Display apparatus, method of manufacturing display apparatus, and electronic apparatus

Abstract

The invention relates to a display device, a method of manufacturing the display device, and an electronic apparatus. The display device includes: a display panel including a display element that generates visible light; a protection panel disposed to face one surface of the display panel; a circuit board disposed to face the protection panel to apply an electrical signal to the display panel; and a circuit covering portion including: a main region; a wing region connected to the main region, positioned between the circuit board and the protection panel, and electrically connected to the circuit board; and a connection region provided in the main region and electrically connected to the protection panel in a region different from the wing region.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0125970, filed on September 13, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Embodiments of this disclosure relate to display devices, methods of manufacturing display devices, and electronic devices. Background Technology

[0004] In recent years, the use of display devices has become more diversified. Furthermore, display devices have become thinner and lighter, and their applications have expanded.

[0005] Furthermore, as the application of display devices has expanded and the technology for utilizing them has advanced, the image quality and high resolution required by display devices have improved.

[0006] Due to the need for precise characteristic control and thinning of display devices, there are limitations to improving electrical characteristics and durability. Summary of the Invention

[0007] Embodiments of this disclosure provide a display device with improved electrical characteristics and durability, and a method for manufacturing the display device.

[0008] Additional aspects will be set forth in part in the description which follows, and will also be apparent in part from the description, or may be learned by practicing the embodiments presented in this disclosure.

[0009] According to an aspect of the present invention, a display device is provided, comprising: a display panel including display elements that generate visible light; a protective panel having one surface disposed facing the display panel; a circuit board disposed facing the protective panel to apply electrical signals to the display panel; and a circuit coverage portion including: a main region; a wing region connected to the main region, positioned between the circuit board and the protective panel, and electrically connected to the circuit board; and a connection region disposed in the main region and electrically connected to the protective panel in a region different from the wing region.

[0010] The wing area and the main area can overlap each other in the thickness direction of the display device.

[0011] At least one area of ​​the circuit board can be located between the wing area and the main area.

[0012] The wing area can directly contact the area on the circuit board.

[0013] The connection area can directly contact the area of ​​the protection panel.

[0014] The circuit cover may include a conductive layer and an insulating layer on at least one surface of the conductive layer.

[0015] The wing region may include the area on the surface of the conductive layer that is not covered by the insulating layer.

[0016] The connection area of ​​the circuit coverage may include the area on the surface of the conductive layer that is not covered by the insulating layer.

[0017] The insulating layer may include a first insulating layer disposed on one surface of the conductive layer and a second insulating layer disposed on the opposite surface of the conductive layer.

[0018] The conductive layer can be configured to correspond to the main area, wing area, and connection area.

[0019] The circuit board may include conductive regions and an insulating substrate layer on at least one surface of the conductive regions.

[0020] The circuit board may include a conductive exposed area in at least one region, and the conductive exposed area may include a region of the conductive area that includes the exposed surface of the conductive area that is not covered by the insulating substrate layer.

[0021] The conductive exposed area can be configured to overlap with the wing area in the thickness direction of the display device.

[0022] The conductive exposed area can have a length and width that are smaller than the length and width of the circuit board, respectively.

[0023] The protective panel may include a protective conductive layer that corresponds at least to the connection area of ​​the circuit-covered portion, and the protective conductive layer may be electrically connected to the connection area.

[0024] The circuit cover portion can be configured to be bent to surround at least one side of the circuit board, and the connection area of ​​the circuit cover portion can be connected to the protective panel at a location separate from the circuit board.

[0025] A conductive path for grounding can be formed through the electrical paths in the wing areas of the circuit board and the circuit cover, as well as the electrical paths in the connection areas of the circuit cover and the protective panel.

[0026] An electrical path can be formed between the circuit board and the protective panel through the circuit coverage area.

[0027] The wing area of ​​the circuit coverage section can be set to protrude from the main area.

[0028] The display elements of the display panel can be mounted on the substrate, the protective panel can be positioned facing the substrate, and the circuit coverage portion can be positioned facing the protective panel.

[0029] According to another aspect of the present invention, a method for manufacturing a display device is provided, the method comprising: preparing a display panel including display elements that generate visible light; preparing a protective panel configured to face one surface of the display panel; preparing a circuit board configured to face the protective panel for applying electrical signals to the display panel; and preparing a circuit cover portion including a main region, a wing region, and a connection region, the wing region being connected to the main region, positioned between the circuit board and the protective panel, and electrically connected to the circuit board, the connection region being positioned in the main region and electrically connected to the protective panel in a region different from the wing region.

[0030] The wing area can be set to stand out from the main area.

[0031] The method may also include bending or folding the wing area to overlap with the circuit board in the thickness direction of the display device, and then bending the main area.

[0032] In a bent main area, the main area can be bent to cover the wing area.

[0033] By bending, the connection area can be electrically connected to the protection panel.

[0034] According to another aspect of the present invention, an electronic device is provided, the electronic device including a display device, and the display device including: a display panel including display elements that generate visible light; a protective panel configured to face one surface of the display panel; a circuit board configured to face the protective panel to apply electrical signals to the display panel; and a circuit coverage portion including: a main area; a wing area connected to the main area, positioned between the circuit board and the protective panel, and electrically connected to the circuit board; and a connection area disposed in the main area and electrically connected to the protective panel in a region different from the wing area.

[0035] Other aspects, features, and advantages, in addition to those described above, will become apparent from the following drawings, claims, and detailed description of the inventive concept. Attached Figure Description

[0036] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings.

[0037] Figure 1 This is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure.

[0038] Figure 2 yes Figure 1 A magnified view of region K.

[0039] Figure 3 Is Figure 1 A schematic plan view observed from direction A.

[0040] Figure 4 It is along Figure 3 The cross-sectional view taken from line IV-IV'.

[0041] Figure 5 yes Figure 4 A magnified view of region Q in the image.

[0042] Figure 6 It is a schematic diagram. Figure 1 A cross-sectional view of an example display panel.

[0043] Figure 7 It is a schematic diagram. Figure 1 A cross-sectional view of an example display panel.

[0044] Figure 8 The illustration serves as Figure 1 A cross-sectional view of an example circuit board for a display device.

[0045] Figure 9 It is observed from one direction. Figure 8 Floor plan.

[0046] Figure 10 The illustration serves as Figure 1 A plan view of the circuit coverage portion of an example display device.

[0047] Figure 11 It is along Figure 10 The cross-sectional view taken from line XI-XI'.

[0048] Figure 12 It is along Figure 10 The cross-sectional view taken from line XII-XII'.

[0049] Figure 13 This is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure.

[0050] Figure 14 Is Figure 13 A plan view observed from direction k.

[0051] Figure 15 It is along Figure 14 A cross-sectional view taken from line XV-XV'.

[0052] Figure 16 yes Figure 15 An enlarged view of region S.

[0053] Figure 17 , Figure 18 , Figure 19 , Figure 20 and Figure 21 It is a diagram setting. Figure 13 A view of an example of the circuitry covering portion of a display device. Detailed Implementation

[0054] Referring now to embodiments in detail, examples of which are illustrated in the accompanying drawings, wherein the same reference numerals always refer to the same elements. In this respect, the presented embodiments may have different forms and should not be construed as limited to the description set forth herein. Therefore, the embodiments described below are merely for illustrative purposes by reference to the accompanying drawings. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Expressions such as “at least one of…” modify the entire list of elements when following a list of elements, but do not modify individual elements in the list.

[0055] Because this disclosure allows for various modifications and numerous embodiments, specific embodiments are illustrated in the accompanying drawings and described in detail in the written description. The advantages and features of the embodiments, as well as the methods for implementing the advantages and features of the embodiments, will become apparent from the following detailed description of the embodiments with reference to the accompanying drawings. However, this disclosure is not limited to the embodiments disclosed below and can be implemented in various forms.

[0056] In the following embodiments, terms such as “first” and “second” are not used in a limiting sense, but are used for the purpose of distinguishing one component from another.

[0057] In the following examples, unless the context clearly indicates otherwise, singular terms also include plural terms.

[0058] In the following embodiments, terms such as “comprising,” “having,” and “including” are intended to indicate the presence of a feature or component disclosed in this specification and are not intended to exclude the possibility that one or more other features or components may be present or added.

[0059] In the following examples, when it is mentioned that a component (such as a membrane, zone, assembly, etc.) is on or above another component, this includes not only cases where the component is directly on top of the other component, but also cases where another membrane, zone, assembly, etc. is located between the component (such as a membrane, zone, assembly, etc.) and the other component.

[0060] In the accompanying drawings, the dimensions of components may be exaggerated or reduced for ease of description. For example, the dimensions and / or thickness of each component shown in the drawings are arbitrarily shown for ease of description, and therefore the following embodiments are not necessarily limited to the embodiments shown.

[0061] In the following description, the X-axis (X-axis direction), Y-axis (Y-axis direction), and Z-axis (Z-axis direction) are not limited to the three axes (directions) in a Cartesian coordinate system, and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis can refer to different directions that are orthogonal or non-orthogonal to each other.

[0062] When a particular embodiment can be implemented differently, the specific process sequence may be performed differently than the described sequence. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of their description.

[0063] In the following description, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, and when describing with reference to the drawings, the same or corresponding components will be given the same reference numerals, and repeated descriptions thereof will be omitted.

[0064] Figure 1 This is a schematic cross-sectional view of a display device 100 according to an embodiment of the present disclosure. Figure 2 yes Figure 1 A magnified view of region K. Figure 3 Is Figure 1 A schematic plan view observed from direction A. Figure 4 It is along Figure 3 The cross-sectional view taken from line IV-IV'. Figure 5 yes Figure 4 A magnified view of region Q in the image.

[0065] Reference Figure 1 The display device 100 may include a display panel 110, a protective panel 120, a circuit board 130, and a circuit cover portion 150.

[0066] Display panel 110 may include display elements that generate visible light. For example, display panel 110 may include one or more display elements disposed on a substrate, and the display elements included in display panel 110 may be organic light-emitting diodes (OLEDs). In embodiments, the display elements included in display panel 110 may include liquid crystal displays (LCDs), light-emitting diodes (LEDs), quantum dot devices, etc. References below. Figures 5 to 7 Description of display panel 110.

[0067] The protective panel 120 can be configured to face a surface of the display panel 110. For example, when the main surface of the display panel 110 in which the image is implemented is referred to as the front surface, the protective panel 120 can be configured to face a rear surface opposite to the front surface of the display panel 110. As an example, since the upper surface of the display panel 110 is based on... Figure 1 The front and main surfaces of the image are implemented therein, so the protective panel 120 can be disposed on the lower surface of the display panel 110.

[0068] The protective panel 120 can protect the display panel 110, and for example, can reduce or prevent the display panel 110 from being damaged or deformed by external impacts, and as an example, can reduce or prevent the display panel 110 from being damaged or deformed by external light, and can reduce or prevent the display panel 110 from being damaged or deformed by heat or electromagnetic waves.

[0069] As an example, the protective panel 120 may include a protective layer, and as an example, it may include a shock-absorbing pad. As an example, the protective panel 120 may include a light-absorbing layer that absorbs external light. In some embodiments, as an example, the protective panel 120 may include a heat-dissipating layer for heat dissipation or an electromagnetic shielding layer for shielding electromagnetic waves.

[0070] In some embodiments, the protective panel 120 may include one or more conductive grounding layers or conductive grounding patterns for grounding.

[0071] The circuit board 130 may be configured to face the protective panel 120 to apply electrical signals to the display panel 110. In some embodiments, the circuit board 130 may include one or more circuit areas and may include, for example, an integrated circuit chip. In some embodiments, the circuit board 130 may include a printed circuit board.

[0072] In this embodiment, although not shown, the circuit board 130 can be electrically connected to the display panel 110 via a connecting circuit portion (not shown). The connecting circuit portion (not shown) may include a flexible, bendable material when connected to the display panel 110 and the circuit board 130.

[0073] The circuit coverage portion 150 can be configured to cover at least one area of ​​the circuit board 130, and as an example, it can be positioned to cover the entire circuit board 130.

[0074] The circuit cover portion 150 can be configured to cover the circuit area (e.g., driving integrated circuit chip) on the display panel 110 or the circuit area of ​​the circuit board 130 to protect the circuit area. For example, the circuit cover portion 150 can protect the circuit area from external contact, pressure or electromagnetic waves.

[0075] The circuit cover portion 150 may include at least a conductive layer and a protective insulating layer disposed on at least one surface of the conductive layer.

[0076] The circuit coverage area 150 may include at least a main area 151, a wing area 152, and a connection area 153 (see...). Figure 3 ).

[0077] The main area 151 of the circuit coverage portion 150 can have one direction ( Figure 1The length along the X-axis and in the direction intersecting the X-axis ( Figure 3 The width along the Y-axis.

[0078] Wing 152 can be connected to main area 151 and is positioned between circuit board 130 and protective panel 120.

[0079] In some embodiments, the wing region 152 may be electrically connected to the circuit board 130. In some embodiments, the wing region 152 may protrude from the main region 151 in the longitudinal direction. The wing region 152 may be bent to overlap with the main region 151 in the Z-axis direction. In some embodiments, the circuit board 130 may be disposed on the main region 151, and the wing region 152, which extends beyond the opposite edge of the circuit board 130, may be bent to contact the region of the circuit board 130. Thus, as Figure 1 As shown in the figure, at least one region of the circuit board 130 adjacent to the side surface of the circuit board 130 can be located between the main region 151 and the wing region 152 of the circuit coverage portion 150.

[0080] Connection area 153 may be an area electrically connected to the protective panel 120 in a different area than the area where wing area 152 is located. In some embodiments, connection area 153 may be located in an area of ​​main area 151, that is, connection area 153 may be a part of main area 151.

[0081] Reference Figure 2 The circuit cover 150, circuit board 130 and protective panel 120 are described in more detail. Figure 2 yes Figure 1 A magnified view of region K.

[0082] Reference Figure 2 The circuit board 130 may include at least one conductive area 131, and for example, the conductive area 131 may include a ground conductive layer or a ground conductive pattern.

[0083] In some embodiments, the circuit board 130 may include a first insulating substrate layer 132 disposed on one surface of the conductive region 131 and a second insulating substrate layer 133 disposed on the other surface (e.g., the opposite surface) of the conductive region 131.

[0084] In some embodiments, the conductive region 131 may be located between the first insulating substrate layer 132 and the second insulating substrate layer 133.

[0085] The circuit board 130 may include a conductive exposed area 131A in at least one region. In some embodiments, the conductive exposed area 131A may be a region of the conductive area 131 that includes an exposed surface not covered by the first insulating substrate layer 132 or the second insulating substrate layer 133, for example, a region that includes an exposed surface not covered by the second insulating substrate layer 133.

[0086] The conductive region 131 may include various conductive materials, such as metallic materials like copper.

[0087] The circuit coverage portion 150 may include at least one conductive layer 150c.

[0088] In some embodiments, the circuit cover portion 150 may include a first insulating layer 150a disposed on one surface of the conductive layer 150c and a second insulating layer 150b disposed on the other surface (e.g., the opposite surface) of the conductive layer 150c.

[0089] In some embodiments, the conductive layer 150c may be positioned between the first insulating layer 150a and the second insulating layer 150b.

[0090] At least one region or the entire region of the wing region 152 of the circuit coverage portion 150 may include a region of the exposed conductive layer 150c, for example, a region of the conductive layer 150c including an exposed surface not covered by the first insulating layer 150a or the second insulating layer 150b, and as an example, a region of the conductive layer 150c including an exposed surface not covered by the first insulating layer 150a.

[0091] The conductive layer 150c may include various conductive materials, such as metallic materials like aluminum (Al). The first insulating layer 150a or the second insulating layer 150b may include various insulating materials, such as organic substances and resin-based materials. In embodiments, the first insulating layer 150a or the second insulating layer 150b may include polyethylene series materials, and as an example, may include polyethylene terephthalate (PET).

[0092] In some embodiments, the conductive region 131 of the circuit board 130 is electrically connected to the conductive layer 150c of the circuit cover portion 150. In some embodiments, the conductive region 131 of the circuit board 130 is connected to the conductive layer 150c of the circuit cover portion 150 through direct contact. In some embodiments, as an example, conductive material may be positioned between the conductive region 131 of the circuit board 130 and the conductive layer 150c of the circuit cover portion 150; for example, a conductive strip may be provided, or as an example, a conductive adhesive material may be provided.

[0093] In some embodiments, the exposed surface of the conductive layer 150c of the wing region 152 of the circuit coverage portion 150, which is not covered by the first insulating layer 150a, can correspond to the area (i.e., the conductive exposed area 131A) of the conductive area 131 of the circuit board 130, and therefore, the conductive layer 150c of the wing region 152 can directly contact the conductive area 131 of the circuit board 130.

[0094] As a result, the circuit board 130 can be electrically connected to the circuit cover portion 150, and for example, the conductive grounding area of ​​the circuit board 130 can be electrically connected to the circuit cover portion 150 to form an electrical path. Thus, the grounding electrical path for the circuit board 130 can be connected from the conductive area 131 of the circuit board 130 through the conductive exposed area 131A to the conductive layer 150c of the wing area 152 of the circuit cover portion 150, and the conductive layer 150c can be connected to the connection area 153 of the circuit cover portion 150 (see...). Figure 3 Alternatively, it can be integrally extended to the connection area 153 of the circuit coverage portion 150, and the conductive layer 150c of the connection area 153 can be connected to the protective conductive layer of the protective panel 120 (see...). Figure 5 (Protective conductive layer 121).

[0095] As a result, a grounding path for the circuit board 130 can be easily established. In some embodiments, instead of forming a grounding path through direct contact between the circuit board 130 and the protective panel 120, electrical connections can be established between the circuit board 130 and the circuit cover portion 150, as well as between the circuit cover portion 150 and the protective panel 120, thereby facilitating stable placement of the circuit board 130 and the protective panel 120 and reducing or preventing difficulties in adjacent conductive grounding connections.

[0096] To ensure stable placement of the circuit cover portion 150 and the protective panel 120 relative to each other, a bonding member, such as an adhesive layer ADH, may be provided in at least one area between the circuit cover portion 150 and the protective panel 120. In some embodiments, the adhesive layer ADH may be positioned between the second insulating layer 150b of the circuit cover portion 150 and the protective panel 120. In an embodiment, the adhesive layer ADH may be provided up to the circuit board 130, for example, up to the second insulating substrate layer 133 of the circuit board 130.

[0097] Reference Figures 3 to 5 The electrical connections between the protective panel 120 and the circuit cover portion 150 are described in more detail.

[0098] Figure 3 Is Figure 1 A schematic plan view observed from direction A. Figure 4 It is along Figure 3 The cross-sectional view taken from line IV-IV'. Figure 5 yes Figure 4 A magnified view of region Q in the image.

[0099] Reference Figure 3 The circuit cover portion 150 is shown as being bent to surround the protective panel 120, for example based on Figure 3 The area at the lower edge of the area.

[0100] In some embodiments, Figure 3 The rear surface can be illustrated as the opposite surface to the front surface in which the image of the display device 100 is implemented, and as an embodiment, a region of the circuit coverage portion 150 is not visible, but can be bent to surround at least one region of the edge of the display panel 110 and connected to a surface of the display panel 110.

[0101] For ease of description, Figure 3 It can be a schematic perspective plan.

[0102] The wing region 152 of the circuit coverage portion 150 can be bent or folded while being connected to the main region 151, or in other words, folded to overlap with a region of the circuit board 130 (e.g., conductive exposed region 131A), and can, for example, overlap with the conductive exposed region 131A of the circuit board 130 (see...). Figure 2 ) to contact or cover the conductive exposed area 131A of the circuit board 130.

[0103] In some embodiments, the main region 151 of the circuit coverage portion 150 may extend along the length direction ( Figure 3 The baseline on the X-axis direction is bent or folded to cover the area of ​​the protective panel 120.

[0104] The connection area 153 of the circuit coverage portion 150 can be disposed within the area of ​​the main area 151 and overlap with the protective panel 120. In an embodiment, the connection area 153 of the circuit coverage portion 150 can be located in the width direction of the circuit coverage portion 150 ( Figure 3 The wing region 152 is positioned close to the edge of the circuit cover portion 150 in the Y-axis direction. In some embodiments, the connection region 153 may be positioned between the wing region 152 and one edge of the circuit cover portion 150, and as an example, the connection region 153 may be connected to the edge of the circuit cover portion 150.

[0105] Reference Figure 4 The diagram illustrates the connection area 153 of the circuit coverage portion 150 (see diagram 153). Figure 3 The cross-sectional view of ) and Figure 5 yes Figure 4 A magnified view of region Q.

[0106] Refer to together Figure 2 , Figure 3 , Figure 4 and Figure 5At least one area or the entire area of ​​the connection area 153 of the circuit coverage portion 150 may include an area of ​​the exposed conductive layer 150c, for example, an area of ​​the conductive layer 150c including an exposed surface not covered by the first insulating layer 150a or the second insulating layer 150b, and as an example, an area of ​​the conductive layer 150c including an exposed surface not covered by the first insulating layer 150a.

[0107] The protective panel 120 may include a protective conductive layer 121, and the protective conductive layer 121 may correspond to the outermost surface of the protective panel 120. In some embodiments, the protective panel 120 may include one or more protective layers on the outermost portion of the protective panel 120 and may include a protective conductive layer 121 that is exposed by the protective layer but not covered by the protective layer.

[0108] The conductive layer 150c of the connection area 153 of the circuit coverage portion 150 can directly contact the protective conductive layer 121 of the protective panel 120.

[0109] Thus, as described above, a stable electrical path can be achieved from the ground area of ​​the circuit board 130 to the protective conductive layer 121 of the circuit coverage portion 150.

[0110] In other words, the conductive exposed area 131A of the conductive area 131 of the circuit board 130 can contact and be electrically connected to the conductive layer 150c of the wing area 152 of the circuit cover portion 150, and the conductive layer 150c of the wing area 152 of the circuit cover portion 150 can be connected to the conductive layer 150c of the connection area 153 or integrally extended to the conductive layer 150c of the connection area 153.

[0111] Figure 6 It is a schematic diagram. Figure 1 A cross-sectional view of an example of the display panel 110.

[0112] Reference Figure 6 The display panel 110 may include a substrate 101 and a display element 115. As described above, the display element 115 may include various types, and in this embodiment, for ease of description, the display element 115 is described as including an organic light-emitting element.

[0113] The display element 115 may include a first electrode 111, a second electrode 112, and an intermediate layer 113.

[0114] The substrate 101 may include various materials. In some embodiments, the substrate 101 may be formed of glass, metal, organic matter or other materials.

[0115] As an example, the substrate 101 may be formed of a flexible material. In some embodiments, the substrate 101 may be formed to be easily bendable, flexible, foldable, or rollable.

[0116] As an example, substrate 101 may include ultrathin glass, metal, or plastic. In some embodiments, when plastic is used, substrate 101 may include polyimide (PI). In some embodiments, substrate 101 may include at least one selected from polystyrene, polyvinyl alcohol, polymethyl methacrylate, polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polycarbonate, cellulose triacetate, and cellulose acetate propionate.

[0117] In some embodiments, substrate 101 may have a structure with one or more layers (e.g., multiple layers). In some embodiments, substrate 101 may include an organic layer (e.g., a resin-based material) and an inorganic layer, and as an example, may include a structure in which the inorganic layer is positioned between two organic layers.

[0118] In an embodiment, one or more insulating layers (not shown) may be disposed on the substrate 101.

[0119] In one embodiment, one or more thin-film transistors (not shown) may be arranged on substrate 101.

[0120] The first electrode 111 may be disposed on the substrate 101. In an embodiment, where one or more insulating layers may be positioned between the first electrode 111 and the substrate 101, one or more insulating layers may be disposed on the substrate 101.

[0121] In one embodiment, where one or more thin-film transistors may be arranged between the first electrode 111 and the substrate 101, one or more thin-film transistors may be arranged on the substrate 101.

[0122] The first electrode 111 can have various shapes; for example, it can be patterned and formed in an island shape.

[0123] The first electrode 111 may comprise various conductive materials. In some embodiments, the first electrode 111 may comprise at least one selected from the group consisting of transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), and zinc aluminum oxide (AZO). In some embodiments, the first electrode 111 may comprise a metal with high reflectivity (such as silver (Ag)).

[0124] In an embodiment, the first electrode 111 may include a multilayer structure, for example, a multilayer structure comprising the materials described above, the multilayer structure comprising at least one layer of transparent conductive oxide (such as ITO, IZO, ZnO, In2O3, IGO, AZO) and one or more layers of metal (such as Ag).

[0125] In some embodiments, the first electrode 111 may include a three-layer structure or a multi-layer structure, may include a metal layer between two transparent conductive oxide layers, and may include, for example, a three-layer structure of ITO / Ag / ITO.

[0126] The second electrode 112 may be configured to face the first electrode 111. The second electrode 112 may include various conductive materials. In some embodiments, the second electrode 112 may include lithium (Li), calcium (Ca), lithium fluoride (LiF), aluminum (Al), magnesium (Mg), or silver (Ag) and may be formed as a single layer or multiple layers including at least one of the above materials, and may include an alloy material comprising at least two of the above materials.

[0127] The intermediate layer 113 may include an organic light-emitting layer and may be positioned between the first electrode 111 and the second electrode 112. The organic light-emitting layer of the intermediate layer 113 may include a low-molecular-weight organic material or a high-molecular-weight organic material. In an embodiment, the intermediate layer 113 may further include at least one selected from the group consisting of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

[0128] Although not shown, in an embodiment, one or more encapsulation components or encapsulation films may be formed on the second electrode 112 to cover the second electrode 112.

[0129] Figure 7 It is a schematic diagram. Figure 1 A cross-sectional view of an example of the display panel 110.

[0130] Reference Figure 7 The display panel 110' may include a substrate 101' and a display element 115'. As described above, the display element 115' may include various types, and in this embodiment, for ease of description, the display element 115' is described as including an organic light-emitting element.

[0131] The display element 115' may include a first electrode 111', a second electrode 112', and an intermediate layer 113'.

[0132] In some embodiments, the display panel 110' may include one or more thin-film transistors, pixel defining films 118', etc., disposed on the substrate 101'.

[0133] For ease of description, the main differences from the above embodiments will be described.

[0134] The substrate 101' may include various materials. In detail, the substrate 101' may be formed of glass, metal, organic matter or other materials, and modifications and applications may be made to the details within substantially the same or similar scope as the substrate 101 of the embodiments mentioned above, and therefore its description is omitted.

[0135] In an embodiment, one or more buffer layers 102' may be disposed on the substrate 101'.

[0136] A buffer layer 102' can be disposed on a substrate 101'. The buffer layer 102' can reduce or prevent impurities from diffusing into the thin-film transistor to be disposed on the buffer layer 102'.

[0137] The buffer layer 102' may comprise various materials, such as inorganic materials. In some embodiments, the buffer layer 102' may comprise silicone resin-based materials. As an example, the buffer layer 102' may comprise silicon nitride (SiN). x ), silicon dioxide (SiO) x ) and silicon oxynitride (SiO) x N y At least one of the following.

[0138] In some embodiments, the buffer layer 102' may include an oxide, and as an example may include aluminum oxide (Al₂O₃). x Metal oxides.

[0139] In an embodiment, the buffer layer 102' may include at least two or more layers.

[0140] A thin-film transistor can be disposed on the buffer layer 102', and the thin-film transistor can be used as part of a circuit for emitting visible light from the intermediate layer 113'.

[0141] In the following text, refer to Figure 7 The description refers to a top-gate type thin-film transistor in which an active layer 103', a gate electrode GE, a source electrode 106', and a drain electrode 107' are sequentially formed.

[0142] However, this embodiment is not limited to this, and various types of thin-film transistors, such as bottom-gate type, can be applied.

[0143] An active layer 103' is formed on a buffer layer 102'. The active layer 103' may include a semiconductor material and may include, for example, amorphous silicon or polycrystalline silicon. However, this embodiment is not limited thereto, and the active layer 103' may include various materials. As an example, the active layer 103' may include an organic semiconductor material.

[0144] As an example, the active layer 103' may include an oxide semiconductor material. In some embodiments, the active layer 103' may include an oxide of a material selected from Group 12, Group 13 or Group 14 metal elements (such as zinc (Zn), indium (In), gallium (Ga), tin (Sn), cadmium (Cd), germanium (Ge) or hafnium (Hf) and combinations thereof).

[0145] A gate insulating film 104' is formed on the active layer 103'. The gate insulating film 104' may be formed as a multilayer film or a single layer film made of inorganic materials (such as silicon oxide and / or silicon nitride). The gate insulating film 104' is used to insulate the active layer 103' from the gate electrode GE.

[0146] The gate electrode GE is formed on top of the gate insulating film 104'. The gate electrode GE can be connected to a gate line (not shown) that transmits one or more electrical signals.

[0147] The gate electrode GE may include a low-resistance metallic material and may be formed of a multilayer film or a single layer film, wherein the multilayer film or single layer film is formed of a conductive material including, for example, molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc.

[0148] An interlayer insulating film 105' is formed on the gate electrode GE. The interlayer insulating film 105' insulates the source electrode 106' and the drain electrode 107' from the gate electrode GE.

[0149] The interlayer insulating film 105' can be formed as a multilayer film or a single layer film made of inorganic materials. In some embodiments, the inorganic material can be a metal oxide or a metal nitride and may include, for example, silicon oxide (SiO2). x ), silicon nitride (SiN) x ), silicon oxynitride (SiO) x N y Aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), zinc oxide (ZnO) x ) or zirconium oxide (ZrO) x ).

[0150] The source electrode 106' and the drain electrode 107' are formed on the interlayer insulating film 105'. The source electrode 106' and the drain electrode 107' can be formed as a single layer or multiple layers using a material with good conductivity.

[0151] The source electrode 106' and the drain electrode 107' are formed to be in contact with the active layer 103'.

[0152] The passivation film 108' can be disposed on the source electrode 106' and the drain electrode 107' to cover the thin-film transistor.

[0153] The passivation film 108' eliminates the steps caused by the thin-film transistor and flattens the upper surface, thereby reducing or preventing display performance defects of the display panel 110' due to lower non-uniformity.

[0154] The passivation film 108' may include an insulating material and may include a single-layer film or a multilayer film containing, for example, an organic material.

[0155] In some embodiments, the passivation film 108' may include general polymers as organic materials (such as polymethyl methacrylate (PMMA) or polystyrene (PS)), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, vinyl alcohol polymers, and blends thereof. In some embodiments, the passivation film 108' may be formed as a composite stack of inorganic and organic insulating films.

[0156] The first electrode 111' can be disposed on the passivation film 108'. The first electrode 111' can be electrically connected to one of the source electrode 106' and the drain electrode 107'.

[0157] The first electrode 111' may include various conductive materials, and because the material of the first electrode 111' is similar to that of the first electrode 111 in the previous embodiment (see above) Figure 6 Since the materials are the same, the description of the material of the first electrode 111' is omitted.

[0158] The second electrode 112' may be configured to face the first electrode 111'. The second electrode 112' may be formed of various conductive materials. In some embodiments, the second electrode 112' may include lithium (Li), calcium (Ca), lithium fluoride (LiF), aluminum (Al), magnesium (Mg), or silver (Ag) and may be formed as a single layer or multiple layers including at least one of the above materials, and may include an alloy material comprising at least two of the above materials.

[0159] The intermediate layer 113' may include an organic light-emitting layer and may be positioned between the first electrode 111' and the second electrode 112'. The organic light-emitting layer of the intermediate layer 113' may be a low-molecular-weight organic material or a high-molecular-weight organic material. As an embodiment, the intermediate layer 113' may also include at least one selected from the group consisting of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

[0160] After the pixel limiting film 118' is positioned to not cover the preset area of ​​the first electrode 111', the intermediate layer 113' can be positioned on the area of ​​the first electrode 111' not covered by the pixel limiting film 118', and the second electrode 112' can be positioned on the intermediate layer 113'.

[0161] The pixel defining film 118' may include various insulating materials. In some embodiments, the pixel defining film 118' may include organic materials and may be formed by a method such as spin coating using one or more organic insulating materials selected from the group consisting of polyimide, polyamide, acrylic resin, benzocyclobutene, and phenolic resin.

[0162] The encapsulation portion 119' may be disposed on top of the second electrode 112'. In some embodiments, the encapsulation portion 119' may have one or more encapsulation layers. In embodiments, the encapsulation portion 119' may include one or more inorganic layers or one or more organic layers, and as an example, it may include a structure in which inorganic layers and organic layers are alternately stacked once or multiple times, and as an example, it may include a structure in which inorganic layers and organic layers are alternately stacked multiple times.

[0163] In some embodiments, the encapsulation portion 119' can be used as an alternative to a substrate-type encapsulation substrate, thereby reducing the thickness of the display device and the electronic device including the display device and improving bending characteristics.

[0164] Figure 8 The illustration serves as Figure 1 A cross-sectional view of a circuit board 130' of an example display device. Figure 9 It is observed from one direction. Figure 8 Floor plan.

[0165] Reference Figure 8 and Figure 9 The circuit board 130' can have one orientation ( Figure 8 and Figure 9 The length along the X-axis and in the direction intersecting a direction ( Figure 9 The width along the Y-axis.

[0166] The circuit board 130' may include a conductive area 131', and for example, the conductive area 131' may include a ground conductive layer or a ground conductive pattern.

[0167] In some embodiments, the circuit board 130' may include a first insulating substrate layer 132' disposed on one surface of the conductive region 131' and a second insulating substrate layer 133' disposed on the other surface (e.g., the opposite surface) of the conductive region 131'.

[0168] In some embodiments, the conductive region 131' may be located between the first insulating substrate layer 132' and the second insulating substrate layer 133'.

[0169] The circuit board 130' may include a conductive exposed area 131'A in at least one region. In some embodiments, the conductive exposed area 131'A may be a region of the conductive area 131' that includes a surface exposed by and not covered by the first insulating substrate layer 132' or the second insulating substrate layer 133', for example, a region of the conductive area 131' that includes a surface exposed by and not covered by the second insulating substrate layer 133'. In some embodiments, Figure 2 It can include Figure 8 The right section of circuit board 130'.

[0170] Reference Figure 8 and Figure 9 The conductive exposed area 131'A can be formed on one surface of the circuit board 130', for example, it can be formed on the area facing the second insulating substrate layer 133', and the conductive exposed area 131'A can be formed along the length of the circuit board 130'. Figure 8 and Figure 9 It is formed adjacent to two corresponding side edges in the X-axis direction.

[0171] These conductive exposure areas 131'A can be formed to have a length smaller than the length of the circuit board 130' and a width smaller than the width of the circuit board 130'. In some embodiments, the shape and size of the conductive exposure areas 131'A can be determined to correspond to a set size for grounding the circuit board 130'.

[0172] Figure 10 The illustration serves as Figure 1 A plan view of an example of the circuit coverage portion 150' of the display device 100. Figure 11 It is along Figure 10 The cross-sectional view taken from line XI-XI'. Figure 12 It is along Figure 10 The cross-sectional view taken from line XII-XII'.

[0173] The circuit coverage portion 150' can be formed to cover at least one area of ​​the circuit board 130', and as an example, it can have an area equal to or greater than the circuit board 130' to cover the entire circuit board 130'.

[0174] The circuit coverage area 150' may include at least a main area 151', a wing area 152', and a connection area 153'.

[0175] The main area 151' of the circuit coverage portion 150' can have one direction ( Figure 10 and Figure 11 The length along the X-axis and in the direction intersecting a direction ( Figure 10 and Figure 12 The width along the Y-axis.

[0176] The wing region 152' can be connected to the main region 151' and can protrude from the main region 151' in the length direction. In addition, the wing region 152' can be bent to overlap with the main region 151', and thus, when the circuit board 130' and the circuit cover portion 150' are arranged, the wing region 152' can be bent or folded to correspond to or overlap with the conductive exposed area 131'A of the circuit board 130'.

[0177] Connection area 153' may be electrically connected to protection panel 120 in a different area than wing area 152' (see Figure 1 In some embodiments, the connection area 153' may be located within the area of ​​the main area 151'.

[0178] The circuit coverage portion 150' may include at least one conductive layer 150c'.

[0179] In some embodiments, the circuit cover portion 150' may include a first insulating layer 150a' disposed on one surface of the conductive layer 150c' and a second insulating layer 150b' disposed on the other surface (e.g., the opposite surface) of the conductive layer 150c'.

[0180] In some embodiments, the conductive layer 150c' may be positioned between the first insulating layer 150a' and the second insulating layer 150b'.

[0181] At least one region or the entire region of the wing region 152' of the circuit coverage portion 150' may include a region of the exposed conductive layer 150c', for example, the conductive layer 150c' includes a region of the surface exposed by the first insulating layer 150a' or the second insulating layer 150b' and not covered by the first insulating layer 150a' or the second insulating layer 150b', and as an example, the conductive layer 150c' includes a region of the surface exposed by the first insulating layer 150a' and not covered by the first insulating layer 150a'.

[0182] At least one area or the entire area of ​​the connection area 153' of the circuit coverage portion 150' may include an area of ​​the exposed conductive layer 150c', for example, an area of ​​the conductive layer 150c' that is exposed by the first insulating layer 150a' or the second insulating layer 150b' and is not covered by the first insulating layer 150a' or the second insulating layer 150b', and as an example, an area of ​​the conductive layer 150c' that is exposed by the first insulating layer 150a' and is not covered by the first insulating layer 150a'.

[0183] Figure 10 The connection area 153' shown in the figure is formed with the same length as the main area 151' of the circuit coverage portion 150' (based on...). Figure 10 and Figure 11 (corresponding to the X-axis direction), but the connecting region 153' can have a shorter length.

[0184] In addition, Figure 10 In the diagram, the connection area 153' is shown as being formed to extend to the edge of the circuit coverage portion 150', but the connection area 153' may also be formed to be separate from the edge.

[0185] exist Figures 10 to 12 The circuit coverage portion 150' is configured to be with Figure 8 and Figure 9 After the circuit board 130' is overlapped, the circuit covering portion 150' is positioned such that the wing regions 152' protruding from both sides of the circuit board 130' can be bent or folded so that the conductive layer 150c' of the wing region 152' of the circuit covering portion 150' overlaps with the conductive exposed area 131'A of the circuit board 130' so that at least one area is in contact.

[0186] Figure 13 This is a schematic cross-sectional view of a display device 200 according to an embodiment of the present disclosure. Figure 14 Is Figure 13 A plan view observed from direction k. Figure 15 It is along Figure 14 A cross-sectional view taken from line XV-XV'. Figure 16 yes Figure 15 An enlarged view of region S.

[0187] Reference Figure 13 and Figure 14 The display device 200 may include a display panel 210, a protective panel 220, a circuit board 230, and a circuit cover portion 250.

[0188] Figure 13 The display device 200 can be used with the above-mentioned Figure 1 The display device 100 is the same as or similar to the display device 100. In some embodiments, it is the same as the display device 100. Figure 1 Compared to display device 100, Figure 13 The display device 200 includes two edges of the display device 100 and includes a circuit cover portion 250 and a connection circuit portion FC adjacent to the circuit cover portion 250, which are bent to the rear surface on one side of the display panel 210. This is described in detail below.

[0189] The display panel 210 may include a display element that generates visible light. In some embodiments, the display panel 210 may include one or more display elements disposed on a substrate, and the display element may be an OLED. As an example, the display element may include a liquid crystal display (LCD), a light-emitting diode (LED), a quantum dot element, etc. In some embodiments, the display panel 210 may employ the above-described... Figure 6 and Figure 7 Configuration.

[0190] like Figure 15 As shown in the diagram, the integrated circuit chip (CIC) can be placed in the area of ​​the display panel 210.

[0191] The protective panel 220 can be positioned to face a surface of the display panel 210. In some embodiments, when the main surface of the display panel 210 in which an image is implemented is referred to as the front surface, the protective panel 220 can be configured to face a rear surface opposite to the front surface of the display panel 210. In some embodiments, because the upper surface of the display panel 210 is based on Figure 13 The front and main surfaces of the image are implemented therein, so the protective panel 220 can be disposed on the lower surface of the display panel 210.

[0192] The protective panel 220 can protect the display panel 210, and for example, can reduce or prevent the display panel 210 from being damaged or deformed by external impacts, and as an example, can reduce or prevent the display panel 210 from being damaged or deformed by external light, and can reduce or prevent the display panel 210 from being damaged or deformed by heat or electromagnetic waves.

[0193] In some embodiments, the protective panel 220 may include a protective layer, and as an example, may include a shock-absorbing pad. As an example, the protective panel 220 may include a layer that absorbs external light. In some embodiments, as an example, the protective panel 220 may include a heat-dissipating layer or a shielding layer that shields electromagnetic waves.

[0194] As an example, such as Figure 15As illustrated, the cover member WG may also be disposed on a surface of the display panel 210, for example, in an area on a surface opposite to the surface facing the protective panel 220. The cover member WG may comprise a light-transmitting material, such as glass. In some embodiments, one or more optical functional layers may be positioned between the display panel 210 and the cover member WG. In some embodiments, one or more touch pattern layers may be formed on a surface of the display panel 210 or the cover member WG, and furthermore, as an example, may be formed in an area between the display panel 210 and the cover member WG.

[0195] In some embodiments, the protective panel 220 may include one or more conductive grounding layers or conductive grounding patterns for grounding.

[0196] The circuit board 230 may be configured to face the protective panel 220 to apply electrical signals to the display panel 210. In some embodiments, the circuit board 230 may include one or more circuit areas and may include, for example, an integrated circuit chip. In some embodiments, the circuit board 230 may include a printed circuit board.

[0197] In some embodiments, the circuit board 230 can be... Figure 15 , Figure 17 The connection circuit section FC is electrically connected to the display panel 210. Figure 15 The connection circuit portion FC may include a flexible, bendable material that is connected to both the display panel 210 and the circuit board 230. By bending the connection circuit portion FC, the circuit board 230 can be configured to face one surface of the protective panel 220 while being electrically connected to the display panel 210.

[0198] The circuit coverage portion 250 can be configured to cover at least a portion of the circuit board 230, and as an example, it can be configured to cover the entire circuit board 230.

[0199] The circuit cover portion 250 can be configured to cover the circuit area (e.g., the circuit area of ​​the integrated circuit chip CIC or the circuit area of ​​the circuit board 230) on the display panel 210 to protect the circuit area, and for example, the circuit cover portion 250 protects the circuit area from external contact, pressure or electromagnetic waves.

[0200] The circuit cover portion 250 may include at least a conductive layer and a protective insulating layer disposed on at least one surface of the conductive layer.

[0201] The circuit coverage area 250 may include at least a main area 251, a wing area 252, and a connection area 253.

[0202] The main area 251 of the circuit coverage portion 250 can have one direction ( Figure 13 and Figure 14The length along the X-axis and in the direction intersecting a direction ( Figure 14 The width along the Y-axis.

[0203] Wing region 252 can be connected to main region 251 and can be positioned between circuit board 230 and protective panel 220, and wing region 252 can be electrically connected to circuit board 230. In some embodiments, wing region 252 can be positioned along its length ( Figure 14 The wing region 252 protrudes from the main region 251 in the X-axis direction. The wing region 252 can be bent to overlap with the main region 251. In some embodiments, the circuit board 230 can be disposed on the main region 251, and the wing regions 252 extending to both sides of the circuit board 230 can be bent to contact the regions of the circuit board 230. Thus, as Figure 13 As shown in the figure, the side surface of the circuit board 230 or at least one area adjacent to the side surface of the circuit board 230 can be located between the main area 251 and the wing area 252 of the circuit cover portion 250.

[0204] In some embodiments, wing regions 252 may be formed on both sides of the main region 251 and folded from both sides to overlap with the circuit board 230, and at least one region may be in contact with and electrically connected to the circuit board 230.

[0205] Connection area 253 may be an area electrically connected to the protective panel 220 in a different area than wing area 252. In some embodiments, connection area 253 may be located in a area of ​​main area 251.

[0206] The electrical connection configuration of the circuit cover 250, circuit board 230, and protective panel 220 can be as described above. Figure 2 The configurations described are basically the same.

[0207] Circuit coverage portion 250 may include Figure 16 At least one conductive layer 250c in it.

[0208] In some embodiments, the circuit coverage portion 250 may include a first insulating layer (and) disposed on one surface of the conductive layer 250c. Figure 10 (Similar to the first insulating layer 150a' in the middle) and Figure 16 The second insulating layer 250b is disposed on the other surface (e.g., the opposite surface) of the conductive layer 250c.

[0209] In some embodiments, the conductive layer 250c may be positioned between the first insulating layer and the second insulating layer 250b.

[0210] At least one region or the entire region of the wing region 252 of the circuit coverage portion 250 may include a region of the exposed conductive layer 250c, for example, a region of the conductive layer 250c including a surface exposed by the first insulating layer or the second insulating layer 250b and not covered by the first insulating layer or the second insulating layer 250b, and as an example, a region of the conductive layer 250c including a surface exposed by the first insulating layer and not covered by the first insulating layer.

[0211] The conductive layer 250c may include various conductive materials, such as metallic materials, and as an example, the metallic material may include aluminum (Al). The first insulating layer or the second insulating layer 250b may include various insulating materials, for example, organic substances, and as an example, resin-based materials. As an embodiment, the first insulating layer or the second insulating layer 250b may include polyethylene series materials, and as an example, may include polyethylene terephthalate (PET).

[0212] In some embodiments, the conductive area 231 of the circuit board 230 is electrically connected to the conductive layer 250c of the circuit cover portion 250, for example, through direct contact.

[0213] In some embodiments, the exposed surface of the conductive layer 250c of the wing region 252 of the circuit cover portion 250, which is not covered by the first insulating layer, can be connected to the area where the conductive region 231 of the circuit board 230 is exposed (i.e., conductive exposed region 231A (see...)). Figure 19 Correspondingly, and therefore, the conductive layer 250c of the wing region 252 can contact the conductive region 231 of the circuit board 230.

[0214] As a result, the circuit board 230 can be electrically connected to the circuit cover portion 250, and for example, the conductive grounding area of ​​the circuit board 230 can be electrically connected to the circuit cover portion 250 to form an electrical path. Thus, an electrical path for grounding from the circuit board 230 can be connected from the conductive area 231 of the circuit board 230 through the conductive exposed area 231A to the conductive layer 250c of the wing area 252 of the circuit cover portion 250, the conductive layer 250c can extend to the connection area 253 of the circuit cover portion 250, and the conductive layer 250c of the connection area 253 can be connected to the protective conductive layer 221 of the protective panel 220.

[0215] Therefore, grounding functionality for circuit board 230 can be easily implemented. In some embodiments, instead of forming a direct grounding path for circuit board 230 and protective panel 220, a stable arrangement of circuit board 230 and protective panel 220 can be facilitated by including electrical connections between circuit board 230 and circuit cover portion 250 and between circuit cover portion 250 and protective panel 220, and difficulties in establishing conductive connections between adjacent components can be reduced or prevented.

[0216] Reference Figures 14 to 16 The electrical connections between the protective panel 220 and the circuit cover portion 250 are described in more detail.

[0217] Reference Figure 14 The circuit cover portion 250 is shown as being bent to surround the protective panel 220, for example based on Figure 14 The area at the lower edge of the area.

[0218] For ease of description, Figure 14 It can be a schematic perspective plan.

[0219] The wing region 252 of the circuit coverage portion 250 can be bent or folded to overlap with the area of ​​the circuit board 230 while being connected to the main region 251, and can, for example, overlap with the conductive exposed area 231A of the circuit board 230 (see Figure 19 ) to contact or cover the conductive exposed area 231A of the circuit board 230.

[0220] In some embodiments, the main region 251 of the circuit coverage portion 250 may extend along the length direction ( Figure 14 The baseline on the X-axis direction is bent or folded to cover the area of ​​the protective panel 220.

[0221] The connection area 253 of the circuit coverage portion 250 can be disposed within the area of ​​the main area 251 and overlap with the protective panel 220. As an embodiment, the connection area 253 of the circuit coverage portion 250 can be located in the width direction of the circuit coverage portion 250 (…). Figure 14 The wing region 252 is located closer to the edge of the circuit cover portion 250 in the Y-axis direction. In some embodiments, the connection region 253 may be positioned between the wing region 252 and one edge of the circuit cover portion 250.

[0222] At least one region or the entire region of the connection area 253 of the circuit coverage portion 250 may include a region of the exposed conductive layer 250c, for example, a region of the conductive layer 250c including an exposed surface not covered by the first insulating layer or the second insulating layer 250b, and as an example, a region of the conductive layer 250c including an exposed surface not covered by the first insulating layer.

[0223] The protective panel 220 may include a protective conductive layer 221, and the protective conductive layer 221 may correspond to the outermost surface of the protective panel 220. As an example, the protective panel 220 may include one or more protective layers at its outermost portion and may include a protective conductive layer 221 that is exposed by the protective layer but not covered by the protective layer.

[0224] The conductive layer 250c of the connection area 253 of the circuit coverage portion 250 can directly contact the protective conductive layer 221 of the protective panel 220.

[0225] Thus, as described above, a stable electrical path can be achieved from the grounding area of ​​the circuit board 230 to the protective conductive layer 221 of the circuit coverage portion 250.

[0226] In other words, the conductive exposed area 231A of the conductive area 231 of the circuit board 230 can be connected to the conductive layer 250c of the wing area 252 of the circuit cover portion 250, and the conductive layer 250c of the wing area 252 can be formed as a conductive layer 250c connected to the connection area 253 or an integral conductive layer 250c extending to the connection area 253.

[0227] Figures 17 to 21 It is a diagram setting. Figure 13 A view of an example of the circuit coverage portion 250 of the display device 200.

[0228] Reference Figure 17 The display panel 210 may include a display area DA and a non-display area NDA. The non-display area NDA may be located on at least one side of the display area DA, for example, it may be located on both sides of the display area DA, or for example, it may be located around the display area DA.

[0229] One or more integrated circuit chips (CICs) can be located in the non-display area (NDA) of the display panel 210.

[0230] Circuit board 230 can be electrically connected to display panel 210 via connection circuit section FC.

[0231] A circuit cover portion 250 may be fabricated and disposed on a circuit board 230. In some embodiments, Figure 17 The surface of the circuit cover portion 250 shown in the figure may be the second insulating layer 250b of the circuit cover portion 250.

[0232] In the following text, refer to Figure 18 The circuit cover portion 250 can be disposed on the circuit board 230, and for example, the circuit cover portion 250 can be disposed to cover the circuit board 230.

[0233] For ease of description, Figure 19 yes Figure 18 A view from the opposite side. In some embodiments, Figure 18 The illustration shows the front surface (e.g., the surface facing the display panel 210) of the display device 200 in which the image is implemented, and Figure 19 The illustration shows the rear surface of device 200 as the opposite surface (e.g., the surface facing the protective panel 220).

[0234] Reference Figure 18 and Figure 19 The circuit coverage portion 250 may have an area at least equal to or larger than the circuit board 230 to cover the entire circuit board 230. In some embodiments, the circuit coverage portion 250 may have at least one direction ( Figure 18 and Figure 19 The width in the Y-axis direction can be configured such that the width is larger than the width of the circuit board 230, thereby allowing the circuit coverage portion 250 to be configured to extend beyond the circuit board 230 in the width direction.

[0235] The connection area 253 of the circuit coverage portion 250 can be positioned in the width direction of the circuit coverage portion 250. Figure 18 In the Y-axis direction, it separates from the circuit board 230 in the area that crosses the circuit board 230. The conductive layer 250c of the connection area 253 can be separated from the circuit board 230. Figure 19 In the diagram, the connection area 253 of the circuit coverage portion 250 is not formed to the two edges of the circuit coverage portion 250 and the edge intersecting with the two edges of the circuit coverage portion 250. Figure 19 (the lower end).

[0236] As an example, the connection area 253 can be formed as an edge connecting to the two edges of the circuit cover portion 250 and an edge intersecting the two edges of the circuit cover portion 250. Figure 19 (the lower end), and for example, the above can be selectively applied. Figures 10 to 12 The circuit coverage portion has a structure of 150'.

[0237] In some embodiments, when the circuit cover portion 250 is provided, the wing region 252 may correspond to or be parallel to the conductive exposed area 231A of the circuit board 230 and may be configured such that at least a horizontal overlap exists. Thus, as described below, the wing region 252 may be folded such that the conductive layer 250c of the wing region 252 overlaps with and contacts the conductive exposed area 231A.

[0238] The order and method of setting up the circuit cover portion 250 and the circuit board 230 can vary, and for example, after setting up the circuit cover portion 250 and the connecting circuit portion FC, the circuit board 230 can be set on the circuit cover portion 250.

[0239] Reference Figure 20 The wing area 252 of the circuit coverage portion 250 is bent or folded toward the circuit board 230 to overlap or contact the circuit board 230. In some embodiments, the conductive layer 250c of the wing area 252 may be folded to contact the conductive exposed area 231A of the circuit board 230.

[0240] In this embodiment, the wing region 252 can be configured to completely cover the conductive exposed area 231A of the circuit board 230, thereby stably setting the circuit board 230, improving the reliability of the electrical connection between the conductive exposed area 231A of the circuit board 230 and the conductive layer 250c of the wing region 252, and easily realizing a smooth path for grounding the circuit board 230.

[0241] Reference Figure 21 The area of ​​the circuit coverage portion 250 can be bent and disposed on the protective panel 220, and is configured to contact the protective panel 220.

[0242] In some embodiments, the connection circuit portion FC and the circuit coverage portion 250 may be based on an overlap area (e.g., Figure 20 The imaginary line in the X-axis direction is bent, and the connection area 253 of the circuit coverage portion 250 can overlap with the protective panel 220 through the overlapping area. As an example, the conductive layer 250c of the connection area 253 (see Figure 16 It can be used with the protective conductive layer 221 of the protective panel 220 (see...) Figure 16 Direct contact.

[0243] In order to ensure the stable placement of the circuit cover portion 250 and the protective panel 220, a bonding member, such as an adhesive layer, can be provided in at least one area between the circuit cover portion 250 and the protective panel 220.

[0244] The display device of this embodiment includes a circuit board for applying electrical signals to a display panel and a circuit cover portion covering at least one area of ​​the circuit board. The circuit cover portion may include a wing region connected to a main area, and when the circuit board is configured to overlap with the circuit cover portion, the wing region may be configured to protrude from a side surface of the circuit board, and the wing region may be folded toward the circuit board. A conductive layer in the folded wing region may correspond to and connect (e.g., contact) a conductive exposed area of ​​the circuit board. This provides a conductive path for grounding from the circuit board to the circuit cover portion.

[0245] The end portion of the circuit coverage area that is different from the wing area (e.g., the area of ​​the main area that is separate from the wing area) can be folded to overlap with the protective panel, and as an example, the connection area can overlap with the protective panel.

[0246] At this time, the bent main area of ​​the circuit cover can overlap with the wing area, and pressure can be applied to the wing area, which can improve the connection or proximity between the wing area and the circuit board, improve the reliability of the conductive connection between the circuit board and the circuit cover, and improve the grounding stability of the circuit board.

[0247] In some embodiments, the conductive layer of the connection area of ​​the circuit cover portion and the protective conductive layer of the protective panel can be electrically connected or in contact. Thus, the conductive layer of the circuit cover portion connected to the wing area, or the conductive layer of the connection area integrally formed with the conductive layer of the wing area, is electrically connected to the protective conductive layer of the protective panel, enabling an electrical connection between the circuit board and the protective panel.

[0248] Therefore, a grounding path can be easily established between the circuit board, the circuit cover, and the protective panel. There is no need for direct contact between the circuit board and the protective panel, and specifically, there is no need for direct contact between the various conductive layers. This improves the ease of arrangement and manufacturing of various components adjacent to the display panel and enhances the reliability of implementing electrical connections and grounding paths.

[0249] The electrical characteristics and durability of display devices can be improved through the embodiments of this disclosure.

[0250] Although this disclosure has been described with reference to embodiments shown in the accompanying drawings, these are merely examples, and those skilled in the art will understand that various modifications and variations can be made to the embodiments therein. Therefore, the true scope of protection of this disclosure should be determined by the technical concept of the appended claims.

Claims

1. A display device, wherein, The display device includes: Display panel, including display elements that generate visible light; A protective panel is configured to face one surface of the display panel; A circuit board, configured to face the protective panel to apply electrical signals to the display panel; and The circuit coverage area includes: a main area; a wing area connected to the main area, positioned between the circuit board and the protective panel, and electrically connected to the circuit board; and a connection area disposed in the main area and electrically connected to the protective panel in a different area from the wing area.

2. The display device according to claim 1, wherein, The wing area and the main area overlap each other in the thickness direction of the display device.

3. The display device according to claim 1, wherein, At least one area of ​​the circuit board is located between the wing area and the main area.

4. The display device according to claim 1, wherein, The wing area is in direct contact with the area of ​​the circuit board.

5. The display device according to claim 1, wherein, The area of ​​the connection zone is in direct contact with the area of ​​the protection panel.

6. The display device according to claim 1, wherein, The circuit coverage portion includes a conductive layer and an insulating layer on at least one surface of the conductive layer.

7. The display device according to claim 6, wherein, The wing region includes the area on the surface of the conductive layer that is not covered by the insulating layer.

8. The display device according to claim 6, wherein, The connection area includes the region on the surface of the conductive layer that is not covered by the insulating layer.

9. The display device according to claim 6, wherein, The insulating layer includes a first insulating layer disposed on one surface of the conductive layer and a second insulating layer disposed on the opposite surface of the conductive layer.

10. The display device according to claim 6, wherein, The conductive layer is configured to correspond to the main region, the wing region, and the connection region.

11. The display device according to claim 1, wherein, The circuit board includes a conductive region and an insulating substrate layer on at least one surface of the conductive region.

12. The display device according to claim 11, wherein, The circuit board includes a conductive exposed area in at least one region, and The conductive exposed area includes the area of ​​the conductive region that includes the exposed surface not covered by the insulating substrate layer.

13. The display device according to claim 12, wherein, The conductive exposed area is configured to overlap with the wing area in the thickness direction of the display device.

14. The display device according to claim 12, wherein, The conductive exposed area has a length and width that are smaller than the length and width of the circuit board, respectively.

15. A method for manufacturing a display device, wherein, The method includes: Fabrication of a display panel comprising display elements that generate visible light; Prepare a protective panel configured to face one surface of the display panel; Fabrication of a circuit board configured to face the protective panel for applying electrical signals to the display panel; and A circuit cover portion is fabricated comprising a main area, a wing area, and a connection area. The wing area is connected to the main area, positioned between the circuit board and the protective panel, and electrically connected to the circuit board. The connection area is positioned in the main area and electrically connected to the protective panel in a region different from the wing area.

16. The method according to claim 15, wherein, The wing area is configured to protrude from the main area.

17. The method according to claim 15, wherein, The method further includes: The wing area is bent or folded to overlap with the circuit board in the thickness direction of the display device, and then the main area is bent.

18. The method according to claim 17, wherein, In the area where the main region is bent, the main region is bent to cover the wing region.

19. The method of claim 17, wherein, Through the bending, the connection area is electrically connected to the protection panel.

20. An electronic device, including a display device, in, The display device includes: Display panel, including display elements that generate visible light; A protective panel is configured to face one surface of the display panel; A circuit board, configured to face the protective panel to apply electrical signals to the display panel; and The circuit coverage area includes: a main area; a wing area connected to the main area, positioned between the circuit board and the protective panel, and electrically connected to the circuit board; and a connection area disposed in the main area and electrically connected to the protective panel in a different area from the wing area.

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