Double-layer substrate chip transfer method and laser mass transfer platform

Abstract

The invention relates to the technical field of chip transfer, in particular to a double-layer substrate chip transfer method and a laser mass transfer platform. The method comprises the following steps of: dividing each chip transfer area according to a first interval between to-be-transferred chip positions in a first direction of a transfer substrate, a second interval between corresponding chip bearing positions in the first direction of a bearing substrate and a first number of energy action points in the first direction in an energy array; and then determining a first moving speed of the transfer substrate and a second moving speed of the bearing substrate according to the first spacing, the second spacing, the first number and the interval time of the emission energy. When the chips are transferred, the transfer substrate is controlled to move at the first moving speed, the bearing substrate is controlled to move at the second moving speed, and the energy array is emitted according to the interval time, so that the current chips are regularly transferred to the corresponding position of the bearing substrate in batches, repeated start and stop alignment is not needed, and the efficiency is improved. And motion errors caused by motion starting and stopping are avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip transfer, in particular to a double-layer substrate chip transfer method and a laser mass transfer platform. BACKGROUND

[0002] Mass transfer refers to separating a large number of tiny workpieces from a transfer substrate and transferring them to a receiving substrate. The common mass transfer technologies can be divided into two categories: contact transfer and non-contact transfer. In order to achieve high efficiency, non-contact transfer is preferred, such as laser-assisted transfer, in which a laser emitter emits laser to strip the chips on the transfer substrate, and the chips are transferred to the receiving substrate. However, in the existing non-contact transfer technology, the laser action point, the position of the chip to be transferred, and the position of the chip receiving position need to be aligned repeatedly, which affects the transfer efficiency, and the repeated start-stop will bring certain motion error, affecting the transfer accuracy. SUMMARY

[0003] The main purpose of the present application is to provide a double-layer substrate chip transfer method and a laser mass transfer platform, which aims to reduce the start-stop alignment process when transferring chips, avoid the motion error caused by start-stop, and improve the transfer efficiency and accuracy.

[0004] To achieve the above purpose, the double-layer substrate chip transfer method provided by the present application is applied to non-contact mass transfer, which comprises the following steps: Obtaining the first interval between the positions of the chips to be transferred in the first direction of the transfer substrate, the second interval between the corresponding chip receiving positions in the first direction of the receiving substrate, the first number of energy action points in the first direction of the energy array, and the interval time of energy output; wherein the second interval is an integer multiple of the first interval; Adjusting the interval between the energy action points in the first direction of the energy array to the second interval; According to the first interval, the second interval and the first number, a plurality of continuous chip transfer regions are divided in the first direction; in each chip transfer region, the number of chips in the first direction is the quotient of the second interval divided by the first interval multiplied by the first number; The quotient of the first interval divided by the interval time is taken as the first moving speed of the transfer substrate; the product of the quotient of the second interval divided by the interval time multiplied by the first number is taken as the second moving speed of the receiving substrate; For each chip transfer region, a chip transfer step is performed, and the chip transfer step is: The transfer substrate is controlled to move along the first direction at a first moving speed, the receiving substrate is controlled to move at a second moving speed, and the energy array is controlled to emit energy at interval times; so that when the energy array emits energy, the plurality of chip positions in the chip transfer region are aligned with the corresponding energy action points, and the plurality of receiving substrate corresponding chip receiving positions are aligned with the corresponding energy action points.

[0005] In the double-layer substrate chip transfer method, when a row of chips in the current chip transfer region is transferred, if there is a next chip transfer region, a region switching jump step is performed, and then the chip transfer step is repeated; The region switching jump step is: The transfer substrate is controlled to move at a first variable speed, so that when the next chip receiving position of the receiving substrate is aligned with the corresponding energy action point, the first chip to be transferred in the first direction of the next chip transfer region is aligned with the first energy action point in the first direction of the energy array, and the speed of the transfer substrate moving along the first direction is the first moving speed.

[0006] In the double-layer substrate chip transfer method, when the transfer substrate moves at the first variable speed, the receiving substrate is controlled to continue to move along the first direction at the second moving speed, and the time length of the first variable speed motion is a first preset number of interval times.

[0007] In the double-layer substrate chip transfer method, the first variable speed motion is a variable speed motion of accelerating first and then decelerating, and in the first variable speed motion, the acceleration interval time, the deceleration interval time, the acceleration of the acceleration interval and the acceleration of the deceleration interval of the transfer substrate satisfy the following conditions: ; ; ; Among them, The acceleration of the acceleration interval is represented by a, The acceleration of the deceleration interval is represented by b, The acceleration interval time is represented by t1, The deceleration interval time is represented by t2, The first preset number is represented by n1, The first interval is represented by d1, The second interval is represented by d2, The first number is represented by n.

[0008] In the double-layer substrate chip transfer method, when a row of chips in the current chip transfer region is transferred, if there is a next chip transfer region, a region switching jump step is performed, and then the chip transfer step is repeated; The line jump step is: controlling the transfer substrate and the receiving substrate to make variable speed movement in the first direction respectively, and controlling the transfer substrate and the receiving substrate to make variable speed movement in the second direction, so that in the current chip transfer area, the last chip to be transferred in another row in the first direction is aligned with the last energy action point of the energy array in the first direction; the last chip receiving position of another row of the receiving substrate in the first direction is aligned with the last energy action point of the energy array in the first direction; and when aligned, the speed value of the transfer substrate in the opposite direction of the first direction is the first moving speed, the speed value of the receiving substrate in the opposite direction of the first direction is the second moving speed, and the speed value of the transfer substrate and the receiving substrate in the second direction is zero.

[0009] In the above double-layer substrate chip transfer method, the time for completing the line jump step is a second preset number of interval times.

[0010] In the above double-layer substrate chip transfer method, in the line jump step, the transfer substrate and the receiving substrate start and end the variable speed movement in the first direction and the variable speed movement in the second direction at the same time.

[0011] In the above double-layer substrate chip transfer method, in the line jump step, the transfer substrate and the receiving substrate make variable speed movement in the first direction to meet the following conditions: ( )= ; ; Wherein, V1 represents the first moving speed of the transfer substrate in the first direction, a1 represents the acceleration of the variable speed movement of the transfer substrate in the first direction, T represents the interval time, N2 represents the second preset number, V2 represents the second moving speed of the receiving substrate in the first direction, a2 represents the acceleration of the variable speed movement of the receiving substrate in the first direction; The transfer substrate and the receiving substrate make variable speed movement in the second direction to meet the following conditions: ; ; = ; ; ; = ; Wherein, This represents the acceleration of the transfer substrate in the acceleration region along the second direction. This indicates the time the substrate is transferred in the acceleration zone in the second direction. This represents the acceleration of the transfer substrate in the deceleration region along the second direction. This indicates the time the transfer substrate spends in the deceleration zone in the second direction. This indicates the third spacing between the current chip row and the next transferred chip row on the transfer substrate in the second direction; This indicates the acceleration of the substrate in the acceleration zone in the second direction. This indicates the time the substrate receiving the signal in the second direction is in the acceleration zone. This indicates the acceleration of the receiving substrate in the second direction during the deceleration range. This indicates the time the receiving substrate spends in the deceleration zone in the second direction. This indicates the fourth spacing between the current chip row and the next chip row in the second direction of the receiving substrate.

[0012] In the above-described double-layer substrate chip transfer method, a positioning step is included before transferring the first chip in the first row of the first chip transfer region in the first direction. The positioning step includes: Align the first energy application point of the energy array in the first direction, the working origin of the transfer substrate, and the working origin of the receiving substrate with each other. The working origin of the transfer substrate is obtained at a first distance from the first chip position in the first direction in the first direction, a second distance from the first chip position in the first direction in the second direction, a third distance from the working origin of the receiving substrate in the first direction to the first receiving chip position in the first direction, and a fourth distance from the working origin of the receiving substrate in the second direction to the first receiving chip position in the first direction. Based on the first distance, second distance, third distance, and fourth distance, the transfer substrate and the receiving substrate are controlled to move at varying speeds in the first direction and / or the second direction, respectively, with the second direction being horizontal and perpendicular to the first direction; so that after a third preset number of time intervals, in the first chip transfer area along the first direction, the first chip to be transferred along the first direction is aligned with the first energy application point of the energy array along the first direction, and the first chip receiving position of the receiving substrate along the first direction is aligned with the first energy application point of the energy array along the first direction; and at this time, the speed at which the transfer substrate moves in the first direction is the first moving speed, the speed at which the receiving substrate moves in the first direction is the second moving speed, and the speeds at which both the transfer substrate and the receiving substrate move in the second direction are zero.

[0013] The second aspect of this invention discloses a laser mass transfer platform applied in the above-mentioned bilayer substrate chip transfer method, wherein the laser mass transfer platform comprises: The acquisition module is used to acquire a first spacing between the positions of the chips to be transferred in the first direction of the transfer substrate, a second spacing between the corresponding chip receiving positions in the first direction of the receiving substrate, a first number of laser action points in the first direction of the laser array, and the interval time for the laser array to emit lasers; wherein, the second spacing is an integer multiple of the first spacing; An adjustment module is used to adjust the spacing between energy application points in the first direction of the energy array to the second spacing. The zoning module is used to divide multiple continuous chip transfer regions along a first direction based on the first spacing, the second spacing, and the first quantity; in each chip transfer region, the number of chips in the first direction is the quotient of the second spacing divided by the first spacing multiplied by the first quantity; The determining module is used to take the quotient of the first spacing divided by the interval time as the first moving speed of the transfer substrate; and to take the product of the quotient of the second spacing divided by the interval time and the first quantity as the second moving speed of the receiving substrate. The control module is used to perform a chip transfer step for each chip transfer region, wherein the chip transfer step is as follows: The transfer substrate is controlled to move along a first direction at a first moving speed, the receiving substrate is controlled to move at a second moving speed, and the laser array is controlled to emit lasers at intervals; such that when the laser array emits lasers, multiple chip positions in the chip transfer area are aligned with their corresponding laser action points, and multiple receiving substrates are aligned with their corresponding chip receiving positions with their corresponding laser action points.

[0014] The technical solution provided by this invention may include the following beneficial effects: The dual-layer substrate chip transfer method provided by this invention first divides each chip transfer region according to a first spacing between the positions of the chips to be transferred along a first direction of the transfer substrate, a second spacing between the corresponding chip receiving positions along a first direction of the receiving substrate, and a first number of energy application points along a first direction in the energy array. Then, a first moving speed of the transfer substrate and a second moving speed of the receiving substrate are determined based on the first spacing, the second spacing, the first number, and the interval between energy emission. During chip transfer, the transfer substrate is controlled to move along the first direction at the first moving speed, and the receiving substrate is controlled to move at the second moving speed, while emitting energy at intervals, thus achieving a regular and batch transfer of the current chip transfer region to the corresponding position on the receiving substrate. During the transfer process, the transfer substrate and the receiving substrate maintain their respective speeds, eliminating the need for repeated start-stop alignment and avoiding motion errors caused by start-stop movements. Furthermore, multiple chips can be transferred in batches, further improving the efficiency of chip transfer. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1 This is a flowchart of one embodiment of the double-layer substrate chip transfer method of the present invention; Figure 2 This is a schematic diagram of the chip arrangement on the transfer substrate in one embodiment of the double-layer substrate chip transfer method of the present invention; Figure 3 This is a schematic diagram showing the chip receiving position arrangement of the receiving substrate in one embodiment of the double-layer substrate chip transfer method of the present invention. Figure 4 This is a schematic diagram illustrating the batch transfer of chips in one embodiment of the dual-layer substrate chip transfer method of the present invention; Figure 5 This is a schematic diagram showing the changes in the first chip transfer region before and after transfer in one embodiment of the dual-layer substrate chip transfer method of the present invention. Figure 6 This is a schematic diagram illustrating the changes before and after a region switching jump in one embodiment of the dual-layer substrate chip transfer method of the present invention; Figure 7 This is a schematic diagram illustrating the transfer of multiple rows of chips in one embodiment of the double-layer substrate chip transfer method of the present invention. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0018] In one embodiment, such as Figure 1 As shown, a method for transferring chips on a dual-layer substrate is provided. This embodiment illustrates the application of this method to a terminal. It is understood that this method can also be applied to a server, and can also be applied to a system including a terminal and a server, and can be implemented through the interaction between the terminal and the server.

[0019] The following is combined Figure 1This invention describes a bilayer substrate chip transfer method according to embodiments of the present invention, applied to non-contact mass transfer, such as laser-assisted transfer, electric field-assisted transfer, and piezoelectric-driven jet transfer. The following explanation uses laser-assisted transfer of Micro LED chips as an example to illustrate the bilayer substrate chip transfer method. The bilayer substrate chip transfer method includes the following steps: Step S1: Obtain the first spacing between the positions of the chips 3 to be transferred in the first direction of the transfer substrate 1, the second spacing between the corresponding receiving positions of the chips 3 in the first direction of the receiving substrate 2, the first number of energy application points 41 in the first direction of the energy array 4, and the interval time of energy output; wherein, the second spacing is an integer multiple of the first spacing.

[0020] Specifically, images of the transfer substrate 1 and the receiving substrate 2 can be acquired using an industrial camera. A visual recognition algorithm is then used to identify the first spacing between the positions of the chips 3 to be transferred in the first direction, and the second spacing between the corresponding receiving positions of the chips 3 on the receiving substrate 2 in the first direction. Furthermore, the first number of energy application points 41 in the first direction of the energy array 4 and the interval time of energy output are preset in the operating parameters of the energy output device 42 according to requirements.

[0021] For example, in some specific application scenarios, such as Figure 2 and Figure 4 As shown, the chips 3 on the transfer substrate 1 are arranged in an array. In the first direction, the spacing between the chips 3 will be consistent, denoted as the first spacing. In the second direction, the spacing between chips 3 remains consistent, denoted as the third spacing. The first and second directions are perpendicular to each other horizontally. Similarly, as... Figure 3 As shown, the positions of the chips 3 on the receiving substrate 2 are also spaced apart in the first direction at a certain interval, denoted as the second interval. The positions of the chips 3 on the substrate 2 will also be spaced apart in the second direction at a certain interval, denoted as the second interval. .

[0022] The energy array 4 is an array composed of multiple energy points 41 simultaneously emitted by energy output devices 42 at preset intervals. For example, the energy output device 42 is a laser emitter, and the laser emitter simultaneously emits multiple laser points forming an array. For example, such as... Figure 4In the illustrated embodiment, the energy array 4 is a 2×2 array, meaning it has two spaced-apart energy application points 41 in the first direction and two spaced-apart energy application points 41 in the second direction. Of course, the number of energy application points 41 in the energy array 4 can be set according to actual needs, but the energy array 4 should at least meet the 1×2 specification, meaning it should have at least one row along the first direction, and each row should have at least two energy application points 41, i.e., the minimum number is 2. Furthermore, the energy array 4 is arranged according to a preset interval time. Reference Figure 4 In the specific embodiment shown, the energy application points 41 of the energy array 4 correspond one-to-one with the chip 3 receiving positions of the receiving substrate 2. It can be seen that in the first direction, the spacing between the energy application points 41 is equal to the second spacing, and the energy application points 41 can span one or more chips 3, that is, there exists a second spacing that is an integer multiple of the first spacing.

[0023] Step S2: Adjust the spacing between the energy application points 41 in the first direction of the energy array 4 to the second spacing. This ensures that the energy application points 41 of the energy array 4 correspond one-to-one with the chip 3 receiving positions on the substrate 2. Specifically, taking a laser matrix as an example, the spacing between the energy application points 41 can be adjusted by changing the bias of each output laser in the laser output device.

[0024] Step S3: Based on the first spacing, the second spacing, and the first quantity, divide a plurality of continuous chip transfer regions along the first direction; in each chip transfer region, the number of chips 3 in the first direction is the quotient of the second spacing divided by the first spacing multiplied by the first quantity. Specifically, as shown... Figure 4 In the specific embodiment shown, when the first quantity is 2, the second spacing is 3 times the first spacing, so the number of chips 3 in the chip transfer region in the first direction is 6, that is, the chip transfer region has 6 columns. In subsequent steps, one energy application point 41 will transfer 3 consecutive chips 3. If the first quantity is 3, under the same spacing conditions, the number of chips 3 in the chip transfer region in the first direction is 9.

[0025] Step S4: The quotient of the first pitch divided by the interval time is taken as the first moving speed of the transfer substrate 1, that is, the first moving speed is... , The interval time is represented by the product of the second spacing divided by the interval time and the first quantity, which is the second moving speed of the receiving substrate 2. ,in Indicates the first quantity.

[0026] Step S5: Perform a chip 3 transfer step for each chip transfer area. The chip 3 transfer step is as follows: control the transfer substrate 1 to move at a first speed along a first direction, control the receiving substrate 2 to move at a second speed, and emit energy at intervals; so that when the energy array 4 emits energy, the positions of multiple chips 3 in the chip transfer area are aligned with their corresponding energy application points 41, and the receiving positions of multiple receiving substrates 2 corresponding to the chip 3 are aligned with their corresponding energy application points 41.

[0027] In a specific embodiment, the transfer substrate 1 and the receiving substrate 2 are both mounted on their respective motion platforms, and the motion platforms drive the transfer substrate 1 and the receiving substrate 2 to move in the first direction and / or the second direction via motors.

[0028] For example, such as Figure 4 In the specific embodiment shown, the chip transfer region has six chips 3 to be transferred in the first direction, which is to the left. Therefore, the first energy application point 41 in the first direction is the first energy application point 41 counting from the left. Similarly, on the transfer substrate 1 and the receiving substrate 2, the first energy application point in the first direction is the first energy application point counting from the left. At the start of the transfer process, the energy array 4 aligns the first energy application point 41 in the first direction with the first chip 3. The energy array 4 aligns the second energy application point 41 in the first direction with the fourth chip 3. The receiving substrate 2 aligns the receiving positions of the first and second chips 3 in the first direction with the two energy application points 41 of the energy array 4. At this time, energy is emitted, and the first and second chips 3 are simultaneously acted upon by the energy application points 41, causing the first and fourth chips 3 to transfer from the transfer substrate 1 to the receiving substrate 2. After a certain interval, as the transfer substrate 1 moves at a first moving speed and the receiving substrate 2 moves at a second moving speed, energy is emitted. At this time, the second chip 3 on the transfer substrate 1 aligns with the first energy application point 41 of the energy array 4, and the fifth chip 3 on the transfer substrate 1 aligns with the second energy application point 41 of the energy array 4. Similarly, after another interval, the third chip 3 on the transfer substrate 1 aligns with the first energy application point 41 of the energy array 4, and the sixth chip 3 on the transfer substrate 1 aligns with the second energy application point 41 of the energy array 4.

[0029] In the double-layer substrate chip 3 transfer method provided by this invention, each chip transfer region is first divided according to the first spacing between the positions of the chips 3 to be transferred in the first direction of the transfer substrate 1, the second spacing between the corresponding chip 3 receiving positions in the first direction of the receiving substrate 2, and the first number of energy application points 41 in the first direction of the energy array 4. Then, the first moving speed of the transfer substrate 1 and the second moving speed of the receiving substrate 2 are determined according to the first spacing, the second spacing, the first number, and the interval time of energy emission. When transferring the chips 3, the transfer substrate 1 is controlled to move along the first direction at the first moving speed, and the receiving substrate 2 is controlled to move at the second moving speed, and the energy array 4 is emitted at interval time, so as to realize the regular and batch transfer of the current chip 3 to the corresponding position of the receiving substrate 2. During the transfer process, the transfer substrate 1 and the receiving substrate 2 always maintain their respective speed movements, without the need for repeated start and stop alignment, avoiding movement errors caused by start and stop movements. In addition, multiple chips 3 can be transferred in batches, further improving the efficiency of chip 3 transfer.

[0030] If, after a row of chips 3 in the current chip transfer area has been transferred, the transfer substrate 1 continues to move at the first moving speed, only the last energy application point 41 of the energy array 4 in the first direction will be aligned with the untransferred chips 3, while the remaining energy application points 41 will be aligned with the already transferred chip 3 positions. This will reduce transfer efficiency. Therefore, this embodiment proposes that when a row of chips 3 in the current chip transfer area has been transferred, if there is a next chip transfer area, a region switching step is performed, and then the chip 3 transfer step is repeated. In this way, all energy application points 41 on the energy array 4 can be aligned with the untransferred chips 3 in the next chip transfer area.

[0031] Specifically, the area-switching step is as follows: the transfer substrate 1 is controlled to perform a first speed change, such that when the next chip 3 receiving position on the receiving substrate 2 aligns with the corresponding energy application point 41, the first chip 3 to be transferred in the next chip transfer area in the first direction aligns with the first energy application point 41 of the energy array 4 in the first direction, and the speed at which the transfer substrate 1 moves along the first direction is the first moving speed. This ensures that all energy application points 41 on the energy array 4 can align with the untransferred chips 3 in the next chip transfer area. Then, the chip 3 transfer step is performed on the chip transfer area. This process is repeated until all the chips 3 in the entire row on the transfer substrate 1 have been transferred. The first speed change may include acceleration and deceleration phases; in other embodiments, a constant speed phase may be added to the acceleration and deceleration phases.

[0032] Preferably, when the transfer substrate 1 performs the first speed change movement, the receiving substrate 2 is controlled to continue moving along the first direction at the second moving speed. This reduces the speed variation of the receiving substrate 2, thereby reducing the occurrence of errors. It is worth noting that in this embodiment, the duration of the first speed change movement is a first preset number of time intervals. The first preset number is a positive integer, preferably 1, so that the situation of missing basic chips cannot occur. However, when the displacement of the area change is large, the first preset number can be increased to allow sufficient time for the area change jump step. Even if the situation of missing basic chips occurs, an additional re-firing step can be added in the subsequent process to solve the problem. Of course, in some other optional embodiments, in the area change jump step, the receiving substrate 2 can also decelerate and then accelerate back to the second moving speed.

[0033] Specifically, as an optional embodiment, the first speed-changing motion is a speed-changing motion that first accelerates and then decelerates. In the first speed-changing motion, the acceleration interval time, deceleration interval time, acceleration interval acceleration, and deceleration interval acceleration of the transfer substrate 1 satisfy the following conditions: ; ; ; in, This represents the acceleration within the acceleration range. This indicates the acceleration during the deceleration range. Indicates the acceleration interval time. Indicates the deceleration interval time. Indicates the first preset quantity. Indicates the first spacing. Indicates the second spacing. Indicates the first quantity.

[0034] Furthermore, as an optional embodiment, when a row of chips 3 in the current chip transfer area is transferred, if there is no next chip transfer area and there is another row of chips 3 to be transferred, then the third spacing between the current row of chips 3 and the next row of chips 3 to be transferred on the transfer substrate 1 in the second direction is obtained; the fourth spacing between the current row of received chips 3 and the next row of received chips 3 on the receiving substrate 2 in the second direction is obtained; based on the third and fourth spacings, a row transition step is performed; then the chip 3 transfer step is performed with the reverse direction of the original first direction defined as the new first direction. Thus, after the current row of chips 3 is transferred along the first direction, a row transition is achieved by controlling the movement of the transfer substrate 1 and the receiving substrate 2 in the second direction. Then, the chip 3 transfer step is performed with the reverse direction of the original first direction defined as the new first direction, eliminating the need to reset to the side where the previous row began, reducing the row transition time, and improving the chip 3 transfer efficiency.

[0035] For easier understanding, please refer to Figure 7 , Figure 7 The process of transferring multiple rows of chips 3 is illustrated, where state (a) is a schematic diagram showing the alignment of the energy array 4's action point transfer substrate 1 with the receiving substrate 2; state (b) is a schematic diagram showing the first batch of chips 3 transferred in the first chip transfer area; state (c) is a schematic diagram showing the completion of the transfer of the current row of chips 3 in the first chip transfer area; state (d) is a schematic diagram showing the transfer of the first batch of chips 3 to the second chip transfer area after the energy array 4 changes areas; state (e) is a schematic diagram showing the completion of the transfer of the current row of chips 3 in the second chip transfer area; and state (f) is a schematic diagram showing the transfer of the first batch of chips 3 after a row change in the second chip transfer area.

[0036] Specifically, the line break jump step is as follows: control the transfer substrate 1 and the receiving substrate 2 to perform variable speed movements in the first direction, and control both the transfer substrate 1 and the receiving substrate 2 to perform variable speed movements in the second direction, so that in the current chip transfer area, the last chip 3 to be transferred in the other row in the first direction is aligned with the last energy application point 41 of the energy array 4 in the first direction; the receiving position of the last chip 3 in the other row of the receiving substrate 2 in the first direction is aligned with the last energy application point 41 of the energy array 4 in the first direction; and when aligned, the speed of the transfer substrate 1 in the opposite direction of the first direction is the first moving speed, the speed of the receiving substrate 2 in the opposite direction of the first direction is the second moving speed, and the speed values ​​of both the transfer substrate 1 and the receiving substrate 2 in the second direction are zero.

[0037] Optionally, the time to complete the line break jump step is a second preset number of time intervals. This eliminates the need to adjust the interval for resetting energy emission; the second preset number is a positive integer.

[0038] Preferably, the transfer substrate 1 and the receiving substrate 2 simultaneously begin and simultaneously end their variable speed movements in the first direction and the second direction. This simultaneous variable speed movement in both directions shortens the time required for line switching.

[0039] For example, in the line break jump step, the variable speed movement of the transfer substrate 1 in the first direction includes a deceleration section and an acceleration section, with the deceleration section lasting the same amount of time as the acceleration section. The transfer substrate 1 decelerates to zero in the deceleration drive and then accelerates in the opposite direction to the first moving speed. During a second preset number of intervals, the displacement of the transfer substrate 1 is zero. Similarly, in the first direction, the variable speed movement of the receiving substrate 2 includes a deceleration section and an acceleration section, with the deceleration section lasting the same amount of time as the acceleration section. The transfer substrate 1 decelerates to zero in the deceleration section and then accelerates in the opposite direction to the second moving speed during the acceleration section. During a second preset number of intervals, the displacement of the transfer substrate 1 is zero.

[0040] In the second direction, the displacement of the variable-speed movement of the transfer substrate 1 is a third gap, the time of the variable-speed movement is a second preset number of time intervals, and at the end of the variable-speed movement, the velocity of the receiving substrate 2 in the second direction is zero. Similarly, in the second direction, the displacement of the variable-speed movement of the receiving substrate 2 is a fourth gap, the time of the variable-speed movement is a second preset number of time intervals, and at the end of the variable-speed movement, the velocity of the receiving substrate 2 in the second direction is zero.

[0041] In one specific embodiment, during the line break transition step, the transfer substrate 1 and the receiving substrate 2 undergo variable speed movement in the first direction to satisfy the following condition: ( )= ; ; in, This indicates the first moving speed of the substrate in the first direction. This represents the acceleration of the variable-speed motion of the transfer substrate in the first direction. Indicates the interval time. Indicates the second preset quantity. This indicates the second moving speed of the substrate in the first direction. This indicates the acceleration of the substrate undergoing variable-speed motion in the first direction; The transfer substrate 1 and the receiving substrate 2 move at varying speeds in the second direction while satisfying the following conditions: ; ; = ; ; ; = ; in, This represents the acceleration of the transfer substrate in the acceleration region along the second direction. This indicates the time the substrate is transferred in the acceleration zone in the second direction. This represents the acceleration of the transfer substrate in the deceleration region along the second direction. This indicates the time the transfer substrate spends in the deceleration zone in the second direction. This indicates the third spacing between the current chip row and the next transferred chip row on the transfer substrate in the second direction; This indicates the acceleration of the substrate in the acceleration zone in the second direction. This indicates the time the substrate receiving the signal in the second direction is in the acceleration zone. This indicates the acceleration of the receiving substrate in the second direction during the deceleration range. This indicates the time the receiving substrate spends in the deceleration zone in the second direction. This indicates the fourth spacing between the current chip row and the next chip row in the second direction of the receiving substrate.

[0042] In one specific embodiment, a positioning step is included before transferring the first chip 3 in the first row of the first chip transfer region in the first direction. The positioning step includes: Align the first energy application point 41 of the energy array 4 in the first direction, the working origin of the transfer substrate 1, and the working origin of the receiving substrate 2 with each other. The working origin of the transfer substrate 1 is obtained at a first distance from the first chip 3 in the first direction in the first direction, a second distance from the first chip 3 in the first direction in the second direction, a third distance from the working origin of the receiving substrate 2 in the first direction to the first receiving chip 3 in the first direction, and a fourth distance from the working origin of the receiving substrate 2 in the second direction to the first receiving chip 3 in the first direction. Based on the first distance, the second distance, the third distance, and the fourth distance, the transfer substrate 1 and the receiving substrate 2 are controlled to move at varying speeds in the first direction and / or the second direction, respectively. This is so that after a third preset number of time intervals, in the first chip transfer area along the first direction, the first chip to be transferred 3 along the first direction is aligned with the first energy application point 41 of the energy array 4 along the first direction, and the receiving position of the first chip 3 of the receiving substrate 2 along the first direction is aligned with the first energy application point 41 of the energy array 4 along the first direction. At this time, the speed at which the transfer substrate 1 moves in the first direction is the first moving speed, the speed at which the receiving substrate 2 moves in the first direction is the second moving speed, and the speeds at which the transfer substrate 1 and the receiving substrate 2 move in the second direction are both zero.

[0043] For example, such as Figure 2 and Figure 3As shown, the working origin of the transfer substrate 1 is the upper left corner, and the working origin of the receiving substrate 2 is also the upper left corner. During the positioning step, after alignment, the transfer substrate 1 undergoes a variable-speed movement simultaneously in the first and second directions. In the first direction, the displacement of the transfer substrate 1 during the variable-speed movement is a first distance, the time of the variable-speed movement is a third preset number of time intervals, and at the end of the variable-speed movement, the speed of the receiving substrate 2 along the first direction is a first moving speed. In the second direction, the displacement of the transfer substrate 1 during the variable-speed movement is a second distance, the time of the variable-speed movement is a third preset number of time intervals, and at the end of the variable-speed movement, the speed of the receiving substrate 2 along the second direction is zero. Similarly, in the first direction, the displacement of the receiving substrate 2 during the variable-speed movement is a third distance, the time of the variable-speed movement is a third preset number of time intervals, and at the end of the variable-speed movement, the speed of the receiving substrate 2 along the first direction is a second moving speed. In the second direction, the displacement of the variable speed motion of the receiving substrate 2 is the fourth distance, the time of the variable speed motion is the third preset number of interval time, and at the end of the variable speed motion, the speed of the receiving substrate 2 in the second direction is zero.

[0044] Of course, in other embodiments, if the working origin of the transfer substrate 1 is collinear with the center of the first row of chips 3 in the first direction, then the transfer substrate 1 only needs to perform speed-changing motion in the first direction, without needing to perform speed-changing motion in the second direction. If the working origin of the transfer substrate 1 is collinear with the center of the first row of chips 3 in the second direction, then the transfer substrate 1 only needs to perform speed-changing motion in the second direction, without needing to perform speed-changing motion in the first direction. Similarly, if the working origin of the receiving substrate 2 is collinear with the center of the first row of chips 3 along the first direction, then the receiving substrate 2 only needs to perform speed-changing motion in the first direction, without needing to perform speed-changing motion in the second direction. If the working origin of the receiving substrate 2 is collinear with the center of the chips 3 in the second direction, then the receiving substrate 2 only needs to perform speed-changing motion in the second direction, without needing to perform speed-changing motion in the first direction.

[0045] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0046] A second aspect of the present invention provides a laser mass transfer platform applied to the transfer method of the bilayer substrate chip 3, the laser mass transfer platform comprising: The acquisition module is used to acquire the first spacing between the positions of the chips 3 to be transferred in the first direction of the transfer substrate 1, the second spacing between the corresponding receiving positions of the chips 3 in the first direction of the receiving substrate 2, the first number of laser action points in the first direction of the laser array, and the interval time for the laser array to emit lasers; wherein, the second spacing is an integer multiple of the first spacing; An adjustment module is used to adjust the spacing between laser action points in the first direction of the laser array to the second spacing; The zoning module is used to divide multiple continuous chip transfer regions along a first direction based on the first spacing, the second spacing, and the first quantity; in each chip transfer region, the number of chips 3 in the first direction is the quotient of the second spacing divided by the first spacing multiplied by the first quantity; The determining module is used to take the quotient of the first spacing divided by the interval time as the first moving speed of the transfer substrate 1; and to take the product of the quotient of the second spacing divided by the interval time and the first quantity as the second moving speed of the receiving substrate 2. The control module is used to perform chip 3 transfer steps for each chip transfer region. The chip 3 transfer steps are as follows: The transfer substrate 1 is controlled to move along a first direction at a first moving speed, the receiving substrate 2 is controlled to move at a second moving speed, and the laser array is controlled to emit lasers at intervals; so that when the laser array emits lasers, the positions of multiple chips 3 in the chip transfer area are aligned with their corresponding laser action points, and the receiving positions of multiple receiving substrates 2 corresponding to the chip 3 are aligned with their corresponding laser action points.

[0047] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made under the concept of the present invention using the contents of the present invention specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for transferring chips from a double-layer substrate, applied to non-contact mass transfer, characterized in that, Includes the following steps: The first spacing between the positions of the chips to be transferred in the first direction of the transfer substrate, the second spacing between the corresponding chip receiving positions in the first direction of the receiving substrate, the first number of energy application points in the first direction of the energy array, and the interval time of energy output are obtained; wherein, the second spacing is an integer multiple of the first spacing; Adjust the spacing between energy application points in the first direction of the energy array to the second spacing; Based on the first spacing, the second spacing, and the first quantity, multiple consecutive chip transfer regions are divided along the first direction; in each chip transfer region, the number of chips in the first direction is the quotient of the second spacing divided by the first spacing multiplied by the first quantity. The first moving speed of the transfer substrate is the quotient of the first spacing divided by the interval time; the second moving speed of the receiving substrate is the product of the quotient of the second spacing divided by the interval time and the first quantity. A chip transfer step is performed for each chip transfer region, and the chip transfer step is as follows: The transfer substrate is controlled to move along a first direction at a first moving speed, the receiving substrate is controlled to move at a second moving speed, and the energy array is controlled to emit energy at intervals; such that when the energy array emits energy, multiple chip positions in the chip transfer area are aligned with their corresponding energy application points, and multiple receiving substrates are aligned with their corresponding chip receiving positions and energy application points.

2. The method for transferring a chip from a double-layer substrate according to claim 1, characterized in that, When a row of chips in the current chip transfer area has been transferred, if there is a next chip transfer area, the area switching jump step is executed, and then the chip transfer steps are repeated. The area switching steps are as follows: The transfer substrate is controlled to make a first speed change movement, so that when the next chip receiving position of the receiving substrate is aligned with the corresponding energy application point, the first chip to be transferred in the next chip transfer area in the first direction is aligned with the first energy application point of the energy array in the first direction, and the speed at which the transfer substrate moves along the first direction is the first moving speed.

3. The method for transferring a chip from a double-layer substrate according to claim 2, characterized in that: When the transfer substrate performs the first speed change movement, the receiving substrate is controlled to continue moving along the first direction at the second moving speed, and the duration of the first speed change movement is a first preset number of interval times.

4. The method for transferring a chip from a double-layer substrate according to claim 3, characterized in that, The first speed-changing motion is a speed-changing motion that first accelerates and then decelerates. In the first speed-changing motion, the acceleration interval time, deceleration interval time, acceleration interval acceleration, and deceleration interval acceleration of the transfer substrate satisfy the following conditions: ； ； ； in, This represents the acceleration within the acceleration range. This represents the acceleration during the deceleration range. Indicates the acceleration interval time. Indicates the deceleration interval time. Indicates the first preset quantity. Indicates the first spacing. Indicates the second spacing. Indicates the first quantity.

5. The method for transferring a chip from a double-layer substrate according to claim 2, characterized in that, When a row of chips in the current chip transfer area has been transferred, if there is no next chip transfer area and there is another row of chips to be transferred, then a line jump step is executed; then the chip transfer step is performed with the reverse direction of the original first direction defined as the new first direction. The line break jump step is as follows: control the transfer substrate and the receiving substrate to move at different speeds in the first direction, and control both the transfer substrate and the receiving substrate to move at different speeds in the second direction, so that in the current chip transfer area, the last chip to be transferred in the other row in the first direction is aligned with the last energy point of the energy array in the first direction; the receiving position of the last chip in the other row of the receiving substrate in the first direction is aligned with the last energy point of the energy array in the first direction; and during alignment, the speed of the transfer substrate in the opposite direction of the first direction is the first moving speed, the speed of the receiving substrate in the opposite direction of the first direction is the second moving speed, and the speed values ​​of both the transfer substrate and the receiving substrate in the second direction are zero.

6. The method for transferring a chip from a double-layer substrate according to claim 5, characterized in that, The time to complete the line break jump step is the second preset number of intervals.

7. The method for transferring a chip from a double-layer substrate according to claim 6, characterized in that, In the line transition step, the transfer substrate and the receiving substrate simultaneously begin and simultaneously end the speed change movement in the first direction and the speed change movement in the second direction.

8. The method for transferring a chip from a double-layer substrate according to claim 7, characterized in that, During the line break jump step, the transfer substrate and the receiving substrate perform variable speed motion in the first direction to satisfy the following condition: ( )= ; ； in, This indicates the first moving speed of the substrate in the first direction. This represents the acceleration of the variable-speed motion of the transfer substrate in the first direction. Indicates the interval time. Indicates the second preset quantity. This indicates the second moving speed of the substrate in the first direction. This indicates the acceleration of the substrate undergoing variable-speed motion in the first direction; The transfer substrate and the receiving substrate move at varying speeds in the second direction while satisfying the following condition: ； ； = ； ； ； = ； in, This indicates the acceleration of the transfer substrate in the acceleration region along the second direction. This indicates the time the substrate is transferred in the acceleration zone in the second direction. This represents the acceleration of the transfer substrate in the deceleration region along the second direction. This indicates the time the transfer substrate spends in the deceleration zone in the second direction. This indicates the third spacing between the current chip row and the next transferred chip row on the transfer substrate in the second direction; This indicates the acceleration of the substrate in the acceleration zone in the second direction. This indicates the time the substrate receiving the signal in the second direction is in the acceleration zone. This indicates the acceleration of the receiving substrate in the second direction during the deceleration range. This indicates the time the receiving substrate spends in the deceleration zone in the second direction. This indicates the fourth spacing between the current chip row and the next chip row in the second direction of the receiving substrate.

9. The method for transferring a chip from a double-layer substrate according to claim 1, characterized in that, Before transferring the first chip in the first row of the first chip transfer region in the first direction, a positioning step is included, the positioning step including: Align the first energy application point of the energy array in the first direction, the working origin of the transfer substrate, and the working origin of the receiving substrate with each other. The working origin of the transfer substrate is obtained at a first distance from the first chip position in the first direction in the first direction, a second distance from the first chip position in the first direction in the second direction, a third distance from the working origin of the receiving substrate in the first direction to the first receiving chip position in the first direction, and a fourth distance from the working origin of the receiving substrate in the second direction to the first receiving chip position in the first direction. Based on the first distance, second distance, third distance, and fourth distance, the transfer substrate and the receiving substrate are controlled to move at varying speeds in the first direction and / or the second direction, respectively, with the second direction being horizontal and perpendicular to the first direction; so that after a third preset number of time intervals, in the first chip transfer area along the first direction, the first chip to be transferred along the first direction is aligned with the first energy application point of the energy array along the first direction, and the first chip receiving position of the receiving substrate along the first direction is aligned with the first energy application point of the energy array along the first direction; and at this time, the speed at which the transfer substrate moves in the first direction is the first moving speed, the speed at which the receiving substrate moves in the first direction is the second moving speed, and the speeds at which both the transfer substrate and the receiving substrate move in the second direction are zero.

10. A laser mass transfer platform, characterized in that: The laser mass transfer platform, used in the bilayer substrate chip transfer method according to any one of claims 1-9, comprises: The acquisition module is used to acquire a first spacing between the positions of the chips to be transferred in the first direction of the transfer substrate, a second spacing between the corresponding chip receiving positions in the first direction of the receiving substrate, a first number of laser action points in the first direction of the laser array, and the interval time for the laser array to emit lasers; wherein, the second spacing is an integer multiple of the first spacing; An adjustment module is used to adjust the spacing between energy application points in the first direction of the energy array to the second spacing. The zoning module is used to divide multiple continuous chip transfer regions along a first direction based on the first spacing, the second spacing, and the first quantity; in each chip transfer region, the number of chips in the first direction is the quotient of the second spacing divided by the first spacing multiplied by the first quantity; The determining module is used to take the quotient of the first spacing divided by the interval time as the first moving speed of the transfer substrate; and to take the product of the quotient of the second spacing divided by the interval time and the first quantity as the second moving speed of the receiving substrate. The control module is used to perform a chip transfer step for each chip transfer region, wherein the chip transfer step is as follows: The transfer substrate is controlled to move along a first direction at a first moving speed, the receiving substrate is controlled to move at a second moving speed, and the laser array is controlled to emit lasers at intervals; such that when the laser array emits lasers, multiple chip positions in the chip transfer area are aligned with their corresponding laser action points, and multiple receiving substrates are aligned with their corresponding chip receiving positions with their corresponding laser action points.

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