Ellipsoidal Mini COB backlight module and electronic equipment

Abstract

The invention relates to the technical field of backlight of display equipment, and provides an ellipsoidal Mini COB backlight module and electronic equipment, and the ellipsoidal Mini COB backlight module comprises a substrate which is provided with a light-emitting circuit; the packaging chip comprises a packaging structure and a light-emitting chip arranged in the packaging structure, the light-emitting chip is arranged on the substrate and electrically connected with the light-emitting circuit, and the light-emitting chip is a Mini LED; and the lens layer is connected to the substrate in a sealing manner and covers and packages the chip, and the lens layer is of a semi-ellipsoid structure. The lens layer is arranged to be in an ellipsoid shape, when light rays pass through the semi-ellipsoid lens layer, an oval light area is formed on the display screen, and under the conditions that the specifications of light-emitting chips are the same and other specification parameters are the same, the area of the light area formed by the semi-ellipsoid lens layer is larger than that of the light area formed by the semi-ellipsoid lens layer. Therefore, the number of the light-emitting chips required for illuminating the whole display screen can be reduced, so that the effect of reducing the production cost is achieved.

Description

Technical Field

[0001] This application relates to the field of display device backlight technology, and more specifically, to an ellipsoidal Mini COB backlight module and electronic device. Background Technology

[0002] Mini COB (Mini Chip on Board) is an advanced LED (light-emitting diode) display technology. It's a branch of chip-on-board packaging technology specifically designed to achieve smaller pixel pitches and higher display performance. In Mini COB technology, the LED chips are directly packaged on the PCB (Printed Circuit Board), rather than being packaged as individual LED beads and then mounted onto the circuit board. Mini COB technology enables displays to achieve extremely small pixel pitches of less than 1.0mm, thus providing clearer, more detailed image quality and wider viewing angles.

[0003] Currently, most displays are rectangular screens with varying lengths and widths. While LED chips packaged with Mini COB can provide better image quality, the large number of LED chips required for a display increases production costs.

[0004] Therefore, existing technologies still need improvement and development. Summary of the Invention

[0005] The purpose of this application is to propose an ellipsoidal Mini COB backlight module and electronic device to solve the technical problem that the large number of LED light-emitting chips required for the display screen in the prior art leads to high production costs.

[0006] To achieve the above objectives, a first aspect of this application provides an ellipsoidal Mini COB backlight module, comprising: A substrate, wherein a light-emitting circuit is provided on the substrate; A packaged chip includes a package structure and a light-emitting chip disposed within the package structure. The light-emitting chip is disposed on the substrate and electrically connected to the light-emitting circuit. The light-emitting chip is a Mini LED. A lens layer is sealed and connected to the substrate and covers the packaged chip. The lens layer has a semi-ellipsoidal structure.

[0007] Furthermore, the lens layer covers and seals the packaged chip, and the lens layer is a transparent silicone layer cured by dispensing.

[0008] Furthermore, the lens layer is provided with a plurality of light-expanding lenses, each light-expanding lens having a hemispherical structure. The vertical projection of the lens layer on the substrate is a first ellipse having a major axis and a minor axis. The vertical projection of the light-expanding lens on the substrate is a light-expanding projection. The plurality of light-expanding projections are symmetrical about the major axis and the minor axis and are located within the angle between the major axis and the minor axis.

[0009] In some embodiments, a plurality of the light-amplifying lenses are arranged sequentially along the outer surface of the lens layer, and the vertical projections of the centers of the plurality of light-amplifying lenses on the substrate are connected in sequence to form a second ellipse, the second ellipse being located within the first ellipse.

[0010] Furthermore, along the circumferential direction of the first ellipse from the major axis to the minor axis, the refractive indices of the plurality of light-expanding lenses increase sequentially and then decrease sequentially.

[0011] In some embodiments, the packaging structure includes a fluorescence conversion layer that covers at least the front side of the light-emitting chip. The fluorescence conversion layer is used to convert and mix the light emitted by the light-emitting chip to emit white light.

[0012] Furthermore, the encapsulation structure also includes a diffusion layer, which is a transparent silicone layer with diffusion powder inside, and the diffusion layer covers the fluorescence conversion layer.

[0013] In some embodiments, the encapsulation structure further includes a reflective layer, which is a transparent silicone layer with diffuser powder inside, wherein the proportion of diffuser powder in the reflective layer is greater than the proportion of diffuser powder in the diffuser layer, and the reflective layer covers the diffuser layer.

[0014] Furthermore, the diffusion powder includes any one or a combination of silica solid particles and titanium dioxide solid particles.

[0015] A second aspect of this application provides an electronic device including the aforementioned ellipsoidal Mini COB backlight module.

[0016] The beneficial effects of the ellipsoidal Mini COB backlight module and electronic device provided in this application are at least as follows: the lens layer of this application is set to be ellipsoidal. When light passes through the semi-ellipsoidal lens layer, it forms an elliptical light area on the display screen. Under the condition that the specifications of the light-emitting chips are the same and other specifications are the same, the area of ​​the light area formed by the semi-ellipsoidal lens layer is larger than the area of ​​the light area formed by the hemispherical lens layer. As a result, the number of light-emitting chips required to illuminate the entire display screen can be reduced, thereby achieving the effect of reducing production costs.

[0017] The light-expanding lens provided in this application can perform secondary diffusion of the light path. The light-expanding projection is located within the angle between the major and minor axes of the first ellipse. In other words, the light-expanding lens mainly performs secondary diffusion of the light path within the auxiliary light area, expanding the light area range of the auxiliary light area. After the light area range of the auxiliary light area is expanded, a part of the auxiliary light area can become the main light area, thereby expanding the range of the main light area. With a larger range of the main light area, the spacing between adjacent packaged chips can be set larger, reducing the number of packaged chips used and achieving the effect of reducing production costs.

[0018] The light-expanding lens of this application is configured with different refractive indices. After the light passes through the light-expanding lens for secondary diffusion, the annular light area formed on the screen is composed of multiple circular light spots. The size of the multiple circular light spots gradually increases and then decreases. The larger circular light spots are concentrated in the upper left, upper right, lower left, and lower right regions of the first ellipse, while the smaller circular light spots are concentrated in the upper, lower, left, and right regions of the first ellipse. The annular light area and the elliptical light area are combined to form a near-rectangular light area, which greatly increases the size of the main light area and further reduces the number of packaged chips used, thereby reducing production costs. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of the ellipsoidal Mini COB backlight module provided in the embodiments of this application; Figure 2 This is a top view of the ellipsoidal Mini COB backlight module provided in the embodiments of this application; Figure 3 A schematic diagram of the semi-ellipsoidal lens layer and the light-expanding lens provided in the embodiments of this application, projected vertically onto the substrate; Figure 4 A light gradation diagram formed by a hemispherical lens layer provided in an embodiment of this application; Figure 5 A light grading map formed by a semi-ellipsoidal lens layer provided in an embodiment of this application; Figure 6 A diagram showing the range of the light area formed after a light-expanding lens is provided on a semi-ellipsoidal lens layer according to an embodiment of this application; Figure 7 for Figure 6 A light distribution hierarchy map of the mid-light region; Figure 8 This is a layout diagram of packaged chips that use hemispherical and semi-ellipsoidal lens layers, respectively.

[0021] The following are the labeling elements in the figure: 1. Substrate; 2. Packaging chips; 21. Light-emitting chip; 22. Encapsulation structure; 221. Fluorescence conversion layer; 222. Diffusion layer; 223. Reflective layer; 3. Lens layer; 4. Amplifying lens; 5. First ellipse; 51. Major axis; 52. Minor axis; 6. The second ellipse; 7. Wide-angle projection; 8. Main light area; 9. Auxiliary light zone. Detailed Implementation

[0022] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0023] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate orientations or positions based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0024] The first aspect of this application provides an ellipsoidal Mini COB backlight module. The ellipsoidal Mini COB backlight module of this application is described below with reference to the accompanying drawings.

[0025] Please see Figure 1 and Figure 2The diagram shows the structure of the ellipsoidal Mini COB backlight module of this application. The ellipsoidal Mini COB backlight module includes a substrate 1, a packaged chip 2 and a lens layer 3. The packaged chip 2 and the lens layer 3 are both connected to the substrate 1. The lens layer 3 protects the packaged chip 2 and diffuses the light emitted by the packaged chip 2.

[0026] Specifically, a light-emitting circuit is provided on the substrate 1, and the packaged chip 2 includes a package structure 22 and a light-emitting chip 21 disposed within the package structure 22. The light-emitting chip 21 is disposed on the substrate 1 and electrically connected to the light-emitting circuit. The light-emitting chip 21 is a Mini LED (mini light-emitting diode). A lens layer 3 is sealed and connected to the substrate 1, and covers the packaged chip 2. The lens layer 3 has a semi-ellipsoidal structure.

[0027] The function of the lens layer 3 is to change the divergence angle and distribution of the light emitted by the light-emitting chip 21, thereby diffusing the light and expanding the light emission angle. Currently, the light-emitting chip 21 is provided with a hemispherical lens layer 3. It can be understood that the lens layer 3 is located on the light-emitting front of the light-emitting chip 21, and the display screen is located outside the lens layer 3. When the lens layer 3 is set as a hemispherical shape, the light forms a circular light area on the display screen after passing through the hemispherical lens layer 3. Multiple circular light areas are arranged in sequence to illuminate the entire display screen.

[0028] In this embodiment, the lens layer 3 is configured as an ellipsoid. Understandably, when light passes through the semi-ellipsoidal lens layer 3, it forms an elliptical light area on the display screen. Furthermore, assuming the light-emitting chips 21 have the same specifications and other parameters, the light area formed by the semi-ellipsoidal lens layer 3 is larger than that formed by the hemispherical lens layer 3. Therefore, the number of light-emitting chips 21 required to illuminate the entire display screen can be reduced, thereby lowering production costs.

[0029] Specifically, see Figure 4 , Figure 4 The circular light area on the display screen is formed by using a hemispherical lens layer 3. Figure 5 The elliptical light area formed on the display screen by using a semi-ellipsoidal lens layer 3 is larger than the area of ​​the circular light area.

[0030] Further, see Figure 8 , Figure 8 Figure (a) shows the number of light-emitting chips 21 required to illuminate the display screen when the circular light area is lit. Figure 8Figure (b) shows the number of light-emitting chips 21 required when the elliptical light area illuminates the display screen. It can be seen that, compared with the hemispherical lens layer 3, after setting the lens layer 3 to a semi-ellipsoidal shape, fewer light-emitting chips 21 can be set, thus reducing production costs.

[0031] In some embodiments, the lens layer 3 encapsulates and seals the packaged chip 2. The lens layer 3 is a transparent silicone layer cured by dispensing. Encapsulation and sealing means that the lens layer 3 completely covers the front and all sides of the packaged chip 2, with no gap between the lens layer 3 and the packaged chip 2. The lens layer 3 is formed on the substrate 1 using a dispensing curing process, which is convenient and can isolate the packaged chip 2 from external moisture. The lens layer 3 is attached to the substrate 1 and can also protect part of the light-emitting circuitry on the substrate 1.

[0032] Furthermore, during the dispensing process, the silicone needs to be melted and the fluid silicone is dripped onto the packaged chip 2 using a dispensing machine. After the fluid silicone covers the packaged chip 2 and forms a semi-ellipsoid, it is cooled and the fluid silicone solidifies to form a hard lens layer 3.

[0033] To facilitate the molding of the fluid silicone into a semi-ellipsoidal shape, guide lines protruding from the surface of substrate 1 are provided. These guide lines are arranged in a cross shape on substrate 1, corresponding to the major axis 51 and minor axis of the semi-ellipsoidal lens layer 3, respectively. During dispensing, the fluid silicone drips onto the packaged chip 2 and flows around the perimeter of the packaged chip 2 onto substrate 1. At this time, capillary action occurs between the guide lines and the fluid silicone, causing the fluid silicone to gradually flow and mold into a semi-ellipsoidal shape under the influence of the guide lines. This makes it easier to dispense and mold the fluid silicone into a semi-ellipsoidal lens layer 3, improving molding accuracy.

[0034] Furthermore, the guide line corresponding to the long axis 51 of the lens layer 3 is a long guide line, and the guide line corresponding to the short axis 52 of the lens layer 3 is a short guide line. The width of the long guide line is smaller than the width of the short guide line, so that the fluid silicone flows more along the long guide line and it is easier to form a semi-ellipsoidal lens layer 3.

[0035] Furthermore, the guide lines are configured as copper foil lines arranged on the substrate 1. One end of the copper foil line is connected to the light-emitting circuit on the substrate 1, and the other end is connected to the light-emitting chip 21. In other words, the guide lines are a portion of the light-emitting circuit protruding from the substrate 1, while the other portion of the light-emitting circuit is the printed circuit disposed on the substrate 1. By combining the guide lines with the light-emitting circuit, there is no need to set up the guide lines separately. By adjusting the arrangement of the light-emitting circuit, the forming of the lens layer 3 is promoted, saving costs and simplifying the layout.

[0036] Furthermore, as explained in the above embodiments, the semi-ellipsoidal lens layer 3 can form an elliptical light area on the display screen. To ensure the uniformity of brightness, the area inside the elliptical light area belongs to the main light area 8, and the area at the edge of the elliptical light area belongs to the auxiliary light area 9 due to its irregular shape. That is to say, when the packaged chip 2 is laid out on the substrate 1, the main light areas 8 of two adjacent elliptical light areas are connected in sequence, and the edge areas of two adjacent elliptical light areas can overlap with each other. In this way, there is no light leakage area between multiple elliptical light areas.

[0037] Whether the light area is elliptical or circular, there is no light leakage area when merging multiple light areas. (See [reference needed]). Figure 5 Therefore, the rectangular shadow area in the center of the elliptical light area is the main light area 8, and the remaining areas are the fill light areas 9. Similarly, see [reference needed]. Figure 4 The square shadow area in the center of the circular light area is the main light area 8, and the remaining areas are auxiliary light areas 9. It can be seen that even when the lens layer 3 is set to a semi-ellipsoidal shape, a large part of the resulting elliptical light area is still the auxiliary light area 9.

[0038] In some embodiments, to reduce the auxiliary light region 9 in the elliptical light region, see [reference needed]. Figures 1-3 The lens layer 3 is provided with multiple light-expanding lenses 4. The light-expanding lenses 4 are hemispherical structures. The vertical projection of the lens layer 3 on the substrate 1 is a first ellipse 5 with a major axis 51 and a minor axis 52. The vertical projection of the light-expanding lenses 4 on the substrate 1 is a light-expanding projection 7. The multiple light-expanding projections 7 are symmetrical about the major axis 51 and the minor axis 52 and are located within the angle between the major axis 51 and the minor axis 52.

[0039] After the light from the packaged chip 2 passes through the lens layer 3, the light-diffusing lens 4 is used to perform secondary diffusion of the light path. Furthermore, the light-diffusing projection 7 is located within the angle between the major axis 51 and the minor axis 52 of the first ellipse 5. In other words, the light-diffusing lens 4 primarily performs secondary diffusion of the light path within the auxiliary light area 9, expanding the light area range of the auxiliary light area 9. After the light area range of the auxiliary light area 9 expands, a portion of the auxiliary light area 9 can become the main light area 8, thereby expanding the range of the main light area 8. A larger main light area 8 allows for a larger spacing between adjacent packaged chips 2, reducing the number of packaged chips 2 used and achieving a reduction in production costs.

[0040] As seen in the attached diagram, see [reference]. Figure 6 , Figure 6 To define the range of the light area behind the expanding lens 4, it can be seen that by superimposing the circular light area formed by the expanding lens 4, the outline of the first ellipse 5 is closer to a rectangle, which greatly increases the area of ​​the main light area 8.

[0041] This allows for a further reduction in the number of light-emitting chips 21, thereby further lowering production costs.

[0042] Furthermore, multiple light-expanding projections 7 are symmetrical about the major axis 51 and the minor axis 52. That is to say, the light-expanding lens 4 is symmetrically arranged on the lens layer 3 relative to the major axis 51 and the minor axis 52. In this way, the expanded auxiliary light area 9 is also symmetrical about the main light area 8, ensuring the regularity of the shape of the light area, so that each expanded auxiliary light area 9 can be partially converted into the main light area 8.

[0043] Understandably, the light-expanding lens 4 is set on the outer surface of the semi-ellipsoidal lens layer 3. Considering the difficulty of the molding process, the light-expanding lens 4 is set as a hemispherical shape, which is easier to manufacture. The hemispherical light-expanding lens 4 is used to diffuse the light path of the auxiliary light area 9.

[0044] Furthermore, the lens layer 3 is formed by dispensing, and the light-expanding lens 4 is also formed by dispensing. Specifically, after the lens layer 3 is dispensed and cured, the lens layer 3 is a rigid lens silicone layer. Then, fluid silicone is symmetrically dispensed onto the lens layer 3 using a dispensing machine, and the temperature is gradually reduced during the dispensing process to allow the fluid silicone to cool and solidify into the light-expanding lens 4.

[0045] During the dispensing process, the bottom of the hemispherical light-expanding lens 4 is formed first, and then the top of the light-expanding lens 4 is formed upwards in sequence. During curing, in order to ensure the accurate shape of the light-expanding lens 4, it is necessary to cure quickly after dispensing. Because the bottom of the hemispherical light-expanding lens 4 has more silicone volume than the top, the silicone needs to be cured more quickly towards the top, especially when forming the top of the hemispherical shape.

[0046] Since the dispensing process involves a certain flow of fluid silicone from the dispensing machine, it is divided into a first stage and a second stage based on the time of fluid silicone flow. The fluid silicone flowing out in the first stage is used to form the lower half of the light-expanding lens 4, and the fluid silicone flowing out in the second stage is used to form the upper half of the light-expanding lens 4.

[0047] Therefore, in this embodiment, the ambient temperature gradually decreases during the dispensing process. This ensures the fluidity of the silicone rubber when molding the lower half of the expanding lens 4, allowing it to form a hemispherical shape after flowing out of the dispensing machine. Once the silicone rubber has completely flowed out of the dispensing machine, that is, when molding the upper half of the expanding lens 4, the basic outline of the lower half is already formed. Therefore, by lowering the temperature, the silicone rubber in the upper half solidifies quickly, ensuring molding efficiency and accuracy, and reducing molding errors.

[0048] Furthermore, the light-expanding lens 4 is disposed on the outer surface of the lens layer 3 and in the area between the top center and the bottom edge of the lens layer 3.

[0049] In some implementations, see Figure 3Multiple light-expanding lenses 4 are arranged sequentially along the outer surface of the lens layer 3. The vertical projection of the center of the multiple light-expanding lenses 4 onto the substrate 1 is connected in sequence to form a second ellipse 6, which is located inside the first ellipse 5.

[0050] Understandably, see Figure 5 The ellipsoidal lens layer 3 forms an elliptical light area. The main light area 8 in the elliptical light area is mainly the area of ​​its inscribed rectangle. Therefore, if the four areas of the upper left, upper right, lower left and lower right of the elliptical light area are expanded, the elliptical light area will approach a rectangle, the area of ​​the inscribed rectangle in the elliptical light area will become larger, and the main light area 8 will also become larger.

[0051] Furthermore, when the light from the packaged chip 2 is diffused through the lens layer 3, the bottom edge of the lens layer 3 has a very small diffusion effect; the diffusion effect is mainly achieved by the upper half of the lens layer 3. In other words, the light emitted by the packaged chip 2 mainly passes through the elliptical light area formed by the upper half of the lens layer 3.

[0052] Therefore, in this embodiment, the second ellipse 6 is located inside the first ellipse 5, which means that the light-expanding lens 4 is not set at the bottom edge of the lens layer 3. In other words, the light-expanding lens 4 is set in the upper half of the lens layer 3. The upper half of the lens layer 3 is the area where the lens layer 3 mainly plays a diffusion role. In this way, it can be ensured that the light-expanding lens 4 can diffuse the light that forms the elliptical light area a second time, so as to achieve the effect of adjusting the shape of the elliptical light area.

[0053] It should be noted that the light-expanding lens 4 is not located at the top center of the lens layer 3 because its function is to adjust the shape of the elliptical light area, thereby increasing the size of the main light area 8. If the light-expanding lens 4 were located at the top center of the lens layer 3, even though it would diffuse the light secondaryly, its effect on changing the shape of the elliptical light area would be minimal. Therefore, the light-expanding lens 4 is not located at the top center of the lens layer 3, but rather is positioned around the top center of the lens layer 3.

[0054] Furthermore, multiple light-expanding lenses 4 are disposed on the lens layer 3, and the multiple light-expanding lenses 4 are arranged sequentially and constructed into a ring. When the light is diffused a second time by the light-expanding lens 4, the light area after the second diffusion by the light-expanding lens 4 is constructed into a ring light area. The ring light area connects to the main light area 8 and extends outward from the main light area 8, thereby achieving the effect of expanding the main light area 8, and ensuring that the four periphery of the expanded main light area 8 is symmetrical and uniform, which is conducive to the overall expansion of the main light area 8.

[0055] Further, see Figure 5 When the expanding lens 4 is not installed on the lens layer 3, the light area formed by the lens layer 3 is a first ellipse, and the main light area 8 is the inscribed rectangle of the first ellipse 5. After the expanding lens 4 is installed, refer to... Figure 6 and Figure 7 The final light area is an irregular ellipse larger than the first ellipse 5. At this time, the main light area 8 is an inscribed rectangle inside the irregular ellipse. Compared with the irregular ellipse, it can be found that the upper left, upper right, lower left, and lower right areas of the first ellipse 5 are the main areas for light diffusion. That is to say, the light needs to be diffused more extensively in the upper left, upper right, lower left, and lower right areas of the lens layer 3, while other areas only need to undergo secondary diffusion in a small range.

[0056] Understandably, when the size of the light-expanding lenses 4 is the same, the greater the refractive index of the light-expanding lens 4, the larger the light diffusion angle. In some embodiments, along the circumference of the first ellipse 5 from the major axis 51 to the minor axis 52, the refractive indices of the multiple light-expanding lenses 4 increase sequentially and then decrease sequentially.

[0057] Continue reading Figure 6 After the light is diffused twice by the light-expanding lens 4, the ring-shaped light area formed on the screen is composed of multiple circular light spots. The size of the multiple circular light spots gradually increases and then decreases again, and this process repeats. The larger circular light spots are concentrated in the upper left, upper right, lower left, and lower right areas of the first ellipse, while the smaller circular light spots are concentrated in the upper, lower, left, and right areas of the first ellipse. In this way, the ring-shaped light area and the elliptical light area are combined to form a near-rectangular light area, which greatly increases the size of the main light area 8 and achieves the effect of reducing the number of packaged chips 2 used and reducing production costs.

[0058] Furthermore, by setting the refractive index of multiple light-expanding lenses 4 to a gradually changing size, the brightness of the light area can also be guaranteed.

[0059] Understandably, as light diffuses, the brightness of the resulting light area decreases. If multiple light-expanding lenses 4 arranged in a ring all use lenses with high refractive index, the resulting light area will be larger, but the brightness of the area around the light area will also decrease, resulting in the brightness of the area around the light area being much lower than that of the area inside the light area. From a practical point of view, the area around the light area cannot meet the requirements of the main light area 8, which greatly reduces the effect of expanding the main light area 8.

[0060] In this embodiment, after the light is diffused twice by the light-expanding lens 4, the overall brightness of the surrounding area of ​​the rectangular light area is higher. In other words, the surrounding area of ​​the rectangular light area can meet the requirements of the main light area 8, thus achieving the effect of expanding the main light area 8.

[0061] In some embodiments, the light-expanding lens 4 is made of cured silicone and manufactured using a dispensing machine. When manufacturing multiple light-expanding lenses 4 with different refractive indices, the refractive index of the light-expanding lens 4 is adjusted by adding diffusion particles into the silicone. Specifically, more diffusion particles are added to the light-expanding lenses 4 manufactured in the regions of the lens layer 3 corresponding to the upper left, upper right, lower left, and lower right of the first ellipse 5, while fewer diffusion particles are added to the light-expanding lenses 4 manufactured in the regions of the lens layer 3 corresponding to the top, bottom, left, and right of the first ellipse 5.

[0062] In some implementations, the light-emitting chip 21 is a blue light chip, that is, the light-emitting chip 21 emits blue light after being powered on, but in actual use, it is necessary to convert the blue light into white light.

[0063] See Figure 1 The encapsulation structure 22 includes a phosphor conversion layer 221, which covers at least the front side of the light-emitting chip 21. The phosphor conversion layer 221 is used to convert and mix the light emitted by the light-emitting chip 21 to emit white light.

[0064] The fluorescence conversion layer 221 includes a green light conversion layer and a red light conversion layer. The green light conversion layer faces the front of the light-emitting chip 21, and the red light conversion layer covers the green light conversion layer, with the green light conversion layer located between the light-emitting chip 21 and the red light conversion layer. Alternatively, the positions of the red and green light conversion layers can be reversed, with the red light conversion layer facing the front of the light-emitting chip 21, the green light conversion layer covering the red light conversion layer, and the red light conversion layer located between the light-emitting chip 21 and the green light conversion layer.

[0065] After the blue light chip emits blue light, the blue light is excited into green light when it passes through the green light conversion layer, and then excited into red light when it passes through the red light conversion layer, and then mixed to form white light.

[0066] In some embodiments, a red phosphor is disposed in the red light conversion layer and a green phosphor is disposed in the green light conversion layer, including but not limited to fluoride phosphors, such as KSF phosphor and KGF phosphor.

[0067] In some embodiments, in order to further expand the range of the main light area 8, in addition to the diffusion effect of the lens layer 3 and the light-expanding lens 4, the light can also be diffused by the packaging structure 22 of the packaged chip 2.

[0068] See Figure 1 The encapsulation structure 22 also includes a diffusion layer 222, which is a transparent silicone layer with diffusion powder inside, and the diffusion layer 222 covers the fluorescent conversion layer 221.

[0069] After entering the diffusion layer 222, the light undergoes path conversion through the diffusion powder, so that more light is emitted from the side of the light-emitting chip 21, thereby increasing the light emission angle of the packaged chip 2.

[0070] Further, see Figure 1 The encapsulation structure 22 also includes a reflective layer 223, which is a transparent silicone layer with diffuser powder inside. The proportion of diffuser powder in the reflective layer 223 is greater than the proportion of diffuser powder in the diffuser layer 222, and the reflective layer 223 covers the diffuser layer 222.

[0071] The diffuser is mainly used to scatter light. When the concentration of the diffuser is high, it can also reflect light. This is the working principle of the diffuser layer 222 and the reflective layer 223. After the reflective layer 223 is set, some of the light entering the reflective layer 223 will return to the diffuser layer 222, and this part of the light will be scattered again and emitted more from the side of the packaged chip 2, thereby further increasing the light emission angle of the packaged chip 2.

[0072] By setting the diffusion layer 222 and the reflection layer 223, the light emission angle of the packaged chip 2 is improved. Based on this, the light area formed after diffusion through the lens layer 3 and the light-expanding lens 4 will also be larger, thereby reducing the number of packaged chips 2 used and reducing production costs.

[0073] In some embodiments, the diffusion powder includes any one or a combination of silica solid particles, titanium dioxide solid particles, or other similar materials.

[0074] A second aspect of this application provides an electronic device including an ellipsoidal Mini COB backlight module as described in the above embodiments.

[0075] The ellipsoidal Mini COB backlight module in electronic devices can form a larger light area, thereby reducing the number of packaged chips 2 per unit area and reducing production costs.

[0076] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An ellipsoidal Mini COB backlight module, characterized in that, include: A substrate, wherein a light-emitting circuit is provided on the substrate; A packaged chip includes a package structure and a light-emitting chip disposed within the package structure. The light-emitting chip is disposed on the substrate and electrically connected to the light-emitting circuit. The light-emitting chip is a Mini LED. A lens layer is sealed and connected to the substrate and covers the packaged chip. The lens layer has a semi-ellipsoidal structure.

2. The ellipsoidal Mini COB backlight module according to claim 1, characterized in that, The lens layer covers and seals the packaged chip, and the lens layer is a transparent silicone layer cured by dispensing.

3. The ellipsoidal Mini COB backlight module according to claim 1, characterized in that, The lens layer is provided with a plurality of light-expanding lenses, each of which has a hemispherical structure. The vertical projection of the lens layer onto the substrate is a first ellipse with a major axis and a minor axis. The vertical projection of the light-expanding lens onto the substrate is a light-expanding projection. The plurality of light-expanding projections are symmetrical about the major axis and the minor axis and are located within the angle between the major axis and the minor axis.

4. The ellipsoidal Mini COB backlight module according to claim 3, characterized in that, Multiple light-amplifying lenses are arranged sequentially along the outer surface of the lens layer. The vertical projections of the centers of the multiple light-amplifying lenses on the substrate are connected in sequence to form a second ellipse, which is located inside the first ellipse.

5. The ellipsoidal Mini COB backlight module according to claim 4, characterized in that, Along the circumference of the first ellipse from the major axis to the minor axis, the refractive indices of the plurality of light-expanding lenses increase sequentially and then decrease sequentially.

6. The ellipsoidal Mini COB backlight module according to any one of claims 1-5, characterized in that, The packaging structure includes a fluorescence conversion layer that covers at least the front side of the light-emitting chip. The fluorescence conversion layer is used to convert and mix the light emitted by the light-emitting chip to emit white light.

7. The ellipsoidal Mini COB backlight module according to claim 6, characterized in that, The encapsulation structure further includes a diffusion layer, which is a transparent silicone layer with diffusion powder inside, and the diffusion layer covers the fluorescence conversion layer.

8. The ellipsoidal Mini COB backlight module according to claim 7, characterized in that, The encapsulation structure further includes a reflective layer, which is a transparent silicone layer with diffuser powder inside. The proportion of diffuser powder in the reflective layer is greater than the proportion of diffuser powder in the diffuser layer, and the reflective layer covers the diffuser layer.

9. The ellipsoidal Mini COB backlight module according to claim 8, characterized in that, The diffusion powder includes any one or a combination of silica solid particles and titanium dioxide solid particles.

10. An electronic device, characterized in that, Includes the ellipsoidal Mini COB backlight module as described in any one of claims 1-9.

Images