Preparation method of AlN ceramic-based heat sink Ce: YAG composite fluorescent ceramic light-emitting device and composite fluorescent ceramic light-emitting device prepared by same
By chemically bonding AlN ceramic-based heat sinks with Ce:YAG fluorescent ceramics, the heat dissipation problem of fluorescent materials for laser white light sources was solved, achieving efficient heat dissipation, improved mechanical strength, and significantly enhanced radiation resistance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2026-03-27
AI Technical Summary
The fluorescent material light-emitting devices in laser white light sources cannot effectively dissipate heat under high blue light power density, leading to severe thermal expansion differences and cracking of the materials. Existing technologies cannot provide an effective heat dissipation solution.
By chemically bonding AlN ceramic-based heat sinks with Ce:YAG fluorescent ceramics, and then thermally bonding them using photopolymer adhesive technology and vacuum sintering, AlN ceramic-based heat sink Ce:YAG composite fluorescent ceramic light-emitting devices were prepared, avoiding the use of adhesives.
It achieves efficient heat dissipation of fluorescent ceramic devices, improves mechanical strength and radiation resistance, increases thermal conductivity to 170W/(m·K), and increases radiation resistance to ~35W/mm2.
Smart Images
Figure CN121735672A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of fluorescent ceramic light-emitting devices, in particular, an AlN ceramic base heat sink Ce:YAG composite fluorescent ceramic light-emitting device preparation method and a composite fluorescent ceramic light-emitting device prepared by the method. BACKGROUND
[0002] Compared with LED white light sources, laser white light sources have great advantages in high brightness, high luminous efficiency, strong directionality and other lighting fields. However, the fluorescent material light-emitting device of the laser white light source needs to withstand a blue light power density far exceeding 10 W / mm 2 If effective heat dissipation cannot be provided, the central position will be sharply heated to 500℃ or even higher, a huge temperature difference between the excitation center and the surrounding area will be caused, and the material will be severely expanded, thereby causing the fluorescent material to burst. In view of the above, it is urgent to design a fluorescent ceramic light-emitting device with strong heat dissipation capacity. SUMMARY
[0003] The present application relates to the field of fluorescent ceramic light-emitting devices, in particular, an AlN ceramic base heat sink Ce:YAG composite fluorescent ceramic light-emitting device preparation method and a composite fluorescent ceramic light-emitting device prepared by the method.
[0004] In order to achieve the above-mentioned purpose, one technical solution of the present application is as follows: an AlN ceramic base heat sink Ce:YAG composite fluorescent ceramic light-emitting device preparation method, comprising: using optical cement technology to bond the AlN ceramic heat sink and the Ce:YAG fluorescent ceramic to obtain a fluorescent ceramic composite blank; and then using a vacuum sintering method to heat bond the fluorescent ceramic composite blank to obtain a composite fluorescent ceramic light-emitting device.
[0005] As a preferred scheme of the AlN ceramic base heat sink Ce:YAG composite fluorescent ceramic light-emitting device preparation method, no adhesive is used in the preparation process.
[0006] As a preferred scheme of the AlN ceramic base heat sink Ce:YAG composite fluorescent ceramic light-emitting device preparation method, the AlN ceramic heat sink and the Ce:YAG fluorescent ceramic are surface polished before being bonded.
[0007] As a preferred scheme of the AlN ceramic base heat sink Ce:YAG composite fluorescent ceramic light-emitting device preparation method, the composition of the Ce:YAG fluorescent ceramic is (Ce x ,Y 1-x )3Al5O 12 , wherein 0.0005≤x≤0.1.
[0008] As a preferred scheme of the AlN ceramic base heat sink Ce:YAG composite fluorescent ceramic light emitting device preparation method, in the heat bonding of the fluorescent ceramic composite blank, the fluorescent ceramic composite blank is heated to 1510-1850 DEG C, and heat bonding is carried out for 5-25 h, and then slow cooling is carried out to 600-800 DEG C, and stress relief is carried out for 2-30 h.
[0009] Another technical solution of the present application is as follows: a composite fluorescent ceramic light emitting device prepared by the AlN ceramic base heat sink Ce:YAG composite fluorescent ceramic light emitting device preparation method.
[0010] Compared with the prior art, the technical effects of the present application are at least as follows: 1. The AlN ceramic base heat sink and the Ce:YAG fluorescent ceramic are bonded by chemical bonds, and the AlN ceramic can provide effective mechanical support for the fluorescent ceramic sheet; 2. The theoretical thermal conductivity of the AlN ceramic base heat sink is 320 W / (m·K), which is about 30 times the thermal conductivity of the Ce:YAG fluorescent ceramic, and can provide an excellent heat dissipation channel for the Ce:YAG fluorescent ceramic, thereby improving the radiation resistance of the Ce:YAG fluorescent ceramic; 3. The AlN ceramic base heat sink selects AlN ceramic material, which can overcome the technical difficulty that the Ce:YAG fluorescent ceramic and the metal heat sink cannot be effectively hard connected due to heterogeneity, and reduce the difficulty, preparation cost and preparation period of the fluorescent ceramic device. BRIEF DESCRIPTION OF DRAWINGS
[0011] Figure 1 is the structure cross-sectional schematic diagram of the AlN ceramic base heat sink Ce:YAG composite fluorescent ceramic light emitting device embodiment 1 and embodiment 2 of the present application.
[0012] Figure 2 is the structure top view schematic diagram of the AlN ceramic base heat sink Ce:YAG composite fluorescent ceramic light emitting device embodiment 1 of the present application.
[0013] Figure 3 is the structure top view schematic diagram of the AlN ceramic base heat sink Ce:YAG composite fluorescent ceramic light emitting device embodiment 2 of the present application.
[0014] Figure sequence number: 1. AlN ceramic base heat sink; 2. Ce:YAG composite fluorescent ceramic. DETAILED DESCRIPTION
[0015] An AlN ceramic base heat sink Ce:YAG composite fluorescent ceramic light emitting device preparation method, comprising:
[0016] Step S1, preparing an AlN ceramic heat sink and a Ce:YAG fluorescent ceramic: the molecular formula of the Ce:YAG fluorescent ceramic is (Ce x ,Y 1-x )3Al5O 12wherein x = 0.02.
[0017] Step S2, the AlN ceramic heat sink and the Ce:YAG fluorescent ceramic are subjected to surface precision machining and polishing, and then the two are cut into shapes and sizes designed in advance.
[0018] Step S3, the AlN ceramic heat sink and the Ce:YAG fluorescent ceramic are precisely bonded by using optical adhesive technology.
[0019] Step S4, the fluorescent ceramic composite body bonded by using optical adhesive is heated to 1650 DEG C by using vacuum sintering method, and heat bonding is performed for 15h, and then slow cooling is performed to 700 DEG C for 20h for stress relief, so that the bonding interface is clean, no pores are left, and the composite fluorescent ceramic light emitting device of the bonded AlN ceramic base heat sink / Ce:YAG fluorescent ceramic is realized.
[0020] The interface between the AlN ceramic base heat sink material and the Ce:YAG fluorescent ceramic material is observed by using optical microscope and scanning electron microscope, the interface is clean and no pores are left, and the chemical bond bonding of the two is realized.
[0021] The parameters of the remaining examples are shown in the following table:
[0022]
[0023]
[0024] Experiments show that the composite fluorescent ceramic light emitting device of the AlN ceramic base heat sink / Ce:YAG fluorescent ceramic has the following advantages: the interface between the AlN ceramic base heat sink material and the Ce:YAG fluorescent ceramic material is observed by using optical microscope and scanning electron microscope, the interface is clean and no pores are left, and the chemical bond bonding of the two is realized. The AlN ceramic base heat sink provides effective support for the fluorescent ceramic sheet, prevents the fluorescent ceramic sheet from cracking, and significantly improves the mechanical strength of the overall device compared with the fluorescent ceramic sheet. In actual use, the thermal conductivity of the AlN ceramic base heat sink can reach 170 W / (m·K), which provides a rapid diffusion channel for the heat generated during the fluorescent ceramic light emitting process, and the radiation resistance of the device is improved from about 5 W / mm 2 to about 35 W / mm 2 , and the radiation resistance is significantly improved.
[0025] The above only expresses the embodiments of the present application, and the description is more specific and detailed, but it cannot be understood as limiting the scope of the patent. It should be noted that for ordinary skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.
Claims
1. A method for fabricating an AlN ceramic-based heat sink Ce:YAG composite fluorescent ceramic light-emitting device, characterized in that, include: An AlN ceramic heat sink was bonded to a Ce:YAG fluorescent ceramic using photopolymerization technology to obtain a fluorescent ceramic composite preform; then, the fluorescent ceramic composite preform was thermally bonded using vacuum sintering to obtain a composite fluorescent ceramic light-emitting device.
2. The method for fabricating an AlN ceramic-based heat sink Ce:YAG composite fluorescent ceramic light-emitting device according to claim 1, characterized in that, No adhesives are used in the preparation process.
3. The method for fabricating an AlN ceramic-based heat sink Ce:YAG composite fluorescent ceramic light-emitting device according to claim 1, characterized in that, Before bonding the AlN ceramic heat sink to the Ce:YAG fluorescent ceramic, the surfaces of both the AlN ceramic heat sink and the Ce:YAG fluorescent ceramic are polished.
4. The method for fabricating an AlN ceramic-based heat sink Ce:YAG composite fluorescent ceramic light-emitting device according to any one of claims 1 to 3, characterized in that, The composition of Ce:YAG fluorescent ceramics is (Ce x ,Y 1-x )3Al5O 12 , where 0.0005≤x≤0.
1.
5. The method for fabricating an AlN ceramic-based heat sink Ce:YAG composite fluorescent ceramic light-emitting device according to any one of claims 1 to 4, characterized in that, In the thermal bonding of fluorescent ceramic composite preforms, the preforms are heated to 1510-1850℃ and held for 5-25 hours for thermal bonding. Then, the preforms are slowly cooled to 600-800℃ and held for 2-30 hours for stress relief.
6. A composite fluorescent ceramic light-emitting device prepared by the method for preparing an AlN ceramic-based heat sink Ce:YAG composite fluorescent ceramic light-emitting device according to any one of claims 1 to 5.