Induction heating device including coil substrate

Abstract

The induction heating device may include an inverter circuit for driving the heating coil. The induction heating device may include a coil substrate including a plurality of pattern layers on which a heating coil is printed to form a coil pattern. The coil patterns respectively formed on the plurality of pattern layers are electrically connected to each other, and a first end of each of the coil patterns may be connected to the input terminal, and a second end of each of the coil patterns may be connected to the output terminal. According to an embodiment of the present disclosure, at least one of the coil patterns branches in parallel at a branch point between the input terminal and the output terminal, and converges at a convergence point between the input terminal and the output terminal.

Description

Technical Field

[0001] This disclosure relates to a heating coil plate used in induction heating devices or non-contact power supply. Background Technology

[0002] Various types of heating devices are used at home or in restaurants to heat food. In the past, gas stoves that used gas as fuel were widely used, but recently, heating devices that use electricity instead of gas to heat objects such as cooking containers (such as pots) have become popular.

[0003] Methods of heating an object using electricity can be broadly categorized into resistance heating and induction heating. Resistance heating involves transferring heat generated when an electric current flows through a metal resistance wire or a non-metallic heating element (such as silicon carbide) via radiation or conduction, thereby heating the object (e.g., a cooking container). Induction heating, on the other hand, heats the object by inducing eddy currents in a metal component within the object using a magnetic field generated around the coil when a high-frequency power of a specific magnitude is applied. Induction cookers typically employ induction heating and have separate working coils (heating coils) corresponding to multiple objects (cooking containers) to heat them individually.

[0004] An induction cooker is a heating device used for cooking that utilizes the principle of induction heating, and is often referred to as an induction cooker, induction heating device, or induction cooking device. Compared to gas stoves, induction cookers do not consume oxygen and emit no exhaust fumes, thus reducing indoor air pollution and indoor temperature increases. Furthermore, induction cookers use an indirect method of inducing heat onto the object being heated itself, offering advantages such as high energy efficiency, stability, and a low risk of burns. This is because heat is generated solely from the object being heated, and the contact surfaces are not heated. Therefore, the demand for induction cookers has been steadily increasing recently.

[0005] Recently, induction cookers have been developed that allow objects to be heated to be placed anywhere on the top plate (hereinafter referred to as "anywhere"). Such induction cookers enable objects to be heated to be placed in an area with multiple heating coils for induction heating, regardless of the size and position of the object.

[0006] Typically, an induction cooker includes a heating coil with copper wire wound around it. However, to improve productivity, a structure is needed to print the heating coil onto a circuit board. Because the heating coil inside an induction cooker needs to be able to conduct large currents, the thickness and width of the pattern, the stacking thickness, and other details need to be precisely designed during the printing process when manufacturing the printed heating coil. Summary of the Invention

[0007] Technical solution An induction heating device according to an embodiment of the present disclosure includes an inverter circuit configured to drive a heating coil. The induction heating device according to an embodiment of the present disclosure includes a coil plate comprising a plurality of patterned layers, on which the heating coil is printed to form a coil pattern. According to an embodiment of the present disclosure, the coil patterns formed on the plurality of patterned layers are electrically connected to each other, a first end of the coil pattern being connected to an input terminal, and a second end of the coil pattern being connected to an output terminal. According to an embodiment of the present disclosure, at least one of the coil patterns branches in parallel at a branch point located between the input terminal and the output terminal, and merges at a confluence point located between the branch point and the output terminal.

[0008] In the induction heating apparatus according to an embodiment of the present disclosure, a first layer coil pattern in a plurality of patterned layers can be electrically connected to a second layer coil pattern in a plurality of patterned layers via a conductor formed inside the first layer coil pattern.

[0009] In an induction heating apparatus according to an embodiment of the present disclosure, a second layer coil pattern in a plurality of patterned layers can be electrically connected to a third layer coil pattern via a conductor formed on the outside of the second layer coil pattern.

[0010] In the induction heating apparatus according to embodiments of the present disclosure, the conductor may include a through-hole that vertically penetrates at least one of a plurality of patterned layers.

[0011] According to embodiments of this disclosure, the lengths of two or more branch paths that branch in parallel at a branch point and merge at a merging point can be equal to each other within a difference of 5% or less.

[0012] According to embodiments of this disclosure, when the frequency of the current flowing through the coil pattern is 50 kHz or greater, the lengths of two or more branch paths may be equal to each other within a difference of 1% or less.

[0013] In the induction heating apparatus according to an embodiment of the present disclosure, when the branch paths generated by the branching of coil patterns formed on multiple pattern layers are arranged such that the first branch path, the second branch path, ... and the nth branch path (where n is a natural number greater than or equal to 2) are arranged starting from the inside of the first layer coil pattern, the first branch path, the second branch path, ... and the nth branch path can be arranged starting from the outside of the second layer coil pattern.

[0014] In the induction heating apparatus according to embodiments of the present disclosure, the coil plate may include adjustment paths formed inside or outside the first layer coil pattern for adjusting the length of at least one of the first branch path, the second branch path, ... and the nth branch path.

[0015] According to embodiments of the present disclosure, a pattern layer including at least one of the coil patterns with parallel branches at the branch point can be a pattern layer other than the uppermost and lowermost layers among a plurality of pattern layers of the coil board.

[0016] In the induction heating apparatus according to embodiments of the present disclosure, the uppermost layer, excluding branch points, may include input terminals or output terminals. According to embodiments of the present disclosure, the lowermost layer, excluding confluence points, may include output terminals or input terminals.

[0017] In the induction heating apparatus according to an embodiment of the present disclosure, among the coil patterns formed on multiple pattern layers, the first coil pattern may branch in the first layer of the multiple pattern layers, and the second coil pattern may branch in the second layer of the multiple pattern layers.

[0018] In the induction heating apparatus according to embodiments of the present disclosure, the branch point of at least one parallel branch in the coil pattern can be a point where the AC resistance of the coil plate is higher than that of the other coil pattern areas.

[0019] In the induction heating device according to an embodiment of the present disclosure, at least one of the coil patterns may branch in parallel at a plurality of branch points located between the input terminal and the output terminal, the number of branches being the same as the number of the plurality of branch points, and may converge at a plurality of convergence points located between the input terminal and the output terminal, the number of convergences being the same as the number of the plurality of convergence points.

[0020] In the induction heating apparatus according to embodiments of the present disclosure, the coil patterns of each layer included in a plurality of patterned layers can be connected in series with each other.

[0021] In the induction heating apparatus according to embodiments of the present disclosure, the coil patterns of each layer included in a plurality of patterned layers may be connected in series or in parallel with each other. Attached Figure Description

[0022] Figure 1a This is a diagram illustrating an induction heating device according to an embodiment of the present disclosure.

[0023] Figure 1b This is a diagram illustrating an induction heating device at any position according to an embodiment of the present disclosure.

[0024] Figure 1c This is a diagram illustrating a heating coil wound in an induction heating device at any position according to an embodiment of the present disclosure.

[0025] Figure 1d This is a circuit diagram of an induction heating device including an inverter circuit for operating multiple heating coils, according to an embodiment of the present disclosure.

[0026] Figure 2This is a diagram illustrating a stacked structure of a coil board according to an embodiment of the present disclosure.

[0027] Figure 3 This is a plan view illustrating the construction of a coil plate according to an embodiment of the present disclosure.

[0028] Figure 4 This is a diagram illustrating the wiring of a coil board according to an embodiment of the present disclosure.

[0029] Figure 5 This is a diagram illustrating a variant example of the wiring of a coil board according to an embodiment of the present disclosure.

[0030] Figure 6 This is a diagram illustrating a variant example of the wiring of a coil board according to an embodiment of the present disclosure.

[0031] Figure 7 This is a diagram illustrating a variant example of the wiring of a coil board including multiple branches and junctions according to an embodiment of the present disclosure.

[0032] Figure 8 This is a cross-sectional view showing the interlayer connection of a coil plate according to an embodiment of the present disclosure.

[0033] Figure 9 This is a block diagram of an induction heating device according to an embodiment of the present disclosure. Detailed Implementation

[0034] The terminology used herein will be briefly described, followed by a detailed description of embodiments of this disclosure.

[0035] Although the terms used herein have been selected from commonly used terms that are currently widely used in consideration of their function in the embodiments of this disclosure, these terms may vary depending on the intent of those skilled in the art, precedent, or the emergence of new technologies. Furthermore, in certain cases, these terms are arbitrarily chosen by the applicant of this disclosure, in which case the meaning of these terms will be described in detail in the corresponding description of the embodiments of this disclosure. Therefore, the terminology used herein is not merely a designation of terms, but is defined based on the meaning of the terms and the content of this disclosure as a whole.

[0036] As used herein, the expression "at least one of a, b, or c" may indicate only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0037] Throughout this disclosure, when a component “includes” an element, it should be understood that, unless otherwise stated otherwise, the component may additionally include other elements rather than exclude them. Furthermore, as used herein, terms such as “...device,” “...unit,” “...module,” etc., denote a unit that performs at least one function or operation, which may be implemented as hardware or software or a combination thereof.

[0038] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings to enable those skilled in the art to readily implement the embodiments. However, embodiments of the present disclosure may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. Furthermore, portions in the drawings that are not relevant to the detailed description have been omitted to ensure clarity of the embodiments of the present disclosure, and similar reference numerals in the drawings denote similar elements.

[0039] Induction heating devices induce a magnetic field in a heating coil to heat a cooking container, and the induced magnetic field causes eddy currents to flow within the cooking container, thereby heating it. Here, when the heating coil is fabricated as a printed circuit board (PCB), assembly becomes easier, and the durability of the induction heating device increases. However, when the heating coil is printed on the board (PCB), a large current flows through the heating coil, which can cause the board to overheat, and proper insulation design is also required when multiple heating coil pattern layers are formed.

[0040] Therefore, according to embodiments of this disclosure, an induction heating device is disclosed, which includes a heating coil plate comprising a plurality of heating coil pattern layers. In this disclosure, the plate may include a PCB on which patterned circuitry is printed. In the case of multiple heating coil pattern layers stacked, an insulating layer may be disposed between them.

[0041] Induction heating devices of related technologies generate eddy currents on the surface of the object to be heated by flowing current through a heating coil formed on a printed circuit board, thereby inductively heating the object. In this type of induction heating device, it is necessary to flow high-frequency current through the printed heating coil to improve heating efficiency or to miniaturize the coil.

[0042] However, when a high-frequency current flows through the coil, the magnetic flux is concentrated inside or outside the coil, which causes a proximity effect, thereby increasing the AC resistance and thus increasing the losses inside or outside the coil, and increasing the heat generated due to the losses.

[0043] Furthermore, because printed heating coils are less able to dissipate heat than wound heating coils, there is a risk that the inner diameter side may malfunction due to overheating when heat is generated inward due to high-frequency current.

[0044] This phenomenon can also occur when high-frequency current flows through electromagnetic induction coils used for non-contact power supply.

[0045] In the following description, an electromagnetic induction coil according to an embodiment of the present disclosure will be described with reference to the accompanying drawings.

[0046] The induction heating device 2000 according to this embodiment induction heats an object to be heated (a cooking utensil, such as a cooking pot) placed on a top plate 1, and can be configured such that the object to be heated can be freely placed at any position on the top plate and then heated. An induction heating device that can heat an object to be heated regardless of where it is placed on the top plate is called an arbitrary position induction heating device.

[0047] Figure 1a This is a diagram illustrating an induction heating apparatus according to an embodiment of the present disclosure.

[0048] Reference Figure 1a The induction heating device 2000 according to embodiments of the present disclosure may include a plurality of heating zones 201, 202 and 203. Hereinafter, the induction heating device 2000 may be referred to as an induction heating device, an induction cooking device or simply a heating device. Figure 1a The components shown are not all necessary. The induction heating device 2000 can be implemented with more or fewer components than those shown.

[0049] The cooking container 101, which is the object to be heated, can be a device for heating the contents inside the cooking container 101. The contents of the cooking container 101 can be liquid (such as water, tea, coffee, soup, juice, wine, oil, etc.) or solid (such as butter, meat, vegetables, bread, rice, etc.), but are not limited thereto.

[0050] According to embodiments of this disclosure, the cooking container 101 can wirelessly receive power from the induction heating device 2000 via electromagnetic induction. Therefore, the cooking container 101 according to embodiments of this disclosure does not include a power cord that would be connected to a power outlet.

[0051] According to embodiments of this disclosure, the type of cooking container 101 that wirelessly receives power from the induction heating device 2000 can vary. The cooking container 101 can be a common induction heating (IH) container (hereinafter referred to as an "IH container") comprising magnetic materials. A magnetic field can be induced within the cooking container 101 (IH metal) itself.

[0052] Cooking container 101 can be a general IH container, such as a pot, frying pan, or steamer. Cooking container 101 may include a cooking appliance. The cooking appliance may be a device that can be inserted into or removed from a typical IH container. According to embodiments of this disclosure, the cooking appliance may be an appliance capable of automatically cooking the contents according to a recipe. Depending on its intended use, the cooking appliance may be referred to as a pot, rice cooker, or steamer. For example, a cooking appliance with an inner pot for cooking rice may be referred to as a rice cooker. Hereinafter, the cooking appliance may be defined as a smart pot.

[0053] According to embodiments of this disclosure, when the cooking container 101 includes a communication interface, the cooking container 101 can communicate with the induction heating device 2000. The communication interface may include a short-range wireless communication interface, a long-range communication interface, etc. The short-range wireless communication interface may include, but is not limited to, Bluetooth communication units, Bluetooth Low Energy (BLE) communication units, Near Field Communication (NFC) units, Wireless Local Area Network (WLAN) (e.g., Wi-Fi) communication units, Zigbee communication units, Infrared Data Association (IrDA) communication units, Wi-Fi Direct (WFD) communication units, Ultra Wideband (UWB) communication units, Ant+ communication units, etc. In an Internet of Things (IoT) environment where the cooking container 101 is remotely controlled by a server (not shown), the long-range communication interface can be used to communicate with the server. The long-range communication interface may include a network, a computer network (e.g., a Local Area Network (LAN) or a Wide Area Network (WAN)), and a mobile communication unit. Mobile communication units may include, but are not limited to, third-generation (3G) modules, fourth-generation (4G) modules, fifth-generation (5G) modules, long-term evolution (LTE) modules, narrowband IoT (NB-IoT) modules, and LTE (LTE-M) modules for machines.

[0054] According to embodiments of this disclosure, the cooking container 101 can transmit information to a server (not shown) via the induction heating device 2000. For example, the cooking container 101 can transmit information obtained from the cooking container 101 (e.g., temperature information of the contents) to the induction heating device 2000 via short-range wireless communication (e.g., Bluetooth or BLE). Here, the induction heating device 2000 can connect to the server using a WLAN (Wi-Fi) communication unit or a long-range communication unit (e.g., the Internet) to transmit information obtained from the cooking container 101 to the server. Furthermore, the server can provide the user with the information received from the cooking container 101 from the induction heating device 2000 via a mobile terminal (not shown) connected to the server. According to embodiments of this disclosure, the induction heating device 2000 can directly transmit information obtained from the cooking container 101 to the user's mobile terminal via device-to-device (D2D) communication (e.g., WFD communication or BLE communication).

[0055] Furthermore, according to embodiments of this disclosure, the cooking container 101 can directly transmit information from the cooking container 101 (e.g., temperature information of the contents) to a server via a communication interface (e.g., a WLAN (Wi-Fi) communication unit). Additionally, the cooking container 101 can directly transmit information obtained from the cooking container 101 (e.g., temperature information of the contents or material information of the cooking container) to a user's mobile device via short-range wireless communication (e.g., Bluetooth or BLE) or D2D communication. In embodiments, the cooking container 101 can directly transmit information obtained from the cooking container 101 (e.g., temperature information of the contents or material information of the cooking container) to the controller (not shown) of the induction heating device 2000 via short-range wireless communication (e.g., Bluetooth or BLE) or D2D communication.

[0056] The induction heating device 2000 according to an embodiment of the present disclosure may be a device that wirelessly transmits electricity to a cooking container 101 located on a top plate 1 of the induction heating device 2000 by means of electromagnetic induction. The induction heating device 2000 may include a working coil that generates a magnetic field for inductively heating the cooking container 101. The working coil is a coil for generating a magnetic field by the flow of electricity and may also be referred to as a heating coil throughout the disclosure.

[0057] The operation of generating a magnetic field through a heating coil may include transmitting electricity by using a magnetic induction method, by using a magnetic field induced in an IH metal (e.g., iron). For example, the induction heating device 2000 may generate eddy currents in the cooking container 101 by causing an electric current to flow through the heating coil to form a magnetic field.

[0058] According to embodiments of this disclosure, the induction heating device 2000 may include a plurality of heating coils. For example, if the top plate 1 of the induction heating device 2000 includes a plurality of cooking zones, the induction heating device 2000 may include a plurality of heating coils corresponding to each of the plurality of cooking zones. Furthermore, the induction heating device 2000 may include a high-power cooking zone having a first heating coil disposed on an inner side and a second heating coil disposed on an outer side. The high-power cooking zone may include two or more heating coils.

[0059] The top plate 1 of the induction heating device 2000 according to an embodiment of the present disclosure may be made of tempered glass (such as ceramic glass) so that it is not easily broken. In addition, the top plate 1 of the induction heating device 2000 may include guide marks for guiding the cooking area that the cooking container 101 needs to be located in.

[0060] According to an embodiment of the present disclosure, the induction heating device 2000 can detect whether a cooking container 101, including a magnet, is placed on the top plate 1. For example, the induction heating device 2000 can detect that the cooking container 101 is located on the top plate 1 of the induction heating device 2000 based on the change in the current value (inductance) of the heating coil caused by the proximity of the cooking container 101.

[0061] According to embodiments of this disclosure, the induction heating device 2000 may include a communication interface for communicating with external devices. For example, the induction heating device 2000 may communicate with the cooking container 101, a user's mobile device, or a server via the communication interface. The communication interface may include a short-range communication unit (e.g., an NFC communication unit, a Bluetooth communication unit, a BLE communication unit, etc.), a mobile communication unit, etc.

[0062] According to embodiments of this disclosure, the induction heating device 2000 can detect the cooking container 101 located on the top plate 1 via a communication interface. For example, the induction heating device 2000 can detect the cooking container 101 by receiving data packets sent from the cooking container 101 located on the top plate 1 using short-range wireless communication (e.g., BLE mesh network or Bluetooth).

[0063] According to embodiments of this disclosure, even if the cooking container 101 does not include a communication interface, the induction heating device 2000 can detect whether the cooking container 101 is placed on the top plate 1 of the induction heating device 2000 by means of a container detection coil (container detection sensor).

[0064] According to embodiments of this disclosure, the induction heating device 2000 can display information related to the cooking container 101 through a user interface. For example, when the cooking container 101 is detected, the induction heating device 2000 can display identification information and location information of the cooking container 101 on a display 2411 included in the user interface.

[0065] Reference Figure 1a When a user places a cooking container 101 (e.g., a pot) on the top plate 1 of the induction heating device 2000, the induction heating device 2000 can provide the user with identification information of the cooking container 101 (e.g., "pot") and location information of the cooking container 101 (e.g., "located in the left rear heating area") as an output interface on the display 2411.

[0066] Figure 1b This is a diagram illustrating an induction heating device at any position according to an embodiment of the present disclosure.

[0067] like Figure 1bAs shown, the induction heating device 2000 includes: a top plate 1 on which the object to be heated is placed; a plurality of heating coils 2 for heating the object to be heated; an inverter circuit 3 for supplying alternating current to the heating coils 2; and a controller 4 for controlling the inverter circuit 3.

[0068] The top plate 1 has a flat surface on its outer surface, the object to be heated is placed on the flat surface, and the top plate 1 may be made of an electrically insulating material such as glass or ceramic.

[0069] Heating coil 2 is arranged on the back (lower side) of top plate 1. For example... Figure 1b As shown, multiple heating coils 2 can be arranged to form a two-dimensional array (vertical and horizontal matrix). When current flows through the heating coils 2, a magnetic flux pointing towards the top plate 1 is generated, and eddy currents are generated on the surface of the object to be heated placed on the top plate 1, so that the object to be heated is inductively heated.

[0070] The plurality of heating coils 2 are thin, sheet-like coils disposed on a plate; more specifically, they are the result of printing copper foil on a printed circuit board (coil board 20) made of photoresist or the like. Here, each of the plurality of heating coils 2 is shown to have the same shape and size, but the shape and size of each of the plurality of heating coils 2 may be appropriately varied. Furthermore, the detailed configuration of the coil board 20 will be described below.

[0071] Inverter circuit 3 is a circuit that converts the AC voltage supplied from the power source into a drive frequency and outputs the drive frequency to multiple heating coils 2. Inverter circuit 3 is a full-bridge type using switching elements, but it can also be a half-bridge type. Inverter circuit 3 can be an insulated-gate bipolar transistor (IGBT) or a field-effect transistor (FET), but is not limited to these.

[0072] The controller 4 includes a central processing unit (CPU), memory, input unit, etc., and functionally, the CPU or its peripheral devices can cooperate to control the inverter circuit 3 according to the program stored in the memory.

[0073] Figure 1c This is a diagram illustrating a heating coil in an induction heating device at any position according to an embodiment of the present disclosure.

[0074] Reference Figure 1c The heating coil 2 of the induction heating device 2000 is made of twisted wire wound into a circle and is densely arranged below the top plate 1 of the induction heating device 2000, so that there is no lack of heating no matter where the cooking container 101 is placed. Figure 1c The induction heating device 2000 shown is an induction heating device at any of the aforementioned locations. Figure 1cIn the induction heating device shown, the heating coils 2 are arranged in such a way that there are no dead zones between the plurality of heating coils. Furthermore, at least one container detection coil may also be arranged at the location where the heating coils 2 are placed. In an exemplary embodiment, the container detection coil is arranged as close as possible to the top plate 1, and therefore may be arranged on the uppermost of the plurality of patterned layers included in the coil plate 20. In embodiments of this disclosure, a temperature sensor 2600 for sensing the temperature of the cooking container 101 may be arranged at the center of the heating coils 2. According to embodiments of this disclosure, the temperature sensor 2600 may be arranged in a hole perpendicularly penetrating the coil plate 20 on which the heating coils 2 are printed.

[0075] Figure 1d This is a circuit diagram of an induction heating device including an inverter circuit for operating multiple heating coils, according to an embodiment of the present disclosure. (Refer to...) Figure 1d The input power supply 2211 is an AC power supply. The AC voltage from the input power supply 2211 can be supplied to the rectifier circuit 2112 via an electromagnetic interference (EMI) filter 2111. Multiple diodes can be used to form the rectifier circuit 2112 as elements for converting the AC voltage to a DC voltage. In the illustrated embodiment, diodes are used as elements of the rectifier circuit 2112, but other types of switching elements capable of switching control (such as thyristors or IGBTs) can also be used. When the AC voltage is converted to DC voltage by the rectifier circuit 2112, the DC voltage can be smoothed using DC link capacitors 2117_1 and 2117_2.

[0076] Figure 1d Two resonant circuits are shown assuming two heating coils, 2_1 and 2_2. However, in the case of three heating regions and therefore requiring three heating coils, additional resonant circuits can be added. Furthermore, according to... Figure 1d The circuit can be applied to situations where there are multiple heating coils (e.g., three or more heating coils).

[0077] The DC voltage, smoothed by DC link capacitor 2117_1, is switched by two switching elements SW1 2113_1 and SW2 2113_2. Due to the resonance between the first heating coil 2_1 and resonant capacitors 1 2114_1 and 2 2114_2, a magnetic field is generated in the first heating coil 2_1. The magnetic field generated in the first heating coil 2_1 induces eddy currents in the cooking container placed on the first heating coil 2_1, thereby heating the contents of the cooking container. CT1 2115_1 is a current sensor used to detect the current flowing through the first heating coil 2_1.

[0078] Similarly, the DC voltage smoothed by the DC link capacitor 2117_2, through the switching operation of the two switching elements SW3 2113_3 and SW4 2113_4, generates a magnetic field in the second heating coil 2_2 due to the resonance between the second heating coil 2_2 and the resonant capacitors 3 2114_3 and 4 2114_4. The magnetic field generated in the second heating coil 2_2 induces eddy currents in the cooking container placed on the second heating coil 2_2, thereby heating the contents of the cooking container. CT22115_2 is a current sensor used to detect the current flowing through the second heating coil 2_2.

[0079] Figure 2 This is a diagram illustrating a stacked structure of a coil board according to an embodiment of the present disclosure.

[0080] like Figure 2 As shown, the coil board 20 includes an input terminal 21 for receiving AC power from the inverter circuit 3, an output terminal 22 connected to a resonant capacitor, and a current path pattern L of multiple lines connected to the input terminal 21 and the output terminal 22.

[0081] like Figure 2 and Figure 3 As shown, the coil board 20 is a printed circuit board formed by stacking multiple patterned layers (here, four layers) on which the coil pattern CP is formed. This is just an example, and more patterned layers can be used. Figure 2 As shown, the heating coil 2 may include a plurality of coil patterns CP formed to overlap each other on the coaxial axis. Furthermore, according to embodiments of this disclosure, the coil patterns CP do not need to all overlap each other on the coaxial axis, but may be stacked on top of each other in an offset manner.

[0082] In addition, each pattern layer can be insulated by an insulating material disposed between the layers, and each pattern layer can be electrically connected by conductors 23a and 23b (through holes) disposed inside and / or outside the coil pattern CP.

[0083] In this disclosure, the multiple stacked pattern layers will be referred to sequentially as the first layer, the second layer, the third layer, and the fourth layer, starting from the top plate 1.

[0084] According to embodiments of this disclosure, such as Figure 2 As shown, four pattern layers are connected sequentially from the first layer to the fourth layer. The input terminal 21 is located on the outside of the first layer coil pattern CP, and the output terminal 22 is located on the outside of the fourth layer coil pattern CP.

[0085] The pattern layers are divided into two types: the first pattern layer PL1 and the second pattern layer PL2.

[0086] The first pattern layer PL1 is connected to another pattern layer inside the coil pattern CP. The second pattern layer PL2 is connected to another pattern layer outside the coil pattern CP.

[0087] According to embodiments of the present disclosure, the first and third layers are configured as a first pattern layer PL1, and the second and fourth layers are configured as a second pattern layer PL2.

[0088] The first (third) layer coil pattern CP, which is the first pattern layer PL1, and the second (fourth) layer coil pattern CP, which is the second pattern layer PL2 connected to the output terminal of the first (third) layer, can be connected in series by a conductor 23a formed inside each coil pattern CP. According to an embodiment of the present disclosure, the conductor 23a may include a through-hole or via, which, when included in a printed circuit board, vertically penetrates at least one of the plurality of pattern layers.

[0089] Furthermore, the second coil pattern CP, which is the second pattern layer PL2, and the third coil pattern CP, which is the first pattern layer PL1 connected to the second layer output terminal, are connected in series by a conductor 23b formed on the outside of each coil pattern CP. According to embodiments of this disclosure, the conductor 23b may be a through-hole or via included in the printed circuit board.

[0090] like Figure 2 As shown, in the current path pattern L, the coil patterns CP of each pattern layer can be connected in series via conductor 23. Furthermore, in Figure 2 In this context, the current path pattern L of multiple lines can be integrated into a single line, but is not limited to this. In other words, the current path pattern L can be multiple lines.

[0091] Figure 3 This is a plan view illustrating the construction of a coil plate according to an embodiment of the present disclosure.

[0092] like Figure 3 As shown, the coil pattern CP can be formed into multiple parallel lines in each pattern layer. The coil pattern CP according to embodiments of this disclosure can have a helical shape. Multiple helical shapes can surround a common center without overlapping each other. Furthermore, as... Figure 2 As shown, the coil pattern CP can be formed with a plurality of coil elements that form a generally rectangular shape when viewed from above, or it can be formed with a plurality of coil elements that form a circle when viewed from above, and the shape of the coil elements is not limited thereto.

[0093] The coil pattern CP according to an embodiment of the present disclosure has 7 turns, but the number of turns can be appropriately changed according to the specifications of the induction heating device 2000.

[0094] According to embodiments of this disclosure, such as Figure 3 and Figure 4 As shown, the current path pattern L may branch partially or entirely from the point between the input terminal 21 and the output terminal 22, and merge at a specific point (merging point 25) between the branch point 24 and the output terminal 22. Furthermore, in the entire current path pattern L, the path from the branch point 24 to the merging point 25 is referred to as the branch path, and the other paths are referred to as the merging path.

[0095] According to embodiments of this disclosure, branch point 24 may be disposed in the first of the four patterned layers (first patterned layer PL1) of the coil board 20, and junction point 25 may be disposed in the fourth layer (second patterned layer PL2). The branch point 24, junction point 25, branch path, and junction path will be described in detail below.

[0096] According to embodiments of this disclosure, the branch point 24 and the confluence point 25 may be located in the middle portion between the interior and exterior of the coil pattern CP in the first layer (first pattern layer PL1) or the fourth layer (second pattern layer PL2), respectively. This is merely an example, and the branch point 24 and the confluence point 25 may be arranged in different pattern layers.

[0097] Here, the middle portion refers to the middle part of the spiral shape of the coil pattern CP of the pattern layer, and can be, for example, any of the turns of the coil pattern CP except for the innermost or outermost turn. For example, if the coil pattern CP has 10 turns, the middle portion can be the fourth to sixth turns from the outside. Furthermore, the positions of the middle portions of the first pattern layer PL1 and the second pattern layer PL2 can be different from each other.

[0098] like Figure 3 and Figure 4 As shown, in the current path pattern L, which is a coil pattern according to an embodiment of the present disclosure, five parallel branch paths 1a, 1b, ..., 1e are formed at the input terminal 21. Each branch path is branched into two paths at a branch point 24, such that a total of ten branch paths 1a1, 1a2, 1b1, 1b2, ..., 1e2 are arranged in parallel. Figure 4 In the diagram, the 3rd, 4th, and 5th current path patterns L (1c, 1d, 1e) are omitted.

[0099] According to embodiments of this disclosure, the merging path and the branching path are set on the first layer as the top layer and the fourth layer as the bottom layer, but the branching path can be set on the second and third layers as intermediate layers. However, this is merely an example, and the merging path can also be set on the second and third layers.

[0100] As mentioned above, the total number of turns of the coil pattern CP in each pattern layer is 7. Figure 4In each current path pattern L (1a, 1b, etc.), the number after the hyphen (-) indicates the cumulative number of turns of the coil pattern CP, starting from the input terminal 21 side.

[0101] In one embodiment, the branch point 24 is located between the third and fourth turns starting from the outer periphery of the coil pattern CP of the first layer (first pattern layer PL1), and the confluence point 25 is located between the third and fourth turns starting from the outer periphery of the coil pattern CP of the fourth layer (second pattern layer).

[0102] Each of the two branch paths provided between a branch point 24 and a confluence point 25 may include a branch coil. The lengths of the branch paths are equal or approximately equal to each other within a certain length range. Specifically, the equal lengths of the branch paths may mean that the difference between the lengths of the two branch paths is 5% or less. Furthermore, when supplying a high-frequency current of 50 kHz or higher to the heating coil 2, the difference between the lengths of the two branch paths may be 1% or less. Although Figure 3 and Figure 4 The illustration shows a coil pattern branching into two branch paths, but the construction of the branch paths according to embodiments of this disclosure is not limited thereto. According to embodiments of this disclosure, the number of branch paths from a single coil pattern branch can be three or more. For example, there can be three or four branch paths from a single coil pattern branch. Therefore, in the case where the number of branch paths is four, four branch paths are formed.

[0103] According to embodiments of this disclosure, in order to ensure that the lengths of the branch paths are equal, the arrangement of each branch path in each of the plurality of stacked pattern layers can be different from each other. Specifically, the arrangement order of the branch paths can be reversed in the first pattern layer PL1 and the second pattern layer PL2. For example, in the first pattern layer PL1, if the branch paths are arranged from the outside of the coil pattern CP in the order of 1a1, 1a2, 1b1, 1b2, ..., 1e2, the branch paths in the second pattern layer PL2 can be arranged from the outside of the coil pattern CP in the order of 1e2, 1e1, 1d2, 1d1, ..., 1a1.

[0104] Furthermore, according to embodiments of this disclosure, the adjustment path 26 for adjusting the length of the current path pattern L may be included inside the coil pattern CP. According to embodiments of this disclosure, the adjustment path may also be included outside the coil pattern CP. See also... Figure 3 Adjustment paths (261, 262) can be used to extend the length of one of two branch paths so that the lengths of each of the two branch paths are equal or substantially equal. The pattern of adjustment path (26) can be used in different ways to extend the length of at least one of the branch paths.

[0105] In an exemplary embodiment, the width of the branch path is less than the width of the coil pattern to which the branch path merges. Specifically, according to embodiments of this disclosure, the sum of the widths of multiple branch paths branching from a coil pattern may be equal to, but is not limited to, the width of a coil pattern before (or after) the branching. Specifically, the equality of widths may indicate that the difference between the sum of the widths of the multiple branch paths and the width of the coil pattern after merging is approximately ±1%.

[0106] According to an embodiment of the induction heating device 2000 of the present disclosure, the coil pattern can be branched in parallel to reduce the current flowing in the portion of the coil pattern CP where the AC resistance increases, thereby reducing coil losses and preventing the generation of heat biased toward the corresponding coil pattern when the coil pattern is not branched.

[0107] Without branch paths, the proximity effect can be significant, potentially increasing the AC resistance within the coil pattern. Furthermore, since the branch paths are positioned within the coil pattern where heat tends to accumulate, internal overheating can be suppressed, and the loss reduction effect introduced by the branch paths can also be enhanced.

[0108] In the heating coil 2 according to an embodiment of the present disclosure, multiple coil patterns may overlap each other on the same axis, and since the heating coil patterns overlap each other, the magnetic flux density inside or outside the coil patterns becomes higher. Therefore, losses can be reduced or overheating can be suppressed by branching paths as described above.

[0109] Furthermore, since the branch paths are located in the intermediate layers (third and fourth layers) of the multiple stacked patterned layers, where heat is more likely to accumulate than the topmost (first) and bottommost (fourth) layers, overheating of the intermediate layers can be suppressed. Therefore, according to embodiments of this disclosure, in the multiple patterned layers, a patterned layer including at least a portion of the coil pattern with parallel branches at branch point 24 can be a patterned layer other than the topmost and bottommost layers.

[0110] According to embodiments of this disclosure, branch point 24 is disposed in the first pattern layer PL1 (first layer), and confluence point 25 is disposed in the second pattern layer PL2 (fourth layer), which is arranged closer to the output terminal 22 than the first layer. Therefore, the branch path can be configured to be biased towards the interior of the coil pattern CP. When the branch path is disposed internally, the current flowing in the interior, which tends to accumulate heat due to proximity effects, can be reduced, and thus losses can be effectively reduced while suppressing internal overheating. Furthermore, by achieving thermal balance between the interior, where heat easily accumulates, and the exterior, where heat is less likely to accumulate, the lifespan of the heating coil can be extended.

[0111] Furthermore, since the lengths of the branch paths branching from a single branch point 24 are equal, the impedances of each branch path can be aligned.

[0112] Since the width of the branch path is smaller than the width of the merging path, coil losses due to the skin effect can be reduced, and localized heating of the corresponding part can be prevented when there is no branch path.

[0113] In the above example, the current path pattern L branches in the first pattern layer and merges in the second pattern layer, but the embodiments of this disclosure are not limited thereto. The current path pattern L may branch in the second pattern layer or may merge in the first pattern layer. It is sufficient as long as the current path pattern L branches in the portion with high AC resistance, such that the current flowing in the branch path is reduced.

[0114] The coil plate 20 according to an embodiment of the present disclosure is formed by stacking four patterned layers, but as Figure 5 As shown, the number of stacked pattern layers can be two, and it is sufficient to have two or more stacked pattern layers.

[0115] In the example above, the intermediate layers (the second and third layers) without branch points 24 and convergence points 25 are arranged between the first layer (the first pattern layer PL1) with branch points 24 and the fourth layer (the second pattern layer PL2) with convergence points 25, but these intermediate layers may also be composed of multiple pattern layers.

[0116] Furthermore, when stacking three or more pattern layers, one or more pattern layers can be positioned closer to the input terminal than the first pattern layer PL1 with branch point 24, or closer to the output terminal than the second pattern layer PL2 with confluence point 25. Therefore, according to embodiments of this disclosure, pattern layers without branch paths can be stacked. When branch paths are provided in any of the multiple stacked pattern layers, coil losses can be reduced.

[0117] According to embodiments of this disclosure, the branch paths are located inside the coil pattern CP, but may also be located outside. The magnetic flux is also concentrated outside the heating coil, and because the AC resistance increases due to proximity, reducing the current flow by branching the current path pattern L in parallel outside the coil pattern CP reduces coil losses and prevents the corresponding portions from generating heat in a biased manner.

[0118] The current path pattern L according to an embodiment of the present disclosure is designed to have five converging paths and ten branching paths, but the number of paths connected to the input terminal 21 and the output terminal 22, as well as the number of branching paths branching at the branch point 24, can be suitably varied. Specifically, the current path pattern L may branch into three or more paths at the branch point 24.

[0119] According to embodiments of this disclosure, multiple current path patterns L branch simultaneously in the middle portion of the same pattern layer and converge simultaneously in another pattern layer. However, the current paths may branch or converge independently of each other. For example, the current paths may branch or connect in different pattern layers. When the current path pattern L branches at a point of high AC resistance on the coil plate 20, coil losses can be suppressed while preventing a portion of the coil from generating heat due to bias.

[0120] According to embodiments of this disclosure, each current path pattern L branches and merges once between the input terminal 21 and the output terminal 22, but the branching and merging can be repeated multiple times between the input terminal 21 and the output terminal 22. For example, as Figure 6 As shown, the current path pattern L can branch and merge twice, such that it branches in the middle of the first layer (first pattern layer PL1), merges in the middle of the second layer (second pattern layer PL2), branches again in the middle of the third layer (first pattern layer PL1), and merges again in the fourth layer (second pattern layer PL2). This is merely an example, and the current path pattern L can branch and merge multiple times. According to embodiments of this disclosure, at least a portion of the coil pattern can branch in parallel at multiple branch points located between the input terminal 21 and the output terminal 22, with the number of branches being as many as the number of branch points. Furthermore, at least a portion of the coil pattern can merge at multiple merging points located between the input terminal 21 and the output terminal 22, with the number of merging points being as many as the number of merging points.

[0121] For example, in the case of stacking four or more patterned layers and the current path pattern L being configured to branch in each first patterned layer PL1 and then converge in the second patterned layer PL2 on the output terminal 22 side (bottom side), the branching paths can be set inside the coil pattern CP of each patterned layer. In this way, the current flowing through the interior can be significantly reduced to reduce losses, thereby balancing the interior where heat is more easily accumulated with the exterior where heat is less easily accumulated, and thus extending the coil's lifespan.

[0122] Furthermore, the current path mode L, which has already branched once, can branch again. This is in Figure 7 As shown in the image.

[0123] Figure 7 This is a diagram illustrating a variant example of the wiring of a coil board including multiple branches and junctions according to an embodiment of the present disclosure.

[0124] According to embodiments of this disclosure, for example, in the case of stacking four or more patterned layers, the middle patterned layers (the second and third layers) may be more susceptible to heat generation than the topmost (first layer) or bottommost (fourth layer). Therefore, for example, the current path pattern L may first branch at a first branch point 24_1 in the first layer of the four patterned layers, and then branch again at a second branch point 24_2 in the second layer. Furthermore, the current path pattern L may first converge at a first confluence point 25_1 in the third layer of the four patterned layers, and then converge again at a second confluence point 25_2 in the fourth layer. Figure 7 The current path pattern L is shown branching and merging twice, but this is only an embodiment of this disclosure, and the current path pattern L may branch and merge two or more times. Furthermore, Figure 7 The diagram shows multiple pattern layers, including four layers, but the number of layers can be four or more.

[0125] According to an embodiment of the present disclosure, the input terminal 21 is disposed in the first layer on the side of the top plate 1, and the output terminal 22 is disposed in the fourth layer, which is the lowest layer, but the arrangement of the input terminal 21 and the output terminal 22 can be reversed.

[0126] According to embodiments of this disclosure, four pattern layers are connected from the first layer to the fourth layer in a sequence close to the top plate 1, but the connection order of each pattern layer can be appropriately changed. Specifically, the pattern layers can be connected between the input terminal 21 and the output terminal 22 in the order of first layer → second layer → third layer → fourth layer. In this case, the first and third layers are the first pattern layer PL1, and the second and fourth layers are the second pattern layer PL2.

[0127] The coil board according to embodiments of this disclosure can be used in contactless power supply devices.

[0128] Figure 8 This is a cross-sectional view showing the interlayer connection of a coil plate according to an embodiment of the present disclosure.

[0129] Figure 8 This is a cross-sectional view showing the interlayer connections in an eight-layer coil plate 20 according to an embodiment of the present disclosure. (Refer to...) Figure 8 The coil board 20 can be a PCB formed by stacking four or more patterned layers PL with coil patterns CP. Insulating layers with two or more prepreg insulating layers can be arranged between the patterned layers.

[0130] Figure 8A coil board 20, formed according to an embodiment of the present disclosure, is shown by stacking multiple patterned layers comprising eight layers (first to eighth layers). According to an embodiment of the present disclosure, the coil board 20 includes coil patterns 11, 12, 13, and 14 in four layers and coil patterns 15, 16, 17, and 18 in four layers. In an embodiment of the present disclosure, the coil patterns 11, 12, 13, and 14 in the four layers may each have four coil patterns CP connected in series. The coil patterns 11, 12, 13, and 14 in the four layers may be connected to each other via a through-hole 2c or a via.

[0131] exist Figure 8 In the example, assume that multiple pattern layers 11, 12, ..., 18 are, starting from the top, the first layer coil pattern 11, the second layer coil pattern 12, the third layer coil pattern 13, the fourth layer coil pattern 14, the fifth layer coil pattern 15, the sixth layer coil pattern 16, the seventh layer coil pattern 17, and the eighth layer coil pattern 18.

[0132] like Figure 8 As shown, the first layer coil pattern 11 can be connected in series with the eighth layer coil pattern 18 formed on the eighth layer through the through hole 2d. The second layer coil pattern 12 can be connected in series with the seventh layer coil pattern 17 formed on the seventh layer through the through hole 2d. The third layer coil pattern 13 can be connected in series with the sixth layer coil pattern 16 through the through hole 2d. The fourth layer coil pattern 14 can be connected in series with the fifth layer coil pattern 15 through the through hole 2d.

[0133] therefore, Figure 8 The multiple upper pattern layers 11, 12, 13, and 14 shown have different combinations of pattern layers connected in series. When the four pattern layers 11, 12, 13, and 14 are connected via through-hole 2c, the coil patterns CP formed on different pattern layers can be connected in parallel.

[0134] Furthermore, in the coil board 20 according to an embodiment of the present disclosure, the coil pattern CP can be connected such that the input terminal 21 is located in the uppermost layer of the plurality of pattern layers, and the output terminal 22 is located in the lowermost layer of the plurality of pattern layers. According to this configuration, when a low-power sensor is disposed in the upper layer during the formation of the plurality of pattern layers, it is easy to form the low-power sensor in a thin-film structure. The low-power sensor may include a container detection coil. The multilayer structure of the coil board 20 is not limited to the eight-layer structure described above, and the number of layers in the multilayer structure may be fewer or more.

[0135] Figure 9 This is a block diagram of an induction heating device according to an embodiment of the present disclosure.

[0136] like Figure 9As shown, the induction heating device 2000 according to an embodiment of the present disclosure may include a controller 4, an inverter unit 30, a top plate 1, and a coil plate 20.

[0137] In the induction heating device 2000 according to an embodiment of the present disclosure, the top plate 1 is a plate on which a cooking container 101 is placed, and is typically made of heat-resistant tempered glass. The top plate 1 may include a user interface 2400. The user interface 2400 may include an output interface 2410 (such as a display) and an input interface 2420 (such as touch buttons). In embodiments of the present disclosure, the actual operation of the output interface 2410 (such as a display) and the input interface 2420 (such as touch buttons) may be performed under the control of a processor 2200, which will be described below.

[0138] The output interface 2410 is used to output audio or video signals and may include a display, an audio output unit, etc.

[0139] In the case where the display and touchpad form a layered structure to create a touchscreen, the display can function as both an output interface 2410 and an input interface 2420. The display may include at least one of a liquid crystal display (LCD), a thin-film transistor liquid crystal display (TFT-LCD), a light-emitting diode (LED) display, an organic LED display, a flexible display, a three-dimensional (3D) display, or an electrophoretic display. Furthermore, depending on the design, the induction heating device 2000 may include two or more displays.

[0140] The audio output unit can output audio data received from the communication interface 2300 or stored in the memory 2500. Furthermore, the audio output unit can output audio signals related to the functions performed by the induction heating device 2000. The audio output unit may include a speaker, a buzzer, etc.

[0141] According to embodiments of this disclosure, the output interface 2410 can display information about the cooking container 101. For example, the output interface 2410 can output a graphical user interface (GUI) corresponding to the identification information or product type information of the cooking container 101. Furthermore, the output interface 2410 can output information about the current location of the cooking container 101 or the materials of the cooking container 101.

[0142] Input interface 2420 is used to receive input from a user. Input interface 2420 may be, but is not limited to, at least one of a keyboard, dome switch, touchpad (e.g., a capacitive touchpad, a pressure-resistive overlay touchpad, an infrared sensor touchpad, a surface acoustic wave conduction touchpad, an integrated tension measurement touchpad, a piezoelectric effect touchpad), scroll wheel, or scroll wheel switch.

[0143] Input interface 2420 may include a speech recognition module. For example, induction heating device 2000 may receive a speech signal as an analog signal via a microphone and convert the speech portion into computer-readable text using an Automatic Speech Recognition (ASR) model. Induction heating device 2000 may interpret the text using a Natural Language Understanding (NLU) model to obtain the user's utterance intent. Here, the ASR model or NLU model may be an artificial intelligence model. The artificial intelligence model may be processed by a dedicated artificial intelligence processor designed with a hardware architecture specifically for processing artificial intelligence models. The artificial intelligence model may be generated via a training process. Here, generating via a training process may mean generating a predefined operating rule or artificial intelligence model set to perform a desired characteristic (or purpose) by training a basic artificial intelligence model using a learning algorithm utilizing a large amount of training data. The artificial intelligence model may include multiple neural network layers. Each of the neural network layers has multiple weight values ​​and performs neural network arithmetic operations via arithmetic operations between the arithmetic operation result of the previous layer and the multiple weight values.

[0144] Language understanding is a technology used to recognize and apply / process human language / characters, and includes natural language processing, machine translation, dialogue systems, question answering, speech recognition / synthesis, etc.

[0145] In the induction heating device 2000 according to an embodiment of the present disclosure, the coil board 20 may include multiple patterned layers, such as a first layer coil pattern 11, a second layer coil pattern 12, ..., an nth layer coil pattern 19 (n is a natural number greater than or equal to 2). The first layer coil pattern 11, the second layer coil pattern 12, ..., the nth layer coil pattern 19 may include heating coils printed and patterned on a PCB. The coil board 20 may have a structure that stacks the first layer coil pattern 11, the second layer coil pattern 12, ..., the nth layer coil pattern 19, thereby forming a plurality of heating coils 2.

[0146] Multiple heating coils 2 patterned on the coil plate 10 can generate a magnetic field for heating the cooking container 101. For example, when current is supplied to the multiple heating coils 2, a magnetic field can be induced around the multiple heating coils 2. When current (i.e., alternating current) of varying magnitude and direction over time is supplied to the multiple heating coils 2, a magnetic field of varying magnitude and direction over time can be induced around the multiple heating coils 2. The magnetic field around the multiple heating coils 2 can pass through the top plate 1 made of tempered glass and reach the cooking container 101 placed on the top plate 1. Due to the magnetic field of varying magnitude and direction over time, eddy currents rotating around the magnetic field can be generated in the cooking container 101, and resistance heat can be generated in the cooking container 101 due to the eddy currents. Resistance heat is the heat generated in a resistor when current flows through it, and is also known as Joule heat. The cooking container 101 is heated by resistance heat, and therefore, the contents of the cooking container 101 can be heated.

[0147] In the induction heating device 2000 according to an embodiment of the present disclosure, the coil plate 20 may further include a temperature sensor 2600. The temperature sensor 2600 can sense the temperature of the top plate 1 or the cooking container 101 placed on the top plate 1. The processor 2200 can determine whether the cooking container 101 is in a state of heat or overheating based on the temperature of the cooking container 101 sensed by the temperature sensor 2600. In an embodiment of the present disclosure, the temperature sensor 2600 may be disposed in a hole penetrating the coil plate 20.

[0148] The coil plate 20 of the induction heating device 2000 according to an embodiment of the present disclosure may further include a container detection coil layer 33. In an embodiment of the present disclosure, the container detection coil layer 33 may include a container detection coil. In an embodiment of the present disclosure, the container detection coil may be printed on a PCB in a patterned form as part of a first layer coil pattern 11. The processor 2200 of the induction heating device 2000 may detect whether the cooking container 101 is placed on the top plate 1 of the induction heating device 2000 by means of the container detection coil included in the container detection coil layer 33 or the first layer coil pattern 11.

[0149] Inverter unit 30 may include drive unit 2110. Drive unit 2110 may receive power from input power and supply current to multiple heating coils 2 according to drive control signals from processor 2200. Drive unit 2110 may include, but is not limited to, EMI filter 2111, rectifier circuit 2112, inverter circuit 3 and resonant capacitor 2114.

[0150] EMI filter 2111 filters out high-frequency noise included in the AC voltage supplied from the input power supply and allows AC voltage and current with a predetermined frequency (e.g., 50Hz or 60Hz) to pass through. A fuse and relay for preventing overcurrent can be provided between EMI filter 2111 and the input power supply. The AC voltage with high-frequency noise filtered out by EMI filter 2111 is supplied to rectifier circuit 2112.

[0151] Rectifier circuit 2112 converts alternating current (AC) voltage to direct current (DC) voltage. For example, rectifier circuit 2112 can convert an AC voltage whose magnitude and polarity (i.e., positive or negative voltage) varies over time into a DC voltage with a constant magnitude and polarity, and can convert an AC current whose magnitude and direction (i.e., positive or negative current) varies over time into a DC current with a polarity that does not change over time. Rectifier circuit 2112 may include diodes as rectification elements. For example, rectifier circuit 2112 may include four diodes. Diodes can convert AC voltages whose polarity varies over time into positive voltages with a constant polarity, and can convert AC currents whose direction varies over time into positive currents with a constant direction. Rectifier circuit 2112 may be connected to a DC link capacitor to smooth the rectified DC voltage.

[0152] The inverter circuit 3 may include a switching circuit for supplying or cutting off drive current to the plurality of heating coils 2. The inverter circuit 3 can cause the plurality of heating coils 2 to resonate with the resonant capacitor 2114 through the switching operation of the switching circuit. According to embodiments of this disclosure, in addition to the processor 2200, the induction heating device 2000 may also include a separate drive processor for generating drive control signals to be provided to the switching elements of the inverter circuit 3.

[0153] The inverter circuit 3 can control the current supplied to multiple heating coils 2.

[0154] In the induction heating device 2000 according to an embodiment of the present disclosure, the controller 4 may include, but is not limited to, a processor 2200, a communication interface 2300, and a memory 2500. Furthermore, components included in the controller 4 can be electrically connected to components included in the inverter unit 30, the top plate 1, and the coil plate 20 via connectors or the like.

[0155] The processor 2200 of the controller 4 can determine the switching frequency (i.e., on / off frequency) of the switching circuit included in the inverter circuit 3 based on the output intensity (i.e., power level) of the induction heating device 2000. The processor 2200 can generate drive control signals for turning the switching circuit on / off according to the determined switching frequency. The induction heating device 2000 may include a drive processor separate from the processor 2200 for controlling the operation of the drive unit 2110 including the inverter circuit 3 during the operation of the processor 2200. However, this is merely an example, and the operation of the drive processor may be replaced by the processor 2200.

[0156] Processor 2200 is a hardware device that controls the overall operation of induction heating device 2000. Processor 2200 may include one or more processors. According to embodiments of this disclosure, processor 2200 may be a hardware processing circuit including at least one of a CPU, graphics processing unit (GPU), accelerometer processing unit (APU), integrated many-core (MIC), digital signal processor (DSP), integrated circuit, or neural processing unit (NPU). Processor 2200 may be implemented as an integrated system-on-a-chip (SoC) including one or more electronic components. In the case where processor 2200 includes multiple processors, each processor may be implemented as a separate hardware (H / W). Processor 2200 may be referred to as a microprocessor controller (MICOM), microprocessor unit (MPU), or microcontroller unit (MCU). Processor 2200 according to this disclosure is a hardware device that may be implemented as a single-core processor or a multi-core processor. Processor 2200 may run programs stored in memory 2500 to control components of inverter unit 30, communication interface 2300, user interface 2400, memory 2500, and coil board 20.

[0157] According to embodiments of this disclosure, the induction heating device 2000 may be equipped with an artificial intelligence (AI) processor. The AI ​​processor may be manufactured as a dedicated hardware chip for AI, or it may be manufactured as part of an existing general-purpose processor (e.g., a CPU or application processor) or a dedicated graphics processor (e.g., a GPU) and then mounted on the induction heating device 2000.

[0158] With the unique identification information of the cooking container 101 stored in the memory 2500, the processor 2200 can establish a short-range wireless communication channel (e.g., a BLE communication channel) with the cooking container 101 through the communication interface 2300.

[0159] The communication interface 2300 of the controller 4 may include one or more components for enabling communication between the induction heating device 2000 and the cooking container 101, between the induction heating device 2000 and a server (not shown), or between the induction heating device 2000 and a user terminal (not shown). For example, the communication interface 2300 may include a short-range wireless communication interface 2310 and a long-range communication interface 2320. The short-range wireless communication interface 2310 may include, but is not limited to, a Bluetooth communication unit, a BLE mesh network communication unit, an NFC unit, a WLAN (e.g., Wi-Fi) communication unit, a Zigbee communication unit, an IrDA communication unit, a WFD communication unit, a UWB communication unit, an Ant+ communication unit, etc. In an Internet of Things (IoT) environment where the cooking container 101 is remotely controlled by a server (not shown), the long-range communication interface 2320 can be used to communicate with the server. The long-range communication interface 2320 may include the Internet, a computer network (e.g., a LAN or WAN), and a mobile communication unit. The mobile communication unit transmits radio signals to at least one of a base station, an external terminal, or a server on the mobile communication network, and receives radio signals from at least one of the base station, external terminal, or server on the mobile communication network. Here, the radio signals may include voice call signals, video call signals, or various types of data sent and received according to text / multimedia messages. The mobile communication unit may include, but is not limited to, 3G modules, 4G modules, LTE modules, 5G modules, 6th generation (6G) modules, NB-IoT modules, LTE-M modules, etc.

[0160] The memory 2500 can store programs for the processor 2200 to execute the operation and control of the induction heating device 2000, and can store input / output data (e.g., unique identification information of the cooking container 101, variable identification information of the cooking container 101, multiple power transmission modes, cooking progress information of the cooking container 101, or material information of the cooking container 101). The memory 2500 can store coded commands for the switching operations of the inverter circuit 3. In addition, the memory 2500 can also store AI models.

[0161] The memory 2500 may include at least one of the following: flash memory, hard disk storage medium, multimedia card micro storage medium, card-type memory (e.g., SD or XD memory), random access memory (RAM), static RAM (SRAM), read-only memory (ROM), electrically erasable programmable ROM (EEPROM), programmable ROM (PROM), magnetic storage, magnetic disk, or optical disk. Furthermore, the induction heating device 2000 can operate on a network storage device or cloud server that performs storage functions over the Internet.

[0162] According to embodiments of the present disclosure, a coil board formed by stacking multiple pattern layers with coil patterns is formed by connecting the coil patterns in series, and may include a current path pattern of multiple lines connected to input terminals and output terminals. According to embodiments of the present disclosure, each of some or all of the multiple current path patterns may branch in parallel at a branch point along the route from the input terminal to the output terminal. According to embodiments of the present disclosure, some or all of the multiple current path patterns may converge at a junction point between the branch point and the output terminal.

[0163] According to embodiments of this disclosure, any one of the plurality of patterned layers can be either a first patterned layer or a second patterned layer, wherein the first patterned layer is connected to another patterned layer on the output terminal side via a conductor formed inside the coil pattern, and the second patterned layer is connected to another patterned layer on the output terminal side via a conductor formed outside the coil pattern. According to embodiments of this disclosure, some or all of the current path patterns may branch in the first patterned layer and converge in the other patterned layer.

[0164] According to embodiments of this disclosure, the current path patterns of the branches can merge in a second pattern layer.

[0165] According to embodiments of this disclosure, when the path from the branch point to the confluence point in the entire current path pattern is a branch path, the lengths of the branch paths branching from the same current path pattern are equal to each other within a predefined error range.

[0166] According to embodiments of this disclosure, multiple pattern layers may be arranged between a first pattern layer having branch points and a second pattern layer having confluence points.

[0167] According to embodiments of this disclosure, the width of the current path pattern between a branch and a confluence may be smaller than the width of the current path pattern before the branch or after the confluence.

[0168] An induction heating device according to an embodiment of the present disclosure may include an inverter circuit configured to drive a heating coil. The induction heating device according to an embodiment of the present disclosure may include a coil plate comprising a plurality of patterned layers, on which the heating coil is printed to form a coil pattern. According to an embodiment of the present disclosure, the coil patterns formed on the plurality of patterned layers may be electrically connected to each other, with a first end of the coil pattern connected to an input terminal and a second end of the coil pattern connected to an output terminal. According to an embodiment of the present disclosure, at least one of the coil patterns branches in parallel at a branch point located between the input terminal and the output terminal, and merges at a confluence point located between the branch point and the output terminal.

[0169] In the induction heating apparatus according to an embodiment of the present disclosure, a first layer coil pattern in a plurality of patterned layers can be electrically connected to a second layer coil pattern in a plurality of patterned layers via a conductor formed inside the first layer coil pattern.

[0170] In an induction heating apparatus according to an embodiment of the present disclosure, a second layer coil pattern in a plurality of patterned layers can be electrically connected to a third layer coil pattern via a conductor formed outside the second layer coil pattern.

[0171] In the induction heating apparatus according to embodiments of the present disclosure, the conductor may include a through-hole that vertically penetrates at least one of a plurality of patterned layers.

[0172] According to embodiments of this disclosure, the lengths of two or more branch paths that branch in parallel at a branch point and merge at a merging point can be equal to each other within a difference of 5% or less.

[0173] According to embodiments of this disclosure, when the frequency of the current flowing through the coil pattern is 50 kHz or greater, the lengths of two or more branch paths may be equal to each other within a difference of 1% or less.

[0174] In the induction heating apparatus according to an embodiment of the present disclosure, when the branch paths generated by the branching of coil patterns formed on multiple pattern layers are arranged such that the first branch path, the second branch path, ... and the nth branch path (n is a natural number greater than or equal to 2) are arranged starting from the inside of the first layer coil pattern, the first branch path, the second branch path, ... and the nth branch path can be arranged starting from the outside of the second layer coil pattern.

[0175] In the induction heating apparatus according to embodiments of the present disclosure, the coil plate may include adjustment paths formed inside or outside the first layer coil pattern for adjusting the length of at least one of the first branch path, the second branch path, ... and the nth branch path.

[0176] According to embodiments of the present disclosure, a pattern layer including at least one of the coil patterns with parallel branches at the branch point can be a pattern layer other than the uppermost and lowermost layers among a plurality of pattern layers of the coil board.

[0177] In the induction heating apparatus according to embodiments of the present disclosure, the uppermost layer, excluding branch points, may include input terminals or output terminals. According to embodiments of the present disclosure, the lowermost layer, excluding confluence points, may include output terminals or input terminals.

[0178] In the induction heating apparatus according to an embodiment of the present disclosure, among the coil patterns formed on multiple pattern layers, the first coil pattern may branch in the first layer of the multiple pattern layers, and the second coil pattern may branch in the second layer of the multiple pattern layers.

[0179] In the induction heating apparatus according to embodiments of the present disclosure, the branch point of at least one parallel branch in the coil pattern can be a point where the AC resistance of the coil plate is higher than that of the other coil pattern areas.

[0180] In the induction heating device according to an embodiment of the present disclosure, at least one of the coil patterns may branch in parallel at a plurality of branch points located between the input terminal and the output terminal, the number of branches being the same as the number of the plurality of branch points, and may converge at a plurality of convergence points located between the input terminal and the output terminal, the number of convergences being the same as the number of the plurality of convergence points.

[0181] In the induction heating apparatus according to embodiments of the present disclosure, the coil patterns of each layer included in a plurality of patterned layers can be connected in series with each other.

[0182] In the induction heating apparatus according to embodiments of the present disclosure, the coil patterns of each layer included in a plurality of patterned layers may be connected in series or in parallel with each other.

[0183] The coil plate according to embodiments of this disclosure can be used in induction heating devices or contactless power supply devices.

[0184] According to the induction heating device of this disclosure configured as described above, heat generation by a portion of the coil can be prevented from being biased, and coil losses can be suppressed when high-frequency current flows through it.

[0185] Furthermore, this disclosure is not limited to the above embodiments, and various modifications can be made without departing from the spirit of this disclosure.

[0186] A method according to embodiments of the present disclosure may be embodied as program instructions executable by various computer devices and recorded on a computer-readable medium. The computer-readable medium may include program instructions, data files, data structures, etc., individually or in combination. The program instructions recorded on the medium may be specifically designed and configured for the present disclosure or may be known and available to those skilled in the art of computer software. Examples of computer-readable recording media include magnetic media (such as hard disks, floppy disks, or magnetic tapes), optical media (such as compact disc ROMs (CD-ROMs) or digital video optical discs (DVDs)), magneto-optical media (such as floppy disks), and hardware devices (such as ROMs, RAMs, or flash memory) specifically configured to store and execute program instructions. Examples of program instructions include not only machine code (such as code produced by a compiler) but also high-level language code executable by a computer using an interpreter, etc.

[0187] Embodiments of this disclosure can be implemented as a recording medium including computer-readable instructions (such as computer-executable program modules). A computer-readable medium can be any available medium accessible by a computer and can include volatile or non-volatile media as well as removable or non-removable media. Furthermore, a computer-readable medium can include computer storage media and communication media. Computer storage media include volatile and non-volatile, removable and non-removable media implemented using any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Communication media typically include computer-readable instructions, data structures, program modules, other data or other transmission mechanisms that modulate data signals, and examples include any information transmission medium. Additionally, some embodiments of this disclosure can be implemented as a computer program or computer program product including computer-executable instructions, such as a computer program executed by a computer.

[0188] Machine-readable storage media may be provided in the form of non-transitory storage media. Here, the term "non-transitory storage media" refers to a tangible device and does not include signals (e.g., electromagnetic waves), and the term "non-transitory storage media" does not distinguish whether data is stored semi-permanently or temporarily in the storage medium. For example, "non-transitory storage media" may include buffers for temporarily storing data.

[0189] According to embodiments of this disclosure, methods according to embodiments disclosed herein may be included and incorporated into a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., CD-ROM), or may be distributed online through an app store (e.g., downloaded or uploaded) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product (e.g., a downloadable application) may be temporarily stored in a machine-readable storage medium, such as the memory of a manufacturer's server, an app store's server, or a relay server.

Claims

1. An induction heating device, comprising: The inverter circuit is configured to drive the heating coil; as well as The coil plate includes multiple patterned layers, wherein the heating coil is printed on the multiple patterned layers to form a coil pattern. The coil patterns formed on the plurality of pattern layers are electrically connected to each other. The first end of the coil pattern is connected to the input terminal. The second end of the coil pattern is connected to the output terminal. At least one of the coil patterns branches in parallel at a branch point located between the input terminal and the output terminal, and merges at a confluence point located between the branch point and the output terminal.

2. The induction heating device as described in claim 1, wherein, The first layer coil pattern in the plurality of patterned layers is electrically connected to the second layer coil pattern in the plurality of patterned layers through a conductor formed inside the first layer coil pattern.

3. The induction heating device as described in claim 2, wherein, The second layer coil pattern in the plurality of pattern layers is electrically connected to the third layer coil pattern through a conductor formed on the outside of the second layer coil pattern.

4. The induction heating device according to any one of claims 2 to 3, wherein, The conductor includes a through-hole that perpendicularly penetrates at least one of the plurality of patterned layers.

5. The induction heating device according to any one of claims 1 to 4, wherein, Two or more branch paths that branch in parallel at the branching point and merge at the merging point have lengths that are equal to each other within a difference of 5% or less.

6. The induction heating device as described in claim 5, wherein, When the frequency of the current flowing through the coil pattern is 50 kHz or greater, the lengths of the two or more branch paths are equal to each other within a difference of 1% or less.

7. The induction heating device according to any one of claims 5 to 6, wherein, When the branch paths generated by the branching of the coil patterns formed on the plurality of pattern layers are arranged such that the first branch path, the second branch path, ... and the nth branch path are arranged starting from the inside of the first layer coil pattern, the first branch path, the second branch path, ... and the nth branch path are arranged starting from the outside of the second layer coil pattern, where n is a natural number greater than or equal to 2.

8. The induction heating device as described in claim 7, wherein, The coil plate includes an adjustment path formed inside or outside the first layer coil pattern for adjusting the length of at least one of the first branch path, the second branch path, ... and the nth branch path.

9. The induction heating device according to any one of claims 1 to 8, wherein, The pattern layer that includes at least one of the coil patterns that branch in parallel at the branch point is a pattern layer other than the uppermost and lowermost layers of the plurality of pattern layers of the coil plate.

10. The induction heating device as claimed in claim 9, wherein, The topmost layer, excluding the branch point, includes either the input terminal or the output terminal, and The lowest layer, excluding the confluence point, includes either the output terminal or the input terminal.

11. The induction heating device as claimed in claim 1, wherein, In the coil patterns formed on the plurality of pattern layers, the first coil pattern branches in the first layer of the plurality of pattern layers, and the second coil pattern branches in the second layer of the plurality of pattern layers.

12. The induction heating device as claimed in claim 1, wherein, The branch point of at least one parallel branch in the coil pattern is the point where the AC resistance of the coil plate is higher than that of the area where other coil patterns are located.

13. The induction heating device as claimed in claim 1, wherein, At least one of the coil patterns branches in parallel at multiple branch points located between the input terminal and the output terminal, the number of branches being the same as the number of multiple branch points, and merges at multiple merging points located between the input terminal and the output terminal, the number of merging points being the same as the number of multiple merging points.

14. The induction heating device according to any one of claims 1 to 13, wherein, The coil patterns, including those in the various layers of the plurality of pattern layers, are electrically connected in series with each other.

15. The induction heating device according to any one of claims 1 to 13, wherein, The coil patterns, including those in the various layers of the plurality of pattern layers, are electrically connected in series or in parallel with each other.

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