Device and method for manufacturing ZP welding rectification chip

Abstract

The invention discloses a manufacturing device and method for a ZP welding rectifier chip, and belongs to the field of chip manufacturing, the manufacturing device comprises a die filling mechanism, a conveying mechanism and a vacuum sintering mechanism, the die filling mechanism carries out die filling on a silicon wafer, a molybdenum element and an aluminum foil, and the die filling mechanism comprises a machine base, a first feeding mechanism, a second feeding mechanism and an auxiliary fixing mechanism; the first feeding mechanism is used for feeding silicon wafers and molybdenum elements, the second feeding mechanism is used for feeding aluminum foil, the auxiliary fixing mechanism comprises a fixing base, an arc-shaped fixing plate is slidably arranged on the fixing base, a limiting assembly is slidably arranged on the arc-shaped fixing plate, a gap groove is formed in the limiting assembly, and the auxiliary fixing mechanism further comprises a fixing mold. The fixing mold is used for fixing the silicon wafer, the molybdenum element and the aluminum foil, the fixing mold comprises an arc-shaped body, and a pressing plate is arranged in the arc-shaped body in a sliding mode.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing, and in particular to an apparatus and method for manufacturing ZP soldering rectifier chips. Background Technology

[0002] With the development of science and technology, some specialized equipment now has requirements that exceed conventional limits. For example, in the aerospace field, specific requirements dictate that rectifier devices must have parameters such as VF ≤ 0.8V, junction temperature ≥ 200℃, a weight less than half that of comparable ordinary devices (the lower the better), and a size less than half that of ordinary devices (the smaller the better). The key to manufacturing such specialized rectifier devices lies in the rectifier chip. Taking a standard rectifier chip like the ф24 as an example, under full dynamic testing with a 200A current, its VF is typically between 1.0 and 1.1V, and its junction temperature cannot exceed 150℃. Maintaining a temperature of 150℃ for an extended period will cause the chip voltage to continuously drop until it breaks down. Therefore, a large heatsink is required when using it in ordinary equipment. This increases the weight and size of the device.

[0003] Devices assembled from rectifier chips in the general market can be manufactured using a sintered planar process to meet the aforementioned voltage drop and junction temperature requirements. However, the components used in devices assembled from chips manufactured using the planar process are not only large in size but also more than six times the weight of bolt-type components, severely exceeding aerospace requirements. If chip bonding is used for assembly: chips with a VF ≤ 0.8 can only be produced using silicon wafers with a thickness of 200 micrometers. Because the silicon wafer is too thin, its stress cannot be resolved, let alone achieving a junction temperature of 200°C.

[0004] Chinese patent CN102306628B, "Method for Manufacturing Planar Diodes or Thyristor Chips Using Aluminum Foil as Solder," discloses a method for manufacturing planar diodes or thyristor chips using aluminum foil as solder. The method involves placing an aluminum foil layer between the bare die and a molybdenum sheet, welding them in a vacuum environment, then depositing an aluminum film on the outer surface of the die, and finally coating it with silicone rubber for vacuum encapsulation. This method overcomes the shortcomings of existing technologies that use lead soldering, and eliminates lead contamination. Based on this, the present invention proposes a manufacturing apparatus and method for ZP soldering rectifier chips. Summary of the Invention

[0005] This invention provides an apparatus and method for manufacturing ZP soldering rectifier chips, which can solve the problem that conventional chip fabrication processes in the prior art cannot meet the fabrication requirements of chips used in aerospace.

[0006] A method for manufacturing ZP soldering rectifier chips includes the following steps: S1: Take a silicon wafer, perform doping and diffusion on the silicon wafer, then perform chemical nickel plating, use vacuum wax sealing to protect the N side of the silicon wafer, and remove the unprotected nickel layer on the P side of the silicon wafer; S2: Take a molybdenum element, plate it with nickel, and protect any side of the molybdenum element by vacuum sealing with wax, then remove the nickel layer from the unprotected side; S3: Remove the vacuum seal wax from the silicon wafer and molybdenum element, combine the silicon wafer and molybdenum element (with the nickel layer removed) together, place an aluminum foil of the same diameter in the middle as solder, and sinter at high temperature to form a flat chip. Remove the oxide layer generated by the high temperature sintering of the chip, chemically plate the chip with nickel after removing the oxide layer, then grind the chip to shape the angle, and add the molybdenum element in the solder furnace to tin both sides of the chip to form a soldered chip.

[0007] An apparatus for manufacturing ZP soldering rectifier chips includes a molding mechanism, a conveying mechanism, and a vacuum sintering mechanism, wherein the molding mechanism molds silicon wafers, molybdenum elements, and aluminum foil. The mold loading mechanism includes a base, a first feeding mechanism, a second feeding mechanism, and an auxiliary fixing mechanism. The first feeding mechanism is used for feeding silicon wafers and molybdenum cells, and the second feeding mechanism is used for feeding aluminum foil. The auxiliary fixing mechanism includes a fixing base, an arc-shaped fixing plate that slides on the fixing base, a limiting component that slides on the arc-shaped fixing plate, and a gap groove in the limiting component. The auxiliary fixing mechanism also includes a fixing mold that is used to fix the silicon wafer, molybdenum element and aluminum foil. The fixing mold includes an arc-shaped body, and a pressure plate that slides inside the arc-shaped body.

[0008] Furthermore, the first feeding mechanism includes a fixed bracket, which is fixed to the base. A U-shaped bracket is also fixedly mounted on the fixed bracket. A rotating shaft is rotatably mounted on the U-shaped bracket. One end of the rotating shaft is coaxially and fixedly mounted with a first pulley. A first motor is also fixedly mounted on the base. The output end of the first motor is connected to the same first pulley. The two first pulleys are connected by a first synchronous belt. The other end of the rotating shaft is coaxially and fixedly connected to a mounting plate. The mounting plate has a symmetrical structure. The rotating shaft is fixedly connected to the center of symmetry of the mounting plate. Discharge mechanisms are symmetrically and fixedly mounted on the mounting plate. The two discharge mechanisms respectively contain silicon wafers and molybdenum elements. The structures of the two discharge mechanisms are the same. The discharge mechanism includes a loading cylinder, which is fixed to the mounting plate. One end of the loading cylinder is a detachable inlet end, and the other end is a discharge end.

[0009] Furthermore, the discharge end of the charging cylinder is provided with a discharge port, and the end of the discharge port that contacts the charging cylinder is provided with an arc-shaped groove. The arc-shaped groove is used for the discharge of silicon wafers or molybdenum cells, and the width of the arc-shaped groove is adapted to the thickness of the silicon wafers or molybdenum cells. A sealing plate is slidably provided at the arc-shaped groove, and the shape of the sealing plate is adapted to the arc-shaped groove. A crescent plate is fixedly provided at the top of the sealing plate, and there is a gap between the crescent plate and the end of the charging cylinder. Several springs are fixedly connected between the crescent plate and the end of the charging cylinder. A magnet is fixedly provided in the middle of the crescent plate. An air pipe is connected to the inlet end of the charging cylinder, and the air pipe is connected to an air pump.

[0010] Furthermore, the discharge ports of the two loading cylinders are positioned one in front of the other.

[0011] Furthermore, the second feeding mechanism includes a support platform, on which a lower sealing box is fixedly mounted, and an upper sealing box is detachably mounted on the lower sealing box. The lower and upper sealing boxes have cylindrical chambers inside. The discharge end of the upper sealing box has an arc-shaped slot, and the end of the lower sealing box has a circular end plate. The arc-shaped slot is used for aluminum foil discharge, and the circular end plate has a groove adapted to the shape of the picking plate. The second feeding mechanism also includes a support frame fixedly mounted on the machine base. Several first telescopic cylinders are fixedly mounted on the support frame. The output ends of the several first telescopic cylinders are respectively fixedly connected to the cylinder body of the second telescopic cylinder. A horizontal plate is fixedly connected to the output end of the second telescopic cylinder. A picking plate is fixedly mounted on the horizontal plate, and a negative pressure suction hole is provided on the picking plate.

[0012] Furthermore, the lower and upper sealing boxes are also provided with micropores, which are circumferentially distributed on the inner walls of the lower and upper sealing boxes and located between the outermost aluminum foil and the next outermost aluminum foil.

[0013] Furthermore, an electromagnet is also provided in the middle of the horizontal plate.

[0014] Furthermore, a plurality of third telescopic cylinders are fixedly mounted on the fixed seat of the auxiliary fixing mechanism. The output ends of the plurality of third telescopic cylinders are fixedly connected to the arc-shaped fixing plate through connecting ears. That is, the arc-shaped fixing plate can be moved up and down through the third telescopic cylinders. The connecting ears are fixedly mounted on both ends of the arc-shaped fixing plate, and the connecting ears at both ends are slidably provided with limiting components. The limiting component has a U-shaped structure, with its two U-shaped sides slidingly disposed in a groove located on the connecting ears at both ends. One of the U-shaped sides is provided with a first rack, and a first gear is rotatably provided on the platform of one of the connecting ears. The first gear meshes with the first rack for transmission. A second pulley is coaxially and fixedly connected to the first gear. A cylindrical rod is rotatably connected to the connecting ear through a connecting plate. One end of the cylindrical rod is coaxially and fixedly connected to a third pulley. The second pulley and the third pulley are connected by a second synchronous belt. The other end of the cylindrical rod is coaxially and fixedly provided with a second gear. A back plate is fixedly provided on the fixed seat. A fourth telescopic cylinder is fixedly provided at the top of the back plate. A connecting rod is fixedly provided at the output end of the fourth telescopic cylinder. The connecting rod is connected to the back plate through a telescopic rod. A second rack is fixedly provided on the side of the connecting rod. The second rack meshes with the second gear for transmission. The connecting rod is also symmetrically provided with two connecting pieces. A U-shaped clamp is fixedly provided on each of the two connecting pieces.

[0015] Furthermore, the fixed mold has an arc-shaped body with a cavity for storing materials, a baffle on the side of the arc-shaped body, a collection groove at the bottom of the arc-shaped body, a pressure plate that slides on the back of the arc-shaped body, a pull rod on the pressure plate, limit blocks fixed on both sides of the pull rod, and a limit groove at the corresponding position on the back of the arc-shaped body.

[0016] Beneficial effects

[0017] 1. This invention provides a method for manufacturing rectifier chips by soldering, used for auxiliary splicing and sintering between silicon wafers, molybdenum elements, and aluminum foil. A molding mechanism molds the silicon wafers, molybdenum elements, and aluminum foil. After molding, the assembled workpiece is conveyed to a vacuum sintering mechanism via a transfer mechanism for mechanical or manual loading. Finally, vacuum sintering is performed in the vacuum sintering mechanism. The first loading mechanism in this invention is used for loading the silicon wafers and molybdenum elements, and the second loading mechanism is used for loading the aluminum foil. The silicon wafers, aluminum foil, and molybdenum elements are sequentially placed into an auxiliary fixing mechanism for molding. After molding, the transfer mechanism then transports them to the vacuum sintering mechanism for sintering and welding.

[0018] 2. This invention separates the silicon wafer, molybdenum element, and aluminum foil by setting a limiting component, ensuring that there are gaps between the three during the molding process. The limiting component also has a gap groove for inserting the aluminum foil. After the silicon wafer, aluminum foil, and molybdenum element are placed in the fixed mold in sequence, the pull rod is pushed to make the pressure plate fit with the silicon wafer or molybdenum element, realizing the fit of the three in the fixed mold. In this invention, pushing the pull rod can insert the limiting block into the limiting groove. At the same time, the limiting component needs to move upward to separate from the silicon wafer, aluminum foil, and molybdenum element, which facilitates the fit of the silicon wafer, aluminum foil, and molybdenum element and the removal of the fixed mold.

[0019] 3. Regarding the thickness of the silicon wafer, this invention selects a very thin silicon wafer to solve the VF≥0.8 problem. The method of using aluminum foil as solder to make a planar diode chip solves the problem of stress on the silicon wafer and the requirement that the operating junction temperature can reach above 200°C. The oxide layer of the semi-finished chip is removed by high-temperature sintering, and then chemical nickel plating is performed to solve the problem of tin on the chip. In this way, the pressure junction chip is manufactured into a bolt-welded diode chip, which solves the problems of excessive weight and size of the diode. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the mold assembly mechanism of the present invention; Figure 3 This is a front view of the molding mechanism of the present invention; Figure 4 This is a schematic diagram of the first feeding mechanism of the present invention; Figure 5This is a schematic diagram of the second feeding mechanism of the present invention; Figure 6 For the present invention Figure 5 Enlarged schematic diagram of section A in the middle; Figure 7 This is a front view of the auxiliary fixing mechanism of the present invention; Figure 8 This is a schematic diagram of the auxiliary fixing mechanism of the present invention; Figure 9 This is a schematic diagram of the fixed mold structure of the present invention. Figure I ; Figure 10 This is a schematic diagram of the fixed mold structure of the present invention. Figure II ; Figure 11 This is a side view of the auxiliary fixing mechanism of the present invention.

[0021] Explanation of reference numerals in the attached figures: 100. Vacuum sintering mechanism; 200. Conveying mechanism; 300. Mold loading mechanism; 301. Machine base; 302. First feeding mechanism; 303. Second feeding mechanism; 304. Auxiliary fixing mechanism; 30201. Fixed bracket; 30202. U-shaped bracket; 30203. Rotating shaft; 30204. First pulley; 30205. First synchronous belt; 30206. First motor; 30207. Air pump; 30208. Mounting plate; 30209. [Unclear text - possibly related to mounting mechanism] 30210. Material cylinder; 30211. Discharge port; 30212. Sealing plate; 30213. Spring; 30214. Magnet; 30215. Crescent plate; 30301. Support platform; 30302. Lower sealing box; 30303. Upper sealing box; 30304. Support frame; 30305. First telescopic cylinder; 30306. Second telescopic cylinder; 30307. Horizontal plate; 30308. Electromagnet; 30309. Material picking plate; 30310. Circular end plate; 3031 1. Arc-shaped slot; 30312. Microhole; 30401. Fixing base; 30402. Third telescopic cylinder; 30403. Connecting ear; 30404. Platform; 30405. Arc-shaped fixing plate; 30406. Limiting component; 30407. U-shaped edge; 30408. Slide groove; 30409. Gap groove; 30410. First gear; 30411. Second pulley; 30412. Second synchronous belt; 30413. Third pulley; 30414. Cavity 30415, Connecting plate; 30416, Cylindrical rod; 30417, Back plate; 30418, Fourth telescopic cylinder; 30419, Connecting rod; 30420, Second rack; 30421, Second gear; 30422, Connecting piece; 30423, U-shaped clamp; 30424, Arc-shaped body; 30425, Collection trough; 30426, Baffle; 30427, Pressure plate; 30428, Pull rod; 30429, Limiting block; 30430, Limiting groove. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] This invention provides a method for fabricating ZP soldering rectifier chips, comprising the following steps: S1: First, select a silicon wafer with appropriate thickness and resistivity according to the voltage requirements of the device. After doping and diffusion, perform chemical nickel plating on the silicon wafer. Use vacuum wax sealing to protect the N side of the silicon wafer. Use 10% aqua regia to remove the nickel layer on the unprotected P side of the silicon wafer. S2: Take a molybdenum element, plate it with nickel, and protect any side of the molybdenum element by vacuum sealing with wax. Then, use a mixed acid to remove the nickel layer on the unprotected side. S3: Remove the vacuum sealant from the silicon wafer and molybdenum element. Combine the silicon wafer and molybdenum element (with the nickel removed) with a layer of aluminum foil of the same diameter as solder. Sinter in a high-vacuum furnace at high temperature to form a planar chip. Remove the oxide layer generated during high-temperature sintering. Quickly perform chemical nickel plating on the de-oxided chip. Shape the chip by grinding at a specified angle. Add the molybdenum element to the chip in a solder bath for double-sided soldering to form a soldered chip. Pickle the chip mesa with a mixed acid. Protect the mesa with silicone rubber and undergo high-temperature aging. Once tested and approved, the chip is put into storage. Furthermore, the chip manufacturing process involves first selecting a molybdenum element of appropriate thickness and a silicon wafer with diffusion parameters that are coated with nickel, and then removing the nickel from the surfaces of the molybdenum element and the silicon wafer that need to be welded together.

[0024] The specific method for removing nickel is as follows: The cathode side of the silicon wafer is first protected with 80# vacuum sealing wax. After drying, it is immersed in 10% aqua regia to remove the nickel layer on the anode side for later use.

[0025] The same method is used to protect the molybdenum element after drying, and then the nickel layer on the unprotected side is removed with a mixed acid.

[0026] Furthermore, the molybdenum element and silicon wafer are processed into ordinary press-fit rectifier chip semi-finished products. For specific pressing methods, please refer to [reference needed].

[0027] Furthermore, the oxide layer generated during the high-temperature synthesis of the semi-finished chip molybdenum element and silicon wafer is removed, and the oxide-removed semi-finished chip is quickly electroless nickel plated. After nickel plating, it is cleaned, dried, and then ground to the designed angle. Then, it enters a high-temperature solder bath for tinning the anode and cathode of the chip. After completion, the surface is acid-washed, and after passing the test, it is protected with silicone rubber. After the silicone rubber has undergone high-temperature aging, the entire manufacturing process is completed.

[0028] The key to the preparation process of this invention lies in: 1. Select the thickness of the silicon wafer; choose a very thin silicon wafer to solve the problem of VF≥0.8.

[0029] 2. The method of "using aluminum foil as solder to make flat diode chips" is adopted to burn very thin silicon wafers and molybdenum elements together to form diodes, which solves the stress of silicon wafers and the requirement that the operating junction temperature can reach above 200℃.

[0030] 3. Remove the oxide layer from the high-temperature sintering of the semi-finished chip, and then perform chemical nickel plating to solve the problem of tin on the chip. In this way, the pressure-bonded chip is manufactured into a bolt-welded diode chip, which solves the problems of excessive weight and size of the diode.

[0031] In actual production, the silicon wafer and the molybdenum element, after the nickel layer has been removed, need to be bonded together, and an aluminum foil of the same diameter needs to be placed in the middle to achieve the welding of the silicon wafer and the molybdenum element. This process is usually carried out manually. Manual molding is inefficient and can easily introduce impurities, affecting the quality of the product. Therefore, this embodiment also provides a manufacturing apparatus for ZP soldering rectifier chips to solve the above problems.

[0032] like Figure 1 As shown, an apparatus for manufacturing ZP rectifier chips includes a molding mechanism 300, a conveying mechanism 200, and a vacuum sintering mechanism 100. The molding mechanism 300 molds silicon wafers, molybdenum elements, and aluminum foil. After molding, the assembled workpiece is conveyed to the vacuum sintering mechanism 100 via the conveying mechanism 200 for mechanical or manual loading. Finally, vacuum sintering is performed within the vacuum sintering mechanism 100. In this embodiment, the conveying mechanism 200 includes a single-channel or multi-channel transmission structure, and the vacuum sintering mechanism 100 includes a single-station sintering furnace and a multi-station sintering furnace. Both the conveying mechanism 200 and the vacuum sintering mechanism 100 are conventional technologies well-known to those skilled in the art, and their principles and usage methods will not be elaborated upon further.

[0033] like Figure 2 and 3 As shown, the molding mechanism 300 includes a base 301, a first feeding mechanism 302 and a second feeding mechanism 303, and an auxiliary fixing mechanism 304. The auxiliary fixing mechanism 304 is fixedly installed on the base 301. The first feeding mechanism 302 is used to feed silicon wafers and molybdenum elements, and the second feeding mechanism 303 is used to feed aluminum foil. The silicon wafers, aluminum foil, and molybdenum elements are sequentially fed into the auxiliary fixing mechanism 304 for molding. After molding, they are then transported by the conveying mechanism 200 to the vacuum sintering mechanism 100 for sintering and welding.

[0034] like Figure 4As shown, the first feeding mechanism 302 includes a fixed bracket 30201, which is fixed to the machine base 301. A U-shaped bracket 30202 is also fixedly mounted on the fixed bracket 30201. A rotating shaft 30203 is rotatably mounted on the U-shaped bracket 30202. One end of the rotating shaft 30203 is coaxially and fixedly mounted with a first pulley 30204. A first motor 30206 is also fixedly mounted on the machine base 301. The output end of the first motor 30206 is connected to the same first pulley 30204. The two first pulleys 30204 are connected by a first synchronous belt 30205. The other end of the rotating shaft 30203 is coaxially and fixedly connected to... There is a mounting plate 30208, which has a symmetrical structure. The rotating shaft 30203 is fixedly connected to the center of symmetry of the mounting plate 30208. The mounting plate 30208 is symmetrically and fixedly provided with two discharge mechanisms. The two discharge mechanisms are respectively filled with silicon wafers and molybdenum cells. The two discharge mechanisms have the same structure. Taking one of the discharge mechanisms as an example, the discharge mechanism includes a loading cylinder 30209, which is fixed on the mounting plate 30208. One end of the loading cylinder 30209 is a detachable feeding end, and the other end is a discharge end. That is, the material is loaded into the loading cylinder 30209 through the feeding end and fed through the discharge end at the other end.

[0035] like Figure 4 As shown, the discharge end of the charging cylinder 30209 is provided with a discharge port 30210. The end of the discharge port 30210 that contacts the charging cylinder 30209 has an arc-shaped groove. The arc-shaped groove is used for discharging silicon wafers or molybdenum wafers, and the width of the arc-shaped groove is adapted to the thickness of the silicon wafer or molybdenum wafer. A sealing plate 30211 is slidably provided at the arc-shaped groove. The sealing plate 30211 is adapted to the shape of the arc-shaped groove, and the sliding process of the sealing plate 30211 can open or seal the arc-shaped groove. A crescent plate 30214 is fixedly provided at the top of the sealing plate 30211. There is a gap between the crescent plate 30214 and the end of the charging cylinder 30209, and the crescent plate 30214 and the end of the charging cylinder 30209 are fixedly connected. Several springs 30212 are connected to the crescent plate 30214, and a magnet 30213 is fixedly installed in the middle position. The feed end of the loading cylinder 30209 is connected to an air pipe, which is connected to an air pump 30207. In use, the loading cylinder 30209 containing silicon wafers or molybdenum elements is rotated to a vertically downward position, that is, the discharge port 30210 is vertically downward. The air pump 30207 pushes the silicon wafers or molybdenum elements in the loading cylinder 30209 forward. When the silicon wafer or molybdenum element at the front moves to the arc-shaped groove, it pulls the crescent plate 30214 to move the sealing plate 30211. The sealing plate 30211 leaves the arc-shaped groove, and the silicon wafer or molybdenum element is fed along the discharge port 30210 under the action of gravity.

[0036] like Figure 2As shown, since aluminum foil needs to be placed between the silicon wafer and the molybdenum element, the silicon wafer and the molybdenum element need to be horizontal after loading, and a certain distance needs to be maintained between them to facilitate the insertion of the aluminum foil. Because the outlets 30210 of the two loading cylinders 30209 in this embodiment are in different positions, as shown... Figure 2 As shown, the discharge ports 30210 of the two loading cylinders 30209 are arranged in a front-to-back manner. That is, when the two loading cylinders 30209 are rotated to the vertical downward position, the discharge positions of the two discharge ports 30210 are different. For example, after one loading cylinder 30209 drops a silicon wafer to the auxiliary fixing mechanism 304, the other loading cylinder 30209 is rotated to drop a molybdenum element to the auxiliary fixing mechanism 304. The silicon wafer and the molybdenum element are parallel to each other on the auxiliary fixing mechanism 304, and there is a gap between them.

[0037] like Figure 5 As shown, the second feeding mechanism 303 then feeds the aluminum foil, moving it between the silicon wafer and the molybdenum element. Specifically, the second feeding mechanism 303 includes a support platform 30301, a lower sealing box 30302 fixedly mounted on the support platform 30301, and an upper sealing box 30303 detachably mounted on the lower sealing box 30302. Both the lower and upper sealing boxes 30302 have cylindrical chambers inside for neatly placing the aluminum foil. The upper sealing box 30303 has an arc-shaped slot 30311 at its discharge end, and the lower sealing box 30302 has a circular end plate 30310 at its end. The arc-shaped slot 30311 is used for aluminum foil discharge, and the circular end plate 30310 has a groove that matches the shape of the picking plate 30309. The picking plate 30309 adsorbs the aluminum foil, and the upward movement of the picking plate 30309 removes the aluminum foil from the arc-shaped slot 30311. The width of the slot 30311 can be greater than the thickness of the aluminum foil to avoid the aluminum foil becoming slightly deformed and unable to be removed. The second feeding mechanism 303 also includes a support frame 30304 fixedly mounted on the base 301. Several first telescopic cylinders 30305 are fixedly mounted on the support frame 30304. The output ends of the first telescopic cylinders 30305 are respectively fixedly connected to the cylinder body of the second telescopic cylinder 30306. A horizontal plate 30307 is fixedly connected to the output end of the second telescopic cylinder 30306. A picking plate 30309 is fixedly mounted on the horizontal plate 30307. The picking plate 30309 is provided with a negative pressure suction hole, which can perform negative pressure suction on the aluminum foil to realize the removal of the aluminum foil. The cooperation of the first telescopic cylinders 30305 and the second telescopic cylinders 30306 can realize the change of the position of the picking plate 30309, realize the movement of the aluminum foil to the designated position of the auxiliary fixing mechanism 304, and place it between the silicon wafer and the molybdenum cell.

[0038] The movement of the aluminum foil inside the lower sealing box 30302 and the upper sealing box 30303 can be done in the same way as the material pushing method of the loading cylinder 30209 or by directly pushing it with a push rod.

[0039] like Figure 6 As shown, due to the low thickness of the aluminum foil, adjacent aluminum foils are prone to sticking together, which can cause two or more aluminum foils to be carried out simultaneously during the removal of the outermost aluminum foil by the material picking plate 30309. Therefore, this embodiment also provides microholes 30312 in the lower sealing box 30302 and the upper sealing box 30303. The microholes 30312 are circumferentially distributed on the inner walls of the lower sealing box 30302 and the upper sealing box 30303, and are located between the outermost aluminum foil and the next outermost aluminum foil. When the material picking plate 30309 removes the foil, the microholes 30312 blow out gas to prevent adjacent aluminum foils from sticking together and to achieve effective removal of the outermost aluminum foil.

[0040] like Figure 4 As shown, since the crescent plate 30214 needs to slide to achieve material feeding, an electromagnet 30308 is also provided in the middle of the horizontal plate 30307 in this embodiment. The electromagnet 30308 generates magnetism when energized. In use, the position of the electromagnet 30308 can be changed by the cooperation of the first telescopic cylinder 30305 and the second telescopic cylinder 30306, so that the electromagnet 30308 attracts the magnet 30213 on the crescent plate 30214, thereby moving and retracting the crescent plate 30214. This avoids the loading cylinder 30209 from being exposed to air for a long time.

[0041] like Figure 7 As shown, the auxiliary fixing mechanism 304 includes a fixing base 30401, on which a plurality of third telescopic cylinders 30402 are fixedly mounted. The output ends of the plurality of third telescopic cylinders 30402 are fixedly connected to arc-shaped fixing plates 30405 via connecting ears 30403. That is, the arc-shaped fixing plates 30405 are moved up and down by the third telescopic cylinders 30402. The connecting ears 30403 are fixedly mounted at both ends of the arc-shaped fixing plates 30405, and limiting components 30406 are slidably mounted on the connecting ears 30403 at both ends. If the silicon wafer or molybdenum element is placed directly within the auxiliary fixing mechanism 304, no gap can be created between them. This means that when the aluminum foil is inserted, the silicon wafer or molybdenum element needs to be separated before the aluminum foil can be inserted. Therefore, this embodiment uses a limiting component 30406 to separate the silicon wafer, molybdenum element, and aluminum foil, ensuring that gaps exist between them during the molding process. Figure 8 As shown, the limiting component 30406 has a U-shaped structure. The two U-shaped sides 30407 of the limiting component 30406 are slidably disposed in the slide groove 30408. The slide groove 30408 ​​is located on the connecting ears 30403 at both ends. The limiting component 30406 is also provided with a gap groove 30409, which is used for the feeding of aluminum foil.

[0042] like Figure 8As shown, a first rack is provided on one of the U-shaped edges 30407, and a first gear 30410 is rotatably provided on the platform 30404 of one of the connecting lugs 30403. The first gear 30410 meshes with the first rack for transmission. A second pulley 30411 is coaxially and fixedly connected to the first gear 30410. A cylindrical rod 30416 is rotatably connected to the connecting lug 30403 through a connecting plate 30415. One end of the cylindrical rod 30416 is coaxially and fixedly connected to a third pulley 30413. The second pulley 30411 and the third pulley 30413 are connected by a second synchronous belt 30412. The other end of the cylindrical rod 30416... The second gear 30421 is coaxially and fixedly mounted on the end. A back plate 30417 is fixedly mounted on the fixed base 30401. A fourth telescopic cylinder 30418 is fixedly mounted on the top of the back plate 30417. A connecting rod 30419 is fixedly mounted on the output end of the fourth telescopic cylinder 30418. The connecting rod 30419 and the back plate 30417 are connected by a telescopic rod. A second rack 30420 is fixedly mounted on the side of the connecting rod 30419. The second rack 30420 meshes with the second gear 30421 for transmission. The connecting rod 30419 is also symmetrically provided with two connecting pieces 30422. A U-shaped clamp 30423 is fixedly mounted on each of the two connecting pieces 30422.

[0043] like Figure 9 and Figure 10 As shown, the auxiliary fixing mechanism 304 also includes a fixing mold, which includes an arc-shaped body 30424. The arc-shaped body 30424 has a cavity 30414 for storing materials. The side of the arc-shaped body 30424 is provided with a baffle 30426 to prevent the internal materials from falling out. The bottom of the arc-shaped body 30424 is provided with a collection groove 30425 for collecting molten aluminum. A pressure plate 30427 is slidably provided on the back of the arc-shaped body 30424. A pull rod 30428 is provided on the pressure plate 30427. Limiting blocks 30429 are fixed on both sides of the pull rod 30428. A limiting groove 30430 is provided at the corresponding position on the back of the arc-shaped body 30424. When the silicon wafer, aluminum foil and molybdenum element are placed in the fixing mold in sequence, the pull rod 30428 is pushed so that the pressure plate 30427 is attached to the silicon wafer or molybdenum element, realizing the attachment of the three in the fixing mold.

[0044] Since the silicon wafer, aluminum foil, and molybdenum element are placed in the fixed mold in sequence, the pull rod 30428 needs to be pushed to insert the limiting block 30429 into the limiting groove 30430. At the same time, the limiting component 30406 needs to be controlled to move upward to separate from the silicon wafer, aluminum foil, and molybdenum element, so as to facilitate the bonding of the silicon wafer, aluminum foil, and molybdenum element and the removal of the fixed mold. Therefore, this embodiment realizes the movement of the limiting block 30429 of the limiting component 30406 at the same time through the following method.

[0045] Specifically, in combination Figure 8 and Figure 11As shown, at this time, the U-shaped clamp 30423 is in the clamping state of the pull rod 30428, and the pressure plate 30427 is close to the back plate 30417. The fixed mold has enough space reserved for the material to be put in, while the limiting component 30406 is lower than the pressure plate 30427. The diameter of the pressure plate 30427 is basically consistent with that of the material. After the feeding is completed, the aluminum foil is located at the gap groove 30409, and the silicon wafer and molybdenum element are located at both ends of the limiting component 30406. The limiting component 30406 separates the three, and then the fourth telescopic cylinder 30418 realizes the movement of the connecting rod 30419 and the U-shaped clamp 30423 on it. The U-shaped clamp 30423 then drives the pull rod 30428 to move and limit the block 30428. 429 is inserted into the limiting groove 30430. At the same time, the second rack 30420 moves synchronously with the connecting rod 30419. The second rack 30420 meshes with the second gear 30421 to realize the rotation of the third pulley 30413. The first gear 30410 is rotated through the second synchronous belt 30412. The first gear 30410 moves upward through meshing with the first rack, that is, the limiting component 30406 is withdrawn upward. At the same time, the pressure plate 30427 pushes and presses the three components in the fixed mold to one side, realizing the bonding of the silicon wafer, molybdenum element and aluminum foil. The withdrawal of the limiting component 30406 also facilitates the removal of the fixed mold.

[0046] If the limiting block 30429 and the limiting groove 30430 are locked in the initial state, they can be pulled out by the U-shaped clamp 30423. First, the overall height of the fixed mold and the limiting component 30406 is lowered by the third telescopic cylinder 30402. At this time, the second rack 30420 and the second gear 30421 are in a vertically separated state. Then, the horizontal U-shaped clamp 30423 is moved to a position directly above the pull rod 30428. As the fixed mold and the limiting component 30406 rise again, the U-shaped clamp 30423 is inserted into the pull rod 30428, and the second rack 30420 and the second gear 30421 are engaged. The fourth telescopic cylinder 30418 controls the U-shaped clamp 30423 to pull out the pull rod 30428. At the same time, the second rack 30420 and the second gear 30421 are engaged to realize the lowering of the limiting component 30406 for the next mold assembly.

[0047] In this embodiment, the second rack 30420 and the second gear 30421 can also be separated laterally. That is, when the second rack 30420 leaves the top of the second gear 30421, there is no obstruction above the second gear 30421, and it can move up and down. That is, the limiting component 30406 and the fixed mold can move up and down to achieve a certain adjustment.

[0048] In the description of this invention, it should be understood that the terms "upper," "lower," "left," and "right," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or a specific orientational structure and operation. Therefore, they should not be construed as limitations on the invention. Furthermore, "first" and "second" are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "multiple" means two or more.

[0049] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0050] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A method for manufacturing ZP soldering rectifier chips, characterized in that, Includes the following steps: S1: Take a silicon wafer, perform doping and diffusion on the silicon wafer, then perform chemical nickel plating, use vacuum wax sealing to protect the N side of the silicon wafer, and remove the unprotected nickel layer on the P side of the silicon wafer; S2: Take a molybdenum element, plate it with nickel, and protect any side of the molybdenum element by vacuum sealing with wax, then remove the nickel layer from the unprotected side; S3: Remove the vacuum seal wax from the silicon wafer and molybdenum element, combine the silicon wafer and molybdenum element (with the nickel layer removed) together, place an aluminum foil of the same diameter in the middle as solder, and sinter at high temperature to form a flat chip. Remove the oxide layer generated by the high temperature sintering of the chip, chemically plate the chip with nickel after removing the oxide layer, then grind the chip to shape the angle, and add the molybdenum element in the solder furnace to tin both sides of the chip to form a soldered chip.

2. An apparatus for manufacturing ZP soldering rectifier chips, applied to the fabrication of the planar chip as described in claim 1, characterized in that, It includes a molding mechanism (300), a conveying mechanism (200), and a vacuum sintering mechanism (100), wherein the molding mechanism (300) molds the silicon wafer, molybdenum element and aluminum foil; The mold loading mechanism (300) includes a base (301), a first feeding mechanism (302), a second feeding mechanism (303), and an auxiliary fixing mechanism (304). The first feeding mechanism (302) is used for feeding silicon wafers and molybdenum cells, and the second feeding mechanism (303) is used for feeding aluminum foil. The auxiliary fixing mechanism (304) includes a fixing seat (30401), an arc-shaped fixing plate (30405) is slidably provided on the fixing seat (30401), a limiting component (30406) is slidably provided on the arc-shaped fixing plate (30405), and a gap groove (30409) is provided in the limiting component (30406). The auxiliary fixing mechanism (304) also includes a fixing mold, which is used to fix the silicon wafer, molybdenum element and aluminum foil. The fixing mold includes an arc-shaped body (30424), and a pressure plate (30427) is slidably provided in the arc-shaped body (30424).

3. The apparatus for manufacturing ZP soldering rectifier chips as described in claim 2, characterized in that, The first feeding mechanism (302) includes a fixed bracket (30201), which is fixed on the machine base (301). A U-shaped bracket (30202) is also fixed on the fixed bracket (30201). A rotating shaft (30203) is rotatably mounted on the U-shaped bracket (30202). One end of the rotating shaft (30203) is coaxial and fixedly mounted with a first pulley (30204). A first motor (30206) is also fixed on the machine base (301). The output end of the first motor (30206) is connected to the same first pulley (30204). The two first pulleys (30204) are connected by a first synchronization mechanism. The mounting plate (30208) is coaxially fixedly connected to the other end of the rotating shaft (30203) via (30205). The mounting plate (30208) has a symmetrical structure. The rotating shaft (30203) is fixedly connected to the center of symmetry of the mounting plate (30208). The mounting plate (30208) is symmetrically and fixedly provided with discharge mechanisms. The discharge mechanisms at the two locations are respectively filled with silicon wafers and molybdenum elements. The structures of the two discharge mechanisms are the same. The discharge mechanism includes a loading cylinder (30209). The loading cylinder (30209) is fixed on the mounting plate (30208). One end of the loading cylinder (30209) is a detachable feeding end, and the other end is a discharge end.

4. The apparatus for manufacturing ZP soldering rectifier chips as described in claim 3, characterized in that, The discharge end of the charging cylinder (30209) is provided with a discharge port (30210). The end of the discharge port (30210) that contacts the charging cylinder (30209) is provided with an arc-shaped groove. The arc-shaped groove is used for discharging silicon wafers or molybdenum cells, and the width of the arc-shaped groove is adapted to the thickness of the silicon wafers or molybdenum cells. A sealing plate (30211) is slidably provided at the arc-shaped groove. The sealing plate (30211) is adapted to the shape of the arc-shaped groove. A crescent plate (30214) is fixedly provided at the top. There is a gap between the crescent plate (30214) and the end of the feeding cylinder (30209). Several springs (30212) are fixedly connected between the crescent plate (30214) and the end of the feeding cylinder (30209). A magnet (30213) is fixedly provided in the middle of the crescent plate (30214). An air pipe is connected to the feed end of the feeding cylinder (30209), and the air pipe is connected to an air pump (30207).

5. The apparatus for manufacturing ZP soldering rectifier chips as described in claim 4, characterized in that, The discharge ports (30210) of the two loading cylinders (30209) are arranged in a front-to-back manner.

6. The apparatus for manufacturing ZP soldering rectifier chips as described in claim 2, characterized in that, The second feeding mechanism (303) includes a support platform (30301), a lower sealing box (30302) fixedly mounted on the support platform (30301), and an upper sealing box (30303) detachably mounted on the lower sealing box (30302). Both the lower sealing box (30302) and the upper sealing box (30303) have cylindrical chambers inside. The discharge end of the upper sealing box (30303) has an arc-shaped slot (30311), and the end of the lower sealing box (30302) has a circular end plate (30310). The arc-shaped slot (30311) is used for aluminum foil discharge, and the circular end plate (30310) has... The second feeding mechanism (303) also includes a support frame (30304) fixedly mounted on the base (301), which is adapted to the shape of the feeding plate (30309). A number of first telescopic cylinders (30305) are fixedly mounted on the support frame (30304). The output ends of the first telescopic cylinders (30305) are respectively fixedly connected to the cylinder body of the second telescopic cylinder (30306). A horizontal plate (30307) is fixedly connected to the output end of the second telescopic cylinder (30306). A feeding plate (30309) is fixedly mounted on the horizontal plate (30307). A negative pressure suction hole is provided on the feeding plate (30309).

7. The apparatus for manufacturing ZP soldering rectifier chips as described in claim 6, characterized in that, The lower sealing box (30302) and the upper sealing box (30303) are also provided with micropores (30312). The micropores (30312) are circumferentially distributed on the inner wall of the lower sealing box (30302) and the upper sealing box (30303), and are located between the outermost aluminum foil and the second outermost aluminum foil.

8. The apparatus for manufacturing ZP soldering rectifier chips as described in claim 7, characterized in that, An electromagnet (30308) is also provided in the middle of the horizontal plate (30307).

9. The apparatus for manufacturing ZP soldering rectifier chips as described in claim 2, characterized in that, The auxiliary fixing mechanism (304) has a number of third telescopic cylinders (30402) fixedly installed on the fixed seat (30401). The output ends of the number of third telescopic cylinders (30402) are fixedly connected to the arc-shaped fixing plate (30405) through the connecting ears (30403). That is, the arc-shaped fixing plate (30405) can be moved up and down through the third telescopic cylinders (30402). The connecting ears (30403) are fixed at both ends of the arc-shaped fixing plate (30405), and the connecting ears (30403) at both ends are slidably provided with limiting components (30406). The limiting component (30406) has a U-shaped structure. The two U-shaped sides (30407) of the limiting component (30406) are slidably disposed in the slide groove (30408), and the slide groove (30408) is located on the connecting ears (30403) at both ends. One of the U-shaped edges (30407) is provided with a first rack, and a first gear (30410) is rotatably provided on the platform (30404) of one of the connecting lugs (30403). The first gear (30410) meshes with the first rack for transmission. A second pulley (30411) is coaxially and fixedly connected to the first gear (30410). A cylindrical rod (30416) is rotatably connected to the connecting lug (30403) through a connecting plate (30415). A third pulley (30413) is coaxially and fixedly connected to one end of the cylindrical rod (30416). The second pulley (30411) and the third pulley (30413) are connected by a second synchronous belt (30412). The other end of the cylindrical rod (30416) is... A second gear (30421) is coaxially and fixedly provided. A back plate (30417) is fixedly provided on a fixed base (30401). A fourth telescopic cylinder (30418) is fixedly provided at the top of the back plate (30417). A connecting rod (30419) is fixedly provided at the output end of the fourth telescopic cylinder (30418). The connecting rod (30419) and the back plate (30417) are connected by a telescopic rod. A second rack (30420) is fixedly provided on the side of the connecting rod (30419). The second rack (30420) meshes with the second gear (30421) for transmission. The connecting rod (30419) is also symmetrically provided with two connecting pieces (30422). A U-shaped clamp (30423) is fixedly provided on each of the two connecting pieces (30422).

10. The apparatus for manufacturing ZP soldering rectifier chips as described in claim 9, characterized in that, The arc-shaped body (30424) on the fixed mold has a cavity (30414) for storing materials. The arc-shaped body (30424) has a baffle (30426) on its side and a collection groove (30425) at its bottom. A pressure plate (30427) is slidably provided on the back of the arc-shaped body (30424). A pull rod (30428) is provided on the pressure plate (30427). Limiting blocks (30429) are fixed on both sides of the pull rod (30428). A limiting groove (30430) is provided at the corresponding position on the back of the arc-shaped body (30424).

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