Display device

Abstract

A display device includes: a substrate including a display area and a non-display area; a plurality of insulating layers disposed on the substrate; a plurality of light emitting elements disposed on the plurality of insulating layers in the display area; a plurality of wires disposed on different insulating layers among the plurality of insulating layers in the non-display area and at least partially overlapping each other; and a plurality of pad electrodes disposed on the plurality of insulating layers in the non-display area and electrically connected to the plurality of wirings. Therefore, crack detectability can be improved.

Description

Technical Field

[0001] This disclosure relates to a display device, and more particularly to a display device having, for example but not limited to, improved crack detectability. Background Technology

[0002] Display devices are used in a variety of electronic devices, such as televisions, mobile phones, laptops, and tablets.

[0003] As display devices, there are organic light-emitting display (OLED) devices that are self-emissive devices and liquid crystal display (LCD) devices that require a separate light source.

[0004] Recently, display devices including light-emitting diodes (LEDs) have attracted attention as the next generation of display devices. LEDs are formed from inorganic materials rather than organic materials, which makes them emit light faster, have better luminous efficiency, and can display images with higher brightness compared to liquid crystal displays or organic light-emitting displays.

[0005] The descriptions provided in the Background section should not be considered prior art simply because they are mentioned in or associated with the Background section. The Background section may include information describing one or more aspects of the subject matter art. Summary of the Invention

[0006] One aspect of this disclosure is to provide a display device with improved crack detection capability.

[0007] Another aspect of this disclosure is to provide a display device that can easily detect cracks to minimize or reduce potential defects caused by cracks in order to improve the lifespan of the display device, thereby driving with low power in terms of reduced power consumption.

[0008] Another aspect of this disclosure is to provide a display device with improved reliability by minimizing or reducing impurity penetration caused by cracks.

[0009] The aspects of this disclosure are not limited to those described above, and other aspects not mentioned will be readily apparent to those skilled in the art from the following description.

[0010] Additional features and aspects of this disclosure are set forth in part in the description which follows, and in part will be apparent from the description or may be learned by practice of the inventive concept provided herein. Other features and aspects of the inventive concept may be realized and obtained by means of the structures and claims pointed out or derived therefrom in this disclosure, as well as the accompanying drawings.

[0011] To achieve these and other aspects of the present invention, as specifically embodied and broadly described herein, a display device includes: a substrate including a display area and a non-display area adjacent to the display area; a plurality of insulating layers disposed on the substrate; a plurality of embankments disposed on the plurality of insulating layers in the display area; a plurality of light-emitting elements disposed on the embankments; a plurality of wirings disposed on different insulating layers in the non-display area to surround the display area and at least partially overlapping each other; and a plurality of pad electrodes disposed on the plurality of insulating layers in the non-display area and electrically connected to the plurality of wirings. One end of the plurality of wirings is electrically connected to the same pad electrode among the plurality of pad electrodes, and the other end of the plurality of wirings is electrically connected to different pad electrodes among the plurality of pad electrodes.

[0012] According to another aspect of this disclosure, a display device includes: a substrate including a display area, a first non-display area adjacent to the display area, a curved area extending from the first non-display area, and a second non-display area extending from the curved area; a plurality of insulating layers disposed on the substrate; a plurality of embankments disposed on the plurality of insulating layers in the display area; a plurality of light-emitting elements disposed on the embankments; a plurality of crack detection lines disposed on different insulating layers in the plurality of insulating layers in the first non-display area to surround the display area and at least partially overlap each other; and a plurality of pad electrodes disposed on the plurality of insulating layers in the second non-display area and including signal transmitting pad electrodes and a plurality of signal receiving pad electrodes electrically connected to the plurality of crack detection lines. Therefore, crack detectability can be improved.

[0013] Further details of exemplary implementations are included in the detailed description and accompanying drawings.

[0014] According to this disclosure, multiple crack detection lines are set up to improve the detectability of cracks.

[0015] According to this disclosure, multiple crack detection lines are connected to different signal receiving pads to read signals for each crack detection line, thereby easily detecting the presence of cracks for each crack detection line.

[0016] According to this disclosure, potential defects caused by cracks are minimized or reduced, and the lifespan of the display device is improved in terms of low-power operation with respect to reduced power consumption.

[0017] According to this disclosure, crack detectability is improved to minimize or reduce impurity penetration caused by cracks, thereby improving the reliability of the display device.

[0018] The effects of this disclosure are not limited to those illustrated above, and include many more effects in this specification.

[0019] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory, and are intended to provide further explanation of the claimed inventive concept. Attached Figure Description

[0020] The accompanying drawings, which may be included to provide a further understanding of the present disclosure and may be incorporated into and constitute a part of the present disclosure, illustrate embodiments of the present disclosure and, together with the description, serve to explain the various principles of the present disclosure.

[0021] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings, wherein:

[0022] Figure 1 This is an exploded perspective view of a display device according to an exemplary embodiment of the present disclosure;

[0023] Figure 2A This is a plan view of a display device according to an exemplary embodiment of the present disclosure;

[0024] Figure 2B This is an enlarged view of a display device according to an exemplary embodiment of the present disclosure;

[0025] Figures 3A to 3E This is a plan view of a display device according to an exemplary embodiment of the present disclosure;

[0026] Figure 4 This is a diagram illustrating a circuit structure according to an exemplary embodiment of the present disclosure;

[0027] Figure 5 This is a plan view of a display device according to an exemplary embodiment of the present disclosure;

[0028] Figure 6 This is a plan view of a display device according to an exemplary embodiment of the present disclosure;

[0029] Figure 7 This is a plan view of a display device according to an exemplary embodiment of the present disclosure;

[0030] Figure 8 It is along Figure 2B The cross-sectional view taken from VIII-VIII';

[0031] Figure 9 This is a cross-sectional view of a display device according to an exemplary embodiment of the present disclosure;

[0032] Figure 10 It is along Figure 2AA cross-sectional view taken at X-X';

[0033] Figure 11A It is along Figure 2A A cross-sectional view taken from A-A';

[0034] Figure 11B It is along Figure 2A A cross-sectional view taken at B-B';

[0035] Figure 11C It is along Figure 2A A cross-sectional view taken at C-C';

[0036] Figure 11D It is along Figure 2A A cross-sectional view taken from D-D';

[0037] Figure 11E It is along Figure 2A The cross-sectional view taken from E-E'; and

[0038] Figures 12 to 15 This is a diagram illustrating a device to which a display apparatus according to an exemplary embodiment of the present disclosure is applied.

[0039] Throughout the accompanying drawings and detailed description, unless otherwise stated, the same reference numerals should be understood to refer to the same elements, features, and structures. For clarity, illustration, and convenience, the relative dimensions and depictions of these elements may be exaggerated. Detailed Implementation

[0040] Reference will now be made in detail to embodiments of this disclosure, examples of which are illustrated in the accompanying drawings. In the following description, detailed descriptions of well-known functions or configurations associated with this document will be omitted where such descriptions would be deemed to unnecessarily obscure the essential points of the inventive concept. The described progression of processing steps and / or operations is exemplary; however, the order of steps and / or operations is not limited to that set forth herein, except that they must occur in a specific order, and can be varied as is known in the art. The same reference numerals always denote the same elements. The names of the elements used in the following description may be chosen solely for convenience of writing the specification and may therefore differ from the names used in actual products.

[0041] The advantages and features of this disclosure, as well as methods for implementing these advantages and features, will become clear from the exemplary embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided by way of example only so that those skilled in the art can fully understand the disclosure and scope of this disclosure. Any implementation described herein as an "example" is not necessarily to be construed as superior to or better than other implementations.

[0042] The shapes, dimensions, ratios, angles, numbers, etc., shown in the accompanying drawings used to describe exemplary embodiments of this disclosure are merely examples, and this disclosure is not limited thereto. Throughout the specification, the same reference numerals generally denote the same elements. Furthermore, in the following description of this disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of this disclosure. Terms such as “comprising,” “having,” and “consisting of” as used herein are generally intended to allow for the addition of additional components, unless these terms are used in conjunction with more restrictive terms such as “only.” Elements described in the singular are intended to include multiple elements, and vice versa, unless the context clearly indicates otherwise.

[0043] When interpreting a component, it is interpreted as including a normal error range or tolerance range, although there is no explicit description of such error or tolerance range.

[0044] When describing positional relationships, such as when using terms like "above," "over," "below," "near," "close to," or "adjacent," "side," or "beside" to describe the positional relationship between two components, one or more other components may be positioned between the two components, unless more restrictive terms such as "immediately," "directly," or "closely" are used. For example, when a structure is described as being "above," "on top," "below," "under," "near," "close to," or "adjacent," "side," or "right next to" another structure, the description should be interpreted to include situations where the structures are in contact with each other and where a third structure is positioned or inserted between them. Furthermore, the terms "left," "right," "top," "bottom," "downward," "upward," "upper," "lower," etc., refer to any frame of reference.

[0045] When interpreting temporal relationships, terms such as “after,” “follow,” “subsequent,” “next,” or “before” can include non-continuous cases, unless more restrictive terms such as “immediately” or “directly” are used.

[0046] Terms such as “first,” “second,” “A,” “B,” “(a),” and “(b)” are used to describe various components, but the nature, order, sequence, or number of these components are not limited by these terms. These terms are used only to distinguish one component from another. For example, without departing from the scope of this disclosure, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component.

[0047] In describing the components of this disclosure, terms such as first, second, A, B, (a) or (b) may be used. These terms are intended only to distinguish one component from other components, and the nature, order, sequence or number of the respective components are not limited by these terms.

[0048] When a component is described as “connected,” “joined,” “engaged,” or “attached” to another component, it should be understood that the component may be directly connected, joined, engaged, or attached to the other component, but may also be indirectly connected, joined, engaged, or attached to the other component, unless otherwise expressly stated.

[0049] When a component or layer is described as "in contact" or "overlapping" with another component or layer, it should be understood that, unless otherwise expressly stated, the component or layer may directly contact or overlap with another component or layer, but may also indirectly contact or overlap with another component between each component.

[0050] The term "at least one" should be understood to include all combinations of one or more related components. For example, "at least one of the first, second, and third components" refers not only to the first, second, or third component, but also to all combinations of two or more of the first, second, and third components.

[0051] The terms “first direction,” “second direction,” “third direction,” “row direction,” “column direction,” “X-axis direction,” “Y-axis direction,” and “Z-axis direction” should not be interpreted merely as geometrically perpendicular to each other, but can indicate a wider range of directions within the scope of which the configurations of this disclosure may function.

[0052] Features of the various embodiments in this disclosure may be combined in part or in whole or associated with each other, various technical interlocks and operations are possible, and each embodiment may be implemented independently of each other or together in an associated relationship.

[0053] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the example embodiments pertain. It should also be understood that terms (such as those defined in common dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant field and should not be interpreted in an idealized or overly formal sense unless explicitly defined herein. For example, the terms “part” or “unit” can be applied to, for example, a single circuit or structure, an integrated circuit, a computational block of a circuit arrangement, or any structure configured to perform the functions described herein that would be understood by one of ordinary skill in the art.

[0054] In the following, display devices according to various exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Furthermore, all components of each display device according to all embodiments of the present disclosure are operatively connected and configured.

[0055] Figure 1 This is a perspective view illustrating a display device according to an exemplary embodiment of the present disclosure. Figure 2A This is a plan view of a display device according to an exemplary embodiment of the present disclosure. Figure 2B This is an enlarged view of a display device according to an exemplary embodiment of the present disclosure. Figures 3A to 3E This is a plan view of a display device according to an exemplary embodiment of the present disclosure. For ease of explanation, in Figure 3A Only the first crack detection line PCDL1 in the multiple crack detection lines PCDL is shown, and... Figure 3B Only the second crack detection line, PCDL2, out of multiple crack detection lines PCDL is shown. Furthermore, in... Figure 3C Only the third crack detection line PCDL3 in the multiple crack detection lines PCDL is shown, and... Figure 3D Only the fourth crack detection line, PCDL4, from the multiple crack detection lines PCDL is shown. Figure 3E Only the fifth crack detection line, PCDL5, is shown in the multiple crack detection lines PCDL.

[0056] Reference Figures 1 to 3E The display device 1000 according to an exemplary embodiment of the present disclosure may include one or more of a display panel 100, a polarizing layer 293, an adhesive layer 295, a cover member 120, a support substrate 170, a flexible circuit board FCB, and a printed circuit board 160. However, the present disclosure is not limited thereto, and the display device of the present disclosure may include more or fewer components. For example, various other functional layers such as a diffusion layer and a reflective layer may also be provided on the display panel 100.

[0057] For example, the display panel 100 of the display device 1000 may include a substrate 110. The substrate 110 may be a component supporting other parts of the display device 1000. The substrate 110 may be formed of an insulating material. For example, the substrate 110 may be formed of glass or resin. In addition, the substrate 110 may also be formed of a flexible material. For example, the substrate 110 may be formed of a flexible plastic material, such as any one of polyethylene terephthalate (PET), polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polyethersulfone (PES), cyclic olefin copolymer (COC), triacetyl cellulose (TAC), polyvinyl alcohol (PVA), polyimide (PI), and polystyrene (PS), but the exemplary embodiments of this disclosure are not limited thereto.

[0058] The display panel 100 can display information, video, and / or images provided to the user. For example, the display panel 100 may include a display area AA and a non-display area NA adjacent to the display area AA. For example, the substrate 110 may include the display area AA and the non-display area NA. However, the display area AA and the non-display area NA are not limited to the substrate 110, but can be used with respect to the entire display device 1000.

[0059] The display area AA can be an area for displaying an image. The display area AA can include multiple pixels PX. Each pixel in the multiple pixels PX can include multiple sub-pixels. Multiple light-emitting elements can be disposed in the multiple sub-pixels respectively. The multiple light-emitting elements can be configured in different ways depending on the type of the display device 1000. For example, when the display device 1000 is an inorganic light-emitting display device, the light-emitting elements can be inorganic light-emitting devices, such as light-emitting diodes (LEDs), micro LEDs, or mini LEDs, but the exemplary embodiments of this disclosure are not limited thereto. In the following description, it will be assumed that the light-emitting elements of the display device 1000 according to the exemplary embodiments of this disclosure are micro LEDs, but the exemplary embodiments of this disclosure are not limited thereto.

[0060] The non-display area NA can be an area where no image is displayed. Various wiring and circuitry for driving the multiple pixels PX of the display area AA can be provided in the non-display area NA. For example, various wiring and driving circuitry can be installed in the non-display area NA, and pad units PAD connected to integrated circuits and printed circuits can be provided, but exemplary embodiments of this disclosure are not limited thereto.

[0061] For example, the driving circuit may be a data driving circuit and / or a gating driving circuit, but the exemplary embodiments of this disclosure are not limited thereto. Wiring may be provided on the substrate 110 to supply control signals for controlling the driving circuit. For example, the control signals may include various timing signals, including clock signals, input data enable signals, and synchronization signals, but the exemplary embodiments of this disclosure are not limited thereto. Control signals may be received via pad units PAD. For example, in the non-display area NA, link lines LL may be provided to transmit signals. For example, driving components such as flexible circuit boards FCB and printed circuit boards 160 may be connected to pad units PAD.

[0062] According to this disclosure, the non-display area NA may include a first non-display area NA1, a curved area BA, and a second non-display area NA2. For example, the first non-display area NA1 may be an area adjacent to (e.g., at least partially surrounding) a portion of the display area AA. The curved area BA may be an area extending from at least one of the plurality of sides of the first non-display area NA1, and may be a flexible area. The second non-display area NA2 may be an area extending from the curved area BA, and pad units PAD may be disposed therein. For example, the curved area BA may be in a curved state, and other areas of the substrate 110 other than the curved area BA may be in a flat state. In this case, when the curved area BA is curved, the second non-display area NA2 may be located on the back surface of the display area AA, but the exemplary embodiments of this disclosure are not limited thereto.

[0063] The display area AA of the substrate 110 or the display device 1000 can be configured to have various shapes according to the design of the display panel 100. For example, the display area AA can be configured as a rectangular shape with four rounded corners, but the exemplary embodiments of this disclosure are not limited thereto. As another example, the display area AA can be configured as a rectangular shape or a circular shape with four rounded corners, but the exemplary embodiments of this disclosure are not limited thereto.

[0064] According to this disclosure, the width of the second non-display area NA2, which is configured with multiple pad electrodes PE, can be greater than the width of the curved area BA, which is configured with only multiple link lines LL. Furthermore, the width of the display area AA, which is configured with multiple sub-pixels, can be greater than the width of the curved area BA, which is configured with only multiple link lines LL. Although the width of the curved area BA is shown in the figures to be smaller than the width of other areas of the substrate 110, the shape of the substrate 110 including the curved area BA is exemplary, and the exemplary embodiments of this disclosure are not limited thereto.

[0065] Reference Figure 2BMultiple pixel driving circuits (PDs) can be disposed in the display area AA. The multiple pixel driving circuits (PDs) can be circuits for driving multiple sub-pixels of micro-LEDs. Each pixel driving circuit in the multiple pixel driving circuits (PDs) can include multiple transistors, which include driving transistors and storage capacitors, and supply control signals, power, and driving current to the multiple sub-pixel micro-LEDs to control the light-emitting operation of the multiple micro-LEDs. For example, the pixel driving circuits (PDs) can include power lines and signal lines for controlling the light-emitting on / off and / or light-emitting time of the micro-LEDs. For example, the multiple pixel driving circuits (PDs) can be driver fabricated on a semiconductor substrate using a metal-oxide-semiconductor field-effect transistor (MOSFET) fabrication process, but exemplary embodiments of this disclosure are not limited thereto. The driver can include multiple pixel driving circuits (PDs) and drive multiple sub-pixels.

[0066] Refer to together Figure 1 The flexible circuit board (FCB) and the printed circuit board 160 can be disposed below the display panel 100. The FCB and the printed circuit board 160 can be disposed at at least one edge of the display panel 100, but the exemplary embodiments of this disclosure are not limited thereto. One side of the flexible circuit board FCB can be attached to the display panel 100, and the other side can be attached to the printed circuit board 160, but the exemplary embodiments of this disclosure are not limited thereto. The FCB can be a flexible film, but the exemplary embodiments of this disclosure are not limited thereto.

[0067] A pad unit PAD, comprising multiple pad electrodes PE, can be disposed in a second non-display area NA2. Within the pad unit PAD, driving components comprising one or more flexible circuit boards (or flexible films) FCB and printed circuit board 160 can be attached or bonded. The multiple pad electrodes PE of the pad unit PAD can be electrically connected to one or more flexible circuit boards (or flexible films) FCB and transmit various signals (or power) from the printed circuit board 160 and the flexible circuit boards (or flexible films) FCB to multiple pixel driving circuits PD in the display area AA.

[0068] Reference Figures 2B to 3E The multiple pad electrodes PE may include, for example, multiple crack detection pad electrodes. The multiple crack detection pad electrodes may include a signal transmitting pad electrode PE_T and multiple signal receiving pad electrodes PE_R. Alternatively, the multiple crack detection pad electrodes may include multiple signal transmitting pad electrodes PE_T and one signal receiving pad electrode PE_R. Furthermore, the multiple crack detection pad electrodes may include multiple signal transmitting pad electrodes PE_T and multiple signal receiving pad electrodes PE_R corresponding to the multiple signal transmitting pad electrodes PE_T.

[0069] For example, the signal transmitting pad electrode PE_T is connected to the flexible circuit board FCB to send a crack detection signal applied by the timing controller of the flexible circuit board FCB to multiple crack detection lines PCDL. However, it is not limited to this; the signal transmitting pad electrode PE_T may be applied with a crack detection signal from the timing controller of the printed circuit board 160.

[0070] For example, the signal transmitting pad electrode PE_T can be connected to all multiple crack detection lines PCDL. Therefore, the signal transmitting pad electrode PE_T can send the same crack detection signal to all crack detection lines PCDL. Alternatively, the signal transmitting pad electrode PE_T can also be called the signal input pad electrode.

[0071] Multiple signal receiving pad electrodes PE_R are connected to the flexible circuit board FCB to send crack detection signals applied through multiple crack detection lines PCDL to the timing controller of the flexible circuit board FCB. However, it is not limited to this, and the multiple signal receiving pad electrodes PE_R can also send crack detection signals to the timing controller of the printed circuit board 160.

[0072] For example, multiple signal receiving pad electrodes PE_R can be connected to multiple crack detection lines PCDL respectively.

[0073] For example, multiple signal receiving pad electrodes PE_R may include a first signal receiving pad electrode PE_R1 connected to a first crack detection line PCDL1, a second signal receiving pad electrode PE_R2 connected to a second crack detection line PCDL2, a third signal receiving pad electrode PE_R3 connected to a third crack detection line PCDL3, a fourth signal receiving pad electrode PE_R4 connected to a fourth crack detection line PCDL4, and a fifth signal receiving pad electrode PE_R5 connected to a fifth crack detection line PCDL5. Although five signal receiving pad electrodes PE_R are described in this disclosure, the number of signal receiving pad electrodes PE_R is not limited to this and can vary depending on the design.

[0074] In addition, the signal receiving pad electrode PE_R can also be called the signal output pad electrode.

[0075] The first signal receiving pad electrode PE_R1 can send the crack detection signal applied from the signal sending pad electrode PE_T through the first crack detection line PCDL1 to the flexible circuit board FCB.

[0076] The second signal receiving pad electrode PE_R2 can send the crack detection signal applied from the signal sending pad electrode PE_T through the second crack detection line PCDL2 to the flexible circuit board FCB.

[0077] The third signal receiving pad electrode PE_R3 can send the crack detection signal applied from the signal sending pad electrode PE_T through the third crack detection line PCDL3 to the flexible circuit board FCB.

[0078] The fourth signal receiving pad electrode PE_R4 can send the crack detection signal applied from the signal sending pad electrode PE_T through the fourth crack detection line PCDL4 to the flexible circuit board FCB.

[0079] The fifth signal receiving pad electrode PE_R5 can send the crack detection signal applied from the signal sending pad electrode PE_T through the fifth crack detection line PCDL5 to the flexible circuit board FCB.

[0080] Reference Figure 1 and Figure 2A The flexible circuit board (or flexible film) FCB can be a film on which various components are disposed on a base film with elasticity. For example, a driver IC such as a gating driver IC or a data driver IC and a timing controller that provides various signals to the driver IC can be disposed in the flexible circuit board (or flexible film) FCB, but the exemplary embodiments of this disclosure are not limited thereto. The driver IC can be a component that processes data and drive signals to display an image. The driver IC can be disposed according to the mounting method using chip-on-glass (COG), chip-on-film (COF), or tape-on-cable (TCP) technology, but the exemplary embodiments of this disclosure are not limited thereto. The flexible circuit board (or flexible film) FCB can be attached or bonded to multiple pad electrodes PE by a conductive adhesive layer, but the exemplary embodiments of this disclosure are not limited thereto.

[0081] The timing controller of the flexible circuit board (FCB) can apply crack detection signals to the signal transmitting pad electrode PE_T. Therefore, the timing controller can read the crack detection signals returned to each of the multiple signal receiving pad electrodes PE_R via multiple crack detection lines PCDL connected to the signal transmitting pad electrode PE_T. Thus, it is possible to determine whether each crack detection line in the multiple crack detection lines PCDL is broken. Alternatively, the signals from the multiple signal receiving pad electrodes PE_R can be transmitted to other components of the display device, or transmitted externally, in addition to the timing controller.

[0082] Printed circuit board 160 may be a component electrically connected to one or more flexible circuit boards (or flexible films) FCBs and providing signals to a driver IC. Printed circuit board 160 is disposed on one side of a flexible circuit board (or flexible film) FCB for electrical connection to the FCB. Various components for providing various signals to the driver IC may be disposed on printed circuit board 160. For example, various components such as timing controllers, power supplies, memory, or processors may be disposed on printed circuit board 160. For example, printed circuit board 160 may include a power management integrated circuit (PMIC), but exemplary embodiments of this disclosure are not limited thereto.

[0083] The printed circuit board 160 may include at least one hole 180, but exemplary embodiments of this disclosure are not limited thereto. Internal components for sensing ambient light or temperature to be supplied to multiple sensors may be disposed in the area corresponding to the at least one hole 180. For example, the internal components may include an ambient light sensor (ALS) or a temperature sensor, but exemplary embodiments of this disclosure are not limited thereto. For example, the hole 180 may be a transmissive aperture, but exemplary embodiments of this disclosure are not limited thereto.

[0084] Refer to together Figures 2A to 3E Multiple crack detection lines PCDL can be disposed in the non-display area NA. For example, the multiple crack detection lines PCDL can also be disposed around at least a portion of the display area AA in the first non-display area NA1. The multiple crack detection lines PCDL can be connected to multiple pad electrodes PE in the second non-display area NA2. Therefore, the multiple crack detection lines PCDL can be disposed in the area of ​​the first non-display area NA1 excluding the portion that overlaps with the second non-display area NA2. The multiple crack detection lines PCDL are disposed at the outermost periphery of the first non-display area NA1 to detect whether the display device 1000 is cracked.

[0085] For example, refer to Figure 2A Multiple crack detection lines PCDL can be arranged to overlap each other at least partially. The multiple crack detection lines PCDL are connected to the same signal transmitting pad electrode PE_T disposed along the periphery of the substrate 110. Therefore, the multiple crack detection lines PCDL can be arranged to overlap each other before being connected to different signal receiving pad electrodes PE_R, but are not limited thereto.

[0086] Reference Figures 2A to 3EOne end of the multiple crack detection lines PCDL can be connected to the flexible circuit board FCB via the signal transmitting pad electrode PE_T. The other end of the multiple crack detection lines PCDL can be connected to the flexible circuit board FCB via the signal receiving pad electrode PE_R. The area between one end of the multiple crack detection lines PCDL and the other end of the multiple crack detection lines PCDL can be set along the outer periphery of the first non-display area NA1. For example, the multiple crack detection lines PCDL can extend along the periphery of the substrate 110 from the signal transmitting pad electrode PE_T toward the signal receiving pad electrode PE_R.

[0087] Multiple crack detection lines (PCDLs) can transmit the crack detection signal applied from the signal transmitting pad electrode (PE_T) to the signal receiving pad electrode (PE_R). For example, multiple crack detection lines (PCDLs) can be connected to the same signal transmitting pad electrode (PE_T) or to different signal receiving pad electrodes (PE_R). For instance, if any one of the crack detection lines (PCDLs) is disconnected, the crack detection signal may not be transmitted to the signal receiving pad electrode (PE_R) connected to the corresponding crack detection line (PCDL). Therefore, it is possible to detect whether the corresponding crack detection line (PCDL) is broken.

[0088] For example, multiple crack detection lines PCDL may include a first crack detection line PCDL1, a second crack detection line PCDL2, a third crack detection line PCDL3, a fourth crack detection line PCDL4, and a fifth crack detection line PCDL5. Although five crack detection lines are described in this disclosure, the number of crack detection lines is not limited to this and can vary depending on the design.

[0089] One end of each of the following crack detection lines—the first crack detection line PCDL1, the second crack detection line PCDL2, the third crack detection line PCDL3, the fourth crack detection line PCDL4, and the fifth crack detection line PCDL5—can be connected to the same signal transmitting pad electrode PE_T. In the following text, the first crack detection line PCDL1, the second crack detection line PCDL2, the third crack detection line PCDL3, the fourth crack detection line PCDL4, and the fifth crack detection line PCDL5 can receive the same crack detection signal from the flexible circuit board FCB via the signal transmitting pad electrode PE_T.

[0090] In addition, the other ends of the first crack detection line PCDL1, the second crack detection line PCDL2, the third crack detection line PCDL3, the fourth crack detection line PCDL4, and the fifth crack detection line PCDL5 can be connected to the flexible circuit board FCB through different signal receiving pad electrodes PE_R.

[0091] For example, the first crack detection line PCDL1 can send a signal applied from the signal transmitting pad electrode PE_T to the first signal receiving pad electrode PE_R1. Therefore, the timing controller of the flexible circuit board FCB reads or determines whether the first signal receiving pad electrode PE_R1 receives a crack detection signal to detect whether the first crack detection line PCDL1 has broken. However, it is not limited to this; the timing controller of the printed circuit board 160 can also determine whether the first signal receiving pad electrode PE_R1 receives a crack detection signal.

[0092] For example, the second crack detection line PCDL2 can send the signal applied from the signal transmitting pad electrode PE_T to the second signal receiving pad electrode PE_R2. Therefore, the timing controller of the flexible circuit board FCB reads or determines whether the second signal receiving pad electrode PE_R2 has received a crack detection signal to detect whether the second crack detection line PCDL2 has broken. However, it is not limited to this; the timing controller of the printed circuit board 160 can also determine whether the second signal receiving pad electrode PE_R2 has received a crack detection signal.

[0093] For example, the third crack detection line PCDL3 can send the signal applied from the signal transmitting pad electrode PE_T to the third signal receiving pad electrode PE_R3. Therefore, the timing controller of the flexible circuit board FCB reads or determines whether the third signal receiving pad electrode PE_R3 has received a crack detection signal to detect whether the third crack detection line PCDL3 has broken. However, it is not limited to this; the timing controller of the printed circuit board 160 can also determine whether the third signal receiving pad electrode PE_R3 has received a crack detection signal.

[0094] For example, the fourth crack detection line PCDL4 can send the signal applied from the signal transmitting pad electrode PE_T to the fourth signal receiving pad electrode PE_R4. Therefore, the timing controller of the flexible circuit board FCB reads or determines whether the fourth signal receiving pad electrode PE_R4 has received a crack detection signal to detect whether the fourth crack detection line PCDL4 has broken. However, it is not limited to this; the timing controller of the printed circuit board 160 can also determine whether the fourth signal receiving pad electrode PE_R4 has received a crack detection signal.

[0095] For example, the fifth crack detection line PCDL5 can send the signal applied from the signal transmitting pad electrode PE_T to the fifth signal receiving pad electrode PE_R5. Therefore, the timing controller of the flexible circuit board FCB reads or determines whether the fifth signal receiving pad electrode PE_R5 has received a crack detection signal to detect whether the fifth crack detection line PCDL5 has broken. However, it is not limited to this, and the timing controller of the printed circuit board 160 can also determine whether the fifth signal receiving pad electrode PE_R5 has received a crack detection signal.

[0096] Furthermore, the lengths of multiple crack detection lines (PCDL) can also be different. Multiple PCDL lines extend from the same signal transmitting pad electrode (PE_T) towards different signal receiving pad electrodes (PE_R), allowing the lengths of the multiple PCDL lines to differ depending on the position of their respective signal receiving pad electrodes (PE_R).

[0097] For example, refer to Figures 2B to 3E The fifth signal receiving pad electrode PE_R5 can be positioned as the outermost of the multiple signal receiving pad electrodes PE_R. Therefore, the length of the fifth crack detection line PCDL5 connected to the fifth signal receiving pad electrode PE_R5 can be the shortest. Conversely, the first signal receiving pad electrode PE_R1 can be positioned relatively at the center of the second non-display area NA2. Therefore, the length of the first crack detection line PCDL1 connected to the first signal receiving pad electrode PE_R1 can be the longest, but is not limited to this.

[0098] Reference Figure 1 The polarization layer 293 can be disposed on the display panel 100. The polarization layer 293 can suppress or reduce the effects on the micro-LEDs caused by light generated from an external light source and entering the display panel 100. In another example, an adhesive layer can be disposed between the polarization layer 293 and the display panel 100.

[0099] A cover member 120 may be disposed on the polarizing layer 293. The cover member 120 may be a member for protecting the display panel 100. An adhesive layer 295 may be disposed between the polarizing layer 293 and the cover member 120. The cover member 120 may be attached to the display panel 100 using the adhesive layer 295. The adhesive layer 295 may include optically clear adhesive (OCA), optically clear resin (OCR), or pressure-sensitive adhesive (PSA), but the exemplary embodiments of this disclosure are not limited thereto.

[0100] A support substrate 170 may be disposed between the display panel 100 and the printed circuit board 160. The support substrate 170 can enhance the rigidity of the display panel 100. The support substrate 170 may be a back plate, but the exemplary embodiments of this disclosure are not limited thereto. The support substrate 170 may also be omitted if necessary.

[0101] Reference Figures 1 to 3EMultiple link lines LL can be provided in the non-display area NA. These link lines LL can be wiring that transmits various signals from one or more flexible circuit boards (or flexible films) FCB and printed circuit boards 160 to the display area AA. The multiple link lines LL extend from multiple pad electrodes PE of the second non-display area NA2 toward the curved area BA and the first non-display area NA1 to be electrically connected to multiple drive lines VL of the display area AA. Through the drive lines VL of the display area AA and the link lines LL of the non-display area NA, multiple pixel drive circuits PD are supplied with signals from one or more flexible films (or multiple flexible films) FCB and printed circuit boards 160 to be driven.

[0102] For example, multiple drive lines VL can be wiring used, together with multiple link lines LL, to transmit signals output from the flexible circuit board (or flexible film) FCB and printed circuit board 160 to multiple pixel driving circuits PD. The multiple drive lines VL are disposed in the display area AA to be electrically connected to each pixel driving circuit in the multiple pixel driving circuits PD. The multiple drive lines VL extend from the display area AA toward the non-display area NA to be electrically connected to the multiple link lines LL. Therefore, signals output from the flexible circuit board (or flexible film) FCB and printed circuit board 160 can be transmitted to each pixel driving circuit in the multiple pixel driving circuits PD via the multiple link lines LL and the multiple drive lines VL.

[0103] As the bending region BA bends, portions of the multiple link lines LL can bend together. Stress concentrates in the bent portions of the link lines LL, causing cracks to form on the link lines LL. Therefore, the multiple link lines LL can include a conductive material with excellent ductility to reduce cracking when the bending region BA bends. For example, the multiple link lines LL can include a conductive material with excellent ductility, such as gold (Au), silver (Ag), or aluminum (Al), but exemplary embodiments of this disclosure are not limited thereto. Furthermore, the multiple link lines LL can include one of a variety of conductive materials for display region AA. For example, the multiple link lines LL can include molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and silver (Ag) magnesium (Mg) alloys, or alloys thereof, but exemplary embodiments of this disclosure are not limited thereto. The multiple link lines LL can include a multilayer structure (such as a two-layer or three-layer structure) comprising various conductive materials. For example, the multiple link lines LL can be configured as a titanium (Ti) / aluminum (Al) / titanium (Ti) three-layer structure, but exemplary embodiments of this disclosure are not limited thereto.

[0104] Multiple link lines LL can be configured to have various shapes to reduce stress. At least some of the multiple link lines LL disposed on the curved region BA can extend in the same direction as the extension direction of the curved region BA, or in a direction different from the extension direction of the curved region BA, to reduce stress. For example, when the curved region BA extends from the first non-display region NA1 toward the second non-display region NA2 in one direction, at least a portion of the link lines LL disposed on the curved region BA can extend in an inclined direction in one direction. As another example, at least some of the multiple link lines LL can include patterns of various shapes. For example, at least a portion of the multiple link lines LL disposed on the curved region BA can have a shape with a repeating configuration of a conductive pattern having at least one shape selected from diamond, rhombus, trapezoidal waveform, triangular waveform, sawtooth waveform, sine waveform, circular, and omega (Ω) shape. However, the exemplary embodiments of this disclosure are not limited thereto. Therefore, in order to minimize or reduce stress concentrated on the multiple link lines LL and the resulting cracks, the shape of the multiple link lines LL can be various shapes including the shapes described above, but the exemplary embodiments of this disclosure are not limited thereto.

[0105] Figure 4 This is a diagram illustrating a circuit structure according to an exemplary embodiment of the present disclosure.

[0106] A pixel driving circuit (PD) may include a miniature driver (μDriver). A miniature LED (ED) is electrically connected to the miniature driver (μDriver) of the pixel driving circuit (PD) to be driven. Although in Figure 4 The illustration shows a micro LED connected to a micro driver (μDriver), but this disclosure is not limited thereto. For example, eight micro LEDs can be connected to a single micro driver (μDriver). As another example, 16 micro LEDs can be connected to a single micro driver (μDriver), or 32 or 64 micro LEDs can be connected to a single micro driver (μDriver) simultaneously.

[0107] A micro-driver μDriver may include a driving transistor T DR and light-emitting transistor T EM However, the exemplary embodiments disclosed herein are not limited thereto. For example, one or more other transistors and one or more capacitors may be included in the micro driver μDriver. For example, 2T1C, 3T1C, 4T1C, 5T1C, 3T2C, 4T2C, 5T2C, 6T2C, 7T1C, 7T2C, 8T2C, and 8T2C structures may also be used in the micro driver μDriver.

[0108] For example, a high-potential power voltage VDD can be applied to the driving transistor T. DR The first electrode, and can hold the light-emitting transistor T EM The first electrode is connected to the driving transistor T DR The second electrode, and the scan signal SC can be applied to the driving transistor T. DR The gate electrode. Applied to the driving transistor T DR The scan signal SC of the gate electrode is direct current (DC) power and a fixed reference voltage can be applied in each frame, but the exemplary embodiments of this disclosure are not limited thereto.

[0109] Drive transistor T DR The second electrode can be connected to the light-emitting transistor T. EM The first electrode of the miniature LED can be connected to the light-emitting transistor T. EM The second electrode, and the light-emitting signal EM can be applied to the light-emitting transistor T. EM The gate electrode is applied to the light-emitting transistor T. EM The light emission signal EM of the gate electrode can be a pulse width modulated signal that varies in each frame, but the exemplary embodiments of this disclosure are not limited thereto.

[0110] The first electrode of a miniature LED can be connected to the light-emitting transistor T. EM The first electrode may be an anode electrode, and the second electrode may be connected to ground. For example, the first electrode may be an anode electrode, and the second electrode may be a cathode electrode, but exemplary embodiments of this disclosure are not limited thereto.

[0111] Drive transistor T DR and light-emitting transistor T EM Each of them can be an n-type transistor or a p-type transistor.

[0112] Drive transistor T DR The micro-driver μDriver can be turned on by applying a scan signal SC from a timing controller T-CON or a driver IC such as a gating driver IC, and the light-emitting transistor T... EM It can be turned on by emitting a light signal EM. By doing so, the signal applied to the driving transistor T is turned on. DR The high potential power voltage VDD of the first electrode is transmitted via the driving transistor T. DR and light-emitting transistor T EM A driving current is applied to the micro LED ED, which enables the micro LED ED to emit light.

[0113] Figures 5 to 7 This is a plan view of a display device according to an exemplary embodiment of the present disclosure. For example, Figure 5It is a magnified planar view of a display area that includes multiple pixels. For example, Figure 6 It is a magnified planar view of a display area including one pixel. For example, Figure 7 It is a magnified planar view of a display area that includes multiple pixels. Figure 5 and Figure 6 The present disclosure shows only multiple signal lines TL, multiple communication lines NL, multiple first electrodes CE1, multiple embankments BNK, and multiple miniature LEDs ED, but the exemplary embodiments of the present disclosure are not limited thereto. Figure 7 Is Figure 5 An enlarged top view of multiple second electrodes CE2 is also provided.

[0114] Reference Figure 5 and Figure 6 Multiple pixels PX, each composed of multiple sub-pixels, can be disposed in the display area AA. Each sub-pixel can include a micro LED ED and emit light independently. The multiple sub-pixels can be arranged into a matrix by forming multiple rows and columns, but the exemplary embodiments of this disclosure are not limited thereto.

[0115] Multiple subpixels may include a first subpixel SP1, a second subpixel SP2, and a third subpixel SP3. For example, any one of the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3 may be a red subpixel, another may be a green subpixel, and the third may be a blue subpixel. However, this disclosure is not limited thereto. In another example, each subpixel may be a white subpixel. The type of multiple subpixels is illustrative, but exemplary embodiments of this disclosure are not limited thereto. For example, depending on how the pixels are arranged, multiple subpixels may include more or fewer principal subpixels.

[0116] Each pixel in a plurality of pixels PX may include one or more first sub-pixels SP1, one or more second sub-pixels SP2, and one or more third sub-pixels SP3. For example, a pixel PX may include a pair of first sub-pixels SP1, a pair of second sub-pixels SP2, and a pair of third sub-pixels SP3. The pair of first sub-pixels SP1 may include first-1 sub-pixels SP1a and first-2 sub-pixels SP1b. The pair of second sub-pixels SP2 may include second-1 sub-pixels SP2a and second-2 sub-pixels SP2b. The pair of third sub-pixels SP3 may include third-1 sub-pixels SP3a and third-2 sub-pixels SP3b. For example, a pixel PX may include first-1 sub-pixels SP1a and first-2 sub-pixels SP1b, second-1 sub-pixels SP2a and second-2 sub-pixels SP2b, and third-1 sub-pixels SP3a and third-2 sub-pixels SP3b, but the exemplary embodiments of this disclosure are not limited thereto.

[0117] The multiple subpixels forming a pixel PX can be arranged in various ways. For example, in a pixel PX, a pair of first subpixels SP1, a pair of second subpixels SP2, and a pair of third subpixels SP3 can be arranged in the same column. The first subpixels SP1, second subpixels SP2, and third subpixels SP3 can be arranged in the same row. The number and position of the multiple subpixels constituting a pixel PX are illustrative, but the exemplary embodiments of this disclosure are not limited thereto.

[0118] Multiple signal lines TL can be positioned in the region between multiple sub-pixels. Multiple signal lines TL can extend along the column direction between the multiple sub-pixels. Multiple signal lines TL can be wiring that transmits the anode voltage from the pixel driving circuit PD to the multiple sub-pixels. For example, multiple signal lines TL can be electrically connected to the multiple pixel driving circuits PD and the first electrode CE1 of the multiple sub-pixels. The anode voltage output from the pixel driving circuit PD can be transmitted to the first electrode CE1 of the multiple sub-pixels via the multiple signal lines TL. For example, the first electrode CE1 can be electrically connected to the first electrode CE1 of the multiple sub-pixels, as described below. Figure 9 The electrode of the anode electrode 134 of the miniature LED ED is shown. Therefore, the anode voltage from the signal line TL can be sent to the anode electrode 134 of the miniature LED ED through the first electrode CE1.

[0119] Therefore, instead of multiple transistors and storage capacitors formed in each of the multiple sub-pixels, a pixel drive circuit PD integrating multiple pixel circuits is used to simplify the structure of the display device 1000. Furthermore, the integration of circuits provided in each of the multiple sub-pixels into a single pixel drive circuit PD makes high-efficiency, low-power driving possible.

[0120] Multiple signal lines TL may include a first signal line TL1, a second signal line TL2, a third signal line TL3, a fourth signal line TL4, a fifth signal line TL5, and a sixth signal line TL6. The first signal line TL1 and the second signal line TL2 can be electrically connected to a pair of first sub-pixels SP1, respectively. The third signal line TL3 and the fourth signal line TL4 can be electrically connected to a pair of second sub-pixels SP2, respectively. The fifth signal line TL5 and the sixth signal line TL6 can be electrically connected to a pair of third sub-pixels SP3, respectively.

[0121] A first signal line TL1 can be disposed on one of the first sub-pixels in a pair of first sub-pixels SP1, and a second signal line TL2 can be disposed on the other first sub-pixel in the pair of first sub-pixels SP1. The first signal line TL1 can electrically connect one of the first sub-pixels SP1 in the pair of first sub-pixels SP1 to, for example, the first electrode CE1 of the first-1 sub-pixel SP1a. The second signal line TL2, for example, can electrically connect the other first sub-pixel SP1 between the pair of first sub-pixels SP1 to the first electrode CE1 of the first-2 sub-pixel SP1b.

[0122] A third signal line TL3 can be disposed on one of the second sub-pixels in a pair of second sub-pixels SP2, and a fourth signal line TL4 can be disposed on the other second sub-pixel in the pair of second sub-pixels SP2. For example, the third signal line TL3 can be disposed adjacent to the second signal line TL2. The third signal line TL3 can electrically connect one of the second sub-pixels SP2 in the pair of second sub-pixels SP2 to, for example, the first electrode CE1 of the second-1st sub-pixel SP2a. The fourth signal line TL4 can electrically connect the other second sub-pixel SP2 in the pair of second sub-pixels SP2 to, for example, the first electrode CE1 of the second-2nd sub-pixel SP2b.

[0123] The fifth signal line TL5 can be disposed on one of the third sub-pixels in a pair of third sub-pixels SP3, and the sixth signal line TL6 can be disposed on the other third sub-pixel in the pair of third sub-pixels SP3. For example, the fifth signal line TL5 can be disposed adjacent to the fourth signal line TL4. The sixth signal line TL6 can be disposed adjacent to the first signal line TL1 connected to the adjacent pixel PX. The fifth signal line TL5 can electrically connect one of the third sub-pixels SP3 in the pair of third sub-pixels SP3 to, for example, the first electrode CE1 of the 3-1st sub-pixel SP3a. The sixth signal line TL6 can electrically connect the other third sub-pixel SP3 in the pair of third sub-pixels SP3 to, for example, the first electrode CE1 of the 3-2nd sub-pixel SP3b.

[0124] Multiple signal lines TL can be formed of conductive materials. For example, multiple signal lines TL may include conductive materials such as titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), chromium (Cr), indium tin oxide (ITO), indium zinc oxide (IZO), and indium gallium zinc oxide (IGZO). However, exemplary embodiments of this disclosure are not limited thereto. As another example, multiple signal lines TL can be formed of a multilayer structure of conductive materials. For example, multiple signal lines TL can be formed of a multilayer structure of titanium (Ti) / aluminum (Al) / titanium (Ti) / indium tin oxide (ITO), but exemplary embodiments of this disclosure are not limited thereto.

[0125] Multiple communication lines NL can be disposed in the region between multiple pixels PX. The multiple communication lines NL can be configured to extend in the row direction in the region between the multiple pixels PX. The multiple communication lines NL can be disposed in the region between multiple second electrodes CE2, and do not overlap with the multiple second electrodes CE2. For example, the multiple communication lines NL can be wiring for short-range communication such as near-field communication (NFC). The multiple communication lines NL can be used as antennas. For example, the multiple communication lines NL can be multiple connecting lines, but the exemplary embodiments of this disclosure are not limited thereto.

[0126] According to this disclosure, each of the plurality of sub-pixels may have a dammed section (BNK). The plurality of dammed sections (BNK) may be structures for placing a plurality of micro-LEDs (EDs). The plurality of dammed sections (BNK) may guide the position of the plurality of micro-LEDs during a transfer process that transfers the plurality of micro-LEDs to the display device 1000. The plurality of micro-LEDs may be transferred onto the plurality of dammed sections (BNK) during the transfer process. The plurality of dammed sections (BNK) may be dammed patterns or structures, but the exemplary embodiments of this disclosure are not limited thereto.

[0127] The BNK portions of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 can be arranged spaced apart from each other. They can also be configured to be separated from one another. Therefore, it is easy to identify which types of micro-LEDs have been transferred to the BNK portions of the first sub-pixel SP1, second sub-pixel SP2, and third sub-pixel SP3.

[0128] The dam portions BNK of sub-pixels SP1a and SP1b can be connected to each other, or spaced apart or separated from each other. For example, considering design requirements such as transfer process requirements, the dam portions BNK of sub-pixels SP1a and SP1b, where the same type of micro LEDs are provided, can be connected to each other, spaced apart or separated from each other. The dam portions BNK of sub-pixels SP2a and SP2b can be connected to each other, spaced apart or separated from each other. The dam portions BNK of sub-pixels SP3a and SP3b can be connected to each other, spaced apart or separated from each other. Therefore, the dam portions BNK of a pair of first sub-pixels SP1, a pair of second sub-pixels SP2, and a pair of third sub-pixels SP3 can be formed in various forms such as islands, but the exemplary embodiments of this disclosure are not limited thereto.

[0129] For example, multiple dammed brick walls (BNKs) can be formed of an organic insulating material. Multiple dammed brick walls (BNKs) can comprise a single layer or a double layer of organic insulating material. For example, multiple dammed brick walls (BNKs) can comprise photoresist, polyimide (PI), or acrylic materials, but the exemplary embodiments of this disclosure are not limited thereto.

[0130] The first electrode CE1 can be disposed in each of the multiple sub-pixels. The first electrode CE1 can be disposed on the embankment BNK. The first electrode CE1 can be electrically connected to one of the multiple signal lines TL, and therefore can also be referred to as the first connecting electrode. At least a portion of the first electrode CE1 extends outside the embankment BNK to be electrically connected to the signal line TL adjacent to the first electrode CE1. For example, a portion of the first electrode CE1 of the first-1 sub-pixel SP1a extends to a region of the first-1 sub-pixel SP1a to be electrically connected to the first signal line TL1. A portion of the first electrode CE1 of the first-2 sub-pixel SP1b extends to another region of the first-2 sub-pixel SP1b to be electrically connected to the second signal line TL2. A portion of the first electrode CE1 of the second-1 sub-pixel SP2a extends to a region of the second-1 sub-pixel SP2a to be electrically connected to the third signal line TL3. A portion of the first electrode CE1 of the second-2 sub-pixel SP2b extends to another region of the second-2 sub-pixel SP2b to be electrically connected to the fourth signal line TL4. A portion of the first electrode CE1 of sub-pixel SP3a extends into one region of sub-pixel SP3a to be electrically connected to the fifth signal line TL5. A portion of the first electrode CE1 of sub-pixel SP3b extends into another region of sub-pixel SP3b to be electrically connected to the sixth signal line TL6. For example... Figure 5 As shown, portions of the first electrode CE1 of each of the 1-1 sub-pixels SP1a, SP2a, and SP3a in different rows can be aligned with each other in the column direction to be electrically connected to the same signal line. Similarly, portions of the first electrode CE1 of each of the 1-2 sub-pixels SP1b, SP2b, and SP3b in different rows can be aligned with each other in the column direction to be electrically connected to the same signal line.

[0131] The first electrode CE1 can be electrically connected to the anode electrode 134 of the micro LED ED, and the anode voltage is sent from the pixel driving circuit PD to the micro LED ED via the signal line TL. Different voltages can be applied to the first electrodes CE1 of multiple sub-pixels depending on the image to be displayed. For example, different voltages can be applied to the first electrodes CE1 of multiple sub-pixels. Therefore, the first electrode CE1 can be a pixel electrode, but exemplary embodiments of this disclosure are not limited thereto.

[0132] The first electrode CE1 may include a conductive material. For example, the first electrode CE1 may be integrally configured with multiple signal lines TL. For example, the first electrode CE1 may include the same conductive material as the multiple signal lines TL, but the exemplary embodiments of this disclosure are not limited thereto. For example, the first electrode CE1 may include conductive materials such as titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), chromium (Cr), indium tin oxide (ITO), indium zinc oxide (IZO), and indium gallium zinc oxide (IGZO). However, the exemplary embodiments of this disclosure are not limited thereto. As another example, the first electrode CE1 may include a multilayer structure of conductive material. For example, multiple first electrodes CE1 may include a multilayer structure of titanium (Ti) / aluminum (Al) / titanium (Ti) / indium tin oxide (ITO), but the exemplary embodiments of this disclosure are not limited thereto.

[0133] The micro LEDs can be disposed in each of the multiple sub-pixels. The multiple micro LEDs can be any of light-emitting diodes or micro LEDs, but the exemplary embodiments of this disclosure are not limited thereto. The multiple micro LEDs can be disposed on the embankment BNK and the first electrode CE1. The multiple micro LEDs can be disposed on the first electrode CE1 and can be electrically connected to the first electrode CE1. Therefore, an anode voltage is applied from the pixel driving circuit PD to the micro LEDs through the signal line TL and the first electrode CE1 to emit light.

[0134] Multiple micro-LED EDs may include a first micro-LED 130, a second micro-LED 140, and a third micro-LED 150. The first micro-LED 130 may be disposed in a first sub-pixel SP1. The second micro-LED 140 may be disposed in a second sub-pixel SP2. The third micro-LED 150 may be disposed in a third sub-pixel SP3. For example, any one of the first micro-LED 130, the second micro-LED 140, and the third micro-LED 150 may be a red micro-LED, another may be a green micro-LED, and the third may be a blue micro-LED, but the exemplary embodiments of this disclosure are not limited thereto. Therefore, red, green, and blue light emitted from the multiple micro-LED EDs are combined to achieve light of various colors, including white. The type of multiple micro-LED EDs is illustrative, but the exemplary embodiments of this disclosure are not limited thereto.

[0135] The first micro-LED 130 may include a first-1 micro-LED 130a disposed in the first-1 sub-pixel SP1a and a first-2 micro-LED 130b disposed in the first-2 sub-pixel SP1b. The second micro-LED 140 may include a second-1 micro-LED 140a disposed in the second-1 sub-pixel SP2a and a second-2 micro-LED 140b disposed in the second-2 sub-pixel SP2b. The third micro-LED 150 may include a third-1 micro-LED 150a disposed in the third-1 sub-pixel SP3a and a third-2 micro-LED 150b disposed in the third-2 sub-pixel SP3b.

[0136] Refer to together Figure 5 , Figure 6 and Figure 7 The second electrode CE2 can be disposed in each of the multiple sub-pixels. The second electrode CE2 can also be disposed on the micro LED ED. The second electrode CE2 can be electrically connected to the pixel driving circuit PD via multiple contact electrodes CCE.

[0137] For example, the second electrode CE2 can be electrically connected to the cathode electrode 135 of the micro LED ED to send the cathode voltage from the pixel driving circuit PD to the micro LED ED. The same cathode voltage can be applied to the second electrodes CE2 of multiple sub-pixels. For example, the same voltage can be applied to the second electrodes CE2 of each of the multiple sub-pixels and the cathode electrode 135 of the micro LED ED. Therefore, the second electrode CE2 can be a common electrode, but the exemplary embodiments of this disclosure are not limited thereto.

[0138] At least some of the sub-pixels in a plurality of sub-pixels can share the second electrode CE2. At least some of the second electrodes CE2 in the plurality of sub-pixels can be electrically connected to each other. Since the same voltage is applied to the second electrode CE2, the second electrodes CE2 of at least some sub-pixels can be shared for use. For example, the second electrodes CE2 of at least some pixels PX located in the same row can be connected to each other. For example, one second electrode CE2 can be located in multiple pixels PX. One second electrode CE2 can be located in every n sub-pixels.

[0139] For example, some of the second electrodes CE2 of the plurality of sub-pixels can be arranged to be spaced apart or separated from each other. For example, the second electrode CE2 connected to the pixel PX in the nth row and the second electrode CE2 connected to the pixel PX in the (n+1)th row can be configured to be spaced apart or separated from each other. For example, the plurality of second electrodes CE2 can be arranged to be spaced apart from each other, and a plurality of communication lines NL extend along the row direction between the second electrodes. Therefore, the number of the plurality of sub-pixels can be greater than the number of the plurality of second electrodes CE2. As another example, all the second electrodes CE2 of the plurality of sub-pixels are connected to each other, such that only one second electrode CE2 can be provided on the substrate 110, but the exemplary embodiments of this disclosure are not limited thereto.

[0140] The plurality of second electrodes CE2 may include a transparent conductive material, but the exemplary embodiments of this disclosure are not limited thereto. The plurality of second electrodes CE2 may include a transparent conductive material such that light emitted from the micro LED ED can travel toward the top of the second electrodes CE2. For example, the second electrodes CE2 may include a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO), but the exemplary embodiments of this disclosure are not limited thereto.

[0141] Multiple contact electrodes CCE can be disposed on the substrate 110. For example, the multiple contact electrodes CCE can be disposed spaced apart from multiple embankments BNK and multiple signal lines TL. Each of the multiple second electrodes CE2 can overlap with at least one contact electrode CCE. For example, one second electrode CE2 can overlap with multiple contact electrodes CCE.

[0142] For example, multiple contact electrodes CCE can be electrically connected to multiple second electrodes CE2. The multiple contact electrodes CCE can be disposed between the substrate 110 and the multiple second electrodes CE2 to send the cathode voltage from the pixel driving circuit PD to the second electrodes CE2.

[0143] For example, multiple micro-LEDs are formed on a wafer and transferred to a substrate 110 of a display device 1000 to manufacture the display device 1000. However, various defects may occur during the process of transferring multiple micro-LEDs with micro-sized dimensions from the wafer to the substrate 110. For example, in some sub-pixels, there may be untransfer defects where micro-LEDs are not transferred, and in other sub-pixels, due to alignment errors, there may be defects where micro-LEDs are transferred to the wrong positions. Furthermore, even if the transfer process is performed normally, the transferred micro-LEDs may still be defective. Therefore, considering the defects in the transfer process of multiple micro-LEDs, multiple micro-LEDs of the same type can be transferred in one sub-pixel. A light emission test is performed on the multiple micro-LEDs, and only one micro-LED is ultimately determined to be normal.

[0144] For example, micro-LED 130a (1-1) and micro-LED 130b (1-2) can be transferred together to a pixel PX, and their defects can be tested. If both micro-LED 130a and micro-LED 130b are determined to be normal, only micro-LED 130a can be used, and micro-LED 130b can be omitted. As another example, if only micro-LED 130b (1-2) is determined to be normal between micro-LED 130a and micro-LED 130b, then only micro-LED 130b can be used instead of micro-LED 130a. Therefore, even if multiple micro-LEDs of the same type are transferred to a pixel PX, only one micro-LED can ultimately be used.

[0145] Therefore, either one of a pair of microLEDs can be a primary (or main) microLED, and the other microLED can be a redundant microLED. The redundant microLED can be an additional microLED transferred to prepare for defects in the primary microLED. When the primary microLED is defective, the redundant microLED can be used as a replacement. Thus, the primary and redundant microLEDs are transferred together to a single pixel (PX), minimizing or reducing display quality degradation caused by defects in both the primary and redundant microLEDs.

[0146] For example, the first-1 microLED 130a, the second-1 microLED 140a and the third-1 microLED 150a transferred to a pixel PX can be used as the main microLED ED, and the first-2 microLED 130b, the second-2 microLED 140b and the third-2 microLED 150b can be used as redundant microLED ED.

[0147] Figure 8 It is along Figure 2B The cross-sectional view taken from VIII-VIII'. Figure 9 This is a cross-sectional view of a display device according to an exemplary embodiment of the present disclosure. Figure 8 This is a cross-sectional view of a display device according to an exemplary embodiment of the present disclosure. For example, Figure 8 This is a cross-sectional view of the display area AA, the first non-display area NA1, the curved area BA, and the second non-display area NA2. For example, Figure 9 This is a magnified cross-sectional view of the first sub-pixel. Additionally, for ease of explanation, in... Figure 2B In the diagram, section lines VIII-VIII' are shown to not overlap with drive line VL and link line LL, but provide... Figure 2B The cross-section line VIII-VIII' is used to indicate the same position as the adjacent drive line VL and link line LL.

[0148] Reference Figure 8 The first buffer layer 111a and the second buffer layer 111b can be disposed in the remaining area of ​​the substrate 110 other than the bending area BA.

[0149] The first buffer layer 111a and the second buffer layer 111b can be disposed in the display area AA, the first non-display area NA1, and the second non-display area NA2. The first buffer layer 111a and the second buffer layer 111b can reduce the penetration of moisture or impurities through the substrate 110. The first buffer layer 111a and the second buffer layer 111b can be formed of an inorganic insulating material. For example, the first buffer layer 111a and the second buffer layer 111b may comprise a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but the exemplary embodiments of this disclosure are not limited thereto.

[0150] For example, the first buffer layer 111a and the second buffer layer 111b on the bending region BA can be partially removed. The top surface of the substrate 110 located in the bending region BA can be exposed from the first buffer layer 111a and the second buffer layer 111b. Removing the first buffer layer 111a and the second buffer layer 111b, which are formed of inorganic insulating material, from the bending region BA minimizes or reduces cracks in the first buffer layer 111a and the second buffer layer 111b that may occur during bending.

[0151] Multiple alignment keys MK can be disposed between the first buffer layer 111a and the second buffer layer 111b. The multiple alignment keys MK can be configured to identify the position of the pixel driving circuit PD during the manufacturing process of the display device 1000. For example, the multiple alignment keys MK can be configured to align the position of the pixel driving circuit PD transferred onto the adhesive layer 112. As another example, the multiple alignment keys MK can be omitted.

[0152] The adhesive layer 112 may be disposed on the second buffer layer 111b. The adhesive layer 112 may be disposed in the display area AA, the first non-display area NA1, the curved area BA, and the second non-display area NA2. For example, the adhesive layer 112 may be disposed on the second buffer layer 111b in the display area AA, the first non-display area NA1, and the second non-display area NA2, and may also be disposed on the substrate 110 in the curved area BA, but is not limited thereto. As another example, at least a portion of the adhesive layer 112 may be removed in the non-display area NA including the curved area BA. For example, the adhesive layer 112 may be formed from any of the following: adhesive polymer, epoxy resin, UV-curable resin, polyimide-based, acrylate-based, urethane-based, and polydimethylsiloxane (PDMS), but the exemplary embodiments of this disclosure are not limited thereto.

[0153] The pixel driving circuit PD can be disposed on the adhesive layer 112 in the display area AA. When the pixel driving circuit PD is implemented as a drive driver, the drive driver can be mounted on the adhesive layer 112 by a transfer process, but the exemplary embodiments of this disclosure are not limited thereto.

[0154] The first protective layer 113a and the second protective layer 113b may be disposed on the adhesive layer 112 and the pixel driving circuit PD. For example, the first protective layer 113a and the second protective layer 113b may be disposed around the side surface of the pixel driving circuit PD, but the exemplary embodiments of this disclosure are not limited thereto. For example, the second protective layer 113b may be arranged to cover at least a portion of the top surface of the pixel driving circuit PD. For example, at least one of the first protective layer 113a and the second protective layer 113b disposed on the curved region BA may also be omitted. For example, the first protective layer 113a may be completely disposed in the display area AA and the non-display area NA, and the second protective layer 113b may be partially disposed in the display area AA, the first non-display area NA1, and the second non-display area NA2. For example, a portion of the second protective layer 113b in the curved region BA may be removed, but the exemplary embodiments of this disclosure are not limited thereto.

[0155] The first protective layer 113a and the second protective layer 113b may include organic insulating materials, but the exemplary embodiments of this disclosure are not limited thereto. For example, the first protective layer 113a and the second protective layer 113b may include photoresist, polyimide (PI), or photopolymer acrylic material, but the exemplary embodiments of this disclosure are not limited thereto. For example, the first protective layer 113a and the second protective layer 113b may be a cover layer or an insulating layer, but the exemplary embodiments of this disclosure are not limited thereto.

[0156] According to this disclosure, in the display area AA, a plurality of first connection lines 121 may be disposed on the second protective layer 113b. The plurality of first connection lines 121 may be wiring that electrically connects the pixel driving circuit PD to other components. For example, the pixel driving circuit PD may be electrically connected to a plurality of signal lines TL and a plurality of contact electrodes CCE via the plurality of first connection lines 121. For example, the plurality of first connection lines 121 may include first-1 connection line 121a, first-2 connection line 121b, first-3 connection line 121c, and first-4 connection line 121d, but exemplary embodiments of this disclosure are not limited thereto. The connection lines described herein may also be referred to as line connection patterns.

[0157] For example, multiple first-1 connection lines 121a can be disposed on the second protective layer 113b. The multiple first-1 connection lines 121a can be electrically connected to the pixel driving circuit PD. The multiple first-1 connection lines 121a can send the voltage output from the pixel driving circuit PD to the first electrode CE1 or the second electrode CE2.

[0158] For example, a third protective layer 114 may be disposed on the second protective layer 113b. The third protective layer 114 may be completely disposed within the display area AA and the non-display area NA. In the curved area BA, the third protective layer 114 may cover the side surface of the second protective layer 113b and the top surface of the first protective layer 113a. The third protective layer 114 may include an organic insulating material. For example, the third protective layer 114 may include a photoresist, polyimide (PI), or photoacrylic material, but the exemplary embodiments of this disclosure are not limited thereto. For example, the first protective layer 113a, the second protective layer 113b, and the third protective layer 114 may include the same material, but the exemplary embodiments of this disclosure are not limited thereto.

[0159] Multiple first-second connection lines 121b may be disposed on the third protective layer 114. These multiple first-second connection lines 121b may be connected indirectly or directly to the pixel driving circuit PD. For example, a portion of the first-second connection lines 121b may be directly connected to the pixel driving circuit PD through contact holes in the third protective layer 114. Another portion of the first-second connection lines 121b may be electrically connected to the first-first connection line 121a through contact holes in the third protective layer 114, but exemplary embodiments of this disclosure are not limited thereto. The voltage output from the pixel driving circuit PD may be transmitted to the first electrode CE1 or the second electrode CE2 through connection lines other than the multiple first-second connection lines 121b.

[0160] The first insulating layer 115a may be disposed on multiple first-second connecting lines 121b. The first insulating layer 115a may be entirely disposed within the display area AA and the non-display area NA, but exemplary embodiments of this disclosure are not limited thereto. The first insulating layer 115a may include an organic insulating material, but exemplary embodiments of this disclosure are not limited thereto. For example, the first insulating layer 115a may include a photoresist, polyimide (PI), or photoacrylic material, but exemplary embodiments of this disclosure are not limited thereto.

[0161] Multiple first-to-third connecting wires 121c can be disposed on the first insulating layer 115a. Multiple first-to-third connecting wires 121c can be electrically connected to multiple first-to-second connecting wires 121b. For example, the first-to-third connecting wires 121c can be electrically connected to the first-to-second connecting wires 121b through contact holes in the first insulating layer 115a.

[0162] The second insulating layer 115b may be disposed on the plurality of first-third connecting lines 121c. The second insulating layer 115b may be disposed in the remaining areas except for the bending region BA, but the exemplary embodiments of this disclosure are not limited thereto. The second insulating layer 115b may be disposed in the display region AA, the first non-display region NA1, and the second non-display region NA2, but the exemplary embodiments of this disclosure are not limited thereto. For example, a portion of the second insulating layer 115b disposed in the bending region BA may also be removed. The second insulating layer 115b may include an organic insulating material, but the exemplary embodiments of this disclosure are not limited thereto. For example, the second insulating layer 115b may include a photoresist, polyimide (PI), or photoacrylic material, but the exemplary embodiments of this disclosure are not limited thereto.

[0163] Multiple first-to-fourth connecting wires 121d can be disposed on the second insulating layer 115b. Multiple first-to-fourth connecting wires 121d can be electrically connected to multiple first-to-third connecting wires 121c. For example, the first-to-fourth connecting wires 121d can be electrically connected to the first-to-third connecting wires 121c through contact holes in the second insulating layer 115b.

[0164] According to this disclosure, in the non-display area NA, a plurality of second connection lines 122 may be disposed on the second protective layer 113b. The plurality of second connection lines 122 may be from the flexible circuit board (or flexible film) FCB and the printed circuit board 160 (see [link to relevant documentation]). Figure 1 The signals sent to the pad unit PAD are sent to the wiring of the pixel driving circuit PD in the display area AA. For example, multiple second connection lines 122 can be electrically connected to multiple pad electrodes PE to apply signals from the flexible circuit board (or flexible film) FCB and the printed circuit board.

[0165] For example, multiple second connection lines 122 extend from the pad unit PAD toward the display area AA to send signals to the wiring of the display area AA. In this case, the multiple second connection lines 122 can be used as link lines LL. The multiple second connection lines 122 may include second-1 connection line 122a, second-2 connection line 122b, second-3 connection line 122c, and second-4 connection line 122d.

[0166] Multiple second-first connection lines 122a can be disposed on the second protective layer 113b. These multiple second-first connection lines 122a can extend from the second non-display area NA2 to the curved area BA and the first non-display area NA1. The multiple second-first connection lines 122a can transmit signals from the flexible circuit board (or flexible film) FCB and the printed circuit board 160 to the pad unit PAD to the pixel driving circuit PD of the display area AA.

[0167] Multiple second-2 connection lines 122b can be disposed on the third protective layer 114. Multiple second-2 connection lines 122b can be disposed in the second non-display area NA2. The second-2 connection lines 122b can be electrically connected to the second-1 connection line 122a through contact holes in the third protective layer 114. Therefore, signals from the flexible circuit board (or flexible film) FCB and the printed circuit board can be transmitted to the second-1 connection line 122a via the second-2 connection lines 122b.

[0168] The second-third connection line 122c can be disposed on the first insulating layer 115a. The second-third connection line 122c can be disposed in the second non-display area NA2. The second-third connection line 122c can be electrically connected to the second-second connection line 122b through the contact hole of the first insulating layer 115a. Therefore, signals from the flexible circuit board (or flexible film) FCB and the printed circuit board can be transmitted to the second-first connection line 122a through the second-third connection line 122c and the second-second connection line 122b.

[0169] The second-fourth connection line 122d can be disposed on the second insulating layer 115b. The second-fourth connection line 122d can be disposed in the second non-display area NA2. The second-fourth connection line 122d can be electrically connected to the second-third connection line 122c through the contact hole of the second insulating layer 115b. Therefore, signals from the flexible circuit board (or flexible film) FCB and the printed circuit board 160 can be transmitted to the second-first connection line 122a through the second-fourth connection line 122d, the second-third connection line 122c, and the second-second connection line 122b.

[0170] The plurality of first connecting lines 121 and the plurality of second connecting lines 122 may be formed of a conductive material with excellent ductility or any of a variety of conductive materials used for the display area AA. For example, the second connecting lines 122, which are partially disposed in the curved area BA, may include a conductive material with excellent ductility, such as gold (Au), silver (Ag), or aluminum (Al), but the exemplary embodiments of this disclosure are not limited thereto. As another example, the plurality of first connecting lines 121 and the plurality of second connecting lines 122 may include molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and silver (Ag) magnesium (Mg) alloys, or alloys thereof, but the exemplary embodiments of this disclosure are not limited thereto.

[0171] The third insulating layer 115c may be disposed on the plurality of first connecting lines 121 and the plurality of second connecting lines 122. The third insulating layer 115c may be disposed in the remaining area excluding the curved region BA, but the exemplary embodiments of this disclosure are not limited thereto. The third insulating layer 115c may be disposed in the display region AA, the first non-display region NA1, and the second non-display region NA2. A portion of the third insulating layer 115c disposed in the curved region BA may also be removed. The third insulating layer 115c may include an organic insulating material, but the exemplary embodiments of this disclosure are not limited thereto. For example, the third insulating layer 115c may include a photoresist, polyimide (PI), or photoacrylic material, but the exemplary embodiments of this disclosure are not limited thereto.

[0172] Multiple embankment BNKs can be disposed on the third insulating layer 115c in the display area AA. The multiple embankment BNKs can be arranged to overlap with each of the sub-pixels in the multiple sub-pixels. One or more micro LEDs of the same type can be disposed above each of the multiple embankment BNKs.

[0173] Multiple signal lines TL can be disposed on the third insulating layer 115c in the display area AA. Multiple signal lines TL can be disposed in the area between multiple dikes BNK. For example, multiple signal lines TL can be disposed adjacent to any one of the multiple dikes BNK.

[0174] Multiple contact electrodes CCE can be disposed on the third insulating layer 115c in the display area AA. The multiple contact electrodes CCE can supply cathode voltage from the pixel driving circuit PD to the second electrode CE2.

[0175] The first electrode CE1 can be disposed on the embankment BNK. For example, the first electrode CE1 can be configured to extend from the adjacent signal line TL toward the top of the embankment BNK. The first electrode CE1 can be disposed on the top surface and the side surface of the embankment BNK. For example, the first electrode CE1 can be configured to extend from the signal line TL on the top surface of the third insulating layer 115c to the side surface and the top surface of the embankment BNK.

[0176] Reference Figure 9 The first electrode CE1 may include multiple conductive layers. For example, the first electrode CE1 may include a first conductive layer CE1a, a second conductive layer CE1b, a third conductive layer CE1c, and a fourth conductive layer CE1d, but the exemplary embodiments of this disclosure are not limited thereto.

[0177] The first conductive layer CE1a can be disposed on the embankment BNK. The second conductive layer CE1b can be disposed on the first conductive layer CE1a. The third conductive layer CE1c can be disposed on the second conductive layer CE1b. The fourth conductive layer CE1d can be disposed on the third conductive layer CE1c. For example, the first conductive layer CE1a, the second conductive layer CE1b, the third conductive layer CE1c, and the fourth conductive layer CE1d may include titanium (Ti), molybdenum (Mo), aluminum (Al), or titanium (Ti) and indium tin oxide (ITO), but the exemplary embodiments of this disclosure are not limited thereto.

[0178] According to this disclosure, some of the conductive layers with good reflectivity among the plurality of conductive layers constituting the first electrode CE1 can be configured as alignment keys and / or reflectors for aligning the micro-LED ED. For example, the second conductive layer CE1b among the plurality of conductive layers of the first electrode CE1 may include a reflective material. For example, the second conductive layer CE1b may include aluminum (Al), but exemplary embodiments of this disclosure are not limited thereto. Therefore, the second conductive layer CE1b can be configured as a reflector. Furthermore, the second conductive layer CE1b has high reflectivity to be easily identifiable during the manufacturing process, allowing the alignment of the micro-LED ED position or transfer position to be based on the second conductive layer CE1b.

[0179] For example, to configure the second conductive layer CE1b as a reflector, the third conductive layer CE1c and the fourth conductive layer CE1d covering the second conductive layer CE1b can be partially removed or etched. For example, a portion of the third conductive layer CE1c and the fourth conductive layer CE1d disposed on the embankment BNK can be removed or etched to expose the top surface of the second conductive layer CE1b. For example, the central and edge portions (or boundary portions) of the solder pattern SDP arranged in the third conductive layer CE1c and the fourth conductive layer CE1d can be retained, and the remaining portions other than these portions can be removed. For example, the edge portions (or boundary portions) of each of the third conductive layer CE1c formed of titanium (Ti) and the fourth conductive layer CE1d formed of indium tin oxide (ITO) can be left unetched. Therefore, corrosion of the other conductive layer of the first electrode CE1 caused by the tetramethylammonium hydroxide (TMAH) solution used in the masking process for the first electrode CE1 can be suppressed.

[0180] According to this disclosure, the first conductive layer CE1a and the third conductive layer CE1c may comprise titanium (Ti) or molybdenum (Mo). The second conductive layer CE1b may comprise aluminum (Al). The fourth conductive layer CE1d may comprise a transparent conductive oxide layer, such as indium tin oxide (ITO) or indium zinc oxide (IZO), which adheres to the solder pattern SPD and has corrosion resistance and acid resistance, but the exemplary embodiments of this disclosure are not limited thereto.

[0181] A first conductive layer CE1a, a second conductive layer CE1b, a third conductive layer CE1c, and a fourth conductive layer CE1d are deposited sequentially, followed by photolithography and etching processes to pattern the material. However, exemplary embodiments of this disclosure are not limited thereto.

[0182] According to this disclosure, the signal line TL, contact electrode CCE, and pad electrode PE disposed on the same layer as the first electrode CE1 may comprise multilayer conductive materials, but the exemplary embodiments of this disclosure are not limited thereto. For example, the signal line TL, contact electrode CCE, and pad electrode PE may be formed simultaneously from the same material in the same masking process. For example, the signal line TL, contact electrode CCE, and pad electrode PE may be formed from a multilayer of indium tin oxide (ITO) / titanium (Ti) / aluminum (Al) / titanium (Ti), but the exemplary embodiments of this disclosure are not limited thereto.

[0183] According to this disclosure, in each of a plurality of sub-pixels, a solder pattern SDP can be disposed on the first electrode CE1. The solder pattern SDP bonds the micro-LED ED to the first electrode CE1 to electrically connect the first electrode CE1 and the micro-LED ED. For example, the first electrode CE1 and the anode electrode 134 of the micro-LED ED can be electrically connected by eutectic bonding using the solder pattern SDP, but exemplary embodiments of this disclosure are not limited thereto.

[0184] For example, when the solder pattern SDP is made of indium (In) and the anode electrode 134 of the micro LED ED is made of gold (Au), heat and pressure are applied during the transfer process of the micro LED ED to bond the solder pattern SDP and the anode electrode 134. The micro LED ED can be bonded to the solder pattern SDP and the first electrode CE1 using eutectic bonding without using a separate adhesive material. For example, the solder pattern SDP may include indium (Id), tin (Sn), or alloys thereof, but the exemplary embodiments of this disclosure are not limited thereto. For example, the solder pattern SDP may be a bonding pad or an adhesive pad, but the exemplary embodiments of this disclosure are not limited thereto.

[0185] According to this disclosure, a passivation layer 116 may be disposed on a plurality of signal lines TL, a plurality of first electrodes CE1, a plurality of contact electrodes CCE, and a third insulating layer 115c. For example, the passivation layer 116 may be disposed in a display area AA, a first non-display area NA1, and a second non-display area NA2. A portion of the passivation layer 116 disposed in a curved area BA may also be removed. A portion of the passivation layer 116 covering a plurality of pad electrodes PE in the second non-display area NA2 may be removed. The passivation layer 116 is arranged to cover the remaining area except for the curved area BA, the plurality of pad electrodes PE, and the solder pattern SDP to reduce the penetration of moisture or impurities into the micro LED ED. For example, the passivation layer 116 may comprise a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but exemplary embodiments of this disclosure are not limited thereto. For example, the passivation layer 116 may be a protective layer or an insulating layer, but exemplary embodiments of this disclosure are not limited thereto. For example, the passivation layer 116 may include holes through which the solder pattern SDP is exposed.

[0186] In each of the multiple sub-pixels, a micro-LED ED can be disposed on the solder pattern SDP. A first micro-LED 130 can be disposed in the first sub-pixel SP1. A second micro-LED 140 can be disposed in the second sub-pixel SP2. A third micro-LED 150 can be disposed in the third sub-pixel SP3.

[0187] Micro-LEDs can be formed on silicon wafers using metal-organic chemical vapor deposition (MOCVD), chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), molecular beam epitaxy (MBE), hydride vapor phase epitaxy (HVPE), or sputtering methods. However, exemplary embodiments of this disclosure are not limited thereto.

[0188] Reference Figure 9 The first micro-LED 130 may include an anode electrode 134, a first semiconductor layer 131, an active layer 132, a second semiconductor layer 133, a cathode electrode 135, and an encapsulation film 136, but the exemplary embodiments of this disclosure are not limited thereto. For example, the encapsulation film 136 may not be included in the first micro-LED 130.

[0189] A first semiconductor layer 131 may be disposed on a solder pattern SDP. A second semiconductor layer 133 may be disposed on the first semiconductor layer 131. For example, an active layer 132 may be disposed on the first semiconductor layer 131, and a second semiconductor layer 133 may be disposed on the active layer 132.

[0190] For example, one of the first semiconductor layer 131 and the second semiconductor layer 133 may be implemented using a compound semiconductor such as a group III-V or group II-VI semiconductor, and may be doped with impurities (or dopants). For example, one of the first semiconductor layer 131 and the second semiconductor layer 133 may be an n-type impurity-doped semiconductor layer, and the other may be a p-type impurity-doped semiconductor layer, but the exemplary embodiments of this disclosure are not limited thereto. For example, one or more of the first semiconductor layer 131 and the second semiconductor layer 133 may be layers in which n-type or p-type impurities are doped on a material such as gallium nitride (GaN), gallium phosphide (GaP), gallium arsenide phosphide (GaAsP), aluminum gallium indium phosphide (AlGaInP), indium aluminum phosphide (InAlP), aluminum gallium nitride (AlGaN), aluminum indium nitride (AlInN), aluminum indium gallium nitride (AlInGaN), aluminum gallium arsenide (AlGaAs), or gallium arsenide (GaAs). However, the exemplary embodiments of this disclosure are not limited thereto. For example, n-type impurities can be silicon (Si), germanium (Ge), selenium (Se), carbon (C), tellurium (Te), or tin (Sn), but the exemplary embodiments of this disclosure are not limited thereto. For example, p-type impurities can be magnesium (Mg), zinc (Zn), calcium (Ca), strontium (Sr), barium (Ba), or beryllium (Be), but the exemplary embodiments of this disclosure are not limited thereto.

[0191] For example, each of the first semiconductor layer 131 and the second semiconductor layer 133 may be a nitride semiconductor including n-type impurities or a nitride semiconductor including p-type impurities, but the exemplary embodiments of this disclosure are not limited thereto. For example, the first semiconductor layer 131 may be a nitride semiconductor including p-type impurities, and the second semiconductor layer 133 may be a nitride semiconductor including n-type impurities, but the exemplary embodiments of this disclosure are not limited thereto.

[0192] An active layer 132 may be disposed between a first semiconductor layer 131 and a second semiconductor layer 133. The active layer 132 supplies holes and electrons from the first semiconductor layer 131 and the second semiconductor layer 133 to emit light. For example, the active layer 132 may include a single-well structure, a multi-well structure, a signal quantum well structure, a multiple quantum well (MQW) structure, a quantum dot structure, and a quantum wire structure, but the exemplary embodiments of this disclosure are not limited thereto. For example, the active layer 132 may include indium gallium nitride (InGaN) or gallium nitride (GaN), but the exemplary embodiments of this disclosure are not limited thereto.

[0193] As another example, the active layer 132 may have a multiple quantum well (MQW) structure having a well layer and a barrier layer with a band gap higher than the well layer. For example, in the active layer 132, InGaN may be configured as the well layer and AlGaN layer may be configured as the barrier layer, but the exemplary embodiments of this disclosure are not limited thereto.

[0194] An anode electrode 134 may be disposed between the first semiconductor layer 131 and the solder pattern SDP. For example, the anode electrode 134 may electrically connect the first semiconductor layer 131 and the first electrode CE1. The anode voltage output from the pixel driving circuit PD may be applied to the first semiconductor layer 131 through the signal line TL, the first electrode CE1, and the anode electrode 134. For example, the anode electrode 134 may include a conductive material that can form a eutectic bond with the solder pattern SDP, but the exemplary embodiments of this disclosure are not limited thereto. For example, the anode electrode 134 may include gold (Au), tin (Sn), tungsten (W), silicon (Si), silver (Ag), titanium (Ti), iridium (Ir), chromium (Cr), indium (In), zinc (Zn), lead (Pb), nickel (Ni), platinum (Pt), and copper (Cu), or alloys thereof, but the exemplary embodiments of this disclosure are not limited thereto.

[0195] A cathode electrode 135 may be disposed on the second semiconductor layer 133. For example, the cathode electrode 135 may electrically connect the second semiconductor layer 133 and the second electrode CE2. The cathode voltage output from the pixel driving circuit PD may be applied to the second semiconductor layer 133 through the contact electrode CCE, the second electrode CE2, and the cathode electrode 135. The cathode electrode 135 may include a transparent conductive material to allow light emitted from the micro LED ED to be guided to the top of the micro LED ED, but the exemplary embodiments of this disclosure are not limited thereto. For example, the cathode electrode 135 may include materials such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO), but the exemplary embodiments of this disclosure are not limited thereto.

[0196] The encapsulation film 136 may be disposed in at least a portion of the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, and the cathode electrode 135. For example, the encapsulation film 136 may surround at least a portion of the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, and the cathode electrode 135, but is not limited thereto. For example, the encapsulation film 136 may not be included in the micro LED ED.

[0197] For example, the encapsulation film 136 can protect the first semiconductor layer 131, the active layer 132, and the second semiconductor layer 133. For example, the encapsulation film 136 can be disposed on the side of the first semiconductor layer 131, the side of the active layer 132, and the side of the second semiconductor layer 133.

[0198] For example, the encapsulation film 136 may be disposed on at least a portion of the anode electrode 134 and the cathode electrode 135, for example, on the edge (or boundary or side) of the anode electrode 134 and the edge (or boundary or side) of the cathode electrode 135. At least a portion of the anode electrode 134 is exposed from the encapsulation film 136, allowing the anode electrode 134 and the solder pattern SDP to be connected. For example, at least a portion of the cathode electrode 135 may be exposed from the encapsulation film 136, allowing the cathode electrode 135 and the second electrode CE2 to be connected. For example, the encapsulation film 136 may be formed of an insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx), but the exemplary embodiments of this disclosure are not limited thereto.

[0199] As another example, the encapsulation film 136 may have a structure in which reflective material is dispersed in a resin layer, but the exemplary embodiments of this disclosure are not limited thereto. For example, the encapsulation film 136 may be made using reflectors with various structures, but the exemplary embodiments of this disclosure are not limited thereto. Light emitted from the active layer 132 is reflected upward by the encapsulation film 136, thereby improving light extraction efficiency. For example, the encapsulation film 136 may be a reflective layer, but the exemplary embodiments of this disclosure are not limited thereto.

[0200] According to this disclosure, a micro LED ED with a vertical structure is described, but the exemplary embodiments of this disclosure are not limited thereto. For example, a micro LED ED may have a lateral structure or a flip-chip structure.

[0201] Already referred to Figure 9 A first micro-LED 130 is described, and a second micro-LED 140 and a third micro-LED 150 may have substantially the same structure as the first micro-LED 130. For example, the second micro-LED 140 and the third micro-LED 150 may be substantially the same as the first semiconductor layer 131, active layer 132, second semiconductor layer 133, anode electrode 134, cathode electrode 135, and encapsulation film 136 of the first micro-LED 130.

[0202] According to this disclosure, a first optical layer 117a may be provided around a plurality of micro LEDs ED in a display area AA. For example, the first optical layer 117a may be provided to cover a plurality of micro LEDs ED and a dam BNK in a region of a plurality of sub-pixels. For example, the first optical layer 117a may cover a portion of the dam BNK, a passivation layer 116, and the space between the plurality of micro LEDs ED. The first optical layer 117a may be provided or covered between the plurality of micro LEDs ED and between the plurality of dam BNK included in a pixel PX. For example, the first optical layer 117a may extend in a first row direction and be spaced apart from each other in a second column direction. For example, the first optical layer 117a may be arranged between the passivation layer 116 and the second electrode CE2, but embodiments of this disclosure are not limited thereto. For example, the first optical layer 117a may be arranged to surround the sides of the micro LEDs ED and the dam BNK between the passivation layer 116 and the second electrode CE2, but exemplary embodiments of this disclosure are not limited thereto. For example, the first optical layer 117a may be a diffusion layer or a sidewall diffusion layer, but the exemplary embodiments of this disclosure are not limited thereto.

[0203] The first optical layer 117a may include an organic insulating material in which microparticles are dispersed, but the exemplary embodiments of this disclosure are not limited thereto. For example, the first optical layer 117a may include a siloxane in which tiny metal particles, such as titanium dioxide (TiO2) particles, are dispersed, but the exemplary embodiments of this disclosure are not limited thereto. Light from the plurality of micro LEDs is scattered by the microparticles dispersed in the first optical layer 117a to be emitted to the outside of the display device 1000. Therefore, the first optical layer 117a can improve the extraction efficiency of light emitted from the plurality of micro LEDs.

[0204] For example, the first optical layer 117a may be disposed in each pixel of a plurality of pixels PX, or disposed together in some pixels PX in the same row, but the exemplary embodiments of this disclosure are not limited thereto. For example, the first optical layer 117a may be disposed in each pixel of a plurality of pixels PX, or a plurality of pixels PX may share a first optical layer 117a. As another example, each sub-pixel of a plurality of sub-pixels may individually include the first optical layer 117a, but the exemplary embodiments of this disclosure are not limited thereto.

[0205] According to this disclosure, in the display area AA, the second optical layer 117b may be disposed on the passivation layer 116. For example, the second optical layer 117b may be arranged to surround the first optical layer 117a. For example, the second optical layer 117b may contact the side surface of the first optical layer 117a. For example, the second optical layer 117b may be disposed in the area between a plurality of pixels PX. However, the exemplary embodiments of this disclosure are not limited thereto. For example, the second optical layer 117b may be a diffusion layer, a diffusion layer window, or a window diffusion layer, but the exemplary embodiments of this disclosure are not limited thereto.

[0206] The second optical layer 117b may include an organic insulating material, but the exemplary embodiments of this disclosure are not limited thereto. The second optical layer 117b may include the same material as the first optical layer 117a, but the exemplary embodiments of this disclosure are not limited thereto. For example, the first optical layer 117a may include microparticles, but the second optical layer 117b may not include microparticles. For example, the second optical layer 117b may include siloxanes, but the exemplary embodiments of this disclosure are not limited thereto.

[0207] For example, the thickness of the first optical layer 117a may be less than the thickness of the second optical layer 117b, but the exemplary embodiments of this disclosure are not limited thereto. Therefore, in a plan view, the area where the first optical layer 117a is disposed may include a recess that is recessed inward from the upper surface of the second optical layer 117b.

[0208] According to this disclosure, the second electrode CE2 can be disposed on the first optical layer 117a and the second optical layer 117b. For example, the second electrode CE2 can be electrically connected to multiple contact electrodes CCE through contact holes in the second optical layer 117b. For example, the second electrode CE2 can be disposed on multiple micro LEDs ED. For example, the second electrode CE2 can include a transparent conductive oxide, such as indium tin oxide (ITO) or indium zinc oxide (IZO), but exemplary embodiments of this disclosure are not limited thereto. For example, the second electrode CE2 can be configured to contact the cathode electrode 135. For example, the second electrode CE2 can overlap with the first optical layer 117a. For example, the second electrode can cover the outer plane of the first optical layer 117a.

[0209] The second electrode CE2 can extend continuously in the first direction of the substrate 110. Therefore, the second electrode CE2 can be connected to a plurality of pixels PX disposed in the first direction of the substrate 110. For example, the second electrode CE2 can be connected to a plurality of pixels PX.

[0210] According to this disclosure, the second electrode CE2 can extend continuously over the first optical layer 117a, the second optical layer 117b, and the micro LED ED. The region where the first optical layer 117a is disposed may include a recess that extends inward from the upper surface of the second optical layer 117b. Therefore, a first portion of the second electrode CE2 disposed on the first optical layer 117a can be disposed along the recess, such that the first portion can be configured to be lower than the second portion of the second electrode CE2 disposed on the second optical layer 117b.

[0211] A third optical layer 117c can be disposed on the second electrode CE2. The third optical layer 117c can be disposed overlapping the plurality of micro-LEDs and the first optical layer 117a. The third optical layer 117c is disposed above the second electrode CE2 and the plurality of micro-LEDs to improve the appearance of muras that may occur in a portion of the plurality of micro-LEDs. For example, when the plurality of micro-LEDs are transferred onto the substrate 110 of the display device 1000, process variations may cause areas of uneven spacing between the plurality of micro-LEDs. When the spacing between the plurality of micro-LEDs is uneven, the light-emitting areas of each micro-LED in the plurality of micro-LEDs can be unevenly arranged, making the muras visible to the user. Therefore, the third optical layer 117c, configured to uniformly diffuse light, is disposed above the plurality of micro-LEDs to reduce the light emitted from some of the micro-LEDs that is visible as a mura. Therefore, the light emitted from the multiple micro LEDs is uniformly diffused by the third optical layer 117c to be extracted to the outside of the display device 1000, thereby improving the brightness uniformity of the display device 1000.

[0212] The third optical layer 117c may be formed of the same material as the first optical layer 117a, but embodiments of the present disclosure are not limited thereto. The third optical layer 117c may include an organic insulating material in which microparticles are dispersed, but exemplary embodiments of the present disclosure are not limited thereto. For example, the third optical layer 117c may include a siloxane in which tiny metal particles, such as titanium dioxide (TiO2) particles, are dispersed, but exemplary embodiments of the present disclosure are not limited thereto. For example, the third optical layer 117c may include the same material as the first optical layer 117a, but exemplary embodiments of the present disclosure are not limited thereto. For example, the third optical layer 117c may be a diffusion layer or a top surface diffusion layer, but exemplary embodiments of the present disclosure are not limited thereto.

[0213] According to this disclosure, light from multiple micro-LEDs is scattered by particles dispersed in a third optical layer 117c to be emitted to the exterior of the display device 1000. The third optical layer 117c uniformly mixes the light emitted from the multiple micro-LEDs to further improve the brightness uniformity of the display device 1000. The light extraction efficiency of the display device 1000 can be improved by the light scattered from the multiple particles, enabling the display device 1000 to be driven with low power.

[0214] In the display area AA, a black matrix BM can be disposed on the second electrode CE2, the first optical layer 117a, the second optical layer 117b, and the third optical layer 117c. For example, the black matrix BM can fill the contact hole of the second optical layer 117b. The black matrix BM is configured to cover the display area AA to reduce color mixing and external light reflection of multiple sub-pixels. For example, the black matrix BM can be disposed in the contact hole connecting the second electrode CE2 and the contact electrode CCE, thereby suppressing light leakage between multiple adjacent sub-pixels.

[0215] For example, a black matrix BM may include an opaque material, but the exemplary embodiments of this disclosure are not limited thereto. For example, a black matrix BM may include an organic insulating material with added black pigment or black dye, but the exemplary embodiments of this disclosure are not limited thereto.

[0216] In the display area AA, a cover layer 118 may be disposed on the black matrix BM. The cover layer 118 may protect the structure beneath it. For example, the cover layer 118 may include an organic insulating material, but exemplary embodiments of this disclosure are not limited thereto. For example, the cover layer 118 may include a photoresist, polyimide (PI), or photoacrylic material, but exemplary embodiments of this disclosure are not limited thereto. For example, the cover layer 118 may be a cover layer or an insulating layer, but exemplary embodiments of this disclosure are not limited thereto.

[0217] The polarizing layer 293 can be disposed on the cover layer 118 by means of the first adhesive layer 291. The cover member 120 can be disposed on the polarizing layer 293 by means of the second adhesive layer 295. For example, the first adhesive layer 291 and the second adhesive layer 295 may include optically transparent adhesive (OCA), optically transparent resin (OCR), or pressure-sensitive adhesive (PSA), but the exemplary embodiments of this disclosure are not limited thereto.

[0218] According to this disclosure, a plurality of pad electrodes PE can be disposed on a third insulating layer 115c in a second non-display area NA2. For example, at least some of the plurality of pad electrodes PE can be exposed from the passivation layer 116. For example, the plurality of pad electrodes PE can be electrically connected to the second-fourth connection line 122d through contact holes in the third insulating layer 115c.

[0219] An adhesive layer ACF can be disposed on multiple pad electrodes PE. The adhesive layer ACF can be an adhesive layer in which conductive balls are dispersed in an insulating material, but exemplary embodiments of this disclosure are not limited thereto. When heat or pressure is applied to the adhesive layer ACF, the conductive balls become electrically connected at the portions where heat or pressure is applied to become conductive. The adhesive layer ACF can be disposed between multiple pad electrodes PE and a flexible circuit board (or flexible film) FCB, and the flexible circuit board (or flexible film) FCB can be attached or bonded to the multiple pad electrodes PE. For example, the adhesive layer ACF can be an anisotropic conductive film, but exemplary embodiments of this disclosure are not limited thereto.

[0220] The flexible circuit board (or flexible film) FCB can be disposed on the adhesive layer ACF. The flexible circuit board (or flexible film) FCB can be electrically connected to multiple pad electrodes PE through the adhesive layer ACF. Therefore, signals output from the flexible circuit board (or flexible film) FCB and the printed circuit board 160 can be transmitted to the pixel driving circuit PD of the display area AA through the multiple pad electrodes PE, the second-fourth connection line 122d, the second-third connection line 122c, the second-second connection line 122b, and the second-first connection line 122a.

[0221] Figure 10 It is along Figure 2A A cross-sectional view taken from the X-X' line. Figure 11A It is along Figure 2A A cross-sectional view taken from the A-A' line. Figure 11B It is along Figure 2A A cross-sectional view taken from the B-B' line. Figure 11C It is along Figure 2A A cross-sectional view taken from the C-C' line. Figure 11D It is along Figure 2A The cross-sectional view taken from D-D'. Figure 11E It is along Figure 2A The cross-sectional view taken from E-E'. Specifically, Figure 10This is a cross-sectional view showing the connection structure between multiple crack detection lines PCDL and the signal transmission pad electrode PE_T. Figures 11A to 11E This is a cross-sectional view showing the connection structure between multiple crack detection lines (PCDL) and multiple signal receiving pad electrodes (PE_R). Additionally, for ease of illustration, in... Figures 10 to 11E The diagram shows that the cross-sectional line does not overlap with multiple crack detection lines PCDL and link lines LL. (The diagram is provided.) Figures 10 to 11E The cross-sectional line is used to indicate the same position as the adjacent multiple crack detection lines PCDL and link lines LL.

[0222] Reference Figures 10 to 11E Multiple crack detection lines (PCDLs) can be set on the second protective layer 113b. These multiple crack detection lines (PCDLs) may include a first crack detection line (PCDL1), a second crack detection line (PCDL2), a third crack detection line (PCDL3), a fourth crack detection line (PCDL4), and a fifth crack detection line (PCDL5) set on different layers.

[0223] For example, the first crack detection line PCDL1 can be disposed on the second protective layer 113b. The first crack detection line PCDL1 is disposed on the same layer as multiple first-1 connecting lines 121a and multiple second-1 connecting lines 122a and is formed of the same material, but is not limited thereto.

[0224] Reference Figure 10 and Figure 11E One end of the first crack detection line PCDL1 can be electrically connected to the signal transmitting pad electrode PE_T, and the other end of the first crack detection line PCDL1 can be electrically connected to the first signal receiving pad electrode PE_R1.

[0225] For example, refer to Figure 10 One end of the first crack detection line PCDL1 can be connected to the signal transmitting pad electrode PE_T via the second connecting line 122, and can be electrically connected to the flexible circuit board FCB via the signal transmitting pad electrode PE_T. Therefore, one end of the first crack detection line PCDL1 can receive crack detection signals from the flexible circuit board FCB via the signal transmitting pad electrode PE_T.

[0226] Reference Figure 11E The other end of the first crack detection line PCDL1 can be connected to the first signal receiving pad electrode PE_R1 via the second connecting line 122, and can be electrically connected to the flexible circuit board FCB via the first signal receiving pad electrode PE_R1. Therefore, the first crack detection line PCDL1 can send a crack detection signal to the flexible circuit board FCB via the first signal receiving pad electrode PE_R1.

[0227] Reference Figures 10 to 11EThe second crack detection line PCDL2 can be disposed on the third protective layer 114. The second crack detection line PCDL2 is disposed on the same layer as multiple first-second connecting lines 121b and multiple second-second connecting lines 122b and is formed of the same material, but is not limited thereto.

[0228] Reference Figure 10 and Figure 11D One end of the second crack detection line PCDL2 can be electrically connected to the signal transmitting pad electrode PE_T, and the other end of the second crack detection line PCDL2 can be electrically connected to the second signal receiving pad electrode PE_R2.

[0229] For example, refer to Figure 10 One end of the second crack detection line PCDL2 can be connected to the signal transmitting pad electrode PE_T via the second connecting line 122, and can also be electrically connected to the flexible circuit board FCB via the signal transmitting pad electrode PE_T. Therefore, the second crack detection line PCDL2 can receive crack detection signals from the flexible circuit board FCB via the signal transmitting pad electrode PE_T.

[0230] Furthermore, the second crack detection line PCDL2 can be connected to the same signal transmission pad electrode PE_T as the first crack detection line PCDL1. Therefore, one end of the second crack detection line PCDL2 is connected to the first crack detection line PCDL1 through a contact hole in the third protective layer 114, so that it is electrically connected to the signal transmission pad electrode PE_T via the first crack detection line PCDL1. For example, the second crack detection line PCDL2 can be connected to the second connecting line 122 via the first crack detection line PCDL1, and can also be connected to the signal transmission pad electrode PE_T via the second connecting line 122. Therefore, the second crack detection line PCDL2 is electrically connected to the flexible circuit board FCB via the signal transmission pad electrode PE_T to receive crack detection signals from the flexible circuit board FCB.

[0231] For example, the second connection line 122 connected to the signal transmitting pad electrode PE_T can electrically connect both the first crack detection line PCDL1 and the second crack detection line PCDL2 to the signal transmitting pad electrode PE_T.

[0232] Reference Figure 11DThe other end of the second crack detection line PCDL2 can be connected to the second connecting line 122 through the contact hole of the second protective layer 113b, and can be connected to the second signal receiving pad electrode PE_R2 through the second connecting line 122. Furthermore, the other end of the second crack detection line PCDL2 can be electrically connected to the flexible circuit board FCB through the second signal receiving pad electrode PE_R2. Therefore, the second crack detection line PCDL2 can send a crack detection signal to the flexible circuit board FCB through the second signal receiving pad electrode PE_R2.

[0233] In addition, the second connection line 122 that connects the second crack detection line PCDL2 and the second signal receiving pad electrode PE_R2 may be different from the second connection line that connects the first crack detection line PCDL1 and the first signal receiving pad electrode PE_R1.

[0234] Reference Figures 10 to 11E The third crack detection line PCDL3 can be disposed on the first insulating layer 115a. The third crack detection line PCDL3 is disposed on the same layer as multiple first-third connecting lines 121c and multiple second-third connecting lines 122c and formed of the same material, but is not limited thereto.

[0235] Reference Figure 10 and Figure 11C One end of the third crack detection line PCDL3 can be electrically connected to the signal transmitting pad electrode PE_T, and the other end of the third crack detection line PCDL3 can be electrically connected to the third signal receiving pad electrode PE_R3.

[0236] For example, refer to Figure 10 One end of the third crack detection line PCDL3 can be connected to the signal transmission pad electrode PE_T via the second connection line 122, and can also be electrically connected to the flexible circuit board FCB via the signal transmission pad electrode PE_T. Therefore, the third crack detection line can receive crack detection signals from the flexible circuit board FCB.

[0237] Furthermore, the third crack detection line PCDL3 can be connected to the same signal transmission pad electrode PE_T as the first crack detection line PCDL1 and the second crack detection line PCDL2. Therefore, one end of the third crack detection line PCDL3 is connected to the second crack detection line PCDL2 through a contact hole in the first insulating layer 115a, so that it can be electrically connected to the signal transmission pad electrode PE_T via the second crack detection line PCDL2. For example, the third crack detection line PCDL3 can be connected to the first crack detection line PCDL1 via the second crack detection line PCDL2, and can be connected to the second connecting line 122 via the first crack detection line PCDL1. Therefore, the third crack detection line PCDL3 can be connected to the signal transmission pad electrode PE_T via the second connecting line 122, and can be electrically connected to the flexible circuit board FCB via the signal transmission pad electrode PE_T to receive crack detection signals from the flexible circuit board FCB.

[0238] For example, the second connection line 122 connected to the signal transmission pad electrode PE_T can electrically connect the first crack detection line PCDL1, the second crack detection line PCDL2, and the third crack detection line PCDL3 to the signal transmission pad electrode PE_T.

[0239] Reference Figure 11C The other end of the third crack detection line PCDL3 can be connected to the third signal receiving pad electrode PE_R3 via the second connecting line 122, and can be electrically connected to the flexible circuit board FCB via the third signal receiving pad electrode PE_R3. Therefore, the third crack detection line PCDL3 can send crack detection signals to the flexible circuit board FCB via the third signal receiving pad electrode PE_R3.

[0240] In addition, the second connection line 122 that connects the third crack detection line PCDL3 and the third signal receiving pad electrode PE_R3 may be different from the second connection line that connects the first crack detection line PCDL1 and the first signal receiving pad electrode PE_R1, as well as the second connection line that connects the second crack detection line PCDL2 and the second signal receiving pad electrode PE_R2.

[0241] Reference Figures 10 to 11E The fourth crack detection line PCDL4 can be disposed on the second insulating layer 115b. The fourth crack detection line PCDL4 is disposed on the same layer as multiple first-fourth connecting lines 121d and multiple second-fourth connecting lines 122d and formed of the same material, but is not limited thereto.

[0242] Reference Figure 10 and Figure 11BOne end of the fourth crack detection line PCDL4 can be electrically connected to the signal transmitting pad electrode PE_T, and the other end of the fourth crack detection line PCDL4 can be electrically connected to the fourth signal receiving pad electrode PE_R4.

[0243] For example, refer to Figure 10 One end of the fourth crack detection line PCD14 can be connected to the signal transmission pad electrode PE_T via the second connection line 122, and can be electrically connected to the flexible circuit board FCB via the signal transmission pad electrode PE_T. Therefore, the fourth crack detection line PCDL4 can receive crack detection signals from the flexible circuit board FCB.

[0244] Furthermore, the fourth crack detection line PCDL4 can be connected to the same signal transmission pad electrode PE_T as the first crack detection line PCDL1, the second crack detection line PCDL2, and the third crack detection line PCDL3. Therefore, one end of the fourth crack detection line PCDL4 is connected to the third crack detection line PCDL3 through a contact hole in the second insulating layer 115b, so that it is electrically connected to the signal transmission pad electrode PE_T via the third crack detection line PCDL3. For example, the fourth crack detection line PCDL4 can be connected to the second crack detection line PCDL2 via the third crack detection line PCDL3, connected to the first crack detection line PCDL1 via the second crack detection line PCDL2, and connected to the second connection line 122 via the first crack detection line PCDL1. Therefore, the fourth crack detection line PCDL4 can be connected to the signal transmission pad electrode PE_T via the second connection line 122, and electrically connected to the flexible circuit board FCB via the signal transmission pad electrode PE_T to receive crack detection signals from the flexible circuit board FCB.

[0245] For example, the second connection line 122 connected to the signal transmission pad electrode PE_T can electrically connect the first crack detection line PCDL1, the second crack detection line PCDL2, the third crack detection line PCDL3, and the fourth crack detection line PCDL4 to the signal transmission pad electrode PE_T.

[0246] Reference Figure 11B The other end of the fourth crack detection line PCDL4 can be connected to the fourth signal receiving pad electrode PE_R4 via the second connecting line 122, and can be electrically connected to the flexible circuit board FCB via the fourth signal receiving pad electrode PE_R4. Therefore, the fourth crack detection line PCDL4 can send crack detection signals to the flexible circuit board FCB via the fourth signal receiving pad electrode PE_R4.

[0247] Furthermore, the second connection line 122 connecting the fourth crack detection line PCDL4 and the fourth signal receiving pad electrode PE_R4 may be different from the second connection line 122 connecting the first crack detection line PCDL1 and the first signal receiving pad electrode PE_R1, the second connection line 122 connecting the second crack detection line PCDL2 and the second signal receiving pad electrode PE_R2, and the second connection line 122 connecting the third crack detection line PCDL3 and the third signal receiving pad electrode PE_R3.

[0248] Reference Figures 10 to 11E The fifth crack detection line PCDL5 can be disposed on the third insulating layer 115c. The fifth crack detection line PCDL5 is disposed on the same layer as multiple signal lines TL and multiple pad electrodes PE and is formed of the same material, but is not limited thereto.

[0249] Reference Figure 10 and Figure 11A One end of the fifth crack detection line PCDL5 can be electrically connected to the signal transmitting pad electrode PE_T, and the other end of the fifth crack detection line PCDL5 can be electrically connected to the fifth signal receiving pad electrode PE_R5.

[0250] For example, refer to Figure 10 One end of the fifth crack detection line PCD15 can be connected to the signal transmission pad electrode PE_T via the second connection line 122, and can be electrically connected to the flexible circuit board FCB via the signal transmission pad electrode PE_T. Therefore, the fifth crack detection line PCDL5 can receive crack detection signals from the flexible circuit board FCB.

[0251] Furthermore, the fifth crack detection line PCDL5 can be connected to the same signal transmission pad electrode PE_T as the first crack detection line PCDL1, the second crack detection line PCDL2, the third crack detection line PCDL3, and the fourth crack detection line PCDL4. Therefore, one end of the fourth crack detection line PCDL4 is connected to the signal transmission pad electrode PE_T through a contact hole in the third insulating layer 115c. For example, the fifth crack detection line PCDL5 can be connected to the third crack detection line PCDL3 through the fourth crack detection line PCDL4, and can be connected to the second crack detection line PCDL2 through the third crack detection line PCDL3. The fifth crack detection line PCDL5 can be connected to the first crack detection line PCDL1 through the second crack detection line PCDL2, and can be connected to the second connection line 122 through the first crack detection line PCDL1. Therefore, the fifth crack detection line PCD15 is connected to the signal transmission pad electrode PE_T via the second connection line 122, and is electrically connected to the flexible circuit board FCB via the signal transmission pad electrode PE_T to receive crack detection signals from the flexible circuit board FCB.

[0252] For example, the second connection line 122 connected to the signal transmission pad electrode PE_T can electrically connect the first crack detection line PCDL1, the second crack detection line PCDL2, the third crack detection line PCDL3, the fourth crack detection line PCDL4, and the fifth crack detection line PCDL5 to the signal transmission pad electrode PE_T.

[0253] Reference Figure 11A The other end of the fifth crack detection line PCDL5 can be connected to the fifth signal receiving pad electrode PE_R5 via the second connecting line 122, and can be electrically connected to the flexible circuit board FCB via the fifth signal receiving pad electrode PE_R5. Therefore, the fifth crack detection line PCDL5 can send crack detection signals to the flexible circuit board FCB via the fifth signal receiving pad electrode PE_R5.

[0254] Furthermore, the second connection line 122 connecting the fifth crack detection line PCDL5 and the fifth signal receiving pad electrode PE_R5 may be different from the second connection line 122 connecting the first crack detection line PCDL1 and the first signal receiving pad electrode PE_R1, the second connection line 122 connecting the second crack detection line PCDL2 and the second signal receiving pad electrode PE_R2, the second connection line 122 connecting the third crack detection line PCDL3 and the third signal receiving pad electrode PE_R3, and the second connection line 122 connecting the fourth crack detection line PCDL4 and the fourth signal receiving pad electrode PE_R4.

[0255] For example, the second connection line 122 can be individually connected to multiple crack detection lines PCDL corresponding to multiple signal receiving pad electrodes PE_R.

[0256] During the manufacturing process of a display device, it may break due to external impacts. For example, the non-display area located at the edge of the display device is susceptible to breakage from external impacts. In this case, cracks formed in the non-display area may extend into the display area, allowing impurities to penetrate into the display area through the cracks, which reduces the reliability of the display device.

[0257] Therefore, various methods can be used to detect cracks in display devices. For example, crack detection lines connected to pad electrodes can be placed in non-display areas. Thus, the crack detection line's condition is determined based on feedback from the signal applied from the pad electrode to the crack detection line. For instance, whether a crack has occurred is determined by whether a crack detection signal input from a flexible circuit board or printed circuit board to a signal transmitting pad electrode is transmitted through the crack detection line to a signal receiving pad electrode, and then output through the signal receiving pad electrode to the flexible circuit board or printed circuit board. However, in this case, even if the crack detection line consists of multiple wires, if these wires are connected in parallel to the same signal transmitting pad electrode and the same signal receiving pad electrode, the signal output to the signal receiving pad electrode can be the same regardless of which wire cracks. Therefore, in this case, there is a problem that only whether the display device is cracked is detected, but not which wire (or which layer) is cracked.

[0258] Therefore, in the display device 1000 according to an exemplary embodiment of the present disclosure, one end of a plurality of crack detection lines PCDL can be connected to the same signal transmitting pad electrode PE_T. The other end of the plurality of crack detection lines PCDL can be connected to different signal receiving pad electrodes PE_R. At this time, for example, the timing controller of the flexible circuit board FCB can read whether each signal receiving pad electrode in the signal receiving pad electrode E_R has received a crack detection signal. Therefore, it is possible to determine whether each crack detection line in the plurality of crack detection lines PCDL is broken. Specifically, the plurality of crack detection lines may include a first crack detection line PCDL1, a second crack detection line PCDL2, a third crack detection line PCDL3, a fourth crack detection line PCDL4, and a fifth crack detection line PCDL5. At this time, the first crack detection line PCDL1 can send the crack detection signal applied from the signal transmitting pad electrode PE_T to the first signal receiving pad electrode PE_R1. Therefore, it is possible to detect whether the first crack detection line PCDL1 is broken by reading whether the first signal receiving pad electrode PE_R1 has received a crack detection signal. The second crack detection line PCDL2 sends the crack detection signal applied from the signal transmitting pad electrode PE_T to the second signal receiving pad electrode PE_R2. Therefore, whether the second crack detection line PCDL2 is broken can be detected by reading whether the second signal receiving pad electrode PE_R2 receives the crack detection signal. The third crack detection line PCDL3 sends the crack detection signal applied from the signal transmitting pad electrode PE_T to the third signal receiving pad electrode PE_R3. Therefore, whether the third crack detection line PCDL3 is broken can be detected by reading whether the third signal receiving pad electrode PE_R3 receives the crack detection signal. The fourth crack detection line PCDL4 sends the crack detection signal applied from the signal transmitting pad electrode PE_T to the fourth signal receiving pad electrode PE_R4. Therefore, whether the fourth crack detection line PCDL4 is broken can be detected by reading whether the fourth signal receiving pad electrode PE_R4 receives the crack detection signal. The fifth crack detection line PCDL5 sends the crack detection signal applied from the signal transmitting pad electrode PE_T to the fifth signal receiving pad electrode PE_R5. Therefore, whether the fifth crack detection line PCDL5 is broken can be detected by reading whether the fifth signal receiving pad electrode PE_R5 receives a crack detection signal. For example, in the display device 1000 according to an exemplary embodiment of the present disclosure, multiple crack detection lines PCDL are configured and connected to different signal receiving pad electrodes PE_R. Thus, it is possible to individually determine whether each crack detection line in the multiple crack detection lines PCDL has cracked. Therefore, not only can it be determined whether the display device 1000 is broken, but also the broken wiring can be identified, thereby improving the detectability of the breakage.Therefore, in the display device 1000 according to the exemplary embodiments of the present disclosure, cracks are accurately detected to minimize or reduce potential defects caused by cracks and improve the lifespan of the display device 1000, thereby improving reliability.

[0259] Figures 12 to 15 This is a diagram illustrating a device to which a display apparatus according to an exemplary embodiment of the present disclosure is applied.

[0260] Reference Figures 12 to 15 The display device 1000 according to an exemplary embodiment of the present disclosure may be included in various devices or electronic devices. For example, refer to Figures 12 to 15 Various electronic devices may include wearable devices 1100, mobile devices 1200, laptop computers 1300, and monitors or TVs 1400, but the exemplary embodiments disclosed herein are not limited thereto.

[0261] according to Figures 1 to 11E In the exemplary embodiments of the present disclosure described herein, each of the wearable device 1100, mobile device 1200, laptop computer 1300, and monitor or TV 1400 may include housing portions 1005, 1010, 1015, and 1020, as well as display panel 100 and display device 1000.

[0262] For example, the display device according to the exemplary embodiments of this disclosure can be applied to mobile devices, video phones, smartwatches, watch phones, wearable devices, foldable devices, rollable devices, bendable devices, flexible devices, bending devices, sliding devices, variable devices, electronic notebooks, e-books, portable multimedia players (PMPs), personal digital assistants (PDAs), MP3 players, mobile medical devices, desktop PCs, laptop PCs, netbooks, workstations, navigation systems, in-vehicle display devices, theater display devices, televisions, wallpaper devices, signage devices, game consoles, laptop computers, monitors, cameras, camcorders, home appliances, etc.

[0263] Exemplary embodiments of this disclosure can also be described as follows:

[0264] According to one aspect of this disclosure, a display device is provided, the display device comprising: a substrate including a display area and a non-display area adjacent to the display area; a plurality of insulating layers disposed on the substrate; a plurality of embankments disposed on the plurality of insulating layers in the display area; a plurality of light-emitting elements disposed on the embankments; a plurality of wirings disposed on different insulating layers in the plurality of insulating layers in the non-display area to surround the display area and at least partially overlapping each other; and a plurality of pad electrodes disposed on the plurality of insulating layers in the non-display area and electrically connected to the plurality of wirings. One end of each of the plurality of wirings is electrically connected to the same pad electrode among the plurality of pad electrodes, and the other end of each of the plurality of wirings is electrically connected to different pad electrodes among the plurality of pad electrodes.

[0265] One end of the plurality of wirings can be connected to each other through contact holes provided in the plurality of insulation layers.

[0266] The plurality of pad electrodes may include: a signal input pad electrode electrically connected to one end of the plurality of wirings; and a plurality of signal output pad electrodes electrically connected to the other end of the plurality of wirings, respectively.

[0267] The plurality of wirings may include: a first wiring; a second wiring disposed on the first wiring; a third wiring disposed on the second wiring; a fourth wiring disposed on the third wiring; and a fifth wiring disposed on the fourth wiring, and the plurality of signal output pad electrodes may include: a first signal output pad electrode electrically connected to the other end of the first wiring; a second signal output pad electrode electrically connected to the other end of the second wiring; a third signal output pad electrode electrically connected to the other end of the third wiring; a fourth signal output pad electrode electrically connected to the other end of the fourth wiring; and a fifth signal output pad electrode electrically connected to the other end of the fifth wiring.

[0268] The display device may further include: a pixel driving circuit disposed between the substrate and the plurality of insulating layers; a plurality of first-1 connecting lines disposed on the lowest insulating layer among the plurality of insulating layers in the display area and electrically connected to the pixel driving circuit; a plurality of first-2 connecting lines on the plurality of first-1 connecting lines; a plurality of first-3 connecting lines on the plurality of first-2 connecting lines; and a plurality of first-4 connecting lines on the plurality of first-3 connecting lines. The first wiring and the plurality of first-1 connecting lines are disposed on the same layer and formed of the same material, the second wiring and the plurality of first-2 connecting lines are disposed on the same layer and formed of the same material, the third wiring and the plurality of first-3 connecting lines are disposed on the same layer and formed of the same material, the fourth wiring and the plurality of first-4 connecting lines are disposed on the same layer and formed of the same material, and the fifth wiring and the plurality of pad electrodes are disposed on the same layer and formed of the same material.

[0269] The display device may further include: a plurality of second connecting lines, the second connecting lines connecting the plurality of pad electrodes to the plurality of wirings in the non-display area; wherein, some of the plurality of second connecting lines electrically connect the signal input pad electrode to all of the plurality of wirings, and the other of the plurality of second connecting lines individually electrically connect the signal output pad electrode to each of the plurality of wirings.

[0270] Each of the plurality of light-emitting elements may include: an anode electrode; a first semiconductor layer disposed on the anode electrode; an active layer disposed on the first semiconductor layer; a second semiconductor layer disposed on the active layer; and a cathode electrode disposed on the second semiconductor layer.

[0271] The display device may further include: a pixel driving circuit disposed between the substrate and the plurality of insulating layers; a first electrode disposed below the plurality of light-emitting elements to electrically connect the pixel driving circuit and the anode electrodes of the plurality of light-emitting elements; and a solder pattern disposed between the first electrode and the anode electrode. The first electrode and the anode electrode are electrically connected by eutectic bonding of the solder pattern.

[0272] The first electrode may include a first conductive layer disposed on the embankment, a second conductive layer disposed on the first conductive layer, a third conductive layer disposed on the second conductive layer, and a fourth conductive layer disposed on the third conductive layer. The second conductive layer may include a reflective material, and a portion of the upper surface of the second conductive layer is exposed by the third and fourth conductive layers.

[0273] Each of the plurality of wirings may be arranged along the periphery of the substrate.

[0274] According to another aspect of this disclosure, a display device is provided, the display device comprising: a substrate, the substrate including a display area, a first non-display area adjacent to the display area, a curved area extending from the first non-display area, and a second non-display area extending from the curved area; a plurality of insulating layers disposed on the substrate; a plurality of embankments disposed on the plurality of insulating layers in the display area; a plurality of light-emitting elements disposed on the embankments; a plurality of crack detection lines disposed on different insulating layers in the plurality of insulating layers in the first non-display area to surround the display area and at least partially overlapping each other; and a plurality of pad electrodes disposed on the plurality of insulating layers in the second non-display area and including signal transmitting pad electrodes and a plurality of signal receiving pad electrodes electrically connected to the plurality of crack detection lines.

[0275] Each of the multiple crack detection lines can be electrically connected to the same signal transmitting pad electrode, and each of the multiple crack detection lines can be electrically connected to different signal receiving pad electrodes among the multiple signal receiving pad electrodes.

[0276] The plurality of crack detection lines may include: a first crack detection line; a second crack detection line disposed on the first crack detection line; a third crack detection line disposed on the second crack detection line; a fourth crack detection line disposed on the third crack detection line; and a fifth crack detection line disposed on the fourth crack detection line. The plurality of signal receiving pad electrodes may include: a first signal receiving pad electrode electrically connected to the first crack detection line; a second signal receiving pad electrode electrically connected to the second crack detection line; a third signal receiving pad electrode electrically connected to the third crack detection line; a fourth signal receiving pad electrode electrically connected to the fourth crack detection line; and a fifth signal receiving pad electrode electrically connected to the fifth crack detection line.

[0277] The display device may further include: multiple connecting lines, the multiple connecting lines including multiple first connecting lines at least partially disposed in the first non-display area and the curved area and connecting the multiple pad electrodes and the multiple crack detection lines in the second non-display area; multiple second connecting lines disposed on the multiple first connecting lines; multiple third connecting lines disposed on the multiple second connecting lines; and multiple fourth connecting lines disposed on the multiple third connecting lines. The first crack detection lines and the multiple first connecting lines are disposed on the same layer and formed of the same material; the second crack detection lines and the multiple second connecting lines are disposed on the same layer and formed of the same material; the third crack detection lines and the multiple third connecting lines are disposed on the same layer and formed of the same material; the fourth crack detection lines and the multiple fourth connecting lines are disposed on the same layer and formed of the same material; and the fifth crack detection line and the multiple pad electrodes are disposed on the same layer and formed of the same material.

[0278] The multiple connecting lines can be respectively connected to the first crack detection line, the second crack detection line, the third crack detection line, the fourth crack detection line, and the fifth crack detection line in the first non-display area.

[0279] The multiple crack detection lines can be set in the area of ​​the first non-display area, excluding the portion of the first non-display area that extends into the second non-display area, to surround the display area.

[0280] The lengths of the multiple crack detection lines can be different from each other.

[0281] The multiple light-emitting elements can be miniature LEDs.

[0282] Although exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all respects and do not limit the present disclosure. All technical concepts within the equivalent scope of the present disclosure should be construed as falling within the scope of the present disclosure.

[0283] Cross-reference to related applications

[0284] This application claims the benefit and priority of Korean Patent Application No. 10-2024-0125778, filed on September 13, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference for all purposes as if fully set forth herein.

Claims

1. A display device, the display device comprising: A substrate, the substrate including a display area and a non-display area adjacent to the display area; Multiple insulating layers disposed on the substrate; Multiple embankments are disposed on the plurality of insulating layers in the display area; Multiple light-emitting elements are disposed on the embankment; Multiple wirings are arranged to surround the display area on different insulating layers among the multiple insulating layers in the non-display area, and at least partially overlap each other; as well as Multiple pad electrodes are disposed on the multiple insulating layers in the non-display area and electrically connected to the multiple wirings. In this configuration, one end of each of the multiple wirings is electrically connected to the same pad electrode among the multiple pad electrodes, and the other end of each of the multiple wirings is electrically connected to different pad electrodes among the multiple pad electrodes.

2. The display device according to claim 1, wherein, One end of the plurality of wirings is connected to each other through contact holes provided in the plurality of insulating layers.

3. The display device according to claim 1, wherein, The plurality of pad electrodes includes: A signal input pad electrode, the signal input pad electrode being electrically connected to one end of the plurality of wirings; and Multiple signal output pad electrodes are provided, and the multiple signal output pad electrodes are electrically connected to the other end of the multiple wirings respectively.

4. The display device according to claim 3, wherein, The multiple wirings include: First wiring; A second wiring is installed on the first wiring; A third wiring is installed on the second wiring; A fourth wiring is provided on the third wiring; and The fifth wiring is provided on the fourth wiring, and The plurality of signal output pad electrodes include: The first signal output pad electrode is electrically connected to the other end of the first wiring; The second signal output pad electrode is electrically connected to the other end of the second wiring; The third signal output pad electrode is electrically connected to the other end of the third wiring; A fourth signal output pad electrode, the fourth signal output pad electrode being electrically connected to the other end of the fourth wiring; and The fifth signal output pad electrode is electrically connected to the other end of the fifth wiring.

5. The display device according to claim 4, further comprising: A pixel driving circuit is disposed between the substrate and the plurality of insulating layers; Multiple first-1 connecting lines are disposed on the lowest insulating layer among the multiple insulating layers in the display area and are electrically connected to the pixel driving circuit; The multiple first-1 connecting lines and the multiple first-2 connecting lines; The multiple first-second connecting lines and the multiple first-third connecting lines; and The multiple connecting lines 1-4 on the multiple connecting lines 1-3, The first wiring and the plurality of first-1 connecting lines are disposed on the same layer and formed of the same material; the second wiring and the plurality of first-2 connecting lines are disposed on the same layer and formed of the same material; the third wiring and the plurality of first-3 connecting lines are disposed on the same layer and formed of the same material; the fourth wiring and the plurality of first-4 connecting lines are disposed on the same layer and formed of the same material; and the fifth wiring and the plurality of pad electrodes are disposed on the same layer and formed of the same material.

6. The display device according to claim 3, further comprising: Multiple second connection lines connect the multiple pad electrodes to the multiple wirings in the non-display area; Some of the multiple second connection lines electrically connect the signal input pad electrode to all of the multiple wirings, while the other multiple second connection lines electrically connect the signal output pad electrode to each of the multiple wirings individually.

7. The display device according to claim 1, wherein, Each of the plurality of light-emitting elements includes: Anode electrode; A first semiconductor layer disposed on the anode electrode; An active layer disposed on the first semiconductor layer; A second semiconductor layer disposed on the active layer; and A cathode electrode disposed on the second semiconductor layer.

8. The display device according to claim 7, further comprising: A pixel driving circuit is disposed between the substrate and the plurality of insulating layers; A first electrode is disposed below the plurality of light-emitting elements to electrically connect the pixel driving circuit and the anode electrode of the plurality of light-emitting elements; as well as A solder pattern is disposed between the first electrode and the anode electrode. The first electrode and the anode electrode are electrically connected by using eutectic bonding of the solder pattern.

9. The display device according to claim 8, wherein, The first electrode includes a first conductive layer disposed on the embankment, a second conductive layer disposed on the first conductive layer, a third conductive layer disposed on the second conductive layer, and a fourth conductive layer disposed on the third conductive layer. The second conductive layer includes a reflective material, and a portion of the upper surface of the second conductive layer is exposed by the third and fourth conductive layers.

10. The display device according to claim 1, wherein, Each of the plurality of wirings is arranged along the periphery of the substrate.

11. A display device, the display device comprising: A substrate, the substrate including a display area, a first non-display area adjacent to the display area, a curved area extending from the first non-display area, and a second non-display area extending from the curved area; Multiple insulating layers disposed on the substrate; Multiple embankments are disposed on the plurality of insulating layers in the display area; Multiple light-emitting elements are disposed on the embankment; Multiple crack detection lines are arranged to surround the display area on different insulating layers among the multiple insulating layers in the first non-display area, and to at least partially overlap with each other; as well as Multiple pad electrodes are disposed on multiple insulating layers in the second non-display area, and include signal transmitting pad electrodes and multiple signal receiving pad electrodes electrically connected to the multiple crack detection lines.

12. The display device according to claim 11, in, Each of the multiple crack detection lines is electrically connected to the same signal transmitting pad electrode, and each of the multiple crack detection lines is electrically connected to a different signal receiving pad electrode among the multiple signal receiving pad electrodes.

13. The display device according to claim 11, wherein, The multiple crack detection lines include: First crack detection line; A second crack detection line is set on the first crack detection line; A third crack detection line is set on the second crack detection line; A fourth crack detection line is set on the third crack detection line; and A fifth crack detection line is set on the fourth crack detection line, and The plurality of signal receiving pad electrodes include: The first signal receiving pad electrode is electrically connected to the first crack detection line; The second signal receiving pad electrode is electrically connected to the second crack detection line; The third signal receiving pad electrode is electrically connected to the third crack detection line; The fourth signal receiving pad electrode is electrically connected to the fourth crack detection line; and Electrically connected to the fifth signal receiving pad electrode of the fifth crack detection line.

14. The display device according to claim 13, further comprising: Multiple connecting lines, the multiple connecting lines including multiple first connecting lines at least partially disposed in the first non-display area and the curved area and connecting the multiple pad electrodes and the multiple crack detection lines in the second non-display area, multiple second connecting lines disposed on the multiple first connecting lines, multiple third connecting lines disposed on the multiple second connecting lines, and multiple fourth connecting lines disposed on the multiple third connecting lines. The first crack detection line and the plurality of first connecting lines are disposed on the same layer and formed of the same material; the second crack detection line and the plurality of second connecting lines are disposed on the same layer and formed of the same material; the third crack detection line and the plurality of third connecting lines are disposed on the same layer and formed of the same material; the fourth crack detection line and the plurality of fourth connecting lines are disposed on the same layer and formed of the same material; and the fifth crack detection line and the plurality of pad electrodes are disposed on the same layer and formed of the same material.

15. The display device according to claim 14, wherein, The multiple connecting lines are respectively connected to the first crack detection line, the second crack detection line, the third crack detection line, the fourth crack detection line, and the fifth crack detection line in the first non-display area.

16. The display device according to claim 11, wherein, The multiple crack detection lines are arranged in the area of ​​the first non-display area, excluding the portion of the first non-display area that extends into the second non-display area, to surround the display area.

17. The display device according to claim 11, wherein, The lengths of the multiple crack detection lines are different from each other.

18. The display device according to claim 11, wherein, The multiple light-emitting elements are miniature LEDs.

Images