Semiconductor product cutting method and system and cutting control device

Abstract

The invention discloses a semiconductor product cutting method and system and a cutting control device, and the cutting method comprises the following steps: obtaining a target vacuum adsorption force according to the obtained target vacuum adsorption force required for cutting a semiconductor product; the opening degree of a control valve arranged at the air suction end of the water ring vacuum pump and / or the connecting pipeline is controlled so that the adsorption jig can generate target vacuum adsorption force; acquiring a detection signal of a pressure sensor between the semiconductor product and the adsorption jig, and determining whether a pressure value corresponding to the detection signal meets the requirement or not; if yes, the cutting mechanism is controlled to conduct cutting; if not, the opening degree of the control valve is adjusted so that the pressure value corresponding to the detection signal can meet the requirement. According to the invention, the corresponding target vacuum adsorption force can be generated according to different semiconductor products, and the vacuum degree and the detection signal of the pressure sensor are combined to regulate and control the adsorption force, so that the actual use requirements of different vacuum adsorption forces of different products can be met, and the vacuum adsorption force can be efficiently regulated and controlled.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor product processing, in particular to a semiconductor product cutting method, system and cutting control device. BACKGROUND

[0002] As in the patent document with the application publication number CN116868314A, when cutting semiconductor products such as wafers, QFNs, BGA packages and the like by a semiconductor cutting mechanism, the semiconductor products are placed on a suction jig, and a vacuum pump is used to generate suction force on the suction jig, so as to fix the semiconductor products for cutting. The current semiconductor cutting mechanism generally uses a water ring vacuum pump to generate vacuum suction force, and the vacuum value of the water ring vacuum pump is fixed, and the vacuum suction force remains unchanged.

[0003] However, different semiconductor products require different vacuum suction forces due to different material properties, so a set of vacuum system is often difficult to meet the cutting requirements of multiple semiconductor products, and the water ring vacuum pump will generate a large noise every time it is started. SUMMARY

[0004] The purpose of the present application is to solve the above-mentioned problems in the prior art, and to provide a semiconductor product cutting method, system and cutting control device.

[0005] The purpose of the present application is achieved by the following technical solutions: The semiconductor product cutting method comprises the following steps: According to the target vacuum suction force required for cutting the semiconductor product, the opening degree of the control valve provided at the suction end of the water ring vacuum pump and / or the connecting pipeline connecting the water ring vacuum pump and the suction jig is controlled to match the vacuum suction force determined according to the vacuum pressure gauge with the target vacuum suction force; The detection signal of the pressure sensor between the semiconductor product and the suction jig is obtained, and whether the current vacuum suction force of the suction jig meets the requirements is determined based on the detection signal; If yes, the cutting mechanism is controlled to cut; If not, the opening degree of the control valve is adjusted to make the current vacuum suction force of the suction jig meet the requirements before the cutting mechanism is controlled to cut.

[0006] Preferably, the water ring vacuum pump is controlled to start when the control valve is fully opened.

[0007] Preferably, when the water ring vacuum pump reaches the rated speed, the control valve is closed for a period of time, and then the opening degree of the control valve is adjusted to match the vacuum suction force determined according to the vacuum pressure gauge with the target vacuum suction force.

[0008] Preferably, when cutting the edge of a semiconductor product, the adsorption fixture generates a first vacuum adsorption force, and after the edge cutting is completed, the adsorption fixture generates a second vacuum adsorption force, wherein the second vacuum adsorption force is less than the first vacuum adsorption force.

[0009] Preferably, the pressure sensor is an annular thin-film pressure sensor, which is disposed in the adsorption hole of the adsorption fixture, and the adsorption hole is a countersunk hole.

[0010] Preferably, determining whether the current vacuum adsorption force of the adsorption fixture meets the requirements based on the detection signal of the pressure sensor is based on whether the current vacuum adsorption force of the adsorption fixture is within a threshold range determined based on the target vacuum adsorption force, wherein the threshold range is greater than or equal to 0.9FL and less than or equal to 1.1FL, where FL is the target vacuum adsorption force.

[0011] Preferably, during the cutting process, when it is determined that the current vacuum adsorption force of the adsorption fixture is less than the warning pressure value, a warning is issued and the cutting is stopped.

[0012] Preferably, the warning pressure value is half of the target vacuum adsorption force.

[0013] Semiconductor product dicing system, including: The first control unit is used to control the opening of the control valve set at the suction end of the water ring vacuum pump and / or the connecting pipe connecting the water ring vacuum pump and the adsorption fixture according to the target vacuum adsorption force required for cutting the semiconductor product, so that the vacuum adsorption force determined according to the vacuum degree measured by the vacuum pressure gauge matches the target vacuum adsorption force. The suction force determination unit is used to acquire the detection signal of the pressure sensor between the semiconductor product and the adsorption fixture, and determine whether the current vacuum adsorption force of the adsorption fixture meets the requirements based on the detection signal. A cutting control unit is used to control the cutting mechanism to perform cutting when it is determined that the current vacuum adsorption force of the adsorption fixture meets the requirements; The second control unit is used to adjust the opening of the control valve when it is determined that the current vacuum adsorption force of the adsorption fixture does not meet the requirements, so that the current vacuum adsorption force of the adsorption fixture meets the requirements before controlling the cutting mechanism to perform cutting.

[0014] A cutting control device includes a memory and a processor. The memory stores a program that can be executed by the processor. When the program is executed, it implements any of the cutting methods described above.

[0015] The advantages of the technical solution of this invention are mainly reflected in: This invention incorporates a control valve at the suction end of a water ring vacuum pump, allowing adjustment of the vacuum adsorption force generated by the pump. This enables the generation of a target vacuum adsorption force tailored to the specific requirements of different semiconductor products, satisfying the practical needs of various products with varying vacuum adsorption forces. Furthermore, by combining the vacuum level detected by a vacuum pressure gauge with the signal from a pressure sensor for vacuum adsorption force control, this invention effectively overcomes the inherent limitations of pressure sensors. While pressure sensors can directly measure adsorption force, their signals can be highly unstable during the initial vacuuming phase. Slight product movement or gradual sealing of the product can cause signal jumps and oscillations. Directly using this volatile signal to control the valve can lead to system overshoot, oscillation, long adjustment times, and even instability. Vacuum level, being a process variable, offers a faster and more stable response. By controlling the valve opening based on vacuum level, the system can be quickly and smoothly brought to near the target vacuum level, providing a stable starting point for subsequent fine-tuning. This enables efficient adsorption force control and ensures reliable adsorption.

[0016] The present invention opens the control valve before the water ring vacuum pump is started, which can effectively reduce the load on the motor during startup, thereby reducing startup noise and making it more environmentally friendly.

[0017] In this invention, a first vacuum adsorption force is first used to cut the frame during the cutting process. After the frame is cut, a lower second vacuum adsorption force is used. This effectively avoids the problem of overload on the semiconductor product due to reduced rigidity after the frame is removed when cutting with the first vacuum adsorption force, which could lead to cutting deviation. This effectively ensures the cutting quality and product consistency, and helps to improve the yield rate.

[0018] The present invention can also determine whether there are any abnormalities in the vacuum adsorption pipeline, water ring vacuum pump and adsorption fixture based on the detection signal of the pressure sensor and provide early warning. Attached Figure Description

[0019] Figure 1 This is a cross-sectional perspective view of the adsorption fixture of the present invention; Figure 2 This is a partial perspective view of the rubber suction cup of the present invention; Figure 3 This is a perspective view of the adsorption fixture of the present invention; Figure 4 This is a schematic diagram of the adsorption fixture of the present invention connected to a water ring vacuum pump via a connecting pipe; Figure 5 This is a flowchart of the cutting method of the present invention. Detailed Implementation

[0020] The objectives, advantages, and features of this invention will be illustrated and explained through the following non-limiting description of preferred embodiments. These embodiments are merely typical examples of applying the technical solutions of this invention, and all technical solutions formed by equivalent substitutions or equivalent transformations fall within the scope of protection claimed by this invention.

[0021] In the description of the solution, it should be noted that the terms "center," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience and simplification of description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] Example 1 The semiconductor product cutting method disclosed in this invention will now be described in conjunction with the accompanying drawings. This semiconductor product cutting method is based on semiconductor cutting equipment, as shown in the attached drawings. Figure 1 As shown, the semiconductor cutting equipment includes an adsorption fixture 100 for supporting and fixing semiconductor products and a cutting mechanism (not shown in the figure) for cutting the semiconductor products fixed on the adsorption fixture 100.

[0023] As attached Figure 1 As shown, the adsorption fixture 100 includes a base plate 110, on which a mounting hole 111 is provided. A rubber suction cup 120 is provided on a support platform 112 on the inner wall of the mounting hole 111. The portion of the mounting hole 111 located below the rubber suction cup 120 has an elongated cavity 113 consistent with the rubber suction cup 120 and a small hole 114 located in the middle position below the elongated cavity 113.

[0024] As attached Figure 2 As shown, the rubber suction cup 120 has crisscrossing grooves 121, which divide the rubber suction cup 120 into multiple grid blocks 122. Each grid block 122 is provided with an adsorption hole 123. The upper end of the adsorption hole 123 extends to the top surface of the rubber suction cup 120, and the lower end extends to the bottom surface of the rubber suction cup 120, thereby communicating with the elongated cavity 113.

[0025] As attached Figure 3As shown, a positioning frame 130 is detachably provided on the upper part of the substrate 110. The positioning frame 130 is coaxially connected to the substrate 110 and surrounds the rubber suction cup. When the semiconductor product is placed on the rubber suction cup 120, the positioning boss 131 at the hole wall of the positioning frame 130 positions the semiconductor product. At the same time, the positioning bosses 131 maintain a distance between each other to facilitate manual handling of the semiconductor product.

[0026] As attached Figure 4 As shown, a water ring vacuum pump 300 can be connected to the lower part of the substrate 110 via a connecting pipe 200. The upper end of the connecting pipe 200 is sealed to the small hole, and a vacuum pressure gauge 400 is installed on the connecting pipe 200. In order to ensure that the detected vacuum degree is as close as possible to the actual value, the vacuum pressure gauge 400 is positioned on the connecting pipe 200 near the small hole 114.

[0027] A control valve 500 is also provided at the suction end of the water ring vacuum pump 300 and / or at the connecting pipe 200. The control valve 500 can be a valve body whose opening can be controlled and adjusted by the cutting control device 600, such as a known pneumatic control valve, electric regulating valve, etc., which is not limited here.

[0028] Meanwhile, at least one pressure sensor (not shown in the figure) connected to the cutting control device 600 is provided on the adsorption fixture 100. The specific location and number of the pressure sensor can be determined as needed. Preferably, the pressure sensor can be located in the adsorption hole 123. When there is one pressure sensor, it can be located in the adsorption hole 123 in the middle area; when there are multiple pressure sensors, they can be located in the adsorption holes 123 in the middle position and near the four corners. The pressure sensor can be a known annular thin film pressure sensor, for example, the RX-H2026 model single-point piezoresistive flexible pressure sensor manufactured by Changzhou Rouxi Electronic Technology Co., Ltd. To facilitate the installation of the pressure sensor, the adsorption hole 123 is a countersunk hole, and the pressure sensor is installed on the stepped surface inside the adsorption hole 123. The detection area of ​​the pressure sensor protrudes slightly from the adsorption surface of the adsorption fixture 100. Furthermore, a wiring slot can be provided on the grid block 122 so that the data line of the pressure sensor can extend to the outside of the substrate 110 through the groove 121 and the wiring hole on the substrate 110. Additionally, if necessary, after installing the pressure sensor, the wiring slots, data cables, etc., can be sealed with glue.

[0029] The specific structure of the cutting mechanism is a known technology. For example, it may include two cutting modules capable of cutting in the X-axis and Y-axis directions, with the X-axis and Y-axis directions perpendicular to each other. Each cutting module includes a horizontally arranged main shaft, which is connected to a moving mechanism that drives it to move in multiple degrees of freedom. For example, the moving mechanism can drive the main shaft to move along the X-axis and Y-axis directions and move up and down. Its specific structure is known and will not be elaborated here. Of course, if necessary, the adsorption fixture can also be horizontally rotated and / or translated, thereby simplifying the structure of the cutting mechanism. The specific implementation structure is known and will not be limited here.

[0030] Correspondingly, as shown in the appendix Figure 5 As shown, the semiconductor product cutting method includes the following steps: Based on the target vacuum adsorption force required for cutting the semiconductor product, the opening degree of the control valve 500 connected to the suction end of the water ring vacuum pump 300 is controlled so that the vacuum adsorption force determined according to the vacuum degree measured by the vacuum pressure gauge 400 matches the target vacuum adsorption force. The detection signal of the pressure sensor between the semiconductor product and the adsorption fixture 100 is acquired, and the current vacuum adsorption force of the adsorption fixture 100 is determined based on the detection signal to determine whether it meets the requirements. If so, then control the cutting mechanism to perform the cutting; If not, adjust the opening of the control valve 500 to ensure that the current vacuum adsorption force of the adsorption fixture 100 meets the requirements before controlling the cutting mechanism to perform cutting.

[0031] Before starting the water ring vacuum pump, the semiconductor product can be placed on the adsorption fixture manually or using automated equipment.

[0032] Once the semiconductor product is confirmed to be placed on the vacuum fixture, the cutting control device 600 starts the water ring vacuum pump 300. After the water ring vacuum pump 300 starts, the cutting control device 600 collects the vacuum degree P detected by the vacuum pressure gauge 400 in real time, and calculates the current theoretical vacuum adsorption force F of the adsorption fixture 100 according to F=P*S based on the bottom surface area S of the rubber suction plate pre-stored in the memory. 理 .

[0033] Therefore, when the opening of the control valve 500 is adjusted, the vacuum level P detected by the vacuum pressure gauge 400 will change. Furthermore, the relationship between the opening of the control valve 500 and the vacuum level P detected by the vacuum pressure gauge 400 can be determined beforehand, for example, by obtaining a linear relationship through linear analysis. Subsequently, the vacuum level P can be directly calculated based on the required target vacuum adsorption force and bottom surface area S, and the opening of the control valve 500 can be determined according to the relationship and the vacuum level P. The control valve can then be directly adjusted to the corresponding opening to achieve rapid control. When the theoretical vacuum adsorption force F is determined based on the vacuum level detected by the vacuum pressure gauge 400... 理 Equal to the target vacuum adsorption force F 目 Alternatively, when their difference is within a set range, the theoretical vacuum adsorption force F is determined. 理 With the target vacuum adsorption force F 目 To match, the opening degree of the control valve 500 remains unchanged. When the theoretical vacuum adsorption force F... 理 Not equal to the target vacuum adsorption force F 目 Or, if their difference is not within the set range, the opening of the control valve can be increased or decreased according to the deviation, so that it can be adjusted quickly.

[0034] Wherein, the target vacuum adsorption force F corresponding to each semiconductor product 目 This information can be pre-stored in memory for later retrieval. Specifically, a known information reader can be used to read the product model information carried on the container holding the semiconductor product, such as a QR code, barcode, or electronic tag (RFID tag, NFC tag, etc.), and then the corresponding target vacuum adsorption force can be determined based on the semiconductor product's model information. Alternatively, in another embodiment, the semiconductor product model can be manually input through the interactive interface of the cutting control device to determine the corresponding target vacuum adsorption force; or, alternatively, the target vacuum adsorption force corresponding to the semiconductor product can be directly input manually.

[0035] When the theoretical vacuum adsorption force F 理 With the target vacuum adsorption force F 目 In accordance with the matching, the cutting control device acquires the signal from the pressure sensor and determines whether the current vacuum adsorption force of the adsorption fixture 100 meets the requirements based on the detection signal from the pressure sensor. Specifically, it determines whether the current vacuum adsorption force of the adsorption fixture 100 is within a threshold range determined based on the target vacuum adsorption force, which is greater than or equal to 0.9FL and less than or equal to 1.1FL, where FL is the target vacuum adsorption force.

[0036] When the theoretical vacuum adsorption force F 理 Equal to the target vacuum adsorption force F 目At that time, the actual vacuum adsorption force on the semiconductor product can be determined based on the detection signal from the pressure sensor. Specifically, when the semiconductor product is placed on the positioning fixture and vacuum adsorption is not activated, the pressure sensor will detect an initial pressure value. When the theoretical vacuum adsorption force F is determined... 理 Equal to the target vacuum adsorption force F 目 At that time, the pressure sensor will measure the current pressure value applied to it by the semiconductor product. Therefore, the pressure difference obtained by subtracting the initial pressure value from the current pressure value is the vacuum adsorption force currently experienced by the semiconductor product.

[0037] When there is only one pressure sensor, the pressure difference determined by the detection signal of the pressure sensor can be directly used as the current vacuum adsorption force of the adsorption fixture 100 and it can be determined whether it meets the requirements.

[0038] When there are multiple pressure sensors, the average of the multiple pressure differences determined by the detection signals of the multiple pressure sensors can be used as the current vacuum pressure value of the adsorption fixture 100, and then it can be determined whether the average value meets the requirements. Further, when there are multiple pressure sensors, it can be first determined whether the standard deviation of the multiple pressure differences they determine is within the standard deviation range. If so, it can be determined whether the average value of the multiple pressure differences meets the requirements. If not, the opening of the control valve 500 is adjusted, and the detection signals of the pressure sensors are re-acquired, and the standard deviation is calculated and judged. Alternatively, the difference between the maximum and minimum values ​​of the multiple pressure differences can be calculated, and it can be determined whether the difference is within the difference threshold range. If so, it can be determined whether the average value of the multiple pressure differences meets the requirements; otherwise, the opening of the control valve 500 is adjusted, and the detection signals of the pressure sensors are re-acquired, and the difference between the maximum and minimum values ​​of the multiple pressure differences is calculated and judged.

[0039] If the current vacuum adsorption force of the adsorption fixture 100 is less than the threshold range, the opening of the control valve can be reduced; if the current vacuum adsorption force of the adsorption fixture 100 is greater than the threshold range, the opening of the control valve can be increased.

[0040] If, after adjusting the opening of the control valve 500 a predetermined number of times, the current vacuum adsorption force determined by the detection signal of the pressure sensor does not meet the requirements, or the aforementioned standard deviation is still outside the standard deviation range, or the aforementioned difference is outside the difference range, then cutting can be stopped and an alarm can be triggered to remind manual handling.

[0041] Of course, in other embodiments, other methods can also be used to determine whether the current vacuum adsorption force meets the requirements based on the detection signals of multiple pressure sensors. For example, the maximum, minimum or median value among multiple pressures can be used as the current vacuum adsorption force of the adsorption fixture 100 and its compliance with the requirements can be determined.

[0042] Furthermore, the conventional water ring vacuum pump 300 generates significant noise during startup, primarily due to cavitation noise. This is because, in the initial startup phase, a stable and thick water ring has not yet formed within the pump. At this time, the agitation and compression of the gas-water mixture by the impeller blades are extremely unstable, causing a sudden drop in local pressure and resulting in the water "boiling" and generating a large number of bubbles. These bubbles collapse instantly when they reach the high-pressure zone, producing a violent, high-frequency popping sound, resembling the crackling of gravel or a sharp whistling.

[0043] To overcome this issue, the inventors further discovered that starting the water ring vacuum pump 300 when the control valve 500 is fully open effectively reduces noise. This is because when the control valve 500 is open, the pump chamber of the water ring vacuum pump 300 is connected to the atmospheric environment. During startup, the pump chamber is filled with atmospheric pressure air. At this time, the impeller rotates and compresses the high-pressure, sufficiently large volume of air, rather than performing work on the water to cause a sudden pressure drop. Therefore, the water pressure remains at a high level, far exceeding its saturated vapor pressure, effectively reducing cavitation and consequently lowering cavitation noise.

[0044] Furthermore, once the water ring vacuum pump reaches its rated speed, the control valve 500 is completely closed for a period of time until the vacuum level detected by the vacuum pressure gauge 400 reaches its maximum value. Subsequently, the control valve 500 is opened to reduce the vacuum level so that the vacuum adsorption force generated by the adsorption fixture 100, determined according to the vacuum level, matches the target vacuum adsorption force. Alternatively, when the water ring vacuum pump 300 reaches its rated speed after startup, the control valve 500 can be gradually closed to match the vacuum adsorption force generated by the adsorption fixture 100, determined according to the vacuum level, with the target vacuum adsorption force.

[0045] Furthermore, since semiconductor products may be warped before cutting, in order to ensure that semiconductor products with borders can be stably adsorbed, the existing technology uses a large vacuum adsorption force generated by the adsorption fixture 100 and maintains it until the cutting is completed. After the border is cut, the rigidity of the remaining part to be cut in the border area of ​​the semiconductor product will be significantly reduced. At this time, the large vacuum adsorption force generated by the adsorption fixture 100 will overload the part to be cut, that is, the particles of the part to be cut will be excessively stretched downwards and tightly "sink" into the adsorption hole 123 of the rubber suction cup 120, which may even cause local elastic deformation of the rubber suction cup 120, resulting in a cutting deviation.

[0046] Therefore, in a superior cutting method, different target vacuum adsorption forces can be used at different cutting stages. In the prior art, the frame of a semiconductor product is typically cut, followed by the cutting of the portion to be cut within the frame. Therefore, when cutting the frame of a semiconductor product, the adsorption fixture 100 generates a first vacuum adsorption force, i.e., the adsorption fixture 100 first generates a first vacuum adsorption force (within a threshold range), and the frame is cut while the adsorption fixture 100 maintains the first vacuum adsorption force. After the frame cutting is completed, the adsorption fixture 100 generates a second vacuum adsorption force (within a threshold range), and the portion to be cut within the frame is cut while the adsorption fixture 100 generates the second vacuum adsorption force, where the second vacuum adsorption force is less than the first vacuum adsorption force. The specific magnitudes of the first and second vacuum adsorption forces can be determined based on different material tests and are not limited here.

[0047] Finally, during the cutting process, when it is determined that the current vacuum adsorption force of the adsorption fixture 100 is less than the warning pressure value, the cutting is stopped and a warning is issued to remind the staff to check whether there is a leak in the pipeline, whether the water ring vacuum pump 300 or the adsorption fixture 100 is damaged, etc., and the warning pressure value is half of the target vacuum adsorption force.

[0048] Example 2 This embodiment discloses a semiconductor product cutting system, including: The first control unit is used to control the opening degree of the control valve 500 provided at the suction end of the water ring vacuum pump 300 and / or the connecting pipe according to the target vacuum adsorption force required for cutting the semiconductor product, so that the vacuum adsorption force determined according to the vacuum degree measured by the vacuum pressure gauge 400 matches the target vacuum adsorption force. The suction force determination unit is used to acquire the detection signal of the pressure sensor between the semiconductor product and the adsorption fixture 100, and determine whether the current vacuum adsorption force of the adsorption fixture 100 meets the requirements based on the detection signal. The cutting control unit is used to control the cutting mechanism to perform cutting when it is determined that the current vacuum adsorption force of the adsorption fixture 100 meets the requirements; The second control unit is used to adjust the opening of the control valve 500 when it is determined that the current vacuum adsorption force of the adsorption fixture 100 does not meet the requirements, so that the current vacuum adsorption force of the adsorption fixture 100 meets the requirements before controlling the cutting mechanism to perform cutting.

[0049] Example 3 This embodiment discloses a cutting control device 600, including a memory and a processor. The memory stores a program that can be executed by the processor. When the program is executed, it implements the cutting method as described above.

[0050] This invention has many other embodiments, and all technical solutions formed by equivalent transformation or equivalent transformation fall within the protection scope of this invention.

Claims

1. A semiconductor product cutting method, characterized in that, Includes the following steps: Based on the target vacuum adsorption force required for cutting the semiconductor product, the opening degree of the control valve set at the suction end of the water ring vacuum pump and / or the connecting pipe connecting the water ring vacuum pump and the adsorption fixture is controlled so that the vacuum adsorption force determined according to the vacuum degree measured by the vacuum pressure gauge matches the target vacuum adsorption force. The detection signal from the pressure sensor between the semiconductor product and the adsorption fixture is acquired, and the current vacuum adsorption force of the adsorption fixture is determined based on the detection signal to determine whether it meets the requirements. If so, then control the cutting mechanism to perform the cutting; If not, adjust the opening of the control valve to ensure that the current vacuum adsorption force of the adsorption fixture meets the requirements before controlling the cutting mechanism to perform cutting.

2. The semiconductor product cutting method according to claim 1, characterized in that: When the control valve is fully open, the water ring vacuum pump is then started.

3. The semiconductor product cutting method according to claim 2, characterized in that: When the water ring vacuum pump reaches its rated speed, the control valve is closed for a period of time, and then the opening of the control valve is adjusted so that the vacuum adsorption force determined according to the vacuum degree measured by the vacuum pressure gauge matches the target vacuum adsorption force.

4. The semiconductor product cutting method according to claim 1, characterized in that: When cutting the edge of a semiconductor product, the adsorption fixture generates a first vacuum adsorption force. After the edge cutting is completed, the adsorption fixture generates a second vacuum adsorption force, which is less than the first vacuum adsorption force.

5. The semiconductor product cutting method according to claim 1, characterized in that: The pressure sensor is an annular thin-film pressure sensor, which is disposed in the adsorption hole of the adsorption fixture, and the adsorption hole is a countersunk hole.

6. The semiconductor product cutting method according to claim 1, characterized in that: Determining whether the current vacuum adsorption force of the adsorption fixture meets the requirements based on the detection signal of the pressure sensor is based on whether the current vacuum adsorption force of the adsorption fixture is within a threshold range determined based on the target vacuum adsorption force, wherein the threshold range is greater than or equal to 0.9FL and less than or equal to 1.1FL, where FL is the target vacuum adsorption force.

7. The semiconductor product cutting method according to claim 1, characterized in that: During the cutting process, when it is determined that the current vacuum adsorption force of the adsorption fixture is less than the warning pressure value, a warning is issued and the cutting is stopped.

8. The semiconductor product cutting method according to claim 7, characterized in that: The warning pressure value is half of the target vacuum adsorption force.

9. A semiconductor product dicing system, characterized in that, include: The first control unit is used to control the opening of the control valve set at the suction end of the water ring vacuum pump and / or the connecting pipe connecting the water ring vacuum pump and the adsorption fixture according to the target vacuum adsorption force required for cutting the semiconductor product, so that the vacuum adsorption force determined according to the vacuum degree measured by the vacuum pressure gauge matches the target vacuum adsorption force. The suction force determination unit is used to acquire the detection signal of the pressure sensor between the semiconductor product and the adsorption fixture, and determine whether the current vacuum adsorption force of the adsorption fixture meets the requirements based on the detection signal. A cutting control unit is used to control the cutting mechanism to perform cutting when it is determined that the current vacuum adsorption force of the adsorption fixture meets the requirements; The second control unit is used to adjust the opening of the control valve when it is determined that the current vacuum adsorption force of the adsorption fixture does not meet the requirements, so that the current vacuum adsorption force of the adsorption fixture meets the requirements before controlling the cutting mechanism to perform cutting.

10. A cutting control device, comprising a memory and a processor, wherein the memory stores a program executable by the processor, characterized in that: When the program is executed, it implements the cutting method as described in any one of claims 1-8.

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