High and low temperature test infrared imaging plug for chip and high and low temperature heat preservation box

Abstract

The invention discloses a high and low temperature test infrared imaging plug for a chip and a high and low temperature incubator, and belongs to the technical field of high and low temperature performance test of chips. The method is used for solving at least one of the problems that in the prior art, in the high-low temperature testing process, chip temperature detection accuracy is poor, a high-low temperature heat preservation box is poor in heat preservation performance and sealing performance, a heat preservation box body needs to be opened for chip replacement, and the stability of the testing environment is affected. The infrared imaging plug comprises germanium glass, an infrared imager and a supporting column. A containing hole is formed in the elastic sleeve supporting column, the elastic sleeve germanium glass cover is arranged at the first end of the containing hole of the supporting column, the elastic sleeve infrared imager is arranged in the containing hole, and the collecting end of the infrared imager faces the germanium glass. The method can be used for high and low temperature testing of the chip.

Description

Technical Field

[0001] This invention belongs to the field of chip high and low temperature performance testing technology, and in particular, an infrared imaging plug and a high and low temperature insulation box for chip high and low temperature testing. Background Technology

[0002] In the research, development, production, and reliability verification of semiconductor chips, high and low temperature testing is a key step in evaluating the operational stability and environmental adaptability of chips and internal components.

[0003] Accurate temperature measurement is a core prerequisite for high and low temperature testing. Only by accurately acquiring real-time temperature change data of components can the failure threshold and environmental adaptability boundary be effectively determined. At room temperature, temperature measurement technology is mature, and the industry commonly uses thermocouples or infrared thermal imagers: thermocouples measure temperature through direct contact between the probe and the component, utilizing the thermoelectric effect, offering fast response and high accuracy; infrared thermal imagers, based on infrared radiation characteristics, operate non-contactly, monitoring temperature distribution without interfering with the component.

[0004] However, in high and low temperature chip testing scenarios, on the one hand, the tests need to be conducted in a sealed high and low temperature insulated chamber to maintain a stable extreme temperature environment. The sealed nature of the insulated chamber prevents operators from installing probes during the test. Even if probes are installed in advance, opening and closing the chamber door can cause temperature fluctuations, disrupting the stability of the test environment and affecting measurement accuracy and data reliability. On the other hand, existing infrared thermal imagers are located outside the high and low temperature insulated chamber. Because the high and low temperature insulated chamber provides insulation, the infrared thermal imager can also accurately measure the chip temperature. Summary of the Invention

[0005] Based on the above analysis, the present invention aims to provide an infrared imaging plug and a high-low temperature insulation box for high and low temperature testing of chips, in order to solve at least one of the following problems in the prior art: poor accuracy of chip temperature detection during high and low temperature testing, poor insulation and sealing of the high and low temperature insulation box, and the need to open the insulation box to replace the chip, which affects the stability of the testing environment.

[0006] The objective of this invention is mainly achieved through the following technical solutions.

[0007] In a first aspect, the present invention provides an infrared imaging plug for high and low temperature testing of chips, comprising germanium glass, an infrared imager, and a support post;

[0008] An accommodating hole is opened on the elastic sleeve support column, and the elastic sleeve germanium glass cover is placed at the first end of the accommodating hole of the support column. The elastic sleeve infrared imager is placed in the accommodating hole, and the acquisition end of the infrared imager faces the germanium glass.

[0009] Furthermore, the cross-sectional shape of the elastic sleeve receiving hole is rectangular, and the cross-sectional shape of the elastic sleeve support column is circular.

[0010] Furthermore, the distance between the flexible sleeve infrared imager and the germanium glass is 5mm to 10mm, and the thickness of the flexible sleeve germanium glass is 2mm to 5mm.

[0011] Furthermore, the elastic sleeve high and low temperature test infrared imaging plug also includes an elastic sleeve, which is sleeved on the outer wall of the support column.

[0012] Furthermore, the elastic sleeve is a silicon elastic sleeve.

[0013] Furthermore, the elastic sleeve support column and the elastic sleeve are interference fit.

[0014] Furthermore, the elastic sleeve high and low temperature test infrared imaging plug also includes a positioning protrusion on the inner wall of the receiving hole, and a positioning groove matching the positioning protrusion is provided on the outer wall of the elastic sleeve infrared imager.

[0015] Furthermore, the elastic sleeve high and low temperature test infrared imaging plug also includes a focusing lens disposed between the germanium glass and the chip.

[0016] Furthermore, the elastic sleeve high and low temperature test infrared imaging plug also includes a pressure ring. The elastic sleeve pressure ring is located on the side of the germanium glass away from the support column, and the elastic sleeve pressure ring is detachably connected to the support column by bolts.

[0017] Secondly, the present invention also provides a high and low temperature insulation box, including an insulation box body and the above-mentioned infrared imaging plug for high and low temperature testing of chips, wherein an elastic sleeve support column penetrates the side wall of the insulation box body and the support column is sealed to the insulation box body.

[0018] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0019] A) The infrared imaging plug for high and low temperature testing of chips provided by the present invention is equipped with a support column specifically designed to accommodate the infrared imager. The support column penetrates the side wall of the high and low temperature insulation chamber and is sealed, so that the infrared imager can collect the temperature of the chip inside the chamber without damaging the sealed environment of the insulation chamber. This reduces temperature fluctuations caused by opening and closing the chamber door, thereby ensuring the stability of the test environment and improving measurement accuracy and data reliability.

[0020] B) The infrared imaging plug for high and low temperature testing of chips provided by the present invention uses germanium glass to cover one end of the support column receiving hole. Germanium glass has good infrared transmittance, which can ensure that the infrared imager accurately collects the infrared radiation of the chip, thereby realizing accurate measurement of chip temperature, effectively solving the problem of poor accuracy of chip temperature detection in the high and low temperature testing process in the prior art.

[0021] C) The infrared imaging plug for high and low temperature testing of chips provided by this invention has a simple structure, is easy to install, and can be widely used in the field of high and low temperature performance testing of chips.

[0022] In this invention, the above-described technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of this invention will be set forth in the following description, and some advantages may become apparent from the description or be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained through the embodiments described and the accompanying drawings, which are particularly pointed out. Attached Figure Description

[0023] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts.

[0024] Figure 1 This is a schematic diagram of the structure of the infrared imaging plug for high and low temperature testing of chips provided in Embodiment 1 of the present invention;

[0025] Figure 2 This is an axial cross-sectional view of an infrared imaging plug for high and low temperature testing of chips provided in Embodiment 1 of the present invention;

[0026] Figure 3 This is a schematic diagram of the high and low temperature insulation box provided in Embodiment 2 of the present invention;

[0027] Figure 4 This diagram illustrates the process of removing the tested chip and placing the chip to be tested into the high and low temperature insulation chamber provided in Embodiment 2 of the present invention.

[0028] Figure label:

[0029] 1-Germanium glass; 2-Infrared imager; 3-Support column; 4-Accommodation hole; 5-Elastic sleeve; 6-Focusing lens; 7-Pressure ring; 8-Elastic heat insulation block; 9-Insulated box; 10-Mounting turntable; 11-Mounting shaft; 12-First baffle; 13-Second baffle; 14-First mounting slot; 15-Second mounting slot; 16-Tested chip; 17-Chip to be tested; 18-First gap baffle; 19-Second gap baffle; 20-Chip collection slot. Detailed Implementation

[0030] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which constitute a part of the present invention and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention.

[0031] Example 1

[0032] This embodiment provides an infrared imaging plug for high and low temperature testing of chips. See [link / reference] Figures 1 to 2 The device includes germanium glass 1, an infrared imager 2, and a support column 3. The support column 3 has a receiving hole 4. The germanium glass 1 covers the first end of the receiving hole 4 of the support column 3. The infrared imager 2 is located in the receiving hole 4, and the acquisition end of the infrared imager 2 faces the germanium glass 1.

[0033] During implementation, the support column 3 is inserted through the side wall of the high and low temperature insulation box, and the support column 3 is sealed to the high and low temperature insulation box. The germanium glass 1 and the infrared imager 2 are positioned facing the inside of the high and low temperature insulation box. The chip is placed inside the high and low temperature insulation box and subjected to high and low temperature tests. During the test, the infrared imager 2 collects the temperature changes of the chip.

[0034] Compared with the prior art, the infrared imaging plug for high and low temperature testing of chips provided in this embodiment has, on the one hand, a support column 3 specifically designed to accommodate the infrared imager 2. The support column 3 penetrates the side wall of the high and low temperature insulation box and is sealed, so that the infrared imager 2 can collect the temperature of the chip inside the box without damaging the sealed environment of the insulation box, reducing temperature fluctuations caused by opening and closing the box door, thereby ensuring the stability of the test environment and improving measurement accuracy and data reliability.

[0035] On the other hand, germanium glass 1 is used to cover one end of the receiving hole 4 of the support column 3. Germanium glass 1 has good infrared transmittance, which can ensure that the infrared imager 2 accurately collects the infrared radiation of the chip, thereby realizing accurate measurement of chip temperature and effectively solving the problem of poor accuracy of chip temperature detection during high and low temperature testing in the existing technology.

[0036] On the other hand, the aforementioned high and low temperature test infrared imaging plug has a simple structure and is easy to install, making it widely applicable in the field of high and low temperature performance testing of chips.

[0037] For example, the accommodating hole 4 has a rectangular cross-sectional shape, and the support column 3 has a circular cross-sectional shape.

[0038] For example, the distance between the infrared imager 2 and the germanium glass 1 is 5mm to 10mm (e.g., 7mm), the thickness of the germanium glass 1 is 2mm to 5mm (e.g., 3mm), and the field of view of the infrared imager 2 is 90°. It should be noted that, on the one hand, limiting the distance between the infrared imager 2 and the germanium glass 1 within the above range not only ensures that the lens of the infrared imager 2 is less affected by the high and low temperature interference inside the high and low temperature insulation box, but also reduces the impact on the field of view of the infrared imager 2.

[0039] To address the issue of poor sealing between the support column 3 and the side wall of the high-low temperature insulation chamber, the aforementioned infrared imaging plug for high-low temperature chip testing also includes an elastic sleeve 5, which is fitted onto the outer wall of the support column 3. This ensures that when the support column 3 penetrates the side wall of the high-low temperature insulation chamber, the elastic sleeve 5 can fit tightly against the side wall, creating a good seal and effectively reducing temperature leakage within the chamber, further guaranteeing the stability of the testing environment.

[0040] For example, the elastic sleeve 5 is a silicone elastic sleeve 5 with a thermal conductivity of 0.2 W / mk. The silicone elastic sleeve 5 not only possesses good elasticity, enabling it to adapt to sidewalls of different apertures and achieve a tight fit, but also has a low thermal conductivity, effectively reducing heat transfer and thus minimizing its impact on the temperature environment inside the high and low temperature insulation chamber. Furthermore, the silicone rubber material also exhibits excellent high and low temperature resistance, maintaining stable physical and chemical properties under extreme temperature conditions, ensuring the durability of the sealing effect.

[0041] It should be noted that the support column 3 and the elastic sleeve 5 are interference-fitted. For example, the outer diameter of the support column 3 is 179mm to 181mm, and the inner diameter of the elastic sleeve 5 is 177mm to 178mm. In this way, the interference fit can reliably fix the support column 3 and the elastic sleeve 5, and at the same time, the interference fit can also ensure that there is no gap between the support column 3 and the elastic sleeve 5, which is beneficial to ensuring the internal temperature of the high and low temperature insulation box.

[0042] To facilitate the installation and removal of the infrared imager 2, the aforementioned infrared imaging plug for high and low temperature testing of the chip also includes a positioning protrusion on the inner wall of the receiving hole 4. Correspondingly, a positioning groove matching the positioning protrusion is provided on the outer wall of the infrared imager 2. In this way, when installing the infrared imager 2, it can be quickly and accurately installed simply by aligning it with the positioning protrusion and the positioning groove, thereby improving installation efficiency.

[0043] To further improve the accuracy of temperature acquisition by the infrared imager 2, the aforementioned infrared imaging plug for high and low temperature testing of the chip also includes a focusing lens 6 disposed between the germanium glass 1 and the chip. The focusing lens 6 can focus the infrared radiation emitted by the chip onto the acquisition end of the infrared imager 2, enhancing the intensity of the infrared signal, thereby further improving the accuracy of temperature measurement.

[0044] To address the issue of unstable installation of the germanium glass 1, the aforementioned infrared imaging plug for high and low temperature testing of the chip also includes a retaining ring 7. The retaining ring 7 is located on the side of the germanium glass 1 furthest from the support post 3, and is detachably connected to the support post 3 via bolts. This bolted connection between the retaining ring 7 and the support post 3 securely fixes the germanium glass 1 to one end of the receiving hole 4 in the support post 3, effectively reducing the possibility of the germanium glass 1 loosening or falling off during high and low temperature testing due to temperature changes or mechanical vibrations. This further ensures the accuracy and stability of the chip temperature data acquired by the infrared imager 2. Simultaneously, the detachable connection between the retaining ring 7 and the support post 3 facilitates the replacement or cleaning of the germanium glass 1 when needed, thereby improving the ease of use and maintainability of the entire high and low temperature testing infrared imaging plug.

[0045] It is worth noting that the opening of the receiving hole 4 on the support column 3 inevitably affects the sealing and insulation performance of the high and low temperature insulation chamber. To reduce this impact, the infrared imaging plug used for high and low temperature testing of the chip also includes an elastic heat insulation block 8, which is located at the second end of the receiving hole 4. In this way, the elastic heat insulation block 8 fills the gap formed by the receiving hole 4 of the support column 3 on the side wall of the high and low temperature insulation chamber, effectively blocking the direct convection of air inside and outside the chamber, reducing heat transfer efficiency, and thus reducing the adverse effects on the sealing and insulation performance of the high and low temperature insulation chamber caused by the opening of the receiving hole 4. At the same time, the elastic heat insulation block 8 has a certain degree of elasticity, which allows it to adapt to the slight deformation of the side wall of the high and low temperature insulation chamber caused by temperature changes during high and low temperature testing, maintaining a tight fit with the side wall and further enhancing the sealing effect.

[0046] For example, the pressure ring 7 and the support column 3 are made of polytetrafluoroethylene or polyimide. Both of these materials have excellent high and low temperature resistance, chemical stability and mechanical properties. They can maintain stable performance in the extreme environment of high and low temperature testing and are not easily deformed or damaged, thereby ensuring the reliability and durability of the entire high and low temperature test infrared imaging plug.

[0047] Example 2

[0048] This embodiment provides a high and low temperature insulation box, see [link]. Figure 3 It includes an insulated box 9 and an infrared imaging plug for high and low temperature testing of chips provided in Embodiment 1. The support column 3 penetrates the side wall of the insulated box 9 and is sealed to the insulated box 9.

[0049] Compared with the prior art, the beneficial effects of the high and low temperature insulation box provided in this embodiment are basically the same as those of the infrared imaging plug for high and low temperature testing of chips provided in Embodiment 1, and will not be described in detail here.

[0050] To address the chip mounting issue, the aforementioned high and low temperature insulation chamber also includes a chip mounting assembly, on which the chip is placed.

[0051] In the existing technology, during the low-temperature or high-temperature testing of chips, when the temperature of a chip is still low or high after the previous chip has been tested, the tester cannot manually remove the tested chip. Therefore, it is necessary to wait for the temperature inside the high-low temperature chamber to return to normal before opening the chamber, taking out the tested chip, and then putting in the next chip to be tested. This obviously greatly reduces the efficiency of the low-temperature or high-temperature testing of chips and cannot guarantee that the testing conditions of multiple chips are consistent, affecting the accuracy of the high-low temperature testing of chips.

[0052] Therefore, for the structure of the chip mounting assembly, see specifically... Figure 4 The device includes a mounting turntable 10, a mounting shaft 11, a first baffle 12, and a second baffle 13. The bottom wall of the insulation box 9 has a turntable mounting hole. The mounting turntable 10 is rotatably connected to the turntable mounting hole via the mounting shaft 11. The mounting turntable 10 has a first mounting groove 14 and a second mounting groove 15 for accommodating chips. Along the rotation direction of the mounting turntable 10, the side wall of the first mounting groove 14 located in front is the first side wall, the side wall of the first mounting groove 14 located behind is the second side wall, the side wall of the second mounting groove 15 located in front is the third side wall, and the side wall of the second mounting groove 15 located behind is the fourth side wall. The first baffle 12 is located on the second side wall, and the second baffle 13 is located on the fourth side wall.

[0053] The chip that has completed high and low temperature testing is defined as chip 16, and the next chip to undergo high and low temperature testing is chip 17. Based on the structure of the chip mounting assembly described above, Figure 4 For example, the process of removing chip 16 and inserting chip 17 after testing is as follows:

[0054] At this time, the tested chip 16 is placed in the first mounting slot 14 and is located between the first baffle 12 and the bottom of the first mounting slot 14, while the chip 17 to be tested is not installed in the second mounting slot 15.

[0055] Rotating the mounting turntable 10 counterclockwise causes the first mounting slot 14 to drive the tested chip 16 to rotate downward counterclockwise by 25° to 35°, and correspondingly, the second mounting slot 15 rotates upward counterclockwise by 25° to 35°.

[0056] The chip to be tested 17 is placed in the second mounting slot 15 and is located between the second baffle 13 and the bottom of the second mounting slot 15. At this time, the first mounting slot 14 is still inside the heat preservation box 9, and the second mounting slot 15 is located. Due to the setting of the second baffle 13, the chip to be tested 17 will not come out of the second mounting slot 15.

[0057] Continue to rotate the installation turntable 10 counterclockwise, and the first installation slot 14 will rotate out of the insulation box 9 from inside the insulation box 9, and the second installation slot 15 will rotate into the insulation box 9 from outside the insulation box.

[0058] Continue to rotate the mounting turntable 10 counterclockwise. Under the action of gravity, the tested chip 16 will be removed from the first mounting slot 14 and fall into the chip collection slot 20 located below the mounting turntable 10, thus completing the removal of the tested chip 16.

[0059] Continue to rotate the mounting turntable 10 counterclockwise, and set the bottom of the second mounting slot 15 horizontally to complete the placement of the chip 17 to be tested.

[0060] In this way, by installing the turntable 10, the first baffle 12, and the second baffle 13, the tester can quickly remove the tested chip 16 and accurately place the chip 17 to be tested without opening the high and low temperature chamber or waiting for the temperature inside the chamber to return to room temperature. This process not only greatly improves the efficiency of high and low temperature chip testing but also ensures that each chip experiences a basically consistent temperature environment during the testing process, thereby effectively improving the accuracy and reliability of high and low temperature chip testing.

[0061] It is worth noting that when the first mounting groove 14 and the second mounting groove 15 pass through the bottom wall of the insulation box 9, the gap between the first mounting groove 14, the second mounting groove 15 and the bottom wall of the insulation box 9 may cause the loss of gas and heat, affecting the sealing and insulation performance of the insulation box 9. Therefore, the above-mentioned high and low temperature insulation box also includes a first gap baffle 18 and a second gap baffle 19. The first gap baffle 18 is provided on one side of the hole wall of the turntable mounting hole, and the second gap baffle 19 is provided on the other side of the hole wall of the turntable mounting hole.

[0062] For example, the cross-sectional shapes of the first gap baffle 18 and the second gap baffle 19 are both arc-shaped. The arc length of the first gap baffle 18 is greater than the width of the first mounting groove 14, and the arc length of the second gap baffle 19 is greater than the width of the second mounting groove 15. Thus, when the first mounting groove 14 and the second mounting groove 15 rotate to a position contacting the bottom wall of the insulation box 9, the first gap baffle 18 and the second gap baffle 19 can respectively tightly fit against the sides of the first mounting groove 14 and the second mounting groove 15, effectively blocking the loss of gas and heat, thereby significantly reducing the adverse effects on the sealing and insulation performance of the insulation box 9 caused by the presence of gaps. At the same time, the arc-shaped baffles can better adapt to the rotation trajectory of the mounting turntable 10, ensuring that they remain tightly fitted with the turntable mounting groove during rotation, further improving the sealing effect.

[0063] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. An infrared imaging plug for high and low temperature testing of chips, characterized in that, Includes germanium glass, infrared imager, and support column; The support column has a receiving hole, the germanium glass cover is placed at the first end of the receiving hole, the infrared imager is placed in the receiving hole, and the acquisition end of the infrared imager faces the germanium glass.

2. The infrared imaging plug for high and low temperature testing of chips according to claim 1, characterized in that, The accommodating hole has a rectangular cross-sectional shape, and the support column has a circular cross-sectional shape.

3. The infrared imaging plug for high and low temperature testing of chips according to claim 1, characterized in that, The distance between the infrared imager and the germanium glass is 5mm to 10mm, and the thickness of the germanium glass is 2mm to 5mm.

4. The infrared imaging plug for high and low temperature testing of chips according to claim 1, characterized in that, The high and low temperature test infrared imaging plug also includes an elastic sleeve, which is sleeved on the outer wall of the support column.

5. The infrared imaging plug for high and low temperature testing of chips according to claim 4, characterized in that, The elastic sleeve is a silicon elastic sleeve.

6. The infrared imaging plug for high and low temperature testing of chips according to claim 4, characterized in that, The support column and the elastic sleeve are interference fit.

7. The infrared imaging plug for high and low temperature testing of chips according to any one of claims 1 to 6, characterized in that, The high and low temperature test infrared imaging plug also includes a positioning protrusion on the inner wall of the receiving hole, and a positioning groove matching the positioning protrusion is provided on the outer wall of the infrared imager.

8. The infrared imaging plug for high and low temperature testing of chips according to any one of claims 1 to 6, characterized in that, The high and low temperature test infrared imaging plug also includes a focusing lens disposed between the germanium glass and the chip.

9. The infrared imaging plug for high and low temperature testing of chips according to any one of claims 1 to 6, characterized in that, The high and low temperature test infrared imaging plug also includes a pressure ring, which is located on the side of the germanium glass away from the support column, and the pressure ring is detachably connected to the support column by bolts.

10. A high and low temperature insulation box, characterized in that, It includes an insulated box and an infrared imaging plug for high and low temperature testing of chips as described in any one of claims 1 to 9, wherein the support column penetrates the side wall of the insulated box and is sealed to the insulated box.

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