MEMS-MPR deep hole release vacuum infiltration equipment

Abstract

The invention relates to the technical field of semiconductor wafer wet methods, and discloses MEMS-MPR deep hole release vacuum infiltration equipment which comprises an outer shell, an operation platform plate is fixedly connected to the interior of the outer shell, a cleaning mechanism is arranged on the operation platform plate, the cleaning mechanism comprises a vacuum cleaning tank, and the vacuum cleaning tank is provided with a vacuum pump. The vacuum cleaning tank penetrates through the operation platform plate and is fixedly connected with the operation platform plate. Through the design of the cleaning mechanism and the adoption of a deep hole release vacuum infiltration scheme, compared with the prior art that gas residues in a micron-sized structure are difficult to avoid, and consequently uneven cleaning is caused, the device has remarkable advantages, and through operation in a vacuum environment, gas in a groove body and a wafer microstructure can be completely emptied firstly, and the cleaning efficiency is improved. The generation of micro bubbles is avoided from the source, an ideal condition is created for full-area and uniform coverage of liquid medicine, and finally, the cleaning uniformity and thoroughness are greatly improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wafer wet processing technology, and in particular to MEMS-MPR deep hole release vacuum impregnation equipment. Background Technology

[0002] In the fabrication of semiconductor components, it is necessary to remove impurities from the wafer surface. The cleaning process for impurity removal is generally divided into wet process and dry process. The wet process refers to a type of process that uses chemical reagents to clean, etch, or strip the wafer. Compared with the dry process, the wet process has advantages such as low cost and simple operation.

[0003] Patent publication number CN216064747U discloses a wet cleaning device for semiconductor wafer production, including a frame, a cleaning tank, a switch base, and a liquid storage tank. The switch base and the cleaning tank are respectively located on the left and right sides above the frame, and the liquid storage tank is located at the rear of the frame. A support frame is slidably connected inside the cleaning tank opening. Sliding grooves are provided at both ends of the cleaning tank opening, and sliders are fixed at both ends of the support frame. By passing the bottom of the wafer rack through the support frame and placing the top of the wafer rack on the support frame, the support frame can be raised and lowered using a lifting switch. When the support frame is lowered, the wafer rack is immersed in the cleaning solution, making operation convenient. A second lifting switch raises and lowers the spray head. By lowering the spray head into the cleaning tank opening and then activating the drive motor and water pump, the rotating roller drives the pusher plate to move, pushing the cleaning solution towards the wafer rack, while the spray head sprays the cleaning solution downwards, thus improving the wafer cleaning effect.

[0004] The above devices improve the cleaning effect by controlling the raising and lowering of the spray head. However, in actual cleaning work, for wafers with micron-level high aspect ratio structures, during atmospheric pressure immersion cleaning, the gas-liquid-solid three-phase interface formed by the chemical solution at the structure opening will form a stable meniscus due to surface tension. This meniscus traps the gas at the bottom of the structure, generating a gas resistance effect, which prevents the chemical solution from effectively replacing and wetting the entire interior of the structure. Ultimately, this results in incomplete cleaning of the patterned area, which seriously affects the product yield. Therefore, the MEMS-MPR deep hole release vacuum immersion equipment is proposed to solve the above problems. Summary of the Invention

[0005] To address the aforementioned problems, this invention provides a MEMS-MPR deep-hole release vacuum wetting device.

[0006] The MEMS-MPR deep-hole release vacuum wetting device provided by this invention adopts the following technical solution: MEMS-MPR deep hole release vacuum impregnation equipment includes an outer housing, an operating platform plate is fixedly connected inside the outer housing, and a cleaning mechanism is provided on the operating platform plate; The cleaning mechanism includes a vacuum cleaning tank that penetrates and is fixedly connected to the operating platform plate. An auxiliary plate is integrally formed on the top of the vacuum cleaning tank, and a vacuum tank cover is hinged to the top of the auxiliary plate. Nitrogen spring rods are installed on both sides of the vacuum cleaning tank; one end of each nitrogen spring rod is connected to the vacuum cleaning tank via a pivot, and the other end is connected to the vacuum tank cover via a pivot. A vacuum pressure detection port and a vacuum rupture port are respectively opened on the rear side wall of the inner cavity of the vacuum cleaning tank. Two bypass liquid level connectors are fixedly connected to one side wall of the vacuum cleaning tank. Two support plates are fixedly connected to one side wall of the inner cavity of the vacuum cleaning tank, and liquid level sensors are fixedly connected to the support plates. The two liquid level sensors are respectively located on one side of the two bypass liquid level connectors.

[0007] By adopting the above technical solution, the deep-hole release vacuum immersion method has significant advantages over the existing technology, which is difficult to avoid gas residue in micron-level structures, thus causing uneven cleaning. Moreover, by operating in a vacuum environment, this device can completely vent the gas in the tank and wafer microstructure first, eliminating the generation of micro bubbles from the source, creating ideal conditions for the full and uniform coverage of the cleaning solution, and ultimately achieving a significant improvement in cleaning uniformity and thoroughness.

[0008] Preferably, the top of the auxiliary plate is provided with a sealing groove, and a sealing ring is fixedly connected inside the sealing groove.

[0009] By adopting the above technical solution, the sealing ring can ensure the sealing of the vacuum cleaning tank after the vacuum tank cover is closed.

[0010] Preferably, a sealing buckle is fixedly connected to the front side of the auxiliary plate, the sealing buckle matches the vacuum tank cover, and a vacuum tank drain pipe is fixedly connected to the bottom of the vacuum cleaning tank.

[0011] By adopting the above technical solution, after the vacuum tank cover is placed on the vacuum cleaning tank, it is locked by a sealing latch.

[0012] Preferably, a lifting door panel is slidably connected to the front side wall of the outer casing, and a control panel is fixedly connected to the front side of the outer casing.

[0013] By adopting the above technical solution, the lifting door panel can be raised and lowered, and after being lowered, the front opening of the outer shell is sealed.

[0014] Preferably, a cantilever is fixedly connected to one side wall of the outer casing, an operating panel is fixedly connected to one end of the cantilever, and a fire extinguisher device is also fixedly connected to one side wall of the outer casing, with the fire extinguisher device located on the rear side of the cantilever.

[0015] By adopting the above technical solution, staff can issue operation commands through the control panel.

[0016] Preferably, the bottom of the outer casing is provided with a bottom leak-proof tray, the bottom leak-proof tray has a discharge port, and the bottom of the outer casing is fixedly connected with casters, the casters being placed inside the bottom leak-proof tray.

[0017] By adopting the above technical solution, the bottom leak-proof tray can catch the splashed liquid during the cleaning process, preventing leakage to the outside.

[0018] Preferably, a frame leak-proof tray is placed on the bottom wall of the inner cavity of the outer shell, and the frame leak-proof tray is located at the bottom of the vacuum cleaning tank.

[0019] By adopting the above technical solution, the frame leak-proof tray directly catches liquids that may leak from the vacuum cleaning tank.

[0020] Preferably, an EFU filter and an exhaust assembly are fixedly connected to the outer housing. Both the EFU filter and the exhaust assembly are located at the top of the vacuum cleaning tank. The exhaust assembly is located behind the EFU filter. Lamp bodies are fixedly connected to both sides of the EFU filter. A shelf is also fixedly connected inside the outer housing and is located between the EFU filter and the vacuum cleaning tank.

[0021] By adopting the above technical solution, the shelf is used to place tools, while the lamp provides lighting.

[0022] Preferably, the exhaust assembly includes an exhaust box body, which is fixedly connected to the outer shell. The exhaust box body has an exhaust port in the groove area. An exhaust regulating plate is fixedly connected to the outside of the exhaust box body and is located at the top of the exhaust port in the groove area. An exhaust box discharge hole is opened at the bottom of the exhaust box body. An exhaust valve device is fixedly connected to the top of the exhaust box body. A vacuum pump exhaust gas treatment tank and a gas condensation tank are fixedly connected to the rear side wall of the outer shell.

[0023] By adopting the above technical solution, the ventilation volume in the operating area can be adjusted by the ventilation regulating plate, the ventilation in the tank area can be ventilated through the ventilation port in the tank area, the condensate waste liquid inside the ventilation box is collected through the bottom ventilation box discharge hole and discharged outside the equipment, and all ventilation is controlled by the ventilation valve device at the top.

[0024] Preferably, the gas condenser is connected to the vacuum rupture port via a pipe, the vacuum pump exhaust gas treatment tank is connected to the gas condenser via a pipe, and the exhaust end of the vacuum pump exhaust gas treatment tank is located inside the outer casing.

[0025] By adopting the above technical solution, the gas condenser condenses and cools the gas that is drawn in.

[0026] In summary, the present invention has the following beneficial technical effects: The MEMS-MPR deep-hole release vacuum immersion equipment, through its cleaning mechanism design and deep-hole release vacuum immersion scheme, has significant advantages over existing technologies that struggle to avoid gas residue in micron-level structures, leading to uneven cleaning. Furthermore, by operating in a vacuum environment, this device can completely vent the gas from the tank and wafer microstructure, eliminating the generation of microbubbles at the source. This creates ideal conditions for the full and uniform coverage of the cleaning solution, ultimately achieving a significant improvement in cleaning uniformity and thoroughness.

[0027] The MEMS-MPR deep-hole release vacuum immersion equipment solves the industry problem of existing wafer immersion cleaning technologies being unable to effectively penetrate the wafer's micron-level structure under normal temperature and pressure conditions due to the surface tension of the cleaning solution, resulting in microscopic bubble residue and uneven cleaning. Ultimately, it effectively improves product yield. In addition to achieving the above functions, the device is easy to operate, and its overall structural design is simple, reducing the operating threshold while effectively controlling immersion cleaning costs. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a cross-sectional side view of the outer casing in this invention; Figure 3 This is a front view of the outer casing in this invention; Figure 4 This is a top view of the outer casing in this invention; Figure 5 This is a schematic diagram of the vacuum cleaning tank in this invention; Figure 6 This is a rear view of the vacuum cleaning tank in this invention; Figure 7 This is a cross-sectional view of the bypass liquid level connector in this invention; Figure 8 This is a schematic diagram of the exhaust assembly in this invention.

[0029] Explanation of reference numerals in the attached drawings: 1. Outer casing; 2. Operating platform plate; 3. Cleaning mechanism; 31. Vacuum cleaning tank; 32. Auxiliary plate; 33. Vacuum tank cover; 34. Nitrogen spring rod; 35. Vacuum pressure detection port; 36. Vacuum extraction port; 37. Bypass liquid level pipe; 38. Support plate; 39. Liquid level sensor; 391. Vacuum tank drain pipe; 392. Sealing ring; 393. Sealing latch; 4. Exhaust assembly; 41. Exhaust box; 42. Tank area exhaust vent; 43. Exhaust regulating plate; 44. Exhaust valve device; 45. Vacuum pump exhaust gas treatment tank; 46. Gas condensate tank; 47. Exhaust box discharge port; 5. Control panel; 6. Cantilever; 7. Operation panel; 8. Fire extinguisher device; 9. Bottom leak-proof tray; 10. Discharge port; 11. Casters; 12. Frame leak-proof tray; 13. Lifting door panel; 14. EFU filter; 15. Lamp body; 16. Shelf. Detailed Implementation

[0030] The following is in conjunction with the appendix Figure 1 -Appendix Figure 8 The present invention will be described in further detail below.

[0031] This invention discloses a MEMS-MPR deep-hole release vacuum wetting device. (Refer to...) Figures 1-8 The system includes an outer shell 1, an operating platform plate 2 fixedly connected inside the outer shell 1, a cleaning mechanism 3 on the operating platform plate 2, a vacuum cleaning tank 31, a vacuum cleaning tank 31 that passes through the operating platform plate 2 and is fixedly connected to the operating platform plate 2, an auxiliary plate 32 integrally formed on the top of the vacuum cleaning tank 31, a vacuum tank cover 33 hinged to the top of the auxiliary plate 32, and nitrogen spring rods 34 on both sides of the vacuum cleaning tank 31, one end of the nitrogen spring rods 34 being connected to the vacuum cleaning tank 31 via a rotating shaft; The other end of the nitrogen spring rod 34 is connected to the vacuum tank cover 33 via a rotating shaft. Vacuum pressure detection port 35 and vacuum extraction port 36 are respectively opened on the rear side wall of the inner cavity of the vacuum cleaning tank 31. Two bypass liquid level pipes 37 are fixedly connected to one side wall of the vacuum cleaning tank 31. Two support plates 38 are fixedly connected to one side wall of the inner cavity of the vacuum cleaning tank 31. Liquid level sensors 39 are fixedly connected to the support plates 38. The two liquid level sensors 39 are respectively set on one side of the two bypass liquid level pipes 37. The deep hole release vacuum immersion scheme has significant advantages over the problem of gas residue in micron-level structures that is difficult to avoid in the existing technology, which leads to uneven cleaning. Moreover, by operating in a vacuum environment, this device can first completely vent the gas in the tank and wafer microstructure, eliminating the generation of micro bubbles from the source, creating ideal conditions for the full and uniform coverage of the liquid, and ultimately achieving a significant improvement in cleaning uniformity and thoroughness.

[0032] A sealing groove is provided on the top of the auxiliary plate 32, and a sealing ring 392 is fixedly connected inside the sealing groove. The sealing ring 392 can ensure the sealing of the vacuum cleaning tank 31 after the vacuum tank cover 33 is closed. A sealing buckle 393 is fixedly connected to the front side of the auxiliary plate 32. The sealing buckle 393 matches the vacuum tank cover 33. A vacuum tank drain pipe 391 is fixedly connected to the bottom of the vacuum cleaning tank 31. After the vacuum tank cover 33 is closed on the vacuum cleaning tank 31, it is locked by the sealing buckle 393. A lifting door plate 13 is slidably connected to the front side wall of the outer shell 1. A control panel 5 is fixedly connected to the front side of the outer shell 1. The lifting door plate 13 can be raised and lowered. After being lowered, it seals the front opening of the outer shell 1.

[0033] A cantilever 6 is fixedly connected to one side wall of the outer shell 1. An operating panel 7 is fixedly connected to one end of the cantilever 6. A fire extinguisher device 8 is also fixedly connected to one side wall of the outer shell 1. The fire extinguisher device 8 is located on the rear side of the cantilever 6. The operator issues operating instructions through the operating panel 7. A bottom leak-proof tray 9 is provided at the bottom of the outer shell 1. A discharge port 10 is provided on the bottom leak-proof tray 9. A caster wheel 11 is fixedly connected to the bottom of the outer shell 1. The caster wheel 11 is placed inside the bottom leak-proof tray 9. During the cleaning process, the bottom leak-proof tray 9 can catch the splashed liquid and prevent it from leaking to the outside. A frame leak-proof tray 12 is placed on the bottom wall of the inner cavity of the outer shell 1. The frame leak-proof tray 12 is located at the bottom of the vacuum cleaning tank 31. The frame leak-proof tray 12 directly catches the liquid that may leak from the vacuum cleaning tank 31. An EFU filter 14 and an exhaust assembly 4 are fixedly connected to the outer casing 1. Both the EFU filter 14 and the exhaust assembly 4 are located at the top of the vacuum cleaning tank 31. The exhaust assembly 4 is located behind the EFU filter 14. Lamp bodies 15 are fixedly connected to both sides of the EFU filter 14. A shelf 16 is also fixedly connected inside the outer casing 1. The shelf 16 is located between the EFU filter 14 and the vacuum cleaning tank 31. The shelf 16 is used to place tools, while the lamp body 15 provides illumination.

[0034] The exhaust assembly 4 includes an exhaust box 41, which is fixedly connected to the outer shell 1. An exhaust port 42 for the groove area is opened on the exhaust box 41. An exhaust regulating plate 43 is fixedly connected to the outside of the exhaust box 41. The exhaust regulating plate 43 is set at the top of the exhaust port 42 for the groove area. An exhaust box discharge hole 47 is opened at the bottom of the exhaust box 41. An exhaust valve device 44 is fixedly connected to the top of the exhaust box 41. A vacuum pump exhaust gas treatment tank 45 and a gas condensation tank 46 are fixedly connected to the rear side wall of the outer shell 1. The ventilation volume in the operating area can be adjusted by the ventilation regulating plate 43. The ventilation in the tank area is achieved through the tank area ventilation port 42. The condensed waste liquid inside the ventilation box 41 is collected and discharged outside the equipment through the bottom ventilation box discharge hole 47. All ventilation is controlled by the ventilation valve device 44 at the top. The gas condensation tank 46 is connected to the vacuum rupture port 36 through a pipe. The vacuum pump exhaust gas treatment tank 45 is connected to the gas condensation tank 46 through a pipe. The exhaust end of the vacuum pump exhaust gas treatment tank 45 is located inside the outer shell 1. The gas condensation tank 46 condenses and cools the gas that is drawn in.

[0035] In actual operation, when this device is used, first, the power is turned on, the fixture containing the wafer is placed into the vacuum cleaning tank 31, the vacuum tank cover 33 is closed, and the sealing lock 393 is fastened to seal the tank. The immersion cleaning process time is set on the operation screen 7, and the start button is pressed on the control panel 5 to start the immersion cleaning process. The cleaning solution is injected into the tank. After the liquid level sensor 39 on the side of the bypass liquid level pipe 37 detects that the liquid has reached the specified height, the injection is stopped. Then, the tank is evacuated, and the gas passes through the vacuum vent 36. The gas is discharged and cooled by the gas condenser 46 to remove condensed water vapor. The dried gas is then discharged into the vacuum pump exhaust gas treatment tank 45 for exhaust gas treatment. The treated exhaust gas is discharged from the exhaust assembly 4. The pressure inside the tank is monitored by the vacuum pressure detection port 35. During the process, a negative pressure of -100KPA is maintained. After the immersion cleaning process is completed, the vacuum pump exhaust gas treatment tank 45 stops working. After reaching normal pressure, the liquid in the tank is discharged through the bottom vacuum tank drain pipe 391. The sealing lock 393 is released, the vacuum tank cover 33 is opened, and the tooling containing the wafer is taken out.

[0036] The above are all preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, all equivalent changes made in accordance with the structure, shape and principle of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A MEMS-MPR deep-hole release vacuum wetting device, characterized in that: Includes an outer shell (1), an operating platform plate (2) is fixedly connected inside the outer shell (1), and a cleaning mechanism (3) is provided on the operating platform plate (2); The cleaning mechanism (3) includes a vacuum cleaning tank (31), which penetrates the operating platform plate (2) and is fixedly connected to it. An auxiliary plate (32) is integrally formed on the top of the vacuum cleaning tank (31), and a vacuum tank cover (33) is hinged to the top of the auxiliary plate (32). Nitrogen spring rods (34) are provided on both sides of the vacuum cleaning tank (31). One end of each nitrogen spring rod (34) is connected to the vacuum cleaning tank (31) via a rotating shaft, and the other end of the nitrogen spring rod (34)... The end is connected to the vacuum tank cover (33) via a rotating shaft. The vacuum cleaning tank (31) has a vacuum pressure detection port (35) and a vacuum extraction port (36) respectively on the rear side wall of the inner cavity. Two bypass liquid level pipes (37) are fixedly connected to one side wall of the vacuum cleaning tank (31). Two support plates (38) are fixedly connected to one side wall of the inner cavity of the vacuum cleaning tank (31). Liquid level sensors (39) are fixedly connected to the support plates (38). The two liquid level sensors (39) are respectively set on one side of the two bypass liquid level pipes (37).

2. The MEMS-MPR deep hole release vacuum wetting device according to claim 1, characterized in that: The top of the auxiliary plate (32) is provided with a sealing groove, and a sealing ring (392) is fixedly connected inside the sealing groove.

3. The MEMS-MPR deep hole release vacuum wetting device according to claim 1, characterized in that: The auxiliary plate (32) is fixedly connected to a sealing buckle (393) on the front side. The sealing buckle (393) matches the vacuum tank cover (33). The vacuum cleaning tank (31) is fixedly connected to a vacuum tank drain pipe (391) at the bottom.

4. The MEMS-MPR deep hole release vacuum wetting device according to claim 1, characterized in that: A lifting door panel (13) is slidably connected to the front wall of the outer casing (1), and a control panel (5) is fixedly connected to the front side of the outer casing (1).

5. The MEMS-MPR deep hole release vacuum wetting device according to claim 1, characterized in that: A cantilever (6) is fixedly connected to one side wall of the outer shell (1), and an operation panel (7) is fixedly connected to one end of the cantilever (6). A fire extinguisher device (8) is also fixedly connected to one side wall of the outer shell (1), and the fire extinguisher device (8) is located on the rear side of the cantilever (6).

6. The MEMS-MPR deep hole release vacuum wetting device according to claim 1, characterized in that: The bottom of the outer shell (1) is provided with a bottom leak-proof tray (9), and a drain port (10) is provided on the bottom leak-proof tray (9). A caster wheel (11) is fixedly connected to the bottom of the outer shell (1), and the caster wheel (11) is placed inside the bottom leak-proof tray (9).

7. The MEMS-MPR deep hole release vacuum wetting device according to claim 1, characterized in that: A frame leak-proof tray (12) is placed on the bottom wall of the inner cavity of the outer shell (1), and the frame leak-proof tray (12) is located at the bottom of the vacuum cleaning tank (31).

8. The MEMS-MPR deep hole release vacuum wetting device according to claim 1, characterized in that: An EFU filter (14) and an exhaust assembly (4) are fixedly connected to the outer housing (1). The EFU filter (14) and the exhaust assembly (4) are both located on the top of the vacuum cleaning tank (31). The exhaust assembly (4) is located on the rear side of the EFU filter (14). Lamp bodies (15) are fixedly connected to both sides of the EFU filter (14). A shelf (16) is also fixedly connected inside the outer housing (1). The shelf (16) is located between the EFU filter (14) and the vacuum cleaning tank (31).

9. The MEMS-MPR deep hole release vacuum wetting device according to claim 8, characterized in that: The exhaust assembly (4) includes an exhaust box (41), which is fixedly connected to the outer shell (1). An exhaust port (42) for the groove area is opened on the exhaust box (41). An exhaust regulating plate (43) is fixedly connected to the outside of the exhaust box (41). The exhaust regulating plate (43) is located at the top of the exhaust port (42) for the groove area. An exhaust box discharge hole (47) is opened at the bottom of the exhaust box (41). An exhaust valve device (44) is fixedly connected to the top of the exhaust box (41). A vacuum pump exhaust gas treatment tank (45) and a gas condensation tank (46) are fixedly connected to the rear side wall of the outer shell (1).

10. The MEMS-MPR deep hole release vacuum wetting device according to claim 9, characterized in that: The gas condenser (46) is connected to the vacuum rupture port (36) through a pipe, and the vacuum pump exhaust gas treatment tank (45) is connected to the gas condenser (46) through a pipe. The exhaust end of the vacuum pump exhaust gas treatment tank (45) is located inside the outer shell (1).

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