Sputtering ion pump

Abstract

The invention relates to the technical field of vacuumizing equipment, in particular to a sputtering ion pump. The magnetic pump comprises a pump body, at least one adsorption unit and a plurality of first magnetic sets, the first magnetic sets are located in the pump body and are sequentially arranged at intervals in the first direction, and each first magnetic set is provided with a first magnetic face and a second magnetic face which are oppositely arranged; the orthographic projection of each adsorption unit on the pump body is located in the orthographic projection of the first magnetic surface corresponding to the adsorption unit on the pump body, and the orthographic projection of each adsorption unit on the pump body is located in the orthographic projection of the second magnetic surface corresponding to the adsorption unit on the pump body. A magnetic field can be generated between the first magnetic surface and the second magnetic surface which are located on the two sides of the additional unit, the magnetic field completely covers the adsorption unit, and magnetic fields can also be generated between the other first magnetic surfaces and the second magnetic surface on one side of the additional unit.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of vacuum pumping equipment, in particular to a sputtering ion pump. BACKGROUND

[0002] The sputtering ion pump is an ultra-high vacuum pump manufactured according to the principle of Penning discharge. The sputtering ion pump is internally provided with two cathode plates, and a plurality of anodes arranged in a honeycomb cylinder are arranged between the two cathode plates. When a power supply supplies power to the ion pump, a high electric field is generated between the anodes and the cathodes, and a magnetic field is applied between the two cathode plates. The electrons in the space are accelerated and approach the anodes. The electrons perform spiral motion under the dual action of the electric field and the magnetic field before entering the anodes, and generate oscillation between the cathode plates. During the oscillation process, the electrons collide with gas molecules to ionize the gas, generate positive ions and new electrons, and the generated positive ions are accelerated and bombard the cathode plates with negative potential to sputter titanium atoms on the cathode plates. The titanium atoms have very strong binding ability and can physically adsorb and chemically react with the gas molecules in the pump body. Part of the sputtered titanium atoms falls on the anode cylinder to form a continuous titanium film, and part of the sputtered titanium atoms falls on the peripheral area of the cathode plate. The gas in the pump body will chemically react with the continuously generated titanium atoms to form compounds and be adsorbed on the inner wall of the anode cylinder or the surface of the cathode plate, thereby being fixed. The continuously generated titanium film can bury the gas molecules adsorbed on its surface, so that the gas molecules in the pump body are continuously reduced, thereby achieving the purpose of vacuum pumping.

[0003] However, in the working process of the above-mentioned sputtering ion pump, only the magnetic field at the center position can maintain the Penning discharge capacity, and the magnetic field strength at the edges of the anode and the cathode decays seriously and is insufficient to maintain the Penning discharge, which seriously reduces the gas pumping capacity of the ion pump and further reduces the performance of the ion pump. SUMMARY

[0004] Therefore, the present application provides a sputtering ion pump to solve the problem that in the working process of the sputtering ion pump, only the magnetic field at the center position can maintain the Penning discharge capacity, and the magnetic field strength at the edges of the anode and the cathode decays seriously and is insufficient to maintain the Penning discharge, which seriously reduces the gas pumping capacity of the ion pump and further reduces the performance of the ion pump.

[0005] In a first aspect, the present application provides a sputtering ion pump, comprising: a pump body; a plurality of first magnetic groups located in the pump body and arranged in a first direction, each first magnetic group having oppositely arranged first and second magnetic surfaces, the first magnetic surface having a first polarity, the second magnetic surface having a second polarity, the first and second polarities being opposite, and each adjacent two first magnetic surfaces having one of the second magnetic surfaces therebetween. at least one adsorption unit, each of the adsorption units is located between any two adjacent first magnetic groups, each of the adsorption units comprises an anode plate, the orthogonal projection of each of the anode plates on the corresponding first magnetic surface is located in the corresponding first magnetic surface; the orthogonal projection of each of the anode plates on the corresponding second magnetic surface is located in the corresponding second magnetic surface.

[0006] Beneficial effects: each adsorption unit has a magnetic field between the corresponding first magnetic surface and the second magnetic surface, and the magnetic field can completely cover the anode plate, the first magnetic surface and the second magnetic surface located on both sides of the additional unit can generate a magnetic field, and the magnetic field completely covers the adsorption unit, in addition, the magnetic field can also be generated between the other first magnetic surface and the second magnetic surface on one side of the additional unit to increase the edge magnetic field strength of the additional unit, in addition, the magnetic field can also be generated between the other second magnetic surface and the first magnetic surface on the other side of the additional unit, which further increases the edge magnetic field strength of the additional unit, so that the edge magnetic field strength of the additional unit can maintain the penning discharge, thereby improving the pumping capacity of the sputter ion pump, and improving the performance of the sputter ion pump.

[0007] In an alternative embodiment, each of the first magnetic groups comprises at least one first magnet and at least one second magnet, each of the first magnets has a first surface, the first surface is of the first polarity, the remaining surfaces of the first magnet are of the second polarity, the first magnet has a second surface opposite to the first surface; the second magnet has a third surface, the third surface is of the second polarity, the remaining surfaces of the second magnet are of the first polarity, the second magnet has a fourth surface opposite to the first surface; all the second surfaces in each of the first magnetic groups enclose a second magnetic surface, and all the fourth surfaces in each of the first magnetic groups enclose a first magnetic surface.

[0008] Beneficial effects: the first magnetic group is composed of at least one first magnet and at least one second magnet, which can realize the opposite of different magnetic poles of adjacent first magnetic groups, thereby forming a specific magnetic field distribution at the adsorption unit, the magnetic field strength is large and the magnetic field area is more uniform, and the pumping speed of the ion pump is improved.

[0009] In an alternative embodiment, it further comprises a plurality of first magnetic groups arranged in the second direction in sequence and at intervals, a plurality of first magnetic groups arranged in the first direction in sequence and at intervals is a first magnetic group string, a plurality of first magnetic groups arranged in the second direction in sequence and at intervals is a second magnetic group string, the first magnetic group string and the second magnetic group string are arranged at intervals, and the second direction is opposite to the first direction.

[0010] Beneficial effects: by increasing the second magnetic group string, the pumping speed of the sputter ion pump is improved.

[0011] In an alternative embodiment, a second magnetic group and a third magnetic group are further included, the second magnetic group, the first magnetic group string, and the third magnetic group are sequentially and spacedly arranged along a first direction; The second magnetic group includes at least one second magnet, and all fourth surfaces in the second magnetic group enclose a third magnetic surface, which is spaced from an adjacent second magnetic surface; The third magnetic group includes at least one second magnet, and all third surfaces in the third magnetic group enclose a fourth magnetic surface, which is spaced from an adjacent first magnetic surface.

[0012] In an alternative embodiment, a fourth magnetic group and a fifth magnetic group are further included, the fourth magnetic group, the second magnetic group string, and the fifth magnetic group are sequentially and spacedly arranged along a second direction; The fourth magnetic group includes at least one first magnet, and all first surfaces in the fourth magnetic group enclose a fifth magnetic surface, which is spaced from an adjacent second magnetic surface; The fifth magnetic group includes at least one first magnet, and all second surfaces in the fifth magnetic group enclose a sixth magnetic surface, which is spaced from an adjacent first magnetic surface.

[0013] Beneficial effects: The sputtering ion pump can be combined into a closed magnetic circuit, reducing the leakage of magnetic energy, reducing the use amount of yoke, increasing the pumping space of the pump, placing more pumping units, further increasing the pumping speed, while reducing the use amount of the magnetic yoke, reducing the weight of the ion pump, and improving the ratio of pumping speed to pump weight.

[0014] In an alternative embodiment, one adsorption unit is arranged between the second magnetic group and the adjacent first magnetic group, one adsorption unit is arranged between the third magnetic group and the adjacent first magnetic group, one adsorption unit is arranged between the fourth magnetic group and the adjacent first magnetic group, and one adsorption unit is arranged between the fifth magnetic group and the adjacent first magnetic group.

[0015] Beneficial effects: The adsorption units arranged between the second magnetic group and the adjacent first magnetic group, the third magnetic group and the adjacent first magnetic group, the fourth magnetic group and the adjacent first magnetic group, and the fifth magnetic group and the adjacent first magnetic group can better adsorb gas ions, further improve the pumping efficiency of the sputtering ion pump, effectively process more positions of gas, and thus help to improve the overall performance and pumping effect of the sputtering ion pump.

[0016] In an alternative embodiment, further comprising: A first magnetic yoke is fixedly connected to the outer side wall of the pump body, the second magnetic group and the fifth magnetic group are located in the first magnetic yoke, and the second magnetic group and the fifth magnetic group are arranged at intervals; A second magnetic yoke is fixedly connected to the outer side wall of the pump body, the third magnetic group and the fourth magnetic group are located in the second magnetic yoke, and the third magnetic group and the fourth magnetic group are arranged at intervals; The first magnetic yoke, the first magnetic group string, the second magnetic yoke, and the second magnetic group string enclose a ring shape.

[0017] Beneficial effects: The first magnetic yoke, the first magnetic group string, the second magnetic yoke, and the second magnetic group string enclose a ring shape, can be combined into a closed magnetic circuit, reduce the leakage of magnetic energy, reduce the use amount of yoke iron, increase the pumping space of the pump, and can place more pumping units, thereby further increasing the pumping speed; compared with the common annular yoke iron, the use amount of the magnetic yoke is reduced, the weight of the ion pump can be well reduced, and the ratio of the pumping speed to the pump weight is improved.

[0018] In an alternative embodiment, the pump body has oppositely arranged first and second outer side walls, a plurality of first grooves are formed in the first outer side wall, the plurality of first grooves are sequentially and spaced arranged along the first direction, and each first magnetic group is inserted into a corresponding first groove; a plurality of second grooves are formed in the second outer side wall, the plurality of second grooves are sequentially and spaced arranged along the second direction, and each second magnetic group is inserted into a corresponding second groove.

[0019] Beneficial effects: The first magnetic group is inserted into the first groove formed in the first outer side wall, the first magnetic group is inserted into the second groove formed in the second outer side wall, the magnetic group can be more stably installed, the position of the magnetic group is more accurate, the relative positional relationship between the magnetic groups is helpful to maintain, the magnetic field distribution is stable, thereby the magnetic field strength is greater and the magnetic field area is more uniform, and the pumping speed of the ion pump is improved.

[0020] In an alternative embodiment, each adsorption unit comprises: A first cathode plate; A second cathode plate arranged at intervals with the first cathode plate; A support plate connected to the first cathode plate and the second cathode plate on both sides, and fixedly connected to the inner wall of the pump body; An anode plate located between the first cathode plate and the second cathode plate, and provided with a plurality of cylindrical members in the anode plate, the axis of the cylindrical member being perpendicular to the corresponding first magnetic surface and second magnetic surface.

[0021] In an alternative embodiment, a filter screen is further included, the pump body has an opening, and the filter screen is arranged in the opening.

[0022] Beneficial effects: The filter screen is arranged at the air inlet of the pump body, which can block impurities from entering the interior of the pump body, avoids the influence of impurities on the normal operation of the ion pump, and guarantees the stability and reliability of the ion pump. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 Structure schematic view of the first magnet and the second magnet in the sputtering ion pump of the present application; Figure 2 Top view of the first magnet and the second magnet in the sputtering ion pump of the present application; Figure 3 Distribution top view of the second magnet group, the first magnet group string, the third magnet group, the fourth magnet group, the second magnet group string and the fifth magnet group string in the sputtering ion pump of the present application; Figure 4 Structure schematic view of the sputtering ion pump of the present application; Figure 5 Structure schematic view of the sputtering ion pump of the present application without the cap; Figure 6 Sectional view of the sputtering ion pump of the present application; Figure 7 Exploded view of the adsorption unit in the sputtering ion pump of the present application.

[0024] Explanation of reference signs: 100, pump body; 101, first outer side wall; 102, second outer side wall; 103, sealing ring; 104, joint; 105, cap; 201, first magnet; 2011, first surface; 2012, second surface; 202, second magnet; 2021, third surface; 2022, fourth surface; 301, first magnet group; 3011, first magnetic surface; 3012, second magnetic surface; 302, second magnet group; 3021, third magnetic surface; 303, third magnet group; 3031, fourth magnetic surface; 304, fourth magnet group; 3041, fifth magnetic surface; 305, fifth magnet group; 3051, sixth magnetic surface; 401, first cathode plate; 402, second cathode plate; 403, anode plate; 404, support plate; 500, filter screen; 601, first magnetic yoke; 602, second magnetic yoke. DETAILED DESCRIPTION

[0025] The technical solutions of the present application will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of them. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the scope of protection of the present application.

[0026] In the description of the present application, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0027] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium; it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0028] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0029] The embodiments of the present application provide a sputter ion pump, as shown in the drawings, comprising a pump body 100, a plurality of first magnetic groups 301 and at least one adsorption unit, wherein the plurality of first magnetic groups 301 are located in the pump body 100 and are arranged in sequence along a first direction, each first magnetic group 301 has oppositely arranged first and second magnetic surfaces 3011 and 3012, the first magnetic surface 3011 has a first polarity, the second magnetic surface 3012 has a second polarity, and the first and second polarities are opposite; each of the two first magnetic surfaces 3011 has one of the second magnetic surfaces 3012 therebetween; each adsorption unit is located between any two adjacent first magnetic groups 301, and the two sides of each adsorption unit are respectively a corresponding first magnetic surface 3011 and a second magnetic surface 3012, the orthographic projection of each adsorption unit on the pump body 100 is located within the orthographic projection of the corresponding first magnetic surface 3011 on the pump body 100, and the orthographic projection of each adsorption unit on the pump body 100 is located within the orthographic projection of the corresponding second magnetic surface 3012 on the pump body 100. Figures 1 to 7 The embodiments of the present application provide a sputter ion pump, as shown in the drawings, comprising a pump body 100, a plurality of first magnetic groups 301 and at least one adsorption unit, wherein the plurality of first magnetic groups 301 are located in the pump body 100 and are arranged in sequence along a first direction, each first magnetic group 301 has oppositely arranged first and second magnetic surfaces 3011 and 3012, the first magnetic surface 3011 has a first polarity, the second magnetic surface 3012 has a second polarity, and the first and second polarities are opposite; each of the two first magnetic surfaces 3011 has one of the second magnetic surfaces 3012 therebetween; each adsorption unit is located between any two adjacent first magnetic groups 301, and the two sides of each adsorption unit are respectively a corresponding first magnetic surface 3011 and a second magnetic surface 3012, the orthographic projection of each adsorption unit on the pump body 100 is located within the orthographic projection of the corresponding first magnetic surface 3011 on the pump body 100, and the orthographic projection of each adsorption unit on the pump body 100 is located within the orthographic projection of the corresponding second magnetic surface 3012 on the pump body 100.

[0030] Specifically, each first magnetic group 301 includes four first magnets 201 and four second magnets 202, of course, the number of first magnets 201 and the number of second magnets 202 in each first magnetic group 301 in the embodiment are not limited. The first magnet 201 has a first surface 2011, which is of a first polarity, the rest of the surfaces of the first magnet 201 are of a second polarity, and the first magnet 201 has a second surface 2012 opposite to the first surface 2011. As shown in Figure 1 and Figure 2 The first magnet 201 is generally block-shaped, for example, cuboid block-shaped, and can be made of a permanent magnet material such as neodymium iron boron, or can be replaced by a ferrite magnet, but the magnetic property of the ferrite magnet is relatively weak. The first polarity is N-pole, and the second polarity is S-pole. As shown in Figure 1 and Figure 2 The second magnet 202 has a third surface 2021, which is of the second polarity, and the rest of the surfaces of the second magnet 202 are of the first polarity, and the second magnet 202 has a fourth surface 2022 opposite to the first surface 2011. The second magnet 202 can also be cuboid block-shaped, and can also be made of neodymium iron boron or the like, or can be replaced by an alnico magnet. All the second surfaces 2012 in each first magnetic group 301 enclose to form a second magnetic surface 3012, and all the fourth surfaces 2022 in each first magnetic group 301 enclose to form a first magnetic surface 3011. The first magnet 201 and the second magnet 202 are combined together by splicing, and such combination enables each first magnetic group 301 to form a specific polarity distribution, thereby establishing a specific magnetic field in the pump body 100, and enabling the magnetic field to be regularly distributed inside the pump body 100, which helps to improve the pumping performance of the ion pump.

[0031] Specifically, as shown in Figure 7As shown, each adsorption unit includes a first cathode plate 401, a second cathode plate 402 spaced apart from the second cathode plate 402, a support plate 404, and an anode plate 403. The first cathode plate 401 and the second cathode plate 402 are typically flat and may be made of titanium. The two sides of the support plate 404 are connected to the first cathode plate 401 and the second cathode plate 402 respectively, and the support plate 404 is fixedly connected to the inner wall of the pump body 100. The support plate 404 may be rectangular and is connected to the first cathode plate 401, the second cathode plate 402, and the inner wall of the pump body 100 by welding or bolting. The anode plate 403 is located between the first cathode plate 401 and the second cathode plate 402. The anode plate 403 contains several cylindrical components, the axes of which are perpendicular to the corresponding first magnetic surface 3011 and second magnetic surface 3012. The cylindrical component is generally cylindrical and can be made of metals with good electrical conductivity, such as aluminum alloy or copper. The anode plate 403 is fixedly connected to the support plate 404 via an insulating plate. The fixing method can be welding or bolting. The insulating plate can be made of rubber, ceramic, or other common insulating materials. When an electric field is applied between the anode plate 403 and the cathode plate, electrons move under the influence of the electric and magnetic fields, colliding with gas molecules to ionize them, and then being adsorbed, thus realizing the gas pumping function of the ion pump.

[0032] The pump body 100 has a first outer side wall 101 and a second outer side wall 102 arranged opposite to each other. The first outer side wall 101 has multiple first grooves arranged at intervals along a first direction. Each first magnetic assembly 301 is inserted into a corresponding first groove. The shape of the first groove matches the shape of the first magnetic assembly 301, ensuring the stability of the first magnetic assembly 301 during installation. The second outer side wall 102 has multiple second grooves arranged at intervals along a second direction. Each second magnetic assembly 302 is inserted into a corresponding second groove. This groove design allows the magnetic assemblies to be securely installed on the pump body 100, which is beneficial for the stable distribution of the magnetic field.

[0033] This embodiment also includes a plurality of first magnetic groups 301 arranged at intervals along a second direction. The plurality of first magnetic groups 301 arranged at intervals along a first direction constitute a first magnetic group string, and the plurality of first magnetic groups 301 arranged at intervals along the second direction constitute a second magnetic group string. The first magnetic group strings and the second magnetic group strings are alternately arranged, and the second direction is opposite to the first direction. This dual magnetic group string layout further optimizes the magnetic field distribution and enhances the coverage of the magnetic field within the pump body 100.

[0034] It also includes a second magnetic group 302, a third magnetic group 303, a fourth magnetic group 304, and a fifth magnetic group 305. The second magnetic group 302 includes at least one second magnet 202. All the fourth surfaces 2022 in the second magnetic group 302 enclose a third magnetic surface 3021, which has a first polarity and is spaced apart from adjacent second magnetic surfaces 3012. The third magnetic group 303 includes at least one second magnet 202. All the third surfaces 2021 in the third magnetic group 303 enclose a fourth magnetic surface 3031, which has a second polarity and is spaced apart from adjacent first magnetic surfaces 3011. The fourth magnetic group 304 includes at least one first magnet 201. All the first surfaces 2011 in the fourth magnetic group 304 enclose a fifth magnetic surface 3041, which has a first polarity and is spaced apart from adjacent second magnetic surfaces 3012. The fifth magnetic group 305 includes at least one first magnet 201. All the second surfaces 2012 in the fifth magnetic group 305 enclose a sixth magnetic surface 3051, which has a second polarity. The fifth magnetic surface 3041 is spaced apart from the adjacent first magnetic surface 3011. The arrangement of these magnetic groups further enriches the magnetic field distribution within the pump body 100, improving the magnetic field strength and uniformity.

[0035] An adsorption unit is provided between the second magnetic group 302 and the adjacent first magnetic group 301, between the third magnetic group 303 and the adjacent first magnetic group 301, between the fourth magnetic group 304 and the adjacent first magnetic group 301, and between the fifth magnetic group 305 and the adjacent first magnetic group 301. This arrangement of multiple adsorption units can increase the pumping area of ​​the ion pump and improve the pumping efficiency.

[0036] In this embodiment, the sputtering ion pump further includes a first magnetic yoke 601 and a second magnetic yoke 602. The first magnetic yoke 601 is fixedly connected to the outer wall of the pump body 100. The second magnetic group 302 and the fifth magnetic group 305 are both located within the first magnetic yoke 601, and are spaced apart. The second magnetic yoke 602 is fixedly connected to the outer wall of the pump body 100. The third magnetic group 303 and the fourth magnetic group 304 are both located within the second magnetic yoke 602, and are spaced apart. The first magnetic yoke 601, the first magnetic group string, the second magnetic yoke 602, and the second magnetic group string form a ring. The function of the magnetic yoke is to guide and confine the magnetic field, reducing magnetic energy leakage. This ring-shaped layout can further improve the utilization efficiency of the magnetic field.

[0037] In addition, the pump body 100 has an opening, and a filter screen 500 is installed inside the opening. The filter screen 500 can be a metal filter screen, such as a stainless steel filter screen, which can filter out larger particulate impurities that enter the pump body 100, prevent impurities from damaging the internal components of the ion pump, and extend the service life of the ion pump.

[0038] In this embodiment, the sputtering ion pump also includes a sealing ring 103, a connector 104, and a cap 105. The cap 105 is used to cover the opening, the sealing ring 103 is located between the cap 105 and the opening, and is used to seal the opening. The connector 104 is a cable connector, which is used to connect to an external power supply device.

[0039] The implementation principle of this embodiment is as follows: Through a unique magnetic array layout, a stronger and more uniform magnetic field is formed inside the pump body 100, which effectively maintains Penning discharge and makes gas molecules easier to ionize. The rational arrangement of multiple adsorption units increases the pumping area and improves pumping efficiency. The use of a magnetic yoke reduces magnetic energy leakage and improves the utilization efficiency of the magnetic field. The filter screen 500 protects the internal components of the pump body 100 and extends the service life of the ion pump. Compared with traditional sputtering ion pumps, this embodiment significantly improves the pumping capacity and performance of the ion pump, reduces magnetic energy waste, and increases the ratio of pumping speed to pump weight.

[0040] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A sputter ion pump characterised in that, The utility model relates to a pump body (100);A plurality of first magnetic group (301) are located in the pump body (100), and are sequentially spaced along the first direction, every first magnetic group (301) has oppositely arranged first magnetic surface (3011) and second magnetic surface (3012), the first magnetic surface (3011) is first polarity, the second magnetic surface (3012) is second polarity, the first polarity and the second polarity are opposite, and every two first magnetic surface (3011) between adjacent has one second magnetic surface (3012); At least one adsorption unit, every adsorption unit is located between every two first magnetic group (301) between adjacent, every adsorption unit includes anode plate (403), the orthographic projection of every anode plate (403) on corresponding first magnetic surface (3011) is located in corresponding first magnetic surface (3011);The orthographic projection of every anode plate (403) on corresponding second magnetic surface (3012) is located in corresponding second magnetic surface (3012). Every first magnetic group (301) includes at least one first magnet (201) and at least one second magnet (202), every first magnet (201) has first surface (2011), the first surface (2011) is the first polarity, the rest surface of first magnet (201) is the second polarity, and first magnet (201) has second surface (2012) oppositely arranged with first surface (2011);Second magnet (202) has third surface (2021), and the third surface (2021) is the second polarity, and the rest surface of second magnet (202) is the first polarity, and second magnet (202) has fourth surface (2022) oppositely arranged with third surface (2021);All second surface (2012) in every first magnetic group (301) is enclosed to form second magnetic surface (3012), and all fourth surface (2022) in every first magnetic group (301) is enclosed to form first magnetic surface (3011). Still include a plurality of first magnetic group (301) sequentially spaced along the second direction, and the plurality of first magnetic group (301) sequentially spaced along the first direction is first magnetic group string, and the plurality of first magnetic group (301) sequentially spaced along the second direction is second magnetic group string, and the first magnetic group string and the second magnetic group string are spaced, and the second direction is opposite to the first direction.

2. A sputter ion pump according to claim 1, characterised in that, Still include second magnetic group (302) and third magnetic group (303), and the second magnetic group (302), the first magnetic group string, the third magnetic group (303) sequentially spaced along the first direction are arranged.

3. A sputter ion pump according to claim 2, characterised in that, ​ 4. A sputter ion pump according to claim 3, characterised in that, ​ The second magnetic group (302) comprises at least one second magnet (202), and all fourth surfaces (2022) in the second magnetic group (302) enclose a third magnetic surface (3021), which is spaced apart from the adjacent second magnetic surface (3012); The third magnetic group (303) comprises at least one second magnet (202), and all third surfaces (2021) in the third magnetic group (303) enclose a fourth magnetic surface (3031), which is spaced apart from the adjacent first magnetic surface (3011).

5. A sputter ion pump according to claim 4, characterised in that, Further comprising a fourth magnetic group (304) and a fifth magnetic group (305), which are sequentially and spaced apart along the second direction; The fourth magnetic group (304) comprises at least one first magnet (201), and all first surfaces (2011) in the fourth magnetic group (304) enclose a fifth magnetic surface (3041), which is spaced apart from the adjacent second magnetic surface (3012); The fifth magnetic group (305) comprises at least one first magnet (201), and all second surfaces (2012) in the fifth magnetic group (305) enclose a sixth magnetic surface (3051), which is spaced apart from the adjacent first magnetic surface (3011).

6. A sputter ion pump according to claim 5, characterised in that, One adsorption unit is arranged between the second magnetic group (302) and the adjacent first magnetic group (301), one adsorption unit is arranged between the third magnetic group (303) and the adjacent first magnetic group (301), one adsorption unit is arranged between the fourth magnetic group (304) and the adjacent first magnetic group (301), and one adsorption unit is arranged between the fifth magnetic group (305) and the adjacent first magnetic group (301).

7. A sputter ion pump according to claim 6, characterised in that, Further comprising: A first magnetic yoke (601) fixedly connected with the outer side wall of the pump body (100), the second magnetic group (302) and the fifth magnetic group (305) are located in the first magnetic yoke (601), and the second magnetic group (302) and the fifth magnetic group (305) are spaced apart; A second magnetic yoke (602) fixedly connected with the outer side wall of the pump body (100), the third magnetic group (303) and the fourth magnetic group (304) are located in the second magnetic yoke (602), and the third magnetic group (303) and the fourth magnetic group (304) are spaced apart; The first magnetic yoke (601), the first magnetic group string, the second magnetic yoke (602), and the second magnetic group string enclose a ring.

8. A sputter ion pump according to claim 7, characterised in that, The pump body (100) has oppositely arranged first and second outer side walls (101 and 102), the first outer side wall (101) is provided with a plurality of first grooves, the plurality of first grooves are sequentially and spacedly arranged along the first direction, and each of the first magnetic groups (301) in the first magnetic group string is inserted into a corresponding first groove; the second outer side wall (102) is provided with a plurality of second grooves, the plurality of second grooves are sequentially and spacedly arranged along the second direction, and each of the first magnetic groups (301) in the second magnetic group string is inserted into a corresponding second groove.

9. A sputter ion pump according to any one of claims 1 to 8, characterised in that, Each of the adsorption units comprises: a first cathode plate (401); a second cathode plate (402) arranged in a spaced manner with the first cathode plate (401), and the first cathode plate (401) and the second cathode plate (402) are electrically connected with a negative electrode of a power supply a support plate (404) connected with the first cathode plate (401) and the second cathode plate (402) on both sides, and the support plate (404) is connected with an inner wall of the pump body (100); the anode plate (403) is located between the first cathode plate (401) and the second cathode plate (402), a plurality of cylindrical members are arranged in the anode plate (403), the axis of the cylindrical member is perpendicular to the corresponding first magnetic surface (3011) and the second magnetic surface (3012), and the anode plate (403) is used for being electrically connected with a positive electrode of the power supply.

10. A sputter ion pump according to claim 9, characterised in that, Further comprising a filter screen (500), the pump body (100) has an opening, and the filter screen (500) is arranged in the opening.

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