Wafer processing equipment and processing method

Abstract

The invention belongs to the technical field of semiconductor manufacturing, and discloses wafer processing equipment which comprises a supporting module, a feeding module and a processing module, when a wafer is placed on a table tray, the outer edge of the wafer is flush with the outer edge of the table tray, it is ensured that the wafer is completely attached to the surface of the table tray, and when the wafer is processed by the processing module, the outer edge of the wafer is not flush with the outer edge of the table tray. The full-bottom support of the table tray can counteract the processing pressure, so that the elastic deformation of the wafer caused by a small support surface is effectively avoided, and meanwhile, the damage of the processing module caused by mechanical interference between the processing module and the table tray due to a large support surface is avoided; secondly, the preset clamping axes of the multiple clamping jaws coincide with the axis of the table disc, the wafer can be placed on the table disc along the preset clamping axes, high-precision alignment of the center of the wafer and the center of the table disc during feeding is achieved, when the clamping jaws clamp the wafer to be placed on the table disc, the concentricity of the wafer and the table disc can be guaranteed, and the wafer feeding efficiency is improved. And the defect of asymmetrical edge processing caused by dislocation of the wafer and the axis of the processing table tray during feeding is avoided.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a wafer processing equipment and processing method. Background Technology

[0002] 3D stacking is one of the core technologies for manufacturing artificial intelligence chips, with its main products being 3D NAND and HBM. During wafer stacking, the wafer edges need to be trimmed to remove defects, residual material, or uneven areas, ensuring uniformity and yield in subsequent wafer stacking. Currently, a common method is to use a high-speed rotating "grinding wheel" (made from a mixture of diamond particles and resin) to perform circumferential grinding on the wafer edges, removing material from several micrometers to tens of micrometers, creating a recessed stepped groove at the wafer edge.

[0003] With the advancement of 3D stacking technology, higher requirements have been placed on the processing accuracy of wafer edges, making existing ring-shaped processing methods unable to meet the accuracy requirements.

[0004] Therefore, there is an urgent need for wafer processing equipment and processing methods to solve the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer processing equipment and processing method that can ensure the concentricity between the wafer and the support stage, and ensure that the edge area of ​​the wafer will not undergo elastic deformation during the processing.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A wafer processing device, comprising:

[0008] A support module includes a platform for supporting and fixing a wafer, wherein the outer edge of the wafer is flush with the outer edge of the platform.

[0009] The loading module includes a clamping assembly, which includes multiple jaws that can approach each other to clamp the wafer. The preset clamping axis of the multiple jaws coincides with the axis of the tray, and the multiple jaws can place the wafer on the tray along the preset clamping axis.

[0010] A processing module is disposed on one side of the support module and is used to process the wafer.

[0011] Preferably, the outer edge of the tray is provided with a plurality of clearance grooves, and the plurality of clearance grooves are provided one-to-one with a plurality of grippers. Each gripper includes an abutting part and a supporting part. The abutting part is used to abut against the outer edge of the wafer, and the supporting part is used to abut against the bottom of the wafer. The supporting part can be placed in the clearance groove.

[0012] Preferably, the feeding module further includes a first driving component, and the clamping assembly further includes a support plate. A plurality of the grippers are disposed on the support plate. The output end of the first driving component is connected to the support plate and is used to drive the support plate to move along the preset clamping axis toward or away from the platform.

[0013] Preferably, the clamping assembly further includes a plurality of second driving members, all of which are disposed on the support plate, and the output ends of the plurality of second driving members are connected one-to-one with the plurality of grippers to drive the plurality of grippers to move closer or further apart to clamp or release the wafer.

[0014] Preferably, the clamping assembly further includes a fifth driving member disposed on the support plate. The fifth driving member has multiple output terminals, which are connected one-to-one with multiple grippers to drive the multiple grippers to move closer or further apart to grip or release the wafer.

[0015] Preferably, the support plate is provided with multiple slide rails, and each of the grippers is connected to a slider. The multiple sliders are arranged in a one-to-one correspondence with the multiple slide rails, and the sliders can move within the slide rails.

[0016] Preferably, the plurality of grippers are evenly spaced along the circumference of the support plate.

[0017] Preferably, the platform is provided with an adsorption tank and a connecting channel. The adsorption tank is located on the upper surface of the platform, and one end of the connecting channel is connected to the adsorption tank, while the other end is selectively connected to a vacuum unit or a cleaning unit.

[0018] Preferably, the adsorption tank is arranged in a vortex shape on the platform, or the adsorption tank is annular and there are multiple such tanks, with the multiple annular adsorption tanks arranged radially at intervals along the platform with the same center.

[0019] A processing method, using the aforementioned wafer processing equipment to process a wafer, includes the following steps:

[0020] S1. The clamping assembly clamps the wafer and places it on the tray along a preset clamping axis;

[0021] S2. The tray fixes the wafer, and the clamping assembly is reset;

[0022] S3. The tray drives the wafer to rotate.

[0023] S4. The processing module processes the outer edge of the wafer.

[0024] The beneficial effects of this invention are:

[0025] This invention proposes a wafer processing equipment, including a support module, a loading module, and a processing module. The support module includes a platform for supporting and fixing wafers, with the outer edge of the wafer flush with the outer edge of the platform. The loading module includes a clamping assembly, which includes multiple clamping jaws that can approach each other. The multiple clamping jaws can cooperate to clamp the wafer and place it on the platform, and the preset clamping axis of the multiple clamping jaws coincides with the axis of the platform and can place the wafer on the platform along the preset clamping axis. The processing module is located on one side of the support module and is used to process the wafer. Specifically, when the wafer is placed on the tray, its outer edge is flush with the outer edge of the tray. This means that a tray with a diameter matching the wafer is used, ensuring that the wafer fits perfectly against the tray surface and improving processing stability. When the processing module processes the wafer, the full bottom support of the tray can offset the processing pressure, effectively preventing elastic deformation of the wafer caused by a small support surface, and preventing mechanical interference between the processing module and the tray caused by a large support surface, which could lead to damage to the processing module. Secondly, the preset clamping axes of multiple grippers coincide with the axis of the tray and can place the wafer on the tray along the preset clamping axis, achieving high-precision alignment between the wafer center and the tray center during loading. When the grippers hold the wafer on the tray, they can ensure the concentricity of the wafer and the tray, guaranteeing processing accuracy from the source and avoiding defects such as asymmetrical edge processing caused by misalignment of the wafer and the processing tray axis during loading, thus meeting strict process dimensional tolerance requirements.

[0026] On the other hand, the present invention also proposes a processing method that uses the above-mentioned wafer processing equipment to process the wafer, which has high processing accuracy and processing efficiency. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of the wafer processing equipment in an embodiment of the present invention;

[0028] Figure 2 This is a schematic diagram of the platform structure in an embodiment of the present invention;

[0029] Figure 3 This is a top view of the platform in an embodiment of the present invention;

[0030] Figure 4 yes Figure 3 A magnified view of a section at point A in the middle;

[0031] Figure 5 This is a schematic diagram of the feeding module in an embodiment of the present invention;

[0032] Figure 6 This is a schematic diagram of the processing module in an embodiment of the present invention;

[0033] Figure 7 This is a cross-sectional view of a wafer with an annular notch formed after processing in an embodiment of the present invention;

[0034] Figure 8 This is a schematic diagram of the clamping component clamping the wafer in an embodiment of the present invention;

[0035] Figure 9 This is a schematic diagram of the process by which the loading module places the wafer on the tray in an embodiment of the present invention;

[0036] Figure 10 This is a schematic diagram of the process of the loading module detaching from the wafer in an embodiment of the present invention;

[0037] Figure 11 This is a schematic diagram illustrating the wafer processing steps performed by the processing module in an embodiment of the present invention;

[0038] Figure 12 This is a flowchart of the wafer processing equipment in an embodiment of the present invention.

[0039] In the picture:

[0040] 1. Support module; 11. Platform; 111. Clearance groove; 112. Adsorption groove; 113. Connecting channel; 12. Rotating base; 2. Feeding module; 21. Clamping assembly; 211. Gripper; 2111. Abutment part; 2112. Support part; 212. Support plate; 213. Second driving component; 214. Slider; 215. Slide rail; 22. First driving component; 3. Processing module; 31. Processing assembly; 311. Grinding belt; 312. Grinding head; 313. Unwinding roller; 314. Rewinding roller; 315. Guide roller; 32. Third driving component; 33. Fourth driving component; 34. Connecting seat; 35. Fixing seat; 36. Unwinding / rewinding fixing plate; 100. Wafer; 101. Annular notch. Detailed Implementation

[0041] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0042] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0043] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0044] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0045] The following reference Figures 1 to 12 This describes the wafer processing equipment in this embodiment.

[0046] Reference Figure 7 In this embodiment, the wafer 100 is processed, specifically the outer edge of the wafer 100 is processed to form an annular notch 101.

[0047] Reference Figure 1 and Figure 5This embodiment proposes a wafer processing equipment, including a support module 1, a loading module 2, and a processing module 3. The support module 1 includes a platform 11 for supporting and fixing a wafer 100, and the outer edge of the wafer 100 is flush with the outer edge of the platform 11. The loading module 2 includes a clamping assembly 21, which includes multiple jaws 211 that can approach each other. The multiple jaws 211 can cooperate to clamp the wafer 100 and place it on the platform 11. The preset clamping axis of the multiple jaws 211 coincides with the axis of the platform 11 and can place the wafer 100 on the platform 11 along the preset clamping axis. The processing module 3 is disposed on one side of the support module 1 and is used to process the edge of the wafer 100. When wafer 100 is placed on tray 11, the outer edge of wafer 100 is flush with the outer edge of tray 11. This means that tray 11, with a diameter matching that of wafer 100, is used to ensure that wafer 100 is fully attached to the surface of tray 11, improving processing stability. When processing module 3 processes wafer 100, the full-bottom support of tray 11 can offset processing pressure, effectively preventing elastic deformation of wafer 100 caused by a small support surface, and simultaneously preventing mechanical interference between processing module 3 and tray 11 caused by a large support surface. Damage; secondly, the preset gripping axes of multiple grippers 211 coincide with the axis of the tray 11 and can place the wafer 100 on the tray 11 along the preset gripping axis, achieving high-precision alignment between the center of the wafer 100 and the center of the tray 11 during loading. When the grippers 211 hold the wafer 100 and place it on the tray 11, the concentricity of the wafer 100 and the tray 11 can be guaranteed, ensuring processing accuracy from the source and avoiding defects such as asymmetrical edge processing caused by misalignment of the wafer 100 and the processing tray 11 axis during loading, thus meeting strict process dimensional tolerance requirements. Specifically, when the grippers 211 hold the wafer 100 and place it on the tray 11, the concentricity of the wafer 100 and the tray 11 can be strictly controlled within 0.02mm.

[0048] It can be understood that the preset clamping axis of the multiple jaws 211 refers to the center line of the clamping area formed by the multiple jaws 211 when clamping the wafer 100. Since the wafer 100 is circular, when the jaws 211 clamp the wafer 100, the preset clamping axis of the multiple jaws 211 coincides with the central axis of the wafer 100. Therefore, when the multiple jaws 211 place the wafer 100 on the tray 11 along the preset clamping axis, it can ensure that the axis of the wafer 100 and the tray 11 coincides, thereby ensuring the concentricity of the wafer 100 and the tray 11.

[0049] In addition, the requirement that the outer edge of wafer 100 be flush with the outer edge of tray 11 means that the diameter matching error between tray 11 and wafer 100 is ≤ ±0.05mm.

[0050] In this embodiment, the clamping assembly 21 is positioned directly above the platform 11. The preset clamping axes of the multiple clamping jaws 211 located above coincide with the axis of the platform 11 located below. When the clamping jaws 211 clamp the wafer 100, the axis of the wafer 100 also coincides with the axis of the platform 11, directly achieving centering. At this time, the clamping assembly 21 moves directly in the vertical direction to place the wafer 100 on the platform 11, thus ensuring the concentricity of the wafer 100 and the platform 11.

[0051] Reference Figure 2 and Figure 3 Furthermore, the outer edge of the tray 11 is provided with a plurality of clearance grooves 111, each of which corresponds to a plurality of grippers 211. Each gripper 211 includes an abutment portion 2111 and a support portion 2112. The abutment portion 2111 abuts against the outer edge of the wafer 100, and the support portion 2112 abuts against the bottom of the wafer 100. The support portion 2112 can be placed within the clearance groove 111. When the gripper 211 grips the wafer 100, the abutment portion 2111 of the gripper 211 abuts against the outer edge of the wafer 100 to provide clamping force, and the support portion 2112 of the gripper 211 abuts against the bottom of the wafer 100 to provide supporting force. The abutment portion 2111 and the support portion 2112 cooperate with each other to ensure the stability of the wafer 100 gripping. When multiple grippers 211 grip the wafer 100 and place it on the tray 11, the presence of the support portion 2112 may cause the grippers 211 to collide with the tray 11, resulting in the wafer 100 not being placed correctly or being displaced. Therefore, multiple clearance slots 111 are provided on the tray 11. When the grippers 211 place the wafer 100 on the tray 11, the support portion 2112 can be completely embedded in the clearance slot 111, avoiding mechanical collision or interference between the support portion 2112 and the surface of the tray 11. Secondly, the precise cooperation between the support portion 2112 and the clearance slot 111 ensures that the wafer 100 can be completely attached to the tray 11 when the grippers 211 are released. In other words, the clearance slot 111 not only provides space for the support portion 2112 to avoid collision, but also serves as a physical positioning reference when the grippers 211 place the wafer 100.

[0052] Reference Figure 5The loading module 2 further includes a first driving member 22, and the clamping assembly 21 further includes a support plate 212. Multiple grippers 211 are disposed on the support plate 212. The output end of the first driving member 22 is connected to the support plate 212 and is used to drive the support plate 212 to move along a preset clamping axis towards or away from the platform 11. In this embodiment, the loading module 2 is disposed above the support module 1, and the first driving member 22 is disposed above the support plate 212. The support plate 212 is located above the platform 11, and its central axis coincides with the axis of the platform 11. The movement path of the output end of the first driving member 22 can coincide with the axis of the platform 11, thereby driving the support plate 212 to move along the preset clamping axis towards or away from the platform 11. Optionally, the first driving member 22 is a lead screw motor.

[0053] In addition, multiple grippers 211 are evenly spaced along the circumference of the support plate 212. When the first driving member 22 drives the support plate 212 to move closer to or further away from the tray 11 along the preset gripping axis, it also drives multiple grippers 211 to move closer to or further away from the tray 11 along the preset gripping axis, thereby placing the wafer 100 on the tray 11 along the preset gripping axis.

[0054] Furthermore, the clamping assembly 21 also includes a plurality of second driving members 213, all of which are disposed on the support plate 212. The output ends of the plurality of second driving members 213 are connected one-to-one with a plurality of grippers 211, used to drive the grippers 211 to move closer or further apart to grip or release the wafer 100. The central axis of the support plate 212 coincides with the axis of the platform 11. The plurality of second driving members 213 are disposed on the support plate 212 and evenly arranged around the center of the support plate 212, with the output ends of the plurality of second driving members 213 facing away from the center of the support plate 212. Therefore, when the plurality of second driving members 213 drive the plurality of grippers 211 to move, the plurality of grippers 211 can move closer to each other to grip the wafer 100 or move further apart to release the wafer 100. The preset gripping axis of the plurality of grippers 211 coincides with the axis of the platform 11. The plurality of second driving members 213 can be synchronously controlled by the control system. Optionally, the second driving member 213 can be a lead screw motor. Alternatively, in other embodiments, a fifth driving element can be directly used instead of multiple second driving elements 213. The fifth driving element is mounted on the support plate 212 and has multiple output ends. These output ends are connected one-to-one with multiple grippers 211, driving the grippers 211 to move closer or further apart to grip or release the wafer 100. The fifth driving element is positioned at the center of the support plate 212, and its multiple output ends are evenly arranged around the center of the support plate 212. When the multiple output ends of the fifth driving element drive the multiple grippers 211 to move, the grippers 211 can move closer to each other to grip the wafer 100 or move further apart to release the wafer 100. The preset gripping axis of the multiple grippers 211 coincides with the axis of the platform 11. One fifth driving element simultaneously drives multiple grippers 211, achieving a high degree of synchronization. Optionally, the fifth driving element can be a lead screw motor. Lead screw motors have high transmission efficiency and low backlash error, providing precise position control to meet the requirements of high positioning accuracy. In addition, lead screw motors have low frictional resistance, reducing internal wear and fatigue, extending service life, and improving system reliability and stability.

[0055] Furthermore, the support plate 212 is provided with multiple slide rails 215, and each gripper 211 is connected to a slider 214. The sliders 214 correspond one-to-one with the slide rails 215, and the sliders 214 can move within the slide rails 215, allowing the grippers 211 to move closer or further apart. The slide rails 215 provide precise guidance for the movement of the sliders 214, ensuring the straightness of the gripper 211's movement and preventing gripping failure. Secondly, lubricating oil can be applied to the slide rails 215 to reduce friction when the sliders 214 move within the slide rails 215, improving the working response speed.

[0056] In this embodiment, three grippers 211 are provided, as are three clearance grooves 111 and three slide rails 215. The three grippers 211 are evenly spaced along the circumference of the support plate 212 to improve gripping uniformity. Specifically, the angle between the line connecting two adjacent grippers 211 and the center of the support plate 212 is 120 degrees. Furthermore, if multiple second driving members 213 are used to drive multiple grippers 211, the number of second driving members 213 is also three. If a fifth driving member is used to drive multiple grippers 211, the output end of the fifth driving member has three outputs.

[0057] Reference Figure 4 The tray 11 is provided with an adsorption tank 112 and a connecting channel 113. The adsorption tank 112 is located on the upper surface of the tray 11. One end of the connecting channel 113 is connected to the adsorption tank 112, and the other end is selectively connected to a vacuum unit or a cleaning unit. The adsorption tank 112 allows the wafer 100 to be fixed on the tray 11 during processing, preventing the wafer 100 from shifting or falling off, thus improving the safety and accuracy of the processing.

[0058] Specifically, when the wafer 100 is placed on the upper surface of the tray 11, a vacuum unit connected to the connecting channel 113 creates a negative pressure within the connecting channel 113 and the adsorption tank 112, allowing the wafer 100 to be tightly adsorbed onto the tray 11. When the wafer 100 needs to be removed from the tray 11 after processing, a cleaning unit connected to the connecting channel 113 introduces a cleaning medium into the connecting channel 113, creating a positive pressure within the connecting channel 113 and the adsorption tank 112, allowing the wafer 100 to detach from the tray 11. Simultaneously, the cleaning medium cleans the upper surface of the tray 11, preventing impurities from remaining and affecting subsequent adsorption and fixation. The cleaning medium can be a mixture of compressed gas and cleaning fluid.

[0059] Furthermore, the adsorption grooves 112 are arranged in a vortex shape on the platform 11, or the adsorption grooves 112 are annular and multiple, with the multiple adsorption grooves 112 arranged radially at intervals along the platform 11 with the same center. In this embodiment, the adsorption grooves 112 are multiple annular grooves, arranged radially at intervals along the platform 11 with the same center, which disperses the adsorption force, forms a multi-level adsorption ring, improves the overall adsorption stability, and can avoid local failure of adsorption force, thus improving the overall uniformity. It can be understood that the adsorption grooves 112 located near the central area have a short path and therefore a high adsorption efficiency per unit area, while the adsorption grooves 112 located near the edge area have a long path and therefore a significantly lower adsorption efficiency per unit area. Therefore, more adsorption grooves 112 are needed to maintain the same adsorption intensity, and thus the distribution density of multiple adsorption grooves 112 gradually increases radially outward along the platform 11, ensuring the overall adsorption effect of the platform 11.

[0060] During processing, wafer 100 needs to rotate. Processing module 3 is positioned on one side of support module 1. When wafer 100 rotates, processing module 3 can make full contact with the outer edge of wafer 100, thereby enabling processing module 3 to perform processing on the outer edge of wafer 100 to form an annular notch 101. Specifically, support module 1 also includes a rotating base 12, which is positioned below and fixedly connected to the platform 11. The rotating base 12 can drive the platform 11 to rotate, thereby driving wafer 100 to rotate. Optionally, rotating base 12 is coaxially connected to platform 11.

[0061] Additionally, cleaning modules can be spaced apart above the platform 11. Each cleaning module includes interconnected nozzles and connecting pipes. The nozzles are connected to one end of the connecting pipes, and the other end of the connecting pipes is connected to a fluid storage device. The nozzles can spray deionized water and / or pure gas toward the processing positions of the processing module 3 and the wafers 100 to remove debris generated during processing and reduce the difficulty of subsequent cleaning.

[0062] Reference Figure 6 The processing module 3 is disposed on one side of the support module 1. The processing module 3 includes a processing assembly 31, which includes a polishing belt 311 and a polishing head 312. The polishing head 312 can approach the table 11 and press the polishing belt 311 against the outer surface of the wafer 100 to process the edge of the wafer 100. The processing assembly 31 also includes an unwinding roller 313, a winding roller 314, and multiple guide rollers 315. The polishing belt 311 is led out by the unwinding roller 313, passes around the multiple guide rollers 315, and is introduced by the winding roller 314. Multiple guide wheels 315 are used to control the path of the grinding belt 311, ensuring it accurately reaches the position of the grinding head 312. The processing module 3 also includes a winding and unwinding fixing plate 36. Unwinding wheels 313 and winding wheels 314 are arranged vertically at intervals on the winding and unwinding fixing plate 36 to reduce space occupation. Both unwinding wheels 313 and winding wheels 314 are connected to a rotary motor to control the unwinding and winding actions of the grinding belt 311, thereby controlling the tension of the grinding belt 311. For example, when the grinding belt 311 is too tight, the unwinding wheel 313 can be operated to let out a further section of the grinding belt 311. When the grinding belt 311 is too loose, the winding wheel 314 can be operated to retract a section of the grinding belt 311, thereby adjusting the tension of the grinding belt 311 and ensuring the processing efficiency of the grinding belt 311.

[0063] The processing module 3 also includes a third drive member 32 and a fourth drive member 33. The third drive member 32 is used to drive the grinding head 312 to move axially along the platform 11, and the fourth drive member 33 is used to drive the grinding head 312 to move radially along the platform 11, so that the grinding head 312 presses the grinding strip 311 against the outer surface of the wafer 100, so that the grinding head 312 can accurately act on the edge of the wafer 100, thereby enabling the grinding strip 311 to process the outer edge of the wafer 100.

[0064] Specifically, the processing module 3 also includes a connecting seat 34 and a fixed seat 35 connected to each other. The grinding head 312 is mounted on the fixed seat 35, and the output end of the third driving member 32 is connected to the grinding head 312, while the output end of the fourth driving member 33 is connected to the connecting seat 34. The third driving member 32, mounted on the fixed seat 35, directly drives the grinding head 312 to move along the axial direction of the table 11, while the fourth driving member 33 drives the connecting seat 34 to move radially along the table 11, thereby causing the fixed seat 35 and the grinding head 312 to move radially along the table 11.

[0065] In addition, multiple guide wheels 315 are movably mounted on the take-up and unwinding fixing plate 36 and the fixing seat 35, so that the path of the grinding belt 311 can be adjusted by moving the position of one or more guide wheels 315, and the tension of the grinding belt 311 can also be adjusted.

[0066] Reference Figures 8 to 12 The processing procedure of this wafer processing equipment is as follows:

[0067] S1. The clamping assembly 21 clamps the wafer 100 and places the wafer 100 on the tray 11 along the preset clamping axis;

[0068] S2, the tray 11 fixes the wafer 100, and the clamping assembly 21 is reset;

[0069] S3 and tray 11 drive wafer 100 to rotate;

[0070] S4, Processing module 3 processes the outer edge of wafer 100.

[0071] In step S1, the clamping assembly 21 clamps the wafer 100 specifically by: multiple second driving members 213 driving multiple jaws 211 to move closer to each other or a fifth driving member moving multiple jaws 211 to move closer to each other to clamp the wafer 100; then the first driving member 22 driving the clamping assembly 21 to move along the preset clamping axis toward the tray 11; when the wafer 100 is in full contact with the tray 11, multiple second driving members 213 driving multiple jaws 211 to move away from each other or a fifth driving member moving multiple jaws 211 to move away from each other to place the wafer 100 on the tray 11.

[0072] In step S2, the platform 11 fixes the wafer 100 by providing a vacuum environment to the adsorption tank 112 through the connecting channel 113 on the platform 11, so that the wafer 100 is fixed on the platform 11; then, multiple second driving members 213 drive multiple grippers 211 to move away from each other to release the wafer 100, and the first driving member 22 drives the clamping assembly 21 to move away from the platform 11 until the clamping assembly 21 is reset.

[0073] In step S3, the tray 11 drives the wafer 100 to rotate, specifically by the rotating base 12 driving the tray 11 to rotate, thereby driving the wafer 100 to rotate.

[0074] In step S4, the processing module 3 processes the outer edge of the wafer 100. Specifically, the fourth driving member 33 and the third driving member 32 jointly drive the polishing head 312 until the polishing strip 311 is pressed against the outer edge of the wafer 100. Then, the fourth driving member 33 continues to drive the polishing head 312 to move radially along the platform 11, so that the polishing strip 311 processes an annular notch 101 on the outer edge of the wafer 100.

[0075] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A wafer processing equipment, characterized in that, include: The support module (1) includes a tray (11) for supporting and fixing a wafer (100), and the outer edge of the wafer (100) is flush with the outer edge of the tray (11); The loading module (2) includes a clamping assembly (21), which includes a plurality of jaws (211) that can move close to each other to clamp the wafer (100). The preset clamping axis of the plurality of jaws (211) coincides with the axis of the tray (11), and the plurality of jaws (211) can place the wafer (100) on the tray (11) along the preset clamping axis. A processing module (3) is disposed on one side of the support module (1) and is used to process the wafer (100).

2. The wafer processing equipment according to claim 1, characterized in that, The outer edge of the tray (11) is provided with a plurality of clearance grooves (111), and the plurality of clearance grooves (111) are provided one-to-one with the plurality of grippers (211). The grippers (211) include an abutment part (2111) and a support part (2112). The abutment part (2111) is used to abut against the outer edge of the wafer (100), and the support part (2112) is used to abut against the bottom of the wafer (100). The support part (2112) can be placed in the clearance groove (111).

3. The wafer processing equipment according to claim 1, characterized in that, The loading module (2) further includes a first driving member (22), and the clamping assembly (21) further includes a support plate (212). A plurality of grippers (211) are disposed on the support plate (212). The output end of the first driving member (22) is connected to the support plate (212) and is used to drive the support plate (212) to move along the preset clamping axis toward or away from the platform (11).

4. The wafer processing equipment according to claim 3, characterized in that, The clamping assembly (21) further includes a plurality of second driving members (213), which are all disposed on the support plate (212). The output ends of the plurality of second driving members (213) are connected one-to-one with the plurality of grippers (211) to drive the plurality of grippers (211) to move closer or further away from each other in order to clamp or release the wafer (100).

5. The wafer processing equipment according to claim 3, characterized in that, The clamping assembly (21) further includes a fifth driving member, which is disposed on the support plate (212). The fifth driving member has multiple output terminals, which are connected one-to-one with multiple grippers (211) to drive the multiple grippers (211) to move closer or further away from each other in order to clamp or release the wafer (100).

6. The wafer processing equipment according to claim 3, characterized in that, The support plate (212) is provided with multiple slide rails (215), and each gripper (211) is connected with a slider (214). The multiple sliders (214) are arranged in a one-to-one correspondence with the multiple slide rails (215), and the sliders (214) can move within the slide rails (215).

7. The wafer processing equipment according to claim 3, characterized in that, The plurality of grippers (211) are evenly spaced along the circumference of the support plate (212).

8. The wafer processing equipment according to any one of claims 1-7, characterized in that, The platform (11) is provided with an adsorption tank (112) and a connecting channel (113). The adsorption tank (112) is located on the upper surface of the platform (11). One end of the connecting channel (113) is connected to the adsorption tank (112), and the other end is selectively connected to a vacuum unit or a cleaning unit.

9. The wafer processing equipment according to claim 8, characterized in that, The adsorption tank (112) is arranged in a vortex shape on the platform (11), or the adsorption tank (112) is annular and there are multiple such tanks, with the multiple annular adsorption tanks (112) arranged radially at intervals along the platform (11) with the same center.

10. A processing method, characterized in that, Processing a wafer (100) using the wafer processing equipment as described in any one of claims 1-9 includes the following steps: S1. The clamping assembly (21) clamps the wafer (100) and places the wafer (100) on the tray (11) along the preset clamping axis; S2, the tray (11) fixes the wafer (100), and the clamping assembly (21) is reset; S3, the tray (11) drives the wafer (100) to rotate; S4. The processing module (3) processes the outer edge of the wafer (100).

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