Crystal oscillator with built-in temperature sensor

Abstract

The invention provides a temperature sensor built-in type crystal oscillator having a practical novel structure capable of reducing the temperature difference between a temperature sensor and a crystal oscillator piece. A crystal oscillator (10) is provided with: an AT-cut crystal resonator element (11); a temperature sensor (13); a container (15) containing these components; and a substrate (17) which is not integral with the container, and which is connected to the container at a first portion (17aa) of the first main surface (17a) by means of a conductive member (19). The temperature sensor is connected to a second portion (17ab) other than the first portion of the first main surface of the substrate via a conductive member (19). The crystal resonator element is connected via a conductive member (19) to a second main surface side portion (facing portion) (17ba) of a second main surface (17b) opposite the first main surface of the substrate, the second main surface side portion (facing portion) (17ba) facing the second portion with the substrate therebetween.

Description

Technical Field

[0001] This invention relates to a crystal oscillator with a built-in temperature sensor such as a thermistor. Background Technology

[0002] In recent years, so-called temperature sensor-integrated crystal oscillators, which integrate an AT-cut crystal oscillator and a temperature sensor into a single container, have become increasingly common. This is because the external electronic device (chipset) designed to use this crystal oscillator compensates for the crystal oscillator's oscillation frequency based on the temperature information detected by the temperature sensor. Therefore, the target frequency can be obtained with higher accuracy using this crystal oscillator.

[0003] As an example of a crystal oscillator with a built-in temperature sensor, there is a crystal oscillator with a room structure. That is, there is a crystal oscillator in which the crystal oscillator and the temperature sensor are installed in a room and hermetically sealed (for example, Patent Document 1, Patent Document 2).

[0004] The crystal oscillator described in Patent Document 1 has a temperature sensor mounted inside the container in the area between a pair of connecting pads for mounting the crystal oscillator (Summary of Patent Document 1, etc.). The crystal oscillator described in Patent Document 2 has an oscillator mounted in a first part of a support extending from the inner wall of the container, and a temperature sensor mounted in a second part facing each other in the thickness direction of the support relative to the first part (Summary of Patent Document 2, etc.).

[0005] In any crystal oscillator, the temperature sensor and the crystal oscillator are easily accessible, thus reducing the temperature difference between them (abstracts of Patent Document 1 and Patent Document 2, etc.). Reducing the temperature difference between the temperature sensor and the crystal oscillator is useful as one method to improve the accuracy of temperature compensation.

[0006] [Existing technical documents]

[0007] [Patent Literature]

[0008] [Patent Document 1] Japanese Patent Application Publication No. 2015-226152

[0009] [Patent Document 2] Japanese Patent Application Publication No. 2023-135986 Summary of the Invention

[0010] [The problem the invention aims to solve]

[0011] However, in the case of the structure described in Patent Document 1, due to the narrow distance between a pair of connecting pads and the limited miniaturization of the temperature sensor, it is difficult in reality to install a temperature sensor between a pair of connecting pads of a container.

[0012] Furthermore, in the case of the structure described in Patent Document 2, the support extends horizontally from the inner wall of the package and is integrated with the container. Therefore, in reality, it is difficult to set a crystal oscillator on the first side of the support and a temperature sensor on the second side.

[0013] This application was made in view of this aspect, and therefore, the object of this application is to provide a novel structure for a temperature sensor-embedded crystal oscillator that includes a practical ability to reduce the temperature difference between the temperature sensor and the crystal oscillator.

[0014] [Technical means to solve the problem]

[0015] To achieve the aforementioned objective, according to the present invention, a temperature sensor-integrated crystal oscillator is provided, comprising an AT-cut crystal oscillator, a temperature sensor, and a container enclosing these components. The temperature sensor-integrated crystal oscillator is characterized by:

[0016] Includes a substrate, wherein the substrate is not integral with the container, and is connected to the container at a first portion of the first main surface via a conductive member.

[0017] The temperature sensor is connected via a conductive member to a second portion of the first main surface of the substrate, excluding the first portion.

[0018] The crystal oscillator is connected via a conductive member to the second main surface side (opposing portion) of the substrate, which is opposite to the first main surface and faces the second portion, across the substrate.

[0019] [The effects of the invention]

[0020] According to the present invention, the crystal oscillator and the temperature sensor are positioned facing each other and close to each other across the thickness of the substrate. Therefore, heat conduction from the object toward the crystal oscillator and the temperature sensor occurs through a common substrate and from a substantially common portion of the substrate. Thus, excluding differences in specific heat, the crystal oscillator and the temperature sensor become a common thermal environment, thereby reducing the temperature difference between them.

[0021] Furthermore, since the substrate and the container are not integrated, the material of the substrate can be freely selected, such as a substrate with the required thermal conductivity or a substrate with the required thermal expansion coefficient.

[0022] Furthermore, since the substrate and the container are not integrated, for example, after mounting a temperature sensor on the first main surface of the substrate, the substrate is mounted in the container, and then a crystal oscillator is mounted on the second main surface of the substrate, a crystal oscillator with a built-in temperature sensor can be manufactured in a practical way.

[0023] Therefore, it is possible to provide a novel structure for a temperature sensor-embedded crystal oscillator that includes a practical ability to reduce the temperature difference between the temperature sensor and the crystal oscillator. Attached Figure Description

[0024] Figure 1 (A) Figure 1 (C) is a diagram used to illustrate the temperature sensor-embedded crystal oscillator 10 of the embodiment.

[0025] Figure 2 (A) Figure 2 Figure (C) is a diagram used to explain in detail, especially the substrate, of the temperature sensor-embedded crystal oscillator 10 in the embodiment.

[0026] Figure 3 (A) and Figure 3 Figure (B) is used to illustrate a preferred example for a crystal oscillator when a crystal substrate is used as the substrate.

[0027] Figure 4 (A) and Figure 4 Figure (B) is a preferred example used to illustrate the relationship between the thickness of the temperature sensor and the recess of the container, the length of the substrate, and the width of the recess.

[0028] Figure 5 (A) Figure 5 (C) is a diagram used to illustrate a specific example of a crystal vibrator.

[0029] Explanation of icon numbers

[0030] 10: Temperature sensor built-in crystal oscillator (crystal oscillator) in the implementation method

[0031] 10x, 10y: Crystal oscillator

[0032] 11: AT-cut crystal oscillators (crystal oscillators)

[0033] 11a: Excitation electrode

[0034] 11b: Lead-out electrode

[0035] 11c: Vibrating part

[0036] 11d: Support section

[0037] 11e: Incision area

[0038] 11f: Through hole

[0039] 13: Temperature sensor

[0040] 13a: Connection terminal for temperature sensor (connection terminal)

[0041] 15: Container

[0042] 15a: Base

[0043] 15b: Embankment

[0044] 15c: concave part

[0045] 15d, 15e: Connecting pads

[0046] 15f, 15g, 15h, 15i: External connection terminals

[0047] 17, 17x, 17y, 17z: substrate

[0048] 17a: First main surface of the substrate

[0049] 17aa: The first part of the first main face

[0050] 17ab: The second part of the first main face

[0051] 17b: Second main surface of the substrate

[0052] 17ba: Second principal face side portion (facing portion)

[0053] 17c, 17d: Connecting wiring

[0054] 19: Conductive components

[0055] 21: Cover component

[0056] a: First direction

[0057] d: Depth of the recess

[0058] h: Height of the temperature sensor

[0059] L: Length of the substrate (dimension along the long side of the crystal oscillator) S: Width of the temperature sensor

[0060] W: Width of the recess; X, Y, Y', Z, Z': Axis Detailed Implementation

[0061] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Furthermore, the drawings used in the description are only schematic representations to enable understanding of the present invention. Also, in the drawings used in the description, there are instances where the same structural components are shown with the same designation and their descriptions are omitted. Moreover, the structural examples, components used, etc., described below are only preferred examples within the scope of the present invention. Therefore, the present invention is not limited to the following embodiments.

[0062] 1. Crystal oscillator of the embodiment

[0063] Figure 1 (A) Figure 1 (C) Figure 2 (A) Figure 2 Figure (C) is used to illustrate the temperature sensor-embedded crystal oscillator 10 (hereinafter sometimes simply referred to as crystal oscillator 10) of the embodiment. In particular Figure 1 (A) is a top view of the crystal oscillator 10. Figure 1 (B) is along Figure 1 A cross-sectional view of the PP line in (A). Figure 1 (C) is the bottom view. Among them, in Figure 1 (A) shows the state where the cover member 21 has been removed. Furthermore, Figure 2 (A) Figure 2 Figure (C) is used to illustrate the relationship between the crystal oscillator 11 and the substrate 17. In particular... Figure 2 (B) is a top view of substrate 17 and a cross section along line RR in the top view.

[0064] The crystal oscillator 10 includes an AT-cut crystal oscillator 11, a temperature sensor 13, a container 15 enclosing the crystal oscillator 11 and the temperature sensor 13, and a defined substrate 17. The defined substrate 17 is not integral with the container 15, and is connected to the container 15 at a first portion 17aa of the first main surface 17a via a conductive member 19.

[0065] Furthermore, the temperature sensor 13 is connected via a conductive member 19 to the second portion 17ab of the first main surface 17a of the substrate 17, excluding the first portion 17aa. The crystal oscillator 11 is connected via a conductive member 19 to the second main surface side portion (also called the opposing portion) 17ba of the second main surface 17b, which is opposite to the first main surface 17a of the substrate 17 and faces the second portion 17ab across the substrate 17. The container 15 is sealed by the cap member 21. The structural components will be described in detail below.

[0066] Especially as Figure 2 As shown in (C), the AT-cut crystal oscillator 11 is quadrilateral when viewed from above, and rectangular in this example. It has a specified thickness corresponding to the oscillation frequency and includes an excitation electrode 11a on the front and back main surfaces, and an output electrode 11b extending from the excitation electrode 11a to one of the short sides of the crystal oscillator.

[0067] The crystal oscillator 11 is selected from the following crystal oscillators that correspond to the design of the crystal oscillator: a so-called X-length crystal oscillator whose long side is parallel to the X-axis, which is the crystal axis of the crystal, and whose short side is parallel to the Z'-axis, which is the crystal axis of the crystal; or a so-called Z-length crystal oscillator whose long side is parallel to the Z'-axis of the crystal and whose short side is parallel to the X-axis of the crystal; or a planar shape that is quadrilateral, with one side parallel to the X-axis or the Z'-axis of the crystal. However, the planar shape of the crystal oscillator 11 is not limited to a quadrilateral, and may also be other shapes such as circles or ellipses.

[0068] Temperature sensor 13 may include a thermistor. However, temperature sensor 13 is not limited to a thermistor and may also use other components, such as a diode. This is because a temperature sensor can be implemented by utilizing the temperature dependence of the PN junction of a diode. In the example described, temperature sensor 13 is cuboid in shape and includes connection terminals 13a at both ends along its length. However, temperature sensor 13 is not limited to this example and may also be other constructions, such as a thin-film thermistor.

[0069] Furthermore, the portion of the temperature sensor 13 other than the part connected to the substrate 17 preferably does not contact other components. In the example described, the portion of the temperature sensor 13 other than the part connected to the substrate 17 preferably does not contact the inner wall of the recess 15c provided in the base 15a of the container 15. This is because the solid-based heat conduction path for the temperature sensor 13 is provided only in the substrate 17.

[0070] In this case, the container 15 includes a ceramic package with a planar quadrilateral shape, specifically a rectangular shape. The container 15 includes a base 15a, a dam 15b disposed along the edge of the base 15a, and a recess 15c disposed on the base 15a and capable of planarly enclosing a temperature sensor 13. A crystal oscillator 11 and a temperature sensor 13 are enclosed within the space enclosed by the base 15a and the dam 15b. However, in this example, the temperature sensor 13 is housed in the recess 15c. Here, in this example, the recess 15c is a depth sufficient to accommodate all or part of the temperature sensor 13 in the height direction, specifically the portion of the portion of the dam 15b that abuts against one end of the container 15's interior. See below for further details. Figure 4 (A) and Figure 4 (B) will be described as a preferred example relating the relationship between the recess 15c and the temperature sensor 13.

[0071] The area on the base 15a includes connecting pads 15d and 15e for connecting the substrate 17. However, in the example described, connecting pad 15d is the connecting pad associated with the temperature sensor 13, and connecting pad 15e is the connecting pad associated with the crystal oscillator 11. That is, these connecting pads 15d and 15e are connected to the crystal oscillator 11 or the temperature sensor 13 in a predetermined relationship via connecting wires 17c and 17d provided on the substrate 17.

[0072] Furthermore, the four corners of the outer bottom surface of the container 15 include external connection terminals 15f, 15g, 15h, and 15i for connecting the crystal oscillator 10 to any electronic device, such as an electronic substrate for a mobile phone (see reference). Figure 1 (C)). Connecting pads 15d and 15e are electrically connected to external connecting terminals 15f, 15g, 15h, and 15i in a specified relationship via through-hole wiring or castle-type wiring (not shown).

[0073] Furthermore, the top surface of the embankment 15b of the container 15 is treated in accordance with the sealing method. Specifically, when the sealing method is a joint seal, a joint ring (not shown) is provided on the top surface of the embankment 15b.

[0074] The substrate 17 is placed between the container 15, the crystal oscillator 11, and the temperature sensor 13, and has the same base function as the crystal oscillator 11 and the temperature sensor 13.

[0075] The substrate 17 can be a quadrilateral substrate viewed from above, but is not limited to this. This is because substrates are easy to process. Moreover, the substrate 17 can contain any preferred material. For example, the substrate can be made of glass, ceramic, resin, or crystal. When it is desirable to easily conduct heat from the container 15 to the crystal oscillator 11 and the temperature sensor 13, a substrate made of a material with high thermal conductivity can be selected; when it is desirable to make heat conduction difficult, a substrate made of a material with low thermal conductivity can be selected. Furthermore, a crystal substrate can be used to match the coefficient of thermal expansion of the crystal oscillator 11. The following describes a suitable example considering the crystal axis when the substrate 17 is made of crystal.

[0076] Furthermore, the thickness of the substrate 17 can be set to take into account the effects of stress on thermal conductivity or the crystal oscillator. If the thickness of the substrate 17 is too thin, the strength of the substrate cannot be ensured; if it is too thick, it will affect the overall thickness of the crystal oscillator 10. Therefore, the thickness can be set to, for example, 30μm to 100μm, preferably 40μm to 70μm, and even thinner thicknesses are also possible. Moreover, the substrate is not limited to one piece; for example, multiple substrates of different materials may be used.

[0077] Furthermore, the size of the substrate 17 in top view is, of course, the size contained within the container 15, but is not limited thereto. In the example described, it is assumed to be larger than the crystal oscillator 11 in top view. However, see below for reference. Figure 4 (A) and Figure 4 (B) provides an explanation of other examples.

[0078] Furthermore, although the first part 17aa, the second part 17ab, and the second main surface side part (opposing part) 17ba mentioned in this invention can be provided as a region within the substrate 17, such as the following.

[0079] First, considering the efficient use of the substrate 17, the second portion 17ab, i.e., the portion connecting the temperature sensor 13, can be an area on one end of the substrate 17 with a width sufficient to allow the temperature sensor 13 to be connected, located at a distance from one end of the substrate 17. Specifically, in the case where the temperature sensor 13 is a cuboid, such as the so-called 0603 type, the width of the temperature sensor 13 is 0.3 mm, therefore the second portion 17ab can be an area approximately 0.3 mm away from one end of the substrate 17. Generally, when the width of the temperature sensor 13 is expressed as S (refer to...), Figure 1 (A)), the second part 17ab may be a region from one end of the substrate 17 to 0.8S to 1.5S, preferably from one end of the substrate 17 to 0.8S to 1.2S, and even more preferably from one end of the substrate 17 to 0.9S to 1.2S.

[0080] Furthermore, the second main surface side portion (opposing portion) 17ba, facing the second portion 17ab, can be the size capable of supporting the crystal oscillator 11. Specifically, it can be the same size as the support portion of the crystal oscillator 11. Alternatively, it can be the same as the second portion 17ab, extending from one end of the substrate 17 to a region of 0.8S to 1.5S, preferably 0.8S to 1.2S, but is not limited thereto. In the above example, the region of the second portion 17ab is defined by the width S of the temperature sensor. However, if the temperature sensor is smaller and the long side dimension of the temperature sensor is also smaller than the fixed area of ​​the crystal oscillator 11, then S can of course be set as the length of the long side.

[0081] On the other hand, the first part 17aa ensures that the connection wiring 17d from the temperature sensor 13 can be configured (see reference). Figure 2 The area of ​​(B) and the connection wiring 17c from the crystal oscillator 11 (see reference) Figure 2The area of ​​(B) is such that the substrate 17 has an area sufficient to ensure the required strength and to be connected to the container 15. For example, considering the width S of the temperature sensor, the first portion 17aa can be a region extending from the end of the second portion 17ab to 1.5S to 3S, preferably to 1.5S to 2.5S, and more preferably to 1.5S to 2S. Furthermore, in the case described above, the first portion 17aa becomes the area connected to a total of four connecting pads, including the connecting pad 15d for the crystal oscillator 11 and the connecting pad 15e for the temperature sensor 13.

[0082] Furthermore, in order to electrically connect the crystal oscillator 11, the temperature sensor 13, and the container 15 respectively, as Figure 2 As shown in (B), the substrate 17 includes defined connection wiring 17c and connection wiring 17d on the first main surface 17a and the second main surface 17b. That is, from the first main surface 17a to the second main surface 17b of the substrate 17, there is connection wiring 17c that connects the crystal oscillator 11 to the connection pad 15e of the container, and on the first main surface 17a of the substrate 17, there is connection wiring 17d that connects the temperature sensor 13 to the connection pad 15d.

[0083] The conductive component 19 can be, for example, a silicone-based conductive adhesive, an epoxy-based conductive adhesive, a polyimide-based conductive adhesive, or other conductive adhesives, or a component other than an adhesive, such as a metal bump. However, considering the mitigation of thermal stress or shock absorption, a silicone-based conductive adhesive is preferred. Furthermore, the conductive component between the substrate 17 and the temperature sensor 13 can be the same as or different from the conductive component between the substrate 17 and the crystal oscillator 11, but is preferably the same.

[0084] The cover member 21 can be any cover member corresponding to the sealing method. When the sealing method is set to a joint seal, the cover member 21 may, for example, be made of nickel plated on Kovar alloy material.

[0085] In the crystal oscillator 10 of the embodiment, the crystal oscillator 11 and the temperature sensor 13 are positioned facing each other and close to each other across the thickness of the substrate 17. Therefore, heat conduction from the object toward the crystal oscillator and the temperature sensor occurs via the substrate 17 and generally from the common portion of the substrate, namely the second portion 17ab and the second main surface side portion (facing portion) 17ba of the substrate 17. Therefore, the temperature difference between the crystal oscillator and the temperature sensor can be reduced. Furthermore, since the substrate 17 and the container 15 are not integrally formed, the material of the substrate 17 can be freely selected. Moreover, since the substrate 17 and the container 15 are not integrally formed, for example, the temperature sensor 13 can be mounted on the first main surface 17a of the substrate 17, the substrate 17 can be mounted on the container 15, and then the crystal oscillator 11 can be mounted on the second main surface 17b of the substrate 17, thus enabling the manufacture of a crystal oscillator with a built-in temperature sensor using a practical method.

[0086] 2. Preferred example when using a crystal substrate 17

[0087] The structural material of the substrate 17 can be arbitrary, but considering its compatibility with the thermal expansion coefficient of the crystal oscillator 11, it is preferable to use a crystal substrate. Furthermore, the crystal oscillator 11 and the crystal substrate 17 are preferably arranged in a configuration that takes into account the crystal axis of the crystal. Hereinafter, refer to... Figure 3 (A) and Figure 3 (B) illustrates the example.

[0088] Figure 3 (A) shows a case where the crystal oscillator 11 is connected to the substrate 17x or substrate 17y through two locations along the X-axis of the crystal. That is, for example, the two lead electrodes 11b are located at two separate locations along the X-axis of the crystal oscillator 11, through which the crystal oscillator 11 is bonded to the substrate 17x and substrate 17y. Specifically, Figure 3 The example shown in the lower left of (A) is a substrate 17x including an AT-cut crystal wafer, which includes connection wiring 17c and connection wiring 17d at two locations along the X-axis of the crystal. Furthermore, Figure 3 The example shown in the lower right of (A) is a substrate 17y including a Z-cut crystal wafer, which includes connection wiring 17c and connection wiring 17d at two locations along the Z' axis of the crystal.

[0089] The crystal oscillator 11 and the substrate 17x or substrate 17y are aligned with each other along the X-axis of their respective crystals in the first direction a (refer to...). Figure 3 The (A)) parallel positional relationship is configured in a consistent manner. Furthermore, consistency naturally includes absolute consistency, but also includes cases where the axes deviate slightly from the scope of the invention (the same applies below). Furthermore, Figure 3 The Z' axis of the crystal in (A) is an axis that is deviated from the true Z axis of the crystal based on the cutting orientation of the AT-cut crystal slice (the same applies below).

[0090] and, Figure 3 (B) is an example where the crystal oscillator 11 is connected to the substrate 17z via two portions along the Z' axis of the crystal. In this case, the substrate 17z includes the Z-axis or Z' axis of the crystal in its plane, and the crystal oscillator 11 can be connected via two portions along the Z-axis or Z' axis. Specifically, the substrate 17z includes an AT-cut crystal sheet, and corresponding to the lead-out electrode 11b of the crystal oscillator 11, connection wiring 17c and connection wiring 17d are respectively included along the Z' axis of the crystal of the substrate 17z.

[0091] The crystal oscillator 11 and the substrate 17z are aligned with each other along their respective crystal Z' axes in the first direction a (refer to...). Figure 3 The (A)) parallel positional relationship is configured in a consistent manner.

[0092] Furthermore, details regarding the possibility of setting the substrate as a crystal substrate and aligning the crystal axis of the crystal with the crystal vibrator and the crystal substrate are described, for example, in Table 2 of the applicant's Japanese Patent Application No. 2014-72182 and Japanese Patent Application No. 2024-154016, which is a prior application thereto, and in articles related to the table.

[0093] 3. Regarding the depth of the recess for mounting the temperature sensor, etc.

[0094] Next, preferred examples of the relationship between the height h of the temperature sensor 13 and the depth d of the recess for the temperature sensor provided in the container 15, the length of the substrate, and the width of the recess will be explained. (Refer to...) Figure 4 (A) Figure 4 The description is provided in (B). Furthermore, Figure 4 (A) Figure 4 (B) are respectively with Figure 1 The diagram corresponding to the cross-sectional view shown in (B).

[0095] Figure 4 The crystal oscillator 10x shown in (A) is denoted as d when the depth of the recess 15c used to mount the temperature sensor 13 is denoted as d and the height of the temperature sensor 13 is denoted as h, and is set to d≦hs.

[0096] In the case of the crystal oscillator 10x, since d≦hs, the substrate 17 will directly contact the container 15, or the temperature sensor 13 will contact the bottom surface of the recess 15c. If the temperature sensor 13 contacts the bottom surface of the recess 15c, the heat conduction paths towards the temperature sensor 13 and the crystal oscillator 11 will differ, which is undesirable. To avoid this situation, the thickness of the connecting pads 15d and 15e, or the thickness of the conductive member 19, is set to an appropriate thickness. However, since d≦hs, it is easy to make the overall thickness of the crystal oscillator 10x too thin.

[0097] Figure 4 In the crystal oscillator 10y shown in (B), when the depth of the recess 15c used to mount the temperature sensor 13 is denoted as d and the height of the temperature sensor is denoted as h, d > h is set.

[0098] In the case of the crystal oscillator 10y, since d > h, the degree of freedom in the thickness of the connecting pads 15d and 15e, or the thickness of the conductive member 19, becomes greater. The manufacture of the crystal oscillator 10y also becomes easier than that of the crystal oscillator 10x.

[0099] exist Figure 4 (A) Figure 4 In any case of (B), the length L of the substrate 17 along the long side of the crystal oscillator 11 is preferably small within a range that ensures the bonding area for connecting the substrate 17 to the container 15 and the bonding area for connecting the crystal oscillator 11 and the temperature sensor 13 to the substrate 17. If the length L of the substrate 17 is less than the length of the crystal oscillator 11, the following advantages can be obtained: the risk of the front end of the crystal oscillator 11 contacting the substrate 17 can be reduced; the influence of parasitic capacitance on the excitation electrode 11a of the crystal oscillator 11 can be reduced, etc.

[0100] Furthermore, the width W of the recess 15c is preferably large within a range that ensures the bonding area for connecting the substrate 17 to the container 15 outside the recess 15c of the container 15, and the area where the connecting pads 15d and 15e can be provided. This also improves the ease of mounting the substrate 17 connected to the temperature sensor 13 to the container 15.

[0101] 4. Regarding crystal oscillators

[0102] In the example described, the crystal oscillator 11 has a uniform thickness and a square planar shape, but the shape of the crystal oscillator 11 is not limited to the example described.

[0103] For example, it can also be like Figure 5As shown in (A), a crystal oscillator plate has a so-called side-frame structure, including a vibrating portion 11c having a thickness corresponding to the frequency and a support portion 11d having a thickness greater than that of the vibrating portion 11c. Furthermore, it can also be as follows... Figure 5 As shown in (B), this is a crystal oscillator with a cutout 11e between the oscillating part and the support part. Furthermore, it can also be as follows... Figure 5 As shown in (C), this is a crystal oscillator with a through hole 11f between the oscillating part and the supporting part. The cutout 11e or the through hole 11f can be provided on a crystal oscillator of uniform thickness, and it can also be provided on... Figure 5 The crystal vibrating plate with a side frame structure shown in (A).

Claims

1. A temperature sensor-integrated crystal oscillator, comprising an AT-cut crystal oscillator, a temperature sensor, and a container enclosing these components, characterized in that: Includes a substrate, wherein the substrate is not integral with the container, and is connected to the container at a first portion of the first main surface via a conductive member. The temperature sensor is connected via a conductive member to a second portion of the first main surface of the substrate, excluding the first portion. The crystal oscillator is connected via a conductive member to the second main surface portion of the substrate, which is opposite to the first main surface and faces the second main surface portion, across the substrate.

2. The temperature sensor-embedded crystal oscillator according to claim 1, characterized in that: The substrate is made of glass, ceramic, resin, or crystal. The crystal oscillator is quadrilateral when viewed from above, and is connected to the substrate in a cantilevered manner via the conductive member at two locations along one side of the quadrilateral.

3. The temperature sensor-embedded crystal oscillator according to claim 1, characterized in that: The crystal oscillator is quadrilateral when viewed from above, and is cantilevered to the substrate via the conductive member at two locations along one side of the crystal's X-axis and along that side. The substrate is an AT-cut crystal plate or a Z-cut crystal plate, and is configured such that the X-axis of the crystal on the substrate is aligned with the X-axis of the crystal oscillator.

4. The temperature sensor-embedded crystal oscillator according to claim 1, characterized in that: The crystal oscillator is quadrilateral when viewed from above, and is cantilevered to the substrate at two locations along one side of the crystal's Z' axis and along that side, via the conductive member. The substrate is an AT-cut crystal plate, and is configured such that the Z' axis of the crystal on the substrate is aligned with the Z' axis of the crystal oscillator.

5. The temperature sensor-embedded crystal oscillator according to claim 1, characterized in that: The portion of the temperature sensor other than the part connected to the substrate does not contact other components.

6. The crystal oscillator with a built-in temperature sensor according to any one of claims 1 to 5, characterized in that: The container includes a recess that can accommodate the temperature sensor in a planar manner. The substrate is connected to the container such that all or part of the temperature sensor connected to the substrate is contained within the recess in the height direction.

7. The crystal oscillator with a built-in temperature sensor according to any one of claims 1 to 5, characterized in that: The container includes a recess for mounting the temperature sensor. The substrate is connected to the container such that all or part of the temperature sensor connected to the substrate is included in the recess in the height direction. When the depth of the recess is set as d and the height of the temperature sensor is set as h, d≦h.

8. The crystal oscillator with a built-in temperature sensor according to any one of claims 1 to 5, characterized in that: The container includes a recess for mounting the temperature sensor. The substrate is connected to the container such that all or part of the temperature sensor connected to the substrate is included in the recess in the height direction. When the depth of the recess is set as d and the height of the temperature sensor is set as h, d ≧ h.

9. The temperature sensor-embedded crystal oscillator according to claim 1, characterized in that: The substrate is rectangular in shape when viewed from above. The second part is one end of the substrate along its long side, and when the width of the temperature sensor is represented as S, it is the region from that end to 0.8S to 1.5S.

10. The temperature sensor-embedded crystal oscillator according to claim 9, characterized in that: The first part is the other end of the long side of the substrate, and when the width of the temperature sensor is expressed as S, it is the region from the end of the second part to 1.5S to 3S.

Images