Atomic gas chamber heating device
By combining a heat-conducting shell made of transparent material with a mounting block, the problems of poor heat preservation and inconvenient replacement of the atomic gas chamber heating device are solved, achieving temperature uniformity and convenient replacement.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-30
- Publication Date
- 2026-03-27
AI Technical Summary
The existing atomic gas chamber heating device has poor heat insulation performance of the heat-conducting shell, cannot transmit light directly, and is inconvenient to replace the atomic gas chamber.
The structure combines a heat-conducting shell and mounting block made of transparent material. The detachable mounting block allows for easy replacement of the atomic gas chamber. The transparent material ensures light transmission, and the insulation shell and temperature sensor are used to regulate temperature uniformity.
The insulation effect of the heating device has been improved, making the temperature of the atomic gas chamber more uniform, simplifying the replacement process of the atomic gas chamber, and ensuring the normal use of the atomic gas chamber.
Smart Images
Figure CN121751407A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of atomic gas chamber heating technology, and in particular to an atomic gas chamber heating device. Background Technology
[0002] Currently, atomic gas chamber heating devices generally use a heat-conducting shell made of boron nitride ceramic. The inside of the boron nitride heat-conducting shell has grooves that fit the atomic gas chamber. A flexible heating film made of thermally conductive silicone grease is attached to the surface of the heat-conducting shell for heating the atomic gas chamber. However, the structure of the boron nitride shell is complex. Since the atomic gas chamber needs to be transparent, the boron nitride heat-conducting shell needs to have openings around its perimeter to allow light in, which leads to uneven heat transfer and temperature distribution within the atomic gas chamber. Secondly, atomic gas chamber heating devices can also use aluminum alloy material of grade 2A12 to make the heat-conducting shell and use a vacuum insulation chamber to insulate the atomic gas chamber. However, the vacuum insulation chamber body and cover need to be bonded by glass melting. After bonding, the atomic gas chamber is not only difficult to replace, but the vacuum level inside the vacuum chamber will gradually decrease over time. After a period of use, the vacuum chamber needs to be re-evacuated, making the operation of this type of heating device cumbersome and the replacement of the atomic gas chamber troublesome. Summary of the Invention
[0003] The purpose of this invention is to provide an atomic gas chamber heating device to solve the technical problems of poor heat insulation effect of the heat-conducting shell, inability to transmit light directly, and inconvenience in replacing the atomic gas chamber in the prior art.
[0004] To achieve the above objectives, the present invention provides an atomic gas chamber heating device, comprising: a heat-conducting shell, a heating element, an atomic gas chamber, and a temperature sensor; the heat-conducting shell includes a housing and a mounting block; both the housing and the mounting block are made of transparent material; the heating element is in contact with the housing; the temperature sensor is in contact with the housing; the housing has a mounting cavity inside, the atomic gas chamber is located inside the mounting cavity; the housing has an opening on one side of the mounting cavity for the atomic gas chamber to pass through, the opening communicating with the mounting cavity; the mounting block is detachably connected to the housing, and the mounting block either fills the opening or isolates the mounting cavity from the opening.
[0005] Preferably, the atomic gas chamber is disposed on the side of the mounting block facing the mounting cavity.
[0006] Preferably, the housing is provided with a blind hole extending in a first direction, the mounting cavity is formed in the blind hole, and the opening is formed at the opening of the blind hole; the mounting block extends into the blind hole from the opening.
[0007] Preferably, the blind hole is a square blind hole, and the mounting block is a square block.
[0008] Preferably, the housing includes a first shell block, a second shell block, a third shell block, a fourth shell block, and a fifth shell block; the first shell block, the second shell block, the third shell block, and the fourth shell block are connected in sequence to form a semi-molded shell with a square through hole, and the fifth shell block closes one end of the square through hole so that the square through hole forms the blind hole.
[0009] Preferably, the fifth shell block has a mounting groove on the side opposite to the mounting cavity, the mounting groove extending in the same direction as the first direction, and the temperature sensor is disposed in contact with the inner wall of the mounting groove.
[0010] Preferably, the second shell block and the fourth shell block are located between the first shell block and the third shell block. There are two heating elements, one of which is disposed on the side of the first shell block away from the third shell block, and the other heating element is disposed on the side of the third shell block away from the first shell block. Both heating elements are provided with light-transmitting holes at the positions corresponding to the atomic gas chambers.
[0011] Preferably, it further includes: a heat-insulating shell and a heat-insulating cover; the heat-insulating shell is provided with a heat-insulating cavity, the heat-insulating shell is provided with a heat-insulating opening communicating with the heat-insulating cavity, the heat-insulating cover is detachably connected to the heat-insulating shell, and the heat-insulating cover seals the heat-insulating opening, the heat-conducting shell is disposed in the heat-insulating cavity; the heat-insulating shell is provided with a light-passing hole at the position corresponding to the two light-transmitting holes, and the light-transmitting holes communicate with the outside through the light-passing holes.
[0012] Preferably, a partition is provided inside the housing, which divides the chamber inside the housing into a heat insulation chamber and a thermal insulation chamber, with the heat insulation chamber surrounding the thermal insulation chamber.
[0013] Preferably, the outer shell of the atomic gas chamber, the housing, and the mounting block are all made of glass.
[0014] The atomic gas chamber heating device provided by this invention has the following advantages: the heat-conducting shell is composed of a shell and a mounting block. When the mounting block is removed from the shell, the mounting cavity communicates with the external space through an opening. This allows workers or operators to remove the atomic gas chamber located within the mounting cavity from the opening for replacement, facilitating the replacement of the atomic gas chamber in the heating device. Furthermore, when the atomic gas chamber is installed in the mounting cavity, the mounting block can fill the opening or isolate the mounting cavity from it, effectively cutting off the channel between the mounting cavity and the external space. Since both the shell and the mounting block are made of transparent material... Even so, light can still pass through the heat-conducting block and irradiate the atomic gas chamber, ensuring that the atomic gas chamber can be used normally. Moreover, there is no air convection for heat exchange between the space inside the installation cavity and the external space, which makes it difficult for the temperature inside the installation cavity to be lost outward, thereby improving the heat insulation effect of the heat-conducting shell and making the temperature inside the installation cavity more uniform, which in turn makes the temperature of the atomic gas chamber more uniform. Compared with the prior art, the atomic gas chamber heating device in this embodiment does not require opening additional light-transmitting holes in the heat-conducting shell. It not only has a good heat insulation effect and makes the temperature of the space where the atomic gas chamber is located more uniform, but also facilitates the replacement of the atomic gas chamber, making the replacement operation simpler and more convenient to use. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the atomic gas chamber heating device according to an embodiment of the present invention; Figure 2 This is an exploded structural diagram of the atomic gas chamber heating device according to an embodiment of the present invention; Figure 3 This is an exploded structural diagram of the heat-conducting shell, heating element, atomic gas chamber, and temperature sensor according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the disassembled structure of the mounting block and the housing according to an embodiment of the present invention; Figure 5 This is a cross-sectional structural schematic diagram of the atomic gas chamber heating device according to an embodiment of the present invention; Figure 6 This is a schematic cross-sectional view of the installation block and the housing after disassembly according to an embodiment of the present invention.
[0016] In the diagram, 100 is the heat-conducting shell; 110 is the shell; 111 is the mounting cavity; 112 is the opening; 113 is the blind hole; 114 is the first shell block; 115 is the second shell block; 116 is the third shell block; 117 is the fourth shell block; 118 is the fifth shell block; 119 is the mounting groove; 120 is the mounting block; 200 is the heating element; 212 is the light-transmitting hole; 300 is the atomic gas chamber; 400 is the temperature sensor; 500 is the heat-insulating shell; 510 is the heat-insulating cavity; 520 is the heat-insulating opening; 530 is the light-transmitting hole; 540 is the partition; 550 is the heat-insulating cavity; 560 is the light-transmitting through hole; and 600 is the heat-insulating cover. Detailed Implementation
[0017] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.
[0018] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.
[0019] In the description of this invention, "multiple" means two or more; "greater than," "less than," and "exceeding" are understood to exclude the stated number; "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.
[0020] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.
[0021] Please refer to the following: Figures 1 to 6 The atomic gas chamber heating device provided in the embodiments of the present invention will now be described. An atomic gas chamber is a sealed container that can contain alkali metal atoms and is a core component of quantum instruments such as chip-level atomic clocks, atomic gyroscopes, and atomic magnetometers.
[0022] like Figures 1 to 5As shown, an atomic gas chamber heating device according to an embodiment of the present invention includes: a heat-conducting shell 100, a heating element 200, an atomic gas chamber 300, and a temperature sensor 400; the heat-conducting shell 100 includes a housing 110 and a mounting block 120; both the housing 110 and the mounting block 120 are made of transparent material; the heating element 200 is in contact with the housing 110; the temperature sensor 400 is in contact with the housing 110; the housing 110 has a mounting cavity 111 inside, the atomic gas chamber 300 is located in the mounting cavity 111; the housing 110 has an opening 112 on one side of the mounting cavity 111 for the atomic gas chamber 300 to pass through, the opening 112 is connected to the mounting cavity 111; the mounting block 120 is detachably connected to the housing 110, and the mounting block 120 either fills the opening 112 or isolates the mounting cavity 111 from the opening 112.
[0023] The heat-conducting shell 100 is composed of a shell 110 and a mounting block 120, wherein the shell 110 and the mounting block 120 are detachably connected. When the mounting block 120 is removed from the shell 110, the mounting cavity 111 communicates with the external space through the opening 112, allowing workers or operators to remove the atomic gas chamber 300 located in the mounting cavity 111 from the opening 112 for replacement, facilitating the replacement of the atomic gas chamber 300 in the heating device. Furthermore, since both the shell 110 and the mounting block 120 are made of transparent material, when the atomic gas chamber 300 is installed in the mounting cavity 111, the mounting block 120 can fill or allow the mounting... The cavity 111 is separated from the opening 112, that is, the mounting block 120 cuts off the channel between the mounting cavity 111 and the external space. Light can still pass through the heat-conducting block and irradiate the atomic gas chamber 300, ensuring that the atomic gas chamber 300 can be used normally. After the mounting block 120 cuts off the channel between the mounting cavity 111 and the external space, the space of the mounting cavity 111 where the atomic gas chamber 300 is located is sealed. There is no air convection for heat exchange between the space inside the mounting cavity 111 and the external space, so that the temperature inside the mounting cavity 111 is not easy to lose to the outside, thereby improving the heat insulation effect of the heat-conducting shell 100, making the temperature inside the mounting cavity 111 more uniform, and thus making the temperature of the atomic gas chamber 300 more uniform.
[0024] The heating element 200 is an electric heater that heats up when powered on. It contacts the housing 110, transferring heat to the entire heat-conducting shell 100 and thus the space within the mounting cavity 111, thereby heating the atomic gas chamber 300. A temperature sensor 400 contacts the housing 110, converting its temperature into an electrical signal and sending it to a control terminal. The control terminal then sends a corresponding control signal to the heating element 200 based on the current temperature of the housing 110, controlling its output power to regulate the temperature of the entire heat-conducting shell 100 and consequently the temperature of the space within the mounting cavity 111 of the atomic gas chamber 300. The control terminal stores a preset temperature. If the temperature sensor 400 detects that the current temperature of the housing 110 is higher than the preset temperature, the control terminal controls the heating element 200 to reduce the output power or turn it off to prevent the temperature of the housing 110 from continuing to rise. If the temperature sensor 400 detects that the current temperature of the housing 110 is lower than the preset temperature, the control terminal controls the heating element 200 to increase the output power or maintain the rated power for continuous heating.
[0025] In this embodiment, the heat-conducting shell 100 of the atomic gas chamber heating device is composed of a shell 110 and a mounting block 120. When the mounting block 120 is removed from the shell 110, the mounting cavity 111 communicates with the external space through the opening 112. Then, the worker or operator can remove the atomic gas chamber 300 located in the mounting cavity 111 from the opening 112 for replacement, facilitating the replacement of the atomic gas chamber 300 in the heating device. Furthermore, when the atomic gas chamber 300 is installed in the mounting cavity 111, the mounting block 120 can fill the opening 112 or isolate the mounting cavity 111 from the opening 112, that is, the mounting block 120 cuts off the channel between the mounting cavity 111 and the external space. Because the shell 110, The mounting blocks 120 are all made of transparent material, allowing light to pass through the heat-conducting blocks and reach the atomic gas chamber 300, ensuring its normal operation. Furthermore, the space inside the mounting cavity 111 does not exchange heat with the external space through air convection, preventing heat loss and improving the insulation effect of the heat-conducting shell 100. This results in a more uniform temperature within the mounting cavity 111, and consequently, a more uniform temperature in the atomic gas chamber 300. Compared to existing technologies, the atomic gas chamber heating device in this embodiment does not require additional light-transmitting holes in the heat-conducting shell 100. This not only provides better insulation and a more uniform temperature in the space where the atomic gas chamber 300 is located, but also facilitates replacement of the atomic gas chamber 300, making the replacement operation simpler and more convenient to use.
[0026] In some embodiments, refer to Figures 4 to 6The atomic gas chamber 300 is disposed on the side of the mounting block 120 facing the mounting cavity 111. That is, the atomic gas chamber 300 is fixedly connected to the mounting block 120. The atomic gas chamber 300 can be bonded to the mounting block 120 using a light-transmitting ultraviolet adhesive. This light-transmitting ultraviolet adhesive (also known as UV optical adhesive or shadowless adhesive) is a type of single-component adhesive that cures rapidly under ultraviolet light and has extremely high light transmittance after curing. It is primarily used for bonding and sealing transparent optical components, and its application in precision applications such as the atomic gas chamber 300 and optical instruments requires stringent conditions. Therefore, when the mounting block 120 is removed from the housing 110, the atomic gas chamber 300 can also be removed, facilitating its removal from the mounting cavity 111. Furthermore, during installation, assembling the mounting block 120 with the housing 110 secures the atomic gas chamber 300 within the mounting cavity 111, facilitating its assembly and disassembly.
[0027] In some embodiments, refer to Figures 4 to 6 The housing 110 is provided with a first direction (refer to) Figures 4 to 6 A blind hole 113 extends in the X direction, forming the mounting cavity 111 within the blind hole 113. The opening of the blind hole 113 forms the opening 112. The mounting block 120 extends into the blind hole 113 from the opening 112. The first direction is the direction in which the mounting block 120 extends into the blind hole 113 from the opening 112. After the mounting block 120 extends into the blind hole 113, it can directly fill the entire opening 112 to close the opening 112; or, when the mounting block 120 extends into the blind hole 113 and is located between the mounting cavity 111 and the opening 112, it can isolate the mounting cavity 111 from the opening 112 to prevent air convection between the mounting cavity 111 and the external space, thus ensuring the heat preservation effect. The size of the mounting block 120 is adapted to the size of the blind hole 113 so that the outer peripheral wall of the mounting block 120 contacts the inner wall of the blind hole 113, thereby blocking the passage between the mounting cavity 111 and the opening 112 and ensuring the heat insulation effect of the heat-conducting block.
[0028] In some embodiments, refer to Figures 4 to 6 The blind hole 113 is a square blind hole 113, and the mounting block 120 is a square block. Both the square blind hole 113 and the square mounting block 120 are easy to manufacture, and it is also convenient for the mounting block 120 to be positioned and assembled with the shell 110, so that the atomic gas chamber 300 is positioned and assembled in the mounting cavity 111.
[0029] In some embodiments, refer to Figures 3 to 6The housing 110 includes a first shell block 114, a second shell block 115, a third shell block 116, a fourth shell block 117, and a fifth shell block 118. The first shell block 114, the second shell block 115, the third shell block 116, and the fourth shell block 117 are sequentially connected to form a semi-molded shell with a square through hole. The fifth shell block 118 closes one end of the square through hole, so that the square through hole forms the blind hole 113. That is, the housing 110 is composed of five shell blocks, which are bonded together with light-transmitting ultraviolet adhesive. The first shell block 114, the second shell block 115, the third shell block 116, and the fourth shell block 117 are combined to form a rectangular cylindrical shell with a square through hole in the middle. Finally, the fifth shell block 118 is used to seal one end of the cylindrical shell, so that the square through hole forms the blind hole 113.
[0030] In some embodiments, refer to Figures 3 to 6 To allow the temperature sensor 400 to be positioned closer to the mounting cavity 111, the fifth housing block 118 has a mounting groove 119 on the side opposite to the mounting cavity 111. The extending direction of the mounting groove 119 is the same as the first direction, and the temperature sensor 400 is positioned in contact with the inner wall of the mounting groove 119. The mounting groove 119 is recessed into the mounting cavity 111 compared to the outer surface of the housing 110, allowing the temperature sensor 400 mounted in the mounting groove 119 to better detect the temperature of the space within the mounting cavity 111. The temperature sensor 400 can be in contact with the inner wall of the mounting groove 119 via thermally conductive silicone grease to better conduct the temperature of the housing 110 to the temperature sensor 400.
[0031] In some embodiments, refer to Figures 3 to 6 The second shell block 115 and the fourth shell block 117 are located between the first shell block 114 and the third shell block 116. There are two heating elements 200, one of which is located on the side of the first shell block 114 facing away from the third shell block 116, and the other is located on the side of the third shell block 116 facing away from the first shell block 114. Both heating elements 200 have light-transmitting holes 212 at positions corresponding to the atomic gas chamber 300. The first shell block 114 and the third shell block 116 are used to contact the heating elements 200. The gaps between the heating elements 200 and the first and third shell blocks 114 and 116 are filled with thermally conductive silicone grease to improve the heat conduction speed between the heating elements 200 and the first and third shell blocks 114 and 116. It is understood that the thermally conductive silicone grease is not applied near the light-transmitting holes 212 to avoid affecting light transmission.
[0032] In some embodiments, refer to Figures 1 to 2 , Figure 5The atomic gas chamber heating device further includes: a heat-insulating shell 500 and a heat-insulating cover 600; the heat-insulating shell 500 is provided with a heat-insulating cavity 510, and the heat-insulating shell 500 is provided with a heat-insulating opening 520 communicating with the heat-insulating cavity 510; the heat-insulating cover 600 is detachably connected to the heat-insulating shell 500, and the heat-insulating cover 600 covers the heat-insulating opening 520; the heat-conducting shell 100 is disposed in the heat-insulating cavity 510; the heat-insulating shell 500 is provided with a light-passing hole 530 at the position corresponding to the two light-transmitting holes 212, and the light-transmitting holes 212 communicate with the outside through the light-passing holes 530. The heat-insulating shell 500 and the heat-insulating cover 600 cover the heat-conducting shell 100 in the heat-insulating cavity 510 to maintain the temperature of the heat-conducting shell 100, improve the heat insulation effect, and allow light to shine into the atomic gas chamber 300 along the light-passing holes 530 and the light-transmitting holes 212. When the atomic gas chamber 300 needs to be replaced, the insulation cover 600 can be removed from the insulation shell 500, and then the mounting block 120 can be removed from the shell 110, so that the atomic gas chamber 300 can be removed for replacement.
[0033] In some embodiments, refer to Figures 1 to 2 , Figure 5 The housing 110 is provided with a partition 540, which divides the chambers within the housing 110 into a heat insulation chamber 550 and a thermal insulation chamber 510. The heat insulation chamber 550 surrounds the thermal insulation chamber 510. The heat insulation chamber 550 may be filled with thermal insulation material (such as porous vacuum silicone insulation cotton) to reduce heat loss from the heat-conducting shell 100.
[0034] In some embodiments, the outer shell of the atomic gas chamber 300, the housing 110, and the mounting block 120 are all made of glass, i.e., the outer shell of the atomic gas chamber 300, the housing 110, and the mounting block 120 are all made of the same material, thereby making heat conduction more uniform, facilitating light transmission, and making it convenient to use. In addition, the transparent material of the heat-conducting shell 100 is not limited to glass; any transparent and thermally conductive material can be used, such as sapphire. This atomic gas chamber heating device is not limited to nuclear magnetic resonance gyroscope systems and can also be used in other physical systems, such as atomic clocks and magnetometers.
[0035] In summary, the heat-conducting shell 100 of the atomic gas chamber heating device is composed of a shell 110 and a mounting block 120. When the mounting block 120 is removed from the shell 110, the mounting cavity 111 communicates with the external space through the opening 112. This allows workers or operators to remove the atomic gas chamber 300 located in the mounting cavity 111 from the opening 112 for replacement, facilitating the replacement of the atomic gas chamber 300 in the heating device. Furthermore, when the atomic gas chamber 300 is installed in the mounting cavity 111, the mounting block 120 can fill the opening 112 or isolate the mounting cavity 111 from the opening 112, effectively cutting off the passage between the mounting cavity 111 and the external space. Because the shell 110 and the mounting block 120... All the mounting blocks 120 are made of transparent material, allowing light to pass through and reach the atomic gas chamber 300, ensuring its normal operation. Furthermore, the space inside the mounting cavity 111 does not exchange heat with the external space through air convection, preventing heat loss and improving the insulation effect of the heat-conducting shell 100. This results in a more uniform temperature within the mounting cavity 111, and consequently, a more uniform temperature in the atomic gas chamber 300. Compared to existing technologies, the atomic gas chamber heating device in this embodiment does not require additional light-transmitting holes in the heat-conducting shell 100. This not only provides better insulation and a more uniform temperature in the space containing the atomic gas chamber 300, but also facilitates replacement of the atomic gas chamber 300, making the replacement operation simpler and more convenient to use.
[0036] The above are merely preferred embodiments of the present invention. It should be noted that those skilled in the art can make several improvements and substitutions without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.
Claims
1. A heating device for an atomic gas chamber, characterized in that, include: The device comprises a heat-conducting shell, a heating element, an atomic gas chamber, and a temperature sensor. The heat-conducting shell includes a housing and a mounting block. Both the housing and the mounting block are made of transparent material. The heating element is in contact with the housing. The temperature sensor is in contact with the housing. The housing has a mounting cavity inside, and the atomic gas chamber is located inside the mounting cavity. The housing has an opening on one side of the mounting cavity for the atomic gas chamber to pass through. The opening communicates with the mounting cavity. The mounting block is detachably connected to the housing, and the mounting block either fills the opening or isolates the mounting cavity from the opening.
2. The atomic gas chamber heating device according to claim 1, characterized in that, The atomic gas chamber is located on the side of the mounting block facing the mounting cavity.
3. The atomic gas chamber heating device according to claim 1, characterized in that, The housing is provided with a blind hole extending in a first direction, the mounting cavity is formed in the blind hole, and the opening is formed at the opening of the blind hole; the mounting block extends into the blind hole from the opening.
4. The atomic gas chamber heating device according to claim 3, characterized in that, The blind hole is square, and the mounting block is square.
5. The atomic gas chamber heating device according to claim 4, characterized in that, The housing includes a first shell block, a second shell block, a third shell block, a fourth shell block, and a fifth shell block; the first shell block, the second shell block, the third shell block, and the fourth shell block are connected in sequence to form a semi-molded shell with a square through hole, and the fifth shell block closes one end of the square through hole so that the square through hole forms the blind hole.
6. The atomic gas chamber heating device according to claim 5, characterized in that, The fifth shell block has a mounting groove on the side opposite to the mounting cavity. The extension direction of the mounting groove is the same as the first direction. The temperature sensor is disposed in contact with the inner wall of the mounting groove.
7. The atomic gas chamber heating device according to claim 5, characterized in that, The second shell block and the fourth shell block are located between the first shell block and the third shell block. There are two heating elements, one of which is located on the side of the first shell block away from the third shell block, and the other heating element is located on the side of the third shell block away from the first shell block. Both heating elements have light-transmitting holes at the positions corresponding to the atomic gas chambers.
8. The atomic gas chamber heating device according to claim 7, characterized in that, Also includes: The insulation shell and the insulation cover; the insulation shell is provided with an insulation cavity, the insulation shell is provided with an insulation port communicating with the insulation cavity, the insulation cover is detachably connected to the insulation shell and the insulation cover covers the insulation port, and the heat-conducting shell is disposed in the insulation cavity; The heat insulation shell is provided with light-passing holes at the positions corresponding to the two light-transmitting holes, and the light-transmitting holes are connected to the outside through the light-passing holes.
9. The atomic gas chamber heating device according to claim 8, characterized in that, The housing is provided with a partition, which divides the chamber inside the housing into a heat insulation chamber and a thermal insulation chamber, with the heat insulation chamber surrounding the thermal insulation chamber.
10. The atomic gas chamber heating device according to any one of claims 1-9, characterized in that, The outer shell of the atomic gas chamber, the housing, and the mounting block are all made of glass.