Ultrathin special-shaped glass coating and loading process

Abstract

The invention discloses an ultrathin special-shaped glass film coating and loading process, which relates to the field of optical glass elements, and mainly comprises the following steps: carrying plate pretreatment, double faced adhesive tape turnover machine laminating and frame cutting, ultrathin special-shaped glass bottom pasting and film covering, matrix type upper piece film coating, and UV photolysis glue discharging. The core is that a multi-layer composite bearing structure which is formed by compounding a back film with a carrier plate and compounding a UV visbreaking double-sided adhesive tape is adopted, and mechanical stress and thermal stress are effectively dispersed in combination with a precise plate turnover machine laminating process and a matrix type arrangement scheme. According to the invention, the problems of easy damage, difficult pollution control, low loading efficiency and the like caused by a mechanical clamp, vacuum adsorption or a traditional gluing mode in the film coating process of the ultrathin special-shaped glass are solved, and the film coating yield and the production efficiency are obviously improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical glass elements, in particular to a super-thin special-shaped glass coating loading process. BACKGROUND

[0002] The rapid development of augmented reality (AR) technology puts high requirements on the core optical elements of AR glasses. As a key component of the cover plate of AR glasses, super-thin special-shaped glass needs to be precisely coated on the surface to improve the light transmittance, reduce reflection, and enhance wear resistance. However, the characteristics of super-thin (thickness usually less than 0.1 mm) and irregular shape make it face great challenges in the coating loading link.

[0003] In the prior art, glass coating loading usually adopts vacuum adsorption, mechanical clamps, hot melt glue or ordinary UV glue fixation and other methods. However, when these methods are applied to super-thin special-shaped glass, there are problems of easy breakage, high pollution risk, and low yield.

[0004] Easy to break: vacuum adsorption can easily cause glass to break due to local stress concentration; the clamping force of mechanical clamps is difficult to accurately control, and it is easy to crush the glass edge.

[0005] High pollution risk: hot melt glue or ordinary UV glue may produce volatile substances during high-temperature coating process, polluting the coating chamber and glass surface, and the glue residue is difficult to clean.

[0006] Poor adaptability: traditional loading plates are difficult to adapt to complex special-shaped profiles, leading to loading difficulties and low efficiency.

[0007] Low yield: when the glass is peeled off, the excessively strong adhesive may cause the glass to break or produce internal stress damage due to uneven stress. SUMMARY

[0008] The purpose of the present application is to provide a super-thin special-shaped glass coating loading process to solve the problems raised in the background art.

[0009] To achieve the above purpose, the present application provides the following technical solution: a super-thin special-shaped glass coating loading process, comprising the following steps: S1, providing a loading plate and performing cutting, cleaning and surface film coating pretreatment on the loading plate; S2, fixing the first surface of the loading plate to a first loading platform and fixing the non-adhesion surface of the UV tack-reducing double-sided adhesive tape to a second loading platform; S3, tearing off the protective film on the surface of the double-sided adhesive tape, and precisely adhering the double-sided adhesive tape to the second surface of the loading plate by a plate turning machine to form a composite loading plate; S4, frame cutting the double-sided adhesive tape adhered on the loading plate to remove the excess part, and the frame cutting profile is larger than the projection profile of the glass to be coated; S5. Remove the protective film from the non-coated side of the ultra-thin irregular-shaped glass, attach the bottom to the double-sided tape after the frame is cut, roll it, and then cover it with the protective film. S6. The composite substrate with the base bonded layer is placed into the coating equipment in a matrix arrangement for coating. S7. After the coating is completed, place the carrier plate under UV light to weaken the adhesion of the double-sided adhesive. Then, safely remove the coated glass from the carrier plate and perform a second coating.

[0010] Preferably, in step S1, the carrier plate is cut using laser cutting, with the following parameters set: linear speed 45-55 mm / s, arc speed 45-55 mm / s, laser frequency 95-105 kHz, and power factor 25%-29%.

[0011] Preferably, in steps S2 and S3, the carrier plate and double-sided adhesive are fixed by vacuum adsorption; the process parameters for the flipping machine lamination are: adhesive roller lamination speed 95-105mm / s, back pressure 0.5-0.55MPa.

[0012] Preferably, in step S4, the frame cutting is performed using laser cutting, with the following parameters set: scanning speed 950-1050 mm / s, laser frequency 1000-1014 Hz, and laser energy 55%-65%; the frame cutting outline is a rectangular area 3-7 mm from the edge of the glass.

[0013] Preferably, in step S5, the protective film is picked up and removed using plastic clips during the bottom-applying process to avoid direct contact with the glass surface; and a rubber roller is used to roll the film at a uniform speed during the rolling process to remove air bubbles.

[0014] Preferably, after each piece of glass is applied to the backing, the surface of the protective film on the adjacent area to be applied is wiped with a lint-free cloth soaked in high-purity isopropyl alcohol. The wiping path is unidirectional, and each lint-free cloth is used only once.

[0015] Preferably, in step S6, the spacing between the sheets in the matrix arrangement is 8-12mm; before loading the sheets, it is necessary to check and ensure that the double-sided adhesive and protective film on the edge of the carrier board are free of wrinkles and peeling.

[0016] Preferably, in step S7, the UV photolysis process is carried out in a nitrogen environment with low oxygen content. The main wavelength of the UV light source used is 365nm±5nm, and the process parameters are: power 45%-55%, ambient temperature controlled at 18-23℃, nitrogen concentration maintained at 55%-65%, and irradiation time 13-17 seconds.

[0017] This invention provides a carrier board assembly, comprising: Rigid carrier layer, which is made of glass, silicon or anodized aluminum alloy; The UV-resistant double-sided adhesive layer is flatly attached to the surface of the rigid carrier plate layer in a bubble-free state using a flipping machine process. The frame-cut structure uses laser cutting to form a receiving window for positioning ultra-thin irregularly shaped glass on the double-sided adhesive layer; A peelable protective film layer covers the coated surface of the ultra-thin irregularly shaped glass attached to the receiving window.

[0018] Compared with the prior art, the beneficial effects of the present invention are: This invention fundamentally solves the breakage problem during loading and unloading by using a buffer design and controllable degumming technology, thereby improving the yield rate.

[0019] The entire process of film protection and contactless operation greatly reduces dust and human-caused pollution, and reduces rework rate.

[0020] The matrix-style loading scheme significantly increases the number of coatings per batch, improves production efficiency, and can perfectly adapt to various complex and irregular structures.

[0021] Precise process parameter windows are provided for the key bonding and debonding steps, ensuring consistency and reliability in mass production. Attached Figure Description

[0022] Fig. 1 This is a diagram of the glass bonding scheme; Fig. 2 This is an image of the glass plate. Fig. 3 This diagram shows the installation of the carrier plate and glass inside the coating machine. Fig. 4 This is a process flow diagram. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0024] Please see Figs. 1 to 4 This invention provides a technical solution: an ultra-thin irregularly shaped glass coating loading process, comprising the following steps: S1. Provide a carrier plate, and perform cutting, cleaning and surface coating pretreatment on the carrier plate; S2. Fix the first side of the carrier plate to the first platform, and fix the non-adhesive side of the UV-resistant double-sided adhesive to the second platform; S3. Remove the protective film from the surface of the double-sided adhesive, and use a flipping machine to precisely adhere the double-sided adhesive to the second side of the carrier plate to form a composite carrier plate; S4. Cut the double-sided tape adhered to the carrier plate by frame cutting, removing the excess part. It is necessary to ensure that the protective film on the surface of the double-sided tape is completely cut through so that the film can be easily peeled off before adhesion. The frame cut outline is larger than the projected outline of the glass to be coated. S5. Remove the protective film from the non-coated side of the ultra-thin irregular-shaped glass, attach its bottom to the double-sided tape after the frame is cut, roll it, and then cover it with the protective film. Attach its bottom to the double-sided tape after the frame is cut and the film is removed. After all the glass on the array is attached, apply a layer of protective film to prevent dirt from being introduced. S6. The composite substrate with the base bonded layer is placed into the coating equipment in a matrix arrangement for coating. S7. After the coating is completed, place the carrier plate under UV light to weaken the adhesion of the double-sided adhesive. Then, safely remove the coated glass from the carrier plate and perform a second coating.

[0025] In this embodiment, in step S1, the carrier plate is cut by laser cutting, and the parameters are set as follows: linear speed 45-55mm / s, arc speed 45-55mm / s, laser frequency 95-105kHz, and power factor 25%-29%.

[0026] In this embodiment, in steps S2 and S3, the carrier plate and double-sided adhesive are fixed by vacuum adsorption; the process parameters of the flipping machine are: adhesive roller coating speed 95-105mm / s, back pressure 0.5-0.55MPa.

[0027] In this embodiment, in step S4, the frame cutting is performed using laser cutting, with the following parameters set: scanning speed 950-1050 mm / s, laser frequency 1000-1014 Hz, and laser energy 55%-65%; the frame cutting outline is a rectangular area 3-7 mm from the edge of the glass.

[0028] In this embodiment, in step S5, the protective film is picked up and removed using plastic clips during the bottom-applying process to avoid direct contact with the glass surface; and a rubber roller is used to roll the film at a uniform speed during the rolling process to remove air bubbles.

[0029] In this embodiment, after each piece of glass is applied to the backing, a lint-free cloth soaked in high-purity isopropyl alcohol is used to wipe the surface of the protective film on the adjacent area to be applied. The wiping path is unidirectional, and each lint-free cloth is used only once.

[0030] In this embodiment, in step S6, the spacing between the sheets in the matrix arrangement is 8-12mm; before loading the sheets, it is necessary to check and ensure that the double-sided adhesive and protective film on the edge of the carrier board are free of wrinkles and peeling.

[0031] In this embodiment, in step S7, the UV photolysis process is carried out in a nitrogen environment with low oxygen content. The main wavelength of the UV light source used is 365nm±5nm, and the process parameters are: power 45%-55%, ambient temperature controlled at 18-23℃, nitrogen concentration maintained at 55%-65%, and irradiation time 13-17 seconds.

[0032] The process includes, in sequence, carrier pretreatment, double-sided adhesive lamination and frame cutting using a flipping machine, undercoating and film application of ultra-thin irregularly shaped glass, matrix-style film coating, and UV photolysis adhesive removal. The key points are: A rigid material with a coefficient of thermal expansion matching that of the target glass (such as borosilicate glass or silicon wafers) is selected as the carrier plate. First, it is cut to the required size using a high-precision laser cutter, with cutting parameters optimized to minimize the heat-affected zone. Then, rigorous ultrasonic and plasma cleaning is performed to thoroughly remove surface contaminants. Finally, a temporary protective film is immediately applied to the clean surface to provide a clean substrate for subsequent processes.

[0033] A high-precision flipping machine is used to bond UV-reducing double-sided adhesive (a pressure-sensitive adhesive whose tack significantly decreases after exposure to UV light of a specific wavelength) to a carrier board. By precisely controlling the speed, pressure, and flipping motion of the adhesive rollers, a uniform and defect-free bonding interface is ensured between the adhesive layer and the carrier board. After bonding, excess double-sided adhesive is trimmed along the edges of the carrier board. This is crucial for achieving bubble-free and wrinkle-free bonding.

[0034] Based on the outline drawings of the ultra-thin irregularly shaped glass, a "window" slightly larger than the actual contour of the glass (usually extending outwards by 3-7mm) is cut into the double-sided adhesive layer of the composite carrier using laser cutting technology. This design provides a precise positioning frame for the glass and avoids waste and subsequent cleaning problems caused by adhesive directly existing in non-coated areas. The laser cutting parameters are optimized to ensure clean cuts without any molten residue.

[0035] The procedure should be performed in a high-level cleanroom (such as Class 1000 or Class 100). Operators should use anti-static plastic tweezers or specialized clamps to remove and place the protective film only along the edges, absolutely avoiding contact with the glass itself. After precisely placing the glass into the framed window, use a silicone roller of specific hardness at a constant speed to roll it over the glass to thoroughly remove air bubbles. Immediately after completion, apply a new high-cleanliness PE protective film to the coated surface of the glass.

[0036] Multiple pre-treated carrier plates are arranged in a matrix with optimized spacing (e.g., 10 mm) and fixed to the back plate of the coating equipment. This arrangement maximizes the use of the coating chamber space, significantly increasing the output per batch. Rigorous visual or machine vision inspection is performed before the plates enter the coating machine.

[0037] After coating, the carrier assembly is irradiated with UV light (such as an oxygen-free curing machine). Under specific wavelengths (such as 365nm), power, time, and atmospheres (such as a nitrogen environment), the UV-resistant double-sided adhesive undergoes chemical cross-linking or degradation, causing its adhesion to the glass to drop sharply to less than 10% of its initial value. At this point, the glass can be removed extremely easily with minimal peeling force and almost no stress, thus ensuring a very high yield rate for finished products.

[0038] This invention provides a carrier board assembly, comprising: Rigid carrier layer, which is made of glass, silicon or anodized aluminum alloy; The UV-resistant double-sided adhesive layer is flatly attached to the surface of the rigid carrier plate layer in a bubble-free state using a flipping machine process. The frame-cut structure uses laser cutting to form a receiving window for positioning ultra-thin irregularly shaped glass on the double-sided adhesive layer; A peelable protective film layer covers the coated surface of the ultra-thin irregularly shaped glass attached to the receiving window.

[0039] Example 1: A 0.05mm thick ultrathin irregularly shaped glass coating loading This embodiment uses an irregularly shaped AR glass cover plate with a thickness of 0.05mm as the processing object to describe the implementation process of the present invention in detail.

[0040] Step S101: Carrier Pretreatment. A smooth-surfaced soda-lime glass is selected as the carrier. First, the carrier is cut to its shape using a laser cutter according to the tray size of the coating equipment. The laser parameters are set as follows: linear speed 50mm / s, arc speed 50mm / s, focal position -33.48mm, laser frequency 100kHz, power factor 27%. After cutting, the carrier is ultrasonically cleaned to remove cutting dust and oil. After cleaning, a temporary PE protective film is applied to the surface of the carrier.

[0041] Step S102: Flipping Machine Debugging and Preparation. Fix a debugging carrier plate and a piece of UV-resistant double-sided tape to the two platforms of the flipping machine, respectively. Start the flipping machine to adjust the alignment accuracy, ensuring the double-sided tape adheres precisely to the designated area on the carrier plate. After debugging, mark the diagonal positions of the carrier plate and double-sided tape on the flipping machine platform with a marker.

[0042] Step S103: Fixing the carrier plate to the double-sided adhesive. The first side (non-adhesive side) of the final carrier plate is fixed to the platform 1 of the flipping machine using vacuum adsorption, ensuring precise positioning via the positioning marks. The non-adhesive side (the side with the heavier release paper) of the UV-reducing double-sided adhesive is also fixed to the platform 2 using vacuum adsorption.

[0043] Step S104: Film Removal and Plate Flipping. Carefully peel off the protective film (release film on the bonding side) from the surface of the double-sided adhesive using manual or robotic arm, ensuring the double-sided adhesive does not shift during operation. Set the plate flipping machine process parameters: adhesive roller coating speed 100mm / s, adhesive roller back pressure 0.529MPa. Start the plate flipping machine; the platform 2 flips, pressing the double-sided adhesive flat onto the second side of the carrier plate. After bonding, remove the composite carrier plate and use a blade to trim off any excess double-sided adhesive along the edges of the carrier plate.

[0044] Step S105: Double-sided adhesive frame cutting. Based on the CAD drawing of the 0.05mm thick irregularly shaped glass, draw a rectangular frame cutting pattern with an outward expansion of 5mm in the laser cutting machine. Place the composite carrier plate into the cutting machine and set the parameters: scanning speed 1000mm / s, laser frequency 1007Hz, outward expansion cutting times 4 times, laser energy 60%. Perform the frame cutting, ensuring that the double-sided adhesive protective film is completely cut through so that the protective film in the area to be accommodated before bonding can be easily removed.

[0045] Step S106: Glass Backing and Coating. Use plastic tweezers or clips to hold the edge of the protective film on the non-coated side of the ultra-thin irregularly shaped glass and gently peel off the protective film. Then, precisely place the glass within the double-sided adhesive area cut out by the frame, and gently roll it with a small adhesive roller at a uniform speed to ensure that the glass, protective film, and double-sided adhesive are completely adhered without air bubbles. After applying all the glass according to the designed array, a layer of PET film needs to be applied to the coated side of the entire carrier board to prevent dust contamination.

[0046] Step S107: Matrix-style substrate loading and coating. Multiple substrates with completed backing are arranged in a matrix and fixed to the coating backing with a 10mm spacing between each substrate. Before loading, check that the double-sided adhesive and protective film on the edges of the substrates are flat and wrinkle-free. Before entering the coating workshop, a furnace inspection is performed. When peeling off the film, strictly follow the principle of top-to-bottom and left-to-right to avoid touching the glass surface. After peeling, immediately send the substrate into the coating machine for coating.

[0047] Step S108: Film Removal and Adhesive Debonding. Immediately after coating, a protective film is applied to the coated surface. The entire carrier assembly is then placed in an oxygen-free curing machine and irradiated with 365nm UV light in a 60% nitrogen atmosphere. The parameters are set as follows: power 50%, temperature 20.6℃, and irradiation time 15 seconds. After irradiation, the double-sided adhesive strength is significantly reduced, allowing the coated glass to be easily and without damage removed from the carrier. Finally, the finished product is slicing and undergoes a final secondary lamination and packaging.

[0048] Example 2: A preforming process An ultra-thin irregularly shaped glass coating with a thickness of 0.03 mm is used for loading. This embodiment is for thinner 0.03mm irregularly shaped glass. Its process principle is the same as that of Embodiment 1. However, since the glass is thinner and more brittle, some process parameters and operational details need to be more refined.

[0049] Step S201: Carrier Pretreatment. A smooth-surfaced soda-lime glass is selected as the carrier. First, the carrier is cut to its shape using a laser cutter according to the tray size of the coating equipment. The laser parameters are set as follows: linear speed 50mm / s, arc speed 50mm / s, focal position -33.48mm, laser frequency 100kHz, power factor 27%. After cutting, the carrier is ultrasonically cleaned to remove cutting dust and oil. After cleaning, a temporary PE protective film is applied to the surface of the carrier.

[0050] Step S202: Flip-board machine debugging and preparation. Fix a debugging carrier plate and a piece of UV-resistant double-sided tape to the two platforms of the flip-board machine respectively. Start the flip-board machine to adjust the alignment accuracy, ensuring that the double-sided tape can accurately adhere to the designated area on the carrier plate. After debugging, mark the diagonal positions of the carrier plate and double-sided tape on the flip-board platform with a marker, and then remove the debugging piece.

[0051] Step S203: Fixing the carrier plate to the double-sided adhesive. The first side (non-adhesive side) of the final carrier plate is fixed to the platform 1 of the flipping machine using vacuum adsorption, ensuring precise positioning via the positioning marks. The non-adhesive side (the side with the heavier release paper) of the UV-reducing double-sided adhesive is also fixed to the platform 2 using vacuum adsorption.

[0052] Step S204: Film Removal and Plate Flipping. Carefully peel off the protective film (release film on the bonding side) from the surface of the double-sided adhesive using manual or robotic arm, ensuring the double-sided adhesive does not shift during operation. Set the plate flipping machine process parameters: adhesive roller coating speed 100mm / s, adhesive roller back pressure 0.529MPa. Start the plate flipping machine; the platform 2 flips, pressing the double-sided adhesive flat onto the second side of the carrier plate. After bonding, remove the composite carrier plate and use a blade to trim off any excess double-sided adhesive along the edges of the carrier plate.

[0053] Step S205: Double-sided adhesive frame cutting. Based on the CAD drawing of the 0.05mm thick irregularly shaped glass, draw a rectangular frame cutting pattern with an outward expansion of 5mm in the laser cutting machine. Place the composite carrier plate into the cutting machine and set the parameters: scanning speed 1000mm / s, laser frequency 1007Hz, outward expansion cutting times 4 times, laser energy 60%. Perform the frame cutting, ensuring that the double-sided adhesive protective film is completely cut through so that the protective film in the glass receiving area can be easily removed before bonding.

[0054] Step S206: Glass backing and lamination. This step is crucial for controlling glass breakage to 0.03mm. A higher level of cleanliness is required for the operating environment. Use lighter rolling pressure and a slower speed during rolling. All operators must wear ion gloves and use anti-static plastic tools.

[0055] Step S207: Matrix-style wafer loading and coating. The wafer spacing can be appropriately increased to 12mm to further reduce the mutual influence between the carriers. The heating and cooling rates of the coating process need to be set more gradually.

[0056] Step S208: Film unloading and adhesive removal. In the UV adhesive removal parameters, the power can be maintained at 50%, but the irradiation time can be shortened to 14 seconds. Ensure that the film unloading operation is performed immediately after adhesive removal to avoid partial recovery of the adhesive.

[0057] As can be seen from the above two embodiments, the method provided by the present invention has a wide range of parameter adjustment space, can be adapted to ultra-thin glass of different thicknesses and shapes, and has good process robustness.

[0058] As is known from common technical knowledge, this invention can be implemented through other embodiments that do not depart from its spirit or essential characteristics. Therefore, the disclosed embodiments described above are merely illustrative and not exhaustive. All modifications within the scope of this invention or its equivalents are included in this invention.

Claims

1. A coating loading process for ultra-thin irregularly shaped glass, characterized in that: Includes the following steps: S1. Provide a carrier plate, and perform cutting, cleaning and surface coating pretreatment on the carrier plate; S2. Fix the first side of the carrier plate to the first platform, and fix the non-adhesive side of the UV-resistant double-sided adhesive to the second platform; S3. Remove the protective film from the surface of the double-sided adhesive, and use a flipping machine to precisely adhere the double-sided adhesive to the second side of the carrier plate to form a composite carrier plate; S4. Cut the double-sided tape adhered to the carrier plate by frame cutting, removing the excess part. It is necessary to ensure that the protective film on the surface of the double-sided tape is completely cut through so that the film can be easily peeled off before adhesion. The frame cut outline is larger than the projected outline of the glass to be coated. S5. Remove the protective film from the non-coated side of the ultra-thin irregular-shaped glass, attach the bottom to the double-sided tape after the frame is cut, roll it and cover it with the protective film. After all the glass on the array is attached, apply a layer of protective film to avoid the introduction of dirt. S6. The composite substrate with the base bonded layer is placed into the coating equipment in a matrix arrangement for coating. S7. After the coating is completed, place the carrier plate under UV light to weaken the adhesion of the double-sided adhesive. Then, safely remove the coated glass from the carrier plate and perform a second coating.

2. The ultra-thin irregular glass coating loading process according to claim 1, characterized in that: In step S1, the carrier plate is cut using laser cutting with the following parameters: linear speed 45-55 mm / s, arc speed 45-55 mm / s, laser frequency 95-105 kHz, and power factor 25%-29%.

3. The ultra-thin irregular glass coating loading process according to claim 1, characterized in that: In steps S2 and S3, the carrier plate and double-sided adhesive are fixed by vacuum adsorption; the process parameters for the flipping machine lamination are: adhesive roller lamination speed 95-105mm / s, back pressure 0.5-0.55MPa.

4. The ultra-thin irregular glass coating loading process according to claim 1, characterized in that: In step S4, the frame cutting is performed using laser cutting, with the following parameters set: scanning speed 950-1050 mm / s, laser frequency 1000-1014 Hz, and laser energy 55%-65%; the frame cutting outline is a rectangular area 3-7 mm from the edge of the glass.

5. The ultra-thin irregular glass coating loading process according to claim 1, characterized in that: In step S5, the protective film is picked up and removed using plastic clips during the bottom application process to avoid direct contact with the glass surface; the rolling process uses a rubber roller to roll at a uniform speed to remove air bubbles.

6. The ultra-thin irregular glass coating loading process according to claim 5, characterized in that: After each piece of glass is applied to the backing, wipe the surface of the protective film on the adjacent area to be applied with a lint-free cloth soaked in high-purity isopropyl alcohol. The wiping path is unidirectional, and each lint-free cloth is used only once.

7. The ultra-thin irregular glass coating loading process according to claim 1, characterized in that: The spacing between the matrix-arranged sheets is 8-12mm; before loading the sheets, it is necessary to check and ensure that the double-sided adhesive and protective film on the edges of the carrier board are free of wrinkles and peeling.

8. The ultra-thin irregular glass coating loading process according to claim 1, characterized in that: In step S7, the UV photolysis process is carried out in a nitrogen environment with low oxygen content. The main wavelength of the UV light source used is 365nm±5nm, and the process parameters are: power 45%-55%, ambient temperature controlled at 18-23℃, nitrogen concentration maintained at 55%-65%, and irradiation time 13-17 seconds.

9. A carrier assembly for implementing the method according to any one of claims 1-8, characterized in that: From bottom to top, it includes: a rigid carrier layer, which is made of glass, silicon, or anodized aluminum alloy; The UV-resistant double-sided adhesive layer is flatly attached to the surface of the rigid carrier plate layer in a bubble-free state using a flipping machine process. The frame-cut structure uses laser cutting to form a receiving window for positioning ultra-thin irregularly shaped glass on the double-sided adhesive layer; A peelable protective film layer covers the coated surface of the ultra-thin irregularly shaped glass attached to the receiving window.

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