Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device, the display panel comprises a display area and a non-display area located on at least one side of the display area, and the display panel comprises a substrate, and an isolation structure, a first signal line, a protection layer, at least one blocking dam and a plurality of light emitting devices which are located on the substrate. At least part of the isolation structure is located in the display area, multiple isolation openings located in the display area are defined by the isolation structure, at least part of the light-emitting device is located in the isolation openings, the blocking dam is located in the non-display area, at least part of the first signal line is located in the non-display area, and the blocking dam is located between the first signal line and the substrate. The first signal line comprises a first opening, the orthographic projection of the first opening on the substrate is located in the orthographic projection of the at least one blocking dam on the substrate, and the protective layer is located on the side, away from the substrate, of the first signal line and covers the first opening. In the display panel, the protection layer can seal the first opening to avoid packaging failure of the display panel.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, specifically to a display panel and its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are organic thin-film electroluminescent devices. They have attracted great attention and are widely used in electronic display products due to their advantages such as simple fabrication process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display capability.

[0003] However, current electronic display products are limited by their structural design, making it difficult to achieve high packaging quality while maintaining a high pixel density (PPI). Summary of the Invention

[0004] This disclosure provides a display panel including a display area and a non-display area located on at least one side of the display area. The display panel includes a substrate and an isolation structure, a first signal line, a protective layer, at least one blocking dam, and a plurality of light-emitting devices located on the substrate. At least a portion of the isolation structure is located in the display area, and the isolation structure encloses to form a plurality of isolation openings in the display area. At least a portion of the light-emitting devices is located in the isolation openings. The blocking dam is located in the non-display area. At least a portion of the first signal line is located in the non-display area, and the blocking dam is located between the first signal line and the substrate. The first signal line includes a first opening, and the orthographic projection of the first opening on the substrate is located within the orthographic projection of at least one blocking dam on the substrate. The protective layer is located on the side of the first signal line opposite to the substrate and covers the first opening.

[0005] In the above scheme, the first opening is used to release gas in the substrate, and the protective layer can seal the first opening to prevent water, gas and other substances from entering the substrate through the first opening in subsequent manufacturing processes, and from escaping through the first opening during the verification or use of the display panel, which would cause the display panel packaging to fail.

[0006] In one specific embodiment of the first aspect of this disclosure, the protective layer is an inorganic film layer. The inorganic film layer has high density, thereby improving the sealing effect on the first opening.

[0007] In one specific embodiment of the first aspect of this disclosure, the display panel may further include a pixel defining layer extending from the display area to the non-display area. In the non-display area, the pixel defining layer is located between the first signal line and the blocking dam and includes a second opening. The orthographic projection of the second opening on the substrate at least partially overlaps with the orthographic projection of the first opening on the substrate and is located within the orthographic projection of at least one blocking dam on the substrate.

[0008] In the above scheme, the second opening is used to release gas in the substrate, and the protective layer can seal the second opening to prevent water, gas and other substances from entering the substrate through the second opening in subsequent manufacturing processes, and from escaping through the second opening during the verification or use of the display panel, which would cause the display panel packaging to fail.

[0009] Optionally, the pixel defining layer includes pixel openings corresponding to the isolation openings, with at least a portion of the light-emitting device located within the pixel openings.

[0010] Optionally, the pixel defining layer is an inorganic film layer. In the process of fabricating light-emitting devices based on the isolation structure, the pixel defining layer does not need to be thick enough to accommodate the light-emitting device, which is beneficial for the thinner and lighter design of the display panel. In addition, as an inorganic film layer, the pixel defining layer can have a high bonding strength with the isolation structure (and also with the first electrode described below), thereby reducing the risk of the isolation structure and the first electrode falling off. Furthermore, the high density of the inorganic film layer can more effectively block the intrusion of water, oxygen, etc., thereby improving the encapsulation effect of the display panel.

[0011] In one specific embodiment of the first aspect of this disclosure, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked on a substrate, and at least a portion of the light-emitting functional layer of the light-emitting device is located in a corresponding isolation opening.

[0012] Optionally, the second electrode is electrically connected to the isolation structure, that is, the second electrodes of multiple light-emitting devices are connected to each other through the isolation structure to serve as a common electrode, thereby alleviating the voltage drop problem generated when driving the second electrode.

[0013] In one specific embodiment of the first aspect of this disclosure, at least a portion of the first signal line and the first electrode are made of the same material. This reduces the manufacturing cost of the display panel.

[0014] In one specific embodiment of the first aspect of this disclosure, the substrate includes a substrate and a first planarization layer located on the substrate between the substrate and a first electrode. The first planarization layer can provide a relatively flat surface for the first electrode to improve the quality of the first electrode.

[0015] Optionally, at least a portion of the barrier dam is co-layered and made of the same material as the first planarization layer. This allows at least a portion of the barrier dam to be fabricated simultaneously during the fabrication of the first planarization layer, simplifying the display panel fabrication process.

[0016] In one specific embodiment of the first aspect of this disclosure, the substrate further includes a second planarization layer extending from the display area to the non-display area. In the display area, the second planarization layer is located between the first planarization layer and the substrate, and in the non-display area, the second planarization layer is located between a barrier dam and the substrate.

[0017] In one specific embodiment of the first aspect of this disclosure, the display panel includes a second signal line extending from a display area to a non-display area and located between a first planarization layer and a second planarization layer. The second planarization layer can planarize the circuit structure in the substrate to provide a flat surface to the second signal line, thereby improving the quality of the second signal line.

[0018] Optionally, the second signal line includes a third opening, the orthographic projection of which onto the substrate lies within the orthographic projection of the barrier dam onto the substrate, and the barrier dam is connected to the second planarization layer through the third opening. In the above solution, the third opening is used to release gas from the substrate. After setting the protective layer, water, gas, etc., can be prevented from entering the substrate through the third opening during subsequent manufacturing processes, and from escaping through the third opening during the verification or use of the display panel, thus preventing the display panel packaging from failing.

[0019] In one specific embodiment of the first aspect of this disclosure, the isolation structure includes a support portion and a crown portion. The support portion is located between the crown portion and a substrate, and the orthographic projection of the surface of the support portion away from the substrate onto the substrate lies within the orthographic projection of the crown portion onto the substrate. Thus, the width of the crown portion is greater than the width of the support portion, thereby improving the isolation effect of the isolation structure.

[0020] Optionally, the support portion is a conductive structure, and the second electrode is connected to the side surface of the support portion. The support portion does not need to consider light transmission, thus allowing for a larger design thickness (greater than the second electrode). That is, the sheet resistance of the support portion is less than the sheet resistance of the second electrode. In this design, the support portion can be connected to the second electrode of the light-emitting device to achieve a common potential, thereby reducing the voltage drop generated on the second electrode.

[0021] Optionally, the isolation structure is located on the side of the pixel defining layer away from the substrate.

[0022] In one specific embodiment of the first aspect of this disclosure, the isolation structure further includes a bottom located between the support and the substrate, wherein the orthographic projection of the support on the substrate is located within the orthographic projection of the bottom on the substrate.

[0023] Optionally, the bottom is a conductive structure, and the second electrode is electrically connected to the portion of the bottom surface facing away from the substrate that is not covered by the support portion. Compared to the sidewalls of the support portion, the second electrode is more easily deposited on the surface area of ​​the bottom facing away from the substrate, thereby reducing the impedance at the connection between the second electrode and the isolation structure.

[0024] Optionally, the orthographic projection of the bottom on the substrate lies within the orthographic projection of the crown on the substrate.

[0025] In one specific embodiment of the first aspect of this disclosure, the display panel may further include a first encapsulation layer located on the side of the light-emitting device and the isolation structure away from the substrate, and covering the isolation opening.

[0026] Optionally, the first encapsulation layer includes a plurality of encapsulation units corresponding to the isolation openings, and the encapsulation units cover the light-emitting devices defined by the corresponding isolation openings.

[0027] Optionally, the packaging units corresponding to adjacent light-emitting devices with different light-emitting colors are spaced apart from each other.

[0028] In one specific embodiment of the first aspect of this disclosure, at least two blocking dams are provided, and the at least two blocking dams include a first blocking dam and a second blocking dam. The first blocking dam is located between the display area and the second blocking dam, and the orthographic projection of the first opening on the substrate is located within the orthographic projection of the first blocking dam on the substrate.

[0029] In one specific embodiment of the first aspect of this disclosure, the display panel may further include a second encapsulation layer extending from the display area to the non-display area, wherein at least a portion of the first barrier dam's orthographic projection on the substrate lies within the orthographic projection of the second encapsulation layer on the substrate and is connected to the second encapsulation layer through a first opening, the second encapsulation layer being located on the side of the second barrier dam facing the display area.

[0030] During the fabrication of the second encapsulation layer, water and gas are introduced. Without the barrier of a protective layer, the water and gas may enter the barrier through the first opening, or even further enter the substrate (e.g., through the aforementioned third opening). During subsequent display panel verification or use, the intruded water and gas will escape through the first opening, causing the second encapsulation layer or other encapsulation structures (e.g., the third encapsulation layer described below) to fail. The water and gas may even further enter the light-emitting device, resulting in poor display of the display panel. By setting a protective layer, this problem can be solved.

[0031] In the above scheme, the second barrier dam blocks the material used to prepare the second encapsulation layer during the preparation of the second encapsulation layer, so as to define the boundary of the second encapsulation layer.

[0032] Optionally, the second encapsulation layer is an organic film layer.

[0033] In one specific embodiment of the first aspect of this disclosure, the display panel may further include a third encapsulation layer that extends from the display area to the non-display area and is located on the side of the second encapsulation layer opposite to the substrate, wherein the orthographic projection of the second encapsulation layer on the substrate is within the orthographic projection of the third encapsulation layer on the substrate.

[0034] Optionally, the third encapsulation layer is an inorganic film layer.

[0035] A second aspect of this disclosure provides a display panel including a display area and a non-display area located on at least one side of the display area. The display panel further includes a substrate and a second encapsulation layer, a protective layer, a plurality of light-emitting devices, and at least one barrier dam located on the substrate. The light-emitting devices are located on the substrate and in the display area, the barrier dam is located on the substrate and in the non-display area, the second encapsulation layer extends from the display area to the non-display area and covers at least one barrier dam, and the protective layer is located on the second encapsulation layer and the barrier dam covered by the second encapsulation layer.

[0036] In the above scheme, the protective layer can block the second encapsulation layer to prevent water and gas from entering the barrier during the preparation of the second encapsulation layer, thereby preventing the display panel from failing due to water and gas escaping from the barrier during verification or use.

[0037] In one embodiment of the second aspect of this disclosure, the display panel may further include a first signal line located on a substrate and at least a portion of the first signal line located in a non-display area, wherein a barrier dam is located between the first signal line and the substrate, the first signal line includes a first opening, the orthographic projection of the first opening on the substrate being located within the orthographic projection of at least one barrier dam on the substrate, and a protective layer is located on the side of the first signal line opposite to the substrate and covers the first opening.

[0038] Optionally, the display panel further includes an isolation structure located on the substrate and at least partially located in the display area. The isolation structure encloses and forms a plurality of isolation openings located in the display area, and at least a portion of the light-emitting device is located in the isolation openings.

[0039] Optionally, the protective layer is an inorganic film layer.

[0040] Optionally, the second encapsulation layer is an organic film layer.

[0041] Optionally, the display panel further includes a pixel defining layer extending from the display area to the non-display area. In the non-display area, the pixel defining layer is located between the first signal line and the blocking dam and includes a second opening. The orthographic projection of the second opening on the substrate at least partially overlaps with the orthographic projection of the first opening on the substrate and is located within the orthographic projection of at least one blocking dam on the substrate.

[0042] Optionally, the pixel defining layer includes pixel openings corresponding to the isolation openings, with at least a portion of the light-emitting device located within the pixel openings.

[0043] Optionally, the pixel defining layer is an inorganic film layer.

[0044] This disclosure discloses a method for fabricating a display panel, the method comprising: providing a substrate and dividing a display area and a non-display area located on at least one side of the display area on the substrate; forming at least one barrier dam in the non-display area; forming a plurality of spaced-apart first electrodes in the display area and forming first signal lines in the non-display area, wherein a first opening is formed in the first signal line, and the orthographic projection of the first opening on the substrate lies within the orthographic projection of the at least one barrier dam on the substrate; forming an isolation structure on the substrate on which the first electrodes are formed, wherein at least a portion of the isolation structure is formed in the display area, and the isolation structure encloses a plurality of isolation openings located in the display area; depositing a protective material film layer and performing a patterning process on the protective material film layer to form a protective layer in the non-display area, wherein the protective layer forms the side of the first signal lines opposite to the substrate and covers the first openings; fabricating a light-emitting functional layer and a second electrode located in the isolation openings based on the isolation structure, wherein the first electrode, the light-emitting functional layer and the second electrode stacked on each other in each isolation opening constitute a light-emitting device. In the display panel obtained by this preparation method, the first opening is used to release gas in the substrate, and the protective layer can seal the first opening to prevent water, gas and other substances from entering the substrate through the first opening in subsequent preparation processes and escaping through the first opening during the verification or use of the display panel, which would cause the display panel encapsulation to fail.

[0045] In one specific embodiment of the third aspect of this disclosure, the fabrication of a light-emitting functional layer and a second electrode located in an isolation opening based on an isolation structure includes: depositing a light-emitting material thin film and a conductive material thin film, the light-emitting material thin film and the conductive material thin film covering the isolation structure and the isolation opening, wherein the portions of the light-emitting material thin film and the conductive material thin film located in the isolation opening respectively form the light-emitting functional layer and the second electrode; depositing an encapsulation material film layer to cover the light-emitting device; forming a photoresist layer on the encapsulation material film layer, and performing a patterning process on the photoresist layer to form a photoresist pattern, the photoresist pattern covering a portion of the isolation opening; etching the encapsulation material film layer, the light-emitting material thin film and the conductive material thin film based on the photoresist pattern, wherein the remaining portion of the encapsulation material film layer forms an encapsulation unit, and the light-emitting functional layer and the second electrode not covered by the encapsulation unit are etched; repeating the above process to form a light-emitting device and an encapsulation unit at the isolation opening where no light-emitting device is formed, all encapsulation units constituting a first encapsulation layer.

[0046] In one specific embodiment of the third aspect of this disclosure, the substrate includes a substrate and a first planarization layer located on the substrate, wherein the step of forming at least one barrier dam in a non-display area may include: forming a planarization film layer on the substrate and performing a patterning process on the planarization film layer such that the portion of the planarization film layer located in the display area is formed as the first planarization layer, and the portion of the planarization film layer located in the non-display area is formed as at least a portion of the barrier dam.

[0047] In one specific embodiment of the third aspect of this disclosure, the preparation method may further include: depositing a pixel defining material film layer before forming the isolation structure and after forming the first electrode, the pixel defining material film layer extending from the display area to the non-display area and covering the barrier dam; performing a patterning process on the pixel defining material film layer to form a pixel defining layer, wherein a pixel opening and a second opening are formed in the pixel defining layer, the orthographic projection of the second opening on the substrate at least partially overlaps with the orthographic projection of the first opening on the substrate and is located within the orthographic projection of at least one barrier dam on the substrate, the pixel opening and the isolation opening respectively correspond to expose at least a portion of the first electrode.

[0048] In one specific embodiment of the third aspect of this disclosure, at least two barrier dams are formed, and the at least two barrier dams include a first barrier dam and a second barrier dam, the first barrier dam being located between the display area and the second barrier dam, and the orthographic projection of the first opening on the substrate being located within the orthographic projection of the first barrier dam on the substrate.

[0049] In one specific embodiment of the third aspect of this disclosure, the preparation method further includes: forming an organic encapsulation material on the side of the first encapsulation layer away from the substrate to form a second encapsulation layer, wherein the second encapsulation layer extends from the display area to the non-display area to cover the first encapsulation layer and the barrier dam, the second encapsulation layer is connected to the barrier dam through a first opening, and the second encapsulation layer is formed on the side of the second barrier dam facing the display area.

[0050] Optionally, the second encapsulation layer is an organic film layer.

[0051] Optionally, the method for forming the second encapsulation layer includes inkjet printing.

[0052] The fourth aspect of this disclosure is a display device, which includes the display panel described in the first or second aspect above, or a display panel obtained by the preparation method described in the third aspect above. Attached Figure Description

[0053] Figure 1 This is a schematic diagram of the planar structure of a display panel provided in one embodiment of the present disclosure.

[0054] Figure 2 for Figure 1 The image shows an enlarged view of area S1 of the display panel in one design.

[0055] Figure 3A for Figure 2 The diagram shows a cross-sectional view of the display panel along M2-N2 in one design.

[0056] Figure 3B In order to be in Figure 1 The diagram shows a cross-sectional view of the display panel along M1-N1 under one design. Figure 3B and Figure 3A The corresponding display panel is shown.

[0057] Figure 4A for Figure 2 The diagram shows a cross-sectional view of the display panel along M2-N2 in another design.

[0058] Figure 4B In order to be in Figure 1 The diagram shows a cross-sectional view of the display panel along M1-N1 in another design. Figure 4B and Figure 4A The corresponding display panel is shown.

[0059] Figure 5A for Figure 2 The diagram shows a cross-sectional view of the display panel along M2-N2 in another design.

[0060] Figure 5B In order to be in Figure 1 The diagram shows a cross-sectional view of the display panel along M1-N1 in another design. Figure 5B and Figure 5A The corresponding display panel is shown.

[0061] Figure 6A for Figure 2 The diagram shows a cross-sectional view of the display panel along M2-N2 in another design.

[0062] Figure 6B In order to be in Figure 1 The cross-sectional view of the display panel along M1-N1 shown in Figure 6 is an alternative design. Figure 6A The corresponding display panel is shown.

[0063] Figure 7A This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure.

[0064] Figure 7B A flowchart illustrating another method for manufacturing a display panel according to an embodiment of this disclosure.

[0065] Figure 8A , 8B , Figure 9A , Figure 9B , Figure 10A , Figure 10B and Figures 11 to 14 An embodiment of this disclosure provides a method for forming such Figure 3A and Figure 3B The diagram shows a process diagram of one method for manufacturing a display panel.

[0066] Explanation of reference numerals in the attached figures:

[0067] 10-Display panel; 11-Display area; 12-Non-display area; 100-Substrate; 111-First signal line; 112-Second signal line; 121-First planarization layer; 122-Second planarization layer; 130-Third signal line; 200-Light-emitting device; 210-First electrode; 220-Light-emitting functional layer; 221-First functional layer; 222-Light-emitting layer; 223-Second functional layer; 230-Second electrode; 300-Isolation structure; 301-Isolation opening; 302-Pixel opening; 310 - Support portion; 320 - Crown portion; 330 - Pixel defining layer; 330a - Pixel defining material layer; 340 - Bottom; 400 - Encapsulation structure; 410 - First encapsulation layer; 410a - Encapsulation material film layer; 411 - Encapsulation unit; 420 - Second encapsulation layer; 430 - Third encapsulation layer; 500 - Barrier dam; 510 - First barrier dam; 520 - Second barrier dam; 501 - First opening; 502 - Second opening; 503 - Third opening; 600 - Protective layer; 700 - Photoresist pattern. Detailed Implementation

[0068] The technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this specification.

[0069] In some scenarios, functional films in light-emitting devices are formed by vapor deposition. Each light-emitting device has multiple functional films, and the material composition of some functional films (such as the light-emitting layer) in light-emitting devices that emit different light is different. Therefore, when vapor deposition of these functional films using a mask (such as a fine mask), multiple alignments are required. To solve the positional offset problem caused by alignment accuracy errors, sufficient space (a safety margin related to alignment errors) needs to be reserved between different light-emitting devices to ensure that the actual light-emitting area of ​​the light-emitting device can have a certain overlap with the designed position (design area). This is equivalent to compressing the designed area of ​​the light-emitting area of ​​the light-emitting device, which not only limits the light-emitting area of ​​the light-emitting device, but also prevents the arrangement density of the light-emitting devices from being further increased, thus making it difficult to further improve the PPI (pixel density) of the display panel.

[0070] In the embodiments of this disclosure, by providing an isolation structure at the gap between the light-emitting devices, the functional film layers of adjacent light-emitting devices are separated. Thus, in the evaporation process of the functional film layers, only the entire display panel needs to be evaporated, without the need to individually prepare the functional film layer for each light-emitting device using a mask. This process does not require consideration of alignment accuracy during evaporation, thereby allowing the gaps between the light-emitting devices to be designed to be smaller, increasing the PPI (the principle of which can be found in the following...). Figures 8A to 14 (Related descriptions in the relevant embodiments).

[0071] It should be noted that during the fabrication of display panels, some film layers may contain water or gas, necessitating the creation of openings to release these substances. However, during the fabrication of light-emitting devices based on the aforementioned isolation structure, the fabrication process may generate new water or gas that can re-enter the film layers through these openings. In display panel verification or usage scenarios, this water or gas may escape from the film layers again through these openings, potentially leading to display panel encapsulation failure or even display malfunction. For the principles of creating openings to release water or gas, and the risk of water or gas entering the internal film layers of the display panel through these openings during the fabrication of light-emitting devices based on the isolation structure, please refer to [link to relevant documentation]. Figures 8A to 14 The relevant descriptions in the illustrated embodiments will not be repeated here.

[0072] This disclosure provides at least one embodiment of a display panel, a method for manufacturing the same, and a display device to at least solve the aforementioned technical problems. The display panel includes a display area and a non-display area located on at least one side of the display area. The display panel includes a substrate and an isolation structure, a first signal line, a protective layer, at least one barrier dam, and multiple light-emitting devices located on the substrate. At least a portion of the isolation structure is located in the display area, forming multiple isolation openings within the display area. At least a portion of the light-emitting devices are located within the isolation openings. The barrier dam is located in the non-display area. At least a portion of the first signal line is located in the non-display area, and the barrier dam is located between the first signal line and the substrate. The first signal line includes a first opening, and the orthographic projection of the first opening onto the substrate lies within the orthographic projection of the at least one barrier dam onto the substrate. The protective layer is located on the side of the first signal line opposite to the substrate and covers the first opening. In this display panel, the first opening is used to release gas from the substrate, and the protective layer can seal the first opening to prevent water, gas, etc., from entering the substrate through the first opening during subsequent manufacturing processes and escaping through the first opening during verification or use of the display panel, thus causing the display panel packaging to fail.

[0073] The structure of a display panel according to at least one embodiment of the present disclosure will now be described in detail with reference to the accompanying drawings. Furthermore, in these drawings, a spatial rectangular coordinate system is established with the substrate as a reference to more intuitively present the positional relationships of the relevant structures in the display panel. In this spatial rectangular coordinate system, the X-axis and Y-axis are parallel to the plane of the substrate, and the Z-axis is perpendicular to the plane of the substrate.

[0074] like Figure 1 , Figure 2 , Figure 3A and Figure 3B As shown, the planar area of ​​the display panel 10 can be divided into a display area 11 and a non-display area 12 located on at least one side of the display area 11. Sub-pixels (also called sub-pixels, etc.) can be arranged in the display area 11, such as P1, P2, P3 sub-pixels. The physical structure of the sub-pixel can be the light-emitting device in the following embodiment. Adjacent sub-pixels with different emitted light colors constitute a pixel (also called a pixel unit, large pixel, etc.). The arrangement density of the pixel in the display area 11 represents the pixel density PPI.

[0075] It should be noted that the non-display area 12 can represent the bezel of the display panel, but a bending area can be provided in the non-display area 12 so that at least part of the non-display area 12 bends to the back of the display panel, thereby making the display panel appear as a narrow bezel or a bezel-less panel when in use.

[0076] The physical structure of the display panel 10 includes a substrate 100 and an isolation structure 300, a first signal line 111, a protective layer 600, at least one barrier dam 500, and a plurality of light-emitting devices 200 located on the substrate 100. At least a portion of the isolation structure 300 is located in the display area 11, and the isolation structure 300 encloses and forms a plurality of isolation openings 301 located in the display area 11. At least a portion of the light-emitting devices 200 is located in the isolation openings 301. The barrier dam 500 is located in the non-display area 12. At least a portion of the first signal line 111 is located in the non-display area 12. The barrier dam 500 is located between the first signal line 111 and the substrate 100. The first signal line 111 includes a first opening 501. The orthographic projection of the first opening 501 on the substrate 100 is located within the orthographic projection of at least one barrier dam 500 on the substrate 100. The protective layer 600 is located on the side of the first signal line 111 facing away from the substrate 100 and covers the first opening 501.

[0077] In this display panel 10, the first opening 501 is used to release gas from the substrate 100, while the protective layer 600 can seal the first opening 501 to prevent water, gas, etc. from entering the substrate 100 through the first opening 501 during subsequent manufacturing processes and escaping through the first opening 501 during the verification or use of the display panel, thus causing the display panel encapsulation to fail. For example, if the light-emitting devices 200 are of various types that emit different colors of light, the light-emitting devices 200 emitting different colors of light are manufactured independently, but the film layer (evaporated film layer, such as the light-emitting functional layer, etc.) in each light-emitting device 200 is deposited on the entire surface of the display panel during evaporation. For example, the light-emitting device 200 is classified into three types: a first type (P1), a second type (P2), and a third type (P3) that emit light of different colors. During the fabrication process, light-emitting devices P1, P2, and P3 are fabricated sequentially. When fabricating light-emitting device P1, a light-emitting device P1 is formed in each isolation opening 301. Then, the second electrode and light-emitting functional layer of the light-emitting device P1 in some of the isolation openings 301 (used to form light-emitting devices P2 and P3 in the final product) are removed. Based on this method, light-emitting devices P2 and P3 are then fabricated sequentially, ultimately forming the first encapsulation layer 410 as shown in Figure 3. This process can be seen below. Figures 8A to 14 The relevant descriptions in the embodiments are not repeated here. In the above process, etching processes (including cleaning processes) are used. If the protective layer 600 does not seal the first opening 501, this process may lead to the risk of water, air, etc. entering the barrier dam 500 through the first opening 501.

[0078] For example, the first type of light-emitting device (P1), the second type of light-emitting device (P2) and the third type of light-emitting device (3) can emit red light, green light and blue light respectively (regardless of order).

[0079] It should be noted that the composition and preparation of the isolation structure 300 (which may be called a partition structure or isolation column) can be found in the relevant descriptions in patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, 202311499823.9, 202310692671.8, and 202311091555.7, and will not be repeated here.

[0080] In at least one embodiment of this disclosure, the protective layer 600 is an inorganic film layer. The inorganic film layer has high density, thereby improving the sealing effect on the first opening 501.

[0081] In at least one embodiment of this disclosure, such as Figure 3A and Figure 3B As shown, the display panel may further include a pixel defining layer 330, which extends from the display area 11 to the non-display area 12. In the non-display area 12, the pixel defining layer 330 is located between the first signal line 111 and the barrier dam 500 and includes a second opening 502. The orthographic projection of the second opening 502 on the substrate 100 at least partially overlaps with the orthographic projection of the first opening 501 on the substrate 100, and is located within the orthographic projection of at least one barrier dam 500 on the substrate 100. The second opening 502 is used to release gas in the substrate 100, and the protective layer 600 can seal the second opening 502 to prevent water, gas, etc., from entering the substrate 100 through the second opening 502 during subsequent manufacturing processes and escaping through the second opening 502 during the verification or use of the display panel, thus causing the display panel packaging to fail.

[0082] For example, the pixel defining layer 330 includes pixel openings 302 that correspond to the isolation openings 301 respectively, and at least a portion of the light-emitting device 200 is located in the pixel openings 302.

[0083] For example, the pixel defining layer 330 is an inorganic film layer. In the process of fabricating the light-emitting device 200 based on the isolation structure 300, the pixel defining layer 330 does not need to be thick enough to accommodate the light-emitting device 200, which is beneficial for the thinner and lighter design of the display panel. In addition, as an inorganic film layer, the pixel defining layer 330 can have a high bonding strength with the isolation structure 300 (and also with the first electrode 210 described below), which reduces the risk of the isolation structure 300 and the first electrode 210 falling off. Furthermore, the high density of the inorganic film layer can more effectively block the intrusion of water, oxygen, etc., thereby improving the encapsulation effect of the display panel.

[0084] In at least one embodiment of this disclosure, such as Figure 3A and Figure 3B As shown, the light-emitting device 200 includes a first electrode 210, a light-emitting functional layer 220 and a second electrode 230 stacked sequentially on a substrate 100, and at least a portion of the light-emitting functional layer 220 of the light-emitting device 200 is located in a corresponding isolation opening 301.

[0085] For example, the light-emitting functional layer 220 may further include a first functional layer 221, a light-emitting layer 222, and a second functional layer 223, which are sequentially stacked on the first electrode 210. The first functional layer 221 may include a hole injection layer, a hole transport layer, an electron blocking layer, etc. The second functional layer 223 may include an electron injection layer, an electron transport layer, a hole blocking layer, etc. It should be noted that since charge carriers (holes and electrons) mainly crosstalk between adjacent light-emitting devices 200 through the first functional layer 221, the isolation structure 300 needs to ensure that the first functional layers 221 of each light-emitting device 200 are electrically disconnected from each other.

[0086] For example, in at least one embodiment of this disclosure, the first electrode 210 may be configured as an anode and the second electrode 230 may be configured as a cathode.

[0087] For example, the second electrode 230 is electrically connected to the isolation structure 300, that is, the second electrodes 230 of multiple light-emitting devices 200 are connected to each other through the isolation structure 300 to serve as a common electrode, thereby alleviating the voltage drop problem generated when driving the second electrode 230.

[0088] In at least one embodiment of this disclosure, such as Figure 3A and Figure 3B As shown, at least a portion of the first signal line 111 and the first electrode 210 are made of the same material. This reduces the manufacturing cost of the display panel.

[0089] For example, the first electrode may include a body electrode and a light-shielding electrode (reflective electrode). The body electrode may be made of a high work function material such as ITO, and the light-shielding electrode may be made of a metal material with high conductivity, and may be configured as a composite structure to have high conductivity. For example, the light-shielding electrode may be a composite film structure such as molybdenum-aluminum-molybdenum or titanium-aluminum-titanium. For example, the first signal line 111 and the light-shielding electrode of the first electrode 210 are made of the same material.

[0090] For example, the first signal line 111 can be connected to the isolation structure 300 to serve as a common electrode line. The common electrode line can have a relatively large area in the non-display area 12 to reduce its own voltage drop. Correspondingly, the large area covered by the first signal line 111 will block the gas from escaping from the lower barrier dam 500. Therefore, multiple first openings 501 are provided in the first signal line 111 to release these gases. Because the common electrode line has a large width, the arrangement of these first openings 501 will not have a significant impact on the conductivity of the common electrode line.

[0091] In at least one embodiment of this disclosure, the display panel may include a substrate and a driving circuit layer located on the substrate. The driving circuit layer includes multiple pixel driving circuits located in the display area, and the display functional layer is located on the side of the driving circuit layer away from the substrate. For example, the pixel driving circuit may include multiple transistors (TFTs), capacitors, etc., and may be formed in various forms such as 2T1C (i.e., 2 transistors (TFTs) and 1 capacitor (C)), 3T1C, or 7T1C. The pixel driving circuit is connected to the light-emitting device 200 in the display functional layer to control the switching state and brightness of the light-emitting device 200.

[0092] In at least one embodiment of this disclosure, such as Figure 4A and Figure 4B As shown, the substrate 100 includes a first planarization layer 121 located on the substrate and between the substrate and the first electrode 210. The first planarization layer 121 is used to planarize the driving circuit layer to provide a relatively flat surface for the first electrode 210, thereby improving the film formation quality of the first electrode 210 and ensuring the luminous efficiency of the light-emitting device 200.

[0093] For example, at least a portion of the barrier dam 500 is in the same layer and made of the same material as the first planarization layer 121. In this way, at least a portion of the barrier dam 500 can be fabricated simultaneously during the fabrication of the first planarization layer 121, thereby simplifying the fabrication process of the display panel.

[0094] For example, the first planarization layer 121 is an organic film layer, thus possessing good planarization function. Correspondingly, the preparation of the first planarization layer 121 may leave residual water and gas, thus requiring the first opening 501 to release them.

[0095] In at least one embodiment of this disclosure, such as Figure 5A and Figure 5B As shown, the substrate 100 further includes a second planarization layer 122 extending from the display area 11 to the non-display area 12. In the display area 11, the second planarization layer 122 is located between the first planarization layer 121 and the substrate, and in the non-display area 12, the second planarization layer 122 is located between the barrier dam 500 and the substrate. A conductive layer can be disposed between the first planarization layer 121 and the second planarization layer 122 for fabricating signal lines to provide wiring space, thereby alleviating wiring pressure in the display panel. In a specific embodiment of the first aspect of this disclosure, the display panel includes a second signal line 112 extending from the display area 11 to the non-display area 12 and located between the first planarization layer 121 and the second planarization layer 122. The second planarization layer 122 can planarize the circuit structure in the substrate 100 to provide a flat surface to the second signal line 112, thereby improving the quality of the second signal line 112.

[0096] In at least one embodiment of this disclosure, such as Figure 5A and Figure 5B As shown, the second signal line 112 includes a third opening 503. The orthographic projection of the third opening 503 on the substrate 100 lies within the orthographic projection of the barrier dam 500 on the substrate 100. The barrier dam 500 is connected to the second planarization layer 122 through the third opening 503. The third opening 503 is used to release gas in the substrate 100 (e.g., the second planarization layer 122). After the protective layer 600 is provided, water, gas, etc., can be prevented from entering the substrate 100 through the third opening 503 in subsequent manufacturing processes, and from escaping through the third opening 503 during the verification or use of the display panel, which would cause the display panel packaging to fail.

[0097] In at least one embodiment of this disclosure, such as Figure 5A and Figure 5B As shown, the display panel includes a third signal line 130 located in the display area 11. The third signal line 130 is located between a first planarization layer 121 and a second planarization layer 122 in the display area 11. The second planarization layer 122 is used to planarize the third signal line 130. For example, the second signal line 112 can be in the same layer and made of the same material as the third signal line 130 to simplify the manufacturing process of the display panel.

[0098] In the embodiments of this disclosure, the setting of the protective layer 600 is related to the process of fabricating the light-emitting device 200 based on the isolation structure 300. The structure of the isolation structure 300 will be described below to illustrate the principle that the protective layer 600 needs to be set in the process of fabricating the light-emitting device 200 based on the isolation structure 300.

[0099] See again for at least one embodiment of this disclosure. Figure 3A and Figure 3B The isolation structure 300 includes a support portion 310 and a crown portion 320. The support portion 310 is located between the crown portion 320 and the substrate 100. The orthographic projection of the surface of the support portion 310 away from the substrate 100 onto the substrate 100 is located within the orthographic projection of the crown portion 320 onto the substrate 100. That is, the isolation structure 300 is generally wider at the top and narrower at the bottom. Thus, when some film layers (such as the light-emitting functional layer 220) in the light-emitting device 200 are deposited, these film layers will be broken at the edge of the isolation structure 300 to reduce the risk of crosstalk between adjacent light-emitting devices 200.

[0100] For example, the support portion 310 is a conductive structure, and the second electrode 230 is connected to the side surface of the support portion 310. The support portion 310 is designed without considering light transmission, thus allowing for a larger design thickness (greater than the second electrode 230). That is, the sheet resistance of the support portion 310 is less than the sheet resistance of the second electrode 230. In this design, the support portion 310 can be connected to the second electrode 230 of the light-emitting device 200 to achieve a common potential, thereby reducing the voltage drop across the second electrode 230.

[0101] For example, the isolation structure 300 is located on the side of the pixel defining layer 330 away from the substrate 100, so that the pixel defining layer 330 separates the first electrode 210 and the isolation structure 300.

[0102] In at least one embodiment of this disclosure, such as Figure 6A and Figure 6B As shown, the isolation structure 300 also includes a bottom 340, which is located between the support portion 310 and the substrate 100. The orthographic projection of the support portion 310 on the substrate 100 is located within the orthographic projection of the bottom 340 on the substrate 100.

[0103] For example, the bottom 340 is a conductive structure, and the second electrode 230 is electrically connected to the portion of the bottom 340's surface facing away from the substrate 100 that is not covered by the support portion 310. The second electrode 230 is more easily deposited on the surface area of ​​the bottom 340 facing away from the substrate 100 compared to the sidewall of the support portion 310, thereby reducing the impedance at the connection between the second electrode 230 and the isolation structure 300.

[0104] For example, the orthographic projection of the bottom 340 onto the substrate 100 lies within the orthographic projection of the crown 320 onto the substrate 100. In this way, the blocking effect of the isolation structure 300 on the light-emitting functional layer 220 can be increased.

[0105] For example, the bottom 340, the support 310, and the crown 320 can be made of molybdenum, aluminum, and titanium, respectively, with the corrosion resistance of aluminum, molybdenum, and titanium increasing in that order. During etching, the film formed by these materials can create a film such as... Figure 6A and Figure 6B The isolation structure 300 is shown.

[0106] In at least one embodiment of this disclosure, such as Figure 6A and Figure 6B As shown, the display panel may also include a first encapsulation layer 410, which is located on the side of the light-emitting device 200 and the isolation structure 300 away from the substrate 100 and covers the isolation opening 301.

[0107] For example, the first encapsulation layer 410 includes a plurality of encapsulation units 411 corresponding to the isolation opening 301, and the encapsulation unit 411 covers the light-emitting device 200 defined by the corresponding isolation opening 301.

[0108] In the fabrication process of the display panel, light-emitting devices P1, P2, and P3 are fabricated sequentially. When fabricating light-emitting device P1, a light-emitting device P1 is formed in each isolation opening 301. A first encapsulation layer 410 is fabricated on the display panel to cover the light-emitting device P1. Then, the first encapsulation layer 410, as well as the second electrode and light-emitting functional layer of the light-emitting device P1, are removed from some of the isolation openings 301 (used to form light-emitting devices P2 and P3 in the final product) to obtain an encapsulation unit 411. During this process, the encapsulation unit 411 protects the light-emitting devices P1 in other isolation openings 301. Based on this method, light-emitting devices P2 and P3 are then fabricated sequentially, ultimately forming a display panel as shown in the image. Figure 6A and Figure 6B The first encapsulation layer 410 shown, that is, the first encapsulation layer 410 on the entire display panel, is obtained by multiple processes. This process can be found below. Figures 8A to 14 The relevant descriptions in the embodiments are not repeated here.

[0109] For example, the packaging units 411 corresponding to adjacent light-emitting devices 200 with different emitted colors are spaced apart from each other. This process can be seen below. Figures 8A to 14 The relevant descriptions in the embodiments will not be repeated here. For example, the packaging units 411 corresponding to adjacent light-emitting devices 200 with the same light emission color can be spaced apart from each other, or they can be connected together.

[0110] In at least one embodiment of this disclosure, such as Figure 6A and Figure 6B As shown, at least two blocking dams 500 are provided, and the at least two blocking dams 500 include a first blocking dam 510 and a second blocking dam 520. The first blocking dam 510 is located between the display area 11 and the second blocking dam 520, and the orthographic projection of the first opening 501 on the substrate 100 is located within the orthographic projection of the first blocking dam 510 on the substrate 100.

[0111] For example, the first barrier 510 and the second barrier 520 can be set to have the same height; or, the height of the second barrier 520 can be set to be greater than the height of the first barrier 510 to increase the blocking effect of the second barrier 520.

[0112] For example, during the fabrication of the first barrier dam 510 and the second barrier dam 520, an auxiliary film layer can be additionally formed in the second barrier dam 520 to increase the height of the second barrier dam 520; or, during the etching of the film layer used to fabricate the first barrier dam 510 and the second barrier dam 520, the photoresist in the area where the second barrier dam 520 is located can be retained as part of the second barrier dam 520, thereby increasing the height of the second barrier dam 520.

[0113] See again for at least one embodiment of this disclosure. Figure 4A and Figure 4B The display panel may also include a second encapsulation layer 420, which extends from the display area 11 to the non-display area 12. At least a portion of the first barrier dam 510 is projected onto the substrate 100 within the projection of the second encapsulation layer 420 onto the substrate 100 and is connected to the second encapsulation layer 420 through a first opening 501. The second encapsulation layer 420 is located on the side of the second barrier dam 520 facing the display area 11. During the fabrication of the second encapsulation layer 420, water and gas may be introduced. Without the protective layer 600, these water and gas could enter the barrier dam 500 through the first opening 501, and even further penetrate the substrate 100 (e.g., through the aforementioned third opening 503). During subsequent display panel verification or use, the infiltrated water and gas would escape through the first opening 501, causing the second encapsulation layer 420 or other encapsulation structures (e.g., the third encapsulation layer 430 described below) to fail. Furthermore, the water and gas could even further penetrate the light-emitting device 200, resulting in poor display quality. The protective layer 600 solves this problem. Figure 4A and Figure 4B In the illustrated scheme, the second barrier 520 blocks the material used to prepare the second encapsulation layer 420 during the preparation process, thereby defining the boundary of the second encapsulation layer 420.

[0114] For example, the second encapsulation layer 420 is an organic film layer. In this way, the second encapsulation layer 420 can improve the flatness of the display panel surface, so as to facilitate the placement of other components on the encapsulation layer; in addition, the second encapsulation layer 420 can have a certain degree of flexibility to release stress, thereby improving the reliability of the display panel and making it more suitable for application in the field of flexible displays.

[0115] See again for at least one embodiment of this disclosure. Figure 4A and Figure 4B The display panel may further include a third encapsulation layer 430, which extends from the display area 11 to the non-display area 12 and is located on the side of the second encapsulation layer 420 opposite to the substrate 100. The orthographic projection of the second encapsulation layer 420 on the substrate 100 lies within the orthographic projection of the third encapsulation layer 430 on the substrate 100. The first encapsulation layer 410, the second encapsulation layer 420, and the third encapsulation layer 430 constitute the encapsulation structure 400.

[0116] For example, the third encapsulation layer 430 is an inorganic film layer. The third encapsulation layer 430 has high density and a high barrier effect against water, oxygen, etc., and the third encapsulation layer 430 has higher strength, so that other components (such as touch function-related structures, optical films, etc.) can be fabricated on it.

[0117] At least one embodiment of this disclosure provides a display panel including a display area and a non-display area located on at least one side of the display area. The display panel also includes a substrate and a second encapsulation layer, a protective layer, a plurality of light-emitting devices, and at least one barrier dam located on the substrate. The light-emitting devices are located on the substrate and in the display area, the barrier dam is located on the substrate and in the non-display area, the second encapsulation layer extends from the display area to the non-display area and covers at least one barrier dam, and the protective layer is located on the second encapsulation layer and the barrier dam covered by the second encapsulation layer. In this display panel, the protective layer can block the second encapsulation layer to prevent water and gas from entering the barrier dam during the fabrication of the second encapsulation layer, thereby preventing the display panel encapsulation from failing due to water and gas escaping from the barrier dam during verification or use. It should be noted that the structure of this display panel, the technical problem it solves, the principle of solving the technical problem, and further improvements can be found in the foregoing embodiments (e.g., Figure 4A and Figure 4B The relevant descriptions in the illustrated embodiments will not be repeated here.

[0118] In at least one embodiment of this disclosure, the display panel may further include a first signal line located on a substrate, with at least a portion of the first signal line located in a non-display area. A blocking dam is located between the first signal line and the substrate. The first signal line includes a first opening, the orthographic projection of which onto the substrate lies within the orthographic projection of at least one blocking dam onto the substrate. A protective layer is located on the side of the first signal line facing away from the substrate and covers the first opening. The pixel definition layer includes a second opening in the portion of the non-display area, at least a portion of which is exposed through the first and second openings. The protective layer covers the first and second openings and contacts the blocking dam.

[0119] The structure of the display panel, the technical problem it solves, the principle behind solving the technical problem, and further improvements can be found in the foregoing embodiments (e.g., Figure 3A and Figure 3B The relevant descriptions in the illustrated embodiments will not be repeated here.

[0120] At least one embodiment of this disclosure provides a method for manufacturing the above-described display panel, the method including, for example, Figure 7A Steps S100 to S600 are as follows.

[0121] S100, a substrate is provided and a display area and a non-display area located on at least one side of the display area are divided on the substrate.

[0122] S200, forming at least one barrier dam in the non-display area.

[0123] S300, a plurality of first electrodes spaced apart from each other are formed in the display area, and a first signal line is formed in the non-display area, wherein a first opening is formed in the first signal line, and the orthogonal projection of the first opening on the substrate is located within the orthogonal projection of at least one blocking dam on the substrate.

[0124] It should be noted that, in at least one embodiment of this disclosure, without involving the relative positional relationship with a third-party film structure (such as the pixel defining layer mentioned above), the formation order and interlayer relationship of the first electrode and the first signal line are not limited. Therefore, in step S300, the first electrode and the first signal line can be formed in the same layer and in the same process step; or, the first signal line can be prepared first, and then the first electrode can be formed; or, the first electrode can be prepared first, and then the first signal line can be formed. For example, this method can correspond to the above. Figure 3B The illustrated embodiment includes a pixel delimiting layer and the first signal line is located above the pixel delimiting layer.

[0125] S400, an isolation structure is formed on a substrate on which a first electrode is formed, wherein at least a portion of the isolation structure is formed in a display area, and the isolation structure encloses a plurality of isolation openings located in the display area.

[0126] S500, deposit a protective material film layer and perform a patterning process on the protective material film layer to form a protective layer in the non-display area, wherein the protective layer forms the side of the first signal line away from the substrate and covers the first opening.

[0127] S600, based on the isolation structure, a light-emitting functional layer and a second electrode are prepared in the isolation opening. The first electrode, the light-emitting functional layer and the second electrode stacked on each other in each isolation opening constitute a light-emitting device.

[0128] In the display panel obtained in steps S100 to S600 above, the first opening is used to release gas from the substrate, and the protective layer can seal the first opening to prevent water, gas, etc. from entering the substrate through the first opening during subsequent manufacturing processes and escaping through the first opening during the verification or use of the display panel, thus causing the display panel encapsulation to fail. The specific structure of the display panel obtained by this manufacturing method, the technical problems solved, and the corresponding technical effects can be found in the relevant descriptions in the foregoing embodiments, and will not be repeated here.

[0129] In at least one embodiment of this disclosure, such as Figure 7B As shown, step S600 above includes:

[0130] S610, depositing a light-emitting material thin film and a conductive material thin film, the light-emitting material thin film and the conductive material thin film covering the isolation structure and the isolation opening, wherein the portions of the light-emitting material thin film and the conductive material thin film located in the isolation opening respectively form a light-emitting functional layer and a second electrode.

[0131] S620, deposits a film of encapsulating material to cover the light-emitting device.

[0132] S630 forms a photoresist layer on the packaging material film layer and performs a patterning process on the photoresist layer to form a photoresist pattern, which covers part of the isolation opening.

[0133] S640, based on photoresist pattern etching of encapsulation material film, light-emitting material film and conductive material film, wherein the remaining part of the encapsulation material film is formed into an encapsulation unit, and the light-emitting functional layer and the second electrode not covered by the encapsulation unit are etched.

[0134] S650, repeat the above process to form a light-emitting device and a packaging unit at the isolation opening where no light-emitting device is formed, and all the packaging units constitute the first packaging layer.

[0135] In at least one embodiment of this disclosure, the substrate includes a substrate and a first planarization layer located on the substrate. Step S200 described above may include: forming a planarization film layer on the substrate and performing a patterning process on the planarization film layer, such that the portion of the planarization film layer located in the display area forms the first planarization layer, and the portion of the planarization film layer located in the non-display area forms at least a portion of a barrier dam. The specific structure of the display panel obtained by this fabrication method, the technical problems solved, and the corresponding technical effects can be found in the relevant descriptions in the foregoing embodiments, and will not be repeated here.

[0136] In at least one embodiment of this disclosure, the above-described fabrication method may further include: depositing a pixel defining material film layer before forming the isolation structure and after forming the first electrode, the pixel defining material film layer extending from the display area to the non-display area and covering the barrier dam; performing a patterning process on the pixel defining material film layer to form a pixel defining layer, wherein pixel openings and a second opening are formed in the pixel defining layer, the orthographic projection of the second opening on the substrate at least partially overlaps with the orthographic projection of the first opening on the substrate, and is located within the orthographic projection of at least one barrier dam on the substrate, the pixel openings and the isolation openings respectively correspond to expose at least a portion of the first electrode. The specific structure of the display panel obtained by this fabrication method, the technical problems solved, and the corresponding technical effects can be found in the relevant descriptions in the foregoing embodiments, and will not be repeated here.

[0137] In the method for manufacturing a display panel provided in at least one embodiment of this disclosure, at least two blocking dams are formed, and the at least two blocking dams include a first blocking dam and a second blocking dam. The first blocking dam is located between the display area and the second blocking dam, and the orthographic projection of the first opening on the substrate is located within the orthographic projection of the first blocking dam on the substrate. The specific structure of the display panel obtained by this manufacturing method, the technical problems solved, and the corresponding technical effects can be found in the relevant descriptions in the foregoing embodiments, and will not be repeated here.

[0138] The manufacturing method of the display panel provided in at least one embodiment of this disclosure may further include: forming an organic encapsulation material on the side of the first encapsulation layer away from the substrate to form a second encapsulation layer, wherein the second encapsulation layer extends from the display area to the non-display area to cover the first encapsulation layer and the barrier dam, the second encapsulation layer is connected to the barrier dam through a first opening, and the second encapsulation layer is formed on the side of the second barrier dam facing the display area. The specific structure of the display panel obtained by this manufacturing method, the technical problems solved, and the corresponding technical effects can be found in the relevant descriptions in the foregoing embodiments, and will not be repeated here.

[0139] For example, methods for forming the second encapsulation layer include inkjet printing.

[0140] Below, as follows Figure 3A and Figure 3B Taking the display panel shown as an example, the method for manufacturing the display panel will be explained by way of example.

[0141] like Figure 8A and Figure 8B As shown, a substrate 100 is provided, which is divided into a display area 11 and a non-display area 12, and a barrier dam 500 is formed in the non-display area 12; an array of first electrodes 210 are formed on the substrate 100; and a pixel defining material layer 330a is formed on the substrate 100 where the first electrodes 210 are formed, the pixel defining material layer 330a covering the barrier dam 500.

[0142] like Figure 9A and Figure 9B As shown, an isolation structure 300 at least partially located in the display area 11 is formed on the pixel defining material layer 330a. The isolation structure 300 has a support portion 310 and a crown portion 320, which define the isolation opening 301. A conductive film layer 111a is formed in the non-display area 12.

[0143] like Figure 9A and Figure 9B As shown, a patterning process is performed on the conductive film layer 111a and the pixel defining material layer 330a (e.g., using...). Figure 9A and Figure 9BThe photoresist pattern 700 shown is etched using a mask to form a conductive film layer 111a as a first signal line 111 and a pixel defining material layer 330a as a pixel defining layer 330. A first opening 501 is formed in the first signal line 111, and a pixel opening 302 located in the display area 11 and a second opening 502 located in the non-display area 12 are formed in the pixel defining layer 330. Figure 9A and Figure 9B The structure shown, after undergoing a patterning process, forms the following: Figure 10A and Figure 10B The structure shown.

[0144] In embodiments of this disclosure, the patterning process can be a photolithographic patterning process, which may include, for example, coating a structural layer to be patterned with photoresist, exposing the photoresist using a photomask, developing the exposed photoresist to obtain a photoresist pattern, etching the structural layer using the photoresist pattern (optionally wet or dry etching), and then optionally removing the photoresist pattern. It should be noted that when the material of the structural layer (e.g., the photoresist pattern described below) includes photoresist, the structural layer can be directly exposed using a photomask to form the desired pattern.

[0145] like Figure 11 As shown, a protective layer 600 is formed on the barrier 500 at the location of the first opening 501 to cover the first opening 501.

[0146] like Figure 12 As shown, a light-emitting material thin film and a conductive material thin film are vapor-deposited on the substrate 100 to form a light-emitting functional layer 220 and a second electrode 230 in each isolation opening 301 of the isolation structure 300. The first electrode 210, the light-emitting functional layer 220 and the second electrode 230 stacked on each other at the isolation opening 301 form a light-emitting device 200. No mask is used in the vapor deposition process, so the vapor-deposited material will also be deposited on the crown 320. It should be noted that in the actual process, the vapor-deposited material will be deposited on the upper surface of the crown 320 away from the substrate 100 and on the sidewalls (not shown in the figure) to form a filling film 500a. Then, an encapsulation material film layer 410a is deposited to cover the light-emitting device 200 and the isolation structure 300.

[0147] For example, the light-emitting layer in the vapor-deposited light-emitting functional layer 220 can be light of the color corresponding to the first type of light-emitting device P1. That is, in this stage, the first type of light-emitting device P1 is formed in each isolation opening 301 of the isolation structure 300.

[0148] like Figure 13As shown, a photoresist is formed (e.g., coated) on a substrate 100 on which an encapsulation material film layer 410a is formed, and then a patterning process is performed on it to form a photoresist pattern 700, which only covers a portion of the isolation opening 301 of the isolation structure 300.

[0149] like Figure 14 As shown, the surface of the display panel is etched using the photoresist pattern 700 as a mask to remove the encapsulation material film layer 410a, the second electrode 230 and the light-emitting functional layer 220 that are not covered by the photoresist pattern 700. The remaining part of the encapsulation material film layer 410a forms the encapsulation unit of the first encapsulation layer 410. Then the residual photoresist pattern 700 is removed.

[0150] Repeat the above Figures 12 to 14 The steps are as follows: to form a second type of light-emitting device P2 and a third type of light-emitting device P3 in other isolation openings 301 respectively, and to form as shown in the figure. Figure 3A and Figure 3B The display panel shown. The process of forming the second type of light-emitting device P2 and the third type of light-emitting device P3 differs from that of forming the first type of light-emitting device P2 and the third type of light-emitting device P3 in that the isolation opening 301 covered by the photoresist pattern 700 is different.

[0151] At least one embodiment of this disclosure provides a display device, which may include the display panel in the above embodiments or a display panel obtained by the manufacturing method in the above embodiments. For example, the display device may include a touch structure, an optical film (e.g., a microlens, a polarizer), a cover plate, or other structures disposed on the light-emitting side of the display panel.

[0152] For example, the display device can be any product or component with a display function, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, or navigator.

[0153] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0154] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

[0155] The above description is merely a preferred embodiment of this specification and is not intended to limit this specification. Any modifications or equivalent substitutions made within the spirit and principles of this specification should be included within the scope of protection of this specification.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a non-display area located on at least one side of the display area, wherein the display panel includes: substrate; An isolation structure is located on the substrate and at least partially located in the display area, wherein the isolation structure encloses and forms a plurality of isolation openings located in the display area; Multiple light-emitting devices are located on the substrate, and at least a portion of the light-emitting devices are located in the isolation opening; At least one blocking dam is located on the substrate and in the non-display area; A first signal line is located on the substrate and at least a portion of the first signal line is located in the non-display area, wherein the blocking dam is located between the first signal line and the substrate, and the first signal line includes a first opening, the orthographic projection of the first opening on the substrate being located within the orthographic projection of at least one of the blocking dams on the substrate. A protective layer is located on the side of the first signal line opposite to the substrate and covers the first opening.

2. The display panel according to claim 1, characterized in that, The protective layer is an inorganic film layer.

3. The display panel according to claim 1, characterized in that, It also includes a pixel defining layer, wherein the pixel defining layer extends from the display area to the non-display area, and in the non-display area, the pixel defining layer is located between the first signal line and the blocking dam and includes a second opening, and The orthographic projection of the second opening on the substrate at least partially overlaps with the orthographic projection of the first opening on the substrate, and is located within the orthographic projection of at least one of the blocking dams on the substrate; Preferably, the protective layer covers the second opening and contacts the barrier dam; Preferably, the pixel defining layer includes pixel openings corresponding to the isolation openings, and at least a portion of the light-emitting device is located in the pixel openings; Preferably, the pixel defining layer is an inorganic film layer.

4. The display panel according to claim 3, characterized in that, The light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked sequentially on the substrate, and at least a portion of the light-emitting functional layer of the light-emitting device is located in the corresponding isolation opening; Preferably, the second electrode is electrically connected to the isolation structure.

5. The display panel according to claim 4, characterized in that, The first signal line is made of at least a portion of the same material as the first electrode.

6. The display panel according to claim 4, characterized in that, The substrate includes a substrate and a first planarization layer located on the substrate, the first planarization layer being located between the substrate and the first electrode; Preferably, at least a portion of the barrier dam is in the same layer and made of the same material as the first flat layer.

7. The display panel according to claim 6, characterized in that, The substrate further includes a second planarization layer extending from the display area to the non-display area, and In the display area, the second flattening layer is located between the first flattening layer and the substrate, and in the non-display area, the second flattening layer is located between the barrier dam and the substrate.

8. The display panel according to claim 7, characterized in that, The display panel includes a second signal line that extends from the display area to the non-display area and is located between the first planarization layer and the second planarization layer. Preferably, the second signal line includes a third opening, the orthographic projection of the third opening on the substrate is located within the orthographic projection of the blocking dam on the substrate, and the blocking dam is connected to the second planarization layer through the third opening.

9. The display panel according to any one of claims 4 to 8, characterized in that, The isolation structure includes a support portion and a crown portion, the support portion being located between the crown portion and the substrate, and The orthographic projection of the surface of the support portion away from the substrate onto the substrate lies within the orthographic projection of the crown portion onto the substrate; Preferably, the support portion is a conductive structure, and the second electrode is connected to the side surface of the support portion; Preferably, the isolation structure is located on the side of the pixel defining layer opposite to the substrate.

10. The display panel according to claim 9, characterized in that, The isolation structure also includes a bottom, which is located between the support and the substrate, and the orthographic projection of the support on the substrate is located within the orthographic projection of the bottom on the substrate. Preferably, the bottom is a conductive structure, and the second electrode is electrically connected to the portion of the bottom surface facing away from the substrate that is not covered by the support portion; Preferably, the orthographic projection of the bottom on the substrate lies within the orthographic projection of the crown on the substrate.

11. The display panel according to claim 9, characterized in that, It also includes a first encapsulation layer, wherein the first encapsulation layer is located on the side of the light-emitting device and the isolation structure opposite to the substrate, and covers the isolation opening; Preferably, the first encapsulation layer includes a plurality of encapsulation units corresponding to the isolation openings, and the encapsulation units cover the light-emitting device defined by the corresponding isolation openings; Preferably, the packaging units corresponding to adjacent light-emitting devices with different light-emitting colors are spaced apart from each other.

12. The display panel according to claim 11, characterized in that, The barrier is configured as at least two, and the at least two barrier includes a first barrier and a second barrier, wherein the first barrier is located between the display area and the second barrier. The orthographic projection of the first opening on the substrate is located within the orthographic projection of the first blocking dam on the substrate; Preferably, the display panel further includes a second encapsulation layer extending from the display area to the non-display area, wherein at least a portion of the first barrier dam's orthographic projection on the substrate is within the orthographic projection of the second encapsulation layer on the substrate, and is connected to the second encapsulation layer through the first opening, wherein the second encapsulation layer is located on the side of the second barrier dam facing the display area; Preferably, the second encapsulation layer is an organic film layer; Preferably, the display panel further includes a third encapsulation layer, which extends from the display area to the non-display area and is located on the side of the second encapsulation layer opposite to the substrate, wherein the orthographic projection of the second encapsulation layer on the substrate is within the orthographic projection of the third encapsulation layer on the substrate; Preferably, the third encapsulation layer is an inorganic film layer.

13. A display panel, characterized in that, The display panel includes a display area and a non-display area located on at least one side of the display area, wherein the display panel includes: substrate; Multiple light-emitting devices are located on the substrate and in the display area; At least one blocking dam is located on the substrate and in the non-display area; A second encapsulation layer extends from the display area to the non-display area and covers at least one of the barrier dams; and A protective layer is located between the second encapsulation layer and the barrier dam covered by the second encapsulation layer.

14. The display panel according to claim 13, characterized in that, It also includes a first signal line, wherein the first signal line is located on the substrate and at least a portion of the first signal line is located in the non-display area, wherein the blocking dam is located between the first signal line and the substrate, the first signal line includes a first opening, and the orthographic projection of the first opening on the substrate lies within the orthographic projection of at least one of the blocking dams on the substrate. The protective layer is located on the side of the first signal line away from the substrate and covers the first opening; Preferably, the display panel further includes an isolation structure located on the substrate and at least partially located in the display area, the isolation structure enclosing and forming a plurality of isolation openings in the display area, and at least a portion of the light-emitting device being located in the isolation openings; Preferably, the protective layer is an inorganic film layer; Preferably, the second encapsulation layer is an organic film layer; Preferably, the display panel further includes a pixel defining layer extending from the display area to the non-display area. In the non-display area, the pixel defining layer is located between the first signal line and the blocking dam and includes a second opening. The orthographic projection of the second opening on the substrate at least partially overlaps with the orthographic projection of the first opening on the substrate and is located within the orthographic projection of at least one of the blocking dams on the substrate. Preferably, the pixel defining layer includes pixel openings corresponding to the isolation openings, and at least a portion of the light-emitting device is located in the pixel openings; Preferably, the pixel defining layer is an inorganic film layer; Preferably, at least a portion of the barrier dam is exposed through the first opening and the second opening; Preferably, the protective layer covers the first opening and the second opening and contacts the barrier dam.

15. A method for manufacturing a display panel, characterized in that, include: A substrate is provided, and a display area and a non-display area located on at least one side of the display area are divided on the substrate; At least one barrier dam is formed in the non-display area; A plurality of first electrodes spaced apart from each other are formed in the display area, and a first signal line is formed in the non-display area, wherein a first opening is formed in the first signal line, and the orthographic projection of the first opening on the substrate is located within the orthographic projection of at least one of the blocking dams on the substrate. An isolation structure is formed on the substrate on which the first electrode is formed, wherein at least a portion of the isolation structure is formed in the display area, and the isolation structure encloses a plurality of isolation openings located in the display area; A protective material film is deposited, and the protective material film is patterned to form a protective layer in the non-display area, wherein the protective layer forms the side of the first signal line opposite to the substrate and covers the first opening; and Based on the isolation structure, a light-emitting functional layer and a second electrode are prepared in the isolation opening. The first electrode, the light-emitting functional layer and the second electrode stacked on top of each other in each isolation opening constitute a light-emitting device.

16. The preparation method according to claim 15, characterized in that, The fabrication of the light-emitting functional layer and the second electrode located in the isolation opening based on the isolation structure includes: A light-emitting material film and a conductive material film are deposited, wherein the light-emitting material film and the conductive material film cover the isolation structure and the isolation opening, wherein the portions of the light-emitting material film and the conductive material film located in the isolation opening respectively form the light-emitting functional layer and the second electrode; Deposit an encapsulation material film to cover the light-emitting device; A photoresist layer is formed on the encapsulation material film, and the photoresist layer is patterned to form a photoresist pattern, the photoresist pattern covering a portion of the isolation opening; The encapsulation material film, the light-emitting material film, and the conductive material film are etched based on the photoresist pattern, wherein the remaining portion of the encapsulation material film is formed as an encapsulation unit, and the light-emitting functional layer and the second electrode not covered by the encapsulation unit are etched. The above process is repeated to form the light-emitting device and the packaging unit at the isolation opening where the light-emitting device is not formed, and all the packaging units constitute the first packaging layer.

17. The preparation method according to claim 16, characterized in that, The substrate includes a substrate and a first planarization layer located on the substrate, wherein forming at least one barrier dam in the non-display area includes: forming a planarization film layer on the substrate and performing a patterning process on the planarization film layer such that the portion of the planarization film layer located in the display area forms the first planarization layer, and the portion of the planarization film layer located in the non-display area forms at least a portion of the barrier dam.

18. The preparation method according to claim 16, characterized in that, Also includes: Before forming the isolation structure and after forming the first electrode, a pixel defining material film is deposited, the pixel defining material film extending from the display area to the non-display area and covering the barrier dam; as well as The pixel defining material film is patterned to form a pixel defining layer, wherein a pixel opening and a second opening are formed in the pixel defining layer, the orthographic projection of the second opening on the substrate at least partially overlaps with the orthographic projection of the first opening on the substrate, and is located within the orthographic projection of at least one of the blocking dams on the substrate, and the pixel opening and the isolation opening correspond respectively to expose at least a portion of the first electrode.

19. The preparation method according to claim 16, characterized in that, The blocking dam is formed in at least two forms, and the at least two blocking dams include a first blocking dam and a second blocking dam. The first blocking dam is located between the display area and the second blocking dam, and the orthographic projection of the first opening on the substrate is located within the orthographic projection of the first blocking dam on the substrate. Preferably, the preparation method further includes: forming an organic encapsulation material on the side of the first encapsulation layer away from the substrate to form a second encapsulation layer, wherein the second encapsulation layer extends from the display area to the non-display area to cover the first encapsulation layer and the barrier dam, the second encapsulation layer is connected to the barrier dam through the first opening, and the second encapsulation layer is formed on the side of the second barrier dam facing the display area; More preferably, the second encapsulation layer is an organic film layer; More preferably, the method for forming the second encapsulation layer includes inkjet printing.

20. A display device, characterized in that, The display panel includes any one of claims 1 to 14 or a display panel obtained by the preparation method of any one of claims 15 to 19.

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