Display module and display device

Abstract

The invention discloses a display module and a display device. The display module includes: a display panel including a plurality of pixels; a carrier panel on a rear surface of the display panel; an adhesive layer disposed between the display panel and the carrier panel, where the adhesive layer is in contact with the carrier panel, and a window on a front surface of the display panel; and an additional adhesive layer between the display panel and the window, in which a side surface of the adhesive layer is recessed from a side surface of the carrier panel, in which the side surface of the carrier panel has an inclined surface with respect to a rear surface of the display panel, and in which a side surface of the additional adhesive layer is aligned with the inclined surface when viewed in a cross-section.

Description

[0001] This application is a divisional application of the patent application filed on May 14, 2020, with application number 202010406006.4 and entitled "Display Module, Display Device and Method of Manufacturing Display Device". Technical Field

[0002] The disclosure herein relates to a display module, a display device including the display module, and a method of manufacturing the display device; more specifically, it relates to a display module having improved process reliability, a display device including the display module, and a method of manufacturing the display device. Background Technology

[0003] Display devices typically include a display panel for displaying images and optical components or windows attached to the display panel. Display devices can be formed through various process steps. In the process of forming the display panel or attaching the optical components or windows to the formed display panel, the display panel may be attached to a carrier panel and pass through various process steps to prevent damage. The carrier panel is then removed from the display panel or separated from the display panel, and the display panel can be shipped as a product. Summary of the Invention

[0004] The present invention discloses a display module configured to have improved process reliability in the process of removing the carrier panel.

[0005] The disclosure also provides a display device including a display module.

[0006] The disclosure also provides a method for manufacturing display devices that can simplify the process, improve process reliability, and reduce process costs.

[0007] An embodiment of the invention provides a display module comprising: a display panel including a plurality of pixels; a carrier panel located on the rear surface of the display panel; and an adhesive layer disposed between the display panel and the carrier panel, wherein the adhesive layer is in contact with the carrier panel, and wherein a side surface of the adhesive layer is recessed from a side surface of the carrier panel.

[0008] In one embodiment, a portion of the rear surface of the display panel may be exposed through an adhesive layer.

[0009] In one embodiment, the side surface of the carrier panel may have an inclined surface relative to the rear surface of the display panel.

[0010] In one embodiment, when viewed in cross-section, the side surface of the display panel can be aligned with the inclined surface.

[0011] In one embodiment, the display module may further include a window located on the front surface of the display panel, wherein, when viewed in cross-section, the side surface of the window may be aligned with the inclined surface.

[0012] In one embodiment, the display module may further include an additional adhesive layer located between the display panel and the window, wherein the side surface of the additional adhesive layer may be aligned with the inclined surface when viewed in cross-section.

[0013] In an embodiment, the adhesive layer may include at least one of an optically transparent adhesive, an optically transparent resin, and a pressure-sensitive adhesive.

[0014] In one embodiment, the display panel may include a polyimide substrate, and the adhesive layer may contact the polyimide substrate.

[0015] In one embodiment, the display module may further include a protrusion that projects from the rear surface of the carrier panel when viewed on the rear surface of the display panel.

[0016] In one embodiment, when viewed from the rear surface of the display panel, the protrusion may be positioned along the side surface of the carrier panel.

[0017] In an embodiment of the invention, a display device includes: a display panel including a plurality of pixels; a lower protective panel located on a rear surface of the display panel; and an adhesive layer located between the display panel and the lower protective panel, wherein a side surface of the display panel is inclined from a side surface of the lower protective panel, and a portion of the rear surface of the display panel is exposed through the adhesive layer.

[0018] In one embodiment, the side surface of the adhesive layer may be recessed from the side surface of the display panel.

[0019] In one embodiment, the display panel may include a substrate and an organic light-emitting device located on the substrate.

[0020] In some embodiments, the substrate may include polyimide.

[0021] In one embodiment, the lower protective panel may include metal.

[0022] In one embodiment, the display panel can be folded around a folding axis extending in one direction.

[0023] In one embodiment, the display device may further include a window located on the front surface of the display panel, wherein the side surface of the window may be aligned with the side surface of the display panel.

[0024] In one embodiment, the display device may further include an additional layer located between the window and the display panel, wherein the side surface of the additional layer may be aligned with the side surface of the display panel.

[0025] In an embodiment of the invention, a method of manufacturing a display device includes the following steps: setting an initial display module, the initial display module including a display panel, a carrier panel located on the rear surface of the display panel, and an adhesive layer disposed between the display panel and the carrier panel, wherein the adhesive layer is in contact with the carrier panel; cutting the initial display module by emitting a first laser beam along a predetermined cutting line to form a first side surface; processing the adhesive layer by emitting a second laser beam along a predetermined processing line defined on the inner side of the first side surface to form a display module of the display device; removing the carrier panel from the display module; and forming the display device by attaching a lower protective panel to the rear surface of the display panel.

[0026] In one embodiment, the second laser beam may have a lower intensity than the first laser beam.

[0027] In one embodiment, the first side surface may be tilted relative to the rear surface of the display panel.

[0028] In one embodiment, the side surface of the adhesive layer may be exposed during the step of cutting the initial display module, and the second laser beam may be incident on the exposed side surface of the adhesive layer.

[0029] In one embodiment, the adhesive layer of the display module may be defined by a portion of the adhesive layer of the initial display module.

[0030] In one embodiment, when the carrier panel is removed, a portion of the adhesive layer that is in contact with the carrier panel can be removed.

[0031] In one embodiment, the first laser beam can form a protrusion on the rear surface of the carrier panel. Attached Figure Description

[0032] These and / or other features of the invention will become clearer and more readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, in which: Figure 1A and Figure 1B This is a perspective view of a display device according to an embodiment of the invention; Figure 2A yes Figure 1A An exploded perspective view of the display device shown in the image; Figure 2B It is along Figure 2A The cross-sectional view of the display panel shown is taken by line I-I'. Figure 3A yes Figure 1A The side view of the display device shown in the image; Figure 3B yes Figure 3A An enlarged side view of region AA'; Figures 4A to 4LThis is a cross-sectional view showing a method of manufacturing a display device according to an embodiment of the invention; Figure 5A and Figure 5B This is a picture showing a cross-section of a display module according to an embodiment of the invention; Figure 6A and Figure 6B This is a planar image showing a display module according to an embodiment of the invention; Figure 7A and Figure 7B A cross-sectional view of a portion of a display module according to an embodiment of the invention; and Figure 8A and Figure 8B This is a plan view of a display module according to an embodiment of the invention. Detailed Implementation

[0033] The invention will now be described more fully below with reference to the accompanying drawings, in which various embodiments are illustrated. However, the invention may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0034] It will be understood that when an element or layer is referred to as being "on," "connected to," or "bonded to" another element or layer, the element or layer may be directly on, directly connected to, or directly bonded to the other element or layer, or there may be intermediate elements or layers between them. Conversely, when an element or layer is referred to as being "directly on," "directly connected to," or "directly bonded to" another element or layer, there are no intermediate elements or layers.

[0035] The same reference numerals always denote the same elements. Furthermore, in the accompanying drawings, the thickness, scale, and dimensions of the elements are exaggerated to effectively depict the technical content.

[0036] As used herein, the term “and / or” includes any and all combinations of one or more of the relevant listed items. “Or” means “and / or”. The term “at least one of…” modifying a listed element means “at least one of…” selected from the listed elements.

[0037] It will be understood that although the terms first, second, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the teachings of the invention, a first element discussed below may be referred to as a second element, and similarly, a second element may be referred to as a first element. Unless the context clearly indicates otherwise, the singular forms “a” and “an” as used herein are intended to include the plural forms (including “at least one”).

[0038] For ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” and “above” may be used to describe the relationship between one element or feature as shown in the figure and another element or feature. It will be understood that spatial relative terms are intended to cover different orientations of the device in use or operation other than those depicted in the figure.

[0039] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should also be understood that terms (such as those defined in a general dictionary) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formalized sense, unless expressly so defined herein.

[0040] It will be understood that when the terms “comprising” or “including” and / or variations thereof are used in this specification, it indicates the presence of the stated features, integrals, steps, operations, elements, components and / or combinations thereof, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or combinations thereof.

[0041] In the following description, embodiments of the invention will be described in detail with reference to the accompanying drawings.

[0042] Figure 1A and Figure 1B This is a perspective view of a display device according to an embodiment of the invention. Figure 2A yes Figure 1A An exploded perspective view of the display device shown in the image. Figure 2B It is along Figure 2A The image shows a cross-sectional view of the display panel taken by line I-I'. Figure 3A yes Figure 1A The image shows a side view of the display device. Figure 3B yes Figure 3A An enlarged side view of region AA'. Refer to the following text. Figures 1A to 3B Description of embodiments of the invention.

[0043] The display device DA is parallel to a plane defined by a first direction D1 and a second direction D2, and has a thickness defined on a third direction D3 perpendicular to the first direction D1 and the second direction D2. The display device DA can be folded about a folding axis FX extending in a predetermined direction. Figure 1A The display device DA in its unfolded state is depicted. Figure 1B The display device DA-F is shown in its folded state.

[0044] In an embodiment, such as Figure 1A As shown, the folding axis FX can extend in the first direction D1. The folding axis FX is defined on the front surface FS of the display device DA. The display device DA can have a front surface FS covered by folding around the folding axis FX and an outwardly exposed rear surface LS in the folded state. Here, the surface of the display device DA on which an image is displayed can be defined as the front surface FS, and the surface opposite to the front surface FS can be defined as the rear surface LS. In the embodiment, as described above, the folding axis FX can be defined on the front surface FS of the display device DA, but is not limited thereto. Optionally, the folding axis FX of the display device DA can be defined on the rear surface LS. In such an embodiment, the display device DA can have an outwardly exposed front surface FS in the folded state, but is not limited to any one embodiment.

[0045] Reference Figure 2A An embodiment of the display device DA includes a window WD, a display panel DP, an adhesive layer AD, and a lower protective panel LP. The window WD is disposed on the display panel DP to protect the front surface IS of the display panel DP. The window WD is optically transparent and has insulating properties. In one embodiment, for example, the window WD may comprise glass, plastic, or a film.

[0046] The display panel DP can receive electrical signals and display images on the front surface IS. The image displayed by the display panel DP is visible to the user through the window WD. The front surface IS includes an active area AA and a peripheral area NAA adjacent to the active area AA.

[0047] The display panel (DP) may include multiple pixels (PX). Pixels (PX) are positioned within an effective area (AA) to display predetermined light. The light generated by the pixels (PX) is collected to provide an image.

[0048] Reference Figure 2BEmbodiments of the display panel DP may include a substrate BS, pixels PX, and multiple insulating layers 10, 20, 30, 40, and 50. The substrate BS has insulating properties. In such embodiments, the substrate BS may be flexible to allow the display panel DP to be foldable. In one embodiment, for example, the substrate BS may be a glass substrate, a polymer substrate or polymer film including at least one selected from polyethylene terephthalate (“PET”), polycarbonate (“PC”), polymethyl methacrylate (“PMMA”), and polyimide (“PI”).

[0049] Insulating layers 10, 20, 30, 40, and 50 may comprise a first insulating layer 10, a second insulating layer 20, a third insulating layer 30, a fourth insulating layer 40, and a fifth insulating layer 50, which are sequentially stacked one on top of the other in their thickness direction. Each of the first insulating layer 10 to the fifth insulating layer 50 may comprise organic and / or inorganic materials.

[0050] In one embodiment, pixel PX is disposed on the substrate BS. In such an embodiment, as... Figure 2B As shown, a pixel PX includes, for example, a thin-film transistor (TR) and a light-emitting device (EMD). In alternative embodiments, a pixel PX may include multiple thin-film transistors (TRs) or other electronic devices such as capacitors, but is not limited to any one embodiment.

[0051] A thin-film transistor (TR) may include a channel portion CP, an input portion IP, an output portion OP, and a control electrode CE. The channel portion CP, input portion IP, and output portion OP may be portions of a single semiconductor pattern disposed between the substrate BS and the first insulating layer 10. The channel portion CP, input portion IP, and output portion OP contain semiconductor material. In one embodiment, for example, the channel portion CP, input portion IP, and output portion OP may include polysilicon or oxide semiconductor.

[0052] The channel portion CP can be a portion of the semiconductor pattern superimposed on the control electrode CE. The control electrode CE can be disposed between the first insulating layer 10 and the second insulating layer 20, and can be configured to be separated from the channel portion CP when viewed in cross-section. The input portion IP and the output portion OP can be portions separated from each other, having the channel portion CP between them, and corresponding to opposite ends of the semiconductor pattern.

[0053] Each of the input section IP and the output section OP may have a relatively higher conductivity than the channel section CP. For example, in one embodiment, the input section IP and the output section OP may also comprise a metallic material compared to the channel section CP, or may have a higher dopant concentration than the channel section CP.

[0054] In an embodiment, the display panel DP may further include a first connection electrode CNP1 and a second connection electrode CNP2. The first connection electrode CNP1 and the second connection electrode CNP2 are disposed between the second insulating layer 20 and the third insulating layer 30, and are configured to be separated from each other when viewed in a plan view.

[0055] The first connecting electrode CNP1 is connected to the input section IP to provide an electrical signal to the input section IP. The second connecting electrode CNP2 connects the output section OP to the light-emitting device EMD. The second connecting electrode CNP2 is connected to the output section OP to transmit the electrical signal output from the output section OP to the light-emitting device EMD.

[0056] In an embodiment, such as Figure 2B As shown, the channel portion CP, the input portion IP, and the output portion OP can define a semiconductor pattern having a uniform shape. In an alternative embodiment, the input portion IP and the output portion OP can be configured as separate conductive patterns separated from the channel portion CP. In such an embodiment, the first connection electrode CNP1 and the second connection electrode CNP2 can be used as the input electrode and output electrode corresponding to the input portion IP and the output portion OP, respectively. In embodiments, the thin-film transistor TR can be modified in various ways to one of various structures, but is not limited to any one embodiment.

[0057] The light-emitting device (EMD) is disposed on the third insulating layer 30. The light-emitting device (EMD) may include a first electrode E1, a second electrode E2, and a light-emitting layer EL.

[0058] The first electrode E1 is disposed between the third insulating layer 30 and the fourth insulating layer 40. The first electrode E1 can pass through the third insulating layer 30 and be connected to the thin-film transistor TR through the second connecting electrode CNP2.

[0059] A light-emitting layer EL is disposed on the first electrode E1. The light-emitting layer EL may be disposed in an opening OPP defined in the fourth insulating layer 40. The opening OPP exposes at least a portion of the first electrode E1. The opening OPP is disposed in the effective area AA to define the light-emitting area. Light generated by the pixel PX can be displayed through the opening OPP.

[0060] The second electrode E2 is disposed on the light-emitting layer EL. In an embodiment, as shown... Figure 2B As shown, the second electrode E2 can be configured, for example, as an integral shape superimposed on the entire effective area AA. In an optional embodiment, the second electrode E2 of the light-emitting device EMD can be configured as a pattern corresponding to the first electrode E1, but is not limited to any one embodiment.

[0061] A fifth insulating layer 50 is disposed on the fourth insulating layer 40 to cover the light-emitting device (EMD). The fifth insulating layer 50 may include a first inorganic layer 51, an organic layer 52, and a second inorganic layer 53. The first inorganic layer 51 is disposed on the second electrode E2 to cover the second electrode E2. The first inorganic layer 51 may include inorganic materials. The first inorganic layer 51 protects the second electrode E2 from external moisture or air.

[0062] An organic layer 52 is disposed on the first inorganic layer 51. The organic layer 52 may have a relatively large thickness compared to the first inorganic layer 51. The organic layer 52 may comprise an organic material. The organic layer 52 may planarize the layer beneath it (e.g., the upper surface of the first inorganic layer 51) to provide a flat surface on its upper side.

[0063] The second inorganic layer 53 is disposed on the organic layer 52 to cover the organic layer 52. The second inorganic layer 53 encapsulates the organic layer 52. The fifth insulating layer 50 described above is merely exemplary. In optional embodiments, at least one of the first inorganic layer 51, the organic layer 52, and the second inorganic layer 53 may be provided as multiple layers, or may be provided alternately with each other, but is not limited to any one embodiment.

[0064] Return to reference Figure 2A A lower protective panel LP is disposed on the rear surface of the display panel DP to cover or protect the rear surface of the display panel DP. Compared to the display panel DP, the lower protective panel LP can have relatively high strength. For example, in one embodiment, the lower protective panel LP can include metal, alloy, tempered glass, or plastic. Optionally, compared to the display panel DP, the lower protective panel LP can have high elasticity. For example, in one embodiment, the lower protective panel LP can include rubber, polyurethane, or foam resin. The lower protective panel LP can improve the reliability of the display device DA by effectively preventing the transmission of external impacts applied from the underside of the display panel DP to the display panel DP.

[0065] An adhesive layer AD is disposed between the lower protective panel LP and the display panel DP to physically bond the lower protective panel LP to the display panel DP. The adhesive layer AD may have a predetermined adhesiveness. The adhesive layer AD may include at least one of, for example, optically clear adhesive (“OCA”), optically clear resin (“OCR”), and pressure-sensitive adhesive (“PSA”).

[0066] Reference Figure 3A and Figure 3B The side surface AD_S of the adhesive layer AD of the display device DA can be defined to be further inward than the side surface WD_S of the window WD and the side surface DP_S of the display panel DP or the side surface LP_S of the lower protective panel LP. In an embodiment, as Figure 3BAs shown, the side surface AD_S of the adhesive layer AD is defined to be further inward than the virtual (or imaginary) line VL defined along the side surface WD_S of the window WD and the side surface DP_S of the display panel DP, and is defined to be further inward than the side surface LP_S of the lower protective panel LP. In such an embodiment, the side surface AD_S of the adhesive layer AD may be recessed relative to the virtual line VL or the side surface LP_S of the lower protective panel LP.

[0067] In an embodiment, a portion of the rear surface DP_L of the display panel DP can be exposed through the adhesive layer AD without being covered by it. As the degree to which the side surface AD_S of the adhesive layer AD is recessed from the virtual line VL increases, the area of ​​the portion of the rear surface DP_L of the display panel DP exposed through the adhesive layer AD can increase. The adhesive layer AD shown in the figures is merely exemplary and is not limited thereto. Optionally, the adhesive layer AD, including the recessed side surface AD_S, can be configured to cover the front surface of the display panel DP, but is not limited to any particular embodiment.

[0068] In an embodiment, the side surface DP_S of the display panel DP and the side surface WD_S of the window WD of the display device DA can be tilted relative to a third party towards D3, as shown by the virtual line VL extending in a diagonal direction tilted relative to the third party towards D3 and the first direction D1. Figure 3B As shown in the diagram. The side surface DP_S of the display panel DP and the side surface WD_S of the window WD of the display device DA will be described in more detail later.

[0069] The side surface LP_S of the lower protective panel LP may not be aligned with the side surface DP_S of the display panel DP and the side surface WD_S of the window WD. In an embodiment, as... Figure 3B As shown, the side surface LP_S of the lower protective panel LP can be parallel to the third direction D3. (See above reference.) Figure 3B The side surface LP_S of the lower protective panel LP described is merely exemplary. Optionally, the side surface LP_S of the lower protective panel LP may be configured to align with the side surface DP_S of the display panel DP and the side surface WD_S of the window WD, but is not limited to any one embodiment.

[0070] Figures 4A to 4L This is a cross-sectional view illustrating a method of manufacturing a display device according to an embodiment of the invention. (Refer to...) Figures 4A to 4L Embodiments of the invention are described. Referring to the above... Figures 1A to 3B The same or identical elements or components described are indicated by the same or identical reference numerals, and any repeated detailed descriptions thereof will be omitted.

[0071] In an embodiment, such as Figure 4AThe diagram shows the initial display module DM-I. The initial display module DM-I may include an initial display panel DP-I, an initial window WD-I, an initial adhesive layer AD-I, and an initial carrier panel CF-I. The initial display module DM-I may be partially integrated with... Figure 2A The display device DA shown in the figure (see Figure 2A )correspond.

[0072] In such an embodiment, apart from their shape (area) when viewed in a plan view, the initial display panel DP-I and the initial window WD-I can be... Figure 2A The display panels shown correspond to DP and WD. Any repeated detailed descriptions will be omitted below.

[0073] Compared to the display device DA, the initial display module DM-I may include the initial carrier panel CF-I instead of the lower protection panel LP (see...). Figure 2A The initial carrier panel CF-I can be bonded to the initial display panel DP-I via the initial adhesive layer AD-I. The initial carrier panel CF-I prevents damage to the initial display panel DP-I that may occur during the process due to movement or other factors. For example, in one embodiment, the initial carrier panel CF-I may include an insulating film.

[0074] Then, as Figure 4B As shown, the initial display module DM-I is rotated. The initial display module DM-I can be rotated approximately 180° relative to the axis oriented in the second direction D2, thereby setting it so that the initial carrier panel CF-I faces upwards.

[0075] Then, as Figures 4C to 4E As shown, the cut display module DM-C is formed by cutting the initial display module DM-I. In an embodiment, as... Figure 4C As shown, the initial display module DM-I is cut to a predetermined size along a virtual cutting line CL defined on the initial carrier panel CF-I. In such an embodiment, the cutting of the initial display module DM-I can be performed using a laser beam LB.

[0076] In an embodiment, such as Figure 4D As shown, when the laser beam LB is emitted from the laser emitter LS to the initial display module DM-I, deformation may occur in the portion of the initial display module DM-I that absorbs the laser beam LB. For ease of description, Figure 4D The area DFA in which deformation has occurred is shown by shading (hereinafter referred to as region DFA). The deformation produced by the laser beam LB can include melting.

[0077] In this configuration, when viewed in cross-section, the region DFA can have a width that decreases in the thickness direction (e.g., third direction D3) as the region DFA moves away from the laser beam LB. Regarding the initial display module DM-I, deformation may occur in the widest region of the initial carrier panel CF-I, where the laser beam LB first enters and is exposed to the laser beam LB for a prolonged period. Conversely, deformation may occur in the narrowest region of the initial window WD-I, where the laser beam LB last reaches and is exposed to the laser beam LB for a relatively short period. Therefore, when viewed in cross-section, the region DFA can have an inverted triangular or inverted trapezoidal shape, such as... Figure 4D As shown in the image.

[0078] Therefore, as Figure 4E As shown, when the cutting is completed, the area DFA is removed, and the cut display module DM-C can be separated from the edge portion PP, which includes the edge window portion WD-P, the edge display panel portion DP-P, the edge adhesive layer portion AD-P, and the edge carrier panel portion CF-P. The cut display module DM-C can be formed by removing the area DFA from the initial carrier panel CF-I, the initial adhesive layer AD-I, the initial display panel DP-I, and the initial window WD-I, and by separating the edge portion PP. The cut display module DM-C includes the cut carrier panel CF, the cut adhesive layer (hereinafter also referred to as the cut adhesive layer) AD-C, the cut display panel DP, and the cut window WD.

[0079] When viewed in cross-section, the width of the region DFA varies in the thickness direction. For example... Figure 4D and Figure 4E As shown, the maximum width WD1 of the region DFA (hereinafter referred to as the first width WD1) can be defined on the rear surface CF-US of the carrier panel CF. The minimum width WD2 of the region DFA (hereinafter referred to as the second width WD2) can be defined on the lower surface of the window WD. As described above, the difference in emission amount and time of the laser beam LB results in the first width WD1 being larger than the second width WD2. In an embodiment, the first width WD1 can be, for example, about 100 micrometers (μm).

[0080] Due to the shape of the region DFA, the side surface of the cut display module DM-C can be formed to be inclined relative to the thickness direction (e.g., third direction D3). When viewed on the rear surface CF-US of the carrier panel CF, the side surfaces of the carrier panel CF, the cut adhesive layer AD-C, the display panel DP, and the window WD can be exposed.

[0081] In such an embodiment, the rear surface CF-US of the carrier panel CF may have a predetermined protrusion RP formed thereon. The protrusion RP may be formed along the edge of the region where the laser beam LB is incident, i.e., along the edge of region DFA. Since the laser beam LB is incident on the initial carrier panel CF-I, plastic deformation may occur on the initial carrier panel CF-I. Therefore, a portion of the rear surface CF-US of the carrier panel CF may be deformed into a curved shape to form the curved protrusion RP. (Refer to above) Figure 4E The protrusion RP described is merely exemplary. The protrusion RP of the cut display module DM-C can be formed according to the intensity and emission time of the laser beam LB or the material of the initial carrier panel CF-I, but is not limited to any one embodiment.

[0082] In such an embodiment, such as Figures 4F to 4H As shown, the display module DM-L (hereinafter referred to as the processed display module DM-L) is formed by emitting an additional laser beam LB-D (hereinafter referred to as laser beam LB-D) at the cutting point of the display module DM-C. The processed display module DM-L may include an adhesive layer AD-L (hereinafter also referred to as the processed adhesive layer AD-L) formed by processing the adhesive layer AD-C of the cut display module DM-C.

[0083] In an embodiment, such as Figure 4F and Figure 4G As shown, the laser beam LB-D is emitted along a virtual processing line (or processing line) DFL defined on the cut display module DM-C. The virtual processing line DFL can be defined further inward than the virtual cutting line CL, and can be defined between the end CF_E of the carrier panel CF and the end WD_E of the window WD. The side surface of the cut display module DM-C is formed as an inclined surface along the virtual line VL, so that when viewed in a plan view, the end CF_E of the uppermost carrier panel CF and the end WD_E of the lowermost window WD can be viewed while being separated from each other.

[0084] In the plan view, the end CF_E of the carrier panel CF is the portion in which the protrusion RP is formed, and it can correspond to the end of the rear surface CF-US of the carrier panel CF. Similarly, the end WD_E of the window WD in the plan view can correspond to the end of the rear surface of the window WD. In an embodiment, as... Figure 4F As shown, the end WD_E of the window WD can be defined inside the virtual cutting line CL. However, the above reference Figure 4F The end WD_E of the window WD described is merely exemplary. Alternatively, the end WD_E of the window WD may be defined to substantially match the virtual cut line CL, but is not limited to any particular embodiment.

[0085] The virtual processing line DFL can be defined along the substantially cut side surface of the adhesive layer AD-C. The side surface of the cut display module DM-C is formed as an inclined surface along the virtual line VL, so that the side surface of the cut adhesive layer AD-C can be seen or exposed when viewed on the rear surface CF-US of the carrier panel CF. The laser beam LB-D is substantially incident on the side surface of the cut adhesive layer AD-C and can create a deformable region AD_V in the portion of the cut adhesive layer AD-C.

[0086] In such an embodiment, the laser beam LB-D can be set to a relatively low intensity or shorter emission time compared to the laser beam LB used in cutting. By controlling the intensity and emission time of the laser beam LB-D, the deformable region AD_V can be formed only in the portion of the adhesive layer AD-C that is being cut (which is a single layer).

[0087] Then, a processed adhesive layer AD-L with a recessed side surface AD-S is formed by removing the deformed region AD_V from the cut adhesive layer AD-C. Depending on the degree of recess in the side surface AD_S of the processed adhesive layer AD-L, at least a portion of the rear surface DP_L of the display panel DP can be exposed.

[0088] In the processing display module DM-L, the side surfaces CF_S of the carrier panel CF, DP_S of the display panel DP, and WD_S of the window WD can be aligned along the virtual line VL when viewed in cross-section, and the side surface AD_S of the processing adhesive layer AD-L can be recessed from the side surface of the processing display module DM-L. The side surface AD_S of the processing adhesive layer AD-L can be recessed from the side surfaces CF_S of the carrier panel CF, DP_S of the display panel DP, and WD_S of the window WD, and can have a recessed shape relative to the virtual line VL when viewed in cross-section.

[0089] Then, as Figure 4I and Figure 4J The image shows the removal of the carrier panel CF from the processing display module DM-L. In one embodiment, the carrier panel CF can be removed by attaching a layering roller DLR to the rear surface CF-US of the carrier panel CF.

[0090] According to an embodiment of the invention, the side surface AD_S of the adhesive layer AD-L is further recessed than the side surface DP_S of the display panel DP, thus reducing the adhesion between the carrier panel CF and the display panel DP on the side surface of the display module DM-L. By deforming and removing a portion of the adhesive layer AD-C at the edge of the display module DM-L (where the carrier panel CF begins to delaminate), the adhesion of the adhesive layer AD-L can be reduced and the carrier panel CF can be delaminated more easily.

[0091] In one embodiment, a portion of the adhesive layer AD-L (RS) can be adhered to the carrier panel CF and removed. Therefore, the exposed surface AD_RS of the adhesive layer AD-R, revealed by removing the carrier panel CF, can have a slightly non-uniform surface. In such an embodiment, the thickness of the adhesive layer AD-R exposed by removing the carrier panel CF can be relatively smaller than the thickness of the adhesive layer AD-L. (Refer to above) Figure 4J The adhesive layer AD-R described is merely exemplary. In an alternative embodiment of the process for manufacturing the display device according to the invention, the carrier panel CF can be removed without damaging the treated adhesive layer AD-L. In such an embodiment, the adhesive layer AD-R exposed by removing the carrier panel CF can have substantially the same thickness as the treated adhesive layer AD-L.

[0092] Then, as Figure 4K and Figure 4L As shown, a lower protective panel LP is attached to form a display device DA. The lower protective panel LP can be attached to the surface of the adhesive layer AD-R exposed by removing the carrier panel CF. In such an embodiment, a separate adhesive layer can be added to the lower protective panel LP to connect to the adhesive layer AD-R exposed by removing the carrier panel CF. In an embodiment, as described above, the adhesive layer AD of the display device DA can be formed as the adhesive layer AD-R exposed by removing the carrier panel CF, or it can have a structure in which the adhesive layer AD-R exposed by removing the carrier panel CF is stacked on top of a separate adhesive layer, but is not limited to any one embodiment.

[0093] The side surface LP_S of the lower protective panel LP of the display device DA may not be aligned with the side surface DP_S of the display panel DP or the side surface WD_S of the window WD. The side surfaces DP_S of the display panel DP and WD_S of the window WD may be inclined relative to the side surface LP_S of the lower protective panel LP. The side surface AD_S of the adhesive layer AD may be recessed from the side surface DP_S of the display panel DP or the side surface WD_S of the window WD, and may be recessed relative to the side surface LP_S of the lower protective panel LP.

[0094] Figure 4L It is one of them Figure 4K The display device DA is flipped so that the window WD faces the front surface of the display device DA. The completed display device DA can essentially be... Figure 1A The display device DA shown in the figure corresponds to this.

[0095] According to embodiments of the invention, an additional laser beam LB-D for processing is emitted after the emission of the laser beam LB for cutting. By removing a portion of the side surface of the cut adhesive layer AD-C by the emission of the additional laser beam LB-D, the carrier panel CF can be easily delaminated. Therefore, the adhesive layer can be processed using conventional or existing processes without adding a separate process, thereby simplifying the process, reducing process costs, and improving process reliability.

[0096] Figure 5A and Figure 5B This is a cross-sectional image showing a display module according to an embodiment of the invention. Figure 5A It shows that it can be used with Figure 4E The image shown is of the first display module DM-C corresponding to the cut display module DM-C. Figure 5B It shows that it can be used with Figure 4H The image shown is of the second display module DM-L corresponding to the processing display module DM-L. In the following text, reference will be made to... Figure 5A and Figure 5B Description of embodiments of the invention.

[0097] In an embodiment, such as Figure 5A As shown, the first display module DM-C includes a window WD, a display panel DP, an adhesive layer AD-C, and a carrier panel CF, and a protrusion RP can be defined on the rear surface CF-US of the carrier panel CF. Figure 5A The diagram shows that the tilted surface is confined to the side surface of the first display module DM-C by removing the deformed region DFA.

[0098] In an embodiment, such as Figure 5B As shown, the second display module DM-L includes a carrier panel CF, an adhesive layer AD-L, a display panel DP, and a window WD. In such an embodiment, in Figure 5B As shown, the adhesive layer AD-L has the same properties as... Figure 5A The adhesive layer AD-C shown has a side surface AD_S with a relatively concave shape compared to the other side surface AD_S. In the embodiment, as described above, the concave side surface AD_S of the adhesive layer AD-L is defined by removing a portion of the adhesive layer AD-C through a process including the emission of an additional laser beam LB-D. Therefore, the carrier panel CF can be easily delaminated.

[0099] Figure 6A and Figure 6B This is a planar image showing a display module according to an embodiment of the invention. Figure 6A and Figure 6B It can correspond to the plan view viewed on the carrier panel CF. Figure 6A It shows that it can be used with Figure 4EThe image shown is of the first display module DM-C corresponding to the cut display module DM-C. Figure 6B It shows that it can be used with Figure 4H The image shown is of the second display module DM-L corresponding to the processing display module DM-L. In the following text, reference will be made to... Figure 6A and Figure 6B Description of embodiments of the invention.

[0100] exist Figure 6A In the diagram, when the first display module DM-C is viewed in plan view, the side surfaces of the carrier panel CF and the adhesive layer AD-C are visible. As described above, since the side surfaces of the first display module DM-C have inclined surfaces, the side surfaces of the adhesive layer AD-C can be positioned to expose the exterior of the end CF_E of the carrier panel CF. Therefore, the laser beam LB-D can be easily or efficiently emitted along the side surfaces of the adhesive layer AD-C.

[0101] like Figure 6B As shown, the portion of the second display module DM-L indicated by the processing line DFL corresponds substantially to the area obtained by removing a portion of the adhesive layer AD-C by the laser beam LB-D. By removing a portion of the adhesive layer AD-C along the processing line DFL, a space damaged by the laser beam LB-D can be formed along the processing line DFL. According to an embodiment of the invention, by removing a portion of the adhesive layer AD-C, the carrier panel CF can be easily delaminated. Furthermore, according to an embodiment of the invention, when viewed in a plan view, the side surface of the adhesive layer AD-C is exposed by forming an inclined surface on the side surface of the first display module DM-C. Therefore, a portion of the adhesive layer AD-C can be easily or effectively processed by the laser beam LB-D.

[0102] Figure 7A and Figure 7B This is a cross-sectional view of a portion of the display module according to an embodiment of the invention. Referring below... Figure 7A and Figure 7B Embodiments of the invention are described. Figure 7A and Figure 7B In the middle, with reference to the above Figures 1A to 6B The same or identical elements or components described are indicated by the same or identical reference numerals, and any repeated detailed descriptions thereof will be omitted.

[0103] In an embodiment, such as Figure 7AAs shown, the display module DM-C1 (hereinafter referred to as the first display module DM-C1) may include a carrier panel CF, a lower protective panel LP, a display panel DP, an optical panel OPL, a shock-absorbing panel DB, a window WD, an upper protective panel UP, and multiple adhesive layers AD1, AD2, and AD3. The first display module DM-C1 may be added to the cut display module DM-C (see [reference needed]) with the lower protective panel LP, optical panel OPL, shock-absorbing panel DB, upper protective panel UP, and adhesive layers AD2 and AD3 therein. Figure 4E The embodiments correspond to this. In the following text, any repeated detailed descriptions of elements or components corresponding to the cut display module DM-C will be omitted.

[0104] In an embodiment, such as Figure 7A As shown, the lower protective panel LP is disposed between the display panel DP and the carrier panel CF. The lower protective panel LP may have insulating properties. In an embodiment, the lower protective panel LP may be flexible. In an embodiment, the lower protective panel LP may, for example, include PI.

[0105] An optical panel (OPL) can be disposed between the display panel (DP) and the window (WD). The OPL can improve the visibility of the display panel (DP) by reducing the external light reflectivity of the DP. For example, in one embodiment, the OPL may include a polarizing film or an anti-scattering film.

[0106] A shock-absorbing panel (DB) can be disposed between the display panel (DP) and the window (WD). The shock-absorbing panel (DB) can reduce the impact of shocks that may be transmitted through the window (WD) on the display panel (DP). The shock-absorbing panel (DB) can have high shock absorption and can be optically transparent. For example, in one embodiment, the shock-absorbing panel (DB) can include polyurethane resin, etc.

[0107] The upper protective panel (UP) covers the window WD. The upper protective panel (UP) can protect the window WD. The upper protective panel (UP) can have higher rigidity than the window WD. Optionally, the upper protective panel (UP) can have a structure in which a hard coating and a soft film are stacked on top of each other.

[0108] Adhesive layers AD1, AD2, and AD3 may include a first adhesive layer AD1, a second adhesive layer AD2, and a third adhesive layer AD3. The first adhesive layer AD1 is disposed between the carrier panel CF and the lower protective panel LP. The first adhesive layer AD1 may substantially adhere to... Figure 4E The cut adhesive layer AD-C is shown in the figure.

[0109] The second adhesive layer AD2 is disposed between the display panel DP and the optical panel OPL to bond the display panel DP to the optical panel OPL. The second adhesive layer AD2 may include at least one of optically transparent adhesive, optically transparent resin, and pressure-sensitive adhesive.

[0110] The third adhesive layer AD3 is disposed between the window WD and the damping panel DB to bond the window WD to the damping panel DB. The third adhesive layer AD3 may include at least one of optically clear adhesive, optically clear resin, and pressure-sensitive adhesive.

[0111] In this embodiment, in addition to adhesive layers AD1, AD2 and AD3, an additional adhesive layer may be included, which may also be disposed between the optical panel OPL and the damping panel DB or between the display panel DP and the lower protective panel LP.

[0112] When viewed in cross-section, the side surfaces of the first display module DM-C1 may include inclined surfaces along the virtual line VL. The side surfaces of the carrier panel CF, lower protective panel LP, display panel DP, optical panel OPL, shock-absorbing panel DB, window WD, upper protective panel UP, and adhesive layers AD1, AD2, and AD3 constituting the first display module DM-C1 are aligned along the virtual line VL.

[0113] In an embodiment, such as Figure 7B As shown, the display module DM-L1 (hereinafter referred to as the second display module DM-L1) can be used with Figure 7A The first display module DM-C1 shown corresponds to this and has undergone processing using the laser beam LB-D (see...). Figure 4H For example, in one embodiment, the second display module DM-L1 may include a first adhesive layer AD11 (hereinafter referred to as the processed adhesive layer AD11) defined by processing the first adhesive layer AD1 of the first display module DM-C1.

[0114] The side surface AD_S of the adhesive layer AD11 can be recessed from the side surface of other components, such as the side surface of the carrier panel CF or the side surface of the lower protective panel LP. The side surface AD_S of the adhesive layer AD11 is defined by the portion of the first adhesive layer AD1 of the first display module DM-C1 that is damaged or removed by the laser beam LB-D, and a portion of the rear surface LP_L of the lower protective panel LP that contacts the side surface AD_S can be exposed through the side surface AD_S of the adhesive layer AD11.

[0115] According to embodiments of the invention, even when the second display module DM-L1 includes multiple panels, the second display module DM-L1 allows for easy delamination of the carrier panel CF by including a partially damaged or removed adhesive layer AD11. Therefore, process reliability can be improved.

[0116] Figure 8A and Figure 8B This is a plan view of a display module according to an embodiment of the invention. Figure 8A and Figure 8B It shows that in relation to Figure 4F The display module corresponds to the process in which the technology is applied. In the following text, reference will be made to... Figure 8A and Figure 8B Embodiments of the invention are described. Figure 8A and Figure 8B In the middle, with reference to the above Figures 1A to 7B The same or identical elements or components described are indicated by the same or identical reference numerals, and any repeated detailed descriptions thereof will be omitted.

[0117] In an embodiment, such as Figure 8A As shown, the processing lines DFL-1 of the display module DM-C2 can be configured as multiple processing lines arranged intermittently. The processing lines DFL-1 can be set only in the regions adjacent to the four vertices of the display module DM-C2, and can be defined to be separated from each other.

[0118] The processing line DFL-1 can be defined as adjacent to the attachment area DLS. The attachment area DLS can be, for example, a split roller DLR (see...). Figure 4I The layered device is attached to the area thereon. For ease of illustration, the attachment area DLS is shown in cross-section in the accompanying drawings.

[0119] The processing line DFL-1 is partially confined to the area adjacent to the adhesion region DLS, therefore the laser beam LB-D (see [reference needed]) is used to process the adhesive layer. Figure 4G It can be selectively emitted along the corresponding processing line DFL-1. Therefore, process time and process cost can be reduced.

[0120] Optionally, such as Figure 8B As shown, the processing line DFL-2 of the display module DM-C3 can be set intermittently and can also extend to the area outside the attachment area DLS. When the adhesion of the adhesive layer is high or the attachment area DLS has a narrow area according to the layering equipment, the process of layering the carrier panel can be stably executed by controlling the length of each processing line DFL-2.

[0121] According to embodiments of the invention, the carrier panel can be easily removed, thereby improving the process reliability of manufacturing display devices. In such embodiments, the display module can be formed using conventional or existing processes, thereby simplifying the process and reducing process costs.

[0122] The invention should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and that they will fully convey the inventive concept to those skilled in the art.

[0123] Although the invention has been specifically shown and described with reference to embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit or scope of the invention as defined by the claims.

Claims

1. A display module, the display module comprising: The display panel includes multiple pixels; A carrier panel is located on the rear surface of the display panel; An adhesive layer is disposed between the display panel and the carrier panel, wherein the adhesive layer is in contact with the carrier panel. A window is located on the front surface of the display panel; and An additional adhesive layer is provided between the display panel and the window. Wherein, the side surface of the adhesive layer is recessed from the side surface of the carrier panel, and The side surface of the carrier panel has an inclined surface relative to the rear surface of the display panel. When viewed in cross-section, the side surface of the additional adhesive layer is aligned with the inclined surface.

2. The display module according to claim 1, wherein, A portion of the rear surface of the display panel is exposed through the adhesive layer.

3. The display module according to claim 1, wherein, When viewed in cross-section, the side surface of the display panel is aligned with the inclined surface.

4. The display module according to claim 1, in, When viewed in cross-section, the side surfaces of the window are aligned with the inclined surfaces.

5. The display module according to claim 1, wherein, The adhesive layer includes at least one of optically transparent adhesive, optically transparent resin, and pressure-sensitive adhesive.

6. The display module according to claim 1, wherein, The display panel includes a polyimide substrate, and The adhesive layer is in contact with the polyimide substrate.

7. The display module according to claim 1, further comprising: A protrusion that protrudes from the rear surface of the carrier panel when viewed from the rear surface of the display panel.

8. The display module according to claim 7, wherein, When viewed from the rear surface of the display panel, the protrusion is positioned along the side surface of the carrier panel.

9. A display device, the display device comprising: The display panel includes multiple pixels; The lower protective panel is located on the rear surface of the display panel; as well as An adhesive layer is located between the display panel and the lower protective panel. Wherein, the side surface of the display panel is inclined from the side surface of the lower protective panel, and A portion of the rear surface of the display panel is exposed through the adhesive layer. The lower protective panel is made of metal.

10. The display device according to claim 9, wherein, The side surface of the adhesive layer is recessed from the side surface of the display panel.

11. The display device according to claim 9, wherein, The display panel includes a substrate and organic light-emitting devices located on the substrate.

12. The display device according to claim 11, wherein, The substrate comprises polyimide.

13. The display device according to claim 9, wherein, The display panel is foldable about a folding axis extending in a predetermined direction.

14. The display device according to claim 9, further comprising: A window is located on the front surface of the display panel. The side surface of the window is aligned with the side surface of the display panel.

15. The display device according to claim 14, further comprising: An additional layer, located between the window and the display panel, The side surface of the additional layer is aligned with the side surface of the display panel.

Images