Phased array system heat dissipation structure based on fan-out packaging and working method

Abstract

The embodiment of the invention provides a phased array system heat dissipation structure based on fan-out packaging and a working method. The heat dissipation structure comprises a fan-out packaged radio frequency chip and antenna array, a high-temperature co-fired ceramic substrate, a printed circuit board, a radio frequency feed network, a control and power supply network, a metal piece, a radio frequency interface and a power module. Wherein the fan-out packaged radio frequency chip and the antenna array are welded on the upper surface of the high-temperature co-fired ceramic substrate; the high-temperature co-fired ceramic substrate and the printed circuit board are respectively welded and fixed on the upper surface of the metal piece; the radio frequency feed network and the control and power supply network are embedded in the high-temperature co-fired ceramic substrate and the printed circuit board; the radio frequency interface and the power supply module penetrate through the metal piece and are welded to the lower surface of the printed circuit board.

Description

Technical Field

[0001] The embodiments disclosed herein belong to the field of phased array antenna technology, specifically relating to a heat dissipation structure and working method for a phased array system based on fan-out packaging. Background Technology

[0002] In the current technological advancements, phased array systems are continuously moving towards miniaturization and weight reduction, with some components employing Fanout packaging technology. While this packaging enhances integration, allowing multiple functional modules to be compactly packaged to reduce size, it also introduces serious heat dissipation problems. The structure leads to a high concentration of heat, and the limited internal space of a phased array system makes it difficult to install effective heat dissipation devices. This inability to dissipate heat effectively threatens the system's performance, reliability, and lifespan, becoming a key obstacle to miniaturization and weight reduction.

[0003] Given the heat dissipation challenges caused by Fanout packaging and the inadequacy of traditional heat dissipation solutions in dealing with the complex internal structure and diverse heat source distribution of phased array systems, especially the lack of precision in handling the special heat dissipation characteristics of components such as antenna modules and power amplifiers using Fanout packaging, and the more prominent heat dissipation problems in special environments such as high temperature, high humidity or confined spaces, it is particularly important to redesign the high-temperature co-fired ceramic substrate and printed circuit board connecting the package. Summary of the Invention

[0004] The embodiments disclosed herein aim to at least solve one of the technical problems existing in the prior art, and provide a heat dissipation structure and working method for a phased array system based on fan-out packaging.

[0005] A first aspect of the embodiments of this disclosure provides a heat dissipation structure for a phased array system based on fan-out packaging, comprising: Fan-out packaged RF chips and antenna arrays, high-temperature co-fired ceramic substrates, printed circuit boards, RF feed networks, control and power supply networks, metal components, RF interfaces, and power modules. The fan-out packaged RF chip and antenna array are soldered to the upper surface of the high-temperature co-fired ceramic substrate; the high-temperature co-fired ceramic substrate and the printed circuit board are respectively soldered and fixed to the upper surface of the metal component; the RF feed network and the control and power supply network are embedded inside the high-temperature co-fired ceramic substrate and the printed circuit board; the RF interface and the power module pass through the metal component and are soldered to the lower surface of the printed circuit board.

[0006] Optionally, the fan-out packaged RF chip and antenna array include a package body. The radio frequency chip is integrated into the bottom of the package using a fan-out packaging process, and the antenna array is arranged in an array on the upper surface of the package.

[0007] Optionally, the high-temperature co-fired ceramic substrate is a multilayer ceramic structure made using a co-firing process; the lower surface of the printed circuit board is provided with a large copper-plated area with windows, and the copper-plated area is soldered to the upper surface of the metal component by a reflow soldering process; the metal component is provided with a cutout area corresponding to the physical outline and position of the RF interface and the power module, and the cutout area is used for the RF interface and the power module to pass through and connect to the lower surface of the printed circuit board.

[0008] Optionally, the control and power supply network includes a multilayer metal circuit formed in the high-temperature co-fired ceramic substrate and the printed circuit board, and chips and electrical components embedded therein; the circuits of different layers in the multilayer metal circuit are vertically interconnected through interlayer metallized vias penetrating the substrate.

[0009] Optionally, the radio frequency (RF) power supply network includes multilayer metal circuits and electrical components formed within the high-temperature co-fired ceramic substrate and the printed circuit board; the RF signal connections at different levels in the multilayer metal circuits are vertically interconnected through interlayer metallized vias.

[0010] Optionally, the high-temperature co-fired ceramic substrate and the printed circuit board are connected by bonding wires.

[0011] Optionally, the power module has a plug-in package structure, and it passes through the metal part and is plugged into the printed circuit board.

[0012] A second aspect of the embodiments of this disclosure provides a method for operating a heat dissipation structure for a phased array system based on fan-out packaging as described above, the method comprising: The power module supplies power to the phased array system; Radio frequency (RF) signals enter the printed circuit board (PCB) through the RF interface, and are interconnected by bonding wires through the PCB to the high-temperature co-fired ceramic substrate. The high-temperature co-fired ceramic substrate transmits signals to the fan-out packaged RF chip and antenna array through its internal vertical interconnect structure. The RF chip performs amplitude modulation and phase shifting processing on the signal. After amplitude modulation and phase shifting, the radio frequency signal is transmitted to the antenna array through the vertical interconnect metal pillars inside the package and forms radiation.

[0013] The beneficial effects of the embodiments of this disclosure include: By combining fan-out packaging technology with the structure of high-temperature co-fired ceramic substrate and printed circuit board, and by rationally designing the connection method and position of each component, and with the special design of metal parts, the internal stress of the overall structure is reduced, the heat dissipation capacity and signal transmission stability of the phased array system are improved, and the overall performance of the phased array system is enhanced. While realizing the miniaturization, integration and lightweighting of the phased array system, its reliability is guaranteed. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of a heat dissipation structure for a phased array system based on fan-out packaging, according to an embodiment of this disclosure. Figure 2 This is a temperature simulation distribution diagram of an embodiment of the present disclosure; Figure 3 This is a temperature simulation distribution diagram of a phased array system based on fan-out packaging, which is not used in one embodiment of this disclosure.

[0015] In the diagram, 1. Fan-out packaged RF chip and antenna array; 2. High-temperature co-fired ceramic substrate; 3. Printed circuit board; 4. RF feed network; 5. Control and power supply network; 6. Metal components; 7. RF interface; 8. Power module. Detailed Implementation

[0016] To enable those skilled in the art to better understand the technical solutions of this disclosure, the disclosure will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0017] The embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. The detailed descriptions and accompanying drawings of the following embodiments are used to exemplarily illustrate the principles of this application, but should not be used to limit the scope of this application; that is, this application is not limited to the described embodiments. In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," etc., indicating orientation or positional relationships are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. "Vertical" is not strictly vertical, but within the allowable error range. "Parallel" is not strictly parallel, but within the allowable error range.

[0018] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application depending on the specific circumstances.

[0019] like Figure 1-3 As shown, a heat dissipation structure for a phased array system based on fan-out packaging includes: a fan-out packaged RF chip and antenna array 1, a high-temperature co-fired ceramic substrate 2, a printed circuit board 3, an RF feed network 4, a control and power supply network 5, a metal component 6, an RF interface 7, and a power module 8.

[0020] The fan-out packaged RF chip and antenna array 1 are soldered to the upper surface of the high-temperature co-fired ceramic substrate 2. The high-temperature co-fired ceramic substrate 2 and printed circuit board 3 are soldered to the upper surface of the metal component 6. The RF feed network 4 and control and power supply network 5 are located in the high-temperature co-fired ceramic substrate 2 and printed circuit board 3. The RF interface 7 and power module 8 are soldered to the lower surface of the printed circuit board 3 through the metal component 6.

[0021] In some embodiments, the fan-out packaged RF chip and the chip in antenna array 1 are placed at the bottom of the package using a fan-out packaging process, and the antenna is located on the upper surface of the package.

[0022] In some embodiments, the high-temperature co-fired ceramic substrate 2 has a multilayer ceramic structure.

[0023] In some embodiments, the soldering of the printed circuit board 3 to the upper surface of the metal component 6 includes: a large copper-plated area with windows on the lower surface of the printed circuit board 3 is soldered to the upper surface of the metal component 6 via reflow soldering. The metal component 6 has cutout areas according to the positional requirements of the RF interface 7 and the power module 8.

[0024] In some embodiments, the control and power supply network 5 consists of multilayer metal circuits, chips and electrical components located in the high-temperature co-fired ceramic substrate 2 and the printed circuit board 3, and the connection between the metal layers is accomplished through interlayer metallized vias.

[0025] In some embodiments, the radio frequency power supply network 4 consists of multilayer metal circuits and electrical components located in the high-temperature co-fired ceramic substrate 2 and the printed circuit board 3, and the radio frequency connection of signals between the metal layers is accomplished through interlayer metallized vias with specific structures.

[0026] In some embodiments, the high-temperature co-fired ceramic substrate 2 and the printed circuit board 3 are connected by bonding wires.

[0027] In some embodiments, the power module 8 is connected to the printed circuit board 3 via a plug-in through the metal part 6.

[0028] According to a second aspect of the present invention, a method for operating the above-described phased array system based on fan-out packaging is provided, the method comprising: When the phased array system is working, the power module 8 supplies power to the system. The radio frequency signal enters the printed circuit board 3 through the radio frequency interface 7, and then enters the high temperature co-fired ceramic substrate 2 through the bonding wire. In the high temperature co-fired ceramic substrate 2, it is transmitted through the metal pillars to the inside of the fan-out packaged radio frequency chip and the antenna array 1. After the radio frequency chip modulates and shifts the signal, it is transmitted through the metal pillars in the package to the antenna on the upper surface to form radiation.

[0029] Specifically, the purpose of this disclosure is to provide a heat dissipation technology for a phased array system based on a fan-out package, which solves the problems of heat dissipation difficulties, unstable signal transmission, and unfavorable conditions for miniaturization, integration, and lightweighting in existing phased array systems, and meets the requirements of efficient and stable operation in various complex environments, ensuring its miniaturization, integration, lightweighting, and good reliability.

[0030] See below for details. Figure 1-3 The phased array system based on fan-out packaging in this embodiment is formed by welding four parts: package body, high temperature co-fired ceramic, printed circuit board, and metal parts. The welding process used between modules and between modules and devices is reflow soldering.

[0031] High-temperature co-fired ceramics (HTCC) are a product of advanced ceramic material preparation technology. They utilize high-melting-point metal heating resistor pastes such as tungsten, molybdenum, and manganese, printed onto alumina (92-96% content) cast ceramic green bodies according to the heating circuit design requirements. Simultaneously, 4-8% sintering aids are added, and then multiple layers of ceramic green bodies are stacked together. Finally, they are co-fired at a high temperature of 1500-1600℃ to form a single unit. This high-temperature sintering process creates a tightly integrated structure between the ceramic and the internal metal circuitry. HTCC ceramics possess exceptional heat dissipation performance. Their high-purity alumina composition and special sintering process endow them with excellent thermal conductivity, enabling efficient heat transfer and effectively reducing localized heat accumulation. They perform exceptionally well in numerous heat dissipation applications and play a crucial role in solving heat dissipation problems in systems such as phased arrays.

[0032] Reflow soldering is a soldering process used in surface mount technology. Its basic principle is to pre-print solder paste onto the pads of a printed circuit board (PCB), and then place surface mount components in the corresponding pad positions. When the PCB enters the reflow soldering equipment, the solder paste melts at high temperatures in the heated zone. The molten solder, under the influence of surface tension, tightly connects the component leads to the PCB pads. After cooling, the solder solidifies, thus forming a reliable electrical connection.

[0033] The phased array system based on fan-out packaging in this embodiment, such as Figure 1 As shown, it includes: The system comprises a fan-out packaged RF chip and antenna array 1, a high-temperature co-fired ceramic substrate 2, a printed circuit board 3, an RF feed network 4, a control and power supply network 5, a metal component 6, an RF interface 7, and a power module 8. Specifically, the fan-out packaged RF chip and antenna array 1 are soldered to the upper surface of the high-temperature co-fired ceramic substrate 2; the high-temperature co-fired ceramic substrate 2 and the printed circuit board 3 are soldered to the upper surface of the metal component 6; the RF feed network 4 and the control and power supply network 5 are located within the high-temperature co-fired ceramic substrate 2 and the printed circuit board 3; and the RF interface 7 and the power module 8 are soldered to the lower surface of the printed circuit board 3 through the metal component 6.

[0034] In the above embodiments, the fan-out packaged RF chip and the chip in antenna array 1 are placed at the bottom of the package using a fan-out packaging process, the antenna is located on the upper surface of the package, the high-temperature co-fired ceramic substrate 2 is a multilayer ceramic structure, and the printed circuit board 3 is soldered to the upper surface of the metal part 6. The large copper-plated area with windows on the lower surface of the printed circuit board 3 is soldered to the upper surface of the metal part 6 by reflow soldering. The metal part 6 has a cutout area according to the position requirements of the RF interface 7 and the power module 8. With the above configuration, the overall system structure of this application can reduce the internal stress of the overall structure, improve the heat dissipation capacity and signal transmission stability of the phased array system, enhance the overall performance of the phased array system, realize the miniaturization, integration, and lightweight of the phased array system, and ensure its good reliability.

[0035] like Figure 1 As shown, the control and power supply network 5 consists of multilayer metal circuits, chips, and electrical components located in the high-temperature co-fired ceramic substrate 2 and the printed circuit board 3. The connections between the metal layers are achieved through interlayer metallized vias. This connection method enables complex control and power supply functions.

[0036] In some embodiments, the radio frequency power supply network 4 consists of multilayer metal circuits and electrical components located in the high-temperature co-fired ceramic substrate 2 and the printed circuit board 3. The radio frequency connection of signals between the metal layers is completed through interlayer metallized vias with specific structures, thereby realizing radio frequency related functions such as power distribution.

[0037] In some embodiments, the high-temperature co-fired ceramic substrate 2 and the printed circuit board 3 are connected by bonding wires to ensure a stable electrical connection and structural integrity between them.

[0038] In some embodiments, the power module 8 is connected to the printed circuit board 3 via the metal part 6 in the form of a plug-in, providing stable power to the entire system.

[0039] In some embodiments, one end of the radio frequency interface 7 is connected to circuitry in the printed circuit board 3 (through the metal component 6) to receive external radio frequency signals. The system also includes a power supply module 8 for powering the system. The metal component 6 serves as a support and auxiliary connection in the structure.

[0040] In some embodiments, the structural design and material selection of components such as the metal part 6, the radio frequency interface 7, and the power module 8 ensure the stability of the system under different environments. During operation, the system does not generate a large amount of thermal stress and structural stress, ensuring the reliable operation of the phased array system.

[0041] According to embodiments of the present invention, the present invention also provides a method for operating a heat dissipation structure for a phased array system based on fan-out packaging, comprising: When the phased array system is working, the power module 8 supplies power to the system. The radio frequency signal enters the printed circuit board 3 through the radio frequency interface 7, and then enters the high temperature co-fired ceramic substrate 2 through the bonding wire. In the high temperature co-fired ceramic substrate, it is transmitted through the metal pillars to the inside of the fan-out packaged radio frequency chip and the antenna array 1. After the radio frequency chip modulates and shifts the signal, it is transmitted through the metal pillars in the package to the antenna on the upper surface to form radiation.

[0042] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A heat dissipation structure for a phased array system based on fan-out packaging, characterized in that, include: Fan-out packaged RF chips and antenna arrays, high-temperature co-fired ceramic substrates, printed circuit boards, RF feed networks, control and power supply networks, metal components, RF interfaces, and power modules. The fan-out packaged RF chip and antenna array are soldered to the upper surface of the high-temperature co-fired ceramic substrate; the high-temperature co-fired ceramic substrate and the printed circuit board are respectively soldered and fixed to the upper surface of the metal component; the RF feed network and the control and power supply network are embedded inside the high-temperature co-fired ceramic substrate and the printed circuit board; the RF interface and the power module pass through the metal component and are soldered to the lower surface of the printed circuit board.

2. The heat dissipation structure for a phased array system based on fan-out packaging according to claim 1, characterized in that, The fan-out packaged RF chip and antenna array include a package body. The radio frequency chip is integrated into the bottom of the package using a fan-out packaging process, and the antenna array is arranged in an array on the upper surface of the package.

3. The heat dissipation structure for a phased array system based on fan-out packaging according to claim 1, characterized in that, The high-temperature co-fired ceramic substrate is a multilayer ceramic structure made using a co-firing process; the lower surface of the printed circuit board is provided with a large copper-plated area with windows, and the copper-plated area is soldered to the upper surface of the metal component by a reflow soldering process; the metal component is provided with a cutout area corresponding to the physical outline and position of the RF interface and the power module, and the cutout area is used for the RF interface and the power module to pass through and connect to the lower surface of the printed circuit board.

4. The heat dissipation structure for a phased array system based on fan-out packaging according to claim 1, characterized in that, The control and power supply network includes a multilayer metal circuit formed in the high-temperature co-fired ceramic substrate and the printed circuit board, and chips and electrical components embedded therein; the circuits of different layers in the multilayer metal circuit are vertically interconnected through interlayer metallized vias penetrating the substrate.

5. The heat dissipation structure for a phased array system based on fan-out packaging according to claim 1, characterized in that, The radio frequency (RF) feed network includes multilayer metal circuits and electrical components formed within the high-temperature co-fired ceramic substrate and the printed circuit board; the RF signal connections of different layers in the multilayer metal circuit are vertically interconnected through interlayer metallized vias.

6. The heat dissipation structure for a phased array system based on fan-out packaging according to claim 1, characterized in that, The high-temperature co-fired ceramic substrate and the printed circuit board are connected by bonding wires.

7. The heat dissipation structure for a phased array system based on fan-out packaging according to claim 1, characterized in that, The power module has a plug-in package structure, and it is inserted through the metal part and plugged into the printed circuit board.

8. A method for operating a heat dissipation structure for a phased array system based on fan-out packaging, as described in any one of claims 1-7, characterized in that, The method includes: The power module supplies power to the phased array system; Radio frequency (RF) signals enter the printed circuit board (PCB) through the RF interface, and are interconnected by bonding wires through the PCB to the high-temperature co-fired ceramic substrate. The high-temperature co-fired ceramic substrate transmits signals to the fan-out packaged RF chip and antenna array through its internal vertical interconnect structure. The RF chip performs amplitude modulation and phase shifting processing on the signal. After amplitude modulation and phase shifting, the radio frequency signal is transmitted to the antenna array through the vertical interconnect metal pillars inside the package and forms radiation.

Images