Vacuum wafer transfer robot and control method thereof

Abstract

The invention provides a vacuum wafer carrying robot and a control method thereof.The vacuum wafer carrying robot comprises a vacuum mechanical arm and an end effector, the vacuum mechanical arm comprises a vacuum driver and multiple stages of arm assemblies, and the multiple stages of arm assemblies are sequentially assembled and linked in a compliant mode through belt wheel transmission chains to form a multi-joint arm; an output shaft of the vacuum driver is connected into a belt wheel transmission chain at a first-stage arm joint, so that at least two first and second rotating output ends which are concentrically arranged in a sleeving manner are established at a last-stage arm wrist joint; the end effector comprises a finger piece, a power conversion assembly, a clamping shaft and a guide piece, the finger end of the finger piece is provided with a limiting piece, the tail end of the finger piece is connected with the first rotary output end, the guide piece is arranged on the finger piece, and the clamping shaft is connected with the guide piece in a matched mode and is in transmission connection with the second rotary output end through the power conversion assembly. And the guide piece is guided by the guide piece to stretch towards the finger tip direction of the finger piece to form a wafer clamping position with the limiting piece. Therefore, the mechanical arm is supported to carry the wafer to run at high speed.

Description

Technical Field

[0001] This invention relates to wafer transport technology, and more particularly to a handling robot suitable for vacuum environments, wherein the end effector employs a clamping structure to fix the wafer, and a control method thereof. Background Technology

[0002] In the semiconductor industry, wafers are the cornerstone of chip manufacturing, and they are typically circular pieces made of materials such as single-crystal silicon. Chip manufacturing requires wafer surfaces to be highly pure and flat. However, this critical characteristic also presents challenges: the thin-walled, small-size structure of wafers results in low physical strength, making them vulnerable to external stresses and impacts during handling, leading to a high risk of breakage. Therefore, how to safely and without damage handle these fragile components has become a recognized thorny issue in the industry.

[0003] Vacuum wafer handling robots are semiconductor manufacturing equipment designed to solve the problem of handling wafers in a vacuum environment. In semiconductor manufacturing, many processes require high vacuum and high cleanliness, necessitating vacuum handling robots that are clean, dust-free, and vacuum-compatible. However, this also limits the methods of wafer handling.

[0004] Currently, wafer handling robots used in atmospheric environments typically employ end effectors that actively grip the wafers, driven by cylinders and motors. However, such solutions are not suitable for vacuum environments. Furthermore, wafer handling methods based on negative pressure adsorption or Bernoulli's mechanism are also unsuitable for vacuum environments.

[0005] Currently, the end effectors of wafer handling robots in vacuum environments are generally designed using a passive friction method to hold and transport wafers. However, while passive friction wafer handling can achieve dust-free and low-vacuum conditions, the friction force applied to the wafer is insufficient, thus limiting the speed, posture, and stability of the vacuum wafer handling robot, thereby limiting production efficiency.

[0006] Therefore, there is an urgent need in this field to develop a robot solution that is adapted to a vacuum environment and can stably clamp and transport wafers in order to break through existing process bottlenecks. Summary of the Invention

[0007] Therefore, the main objective of this invention is to provide a vacuum wafer handling robot and its control method to solve the problems mentioned in the background art.

[0008] To achieve the above objectives, according to one aspect of the present invention, a vacuum wafer handling robot is provided, comprising: a vacuum robotic arm and an end effector. The vacuum robotic arm includes: a vacuum actuator and a multi-stage arm assembly, wherein each stage of the arm assembly is sequentially and compliantly assembled and linked by a pulley drive chain to form a multi-joint arm. The output shaft of the vacuum actuator is connected to the pulley drive chain at the joint of the first stage arm to establish at least two first and second rotary output ends arranged concentrically at the wrist joint of the last stage arm. The end effector includes: a finger component, a power conversion component, a clamping shaft, and a guide component. The finger component has a limiting component at its fingertip and its tail end is connected to the first rotary output end. The guide component is disposed on the finger component. The clamping shaft is engaged with the guide component and is drivenly connected to the second rotary output end via the power conversion component to extend and retract toward the fingertip of the finger component as guided by the guide component, forming a wafer clamping position with the limiting component.

[0009] In a possible preferred embodiment, the power conversion assembly includes: a connecting rod, a first connecting shaft, a second connecting shaft, and an elastic element. The two ends of the elastic element are respectively connected to a clamping shaft and a finger element. The two ends of the connecting rod are respectively connected to the tail end of the clamping shaft and the second rotary output end via the first connecting shaft and the second connecting shaft.

[0010] In a possible preferred embodiment, the power conversion component includes a cam, a roller, and an elastic element, wherein the cam is connected to the second rotary output end, the roller is axially connected to the tail end of the clamping shaft, and the two ends of the elastic element are respectively connected to the clamping shaft and the finger element, so that the roller and the cam maintain elastic contact on the wheel surface.

[0011] In a possible preferred embodiment, the clamping shaft head is bifurcated, and each bifurcated end is provided with at least one clamping wheel.

[0012] In a possible preferred embodiment, the clamping shaft includes: a shaft, a forked head, and clamping wheels. The forked head is connected to the shaft shaft, the clamping wheels are disposed at each fork end of the forked head, and the elastic element is arranged on both sides of the shaft, connecting the finger element and the forked head from both sides respectively.

[0013] In a possible preferred embodiment, the guide includes a track and a pulley, the pulley being selectively mounted on either the track or the clamping shaft to form a pulley engagement between the clamping shaft and the track.

[0014] To achieve the above objectives, according to another aspect of the present invention, a vacuum wafer handling robot is also provided, comprising: a vacuum robotic arm and an end effector, wherein the vacuum robotic arm comprises: a vacuum actuator and a multi-stage arm assembly, wherein each stage of the arm assembly is sequentially and compliantly assembled and linked by a pulley drive chain to form a multi-joint arm, and the output shaft of the vacuum actuator is connected to the pulley drive chain at the joint of the first stage arm to establish at least one rotary output end at the wrist joint of the last stage arm; the end effector comprises: a finger component, a power conversion component, a clamping shaft, and a guide component, wherein the finger component has a limiting component at its fingertip and its tail end is fixed to the wrist of the last stage arm, the guide component is disposed on the finger component, the clamping shaft is engaged with the guide component and is connected to the rotary output end via the power conversion component to extend and retract toward the fingertip of the finger component as guided by the guide component, forming a wafer clamping position with the limiting component.

[0015] In a possible preferred embodiment, the power conversion assembly includes: a connecting rod, a first connecting shaft, a second connecting shaft, and an elastic element. The two ends of the elastic element are respectively connected to a clamping shaft and a finger element. The two ends of the connecting rod are respectively connected to the tail end of the clamping shaft and the rotary output end via the first connecting shaft and the second connecting shaft.

[0016] In a possible preferred embodiment, the power conversion component includes: a cam, a roller, and an elastic element, wherein the cam is connected to the rotary output end, the roller is axially connected to the tail end of the clamping shaft, and the two ends of the elastic element are respectively connected to the clamping shaft and the finger element, so that the roller and the cam maintain an elastic fit on the wheel surface.

[0017] To achieve the above objectives, according to another aspect of the present invention, a control method suitable for any of the above-described vacuum wafer handling robots is also provided, comprising the steps of:

[0018] Start the vacuum robotic arm and send the end effector to the wafer pick-up position, waiting for the fingers to carry the wafer; control the rotary output end connected to the power conversion component to rotate forward, which in turn causes the clamping shaft to extend and cooperate with the limiting component to clamp the wafer; start the vacuum robotic arm and send the end effector to the wafer placement position; control the rotary output end connected to the power conversion component to rotate in reverse, which in turn causes the clamping shaft to retract and release the wafer.

[0019] The vacuum wafer handling robot and its control method provided by this invention innovatively utilize the rotary output end established at the wrist of the final-stage arm by the vacuum actuator and pulley transmission chain within the vacuum robotic arm as the gripping control power source. Through a power conversion component, the rotary motion is cleverly converted into the extension and retraction motion of the clamping shaft, thereby forming a gripper structure with the upper limit components of the fingers. This approach leverages the cleanliness and vacuum adaptability of the vacuum robotic arm itself, while providing a controllable power source suitable for vacuum environments, enabling the establishment of a gripper structure even in a vacuum. Compared to traditional passive friction-based handling solutions, this solution actively grips and handles wafers, supporting the vacuum robotic arm to operate at higher speeds, thereby significantly improving the production efficiency and operational stability of wafer handling operations. Attached Figure Description

[0020] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0021] Figure 1 This is a schematic diagram of the overall structure of the vacuum wafer handling robot of the present invention;

[0022] Figure 2 This is a schematic diagram of the first example of the power conversion component in the vacuum wafer handling robot of the present invention;

[0023] Figure 3 This is a schematic diagram of a second example of the power conversion component in the vacuum wafer handling robot of the present invention;

[0024] Figure 4 This is a half-section structural diagram of the vacuum wafer handling robot of the present invention;

[0025] Figure 5 This is a half-section diagram of the pulley drive chain at the left joint of the primary arm in the vacuum wafer handling robot of the present invention;

[0026] Figure 6 This is a half-sectional schematic diagram of the pulley transmission chain at the right joint of the primary arm and the left joint of the secondary arm in the vacuum wafer handling robot of the present invention.

[0027] Figure 7 This is a half-sectional schematic diagram of the pulley drive chain at the right joint of the secondary arm and the end effector in the vacuum wafer handling robot of the present invention;

[0028] Figure 8 This is a schematic diagram illustrating the implementation state of controlling the end effector to clamp the wafer in the extended arm state of the vacuum wafer handling robot of the present invention.

[0029] Figure 9 This is a schematic diagram of the second example of the clamping shaft in the vacuum wafer handling robot of the present invention.

[0030] Explanation of reference numerals in the attached figures

[0031] Vacuum robotic arm 1, end effector 2, wafer 9, vacuum actuator 11, bellows 12, primary arm assembly 13, secondary arm assembly 14, steel belt 15, slot 16, finger component 21, power conversion assembly 22, clamping shaft 23, guide component 24, limit component 25, spring 26, clamping wheel 27, first arm housing 131, first shoulder pulley 132, second shoulder pulley 133, third shoulder pulley 134, first elbow pulley 135, second elbow pulley 136, third elbow pulley 1 37, Second arm housing 141, Inner elbow shaft 142, Middle elbow shaft 143, Outer elbow shaft 144, Fourth elbow pulley 145, Fifth elbow pulley 146, First wrist pulley 147, Second wrist pulley 148, Inner wrist shaft 149, Outer wrist shaft 150, Connecting rod 221, First connecting shaft 222, Second connecting shaft 223, Cam 224, Roller 225, Shaft 231, Fork head 232, Output shaft end T1, Output shaft end T2, Output shaft end T3, Output shaft end T4. Detailed Implementation

[0032] To enable those skilled in the art to better understand the technical solutions of the present invention, the specific technical solutions of the present invention will be clearly and completely described below in conjunction with embodiments, so as to help those skilled in the art further understand the present invention. Obviously, the embodiments described in this application are merely some embodiments of the present invention, and not all embodiments. It should be noted that, for those skilled in the art, the embodiments and features in the embodiments of this application can be combined with each other without departing from the concept of the present invention and without conflict. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the disclosure and protection scope of the present invention.

[0033] Furthermore, the terms "first," "second," "S1," "S2," etc., used in the specification, claims, and drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such features can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those described herein. At the same time, the stages described in each step are not necessarily to be implemented in the same step; it should be understood that the implementation order of the contents of each step stage can be adjusted and interchanged without violating the inventive concept, so that embodiments of the invention described herein can be implemented in orders other than those described herein. Additionally, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. Unless otherwise expressly specified and limited, the terms "set," "arrange," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or a connection within two elements. Those skilled in the art can understand the specific meaning of the above terms in this case based on the specific circumstances and in conjunction with existing technology.

[0034] To design a robot solution that can adapt to vacuum environments and stably handle wafers, such as... Figures 1 to 8 As shown, the present invention provides a vacuum wafer handling robot, an example of which includes: a vacuum robotic arm 1 and an end effector 2.

[0035] Among them, such as Figure 4 As shown, the vacuum robotic arm 1 is preferably a vacuum SCARA structure, an example of which includes: a vacuum actuator 11 and a multi-stage arm assembly, wherein each stage of the arm assembly is sequentially and compliantly assembled and linked by a pulley drive chain to form a multi-joint arm. The output shaft of the vacuum actuator 11 is connected to the pulley drive chain at the joint of the first stage arm to establish at least two first and second rotational output ends arranged concentrically at the wrist joint of the last stage arm, providing a controllable power source suitable for a vacuum environment for the subsequent design of the gripper structure.

[0036] Specifically, in this embodiment, the vacuum actuator 11 is responsible for ensuring its vacuum environment and providing driving force. Its basic components include: the output shafts of one or more vacuum motors as the power input source, and these output shafts achieve strict vacuum sealing through bellows 12 and sealing rings. For example, the bellows 12, as a flexible sealing element, can compensate for displacement during shaft movement while preventing atmospheric leakage to the vacuum side; while the sealing ring is used for static or dynamic sealing points, such as flange connections, to ensure overall airtightness. Since the sealing characteristics of these vacuum actuators 11 are existing technologies, they will not be described in detail here.

[0037] The various arm components are connected by a multi-stage steel belt-pulley system, forming a continuous transmission chain. This pulley transmission chain transmits the rotational power of the output shaft to the wrist joint of the final arm stage, while simultaneously maintaining all transmission components in a vacuum environment. It should be noted that although this embodiment uses a pulley transmission chain as an example, those skilled in the art can equivalently replace the transmission chain with steel wire ropes, synchronous belts, etc., depending on the actual situation; therefore, this embodiment does not impose any limitations on this.

[0038] To better illustrate the structure of vacuum robotic arm 1, such as Figure 4 As shown, the example vacuum actuator 11 provides four vacuum output shaft ends T1, T2, T3, and T4. The multi-stage arm assembly includes a primary arm assembly 13 and a secondary arm assembly 14. The connection point between the vacuum actuator 11 and the primary arm assembly 13 is referred to as the robot shoulder, the connection point between the primary arm assembly 13 and the secondary arm assembly 14 is referred to as the robot elbow, and the connection point between the secondary arm assembly 14 and the end effector 2 is referred to as the robot wrist.

[0039] like Figures 5 to 6 As shown, the primary arm assembly 13 includes: a first arm housing 131, a first shoulder pulley 132, a second shoulder pulley 133, a third shoulder pulley 134, a first elbow pulley 135, a second elbow pulley 136, and a third elbow pulley 137. The first shoulder pulley 132 and the first elbow pulley 135, the second shoulder pulley 133 and the second elbow pulley 136, and the third shoulder pulley 134 and the third elbow pulley 137 are all connected by a steel belt 15 to form a pulley drive.

[0040] like Figure 5 As shown, the output shaft end T1 of the vacuum actuator 11 is fixedly connected to the left end of the first arm housing 131 to drive the first-stage arm assembly 13 to rotate as a whole, realizing a wide range of rotational movements of the robot's first-stage arm. The output shaft ends T2, T3, and T4 of the vacuum actuator 11 are respectively connected to the first shoulder pulley 132, the second shoulder pulley 133, and the third shoulder pulley 134 to transmit power to subsequent components through the pulleys.

[0041] The connection between the pulleys and the steel belt 15 of the aforementioned primary arm assembly 13 can be either fixed or friction-type. The transmission component is not limited to a steel belt; flexible elements such as steel wire ropes can also be used instead. The transmission ratio between the pulleys can be selected as 1:1, 1:2, 1:0.6, etc., and those skilled in the art can make combinations, substitutions, and adjustments according to the actual situation.

[0042] like Figures 6 to 7As shown, the secondary arm assembly 14 includes: a second arm housing 141, an inner elbow shaft 142, a central elbow shaft 143, an outer elbow shaft 144, a fourth elbow pulley 145, a fifth elbow pulley 146, a first wrist pulley 147, a second wrist pulley 148, an inner wrist shaft 149, and an outer wrist shaft 150.

[0043] The first elbow pulley 135 is connected to the right end of the first arm housing 131 via a bearing, and the second arm housing 141 is fixedly connected to the first elbow pulley 135 via an inner elbow shaft 142, thereby driving the secondary arm assembly 14 to rotate as a whole.

[0044] The second elbow pulley 136 is sleeved on the inner shaft 142 of the elbow via a bearing, and the fourth elbow pulley 145 is fixedly connected to the second elbow pulley 136 via the central shaft 143 of the elbow, so that the fourth elbow pulley 145 and the second elbow pulley 136 rotate synchronously.

[0045] The third elbow pulley 137 is sleeved on the elbow central shaft 143 and connected to the right end of the first arm housing 131 via a bearing. The fifth elbow pulley 146 is fixedly connected to the third elbow pulley 137 via the elbow outer shaft 144, so that the fifth elbow pulley 146 and the third elbow pulley 137 rotate synchronously.

[0046] like Figure 7 As shown, a groove platform 16 is provided at the left end of the second arm housing 141. The first wrist pulley 147 is connected to the left end of the second arm housing 141 via a bearing and fixed under the groove platform 16. The second wrist pulley 148 is fixed on the groove platform 16 via a bearing. The first wrist pulley 147 and the second wrist pulley 148 are respectively connected to the fourth elbow pulley 145 and the fifth elbow pulley 146 via steel belts 15 to form a pulley drive. In this way, a pulley drive chain is established between the first-stage arm assembly 13 and the first-stage arm assembly 148, and the compliant assembly linkage is completed sequentially to form a vacuum SCARA structure.

[0047] Finally, the inner wrist shaft 149 and the outer wrist shaft 150 are coaxially sleeved and fixedly connected to the first wrist pulley 147 and the second wrist pulley 148, respectively, to establish the first and second rotation output ends in the robot wrist, providing a controllable power source suitable for a vacuum environment for the subsequent design of the gripper structure.

[0048] Furthermore, the connection between the pulleys and the steel belt 15 of the aforementioned secondary arm assembly 14 can be either fixed or friction-type. The transmission component is not limited to a steel belt; flexible elements such as steel wire ropes can also be used. The transmission ratio between the pulleys can be selected as 1:1, 1:2, 1:0.6, etc., and those skilled in the art can combine, replace, and adjust them according to actual conditions.

[0049] Furthermore, after solving the problem of a controllable power source suitable for a vacuum environment, in order to design a wafer clamping structure, the end effector 2 example includes: finger 21, power conversion assembly 22, clamping shaft 23, and guide 24.

[0050] Specifically, the finger member 21 has a plurality of limiting members 25 at its fingertip. The limiting members 25 are spaced apart and tangent to the outer contour of the wafer 9. The tail end of the finger member 21 is connected to the first rotary output end (i.e., the outer shaft 150 of the wrist). In this embodiment, the guide member 24 is exemplified as a linear track, which is disposed on the finger member 21. The clamping shaft 23 is engaged with the guide member 24 and is connected to the second rotary output end (i.e., the inner shaft 149 of the wrist) via the power conversion component 22 to provide a power source, so as to control the clamping shaft 23 to extend and retract toward the fingertip of the finger member 21 as guided by the guide member 24, forming a wafer clamping position with the limiting members 25.

[0051] Specifically, such as Figure 2 As shown, an example of a power conversion assembly 22 of a linkage mechanism is illustrated. The power conversion assembly 22 includes: a connecting rod 221, a first connecting shaft 222, a second connecting shaft 223, and a spring 26. The two ends of the spring 26 are respectively connected to the head end of the clamping shaft 23 and the finger member 21. One end of the connecting rod 221 is axially connected to the tail end of the clamping shaft 23 via the first connecting shaft 222, and the other end of the connecting rod 221 is eccentrically connected to the second rotation output end (i.e., the inner shaft 149 of the wrist) via the second connecting shaft 223.

[0052] With this configuration, when the inner wrist shaft 149 and the outer wrist shaft 150 rotate synchronously, the finger component 21 can change direction. When the inner wrist shaft 149 rotates forward / reverse, the clamping shaft 23 can be extended and retracted on the finger component 21 via the connecting rod 221, forming at least three-point clamping of the outer contour of the wafer 9 with the limiting member 25. At the same time, during this process, the spring 26 can, on the one hand, adjust and buffer the clamping force applied to the wafer 9 by the clamping shaft 23 to prevent overpressure from causing damage to the wafer 9 or stress concentration, and on the other hand, enhance the flexibility of the linkage mechanism when the clamping shaft 23 retracts.

[0053] Furthermore, in alternative implementations, such as Figure 3 As shown, an example of a power conversion assembly 22 of a cam mechanism is illustrated, wherein the power conversion assembly 22 includes: a cam element 224, a roller 225, and a spring 26, wherein the cam element 224 is elliptical in shape and is connected to the second rotation output end (i.e., the inner shaft 149 of the wrist), the roller 225 is connected to the tail end of the clamping shaft 23, and the two ends of the spring 26 are respectively connected to the clamping shaft 23 and the finger element 21, so that the roller 225 and the cam element 224 maintain an elastic fit on the wheel surface.

[0054] With this configuration, when the inner wrist shaft 149 and outer wrist shaft 150 rotate synchronously, the finger component 21 can change direction. When the inner wrist shaft 149 rotates forward / reverse, it can drive the cam component 224 to rotate, and push the clamping shaft 23 to extend and retract on the finger component 21 via the roller 225, forming at least three-point clamping of the wafer's outer contour with the limiting component 25. At the same time, during this process, the spring 26 can, on the one hand, adjust and buffer the clamping force applied to the wafer by the clamping shaft 23 to prevent overpressure from causing wafer damage or stress concentration, and on the other hand, supplement the cam mechanism with the retraction mechanism of the clamping shaft 23 to support the overall extension and retraction of the clamping shaft 23.

[0055] Furthermore, such as Figures 2 to 3 As shown, to ensure clamping stability, in an optional embodiment, the clamping shaft 23 head can be designed with a forked end, such as a Y-shaped structure, and each fork end is provided with a clamping wheel 27. This design allows the clamping shaft 23 head to better adapt to the curvature of the wafer 9 edge (such as arc or ellipse), while the clamping wheel 27, made of rubber or other existing flexible materials, can provide uniform clamping force and improve the tolerance of the clamping shaft 23 head when clamping the wafer.

[0056] Furthermore, to improve the reliability of the clamping shaft 23 head when clamping the wafer, in optional embodiments, such as Figure 9 As shown, the clamping shaft 23 includes: a shaft 231, a forked head 232, and a clamping wheel 27. The forked head 232 is Y-shaped and is connected to the shaft 231, allowing the forked head 232 to swing left and right. The clamping wheel 27 is disposed at each fork end of the forked head 232. The spring 26 is preferably arranged on both sides of the shaft 231, connecting the finger piece 21 and the forked head 232 from both sides respectively.

[0057] With this configuration, when the shaft 231 extends outward and the forked head 232 is offset from the outer contour of the wafer 9, the forked head 232 can achieve stable clamping by swaying to adapt to the outer contour of the wafer 9. At the same time, when the shaft 231 retracts, the forked head 232 can be reset by the spring 26, without hindering the implementation of the power conversion component 22 adapted to the linkage mechanism or cam mechanism scheme.

[0058] Furthermore, to improve the smoothness of the guiding fit between the guide member 24 and the clamping shaft 23, in an optional embodiment, the guide member 24 includes: a track and sliding wheels. The sliding wheels are selectively mounted on either the track or the clamping shaft 23 so that a pulley connection is formed between the clamping shaft 23 and the track. For example, the clamping shaft 23 can usually be equipped with two sliding wheels, or the number of sliding wheels can be adjusted according to actual needs and the length of the clamping shaft 23. These sliding wheels can be precisely matched with the track to achieve linear guidance during the clamping process. The specific implementation can refer to the existing track and pulley technology, which will not be elaborated here.

[0059] On the other hand, based on the concept of the above embodiments, the present invention also provides a simplified implementation scheme, wherein the vacuum wafer handling robot includes: a vacuum robotic arm 1 and an end effector 2, wherein the vacuum robotic arm 1 includes: a vacuum driver 11 and a multi-stage arm assembly, wherein each stage of the arm assembly is sequentially and compliantly assembled and linked by a pulley drive chain to form a multi-joint arm, and the output shaft of the vacuum driver 11 is connected to the pulley drive chain at the joint of the first stage arm to establish at least one rotational output end at the wrist joint of the last stage arm.

[0060] The end effector 2 includes: a finger component 21, a power conversion assembly 22, a clamping shaft 23, and a guide component 24. The finger component 21 has a limiting member 25 at its fingertip and its tail end is fixed to the wrist of the end-stage arm. The guide component 24 is disposed on the finger component 21. The clamping shaft 23 is engaged with the guide component 24 and is connected to the rotary output end via the power conversion assembly 22, so that it extends and retracts towards the fingertip of the finger component 21 as guided by the guide component 24, forming a wafer clamping position with the limiting member 25. The implementation of the power conversion assembly 22 can refer to the example schemes of the aforementioned linkage mechanism or cam mechanism, and will not be described in detail here.

[0061] The relevant structure of the above example can be implemented and understood with reference to the aforementioned example. The simplified solution provided in this example abandons the rotation control of the finger component 21 and only allows the finger component 21 to be driven by the wrist of the final arm of the vacuum robotic arm 1. However, the control of the power conversion component 22 by the inner shaft 149 of the wrist is retained to support the control of the extension and retraction of the clamping shaft 23 to combine with the limiting component 25 to form a wafer clamping position. Therefore, the number of output shafts of the vacuum driver 11 and the corresponding number of pulley transmission chains can be reduced in the vacuum robotic arm 1 to reduce implementation costs.

[0062] On the other hand, the present invention also provides a control method for the vacuum wafer handling robot corresponding to the above example, the steps of which include:

[0063] Step S1: Start the vacuum robotic arm 1 and send the end effector 2 to the wafer pick-up position, waiting for the finger component 21 to carry the wafer 9;

[0064] Step S2 controls the rotary output end connected to the power conversion component 22 to rotate in the forward direction, which in turn causes the clamping shaft 23 to extend outward and the limiting component 25 to cooperate in clamping the wafer 9;

[0065] Step S3: Start the vacuum robotic arm 1 and send the end effector 2 to the wafer placement position;

[0066] Step S4 controls the rotary output end connected to the power conversion component 22 to rotate in the opposite direction, which in turn causes the clamping shaft 23 to retract and release the wafer 9.

[0067] In summary, the vacuum wafer handling robot and its control method provided by this invention innovatively utilize the rotary output end established at the wrist of the final arm of the vacuum robotic arm 1 by the vacuum actuator 11 and the pulley transmission chain as the gripping control power source. Through the power conversion component 22, the rotary motion is cleverly converted into the extension and retraction motion of the clamping shaft 23, thereby forming a gripper structure with the finger component 21 and the upper limit component 25. This approach utilizes the cleanliness and vacuum adaptability of the vacuum robotic arm 1 itself, while also providing a controllable power source suitable for a vacuum environment, enabling the gripper structure to be built even in a vacuum. Compared to traditional passive friction handling solutions, this solution actively grips and handles wafers, supporting the vacuum robotic arm 1 to operate at higher speeds, thereby significantly improving the production efficiency and operational stability of wafer handling operations.

[0068] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the invention should be included within the protection scope of the invention.

[0069] Those skilled in the art will understand that, besides implementing the system, apparatus, unit, and its modules provided by this invention in purely computer-readable program code, the same program can be implemented in the form of logic gates, switches, application-specific integrated circuits, programmable logic controllers, and embedded microcontrollers by logically programming the method steps. Therefore, the system, apparatus, and its modules provided by this invention can be considered a hardware component, and the modules included therein for implementing various programs can also be considered structures within the hardware component; alternatively, modules for implementing various functions can be considered both software programs implementing the method and structures within the hardware component.

[0070] Furthermore, all or part of the steps in the methods of the above embodiments can be implemented by a program instructing related hardware. This program is stored in a storage medium and includes several instructions to cause a microcontroller, chip, or processor to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as a USB flash drive, a portable hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0071] Furthermore, various different implementations of the present invention can be combined arbitrarily, as long as they do not violate the spirit of the present invention, they should also be regarded as the content disclosed in the present invention.

Claims

1. A vacuum wafer handling robot, comprising: A vacuum robotic arm with an end effector, the vacuum robotic arm comprising: a vacuum driver and a multi-stage arm assembly, wherein each stage of the arm assembly is sequentially and compliantly assembled and linked by a pulley drive chain to form a multi-joint arm, the output shaft of the vacuum driver is connected to the pulley drive chain at the joint of the first stage arm to establish at least two first and second rotary output ends arranged concentrically at the wrist joint of the last stage arm; The end effector includes: a finger component, a power conversion assembly, a clamping shaft, and a guide component. The finger component has a limiting component at its fingertip and its tail end is connected to a first rotary output end. The guide component is disposed on the finger component. The clamping shaft is mated with the guide component and is connected to a second rotary output end via the power conversion assembly, so as to extend and retract toward the fingertip of the finger component as guided by the guide component, forming a wafer clamping position with the limiting component.

2. The vacuum wafer handling robot according to claim 1, wherein the power conversion component comprises: The system comprises a connecting rod, a first connecting shaft, a second connecting shaft, and an elastic element. The two ends of the elastic element are respectively connected to a clamping shaft and a finger element. The two ends of the connecting rod are respectively connected to the tail end of the clamping shaft and the second rotary output end via the first connecting shaft and the second connecting shaft.

3. The vacuum wafer handling robot according to claim 1, wherein the power conversion component comprises: The components include a cam, a roller, and an elastic element. The cam is connected to the second rotary output end, the roller is axially connected to the tail end of the clamping shaft, and the elastic element is connected at both ends to the clamping shaft and the finger component, respectively, so that the roller and the cam maintain an elastic fit on the wheel surface.

4. The vacuum wafer handling robot according to claim 1, wherein the clamping shaft head is forked, and each fork end is provided with at least one clamping wheel.

5. The vacuum wafer handling robot according to any one of claims 2 or 3, wherein the clamping shaft comprises: The shaft, fork head, and clamping wheels are provided. The fork head is connected to the shaft shaft. The clamping wheels are provided at each fork end of the fork head. The elastic elements are arranged on both sides of the shaft and are connected to the finger elements and the fork head from both sides respectively.

6. The vacuum wafer handling robot according to claim 1, wherein the guide comprises: The track and the pulley are selectively mounted on either the track or the clamping shaft, so that the clamping shaft and the track form a pulley engagement.

7. A vacuum wafer handling robot, comprising: A vacuum robotic arm and an end effector, wherein the vacuum robotic arm includes: a vacuum driver and a multi-stage arm assembly, wherein each stage of the arm assembly is sequentially and compliantly assembled and linked by a pulley drive chain to form a multi-joint arm, and the output shaft of the vacuum driver is connected to the pulley drive chain at the joint of the first stage arm to establish at least one rotary output end at the wrist joint of the last stage arm. The end effector includes: a finger component, a power conversion assembly, a clamping shaft, and a guide component. The finger component has a limiting component at its fingertip and its tail end is fixed to the wrist of the end-stage arm. The guide component is disposed on the finger component. The clamping shaft is connected to the guide component and is driven by the power conversion assembly to the rotary output end so as to extend and retract toward the fingertip of the finger component as guided by the guide component, forming a wafer clamping position with the limiting component.

8. The vacuum wafer handling robot according to claim 7, wherein the power conversion component comprises: The system comprises a connecting rod, a first connecting shaft, a second connecting shaft, and an elastic element. The two ends of the elastic element are respectively connected to a clamping shaft and a finger element. The two ends of the connecting rod are respectively connected to the tail end of the clamping shaft and the rotating output end via the first connecting shaft and the second connecting shaft.

9. The vacuum wafer handling robot according to claim 7, wherein the power conversion component comprises: The system includes a cam component, a roller, and an elastic component, wherein the cam component is connected to the rotary output end, the roller is axially connected to the tail end of the clamping shaft, and the two ends of the elastic component are respectively connected to the clamping shaft and the finger component, so that the roller and the cam component maintain an elastic fit on the wheel surface.

10. A control method suitable for a vacuum wafer handling robot as described in any one of claims 1 to 9, comprising the steps of: The vacuum robotic arm is activated, and the end effector is sent to the wafer pick-up position, waiting for the fingers to pick up the wafer; The rotary output end connected to the control and power conversion component rotates in the forward direction, which in turn drives the clamping shaft extension and the limiting component to clamp the wafer in coordination. Start the vacuum robotic arm and send the end effector to the wafer placement position; The rotary output end connected to the control and power conversion component rotates in the opposite direction, which in turn causes the clamping shaft to retract and release the wafer.

Images