Heat dissipation device and applicable power module thereof

Abstract

A heat dissipation device comprises a first plate-shaped body and a second plate-shaped body. The first plate-shaped body comprises a first plate piece. The first plate has a plurality of holes. The first plate has a first surface and a second surface opposite to each other, and the first surface faces a heating source in the power module. The second plate-shaped body and the first plate-shaped body are arranged in an overlapped mode, and the second plate-shaped body comprises a second plate piece and a plurality of protruding pieces. The second plate is provided with a third face and a fourth face which are opposite to each other, and the third face is adjacent to the second face. The protruding pieces are arranged on the third face, and at least one part of the protruding pieces correspondingly penetrate through the holes and make contact with the heating source.

Description

Technical Field

[0001] This case relates to a heat dissipation device, and more particularly to a heat dissipation device suitable for use in power modules. Background Technology

[0002] Generally, power modules are equipped with heat dissipation devices to cool heat sources (such as circuit boards), thereby helping to improve the reliability and durability of the power module.

[0003] Typically, a heat dissipation device comprises two stacked plates, with the lower plate having multiple protrusions facing the upper plate, sandwiching the upper plate between them. The lower plate contacts the heat source within the power module, such as the circuit board, and then removes heat generated by the heat-generating components on the circuit board through contact with a liquid cooling system. In this approach, the heat generated by the heat source is first transferred to the lower plate, then to the multiple protrusions, and finally carried away by the liquid passing through the protrusions, requiring multiple conduction steps, which can easily lead to poor heat dissipation efficiency. Furthermore, the two plates need to be additionally joined together by methods such as welding, for example, welding the upper plate to the protrusions of the lower plate, increasing the complexity of the heat dissipation device assembly process.

[0004] Therefore, it is necessary to develop a heat dissipation device that can improve the above-mentioned shortcomings and a power module suitable for it. Summary of the Invention

[0005] The purpose of this invention is to provide a heat dissipation device and a power module thereof, wherein the heat dissipation device has improved heat dissipation efficiency and a simplified assembly process.

[0006] To achieve the above objectives, this invention provides a heat dissipation device suitable for power modules. The heat dissipation device includes a first plate and a second plate. The first plate includes a first plate member and a plurality of holes. The first plate member has a first surface and a second surface facing each other, with the first surface facing a heat source in the power module. The second plate is stacked on top of the first plate and includes a second plate member and a plurality of protrusions. The second plate member has a third surface and a fourth surface facing each other, with the third surface adjacent to the second surface. The plurality of protrusions are disposed on the third surface, and at least a portion of the plurality of protrusions passes through the plurality of holes and contacts the heat source.

[0007] To achieve the above objectives, this invention further provides a power module, including a heat source and a heat dissipation device. The heat dissipation device is used to dissipate heat from the heat source and includes a first plate and a second plate. The first plate includes a first component and a plurality of holes. The first component has a first surface and a second surface that are opposite to each other, and the first surface faces the heat source in the power module. The second plate is stacked on top of the first plate. The second component has a third surface and a fourth surface that are opposite to each other, and the third surface is adjacent to the second surface. A plurality of protrusions are disposed on the third surface, and at least a portion of the plurality of protrusions passes through the plurality of holes and contacts the heat source.

[0008] The heat dissipation device in this case features a structure design where a protrusion on the upper second plate passes through the lower first plate, allowing a portion of the second plate in contact with the liquid cooling system to directly contact the heat source. This effectively improves heat transfer and increases heat dissipation efficiency. Furthermore, the protrusion's cross-sectional dimensions and / or shape can be varied to accommodate changes in the size of the heat source it contacts, further ensuring effective heat dissipation. Moreover, the design of the protrusion passing through the lower first plate allows the assembly process between the two plates to be completed simultaneously during the integration of the heat dissipation device with the heat source within the power module, effectively reducing the assembly complexity of the heat dissipation device. Attached Figure Description

[0009] Figure 1 This diagram shows a schematic representation of the heat dissipation device according to an embodiment of the present invention.

[0010] Figure 2A This diagram shows an exploded view of the heat dissipation device according to an embodiment of the present invention.

[0011] Figure 2B This shows an exploded view of the heat dissipation device according to an embodiment of the present invention.

[0012] Figure 3A Showing a side view of the first plate-shaped body of the heat dissipation device according to an embodiment of this case.

[0013] Figure 3B Showing a side view of the heat dissipation device in the assembled state according to an embodiment of this case.

[0014] Figure 4 This shows a perspective cross-sectional view of the heat dissipation device in its assembled state according to an embodiment of the present invention.

[0015] Figure 5 This shows an exploded top view of a heat dissipation device according to another embodiment of the present invention.

[0016] Figure 6 This shows an exploded top view of a heat dissipation device according to another embodiment of the present invention.

[0017] Explanation of reference numerals in the attached figures

[0018] 100, 100a, 100b: Heat dissipation device

[0019] 20, 20a, 20b: first plate-shaped body,

[0020] 21: First plate

[0021] 211: First page

[0022] 212: Second page

[0023] 22, 22a, 22a', 22b, 22b': Holes,

[0024] 23: Protruding part

[0025] 24: Protrusion,

[0026] 30, 30a, 30b: second plate-shaped body,

[0027] 31: Second plate,

[0028] 311: The Third Side

[0029] 312: The Fourth Page

[0030] 32, 32a, 32a', 32b, 32b': Protruding parts,

[0031] 33: First undulating structure,

[0032] 34: Second undulating structure

[0033] H1: First protrusion height,

[0034] H2: Second protrusion height

[0035] X, Y, Z: Axes. Detailed Implementation

[0036] Some typical embodiments embodying the features and advantages of this invention will be described in detail in the following description. It should be understood that the invention can be varied in different ways without departing from the scope of the invention, and the descriptions and illustrations herein are for illustrative purposes only and not intended to limit the invention.

[0037] Please see Figure 1 , Figure 2A and Figure 2B . Figure 1 This diagram shows a schematic representation of the heat dissipation device according to an embodiment of the present invention. Figure 2A An exploded view of the heat dissipation device according to an embodiment of this case is shown, and Figure 2BThis diagram shows an exploded view of the heat dissipation device according to an embodiment of the present invention. The heat dissipation device 100 includes a first plate-shaped body 20 and a second plate-shaped body 30, which are arranged in a superimposed manner with the second plate-shaped body 30 above the first plate-shaped body 20, that is, the second plate-shaped body 30 is higher than the first plate-shaped body 20 in the Z direction. The first plate-shaped body 20 includes a first plate member 21, and the second plate-shaped body 30 includes a second plate member 31. The first plate member 21 of the first plate-shaped body 20 has a first surface 211 and a second surface 212 that are opposite each other, and the first surface 211 is lower than the second surface 212 in the Z direction. The second plate member 31 of the second plate-shaped body 30 has a third surface 311 and a fourth surface 312 that are opposite each other, and the third surface 311 is lower than the fourth surface 312 in the Z direction. When the first plate-shaped body 20 and the second plate-shaped body 30 are superimposed, the second surface 212 of the first plate-shaped body 20 and the third surface 311 of the second plate-shaped body 30 are adjacent to each other.

[0038] The heat dissipation device 100 in this invention is mainly used in power modules to provide heat dissipation for heat sources (not shown). For example, the heat source can be a circuit board, such as a circuit board using an AMB ceramic substrate, or other types of circuit boards, and it can especially provide heat dissipation for heat-generating components on the circuit board, such as dies. In actual use, the heat dissipation device 100 is disposed on the circuit board with its first surface 211 facing the circuit board, for example, by means of soldering or sintering; and then achieves the effect of heat dissipation for the circuit board by contacting a liquid cooling system. For example, the liquid in the liquid cooling system mainly passes through the second plate 30 and the space between the first plate 20 and the second plate 30 to carry away the heat generated by the components on the circuit board in contact with it, thereby achieving the heat dissipation effect.

[0039] To enhance heat dissipation and improve assembly processes, the heat dissipation device 100 in this design features a unique structural design. Please also refer to... Figures 1 to 4 ,in Figure 3A This shows a side view of the first plate-shaped body of the heat dissipation device according to an embodiment of the present invention. Figure 3B Showing a side view of the heat dissipation device in its assembled state according to an embodiment of this case, and Figure 4This diagram shows a perspective cross-sectional view of the heat dissipation device in its assembled state according to an embodiment of the present invention. The first plate 21 has multiple holes 22 penetrating both the first surface 211 and the second surface 212. The second plate 30 further includes multiple protrusions 32 disposed on the third surface 311 of the second plate 31 facing the second surface 212 of the first plate 20. Specifically, the positions of the holes 22 correspond to the protrusions 32, allowing the protrusions 32 to pass through them. That is, when the first plate 20 and the second plate 30 are stacked together, the protrusions 32 on the second plate 31 pass through the corresponding holes 22 and are exposed on the first surface 211 of the first plate 21. In this configuration, the protrusions 32, which are part of the second plate 30, can directly contact a heat source, such as a circuit board, allowing heat to be directly transferred to the second plate 30 in contact with the liquid cooling system without needing to pass through the first plate 20 as an intermediate transfer point, effectively increasing heat dissipation efficiency.

[0040] Depending on the different configurations of the circuit boards and components in different power modules, the number and position of the protrusions 32 passing through the holes 22 can be changed according to actual needs. For example, the number and position of the protrusions 32 penetrating the first plate 21 can be varied according to the number and position of the heating components on the circuit board. In one embodiment, all the protrusions 32 of the second plate-like body 30 penetrate the first plate 21 through the holes 22. In another embodiment, a portion of the protrusions 32 of the second plate-like body 30 penetrate the first plate 21 through the holes 22, while the other portions abut against the second surface 212 of the first plate 21 and do not penetrate the first plate 21. In other words, the number of holes 22 varies with the number of protrusions 32 penetrating the first plate 21, and the two numbers are equal.

[0041] The exposure state of the protrusion 32 on the first surface 211 of the first plate 21 also varies depending on actual requirements. For example, in one embodiment, the protrusion 32 may be flush with the first surface 211. In another embodiment, such as... Figure 3BAs shown, the protrusion 32 can also be configured to have a first protrusion height H1 relative to the first surface 211. For example, the first protrusion height H1 can be determined in accordance with the height of the components on the circuit board facing the first surface 211, for example, protruding by about 0.1-0.2 nm. In this case, the first plate-like body 20 can correspondingly have a protrusion 23 on the first surface 211 and a second protrusion height H2 relative to the first surface 211, so as to form a contact surface with the circuit board together with the protrusion 32. In other words, the first protrusion height H1 can be greater than or equal to zero, while the second protrusion height H2 is greater than zero. It should be noted that the first protrusion height H1 of each protrusion 32 may be the same or different, and the second protrusion height H2 of each protrusion 23 may also be the same or different. Furthermore, the first protrusion height H1 of the protrusion 32 and the second protrusion height H2 of the protrusion 23 may be the same or different from each other. For example, depending on the different heights of components at different positions on the circuit board relative to the circuit board mounting surface, a protrusion 32 / protrusion 23 with a larger protrusion height may be provided at a position where the relative height of the component is lower, and / or a protrusion 32 / protrusion 23 with a smaller protrusion height may be provided at a position where the relative height of the component is higher. Therefore, this is not limited to what is shown in the accompanying drawings and does not depart from the scope of the claims in this case.

[0042] On the other hand, in this case, the assembly process between the first plate 20 and the second plate 30 can be further simplified by using the structural design of the protrusion 32 passing through the hole 22. Since the protrusion 32 is directly disposed on the second plate 31 and directly passes through the hole 22 of the first plate 21, the bonding between the second plate 30 and the first plate 20 can be completed simultaneously through the soldering or sintering process when the heat dissipation device 100 is disposed on the circuit board, reducing the step of soldering the upper plate to the protrusion on the lower plate in the prior art. Specifically, this case completes the assembly between the two plates simultaneously through the existing bonding process between the heat dissipation device 100 and the circuit board. Furthermore, since the molten solder (e.g., sheet solder) during the welding or sintering process can fill the gap between the hole 22 and the protrusion 32, it can also ensure that the liquid of the liquid cooling system does not leak out from the gap. Therefore, the width of the gap between the hole 22 and the protrusion 32 is not limited, and can be filled by the molten solder regardless of whether it is implemented as a tight fit or a loose fit. In addition, the molten solder also helps to fill the difference in the different protrusion heights of the protrusion 32 / protrusion 23 on the first surface 211.

[0043] The first plate 20 can be integrally formed or composed of various components, and the second plate 30 can also be integrally formed or composed of various components, without limitation. In a preferred embodiment, the first plate 20 and the second plate 30 are integrally formed. The two are assembled by means of a protrusion 32 passing through a hole 22, combined with the soldering process between the first surface 211 and the circuit board, thus achieving the assembly of the plates and the connection between the heat dissipation device and the circuit board in the simplest steps.

[0044] Furthermore, the first plate-shaped body 20 further includes a protrusion 24 disposed on the second surface 212 of the first plate 21, which, together with the protrusion 32, constitutes a heat dissipation structure between the first plate 21 and the second plate 31, helping to increase the flow rate of the liquid in the liquid cooling system therebetween. Additionally, the second plate-shaped body 30 further includes a first undulating structure 33 disposed on the third surface 311 and a second undulating structure 34 disposed on the fourth surface 312. The undulating structure helps to increase the contact area between the liquid in the liquid cooling system and the second plate-shaped body 30, thereby improving the heat dissipation effect. In one embodiment, the protrusion 32 may be disposed at a relatively protruding position of the second undulating structure 34; in another embodiment, the protrusion 32 may be disposed at a relatively recessed position of the second undulating structure 34; in yet another embodiment, the protrusion 32 may be disposed at both the relatively protruding and recessed positions of the second undulating structure 34. Therefore, it is not limited to the figures shown.

[0045] Please see Figure 5 and Figure 6 . Figure 5 An exploded top view of a heat dissipation device according to another embodiment of this case is shown, and Figure 6 This shows an exploded top view of a heat dissipation device according to another embodiment of the present invention. Furthermore, the cross-sectional shape / size of the protrusion can be varied to match the size of the high-heat-generating component on the circuit board. For example, when a high-heat-generating component, such as a die, is disposed on the circuit board and has a large planar dimension, the corresponding protrusion can increase its cross-sectional dimension along the plane direction parallel to the second plate (i.e., the XY plane direction) to correspond to the larger planar dimension of the high-heat-generating component.

[0046] In one embodiment, such as Figure 5As shown, the heat dissipation device 100a includes a first plate-shaped body 20a and a second plate-shaped body 30a. The first plate-shaped body 20a has multiple holes 22a and multiple holes 22a', and the second plate-shaped body 30a has multiple protrusions 32a and multiple protrusions 32a'. The cross-sectional shapes of the protrusions 32a and holes 22a are approximately equal, and the cross-sectional shapes of the protrusions 32a' and holes 22a' are approximately equal. The cross-sectional dimensions of the protrusions 32a' are larger than those of the holes 22a, and the cross-sectional dimensions of the holes 22a' are larger than those of the holes 22a. In this embodiment, the cross-sectional shape of the protrusions 32a' is approximately square. In this case, the protrusions 32a' are suitable for placement on the corresponding circuit board at the location of a high-heat-generating component with a large planar size and approximately square shape, to further enhance the heat conduction effect on the high-heat-generating component.

[0047] In one embodiment, such as Figure 6 As shown, the heat dissipation device 100b includes a first plate-shaped body 20b and a second plate-shaped body 30b. The first plate-shaped body 20b has multiple holes 22b and multiple holes 22b', and the second plate-shaped body 30b has multiple protrusions 32b and multiple protrusions 32b'. The cross-sectional shapes of the protrusions 32b and the holes 22b are approximately equal, and the cross-sectional shapes of the protrusions 32b' and the holes 22b' are approximately equal. Furthermore, the cross-sectional dimensions of the protrusions 32b' are larger than those of the holes 22b, and the cross-sectional dimensions of the holes 22b' are larger than those of the holes 22b. In this embodiment, the cross-sectional shape of the protrusions 32b' is approximately circular. In this case, the protrusions 32b' are suitable for placement on the corresponding circuit board at the location of a high-heat-generating component with a large planar size and approximately circular shape, to further enhance the heat conduction effect on the high-heat-generating component.

[0048] It should be noted that the number of holes 22a' and 22b' and protrusions 32a' and 32b' can be implemented as one or more, and their placement is not limited to the placement of high-heat-generating components. They can be increased or decreased as needed, and are not limited to the figures shown in the attached drawings. All of these are feasible.

[0049] In another embodiment, the first plate-shaped bodies 20a and 20b may be provided with only holes 22a' and 22b' for protrusions 32a' and 32b' with larger cross-sectional dimensions to pass through, that is, without holes 22a and 22b, and other protrusions 32a and 32b do not pass through the first plate-shaped bodies 20a and 20b, so as to improve the heat transfer effect specifically for high-heat-generating components.

[0050] In other embodiments, the protrusion with a large cross-sectional dimension may also be implemented in other shapes, such as polygons, irregular shapes, etc. Therefore, it is not limited to the figures shown and can be changed according to the actual implementation.

[0051] Accordingly, the arrangement of the protrusions on the second plate can be changed according to actual needs. For example, the cross-sectional dimensions / shapes of the protrusions can be the same or different, the spacing between the protrusions can be the same or different, and / or the number and position of the protrusions passing through the first plate can be varied, so as to achieve the best heat dissipation effect in combination with the configuration of components on the circuit board, especially high-heat components. Therefore, it is not limited to the figures shown.

[0052] It should also be noted that, since the flow rate of the liquid between the first plate-shaped body and the second plate-shaped body is affected by the protrusions / protrusions disposed therebetween, when considering the size and placement of the protrusions 32, 32a, 32a' and the protrusions 24, a balance must be achieved between the liquid flow rate of the liquid cooling system and the spacing between the protrusions / protrusions, so as to avoid the excessively large cross-sectional size of the protrusions / protrusions and / or the excessively small spacing from hindering the liquid flow and causing the opposite effect of reducing the heat dissipation efficiency.

[0053] Furthermore, the first plate-shaped bodies 20, 20a, 20b and the second plate-shaped bodies 30, 30a, 30b of the heat dissipation devices 100, 100a, 100b in this case can be made of metal materials such as copper, aluminum, iron, or other materials commonly used for heat dissipation, and there are no restrictions on their use.

[0054] In summary, the heat dissipation device of this invention, through its structural design of a protrusion on the upper second plate passing through the lower first plate, allows a portion of the second plate in contact with the liquid cooling system to directly contact the heat source in the power module, thereby effectively improving heat transfer and increasing heat dissipation efficiency. Furthermore, since the protrusion passes through the lower first plate, the assembly of the first and second plates can be completed simultaneously through the welding process between the first plate and the heat source, effectively simplifying the assembly process. In addition, the cross-sectional dimensions, shape, number, and / or placement of the protrusion, and / or the number and position of the protrusions passing through the first plate, can all be varied according to the heat source, offering great application flexibility.

[0055] It should be noted that the above are merely preferred embodiments for illustrative purposes, and the scope of this application is not limited to the described embodiments. The scope of this application is determined by the claims of the appended patent application. Furthermore, this application may be modified in various ways by those skilled in the art, but none of these modifications shall depart from the protection sought by the claims of the appended patent application.

Claims

1. A heat dissipation device suitable for a power module, wherein, Include: A first plate-like body, comprising: A first plate has a first surface and a second surface facing each other, the first surface facing a heat source in the power module, wherein the first plate has a plurality of holes penetrating the first surface and the second surface; and A second plate-shaped body, stacked on top of the first plate-shaped body, includes: A second plate has a third surface and a fourth surface that are opposite to each other, and the third surface is adjacent to the second surface; as well as Multiple protrusions are disposed on the third surface, and at least a portion of the multiple protrusions are correspondingly inserted into the multiple holes and in contact with the heat source.

2. The heat dissipation device according to claim 1, wherein, The assembly process between the first plate and the second plate is achieved through the bonding process between the first plate and the heat source.

3. The heat dissipation device according to claim 2, wherein, The heat source is a circuit board in the power module, and the bonding process is a welding or sintering process.

4. The heat dissipation device according to claim 1, wherein, The number of the plurality of holes is equal to the number of the plurality of protrusions in at least a portion of the plurality of holes.

5. The heat dissipation device according to claim 1, wherein, Each of the plurality of protrusions has a cross-sectional shape along the direction of the third plane, and the plurality of protrusions includes at least two cross-sectional shapes.

6. The heat dissipation device according to claim 5, wherein, One of the at least two cross-sectional shapes corresponds to the shape of a heating component on the heat source.

7. The heat dissipation device according to claim 1, wherein, Each of the plurality of protrusions has a height relative to the third surface, and the plurality of protrusions includes at least two heights relative to the third surface.

8. The heat dissipation device according to claim 1, wherein, When at least a portion of the plurality of protrusions are inserted through the plurality of holes, they are exposed on the first surface and have a first protrusion height relative to the first surface, and the first protrusion height is greater than or equal to zero.

9. The heat dissipation device according to claim 1, wherein, The third surface of the second plate includes a first undulating structure, and the plurality of protrusions are disposed on the first undulating structure.

10. The heat dissipation device according to claim 1, wherein, The fourth surface of the second plate includes a second undulating structure.

11. The heat dissipation device according to claim 1, wherein, The first plate-like body also includes a plurality of protrusions disposed on the first surface, and has a second protrusion height relative to the first surface, and the second protrusion height is greater than zero.

12. The heat dissipation device according to claim 1, wherein, The first plate-like body also includes a plurality of protrusions disposed on the second surface and facing the third surface.

13. The heat dissipation device according to claim 1, wherein, The heat dissipation device is in contact with a liquid cooling system for heat dissipation.

14. A power module, wherein, Include: One heat source; and A heat dissipation device for dissipating heat from the heat source, and the heat dissipation device includes: A first plate-like body, comprising: A first plate has a first surface and a second surface facing each other, the first surface facing a heat source in the power module, wherein the first plate has a plurality of holes penetrating the first surface and the second surface; and A second plate-shaped body, stacked on top of the first plate-shaped body, includes: A second plate has a third surface and a fourth surface that are opposite to each other, and the third surface is adjacent to the second surface; as well as Multiple protrusions are disposed on the third surface, and at least a portion of the multiple protrusions are correspondingly inserted into the multiple holes and in contact with the heat source.

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