resistors, capacitors, chips, etc.). Its functions include physical support (such as fixing the mounting position of electronic components), electrical connection, and functional integration. PCBs can be rigid circuit boards, flexible circuit boards, or rigid-flex boards.

[0031] Please combine Figure 7 In some embodiments of this application, the circuit board 300 includes a substrate 330 and a heat source 310. The substrate 330 and the heat sink 100 are stacked together, and the heat source 310 is disposed on the substrate 330 and located between the substrate 330 and the heat sink 100. The heat source 310 is an electronic component whose power consumption is mainly dissipated as heat during normal operation, and this heat is an unavoidable byproduct of its specific function. That is, the heat source 310 generates heat while performing its specific functions (such as protection, control, energy conversion, etc.). Specifically, the heat source 310 is an electronic component on the circuit board 300 that continuously generates heat due to power loss (such as resistance loss, switching loss, etc.). The heat source 310 includes, but is not limited to, controllers, image sensors, power semiconductors (MOSFETs, voltage regulators, etc.), RF modules, resistors, and inductors. For example, the controller may specifically adopt control devices such as MCU (Micro Controller Unit), CPU (Central Processing Unit), and FPGA (Field Programmable Gate Array).

[0032] The heat sink 100 is a structure capable of rapidly absorbing and dissipating heat, ultimately transferring it to the environment through natural convection or forced cooling. The heat generated by the heat source 310 can affect the temperature inside the entire electronic device 1000. Therefore, the heat source 310 needs to be cooled promptly to ensure it does not overheat and become damaged, improve its thermal stability, extend its lifespan, and prevent it from adversely affecting other heat sources 310 or other electrical components. Thus, in some embodiments of this application, the heat sink 100 effectively and promptly dissipates heat from the heat source 310 on the circuit board 300, reducing the possibility of overheating damage, extending its lifespan, and preventing it from adversely affecting other heat sources 310 or other electrical components. Specifically, the heat sink 100 can quickly dissipate the heat from the heat source 310 on the circuit board 300 to a larger area, preventing heat concentration. Furthermore, the heat from the heat sink 100 can be transferred to the electronic device 1000 or to the outside of the electronic device 1000 through the casing 700, thereby achieving heat dissipation from the heat source 310 on the circuit board 300. It should be noted that in some embodiments, the heat sink 100 can be made of at least one of the materials with high thermal conductivity, such as copper or aluminum.

[0033] The heat-conducting component 500 is a structure that can be disposed between the heat source 310 and the heat sink 100 to eliminate air gaps, reduce contact thermal resistance, and ensure efficient heat conduction. The quantity relationship between the heat-conducting component 500 and the heat source 310 can be one-to-one, i.e., one heat-conducting component 500 corresponds to one heat source 310. Alternatively, the quantity relationship can be one-to-many, i.e., one heat-conducting component 500 corresponds to multiple heat sources 310. The material of the heat-conducting component 500 can be thermally conductive silicone, etc. In some embodiments of this application, the heat from the heat source 310 can be conducted to the heat sink 100 through the corresponding heat-conducting component 500. The placement of the heat-conducting component 500 can reduce contact thermal resistance and improve heat conduction efficiency, thereby improving the heat dissipation effect.

[0034] It should be noted that in some embodiments, during use, the heat-conducting component 500 can be compressed under the clamping action of the heat sink 100 and the circuit board 300, so that the heat-conducting component 500 can effectively eliminate the gap between the heat sink 100 and the heat source 310, reduce the contact thermal resistance, and ensure efficient heat conduction. For example, the compression rate of the heat-conducting component 500 can be 20%. In this case, the distance between the heat sink 100 and the heat source 310 is 80% of the thickness of the heat-conducting component 500. During installation, the heat-conducting component 500 will deform under the squeezing action of the heat sink 100 and the heat source 310, and the thickness after deformation will be 80% of the original thickness. The compression rate of the heat-conducting component 500 is the ratio of the deformation of the heat-conducting component 500 under the squeezing action of the heat sink 100 and the heat source 310 to the thickness of the heat-conducting component 500 when it is not squeezed.

[0035] Please combine Figure 8 In some embodiments, the electronic device 1000 further includes a housing 700, in which the circuit board 300, the heat-conducting component 500, and the heat sink 100 are all housed. Specifically, the circuit board 300 is connected to the housing 700, the heat sink 100 is connected to the circuit board 300, and the heat-conducting component 500 is disposed between the heat sink 100 and the circuit board 300.

[0036] The housing 700 is a structure in the electronic device 1000 used to house and protect other components besides the housing 700. Other components besides the housing 700 in this application include, but are not limited to, the circuit board 300, the heat-conducting component 500, and the heat sink 100. The materials of the housing 700 include, but are not limited to, plastics, aluminum alloys, copper, iron, steel, and carbon fiber composites. When the housing 700 is made of plastic, it is lighter, which is beneficial for making the electronic device 1000 more portable. When the housing 700 is made of a high-temperature resistant material, it can prevent the housing 700 from being damaged by heat (e.g., deformation), ensuring the stability and reliability of the electronic device 1000. High-temperature resistant materials include, but are not limited to, polyetheretherketone (PEEK), high-melting-point metals, and high-temperature ceramics.

[0037] Since the electronic device 1000 in this embodiment includes a heat sink 100, it is understood that the electronic device 1000 has at least the same beneficial effects as the heat sink 100. Therefore, for the beneficial effects of the electronic device 1000, please refer to the beneficial effects of the heat sink 100 described below.

[0038] Please see Figure 1 and Figure 2 , Figure 6 and Figure 7 ,or Figures 10 to 12The heat sink 100 provided in this application embodiment is used in an electronic device 1000. The heat sink 100 includes a body 10 and a mating portion 30. The body 10 includes a heat dissipation area 11 and a contact area 13. The contact area 13 is connected to the heat dissipation area 11 and is configured to abut against and fit with a heat conductor 500. The mating portion 30 is provided on the body 10 and is configured to reduce the pressure exerted by the heat sink 100 on the heat conductor 500 when the contact area 13 abuts against the heat conductor 500.

[0039] The body 10 is the main structure of the heat sink 100, directly participating in heat transfer and dissipation. The contact area 13 is a structure on the body 10 that can closely adhere to the heat conductor 500 to achieve efficient heat conduction. The heat from the heat conductor 500 can be transferred to the heat dissipation area 11 through the contact area 13, and the heat dissipation area 11 can dissipate heat through natural convection or radiation, thereby cooling the heat source 310. The contact area 13 and the heat dissipation area 11 can be made of the same or different materials.

[0040] In some embodiments, the body 10 is a one-piece molded structure. One-piece molding is a manufacturing process that refers to the process of forming the entire part in one mold at a time. For example, the body 10 can be formed using one-piece molding processes such as stamping. Using one-piece molding can increase the bonding strength between the heat dissipation area 11 and the contact area 13, making it less prone to splitting during heat dissipation and ensuring the stable implementation of the heat dissipation function. In addition, the one-piece molded structure can reduce the number of parts, simplify the installation steps, and improve assembly efficiency. In other embodiments, the body 10 is a split-molded structure. Split-molding is a manufacturing process that refers to dividing a whole into multiple parts, molding them separately, and then assembling the parts together. For example, the heat dissipation area 11 and the contact area 13 can be processed and molded separately using a split-molding process, and then assembled together using a detachable or non-detachable connection method.

[0041] The mating part 30 is a structure that reduces the pressure exerted by the heat sink 100 on the heat sink 500 when the contact area 13 abuts against the heat sink 500. That is, the mating part 30 ensures that when the contact area 13 abuts against the heat sink 500, the contact area 13 and the heat sink 500 abut and fit together, and the pressure exerted by the heat sink 100 on the heat sink 500 is reduced. This ensures a tight fit between the heat sink 100 and the heat sink 500, achieving efficient heat conduction and improving heat dissipation. Furthermore, it reduces the pressure exerted by the heat sink 500 on the heat source 310, lowering the possibility of damage to the heat source 310 due to stress compression from the heat sink 500. This extends the service life of the heat source 310, improves the stability and reliability of the circuit board 300, and prevents performance degradation of the heat source 310 due to stress, thus protecting its performance. For example, stress optimization can prevent blurring of the camera image sensor due to stress, ensuring the image sensor's performance and making the image clearer.

[0042] In the heat sink 100 of this application embodiment, the contact area 13 is connected to the heat sink 11 and is configured to abut against the heat conduction element 500. The mating part 30 is provided on the body 10. The mating part 30 is configured to reduce the pressure exerted by the heat sink 100 on the heat conductor 500 when the contact area 13 abuts against the heat conductor 500, and to make the contact area 13 and the heat conductor 500 fit together. That is, the setting of the mating part 30 not only ensures that the contact area 13 and the heat conductor 500 are in close contact when they abut against each other, thus improving the heat transfer performance between them, but also reduces the pressure exerted by the heat sink 100 on the heat conductor 500 when the contact area 13 abuts against the heat conductor 500. This can reduce the pressure exerted by the heat conductor 500 on the heat dissipation target (such as the heat source 310 on the circuit board 300), reduce the possibility of the heat dissipation target being damaged by the stress compression of the heat conductor 500, thereby extending the service life of the circuit board 300, ensuring the performance of the heat dissipation target, and improving the stability and reliability of the circuit board 300.

[0043] In addition, the heat sink 100 of this application can ensure a tight fit between the heat conductor 500 and the heat source 310, as well as between the heat conductor 500 and the heat sink 100, without increasing additional material costs and assembly complexity, thus ensuring good heat dissipation. At the same time, it can also reduce the reaction force generated by the compression of the heat conductor 500 on the heat source 310, reduce the possibility of damage to the heat source 310, and achieve stress optimization of the heat source 310.

[0044] Please see Figure 1 and Figure 2In some embodiments of this application, the mating part 30 is provided in the contact area 13. The mating part 30 is configured to reduce the contact area between the contact area 13 and the heat-conducting member 500, so as to reduce the pressure exerted by the heat sink 100 on the heat-conducting member 500.

[0045] In other words, the fitting part 30 reduces the area of ​​the heat-conducting component 500 being squeezed during assembly, thereby reducing the reaction force generated after the heat-conducting component 500 is squeezed. This prevents the heat-conducting component 500 from applying excessive stress to the heat source 310 and the circuit board 300, optimizing the stress performance of the heat source 310 and the circuit board 300. That is, stress optimization of the heat source 310 is achieved. At the same time, since the heat source 310 is set on the circuit board 300, the external force (the force applied by the heat-conducting component 500) on the circuit board 300 is also reduced, thus also optimizing the stress of the circuit board 300. This reduces the possibility of damage to the heat source 310 and the circuit board 300, extends the service life of the heat source 310 and the circuit board 300, and also avoids the performance degradation of the heat source 310 due to stress, ensuring the performance of the heat source 310. For example, through stress optimization, the blurring phenomenon of the camera image sensor due to stress can be prevented, ensuring the performance of the image sensor and making the image clearer.

[0046] Please see Figure 6 and Figure 7 ,or Figures 10 to 12 In some other embodiments of this application, the mating part 30 is provided in the heat dissipation area 11. The mating part 30 is configured to cause at least a portion of the body 10 to deform in a direction away from the heat conductor 500 when the contact area 13 abuts against the heat conductor 500, so as to reduce the pressure of the heat dissipation member 100 acting on the heat conductor 500.

[0047] In other words, the mating part 30 allows the body 10 to effectively deform in the opposite direction after being subjected to the reaction force generated by the heat-conducting component 500 on the heat sink 100 during assembly. This prevents the heat sink 100 from exerting excessive pressure on the heat-conducting component 500. This ensures that the contact area 13 and the heat-conducting component 500 are tightly fitted under pressure, while preventing excessive compression of the heat-conducting component 500. This reduces the pressure exerted by the heat-conducting component 500 on the heat source 310, lowering the possibility of damage to the heat source 310 and optimizing its stress. Simultaneously, since the heat source 310 is mounted on the circuit board 300, the external force (from the heat-conducting component 500) on the circuit board 300 is reduced, thus also optimizing the stress on the circuit board 300. This further reduces the possibility of damage to both the heat source 310 and the circuit board 300, extending their service life. It also prevents performance degradation of the heat source 310 due to stress, ensuring its performance.

[0048] Please see Figure 1 and Figure 2 , Figure 6 and Figure 7 , Figures 10 to 12 In some other embodiments of this application, the mating portion 30 is provided in the contact area 13, and the mating portion 30 is configured to reduce the contact area between the contact area 13 and the heat-conducting member 500, so as to reduce the pressure exerted by the heat sink 100 on the heat-conducting member 500. The mating portion 30 is provided in the heat dissipation area 11, and the mating portion 30 is configured to cause at least a portion of the body 10 to deform in a direction away from the heat-conducting member 500 when the contact area 13 abuts against the heat-conducting member 500, so as to reduce the pressure exerted by the heat sink 100 on the heat-conducting member 500.

[0049] Please see Figure 1 and Figure 2 In some embodiments, the mating part 30 is provided in the contact area 13. The mating part 30 is configured to reduce the contact area between the contact area 13 and the heat-conducting member 500, so as to reduce the pressure exerted by the heat sink 100 on the heat-conducting member 500. The contact area 13 includes a contact surface 131 and a non-contact surface 132 facing away from each other. The contact surface 131 is configured to abut against the heat-conducting member 500.

[0050] The contact surface 131 is the surface on the contact area 13 that is directly in contact with the heat-conducting component 500. The shape and size of the cross-section of the contact surface 131 can be the same as the shape and size of the cross-section of the heat-conducting component 500, thus maximizing the contact area, improving heat conduction efficiency, and ensuring heat dissipation. Alternatively, the shape and size of the contact surface 131 can be different from the shape and size of the cross-section of the heat-conducting component 500. For example, the shape of the contact surface 131 may be the same as the shape of the cross-section of the heat-conducting component 500, but the size of the contact surface 131 may be larger than the size of the cross-section of the heat-conducting component 500.

[0051] Please combine Figure 3 and Figure 4 In some embodiments, the body 10 is provided with a through hole 101, which penetrates the contact surface 131 and the non-contact surface 132, and the mating part 30 includes the through hole 101.

[0052] The through hole 101 effectively reduces the contact area between the contact surface 131 and the heat-conducting component 500, thus reducing the area of ​​the heat-conducting component 500 under pressure. This effectively reduces the reaction force generated by the heat-conducting component 500 under pressure when the contact area 131 comes into contact with the heat-conducting component 500, thereby reducing the pressure exerted by the heat-conducting component 500 on the heat source 310 and reducing the possibility of damage to the heat source due to stress compression from the heat-conducting component 500. In addition, when the contact area 13 comes into contact with the heat-conducting component 500, the through hole 101 also provides deformation space for the heat-conducting component 500. That is, when the heat-conducting component 500 is compressed and deformed, part of its structure can extend into the through hole 101, which further reduces the pressure exerted by the heat-conducting component 500 on the heat source 310 during compression deformation and reduces the possibility of damage to the heat source 310.

[0053] It should be noted that, in some embodiments, the cross-sectional shape of the through hole 101 (the cross-section obtained by a plane perpendicular to the direction from the contact surface 131 to the non-contact surface 132) includes, but is not limited to, a circle (e.g., ...). Figure 4 (as shown), square, racetrack-shaped (such as) Figure 3 (As shown), rhombuses, triangles, etc. There is at least one through hole 101. When there are multiple through holes 101, they can be evenly or non-uniformly arranged in the contact area 13. In summary, this application does not limit the shape, size, area, or number of through holes 101, and can make adaptive adjustments according to specific needs.

[0054] Please combine Figure 5 In some embodiments, the body 10 is provided with a groove 102, which is recessed from the contact surface 131 toward the non-contact surface 132, and the mating part 30 includes the groove 102. It should be noted that the groove 102 in this embodiment is a blind groove.

[0055] The groove 102 reduces the contact area between the contact surface 131 and the heat-conducting component 500, thus reducing the area of ​​the heat-conducting component 500 under pressure. This effectively reduces the reaction force generated by the compression of the heat-conducting component 500 when the contact area 131 comes into contact with it, thereby reducing the pressure exerted by the heat-conducting component 500 on the heat source 310 and lowering the possibility of damage to the heat source due to stress compression from the heat-conducting component 500. Furthermore, when the contact area 13 comes into contact with the heat-conducting component 500, the groove 102 also provides deformation space for the heat-conducting component 500. That is, when the heat-conducting component 500 is compressed and deformed, part of its structure can extend into the groove 102. This further reduces the pressure exerted by the heat-conducting component 500 on the heat source 310 during compression deformation, lowering the possibility of damage to the heat source 310.

[0056] It should be noted that, in some embodiments, the cross-sectional shape of the groove 102 (the cross-section obtained by a plane perpendicular to the direction from the contact surface 131 to the non-contact surface 132) includes, but is not limited to, circular, square, racetrack-shaped, rhomboid, and triangular shapes. The groove 102 includes at least one. When there are multiple grooves 102, the multiple grooves 102 can be uniformly arranged in the contact area 13 or non-uniformly arranged in the contact area 13. In summary, this application does not limit the shape, depth, size, area, and number of the grooves 102, and can be adaptively adjusted according to specific needs.

[0057] Please see Figure 1 and Figure 2 In some embodiments, the body 10 includes a first sidewall 103 and a second sidewall 104 facing away from each other. The first sidewall 103 is opposite to the heat-conducting component 500, and a portion of the second sidewall 104 is recessed and extends along the direction from the second sidewall 104 to the first sidewall 103 to form a contact area 13. That is, the contact area 13 can be protruding relative to the first sidewall 103. Thus, when the heat-conducting component 500 is installed on the heat sink 100, the contact area 13 can position the installation of the heat-conducting component 500, which helps to improve installation efficiency. Furthermore, in this embodiment, compared to the first sidewall 103 directly contacting the heat-conducting component 500, a portion of the second sidewall 104 is recessed and extends along the direction from the second sidewall 104 to the first sidewall 103 to form a contact area 13. This can shorten the distance between the contact area 13 and the circuit board 300, avoiding the excessive thickness of the heat-conducting component 500 due to a large distance between the contact area 13 and the circuit board 300. In other words, heat transfer can be achieved without using an excessively thick heat-conducting component 500, thereby improving the heat dissipation effect.

[0058] It should be noted that in other embodiments, the body 10 includes a first sidewall 103 and a second sidewall 104 facing away from each other. The first sidewall 103 is opposite to the heat-conducting element 500, and a portion of the first sidewall 103 can protrude towards the circuit board 300 to form a contact area 13. Thus, compared to the first sidewall 103 directly contacting the heat-conducting element 500, the portion of the first sidewall 103 protruding towards the circuit board 300 to form the contact area 13 can shorten the distance between the contact area 13 and the circuit board 300, avoiding the problem of the heat-conducting element 500 being too thick due to a large distance between the contact area 13 and the circuit board 300. That is, heat transfer can be achieved without using an excessively thick heat-conducting element 500, thereby improving the heat dissipation effect.

[0059] Please see Figures 6 to 8In some embodiments, the mating part 30 is provided in the heat dissipation area 11. The mating part 30 is configured to cause at least a portion of the body 10 to deform in a direction away from the heat conductor 500 when the contact area 13 abuts against the heat conductor 500, thereby reducing the pressure exerted by the heat dissipation element 100 on the heat conductor 500. The heat dissipation area 11 includes a main body area 111 and a connecting area 112. The connecting area 112 is configured to connect to the circuit board 300. The heat dissipation area 11 has a through groove 113, which is arranged around the outside of a portion of the connecting area 112 to disconnect the connection between the portion of the connecting area 112 and the main body area 111. The mating part 30 includes the through groove 113. It should be noted that in this embodiment, the contact area 13 is provided on the main body area 111.

[0060] The main body area 111 is the main area of ​​the heat dissipation area 11, enabling heat dissipation. The connection area 112 is the area on the heat dissipation area 11 that can be connected and mated with the circuit board 300. The connection methods between the connection area 112 and the circuit board 300 include, but are not limited to, bolt connection, snap-fit ​​connection, and welding. In some embodiments of this application, the connection area 112 is provided with threaded holes, and fasteners (such as bolts) can pass through the threaded holes and connect with the threaded holes on the circuit board 300, thereby realizing the connection between the heat sink 100 and the circuit board 300. It should be noted that in some embodiments, the connection area 112 includes at least one; when the connection area 112 includes at least two, the at least two connection areas 112 are spaced apart, which helps to improve the stability of the connection between the heat sink 100 and the circuit board 300.

[0061] In some embodiments, the heat dissipation area 11 is a one-piece molded structure. One-piece molding is a manufacturing process that refers to the process of forming the entire part in one mold at a time. For example, the heat dissipation area 11 can be formed by one-piece molding processes such as stamping. Using one-piece molding can increase the bonding strength between the main body area 111 and the connecting area 112, making it less prone to splitting during heat dissipation and ensuring the stable implementation of the heat dissipation function. In addition, the one-piece molded structure can reduce the number of parts, simplify the installation steps, and improve assembly efficiency. In other embodiments, the heat dissipation area 11 is a split-molded structure. Split-molding is a manufacturing process that refers to dividing a whole into multiple parts, molding them separately, and then assembling the parts together. In this application, the main body area 111 and the connecting area 112 can be processed and molded separately by a split-molding process, and then assembled together by a detachable connection method or a non-detachable connection method.

[0062] Specifically, in some embodiments, the heat dissipation area 11 is provided with a through groove 113. The through groove 113 is arranged around the outside of a portion of the connecting area 112 to disconnect the connection between the portion of the connecting area 112 and the main body area 111. The mating part 30 includes the through groove 113, that is, the through groove 113 is provided around the connecting area 112. The through groove 113 can reduce the local stiffness of the heat dissipation area 11, that is, reduce the stiffness of the area around the connecting area 112, so that when the contact area 13 abuts against the heat conductor 500, the heat dissipation element 100 can withstand the reaction force exerted by the heat conductor 500 on the heat dissipation element 100. The connection area between the main body area 111 and the connection area 112 can deform under the reaction force exerted by the heat-conducting component 500 on the heat sink 100. At this time, the main body area 111 can move away from the heat-conducting component 500. This can ensure that the contact area 13 and the heat-conducting component 500 are tightly fitted, and at the same time reduce the force exerted by the heat sink 100 on the heat-conducting component 500. This reduces the pressure exerted by the heat-conducting component 500 on the circuit board 300, ensuring that the heat source 310 and the traces on the circuit board 300 are not negatively affected by stress, and reducing the possibility of damage to the heat source 310.

[0063] Please combine Figure 9 (a) In some embodiments, the through groove 113 includes a first sub-groove 1131 and a second sub-groove 1133. Both the first sub-groove 1131 and the second sub-groove 1133 are arranged around a portion of the connecting area 112, and the second sub-groove 1133 is further away from the connecting area 112 than the first sub-groove 1131. There are two first sub-grooves 1131, which are symmetrically arranged with respect to the connecting area 112 and are not connected. There are also two second sub-grooves 1133, which are symmetrically arranged with respect to the connecting area 112 and are not connected. The line connecting the centers of the two first sub-grooves 1131 intersects the line connecting the centers of the two second sub-grooves 1133.

[0064] Specifically, in this embodiment, the connection area 112 can be located in the area near the center of the heat dissipation area 11. In this case, through slots 113 can be opened in all areas around the connection area 112. The arrangement of the first sub-slot 1131 and the second sub-slot 1133 can effectively reduce the rigidity of the area around the connection area 112, so that the connection area between the main body area 111 and the connection area 112 can deform during assembly. This can ensure that the contact area 13 and the heat-conducting component 500 fit tightly, while also reducing the force exerted by the heat dissipation component 100 on the heat-conducting component 500, thereby reducing the pressure exerted by the heat-conducting component 500 on the circuit board 300, ensuring that the heat source 310 and the wiring on the circuit board 300 are not negatively affected by stress, and reducing the possibility of damage to the heat source 310.

[0065] Please combine Figure 8 , Figure 9 (b) and Figure 9 (c) In other embodiments, the through groove 113 includes a first sub-groove 1131 and at least one second sub-groove 1133, the first sub-groove 1131 being arranged around the outside of a portion of the connecting area 112, and the second sub-groove 1133 extending from one end of the first sub-groove 1131 in a direction away from the connecting area 112.

[0066] Specifically, in this embodiment, the connection area 112 may be located in the corner region of the heat dissipation area 11 (e.g., Figure 8 or Figure 9 (b) shown) or edge areas (such as Figure 9 (c) shows that the first sub-groove 1131 and the second sub-groove 1133 can jointly reduce the stiffness of the area surrounding the connection area 112, and the second sub-groove 1133 can form a relatively slender structure between the connection area 112 and the main body area 111, so that the connection area between the main body area 111 and the connection area 112 can effectively deform during assembly. This ensures that the contact area 13 and the heat conductor 500 are tightly fitted under pressure, and also avoids excessive compression of the heat conductor 500. This reduces the pressure exerted by the heat conductor 500 on the circuit board 300, optimizes the stress on the heat source 310 and the remaining areas on the circuit board 300, ensures that the heat source 310 and the traces on the circuit board 300 are not negatively affected by stress, and reduces the possibility of damage to the heat source 310. It should be noted that in some embodiments, there are two second sub-grooves 1133, and the extension directions of the two second sub-grooves 1133 are parallel (e.g., Figure 9 (c) shown) or intersecting (as shown) Figure 9 (b) shown).

[0067] Please combine Figure 8 In some embodiments of this application, the connection area 112 is located at the corner of the heat dissipation area 11. The second sub-slot 1133 includes one sub-slot ring 1131 located on the outer side of a portion of the connection area 112, with one end of the first sub-slot 1131 communicating with the second sub-slot 1133 and the other end spaced apart from or communicating with the side edge of the heat dissipation area 11. Thus, the second sub-slot 1133 enables a relatively elongated structure between the connection area 112 and the main body area 111, allowing the connection area between the main body area 111 and the connection area 112 to effectively deform during assembly. This ensures that pressure forces the contact area 13 and the heat-conducting component 500 to fit tightly, while also preventing excessive compression of the heat-conducting component 500. This reduces the pressure exerted by the heat-conducting component 500 on the circuit board 300, optimizing stress on the heat source 310 and other areas of the circuit board 300. This ensures that the heat source 310 and the traces on the circuit board 300 are not negatively affected by stress, reducing the possibility of damage to the heat source 310, and also guaranteeing the performance of the heat source 310.

[0068] Please see Figures 10 to 12 In some embodiments, a mating part 30 is provided in the heat dissipation area 11. The mating part 30 is configured to cause at least a portion of the body 10 to deform in a direction away from the heat conductor 500 when the contact area 13 abuts against the heat conductor 500, thereby reducing the pressure exerted by the heat dissipation element 100 on the heat conductor 500. A through groove 113 is provided on the heat dissipation area 11, which is arranged around the outside of a portion of the contact area 13 to disconnect the connection between the portion of the contact area 13 and the heat dissipation area 11. The mating part 30 includes the through groove 113.

[0069] That is, a through groove 113 is provided around the contact area 13. The through groove 113 can reduce the local stiffness of the heat dissipation area 11, that is, reduce the stiffness of the area around the contact area 13. When the contact area 13 comes into contact with the heat conductor 500, the heat dissipation component 100 can deform under the action of the reaction force exerted by the heat conductor 500 on the heat dissipation component 100. That is, the connection area between the heat dissipation area 11 and the contact area 13 can deform under the action of the reaction force exerted by the heat conductor 500 on the heat dissipation component 100. At this time, the contact area 13 can move away from the heat conductor 500. In this way, while ensuring that the contact area 13 and the heat conductor 500 fit tightly, the force exerted by the heat dissipation component 100 on the heat conductor 500 can also be reduced, thereby reducing the pressure exerted by the heat conductor 500 on the circuit board 300. This ensures that the heat source 310 and the traces on the circuit board 300 are not negatively affected by stress and reduces the possibility of damage to the heat source 310.

[0070] Please combine Figure 12 In some embodiments, the heat dissipation area 11 includes a first side 114 and a second side 115 facing away from each other, and a through groove 113 passes through the first side 114 and the second side 115 of the heat dissipation area 11. The contact area 13 includes a bending area 133 and a pressing area 134. The bending area 133 bends and extends from the heat dissipation area 11 in a direction away from the first side 114 of the heat dissipation area 11. The pressing area 134 bends and extends from one end of the bending area 133 away from the heat dissipation area 11 relative to the bending area 133. The bending area 133 is configured to deform in a direction away from the heat conductor 500 when the contact area 13 comes into contact with the heat conductor 500.

[0071] Specifically, in some embodiments, the side of the pressing area 134 opposite to the heat-conducting element 500 is the contact surface 131. When the pressing area 134 abuts against the heat-conducting element 500, the heat-conducting element 500 can exert a reaction force on the contact area 13 through the pressing area 134. At this time, the bending area 133 can deform away from the heat-conducting element 500 under the action of the reaction force. This ensures a tight fit between the contact area 13 and the heat-conducting element 500 while reducing the force exerted by the heat sink 100 on the heat-conducting element 500, minimizing the compression of the heat-conducting element 500, thereby reducing the pressure exerted by the heat-conducting element 500 on the circuit board 300. This ensures that the heat source 310 and traces on the circuit board 300 are not negatively affected by stress, reducing the possibility of damage to the heat source 310. It should be noted that in some embodiments, the bending area 133 may include multiple bending sections, which are formed by multiple bends.

[0072] Please combine Figure 7 In some embodiments of this application, the assembly steps of the electronic device 1000 may include: first, placing a heat-conducting component 500 on a heat source 310; then, placing a heat sink 100 on a circuit board 300 and connecting the heat sink 100 and the circuit board 300 to form an integral structure; finally, placing the integral structure on a housing 700 and connecting the circuit board 300 and the housing 700, thereby completing the assembly of the circuit board 300, the heat-conducting component 500, and the heat sink 100 on the housing 700. It should be noted that the above assembly steps of the electronic device 1000 are merely illustrative examples. In other embodiments, the assembly steps of the electronic device 1000 may take other forms, which are not limited here.

[0073] The technical features of the embodiments described above can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered within the scope of this specification. Furthermore, other implementation methods can be derived from the above embodiments, allowing for structural and logical substitutions and changes without departing from the scope of this disclosure.

[0074] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A heat sink for use in an electronic device, characterized in that, The electronic device includes a circuit board and a heat-conducting component, wherein the heat-conducting component is stacked on top of the circuit board, and the heat-conducting component is disposed between the heat-conducting component and the circuit board. The heat-conducting component includes: The body includes a heat dissipation area and a contact area, the contact area being connected to the heat dissipation area and configured to abut against and conform to the heat-conducting element; and A mating part is provided on the body, and the mating part is configured to reduce the pressure exerted by the heat dissipation component on the heat conductor when the contact area abuts against the heat conductor.

2. The heat sink according to claim 1, characterized in that, The mating portion is disposed in the contact area, and the mating portion is configured to reduce the contact area between the contact area and the heat-conducting element, thereby reducing the pressure exerted by the heat dissipation element on the heat-conducting element; and / or, The mating part is provided in the heat dissipation area, and the mating part is configured to cause at least a portion of the body to deform in a direction away from the heat conductor when it abuts against the heat conductor in the contact area, so as to reduce the pressure of the heat dissipation element acting on the heat conductor.

3. The heat sink according to claim 2, characterized in that, The mating part is provided in the contact area, and the mating part is configured to reduce the contact area between the contact area and the heat-conducting component, so as to reduce the pressure exerted by the heat dissipation component on the heat-conducting component. The contact area includes opposite contact surfaces and non-contact surfaces, and the contact surfaces are configured to abut against the heat-conducting component. The body has a through hole that penetrates both the contact surface and the non-contact surface; the mating part includes the through hole; and / or... The body has a groove, which is recessed from the contact surface toward the non-contact surface, and the mating part includes the groove.

4. The heat sink according to claim 3, characterized in that, The body includes a first sidewall and a second sidewall facing away from each other. The first sidewall is opposite to the heat-conducting element, and a portion of the second sidewall is recessed and extends along the direction from the second sidewall to the first sidewall to form the contact area.

5. The heat sink according to claim 2, characterized in that, The mating part is provided in the heat dissipation area, and the mating part is configured to cause at least a portion of the body to deform in a direction away from the heat conductor when it abuts against the heat conductor in the contact area, so as to reduce the pressure of the heat dissipation element acting on the heat conductor. The heat dissipation area includes a main body area and a connection area. The connection area is configured to connect to the circuit board or the housing of the electronic device. The heat dissipation area is provided with a through groove. The through groove is arranged around a portion of the connection area to disconnect the connection between the portion of the connection area and the main body area. The mating part includes the through groove.

6. The heat sink according to claim 5, characterized in that, The through groove includes a first sub-groove and a second sub-groove. Both the first sub-groove and the second sub-groove are arranged around a portion of the connecting area, and the second sub-groove is farther away from the connecting area than the first sub-groove. The first sub-slot includes two sub-slots, which are symmetrically arranged with respect to the connection area and are not connected. The second sub-slot includes two sub-slots, which are symmetrically arranged with respect to the connection area and are not connected. The line connecting the centers of the two first sub-slots intersects the line connecting the centers of the two second sub-slots.

7. The heat sink according to claim 5, characterized in that, The through groove includes a first sub-groove and at least one second sub-groove. The first sub-groove is arranged around a portion of the connecting area on the outside, and the second sub-groove extends from one end of the first sub-groove in a direction away from the connecting area.

8. The heat sink according to claim 7, characterized in that, The connection area is located at the corner of the heat dissipation area. The second sub-slot includes one sub-slot. The first sub-slot is arranged around a portion of the connection area on the outside. One end of the first sub-slot is connected to the second sub-slot, and the other end is spaced apart from or connected to the side edge of the heat dissipation area.

9. The heat sink according to claim 7, characterized in that, The second sub-slot comprises two sub-slots, and the two sub-slots extend in parallel or intersecting directions.

10. The heat sink according to claim 2, characterized in that, The mating part is provided in the heat dissipation area, and the mating part is configured to cause at least a portion of the body to deform in a direction away from the heat conductor when it abuts against the heat conductor in the contact area, so as to reduce the pressure of the heat dissipation element acting on the heat conductor. The heat dissipation area is provided with a through groove, which is arranged around the outside of a portion of the contact area to disconnect the connection between the portion of the contact area and the heat dissipation area. The mating part includes the through groove.

11. The heat sink according to claim 10, characterized in that, The heat dissipation area includes a first side and a second side that are opposite to each other, and the through groove passes through the first side and the second side of the heat dissipation area; The contact area includes a bending area and a pressing area. The bending area bends and extends from the heat dissipation area in a direction away from the heat dissipation area. The pressing area bends and extends from one end of the bending area away from the heat dissipation area relative to the bending area. The bending area is configured to cause the contact area to deform in a direction away from the heat dissipation element when the contact area comes into contact with the heat-conducting element.

12. An electronic device, characterized in that, The electronic device includes a circuit board, a heat-conducting component, and a heat sink as described in any one of claims 1-11. The heat sink is stacked on top of the circuit board, and the heat-conducting component is disposed between the heat sink and the circuit board. The heat-conducting component is configured to conduct heat from a heat source on the circuit board to the heat sink.

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