Lateral glue injection molding device and method for notebook computer shell
By designing an automated glue injection molding device for the side of a laptop shell, and integrating mold components and glue application components, the problems of low efficiency and material waste caused by manual positioning in existing technologies are solved, achieving efficient glue molding and quality control.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-20
- Publication Date
- 2026-03-17
AI Technical Summary
The existing method of applying adhesive to the edges of laptop casings relies on manual positioning and robotic arms for application, resulting in low work efficiency and significant material waste.
Design a side injection molding device for laptop shells, including a mold assembly and an adhesive application assembly. Employ an automated mold sliding and spiral feeder to achieve precise delivery and cooling of the adhesive material. Integrate a negative pressure adsorption and cooler to ensure the quality of the adhesive molding.
It has enabled the automation and refinement of glue injection on the side of laptop shells, improving product quality and production efficiency while reducing manual intervention and material waste.
Smart Images

Figure CN121670914A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of glue injection, and particularly to a notebook computer shell side glue injection forming device and method. BACKGROUND
[0002] Notebook computer shell frame dispensing is a key process for sealing, fixing and buffering in the assembly process. By precisely applying glue (such as silicone, epoxy resin or polyurethane, etc.) at specific positions of the metal or plastic frame, the stability, dust and water resistance, and impact resistance of the overall structure can be effectively improved.
[0003] The existing frame dispensing method generally needs manual positioning, and then uses a mechanical hand to apply glue, which is low in work efficiency. SUMMARY
[0004] The present application aims to provide a notebook computer shell side glue injection forming device and method, which can realize the automation and refinement of notebook computer shell side glue injection forming, improve product quality and production efficiency, and significantly reduce manual intervention and material waste.
[0005] To achieve the above-mentioned purpose, in a first aspect, the present application provides a notebook computer shell side glue injection forming device, comprising a base and a support frame, the support frame is fixedly connected with the base and located at the top of the base, further comprising a mold assembly and a glue applying assembly, the mold assembly comprises a left mold, a right mold and a driver, the left mold is fixed on the support frame, the right mold is slidingly arranged on the support frame and located on one side of the left mold, and the driver is used to push the right mold to move. The glue applying assembly comprises a material box, a feeding pipe and a screw feeder, the material box is arranged on one side of the support frame, the feeding pipe is in communication with the material box and the right mold, and the screw feeder is arranged in the feeding pipe.
[0006] Among them, the left mold comprises a left mold body, a negative pressure adsorption structure and a cooler, the negative pressure adsorption structure is arranged inside the left mold body for adsorbing the computer shell to be processed, and the cooler is arranged outside the left mold body for cooling the computer shell after glue injection.
[0007] Among them, the mold assembly further comprises a guide rail, the guide rail is fixed on the support frame and in sliding connection with the right mold.
[0008] Among them, the glue applying assembly further comprises a heat insulation layer and a heat preservation layer, the heat insulation layer is arranged outside the feeding pipe, and the heat preservation layer is arranged outside the heat insulation layer.
[0009] The notebook computer shell side glue injection forming device further comprises an upper and lower feeding assembly, the upper and lower feeding assembly comprises a placing rack, a lifter, a translator, a mounting head, a rotating head and a suction head, the placing rack is arranged above the support frame and is used for storing computer shells to be processed, the lifter is slidingly arranged on one side of the placing rack, the translator is arranged on the output end of the lifter, the mounting head is fixed on the output end of the translator, the rotating head is rotatably arranged on the mounting head, and the suction head is arranged on the rotating head.
[0010] The placing rack comprises a rack body, a storage rack and a sliding partition plate, the storage rack is fixed on the support frame, the rack body is fixed above the storage rack, and the sliding partition plate is arranged between the storage rack and the rack body; after a computer shell on the rack body is taken down and glue injection is completed, the computer shell is placed back into a tray on the rack body, then the sliding partition plate is slid to lose support for the tray, so that the tray and the computer shell after glue injection are dropped into the storage rack for storage.
[0011] The placing rack further comprises a buffer plate, and the buffer plate is arranged at the bottom of the storage rack.
[0012] The placing rack further comprises a material taking plate, and the material taking plate is slidingly arranged at the bottom of the storage rack and is used for simultaneously taking out a plurality of trays and computer shells after glue injection.
[0013] The rotating head comprises a rotating head body, a limiting block, a first elastic member, a pressure sensor, a second elastic member and a controller, the rotating head body is rotatably arranged on the mounting head, the first elastic member is used for resetting the rotating head body, the limiting block is fixed on the mounting head and is used for limiting the reset angle of the rotating head body, the pressure sensor is arranged on the mounting head, the second elastic member is arranged between the pressure sensor and the rotating head body, the pressure sensor is used for detecting the contact force between the rotating head body and the computer shell, and the controller is connected with the pressure sensor and is used for controlling the translator based on the contact force.
[0014] In the second aspect, the present application further provides a notebook computer shell side glue injection forming method, which comprises the following steps: A driver is started to drive the right mold to move close to the left mold and fix the notebook computer shell to a preset position; The screw feeder is started to send the molten glue in the material box into the right mold and into the predetermined position of the notebook computer shell; After waiting for glue injection to cool, the right mold is reset to take out the notebook computer shell.
[0015] This invention discloses a device and method for injection molding the side of a laptop casing. The device includes a base and a support frame. The support frame is securely fixed to the top of the base, forming the main frame of the entire device and providing a reliable mounting base and structural support for other functional components. The mold assembly is used to form the injection cavity required for the side of the laptop casing, and includes a left mold, a right mold, and a driver. The left mold is fixedly mounted on the support frame as a reference mold in the molding process; the right mold is slidably disposed on the support frame and located to one side of the left mold, and can reciprocate horizontally under the drive of the driver, thereby realizing the opening and closing action of the mold. The driver is preferably a linear drive device such as a cylinder, hydraulic cylinder, or electric push rod, and its output end is connected to the right mold to precisely control the displacement of the right mold, ensuring tight fit when the mold is closed and smooth separation when it is opened, thereby ensuring the sealing of the injection process and the reliability of demolding. The glue application assembly is used to stably and continuously convey the glue material into the mold cavity, and includes a material box, a feeding pipe, and a screw feeder. The material hopper is located on one side of the support frame and is used to store the adhesive to be injected. One end of the feeding pipe is connected to the bottom of the material hopper, and the other end is connected to the injection port on the right mold, forming an adhesive conveying channel. Inside the feeding pipe is a screw feeder, which uses rotation to quantitatively and evenly push the adhesive from the material hopper into the mold cavity. The structure of the screw feeder can effectively prevent air bubbles or flow interruptions in the adhesive during conveying. At the same time, by adjusting its rotation speed, the amount and speed of adhesive injection can be precisely controlled to meet the process requirements of different products for adhesive layer thickness and filling density.
[0016] This invention achieves automation and precision in the side injection molding of laptop shells by integrating high-precision mold components and a controllable gluing system. This not only improves product quality and production efficiency but also significantly reduces manual intervention and material waste. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a structural diagram of a side injection molding device for a laptop shell according to the present invention.
[0019] Figure 2 This is a right-side structural diagram of a side injection molding device for a laptop shell according to the present invention.
[0020] Figure 3 This is a left-side structural diagram of a notebook computer case side injection molding device according to the present invention.
[0021] Figure 4 This is a cross-sectional structural diagram of a side injection molding device for a laptop shell according to the present invention.
[0022] Figure 5 yes Figure 4 A magnified view of detail A.
[0023] Figure 6 This is a structural diagram of the combination of the left and right molds of the present invention.
[0024] Figure 7 This is a flowchart of a method for injection molding the side of a laptop shell according to the present invention.
[0025] Base 101, support frame 102, left mold 103, right mold 104, driver 105, material box 106, feeding pipe 107, screw feeder 108, left mold body 109, negative pressure adsorption structure 110, cooler 111, guide rail 112, heat insulation layer 113, heat preservation layer 114, placement rack 115, lifting device 116, translation device 117, mounting head 118, rotating head 119, adsorption head 120, frame 121, storage rack 122, sliding partition 123, buffer plate 124, material picking plate 125, rotating head body 126, limit block 127, first elastic element 128, pressure sensor 129, second elastic element 130, controller 131. Detailed Implementation
[0026] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.
[0027] In the description of this invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, in the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified. Example
[0028] Please see Figures 1-6This invention provides a side injection molding device for a laptop shell, including a base 101 and a support frame 102. The support frame 102 is fixedly connected to the base 101 and located on top of the base 101. It also includes a mold assembly and an adhesive application assembly. The mold assembly includes a left mold 103, a right mold 104, and a driver 105. The left mold 103 is fixed to the support frame 102, and the right mold 104 is slidably disposed on the support frame 102 and located on one side of the left mold 103. The driver 105 is used to push the right mold 104 to move. The adhesive application assembly includes a material box 106, a feeding pipe 107, and a screw feeder 108. The material box 106 is disposed on one side of the support frame 102. The feeding pipe 107 communicates with the material box 106 and the right mold 104. The screw feeder 108 is disposed within the feeding pipe 107.
[0029] In this embodiment, the device includes a base 101 and a support frame 102. The support frame 102 is securely fixed to the top of the base 101, forming the main frame of the entire device and providing a reliable installation foundation and structural support for other functional components.
[0030] The mold assembly is used to form the injection cavity required for the side of the laptop shell, and includes a left mold 103, a right mold 104, and a driver 105. The left mold 103 is fixedly mounted on the support frame 102 as a reference mold in the molding process; the right mold 104 is slidably disposed on the support frame 102 and located on one side of the left mold 103, and can reciprocate horizontally under the drive of the driver 105, thereby realizing the opening and closing action of the mold. The driver 105 is preferably a linear drive device such as a cylinder, hydraulic cylinder, or electric push rod, and its output end is connected to the right mold 104 to precisely control the displacement of the right mold 104, ensuring tight fit when the mold is closed and smooth separation when it is opened, thereby ensuring the sealing of the injection process and the reliability of demolding.
[0031] The adhesive application assembly, comprising a material bin 106, a feeding pipe 107, and a screw feeder 108, is used to stably and continuously deliver the adhesive material into the mold cavity. The material bin 106 is located on one side of the support frame 102 and stores the adhesive material to be injected. One end of the feeding pipe 107 is connected to the bottom of the material bin 106, and the other end is connected to the injection port on the right mold 104, forming an adhesive material delivery channel. Inside the feeding pipe 107 is a screw feeder 108, which, through rotational motion, quantitatively and evenly pushes the adhesive material from the material bin 106 into the mold cavity. The structure of the screw feeder 108 effectively prevents air bubbles or flow interruptions during the delivery process. Furthermore, by adjusting its rotational speed, the injection volume and speed can be precisely controlled to meet the process requirements of different products regarding adhesive layer thickness and filling density.
[0032] In summary, this invention, by integrating high-precision mold components and a controllable gluing system, achieves automation and precision in the side injection molding of laptop shells, which not only improves product quality and production efficiency but also significantly reduces manual intervention and material waste.
[0033] The left mold 103 includes a left mold body 109, a negative pressure adsorption structure 110, and a cooler 111. The negative pressure adsorption structure 110 is disposed inside the left mold body 109 for adsorbing the computer shell to be processed. The cooler 111 is disposed outside the left mold body 109 for cooling the computer shell after glue injection.
[0034] The left mold body 109, as the main structure of the left mold 103, is typically made of high-strength, heat-resistant metal materials (such as aluminum alloy or mold steel). Its inner surface is precision-machined according to the geometry of the laptop shell side to form a cavity surface that matches the product contour. The negative pressure adsorption structure 110 is embedded in the inner side of the left mold body 109 (i.e., the side facing the product). It includes several microporous channels and vacuum pipelines connected to them. A negative pressure is generated by an external vacuum pump, so that the laptop shell to be processed can be firmly and flatly adsorbed onto the surface of the left mold 103 before glue injection. This effectively prevents glue injection deviation or poor filling caused by shell warping, displacement, or vibration, and significantly improves the consistency and yield of product molding.
[0035] Meanwhile, to accelerate the curing speed of the product after glue injection and shorten the production cycle, the cooler 111 is located on the outside of the left mold body 109 (i.e., the side away from the product), and can take the form of a circulating water cooling channel, thermoelectric cooling module, or air-cooled heat sink. After glue injection, the cooler 111 quickly removes the heat from the mold and glue, promoting rapid setting of the glue, which not only improves the production cycle but also reduces problems such as shell deformation or glue layer aging that may be caused by prolonged high-temperature exposure.
[0036] The mold assembly also includes a guide rail 112, which is fixed on the support frame 102 and slidably connected to the right mold 104.
[0037] To ensure the smooth movement and guiding accuracy of the right mold 104 during opening and closing, the mold assembly also includes a guide rail 112. The guide rail 112 is fixedly mounted on the support frame 102 and forms a sliding fit connection with the right mold 104. The guide rail 112 can be a linear guide rail 112, a dovetail guide rail 112, or a ball bearing slide rail, etc., and its extension direction is consistent with the movement direction of the right mold 104. Constrained by the guide rail 112, the right mold 104 slides smoothly along a predetermined trajectory under the push of the driver 105, effectively avoiding skewing, jamming, or impact phenomena, thereby ensuring the alignment accuracy and sealing performance when the mold closes, and further improving the injection molding quality.
[0038] The gluing assembly also includes a heat insulation layer 113 and a heat insulation layer 114. The heat insulation layer 113 is disposed on the outside of the feeding pipe 107, and the heat insulation layer 114 is disposed on the outside of the heat insulation layer 113.
[0039] To maintain the flowability and temperature stability of the adhesive during transport and prevent premature curing or viscosity fluctuations due to changes in ambient temperature, the adhesive application assembly is further equipped with a heat insulation layer 113 and a thermal insulation layer 114. Specifically, the heat insulation layer 113 covers the outside of the feeding pipe 107 and is made of a material with low thermal conductivity (such as ceramic fiber, aerogel, or silicone rubber) to block heat exchange between the external environment and the adhesive inside the pipe. A thermal insulation layer 114 is then provided outside the heat insulation layer 113. This thermal insulation layer 114 can integrate electric heating wires, a constant temperature belt, or a phase change energy storage material to actively or passively maintain the adhesive inside the feeding pipe 107 within the optimal process temperature range. Through this dual design of heat insulation and thermal insulation, not only is the uniformity and stability of the adhesive during transport ensured, but the reliable operating time of the equipment during continuous operation is also effectively extended, improving the overall process controllability and adaptability.
[0040] The laptop casing side injection molding device also includes a loading and unloading assembly, which includes a placement rack 115, a lifting device 116, a translation device 117, a mounting head 118, a rotating head 119, and a suction head 120. The placement rack 115 is disposed above the support frame 102 and is used to store the laptop casing to be processed. The lifting device 116 is slidably disposed on one side of the placement rack 115. The translation device 117 is disposed on the output end of the lifting device 116. The mounting head 118 is fixed on the output end of the translation device 117. The rotating head 119 is rotatably disposed on the mounting head 118. The suction head 120 is disposed on the rotating head 119.
[0041] The placement rack 115 is positioned above the support frame 102, serving as a temporary storage platform for laptop shells to be processed. Its structure includes multiple positioning slots or limiting structures, enabling the neat and stable stacking or side-by-side placement of multiple shells to be processed, ensuring consistent positioning and preventing tipping during material handling. The placement rack 115 can be detachable or modular, facilitating quick replacement of different product carriers and enhancing the equipment's flexible production capabilities.
[0042] The lifting device 116 is slidably mounted on one side of the placement frame 115, and preferably achieves precise vertical movement through a vertical guide rail 112 or a lead screw slide structure. The lifting device 116 can be driven by a servo motor, a stepper motor, or a pneumatic device, and its function is to drive the subsequent mechanism to move vertically to align with the shell layers at different heights on the placement frame 115 or to align with the clamping position of the mold.
[0043] The translation device 117 is installed on the output end of the lifting device 116. The translation device 117 moves in the horizontal direction (usually forward and backward or left and right) to move the adsorption mechanism from above the placement rack 115 to directly above the mold assembly, or back in the opposite direction. The translation device 117 can also adopt a linear module, slide rail cylinder or synchronous belt drive structure, which has good repeatability and smooth operation.
[0044] The mounting head 118 is fixedly connected to the output end of the translator 117, serving as the mounting base for the subsequent rotation and adsorption mechanism. Its structural design balances rigidity and lightweight, and it can integrate an internal air passage or electrical interface for easy connection with the adsorption head 120.
[0045] The rotating head 119 is rotatably mounted on the mounting head 118, enabling angle adjustment within a certain range. This rotation function allows the adsorption head 120 to flexibly adjust its angle according to the placement and removal posture of the computer case or the orientation of the mold cavity, ensuring that the case maintains a horizontal or specific process-required posture during transfer, avoiding bumps or positioning deviations caused by tilting.
[0046] Finally, the suction head 120 is installed at the end of the rotating head 119, serving as the actuating component for directly contacting and gripping the computer case. The suction head 120 typically employs a vacuum suction cup structure, made of wear-resistant and flexible silicone or polyurethane, which can adapt to the surface of the case with different curvatures. Simultaneously, the suction head 120 has an internal vacuum channel connected to a vacuum generator via an air tube, creating negative pressure during gripping to firmly adhere to the case; and releasing the vacuum during placement to achieve non-destructive release.
[0047] The placement rack 115 includes a frame 121, a storage rack 122, and a sliding partition 123. The storage rack 122 is fixed on the support frame 102, and the frame 121 is fixed above the storage rack 122. A sliding partition 123 is provided between the storage rack 122 and the frame 121. After the computer case on the frame 121 is removed and glued, it is put back into the tray on the frame 121. Then, the sliding partition 123 is slid to lose support for the tray, so that the tray and the glued computer case fall into the storage rack 122 for storage.
[0048] The storage rack 122 serves as the base structure for the placement rack 115 and is fixedly installed on the support frame 102 to support the laptop casings that have been glued and their matching trays. It has several stacked storage spaces inside, capable of accommodating multiple tray units, and its stable structure facilitates subsequent centralized transportation or quality inspection.
[0049] A frame 121 is fixedly installed above the storage rack 122. The frame 121 is used to temporarily place laptop shells to be processed. The frame 121 is provided with multiple positioning grooves or locking structures, each of which can hold a dedicated tray. The tray accurately positions one or more shells to be glued, ensuring consistent position and stable posture during automatic material handling.
[0050] A sliding partition 123 is provided between the frame 121 and the storage rack 122. This sliding partition 123 is horizontally arranged and can slide laterally. Normally, it is located directly below the tray, supporting it and keeping it stably positioned at the height of the frame 121, facilitating the loading and unloading components to grasp the casing for glue application. Once the casing has been glued and returned to the original tray by the loading and unloading components, the control system triggers the sliding partition 123—the partition slides out of its supporting position along the guide rail 112, thus losing its supporting force on the tray. At this time, the tray, along with the glued computer casing, falls smoothly under gravity and accurately lands in the corresponding storage layer of the lower storage rack 122, achieving automatic placement and categorized storage of finished products.
[0051] The storage rack 115 also includes a buffer plate 124, which is disposed at the bottom of the storage rack 122.
[0052] To prevent damage or displacement of the pallet and housing due to impact during descent, the placement rack 115 is also equipped with a buffer plate 124 at the bottom of the storage rack 122. The buffer plate 124 is made of elastic material (such as rubber, polyurethane, or silicone), which can effectively absorb the kinetic energy of the fall, reduce the impact force, protect the surface integrity and structural accuracy of the precision injection molded housing, and reduce the operating noise of the equipment.
[0053] The placement rack 115 also includes a material picking plate 125, which is slidably disposed at the bottom of the storage rack 122 for simultaneously picking up multiple trays and computer cases that have been glued.
[0054] The picking plate 125 is slidably mounted at the bottom of the storage rack 122 and can be pulled out or pushed in horizontally. Once a certain number of finished adhesive-filled pallets have accumulated in the storage rack 122, the operator or automated conveying mechanism can drive the picking plate 125 to slide out entirely, carrying out multiple pallets and their corresponding finished product shells at once, achieving efficient and neat batch unloading. The surface of the picking plate 125 is equipped with limiting grooves or magnetic / clamping structures that match the pallets, ensuring that the pallets will not slide or tip over during movement and guaranteeing safe transport.
[0055] The rotating head 119 includes a rotating head body 126, a limiting block 127, a first elastic element 128, a pressure sensor 129, a second elastic element 130, and a controller 131. The rotating head body 126 is rotatably mounted on the mounting head 118. The first elastic element 128 is used to reset the rotating head body 126. The limiting block 127 is fixed on the mounting head 118 to limit the reset angle of the rotating head body 126. The pressure sensor 129 is disposed on the mounting head 118. The second elastic element 130 is disposed between the pressure sensor 129 and the rotating head body 126. The pressure sensor 129 is used to detect the contact force between the rotating head body 126 and the computer casing. The controller 131 is connected to the pressure sensor 129 and is used to control the translation device 117 based on the contact force.
[0056] The rotating head body 126, as the core component of the rotating head 119, is rotatably mounted on the mounting head 118 via bearings, a rotating shaft, or a rotary joint. It can rotate around its axis under the drive of a driving mechanism (such as a micro motor or pneumatic rotary cylinder) to accommodate the loading and unloading needs of computer cases in different postures. To ensure that the rotating head body 126 automatically returns to a preset initial angle position without external force, the first elastic element 128 (such as a torsion spring, tension spring, or coil spring) is positioned between the rotating head body 126 and the mounting head 118, providing a stable reset torque. This reset function helps the adsorption head 120 return to its standard posture after each work cycle, improving repeatability and positioning accuracy.
[0057] To prevent the rotating head body 126 from excessively rotating during the reset process due to inertia or external forces, which could cause structural interference or displacement of the adsorption head 120, the limiting block 127 is fixedly installed on the mounting head 118. Its position matches the movement trajectory of the rotating head body 126, and it is used to physically limit its maximum reset angle. The limiting block 127 is typically made of wear-resistant, low-friction engineering plastics or metal materials, which can effectively constrain the rotation range, reduce impact wear, and ensure long-term operational reliability.
[0058] To achieve intelligent control of the contact process between the adsorption head 120 and the computer case, this invention integrates a force feedback system in the rotating head 119. The pressure sensor 129 is installed inside or on the side wall of the mounting head 118 to detect in real time the reaction force experienced by the rotating head body 126 when it contacts the case. A second elastic element 130 (such as a compression spring, silicone pad, or elastic bellows) is provided between the pressure sensor 129 and the rotating head body 126. This elastic element serves two purposes: firstly, it buffers and dampens shocks, making the contact process smoother; secondly, it acts as a force transmission medium, accurately transmitting the contact force experienced by the rotating head body 126 to the pressure sensor 129, avoiding measurement distortion or sensor damage caused by rigid impacts.
[0059] When the loading / unloading assembly drives the suction head 120 to approach the computer case for gripping or placement, if the suction head 120 contacts the case, the rotating head body 126 will deflect slightly or compress due to the contact force. This force is transmitted to the pressure sensor 129 via the second elastic element 130. The pressure sensor 129 sends the collected contact force signal to the controller 131 in real time. The controller 131 is electrically connected to the pressure sensor 129 and forms a closed-loop control with the drive system of the translation device 117 (such as a servo motor or pneumatic valve). The controller 131 determines the current contact state based on a preset force threshold (e.g., 0.5N to 2N, depending on the case material): if the detected contact force exceeds the safe range, the controller 131 immediately issues a command to control the translation device 117 to decelerate, pause, or reverse, thereby avoiding deformation, scratches, or damage to the adhesive layer of the case due to excessive pressure. Example
[0060] Please see Figure 7 The present invention also provides a method for injection molding the side of a laptop shell, comprising: S201 places the laptop case onto the left mold 103; The operator or automated robotic arm accurately places the laptop casing to be processed into the positioning area of the left mold 103 of the injection molding equipment. The surface of the left mold 103 is provided with positioning grooves or limiting structures that match the shape of the laptop casing to ensure that the casing remains stable during the subsequent injection process and prevents displacement or deformation. At the same time, the left mold 103 can integrate a temperature control system to preheat the casing before injection, improving the bonding performance between the adhesive and the casing material.
[0061] S202 starts the driver 105 to move the right mold 104 closer to the left mold 103 and fix the laptop shell in the preset position; After confirming that the laptop casing is correctly positioned, the control system activates the drive mechanism (such as a cylinder, hydraulic cylinder, or servo motor) to drive the right mold 104 to move smoothly in a horizontal or vertical direction until it is tightly closed with the left mold 103. After the right mold 104 and left mold 103 close, a sealed injection cavity is formed, precisely corresponding to the area on the side of the laptop casing that needs injection. During the mold closing process, the closing status can be monitored in real time via a pressure sensor 129 or a position encoder to ensure that the casing is firmly clamped in the preset position, preventing injection overflow or uneven filling due to loosening.
[0062] S203 starts the screw feeder 108, feeds the molten rubber material in the material box 106 into the right mold 104, and enters the predetermined position of the laptop shell; Once the mold is fully closed and a good seal is confirmed, the system activates the screw feeder 108. This feeder draws preheated molten material (such as thermoplastic elastomer TPE, silicone, or polyurethane) from the thermostatic material tank 106 and steadily delivers it through heated runners to the injection channel inside the right mold 104. Under pressure, the molten material flows through a precisely designed gate into predetermined areas on the side of the laptop casing (such as interface sealing grooves, decorative strip recesses, or buffer structure areas), achieving uniform filling of complex contours. Pressure and flow control can be used during the injection process to prevent air bubbles or insufficient filling.
[0063] After the S204 injection molding process has cooled, the right mold 104 is reset to remove the laptop casing.
[0064] After the adhesive is injected, the system enters the pressure holding and cooling stage. Cooling channels or air-cooling devices can be integrated inside the mold to accelerate the curing and molding of the adhesive. Once the adhesive has completely cooled and reached the required demolding strength, the driver 105 reverses its direction, smoothly retracting the right mold 104 to its initial position and releasing it from the grip on the laptop casing. At this point, the finished casing can be removed manually or by a robotic arm for the next process (such as quality inspection, assembly, or packaging). The entire process can be automated and cyclical, significantly improving production efficiency and product consistency.
[0065] The above description discloses only one preferred embodiment of the present invention, and should not be construed as limiting the scope of the present invention. Those skilled in the art will understand that all or part of the processes of the above embodiments can be implemented, and equivalent changes made in accordance with the claims of the present invention are still within the scope of the invention.
Claims
1. A notebook computer shell side glue injection molding device, comprising a base and a support frame, the support frame is fixedly connected with the base and located at the top of the base, characterized in that, it also comprises a mold assembly and a gluing assembly, the mold assembly comprises a left mold, a right mold and a driver, the left mold is fixed on the support frame, the right mold is slidably arranged on the support frame and located on one side of the left mold, and the driver is used to push the right mold to move; the gluing assembly comprises a tank, a feeding pipe and a screw feeder, the tank is arranged on one side of the support frame, the feeding pipe is in communication with the tank and the right mold, and the screw feeder is arranged in the feeding pipe.
2. The notebook computer shell side glue injection molding device of claim 1, characterized in that, the left mold comprises a left mold body, a negative pressure adsorption structure and a cooler, the negative pressure adsorption structure is arranged inside the left mold body for adsorbing the computer shell to be processed, and the cooler is arranged outside the left mold body for cooling the computer shell after glue injection.
3. The notebook computer shell side glue injection molding device of claim 2, characterized in that, the mold assembly further comprises a guide rail, which is fixed on the support frame and in sliding connection with the right mold.
4. The notebook computer shell side glue injection molding device of claim 3, characterized in that, the gluing assembly further comprises a heat insulation layer and a heat preservation layer, the heat insulation layer is arranged outside the feeding pipe, and the heat preservation layer is arranged outside the heat insulation layer.
5. The notebook computer shell side glue injection molding device of claim 4, characterized in that, the notebook computer shell side glue injection molding device further comprises a feeding and discharging assembly, the feeding and discharging assembly comprises a placing frame, a lifter, a translator, a mounting head, a rotating head and a suction head, the placing frame is arranged above the support frame for storing the computer shell to be processed, the lifter is slidably arranged on one side of the placing frame, the translator is arranged on the output end of the lifter, the mounting head is fixed on the output end of the translator, the rotating head is rotatably arranged on the mounting head, and the suction head is arranged on the rotating head.
6. The notebook computer shell side glue injection molding device of claim 5, characterized in that, the placing frame comprises a frame body, a storage frame and a sliding partition plate, the storage frame is fixed on the support frame, the frame body is fixed above the storage frame, and the sliding partition plate is arranged between the storage frame and the frame body, the computer shell on the frame body is taken off after glue injection and is placed back into the tray on the frame body, then the sliding partition plate is slid to lose support for the tray, so that the tray and the computer shell after glue injection fall into the storage frame for storage.
7. The notebook computer shell side glue injection molding device of claim 6, characterized in that, the placing frame further comprises a buffer plate, which is arranged at the bottom of the storage frame.
8. The notebook computer shell side glue injection molding device of claim 7, characterized in that, The placing rack further comprises a taking plate which is slidingly arranged at the bottom of the storage rack and used for simultaneously taking out a plurality of trays and computer cases with completed glue injection.
9. The notebook computer case side glue injection forming device according to claim 8, characterized in that, The rotating head comprises a rotating head body, a limiting block, a first elastic member, a pressure sensor, a second elastic member and a controller, the rotating head body is rotationally arranged on the mounting head, the first elastic member is used for resetting the rotating head body, the limiting block is fixed on the mounting head and used for limiting the resetting angle of the rotating head body, the pressure sensor is arranged on the mounting head, the second elastic member is arranged between the pressure sensor and the rotating head body, the pressure sensor is used for detecting the contact force between the rotating head body and the computer case, and the controller is connected with the pressure sensor and used for controlling the translator based on the contact force.
10. A method for side injection molding of a notebook computer shell, using the side injection molding device for a notebook computer shell according to any one of claims 1 to 9. The method is characterized in that, The notebook computer case is placed on the left mold; The driver is started to drive the right mold to approach the left mold and fix the notebook computer case to a preset position; The screw feeder is started to send the molten glue in the material box into the right mold and the predetermined position of the notebook computer case; After the glue is cooled, the right mold is reset to take out the notebook computer case.