Wafer transfer apparatus control method and system, and semiconductor manufacturing transfer system

Abstract

The invention relates to a wafer carrying device control method and system and a semiconductor manufacturing and carrying system. The method comprises the steps that in the process that a wafer carrying device responds to a first command, executes a current task and carries a wafer box to a current goods placing point, a second command is obtained, and the second command is used for instructing and controlling the wafer carrying device to carry the wafer box to a target goods placing point; responding to the second command: if the current task of the wafer carrying device does not enter the goods placing process to the current goods placing point, changing the goods placing target point of the current task into a target goods placing point from the current goods placing point so as to control the wafer carrying device to carry the wafer box to the target goods placing point; and if the current task of the wafer carrying device enters the goods placing process to the current goods placing point, the current goods placing process is terminated, and the wafer carrying device is controlled to carry the wafer box to the target goods placing point. The overall wafer carrying efficiency can be improved at least, and the actual carrying time is shortened.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a wafer handling device control method, system, and semiconductor manufacturing handling system. Background Technology

[0002] Automated Material Handling Systems (AMHS) are core technologies in semiconductor manufacturing, enabling efficient and precise material handling. They are widely used in wafer fabrication, packaging, and testing. Within semiconductor device manufacturing plants, different production equipment is partitioned, and materials are transferred between these partitions via AMHS Overhead-Hoist-Transportation (OHT) systems and semiconductor overhead cranes that move between them. The OHT crane tracks are suspended from the workshop ceiling, providing support and guidance for the overhead cranes. These cranes transport wafer cassettes (such as Foups) between two different locations, saving space and enabling fast and stable Foup transport.

[0003] However, the handling efficiency of traditional OHT cranes needs improvement during transportation tasks. For example, if an OHT crane task is canceled, it needs to be stopped before a new task can be performed. On the one hand, stopping operation takes unnecessary time; on the other hand, it may also block the operation of other OHT cranes. Summary of the Invention

[0004] Therefore, it is necessary to provide a wafer handling device control method, system, and semiconductor manufacturing handling system that can improve the overall wafer handling efficiency and reduce the actual handling time, in order to address the above-mentioned technical problems.

[0005] In a first aspect, this application provides a method for controlling a wafer handling device, comprising:

[0006] During the process of the wafer handling device responding to the first command and executing the current task of moving the wafer cassette to the current delivery point, a second command is obtained. The second command is used to instruct and control the wafer handling device to move the wafer cassette to the target delivery point, which is the ordering machine during the execution of the current task.

[0007] In response to the second command: if the current task of the wafer handling device has not yet entered the delivery process to the current delivery point, the delivery target point of the current task is changed from the current delivery point to the target delivery point, so as to control the wafer handling device to move the wafer cassette to the target delivery point; if the current task of the wafer handling device has already entered the delivery process to the current delivery point, the current delivery process is terminated, and the wafer handling device is controlled to move the wafer cassette to the target delivery point.

[0008] In the wafer handling device control method described in the above embodiments, during the process of the wafer handling device responding to a first command and executing the current task of moving the wafer cassette to the current delivery point, a second command sent by the wafer handling device control system is obtained. The second command is used to instruct the wafer handling device to move the wafer cassette to the target delivery point, which is the ordering machine during the execution of the current task. The wafer handling device responds to the second command as follows: if the current task of the wafer handling device has not yet entered the delivery process to the current delivery point, the delivery target point of the current task is changed from the current delivery point to the target delivery point, so as to control the wafer handling device to directly move the wafer cassette to the target delivery point, avoiding unnecessary downtime caused by canceling the execution of the first command; if the current task of the wafer handling device has already entered the delivery process to the current delivery point, the current delivery process is terminated, and the wafer handling device is controlled to move the wafer cassette to the target delivery point, avoiding unnecessary handling time caused by delivery to the current delivery point and subsequent re-retrieval, thus effectively improving the overall wafer handling efficiency and reducing the actual handling time.

[0009] In some embodiments, during the process of the wafer handling device performing the current task and moving the wafer cassette to the current placement point, a second command is obtained. This includes: if the second command is obtained before or after the wafer handling device reaches the pickup point where the wafer cassette to be moved is stored, then the placement target point of the current task is changed from the current placement point to the target placement point; the shortest transport path between the current position of the wafer handling device and the target placement point is obtained; and the wafer handling device is controlled to move the wafer cassette to the target placement point based on the shortest transport path. This avoids unnecessary downtime caused by the wafer handling device canceling the execution of the first command, and replans the shortest transport path after pickup, moving the wafer cassette to the target placement point via the shortest transport path, further reducing the actual wafer cassette handling time. Compared to the traditional command sequence execution scheme, the wafer cassette is first moved to the current placement point, and then the second command is executed to move the wafer cassette to the target placement point. This not only reduces the time spent moving wafer cassettes due to unnecessary execution of the first command, but also reduces the wear and tear on the wafer handling equipment, effectively improving the overall wafer handling efficiency and reducing the actual handling time.

[0010] In some embodiments, during the process of the wafer handling device performing the current task and moving the wafer cassette to the current placement point, a second command is obtained. This includes: if the second command is obtained after the wafer handling device retrieves the wafer cassette from a pickup point storing the wafer cassettes to be handled, and before reaching the current placement point, then the placement target point of the current task is changed from the current placement point to the target placement point; the shortest transport path between the current position of the wafer handling device and the target placement point is obtained; and the wafer handling device is controlled to move the wafer cassette to the target placement point based on the shortest transport path. This avoids unnecessary handling time caused by placing the wafer cassette to the current placement point and subsequent re-retrieval, reduces the time spent moving the wafer cassette due to unnecessary execution of the first command, reduces wear and tear on the wafer handling device, and thus effectively improves the overall wafer handling efficiency and reduces the actual handling time.

[0011] In some embodiments, during the process of the wafer handling device performing the current task and moving the wafer cassette to the current placement point, a second command is obtained. This includes: if the second command is obtained after the wafer handling device has moved the wafer cassette to the current placement point, terminating the current placement process; obtaining the shortest transport path between the current placement point and the target placement point; and controlling the wafer handling device to move the wafer cassette to the target placement point based on the shortest transport path. This avoids unnecessary handling time caused by placing wafers to the current placement point and subsequent re-retrieval, reduces wear and tear on the wafer handling device, and thus effectively improves the overall wafer handling efficiency and reduces actual handling time.

[0012] In some embodiments, the current delivery point includes a machine or storage location.

[0013] In some embodiments, the current delivery point is a storage location, and the first command is used to instruct the wafer handling device to move the wafer cassette to a nearby storage location of the target machine; the first command is obtained during the process of the wafer handling device performing an inter-machine transport task and moving the wafer cassette to the target machine; the wafer handling device responds to the first command and performs the current task of moving the wafer cassette to the storage location.

[0014] In some embodiments, changing the delivery target point of the current task from the current delivery point to the target delivery point includes: replacing the code of the delivery target point of the current task with the code of the target delivery point.

[0015] Secondly, embodiments of this application also provide a wafer handling device control system, connected to at least one wafer handling device; the wafer handling device control system includes a receiving module and a handling control module, the receiving module being used to receive a first command or a second command; the first command being used to instruct the wafer handling device to execute the current task and move the wafer cassette to the current delivery point; the second command being used to instruct the wafer handling device to move the wafer cassette to a target delivery point, the target delivery point being the ordering machine during the execution of the current task; the handling control module being used, in response to the received second command, during the process of the wafer handling device executing the current task and moving the wafer cassette to the current delivery point in response to the first command: if the current task of the wafer handling device has not yet entered the delivery process to the current delivery point, then the delivery target point of the current task is changed from the current delivery point to the target delivery point, so as to control the wafer handling device to move the wafer cassette to the target delivery point; if the current task of the wafer handling device has already entered the delivery process to the current delivery point, then the current delivery process is terminated, and the wafer handling device is controlled to move the wafer cassette to the target delivery point.

[0016] In some embodiments, the handling control module includes a handling control unit and a termination unit. The handling control unit is configured to, upon receiving a second command during a target state period, change the current task's delivery target point from the current delivery point to the target delivery point, obtain the shortest transport path between the current position of the wafer handling device and the target delivery point, and control the wafer handling device to transport the wafer cassette to the target delivery point based on the shortest transport path. The target state period includes any one of the following states: before the wafer handling device reaches the pickup point storing the wafer cassette to be transported; when the wafer handling device reaches the pickup point storing the wafer cassette to be transported; after the wafer handling device retrieves the wafer cassette to be transported from the pickup point storing the wafer cassette to be transported; and before reaching the current delivery point. The termination unit is configured to, if receiving the second command after the wafer handling device has transported the wafer cassette to the current delivery point, terminate the current delivery process, obtain the shortest transport path between the current delivery point and the target delivery point, and control the wafer handling device to transport the wafer cassette to the target delivery point based on the shortest transport path.

[0017] Thirdly, embodiments of this application also provide a semiconductor manufacturing transport system, which includes a wafer transport device, an overhead track, and a wafer transport device control system as described in any of the foregoing embodiments. The overhead track is used to support the movement of the wafer transport device, and the wafer transport device stores and retrieves the wafer cassettes it transports at the workstations of the corresponding processes. The wafer transport device control system is used to schedule the wafer transport device to complete the transfer of the wafer cassettes, so as to minimize the total actual wafer cassette transport time.

[0018] Fourthly, this application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps of the wafer handling device control method in any of the above embodiments.

[0019] Fifthly, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the wafer handling device control method in any of the above embodiments.

[0020] Sixthly, this application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the wafer handling device control method in any of the above embodiments.

[0021] The aforementioned wafer handling device control method, system, and semiconductor manufacturing handling system include a wafer handling device control system connected to at least one wafer handling device. After sending a first command to the wafer handling device, the control system receives a second command from the control system while the wafer handling device is responding to the first command and executing its current task of moving a wafer cassette to the current placement point. The second command instructs the control system to move the wafer cassette to a target placement point, which is the ordering machine used during the current task execution. The wafer handling device responds to the second command by: if the current task of the wafer handling device is still... Before entering the delivery process to the current delivery point, the delivery target point of the current task is changed from the current delivery point to the target delivery point. This controls the wafer handling device to directly transport the wafer cassette to the target delivery point, avoiding unnecessary downtime caused by canceling the first command. If the current task of the wafer handling device has already entered the delivery process to the current delivery point, the current delivery process is terminated, and the wafer handling device is controlled to transport the wafer cassette to the target delivery point. This avoids unnecessary handling time caused by delivering to the current delivery point and subsequent re-retrieval, thus effectively improving the overall wafer handling efficiency and reducing the actual handling time. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the architecture for application scenarios in some embodiments;

[0024] Figure 2 This is a flowchart illustrating the control method for the wafer handling device in some embodiments;

[0025] Figure 3 This is a schematic diagram illustrating the working principle of the wafer handling device control method in some embodiments;

[0026] Figure 4 This is a schematic diagram illustrating the working principle of the transport vehicle in some embodiments;

[0027] Figure 5 This is a structural block diagram of the wafer handling device control system in some embodiments;

[0028] Figure 6 This is a structural block diagram of the wafer handling device control system in some other embodiments;

[0029] Figure 7 This is a diagram showing the internal structure of a computer device in some embodiments.

[0030] in:

[0031] 10. Lateral movement mechanism; 20. Lifting mechanism; 30. Clamping mechanism; 40. Traveling mechanism; 300. Semiconductor material box; 200. Transport vehicle; 101. Turning detection unit; 104. Straight-line detection unit; 201. Receiving module; 202. Handling control module; 2021. Handling control unit; 2022. Termination unit. Detailed Implementation

[0032] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0034] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0035] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0036] Furthermore, the terms “first”, “second”, etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0037] In semiconductor manufacturing companies, Advanced Handling System (AMHS) was developed to address the risks and uncertainties associated with manual handling, and it has been widely adopted in the industry. The AMHS track system includes various track types such as branch tracks, turning tracks, and straight tracks, as well as complex environmental layouts around the tracks. Appropriate sensors are needed on different track types to assist in locating the crane's current position, enabling it to turn in suitable areas and obtain the shortest handling path.

[0038] In related technologies, if the overhead crane's route is changed, the reroute command currently only exists between the Manufacturing Execution System (MES) and the Material Control System (MCS). The MES needs to schedule Foup01 to be moved from process machine A to process machine B by the overhead crane. Since process machine B is currently operating, Foup01 will first be temporarily stored in a nearby storage location (e.g., OHB C) on process machine B. Once process machine B finishes its work and requests a new order, Foup01 will then be scheduled from OHB C to process machine B. If, while Foup01 is being moved from process machine A to OHB C by the overhead crane, process machine B has finished its work and can receive a new Foup and request a new order, the MES will notify the MCS to schedule Foup01 to process machine B. At this point, the MCS will issue a Cancel or Abort command based on the task status reported by the intelligent fleet dispatch system to end the task of the overhead crane moving Foup01 from process station A to OHB C. If the task is successfully completed and the overhead crane stops, or if the task fails and Foup01 is placed on OHB C, a new transport command will be issued to control the overhead crane to move Foup01 from OHB C to process station B. During the entire task, the overhead crane needs to stop for at least 3-4 seconds, and this stop will obstruct the passage of other overhead cranes. If Cancel or Abort fails, more running time will be wasted, and an additional set of pick-up and place-up time will be added, which is approximately 14 seconds.

[0039] The embodiments of this application aim to provide a wafer handling device control method, system, and semiconductor manufacturing handling system, which can at least improve the overall wafer handling efficiency and reduce the actual handling time.

[0040] The wafer handling device control method provided in this application embodiment can be applied to, for example, Figure 1 The wafer handling device control system is shown. The control system communicates or is connected to at least one wafer handling device to control the handling device (e.g., an overhead crane) to move wafer cassettes between different storage locations or wafer processing equipment (e.g., process equipment), minimizing the Average Delivery Time (ADT). The faster the overhead crane is released, the better the crane's performance, the more efficient the track layout, and the shorter the transport path, the smaller the ADT and the higher the AMHS operating efficiency.

[0041] In some embodiments, please refer to Figure 2 A method for controlling a wafer handling device is provided, comprising:

[0042] Step S20: During the process of the wafer handling device responding to the first command and executing the current task to move the wafer cassette to the current delivery point, a second command is obtained. The second command is used to instruct and control the wafer handling device to move the wafer cassette to the target delivery point, which is the ordering machine during the execution of the current task.

[0043] Step S40: In response to the second command: If the current task of the wafer handling device has not yet entered the delivery process to the current delivery point, change the delivery target point of the current task from the current delivery point to the target delivery point, so as to control the wafer handling device to move the wafer cassette to the target delivery point; if the current task of the wafer handling device has already entered the delivery process to the current delivery point, terminate the current delivery process and control the wafer handling device to move the wafer cassette to the target delivery point.

[0044] For example, please continue to refer to Figure 2 During the process of the wafer handling device responding to the first command and executing the current task of moving the wafer cassette to the current placement point, a second command is received from the wafer handling device control system. The second command instructs the wafer handling device to move the wafer cassette to the target placement point, which is the ordering machine used during the execution of the current task. The wafer handling device responds to the second command as follows: if the current task has not yet entered the placement process to the current placement point, the placement target point of the current task is changed from the current placement point to the target placement point, so that the wafer handling device can directly move the wafer cassette to the target placement point, avoiding unnecessary downtime caused by canceling the execution of the first command; if the current task has already entered the placement process to the current placement point, the current placement process is terminated, and the wafer handling device is moved to the target placement point, avoiding unnecessary handling time caused by placing the wafer cassette to the current placement point and subsequent re-retrieving, thus effectively improving the overall wafer handling efficiency and reducing the actual handling time.

[0045] For example, please continue to refer to Figure 2 The wafer handling device responds to the first command and executes the current task, which mainly includes a picking process and a placing process. The picking process includes picking movement and picking gripping actions; the placing process includes placing movement and placing gripping actions. This achieves the transfer of the wafer cassette to the current placing point.

[0046] In some embodiments, during step S20, when the wafer handling device performs the current task of moving the wafer cassette to the current delivery point, it receives a second command, including:

[0047] Step S22: If a second command is received before the wafer handling device reaches the pickup point where the wafer cassette to be handled is stored, or if the device reaches the pickup point, the delivery target point of the current task is changed from the current delivery point to the target delivery point.

[0048] Step S24: Obtain the shortest transport path between the current location of the wafer handling device and the target delivery point;

[0049] Step S26: Based on the shortest transport path, control the wafer handling device to transport the wafer box to the target delivery point.

[0050] For example, please refer to Figure 3 The current location of the overhead crane is at point A. Point B indicates the pickup point, where a wafer box to be transported is stored. In response to the first command, the overhead crane executes the current task and transports the wafer box to the current delivery point (original delivery point C). During this process, a call for goods is received at point D, and the overhead crane receives a second command instructing it to transport the wafer box to point D. In response to the second command, the overhead crane changes the delivery target point of the current task from point C to point D. After the overhead crane reaches point M via line (1), it reaches point B via line (2) to pick up the goods, obtains the wafer box to be transported, obtains the shortest transportation path (7) from point B to point D, and the overhead crane transports the wafer box to point D via the shortest transportation path (7). Compared to the traditional solution where the overhead crane first travels via lines (1) and (2) to point B to pick up the goods, then via lines (3) and (4) to point C, and then via line (5) to transport the wafer box to point D, the overhead crane transports the wafer box to point D via the shortest transport path (7), which significantly shortens the overhead crane's running time, shortens the overhead crane's running path, and reduces overhead crane wear.

[0051] In some embodiments, please refer to Figure 3 The current position of the overhead crane is at point B, which indicates the pickup point. Point B stores wafer boxes to be transported. In response to the first command, the overhead crane executes the current task and transports the wafer boxes to the current delivery point (the original delivery point C). During this process, a call is made at point D, and the overhead crane receives a second command instructing it to transport the wafer boxes to point D. In response to the second command, the overhead crane changes the delivery target point of the current task from point C to point D. The overhead crane picks up the wafer boxes at point B, obtains the shortest transport path (7) from point B to point D, and transports the wafer boxes to point D via the shortest transport path (7). Compared with the traditional solution where the overhead crane first reaches point B via lines (1) and (2) to pick up the wafer boxes, then reaches point C via lines (3) and (4), and then transports the wafer boxes to point D via line (5), the technical solution where the overhead crane transports the wafer boxes to point D via the shortest transport path (7) significantly shortens the overhead crane's running time, shortens the overhead crane's running path, and reduces overhead crane wear.

[0052] In some embodiments, during step S20, when the wafer handling device performs the current task of moving the wafer cassette to the current delivery point, it receives a second command, including:

[0053] Step S231: If a second command is received after the wafer handling device retrieves the wafer cassette from the pickup point where the wafer cassette is stored, and before it reaches the current delivery point, the delivery target point of the current task is changed from the current delivery point to the target delivery point.

[0054] Step S24: Obtain the shortest transport path between the current location of the wafer handling device and the target delivery point;

[0055] Step S26: Based on the shortest transport path, control the wafer handling device to transport the wafer box to the target delivery point.

[0056] For example, please refer to Figure 3 The overhead crane responds to the first command, executes the current task, and after acquiring the wafer box to be transported at point B, and before running to the current delivery point C, that is, the overhead crane acquires the wafer box to be transported at point B and runs on line (3), and orders are placed at point D. The overhead crane receives a second command instructing it to transport the wafer box to point D. The overhead crane responds to the second command and changes the delivery target point of the current task from point C to point D. It obtains the shortest transport path (8) from line (3) to point D, and the overhead crane transports the wafer box to point D via the shortest transport path (8). Compared to the traditional solution where the overhead crane stops first and then executes the second command, this avoids unnecessary downtime caused by canceling the execution of the first command for the wafer handling device, and re-plans the shortest transport path after picking up the goods, transporting the wafer box to the target delivery point via the shortest transport path, further reducing the actual wafer box handling time.

[0057] In some embodiments, during step S20, when the wafer handling device performs the current task of moving the wafer cassette to the current delivery point, it receives a second command, including:

[0058] Step S232: If a second command is received after the wafer handling device has moved the wafer cassette to the current delivery point, the current delivery process is terminated.

[0059] Step S25: Obtain the shortest transportation path between the current delivery point and the target delivery point;

[0060] Step S26: Based on the shortest transport path, control the wafer handling device to transport the wafer box to the target delivery point.

[0061] For example, please refer to Figure 3In response to the first command, the overhead crane executes the current task, moving the wafer cassette to the original delivery point C. Before delivery, a call is made at point D, and the overhead crane receives a second command instructing it to move the wafer cassette to point D. In response to the second command, the overhead crane terminates the current delivery process and obtains the shortest transport path (5) from point C to point D. The overhead crane then moves the wafer cassette to point D via the shortest transport path (5). Compared to the traditional solution where the overhead crane executes the first command to complete the delivery process at point C and then executes the second command, requiring the wafer cassette to be retrieved again and moved to point D, this avoids unnecessary handling time caused by delivering to the current delivery point and subsequently retrieving the wafer cassette. This reduces wear and tear on the wafer handling device, thus effectively improving the overall wafer handling efficiency and reducing actual handling time.

[0062] In some embodiments, the current delivery point includes a machine or storage location.

[0063] In some embodiments, the wafer handling device includes an overhead crane or a transport vehicle.

[0064] In some embodiments, the storage location, such as the Overhead Buffer (OHB), is located near the machine, for example, one-to-one with the machine. Before the current process of the machine is completed, the transported wafer cassette can be temporarily stored on the OHB near the machine. When the machine calls for delivery, the wafer cassette on the OHB is then moved to the machine.

[0065] The OHB can be suspended and located on both sides of the track, thus creating a space below the track that allows the vehicle to pass through. When traveling straight, the OHB has no effect on the movement of the air transport vehicle. The detection range of the radar in front of the vehicle can be set to a certain range in front of the vehicle, and the maximum width of this range can roughly match the width of the vehicle (generally slightly wider than the width of the vehicle). This detection range does not extend to the positions of the OHB on both sides.

[0066] The OHB mainly consists of four OHB pillars and a storage rack. For details on the specific arrangement of the four OHB pillars, please refer to the patent document with publication number CN212557851U, entitled "A Lifted Intelligent Cleaning Storage Device". The storage rack has several storage positions, each capable of holding one FOUP. The number of storage positions is determined based on the scenario and usage requirements.

[0067] Please refer to Figure 4In some embodiments, a semiconductor manufacturing handling system is provided, including a plurality of semiconductor material boxes 300, a transport vehicle 200, an overhead track (not shown) for carrying the transport vehicle 200, the transport vehicle 200 storing and retrieving the semiconductor material boxes 300 it carries at the corresponding process station, and an obstacle avoidance device. The semiconductor material boxes 300 may be front-opening unified pods (FOUPs). The turning detection unit 101 of the obstacle avoidance device is disposed on the transport vehicle 200, and the shielding component of the obstacle avoidance device is disposed on the target obstacle that the transport vehicle 200 approaches when turning. By installing a turning detection unit 101 at the first position of the transport vehicle 200, the turning detection unit 101 emits a wireless detection signal to detect the presence of obstacles in the target area. As the transport vehicle 200 approaches at least one target obstacle, a shielding component on the target obstacle prevents the generation of a target feedback signal based on the wireless detection signal. This avoids the control unit 103, connected to the turning detection unit 101, from controlling the transport vehicle 200 to decelerate and avoid obstacles upon receiving a target feedback signal from an obstacle in the target area, effectively preventing accidental stopping of the transport vehicle 200 due to its proximity to an obstacle during a turn. Even if the transport vehicle 200 approaches an obstacle without a shielding component during a turn, it can still trigger the deceleration and obstacle avoidance action, improving the efficiency, intelligence, and reliability of the semiconductor automated handling system. For specific obstacle avoidance schemes in this embodiment, please refer to the patent publication document with application number "2025102855036" and patent title "Semiconductor Transport Vehicle Obstacle Avoidance Device and Semiconductor Manufacturing Handling System".

[0068] It should be noted that, in this embodiment of the application, the target obstacle for which the shielding component is installed is located within a preset distance from the transport path of the transport vehicle. For example, the target obstacle is located at the edge of the target area to be detected, or at a specified distance inward from the edge of the target area to be detected.

[0069] Please refer to Figure 4 In some embodiments, the transport vehicle 200 is equipped with a lateral movement mechanism 10, a lifting mechanism 20, a clamping mechanism 30, and a traveling mechanism 40. A suspension rail (not shown) may be provided on the top of the transport vehicle 200. The suspension rail carries the traveling mechanism 40 of the transport vehicle 200 and defines the movement path of the transport vehicle 200. The lateral movement mechanism 10 is connected to the body of the transport vehicle 200 via a connecting shaft. The lateral movement mechanism 10 is configured to drive the lifting mechanism 20 to extend laterally outward from the body or retract from the outside into the body. The lifting mechanism 20 is configured to drive the clamping mechanism 30 to lift or lower. The clamping mechanism 30 is configured to grasp or release the FOUP.

[0070] As an example, please continue to refer to Figure 4A rotary mechanism (not shown) is also provided between the transverse mechanism 10 and the lifting mechanism 20. The clamping mechanism 30 is connected to the lifting mechanism 20 in a liftable manner through a flexible belt assembly (not shown), so that the lifting mechanism 20 and the clamping mechanism 30 can rotate as a whole to meet the needs of more flexible and efficient product transportation.

[0071] As an example, please continue to refer to Figure 4 The transport vehicle 200 also includes a position detection mechanism (not shown). During the gripping or unloading process of the clamping mechanism 30, the gripping action can be determined when the detection rod (not shown) is in a first preset position, and the unloading action can be determined when the detection rod is in a second preset position; or, the unloading action can be determined when the detection rod is in the first preset position, and the gripping action can be determined when the detection rod is in the second preset position.

[0072] Please continue to refer to this. Figure 4 In some embodiments, the clamping mechanism 30 can be driven by a linear drive to support the FOUP from below for clamping, or to release the FOUP. Here, the linear drive can be a linear drive structure component such as a linear motor, lead screw, or cylinder mechanism.

[0073] Please continue to refer to this. Figure 4 In some embodiments, the semiconductor material box 300 can be a 6-inch semiconductor wafer box or an 8-inch semiconductor wafer box, etc.

[0074] In some embodiments, the current delivery point is a storage location, and the first command is used to instruct the wafer handling device to move the wafer cassette to a nearby storage location of the target machine; the first command is obtained during the process of the wafer handling device performing an inter-machine transport task and moving the wafer cassette to the target machine; the wafer handling device responds to the first command and performs the current task of moving the wafer cassette to the storage location.

[0075] In some embodiments, changing the delivery target point of the current task from the current delivery point to the target delivery point includes: replacing the code of the current delivery target point with the code of the target delivery point to avoid unnecessary downtime caused by the wafer handling device canceling the execution of the first command; if the current task of the wafer handling device has already entered the delivery process to the current delivery point, then the current delivery process is terminated, and the wafer handling device is controlled to move the wafer cassette to the target delivery point to avoid unnecessary handling time caused by delivery to the current delivery point and subsequent re-retrieval, thereby effectively improving the overall wafer handling efficiency and reducing the actual handling time.

[0076] In some embodiments, the code of the delivery point is used to indicate the location information of the delivery point. For example, if the delivery point is an OHB (Outbound Handling Station), the code of the delivery point is used to indicate the location information of the OHB; if the delivery point is an EQ (Equipment Controller), the code of the delivery point is used to indicate the location information of the EQ. The location information of the delivery point can be determined via the track ID and the relative position of the delivery point on the track.

[0077] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages in other steps. It is understood that the steps in different embodiments can be freely combined as needed, and all non-contradictory solutions formed by such combinations are within the scope of protection of this application.

[0078] Based on the same inventive concept, this application also provides a wafer handling device control system for implementing the wafer handling device control method described above. The solution provided by this system is similar to the solution described in the above method; therefore, the specific limitations in one or more wafer handling device control system embodiments provided below can be found in the limitations of the wafer handling device control method described above, and will not be repeated here.

[0079] Please refer to Figure 5In some embodiments, a wafer handling device control system is provided, connected to at least one wafer handling device. The wafer handling device control system includes a receiving module 201 and a handling control module 202. The receiving module 201 is used to receive a first command or a second command. The first command is used to instruct the wafer handling device to perform the current task and move the wafer cassette to the current delivery point. The second command is used to instruct the wafer handling device to move the wafer cassette to a target delivery point, where the target delivery point is the ordering machine used during the execution of the current task. The handling control module 202 is used, in response to the received second command, to change the delivery target point of the current task from the current delivery point to the target delivery point before the current task of the wafer handling device has entered the delivery process to the current delivery point, so as to control the wafer handling device to move the wafer cassette to the target delivery point. If the current task of the wafer handling device has entered the delivery process to the current delivery point, the current delivery process is terminated and the wafer handling device is controlled to move the wafer cassette to the target delivery point.

[0080] Please refer to Figure 6 In some embodiments, the handling control module includes a handling control unit 2021 and a termination unit 2022. The handling control unit 2021, upon receiving a second command during the target state period, changes the current task's delivery target point from the current delivery point to the target delivery point, obtains the shortest transport path between the current position of the wafer handling device and the target delivery point, and controls the wafer handling device to transport the wafer cassette to the target delivery point based on the shortest transport path. The target state period includes any one of the following state periods: when the wafer handling device is running to a point where the memory is stored... Before the pick-up point of the wafer cassette to be transported; when the wafer handling device runs to the pick-up point where the wafer cassette to be transported is stored; after the wafer handling device retrieves the wafer cassette to be transported from the pick-up point where the wafer cassette to be transported is stored, and before running to the current delivery point; the termination unit 2022 is used to terminate the current delivery process if a second command is obtained after the wafer handling device transports the wafer cassette to the current delivery point, obtain the shortest transportation path between the current delivery point and the target delivery point, and control the wafer handling device to transport the wafer cassette to the target delivery point based on the shortest transportation path.

[0081] In some embodiments, a semiconductor manufacturing material handling system is provided. The semiconductor manufacturing material handling system includes a wafer handling device, an overhead track, and a wafer handling device control system in any of the foregoing embodiments. The overhead track is used to support the movement of the wafer handling device, and the wafer handling device stores and retrieves the wafer cassettes it is handling at the workstations of the corresponding processes. The wafer handling device control system is used to schedule the wafer handling device to complete the transfer of wafer cassettes, so as to minimize the total actual wafer cassette handling time.

[0082] In some embodiments, a computer device is provided, including a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the steps of the wafer handling device control method in any of the above embodiments.

[0083] In some embodiments, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the steps of the wafer handling device control method in any of the above embodiments.

[0084] In some embodiments, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps of the wafer handling device control method in any of the above embodiments.

[0085] The aforementioned wafer handling device control method, system, and semiconductor manufacturing handling system include a wafer handling device control system connected to at least one wafer handling device. After sending a first command to the wafer handling device, the control system receives a second command from the control system while the wafer handling device is responding to the first command and executing its current task of moving a wafer cassette to the current placement point. The second command instructs the control system to move the wafer cassette to a target placement point, which is the ordering machine used during the current task execution. The wafer handling device responds to the second command by: if the current task of the wafer handling device is still... Before entering the delivery process to the current delivery point, the delivery target point of the current task is changed from the current delivery point to the target delivery point. This controls the wafer handling device to directly transport the wafer cassette to the target delivery point, avoiding unnecessary downtime caused by canceling the first command. If the current task of the wafer handling device has already entered the delivery process to the current delivery point, the current delivery process is terminated, and the wafer handling device is controlled to transport the wafer cassette to the target delivery point. This avoids unnecessary handling time caused by delivering to the current delivery point and subsequent re-retrieval, thus effectively improving the overall wafer handling efficiency and reducing the actual handling time.

[0086] Each module in the aforementioned wafer handling device control system can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0087] In one exemplary embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 7As shown, the computer device includes a processor, memory, input / output (I / O) interfaces, and a communication interface. The processor, memory, and I / O interfaces are connected via a system bus, and the communication interface is also connected to the system bus via the I / O interfaces. The processor provides computational and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and a database. The internal memory provides the environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The database stores various handling instructions, etc. The I / O interfaces are used for exchanging information between the processor and external devices. The communication interface is used for communication with external terminals via a network connection. When the computer program is executed by the processor, it implements a wafer handling device control method.

[0088] Those skilled in the art will understand that Figure 7 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0089] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data must comply with relevant regulations.

[0090] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, artificial intelligence (AI) processors, etc., and are not limited to these.

[0091] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0092] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A control method for a wafer handling device, characterized in that, include: During the process of the wafer handling device responding to the first command and executing the current task of moving the wafer cassette to the current delivery point, a second command is obtained. The second command is used to instruct the wafer handling device to move the wafer cassette to the target delivery point, which is the ordering machine during the execution of the current task. In response to the second command: if the current task of the wafer handling device has not yet entered the delivery process to the current delivery point, the delivery target point of the current task is changed from the current delivery point to the target delivery point, so as to control the wafer handling device to move the wafer cassette to the target delivery point; if the current task of the wafer handling device has already entered the delivery process to the current delivery point, the current delivery process is terminated, and the wafer handling device is controlled to move the wafer cassette to the target delivery point.

2. The wafer handling device control method according to claim 1, characterized in that, During the process of the wafer handling device performing its current task and moving the wafer cassette to the current delivery point, it receives a second command, including: If the second command is obtained before the wafer handling device reaches the pickup point where the wafer cassette to be handled is stored, or when it reaches the pickup point, the delivery target point of the current task is changed from the current delivery point to the target delivery point. Obtain the shortest transport path between the current position of the wafer handling device and the target delivery point; Based on the shortest transport path, the wafer handling device is controlled to transport the wafer box to the target delivery point.

3. The wafer handling device control method according to claim 1, characterized in that, During the process of the wafer handling device performing its current task and moving the wafer cassette to the current delivery point, it receives a second command, including: If the second command is obtained after the wafer handling device retrieves the wafer cassette from the pickup point where the wafer cassette is stored, and before it reaches the current delivery point, then the delivery target point of the current task is changed from the current delivery point to the target delivery point. Obtain the shortest transport path between the current position of the wafer handling device and the target delivery point; Based on the shortest transport path, the wafer handling device is controlled to transport the wafer box to the target delivery point.

4. The wafer handling device control method according to claim 1, characterized in that, During the process of the wafer handling device performing its current task and moving the wafer cassette to the current delivery point, it receives a second command, including: If the second command is received after the wafer handling device has moved the wafer cassette to the current delivery point, the current delivery process is terminated. Obtain the shortest transportation path between the current delivery point and the target delivery point; Based on the shortest transport path, the wafer handling device is controlled to transport the wafer box to the target delivery point.

5. The wafer handling device control method according to any one of claims 1-4, characterized in that, The current delivery point includes a machine or storage location.

6. The wafer handling device control method according to any one of claims 1-4, characterized in that, The current delivery point is the storage location, and the first command is used to instruct the wafer handling device to move the wafer cassette to the adjacent storage location of the target machine. The first command is acquired during the process of the wafer handling device performing inter-machine transport tasks and transporting wafer cassettes to the target machine. The wafer handling device responds to the first command and performs the current task of moving the wafer cassette to the storage location.

7. The wafer handling device control method according to any one of claims 1-4, characterized in that, Changing the delivery target point of the current task from the current delivery point to the target delivery point includes: Replace the code of the current task's delivery target point with the code of the target delivery point.

8. A control system for a wafer handling device, characterized in that, Connected to at least one wafer handling device; the wafer handling device control system includes: A receiving module is used to receive a first command or a second command; the first command is used to instruct the wafer handling device to perform the current task and move the wafer cassette to the current delivery point; the second command is used to instruct the wafer handling device to move the wafer cassette to the target delivery point, the target delivery point being the ordering machine during the execution of the current task. The handling control module is used to, in response to a first command, execute the current task of moving a wafer cassette to the current placement point, and, in response to a second command, change the placement target point of the current task from the current placement point to the target placement point if the current task of the wafer handling device has not yet entered the placement process to the current placement point, thereby controlling the wafer handling device to move the wafer cassette to the target placement point; if the current task of the wafer handling device has already entered the placement process to the current placement point, terminate the current placement process and control the wafer handling device to move the wafer cassette to the target placement point.

9. The wafer handling device control system according to claim 8, characterized in that, The transport control module includes: A handling control unit is configured to, upon receiving the second command during a target state period, change the current task's delivery target point from the current delivery point to the target delivery point, obtain the shortest transport path between the current position of the wafer handling device and the target delivery point, and control the wafer handling device to transport the wafer cassette to the target delivery point based on the shortest transport path; wherein the target state period includes any one of the following state periods: before the wafer handling device reaches the pickup point storing the wafer cassette to be transported; when the wafer handling device reaches the pickup point storing the wafer cassette to be transported; after the wafer handling device retrieves the wafer cassette to be transported from the pickup point storing the wafer cassette to be transported, and before reaching the current delivery point; and The termination unit is configured to terminate the current delivery process if the second command is received after the wafer handling device has moved the wafer cassette to the current delivery point, obtain the shortest transportation path between the current delivery point and the target delivery point, and control the wafer handling device to move the wafer cassette to the target delivery point based on the shortest transportation path.

10. A semiconductor manufacturing handling system, characterized in that, include: Wafer handling equipment; An overhead track supports the movement of the wafer handling device, which stores and retrieves the wafer cassettes it is handling at the corresponding process station; and The wafer handling device control system as described in claim 9 or 10; The wafer handling device control system is used to schedule the wafer handling device to complete the transfer of wafer cassettes, so as to minimize the total actual wafer cassette handling time.

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