Display panel, manufacturing method thereof and display device

Abstract

The invention relates to a display panel and a display device. The display panel includes a substrate; the plurality of isolation structures are arranged on one side of the substrate at intervals, and isolation openings are limited by the isolation structures; at least part of the light-emitting devices are arranged in the isolation openings; the isolation structure comprises a supporting part and a crown part which are sequentially stacked on the substrate, and the side wall of the supporting part comprises a first side wall facing the adjacent light-emitting device and a second side wall far away from the adjacent light-emitting device; in the direction parallel to the plane where the substrate is located, the crown portion protrudes in the direction towards the light-emitting device relative to the first side wall to form a first protruding structure, and the crown portion protrudes in the direction away from the light-emitting device relative to the second side wall to form a second protruding structure. In the direction parallel to the plane where the substrate is located, the size of the second protruding structure in the direction away from the light-emitting device is larger than the size of the first protruding structure in the direction towards the light-emitting device. The packaging performance of the display panel can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, its manufacturing method, and a display device. Background Technology

[0002] OLED (Organic Light Emitting Diode) display panels are one of the hottest topics in the field of display panel research today. OLED display panels have advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angle and fast response speed.

[0003] However, OLED display panels in related technologies suffer from insufficient encapsulation performance and reliability failures. Summary of the Invention

[0004] Therefore, it is necessary to provide a display panel, its manufacturing method, and a display device to address the issues of insufficient encapsulation performance and reliability failure in OLED display panels.

[0005] According to a first aspect of this application, a display panel is provided, comprising:

[0006] substrate;

[0007] Multiple isolation structures are spaced apart on one side of the substrate, and each isolation structure defines an isolation opening;

[0008] Multiple light-emitting devices, at least some of which are disposed within the isolation opening;

[0009] The isolation structure includes a support portion and a crown portion stacked sequentially on the substrate. The sidewalls of the support portion include a first sidewall facing the adjacent light-emitting device and a second sidewall away from the adjacent light-emitting device.

[0010] In a direction parallel to the plane of the substrate, the crown protrudes relative to the first sidewall in a direction toward the light-emitting device to form a first protruding structure, and the crown protrudes relative to the second sidewall in a direction away from the light-emitting device to form a second protruding structure;

[0011] In a direction parallel to the plane of the substrate, the dimension of the second protruding structure in the direction away from the light-emitting device is greater than the dimension of the first protruding structure in the direction toward the light-emitting device.

[0012] In some embodiments, the light-emitting device includes a first electrode, a first light-emitting portion, and a second electrode arranged in sequence.

[0013] The display panel further includes multiple encapsulation layers, which are correspondingly disposed with respect to the light-emitting device;

[0014] The encapsulation layer is disposed on the side of the second electrode of the corresponding light-emitting device away from the substrate. The encapsulation layer covers the second electrode and at least part of the isolation structure. In the direction perpendicular to the plane of the substrate, the size of the encapsulation layer in direct contact with the second sidewall is larger than the size of the encapsulation layer in direct contact with the first sidewall.

[0015] In some embodiments, the encapsulation layer includes a first encapsulation portion, a second encapsulation portion, and a third encapsulation portion connected in sequence. The first encapsulation portion covers the second electrode, the second encapsulation portion covers the first sidewall, the surface of the crown portion facing the substrate, and the side end face of the crown portion, and the third encapsulation portion covers at least a portion of the second sidewall.

[0016] In some embodiments, the third encapsulation portion is in direct contact with the second sidewall, and the encapsulation layer further includes a cover portion connected to the third encapsulation portion, one end of the cover portion being connected to the end of the third encapsulation portion away from the second encapsulation portion, and the other end of the cover portion extending in a direction away from the second sidewall or away from the substrate.

[0017] In some embodiments, one end of the third encapsulation portion away from the second encapsulation portion is located on the second sidewall, and the other end of the cover portion extends in a direction away from the second sidewall;

[0018] At least a portion of the surface of the cover near the second sidewall has a first gap with the second sidewall.

[0019] In some embodiments, the display panel further includes an electrode filling portion disposed in the same layer and material as the second electrode, and at least a portion of the electrode filling portion fills the first gap.

[0020] In some embodiments, the display panel further includes a pixel definition layer disposed on the substrate, and the isolation structure is disposed on the side of the pixel definition layer away from the substrate;

[0021] The pixel definition layer includes multiple pixel definition structures, each pixel definition structure defining a pixel opening, and the pixel opening is configured to correspond to the first electrode.

[0022] The third encapsulation portion covers the second sidewall and the surface of the corresponding pixel definition structure near the second sidewall, and the other end of the covering portion extends in a direction away from the substrate;

[0023] At least a portion of the surface of the cover near the pixel definition structure has a second gap with the pixel definition structure.

[0024] In some embodiments, the display panel further includes an electrode filling portion disposed in the same layer and material as the second electrode, and at least a portion of the electrode filling portion fills the second gap;

[0025] Optionally, the pixel definition structure covers the edge of the corresponding first electrode, and the first light-emitting part is disposed on the side of the corresponding first electrode and the pixel definition structure away from the substrate;

[0026] Optionally, the pixel definition layer is made of an inorganic material.

[0027] In some embodiments, the difference between the dimension of the second protruding structure in the direction away from the light-emitting device and the dimension of the first protruding structure in the direction toward the light-emitting device is greater than 0.1 micrometers in the direction parallel to the plane of the substrate.

[0028] In some embodiments, the second protruding structure has a size ranging from 0.5 to 1.5 micrometers in the direction away from the light-emitting device, in a direction parallel to the plane of the substrate.

[0029] Optionally, in a direction parallel to the plane of the substrate, the size of the first protruding structure in the direction toward the light-emitting device ranges from 0.3 to 0.7 micrometers.

[0030] In some embodiments, the support portion is a conductive structure, and the second electrode overlaps with the second sidewall;

[0031] Optionally, the support portion and the crown portion are integrally formed;

[0032] Optionally, the support portion and the crown portion are made of different materials;

[0033] Optionally, the isolation structure is ring-shaped on a plane parallel to the substrate.

[0034] According to a second aspect of this application, a display panel is provided, comprising:

[0035] substrate;

[0036] Multiple isolation structures are spaced apart on one side of the substrate, and each isolation structure defines an isolation opening;

[0037] Multiple light-emitting devices, at least some of which are disposed within the isolation opening;

[0038] The isolation structure includes a support portion and a crown portion stacked sequentially on the substrate. The sidewalls of the support portion include a first sidewall facing the adjacent light-emitting device and a second sidewall away from the adjacent light-emitting device.

[0039] Multiple encapsulation layers are disposed corresponding to the light-emitting device. The encapsulation layer is disposed on the side of the corresponding light-emitting device away from the substrate. The encapsulation layer covers the light-emitting device and at least part of the isolation structure. In the direction perpendicular to the plane of the substrate, the size of the encapsulation layer in direct contact with the second sidewall is larger than the size of the encapsulation layer in direct contact with the first sidewall.

[0040] In some embodiments, in a direction parallel to the plane of the substrate, the crown protrudes relative to the first sidewall in a direction toward the light-emitting device to form a first protruding structure, and the crown protrudes relative to the second sidewall in a direction away from the light-emitting device to form a second protruding structure;

[0041] In a direction parallel to the plane of the substrate, the dimension of the second protruding structure in the direction away from the light-emitting device is greater than the dimension of the first protruding structure in the direction toward the light-emitting device.

[0042] In some embodiments, the encapsulation layer includes a first encapsulation portion, a second encapsulation portion, and a third encapsulation portion connected in sequence. The first encapsulation portion covers the second electrode, the second encapsulation portion covers the first sidewall, the surface of the crown portion facing the substrate, and the side end face of the crown portion, and the third encapsulation portion covers at least a portion of the second sidewall.

[0043] In some embodiments, the third encapsulation portion is in direct contact with the second sidewall, and the encapsulation layer further includes a cover portion connected to the third encapsulation portion, one end of the cover portion being connected to the end of the third encapsulation portion away from the second encapsulation portion, and the other end of the cover portion extending in a direction away from the second sidewall or away from the substrate.

[0044] In some embodiments, one end of the third encapsulation portion away from the second encapsulation portion is located on the second sidewall, and the other end of the cover portion extends in a direction away from the second sidewall;

[0045] At least a portion of the surface of the cover near the second sidewall has a first gap with the second sidewall;

[0046] Optionally, the display panel further includes an electrode filling portion disposed in the same layer and material as the second electrode, at least a portion of the electrode filling portion filling the first gap.

[0047] In some embodiments, the display panel further includes a pixel definition layer disposed on the substrate, and the isolation structure is disposed on the side of the pixel definition layer away from the substrate;

[0048] The light-emitting device includes a first electrode, a first light-emitting part, and a second electrode arranged in sequence.

[0049] The pixel definition layer includes multiple pixel definition structures, each pixel definition structure defining a pixel opening, and the pixel opening is configured to correspond to the first electrode.

[0050] The third encapsulation portion covers the second sidewall and the surface of the corresponding pixel definition structure near the second sidewall, and the other end of the covering portion extends in a direction away from the substrate;

[0051] At least a portion of the surface of the covering portion near the pixel definition structure has a second gap with the pixel definition structure;

[0052] Optionally, the display panel further includes an electrode filling portion disposed in the same layer and material as the second electrode, at least a portion of the electrode filling portion filling the second gap.

[0053] In some embodiments, in a direction parallel to the plane of the substrate, the difference between the dimension of the second protruding structure in the direction away from the light-emitting device and the dimension of the first protruding structure in the direction toward the light-emitting device is greater than 0.1 micrometers;

[0054] Optionally, in a direction parallel to the plane of the substrate, the size of the second protruding structure in the direction away from the light-emitting device ranges from 0.5 to 1.5 micrometers.

[0055] Optionally, in a direction parallel to the plane of the substrate, the size of the first protruding structure in the direction toward the light-emitting device ranges from 0.3 to 0.7 micrometers.

[0056] According to a third aspect of this application, a display device is provided, comprising the display panel described in any one of the preceding descriptions.

[0057] According to a fourth aspect of this application, a method for manufacturing a display panel is provided, comprising:

[0058] Provide a substrate;

[0059] A plurality of isolation structures are formed on one side of the substrate, the isolation structures being spaced apart on one side of the substrate, and the isolation structures defining isolation openings;

[0060] A plurality of light-emitting devices are formed on one side of the substrate, and at least some of the light-emitting devices are disposed within the isolation opening;

[0061] The isolation structure includes a support portion and a crown portion stacked sequentially on the substrate. The sidewalls of the support portion include a first sidewall facing the adjacent light-emitting device and a second sidewall away from the adjacent light-emitting device.

[0062] In a direction parallel to the plane of the substrate, the crown protrudes relative to the first sidewall in a direction toward the light-emitting device to form a first protruding structure, and the crown protrudes relative to the second sidewall in a direction away from the light-emitting device to form a second protruding structure;

[0063] In a direction parallel to the plane of the substrate, the dimension of the second protruding structure in the direction away from the light-emitting device is greater than the dimension of the first protruding structure in the direction toward the light-emitting device.

[0064] In this embodiment, in the direction parallel to the plane of the substrate, the dimension of the second protruding structure away from the light-emitting device is larger than the dimension of the first protruding structure towards the light-emitting device; that is, the second dimension is larger than the first dimension (the second length is larger than the first length). This allows the encapsulation layer to cover a larger area on the second sidewall when it covers or encapsulates the isolation structure and the light-emitting device (in the direction perpendicular to the plane of the substrate, the encapsulation layer covers a larger dimension on the second sidewall). This increases the contact area between the encapsulation layer and the second sidewall, better preventing moisture and oxygen from entering, thereby improving the encapsulation performance and reliability of the display panel. Furthermore, in the direction perpendicular to the plane of the substrate, the encapsulation layer can cover the entire second sidewall, and the encapsulation layer extends to cover the surface of the corresponding pixel definition structure near the second sidewall. The encapsulation layer is in direct contact with the pixel definition structure, which avoids the formation of channels for moisture and oxygen to enter through residual light-emitting layer material, while further increasing the encapsulation area of ​​the encapsulation layer, thereby further improving the prevention of moisture and oxygen from entering, and thus improving the encapsulation performance and reliability of the display panel. Meanwhile, compared to the second size, the first size is smaller. The first protruding structure and the first sidewall can block other film layers such as the light-emitting layer or hole transport layer (HTL) of adjacent light-emitting devices, while ensuring that the second electrode is attached to the first sidewall. The support is a conductive structure, ensuring that an electrical signal can be provided to the second electrode through the support. Attached Figure Description

[0065] Figure 1 This is a partial top view of a display panel provided for some embodiments of this application.

[0066] Figure 2 This is a first partial cross-sectional schematic diagram of a display panel provided for some embodiments of this application.

[0067] Figure 3This is a second partial cross-sectional schematic diagram of a display panel provided for some embodiments of this application.

[0068] Figure 4 This is a third partial cross-sectional schematic diagram of a display panel provided for some embodiments of this application.

[0069] Figure 5 This is a fourth partial cross-sectional schematic diagram of a display panel provided for some embodiments of this application.

[0070] Figure 6 This is a fifth partial cross-sectional schematic diagram of a display panel provided for some embodiments of this application.

[0071] Figure 7 This is a schematic diagram of a display device provided for some embodiments of this application.

[0072] Figure 8 This is a schematic flowchart illustrating a method for manufacturing a display panel according to some embodiments of this application.

[0073] Reference numerals: Display panel 100; Display device 200; Substrate 10; Base 11; Driving circuit 13; Array composite layer 12;

[0074] Light-emitting device 31; first electrode 141; first light-emitting part 171; second electrode 181; encapsulation layer 19; first encapsulation part 191; second encapsulation part 192; third encapsulation part 193; covering part 194; first gap 194J1; second gap 194J2; first electrode layer 14; barrier electrode part 182; electrode filling part 183; light-emitting layer 17; second light-emitting part 172; second electrode layer 18; pixel definition layer 15; pixel definition structure 151; pixel opening 152;

[0075] Isolation structure 16; First isolation structure 161; Second isolation structure 162; Support part 1601; Crown part 1602; First sidewall 1601a; Second sidewall 1601b; First protruding structure 1602a; Second protruding structure 1602b;

[0076] Red subpixel R; green subpixel G; and blue subpixel B; second length d2; first length d1; second height h2; first height h1; isolation opening 16K; light-transmitting opening 16T. Detailed Implementation

[0077] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0078] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0079] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0080] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0081] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0082] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0083] In related technologies, OLED display panels suffer from problems such as insufficient encapsulation performance and reliability failure.

[0084] To address the challenges of improving the packaging performance and reliability of display panels, this application presents a display panel, its manufacturing method, and a display device, aiming to enhance the packaging performance and reliability of the display panel.

[0085] Please see Figures 1 to 6 , Figure 1 This is a partial top view of a display panel provided for some embodiments of this application. Figure 2 This is a first partial cross-sectional schematic diagram of a display panel provided for some embodiments of this application. Figure 3 This is a second partial cross-sectional schematic diagram of a display panel provided for some embodiments of this application. Figure 4 This is a third partial cross-sectional schematic diagram of a display panel provided for some embodiments of this application. Figure 5 This is a fourth partial cross-sectional schematic diagram of a display panel provided for some embodiments of this application. Figure 6 This is a fifth partial cross-sectional schematic diagram of a display panel provided for some embodiments of this application. Figures 2 to 6 for Figure 1 A cross-sectional diagram along the CC direction (middle dashed line). Figure 2 The diagram shows multiple isolation structures, but does not show the first light-emitting part and the second electrode of the light-emitting device. Figure 6 and Figure 5 The setting of the middle encapsulation layer and Figure 4 and Figure 3 There are differences.

[0086] "The composition and preparation of the isolation structure mentioned below are further described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 100935, PCT / CN2024 / 102785, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and CN116685174A for reference."

[0087] Firstly, please refer to Figures 1 to 6 This application provides a display panel 100, which includes a substrate 10, a plurality of isolation structures 16 and a plurality of light-emitting devices 31. Multiple isolation structures 16 are spaced apart on one side of the substrate 10, and each isolation structure 16 defines an isolation opening 16K. At least a portion of the light-emitting devices 31 are disposed within the isolation opening 16K. Each isolation structure 16 includes a support portion 1601 and a crown portion 1602 sequentially stacked on the substrate 10. The sidewalls of the support portion 1601 include a first sidewall 1601a facing the adjacent light-emitting device 31 and a second sidewall 1601b away from the adjacent light-emitting device 31. In a direction parallel to the plane of the substrate 10, the crown portion 1602 protrudes relative to the first sidewall 1601a in the direction toward the light-emitting device 31 to form a first protruding structure 1602a, and the crown portion 1602 protrudes relative to the second sidewall 1601b in the direction away from the light-emitting device 31 to form a second protruding structure 1602b. In a direction parallel to the plane of the substrate 10, the dimension of the second protruding structure 1602b in the direction away from the light-emitting device 31 is larger than the dimension of the first protruding structure 1602a in the direction toward the light-emitting device 31.

[0088] It should be noted that, Figure 1 The example provided is merely one pixel arrangement method and / or isolation structure setting method. The pixel arrangement method and / or isolation structure setting method in the embodiments of this application may also be other forms. Figure 1 The diagram illustrates that the display panel 100 includes a red subpixel R, a green subpixel G, and a blue subpixel B. The display panel 100 may also be in other color display modes, and may also include subpixels other than the red subpixel R, green subpixel G, and blue subpixel B.

[0089] For example, the substrate 10 can be an array substrate, and the substrate 10 can include a plurality of driving circuits 13. For example, the substrate 10 includes a substrate 11 and a plurality of driving circuits 13 disposed on one side of the substrate 11. For example, the substrate 10 can include a substrate 11 and an array composite layer 12 disposed on one side of the substrate 11, and a plurality of driving circuits 13 disposed on the array composite layer 12. The film structure of the array composite layer 12 can include a film layer of a plurality of transistors and driving lines in the plurality of driving circuits 13. For example, two isolation structures 16 are provided between two adjacent light-emitting devices 31, that is, the plurality of isolation structures 16 include a first isolation structure 161 and a second isolation structure 162 located between two adjacent light-emitting devices 31 and respectively adjacent to the two light-emitting devices 31; between two adjacent light-emitting devices 31, a first isolation structure 161 and a second isolation structure 162 are provided, the first isolation structure 161 is adjacent to one light-emitting device 31, and the second isolation structure 162 is adjacent to the other light-emitting device 31. Figure 3 The light-emitting device 31 located on the side of the second isolation structure 162 away from the first isolation structure 161 is not fully shown.

[0090] For example, the isolation structure 16 includes a first sidewall 1601a and a second sidewall 1601b. The first sidewall 1601a encloses an isolation opening 16K, and the second sidewall 1601b is located on the side of the isolation structure 16 away from the isolation opening 16K. The light-emitting device 31 is at least partially accommodated within the corresponding isolation opening 16K. The isolation structure 16 includes a support portion 1601 and a crown portion 1602 sequentially stacked on the substrate 10. The orthographic projection of the support portion 1601 onto the substrate 10 lies within the orthographic projection of the crown portion 1602 onto the substrate 10. In a direction parallel to the plane of the substrate 10, the crown portion 1602 protrudes relative to the first sidewall 1601a in a direction toward the light-emitting device 31 to form a first length d1, and the crown portion 1602 protrudes relative to the second sidewall 1601b in a direction away from the light-emitting device 31 to form a second length d2. The second length d2 is greater than the first length d1.

[0091] For example, the isolation structure 16 (the support portion 1601 of the isolation structure 16) includes a first sidewall 1601a and a second sidewall 1601b. The first sidewall 1601a encloses and forms an isolation opening 16K. The second sidewall 1601b is located on the side of the isolation structure 16 away from the isolation opening 16K. The light-emitting device 31 is at least partially accommodated in the corresponding isolation opening 16K.

[0092] For example, in some embodiments, the display panel 100 includes a plurality of light-emitting devices 31, at least a portion of which are disposed within corresponding isolation openings 16K; in other embodiments, at least a portion of the light-emitting devices 31 are disposed within corresponding isolation openings 16K.

[0093] For example, such as Figure 1 As shown, the orthographic projection of the isolation structure 16 on the substrate 10 is the orthographic projection of the corresponding light-emitting device 31 on the substrate 10. For example, the isolation structure 16 is annular, and the first sidewall 1601a surrounds and forms the isolation opening 16K.

[0094] It should be noted that in some other embodiments, the second sidewall 1601b surrounds and forms a light-transmitting opening 16T, for example... Figure 1 Different annular isolation structures 16 can be interconnected so that the second sidewall 1601b encloses and forms a light-transmitting opening 16T. In some directions, the isolation opening 16K and the light-transmitting opening 16T can be alternately arranged. By setting the light-transmitting opening 16T, the area where the light-transmitting opening 16T is located can transmit light to facilitate under-display recognition (such as fingerprint recognition, camera, etc.) or transparent display. In other embodiments, the light-transmitting opening 16T is not used for light transmission; it is merely the area enclosed by the second sidewall 1601b.

[0095] For example, the isolation structure 16 includes a support portion 1601 and a crown portion 1602 sequentially stacked on the substrate 10, with the orthographic projection of the support portion 1601 onto the substrate 10 located within the orthographic projection of the crown portion 1602 onto the substrate 10. Thus, the portion of the isolation structure 16 at least away from the substrate 11 is configured with a shape that is wider at the top and narrower at the bottom, allowing the isolation structure 16 to block other film layers such as the light-emitting layer or hole transport layer (HTL) of adjacent light-emitting devices 31. This saves on expensive fine metal mask (FMM) plates, thereby reducing the manufacturing cost of the display panel. At the same time, without using a fine metal mask (FMM), the light-emitting area of ​​the sub-pixels is not limited by the opening of the fine metal mask, allowing the light-emitting area of ​​the sub-pixels to be made smaller, and a greater number of sub-pixels can be formed in the display panel, thereby improving the resolution of the display panel.

[0096] For example, the first sidewall 1601a faces the adjacent light-emitting device 31, and the second sidewall 1601b faces away from the adjacent light-emitting device 31. The second sidewall 1601b of the first isolation structure 161 is disposed opposite to the second sidewall 1601b of the second isolation structure 162.

[0097] For example, in a direction parallel to the plane of the substrate 10, the crown 1602 protrudes relative to the first sidewall 1601a in the direction toward the light-emitting device 31 to form a first protruding structure 1602a, that is, a first undercut structure is formed.

[0098] For example, in a direction parallel to the plane of the substrate 10, the crown 1602 protrudes relative to the second sidewall 1601b in a direction away from the light-emitting device 31 to form a second protruding structure 1602b, that is, a second undercut structure is formed.

[0099] For example, in the direction parallel to the plane of the substrate 10, the second protruding structure 1602b has a second dimension (i.e., a second length d2) in the direction away from the light-emitting device 31, and the first protruding structure 1602a has a first dimension (i.e., a first length d1) in the direction toward the light-emitting device 31. The second dimension is greater than the first dimension (i.e., the second length d2 is greater than the first length d1).

[0100] For example, when manufacturing the second protruding structure 1602b, the second dimension can be made larger than the first dimension by increasing the etching amount of the support portion 1601 below the second protruding structure 1602b.

[0101] In this embodiment, in the direction parallel to the plane of the substrate 10, the dimension of the second protruding structure 1602b in the direction away from the light-emitting device 31 is greater than the dimension of the first protruding structure 1602a in the direction towards the light-emitting device 31, that is, the second dimension is greater than the first dimension (the second length d2 is greater than the first length d1). This allows the encapsulation layer 19 to cover or encapsulate the isolation structure 16 and the light-emitting device 31, thus covering a larger area on the second sidewall 1601b (in the direction perpendicular to the plane of the substrate 10, the encapsulation layer 19 covers a larger dimension on the second sidewall 1601b). This increases the contact area between the encapsulation layer 19 and the second sidewall 1601b, which can better prevent moisture and oxygen from entering, thereby improving the encapsulation performance and reliability of the display panel. Furthermore, in the direction perpendicular to the plane of the substrate 10, the encapsulation layer 19 can cover the entire second sidewall 1601b, and the encapsulation layer 19 extends to cover the surface of the corresponding pixel definition structure 151 near the second sidewall 1601b. The encapsulation layer 19 is in direct contact with the pixel definition structure 151, which can prevent the formation of channels for water vapor and oxygen entry through the residual material of the light-emitting layer 17, and at the same time further increases the encapsulation area of ​​the encapsulation layer 19, thereby further preventing water vapor and oxygen from entering, thereby improving the encapsulation performance and reliability of the display panel. Meanwhile, compared with the second size, the first size is smaller. The first protruding structure 1602a and the first sidewall 1601a can block the light-emitting layer or hole transport layer HTL and other film layers of adjacent light-emitting devices 31, while ensuring that the second electrode 181 is attached to the first sidewall 1601a. ​​The support portion 1601 is a conductive structure, ensuring that electrical signals can be provided to the second electrode 181 through the support portion 1601.

[0102] In some implementations, such as Figures 1 to 6 As shown, the light-emitting device 31 includes a first electrode 141, a first light-emitting part 171, and a second electrode 181 stacked sequentially; the display panel 100 also includes a plurality of encapsulation layers 19, which are correspondingly disposed with respect to the light-emitting device 31; the encapsulation layer 19 is disposed on the side of the second electrode 181 of the corresponding light-emitting device 31 away from the substrate 10, and the encapsulation layer 19 covers the second electrode 181 and at least part of the isolation structure 16. In the direction perpendicular to the plane of the substrate 10, the size of the encapsulation layer 19 in direct contact with the second sidewall 1601b is larger than the size of the encapsulation layer 19 in direct contact with the first sidewall 1601a.

[0103] For example, in some embodiments, the display panel 100 may include a first electrode layer 14, a light-emitting layer 17, and a second electrode layer 18. The first electrode layer 14 includes a plurality of first electrodes 141, which are electrically connected to the driving circuit 13. The light-emitting layer 17 may include a plurality of first light-emitting portions 171, and different first light-emitting portions 171 may be located in different light-emitting devices 31. The second electrode layer 18 may include a plurality of second electrodes 181, and different second electrodes 181 are located in different light-emitting devices 31.

[0104] For example, in some implementations, at least a portion of the isolation structure 16 is covered by the corresponding encapsulation layer 19; in other implementations, at least a portion of the isolation structure 16 is covered by the corresponding encapsulation layer 19.

[0105] For example, in some embodiments, the sub-film layers or materials in the first light-emitting portion 171 of different colored light-emitting devices 31 may be partially the same or completely different.

[0106] For example, the light-emitting device 31 may also include other film layers besides the light-emitting material layer (EML, i.e., the first light-emitting part 171) between the first electrode 141 and the second electrode 181. For example, it may also include one or more of the following: hole injection layer (HIL), hole transport layer (HTL), electron injection layer (EIL), electron transport layer (ETL), hole block layer (HBL), and electron block layer (EBL).

[0107] For example, such as Figures 3 to 6As shown, in the direction perpendicular to the plane of the substrate 10, the dimension in direct contact between the encapsulation layer 19 and the second sidewall 1601b is the second height h2, and the dimension in direct contact between the encapsulation layer 19 and the first sidewall 1601a is the first height h1. The second height h2 is greater than the first height h1.

[0108] For example, such as Figures 3 to 6 As shown, in the direction perpendicular to the plane of the substrate 10, the size of the encapsulation layer 19 directly contacting the second sidewall 1601b is larger than the size of the encapsulation layer 19 directly contacting the first sidewall 1601a. ​​That is, the second height h2 is greater than the first height h1, which increases the contact area between the encapsulation layer 19 and the second sidewall 1601b, better preventing moisture and oxygen from entering, thereby improving the encapsulation performance and reliability of the display panel. At the same time, the first height h1 is small, meaning that the overlap size of the second electrode 181 on the first sidewall 1601a is sufficiently large, and the support portion 1601 is a conductive structure, ensuring that electrical signals can be provided to the second electrode 181 through the support portion 1601.

[0109] In some implementations, such as Figures 3 to 6 As shown, the encapsulation layer 19 includes a first encapsulation portion 191, a second encapsulation portion 192, and a third encapsulation portion 193 connected in sequence. The first encapsulation portion 191 covers the second electrode 181, the second encapsulation portion 192 covers the first sidewall 1601a, the surface of the crown 1602 facing the substrate 10, and the side end face of the crown 1602, and the third encapsulation portion 193 covers at least a portion of the second sidewall 1601b.

[0110] For example, in some embodiments, at least a portion of the second sidewall 1601b is covered by the corresponding third encapsulation portion 193; in other embodiments, at least a portion of the second sidewall 1601b is covered by the corresponding third encapsulation portion 193.

[0111] For example, in some embodiments, the third encapsulation portion 193, the second encapsulation portion 192, and the first encapsulation portion 191 are connected in sequence.

[0112] For example, in some embodiments, such as Figure 3 As shown, the isolation structure 16 blocks the light-emitting layer 17, so that the first light-emitting part 171 is accommodated between two opposing first sidewalls 1601a. ​​The light-emitting layer 17 also includes a second light-emitting part 172 disposed on the side of the isolation structure 16 away from the substrate 10 (the second light-emitting part 172 may not be used for light emission).

[0113] For example, in some embodiments, such as Figures 3 to 6As shown, the second encapsulation portion 192 covers the second light-emitting portion 172, and the second electrode layer 18 also includes a blocking electrode portion 182 located on the side of the crown portion 1602 away from the substrate 10. The blocking electrode portion 182 covers the second light-emitting portion 172, and the second encapsulation portion 192 covers the blocking electrode portion 182.

[0114] For example, in some embodiments, such as Figures 3 to 6 As shown, a third encapsulation part 193, a second encapsulation part 192, a first encapsulation part 191, another second encapsulation part 192 and another third encapsulation part 193 are connected in sequence to form an encapsulation layer 19.

[0115] In some ways, such as Figures 3 to 6 As shown, the third encapsulation portion 193 is in direct contact with the second sidewall 1601b. The encapsulation layer 19 also includes a cover portion 194 connected to the third encapsulation portion 193. One end of the cover portion 194 is connected to the end of the third encapsulation portion 193 away from the second encapsulation portion 192, and the other end of the cover portion 194 extends in a direction away from the second sidewall 1601b or away from the substrate 10.

[0116] For example, in some embodiments, during the manufacturing process of the display panel, when forming the first light-emitting part 171, the second electrode 181 and the encapsulation layer 19, a dummy light-emitting part disposed on the same layer and material as the first light-emitting part 171, a dummy second electrode part disposed on the same layer and material as the second electrode 181, and a dummy encapsulation part disposed on the same layer and material as the encapsulation layer 19 are simultaneously stacked and formed between the opposing first sidewall 1601a and second sidewall 1601b. At this time, the dummy light-emitting part, the dummy second electrode part and the dummy encapsulation part are removed by an etching process to form the cover part 194.

[0117] For example, the other end of the cover portion 194 extends away from the second sidewall 1601b or away from the substrate 10, that is, the cover portion 194 and the second sidewall 1601b (as shown) Figure 3 and Figure 4 The dummy light-emitting portion and dummy second electrode portion (such as) between the substrate 10 and / or the substrate 10 Figure 5 and Figure 6 At least some of the parts are etched away, for example, the dummy light-emitting part is completely etched away, and the dummy second electrode part is at least partially etched away, which reduces the adsorption and penetration capacity of water vapor and oxygen at the cover part 194, and improves the packaging performance and reliability.

[0118] In some implementations, such as Figure 3 and Figure 4As shown, one end of the third encapsulation portion 193 away from the second encapsulation portion 192 is located on the second sidewall 1601b, and the other end of the cover portion 194 extends in a direction away from the second sidewall 1601b; at least a portion of the surface of the cover portion 194 near the second sidewall 1601b has a first gap 194J1 between it and the second sidewall 1601b.

[0119] For example, in some embodiments, such as Figure 3 As shown, between two adjacent light-emitting devices 31, the dummy light-emitting portion, which is made of the same layer and material as the first light-emitting portion 171, and the dummy second electrode portion, which is made of the same layer and material as the second electrode 181, between the oppositely arranged first sidewall 1601a and second sidewall 1601b, are completely etched away. This results in the encapsulation layer 19 covering the edge of the dummy second electrode forming a cover portion 194. The dummy light-emitting portion and / or the dummy second electrode portion between the cover portion 194 and the second sidewall 1601b or / and the substrate 10 are completely etched away, forming a first gap 194J1. This reduces the adsorption and permeation capacity of water vapor and oxygen at the cover portion 194, thereby improving the encapsulation performance and reliability.

[0120] In some embodiments, such as Figure 4 As shown, the display panel 100 also includes an electrode filling portion 183 disposed in the same layer and material as the second electrode 181, and at least a portion of the electrode filling portion 183 fills the first gap 194J1.

[0121] For example, in some embodiments, the display panel 100 includes a plurality of electrode filling portions 183, at least a portion of which fill a corresponding first gap 194J1; in other embodiments, at least a portion of the electrode filling portions 183 fills a corresponding first gap 194J1.

[0122] For example, such as Figure 4 As shown, the electrode filling part 183 can fill a portion of the first gap 194J1, and the electrode filling part 183 can prevent the covering part 194 from collapsing.

[0123] For example, such as Figure 4 As shown, the electrode filling part 183 can fill the entire portion of the first gap 194J1, and the electrode filling part 183 can prevent the covering part 194 from collapsing.

[0124] For example, in some embodiments, the electrode filling portion 183 is the portion remaining after the dummy second electrode has been etched.

[0125] In some implementations, such as Figure 5 and Figure 6As shown, the display panel 100 also includes a pixel definition layer 15 disposed on the substrate 10, and an isolation structure 16 disposed on the side of the pixel definition layer 15 away from the substrate 10; the pixel definition layer 15 includes a plurality of pixel definition structures 151, each pixel definition structure 151 defining a pixel opening 152, the pixel opening 152 being disposed corresponding to the first electrode 141; the third encapsulation portion 193 covers the second sidewall 1601b and the surface of the corresponding pixel definition structure 151 near the second sidewall 1601b, and the other end of the covering portion 194 extends in a direction away from the substrate 10; at least a portion of the surface of the covering portion 194 near the pixel definition structure 151 has a second gap 194J2 between it and the pixel definition structure 151.

[0126] For example, such as Figure 5 and Figure 6 As shown, multiple pixel openings 152 are surrounded by multiple pixel definition structures 151, and the pixel openings 152 expose the corresponding first electrode 141.

[0127] For example, such as Figure 5 and Figure 6 As shown, the third encapsulation portion 193 covers the second sidewall 1601b and extends to cover the surface of the corresponding pixel definition structure 151 near the second sidewall 1601b. That is, the third encapsulation portion 193 directly contacts the entire surface of the second sidewall 1601b and extends to cover the part where the pixel definition structure 151 connects with the second sidewall 1601b. At this time, the area of ​​the encapsulation layer 19 directly contacting the second sidewall 1601b and the pixel definition structure 151 is larger, which can further and better prevent moisture and oxygen from entering, thereby improving the encapsulation performance and reliability of the display panel.

[0128] For example, such as Figure 5 and Figure 6 As shown, the other end of the cover portion 194 extends in a direction away from the substrate 10 and the second sidewall 1601b.

[0129] Alternatively, in some embodiments, such as Figure 6 As shown, the display panel 100 also includes an electrode filling portion 183 disposed in the same layer and material as the second electrode 181, and at least a portion of the electrode filling portion 183 fills the second gap 194J2.

[0130] For example, in some embodiments, the display panel 100 includes a plurality of electrode filling portions 183, at least a portion of which fill the corresponding second gaps 194J2; in other embodiments, at least a portion of the electrode filling portions 183 fills the corresponding second gaps 194J2.

[0131] For example, such as Figure 6As shown, the electrode filling part 183 can fill a portion of the second gap 194J2, and the electrode filling part 183 can prevent the covering part 194 from collapsing.

[0132] Optionally, the pixel definition structure 151 covers the edge of the corresponding first electrode 141, and the first light-emitting part 171 is disposed on the side of the corresponding first electrode 141 and pixel definition structure 151 away from the substrate 10.

[0133] Optionally, in some embodiments, the pixel definition layer 15 is made of an inorganic material.

[0134] For example, in Figure 5 and Figure 6 In the example, the encapsulation layer 19 is in direct contact with the pixel definition structure 151. The pixel definition layer 15 is made of inorganic material. The encapsulation layer 19, the pixel definition structure 151, and the isolation structure 16 form a larger area of ​​inorganic material sealing structure, creating a larger area of ​​water vapor and oxygen entry barrier. This can further prevent water vapor and oxygen from entering, thereby improving the encapsulation performance and reliability of the display panel.

[0135] For example, the material of the pixel definition layer 15 may include, but is not limited to, any one of silicon nitride, silicon oxide, and silicon oxynitride.

[0136] For example, the material of the encapsulation layer 19 may include, but is not limited to, any one of silicon nitride, silicon oxide, and silicon oxynitride.

[0137] In some embodiments, the difference between the size of the second protruding structure 1602b in the direction away from the light-emitting device 31 and the size of the first protruding structure 1602a in the direction toward the light-emitting device 31 is greater than 0.1 micrometers in the direction parallel to the plane of the substrate 10.

[0138] For example, in the direction parallel to the plane of the substrate 10, the second protruding structure 1602b has a second dimension (second length d2) in the direction away from the light-emitting device 31, and the first protruding structure 1602a has a first dimension (first length d1) in the direction towards the light-emitting device 31. The second dimension is larger than the first dimension. The difference between the second length d2 and the first length d1 is greater than 0.1 micrometers, so that when the encapsulation layer 19 covers the encapsulation isolation structure 16 and the light-emitting device 31, the encapsulation layer 19 covers a larger area on the second sidewall 1601b, increasing the contact area between the encapsulation layer 19 and the second sidewall 1601b. This better prevents moisture and oxygen from entering, thereby improving the encapsulation performance and reliability of the display panel.

[0139] For example, in some embodiments, the difference between the second length d2 and the first length d1 can be greater than any of the values ​​of 0.1 micrometer, 0.2 micrometer, 0.3 micrometer, 0.4 micrometer and 0.5 micrometer.

[0140] Optionally, in some embodiments, the second protruding structure 1602b has a size ranging from 0.5 to 1.5 micrometers in the direction away from the light-emitting device 31 in a direction parallel to the plane of the substrate 10.

[0141] For example, the second length d2 is any value from 0.5 to 1.5 micrometers, such as 0.5 micrometers, 0.7 micrometers, 0.9 micrometers, 1.0 micrometers, 1.2 micrometers, and 1.5 micrometers.

[0142] Optionally, in some embodiments, the size of the first protruding structure 1602a in the direction toward the light-emitting device 31 ranges from 0.3 to 0.7 micrometers in a direction parallel to the plane of the substrate 10.

[0143] For example, the first length d1 is any value from 0.3 to 0.7 micrometers, such as any value among 0.3 micrometers, 0.4 micrometers, 0.5 micrometers, 0.6 micrometers, and 0.7 micrometers.

[0144] In some embodiments, the support portion 1601 is a conductive structure, and the second electrode 181 overlaps with the second sidewall 1601b. An electrical signal can be provided to the second electrode 181 through the support portion 1601.

[0145] Optionally, in some embodiments, the support portion 1601 and the crown portion 1602 are integrally formed.

[0146] Optionally, in some embodiments, the support portion 1601 and the crown portion 1602 are made of different materials.

[0147] For example, the support portion 1601 and the crown portion 1602 can be a multi-layered stacked structure, which facilitates the use of different materials for each. For example, the support portion 1601 is designed to be a conductive material, and the crown portion 1602 is designed to be an insulating material. For example, the support portion 1601 is designed to be a conductive material, and the crown portion 1602 is designed to be a conductive material, but the etching rate of the support portion 1601 is greater than the etching rate of the crown portion 1602. For example, the support portion 1601 and the crown portion 1602 can be configured as an integrated structure to increase the robustness of the isolation structure 16.

[0148] For example, the support portion 1601 includes at least one metal layer. In one example, the support portion 1601 includes one metal layer. Further, the material of the support portion 1601 includes at least one of a metal and a metal oxide. Exemplarily, the metal may be silver, copper, titanium, aluminum, etc. The metal oxide may be tin oxide, zinc oxide, cadmium oxide, indium oxide, indium tin oxide, zinc indium oxide, zinc gallium oxide, zinc aluminum oxide, titanium tantalum oxide, etc.

[0149] For example, the crown 1602 may be made of titanium or molybdenum.

[0150] For example, in some embodiments, the stacked structure of the isolation structure 16 may be titanium / aluminum / titanium or molybdenum / aluminum / molybdenum. By providing the stacked three metal layers, the resistance of the isolation structure 16 can be reduced, thereby reducing the power consumption of the display panel 100.

[0151] Optionally, in some embodiments, the isolation structure 16 is annular in the plane parallel to the substrate 10.

[0152] For example, the isolation structure 16 is annular, and the orthographic projection of the isolation structure 16 on the substrate 10 is the orthographic projection of the corresponding light-emitting device 31 on the substrate 10.

[0153] For example, such as Figure 1 As shown, the orthographic projection of the isolation structure 16 on the substrate 10 is the orthographic projection of the corresponding light-emitting device 31 on the substrate 10. For example, the isolation structure 16 is annular, so that the first light-emitting part 171 and the second electrode 181 can be disconnected by the isolation structure 16 in all directions, allowing the light-emitting device 31 to emit light independently. At the same time, the encapsulation layer 19 forms a well-sealed structure in all directions, improving encapsulation performance and reliability.

[0154] Secondly, please refer to Figures 1 to 6This application provides a display panel 100, which includes a substrate 10, a plurality of isolation structures 16, a plurality of light-emitting devices 31, and a plurality of encapsulation layers 19. The plurality of isolation structures 16 are spaced apart on one side of the substrate 10, and each isolation structure 16 defines an isolation opening 16K. At least a portion of the light-emitting devices 31 are disposed within the isolation opening 16K. The encapsulation layers 19 are correspondingly disposed with respect to the light-emitting devices 31. Each isolation structure 16 includes a support portion 1601 and a crown portion 1602 sequentially stacked on the substrate 10. The sidewalls of the support portion 1601 include a first sidewall 1601a facing the adjacent light-emitting device 31 and a second sidewall 1601b away from the adjacent light-emitting device 31. The encapsulation layer 19 is disposed on the side of the corresponding light-emitting device 31 away from the substrate 10, and covers the light-emitting device 31 and at least a portion of the isolation structures 16. In a direction perpendicular to the plane of the substrate 10, the size of the encapsulation layer 19 directly contacting the second sidewall 1601b is larger than the size of the encapsulation layer 19 directly contacting the first sidewall 1601a.

[0155] For example, the encapsulation layer 19 is disposed on the side of the second electrode 181 of the corresponding light-emitting device 31 away from the substrate 10, and the encapsulation layer 19 covers the second electrode 181 and at least part of the isolation structure 16.

[0156] In the embodiments of this application, such as Figures 3 to 6 As shown, in the direction perpendicular to the plane of the substrate 10, the size of the encapsulation layer 19 directly contacting the second sidewall 1601b is larger than the size of the encapsulation layer 19 directly contacting the first sidewall 1601a. ​​That is, the second height h2 is greater than the first height h1, which increases the contact area between the encapsulation layer 19 and the second sidewall 1601b, better preventing moisture and oxygen from entering, thereby improving the encapsulation performance and reliability of the display panel. At the same time, the first height h1 is small, meaning that the overlap size of the second electrode 181 on the first sidewall 1601a is sufficiently large, and the support portion 1601 is a conductive structure, ensuring that electrical signals can be provided to the second electrode 181 through the support portion 1601.

[0157] Furthermore, in this embodiment, the first light-emitting part 171 and the second electrode 181 can be disconnected by the isolation structure 16 in all directions, allowing the light-emitting device 31 to emit light independently. Simultaneously, the encapsulation layer 19 forms a well-sealed structure in all directions, improving encapsulation performance and reliability.

[0158] In some embodiments, in a direction parallel to the plane of the substrate 10, the crown 1602 protrudes relative to the first sidewall 1601a in the direction toward the light-emitting device 31 to form a first protruding structure 1602a, and the crown 1602 protrudes relative to the second sidewall 1601b in the direction away from the light-emitting device 31 to form a second protruding structure 1602b; in a direction parallel to the plane of the substrate 10, the dimension of the second protruding structure 1602b in the direction away from the light-emitting device 31 is greater than the dimension of the first protruding structure 1602a in the direction toward the light-emitting device 31.

[0159] In some implementations, such as Figures 3 to 6 As shown, the encapsulation layer 19 includes a first encapsulation portion 191, a second encapsulation portion 192, and a third encapsulation portion 193 connected in sequence. The first encapsulation portion 191 covers the second electrode 181, the second encapsulation portion 192 covers the first sidewall 1601a, the surface of the crown 1602 facing the substrate 10, and the side end face of the crown 1602, and the third encapsulation portion 193 covers at least a portion of the second sidewall 1601b.

[0160] In some ways, such as Figures 3 to 6 As shown, the third encapsulation portion 193 is in direct contact with the second sidewall 1601b. The encapsulation layer 19 also includes a cover portion 194 connected to the third encapsulation portion 193. One end of the cover portion 194 is connected to the end of the third encapsulation portion 193 away from the second encapsulation portion 192, and the other end of the cover portion 194 extends in a direction away from the second sidewall 1601b or away from the substrate 10.

[0161] In some implementations, such as Figure 3 and Figure 4 As shown, one end of the third encapsulation portion 193 away from the second encapsulation portion 192 is located on the second sidewall 1601b, and the other end of the cover portion 194 extends in a direction away from the second sidewall 1601b; at least a portion of the surface of the cover portion 194 near the second sidewall 1601b has a first gap 194J1 between it and the second sidewall 1601b.

[0162] Alternatively, in some embodiments, such as Figure 4 As shown, the display panel 100 also includes an electrode filling portion 183 disposed in the same layer and material as the second electrode 181, and at least a portion of the electrode filling portion 183 fills the first gap 194J1.

[0163] In some implementations, such as Figure 5 and Figure 6As shown, the display panel 100 also includes a pixel definition layer 15 disposed on the substrate 10, and an isolation structure 16 disposed on the side of the pixel definition layer 15 away from the substrate 10; the light-emitting device 31 includes a first electrode 141, a first light-emitting part 171 and a second electrode 181 disposed in sequence; the pixel definition layer 15 includes a plurality of pixel definition structures 151, each pixel definition structure 151 defining a pixel opening 152, the pixel opening 152 being disposed corresponding to the first electrode 141; the third encapsulation part 193 covers the second sidewall 1601b and the surface of the corresponding pixel definition structure 151 near the second sidewall 1601b, and the other end of the covering part 194 extends in a direction away from the substrate 10; at least a portion of the surface of the covering part 194 near the pixel definition structure 151 has a second gap 194J2 between it and the pixel definition structure 151.

[0164] Alternatively, in some embodiments, such as Figure 6 As shown, the display panel 100 also includes an electrode filling portion 183 disposed in the same layer and material as the second electrode 181, and at least a portion of the electrode filling portion 183 fills the second gap 194J2.

[0165] Optionally, in some embodiments, the pixel definition structure 151 covers the edge of the corresponding first electrode 141, and the first light-emitting part 171 is disposed on the side of the corresponding first electrode 141 and pixel definition structure 151 away from the substrate 10.

[0166] Optionally, in some embodiments, the pixel definition layer 15 is made of an inorganic material.

[0167] In some implementations, the difference between the second length d2 and the first length d1 is greater than 0.1 micrometers.

[0168] Optionally, in some embodiments, the second length ranges from 0.5 to 1.5 micrometers.

[0169] Optionally, in some embodiments, the first length ranges from 0.3 to 0.7 micrometers.

[0170] In some embodiments, the support portion 1601 is a conductive structure, and the second electrode 181 overlaps with the second sidewall 1601b. An electrical signal can be provided to the second electrode 181 through the support portion 1601.

[0171] Optionally, in some embodiments, the support portion 1601 and the crown portion 1602 are integrally formed.

[0172] Optionally, in some embodiments, the support portion 1601 and the crown portion 1602 are made of different materials.

[0173] For example, illustrating one structure of substrate 10, substrate 10 may include a substrate 11, a first semiconductor layer, a first insulating layer, a first metal layer, a second insulating layer, a second metal layer, a third insulating layer, a second semiconductor layer, a fourth insulating layer, a metal oxide layer, a fifth insulating layer, a third metal layer, a first planarization layer, a fourth metal layer, a second planarization layer, a fifth metal layer, and a third planarization layer stacked sequentially. Driving circuit 13 includes devices such as transistors and capacitors, which are disposed within the aforementioned film layers.

[0174] Please see Figure 7 , Figure 7 This is a schematic diagram of a display device 200 provided for some embodiments of this application.

[0175] Thirdly, please refer to Figure 7 This application provides a display device 200, which includes a display panel 100 of any one of the above features, or a display panel 100 that combines any of the above features.

[0176] For example, the display device 200 may be a mobile phone, a laptop, a television, etc., but is not limited to these.

[0177] Please see Figure 8 , Figure 8 This is a schematic flowchart illustrating a method for manufacturing a display panel according to some embodiments of this application.

[0178] Fourthly, please refer to Figure 8 This application provides a method for manufacturing a display panel. The display panel described above can be manufactured using this method. The method for manufacturing a display panel includes steps S100, S200, and S300.

[0179] Step S100: Provide a substrate 10.

[0180] In step S200, a plurality of isolation structures 16 are formed on one side of the substrate 10. The isolation structures 16 are spaced apart on one side of the substrate 10 and the isolation structures 16 define isolation openings 16K.

[0181] In step S300, a plurality of light-emitting devices 31 are formed on one side of the substrate 10, and at least some of the light-emitting devices 31 are disposed within the isolation opening 16K;

[0182] The isolation structure 16 includes a support portion 1601 and a crown portion 1602 stacked sequentially on the substrate 10. The sidewalls of the support portion 1601 include a first sidewall 1601a facing the adjacent light-emitting device 31 and a second sidewall 1601b away from the adjacent light-emitting device.

[0183] In a direction parallel to the plane of the substrate 10, the crown 1602 protrudes relative to the first sidewall 1601a in the direction toward the light-emitting device 31 to form a first protruding structure 1602a, and the crown 1602 protrudes relative to the second sidewall 1601b in the direction away from the light-emitting device 31 to form a second protruding structure 1602b.

[0184] In the direction parallel to the plane of the substrate 10, the dimension of the second protruding structure 1602b in the direction away from the light-emitting device 31 is larger than the dimension of the first protruding structure 1602a in the direction toward the light-emitting device 31.

[0185] For example, when manufacturing the second protruding structure 1602b, the second dimension can be made larger than the first dimension by increasing the etching amount of the support portion 1601 below the second protruding structure 1602b.

[0186] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0187] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: substrate; Multiple isolation structures are spaced apart on one side of the substrate, and each isolation structure defines an isolation opening; Multiple light-emitting devices, at least some of which are disposed within the isolation opening; The isolation structure includes a support portion and a crown portion stacked sequentially on the substrate. The sidewalls of the support portion include a first sidewall facing the adjacent light-emitting device and a second sidewall away from the adjacent light-emitting device. In a direction parallel to the plane of the substrate, the crown protrudes relative to the first sidewall in a direction toward the light-emitting device to form a first protruding structure, and the crown protrudes relative to the second sidewall in a direction away from the light-emitting device to form a second protruding structure; In a direction parallel to the plane of the substrate, the dimension of the second protruding structure in the direction away from the light-emitting device is greater than the dimension of the first protruding structure in the direction toward the light-emitting device.

2. The display panel according to claim 1, characterized in that, The light-emitting device includes a first electrode, a first light-emitting part, and a second electrode arranged in sequence. The display panel further includes multiple encapsulation layers, which are correspondingly disposed with respect to the light-emitting device; The encapsulation layer is disposed on the side of the second electrode of the corresponding light-emitting device away from the substrate. The encapsulation layer covers the second electrode and at least part of the isolation structure. In the direction perpendicular to the plane of the substrate, the size of the encapsulation layer in direct contact with the second sidewall is larger than the size of the encapsulation layer in direct contact with the first sidewall.

3. The display panel according to claim 2, characterized in that, The encapsulation layer includes a first encapsulation portion, a second encapsulation portion, and a third encapsulation portion connected in sequence. The first encapsulation portion covers the second electrode, the second encapsulation portion covers the first sidewall, the surface of the crown portion facing the substrate, and the side end face of the crown portion, and the third encapsulation portion covers at least a portion of the second sidewall.

4. The display panel according to claim 3, characterized in that, The third encapsulation portion is in direct contact with the second sidewall. The encapsulation layer also includes a cover portion connected to the third encapsulation portion. One end of the cover portion is connected to the end of the third encapsulation portion away from the second encapsulation portion, and the other end of the cover portion extends in a direction away from the second sidewall or away from the substrate.

5. The display panel according to claim 4, characterized in that, The third encapsulation portion is located on the second sidewall at one end away from the second encapsulation portion, and the other end of the covering portion extends in a direction away from the second sidewall. At least a portion of the surface of the cover near the second sidewall has a first gap with the second sidewall.

6. The display panel according to claim 5, characterized in that, The display panel further includes an electrode filling portion disposed in the same layer and material as the second electrode, and at least a portion of the electrode filling portion fills the first gap.

7. The display panel according to claim 4, characterized in that, The display panel further includes a pixel definition layer disposed on the substrate, and the isolation structure is disposed on the side of the pixel definition layer away from the substrate; The pixel definition layer includes multiple pixel definition structures, each pixel definition structure defining a pixel opening, and the pixel opening is configured to correspond to the first electrode. The third encapsulation portion covers the second sidewall and the surface of the corresponding pixel definition structure near the second sidewall, and the other end of the covering portion extends in a direction away from the substrate; At least a portion of the surface of the cover near the pixel definition structure has a second gap with the pixel definition structure.

8. The display panel according to claim 7, characterized in that, The display panel further includes an electrode filling portion disposed in the same layer and material as the second electrode, and at least a portion of the electrode filling portion fills the second gap; Optionally, the pixel definition structure covers the edge of the corresponding first electrode, and the first light-emitting part is disposed on the side of the corresponding first electrode and the pixel definition structure away from the substrate; Optionally, the pixel definition layer is made of an inorganic material.

9. The display panel according to claim 1, characterized in that, In a direction parallel to the plane of the substrate, the difference between the dimension of the second protruding structure in the direction away from the light-emitting device and the dimension of the first protruding structure in the direction toward the light-emitting device is greater than 0.1 micrometers.

10. The display panel according to claim 1, characterized in that, In a direction parallel to the plane of the substrate, the size of the second protruding structure in the direction away from the light-emitting device ranges from 0.5 to 1.5 micrometers; Optionally, in a direction parallel to the plane of the substrate, the size of the first protruding structure in the direction toward the light-emitting device ranges from 0.3 to 0.7 micrometers.

11. The display panel according to claim 2, characterized in that, The support portion is a conductive structure, and the second electrode overlaps with the second sidewall; Optionally, the support portion and the crown portion are integrally formed; Optionally, the support portion and the crown portion are made of different materials; Optionally, the isolation structure is ring-shaped on a plane parallel to the substrate.

12. A display panel, characterized in that, include: substrate; Multiple isolation structures are spaced apart on one side of the substrate, and each isolation structure defines an isolation opening; Multiple light-emitting devices, at least some of which are disposed within the isolation opening; The isolation structure includes a support portion and a crown portion stacked sequentially on the substrate. The sidewalls of the support portion include a first sidewall facing the adjacent light-emitting device and a second sidewall away from the adjacent light-emitting device. Multiple encapsulation layers are disposed corresponding to the light-emitting device. The encapsulation layer is disposed on the side of the corresponding light-emitting device away from the substrate. The encapsulation layer covers the light-emitting device and at least part of the isolation structure. In the direction perpendicular to the plane of the substrate, the size of the encapsulation layer in direct contact with the second sidewall is larger than the size of the encapsulation layer in direct contact with the first sidewall.

13. The display panel according to claim 12, characterized in that, In a direction parallel to the plane of the substrate, the crown protrudes relative to the first sidewall in a direction toward the light-emitting device to form a first protruding structure, and the crown protrudes relative to the second sidewall in a direction away from the light-emitting device to form a second protruding structure; In a direction parallel to the plane of the substrate, the dimension of the second protruding structure in the direction away from the light-emitting device is greater than the dimension of the first protruding structure in the direction toward the light-emitting device.

14. The display panel according to claim 12, characterized in that, The encapsulation layer includes a first encapsulation portion, a second encapsulation portion, and a third encapsulation portion connected in sequence. The first encapsulation portion covers the second electrode, the second encapsulation portion covers the first sidewall, the surface of the crown portion facing the substrate, and the side end face of the crown portion, and the third encapsulation portion covers at least a portion of the second sidewall.

15. The display panel according to claim 14, characterized in that, The third encapsulation portion is in direct contact with the second sidewall. The encapsulation layer also includes a cover portion connected to the third encapsulation portion. One end of the cover portion is connected to the end of the third encapsulation portion away from the second encapsulation portion, and the other end of the cover portion extends in a direction away from the second sidewall or away from the substrate.

16. The display panel according to claim 15, characterized in that, The third encapsulation portion is located on the second sidewall at one end away from the second encapsulation portion, and the other end of the covering portion extends in a direction away from the second sidewall. At least a portion of the surface of the cover near the second sidewall has a first gap with the second sidewall; Optionally, the display panel further includes an electrode filling portion disposed in the same layer and material as the second electrode, at least a portion of the electrode filling portion filling the first gap.

17. The display panel according to claim 15, characterized in that, The display panel further includes a pixel definition layer disposed on the substrate, and the isolation structure is disposed on the side of the pixel definition layer away from the substrate; The light-emitting device includes a first electrode, a first light-emitting part, and a second electrode arranged in sequence. The pixel definition layer includes multiple pixel definition structures, each pixel definition structure defining a pixel opening, and the pixel opening is configured to correspond to the first electrode. The third encapsulation portion covers the second sidewall and the surface of the corresponding pixel definition structure near the second sidewall, and the other end of the covering portion extends in a direction away from the substrate; At least a portion of the surface of the covering portion near the pixel definition structure has a second gap with the pixel definition structure; Optionally, the display panel further includes an electrode filling portion disposed in the same layer and material as the second electrode, at least a portion of the electrode filling portion filling the second gap.

18. The display panel according to claim 13, characterized in that, In a direction parallel to the plane of the substrate, the difference between the dimension of the second protruding structure in the direction away from the light-emitting device and the dimension of the first protruding structure in the direction toward the light-emitting device is greater than 0.1 micrometers; Optionally, in a direction parallel to the plane of the substrate, the size of the second protruding structure in the direction away from the light-emitting device ranges from 0.5 to 1.5 micrometers. Optionally, in a direction parallel to the plane of the substrate, the size of the first protruding structure in the direction toward the light-emitting device ranges from 0.3 to 0.7 micrometers.

19. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 18.

20. A method for manufacturing a display panel, characterized in that, include: Provide a substrate; A plurality of isolation structures are formed on one side of the substrate, the isolation structures being spaced apart on one side of the substrate, and the isolation structures defining isolation openings; A plurality of light-emitting devices are formed on one side of the substrate, and at least some of the light-emitting devices are disposed within the isolation opening; The isolation structure includes a support portion and a crown portion stacked sequentially on the substrate. The sidewalls of the support portion include a first sidewall facing the adjacent light-emitting device and a second sidewall away from the adjacent light-emitting device. In a direction parallel to the plane of the substrate, the crown protrudes relative to the first sidewall in a direction toward the light-emitting device to form a first protruding structure, and the crown protrudes relative to the second sidewall in a direction away from the light-emitting device to form a second protruding structure; In a direction parallel to the plane of the substrate, the dimension of the second protruding structure in the direction away from the light-emitting device is greater than the dimension of the first protruding structure in the direction toward the light-emitting device.

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