Chemical electroplating edge washing device, edge washing machine and method

Abstract

The invention discloses a chemical electroplating edge washing device which comprises an edge washing chamber used for placing a bearing unit; the bearing unit comprises a bearing driving source and a bearing frame fixed with a central shaft of the bearing driving source, the bearing frame is used for horizontally bearing a wafer, and the bearing driving source drives the bearing frame to drive the wafer to rotate around the central shaft perpendicular to the horizontal plane; a plurality of uniformly distributed positioning assemblies and sensing assemblies are arranged at the end part of the bearing frame, the sensing assemblies are used for sensing the positions of wafers on the bearing frame, and the positioning assemblies push the wafers on the bearing frame, so that the centers of the wafers and the center of the bearing frame are positioned on the same axis. By means of the mode, the problems that in the prior art, the wafer deviates from the center position on the edge washing machine table, the actual edge washing effect is not consistent with the setting, and the yield and performance of products are affected are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, in particular to a chemical plating edge cleaning device, an edge cleaning machine and a method. BACKGROUND

[0002] In the field of semiconductor manufacturing, the edge of a wafer is often a region with a high defect rate. In particular, after a chemical copper plating process, the edge of the wafer is covered with a copper film, and the uniformity of the physical vapor deposition barrier layer and the copper seed layer at the edge of the wafer is poor. Copper can easily diffuse into the dielectric material at the weak local barrier layer (at the edge of the wafer), which affects the performance of the device. In addition, the uneven copper seed layer at the edge has adhesion problems with the subsequent thin film, which can easily fall off and generate particulate matter, reducing product yield. Therefore, the edge copper film needs to be removed in a timely manner after the copper plating process.

[0003] In the prior art, the edge copper film cleaning device for a wafer includes a rotatable bearing table, a fixed clamp is arranged on the bearing table to rotate concentrically with the bearing table, and an edge cleaning nozzle is arranged at a predetermined position above the bearing table.

[0004] Currently, to remove the photoresist at the edge of the wafer, an edge bead removal process (EBR) is usually performed after the photoresist is coated. The general process of EBR is to spray an edge cleaning solvent into the edge cleaning area of the wafer through a nozzle to dissolve the residual photoresist. In addition, during the EBR process, the width of the edge cleaning needs to be set according to the process requirements. In actual production, due to the deviation of the wafer from the center position on the edge cleaning machine table, the actual edge cleaning effect does not match the setting, which affects the yield and performance of the product. SUMMARY

[0005] The present application aims to provide a chemical plating edge cleaning device, an edge cleaning machine and a method, which can solve the problem that the wafer deviates from the center position on the edge cleaning machine table in the prior art, resulting in that the actual edge cleaning effect does not match the setting, which affects the yield and performance of the product.

[0006] To solve the above technical problems, one technical solution adopted by the present application is to provide a chemical plating edge cleaning device, comprising: an edge cleaning chamber for placing a bearing unit; a bearing unit comprising a bearing drive source and a bearing frame fixed to the center axis of the bearing drive source, the bearing frame being used to horizontally support a wafer, and the bearing drive source driving the bearing frame to rotate the wafer around a vertical center axis; The end of the carrier is provided with a plurality of evenly distributed positioning components and sensing components, the sensing components are used to sense the position of the wafer on the carrier, and the positioning components push the wafer on the carrier to make the center of the wafer and the center of the carrier on the same axis.

[0007] The carrier comprises a mounting portion and a plurality of mounting arms, the mounting portion is fixedly mounted with the carrier driving source, and the plurality of mounting arms are evenly distributed and fixedly connected with the mounting portion.

[0008] The plurality of positioning components are matched with the plurality of mounting arms and are correspondingly mounted at the outer ends of the mounting arms.

[0009] The positioning component comprises a chuck and a lifting pin, the lifting pin is fixedly mounted on the chuck, and the contact end of the lifting pin is used to abut against the edge of the wafer.

[0010] The movement track of the lifting pin covers the sensing component.

[0011] The sensing component comprises a plurality of sensors, the plurality of sensors at least comprise a first sensor, a second sensor and a third sensor which are sequentially mounted from inside to outside, and the plurality of first sensors form a bearing area with the same radius as the wafer.

[0012] The spacing between the first sensor, the second sensor and the third sensor is 3mm.

[0013] The plurality of mounting arms are at least provided with 3.

[0014] A chemical electroplating edge cleaning machine comprises the above-mentioned edge cleaning device, and further comprises an edge cleaning chamber and a nozzle device, the edge cleaning device is arranged in the edge cleaning chamber and used to spray edge cleaning solution to the edge of the wafer.

[0015] An edge cleaning method of chemical electroplating is implemented based on a chemical electroplating edge cleaning machine, S1: horizontally placing the wafer on the carrier; S2: sensing the initial position of the wafer on the carrier through the sensing component; S3: based on the result of the sensing step, driving the positioning component to act and push the edge of the wafer until the center of the wafer and the center axis of the carrier coincide; S4: driving the carrier to rotate around the center axis of the centered wafer, and spraying edge cleaning solution to the edge of the rotating wafer through the nozzle device to perform edge cleaning operation.

[0016] The edge cleaning device, the edge cleaning method and the edge cleaning machine of the present application have the following beneficial effects: I. Advantages of the Edge Washing Device and the Edge Washing Machine 1. High precision and high uniformity: Core advantage: Through the "sensing-positioning" closed-loop system, the automatic precise centering of the wafer center is realized, ensuring that the center is completely coincident with the rotation axis.

[0017] Direct effect: During cleaning, the relative speed and distance of each point on the wafer edge to the nozzle remain consistent, achieving extremely uniform edge cleaning and avoiding cleaning blind spots or over-washing caused by eccentricity.

[0018] 2. Automation and intelligence, improving yield: Eliminate human error: The entire centering process is automatically completed by sensors and actuators, completely avoiding random errors caused by manual placement.

[0019] Process controllable: The system can sense and correct micron-level deviations, which is crucial for advanced processes, effectively reducing edge defects and significantly improving product yield.

[0020] 3. Ingenious structural design, stable and reliable: Multi-arm bearing frame: The symmetrical design of at least 3 installation arms provides stable support and multiple uniform action points, ensuring the stability of the wafer at high speed.

[0021] High component integration: The sensing components and positioning components are integrated at the end of the installation arm, with compact layout and direct response, improving the reliability and response speed of the system.

[0022] 4. Flexibility and universality: Self-adaptive adjustment: Regardless of the direction of the wafer deviation caused by incoming materials or placement, the system can "push back" to the center through the coordinated action of multiple positioning points, with strong adaptability.

[0023] II. Advantages of the Edge Washing Method 1. Process optimization, strong process reproducibility: The "placement" step, which originally relied on operator experience, is optimized into a standardized and quantifiable "sensing-correction" process.

[0024] This means that the initial conditions of each cleaning are highly consistent, and the process reproducibility is extremely strong, laying the foundation for large-scale stable production.

[0025] 2. Achieve precise process control: This method ensures that subsequent cleaning processes (such as rotation speed, liquid spraying parameters) can be carried out on an ideal basis.

[0026] Engineers can accurately establish the model between process parameters (such as rotation speed, flow) and cleaning effect (such as etching rate, uniformity) without considering the interference caused by placement deviation, which is convenient for process window optimization and fine control.

[0027] 3. Improve production efficiency and equipment utilization: Reduce commissioning time: automatic centering is fast, reducing the manual adjustment or trial operation time that may be required in traditional methods.

[0028] Reduce the skill requirements of operators: simplify the operation process and improve the overall production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments described in the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0030] Figure 1 is a structural schematic diagram of a chemical electroplating edge cleaning device of the present application; Figure 2 is a schematic diagram of placing a wafer of the present application Figure One ; Figure 3 is a schematic diagram of placing a wafer of the present application Figure Two ; Figure 4 is a process diagram of adjusting a wafer of the present application. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical scheme and advantages of the present application more clear, the specific embodiments of the present application will be described in detail below with reference to the drawings. The examples of these preferred embodiments are illustrated in the drawings. The embodiments of the present application shown in the drawings and described according to the drawings are only exemplary, and the present application is not limited to these embodiments.

[0032] Here, it also needs to be explained that, in order to avoid the present application from being obscured by unnecessary details, only the structures and / or processing steps closely related to the scheme according to the present application are shown in the drawings, and other details not closely related to the present application are omitted.

[0033] And, in the description of the present application, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0034] Please refer to Figures 1 to 4 The embodiments of the present application include: a chemical electroplating edge washing device, comprising: An edge washing chamber for placing a carrying unit; A carrying unit 1 comprising a carrying drive source and a carrying frame 11 fixed to the center axis of the carrying drive source, the carrying frame 11 being used to horizontally carry a wafer 2, the carrying drive source driving the carrying frame 11 to rotate the wafer 2 around the center axis perpendicular to the horizontal plane; A plurality of positioning components 12 and sensing components 13 are arranged at the end of the carrying frame 11, the sensing components 13 being used to sense the position of the wafer on the carrying frame, and the positioning components 12 pushing the wafer on the carrying frame to make the center of the wafer and the center of the carrying frame on the same axis.

[0035] The carrying frame comprises a mounting portion and a plurality of mounting arms, the mounting portion being fixedly mounted with the carrying drive source, and the plurality of mounting arms being uniformly distributed and fixedly connected with the mounting portion.

[0036] The plurality of positioning components 12 are matched with the plurality of mounting arms and correspondingly mounted at the outer end of the mounting arms.

[0037] The positioning component 12 comprises a chuck and a top rod, the top rod being fixedly mounted on the chuck, and the contact end of the top rod being used to abut against the edge of the wafer.

[0038] The movement trajectory of the top rod covers the sensing component 13.

[0039] The sensing component 13 comprises a plurality of sensors, the plurality of sensors at least comprising a first sensor 131, a second sensor 132 and a third sensor 133 mounted in sequence from inside to outside, and the plurality of first sensors forming a carrying area with the same radius as the wafer.

[0040] The spacing between the first sensor, the second sensor and the third sensor is 3mm.

[0041] The plurality of mounting arms are provided with at least 3.

[0042] A chemical plating edge trimming machine, comprising the edge trimming device as described above, further comprising an edge trimming chamber and a nozzle device, the edge trimming device is placed in the edge trimming chamber for spraying edge trimming solution to the edge of the wafer.

[0043] An edge trimming method of chemical plating, S1: horizontally place the wafer on the carrier; S2: sense the initial position of the wafer on the carrier through the sensing assembly; S3: based on the result of the sensing step, drive the positioning assembly 12 to act, push the edge of the wafer, until the center of the wafer coincides with the center axis of the carrier; S4: drive the carrier to rotate the centered wafer around its center axis, while spraying edge trimming solution to the edge of the rotating wafer through the nozzle device to perform edge trimming operation.

[0044] Detect the position of the wafer edge through the first sensor, the second sensor and the third sensor arranged from inside to outside; when the wafer is accurately placed, its edge should be located on the circular track formed by a plurality of first sensors.

[0045] The positioning correction step specifically includes: If the detection signal of the sensing assembly indicates that the edge of the wafer is located outside the first sensor, control the outward movement of the corresponding positioning assembly's top rod to push the wafer to move inward; If the detection signal of the sensing assembly indicates that the edge of the wafer is located inside the first sensor, control the inward movement of the corresponding positioning assembly's top rod to push the wafer to move outward; Through repeated adjustment, until the edge of the wafer coincides with the circular track formed by the first sensor.

[0046] In the positioning correction step, a plurality of positioning assemblies are synchronously controlled to cooperatively push the wafer to achieve accurate centering of its center with the center axis of the carrier.

[0047] In the edge trimming step, the rotation speed of the carrier is linked to the injection pressure and flow rate of the nozzle solution according to different process recipes.

[0048] Furthermore, it is to be understood that the use of "including," "comprising," or "having" and variations thereof herein are meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless otherwise specified, "or" means "and / or" and "between" includes "and". Stated another way, "A, B, and / or C" means "A, B alone, A and C, B and C or A, B, and C." Language of degree should be interpreted by the application, if possible, to yield the most liberal results when interpreting limitations.

[0049] It should be understood that, although the present specification describes particular embodiments, each of which contains only a single independent technical solution, the specification is merely a description of certain embodiments of the application and is not intended to be limiting of the application's scope. The technical solutions in each embodiment can be combined with each other to form other embodiments that are understood by those skilled in the art.

Claims

1. A chemical electroplating edge cleaning device, characterized in that, include: The edge-washing chamber is used to house the load-bearing unit; The carrier unit includes a carrier drive source and a carrier frame fixed to the central axis of the carrier drive source. The carrier frame is used to horizontally carry the wafer, and the carrier drive source drives the carrier frame to rotate the wafer around a central axis perpendicular to the horizontal plane. The end of the carrier is provided with a plurality of evenly distributed positioning components and sensing components. The sensing components are used to sense the position of the wafer located on the carrier. The positioning components push the wafer located on the carrier so that the center of the wafer and the center of the carrier are on the same axis.

2. The chemical electroplating edge cleaning device according to claim 1, characterized in that, The support frame includes a mounting part and multiple mounting arms. The mounting part is fixedly mounted to the support drive source, and the multiple mounting arms are evenly distributed and fixedly connected to the mounting part.

3. The chemical electroplating edge-washing device according to claim 2, characterized in that, The plurality of positioning components are matched with the plurality of mounting arms and are correspondingly mounted on the outer ends of the mounting arms.

4. The chemical electroplating edge cleaning device according to claim 3, characterized in that, The positioning assembly includes a chuck and a push rod, the push rod being fixedly mounted on the chuck, and the contact end of the push rod being used to abut against the edge of the wafer.

5. The chemical electroplating edge cleaning device according to claim 4, characterized in that, The movement trajectory of the push rod covers the sensing component.

6. The chemical electroplating edge cleaning device according to claim 5, characterized in that, The sensing component includes multiple sensors, and the multiple sensors include at least a first sensor, a second sensor and a third sensor installed sequentially from the inside out. The radius of the bearing area formed by the multiple first sensors is the same as the radius of the wafer.

7. A chemical electroplating edge-washing device according to claim 6, characterized in that, The distance between the first sensor, the second sensor and the third sensor is 3 mm.

8. The chemical electroplating edge cleaning device according to claim 3, characterized in that, The plurality of mounting arms are provided with at least three.

9. A chemical electroplating edge-washing machine, characterized in that, The edge washing apparatus according to any one of claims 1-8 further includes an edge washing chamber and a nozzle device, wherein the edge washing device is disposed in the edge washing chamber for spraying the edge washing solution toward the edge of the wafer.

10. A chemical electroplating edge cleaning method based on a chemical electroplating edge cleaning machine according to claim 9, characterized in that, Placement steps: Place the wafer horizontally on the support frame; Sensing step: The initial position of the wafer on the carrier is sensed by the sensing component; Positioning and correction step: Based on the result of the sensing step, drive the positioning component to move and push the edge of the wafer until the center of the wafer coincides with the central axis of the carrier. Edge washing step: Drive the support frame to rotate the centered wafer around its central axis, and at the same time spray the edge washing solution onto the edge of the rotating wafer through the nozzle device to perform the edge washing operation.

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