Battery pack and vehicle

Abstract

The invention provides a battery pack and a carrying tool, and relates to the technical field of battery thermal management, the battery pack specifically comprises a battery module, a shell, a semiconductor refrigeration device and a forced convection fan, the semiconductor refrigeration device comprises a semiconductor refrigeration module, the semiconductor refrigeration module is provided with a first heat exchange surface and a second heat exchange surface which are opposite to each other, the first heat exchange surface is further configured to face the battery module, and the second heat exchange surface is further configured to deviate from the battery module; the forced convection fan is arranged on the side wall in the shell and is configured to form directional circulating airflow in the shell. Compared with the prior art, the battery module has the advantages that the structure is simple, the assembly difficulty is low, a complicated pipeline for direct liquid cooling is avoided, the forced convection fan is used for carrying out forced convection on air in the shell, the cooling / heating efficiency is improved, meanwhile, the local temperature difference is reduced, and the temperature distribution of the battery module is more uniform.

Description

Technical Field

[0001] This invention relates to the field of battery thermal management technology, and more specifically, to a battery pack and a vehicle. Background Technology

[0002] Battery thermal management is crucial in high-power applications such as power batteries for new energy vehicles, energy storage battery packs, and electric two-wheelers. Battery thermal management typically focuses on heat dissipation, with current main methods including liquid cooling systems, air cooling systems, and TEC (Thermoelectric Cooler) systems. Liquid cooling systems circulate coolant through pipes to remove heat, offering high efficiency, but require components such as water pumps, pipes, and heat exchangers, resulting in complex structures, heavy weight, and the risk of leakage, leading to high maintenance costs. Air cooling systems rely solely on forced convection via fans, depending on ambient temperature. Their heat dissipation capacity drops sharply in high-temperature environments (such as inside a car in summer), and they cannot actively cool the battery. Furthermore, in situations requiring high battery casing sealing, direct air cooling of the battery interior is impossible, resulting in poor heat dissipation. In conventional TEC cooling systems, the TEC is not positioned close to the heat source, leading to a long heat transfer path, low and uneven cooling efficiency, and significant localized temperature differences within the battery.

[0003] Furthermore, existing heat dissipation systems can only achieve "cooling" and cannot solve the problem of sudden drop in charging and discharging efficiency and capacity decay in battery environments with low temperatures (≤0℃). Therefore, additional heating devices (such as PTC heaters) are usually required, which undoubtedly increases the complexity of the system. Summary of the Invention

[0004] The purpose of this invention is to provide a battery pack and a vehicle that have a simple structure, are easy to assemble, and have high cooling / heating efficiency, effectively reducing local temperature differences and improving the heat dissipation / heating effect on the battery.

[0005] In a first aspect, the present invention provides a battery pack, comprising: Battery module; The housing is configured to accommodate the battery module; At least one semiconductor cooling device, the semiconductor cooling device including a semiconductor cooling module connected to the housing and having opposing first heat exchange surfaces and second heat exchange surfaces, one of the first heat exchange surfaces and the second heat exchange surface being configured to absorb heat and the other being configured to release heat, and the first heat exchange surface being configured to face the battery module and the second heat exchange surface being configured to face away from the battery module. At least one forced convection fan is disposed within the housing and configured to generate a circulating airflow within the housing.

[0006] In an optional embodiment, the semiconductor cooling device further includes a first heat exchanger and a second heat exchanger. The first heat exchanger is located inside the housing and thermally bonded to the first heat exchange surface, and is configured to achieve heat transfer between the airflow inside the housing and the first heat exchange surface. The second heat exchanger is located outside the housing and thermally bonded to the second heat exchange surface, and is configured to achieve heat transfer between the airflow outside the housing and the second heat exchange surface. The forced convection fan is located on the air inlet side and / or air outlet side of the first heat exchanger.

[0007] In an optional embodiment, the first heat exchange surface is provided with a first thermally conductive layer, and the first heat exchanger is attached to the first heat exchange surface through the first thermally conductive layer. The second heat exchange surface is provided with a second heat-conducting layer, and the second heat exchanger is attached to the second heat exchange surface through the second heat-conducting layer.

[0008] In an optional embodiment, the second heat exchanger is integrally disposed on the housing and attached to the second heat exchange surface, the semiconductor refrigeration module and the first heat exchanger are disposed inside the housing, and the first heat exchanger is attached to the first heat exchange surface.

[0009] In an optional embodiment, the first heat exchanger includes a first heat collection plate and a plurality of first heat dissipation teeth. The middle part of one side surface of the first heat collection plate is attached to the first heat exchange surface, and the plurality of first heat dissipation teeth are spaced apart on the other side surface of the first heat collection plate and protrude in a direction away from the first heat exchange surface. The second heat exchanger includes a second heat collection plate and a plurality of second heat dissipation teeth. The second heat collection plate is integrally disposed on the housing, and one side surface of the second heat collection plate is attached to the second heat exchange surface. The plurality of second heat dissipation teeth are spaced apart on the other side surface of the second heat collection plate and protrude in a direction away from the second heat exchange surface.

[0010] In an optional embodiment, the forced convection fan is provided on both the air inlet and air outlet sides of the first heat exchanger. The forced convection fan is installed on opposite side walls inside the housing and is configured to correspond to the middle of the side wall of the battery module.

[0011] In an optional embodiment, the battery pack further includes a liquid cooling plate connected to the second heat exchanger.

[0012] In an optional embodiment, the second heat exchanger is thermally bonded to the inner wall of the housing, and the first heat exchanger surface is configured to adhere to the battery module.

[0013] In an optional embodiment, the inner wall of the housing is further provided with a heat insulation layer, and the semiconductor cooling module is embedded in the heat insulation layer.

[0014] In an optional embodiment, the battery pack further includes a temperature control device that is electrically connected to both the semiconductor cooling device and the forced convection fan, and is configured to control the output power of the semiconductor cooling device and the rotational speed of the forced convection fan based on the cell temperature of the battery module and / or the ambient temperature inside the housing.

[0015] In an optional embodiment, the temperature control device includes a cell temperature sensor, an ambient temperature sensor, and a controller. Both the cell temperature sensor and the ambient temperature sensor are electrically connected to the controller. The cell temperature sensor is configured to be disposed on the battery module to detect the cell temperature of the battery module. The ambient temperature sensor is disposed on the side wall inside the housing and is configured to detect the ambient temperature inside the housing. The controller is electrically connected to the semiconductor cooling device and the forced convection fan.

[0016] In a second aspect, the present invention provides a vehicle comprising a battery pack as described in any of the foregoing embodiments.

[0017] The beneficial effects of the embodiments of the present invention include: The battery pack and vehicle provided in this embodiment of the invention connect a semiconductor cooling module to a housing. The first heat exchange surface of the semiconductor cooling module faces the battery module, exchanging heat with the airflow inside the housing. The second heat exchange surface faces away from the battery module, exchanging heat with the airflow outside the housing. A forced convection fan is installed on the side wall inside the housing, creating a directional circulating airflow within the housing. This directional circulating airflow forces the gas in the battery module to flow towards the first heat exchange surface, thereby ensuring sufficient heat exchange between the first heat exchange surface and the battery module.

[0018] In practical use, when cooling the battery module is required, the current direction of the semiconductor cooling module can be controlled to allow the first heat exchange surface to absorb heat and the second heat exchange surface to release heat. Simultaneously, a forced convection fan can be activated. The heat generated by the battery module turns the gas within it into hot air. This hot air, under the action of the forced convection fan, flows towards the first heat exchange surface with the directional circulating airflow, exchanging heat with it and thus dissipating heat from the battery module. After the first heat exchange surface absorbs heat, the second heat exchange surface releases the heat, exchanging heat with the airflow outside the casing.

[0019] When the battery module needs to be heated, the current direction of the semiconductor cooling module can be changed, causing the first heat exchange surface to release heat and the second heat exchange surface to absorb the released heat. Meanwhile, the cool air around the battery module flows towards the first heat exchange surface under the action of a forced convection fan, exchanging heat with it. The resulting hot air can then return to the battery module, thus heating it. Simultaneously, the second heat exchange surface absorbs heat from the airflow outside the casing, which is then released by the first heat exchange surface, exchanging heat with the airflow outside the casing.

[0020] Compared to existing technologies, the battery pack and vehicle provided in this invention achieve heat exchange between the interior and exterior of the housing through a first heat exchange surface of a semiconductor cooling module and a second heat exchange surface, thereby cooling or heating the battery module. The semiconductor cooling module is located close to the battery module, and the first heat exchange surface faces the battery module, effectively reducing the heat transfer path and improving cooling / heating efficiency. Furthermore, the structure is simple and easy to assemble, avoiding the complex piping of direct liquid cooling. Forced convection fans further enhance cooling / heating efficiency while reducing local temperature differences, resulting in a more uniform temperature distribution within the battery module. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A partial structural schematic diagram of the battery pack provided in an embodiment of the present invention from a first perspective; Figure 2 A partially exploded view of the battery pack provided in an embodiment of the present invention from a second perspective. Figures 3 to 5 The diagram shows the overall structure of the battery pack provided in the embodiment of the present invention from different perspectives. Figure 6 for Figure 4 Schematic diagram of the cross-sectional structure at point AA; Figure 7 for Figure 4 Schematic diagram of the cross-sectional structure at point BB; Figure 8 for Figure 5 Schematic diagram of the cross-sectional structure at point C; Figure 9This is a schematic diagram of the internal structure of a battery pack provided in an embodiment of the present invention.

[0023] Icons: 100-Battery pack; 110-Housing; 111-Insulation layer; 120-Semiconductor cooling device; 130-Forced convection fan; 140-Semiconductor cooling module; 141-First heat exchange surface; 142-Second heat exchange surface; 143-Heat exchange channel; 144-First thermal conductive layer; 145-Second thermal conductive layer; 150-First heat exchanger; 160-Second heat exchanger; 170-Temperature control device; 171-Cell temperature sensor; 172-Ambient temperature sensor; 173-Controller; 180-Battery module. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0026] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0027] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0028] Furthermore, the terms "first" and "second" are configured only for distinguishing descriptions and should not be interpreted as indicating or implying relative importance.

[0029] As disclosed in the background section, existing technologies for battery thermal management typically focus solely on how to dissipate heat from the battery. Currently, the main heat dissipation methods are passive and active cooling. Traditional passive cooling (such as natural convection cooling and heat sink cooling) is highly dependent on ambient temperature and has low heat dissipation efficiency. Under high-power charging and discharging or high-temperature environments, it cannot dissipate the heat from the battery cells in a timely manner, which can easily cause the internal temperature of the battery pack to exceed the safety threshold (usually ≥50℃), leading to capacity decay and thermal runaway risks.

[0030] Conventional active cooling technologies typically include liquid cooling, air cooling, and TEC (Electronic Temperature Coefficient) cooling. Liquid cooling systems circulate coolant through pipes to remove heat, offering high efficiency, but require components such as water pumps, pipes, and heat exchangers, resulting in complex structures, heavy weight, and the risk of leakage, leading to high maintenance costs. Traditional air cooling systems rely solely on forced convection via fans, depending on ambient temperature. Their cooling capacity drops drastically in high-temperature environments (such as inside a car during summer), rendering them ineffective for active cooling. In single TEC cooling solutions, the TEC is often externally located outside the battery pack, away from heat sources, resulting in long heat transfer paths and a lack of internal airflow optimization, leading to low cooling efficiency and large local temperature differences (temperature differences between cells can exceed 5°C). Furthermore, conventional TEC cooling solutions struggle to remove heat from the hot end in a timely manner and are prone to backflow, affecting cooling performance and efficiency.

[0031] Furthermore, existing heat dissipation systems can usually only achieve "cooling" and cannot solve the problem of sudden drop in charging and discharging efficiency and capacity decay of batteries at low temperatures (≤0℃). Additional heating devices (such as PTC heaters) are required, which increases the complexity of the system.

[0032] To address the aforementioned problems, embodiments of the present invention provide a battery pack and a vehicle. It should be noted that, without conflict, the features in the embodiments of the present invention can be combined with each other.

[0033] See Figures 1 to 9 This invention provides a battery pack 100 with a simple structure, low assembly difficulty, and high cooling / heating efficiency, which effectively reduces local temperature differences and provides better heat dissipation / heating effect for the battery.

[0034] See also Figure 1 and Figure 2The battery pack 100 provided in this embodiment of the invention includes a battery module 180, a housing 110, at least one semiconductor cooling device 120, and at least one forced convection fan 130. The housing 110 is configured to house the battery module 180. The semiconductor cooling device 120 includes a semiconductor cooling module 140 connected to the housing 110 and having opposing first heat exchange surfaces 141 and 142. One of the first heat exchange surfaces 141 and 142 is configured to absorb heat, and the other is configured to release heat. The first heat exchange surface 141 is also configured to face the battery module 180 and exchange heat with the airflow inside the housing 110. The second heat exchange surface 142 is also configured to face away from the battery module 180 and exchange heat with the airflow outside the housing 110. The forced convection fan 130 is disposed on the side wall inside the housing 110 and is configured to form a directional circulating airflow inside the housing 110 to force the gas in the battery module 180 to flow toward the first heat exchange surface 141.

[0035] It should be noted that in this embodiment, the housing 110 is a sealed structure, which meets the waterproof requirements. The battery module 180 can be fixedly installed inside the housing 110 by a bracket or support pad. The thermoelectric cooling module 140 can be a thermoelectric cooler (TEC), model TEC1-12706, with a power of 60W and an operating voltage of 12V. The first heat exchange surface 141 and the second heat exchange surface 142 of the thermoelectric cooling module 140 can serve as the hot end and the cold end, respectively, and can be switched by changing the direction of the current.

[0036] In practical use, when cooling of the battery module 180 is required, the current direction of the semiconductor cooling module 140 can be controlled to allow the first heat exchange surface 141 to absorb heat and the second heat exchange surface 142 to release heat. Simultaneously, the forced convection fan 130 can be activated. The heat generated by the battery module 180 turns the gas within it into hot air. This hot air, under the action of the forced convection fan 130, flows towards the first heat exchange surface 141 with the directional circulating airflow, exchanging heat with the first heat exchange surface 141, thereby achieving heat dissipation for the battery module 180. After the first heat exchange surface 141 absorbs heat, the second heat exchange surface 142 releases the heat, exchanging heat with the airflow outside the housing 110.

[0037] When the battery module 180 needs to be heated, the current direction of the semiconductor cooling module 140 can be changed, causing the first heat exchange surface 141 to release heat and the second heat exchange surface to absorb the released heat. Meanwhile, the cold air around the battery module 180 flows towards the first heat exchange surface 141 under the action of the forced convection fan 130, and exchanges heat with the first heat exchange surface 141. The hot air formed after the heat exchange can then return to the battery module 180, thus heating the battery module 180. At the same time, after the second heat exchange surface 142 absorbs the heat from the airflow outside the housing 110, the heat is released by the first heat exchange surface 141 and exchanges heat with the airflow outside the housing 110.

[0038] It is worth noting that in this embodiment, the semiconductor cooling module 140 can be disposed inside the housing 110, such that both the first heat exchange surface 141 and the second heat exchange surface 142 are located inside the housing 110, with the second heat exchange surface 142 adhering to the inner wall of the housing 110. This allows the first heat exchange surface 141 to be closer to the battery module 180, further shortening the heat transfer path. At this time, under the action of the forced convection fan 130, the gas in the battery module 180 is forced to flow toward the first heat exchange surface 141. Of course, in other preferred embodiments of the present invention, the semiconductor cooling module 140 can also be disposed outside the housing 110, such that both the first heat exchange surface 141 and the second heat exchange surface 142 are located outside the housing 110, with the first heat exchange surface 141 adhering to the outer surface of the housing 110. In this case, under the action of the forced convection fan 130, the gas in the battery module 180 flows inside the housing, causing the first heat exchange surface 141 to exchange heat with the housing 110, and further exchange heat with the gas inside the housing 110. Alternatively, in other preferred embodiments of the present invention, the semiconductor cooling module 140 may also be embedded in the housing 110, with an opening correspondingly provided on the housing 110, and the semiconductor cooling module 140 is embedded in the opening, such that the first heat exchange surface 141 is located inside the housing 110 and the second heat exchange surface 142 is located outside the housing 110.

[0039] In some embodiments, there are multiple semiconductor cooling devices 120, which are correspondingly disposed on multiple sidewalls of the housing 110. Specifically, the housing 110 may be rectangular, and there may be four semiconductor cooling devices 120, which are correspondingly disposed on the four sidewalls of the housing 110 and surround the battery module 180. The forced convection fan 130 may be disposed on the remaining two sidewalls of the housing 110, that is, the forced convection fan 130 is disposed on the sidewall of the housing 110 adjacent to the semiconductor cooling devices 120.

[0040] See also Figure 1 , Figure 2 and Figure 7In some embodiments, the semiconductor cooling device 120 further includes a first heat exchanger 150 and a second heat exchanger 160. The first heat exchanger 150 is located inside the housing 110 and thermally bonded to a first heat exchange surface 141, and is configured to achieve heat transfer between the airflow inside the housing 110 and the first heat exchange surface 141. The second heat exchanger 160 is located outside the housing 110 and thermally bonded to a second heat exchange surface 142, and is configured to achieve heat transfer between the airflow outside the housing 110 and the second heat exchange surface 142. A forced convection fan 130 is located on the air inlet side and / or air outlet side of the first heat exchanger 150.

[0041] Specifically, a certain gap exists between the first heat exchange surface 141 and the battery module 180, forming a heat exchange channel 143. The first heat exchanger 150 is located within this heat exchange channel 143. Gas in the battery module 180 can flow to the heat exchange channel 143 under the action of the forced convection fan 130, achieving heat exchange with the first heat exchanger 150, and then circulating back into the battery module 180 to complete the heat dissipation or heating of the battery module 180. The second heat exchanger 160 can be located outside the housing 110, thereby directly exchanging heat with the external airflow of the housing 110, quickly removing heat from the second heat exchange surface 142 or quickly transferring external heat to the second heat exchange surface 142.

[0042] It should be noted that the thermal bonding mentioned in the embodiments of the present invention refers to the direct or indirect bonding of the two parts, which enables the transfer of heat.

[0043] See also Figure 2 In some embodiments, a first heat exchange surface 141 is provided with a first thermally conductive layer 144, and a first heat exchanger 150 is attached to the first heat exchange surface 141 through the first thermally conductive layer 144; a second heat exchange surface 142 is provided with a second thermally conductive layer 145, and a second heat exchanger 160 is attached to the second heat exchange surface 142 through the second thermally conductive layer 145. Specifically, both the first thermally conductive layer 144 and the second thermally conductive layer 145 include a thermally conductive silicone grease layer or a graphene thermally conductive layer. Preferably, both the first thermally conductive layer 144 and the second thermally conductive layer 145 are thermally conductive silicone grease layers with a thermal conductivity ≥3 W / (m·K) and a thickness between 0.3-0.8 mm, preferably 0.5 mm, which can improve thermal conductivity.

[0044] In some embodiments, the second heat exchanger 160 is integrally disposed on the housing 110 and attached to the second heat exchange surface 142. The semiconductor refrigeration module 140 and the first heat exchanger 150 are disposed within the housing 110, with the first heat exchanger 150 attached to the first heat exchange surface 141. Specifically, the second heat exchanger 160 is integrated onto the housing 110, enabling direct attachment between the second heat exchanger 160 and the second heat exchange surface 142, thereby eliminating contact thermal resistance and improving thermal conductivity.

[0045] Of course, in other preferred embodiments of the present invention, the second heat exchanger 160 can also be set separately and located outside the housing 110. In this case, the second heat exchanger 160 is attached to the outer wall of the housing 110, and the second heat exchange surface 142 is attached to the inner wall of the housing 110. By indirectly attaching with the housing 110, heat transfer can also be achieved.

[0046] See Figures 3 to 9 In some embodiments, the first heat exchanger 150 is a finned radiator or a microchannel radiator. The second heat exchanger 160 is a toothed radiator or a finned composite radiator. Preferably, the first heat exchanger 150 can be an aluminum finned heat exchanger, and the second heat exchanger 160 can be a toothed radiator. The specific types of the first heat exchanger 150 and the second heat exchanger 160 are not specifically limited here.

[0047] In some embodiments, the first heat exchanger 150 includes a first heat-collecting plate and a plurality of first heat-dissipating teeth. The middle portion of one side surface of the first heat-collecting plate is attached to a first heat exchange surface 141. The plurality of first heat-dissipating teeth are spaced apart on the other side surface of the first heat-collecting plate and protrude in a direction away from the first heat exchange surface 141. The second heat exchanger 160 includes a second heat-collecting plate and a plurality of second heat-dissipating teeth. The second heat-collecting plate is integrally disposed on the housing 110, and one side surface of the second heat-collecting plate is attached to a second heat exchange surface 142. The plurality of second heat-dissipating teeth are spaced apart on the other side surface of the second heat-collecting plate and protrude in a direction away from the second heat exchange surface 142. Specifically, the thickness of the first heat-dissipating teeth is 0.3 mm, the spacing is 2 mm, the thickness of the first heat-collecting plate is 2 mm, the thickness of the second heat-dissipating teeth is 1 mm, the spacing is 1 mm, and the thickness of the second heat-collecting plate is 2 mm. The first heat-collecting plate and the plurality of first heat-dissipating teeth are integrally formed, and the second heat-collecting plate and the plurality of second heat-dissipating teeth are integrally formed, and are made of a metal material with good thermal conductivity, such as copper, aluminum, or other alloy materials. Furthermore, the width of the first heat collector plate is greater than the width of the first heat exchange surface 141, and the width of the second heat collector plate is greater than the width of the second heat exchange surface 142. By designing the first heat collector plate and the second heat collector plate, the heat distribution can be made more uniform while improving the heat conduction efficiency.

[0048] See Figure 7 and Figure 9In some embodiments, forced convection fans 130 are provided on both the air inlet and outlet sides of the first heat exchanger 150. The forced convection fans 130 are installed on opposite side walls inside the housing 110 and are configured to correspond to the middle of the side wall of the battery module 180. Specifically, the forced convection fans 130 can be axial fans or cross-flow fans. Preferably, four 12V DC axial fans with an airflow of 15CFM and a rated speed of 3000rpm are used. They are installed on two opposite side walls inside the housing 110 along the airflow direction Q of the first heat exchanger 150 and correspond to the middle of the side wall of the battery module 180. That is, forced convection fans 130 are provided on both sides of the battery module 180 along the airflow direction Q, and the air outlet directions of the forced convection fans 130 on both sides are the same, so as to form a directional circulating airflow under the guidance of the inner wall of the housing 110.

[0049] It should be noted that the airflow direction Q mentioned in this embodiment refers to the airflow direction of the heat exchange channel 143 between the first heat exchange surface 141 and the battery module 180. This airflow direction Q is opposite to the airflow direction inside the battery module 180. Under the action of the forced convection fan 130, the airflow inside the battery module 180 first passes through the forced convection fan 130 on one side and enters the heat exchange channel 143 to exchange heat with the first heat exchanger 150. Then, it passes through the forced convection fan 130 on the other side and returns to the battery module 180, thus forming a directional circulating airflow. At the same time, the fin direction of the first heat exchanger 150 is parallel to the airflow direction Q, so that the airflow can pass through the first heat exchanger 150 better.

[0050] It is worth noting that the forced convection fan 130 is positioned directly opposite the center of the side wall of the battery module 180, and the width of the forced convection fan 130 is less than the thickness of the battery module 180. This allows the forced convection fan 130 to be offset from the heat exchange channel 143, preventing the airflow direction of the forced convection fan 130 from directly facing the heat exchange channel 143. Furthermore, to ensure the normal airflow of the forced convection fan 130, its fan blades need to maintain a certain distance from both the inner side wall of the housing 110 and the battery module 180. That is, the fan blades are located between the battery module 180 and the inner side wall of the housing 110, and are fixed by a bracket.

[0051] See also Figure 2 and Figure 6In some embodiments, the inner wall of the housing 110 is further provided with a heat insulation layer 111, and the semiconductor cooling module 140 is embedded in the heat insulation layer 111. Specifically, a heat insulation layer 111 can be applied to the inner surface of the housing 110. The heat insulation layer 111 can be an aerogel and can avoid the bonding area of ​​the semiconductor cooling module 140, so that the semiconductor cooling module 140 is embedded in the heat insulation layer 111. The thickness of the heat insulation layer 111 is between 1-3 mm, preferably 2 mm. By providing the heat insulation layer 111, direct temperature exchange between the inner and outer sides of the housing 110 can be isolated, heat diffusion into the housing 110 can be blocked, and interference between the temperature of the housing 110 and the air inside the housing 110 can be avoided.

[0052] See also Figure 6 and Figure 7 In some embodiments, the battery pack 100 further includes a temperature control device 170, which is electrically connected to both the thermoelectric cooler 120 and the forced convection fan 130, and is configured to control the output power of the thermoelectric cooler 120 and the rotation speed of the forced convection fan 130 based on the cell temperature of the battery module 180 and / or the ambient temperature inside the housing 110. Specifically, when at least one of the cell temperature and the ambient temperature meets a set condition, the temperature control device 170 can control the output power of the thermoelectric cooler 120 and the rotation speed of the forced convection fan 130 to achieve temperature control inside the housing 110.

[0053] Furthermore, the temperature control device 170 includes a cell temperature sensor 171, an ambient temperature sensor 172, and a controller 173. Both the cell temperature sensor 171 and the ambient temperature sensor 172 are electrically connected to the controller 173. The cell temperature sensor 171 is configured to be installed on the battery module 180 to detect the cell temperature of the battery module 180. The ambient temperature sensor 172 is installed on the side wall inside the housing 110 and is configured to detect the ambient temperature inside the housing 110. The controller 173 is electrically connected to the semiconductor cooling device 120 and the forced convection fan 130. The temperature control device 170 can be installed inside the housing 110, meaning the controller 173 is installed inside the housing 110, thereby ensuring the waterproof performance of the entire housing 110.

[0054] Specifically, both the cell temperature sensor 171 and the ambient temperature sensor 172 are NTC sensors (accuracy ±0.5℃) or PT1000, and there can be multiple sensors to obtain accurate cell temperature and ambient temperature in real time from multiple locations. For example, there can be six cell temperature sensors 171, attached to the surface of the cell and evenly distributed at different positions in the battery module 180. There can be two ambient temperature sensors 172, set on opposite sidewalls inside the housing 110. The controller 173 can be an MCU microprocessor, such as an STM32F103 MCU. After receiving the sensor signals, the controller 173 outputs a PWM signal according to a preset threshold (such as the normal operating temperature of 25℃-40℃). The controller adjusts the direction of the TEC current (cooling / heating switching) and voltage (0-12V, corresponding to power 0-100%) through the H-bridge circuit, and adjusts the speed of the forced convection fan 130 (500-3000rpm) through the fan driver chip.

[0055] The battery pack 100 has three working modes: high temperature cooling mode, low temperature heating mode, and constant temperature regulation mode.

[0056] High-temperature cooling mode: When the cell temperature sensor 171 detects a cell temperature ≥40℃ or the ambient temperature sensor 172 detects an ambient temperature ≥38℃, the controller 173 activates the TEC positive current (cooling mode). The first heat exchange surface 141 acts as the cold end, absorbing heat from inside the housing 110 through the first heat exchanger 150. At the same time, the forced convection fan 130 is activated to accelerate heat flow, allowing the hot air on the cell surface to quickly diffuse to the first heat exchange surface 141, carrying the cell heat back to the first heat exchanger 150 through the airflow, forming a closed loop of "cooling-heat exchange-heat dissipation". The second heat exchange surface 142 acts as the hot end, and the heat it generates is conducted to the outside of the housing 110 through the second heat exchanger 160.

[0057] For example, in a high-temperature scenario (ambient temperature 35℃, fast charging): the cell temperature first rises to 42℃, and the ambient temperature rises to 40℃, at which point the sensor triggers a high-temperature signal. Then, the controller 173 can activate the TEC forward current (12V, full power), and the temperature of the first heat exchange surface 141, acting as the cold end, can be reduced to 15℃. Simultaneously, the controller 173 controls the forced convection fan 130 to operate at high speed (3000rpm). Under the action of the airflow, the cold air that has exchanged heat with the first heat exchanger 150 will diffuse to the cell surface, while the hot air on the cell surface will diffuse to the first heat exchanger 150. This can reduce the cell temperature to 38℃ within 3 minutes, while the ambient temperature drops to 36℃. After the temperature stabilizes, the TEC power can be reduced to 50% (6V), and the speed of the forced convection fan 130 can be reduced to 2000rpm, maintaining a temperature fluctuation of ≤1℃.

[0058] Low temperature heating mode: When the cell temperature is ≤10℃ or the ambient temperature is ≤5℃, the controller 173 starts the TEC reverse current (heating mode). The first heat exchange surface 141 serves as the hot end and releases heat to the inside of the housing 110 through the first heat exchanger 150. At this time, the forced convection fan 130 can run at low speed to evenly transfer heat to the cell and improve battery activity.

[0059] For example, in a low-temperature environment (ambient temperature -10°C before startup), the battery cell temperature is first detected to be -8°C, and the ambient temperature is -9°C, triggering a low-temperature signal from the sensor. Then, the controller 173 activates the TEC reverse current (heating mode, 12V), raising the temperature of the first heat exchange surface 141 to 30°C. The controller 173 then controls the forced convection fan 130 to run at low speed (1000rpm), raising the battery cell temperature to 12°C within 10 minutes, meeting the startup requirements. After startup, the system can switch to a constant-temperature mode, reducing the TEC power to 30% to maintain the battery cell temperature at 15°C-20°C.

[0060] Constant temperature regulation mode: When the temperature is in the range of 10℃-40℃, the controller 173 dynamically adjusts the TEC power (e.g. 30%~70%) and the speed of the forced convection fan 130 (e.g. 1000~3000rpm) according to the real-time temperature to maintain the temperature fluctuation inside the battery pack ≤±2℃.

[0061] In some embodiments, the battery pack 100 further includes a liquid cooling plate (not shown), which is connected to a second heat exchanger 160. Specifically, for heat dissipation of high-power energy storage battery packs, eight semiconductor cooling devices 120, i.e., eight TEC1-12710 chips (100W / chip), can be used. Meanwhile, the first heat exchanger 150 is a microchannel heat exchanger (with built-in microchannels to enhance airflow turbulence). Furthermore, the second heat exchanger 160, with liquid cooling assistance, can be connected to a small liquid cooling plate, and a water pump can transfer heat to an external cooling tower, significantly improving heat dissipation capacity, suitable for energy storage battery packs of 1MWh or higher.

[0062] In some embodiments, the second heat exchanger is thermally bonded to the inner sidewall of the housing 110, and the first heat exchange surface 141 is configured to adhere to the battery module 180. Specifically, for small battery packs (such as drone battery packs), this can eliminate the need for the first heat exchanger 150 and the second heat exchanger 160, and utilize a single semiconductor cooling device 120 (monolithic TEC1-12703, 30W cooling capacity). The first heat exchange surface 141 can be directly adhered to the battery module 180, which can be a single-cell or multi-cell structure, allowing the first heat exchange surface 141 to directly contact the cell surface, while the second heat exchange surface 142 can be guided to the housing 110 via a graphene film. In this case, the forced convection fan 130 can be a miniature centrifugal fan (5 CFM) to accommodate installation in confined spaces.

[0063] It should be noted that the battery pack 100 in this embodiment can be a power battery or an energy storage battery, and the application scenario of the battery pack 100 is not limited. The battery module 180 is composed of multiple cells and a bracket, wherein there is a certain gap between the cells, and the bracket has openings on both sides facing the forced convection fan 130, so that the airflow inside the battery module 180 can flow to the heat exchange channel 143 under the action of the forced convection fan 130 and form a directional circulating airflow.

[0064] This invention also provides a vehicle comprising the aforementioned battery pack 100, which includes a battery module 180, a housing 110, at least one semiconductor cooling device 120, and at least one forced convection fan 130. The housing 110 is configured to house the battery module 180. The semiconductor cooling device 120 includes a semiconductor cooling module 140 connected to the housing 110 and having opposing first heat exchange surfaces 141 and 142. One of the first and second heat exchange surfaces 141 and 142 is configured to absorb heat, and the other is configured to release heat. The first heat exchange surface 141 exchanges heat with the airflow inside the housing 110, and the second heat exchange surface 142 exchanges heat with the airflow outside the housing 110. The forced convection fan 130 is disposed on the side wall inside the housing 110 and configured to form a directional circulating airflow within the housing 110, thereby forcing the gas in the battery module 180 to flow toward the first heat exchange surface 141. The first heat exchange surface 141 faces the battery module 180, and the second heat exchange surface 142 faces away from the battery module 180.

[0065] It should be noted that the vehicle can be an electric car or an electric two-wheeler, which also includes a frame. The battery pack 100 is located at the chassis of the frame. For details on the specific structure of the electric car and the installation position of the battery pack 100, please refer to existing electric vehicles.

[0066] In summary, the battery pack 100 and vehicle provided in this embodiment of the invention connect the semiconductor cooling module 140 to the housing 110. The first heat exchange surface 141 of the semiconductor cooling module 140 faces the battery module 180 and exchanges heat with the airflow inside the housing 110. The second heat exchange surface 142 faces away from the battery module 180 and exchanges heat with the airflow outside the housing 110. The forced convection fan 130 is disposed on the side wall inside the housing 110, which can form a directional circulating airflow within the housing 110. This directional circulating airflow forces the gas in the battery module 180 to flow towards the first heat exchange surface 141, thereby enabling the first heat exchange surface 141 to fully exchange heat with the battery module 180. In actual use, when cooling the battery module 180 is required, the current direction of the semiconductor cooling module 140 can be controlled so that the first heat exchange surface 141 absorbs heat and the second heat exchange surface 142 releases heat. Simultaneously, the forced convection fan 130 can be activated. The heat generated by the battery module 180 turns the gas inside the battery module 180 into hot air. Under the action of the forced convection fan 130, this hot air flows towards the first heat exchange surface 141 with the directional circulating airflow and exchanges heat with the first heat exchange surface 141, thereby dissipating heat from the battery module 180. After the first heat exchange surface 141 absorbs heat, the second heat exchange surface 142 releases the heat and exchanges heat with the airflow outside the housing 110. When it is necessary to heat the battery module 180, the current direction of the semiconductor cooling module 140 can be changed, causing the first heat exchange surface 141 to release heat, the second heat exchange surface to absorb and release heat, and the cold air around the battery module 180 to flow towards the first heat exchange surface 141 with the directional circulating airflow under the action of the forced convection fan 130 and exchange heat with the first heat exchange surface 141. The hot air formed after the heat exchange can then return to the battery module 180, thereby heating the battery module 180. Meanwhile, after the second heat exchange surface 142 absorbs the heat from the airflow outside the housing 110, the heat is released by the first heat exchange surface 141 and heat exchange is achieved with the airflow outside the housing 110.

[0067] Compared to existing technologies, the battery pack 100 and vehicle provided in this embodiment of the invention achieve heat exchange between the inside of the housing 110 and the outside of the housing 110 through the first heat exchange surface 141 of the semiconductor cooling module 140, and heat exchange between the outside of the housing 110 and the outside of the housing 110 through the second heat exchange surface 142. This achieves cooling or heating of the battery module 180. The semiconductor cooling module 140 is close to the battery module 180, and the first heat exchange surface 141 faces the battery module 180, which can effectively reduce the heat transfer path and improve cooling / heating efficiency. At the same time, the structure is simple and the assembly difficulty is low, avoiding the complex piping of direct liquid cooling. Furthermore, the forced convection fan 130 is used to force convection of air inside the housing 110, which improves cooling / heating efficiency while reducing local temperature differences, resulting in a more uniform temperature distribution in the battery module 180.

[0068] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A battery pack, characterized in that, include: Battery module (180); The housing (110) is configured to accommodate the battery module (180). At least one semiconductor cooling device (120) includes a semiconductor cooling module (140) connected to the housing (110) and having opposing first heat exchange surface (141) and second heat exchange surface (142), one of the first heat exchange surface (141) and the second heat exchange surface (142) being configured to absorb heat and the other being configured to release heat, and the first heat exchange surface (141) being configured to face the battery module (180) and the second heat exchange surface (142) being configured to face away from the battery module (180). At least one forced convection fan (130) is disposed within the housing (110) and configured to form a circulating airflow within the housing (110).

2. The battery pack according to claim 1, characterized in that, The semiconductor cooling device (120) further includes a first heat exchanger (150) and a second heat exchanger (160). The first heat exchanger (150) is located inside the housing (110) and thermally bonded to the first heat exchange surface (141), and is configured to achieve heat transfer between the airflow inside the housing (110) and the first heat exchange surface (141). The second heat exchanger (160) is located outside the housing (110) and thermally bonded to the second heat exchange surface (142), and is configured to achieve heat transfer between the airflow outside the housing (110) and the second heat exchange surface (142). The forced convection fan (130) is located on the air inlet side and / or air outlet side of the first heat exchanger (150).

3. The battery pack according to claim 2, characterized in that, The first heat exchange surface (141) is provided with a first heat-conducting layer (144), and the first heat exchanger (150) is thermally bonded to the first heat exchange surface (141) through the first heat-conducting layer (144). The second heat exchange surface (142) is provided with a second heat-conducting layer (145), and the second heat exchanger (160) is thermally bonded to the second heat exchange surface (142) through the second heat-conducting layer (145).

4. The battery pack according to claim 2, characterized in that, The second heat exchanger (160) is integrally disposed on the housing (110) and attached to the second heat exchange surface (142). The semiconductor refrigeration module (140) and the first heat exchanger (150) are disposed inside the housing (110), and the first heat exchanger (150) is attached to the first heat exchange surface (141).

5. The battery pack according to claim 2, characterized in that, The first heat exchanger (150) is provided with a forced convection fan (130) on both the air inlet side and the air outlet side. The forced convection fan (130) is installed on the opposite side wall inside the housing (110) and is configured to correspond to the middle of the side wall of the battery module (180).

6. The battery pack according to claim 2, characterized in that, The battery pack also includes a liquid cooling plate connected to the second heat exchanger (160).

7. The battery pack according to claim 1, characterized in that, The second heat exchanger is thermally bonded to the inner wall of the housing (110), and the first heat exchanger surface (141) is configured to adhere to the battery module (180).

8. The battery pack according to claim 1, characterized in that, The inner wall of the housing (110) is also provided with a heat insulation layer (111), and the semiconductor cooling module (140) is embedded in the heat insulation layer (111).

9. The battery pack according to any one of claims 1-8, characterized in that, The battery pack also includes a temperature control device (170), which is electrically connected to both the semiconductor cooling device (120) and the forced convection fan (130), and is configured to control the output power of the semiconductor cooling device (120) and the rotation speed of the forced convection fan (130) based on the cell temperature of the battery module (180) and / or the ambient temperature inside the housing (110).

10. The battery pack according to claim 9, characterized in that, The temperature control device (170) includes a cell temperature sensor (171), an ambient temperature sensor (172), and a controller (173). The cell temperature sensor (171) and the ambient temperature sensor (172) are both electrically connected to the controller (173). The cell temperature sensor (171) is disposed on the battery module (180) and is configured to detect the cell temperature of the battery module (180). The ambient temperature sensor (172) is disposed on the side wall inside the housing (110) and is configured to detect the ambient temperature inside the housing (110). The controller (173) is electrically connected to the semiconductor cooling device (120) and the forced convection fan (130).

11. A vehicle, characterized in that, Includes the battery pack as described in any one of claims 1-10.

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