Laser detection device, laser processing equipment and processing equipment

Abstract

The invention relates to the technical field of machining, and particularly discloses a laser detection device, laser machining equipment and machining equipment. The laser detection device comprises a laser detection light source used for emitting a detection light beam comprising first polarized light and second polarized light; the first half-wave plate is used for converting part of the second polarized light into part of the first polarized light; the polarizing beam splitter is used for transmitting the first polarized light and reflecting the second polarized light; the second half-wave plate is used for converting the first polarized light into third polarized light, the third polarized light is used for irradiating the to-be-detected area, is reflected by the to-be-detected area and then passes through the second half-wave plate to form detection light, and the polarizing beam splitter is also used for reflecting the detection light; the reference conversion module is used for converting the second polarized light into reference light and enabling the reference light to penetrate through the polarizing beam splitter; and the detector is used for receiving the reference light penetrating through the polarizing beam splitter and the detection light reflected by the polarizing beam splitter so as to detect whether the to-be-detected area is qualified or not. The laser detection device can help to improve the product quality.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of processing, in particular to a laser detection device, a laser processing equipment and a processing equipment. BACKGROUND

[0002] In the related art, a laser device can engrave a pattern such as a two-dimensional code on glass. However, when using a laser to engrave glass, the problem of inconsistent engraving depth at different positions easily occurs, affecting product quality. SUMMARY

[0003] The present application provides a laser detection device, a laser processing equipment and a processing equipment to solve at least one of the above technical problems.

[0004] The laser detection device provided by the present application comprises: a laser detection light source configured to emit a detection beam comprising first polarized light and second polarized light; a first half-wave plate configured to be arranged corresponding to the laser detection light source and configured to convert part of the second polarized light into part of the first polarized light; a polarization beam splitter configured to be arranged corresponding to the first half-wave plate and configured to transmit the first polarized light and reflect the second polarized light; a second half-wave plate configured to be arranged corresponding to the polarization beam splitter and configured to convert the first polarized light into third polarized light, wherein the third polarized light is configured to irradiate a to-be-detected area and is reflected by the to-be-detected area and then passes through the second half-wave plate to form detection light, and the polarization beam splitter is further configured to reflect the detection light; a reference conversion module configured to be arranged corresponding to the polarization beam splitter and configured to convert the second polarized light into reference light and make the reference light pass through the polarization beam splitter; a detector configured to be arranged corresponding to the polarization beam splitter and configured to receive the reference light passing through the polarization beam splitter and the detection light reflected by the polarization beam splitter to detect whether the to-be-detected area is qualified.

[0005] In the laser detection device, the detection light and the reference light can be used to detect the to-be-detected area, which helps to improve product quality.

[0006] In some embodiments, the reference conversion module comprises a mirror group and a third half-wave plate; the mirror group is configured to be arranged corresponding to the polarization beam splitter and configured to reflect the second polarized light to the third half-wave plate; the third half-wave plate is configured to be arranged corresponding to the mirror group and configured to convert the second polarized light into the reference light and make the reference light pass through the polarization beam splitter.

[0007] In some embodiments, the detector comprises a display screen and a processing unit, the display screen corresponding to the polarization beam splitter and configured to display an interference pattern formed by the reference light and the detection light after the interference of the combined beams. The processing unit is configured to determine whether the to-be-detected region is qualified based on the interference pattern.

[0008] In some embodiments, the processing unit is specifically configured to fit the number of fringes of the interference pattern to determine whether the to-be-detected region is qualified.

[0009] In some embodiments, the processing unit is specifically configured to: obtain an interference pattern corresponding to each Z-height at a plurality of Z-heights set by the laser detection device; calculate the number of fringes based on the interference pattern corresponding to the Z-height; fit the number of fringes of the interference patterns corresponding to the plurality of Z-heights to obtain a mapping relationship between the Z-height and the number of fringes; determine the depth of the current position of the to-be-detected region based on the interference pattern corresponding to the current position of the to-be-detected region and the mapping relationship, and determine whether the to-be-detected region is qualified based on the depth of the current position of the to-be-detected region.

[0010] In some embodiments, the laser detection device further comprises a filtering mechanism, the filtering mechanism being configured to filter the third polarized light reflected by the to-be-detected region and then make the third polarized light incident on the second half-wave plate.

[0011] In some embodiments, the filtering mechanism comprises two lens groups and an aperture, and the two lens groups are mirror-symmetrically arranged about the aperture.

[0012] In some embodiments, the lens group comprises a convex lens, a first tooth-shaped lens, and a second tooth-shaped lens, and the first tooth-shaped lens, the second tooth-shaped lens, and the convex lens are sequentially arranged in a direction away from the aperture.

[0013] An embodiment of the present application provides a laser processing device comprising: the laser detection device of any one of the above embodiments; a laser processing device arranged on one side of the laser detection device and electrically connected to the laser detection device, the laser processing device comprising: a laser processing light source configured to emit a processing beam; a beam combiner configured to reflect the processing beam so that the processing beam reaches the to-be-detected region for processing, and configured to transmit the third polarized light and combine the third polarized light with the processing beam.

[0014] The aforementioned laser processing equipment can utilize detection light and reference light to detect the area to be detected, thereby improving product quality to a certain extent and enabling the laser processing equipment to have both processing and detection functions.

[0015] In some embodiments, the laser processing apparatus further includes: A galvanometer scanning system, configured corresponding to the beam combiner, is used to deflect the processing beam and the third polarized light; A field lens system, configured corresponding to the galvanometer scanning system, is used to focus the processing beam and the third polarized light output by the galvanometer scanning system onto the area to be detected.

[0016] The processing equipment provided by the embodiments of the present invention includes the laser detection device of any of the above embodiments.

[0017] The aforementioned processing equipment can utilize detection light and reference light to detect the area to be detected, which helps improve product quality.

[0018] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of the laser processing equipment according to an embodiment of the present invention; Figure 2 This is a partial structural schematic diagram of the laser detection device according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the filtering mechanism according to an embodiment of the present invention; Figure 4 This is a schematic diagram illustrating the principle of interference between the detection light and the reference light in an embodiment of the present invention; Figure 5 This is a schematic diagram illustrating the detection and processing principles of the laser processing equipment according to an embodiment of the present invention.

[0021] Explanation of key component reference numerals: The system includes a laser detection device 100, a laser detection light source 110, a first half-wave plate 120, a polarizing beam splitter 130, a second half-wave plate 140, a reference conversion module 150, a mirror group 151, a first mirror 153, a second mirror 154, a third half-wave plate 152, a detector 160, a display screen 161, a processing unit 162, a filtering mechanism 170, a lens group 171, an aperture 172, a convex lens 173, a first toothed lens 174, a second toothed lens 175, and a third mirror 180. Laser processing equipment 1000, laser processing device 400, laser processing light source 410, beam combiner 420, galvanometer scanning system 430, field lens system 440. Detailed Implementation

[0022] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0023] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0024] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0025] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0026] The following disclosure provides many different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0027] Please refer to Figure 1 The laser detection device 100 provided in this embodiment of the invention includes a laser detection light source 110, a first half-wave plate 120, a polarizing beam splitter 130, a second half-wave plate 140, a reference conversion module 150, and a detector 160.

[0028] The laser detection source 110 emits a detection beam 200 comprising a first polarized light 210 and a second polarized light 220. A first half-wave plate 120 is disposed corresponding to the laser detection source 110, and is used to convert a portion of the second polarized light 220 into a portion of the first polarized light 210. A polarizing beam splitter 130 is disposed corresponding to the first half-wave plate 120, and is used to transmit the first polarized light 210 and reflect the second polarized light 220. A second half-wave plate 140 is disposed corresponding to the polarizing beam splitter 130, and is used to convert the first polarized light 210 into a third polarized light 230. The third polarized light 230 is used to illuminate the area to be detected 300 and is reflected back from the area to be detected 300, then passes through the second half-wave plate 140 to form the detection light 240. The polarizing beam splitter 130 is also used to reflect the detection light 240. The reference conversion module 150 is configured to correspond to the polarization beam splitter 130. The reference conversion module 150 is used to convert the second polarized light 220 into reference light 250 and allow the reference light 250 to pass through the polarization beam splitter 130. The detector 160 is configured to correspond to the polarization beam splitter 130. The detector 160 is used to receive the reference light 250 that passes through the polarization beam splitter 130 and the detection light 240 reflected by the polarization beam splitter 130, so as to detect whether the area to be detected 300 is qualified.

[0029] In the aforementioned laser inspection device 100, the inspection area 300 can be inspected using the inspection light 240 and the reference light 250, which helps to improve product quality.

[0030] Specifically, the laser inspection device 100 is a device that uses a laser to detect whether the area to be inspected 300 is qualified. Optionally, the area to be inspected 300 can be a region on the surface of a workpiece. For example, the area to be inspected 300 can be a QR code area formed on the surface of the workpiece by laser processing. The laser inspection device 100 can use the laser to detect the depth of the QR code area, thereby determining whether the QR code area is qualified. When the depth of the current position of the QR code area is equal to the set depth, the current position of the QR code area is qualified. When the depth of the current position of the QR code area is less than the set depth, the current position of the QR code area is unqualified. The laser processing device continues to process the current position of the QR code area until the depth of the current position of the QR code is equal to the set depth.

[0031] The laser detection source 110 is used to emit a detection beam 200 comprising a first polarized light 210 and a second polarized light 220. Optionally, both the first polarized light 210 and the second polarized light 220 may be linearly polarized light, and their polarization directions may be perpendicular to each other. Optionally, the laser detection source 110 is a 650nm laser source, providing coherent light to achieve coherence between the detection light 240 and the reference light 250, thereby realizing the detection of the area 300 to be detected.

[0032] The first half-wave plate 120 is positioned corresponding to the laser detection light source 110. The detection beam 200 emitted by the laser detection light source 110 can be incident perpendicularly onto the first half-wave plate 120. The first half-wave plate 120 can be used to convert a portion of the second polarized light 220 into a portion of the first polarized light 210 to increase the proportion of the first polarized light 210, thereby increasing the energy of the first polarized light 210, which can help improve the detection effect and accuracy.

[0033] The polarizing beam splitter 130 (PBS) is positioned corresponding to the first half-wave plate 120, and the detection beam 200 emitted from the first half-wave plate 120 can be incident on the polarizing beam splitter 130. The polarizing beam splitter 130 can transmit the first polarized light 210 and reflect the second polarized light 220.

[0034] The polarizing beam splitter 130 transmits the first polarized light 210 and reflects the second polarized light 220, causing the first polarized light 210 to be incident on the second half-wave plate 140 and the second polarized light 220 to be incident on the reference conversion module 150, thereby splitting the detection beam 200. Optionally, the first polarized light 210 can be P-light (with a transmittance greater than 95%), and the second polarized light 220 can be S-light (with a reflectance greater than 95%).

[0035] The second half-wave plate 140 is positioned corresponding to the polarizing beam splitter 130, allowing the first polarized light 210 transmitted through the polarizing beam splitter 130 to be incident on the second half-wave plate 140. The second half-wave plate 140 converts the transmitted first polarized light 210 into third polarized light 230. After the third polarized light 230 illuminates the detection area 300, it is reflected and passes through the second half-wave plate 140 again to form the detection light 240. The polarizing beam splitter 130 is also used to reflect the detection light 240 to the detector 160.

[0036] The reference conversion module 150 is configured to correspond to the polarization beam splitter 130, so that the second polarized light 220 reflected by the polarization beam splitter 130 can be incident on the reference conversion module 150. The reference conversion module is used to convert the second polarized light 220 into reference light 250 and then pass the reference light 250 through the polarization beam splitter 130 to the detector 160.

[0037] Detector 160 is positioned corresponding to polarizing beam splitter 130, allowing reference light 250 transmitted from polarizing beam splitter 130 and detection light 240 reflected from polarizing beam splitter 130 to be incident on detector 160. Detector 160 is used to receive the reference light 250 transmitted through polarizing beam splitter 130 and the detection light 240 reflected by polarizing beam splitter 130 to detect whether the area to be detected 300 is qualified. It is understood that when using the interference pattern formed by the coherence characteristics of reference light 250 and detection light 240 to detect whether the area to be detected 300 is qualified, if interference cannot be caused due to polarization direction, detector 160 can also convert the polarization direction of reference light 250 and detection light 240 into a polarization direction that can cause interference.

[0038] In one embodiment, detector 160 is used to detect whether the depth of the area to be tested 300 is acceptable based on detection light 240 and reference light 250. When the depth of the current position of the area to be tested 300 is less than a set depth, detector 160 determines that the current position of the area to be tested 300 is unacceptable, and the laser processing apparatus can continue processing the current position of the area to be tested 300 until the depth of the current position of the area to be tested 300 equals the set depth. When the depth of the current position of the area to be tested 300 equals the set depth, detector 160 determines that the current position of the area to be tested 300 is acceptable.

[0039] The specific depth can be determined according to actual needs, and this invention does not limit it.

[0040] In some implementations, please refer to Figure 2 The reference conversion module 150 includes a mirror group 151 and a third half-wave plate 152. The mirror group 151 is disposed corresponding to the polarizing beam splitter 130, and is used to reflect the second polarized light 220 to the third half-wave plate 152. The third half-wave plate 152 is disposed corresponding to the mirror group 151, and is used to convert the second polarized light 220 into reference light 250 and allow the reference light 250 to pass through the polarizing beam splitter 130.

[0041] Therefore, it is possible to convert the second polarized light 220 into reference light 250, which is simple in structure and easy to implement.

[0042] Specifically, the mirror assembly 151 is positioned corresponding to the polarizing beam splitter 130, allowing the second polarized light 220 reflected from the polarizing beam splitter 130 to be incident on the mirror assembly 151. The mirror assembly 151 can reflect the second polarized light 220 to the third half-wave plate 152.

[0043] Optionally, in Figure 2In this configuration, the mirror assembly 151 includes a first mirror 153 and a second mirror 154 that are perpendicular to each other. The first mirror 153 reflects the second polarized light 220 reflected from the polarizing beam splitter 130 to the second mirror 154. The second mirror 154 reflects the second polarized light 220 reflected from the first mirror 153 to a third half-wave plate 152. By adjusting the distance between the first mirror 153 and the second mirror 154, the mirror assembly 151 can adjust the position of the reference light 250 at the detector 160, thereby aligning the detection light 240 with the reference light 250 to detect whether the area to be detected 300 is qualified.

[0044] The third half-wave plate 152 is disposed between the second reflecting mirror 154 and the polarizing beam splitter 130. The second polarized light 220 reflected from the second reflecting mirror 154 is incident on the third half-wave plate 152. The third half-wave plate 152 can convert the second polarized light 220 into reference light 250 and allow the reference light 250 to pass through the polarizing beam splitter 130.

[0045] In some implementations, please refer to Figure 1 and Figure 2 The detector 160 includes a display screen 161 and a processing unit 162. The display screen 161 is positioned corresponding to the polarizing beam splitter 130 and is used to display the interference pattern formed by the reference light 250 and the detection light 240 after beam combining. The processing unit 162 is used to detect whether the area to be detected 300 is qualified based on the interference pattern.

[0046] Therefore, the quality of the area to be tested 300 can be determined by the interference pattern formed after the beams of the detection light 240 and the reference light 250 are combined. The detection method is simple and has a high accuracy.

[0047] Specifically, the detection light 240 reflected from the polarizing beam splitter 130 and the reference light 250 behind the lens can be combined into a single beam, which can then be incident on the display screen 161. An interference pattern will be formed on the surface of the display screen 161 after the detection light 240 and the reference light 250 interfere.

[0048] Optionally, the processing unit 162 can acquire the interference pattern by capturing the interference pattern formed on the display screen 161 with a camera, and detect whether the area to be tested 300 is qualified based on the interference pattern.

[0049] In some implementations, the processing unit 162 is specifically used to fit the number of fringe rings of the interference pattern to detect whether the area to be detected 300 is qualified.

[0050] Therefore, the detection area 300 can be detected by the number of fringe rings in the interference pattern, which is highly efficient.

[0051] Specifically, please combine Figure 4 andFigure 5 The interference pattern formed by the detection light 240 and the reference light 250 can be a Newton's rings interference pattern. The interference pattern consists of multiple concentric rings. These concentric rings can be used to represent the number of fringe rings. The detection beam 200 is a laser, which is a spherical wave. The laser wavefront difference between the detection surface and the reference surface is L = dz, and the number of concentric rings is N = (dz) / λ. According to the Gaussian beam transmission characteristic of lasers, DZ > dz, where d and D are the edge distances of the two wavefronts, and z and Z are the midpoint distances of the two wavefronts. Therefore, the number of interference rings on detection surface 2 is greater than the number of interference rings on detection surface 1, allowing the height (or depth) value to be measured based on the interference pattern.

[0052] In some implementations, please refer to Figure 5 The processing unit 162 is specifically used for: At multiple Z-axis heights set by the laser detection device 100, interference patterns corresponding to each Z-axis height are acquired respectively; Calculate the number of fringe rings based on the interference pattern corresponding to the height in the Z direction; The number of fringe rings of multiple interference patterns corresponding to Z-axis heights is fitted to obtain the mapping relationship between Z-axis height and fringe ring number; Based on the interference pattern and mapping relationship corresponding to the current position of the area to be tested 300, the depth of the current position of the area to be tested 300 is determined, and the quality of the area to be tested 300 is determined based on the depth of the current position of the area to be tested 300.

[0053] Therefore, the depth of the current position of the area to be tested 300 can be determined to detect whether the area to be tested 300 is qualified.

[0054] Specifically, in one embodiment, the laser detection device 100 may further include a Z-axis motion platform, which can drive an optical system composed of optical elements such as a first half-wave plate 120, a polarizing beam splitter 130, a second half-wave plate 140, and a reference conversion module 150 to move along the Z-axis. In one embodiment, the detection area 300 is formed by laser processing of the workpiece surface (such as a glass surface) by a laser processing device. During processing, the laser processing device can perform layered processing on the workpiece surface at each Z-axis height. After processing at all Z-axis heights, the detection area 300 (such as a QR code area) can be formed on the workpiece surface. The Z-axis height corresponds to a processing depth.

[0055] Understandably, due to the different areas being processed, when machining the workpiece surface using the same machining parameters, the depth at some locations may be acceptable, while the depth at others may not. Therefore, it is necessary to use different machining parameters at different Z-axis heights to process the workpiece surface in layers, ensuring that each area can be machined to the required depth. For example, please refer to... Figure 5The second to last image from left to right shows a light-colored area representing a layer processed at a larger Z-axis height Z1. The laser inspection device 100 can inspect at height Z1 to obtain the depth at different locations within the inspection area 300. The laser processing device can adjust processing parameters according to the depth at different locations to control the laser processing depth. Please refer to... Figure 5 The last image from left to right shows a large, connected dark area (the area connected to the left, bottom, and lower right). After inspection, the depth formed by processing at height Z1 is acceptable, while the other three light-colored areas are unacceptable. Therefore, the processing parameters and Z-axis height can be adjusted to process the other three light-colored areas sequentially. For example, process one of the darker light-colored areas (in the middle position) at height Z2, process the lightest light-colored area (in the upper right position) at height Z3, and process the remaining light-colored areas (the areas that are separated into individual grids) at height Z4.

[0056] When using automatic depth adjustment, the laser detection device 100 can directly detect the processing depth of the area to be detected 300. The laser processing device can associate the depth with the processing technology and adjust the processing technology of each layer in real time to solve the problem of inconsistent processing depth, avoid damage to the product, improve product yield, and ensure that the processing depth meets the requirements of subsequent processes. It can automatically determine the position that meets the depth and automatically adjust the processing drawing to avoid reprocessing, reduce the processing cycle, and improve processing efficiency.

[0057] Optionally, the laser inspection device 100 can simultaneously inspect the current position of the inspection area 300 to determine whether it is qualified while the laser processing device is processing the workpiece surface. Optionally, after processing each area, the laser inspection device 100 can inspect the current position of the inspection area 300 at the corresponding height to determine whether it is qualified. Optionally, after processing all areas, the laser inspection device 100 can inspect the corresponding inspection area 300 at each Z-axis height to determine whether it is qualified. If it is unqualified, the laser processing device can automatically adjust the processing parameters according to the detection depth and process until it is qualified.

[0058] The laser inspection device 100 works synchronously with the laser processing device. When the laser processing device processes at each Z-axis height, it emits an inspection beam 200 to synchronously inspect the inspection area 300 on the surface of the workpiece until the inspection of all Z-axis heights is completed.

[0059] Processing unit 162 can acquire the corresponding interference pattern at each Z-axis height and calculate the number of fringe rings based on the interference pattern corresponding to the Z-axis height, thereby obtaining multiple Z-axis heights and multiple corresponding fringe ring numbers. Processing unit 162 can perform data fitting based on the multiple Z-axis heights and the multiple corresponding fringe ring numbers to obtain the mapping relationship between Z-axis heights and fringe ring numbers. Optionally, please combine...Figure 5 The processing unit 162 can fit a curve showing the relationship between the Z-axis height and the number of stripes based on multiple Z-axis heights and the corresponding number of stripe rings.

[0060] The processing unit 162 can obtain the actual Z-axis height based on the number of fringe rings of the interference pattern corresponding to the area to be inspected 300 and the aforementioned relationship curve. This actual Z-axis height can be characterized as the depth of the current position of the area to be inspected 300. Since there is a corresponding relationship between the Z-axis height and the processing depth, when the actual Z-axis height is equal to the set Z-axis height, the current position of the area to be inspected 300 is determined to be qualified. When the actual Z-axis height is not equal to the set Z-axis height, the current position of the area to be inspected 300 is determined to be unqualified. It can be understood that the actual Z-axis height being equal to the set Z-axis height can mean that the actual Z-axis height is exactly equal to the set Z-axis height, or that the difference between the actual Z-axis height and the set Z-axis height is within the error range.

[0061] In some implementations, please refer to Figure 1 The laser detection device 100 also includes a filtering mechanism 170, which is used to filter the third polarized light 230 reflected back from the area to be detected 300 and then incident it onto the second half-wave plate 140.

[0062] This can improve the accuracy of test results.

[0063] Specifically, the filtering mechanism 170 can filter out stray light from the third polarized light 230 reflected back from the detection area 300. In addition, the third polarized light 230 emitted from the second half-wave plate 140 can pass through the filtering mechanism 170 and then be incident on the detection area 300. The filtering mechanism 170 can constrain the beam divergence angle to ensure that the third polarized light 230 incident on the detection area 300 is at the same focal point as the processing laser.

[0064] Optionally, the laser detection device 100 further includes a third reflector 180, which is disposed corresponding to the filter mechanism 170 and the second half-wave plate 140, and converts the direction of the beam between the filter mechanism 170 and the second half-wave plate 140.

[0065] In some implementations, please refer to Figure 3 The filtering mechanism 170 includes two lens groups 171 and an aperture stop 172. The two lens groups 171 are arranged in a mirror symmetrical manner with respect to the aperture stop 172.

[0066] Therefore, the detection beam 200 can be filtered using two symmetrically arranged lens groups 171.

[0067] In some implementations, please refer to Figure 3The lens group 171 includes a convex lens 173, a first toothed lens 174, and a second toothed lens 175. The first toothed lens 174, the second toothed lens 175, and the convex lens 173 are arranged sequentially in a direction away from the aperture stop 172.

[0068] Therefore, a system for eliminating spherical aberration and coma can be formed.

[0069] Specifically, the convex lens 173, the first serrated lens 174, and the second serrated lens 175 can form a system to eliminate spherical aberration and coma, thereby resolving detection anomalies caused by stray light, improving the quality of the returned beam, and ensuring the accuracy of the detection results. The parameters of the convex lens 173, the first serrated lens 174, the second serrated lens 175, and the aperture 172 can be determined according to specific requirements, and this invention does not impose any limitations on them.

[0070] Please combine Figure 1 The laser processing equipment 1000 provided in this embodiment includes a laser detection device 100 and a laser processing device 400 as described in any of the above embodiments. The laser processing device 400 is disposed on one side of the laser detection device 100 and electrically connected to it. The laser processing device 400 includes a laser processing light source 410 and a beam combiner 420. The laser processing light source 410 emits a processing beam 500. The beam combiner 420 reflects the processing beam 500, allowing it to reach the detection area 300 for processing, and also allows the third polarized light 230 to be transmitted and combined with the processing beam 500.

[0071] In the aforementioned laser processing equipment 1000, the detection light 240 and the reference light 250 can be used to detect the area to be detected 300, which helps to improve product quality and also enables the laser processing equipment 1000 to have processing and detection functions.

[0072] Optionally, the laser processing light source 410 can be a 355nm ultraviolet light source for processing. The beam combiner 420 can be used to reflect the processing beam 500, so that the processing beam 500 reaches the area to be inspected 300 for processing, and is also used to transmit the third polarized light 230 and combine it with the processing beam 500, thereby realizing processing and inspection functions and improving efficiency.

[0073] In some implementations, please refer to Figure 1 The laser processing apparatus 400 also includes a galvanometer scanning system 430 and a field lens system 440. The galvanometer scanning system 430 is configured corresponding to the beam combiner 420 and is used to deflect the processing beam 500 and the third polarized light 230. The field lens system 440 is configured corresponding to the galvanometer scanning system 430 and is used to focus the processing beam 500 and the third polarized light 230 output from the galvanometer scanning system 430 onto the detection area 300.

[0074] This allows for processing at different locations and improves the accuracy of processing and testing.

[0075] Specifically, the galvanometer scanning system 430 is set to correspond to the beam combiner 420, so that the processing beam 500 and the third polarized light 230 emitted from the beam combiner 420 can be incident on the galvanometer scanning system 430. The galvanometer scanning system 430 can be used to deflect the processing beam 500 and the third polarized light 230, thereby realizing the processing and detection of different positions of the area to be detected 300.

[0076] The galvanometer scanning system 430 is an electromagnetically driven optical scanning device that can precisely guide the light beam by controlling the deflection angle of the reflector. Specifically, the galvanometer scanning system 430 drives the reflector to rotate via an electromagnetic coil. By adjusting the current in the electromagnetic coil, the deflection angle of the reflector is changed, thereby controlling the direction of the light beam reflection. In the galvanometer scanning system 430, the coordinated movement of the X-axis and Y-axis reflectors enables arbitrary trajectory scanning within a two-dimensional plane, thereby achieving processing and inspection of different positions in the area to be inspected 300.

[0077] The field lens system 514 is configured to correspond to the galvanometer scanning system 430, so that the beam emitted from the galvanometer scanning system 430 can be incident on the field lens system 440. The field lens system 440 can be used to focus the processing beam 500 and the third polarized light 230 output by the galvanometer scanning system 430 onto the area to be inspected 300, thereby improving the accuracy of processing and inspection.

[0078] The field lens system 440 may include one or more lenses. The field lens system 440 can optimize the beam propagation path and improve image quality and manufacturing accuracy. By adjusting the direction of light propagation within the field lens system 440, the field lens system 440 can expand or converge the beam, correct aberrations, adjust the field curvature, or control the beam diameter, thereby achieving better optical performance.

[0079] The processing equipment provided by the embodiments of the present invention includes the laser detection device 100 of any of the above embodiments.

[0080] In the aforementioned processing equipment, the detection light 240 and the reference light 250 can be used to detect the area 300 to be detected, which helps to improve product quality.

[0081] Specifically, the processing equipment includes, but is not limited to, laser processing equipment 1000 and machining equipment. The processing equipment can process the inspection area 300 on the surface of the workpiece. The laser inspection device 100 can inspect the inspection area 300 to determine whether the inspection area 300 is qualified.

[0082] In one embodiment, the processing equipment of this invention can be applied to glass processing, solving the problem of inconsistent processing depths between large and small graphics under the same processing parameters when processing glass or creating QR codes on glass. It can effectively control the processing depth at various locations, avoiding damage to functional areas of the product, improving product processing results and yield, and shortening processing time. It can be extended to industries beyond 3C (computers, communications, and consumer electronics), such as architectural glass, automotive glass, and semiconductors, and has significant advantages in glass depth processing and depth self-adaptation.

[0083] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0084] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A laser detection device, characterized in that, include: A laser detection light source is used to emit a detection beam that includes first polarized light and second polarized light; The first half-wave plate, configured corresponding to the laser detection light source, is used to convert a portion of the second polarized light into a portion of the first polarized light. A polarizing beam splitter is configured corresponding to the first half-wave plate and is used to transmit the first polarized light and reflect the second polarized light. The second half-wave plate, which is configured corresponding to the polarizing beam splitter, is used to convert the first polarized light into third polarized light. The third polarized light is used to illuminate the area to be detected and is reflected back by the area to be detected and then passes through the second half-wave plate to form detection light. The polarizing beam splitter is also used to reflect the detection light. A reference conversion module is configured corresponding to the polarizing beam splitter to convert the second polarized light into reference light and allow the reference light to pass through the polarizing beam splitter. The detector, configured corresponding to the polarizing beam splitter, is used to receive the reference light transmitted through the polarizing beam splitter and the detection light reflected by the polarizing beam splitter, so as to detect whether the area to be detected is qualified.

2. The laser detection device according to claim 1, characterized in that, The reference conversion module includes a mirror assembly and a third half-wave plate; The mirror group is arranged corresponding to the polarizing beam splitter and is used to reflect the second polarized light to the third half-wave plate; The third half-wave plate is configured corresponding to the mirror group and is used to convert the second polarized light into the reference light and allow the reference light to pass through the polarizing beam splitter.

3. The laser detection device according to claim 1, characterized in that, The detector includes a display screen and a processing unit. The display screen is set corresponding to the polarization beam splitter and is used to display the interference pattern formed by the reference light and the detection light after beam combining and interference. The processing unit is used to detect whether the area to be detected is qualified based on the interference pattern.

4. The laser detection device according to claim 3, characterized in that, The processing unit is specifically used to fit the number of fringe rings of the interference pattern to detect whether the area to be detected is qualified.

5. The laser detection device according to claim 4, characterized in that, The processing unit is specifically used for: At multiple Z-axis heights set by the laser detection device, interference patterns corresponding to each Z-axis height are acquired. Calculate the number of fringe rings based on the interference pattern corresponding to the Z-axis height; The number of fringe rings of the interference patterns corresponding to the multiple Z-axis heights is fitted to obtain the mapping relationship between Z-axis height and fringe ring number; Based on the interference pattern corresponding to the current position of the area to be detected and the mapping relationship, the depth of the current position of the area to be detected is determined, and the qualification of the area to be detected is detected based on the depth of the current position of the area to be detected.

6. The laser detection device according to claim 1, characterized in that, The laser detection device further includes a filtering mechanism, which is used to filter the third polarized light reflected back from the area to be detected and then incident it onto the second half-wave plate.

7. The laser detection device according to claim 6, characterized in that, The filtering mechanism includes two lens groups and an aperture stop, with the two lens groups arranged in a mirror-symmetrical manner about the aperture stop.

8. The laser detection device according to claim 7, characterized in that, The lens group includes a convex lens, a first serrated lens, and a second serrated lens, which are arranged sequentially with respect to the direction away from the aperture stop.

9. A laser processing device, characterized in that, include: The laser detection device according to any one of claims 1-8; A laser processing apparatus is disposed on one side of the laser detection apparatus and electrically connected to the laser detection apparatus. The laser processing apparatus includes: Laser processing light source, used to emit a processing beam; A beam combiner is used to reflect the processing beam so that the processing beam reaches the area to be inspected for processing, and to transmit the third polarized light and combine it with the processing beam.

10. The laser processing equipment according to claim 9, characterized in that, The laser processing device also includes: A galvanometer scanning system, configured corresponding to the beam combiner, is used to deflect the processing beam and the third polarized light; A field lens system, configured corresponding to the galvanometer scanning system, is used to focus the processing beam and the third polarized light output by the galvanometer scanning system onto the area to be detected.

11. A processing device, characterized in that, Includes the laser detection device according to any one of claims 1-8.

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