Conductive film, method for processing same, and wiring structure using conductive film

Abstract

The conductive film (100) includes a base material layer (4), an insulating layer (5) laminated on an upper surface (4a) of the base material layer (4), a first groove portion (6) and a second groove portion (7) wider than the first groove portion (6) are formed on an upper surface (5a) of the insulating layer (5), and a thin wire (20) provided in the first groove portion (6) and having conductivity. In plan view, the second groove portion (7) is provided between the first groove portion (6) and a cut surface (CS) of a layer in which the base material layer (4) and the insulating layer (5) are laminated. The second groove part (7) surrounds the periphery of the first groove part (6) in a plan view.

Description

Technical Field

[0001] This disclosure relates to a conductive film and a method for processing the same. Background Technology

[0002] Conventionally, conductive films, such as those shown in Patent Document 1, are known as conductive films that can be applied to touch sensors. Specifically, Patent Document 1 discloses an electrode component 3 for a touch panel.

[0003] In Patent Document 1, the electrode component 3 for a touch panel includes a transparent insulating substrate 5, a transparent insulating component 7B stacked on the transparent insulating substrate 5, and a transparent insulating component 7A stacked on the transparent insulating component 7B. A first electrode layer 6A is formed in the transparent insulating component 7A. A second electrode layer 6B is formed in the transparent insulating component 7B.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Publication No. 2022-10750 Summary of the Invention

[0007] -The technical problem the invention aims to solve-

[0008] However, in the touch panel electrode component 3 disclosed in Patent Document 1, in order to obtain the specified product shape (Patent Document 1), Figure 2 The conductive film (shown as a quadrilateral shape) is typically cut into a specified product shape using a cutting device. The conductive film is obtained by pre-forming a first electrode layer 6A and a second electrode layer 6B on a base material with dimensions larger than the product shape.

[0009] However, in the process of cutting the product into a specified shape using a cutting device (hereinafter referred to as the "cutting process"), external factors generated during the cutting process act on the cross-sectional portion (the cross-sectional portion of the transparent insulating substrate 5 and the transparent insulating component 7B) corresponding to the cut position that forms the product shape.

[0010] For example, when using a laser processing apparatus as the cutting device, the processing heat generated by the laser processing can easily cause cracking at the boundary between the transparent insulating substrate 5 and the transparent insulating member 7B in the thickness direction. Furthermore, when using a cutting device including a cutting tool, friction easily occurs between the cutting tool and the cutting surface when the cutting tool is pulled away from the cut surface of the transparent insulating substrate 5 and the transparent insulating member 7B. As a result, during the aforementioned cutting process, external factors such as processing heat or friction may cause the transparent insulating members 7A and 7B to peel off from the transparent insulating substrate 5 starting from the boundary between the transparent insulating substrate 5 and the transparent insulating member 7B in the thickness direction. To prevent such phenomena, improvements are desired to properly maintain the stacking state of the layers constituting the conductive film.

[0011] This disclosure was made to solve the above-mentioned technical problems, and its purpose is to properly maintain the stacking state of the layers constituting the conductive film during the cutting process.

[0012] - Technical solutions used to solve technical problems -

[0013] To achieve the above objectives, one embodiment of the conductive film disclosed herein includes a substrate layer, an insulating layer, and fine wires. The insulating layer is stacked on the upper surface of the substrate layer, and a first groove and a second groove wider than the first groove are formed on the upper surface of the insulating layer. The fine wires are disposed in the first grooves and are conductive. In plan view, the second groove is located between the cut surface of the layer formed by stacking the substrate layer and the insulating layer and the first groove. In plan view, the second groove surrounds the first groove.

[0014] -The effects of the invention-

[0015] According to this disclosure, the stacking state of the substrate layer and the insulating layer in the conductive film can be appropriately maintained. Attached Figure Description

[0016] Figure 1 This is a three-dimensional view of a touch sensor that uses conductive components.

[0017] Figure 2 It is along Figure 1 A sectional view (simplified diagram) taken along line II-II.

[0018] Figure 3 This is a simplified perspective view of the conductive component as seen from the top surface side.

[0019] Figure 4 This is a simplified diagram showing the transmitting electrode, the first wiring section, and the pads as viewed from the lower surface side of the conductive component.

[0020] Figure 5This is a simplified diagram showing the receiving electrode, the second wiring section, and the pads as viewed from the upper surface side of the conductive component.

[0021] Figure 6 yes Figure 3 A magnified view of part VI shown.

[0022] Figure 7 This is a diagram that briefly illustrates the structure of the grid pattern in the transmitting electrode.

[0023] Figure 8 It is a diagram that briefly shows the grid pattern, dummy pattern, and various structures of the dummy electrode.

[0024] Figure 9 yes Figure 6 A magnified view of part IX shown.

[0025] Figure 10 It is a cross-sectional view that briefly shows the cross-sectional state of the thin line.

[0026] Figure 11 This is a top view of the conductive film.

[0027] Figure 12 yes Figure 11 A magnified view of part XII shown.

[0028] Figure 13 It is along Figure 12 A sectional view taken along line XIII-XIII.

[0029] Figure 14 It is briefly shown in Figure 13 The cross-sectional view shown depicts a portion of the insulating layer in the second region peeled off from the substrate layer.

[0030] Figure 15 This is a flowchart illustrating the various steps in the manufacturing process of a conductive component.

[0031] Figure 16 This is a cross-sectional view that briefly shows the cross-sectional structure around the second region in the touch sensor (wiring structure).

[0032] Figure 17 This shows the cross-sectional structure of the conductive film in Modified Example 1, which is equivalent to... Figure 13 The image.

[0033] Figure 18 It is briefly shown in Figure 17 The cross-sectional view shown depicts a portion of the insulating layer in the second region peeled off from the substrate layer.

[0034] Figure 19This shows the cross-sectional structure of the conductive film in Modified Example 2, which is equivalent to... Figure 13 The image.

[0035] Figure 20 This is equivalent to the cross-sectional structure of the conductive film shown in other embodiments. Figure 13 The image. Detailed Implementation

[0036] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. The following description of the embodiments is merely illustrative in nature and is not intended to limit the scope of this disclosure, its application, or its uses.

[0037] Figure 1 The application of conductive component 10 is shown (see reference). Figures 2-6 The touch sensor 1 is a type of wiring structure. The conductive component 10 is derived from the conductive film 100 (see reference 100) according to embodiments of this disclosure. Figure 11 The components removed. Hereinafter, the touch sensor 1 and the conductive component 10 will be described first, and then the manufacturing method of the conductive film 100 and the conductive component 10 will be described.

[0038] (Touch sensor)

[0039] The touch sensor 1 is applied, for example, to the display 50 (see reference). Figure 2 This is a capacitive sensor-type input device. This touch sensor 1 is used, for example, as an input device for in-vehicle devices such as car navigation systems, display devices for personal computers, mobile phones, portable information terminals, portable game consoles, photocopiers, ticket vending machines, ATMs, watches, etc.

[0040] It should be noted that in the following description, the operating surface 2b of the cover component 2 (refer to) will be referred to as the operating surface 2b of the cover component 2 described later. Figure 1 and Figure 2 The side where the touch sensor 1 is located serves as the "upper side" ( Figure 2 The upper side of the paper), and its opposite side is designated as the "lower side" of touch sensor 1 ( Figure 2 The positional relationship of the elements constituting the touch sensor 1 is defined by the lower side of the paper. It should be noted that this positional relationship is independent of the actual vertical direction in the device or apparatus equipped with the touch sensor 1.

[0041] Furthermore, in the embodiments of this disclosure, for ease of explanation, [the following will be used] Figure 3 The direction from the left side of the paper to the right side is defined as "first direction X". On the other hand, Figure 3 The direction from the bottom of the paper towards the top of the paper is defined as the "second direction Y".

[0042] (Cover component)

[0043] like Figure 1 and Figure 2 As shown, the touch sensor 1 includes a light-transmitting cover component 2. The cover component 2 is, for example, made of a glass cover or a plastic protective cover. The cover component 2 is, for example, formed into a rectangular plate shape when viewed from above. The cover component 2 is fixed to the insulating layer 5 of the substrate 3 (described later). Figure 10 )superior.

[0044] On the periphery of the lower surface of the cover member 2, a dark-colored, roughly frame-shaped decorative portion 2a is formed by screen printing or the like. The rectangular area enclosed by this decorative portion 2a becomes a light-transmitting visible area Va. In other words, the user can obtain visual information through this visible area Va, which comes from the display 50 located below the touch sensor 1. Furthermore, the upper surface of the cover member 2 within the visible area Va is configured as an operating surface 2b that is touched by the user's fingers or the like during touch operations.

[0045] (Conductive components)

[0046] like Figures 2-6 As shown, the touch sensor 1 includes a conductive component 10. The conductive component 10 can be mounted on the lower surface side of the cover component 2 (see reference). Figure 2 The conductive component 10 includes a substrate 3, multiple sensor electrodes based on electrostatic capacitance, multiple dummy electrodes 16, multiple wiring portions, a first ground portion 34, and a second ground portion 35. It should be noted that details regarding the multiple sensor electrodes, multiple dummy electrodes 16, multiple wiring portions, the first ground portion 34, and the second ground portion 35 will be described later.

[0047] (Adhesive layer)

[0048] like Figure 2 As shown, the touch sensor 1 includes an adhesive layer 8. The adhesive layer 8 is laminated between the cover member 2 and the substrate 3. Specifically, the adhesive layer 8 is laminated on a portion of the insulating layer 5 and the substrate layer 4, which will be described later. The adhesive layer 8 is an optically clear adhesive (OCA). The thickness of the adhesive layer 8 is, for example, 25 μm or more and 250 μm or less.

[0049] (Flexible wiring board)

[0050] like Figure 1As shown, the touch sensor 1 includes a flexible wiring board 40. The flexible wiring board 40 is configured to be flexible and its electrical properties do not change even when deformed. The flexible wiring board 40 is made of a flexible insulating film such as PI (polyimide), PET (polyethylene terephthalate), or PEN (polyethylene naphthalate).

[0051] (Substrate)

[0052] like Figure 10 As shown, the substrate 3 has a substrate layer 4 and an insulating layer 5. When viewed from above, the substrate layer 4 and the insulating layer 5 are each formed in a generally rectangular shape, for example.

[0053] The substrate layer 4 is made of a transparent resin material. Examples of transparent resin materials include PET (polyethylene terephthalate), PC (polycarbonate), COP (cyclic olefin polymer), and COC (cyclic olefin copolymer).

[0054] An insulating layer 5 is stacked on the upper surface 4a of the substrate layer 4. Additionally, in this embodiment, an insulating layer 5 is also stacked on the lower surface of the substrate layer 4; however, this is not shown in the diagram.

[0055] The insulating layer 5 is made of a resin material that is both insulating and transparent. To ensure flexibility, the thickness of the insulating layer 5 is set to, for example, 1.0 μm or more and 10.0 μm or less. In addition, the thickness of the insulating layer 5 is formed to be greater than the depth of the first groove 6 described later.

[0056] In the conductive component 10, a plurality of first grooves 6 are provided on the upper surface 5a side of the insulating layer 5. A plurality of first grooves 6 are also provided on the lower surface side of the insulating layer 5, which are omitted from the figure. It should be noted that the details of the first grooves 6 will be described later.

[0057] (Sensor electrodes)

[0058] Multiple sensor electrodes consist of multiple transmitting electrodes 11 and multiple receiving electrodes 12 (see reference). Figure 3 Multiple transmitting electrodes 11 and multiple receiving electrodes 12 are arranged in the substrate 3 and the visible area Va (see reference). Figure 1 The corresponding position. The touch sensor 1 can detect touch operations performed by the user's finger (the object to be detected) that is in contact with the operating surface 2b through multiple transmitting electrodes 11 and multiple receiving electrodes 12 located in the visible area Va.

[0059] Each transmitting electrode 11 is connected to a driving circuit (not shown) via a flexible wiring board 40. Each transmitting electrode 11 is configured to radiate an electric field to the surroundings via the driving circuit. On the other hand, each receiving electrode 12 is connected to a detection circuit (not shown) via the flexible wiring board 40. Each receiving electrode 12 is configured to receive the electric field emitted from each transmitting electrode 11.

[0060] like Figure 3 and Figure 6 As shown, the transmitting electrodes 11 and receiving electrodes 12 are arranged so that they intersect (orthogonal) when viewed from above. Furthermore, a node is formed in the overlapping area of ​​each transmitting electrode 11 and each receiving electrode 12. This node is configured to generate electrostatic capacitance. Additionally, the capacitance value of this node is determined based on the number of intersections between the multiple thin wires 20 constituting each transmitting electrode 11 and each receiving electrode 12. It should be noted that details regarding the multiple thin wires 20 will be described later.

[0061] like Figure 4 As shown, a plurality of transmitting electrodes 11 are disposed on the lower surface side of the substrate 3 (the lower surface side of the insulating layer 5). Each transmitting electrode 11 extends along the long side direction (first direction X) of the substrate 3. The plurality of transmitting electrodes 11 are arranged at intervals from each other in the short side direction (second direction Y) of the substrate 3. Figure 9 As shown, the spacing ES between the transmitting electrodes 11, 11 is set to, for example, more than 1 μm and less than 20 μm.

[0062] like Figure 5 As shown, multiple receiving electrodes 12 are disposed on the upper surface side of the substrate 3. Figure 10 and Figure 13 The upper surface 5a side of the insulating layer 5 shown. That is, a plurality of receiving electrodes 12 are arranged on the viewing side of the touch sensor 1 in the substrate 3 (the side where the operating surface 2b of the cover member 2 is located). The plurality of receiving electrodes 12 are insulated from the plurality of transmitting electrodes 11 via the substrate 3. Each receiving electrode 12 extends along the short side direction (second direction Y) of the substrate 3. The plurality of receiving electrodes 12 are arranged at intervals from each other in the long side direction (first direction X) of the substrate 3.

[0063] like Figure 6 As shown, the distance EP between the receiving electrodes 12, 12 in the first direction X is, for example, 3 mm or more and 7 mm or less. The electrode width EW2 of the receiving electrode 12 is configured to be smaller than the distance EP between the receiving electrodes 12, 12. Specifically, the electrode width EW2 of the receiving electrode 12 is, for example, 0.5 mm or more. In addition, the electrode width EW2 of the receiving electrode 12 is configured to be smaller than the electrode width EW1 of the transmitting electrode 11. It should be noted that in Figure 6In the diagram, to facilitate observation of the overlap between each transmitting electrode 11 and each receiving electrode 12, only dotted shading is used to mark each receiving electrode 12. Additionally, in... Figure 6 For ease of illustration, the first grounding part 34 and the second grounding part 35 are omitted from the illustration.

[0064] like Figure 7 and Figure 8 As shown, each transmitting electrode 11 and each receiving electrode 12 includes a grid pattern 14. The grid pattern 14 is formed by arranging multiple units 13 composed of multiple fine lines 20. The grid patterns 14 constituting each transmitting electrode 11 and each receiving electrode 12 are arranged to overlap each other in the thickness direction of the substrate 3. It should be noted that in Figure 8 In order to clearly indicate the outer edge of the receiving electrode 12, an imaginary line is used to show the position corresponding to the outer edge of the receiving electrode 12.

[0065] Each of the thin wires 20 is conductive. Multiple thin wires 20 extend in directions inclined relative to both the first direction X and the second direction Y. It should be noted that the cross-sectional structure of the thin wires 20 will be described later.

[0066] The linewidth of each fine wire 20 constituting the transmitting electrode 11 and the receiving electrode 12 is, for example, 1 μm or more and 3 μm or less. The transmitting electrode 11 is configured such that the fine wires 20 are adjacent to each other, and the spacing between the two wires is LD1 (see reference). Figure 7 The size is in the range of 100μm to 500μm. It should be noted that the size of the interval LD1 is preferably approximately equal to the size of the intervals LD2 and LD3, which will be described later.

[0067] Each unit 13 is quadrilateral. The quadrilateral is formed by an imaginary first diagonal d1 and an imaginary second diagonal d2. The second diagonal d2 is set to be longer than the first diagonal d1. In this embodiment, the quadrilateral is a rhombus. The acute angle θ of the rhombus is, for example, set in the range of 50° to 70°. More preferably, the acute angle θ is in the range of 50° to 58°. It should be noted that in this embodiment, each unit 13 constituting the receiving electrode 12 (refer to…) Figure 8 ) is formed as a unit 13 constituting the transmitting electrode 11 (refer to Figure 7 )big.

[0068] Each sensor electrode is configured such that the second diagonal d2 of each unit 13 extends along the extension direction of each sensor electrode.

[0069] like Figure 7 As shown, in the transmitting electrode 11, the second diagonal d2 of each unit 13 extends along the first direction X. That is, in the transmitting electrode 11, the relatively longer second diagonal d2 of each unit 13 is arranged along the first direction X.

[0070] like Figure 8 As shown, in the receiving electrode 12, the second diagonal d2 of each unit 13 extends along the second direction Y. That is, in the receiving electrode 12, the relatively longer second diagonal d2 of each unit 13 is arranged along the second direction Y.

[0071] (Electrode connection part)

[0072] like Figure 7 and Figure 8 As shown, the transmitting electrode 11 and the receiving electrode 12 each include an electrode connection portion 17. The electrode connection portion 17 is constructed of the same fine wire as the fine wire 20. The electrode connection portion 17 is arranged at the end side of each of the transmitting electrode 11 and the receiving electrode 12. The electrode connection portion 17 is electrically connected to the multiple fine wires 20 constituting each unit 13. The wire width of the electrode connection portion 17 is formed to be thicker than the wire width of the multiple fine wires 20 constituting each unit 13.

[0073] (Wiring Department)

[0074] Multiple wiring sections are elements used to electrically connect multiple transmitting electrodes 11 and multiple receiving electrodes 12 to external circuitry (the aforementioned drive circuit and detection circuit) not shown. Each wiring section is composed of the same fine wire as the fine wire 20.

[0075] like Figures 3-5 As shown, the multiple wiring sections are composed of multiple first wiring sections 31 and multiple second wiring sections 32. The multiple first wiring sections 31 and multiple second wiring sections 32 are arranged in the visible area Va (refer to...). Figure 1 On the outside of the decorative part 2a (see reference 2b). Specifically, a plurality of first wiring portions 31 and a plurality of second wiring portions 32 are arranged on the outside of the decorative part 2a when viewed from the operating surface 2b. Figure 1 and Figure 2 The overlapping positions. That is to say, the multiple first wiring portions 31 and the multiple second wiring portions 32 cannot be seen from the operation surface 2b side due to the decorative portion 2a.

[0076] like Figure 4 As shown, a plurality of first wiring portions 31 are formed on the lower surface of the substrate 3. One end of each first wiring portion 31 is connected to the end of each transmitting electrode 11 (that is, Figure 7 The electrode connection portion 17 shown is electrically connected. A plurality of first wiring portions 31 are arranged such that their other ends are concentrated at approximately the center of the lower side of the substrate 3.

[0077] like Figure 5 As shown, a plurality of second wiring portions 32 are formed on the upper surface of the substrate 3. One end of each second wiring portion 32 is connected to the end of each receiving electrode 12 (that is, Figure 8The electrode connection portion 17 shown is electrically connected. A plurality of second wiring portions 32 are arranged such that their other ends are concentrated at approximately the center of the lower side of the substrate 3.

[0078] (pad)

[0079] like Figures 3-5 As shown, a pad 33 for electrical connection with the flexible wiring board 40 is provided at the other end of each wiring section. Each pad 33 has the same cross-sectional structure as the thin line 20.

[0080] (First grounding part and second grounding part)

[0081] Figure 4 and Figure 5 The first grounding portion 34 and the second grounding portion 35 shown are set to ground potential. The first grounding portion 34 and the second grounding portion 35 are electrically insulated from the plurality of sensor electrodes and the plurality of wiring portions. The first grounding portion 34 and the second grounding portion 35 are arranged in the visible area Va (refer to...). Figure 1 The outer side of the visible area Va. Specifically, the first grounding portion 34 and the second grounding portion 35 are arranged to surround the outer periphery of the visible area Va.

[0082] like Figure 4 As shown, a first ground portion 34 is formed on the lower surface of the substrate 3. The first ground portion 34 is located near the periphery of the lower surface of the substrate 3. Pads 33, 33 are provided in the middle portion of the first ground portion 34 (the middle portion located approximately near the center of the lower side of the substrate 3).

[0083] like Figure 5 As shown, a second ground portion 35 is formed on the upper surface of the substrate 3. The second ground portion 35 is located near the periphery of the upper surface of the substrate 3. The two ends of the second ground portion 35 are located approximately near the center of the lower edge of the substrate 3. Pads 33, 33 are provided at both ends of the second ground portion 35.

[0084] (Pseudo-pattern)

[0085] like Figure 8 As shown, the receiving electrode 12 includes a pseudo-pattern 15. When viewed from above, the pseudo-pattern 15 is arranged inside each unit 13 constituting the receiving electrode 12.

[0086] The pseudo-pattern 15 is composed of multiple thin lines 20. Specifically, the pseudo-pattern 15 is configured as a grid pattern composed of multiple thin lines 20. The pseudo-pattern 15 is configured such that the spacing LD2 between adjacent thin lines 20 is (see reference). Figure 8 () in the range of 100μm and above and 500μm and below.

[0087] The dummy pattern 15 is electrically insulated from the multiple fine wires 20 constituting each unit 13 of the receiving electrode 12. Specifically, the ends of each fine wire 20 constituting the dummy pattern 15 are arranged at intervals from the multiple fine wires 20 constituting each unit 13 of the receiving electrode 12. That is, the fine wires 20 constituting the dummy pattern 15 do not intersect with the multiple fine wires 20 constituting the receiving electrode 12. In addition, each fine wire 20 constituting the dummy pattern 15 is electrically insulated from the electrode connection portion 17.

[0088] (Pseudo-electrode)

[0089] like Figure 8 As shown, dummy electrodes 16 are disposed between the receiving electrodes 12, 12. The dummy electrodes 16 are composed of multiple fine lines 20. Specifically, the dummy electrodes 16 are configured as a grid pattern composed of multiple fine lines 20. The spacing LD3 between adjacent fine lines 20, 20 in the dummy electrodes 16 is in the range of 100 μm or more and 500 μm or less.

[0090] The dummy electrode 16 is electrically insulated from each receiving electrode 12. Specifically, the ends of each wire 20 constituting the dummy electrode 16 are arranged at intervals from each wire 20 constituting each unit 13 of the receiving electrode 12. That is, each wire 20 constituting the dummy electrode 16 does not intersect with the multiple wires 20 constituting the receiving electrode 12. In addition, each wire 20 constituting the dummy electrode 16 is electrically insulated from the electrode connection portion 17.

[0091] (Cross-sectional structure of fine lines)

[0092] like Figure 10 As shown, each fine wire 20 is disposed in the first groove 6. Each fine wire 20 is conductive. Specifically, each fine wire 20 comprises conductive material embedded in each first groove 6. Each fine wire 20 is composed of a tight-fitting layer 21, a seed layer 22, a conductive layer 23, and a blackening layer 24.

[0093] The tight-fitting layer 21 is an element used to ensure the tightness of the seed layer 22 relative to the first groove 6. The tight-fitting layer 21 has the function of making the fine wire 20 difficult to see when viewed by the user from the operating surface 2b side.

[0094] The bonding layer 21 is, for example, a metal layer composed of a metal nitride or a metal oxide, wherein the metal nitride or metal oxide comprises at least one metal selected from the group consisting of Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, Cu, and Zn. The bonding layer 21 may be a single layer or a laminate composed of multiple layers with different compositions. The bonding layer 21 is deposited on the first trench portion 6 in a thin film, for example, by vapor deposition or sputtering.

[0095] The seed layer 22 functions to bond the conductive layer 23 to the bonding layer 21. Specifically, during the electroplating process described later, the seed layer 22 functions as a cathode for depositing the constituent material (conductive metal) of the conductive layer 23 onto the bonding layer 21. The seed layer 22 is deposited on the bonding layer 21 in a thin film, for example, by vapor deposition or sputtering.

[0096] The conductive layer 23 is made of a conductive metal such as copper (Cu). The conductive layer 23 is formed, for example, by electroplating. When electroplating is performed, the seed layer 22 and the conductive layer 23 are formed as a single unit. Therefore, the interface between the seed layer 22 and the conductive layer 23 is indistinguishable. It should be noted that the conductive metal is not limited to copper; it can also be silver, gold, or a copper alloy.

[0097] A blackening layer 24 is stacked on the upper surface of the conductive layer 23. The blackening layer 24 is formed by replacing copper grains located on the upper surface of the conductive layer 23 with palladium (which undergoes a blackening treatment), with the replaced copper grains situated at the boundaries between the copper grains. The thickness of the blackening layer 24 is, for example, 7 nm or more and 10 nm or less. The blackening layer 24 has the function of making the fine line 20 difficult to see visually when viewed by a user from the operating surface 2b side.

[0098] (Conductive film)

[0099] Next, the conductive film 100 according to the embodiments of this disclosure will be described.

[0100] The conductive film 100 is the base material before the conductive component 10 is formed. Multiple sensor electrodes, multiple dummy electrodes 16, multiple wiring portions, multiple pads 33, a first ground portion 34, and a second ground portion 35 are pre-formed on the conductive film 100.

[0101] like Figure 11 and Figure 12 As shown, when viewed from above, the conductive film 100 is composed of a first region R1, a second region R2, and a third region R3. The first region R1 and the second region R2 correspond to the conductive component 10 described above.

[0102] The first region R1 is used to arrange multiple thin wires 20, each made of conductive material. That is, multiple sensor electrodes, multiple dummy electrodes 16, multiple electrode connection portions 17, multiple wiring portions, multiple pads 33, a first grounding portion 34, and a second grounding portion 35 are arranged in the first region R1. It should be noted that... Figure 11 and Figure 12 In order to distinguish the first region R1 from other regions, dotted shadows are marked on the first region R1.

[0103] Viewed from above, the second region R2 corresponds to the region remaining after removing the first region R1 and the third region R3 from the entire area of ​​the conductive film 100. The second region R2 is arranged to surround the entire circumference of the first region R1. Viewed from above, the second region R2 has a generally quadrilateral frame shape.

[0104] Viewed from above, the third region R3 corresponds to the region remaining after removing the first region R1 and the second region R2 from the entire area of ​​the conductive film 100. The third region R3 is arranged to surround the entire circumference of the second region R2. Viewed from above, the third region R3 has a generally quadrilateral frame shape.

[0105] At a position corresponding to the boundary line between the second region R2 and the third region R3, a cutting surface CS is provided for cutting the first region R1 and the second region R2 from the third region R3. The cutting surface CS is formed on a layer formed by stacking a substrate layer 4 and an insulating layer 5 (see reference). Figure 13 It should be noted that, in this embodiment, the outer edge of the second region R2 (that is, Figures 11-13 The position of the cut surface CS shown corresponds to the outer edge of the conductive component 10. Additionally, the outer edge of the third region R3 corresponds to the outer edge of the conductive film 100. Figure 11 (Imaginary line shown).

[0106] like Figure 13 As shown, the conductive film 100 has a substrate layer 4 and an insulating layer 5. It should be noted that the substrate layer 4 and the insulating layer 5 constituting the conductive film 100 are related to... Figure 10 The substrate layer 4 and insulating layer 5 constituting the conductive component 10 are the same, so their detailed description is omitted.

[0107] (First trench section)

[0108] like Figure 13 As shown, a plurality of first grooves 6 are arranged in the first region R1. Each first groove 6 has a bottomed shape that is recessed in the thickness direction of the insulating layer 5. It should be noted that in Figure 13 The image shows a first groove 6 located near the boundary between the first region R1 and the second region R2.

[0109] The width W1 of each first groove 6 is, for example, set to 10 μm or more. The depth D1 of each first groove 6 is, for example, set to 0.9 μm or more and 3.0 μm or less. In addition, in the first region R1, the thickness T1 between the lower surface 6a of the insulating layer 5 and the upper surface 4a of the substrate layer 4 is, for example, set to 1.0 μm or more and 10.0 μm or less.

[0110] (Second trough)

[0111] like Figure 12 and Figure 13As shown, the conductive film 100 has a second groove 7. It should be noted that, in Figure 2 as well as Figure 11 The illustration of the second groove 7 is omitted in the text.

[0112] The second groove 7 is arranged in the second region R2. Furthermore, when viewed from above, the second groove 7 is located near the cut surface CS.

[0113] The second groove 7 extends along the extension direction of the cut surface CS. Specifically, the second groove 7 extends parallel to the extension direction of the cut surface CS throughout the entire circumference of the outer edge (cut surface CS) of the second region R2.

[0114] Viewed from above, the second groove 7 is disposed between the cut surface CS and the first groove 6. Specifically, viewed from above, the second groove 7 is arranged between the cut surface CS and the first groove 6 located near the outer edge of the first region R1 (see reference). Figure 12 and Figure 13 ).

[0115] Viewed from above, the second groove 7 surrounds the first groove 6. Specifically, viewed from above, the second groove 7 surrounds the first groove 6 located near the outer edge of the first region R1 (see reference). Figure 12 and Figure 13 ).

[0116] like Figure 13 As shown, the second groove 7 has a bottomed shape that is recessed in the thickness direction of the insulating layer 5. The groove width of the second groove 7 is wider than the groove width of the first groove 6. That is, the second groove 7 is configured such that the groove width dimension W2 of the second groove 7 is larger than the groove width dimension W1 of the first groove 6. The groove width dimension W2 is set to, for example, 10 μm or more. With this setting, in the removal process S34 described later, the conductive metal (copper, etc.) constituting the conductive layer 23 of the fine wire 20 is less likely to remain in the second groove 7.

[0117] In this embodiment, the length between the lower surface 7a of the second groove 7 and the upper surface 4a of the substrate layer 4 is equal to the length between the lower surface 6a of the first groove 6 and the upper surface 4a of the substrate layer 4. Specifically, as... Figure 13 As shown, the thickness dimension T2 on the side of the second groove 7 is the same as the thickness dimension T1 on the side of the first groove 6.

[0118] Furthermore, in this embodiment, the length between the lower surface 7a of the second groove 7 and the upper surface 5a of the insulating layer 5 is equal to the length between the lower surface 6a of the first groove 6 and the upper surface 5a of the insulating layer 5. Specifically, as... Figure 13 As shown, the depth dimension D2 of the second groove 7 is the same as the depth dimension D1 of the first groove 6.

[0119] (Manufacturing method of conductive components)

[0120] Next, refer to Figure 15 The manufacturing method of the conductive component 10 will be described.

[0121] like Figure 15 As shown, the manufacturing method of the conductive component 10 mainly consists of an insulating layer forming process S1, a groove forming process S2, a fine wire forming process S3, and a cutting process S4. The cutting process S4 is equivalent to the processing method of the conductive film 100.

[0122] In the insulating layer forming process S1, an insulating layer 5 is laminated onto a substrate layer 4 having a first region R1 to a third region R3. In the insulating layer forming process S1, a resin material having insulating and light-transmitting properties is applied to the upper surface 4a of the substrate layer 4. The applied resin material is then cured, for example, by natural drying. Thus, the insulating layer 5 is laminated onto the upper surface 4a of the substrate layer 4.

[0123] In the groove forming process S2, for example, an embossing process is used to form a plurality of first grooves 6 and second grooves 7 on the insulating layer 5. Specifically, a plurality of first grooves 6 are formed on the insulating layer 5 corresponding to the first region R1. In addition, second grooves 7 are formed on the insulating layer 5 corresponding to the second region R2. It should be noted that, in the groove forming process S2, rounded corners may also be formed at the corners between the lower surface and the side surface of each of the first grooves 6 and the second grooves 7.

[0124] Next, the fine wire formation process S3 is performed. The fine wire formation process S3 mainly includes the close bonding layer formation process S31, the seed layer formation process S32, the conductive layer formation process S33, the removal process S34, and the blackening layer formation process S35.

[0125] In the close-bonding layer formation process S31, a metal layer composed of the aforementioned metal nitride or metal oxide is formed in thin film on each of the first trench portions 6 of the insulating layer 5, for example, by vapor deposition or sputtering. Through this film formation, a close-bonding layer 21 is formed within each of the first trench portions 6 (see reference). Figure 10 ).

[0126] In the seed layer formation process S32, after the formation of the close-fitting layer 21, copper (Cu) is deposited on the close-fitting layer 21 in a thin film, for example, by vapor deposition or sputtering. Through this film formation, a seed layer 22 is formed in each of the first trench portions 6 (see reference). Figure 10 ).

[0127] In the conductive layer formation process S33, after the seed layer 22 is formed, a conductive metal (such as copper) is deposited on the entire area of ​​the seed layer 22, for example, by electroplating and using the seed layer 22 as the cathode. In this electroplating process, the amount of conductive metal deposited is adjusted so that the conductive metal completely fills each of the first trenches 6.

[0128] In the removal process S34, after a predetermined amount of conductive metal has been deposited through electroplating, excess conductive metal deposited on the upper surface 5a side of the insulating layer 5 is removed. Thus, the remaining conductive metal deposited on the upper surface 5a side of the insulating layer 5 is removed. On the other hand, conductive metal remains in each of the first grooves 6. Thus, a conductive layer 23 is formed in each of the first grooves 6. Here, since the groove width W2 of the second groove 7 is larger than the groove width W1 of the first groove 6, conductive metal is less likely to remain in the second groove 7 after the removal process S34.

[0129] In the blackening layer formation process S35, after the conductive layer 23 is formed, a blackening treatment is performed to form a blackening layer 24 (see reference). Figure 5 Specifically, in the blackening process, a blackening layer 24 is formed by replacing the surface of the conductive layer 23 with, for example, palladium. Finally, the blackening layer 24 is subjected to a rust-preventive treatment to form a rust-preventive film (not shown).

[0130] After the fine wire forming process S3 (S31 to S35 mentioned above), the cutting process S4 is performed. In the cutting process S4, the conductive film 100 is cut along the boundary line between the second region R2 and the third region R3 (the position corresponding to the cutting surface CS) using a prescribed cutting device (see reference). Figure 13 Through this process, the first region R1 and the second region R2 are removed from the conductive film 100. That is, a conductive component 10 composed of the first region R1 and the second region R2 is formed (see reference). Figure 3 As the aforementioned cutting device, for example, a laser processing device or a cutting device including a cutting tool is suitable. It should be noted that, in Figure 13 In the diagram, the cutting position of the cutting device is schematically indicated by the symbol Cp (arrow).

[0131] Here, as Figure 14 As shown, after the cutting process S4, the insulating layer 5 of the conductive component 10 forms a peeling surface 9. Specifically, the peeling surface 9 is formed on the thickness portion of the insulating layer 5 from the lower surface 7a of the second groove 7 to the upper surface 4a of the substrate layer 4. The peeling surface 9 extends downward from the lower surface 7a of the second groove 7 toward the substrate layer 4.

[0132] After going through the above processes S1 to S4, the manufacturing of the conductive component 10 is completed.

[0133] [Effects of the Implementation Method]

[0134] In the cutting process S4 described above, external factors generated during cutting act on the cross-sectional portion of the substrate layer 4 and the insulating layer 5 corresponding to the position of the cutting surface CS. For example, when a laser processing device is used as the cutting device, the processing heat generated by the laser processing can easily cause cracking at the boundary between the substrate layer 4 and the insulating layer 5. Furthermore, when a cutting device including a cutting tool is used as the cutting device, friction easily occurs between the cutting tool and the cutting surface CS when the cutting tool is pulled away from the cutting surface CS of the substrate layer 4 and the insulating layer 5. As a result, in the cutting process described above, external factors such as processing heat or friction may cause the insulating layer 5 to peel off from the substrate layer 4 in the thickness direction, starting from the boundary between the substrate layer 4 and the insulating layer 5.

[0135] To prevent such phenomena from occurring, the conductive film 100 disclosed herein includes a substrate layer 4, an insulating layer 5, and fine wires 20. The insulating layer 5 is stacked on the upper surface 4a of the substrate layer 4, and a first groove 6 and a second groove 7, wider than the first groove 6, are formed on its upper surface 5a. The fine wires 20 are disposed in the first groove 6 and are conductive. Viewed from above, the second groove 7 is disposed between the cut surface CS of the layer formed by the stacked substrate layer 4 and the insulating layer 5 and the first groove 6. Furthermore, viewed from above, the second groove 7 surrounds the first groove 6.

[0136] As described above, in the removal process S34, conductive metals such as copper are unlikely to remain in the second groove 7. Therefore, in the cutting process S4, when the insulating layer 5 is to be peeled from the substrate layer 4 due to the aforementioned external factors, the stress generated during peeling tends to concentrate on the thickness portion of the insulating layer 5 from the lower surface 7a of the second groove 7 to the upper surface 4a of the substrate layer 4. Compared to the thickness of the portion in the second region R2 where the second groove 7 is not present, the thickness of this thickness portion is relatively small. Therefore, if the stress generated during peeling is concentrated on the thickness portion from the lower surface 7a of the second groove 7 to the upper surface 4a of the substrate layer 4, the middle part of the thickness portion may break, for example. In the event of such a breakage, the portion of the insulating layer 5 in the second region R2 from the cutting surface CS to the lower surface 7a of the second groove 7 ( Figure 14 The fragment shown (f) is peeled off from the substrate layer 4 (see reference). Figure 14 As a result, it is possible to prevent the insulating layer 5 corresponding to the first region R1 from being peeled off from the substrate layer 4. In other words, it is possible to properly maintain the state in which the insulating layer 5 corresponding to the first region R1 is stacked on the substrate layer 4.

[0137] Therefore, in the conductive film 100 of the embodiments of this disclosure, the stacked state of the substrate layer 4 and the insulating layer 5 can be properly maintained at least in the first region R1.

[0138] Furthermore, when viewed from above, the second groove 7 is located near the cut surface CS. Therefore, in the second region R2, the portion of the insulating layer 5 from the cut surface CS to the second groove 7 ( Figure 14 The fragment portion f shown becomes relatively small. That is, in the second region R2, the fragment portion f can be limited to a minimum size. As a result, in the first region R1, the state in which the insulating layer 5 is stacked on the substrate layer 4 can be appropriately maintained.

[0139] Furthermore, when viewed from above, the second groove 7 extends along the extension direction of the cut surface CS. Therefore, it is possible to maintain the state of being stacked on the substrate layer 4 appropriately throughout the entire region of the first region R1.

[0140] Furthermore, the second groove 7 is arranged between the cut surface CS and the first groove 6 located near the outer edge of the first region R1. That is, the second groove 7 is arranged at a distance from the first groove 6 located near the outer edge of the first region R1 in the planar direction of the conductive film 100. Therefore, even if the fragment f peels off from the substrate layer 4 in the second region R2, it will not affect the first groove 6 located near the outer edge of the first region R1. Thus, the first groove 6 located near the outer edge of the first region R1 and the conductive material (especially the conductive layer 23) embedded in the first groove 6 can be adequately protected.

[0141] Furthermore, in the embodiments of this disclosure, as a processing method for the conductive film 100, a cutting step S4 is performed to cut the conductive film 100 along the cutting surface CS using a predetermined cutting device. Thus, the conductive film 100 is obtained. In the conductive film 100 obtained by the cutting step S4, the insulating layer 5 is appropriately maintained on the substrate layer 4 in the first region R1 due to the aforementioned action of the second groove 7.

[0142] Moreover, such as Figure 16 As shown, the touch sensor 1 (wiring structure) according to the embodiments of this disclosure includes a conductive component 10, an adhesive layer 8, and a cover component 2. The adhesive layer 8 is stacked on the upper surface 5a of the insulating layer 5 and a portion of the substrate layer 4, and the cover component 2 is stacked on the adhesive layer 8. It should be noted that... Figure 16 The conductive component 10 shown is composed of a first region R1 and a second region R2 in the state where the third region R3 has been removed in the cutting process S4.

[0143] like Figure 16As shown, the adhesive layer 8 covers the release surface 9 of the insulating layer 5 and a portion of the substrate layer 4. Specifically, in cross-section, the adhesive layer 8 covers the release surface 9 of the insulating layer 5 and a portion of the substrate layer 4 located in the second region R2. Therefore, when viewed from the side of the touch sensor 1 (that is, at the position of the cut surface CS in the conductive film 100), the insulating layer 5 appears to be hidden by the adhesive layer 8. As a result, when storing the touch sensor 1, foreign matter such as moisture will not penetrate the interior of the touch sensor 1 from the outside (that is, the first region R1 where the multiple fine wires 20 are located). Therefore, in the embodiments of this disclosure ( Figure 16 In the structure shown, the quality and reliability of the touch sensor 1 (wiring structure) can be properly maintained.

[0144] [Modification of the implementation method 1]

[0145] In the above embodiment, the second groove 7 is shown to be located between the cut surface CS and the first groove 6 located near the outer edge of the first region R1, but it is not limited to this arrangement. For example, as... Figure 17 and Figure 18 As shown in Modified Example 1, the second groove 7 can also be arranged at a position that overlaps with the cut surface CS.

[0146] like Figure 17 As shown, when viewed from above, the second groove 7 of this modified example overlaps with the cut surface CS. Specifically, the lower surface 7a of the second groove 7 approximately overlaps with the cut surface CS.

[0147] like Figure 18 As shown, in this modified example, during the cutting process S4, breakage is likely to occur near the corner of the lower surface 7a and side surface 7b of the insulating layer 5 in the second region R2 and the second groove 7.

[0148] In this modified example 1, the second groove 7 is also arranged at a distance from the first groove 6 located near the outer edge of the first region R1 in the surface direction of the conductive film 100. Therefore, even if a portion (fragment f) of the insulating layer 5 from the cut surface CS to the lower surface 7a of the second groove 7 is peeled off from the substrate layer 4 in the second region R2, the first groove 6 located near the outer edge of the first region R1 will not be affected. Thus, the first groove 6 located near the outer edge of the first region R1 and the conductive material (especially the conductive layer 23) embedded in the first groove 6 can be adequately protected.

[0149] Furthermore, in this modified example 1, compared with the above embodiment, the size of the insulating layer 5 in the second region R2 from the cut surface CS to the fracture portion is relatively small.

[0150] [Modification 2 of the implementation method]

[0151] In the above embodiment, the length (thickness dimension T2) between the lower surface 7a of the second groove 7 and the upper surface 4a of the substrate layer 4 is shown to be equal to the length (thickness dimension T1) between the lower surface 6a of the first groove 6 and the upper surface 4a of the substrate layer 4, but it is not limited to this method. For example, it is also possible to... Figure 19 It is constructed as shown in Modified Example 2.

[0152] like Figure 19 As shown, the length between the lower surface 7a of the second groove 7 and the upper surface 4a of the substrate layer 4 is less than the length between the lower surface 6a of the first groove 6 and the upper surface 4a of the substrate layer 4. Specifically, the thickness dimension T2 is less than the thickness dimension T1. The thickness dimension T2 is, for example, 1.0 μm or more and 10.0 μm or less.

[0153] Furthermore, the length between the lower surface 7a of the second groove 7 and the upper surface 5a of the insulating layer 5 is greater than the length between the lower surface 6a of the first groove 6 and the upper surface 5a of the insulating layer 5. Specifically, the depth dimension D2 of the second groove 7 is greater than the depth dimension D1 of the first groove 6.

[0154] According to this modified example, in the insulating layer 5, the rigidity of the thickness portion from the lower surface 7a of the second groove 7 to the upper surface 4a of the substrate layer 4 is less than the rigidity of the thickness portion from the lower surface 6a of the first groove 6 to the upper surface 4a of the substrate layer 4. As a result, in the cutting process S4, the thickness portion from the lower surface 7a of the second groove 7 to the upper surface 4a of the substrate layer 4 is prone to breakage. That is, in the second region R2, the portion of the insulating layer 5 from the cutting surface CS to the lower surface 7a in the second groove 7 (fragment portion) is easily peeled off from the substrate layer 4. Therefore, in the first region R1, the state in which the insulating layer 5 is stacked on the substrate layer 4 can be properly maintained.

[0155] Furthermore, in Modification 2, it is also similar to the above-described embodiment. Figure 16 Similarly, in the structure shown, the conductive component 10, after the third region R3 has been removed in the cutting process S4, is composed of the first region R1 and the second region R2, which are not shown. Furthermore, in variation 2, the touch sensor 1 (wiring structure) also includes a structure based on... Figure 19 The structure shown includes a conductive component 10, an adhesive layer 8 stacked on the upper surface 5a of the insulating layer 5 and a portion of the substrate layer 4, and a cover component 2 stacked on the adhesive layer 8. In this structure, the adhesive layer 8 covers the peel surface 9 of the insulating layer 5 and a portion of the substrate layer 4. Thus, in variation 2, it is also similar to the above-described embodiment. Figure 16 Similarly, the structure shown can properly maintain the quality and reliability of the touch sensor 1 (wiring structure).

[0156] [Other Implementation Methods]

[0157] In the above embodiment, a method of applying a roughly rectangular visible area Va is shown, but it is not limited to this method. For example, the visible area Va may also have a roughly circular shape, a pentagonal shape, or a polygonal shape when viewed from above.

[0158] In the above embodiment, a method using one substrate 3 is shown, but it is not limited to this method. That is, it is also possible to use two substrates (not shown). Two substrates can be used by stacking an insulating layer 5 on the upper surface 4a or the lower surface of the substrate layer 4, which is not shown.

[0159] In the above embodiment, a method is shown in which the substrate 3 in the conductive component 10 has a substrate layer 4 and an insulating layer 5, but it is not limited to this method. For example, the substrate 3 may only have a substrate layer 4. In this method, a plurality of first grooves 6 may be formed on at least one of the upper surface 4a and the lower surface of the substrate layer 4.

[0160] In the above embodiments, Figure 3 The direction from left to right on the paper is defined as the first direction X. On the other hand, Figure 3 The direction from the bottom to the top in the paper is defined as the second direction Y, but it is not limited to this. That is to say, it is also possible to... Figure 3 The direction from bottom to top on the paper is defined as the first direction X. On the other hand, Figure 3 The direction from left to right in the plane of the paper is defined as the second direction Y. In this case, the extension direction of each transmitting electrode 11 and the extension direction of the second diagonal d2 of each unit 13 constituting each transmitting electrode 11 become Figure 3 The direction from bottom to top in the paper is not shown. On the other hand, the extending direction of each receiving electrode 12 and the extending direction of the second diagonal d2 of each unit 13 constituting each receiving electrode 12 become... Figure 3 The direction from left to right on the paper.

[0161] In the above embodiment, it is shown that a plurality of transmitting electrodes 11, a plurality of first wiring portions 31, and a first ground portion 34 are disposed on the lower surface side of the substrate 3, while a plurality of receiving electrodes 12, a plurality of second wiring portions 32, and a second ground portion 35 are disposed on the upper surface side of the substrate 3. However, this embodiment is not limited to this configuration. For example, it is also possible to configure a plurality of transmitting electrodes 11, a plurality of first wiring portions 31, and a first ground portion 34 to be disposed on the upper surface side of the substrate 3, while a plurality of receiving electrodes 12, a plurality of second wiring portions 32, and a second ground portion 35 to be disposed on the lower surface side of the substrate 3, which is not shown in the figure. It should be noted that even in this structure, each dummy pattern 15 and each dummy electrode 16 are arranged on the upper surface side of the substrate 3 (the viewing side of the touch sensor 1).

[0162] In the above embodiment, each unit 13 is shown to be rhomboid in shape, but is not limited to this method. That is, each unit 13 can be a quadrilateral formed by an imaginary first diagonal d1 and an imaginary second diagonal d2 that is longer than the first diagonal d1.

[0163] In the above embodiment, it is shown that the second diagonal d2 of each unit 13 constituting the transmitting electrode 11 extends along the first direction X (see reference). Figure 7 However, it is not limited to this method. In the transmitting electrode 11, it may also be configured such that the second diagonal d2 of each unit 13 extends along the second direction Y, which is not shown.

[0164] In the above embodiment, it is shown that the second diagonal d2 of each unit 13 constituting the receiving electrode 12 extends along the second direction Y (see reference). Figure 8 However, it is not limited to this method. In the receiving electrode 12, it may also be configured such that the second diagonal d2 of each unit 13 extends along the first direction X, which is not shown.

[0165] In the above embodiment, a configuration where the transmitting electrode 11 does not include the dummy pattern 15 is shown, but the embodiment is not limited to this configuration. The transmitting electrode 11 may also include the same dummy pattern as the dummy pattern 15 described in the above embodiment, which is not shown in the figure. In this case, similar to the dummy pattern 15 on the receiving electrode 12 side, the dummy pattern on the transmitting electrode 11 side is composed of multiple dummy lines (not shown). Furthermore, when viewed from above, the dummy pattern on the transmitting electrode 11 side is arranged within the area of ​​each unit 13 constituting the transmitting electrode 11.

[0166] In the above embodiment, a dummy electrode 16 is shown without being provided between the transmitting electrodes 11, 11, but this is not a limitation. For example, if the electrode width EW1 of the transmitting electrode 11 is relatively small, a dummy electrode (not shown) may be provided between the transmitting electrodes 11, 11, and so on. Figure 8Similarly, the dummy electrode 16 shown is composed of multiple dummy fine lines (not shown).

[0167] In the above embodiment, it is shown that a plurality of transmitting electrodes 11, a plurality of first wiring portions 31, and a first ground portion 34 are disposed on the lower surface side of the substrate 3, while a plurality of receiving electrodes 12, a plurality of second wiring portions 32, and a second ground portion 35 are disposed on the upper surface side of the substrate 3. However, this embodiment is not limited to this configuration. For example, it is also possible to configure a plurality of transmitting electrodes 11, a plurality of first wiring portions 31, and a first ground portion 34 to be disposed on the upper surface side of the substrate 3, while a plurality of receiving electrodes 12, a plurality of second wiring portions 32, and a second ground portion 35 to be disposed on the lower surface side of the substrate 3, which is not shown in the figure. It should be noted that even in this structure, each dummy pattern 15 and each dummy electrode 16 are arranged on the upper surface side of the substrate 3 (the viewing side of the touch sensor 1).

[0168] In the above embodiment, a configuration with one second groove 7 is shown, but the embodiment is not limited to this configuration. Multiple second grooves 7 may also be provided, but these are not shown. In this case, it is sufficient to arrange the multiple second grooves 7 at intervals in directions orthogonal to the extension direction of the cut surface CS. In summary, in the conductive film 100 according to the embodiments of this disclosure, at least one second groove 7 is provided on the insulating layer 5. Alternatively, the second groove 7 may also be formed on the insulating layer 5 located on the lower surface of the substrate layer 4, but this is not shown.

[0169] Furthermore, in the above embodiment, a method is shown where the groove width W2 of the second groove 7 is greater than the groove width W1 of the first groove 6, but this method is not limited to this. For example, as Figure 20 As shown, the groove width W2 on the second groove 7 side can also be equal to the groove width W1 on the first groove 6 side. Even with this structure, if the depth D2 of the second groove 7 is greater than or equal to the depth D1 of the first groove 6 (that is, if the thickness T2 is less than or equal to the thickness T1), then, similar to the above embodiment or the above variation 2, in the cutting process S4, the portion (fragment portion) of the insulating layer 5 in the second region R2 from the cutting surface CS to the lower surface 7a of the second groove 7 is easily peeled off from the substrate layer 4. As a result, the situation where the insulating layer 5 corresponding to the first region R1 is peeled off from the substrate layer 4 is prevented. Therefore, even Figure 20 The manner shown is similar to the above-described embodiment, and can appropriately maintain the state in which the insulating layer 5 corresponding to the first region R1 is stacked on the substrate layer 4.

[0170] Moreover, it is able to... Figure 16 The touch sensor 1 (wiring structure) in the above-described embodiment of the example is similarly configured to include components made of... Figure 20The conductive component 10 of the touch sensor 1 (wiring structure) is configured as shown, but is not illustrated. According to this structure, similar to the embodiment described above, when storing the touch sensor 1, foreign matter such as moisture is difficult to penetrate the interior of the touch sensor 1, thus appropriately maintaining the quality and reliability of the touch sensor 1.

[0171] In the above embodiments, a touch sensor 1 with conductive component 10 is exemplified as a wiring structure, but it is not limited to this. For example, the conductive component 10 can be widely applied to wiring structures in technical fields other than touch sensor 1 (e.g., liquid crystal display devices, organic light-emitting diode (OLED) display devices, micro LED display devices, solar cell devices, heating devices, antenna devices, electromagnetic wave shielding sheets, etc.). It should be noted that the cover component 2, which is applied to wiring structures other than touch sensor 1, can be configured as a component capable of covering the insulating layer 5 (e.g., a plate-like or film-like component for protecting the insulating layer 5).

[0172] -Industry Applicability-

[0173] This disclosure can be used industrially as a conductive film and its processing method, as well as a wiring structure using the conductive film.

[0174] - Symbol Explanation -

[0175] 1: Touch sensor (wiring structure)

[0176] 2: Cover component

[0177] 3: Substrate

[0178] 4: Substrate layer

[0179] 5: Insulation layer

[0180] 6: First trench section

[0181] 7: Second groove section

[0182] 8: Adhesive layer

[0183] 10: Conductive components

[0184] 11: Sending Electrode

[0185] 12: Receiving electrode

[0186] 20: Thin line

[0187] 21: Close-fitting layer

[0188] 22: Seed layer

[0189] 23: Conductive layer

[0190] 24: Blackening layer

[0191] 100: Conductive film

[0192] R1: First Region

[0193] R2: Second Region

[0194] R3: Third Region

[0195] CS: Cut surface

[0196] Cp: ​​Cut-off position

[0197] f: Fragmentation section.

Claims

1. A conductive film, characterized in that: The conductive film includes a substrate layer, an insulating layer, and fine wires. The insulating layer is stacked on the upper surface of the substrate layer, and a first groove and a second groove with a width wider than the first groove are formed on the upper surface of the insulating layer. The thin wire is disposed in the first groove, and the thin wire is conductive. Viewed from above, the second groove is positioned between the cut surface of the layer formed by stacking the substrate layer and the insulating layer and the first groove. When viewed from above, the second groove surrounds the first groove.

2. The conductive film according to claim 1, characterized in that: When viewed from above, the second groove is located near the cut surface.

3. The conductive film according to claim 1, characterized in that: When viewed from above, the second groove extends along the extension direction of the cut surface.

4. The conductive film according to claim 1, characterized in that: When viewed from above, the second groove overlaps with the cut surface.

5. The conductive film according to claim 1, characterized in that: The length between the lower surface of the second groove and the upper surface of the substrate layer is less than the length between the lower surface of the first groove and the upper surface of the substrate layer.

6. A method for processing a conductive film, wherein the conductive film is the conductive film according to claim 1, characterized in that: The method for processing the conductive film includes a cutting step of cutting the conductive film along a cutting surface using a cutting device.

7. A conductive film, characterized in that: The conductive film includes a substrate layer, an insulating layer, and fine wires. The insulating layer is stacked on the upper surface of the substrate layer, and a first groove and a second groove are formed on the upper surface of the insulating layer. The thin wire is disposed in the first groove, and the thin wire is conductive. The second groove is disposed between the cut surface of the layer formed by stacking the substrate layer and the insulating layer and the first groove. Viewed from above, the second groove surrounds the first groove. The length between the lower surface of the second groove and the upper surface of the insulating layer is greater than the length between the lower surface of the first groove and the upper surface of the insulating layer.

8. A conductive film, characterized in that: The conductive film includes a substrate layer, an insulating layer, and fine wires. The insulating layer is stacked on the upper surface of the substrate layer, and a first groove and a second groove are formed on the upper surface of the insulating layer. The thin wire is disposed in the first groove, and the thin wire is conductive. The second groove is disposed between the cut surface of the layer formed by stacking the substrate layer and the insulating layer and the first groove. Viewed from above, the second groove surrounds the first groove. The length between the lower surface of the second groove and the upper surface of the substrate layer is less than the length between the lower surface of the first groove and the upper surface of the substrate layer.

9. A wiring structure, characterized in that: The wiring structure includes the conductive film, adhesive layer, and cover component as described in claim 1. The adhesive layer is stacked on the upper surface of the insulating layer and a portion of the substrate layer. The cover component is stacked on the adhesive layer. The insulating layer has a peelable surface extending downward from the lower surface of the second groove toward the substrate layer side. In cross-section, the adhesive layer covers the peel surface of the insulating layer located in the second region and a portion of the substrate layer.

10. A wiring structure, characterized in that: The wiring structure includes the conductive film, adhesive layer, and cover component as described in claim 7. The adhesive layer is stacked on the upper surface of the insulating layer and a portion of the substrate layer. The cover component is stacked on the adhesive layer. The insulating layer has a peelable surface extending downward from the lower surface of the second groove toward the substrate layer side. In cross-section, the adhesive layer covers the peel surface of the insulating layer located in the second region and a portion of the substrate layer.

11. A wiring structure, characterized in that: The wiring structure includes the conductive film, adhesive layer, and cover component as described in claim 8. The adhesive layer is stacked on the upper surface of the insulating layer and a portion of the substrate layer. The cover component is stacked on the adhesive layer. The insulating layer has a peelable surface extending downward from the lower surface of the second groove toward the substrate layer side. In cross-section, the adhesive layer covers the peel surface of the insulating layer located in the second region and a portion of the substrate layer.

Images