Production process of antistatic BOPP waste discharge adhesive tape for electronic device

Abstract

The invention relates to a production process of an antistatic BOPP waste discharge adhesive tape for an electronic device, and belongs to the technical field of adhesive tape production. The BOPP film is sequentially subjected to plasma treatment, alcohol degreasing and hot air drying pretreatment; the preparation method comprises the following steps: mixing a polythiophene derivative, nano tin antimony oxide, a silane coupling agent, a thickener hydroxyethyl cellulose and deionized water, stirring, and ultrasonically dispersing to obtain an antistatic primer solution; the single face of the pretreated BOPP film is coated with the anti-static bottom coating liquid in a micro-concave coating mode, baking is conducted, and an anti-static bottom coating layer is formed; coating a pressure-sensitive adhesive on the surface of the antistatic bottom coating in a comma blade coating manner, and pre-drying; and compounding the film coated with the pressure-sensitive adhesive with a release film, curing, slitting and rolling to obtain the antistatic BOPP waste discharge adhesive tape for the electronic device. The prepared adhesive tape is excellent in antistatic performance and high in permanent adhesion and peel strength, meets the requirements of no adhesive falling and no adhesive residue in the waste discharge process, and meets the processing requirements of precise electronic devices.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of adhesive tape production, in particular to a production process of an antistatic BOPP waste removal adhesive tape for electronic devices. BACKGROUND

[0002] In the process of manufacturing electronic devices, the waste removal adhesive tape, as a key auxiliary material, is mainly used for removing redundant substrates or protective films in the process of flexible circuit board and semiconductor chip packaging, and the performance of the waste removal adhesive tape directly affects the processing precision and product yield of the electronic devices. With the development of electronic devices in the direction of miniaturization and high density, the requirements for the waste removal adhesive tape are increasingly stringent. The waste removal adhesive tape not only needs to have stable peeling strength and excellent tackiness, but also needs to have good antistatic performance to avoid electrostatic adsorption of dust or breakdown of sensitive electronic components.

[0003] Chinese patent CN109294480A discloses a preparation method of an environmentally friendly degradable adhesive tape for packaging materials, which comprises the following steps: step one, weighing the following raw materials: 42-60 parts of butyronitrile rubber, 18-24 parts of polylactic acid, 14-18 parts of modified corn starch, 8-14 parts of natural composite plant fiber, 4-8 parts of graphene oxide, 2-5 parts of pretreated water talc powder, 1-5 parts of PEG hydrogenated castor oil and 1-2 parts of oxidized molasses.

[0004] Chinese patent CN107674599A relates to a preparation process of an adhesive tape, which comprises the following steps: S1, spraying a softening agent; S2, dipping; S3, first baking; S4, applying a release agent; S5, second baking; S6, gluing; and S7, third baking.

[0005] At present, the BOPP waste removal adhesive tape in the prior art is mainly realized by adding an antistatic agent in the pressure-sensitive adhesive to achieve the antistatic function, but there are problems such as short duration of antistatic effect and poor compatibility with the pressure-sensitive adhesive. For example, some adhesive tapes using small molecule antistatic agents are prone to migration to the surface to cause precipitation in long-term use or high-temperature environment, which not only reduces the antistatic performance, but also may pollute the electronic devices. When a single conductive polymer is used as an antistatic component, the adhesion of the conductive polymer on the surface of the substrate is weak, and the conductive polymer is prone to falling off in the waste removal process, thereby affecting the use stability. SUMMARY

[0006] In order to solve the above problems, the application provides a production process of an antistatic BOPP waste removal adhesive tape for electronic devices, and the operation steps are as follows: S1, substrate pretreatment: selecting a BOPP film with a thickness of 25-50 microns, and sequentially performing plasma treatment, alcohol degreasing and hot air drying; S2 antistatic primer liquid preparation: 3-8 parts of polythiophene derivative, 2-5 parts of nano antimony tin oxide, 1-3 parts of silane coupling agent KH-550, 0.5-2 parts of thickening agent hydroxyethyl cellulose, 70-90 parts of deionized water are mixed, stirred for 30-60 min, ultrasonic dispersion for 20-40 min, to obtain an antistatic primer liquid; S3 primer coating: the antistatic primer liquid is coated on one side of the pretreated BOPP film by micro-concave coating method, the coating thickness is 1-3 μm, and the coating is baked to form an antistatic primer layer; S4 adhesive layer coating: the pressure sensitive adhesive is coated on the surface of the antistatic primer layer by comma blade coating method, the coating thickness is 15-30 μm, and the coating is pre-baked at 80-100 ℃ for 3-8 min; S5 composite curing: the film coated with pressure sensitive adhesive is combined with release film, and cured under the protection of nitrogen; S6 slitting and winding: the cured composite film is slitted and wound to obtain an antistatic BOPP waste tape for electronic devices.

[0007] Optionally, the polythiophene derivative is poly(3,4-ethylenedioxythiophene)-poly(styrene sulfonate).

[0008] Optionally, the release film is a polyethylene terephthalate release film with a thickness of 25-50 μm.

[0009] Optionally, the power of the S1 plasma treatment is 90-110 W, and the specific operation steps are as follows: T1: The BOPP film is laid on the vacuum chuck carrier in the reaction kettle, 84-168 parts of dichloromethane, 10-16 parts of 3-amino-1,2,4-triazole, and 7-11 parts of propionyl chloride are added into the kettle; T2: Oxygen is removed by introducing krypton for 15-30 minutes, the plasma device is turned on, and the annular nozzle sprays krypton to form a protective gas flow; the micro-concave coating head is coated on the upper surface of the film, the carrier is lifted at a speed of 1 cm / min to make the lower surface of the film immersed for a short time, 0.2-0.6 parts of triethylamine is added, and the temperature is lowered to 0-5 ℃ for 1.5-3 hours; T3: After the reaction is completed, the plasma device is turned off and the temperature is lowered, the film is washed with water for 3-4 times to remove the salt, and vacuum drying is performed to obtain a pretreated BOPP film.

[0010] Optionally, the vacuum drying temperature of T3 is 40-50 ℃, and the time is 5-10 minutes.

[0011] Optionally, the temperature of the S1 hot air drying is 60-80 ℃, and the drying time is 5-10 min.

[0012] Optionally, the stirring speed of S2 is 800-1200 r / min.

[0013] Optionally, the S3 baking temperature is 100-120℃, and the baking time is 5-10min.

[0014] Optionally, the S5 curing temperature is 120-140℃, and the curing time is 10-20min.

[0015] Optionally, the preparation method of the pressure-sensitive adhesive is as follows: H1 Preparation of component A: 50-70 parts of butyl acrylate, 20-30 parts of methyl methacrylate, 5-10 parts of hydroxyethyl acrylate, 2-5 parts of acrylic acid, and 0.3-1 part of initiator benzoyl peroxide are added into a reaction kettle, 200-300 parts of ethyl acetate is used as solvent, and the reaction is carried out at 75-85℃ for 3-5h; H2 Preparation of component B: 1-3 parts of hexamethylene diisocyanate trimer, 0.5-2 parts of antioxidant 1010, and 0.3-1 part of ultraviolet absorber UV-531 are uniformly mixed; H3: The component B is added into the component A, and stirred at a rotation speed of 500-800r / min for 15-30min to obtain the pressure-sensitive adhesive.

[0016] I. Reaction mechanism The plasma acts on the surface of the BOPP film to activate the film material to generate carboxyl (-COOH) and hydroxyl (-OH), providing active sites for subsequent chemical combination; the acyl chloride group (-CO-Cl) in propionyl chloride reacts with the amino group (-NH2) in 3-amino-1,2,4-triazole to form an amide, and triethylamine is generated by neutralizing the generated hydrogen chloride, effectively protecting the amide bond from being destroyed, ensuring the stability of the heterocyclic structure; the generated heterocyclic compound is tightly combined with the carboxyl and hydroxyl groups on the surface of the BOPP film through hydrogen bonding and secondary amide bonding, constructing a continuous and stable charge channel on the film surface, and strengthening the interfacial adhesion between the antistatic primer and the substrate; in addition, the silane coupling agent promotes the compatibility of nano antimony tin oxide and polythiophene derivatives, ensuring uniform dispersion of the antistatic components, further optimizing the continuity of the charge channel, and providing synergistic protection for the antistatic performance and adhesive performance of the adhesive tape.

[0017] II. Technical effects 1. Stable antistatic protection: The continuous charge channel constructed on the surface of the substrate can quickly dissipate static electricity generated during the use of the adhesive tape due to friction, avoiding the adsorption of dust or the breakdown of sensitive electronic components, and providing stable antistatic protection for the production environment of precision electronic devices.

[0018] Accurate waste discharge improvement: stable antistatic properties reduce the electrostatic force between the tape and electronic components, while the strong adhesion of the antistatic primer layer to the substrate and the pressure-sensitive adhesive layer prevents the adhesive layer from peeling off, making the waste discharge process smoother, reducing waste discharge deviation or residual adhesive problems, and improving the accuracy of electronic device processing.

[0019] 2. Long-term component protection: BOPP film modified by plasma and specific compounds has significantly improved chemical stability, and the subsequently coated antistatic primer layer and pressure-sensitive adhesive layer do not release corrosive substances, which can prevent corrosion of the metal pins or circuits of electronic components, ensuring long-term performance stability of electronic devices. DETAILED DESCRIPTION

[0020] The application will be further described below in conjunction with specific implementation methods, but this is not a limitation on the scope of protection.

[0021] 1. Surface resistance detection: Referring to GB / T1410-2006 "Test Method for Volume Resistivity and Surface Resistivity of Solid Insulating Materials", a high resistance meter is used to test the surface of the tape substrate.

[0022] 2. 180° peel strength detection: Referring to GB / T2792-2014 "Determination of Adhesive Tape Peel Strength", an electronic universal testing machine is used to test the 180° peel strength of the tape with a stainless steel plate at a stretching speed of 300 mm / min.

[0023] 3. Adhesion retention detection: Referring to GB / T4851-2014 "Adhesive Tape Adhesion Retention Test Method", the tape is attached to the test plate, a 1kg load is hung, and the time of tape falling is recorded in a temperature of 23℃ and humidity of 50%. If it does not fall within 100h, it is recorded as ≥100h.

[0024] Example 1

[0025] A production process of an antistatic BOPP waste discharge tape for electronic devices, the operation steps are: S1 substrate pretreatment: select a BOPP film with a thickness of 25μm, and sequentially pass through plasma treatment, alcohol degreasing, and hot air drying; S2 antistatic primer liquid preparation: mix 3g of polythiophene derivative, 2g of nano antimony tin oxide, 1g of silane coupling agent KH-550, 0.5g of thickening agent hydroxyethyl cellulose, and 70g of deionized water, stir for 30min, and ultrasonic dispersion for 20min to obtain an antistatic primer liquid; S3 primer coating: the antistatic primer liquid is coated on one side of the pretreated BOPP film by micro-concave coating method, the coating thickness is 1μm, and the antistatic primer layer is formed after baking; S4 adhesive layer coating: the pressure sensitive adhesive is coated on the surface of the antistatic primer layer by comma blade coating, the coating thickness is 15 microns, and pre-baking is carried out at 80 DEG C for 3 minutes; S5 composite curing: the film coated with pressure sensitive adhesive is combined with the release film, and curing is carried out under the protection of nitrogen; S6 slitting and winding: the cured composite film is slitted and wound to obtain an antistatic BOPP waste tape for electronic devices.

[0026] The polythiophene derivative is poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate).

[0027] The release film is a polyethylene terephthalate release film with a thickness of 25 microns.

[0028] The power of the S1 plasma treatment is 90W, and the specific operation steps are as follows: T1: the BOPP film is laid on the vacuum chuck carrier in the reaction kettle, 84g of dichloromethane, 10g of 3-amino-1,2,4-triazole and 7g of propionyl chloride are added into the kettle; T2: oxygen is removed by introducing krypton for 15 minutes, the plasma device is turned on, and krypton gas is sprayed from the annular nozzle to form a protective gas flow; the micro-concave coating head is used to coat the upper surface of the film, and the carrier is lifted at a speed of 1cm / min to make the lower surface of the film be immersed for a short time, 0.2g of triethylamine is added, and the temperature is lowered to 0 DEG C for 1.5 hours; T3: after the reaction is completed, the plasma device and the cooling device are turned off, the film is washed with water for 3 times to remove the salt, and vacuum drying is carried out to obtain the pretreated BOPP film.

[0029] The vacuum drying temperature of T3 is 40 DEG C, and the time is 5 minutes.

[0030] The temperature of the S1 hot air drying is 60 DEG C, and the drying time is 5 minutes.

[0031] The stirring speed of S2 is 800r / min.

[0032] The baking temperature of S3 is 100 DEG C, and the baking time is 5 minutes.

[0033] The curing temperature of S5 is 120 DEG C, and the curing time is 10 minutes.

[0034] The preparation method of the pressure sensitive adhesive is as follows: H1 preparation of component A: 50g of butyl acrylate, 20g of methyl methacrylate, 5g of hydroxyethyl acrylate, 2g of acrylic acid and 0.3g of initiator benzoyl peroxide are added into a reaction kettle, 200g of ethyl acetate is used as a solvent, and reaction is carried out at 75 DEG C for 3h; H2 Preparation of B component: 1g hexamethylene diisocyanate trimer, 0.5g antioxidant 1010, 0.3g UV absorber UV-531 are mixed uniformly; H3: the B component is added to the A component, and stirring is carried out at a rotation speed of 500r / min for 15min to obtain a pressure-sensitive adhesive.

[0035] Example 2

[0036] A production process of an antistatic BOPP waste discharge adhesive tape for electronic devices, the operation steps of which are: S1 substrate pretreatment: a BOPP film with a thickness of 35μm is selected, and is sequentially subjected to plasma treatment, alcohol degreasing and hot air drying; S2 preparation of antistatic primer solution: 4g of polythiophene derivative, 3g of nano antimony tin oxide, 2g of silane coupling agent KH-550, 1g of thickening agent hydroxyethyl cellulose and 75g of deionized water are mixed, stirred for 40min and ultrasonically dispersed for 25min to obtain an antistatic primer solution; S3 primer coating: the antistatic primer solution is coated on one side of the pretreated BOPP film by micro-concave coating, the coating thickness is 2μm, and baking is performed to form an antistatic primer layer; S4 adhesive layer coating: the pressure-sensitive adhesive is coated on the surface of the antistatic primer layer by comma doctor blade coating, the coating thickness is 20μm, and pre-baking is performed at 85℃ for 4min; S5 composite curing: the film coated with the pressure-sensitive adhesive is combined with a release film, and curing is performed under the protection of nitrogen; S6 slitting and winding: the cured composite film is slitted and wound to obtain an antistatic BOPP waste discharge adhesive tape for electronic devices.

[0037] The polythiophene derivative is poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate).

[0038] The release film is a polyethylene terephthalate release film with a thickness of 35μm.

[0039] The power of the S1 plasma treatment is 100W, and the specific operation steps are: T1: the BOPP film is laid flat on the vacuum chuck carrier of the reaction kettle, 100g of dichloromethane, 12g of 3-amino-1,2,4-triazole and 8g of propionyl chloride are added to the kettle; T2: oxygen is removed by introducing krypton gas for 20min, the plasma equipment is turned on, and a protective gas stream is formed by the annular nozzle spraying krypton gas; the micro-concave coating head is coated on the upper surface of the film, the carrier is lifted at a speed of 1cm / min to make the lower surface of the film immerse for a short time, 0.3g of triethylamine is added, and the temperature is lowered to 0℃ for 2h of reaction; T3: After the reaction, turn off the plasma device and cool down, wash the film 3 times with water to remove salt, vacuum dry to obtain the pretreated BOPP film.

[0040] The vacuum drying temperature of T3 is 45℃, and the time is 6 minutes.

[0041] The hot air drying temperature of S1 is 65℃, and the drying time is 6min.

[0042] The stirring speed of S2 is 900r / min.

[0043] The baking temperature of S3 is 105℃, and the baking time is 6min.

[0044] The curing temperature of S5 is 125℃, and the curing time is 15min.

[0045] The preparation method of the pressure-sensitive adhesive is: H1 Preparation of component A: 55g of butyl acrylate, 23g of methyl methacrylate, 6g of hydroxyethyl acrylate, 3g of acrylic acid, and 0.5g of initiator benzoyl peroxide are added to a reaction kettle, 240g of ethyl acetate is used as the solvent, and the reaction is carried out at 80℃ for 4h; H2 Preparation of component B: 2g of hexamethylene diisocyanate trimer, 1g of antioxidant 1010, and 0.5g of ultraviolet absorber UV-531 are uniformly mixed; H3: The component B is added to the component A, and stirred at a speed of 600r / min for 20min to obtain the pressure-sensitive adhesive.

[0046] Example 3

[0047] A production process of an antistatic BOPP waste tape for electronic devices, the operation steps of which are: S1: The BOPP film with a thickness of 45μm is selected, and sequentially subjected to plasma treatment, alcohol degreasing, and hot air drying; S2: The antistatic primer solution is prepared by mixing 7g of polythiophene derivative, 4g of nano-tin antimony oxide, 2g of silane coupling agent KH-550, 1.5g of thickening agent hydroxyethyl cellulose, and 85g of deionized water, stirring for 50min, and ultrasonic dispersion for 35min; S3: The antistatic primer solution is coated on one side of the pretreated BOPP film by micro-concave coating method, with a coating thickness of 2μm, and baked to form an antistatic primer layer; S4: The pressure-sensitive adhesive is coated on the surface of the antistatic primer layer by comma doctor blade coating method, with a coating thickness of 25μm, and pre-baked at 95℃ for 7min; S5 composite curing: the film coated with pressure sensitive adhesive is compounded with release film, and cured under the protection of nitrogen; S6 slitting and winding: the cured composite film is slitted and wound to obtain the antistatic BOPP waste tape for electronic devices.

[0048] The polythiophene derivative is poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate).

[0049] The release film is a polyethylene terephthalate release film with a thickness of 45 μm.

[0050] The power of the S1 plasma treatment is 100 W, and the specific operation steps are as follows: T1: the BOPP film is laid on the vacuum chuck carrier in the reaction kettle, 155 g of dichloromethane, 14 g of 3-amino-1,2,4-triazole, and 10 g of propionyl chloride are added into the kettle; T2: oxygen is removed by introducing krypton for 25 minutes, the plasma device is turned on, and krypton is sprayed from the annular nozzle to form a protective gas flow; the micro-concave coating head is used to coat the upper surface of the film, and the carrier is lifted at a speed of 1 cm / min to make the lower surface of the film be immersed for a short time, 0.5 g of triethylamine is added, and the temperature is lowered to ℃ for 2.5 hours of reaction; T3: after the reaction is completed, the plasma device is turned off and the temperature is lowered, the film is washed with water for 4 times to remove salt, and vacuum drying is performed to obtain the pretreated BOPP film.

[0051] The vacuum drying temperature of T3 is 45℃, and the time is 8 minutes.

[0052] The temperature of the S1 hot air drying is 75℃, and the drying time is 8 min.

[0053] The stirring speed of S2 is 1100 r / min.

[0054] The baking temperature of S3 is 115℃, and the baking time is 8 min.

[0055] The curing temperature of S5 is 135℃, and the curing time is 15 min.

[0056] The preparation method of the pressure sensitive adhesive is as follows: H1 preparation of component A: 65 g of butyl acrylate, 28 g of methyl methacrylate, 8 g of hydroxyethyl acrylate, 4 g of acrylic acid, and 0.8 g of initiator benzoyl peroxide are added into a reaction kettle, 280 g of ethyl acetate is used as a solvent, and the reaction is carried out at 80℃ for 4 h; H2 preparation of component B: 2 g of hexamethylene diisocyanate trimer, 1.5 g of antioxidant 1010, and 0.8 g of ultraviolet absorber UV-531 are uniformly mixed; H3: Add B component to A component, stir at 700 r / min for 25 min to obtain a pressure-sensitive adhesive.

[0057] Example 4

[0058] A production process of an antistatic BOPP waste discharge adhesive tape for electronic devices, the operation steps of which are: S1: Pretreatment of the substrate: select a BOPP film with a thickness of 50 μm, and sequentially perform plasma treatment, alcohol degreasing, and hot air drying; S2: Preparation of the antistatic primer solution: mix 8 g of polythiophene derivative, 5 g of nano antimony tin oxide, 3 g of silane coupling agent KH-550, 2 g of thickening agent hydroxyethyl cellulose, and 90 g of deionized water, stir for 60 min, and ultrasonic dispersion for 40 min to obtain the antistatic primer solution; S3: Primer coating: coat the antistatic primer solution on one side of the pretreated BOPP film by micro-concave coating, with a coating thickness of 3 μm, and bake to form an antistatic primer layer; S4: Adhesive layer coating: coat the pressure-sensitive adhesive on the surface of the antistatic primer layer by comma blade coating, with a coating thickness of 30 μm, and pre-bake at 100℃ for 8 min; S5: Composite curing: composite the film coated with the pressure-sensitive adhesive with a release film, and cure under the protection of nitrogen; S6: Slitting and winding: slit and wind the cured composite film to obtain the antistatic BOPP waste discharge adhesive tape for electronic devices.

[0059] The polythiophene derivative is poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate).

[0060] The release film is a polyethylene terephthalate release film with a thickness of 50 μm.

[0061] The power of the S1 plasma treatment is 110 W, and the specific operation steps are: T1: Place the BOPP film on the vacuum chuck carrier in the reaction kettle, and add 168 g of dichloromethane, 16 g of 3-amino-1,2,4-triazole, and 11 g of propionyl chloride into the kettle; T2: Introduce krypton gas to remove oxygen for 30 min, turn on the plasma equipment, and form a protective gas flow by spraying krypton gas from the annular nozzle; coat the upper surface of the film by the micro-concave coating head, and make the lower surface of the film immerse for a short time by lifting the carrier at a speed of 1 cm / min; add 0.6 g of triethylamine, and cool to 5℃ for 3 h; T3: After the reaction is completed, turn off the plasma equipment and cool, wash the film with water for 4 times to remove the salt, and vacuum dry to obtain the pretreated BOPP film.

[0062] The vacuum drying temperature of T3 is 50℃, and the time is 10 min.

[0063] The temperature of the S1 hot air drying is 80℃, and the drying time is 10 min.

[0064] The stirring speed of the S2 is 1200 r / min.

[0065] The baking temperature of the S3 is 120℃, and the baking time is 10 min.

[0066] The curing temperature of the S5 is 140℃, and the curing time is 20 min.

[0067] The preparation method of the pressure-sensitive adhesive is as follows: H1 Preparation of component A: 70 g of butyl acrylate, 30 g of methyl methacrylate, 10 g of hydroxyethyl acrylate, 5 g of acrylic acid, and 1 g of initiator benzoyl peroxide are added to a reaction kettle, 300 g of ethyl acetate is used as a solvent, and reaction is carried out at 85℃ for 5 h; H2 Preparation of component B: 3 g of hexamethylene diisocyanate trimer, 2 g of antioxidant 1010, and 1 g of ultraviolet absorber UV-531 are uniformly mixed; H3: The component B is added to the component A, and stirring is carried out at a speed of 800 r / min for 30 min to obtain the pressure-sensitive adhesive.

[0068] Comparative Example 1 A production process of an antistatic BOPP waste discharge adhesive tape for electronic devices, and the operation steps are as follows: S1 Base material pretreatment: a BOPP film with a thickness of 25 μm is selected, and is sequentially subjected to alcohol degreasing and hot air drying; S2 Preparation of antistatic primer solution: 3 g of polythiophene derivative, 2 g of nano-tin antimony oxide, 1 g of silane coupling agent KH-550, and 0.5 g of thickening agent hydroxyethyl cellulose are mixed with 70 g of deionized water, stirring is carried out for 30 min, and ultrasonic dispersion is carried out for 20 min to obtain the antistatic primer solution; S3 Primer coating: the antistatic primer solution is coated on one side of the pretreated BOPP film by using a micro-concave coating method, the coating thickness is 1 μm, and baking is carried out to form an antistatic primer layer; S4 Adhesive layer coating: the pressure-sensitive adhesive is coated on the surface of the antistatic primer layer by using a comma doctor blade coating method, the coating thickness is 15 μm, and pre-baking is carried out at 80℃ for 3 min; S5 Compound curing: the film coated with the pressure-sensitive adhesive is compounded with a release film, and curing is carried out under the protection of nitrogen; S6 Slitting and winding: the cured composite film is slitted and wound to obtain the antistatic BOPP waste discharge adhesive tape for electronic devices.

[0069] The polythiophene derivative is poly(3,4-ethylenedioxythiophene)-poly(styrene sulfonate).

[0070] The release film is a polyethylene terephthalate release film with a thickness of 25 μm.

[0071] The temperature of the S1 hot air drying is 60℃, and the drying time is 5 min.

[0072] The stirring speed of the S2 is 800 r / min.

[0073] The baking temperature of the S3 is 100℃, and the baking time is 5 min.

[0074] The curing temperature of the S5 is 120℃, and the curing time is 10 min.

[0075] The preparation method of the pressure-sensitive adhesive is as follows: H1 Preparation of Component A: 50 g of butyl acrylate, 20 g of methyl methacrylate, 5 g of hydroxyethyl acrylate, 2 g of acrylic acid, and 0.3 g of initiator benzoyl peroxide are added to a reaction kettle, 200 g of ethyl acetate is used as a solvent, and reaction is carried out at 75℃ for 3 h; H2 Preparation of Component B: 1 g of hexamethylene diisocyanate trimer, 0.5 g of antioxidant 1010, and 0.3 g of ultraviolet absorber UV-531 are uniformly mixed; H3: The Component B is added to the Component A, and stirring is carried out at a speed of 500 r / min for 15 min to obtain the pressure-sensitive adhesive.

[0076] Comparative Example 2 A production process of an antistatic BOPP waste discharge adhesive tape for electronic devices, and the operation steps are as follows: S1 Base material pretreatment: a BOPP film with a thickness of 25 μm is selected, and is sequentially subjected to plasma treatment, alcohol degreasing, and hot air drying; S2 Preparation of antistatic primer solution: 3 g of polythiophene derivative, 2 g of nano antimony tin oxide, 1 g of silane coupling agent KH-550, 0.5 g of thickening agent hydroxyethyl cellulose, and 70 g of deionized water are mixed, stirring is carried out for 30 min, and ultrasonic dispersion is carried out for 20 min to obtain the antistatic primer solution; S3 Primer coating: the antistatic primer solution is coated on one side of the pretreated BOPP film by using a micro-concave coating method, the coating thickness is 1 μm, and baking is carried out to form an antistatic primer layer; S4 Adhesive layer coating: the pressure-sensitive adhesive is coated on the surface of the antistatic primer layer by using a comma doctor blade coating method, the coating thickness is 15 μm, and pre-baking is carried out at 80℃ for 3 min; S5 Compound curing: the film coated with the pressure-sensitive adhesive is compounded with a release film, and curing is carried out under the protection of nitrogen; S6 Slitting and winding: the cured compound film is slit and wound to obtain the antistatic BOPP waste discharge adhesive tape for electronic devices.

[0077] The polythiophene derivative is poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate).

[0078] The release film is a polyethylene terephthalate release film with a thickness of 25 μm.

[0079] The power of the S1 plasma treatment is 90 W, and the specific operation steps are as follows: T1: The BOPP film is laid on the vacuum chuck carrier in the reaction kettle, 84 g of dichloromethane and 7 g of propionyl chloride are added into the kettle; T2: Oxygen is removed by introducing krypton for 15 minutes, the plasma device is turned on, and a protective gas stream is formed by the annular nozzle spraying krypton; the micro-concave coating head is used to coat the upper surface of the film, the carrier is lifted at a speed of 1 cm / min to make the lower surface of the film immerse for a short time, 0.2 g of triethylamine is added, and the temperature is lowered to 0°C for 1.5 hours; T3: After the reaction is completed, the plasma device is turned off and the temperature is lowered, the film is washed with water for 3 times to remove the salt, and vacuum drying is performed to obtain the pretreated BOPP film.

[0080] The vacuum drying temperature of T3 is 40°C, and the time is 5 minutes.

[0081] The temperature of the S1 hot air drying is 60°C, and the drying time is 5 min.

[0082] The stirring speed of S2 is 800 r / min.

[0083] The baking temperature of S3 is 100°C, and the baking time is 5 min.

[0084] The curing temperature of S5 is 120°C, and the curing time is 10 min.

[0085] The preparation method of the pressure-sensitive adhesive is as follows: H1: Preparation of component A: 50 g of butyl acrylate, 20 g of methyl methacrylate, 5 g of hydroxyethyl acrylate, 2 g of acrylic acid, and 0.3 g of initiator benzoyl peroxide are added into a reaction kettle, 200 g of ethyl acetate is used as a solvent, and the reaction is carried out at 75°C for 3 h; H2: Preparation of component B: 1 g of hexamethylene diisocyanate trimer, 0.5 g of antioxidant 1010, and 0.3 g of ultraviolet absorber UV-531 are uniformly mixed; H3: The component B is added into the component A, and stirred at a speed of 500 r / min for 15 min to obtain the pressure-sensitive adhesive.

[0086] Comparative Example 3 A production process of an antistatic BOPP waste tape for electronic devices, and the operation steps are as follows: S1 substrate pretreatment: select a BOPP film with a thickness of 25 μm, and sequentially pass through plasma treatment, alcohol degreasing, and hot air drying; S2 antistatic primer preparation: 3 g of polythiophene derivative, 2 g of nano antimony tin oxide, 1 g of silane coupling agent KH-550, 0.5 g of thickening agent hydroxyethyl cellulose, and 70 g of deionized water are mixed, stirred for 30 min, and ultrasonically dispersed for 20 min to obtain an antistatic primer; S3 primer coating: the antistatic primer is coated on one side of the pretreated BOPP film using a micro-concave coating method, with a coating thickness of 1 μm, and is baked to form an antistatic primer layer; S4 adhesive layer coating: the pressure-sensitive adhesive is coated on the surface of the antistatic primer layer using a comma doctor blade coating method, with a coating thickness of 15 μm, and is pre-baked at 80℃ for 3 min; S5 composite curing: the film coated with the pressure-sensitive adhesive is combined with a release film, and is cured under the protection of nitrogen; S6 slitting and winding: the cured composite film is slit and wound to obtain an antistatic BOPP waste removal adhesive tape for electronic devices.

[0087] The polythiophene derivative is poly(3,4-ethylenedioxythiophene)-poly(styrene sulfonate).

[0088] The release film is a polyethylene terephthalate release film with a thickness of 25 μm.

[0089] The power of the S1 plasma treatment is 90 W, and the specific operation steps are as follows: T1: the BOPP film is laid flat on the vacuum chuck carrier in the reaction kettle, 84 g of dichloromethane and 10 g of 3-amino-1,2,4-triazole are added to the kettle; T2: oxygen is removed by introducing krypton gas for 15 minutes, the plasma device is turned on, and a protective gas stream is formed by the annular nozzle spraying krypton gas; the micro-concave coating head is coated on the upper surface of the film, the carrier is lifted at a speed of 1 cm / min to make the lower surface of the film dip for a short time, 0.2 g of triethylamine is added, and the temperature is lowered to 0℃ for 1.5 hours; T3: after the reaction is completed, the plasma device is turned off and the temperature is lowered, the film is washed with water for 3 times to remove salt, and vacuum drying is performed to obtain the pretreated BOPP film.

[0090] The vacuum drying temperature of T3 is 40℃, and the time is 5 minutes.

[0091] The hot air drying temperature of S1 is 60℃, and the drying time is 5 min.

[0092] The stirring speed of S2 is 800 r / min.

[0093] The S3 baking temperature is 100 DEG C, and the baking time is 5 min.

[0094] The S5 curing temperature is 120 DEG C, and the curing time is 10 min.

[0095] The preparation method of the pressure-sensitive adhesive is as follows: H1 Preparation of A component: 50 g of butyl acrylate, 20 g of methyl methacrylate, 5 g of hydroxyethyl acrylate, 2 g of acrylic acid, and 0.3 g of initiator benzoyl peroxide are added to a reaction kettle, 200 g of ethyl acetate is used as a solvent, and the reaction is carried out at 75 DEG C for 3 h; H2 Preparation of B component: 1 g of hexamethylene diisocyanate trimer, 0.5 g of antioxidant 1010, and 0.3 g of ultraviolet absorber UV-531 are uniformly mixed; H3: The B component is added to the A component, and stirring is carried out at a rotation speed of 500 r / min for 15 min to obtain the pressure-sensitive adhesive.

[0096] Table 1 Detection results of surface resistance, 180° peeling strength, and holding adhesion of the adhesive tapes in the examples and the comparative examples Surface resistance (Ω) 180° peel strength (N / 25 mm) Holding power (h) Example 1 3.6 x 10 7 ]] 4.8 ≥100 Example 2 3.3 x 10 7 ]]> 5.0 ≥100 Example 3 2.5 x 10 7 ]] 5.4 ≥100 Example 4 2.1 x 10 7 ]] 5.6 ≥100 Comparative Example 1 6.3 x 10 9 ]]> 1.8 32 Comparative Example 2 4.9 x 10 8 ]] 2.9 65 Comparative Example 3 4.1 x 10 8 ]]> 3.5 71 According to the performance differences of the examples and the comparative examples in the table, the excellent performance of the adhesive tape depends on the synergistic effect of the auxiliary compounds, and the absence of key auxiliary agents or steps will cause a significant decline in performance, as follows: Core role of plasma treatment and related compounds: all the examples contain complete plasma treatment (containing dichloromethane, 3-amino-1,2,4-triazole, propionyl chloride, and triethylamine), while comparative example 1 lacks plasma treatment, which results in that the BOPP film surface cannot generate enough active sites, the bonding force between the antistatic primer and the substrate is greatly weakened, not only the surface resistance is significantly increased (the antistatic performance is decreased), but also the 180° peeling strength and the holding adhesion are greatly reduced; comparative example 2 lacks 3-amino-1,2,4-triazole, and comparative example 3 lacks propionyl chloride, both of which result in incomplete amidation reaction, and the stable heterocycle and continuous charge channel cannot be formed, the antistatic performance, the peeling strength, and the holding adhesion are all weaker than those of the examples, which confirms that 3-amino-1,2,4-triazole and propionyl chloride are the core substances for constructing the charge channel and enhancing the interface bonding, and triethylamine further guarantees the stability of the system by protecting the amide bond.

[0097] The auxiliary action of other auxiliary agents: silane coupling agent KH-550 promotes the compatibility of nano-tin-antimony oxide and polythiophene derivatives, avoids the agglomeration of antistatic components, ensures the uniform continuity of the charge channel; thickening agent hydroxyethyl cellulose ensures the uniformity of the antistatic primer coating, avoids the influence of uneven coating thickness on performance, and the two auxiliary agents together improve the antistatic stability and adhesive layer bonding force, so that the comprehensive performance of the examples is always better than that of the comparative examples lacking key auxiliary agents.

[0098] In summary, the auxiliary agent compounds realize the excellent performance of the adhesive tape antistatic performance, peel strength and adhesive force through the synergistic effect of "activating the active sites of the substrate - constructing stable charge channels - strengthening the interface bonding - optimizing the dispersion of components", which meets the waste discharge demand of precision electronic devices.

[0099] The above is only a preferred embodiment of the present application, and does not limit the present application in any form. Although the present application has been disclosed as above with a preferred embodiment, it is not intended to limit the present application. Any person skilled in the art can make some changes or modifications to the above disclosed technical content to obtain equivalent embodiments with equivalent changes, without departing from the technical solution of the present application. Any modification, equivalent change and modification of the above embodiments made in accordance with the technical essence of the present application are still within the scope of the technical solution of the present application.

Claims

1. A production process for antistatic BOPP waste discharge tape for electronic devices, the operation steps of which are as follows, by weight parts: S1 Substrate Pretreatment: Select BOPP film with a thickness of 25-50μm, and sequentially pass it through plasma treatment, alcohol degreasing, and hot air drying; Preparation of S2 antistatic primer: Mix 3-8 parts of polythiophene derivative, 2-5 parts of nano-tin antimony oxide, 1-3 parts of silane coupling agent KH-550, 0.5-2 parts of thickener hydroxyethyl cellulose, and 70-90 parts of deionized water, stir for 30-60 min, and ultrasonically disperse for 20-40 min to obtain antistatic primer; S3 Primer Coating: The antistatic primer liquid is coated onto one side of the pretreated BOPP film using a micro-gravure coating method, with a coating thickness of 1-3μm, and then baked to form an antistatic primer coating. S4 Adhesive Layer Coating: Apply pressure-sensitive adhesive to the surface of the antistatic primer using a comma-shaped doctor blade coating method. The coating thickness is 15-30μm. Pre-bake at 80-100℃ for 3-8min. S5 Composite Curing: The film coated with pressure-sensitive adhesive is laminated with a release film and cured under nitrogen protection; S6 Slitting and Rewinding: The cured composite film is slitted and rewound to obtain antistatic BOPP waste discharge tape for electronic devices; The S1 plasma treatment involves treating the BOPP membrane in a plasma device using dichloromethane, 3-amino-1,2,4-triazole, propionyl chloride, and triethylamine.

2. The production process of an antistatic BOPP waste discharge tape for electronic devices according to claim 1, characterized in that: The polythiophene derivative is poly(3,4-ethylenedioxythiophene)-poly(styrene sulfonate).

3. The production process of an antistatic BOPP waste discharge tape for electronic devices according to claim 1, characterized in that: The release film is a polyethylene terephthalate release film with a thickness of 25-50 μm.

4. The production process of an antistatic BOPP waste discharge tape for electronic devices according to claim 1, characterized in that: The S1 plasma treatment has a power of 90-110W, and the specific operation steps are as follows: T1: Lay the BOPP membrane flat on the vacuum suction cup stage in the reactor, and add 84-168 parts of dichloromethane, 10-16 parts of 3-amino-1,2,4-triazole, and 7-11 parts of propionyl chloride into the reactor; T2: Introduce krypton gas to remove oxygen for 15-30 minutes, turn on the plasma equipment, and spray krypton gas from the annular nozzle to form a protective gas flow; coat the upper surface of the film with the micro-grooving head, and briefly dip the lower surface of the film into the stage by raising and lowering it at 1 cm / min; add 0.2-0.6 parts of triethylamine, and cool to 0-5℃ to react for 1.5-3 hours. T3: After the reaction is complete, the plasma equipment is turned off and the temperature is lowered. The membrane is washed with water 3-4 times to remove salt, and then vacuum dried to obtain the pretreated BOPP film.

5. The production process of an antistatic BOPP waste discharge tape for electronic devices according to claim 3, characterized in that: The vacuum drying temperature of T3 is 40-50℃, and the time is 5-10 minutes.

6. The production process of an antistatic BOPP waste discharge tape for electronic devices according to claim 1, characterized in that: The temperature of the S1 hot air drying is 60-80℃, and the drying time is 5-10 minutes.

7. The production process of an antistatic BOPP waste discharge tape for electronic devices according to claim 1, characterized in that: The stirring speed of S2 is 800-1200 r / min.

8. The production process of an antistatic BOPP waste discharge tape for electronic devices according to claim 1, characterized in that: The S3 baking temperature is 100-120℃, and the baking time is 5-10 minutes.

9. The production process of an antistatic BOPP waste discharge tape for electronic devices according to claim 1, characterized in that: The curing temperature of S5 is 120-140℃, and the curing time is 10-20 min.

10. The production process of an antistatic BOPP waste discharge tape for electronic devices according to claim 1, characterized in that: The preparation method of the pressure-sensitive adhesive is as follows: Preparation of component A in H1: Add 50-70 parts of butyl acrylate, 20-30 parts of methyl methacrylate, 5-10 parts of hydroxyethyl acrylate, 2-5 parts of acrylic acid, and 0.3-1 parts of initiator benzoyl peroxide to a reaction vessel, and react at 75-85℃ for 3-5 hours using 200-300 parts of ethyl acetate as solvent. H2 Preparation of Component B: Mix 1-3 parts of hexamethylene diisocyanate trimer, 0.5-2 parts of antioxidant 1010, and 0.3-1 parts of ultraviolet absorber UV-531 evenly; H3: Add component B to component A and stir at 500-800 r / min for 15-30 min to obtain pressure-sensitive adhesive.