PCB assembly and sound production equipment

Abstract

The invention discloses a PCB assembly and sound production equipment, and relates to the technical field of sound production equipment, and the PCB assembly comprises a power board, a mainboard, a power amplifier board, a grounding part and a bearing part. A first grounding layer is arranged in the power panel, a first conductive heat dissipation piece is arranged on the power panel, and the first grounding layer is electrically connected with the first conductive heat dissipation piece; a second grounding layer is arranged in the main board, a second conductive heat dissipation piece is arranged on the main board, and the second grounding layer is electrically connected with the second conductive heat dissipation piece; a third grounding layer is arranged in the power amplifier board, a third conductive heat dissipation piece is arranged on the power amplifier board, the third grounding layer is electrically connected with the third conductive heat dissipation piece, the first conductive heat dissipation piece and the second conductive heat dissipation piece are both fixedly connected with the third conductive heat dissipation piece, and the first conductive heat dissipation piece and the second conductive heat dissipation piece are both electrically connected with the third conductive heat dissipation piece; the grounding piece is electrically connected with the third conductive heat dissipation piece; the power board, the mainboard and the power amplifier board are arranged on the bearing part.

Description

Technical Field

[0001] This invention relates to the field of sound-generating equipment technology, and in particular to a PCB board assembly and a sound-generating device. Background Technology

[0002] With the development of the times, the number of PCBs (printed circuit boards) inside sound-producing equipment has gradually increased. It is no longer limited to a single motherboard working. Nowadays, the heat dissipation and grounding functions of each PCB in the equipment are usually completed independently, which can lead to uneven heat dissipation, small grounding area of ​​PCBs, resulting in local overheating and poor EMC (electromagnetic compatibility) of the equipment.

[0003] In related technologies, to ensure the safety of the working environment, the grounding level of the PCB board is expanded or terminals and wires are used to connect the grounding levels of each PCB board. However, this will occupy the internal space of the equipment, increase the internal wiring pressure, installation difficulty and production cost. At the same time, the grounding point is usually a point and surface contact, which has poor stability and is easily affected by external factors (such as vibration, displacement, surface oxidation, etc.), which may lead to conductivity interruption, increased contact resistance and other situations. Summary of the Invention

[0004] The main objective of this invention is to provide a PCB board assembly and a sound-generating device, which aims to improve the heat dissipation uniformity and grounding stability of each PCB board.

[0005] To achieve the above objectives, the PCB board assembly proposed in this invention includes a power board, a motherboard, a power amplifier board, a grounding component, and a carrier component. The power board has a first grounding layer and a first conductive heat sink, with the first grounding layer electrically connected to the first conductive heat sink. The motherboard has a second grounding layer and a second conductive heat sink, with the second grounding layer electrically connected to the second conductive heat sink. The power amplifier board has a third grounding layer and a third conductive heat sink, with the third grounding layer electrically connected to the third conductive heat sink. Both the first and second conductive heat sinks are fixedly connected to the third conductive heat sink, and both are electrically connected to the third conductive heat sink. The grounding component is electrically connected to the third conductive heat sink. The power board, the motherboard, and the power amplifier board are all mounted on the carrier component.

[0006] The present invention also proposes a sound-generating device, which includes the PCB board assembly described in the above embodiments. Attached Figure Description

[0007] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0008] Figure 1 This is a schematic diagram of a PCB board assembly according to an embodiment of the present invention; Figure 2 for Figure 1 Exploded view of the PCB board assembly from one perspective; Figure 3 for Figure 1 Exploded view of the PCB board assembly from another perspective; Figure 4 for Figure 3 A magnified view of a section at point A in the middle; Figure 5 for Figure 3 A magnified view of a section at point B in the middle; Figure 6 for Figure 3 A magnified view of a section at point C; Figure 7 for Figure 1 Another exploded view of the PCB board assembly; Figure 8 for Figure 1 Exploded view of the hidden structure of the PCB board assembly; Figure 9 for Figure 1 An exploded view of the PCB assembly after another part of the structure has been hidden.

[0009] Explanation of icon numbers: 100. PCB board assembly; 11. Power board; 111. First exposed part; 12. First conductive heat sink; 121. Heat sink base plate; 122. Side plate; 1221. Ear plate; 12a. Receiving groove; 21. Motherboard; 211. Second exposed part; 212. Fourth exposed part; 22. Second conductive heat sink; 31. Power amplifier board; 311. Third exposed part; 32. Third conductive heat sink; 321. Heat sink substrate; 321a. Heat sink groove; 3211. Heat sink protrusion; 322. Extension; 4. Grounding components; 5. Load-bearing components; 61. First fastener; 62. Second fastener; 63. Third fastener; 7. Flexible conductive component; 71. First conductive part; 72. Second conductive part; 8. Heat dissipation fins; 81. Base section; 82. Fin section.

[0010] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0011] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0012] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0013] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0014] This invention proposes a PCB board assembly 100.

[0015] Please see Figures 1 to 3In one embodiment of the present invention, the PCB board assembly 100 includes a power board 11, a main board 21, a power amplifier board 31, a grounding component 4, and a carrier component 5. The power board 11 has a first grounding layer and a first conductive heat sink 12, which is electrically connected to the first conductive heat sink 12. The main board 21 has a second grounding layer and a second conductive heat sink 22, which is electrically connected to the second conductive heat sink 22. The power amplifier board 31 has a third grounding layer and a third conductive heat sink 32, which is electrically connected to the third conductive heat sink 32. The first conductive heat sink 12 and the second conductive heat sink 22 are both fixedly connected to the third conductive heat sink 32, and both are electrically connected to the third conductive heat sink 32. The grounding component 4 is electrically connected to the third conductive heat sink 32. The power board 11, the main board 21, and the power amplifier board 31 are all mounted on the carrier component 5.

[0016] It should be noted that the PCB boards involved in the technical solutions proposed in this application include three types: motherboard 21, power amplifier board 31, and power supply board 11. For ease of describing the commonalities among the three, motherboard 21, power amplifier board 31, and power supply board 11 are collectively referred to as PCB boards in this application. Similarly, the conductive heat dissipation components involved in the technical solutions proposed in this application include first conductive heat dissipation component 12, second conductive heat dissipation component 22, and third conductive heat dissipation component 32. For ease of describing the commonalities among the three, first conductive heat dissipation component 12, second conductive heat dissipation component 22, and third conductive heat dissipation component 32 are collectively referred to as conductive heat dissipation components. In addition, the first ground layer, second ground layer, and third ground layer are collectively referred to as the ground layer of each PCB board.

[0017] In this embodiment, the power supply board 11 is used to perform mains power rectification, power factor correction, and multiple DC outputs, providing rated voltage and current for subsequent circuits. The main board 21 houses the central processing unit, memory, and input / output interfaces, used to execute control programs and generate and distribute audio data and logic signals. The power amplifier board 31 receives audio signals, amplifies them with voltage and current, and drives the speakers to achieve electroacoustic conversion. By fixing and electrically connecting the conductive heat sinks on each board to each other, and finally grounding them uniformly through the grounding component 4, the heat dissipation and grounding functions are integrated, making it suitable for electronic devices with multiple boards working together.

[0018] Specifically, the power board 11 has a first ground layer inside, which is a copper-plated area parallel to the surface of the power board 11. A first conductive heat sink 12 is attached to the surface of the power board 11. The first conductive heat sink 12 can be made of a metal material with high conductivity and thermal conductivity, such as an aluminum heat sink. It is in close contact with the heat-generating elements on the power board 11 to quickly conduct heat away. It can be directly connected to the first ground layer by soldering or screws, so that heat and charge are discharged synchronously. Similarly, the motherboard 21 has a second ground layer inside, and a second conductive heat sink 22 is attached to the surface of the motherboard 21. The power amplifier board 31 has a third ground layer inside, and a third conductive heat sink 32 is attached to the surface of the power amplifier board 31.

[0019] The first conductive heat sink 12 and the third conductive heat sink 32, as well as the second conductive heat sink 22 and the third conductive heat sink 32, can be connected by screws to form surface contact. Multiple screws pass through each heat sink and the corresponding PCB board to achieve mechanical connection and fixation. The screws are made of conductive material, ensuring electrical conductivity between the ground plane of each PCB board and the conductive heat sink. This connection method integrates the originally dispersed conductive heat sinks into a whole, allowing heat to flow freely between them. Heat in high-power areas is distributed to low-power areas, significantly reducing the temperature gradient on the board surface. Simultaneously, the ground planes of each PCB board are connected to the grounding component 4 through the integrated structure of the conductive heat sinks. Compared to connections via wires and terminals, the cross-sectional area of ​​the screw connection between the conductive heat sinks is larger, and the grounding path is shorter, resulting in a decrease in common-mode interference voltage and radiated emission during EMC testing. The grounding component 4 can be made of metal sheet or metal mesh. One end is connected to the edge of the third conductive heat sink 32 by riveting or screwing, and the other end is connected to the receiving component or the metal shell of the equipment to achieve single-point grounding of the system. The cross-sectional width of the grounding component 4 is designed according to the maximum fault current to ensure that it will not melt during transient surges. The bearing component 5 can be made of injection molded bracket. Corresponding to the power board 11, the main board 21, and the power amplifier board 31, it is provided with slots and positioning posts. Each PCB board is connected and fixed to the positioning posts or the body of the bearing component 5 by screws. The bracket plays a role in bearing and limiting.

[0020] Through the above structure, this embodiment improves the EMC performance of the equipment: Traditional designs use an expanded ground level, but the expansion is limited. This embodiment integrates the conductive heat sinks on each PCB board, connecting them into a whole, and finally connecting them to grounding component 4 at one point, greatly improving the EMC performance of the equipment and providing a safe environment for the internal electronic components. This embodiment also achieves uniform heat dissipation on each PCB board, improving heat dissipation efficiency: Since each PCB board has different operating requirements, the heat generated is different. The conductive heat sinks on each PCB board are interconnected and mutually conductive, allowing heat to be dissipated evenly, reducing the risk of local overheating and improving the overall heat dissipation efficiency. This embodiment makes reasonable use of internal space, eliminating terminals and wires, reducing cable management pressure, and the interconnection of conductive heat sinks saves internal space. This embodiment also simplifies the installation process: no manual installation of terminals and wires is required, saving labor costs. Correspondingly, it also saves the cost of terminals, wires, and original heat sink fixing screws, thus reducing product manufacturing costs.

[0021] Further, please refer to Figure 2 and Figures 4 to 6 In one embodiment of the present invention, the first grounding layer has a first exposed portion 111, which is exposed on the outer wall of the power board 11 and connected to the first conductive heat sink 12; the second grounding layer has a second exposed portion 211, which is exposed on the outer wall of the motherboard 21 and connected to the second conductive heat sink 22; the third grounding layer has a third exposed portion 311, which is exposed on the outer wall of the power amplifier board 31 and connected to the third conductive heat sink 32.

[0022] In this embodiment, by providing exposed portions on the power board 11, main board 21, and power amplifier board 31, the grounding layer inside the board is made in direct contact with the corresponding conductive heat sink, achieving low-resistance grounding. This is suitable for electronic devices with multi-layer boards and dense surface components, where it is impossible to arrange a large number of vias inside the board. Specifically, taking the power board 11 and the first conductive heat sink 12 as examples, the first grounding layer inside the power board 11 is a full-layer copper plating. A hole is opened on the outer wall of the power board 11 to expose the copper surface, forming the first exposed portion 111. The surface of the first exposed portion 111 can be treated with anti-oxidation and is attached to the bottom surface of the first conductive heat sink 12. The first conductive heat sink 12 can be made of aluminum heat sink, with the corresponding area on its bottom surface de-anodized and nickel-plated to ensure long-term reliable contact with the copper surface. A hole can also be opened next to the first exposed portion 111, and a screw can be passed through the hole and connected to the first conductive heat sink 12 to provide locking force, so that the first exposed portion 111 and the first conductive heat sink 12 remain in close contact to ensure charge conduction. The main board 21 and the second conductive heat sink 22, the power amplifier board 31 and the third conductive heat sink 32 can be referenced from the power board 11 and the first conductive heat sink 12, so they will not be described again.

[0023] Further, please refer to Figure 3 and 9 In one embodiment of the present invention, the PCB board assembly 100 further includes a first fastener 61, which passes through the power board 11 and fixes the power board 11 and the first conductive heat sink 12, and the first fastener 61 is electrically connected to the first ground layer and the first conductive heat sink 12.

[0024] In this embodiment, the power board 11 and the first conductive heat sink 12 are directly locked together by fasteners, thus simultaneously completing the electrical connection and achieving both mechanical fixation and low-resistance grounding. Specifically, the first fastener 61 can be a metal screw, with the screw shank penetrating a pre-drilled hole in the power board 11. The hole wall is composed of a first grounding layer. After the screw is screwed into the first conductive heat sink 12, the head presses against the surface of the power board 11, and the shank contacts the first grounding layer inside the hole wall and the first conductive heat sink 12, thereby achieving an electrical connection between the first grounding layer and the first conductive heat sink 12.

[0025] Further, please refer to Figure 2 , Figure 7 and Figure 8 In one embodiment of the present invention, the PCB board assembly 100 further includes a second fastener 62, which is detachably connected to the first conductive heat sink 12 and the third conductive heat sink 32, and electrically connected to the first conductive heat sink 12 and the third conductive heat sink 32.

[0026] In this embodiment, the first conductive heat sink 12 and the third conductive heat sink 32 are directly locked together by detachable metal fasteners, simultaneously completing the mechanical and electrical connection, facilitating on-site maintenance or module replacement. Specifically, the first conductive heat sink 12 can be an aluminum heat sink located on the surface of the power board 11, with a section of bare aluminum without anodizing extending from its edge, and through holes machined in this area; the third conductive heat sink 32 is also an aluminum heat sink located on the surface of the power amplifier board 31, with through holes machined in the corresponding positions, and the area around the through holes can be deoxidized and nickel-plated to ensure long-term conductive stability. The second fastener 62 can be a combination of a stainless steel screw and a lock nut, with the screw passing through the through holes of the first conductive heat sink 12 and the third conductive heat sink 32 in sequence, and locked with a nut on the other side to form a continuous low-resistance channel. Alternatively, threads can be directly provided in the through holes of the first conductive heat sink 12 and the third conductive heat sink 32, directly connecting the first conductive heat sink 12 and the third conductive heat sink 32 by screws. This detachable connection keeps the power board 11 and the amplifier board 31 firmly connected after installation. During maintenance, the screws can be loosened to separate the two boards without disassembling the entire heat dissipation system, thus improving maintenance convenience.

[0027] Further, please refer to Figure 2 , Figure 3 , Figure 5 and Figure 8In one embodiment of the present invention, the PCB board assembly 100 further includes a flexible conductive element 7 and a third fastener 63. The second ground layer also has a fourth exposed portion 212. The second exposed portion 211 and the fourth exposed portion 212 are respectively exposed on the outer walls of both sides of the motherboard 21. The flexible conductive element 7 has a first conductive portion 71 and a second conductive portion 72 connected to each other. The two sides of the first conductive portion 71 abut against the second exposed portion 211 and the second conductive heat sink 22, respectively. The two sides of the second conductive portion 72 abut against the fourth exposed portion 212 and the third conductive heat sink 32, respectively. The third fastener 63 is detachably connected to the third conductive heat sink 32, the motherboard 21 and the second conductive heat sink 22 in sequence.

[0028] In this embodiment, a grounding and heat dissipation bypass is simultaneously established on both sides of the motherboard 21 using a flexible conductive element 7, and locked in place by a third fastener 63. This achieves a detachable, low-resistance connection between the motherboard 21 and the heat sinks on both sides. Compared to the traditional grounding method that connects the exposed copper of the grounding layer on each PCB board to the hardware components, where the traditional charge conduction method is point-to-surface contact, this invention attaches a flexible conductive element 7 that can rotate 180° to the grounding point of the motherboard 21, changing the charge conduction method between the motherboard 21 and the heat sink to surface-to-surface, avoiding grounding breaks or increased resistance. This ensures that the grounding of the motherboard 21 is not just one-end grounding, but grounded at both ends, achieving a low-cost, high-reliability, and low-impedance grounding connection. Specifically, the motherboard 21 has a second grounding layer inside, which is a complete copper plane. Windows are opened on the left and right sides of the motherboard 21, forming a second exposed part 211 and a fourth exposed part 212. The surfaces of the two exposed parts are flush with the outer wall of the motherboard 21. The flexible conductive element 7 can be made of conductive cloth. The conductive fabric substrate is polyester fiber, with surface electroplating (metals such as copper, nickel, and silver) or coating (electroplated adhesive, carbon paste). The conductive fabric is soft, thin, and can be compressed or folded 180°. Figure 5 As shown; the third fastener 63 is a metal screw, with its shank sequentially passing through the third conductive heat sink 32, the main board 21, and the second conductive heat sink 22, and is locked at the other end with a metal nut or directly screwed into the carrier 5. During assembly, the flexible conductive element 7 is first pre-installed on the exposed parts on both sides of the main board 21, then the main board 21 is placed into the slot of the carrier 5, and the heat sinks on both sides are closed, compressing the flexible conductive element 7; then the third fastener 63 is screwed in.

[0029] Further, please refer to Figure 2 , Figure 7 and Figure 9In one embodiment of the present invention, the first conductive heat sink 12 includes a heat sink base plate 121 and two side plates 122 respectively connected to the two side edges of the heat sink base plate 121. The two side plates 122 and the heat sink base plate 121 enclose to form a receiving groove 12a. The power board 11 is disposed in the receiving groove 12a. The heat sink base plate 121 abuts against the outer wall of the power board 11 and is electrically connected to the first ground layer. An ear piece 1221 is formed on one side plate 122 and is electrically connected to the third conductive heat sink 32.

[0030] In this embodiment, the heat dissipation base plate 121 and the two side plates 122 of the first conductive heat sink 12 form a rectangular receiving groove 12a. The power board 11 is placed in the groove, and the heat dissipation base plate 121 is in contact with the first exposed portion 111 of the bottom surface of the power board 11, so as to realize the synchronous conduction of heat and current. At the same time, the side plates 122 expand the heat dissipation area and shield the heat-generating elements, which not only improves the heat dissipation area, but also prevents damage to the power board 11 during disassembly and maintenance. Specifically, the first conductive heat sink 12 can be formed in one piece from aluminum material. The heat dissipation base plate 121 is a rectangular flat plate, and the two side plates 122 are perpendicular to the base plate. The three form a receiving groove 12a. The anodized layer is removed from the inner surface of the base plate and nickel is plated. It is in close contact with the first exposed portion 111 of the bottom surface of the power board 11 to form a surface contact, which is used to diffuse the heat of the power board 11 along the plane of the base plate and to conduct the charge of the first ground layer into the base plate. The side plate 122 is slightly higher than the highest heat-generating element of the power board 11. A ventilation gap is maintained between the element and the inner surface of the side plate 122. The thickness of the side plate 122 is the same as that of the base plate, which maintains mechanical strength and also acts as a heat-conducting fin to continue to diffuse the heat from the base plate into the space, thereby improving heat dissipation efficiency. A lug 1221 extends horizontally from the top of one side plate 122. The surface of the lug 1221 is deoxidized and nickel-plated. It is locked to the third conductive heat sink 32 by the second fastener 62. The side plate 122, the lug 1221, and the third conductive heat sink 32 form a continuous low-resistance channel.

[0031] Further, please refer to Figure 7 and Figure 8 In one embodiment of the present invention, the third conductive heat sink 32 includes a heat sink substrate 321, an extension 322 is provided on the heat sink substrate 321, the extension 322 is disposed away from the heat sink substrate 321 to one side, and the extension 322 is electrically fixedly connected to the first conductive heat sink 12 or the second conductive heat sink 22.

[0032] In this embodiment, the heat dissipation substrate 321 and the extension 322 are integrally formed. The power amplifier board 31 is arranged away from the power board 11 and the main board 21. The extension 322 spans the heat dissipation gap and is electrically fixed to the first conductive heat sink 12 or the second conductive heat sink 22, realizing the cross-distance transmission of heat and charge. This is suitable for scenarios where the power amplifier board 31 needs to be physically isolated while maintaining continuous heat dissipation and grounding. Specifically, the third conductive heat sink 32 can be die-cast from aluminum material, and the heat dissipation substrate 321 can be a flat plate structure with its back side attached to the heat source of the power amplifier board 31. The extension 322 extends outward from the edge of the heat dissipation substrate 321, with an L-shaped or straight strip cross section and the same thickness as the substrate. The surface is de-anodized and nickel-plated to form a conductive area. The carrier 5 has a heat dissipation gap between the power amplifier board 31, the power supply board 11, and the main board 21. The extension 322 crosses the gap, and the end is locked to the ear piece 1221 of the first conductive heat dissipation component 12 by the second fastener 62, or locked to the second conductive heat dissipation component 22 by the third fastener 63, so as to realize the transfer of heat and the conduction of charge.

[0033] Further, please refer to Figure 7 and Figure 8 In one embodiment of the present invention, the heat dissipation substrate 321 is bent and formed with alternating heat dissipation grooves 321a and heat dissipation protrusions 3211. The heat dissipation protrusions 3211 abut against the power amplifier board 31 and are electrically connected to the third ground layer.

[0034] In this embodiment, the third conductive heat sink 32 is formed by bending and shaping alternating heat sink grooves 321a and heat sink protrusions 3211 on the surface of the heat sink substrate 321. The top surface of the heat sink protrusions 3211 abuts against the outer wall of the power amplifier board 31 and is electrically connected to the third ground layer. Compared with the flat plate shape, this increases the heat dissipation area and improves the heat dissipation efficiency. Specifically, the third conductive heat sink 32 can be integrally stamped and bent from aluminum material. The heat sink substrate 321 is formed with alternating heat sink grooves 321a and heat sink protrusions 3211, making the heat sink substrate 321 as a whole wavy shape. The peaks of the waves form the heat sink protrusions 3211, and the troughs form the heat sink grooves 321a. The protrusions and grooves alternate continuously along the plate surface. The top surface of the heat sink protrusions 3211 is de-anodized and nickel-plated to form a conductive area. This area is connected to the third exposed part 311 on the bottom surface of the power amplifier board 31 to conduct the charge of the third ground layer into the heat sink substrate 321 and quickly carry away the heat of the power amplifier chip. The heat sink 321a forms an air channel on the inside. When the system airflow passes through the sink, it carries away the heat transmitted from the wave crest and increases the heat dissipation area, thereby improving the heat dissipation efficiency.

[0035] Further, please refer to Figure 2 In one embodiment of the present invention, the PCB board assembly 100 further includes heat dissipation fins 8, which include a base portion 81 and a plurality of fin portions 82 spaced apart on the base portion 81. The base portion 81 is connected to the side of the motherboard 21 facing away from the second conductive heat sink 22.

[0036] In this embodiment, the heat sink fins 8 are attached to the side of the motherboard 21 facing away from the second conductive heat sink 22 via the base part 81. They are not directly electrically connected to the second ground layer inside the motherboard 21, and only achieve localized efficient heat dissipation. This can be set for components such as chips that generate a lot of heat and heat up quickly.

[0037] Specifically, the heat sink fins 8 are made of die-cast aluminum or formed by a toothed process. The base 81 is a rectangular flat plate with a thickness sufficient to prevent deformation after fitting with the motherboard 21. The fins 82 are perpendicular to the base 81 and arranged at equal intervals. The fin height, thickness, and spacing are set according to the chip power consumption and available airflow. No exposed grounding portion is provided in the corresponding area of ​​the motherboard 21, allowing the heat sink fins 8 to only perform a thermal function without introducing additional ground potential. Chip heat is conducted to the fins 82 via the base 81 and then carried away by the system airflow, reducing the chip junction temperature peak and preventing heat accumulation that could lead to localized overheating. This rapid dissipation of localized high heat reduces heat accumulation and promotes uniform heat dissipation of the device.

[0038] This invention also proposes a sound-generating device, which includes the PCB board assembly 100 in the above embodiments. Since this sound-generating device adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated further here. This sound-generating device can be a device specifically for playing audio, such as a speaker, or a device integrating audio and video playback functions; this embodiment does not limit this. The carrier 5 can be the device's outer casing or a mounting bracket located within the casing, etc., which can accommodate the power board 11, the main board 21, and the amplifier board 31; this embodiment also does not limit this.

[0039] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A PCB board assembly, characterized in that, The PCB board assembly includes: A power board, wherein a first grounding layer is provided inside the power board, and a first conductive heat sink is provided on the power board, and the first grounding layer is electrically connected to the first conductive heat sink; The motherboard has a second grounding layer inside and a second conductive heat sink on the motherboard. The second grounding layer is electrically connected to the second conductive heat sink. A power amplifier board, wherein a third grounding layer is provided inside the power amplifier board, a third conductive heat sink is provided on the power amplifier board, the third grounding layer is electrically connected to the third conductive heat sink, and the first conductive heat sink and the second conductive heat sink are both fixedly connected to the third conductive heat sink, and the first conductive heat sink and the second conductive heat sink are both electrically connected to the third conductive heat sink. Grounding element, which is electrically connected to the third conductive heat sink; and The power supply board, the main board, and the power amplifier board are all mounted on the carrier.

2. The PCB board assembly as described in claim 1, characterized in that, The first grounding layer has a first exposed portion, which is exposed on the outer wall of the power board and connected to the first conductive heat sink. The second grounding layer has a second exposed portion, which is exposed on the outer wall of the motherboard and connected to the second conductive heat sink. The third grounding layer has a third exposed portion, which is exposed on the outer wall of the power amplifier board and connected to the third conductive heat sink.

3. The PCB board assembly as described in claim 2, characterized in that, The PCB board assembly further includes a first fastener, which passes through the power board and fixes the power board to the first conductive heat sink, and the first fastener is electrically connected to the first ground layer and the first conductive heat sink.

4. The PCB board assembly as described in claim 2, characterized in that, The PCB assembly further includes a second fastener, which detachably connects the first conductive heat sink to the third conductive heat sink and electrically connects the first conductive heat sink to the third conductive heat sink.

5. The PCB board assembly as described in claim 2, characterized in that, The PCB assembly further includes a flexible conductive element and a third fastener. The second ground layer also has a fourth exposed portion. The second exposed portion and the fourth exposed portion are respectively exposed on the outer walls of both sides of the motherboard. The flexible conductive element has a first conductive portion and a second conductive portion that are connected to each other. The two sides of the first conductive portion abut against the second exposed portion and the second conductive heat sink, respectively. The two sides of the second conductive portion abut against the fourth exposed portion and the third conductive heat sink, respectively. The third fastener is detachably connected to the third conductive heat sink, the motherboard, and the second conductive heat sink in sequence.

6. The PCB board assembly as described in claim 1, characterized in that, The first conductive heat dissipation component includes a heat dissipation base plate and two side plates respectively connected to the two sides of the heat dissipation base plate. The two side plates and the heat dissipation base plate form a receiving groove. The power board is disposed in the receiving groove. The heat dissipation base plate abuts against the outer wall of the power board and is electrically connected to the first grounding layer. An ear piece is formed on the side plate, and the ear piece is electrically connected to the third conductive heat sink.

7. The PCB board assembly as described in claim 1, characterized in that, The third conductive heat sink includes a heat sink substrate, an extension portion is provided on the heat sink substrate, the extension portion is disposed away from the heat sink substrate to one side, and the extension portion is electrically fixedly connected to the first conductive heat sink or the second conductive heat sink.

8. The PCB board assembly as described in claim 7, characterized in that, The heat dissipation substrate is bent and formed with alternating heat dissipation grooves and heat dissipation protrusions. The heat dissipation protrusions abut against the power amplifier board and are electrically connected to the third ground layer.

9. The PCB board assembly as described in claim 1, characterized in that, The PCB assembly further includes heat dissipation fins, each heat dissipation fin comprising a base portion and a plurality of fin portions spaced apart on the base portion, the base portion being connected to the side of the motherboard facing away from the second conductive heat sink.

10. A sound-generating device, characterized in that, The sound-generating device includes a PCB board assembly as described in any one of claims 1 to 9.

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