Processing device for processing substrate for electrochemical cell and method for processing substrate for electrochemical cell
By combining an active cooling system for liquid pools with a laser processing unit, the problem of low cooling efficiency in electrochemical single-cell substrate processing is solved, achieving efficient thermal management, avoiding substrate deformation and melt residue, and improving processing quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-26
- Publication Date
- 2026-03-27
AI Technical Summary
Existing electrochemical single-cell substrate processing equipment is difficult to cool efficiently, leading to heat energy introduction causing deformation and melt residue problems.
An active cooling system using a liquid pool is employed. The base is kept parallel to the direction of gravity and perpendicular to the liquid surface by a support structure. Laser pulses generated by the laser processing unit are used to process the liquid while being perpendicular to the direction of gravity and parallel to the liquid surface, thus achieving active cooling.
It effectively reduces or avoids thermal deformation and melt residue on the substrate during processing, improves cooling efficiency, and ensures processing quality.
Smart Images
Figure CN121733014A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a processing apparatus for processing substrates for electrochemical single cells and a method for processing substrates for electrochemical single cells by means of such processing apparatus. Background Technology
[0002] A known processing apparatus is used to process substrates for electrochemical single cells, the apparatus comprising tools for actively cooling the substrate by means of airflow. Summary of the Invention
[0003] In contrast, the processing apparatus of the present invention, which has the features of the independent claims, has the advantage of including a liquid pool for actively cooling the substrate. This enables efficient cooling of the substrate.
[0004] The term "processing equipment" can be understood in particular as a device for processing substrates. Specifically, the processing equipment is configured to process substrates for electrochemical single cells. Preferably, the processing equipment is constructed in multiple parts. It is preferred to use the processing equipment to perform a non-cutting processing method. Furthermore, the processing equipment has the aforementioned support for the substrate of the electrochemical single cell. It is preferred to perform direct processing of the substrate during the processing steps. Alternatively, indirect processing of the substrate via the processing equipment is also conceivable. It is particularly preferred that the processing equipment is configured to perform all the necessary steps for processing. Specifically, the processing equipment includes processing units for processing substrates for electrochemical single cells.
[0005] The term "machining unit" can be understood in particular as a unit configured to perform machining on a substrate. Preferably, the machining unit is configured to create recesses, especially through recesses, in the substrate. Preferably, the machining unit has at least one non-cutting tool for creating the recesses. Preferably, the machining unit is constructed in multiple parts. Preferably, the machining unit is configured to generate laser pulses. Preferably, the machining unit is configured to generate a single laser pulse and / or multiple successive laser pulses. Particularly preferred, the machining unit is configured as a laser drilling machine. Specifically, the machining unit is configured to perform machining on at least one surface of the substrate for an electrochemical single cell. Preferably, energy is introduced locally by means of the laser pulses generated by the machining unit. Particularly preferred, the energy is locally so large that the surface of the substrate is at least substantially partially, preferably substantially, and particularly preferably completely melted and / or evaporated. Alternatively, particularly complete melting along with particularly at least substantially partial evaporation is also conceivable. Preferably, at least one recess is created in the substrate for an electrochemical single cell by machining the surface of the substrate for the electrochemical single cell. Particularly preferred is to construct a through-hole in the substrate for the electrochemical single cell by machining the surface of the substrate. Preferably, the through-hole is arranged perpendicular to the main extending plane of the substrate for the electrochemical single cell. Focusing of the laser pulse is preferably performed by a machining unit.
[0006] "Substrate for electrochemical single cell" is preferably understood in this respect as a substrate configured for use in a fuel cell. Preferably, the substrate for electrochemical single cell is constructed as a plate. Preferably, the substrate is configured for use in an electrolyte single cell. Particularly preferred is the substrate for use in a solid oxide fuel cell. Alternatively, the substrate is configured for use in a battery. Preferably, the substrate for electrochemical single cell is configured to provide a substrate for the electrolyte. Furthermore, substrates made of pre-sintered ceramics are conceivable. Additionally, other materials that are of interest to those skilled in the art are also conceivable. Non-shrink materials should be understood in this respect as materials that do not further shrink during shrinkage processes, such as sintering processes, and / or have been pre-shrinked by, for example, sintering processes.
[0007] The “main extending plane” of an object or arrangement should be understood in particular as a plane that is parallel to the largest side of the smallest imaginary cuboid that just completely surrounds the object or arrangement and extends through the center point of the cuboid.
[0008] "Active cooling" can be understood in particular as the active extraction and / or removal of heat energy from an object and / or from its surroundings. This is preferably achieved using tools such as fans, cooling systems, or cooling media, which typically consume additional energy to enable the extraction and / or removal of heat energy.
[0009] "Passive cooling" can be understood in particular as the passive extraction and / or removal of heat energy from an object and / or from its surroundings. This is preferably achieved through natural physical processes such as convection, radiation, or heat extraction, which typically do not require additional energy to enable the extraction and / or removal of heat energy.
[0010] Advantageous improvements to the processing apparatus according to the independent claim can be achieved through the features listed in the dependent claims. It is therefore advantageous that the support is arranged such that the substrate can be held by the support so that the main extending plane of the substrate is at least substantially parallel to the direction of gravity and / or at least substantially perpendicular to the surface orientation of the liquid in the liquid pool. This technically enables, particularly active cooling.
[0011] "At least substantially parallel" should be understood in particular as the orientation of a plane or axis relative to a reference plane or reference axis, wherein, in particular, the plane and the reference plane are observed along the sectional axis of the plane and the reference plane, the axis and the reference axis are observed along an observation axis perpendicular to both the axis and the reference axis, or the plane and the reference axis or the axis and the reference plane are observed along an observation axis that is located in the plane or the reference plane and is arranged perpendicular to the axis or the reference axis, forming an angle of less than 10°, advantageously less than 5° and particularly advantageously less than 2°, wherein, advantageously, the plane or axis is arranged parallel to the reference plane or reference axis.
[0012] "At least substantially perpendicular" should be understood in particular as the orientation of a plane or axis relative to a reference plane or reference axis, wherein the plane and reference plane are observed, in particular, along the sectional axis of the plane and reference plane, the axis and reference axis are observed, in particular, along an observation axis perpendicular to both the axis and the reference axis, or the plane and reference axis or the axis and reference plane are observed, in particular, along an observation axis arranged in the plane or reference plane and perpendicular to the axis or reference axis, having an angle of 90°, which has a maximum deviation of, in particular, less than 10°, advantageously less than 5° and particularly advantageously less than 2°.
[0013] It is also advantageous that the processing units are arranged such that the propagation direction of the laser pulses generated, in particular, is at least substantially perpendicular to the direction of gravity and / or at least substantially parallel to the surface orientation of the liquid in the liquid pool. This also makes it technically advantageous to achieve, in particular, active cooling.
[0014] It is also advantageous that the support, especially the support, is movably arranged at least substantially parallel to the direction of gravity and / or at least substantially perpendicular to the surface of the liquid in the liquid pool. This enables, particularly, active cooling, which is technically advantageous.
[0015] It is also advantageous that the propagation direction of the laser pulses generated by the processing unit, and in particular the processing unit, can be at least substantially perpendicular to the direction of gravity and / or at least substantially parallel to the surface movement of the liquid in the liquid pool. This also makes it particularly advantageous to achieve active cooling.
[0016] The method used to process substrates for electrochemical single cells has the advantage of actively cooling the substrate using a liquid cell. This also allows for efficient substrate cooling.
[0017] Advantageous improvements to the method according to the independent claim can be achieved through the features listed in the dependent claims. Therefore, it is advantageous that the substrate is at least partially and continuously in and / or at least partially and continuously immersed in the liquid pool for particularly active cooling. This allows for particularly efficient, and especially active, cooling of the substrate.
[0018] It is also advantageous that the substrate is immersed in the liquid pool at least substantially parallel to the direction of gravity and / or at least substantially perpendicular to the surface of the liquid in the pool. This enables, technically, particularly active cooling.
[0019] It is also advantageous to process the substrate using laser pulses generated by the processing unit, wherein the processing is performed at least substantially perpendicular to the direction of gravity and / or at least substantially parallel to the surface of the liquid in the liquid pool, and in particular, to create recesses in the substrate, especially through-drilling. This allows for advantageous processing of the substrate, especially with active cooling.
[0020] A particular advantage is that the substrate is immersed in the liquid pool according to the processing progress. This allows for particularly efficient cooling of the substrate during simultaneous processing. Attached Figure Description
[0021] Embodiments of the present invention are schematically illustrated in the accompanying drawings and explained in more detail in the following description. Wherein: Figure 1 A cross-section of an embodiment of a processing apparatus for processing substrates for electrochemical single cells is shown. Figure 2 Showing from Figure 1 A side view of an embodiment of a processing apparatus used to process substrates for electrochemical single cells. Figure 3 Showing from Figure 1 Another side view of an embodiment of a processing apparatus used to process substrates for electrochemical single cells. Detailed Implementation
[0022] exist Figure 1The image shows a cross-section of an embodiment of the processing equipment 10 used to process the substrate 12 for electrochemical single cells, while... Figure 2 The text shows information from... Figure 1 A side view of an embodiment of the processing equipment 10 used to process substrate 12 for electrochemical single cells and in Figure 3 Another side view is shown. In the illustrated embodiment, the processing apparatus 10 includes a processing unit 14 for processing the substrate 12. Furthermore, in the illustrated embodiment, the processing apparatus 10 includes a support 16 for the substrate 12. In the illustrated embodiment, the substrate 12 is introduced into or held by the support 16.
[0023] The processing equipment 10 now stands out for its liquid pool 18, which is used for actively cooling the substrate 12. Correspondingly, the substrate 12 is actively cooled by means of the liquid pool 18 in the illustrated case. In the illustrated embodiment, the liquid pool 18 is a water pool. However, alternatively, a liquid pool containing other liquids, such as a coolant, can also be conceived.
[0024] By actively cooling the substrate 12 using the liquid pool 18 as shown, the heat energy introduced into the substrate 12 during processing can be efficiently removed from the substrate 12 through the liquid pool 18 via heat dissipation. This allows for efficient cooling of the substrate 12. Consequently, deformation that may occur due to the heat energy introduced during processing is reduced or even completely avoided. Furthermore, any molten components that may not have evaporated and remain in or at the substrate 12 are also reduced or even completely avoided.
[0025] In the illustrated embodiment, the substrate 12 is partially and continuously in or continuously immersed in the liquid pool 18 for active cooling as shown. This enables particularly efficient active cooling of the substrate as shown.
[0026] In the current context, the support 16 can also be understood as a clamp and / or workpiece carrier. In the illustrated embodiment, the support 16 includes a first component 22 and a second component 24. In the illustrated embodiment, a base 12 is introduced between the first component 22 and the second component 24. Correspondingly, the base 12 can be introduced between the first component 22 and the second component 24, or in other words, can be introduced into the space between the first component 22 and the second component 24. In the illustrated embodiment, the support is designed such that, with the base 12 introduced, the support 16 surrounds the base 12 on both sides with respect to the main extension plane of the base 12 in the illustrated embodiment. Thus, when the base 12 is actively cooled in the illustrated embodiment, the support 16, along with the base 12, is also immersed in the liquid pool 18. However, as an alternative, it is also conceivable that, with the base 12 introduced, the support 16 does not surround the base and / or particularly with respect to the extension of the base 12, for example, extending longitudinally on one side, preferably at the end, for example at the longitudinal end, holds the base 12, so that the support 16 is not immersed in the liquid pool 18.
[0027] In the illustrated embodiment, the support 16 is arranged such that the base 12 can be held by the support 18 such that the main extending plane of the base 12 is oriented parallel to the direction of gravity and perpendicular to the surface 26 of the liquid (currently water) in the liquid pool. Correspondingly, in the illustrated embodiment, the base 12 is immersed in the liquid pool 18, parallel to the direction of gravity and perpendicular to the surface 26 of the liquid in the liquid pool 18. Thus, the base 12 can be actively cooled in the illustrated case by immersing itself in the liquid in the liquid pool 28 at different depths as needed, or partially immersed as necessary, or the depth of immersion of the base 12 in the liquid pool 18 can be set differently as needed.
[0028] In the illustrated embodiment, the processing unit 14 is arranged such that the propagation direction of the laser pulse 28 generated by the processing unit is perpendicular to the direction of gravity and parallel to the surface 26 of the liquid in the liquid pool 18. Correspondingly, the substrate 12 is processed by means of the laser pulse 28 generated by the processing unit 14, wherein the processing is performed perpendicular to the direction of gravity and parallel to the surface 26 of the liquid in the liquid pool 18, and in the illustrated case, notches are created in the substrate 12 by batch drilling, for example, through notches. Thus, the laser pulse 28 does not need to traverse the liquid pool 18 to process the substrate 12, and in the illustrated case, it can be incident on or act on the substrate 12 just above the surface of the liquid in the liquid pool 18 without high energy loss, wherein, in the present case, the substrate 12 can be actively cooled, or the heat energy introduced into the substrate 12 during processing can be efficiently removed from the substrate 12 through the liquid pool 18, or through heat removal.
[0029] In the illustrated embodiment, the support 16 is movably arranged parallel to the direction of gravity and perpendicular to the surface 26 of the liquid in the liquid pool. Thus, for active cooling in the illustrated case, the substrate 12 can be immersed in the liquid in the liquid pool 28 at different depths as needed during processing, or, if necessary, partially in sections, or the depth to which the substrate 12 is immersed in the liquid pool 18 can be set differently as needed during processing of the substrate 12.
[0030] In the illustrated embodiment, the propagation direction of the laser pulse 28 generated by the processing unit 14 can be perpendicular to the direction of gravity and parallel to the surface 26 of the liquid in the liquid pool 18. Thus, the laser pulse 28 can be incident on or act on the substrate 12 at different locations, in the illustrated case, just above the surface 26 of the liquid in the liquid pool 18, without significant energy loss.
[0031] In the illustrated embodiment, the substrate 12 is immersed in the liquid pool 18 according to the processing progress. In the illustrated case, when a row of notches is created or completed just above the surface 26 of the liquid in the liquid pool 18, the substrate 12 is immersed deeper into the liquid pool with the spacing between the two rows of notches in the substrate 12. As a result, the substrate can be cooled particularly efficiently during simultaneous processing, in the illustrated case, when the next row of notches located above is created or drilled.
Claims
1. A processing apparatus (10) for processing a substrate (12) for an electrochemical cell, characterized in that A liquid bath (18) for actively cooling the substrate (12), in particular.
2. The processing apparatus (10) according to claim 1, characterized in that The holder (14) is arranged in such a way that the substrate (12) can then be held by the holder (16) in such a way that the main extension plane of the substrate (12) is oriented at least substantially parallel to the direction of gravity and / or at least substantially perpendicular to the surface (26) of the liquid in the liquid bath (18).
3. The processing apparatus (10) according to any one of the preceding claims, characterized in that The machining unit (14) is arranged in such a way that the propagation direction of the laser pulses (28) generated by the machining unit (14) is oriented at least substantially perpendicular to the direction of gravity and / or at least substantially parallel to the surface (26) of the liquid in the liquid bath (18).
4. The processing apparatus (10) according to any one of the preceding claims, characterized in that The holder (16), in particular the holder (16), is arranged moveably at least substantially parallel to the direction of gravity and / or at least substantially perpendicular to the surface (26) of the liquid in the liquid bath (18).
5. The processing apparatus (10) according to any one of the preceding claims, characterized in that The propagation direction of the laser pulses (28) generated by the machining unit (14), in particular the machining unit (14), can be moved at least substantially perpendicular to the direction of gravity and / or at least substantially parallel to the surface (26) of the liquid in the liquid bath (18).
6. A method for machining a substrate (12) for an electrochemical single cell by means of a machining device (10), in particular a machining device (10) according to any one of the preceding claims, characterized in that The substrate (12) is actively cooled, in particular, by means of the liquid bath (18).
7. The method of claim 6, wherein, The substrate (12) is at least partially continuously in the liquid bath (18) and / or at least partially continuously immersed in the liquid bath (18) for active cooling, in particular.
8. The method according to any one of claims 6 or 7, characterized in that, The substrate (12) is immersed in the liquid bath (18) at least substantially parallel to the direction of gravity and / or at least substantially perpendicular to the surface (26) of the liquid in the liquid bath (18).
9. The method according to any one of claims 6 to 8, characterized in that, The substrate (12) is machined, in particular by means of the laser pulses (28) generated by the machining unit (14), wherein the machining is carried out at least substantially perpendicular to the direction of gravity and / or at least substantially parallel to the surface (26) of the liquid in the liquid bath (18), in particular producing recesses, preferably through recesses, in the substrate (12), in particular by batch drilling.
10. The method according to any one of claims 6 to 9, characterized in that, The substrate (12) is immersed in the liquid bath (18) in accordance with the machining progress.