Wafer ultrasonic scanning carrier

Abstract

The invention belongs to the technical field of semiconductor wafer detection, and particularly relates to a wafer ultrasonic scanning carrier which comprises a carrier body, a pressing assembly and a positioning assembly, the carrier body is provided with a containing groove, a pressing groove and a positioning groove, the containing groove is used for containing a wafer, the pressing groove is used for containing the pressing assembly, and the positioning assembly is used for positioning the wafer. The positioning groove is used for placing a positioning assembly; one end of the pressing assembly abuts against the plane edge of the wafer, and one end of the positioning assembly abuts against the arc edge of the wafer. The pressing assembly is matched with the positioning assembly and is used for pressing and positioning the wafer; wherein the upper surface of the wafer protrudes out of the upper surface of the carrier body; according to the invention, a plurality of wafers can be clamped at the same time for batch detection, the detection efficiency is greatly improved, and the requirements of high-precision and high-efficiency detection in the technical field of semiconductor wafer detection can be met.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor wafer inspection technology, and specifically relates to a wafer ultrasonic scanning carrier. Background Technology

[0002] During the wafer bonding manufacturing process, after the wafer bonding process is completed, the wafer needs to be ultrasonically scanned to detect whether there are voids or bubbles on the wafer bonding surface.

[0003] As the requirements for scanning and inspection accuracy increase, the frequencies of ultrasonic probes used are also increasing. In immersion ultrasonic scanning, the entire wafer needs to be placed in the coupling liquid. To obtain better image scanning results, high-frequency ultrasonic probes are required, typically ranging from 175MHz to 400Hz. Due to the acoustic characteristics of high-frequency ultrasonic probes, the distance between the probe and the wafer surface is generally less than 1mm. During scanning, the probe is prone to colliding with the wafer surface, potentially damaging it. Furthermore, since the wafer thickness is generally less than 1mm, existing wafer carriers struggle to clamp and secure the wafer during immersion ultrasonic scanning, further affecting the scanning and inspection results.

[0004] Therefore, it is necessary to improve the existing technology to overcome its shortcomings in practical applications. Summary of the Invention

[0005] Based on the aforementioned shortcomings and deficiencies in the prior art, one of the objectives of this invention is to at least solve one or more of the aforementioned problems in the prior art. In other words, one of the objectives of this invention is to provide a wafer ultrasonic scanning carrier that meets one or more of the aforementioned requirements.

[0006] To achieve the above-mentioned objectives, the present invention adopts the following technical solution:

[0007] This invention provides a wafer ultrasonic scanning carrier, including a carrier body, a clamping assembly, and a positioning assembly. The carrier body has a receiving groove, a clamping groove, and a positioning groove. The receiving groove is used to place the wafer, the clamping groove is used to place the clamping assembly, and the positioning groove is used to place the positioning assembly. One end of the clamping assembly abuts against the planar edge of the wafer, and one end of the positioning assembly abuts against the arcuate edge of the wafer. The clamping assembly and the positioning assembly cooperate to clamp and position the wafer. The upper surface of the wafer protrudes from the upper surface of the carrier body.

[0008] As a preferred embodiment, the vehicle body is provided with several receiving slots, each receiving slot being configured with at least one pressing slot and two positioning slots, the pressing slots and the positioning slots being located on the outside of the receiving slots and arranged sequentially at intervals.

[0009] As a preferred embodiment, the clamping assembly includes a base, a wedge block, an elastic element, a sliding assembly, and a limiting block. The sliding assembly and the limiting block are mounted on the base. One end of the elastic element is connected to the wedge block, and the other end abuts against the inner wall of the clamping groove. The sliding assembly is connected to the wedge block, and the wedge block has a wedge-shaped surface that mates with the wafer wedge.

[0010] As a preferred embodiment, the sliding assembly includes a guide rail and a slider. The guide rail is disposed on the base, and the slider is connected to the wedge block. The slider and the guide rail are slidably connected. The limiting block has a limiting groove, and the guide rail passes through the limiting groove. By adjusting the distance between the slider and the limiting block, the movement position of the slider is limited.

[0011] As a preferred embodiment, the elastic element is configured as a compression spring, and two compression springs are installed in each of the compression grooves.

[0012] As a preferred embodiment, the vehicle body is provided with several positioning slots, and a positioning component is installed in each of the positioning slots.

[0013] As a preferred embodiment, multiple positioning components are configured, and each positioning component includes a positioning block. The positioning block has an arc surface that abuts against the arc edge of the wafer.

[0014] As a preferred embodiment, the receiving groove includes a contoured notch and a hollowed-out groove, wherein the contoured notch is used to support the wafer, and the hollowed-out groove is used to avoid the warped surface of the wafer.

[0015] As a preferred embodiment, the carrier body is provided with several pick-and-place slots, which are used to place or remove wafers from the receiving slots.

[0016] As a preferred embodiment, the vehicle body is equipped with at least two receiving slots.

[0017] Compared with the prior art, the beneficial effects of this invention are:

[0018] This invention provides a wafer ultrasonic scanning carrier. Through the ingenious cooperation of the clamping component and the positioning component, it achieves precise clamping of the wafer plane and reliable positioning of the arc edge, avoiding collision of the high-frequency ultrasonic probe with the wafer surface during scanning, thereby protecting the wafer from damage.

[0019] This invention provides a wafer ultrasonic scanning carrier, which can balance the water pressure on the upper and lower surfaces of the wafer through the hollowed-out grooves, avoid the warped surface of the wafer, effectively prevent the wafer from deforming or displacing due to uneven water pressure during the inspection process, and ensure the accuracy of scanning and inspection.

[0020] This invention provides a wafer ultrasonic scanning carrier that can simultaneously clamp multiple wafers for batch inspection, greatly improving inspection efficiency. It has the advantages of reliable clamping and fixing, high inspection efficiency, and simple operation, and can meet the needs of the semiconductor wafer inspection technology field for high-precision and high-efficiency inspection. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other embodiments can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of a wafer ultrasonic scanning carrier according to an embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of the structure of the vehicle body according to an embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of the clamping assembly according to an embodiment of the present invention;

[0025] Figure 4 This is a schematic diagram of the structure of the sliding component according to an embodiment of the present invention;

[0026] Figure 5 This is a side view of the wedge block according to an embodiment of the present invention;

[0027] In the figure: 0 wafer, 1 carrier body, 11 receiving groove, 111 contoured notch, 112 hollow groove, 12 clamping groove, 13 positioning groove, 14 pick-and-place groove, 2 clamping assembly, 21 base, 22 wedge block, 221 wedge surface, 23 elastic element, 24 sliding assembly, 241 slider, 242 guide rail, 25 limit block, 3 positioning assembly, 31 positioning block. Detailed Implementation

[0028] To more clearly illustrate the embodiments of this application, the specific implementation methods of this application will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.

[0029] In the description of the embodiments of this application, the terms "upper," "lower," "front," "rear," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," etc., are only used for distinction in description and have no special meaning.

[0030] According to some embodiments of this application, please refer to Figures 1 to 5 As shown, a wafer ultrasonic scanning carrier is provided, including a carrier body 1, a clamping assembly 2, and a positioning assembly 3. The carrier body 1 is provided with a receiving groove 11, a clamping groove 12, and a positioning groove 13. The receiving groove 11 is used to place the wafer 0, the clamping groove 12 is used to place the clamping assembly 2, and the positioning groove 13 is used to place the positioning assembly 3. One end of the clamping assembly 2 abuts against the planar edge of the wafer 0, and one end of the positioning assembly 3 abuts against the arc edge of the wafer 0. The clamping assembly 2 and the positioning assembly 3 cooperate to clamp and position the wafer 0. The upper surface of the wafer 0 protrudes from the upper surface of the carrier body 1.

[0031] In some embodiments of this application, the vehicle body 1 is provided with several receiving slots 11, each receiving slot 11 is provided with at least one pressing slot 12 and two positioning slots 13, the pressing slots 12 and positioning slots 13 are located on the outside of the receiving slot 11 and are arranged in sequence at intervals.

[0032] Specifically, the multiple receiving slots 11 provided on the carrier body 1 can simultaneously place and inspect multiple wafers 0, improving inspection efficiency. Each receiving slot 11 is equipped with at least one clamping slot 12 and two positioning slots 13, and the clamping slots 12 and positioning slots 13 are located on the outside of the receiving slot 11 and arranged sequentially at intervals, which can ensure that the clamping component 2 and the positioning component 3 perform stable and accurate clamping and positioning operations on the wafers 0.

[0033] Furthermore, each receiving groove 11 has a clamping groove 12 and two positioning grooves 13 on its outer side. The two positioning grooves 13 are arranged at a 60° angle to the clamping groove 12. By installing the clamping component 2 in the clamping groove 12 and the positioning component 2 in the positioning groove 13, the wafer 0 is clamped and fixed to ensure the stability of the wafer and avoid the wafer warping phenomenon.

[0034] In some embodiments of this application, the clamping assembly 2 includes a base 21, a wedge block 22, an elastic element 23, a sliding assembly 24, and a limiting block 25. The sliding assembly 24 and the limiting block 25 are mounted on the base 21. One end of the elastic element 23 is connected to the wedge block 22, and the other end abuts against the inner wall of the clamping groove 12. The sliding assembly 24 is connected to the wedge block 22, which has a wedge-shaped surface 221 that wedges with the edge of the wafer. This wedge-shaped fit allows for better contact with the wafer edge, achieving stable clamping and facilitating control over the degree of clamping of the wedge block 22 onto the wafer 0. When the elastic element 23 is subjected to pressure, it pushes the wedge block 22 to move along the sliding assembly 24, causing the wedge-shaped surface 221 to come into close contact with the wafer 0, ensuring that the wafer 0 does not shift during scanning.

[0035] Furthermore, the sliding assembly 24 includes a guide rail 242 and a slider 241. The guide rail 242 is mounted on the base 21, and the slider 241 is connected to the wedge block 22, with the slider 241 slidably connected to the guide rail 242. The limiting block 25 has a limiting groove, through which the guide rail 242 passes. By adjusting the distance between the slider 241 and the limiting block 25, the movement position of the slider 241 is limited. In actual operation, the position of the slider 241 can be precisely adjusted according to the size and shape of the wafer 0, thereby controlling the clamping force of the wedge block 22 on the wafer 0, ensuring the accuracy and stability of the scanning detection.

[0036] Furthermore, the elastic element 23 is configured as a compression spring, with two compression springs installed in each clamping groove 12. This design of two compression springs ensures that the pressure is evenly distributed on the wedge block 22, guaranteeing uniform pressure and preventing uneven pressure from causing unbalanced force on the wafer 0, which would affect the scanning effect. Simultaneously, the compression springs have excellent elastic recovery capabilities, quickly restoring their original shape when encountering vibration or external impact during scanning, maintaining stable clamping of the wafer 0.

[0037] In some embodiments of this application, the carrier body 1 is provided with a plurality of positioning slots 13, and a positioning component 3 is installed in each positioning slot 13. The stable installation of the positioning component 3 in the positioning slot 13 provides reliable positioning support for the arc edge of the wafer 0.

[0038] Specifically, multiple positioning components 3 are configured, each including a positioning block 31. The positioning block 31 has an arc surface that abuts against the arc edge of the wafer. Multiple positioning components 3 position the arc edge of the wafer 0 from different directions, enabling more precise positioning of the wafer 0 and preventing rotation or displacement during scanning. The arc surface design of the positioning block 31 better conforms to the arc edge of the wafer 0, improving positioning accuracy and reliability.

[0039] In some embodiments of this application, the carrier body 1 is equipped with at least two receiving slots 11. Each receiving slot 11 is surrounded by an independently arranged clamping slot 12 and a positioning slot 13 as described above. The multiple receiving slots 11 enable the carrier to process multiple wafers simultaneously, significantly improving inspection efficiency. The spatial spacing between the receiving slots 11 avoids interference between wafers during simultaneous inspection, ensuring that each wafer can be scanned and inspected in a stable environment. In practical applications, operators can flexibly select the number of wafers to be inspected simultaneously according to production needs, enabling both high-precision inspection of a single wafer and batch inspection of multiple wafers, greatly enhancing the applicability and flexibility of the equipment.

[0040] In some embodiments of this application, the receiving groove 11 includes a contoured notch 111 and a hollowed-out groove 112. The contoured notch 111 supports the wafer 0, and the hollowed-out groove 112 avoids any warped surfaces of the wafer. The shape of the contoured notch 111 matches the bottom contour of the wafer 0, providing stable support for the wafer 0 and preventing it from wobbling within the receiving groove 11. The hollowed-out groove 112 effectively balances the water pressure above and below the wafer 0, preventing deformation or damage to the wafer 0 due to pressure differences, while also avoiding any warped surfaces that may exist on the wafer 0, ensuring smooth scanning and inspection.

[0041] In practical applications, the carrier body is made of high-strength, wear-resistant materials to ensure stable performance during long-term use. The elastic element of the clamping assembly provides uniform and durable clamping force, ensuring that the wafer does not shift during scanning. The positioning assembly is precision-machined, with its arc surface closely matching the arc edge of the wafer, effectively improving positioning accuracy.

[0042] In some embodiments of this application, the carrier body 1 is provided with several pick-and-place slots 14, which are used to place or remove wafers from the receiving slots 11. The pick-and-place slots 14 facilitate quick and accurate placement and removal of wafers 0 by operators, improving work efficiency. In actual operation, operators can easily place and secure wafers 0 into the receiving slots 11 using the pick-and-place slots 14; after scanning and inspection, wafers 0 can also be easily removed from the receiving slots 11 for subsequent processing.

[0043] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0044] The above description is only a detailed explanation of the preferred embodiments and principles of this application. For those skilled in the art, there may be changes in the specific implementation based on the ideas provided by this invention, and these changes should also be considered within the scope of protection of this application.

Claims

1. A wafer ultrasonic scanning carrier, characterized in that, The device includes a carrier body, a clamping assembly, and a positioning assembly. The carrier body has a receiving groove, a clamping groove, and a positioning groove. The receiving groove is used to place a wafer, the clamping groove is used to place the clamping assembly, and the positioning groove is used to place the positioning assembly. One end of the clamping assembly abuts against the flat edge of the wafer, and one end of the positioning assembly abuts against the arc edge of the wafer. The clamping assembly and the positioning assembly cooperate to clamp and position the wafer. The upper surface of the wafer protrudes from the upper surface of the carrier body.

2. The wafer ultrasonic scanning carrier according to claim 1, characterized in that, The vehicle body is provided with several receiving slots, each receiving slot is provided with at least one pressing slot and two positioning slots, the pressing slots and the positioning slots are located on the outside of the receiving slots and are arranged in sequence at intervals.

3. A wafer ultrasonic scanning carrier according to claim 2, characterized in that, The clamping assembly includes a base, a wedge block, an elastic element, a sliding assembly, and a limiting block. The sliding assembly and the limiting block are mounted on the base. One end of the elastic element is connected to the wedge block, and the other end abuts against the inner wall of the clamping groove. The sliding assembly is connected to the wedge block, and the wedge block has a wedge-shaped surface that mates with the wafer wedge.

4. A wafer ultrasonic scanning carrier according to claim 3, characterized in that, The sliding assembly includes a guide rail and a slider. The guide rail is disposed on the base, and the slider is connected to the wedge block. The slider and the guide rail are slidably connected. The limiting block has a limiting groove, and the guide rail passes through the limiting groove. By adjusting the distance between the slider and the limiting block, the movement position of the slider is limited.

5. A wafer ultrasonic scanning carrier according to claim 3, characterized in that, The elastic element is configured as a compression spring, and two compression springs are installed in each of the compression grooves.

6. A wafer ultrasonic scanning carrier according to claim 1, characterized in that, The vehicle body is provided with several positioning slots, and a positioning component is installed in each of the positioning slots.

7. A wafer ultrasonic scanning carrier according to claim 6, characterized in that, Multiple positioning components are configured, and each positioning component includes a positioning block. The positioning block has an arc surface that abuts against the arc edge of the wafer.

8. A wafer ultrasonic scanning carrier according to claim 1, characterized in that, The receiving groove includes a contoured notch and a hollowed-out groove. The contoured notch is used to support the wafer, and the hollowed-out groove is used to avoid the warped surface of the wafer.

9. A wafer ultrasonic scanning carrier according to claim 1, characterized in that, The carrier body is provided with several pick-and-place slots, which are used to place or remove wafers from the receiving slots.

10. A wafer ultrasonic scanning carrier according to claim 1, characterized in that, The vehicle body is equipped with at least two receiving slots.

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