Photoelectric display film and preparation method thereof

Abstract

The invention discloses a photoelectric display film and a preparation method thereof, and belongs to the field of photoelectricity. The photoelectric display film comprises a transparent conductive layer, an active layer, a substrate, an optical film layer and a packaging layer, the transparent conductive layer is a layer through which current flows, and the active layer is an area where a photoelectric effect occurs; the transparent conductive layer triggers a photoelectric effect in a manner that electrons flow from the transparent conductive layer to the active layer; the optical film layer adjusts the transmissivity, the reflectivity and the color saturation, and the novel optical film material expands the color gamut; the transparent conductive layer is attached to the substrate; the packaging layer is located on the surface of the photoelectric display film, protects the internal structure and prevents harmful elements such as moisture and oxygen from permeating; sensor elements are integrated through the intelligent packaging technology, and the functions of the displayer are increased. The invention discloses a photoelectric display film and a preparation method thereof. The preparation method comprises the following steps: S1, preparing a substrate; s2, cleaning treatment; s3, preparing a transparent conductive layer; s4, preparing an active layer; s5, adding an optical film layer; and S6, preparing a packaging layer.

Description

Technical Field

[0001] This invention relates to the field of electro-optic technology, and in particular to a photoelectric display film and its preparation method. Background Technology

[0002] Optoelectronic display films are a key display technology, with a historical technological background involving transparent conductive layers, active layers, and encapsulation techniques. In the late 20th century, indium tin oxide (ITO) became the mainstream transparent conductive material, but its high cost and limited resources spurred research into alternative materials. Regarding active layers, the rise of OLED technology has provided new possibilities for flexible displays, while quantum dot technology has broadened the color gamut. Encapsulation technologies have evolved gradually, from glass substrates to flexible materials, to meet the needs of various display devices. Developments in fabrication methods, including sputtering and solution methods, have provided diversity and innovation for optoelectronic display films. These technological advancements have driven the continuous progress of display devices, from traditional liquid crystals to modern OLEDs.

[0003] Traditional optoelectronic display films, such as the transparent conductive layer used in liquid crystal displays (typically indium tin oxide - ITO), have several drawbacks. First, ITO material is expensive and scarce in the supply chain, increasing production costs. Second, the ITO manufacturing process is environmentally unfriendly, involving high-temperature processing and the use of chemical solutions. Furthermore, ITO conductive films exhibit significant rigidity in flexible display applications, limiting the flexibility and thinness of the devices. To address these issues, researchers are actively seeking alternative materials and green manufacturing methods to improve sustainability, reduce costs, and meet the demands of next-generation optoelectronic display technologies. Summary of the Invention

[0004] The technical problem this invention aims to solve is to provide a photoelectric display film and its preparation method to address the numerous shortcomings of existing traditional photoelectric display films, such as the transparent conductive layer used in liquid crystal displays (typically indium tin oxide - ITO). First, ITO material is expensive and scarce in the supply chain, increasing production costs. Second, the ITO preparation process is environmentally unfriendly, involving high-temperature processing and the use of chemical solutions. Furthermore, the rigidity of ITO conductive films in flexible display applications is relatively high, limiting the flexibility and thinness of the devices. Faced with these problems, researchers are actively seeking alternative materials and green preparation methods to improve sustainability, reduce costs, and meet the demands of next-generation photoelectric display technologies.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: A photoelectric display film and its preparation method are disclosed, comprising a transparent conductive layer, an active layer, a substrate, an optical film layer, and an encapsulation layer. The transparent conductive layer is the layer through which current flows, and the active layer is the region where the photoelectric effect occurs; the good current conduction performance between the transparent conductive layer and the active layer allows electrons to flow from the transparent conductive layer to the active layer, triggering the photoelectric effect. The novel conductive layer enhances the absorption of electrons by the active layer; The optical film layer adjusts the transmittance, reflectance, and color saturation, and the novel optical film material expands the color gamut; The transparent conductive layer is attached to the substrate, which serves as the supporting structure for the entire display device. Flexible plastic substrates are used to manufacture flexible displays. The encapsulation layer is located on the surface of the optoelectronic display film, protecting the internal structure and preventing the penetration of moisture, oxygen, and harmful elements. Smart packaging technology integrates sensor elements, enhancing the functionality of the display.

[0006] Preferably, the transparent conductive layer is formed of indium tin oxide and other oxides: The indium tin oxide is a transparent conductive material composed of indium, tin, and oxygen, with the chemical formula In₂O₃-SnO₂. Its main characteristics are as follows: The indium tin oxide has high transparency, allowing light to penetrate to the underlying layers; The indium tin oxide has good electrical conductivity, conducts current, and forms electrodes; it is deposited on the substrate in the form of a thin film, prepared by physical evaporation and sputtering techniques; to further optimize the performance of the transparent conductive layer, the indium tin oxide is doped and a composite structure is adopted, including by doping with tin, nitrogen, and molybdenum elements to adjust the electrical properties of the film; the transparent conductive layer is used for flexible display applications, and the substrate is a flexible plastic, including polyester film; Meanwhile, the transparent conductive layer also uses renewable conductive materials including carbon nanotubes and silver nanowires.

[0007] Preferably, the active layer incorporates quantum dot technology and organic semiconductors; The active layer of the quantum dot technology consists of a thin film; quantum dots are nanoscale semiconductor particles, and their size determines their emission color; by adjusting the size of the quantum dots, a rich variety of colors can be obtained; The organic semiconductor includes an organic light-emitting diode (OLED), and the active layer of the OLED includes light-emitting organic molecules, including polymers and small molecules; the polymers and small molecules emit light when excited by an electric field.

[0008] Preferably, the substrate integrates sensors including a photosensitive sensor, an image sensor, a temperature sensor, a humidity sensor, an accelerometer, and a gyroscope sensor, as well as a smart substrate with communication technologies including Wi-Fi, NFC, GPS, and fingerprint recognition sensors, to enable intelligent and interactive display devices.

[0009] Preferably, the optical film layer is a multilayer dielectric film, including a multilayer dielectric material of silicon dioxide and titanium dioxide; The multilayer dielectric film reduces reflection by adjusting the thickness and refractive index of the layers to induce destructive interference of light at specific wavelengths.

[0010] Preferably, the encapsulation layer uses a polymer as its main component; The encapsulation layer is made of inorganic materials, including glass, metal, and ceramic. The encapsulation layer uses a highly transparent substrate, including high-quality polymers and special glass, to allow light to pass through efficiently; The surface of the encapsulation layer substrate is coated with an anti-reflective coating. Through multilayer dielectric film and nanostructure design, reflection is reduced, transmittance is increased, and light loss is reduced. The encapsulation layer substrate has a moisture-proof layer, including a polymer film and a special coating, to prevent moisture penetration and protect internal components from moisture. An airtight layer is used above the moisture-proof layer of the encapsulation layer, which is made of polymer materials and special airtight packaging technology. The bottom and middle of the encapsulation layer contain a thermally conductive layer, which is made of thermally conductive film, thermally conductive adhesive and other thermally conductive materials; The surface of the encapsulation layer contains a hard film, including a siloxane material.

[0011] Preferably, the method for preparing an optoelectronic display film, based on an optoelectronic display film and its preparation method, includes the following steps: S1. Substrate preparation: Select a substrate including glass, flexible plastic, and metal; the substrate surface must be flat and clean. S2. Cleaning process: The substrate is cleaned to remove dust, impurities and grease from the surface, thus improving the quality of the thin film deposition. S3. Preparation of transparent conductive layer: Using sputtering technology, transparent conductive materials, including indium tin oxide, are deposited on the substrate in the form of a target film layer; The sputtering is a physical vapor deposition technique that uses an electric field applied to a target to sputter atoms and molecules of the target onto a substrate to form a thin film. S4. Active layer preparation: Depending on the specific display technology, different methods are used to prepare the active layer; including in OLEDs, using organic molecular deposition technology or solution method to deposit organic light-emitting materials on a transparent conductive layer; S5. Addition of optical coatings, including polarizing films and antireflective films; S6. Encapsulation layer preparation: An encapsulation layer is added to the prepared structure using encapsulating adhesive, thin film encapsulation, and other encapsulation technologies.

[0012] Preferably, the S3 method using sputtering technology includes the following steps: S3-1. Substrate preparation: Prepare the substrate material, clean the substrate surface to ensure it is free of dust, grease, and other contaminants; S3-2. Select the substrate material as the sputtering target; the target material is selected according to the type of thin film to be prepared, and can be a metal or an oxide; The target material is mounted on the target holder in the sputtering system; S3-3. Place the entire sputtering system in the vacuum chamber and begin evacuation; The vacuum level is achieved at the required level, and the process is carried out under high vacuum and ultra-high vacuum conditions. S3-4. During the vacuuming process, an inert gas, argon, is added to clean the vacuum chamber, ensuring that there is no oxygen, moisture, or harmful gases inside. S3-5. The target material is heated to increase its temperature, causing it to release evaporated atoms and molecules; Heating is achieved through resistance heating and electron beam heating; S3-6. In a vacuum environment, by accelerating electric and magnetic fields, the atoms and molecules of the target material are evaporated and deposited on the surface of the substrate to form a thin film; The thickness and properties of the deposited film are adjusted by controlling sputtering time, sputtering power, and target temperature parameters; S3-7. Monitor the growth of the thin film in real time using real-time monitoring technologies, including laser interferometers and ellipsometers; Adjusting sputtering parameters controls the thickness, uniformity, and crystal structure of the thin film; S3-8. After deposition is complete, stop the sputtering source, turn off the heating system, and cool the entire system; Remove the deposited substrate to complete the fabrication process.

[0013] Preferably, S6-1. Prepare the encapsulating adhesive, which is a two-part mixture comprising epoxy resin and a hardener; mix the two parts according to the manufacturer's ratio and use it within the specified time; S6-2. Before mixing the encapsulating adhesive, place it in a vacuum chamber to remove air bubbles from the mixture; S6-3. Use an adhesive coating process to evenly apply encapsulating adhesive to the substrate, covering the encapsulated and protected component area; During the coating process, molds and templates are used to ensure that the shape and thickness of the encapsulating adhesive meet the design requirements, resulting in a substrate coated with encapsulating adhesive. S6-4. Place the substrate coated with encapsulant under appropriate environmental conditions to trigger the curing process of the encapsulant, including temperature control and curing time management; S6-5. After curing, a baking process is performed to achieve the final hardness and performance of the cured encapsulant; S6-6. According to the design requirements, the packaged device is cut and shaped to meet the requirements in terms of appearance.

[0014] Compared with the prior art, the present invention has at least the following beneficial effects: (1) Introduce new conductive materials, active layers and other innovative components to reduce dependence on scarce resources and improve sustainability.

[0015] Innovative preparation methods may employ more environmentally friendly processes, reducing adverse environmental impacts.

[0016] (2) Using alternative expensive materials, such as new conductive materials, can reduce production costs.

[0017] The new preparation method may be more efficient, reduce energy consumption and waste generation, and further reduce preparation costs.

[0018] (3) Introducing flexible conductive materials and biodegradable substrates makes the optoelectronic display film more flexible and suitable for flexible display devices.

[0019] Innovative ingredients and preparation methods may enable optoelectronic display films to be adapted to a wider range of applications.

[0020] (4) The introduction of new active layer materials, quantum dot technology, etc., improves the color purity, brightness and response speed of the display.

[0021] Innovative optical coatings and anti-reflective technologies can improve the contrast and visibility of displays.

[0022] (5) Integrate intelligent elements into the substrate, such as sensors and communication technologies, to enable the optoelectronic display film to have intelligent and richer interactive functions; improve user experience and expand the application fields of the display.

[0023] (6) Innovative components and preparation methods make optoelectronic display films more suitable for the requirements of next-generation display technologies, such as OLED technology and quantum dot display. Attached Figure Description

[0024] The accompanying drawings, which are incorporated herein and form part of the specification, illustrate embodiments of the present application and, together with the specification, further serve to explain the principles of the present application and enable those skilled in the art to implement and use the present application.

[0025] Figure 1-2 This is a schematic diagram of the overall process of an optoelectronic display film and its preparation method. As shown in the figure, specific structures and devices are labeled in the figure to clearly illustrate the structure of the embodiments of the present invention. However, this is only for illustrative purposes and is not intended to limit the present invention to the specific structure, device and environment. Those skilled in the art can adjust or modify these devices and environments according to specific needs, and such adjustments or modifications are still included in the scope of the appended claims. Detailed Implementation

[0026] The present invention provides a photoelectric display film and its preparation method, with reference to the accompanying drawings and specific embodiments. It should be noted that, to make the embodiments more detailed, the following embodiments are the best and preferred embodiments; those skilled in the art can also use other alternative methods to implement some known technologies; and the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit the present invention.

[0027] It should be noted that the use of terms such as "an embodiment," "an embodiment," "an exemplary embodiment," and "some embodiments" in the specification indicates that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the art.

[0028] Generally, terms can be understood at least partly from their use in context. For example, depending at least partly on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood not necessarily to convey an exclusive set of factors, but rather, alternatively, depending at least partly on the context, to allow for the presence of other factors that are not necessarily explicitly described.

[0029] It is understood that the meanings of “on”, “above”, and “above” in this application should be interpreted in the broadest sense, such that “on” means not only “directly on” something, but also includes something with an intermediary feature or layer, and that “above” or “above” means not only “on” something, but also includes something “above” something without an intermediary feature or layer.

[0030] Furthermore, spatially related terms such as “below,” “under,” “lower,” “above,” and “upper” are used herein for convenience to describe the relationship of one element or feature to one or more other elements or features, as illustrated in the accompanying drawings. Spatially related terms are intended to cover different orientations in the use or operation of the device other than those depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially related descriptive terms used herein can be interpreted similarly.

[0031] In this embodiment, as Figure 1 and Figure 2 As shown, the embodiment of the present invention provides an optoelectronic display film comprising a transparent conductive layer, an active layer, a substrate, an optical film layer, and an encapsulation layer; The transparent conductive layer is the layer through which current flows, and the active layer is the region where the photoelectric effect occurs; the good current conduction performance between the transparent conductive layer and the active layer allows electrons to flow from the transparent conductive layer to the active layer, triggering the photoelectric effect. The novel conductive layer enhances the absorption of electrons by the active layer; The optical film layer adjusts the transmittance, reflectance, and color saturation, and the novel optical film material expands the color gamut; The transparent conductive layer is attached to the substrate, which serves as the supporting structure for the entire display device. Flexible plastic substrates are used to manufacture flexible displays. The encapsulation layer is located on the surface of the optoelectronic display film, protecting the internal structure and preventing the penetration of moisture, oxygen, and harmful elements. Smart packaging technology integrates sensor elements, enhancing the functionality of the display.

[0032] The transparent conductive layer is formed of indium tin oxide and other oxides: The indium tin oxide is a transparent conductive material composed of indium, tin, and oxygen, with the chemical formula In₂O₃-SnO₂. Its main characteristics are as follows: The indium tin oxide has high transparency, allowing light to penetrate to the underlying layers; The indium tin oxide has good electrical conductivity, conducts current, and forms electrodes; it is deposited on the substrate in the form of a thin film, prepared by physical evaporation and sputtering techniques; to further optimize the performance of the transparent conductive layer, the indium tin oxide is doped and a composite structure is adopted, including by doping with tin, nitrogen, and molybdenum elements to adjust the electrical properties of the film; the transparent conductive layer is used for flexible display applications, and the substrate is a flexible plastic, including polyester film; Meanwhile, the transparent conductive layer also uses renewable conductive materials including carbon nanotubes and silver nanowires.

[0033] The active layer incorporates quantum dot technology and organic semiconductors; The active layer of the quantum dot technology consists of a thin film; quantum dots are nanoscale semiconductor particles, and their size determines their emission color; by adjusting the size of the quantum dots, a rich variety of colors can be obtained; The organic semiconductor includes an organic light-emitting diode (OLED), and the active layer of the OLED includes light-emitting organic molecules, including polymers and small molecules; the polymers and small molecules emit light when excited by an electric field.

[0034] The substrate integrates sensors including a photosensitive sensor, an image sensor, a temperature sensor, a humidity sensor, an accelerometer, and a gyroscope, as well as communication technologies including Wi-Fi, NFC, GPS, and fingerprint recognition sensors, to enable intelligent and interactive display devices.

[0035] The optical film layer is a multilayer dielectric film, including a multilayer dielectric material of silicon dioxide and titanium dioxide; The multilayer dielectric film reduces reflection by adjusting the thickness and refractive index of the layers to induce destructive interference of light at specific wavelengths.

[0036] The encapsulation layer uses a polymer as its main component. The encapsulation layer is made of inorganic materials, including glass, metal, and ceramic. The encapsulation layer uses a highly transparent substrate, including high-quality polymers and special glass, to allow light to pass through efficiently; The surface of the encapsulation layer substrate is coated with an anti-reflective coating. Through multilayer dielectric film and nanostructure design, reflection is reduced, transmittance is increased, and light loss is reduced. The encapsulation layer substrate has a moisture-proof layer, including a polymer film and a special coating, to prevent moisture penetration and protect internal components from moisture. An airtight layer is used above the moisture-proof layer of the encapsulation layer, which is made of polymer materials and special airtight packaging technology. The bottom and middle of the encapsulation layer contain a thermally conductive layer, which is made of thermally conductive film, thermally conductive adhesive and other thermally conductive materials; The surface of the encapsulation layer contains a hard film, including a siloxane material.

[0037] According to a photoelectric display film and its preparation method, the following steps are included: S1. Substrate preparation: Select a substrate including glass, flexible plastic, and metal; the substrate surface must be flat and clean. S2. Cleaning process: The substrate is cleaned to remove dust, impurities and grease from the surface, thus improving the quality of the thin film deposition. S3. Preparation of transparent conductive layer: Using sputtering technology, transparent conductive materials, including indium tin oxide, are deposited on the substrate in the form of a target film layer; The sputtering is a physical vapor deposition technique that uses an electric field applied to a target to sputter atoms and molecules of the target onto a substrate to form a thin film. S4. Active layer preparation: Depending on the specific display technology, different methods are used to prepare the active layer; including in OLEDs, using organic molecular deposition technology or solution method to deposit organic light-emitting materials on a transparent conductive layer; S5. Addition of optical coatings, including polarizing films and antireflective films; S6. Encapsulation layer preparation: An encapsulation layer is added to the prepared structure using encapsulating adhesive, thin film encapsulation, and other encapsulation technologies.

[0038] The S3 uses sputtering technology and includes the following steps: S3-1. Substrate preparation: Prepare the substrate material, clean the substrate surface to ensure it is free of dust, grease, and other contaminants; S3-2. Select the substrate material as the sputtering target; the target material is selected according to the type of thin film to be prepared, and can be a metal or an oxide; The target material is mounted on the target holder in the sputtering system; S3-3. Place the entire sputtering system in the vacuum chamber and begin evacuation; The vacuum level is achieved at the required level, and the process is carried out under high vacuum and ultra-high vacuum conditions. S3-4. During the vacuuming process, an inert gas, argon, is added to clean the vacuum chamber, ensuring that there is no oxygen, moisture, or harmful gases inside. S3-5. The target material is heated to increase its temperature, causing it to release evaporated atoms and molecules; Heating is achieved through resistance heating and electron beam heating; S3-6. In a vacuum environment, by accelerating electric and magnetic fields, the atoms and molecules of the target material are evaporated and deposited on the surface of the substrate to form a thin film; The thickness and properties of the deposited film are adjusted by controlling sputtering time, sputtering power, and target temperature parameters; S3-7. Monitor the growth of the thin film in real time using real-time monitoring technologies, including laser interferometers and ellipsometers; Adjusting sputtering parameters controls the thickness, uniformity, and crystal structure of the thin film; S3-8. After deposition is complete, stop the sputtering source, turn off the heating system, and cool the entire system; Remove the deposited substrate to complete the fabrication process.

[0039] The S6 encapsulating adhesive includes the following steps: S6-1. Prepare the encapsulating adhesive, which is a two-part mixture including epoxy resin and hardener; mix the two parts according to the manufacturer's ratio and use within the specified time. S6-2. Before mixing the encapsulating adhesive, place it in a vacuum chamber to remove air bubbles from the mixture; S6-3. Use an adhesive coating process to evenly apply encapsulating adhesive to the substrate, covering the encapsulated and protected component area; During the coating process, molds and templates are used to ensure that the shape and thickness of the encapsulating adhesive meet the design requirements, resulting in a substrate coated with encapsulating adhesive. S6-4. Place the substrate coated with encapsulant under appropriate environmental conditions to trigger the curing process of the encapsulant, including temperature control and curing time management; S6-5. After curing, a baking process is performed to achieve the final hardness and performance of the cured encapsulant; S6-6. According to the design requirements, the packaged device is cut and shaped to meet the requirements in terms of appearance.

[0040] This invention encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this invention. To provide the public with a thorough understanding of this invention, specific details are described in detail in the following preferred embodiments; however, those skilled in the art will fully understand the invention even without these details. Furthermore, to avoid unnecessary misunderstanding of the essence of this invention, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0041] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A photoelectric display film, characterized in that, The aforementioned optoelectronic display film includes a transparent conductive layer, an active layer, a substrate, an optical film layer, and an encapsulation layer; The transparent conductive layer is the layer through which current flows, and the active layer is the region where the photoelectric effect occurs; The excellent current conduction performance between the transparent conductive layer and the active layer allows electrons to flow from the transparent conductive layer to the active layer, triggering the photoelectric effect. The novel conductive layer enhances the absorption of electrons by the active layer; The optical film layer adjusts the transmittance, reflectance, and color saturation, and the novel optical film material expands the color gamut; The transparent conductive layer is attached to the substrate, which serves as the supporting structure for the entire display device. Flexible plastic substrates are used to manufacture flexible displays. The encapsulation layer is located on the surface of the optoelectronic display film, protecting the internal structure and preventing the penetration of moisture, oxygen, and harmful elements. Smart packaging technology integrates sensor elements, enhancing the functionality of the display.

2. The photoelectric display film according to claim 1, characterized in that, The transparent conductive layer is formed of indium tin oxide and other oxides: The indium tin oxide is a transparent conductive material composed of indium, tin, and oxygen, with the chemical formula In₂O₃-SnO₂. Its main characteristics are as follows: The indium tin oxide has high transparency, allowing light to penetrate to the underlying layers; The indium tin oxide has good electrical conductivity, conducts current, and forms electrodes; it is deposited on the substrate in the form of a thin film, prepared by physical evaporation and sputtering techniques; to further optimize the performance of the transparent conductive layer, the indium tin oxide is doped and a composite structure is adopted, including by doping with tin, nitrogen, and molybdenum elements to adjust the electrical properties of the film; the transparent conductive layer is used for flexible display applications, and the substrate is a flexible plastic, including polyester film; Meanwhile, the transparent conductive layer also uses renewable conductive materials including carbon nanotubes and silver nanowires.

3. The photoelectric display film according to claim 1, characterized in that, The active layer incorporates quantum dot technology and organic semiconductors; The active layer of the quantum dot technology consists of a thin film; quantum dots are nanoscale semiconductor particles, and their size determines their emission color; by adjusting the size of the quantum dots, a rich variety of colors can be obtained; The organic semiconductor includes an organic light-emitting diode (OLED), and the active layer of the OLED includes light-emitting organic molecules, including polymers and small molecules; the polymers and small molecules emit light when excited by an electric field.

4. The photoelectric display film according to claim 1, characterized in that, The substrate integrates sensors including a photosensitive sensor, an image sensor, a temperature sensor, a humidity sensor, an accelerometer, and a gyroscope, as well as communication technologies including Wi-Fi, NFC, GPS, and fingerprint recognition sensors, to enable intelligent and interactive display devices.

5. The photoelectric display film according to claim 1, characterized in that, The optical film layer is a multilayer dielectric film, including a multilayer dielectric material of silicon dioxide and titanium dioxide; The multilayer dielectric film reduces reflection by adjusting the thickness and refractive index of the layers to induce destructive interference of light at specific wavelengths.

6. The photoelectric display film according to claim 1, characterized in that, The encapsulation layer uses a polymer as its main component. The encapsulation layer is made of inorganic materials, including glass, metal and ceramic; The encapsulation layer uses a highly transparent substrate, including high-quality polymers and special glass, to allow light to pass through efficiently; The surface of the encapsulation layer substrate is coated with an anti-reflective coating. Through multilayer dielectric film and nanostructure design, reflection is reduced, transmittance is increased, and light loss is reduced. The encapsulation layer substrate has a moisture-proof layer, including a polymer film and a special coating, to prevent moisture penetration and protect internal components from moisture. An airtight layer is used above the moisture-proof layer of the encapsulation layer, which is made of polymer materials and special airtight packaging technology. The bottom and middle of the encapsulation layer contain a thermally conductive layer, which is made of thermally conductive film, thermally conductive adhesive and other thermally conductive materials; The surface of the encapsulation layer contains a hard film, including a siloxane material.

7. A method for preparing an optoelectronic display film, comprising an optoelectronic display film according to any one of claims 1-6, characterized in that, The method for preparing an optoelectronic display film, based on an optoelectronic display film and its preparation method, includes the following steps: S1. Substrate preparation: Select a substrate including glass, flexible plastic, and metal; the substrate surface must be flat and clean. S2. Cleaning process: The substrate is cleaned to remove dust, impurities and grease from the surface, thus improving the quality of the thin film deposition. S3. Preparation of transparent conductive layer: Using sputtering technology, transparent conductive materials, including indium tin oxide, are deposited on the substrate in the form of a target film layer; The sputtering is a physical vapor deposition technique that uses an electric field applied to a target to sputter atoms and molecules of the target onto a substrate to form a thin film. S4. Active layer preparation: Depending on the specific display technology, different methods are used to prepare the active layer; including in OLEDs, using organic molecular deposition technology or solution method to deposit organic light-emitting materials on a transparent conductive layer; S5. Addition of optical coatings, including polarizing films and antireflective films; S6. Encapsulation layer preparation: An encapsulation layer is added to the prepared structure using encapsulating adhesive, thin film encapsulation, and other encapsulation technologies.

8. The method for preparing a photoelectric display film according to claim 7, characterized in that, The S3 uses sputtering technology and includes the following steps: S3-1. Substrate preparation: Prepare the substrate material, clean the substrate surface to ensure it is free of dust, grease, and other contaminants; S3-2. Select the substrate material as the sputtering target; the target material is selected according to the type of thin film to be prepared, and can be a metal or an oxide; The target material is mounted on the target holder in the sputtering system; S3-3. Place the entire sputtering system in the vacuum chamber and begin evacuation; The vacuum level is achieved at the required level, and the process is carried out under high vacuum and ultra-high vacuum conditions. S3-4. During the vacuuming process, an inert gas, argon, is added to clean the vacuum chamber, ensuring that there is no oxygen, moisture, or harmful gases inside. S3-5. The target material is heated to increase its temperature, causing it to release evaporated atoms and molecules; Heating is achieved through resistance heating and electron beam heating; S3-6. In a vacuum environment, by accelerating electric and magnetic fields, the atoms and molecules of the target material are evaporated and deposited on the surface of the substrate to form a thin film; The thickness and properties of the deposited film are adjusted by controlling sputtering time, sputtering power, and target temperature parameters; S3-7. Monitor the growth of the thin film in real time using real-time monitoring technologies, including laser interferometers and ellipsometers; Adjusting sputtering parameters controls the thickness, uniformity, and crystal structure of the thin film; S3-8. After deposition is complete, stop the sputtering source, turn off the heating system, and cool the entire system; Remove the deposited substrate to complete the fabrication process.

9. The method for preparing a photoelectric display film according to claim 7, characterized in that, The S6 encapsulating adhesive includes the following steps: S6-1. Prepare the encapsulating adhesive, which is a two-part mixture including epoxy resin and hardener; mix the two parts according to the manufacturer's ratio and use within the specified time. S6-2. Before mixing the encapsulating adhesive, place it in a vacuum chamber to remove air bubbles from the mixture; S6-3. Use an adhesive coating process to evenly apply encapsulating adhesive to the substrate, covering the encapsulated and protected component area; During the coating process, molds and templates are used to ensure that the shape and thickness of the encapsulating adhesive meet the design requirements, resulting in a substrate coated with encapsulating adhesive. S6-4. Place the substrate coated with encapsulant under appropriate environmental conditions to trigger the curing process of the encapsulant, including temperature control and curing time management; S6-5. After curing, a baking process is performed to achieve the final hardness and performance of the cured encapsulant; S6-6. According to the design requirements, the packaged device is cut and shaped to meet the requirements in terms of appearance.

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