Display panel and preparation method thereof
By adding a dam and an organic encapsulation layer to the display panel, the problem of poor encapsulation effect of stretchable display panels is solved, and its reliability is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2026-03-27
AI Technical Summary
The existing stretchable display panels have poor packaging, resulting in poor reliability.
A dam is added to the display panel, surrounding the pixel circuits and light-emitting devices. An organic encapsulation layer is introduced into the encapsulation structure to prevent the organic encapsulation material from overflowing, thereby enhancing the encapsulation effect.
The encapsulation effect of the display panel has been improved, thus enhancing its reliability.
Smart Images
Figure CN121751893A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display technology, specifically to a display panel and its manufacturing method. Background Technology
[0002] In recent years, with the development of display technology, stretchable display panels have gradually come into view, showing broad application prospects in display, lighting and other fields. However, the existing stretchable display panels have poor encapsulation, resulting in poor reliability.
[0003] Therefore, improving the encapsulation effect of display panels has become an urgent problem to be solved. Summary of the Invention
[0004] To address the aforementioned technical problems, this application is proposed. Embodiments of this application provide a display panel and a method for manufacturing the same.
[0005] The first aspect of this application provides a display panel, comprising: a substrate including a plurality of islands; a plurality of light-emitting composite layers respectively disposed on the islands, the light-emitting composite layers including pixel circuit functional layers and light-emitting functional layers located on the pixel circuit functional layers; at least one dam located on the islands and surrounding the light-emitting composite layers, a groove being formed between the dam and the light-emitting composite layers; an encapsulation structure located on the side of the light-emitting functional layers away from the substrate, the encapsulation structure including an organic encapsulation layer, the organic encapsulation layer at least covering the sidewall of the groove near the light-emitting composite layer; and a bridging wire connecting the pixel circuit functional layers on adjacent islands.
[0006] In conjunction with the first aspect, in some possible implementations, the dam includes at least one partition unit; the partition unit includes a stacked first etch-block portion and an insulating portion, the first etch-block portion being located on the side of the insulating portion away from the substrate; a first sidewall of the first etch-block portion facing the light-emitting composite layer and a second sidewall of the insulating portion facing the light-emitting composite layer constitute at least a portion of the sidewalls of the dam, in the same partition unit, the second sidewall of the insulating portion gradually recesses in the direction away from the first etch-block portion; and / or the partition unit includes a stacked second etch-block portion and an insulating portion, the second etch-block portion being located on the side of the insulating portion away from the substrate; a third sidewall of the second etch-block portion away from the light-emitting composite layer and a fourth sidewall of the insulating portion away from the light-emitting composite layer constitute at least a portion of the sidewalls of the dam, in the same partition unit, the fourth sidewall of the insulating portion gradually recesses in the direction away from the second etch-block portion.
[0007] In conjunction with the first aspect, in some possible implementations, the partition unit includes a first etch-blocking portion and a second etch-blocking portion, the first etch-blocking portion and the second etch-blocking portion being in the same layer and made of the same material; preferably, the first etch-blocking portion and the second etch-blocking portion are an integral structure; or, the first etch-blocking portion and the second etch-blocking portion are spaced apart; preferably, the material of the first etch-blocking portion and the second etch-blocking portion includes at least one of metal and semiconductor.
[0008] In conjunction with the first aspect, in some possible implementations, at least one partition unit includes multiple partition units, which are stacked sequentially in a direction away from the substrate; preferably, the multiple partition units include a first partition unit and a second partition unit disposed adjacent to each other, with the first partition unit located on the side of the second partition unit closer to the substrate; in a direction parallel to the substrate, the second sidewall of the insulating portion of the second partition unit facing the light-emitting composite layer is recessed relative to the first sidewall of the first etch-blocking portion of the first partition unit, and the fourth sidewall of the insulating portion of the second partition unit facing away from the light-emitting composite layer is recessed relative to the third sidewall of the second etch-blocking portion of the first partition unit.
[0009] In conjunction with the first aspect, in some possible implementations, the dam further includes a raised portion located on the side of the partition unit facing away from the substrate; preferably, the orthographic projection of the raised portion on the substrate is within the orthographic projection range of the partition unit on the substrate; preferably, the raised portion includes a first raised sub-part; the pixel circuit functional layer includes a planarization layer, and the first raised sub-part is on the same layer and made of the same material as the planarization layer; preferably, the raised portion further includes a second raised sub-part located on the side of the first raised sub-part closer to the substrate; the pixel circuit functional layer includes an interlayer dielectric layer, and the second raised sub-part is on the same layer and made of the same material as the interlayer dielectric layer; preferably, the raised portion further includes a third raised sub-part located on the side of the first raised sub-part facing away from the substrate; the light-emitting functional layer includes a pixel definition layer, and the third raised sub-part is on the same layer and made of the same material as the pixel definition layer.
[0010] In conjunction with the first aspect, in some possible implementations, the pixel circuit functional layer includes alternating conductive layers and a first insulating layer; at least a portion of the conductive layer includes a third etch stop portion, the fifth sidewall of the third etch stop portion facing the dam and the sixth sidewall of the first insulating layer facing the dam forming a portion of the sidewall of a plurality of light-emitting composite layers; the sixth sidewall of the first insulating layer, which is in contact with the third etch stop portion and located on the side of the third etch stop portion closer to the substrate, gradually concave in the direction away from the third etch stop portion; preferably, the sixth sidewall of the first insulating layer, which is in contact with the third etch stop portion and located on the side of the third etch stop portion away from the substrate, is relatively concave relative to the fifth sidewall of the third etch stop portion. The sidewalls are recessed; preferably, the partition unit includes a first etch-block portion, at least a portion of the first etch-block portion and the third etch-block portion are in the same layer and made of the same material; preferably, the pixel circuit functional layer further includes an active layer and a second insulating layer, the second insulating layer is located on the side of the active layer near the substrate and is in contact with the active layer; the active layer is located on the side of the conductive layer near the substrate, or is located between adjacent conductive layers; the active layer includes a fourth etch-block portion, the seventh sidewall of the fourth etch-block portion facing the dam and the eighth sidewall of the second insulating layer facing the dam constitute part of the sidewalls of a plurality of light-emitting combination layers; in the direction away from the fourth etch-block portion, the eighth sidewall of the second buffer layer facing the dam is gradually recessed.
[0011] In conjunction with the first aspect, in some possible implementations, the pixel circuit functional layer includes a pixel circuit, and the light-emitting functional layer includes sub-pixels; the pixel circuit and the sub-pixels are electrically connected; preferably, a lead wire is provided on the side of the dam near the substrate; the lead wire connects the pixel circuit and the bridging wire; preferably, a buffer layer is provided on the substrate, the buffer layer is located between the substrate and the pixel circuit, and between the substrate and the dam, and the lead wire is located between the buffer layer and the substrate; preferably, at least one dam farthest from the light-emitting composite layer includes a conductive hole, the conductive hole penetrates a portion of the dam along the thickness direction of the substrate, and the lead wire is connected to the bridging wire through the conductive hole; preferably, the light-emitting functional layer includes a stacked light-emitting layer and a first electrode layer, the light-emitting layer is located on the side of the first electrode layer near the substrate; the light-emitting layer and the first electrode layer are respectively disconnected on the sidewall of the groove.
[0012] In conjunction with the first aspect, in some possible implementations, the encapsulation structure further includes a first inorganic encapsulation layer located on the side of the organic encapsulation layer near the substrate; the first inorganic encapsulation layer is continuous at the sidewalls of the light-emitting functional layer and / or the sidewalls of the dam; preferably, the orthographic projection of the organic encapsulation layer on the substrate is within the range of the orthographic projection of the first inorganic encapsulation layer on the substrate; preferably, the first inorganic encapsulation layer extends to the side of the dam furthest from the light-emitting composite layer near the light-emitting composite layer; preferably, the encapsulation structure further includes a second inorganic encapsulation layer located on the side of the organic encapsulation layer away from the substrate, and the orthographic projection of the second inorganic encapsulation layer on the substrate covers the orthographic projection of the first inorganic encapsulation layer on the substrate.
[0013] A second aspect of this application provides a method for fabricating a display panel, comprising: fabricating an initial structural layer on a substrate, the initial structural layer including pixel circuits and a plurality of etch-stop portions, the etch-stop portions surrounding the pixel circuits; dry etching the initial structural layer between adjacent etch-stop portions to form a groove, the groove penetrating at least a portion of the initial structural layer along the thickness direction of the substrate, the sidewalls of the groove having pits, and the initial structural layer between adjacent grooves forming a dam; fabricating at least a portion of a light-emitting functional layer on the side of the pixel circuits facing away from the substrate; and fabricating an encapsulation structure on the side of the light-emitting functional layer facing away from the substrate, the encapsulation structure including an organic encapsulation layer, the organic encapsulation layer at least covering the sidewalls of the grooves near the functional layer of the pixel circuits.
[0014] In conjunction with the second aspect, in some possible implementations, the pixel circuit includes a conductive portion; the fabrication of the initial structural layer on the substrate includes: fabricating a semiconductor layer, a plurality of first insulating material layers and a plurality of conductive material layers on the substrate, wherein the insulating material layers and conductive material layers are alternately disposed, and at least a portion of the conductive material layers includes a conductive portion and an etch-blocking portion.
[0015] The display panel provided in this application embodiment is a stretchable display panel with an island portion. A light-emitting assembly layer is disposed on the island portion, comprising a pixel circuit functional layer and a light-emitting functional layer located on top of the pixel circuit functional layer. In this display panel, a dam is also disposed on the island portion, surrounding the light-emitting assembly layer. A groove is formed between the dam and the light-emitting assembly layer. An organic encapsulation layer at least covers the groove near the sidewall of the light-emitting assembly layer. That is, the encapsulation structure of the island-bridge structure display panel provided in this application embodiment includes an organic encapsulation layer, enabling the encapsulation structure to possess organic encapsulation capabilities. During the fabrication of the organic encapsulation layer, the dam serves to provide a barrier, preventing the organic encapsulation material from overflowing. By adding an organic encapsulation layer to the encapsulation structure, the encapsulation reliability of the display panel is improved. Attached Figure Description
[0016] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.
[0017] Figure 1a The diagram shown is a top view of a display panel provided in an embodiment of this application.
[0018] Figure 1b for Figure 1a A magnified view of a portion of the display panel shown.
[0019] Figure 1c for Figure 1bThe diagram shows a cross-sectional view of the display panel along line N1-N2.
[0020] Figure 2 This is a cross-sectional structural diagram of the display panel provided in the second embodiment of this application.
[0021] Figure 3 This is a cross-sectional structural diagram of the display panel provided in the third embodiment of this application.
[0022] Figure 4 This is a cross-sectional structural diagram of the display panel provided in the fourth embodiment of this application.
[0023] Figure 5 This is a cross-sectional structural diagram of the display panel provided in the fifth embodiment of this application.
[0024] Figure 6 This is a cross-sectional structural diagram of the display panel provided in the sixth embodiment of this application.
[0025] Figure 7 The diagram shown is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application.
[0026] Figure 8 The diagram shown is a cross-sectional structural schematic of an intermediate product in the display panel manufacturing process according to an embodiment of this application.
[0027] Figure 9 The diagram shown is a cross-sectional structural schematic of an intermediate product in the display panel manufacturing process according to another embodiment of this application. Detailed Implementation
[0028] As described in the background section, in existing stretchable display panels, the encapsulation structure layer of the island area only includes an inorganic encapsulation layer. However, the encapsulation effect of the inorganic encapsulation layer is poor, resulting in poor reliability of the display panel.
[0029] To address the aforementioned technical problems, this application is proposed. Embodiments of this application add a dam to the display panel, with the dam surrounding the pixel circuitry and light-emitting devices. This dam prevents the overflow of organic encapsulation material, giving the encapsulation structure organic encapsulation capabilities. Compared to island-bridge structure display panels that solely utilize inorganic encapsulation layers, this improves the encapsulation effect of the display panel, thereby enhancing its reliability.
[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0031] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented even without certain specific details. In some instances, methods and means well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.
[0032] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0033] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.
[0034] Figure 1a The diagram shown is a top view of a display panel provided in an embodiment of this application. Figure 1b for Figure 1a A magnified view of a portion of the display panel shown. Figure 1c for Figure 1b The diagram shows a cross-sectional view of the display panel along line N1-N2. (Combined with...) Figure 1a , Figure 1b and Figure 1c As shown, the display panel 100 includes a substrate 10, a plurality of light-emitting composite layers 20, at least one dam 30, an encapsulation structure 40, and a bridging line 50. The substrate 10 includes a plurality of islands 11. The plurality of light-emitting composite layers 20 are respectively disposed on the islands 11, and each light-emitting composite layer 20 includes a pixel circuit functional layer and a light-emitting functional layer located on top of the pixel circuit functional layer. The dam 30 is located on the island 11 and surrounds the light-emitting composite layers 20, and a groove G is formed between the dam 30 and the light-emitting composite layers 20. The encapsulation structure 40 is located on the side of the light-emitting functional layer opposite to the substrate 10, and the encapsulation structure 40 includes an organic encapsulation layer 41, which at least covers the sidewall of the groove G near the light-emitting composite layer 20. The bridging line 50 connects the pixel circuit functional layers on adjacent islands 11.
[0035] The pixel circuit functional layer includes pixel circuit 21 and various signal lines connected to pixel circuit 21. Pixel circuit 21 is, for example, a 7T1C pixel circuit. The various signal lines include scan lines, data lines, initialization signal lines, power signal lines, etc.
[0036] The light-emitting functional layer includes sub-pixels 22 (also called light-emitting devices), which are electrically connected to pixel circuits 21. Pixel circuits 21 drive the light-emitting devices 122 to emit light according to a predetermined grayscale. Sub-pixels 22 can be organic light-emitting diodes (OLEDs).
[0037] The display panel provided in this embodiment has an overall island-bridge structure, with adjacent island structures connected by bridge structures. Each island structure includes an island portion 11, and pixel circuits 21, sub-pixels 22, and dams 30 located on the island portion 11. Sub-pixels 22 are located on the side of the pixel circuits 21 facing away from the island portion 11, and the dams 30 surround the pixel circuits 21 and sub-pixels 22. The surrounding bridge structure includes bridging wires 50.
[0038] The encapsulation structure 40 includes an organic encapsulation layer 41, which at least covers the recess G near the sidewall of the light-emitting assembly layer 20. Exemplarily, the organic encapsulation layer 41 terminates at the sidewall of the recess G near the light-emitting assembly layer 20; or, the organic encapsulation layer 41 partially fills the recess G, i.e., the organic encapsulation layer 41 terminates at the side of the dam 30 near the light-emitting assembly layer 20; or the display panel includes multiple dams, with recesses formed between adjacent dams 30. For ease of distinction, the recess between the light-emitting assembly layer 20 and the dams 30 is referred to as the first recess, and the recess between adjacent dams 30 is referred to as the second recess. The organic encapsulation layer 41 fills the first recess and partially fills the second recess.
[0039] In one embodiment, the encapsulation structure 40 further includes a first inorganic encapsulation layer 42 located on the side of the organic encapsulation layer 41 near the substrate 10. The first inorganic encapsulation layer 42 is continuous along the sidewalls of the light-emitting composite layer 20 and / or the sidewalls of the dam 30. Exemplarily, the first inorganic encapsulation layer 42 is fabricated using a vapor deposition process. Due to the process characteristics, the first inorganic encapsulation layer 42 can be continuous along the sidewalls of the light-emitting composite layer 20 and / or the sidewalls of the dam 30, thereby ensuring good water and oxygen barrier effects.
[0040] For example, the orthographic projection of the organic encapsulation layer 41 onto the substrate 10 lies within the orthographic projection range of the first inorganic encapsulation layer 42 onto the substrate 10. For instance, the display panel includes three dams 30, which are sequentially referred to as the first dam, second dam, and third dam in the direction away from the light-emitting assembly layer 20. The first inorganic encapsulation layer 42 extends to the dam 30 furthest from the light-emitting assembly layer 20, i.e., the side of the third dam closest to the light-emitting assembly layer 20, and the organic encapsulation layer 41 extends to the dam 30 closest to the light-emitting assembly layer 20, i.e., the side of the first dam closest to the light-emitting assembly layer 20, and partially fills the groove G.
[0041] In one embodiment, the encapsulation structure 40 further includes a second inorganic encapsulation layer 43 located on the side of the organic encapsulation layer 41 facing away from the substrate 10. The orthographic projection of the second inorganic encapsulation layer 43 onto the substrate 10 overlaps the orthographic projection of the organic encapsulation layer 41 onto the substrate. In this case, the edge regions of the first inorganic encapsulation layer 42 and the second inorganic encapsulation layer 43 are in contact, thereby further enhancing the water and oxygen barrier effect.
[0042] In one embodiment, a lead wire 60 is provided on the side of the dam 30 near the substrate 10, and the lead wire 60 connects the pixel circuit 21 and the bridging line 50. Specifically, at least one dam 30 farthest from the light-emitting combination layer 20 includes a conductive hole H, which penetrates a portion of the dam 30 along the thickness direction of the substrate 10, and the lead wire 60 is connected to the bridging line 50 through the conductive hole H.
[0043] The display panel provided in this embodiment is a stretchable display panel, which has an island 11. A light-emitting assembly layer 20 is disposed on the island 11. The light-emitting assembly layer 20 includes a pixel circuit functional layer and a light-emitting functional layer located on the pixel circuit functional layer. In this display panel, a dam 30 is also disposed on the island, surrounding the light-emitting assembly layer 20. A groove G is formed between the dam 30 and the light-emitting assembly layer 20. An organic encapsulation layer 41 at least covers the groove G near the sidewall of the light-emitting assembly layer 20. That is, the encapsulation structure 40 of the island-bridge structure display panel provided in this application embodiment includes an organic encapsulation layer 41, so that the encapsulation structure 40 has organic encapsulation capability. During the preparation of the organic encapsulation layer 41, the dam 30 is used to provide a blocking effect to prevent the organic encapsulation material from overflowing. By adding an organic encapsulation layer 41 to the encapsulation structure 40, the encapsulation reliability of the display panel is improved.
[0044] Figure 2 This is a schematic cross-sectional view of the display panel provided in the second embodiment of this application. Figure 2 As shown, in this embodiment, the dam 30 includes at least one partition unit. The partition unit includes a first etch-blocking portion 311 and an insulating portion 312 stacked together. The first etch-blocking portion 311 is located on the side of the insulating portion 312 facing away from the substrate 10. The first sidewall of the first etch-blocking portion 311 facing the light-emitting composite layer 20 and the second sidewall of the insulating portion 312 facing the light-emitting composite layer 20 constitute at least a portion of the sidewalls of the dam 30. Within the same partition unit, the second sidewall of the insulating portion 312 gradually recesses in the direction away from the first etch-blocking portion 311.
[0045] In one embodiment, the material of the first etch barrier 311 includes at least one of metal and semiconductor.
[0046] For example, the pixel circuit functional layer includes an alternately arranged conductive layer 211 and a first insulating layer 212, at least a portion of the conductive layer 211 and the first etch stop portion 311 are in the same layer and made of the same material. The conductive layer 211 is, for example, a metal layer, and the first insulating layer 212 includes at least one of a gate insulating layer GI, a capacitor insulating layer CI, and an interlayer dielectric layer ILD.
[0047] For example, the pixel circuit functional layer further includes an active layer 213 and a second insulating layer 214, the second insulating layer 214 being located on the side of the active layer 213 near the substrate 10 and in contact with the active layer 213. The active layer 213 is located on the side of the conductive layer 211 near the substrate 10, or between adjacent conductive layers 211. For example, the active layer 213 includes a semiconductor layer and a metal oxide layer, and the second insulating layer 214 is, for example, a buffer layer. At least a portion of the first etch stop portion 311 and the active layer 213 are on the same layer and made of the same material.
[0048] In one embodiment, the sub-pixel 22 includes a second electrode layer 221, a light-emitting layer 222, and a first electrode layer 223 stacked in a direction away from the substrate 10. The light-emitting layer 222 and the first electrode layer 223 are disconnected on the sidewall of the recess G. This prevents water and oxygen from intruding into the sub-pixel 22 through the transport path formed by the light-emitting layer 222 and the first electrode layer 223, thereby improving the reliability of the display panel.
[0049] In one embodiment, such as Figure 3 As shown, the dam 30 also includes a raised portion 313, which is located on the side of the partition unit away from the substrate 10. The orthographic projection of the raised portion 313 on the substrate 10 is within the orthographic projection range of the partition unit on the substrate 10.
[0050] The raised portion 313 can be a composite structure with multiple film layers stacked together, or it can be a single film layer structure. For example, the raised portion 313 includes a first raised sub-portion. The pixel circuit functional layer includes a planarization layer PLN, and the first raised sub-portion is on the same layer and made of the same material as the planarization layer PLN. Preferably, the raised portion 313 also includes a second raised sub-portion located on the side of the first raised sub-portion closer to the substrate 10. The pixel circuit functional layer also includes an interlayer dielectric layer ILD, and the second raised sub-portion is on the same layer and made of the same material as the interlayer dielectric layer ILD. For example, the raised portion 313 also includes a third raised sub-portion located on the side of the first raised sub-portion facing away from the substrate 10. The light-emitting functional layer includes a pixel definition layer PDL, and the third raised sub-portion is on the same layer and made of the same material as the pixel definition layer PDL.
[0051] According to the display panel provided in this embodiment, by providing a recess on the sidewall of the dam 30 near the light-emitting composite layer 20, the light-emitting layer 222 and the first electrode layer 223 are separated by the recess, thus blocking the path of water and oxygen intrusion. At the same time, by setting the first etch-blocking part 311 and the conductive layer 211 in the dam 30 to be in the same layer and made of the same material, the first etch-blocking part 311 and the conductive layer 211 can be formed simultaneously, reducing process steps and improving production efficiency.
[0052] In one embodiment, such as Figure 2The display panel shown includes a partition unit that further comprises a second etch-blocking portion 314, which is on the same layer and made of the same material as the first etch-blocking portion 311. The second etch-blocking portion 314 is located on the side of the insulating portion 312 facing away from the substrate 10. The second etch-blocking portion 314 and the first etch-blocking portion 311 are spaced apart. The third sidewall of the second etch-blocking portion 314 facing away from the light-emitting composite layer 20 and the fourth sidewall of the insulating portion 312 facing away from the light-emitting composite layer 20 constitute at least a portion of the sidewall of the dam 30. In the same partition unit, the fourth sidewall of the insulating portion 312 gradually becomes concave in the direction away from the second etch-blocking portion 314. That is, a recess is also formed on the sidewall of the dam 20 facing away from the light-emitting composite layer 20. In this case, the light-emitting layer 222 and the first electrode layer 223 are also disconnected on the sidewall of the dam 20 facing away from the light-emitting composite layer 20, thereby further blocking the intrusion of water and oxygen.
[0053] It should be noted that in the actual product, the dam 30 may only include the second etched blocking part 314, without including the first etched blocking part 311, that is, the concave structure is only formed on the side wall of the dam 30 away from the light-emitting composite layer 20.
[0054] In one embodiment, such as Figure 2 As shown, at least one partition unit includes multiple partition units, which are stacked sequentially in a direction away from the substrate 10.
[0055] Specifically, the plurality of partition units include a first partition unit and a second partition unit disposed adjacent to each other, with the first partition unit located on the side of the second partition unit closer to the substrate 10. In a direction parallel to the substrate 10, the second sidewall of the insulating portion 312 in the second partition unit facing the light-emitting composite layer 20 is recessed relative to the first sidewall of the first etch-block portion 311 in the first partition unit, and the fourth sidewall of the insulating portion 312 in the second partition unit facing away from the light-emitting composite layer 20 is recessed relative to the third sidewall of the second etch-block portion 314 in the first partition unit.
[0056] Figure 3 This is a schematic cross-sectional view of the display panel provided in the third embodiment of this application. Figure 3 The display panel shown and Figure 2 The difference in the display panel shown is that, in this embodiment, the first etch barrier 311 and the second etch barrier 314 are an integral structure, that is, the side of the first etch barrier 311 away from the light-emitting composite layer 20 and the side of the second etch barrier 314 close to the light-emitting composite layer 20 are in contact.
[0057] In one embodiment, combined Figure 2 and Figure 3As shown, the pixel circuit functional layer includes alternating conductive layers 211 and a first insulating layer 212. At least a portion of the conductive layer 211 includes a third etch stop portion 201, and the fifth sidewall of the third etch stop portion 201 facing the dam 30 and the sixth sidewall of the first insulating layer 212 facing the dam 30 constitute partial sidewalls of a plurality of light-emitting composite layers 20. The sixth sidewall of the first insulating layer 212, which is in contact with the third etch stop portion 201 and located on the side of the third etch stop portion 201 closer to the substrate 10, gradually concave in the direction away from the third etch stop portion 201.
[0058] In one embodiment, the sixth sidewall of the first insulating layer 212, which is in contact with the third etch barrier 201 and located on the side of the third etch barrier 201 away from the substrate 10, is recessed relative to the fifth sidewall of the third etch barrier 201.
[0059] In one embodiment, at least a portion of the first etch barrier 311 and the third etch barrier 201 are in the same layer and made of the same material.
[0060] In one embodiment, the pixel circuit functional layer further includes an active layer 213 and a second insulating layer 214. The second insulating layer 214 is located on the side of the active layer 213 near the substrate 10 and is in contact with the active layer 213. The active layer 213 is located on the side of the conductive layer 211 near the substrate 10, or between adjacent conductive layers 211. The active layer 213 includes a fourth etch stop 202. The seventh sidewall of the fourth etch stop 202 facing the dam 30 and the eighth sidewall of the second insulating layer 214 facing the dam 30 constitute part of the sidewalls of the plurality of light-emitting composite layers 20. In the direction away from the fourth etch stop 202, the eighth sidewall of the second insulating layer 214 facing the dam 30 gradually becomes concave.
[0061] Figure 4 This is a schematic cross-sectional view of the display panel provided in the fourth embodiment of this application. Figure 4 The difference between the display panels provided in any of the above embodiments is that the display panel includes a plurality of dams 30, and the organic encapsulation layer 41 terminates on the side of any dam 30 near the light-emitting composite layer 20.
[0062] For example, in the direction from the light-emitting composite layer 20 to the dam 30, the plurality of dams 30 include a first dam 31 and a second dam 32 arranged sequentially. An organic encapsulation layer 41 extends to the side of the first dam 31 near the light-emitting composite layer 20, and the organic encapsulation layer 41 at least partially fills the groove G1.
[0063] Figure 5 This is a schematic cross-sectional view of the display panel provided in the fifth embodiment of this application. Figure 5 The difference between the display panel shown and the display panel provided in any of the above embodiments is that, with Figure 4Taking the display panel shown as an example, in this embodiment, a second insulating layer 214, such as a buffer layer, is disposed on the substrate 10. The buffer layer is located between the substrate 10 and the pixel circuit 21, and between the substrate 10 and the dam 30, and the lead wire 60 is located between the buffer layer and the substrate 10.
[0064] Specifically, at least one of the dams 30, the one furthest from the light-emitting composite layer 20, includes a conductive hole H that extends through a portion of the dam 30 along the thickness direction of the substrate 10, and a lead wire 60 is connected to a bridging wire 50 through the conductive hole H.
[0065] Figure 6 This is a schematic cross-sectional view of the display panel provided in the sixth embodiment of this application. Figure 6 The display panel shown and Figure 4 The difference in the display panel shown is that the second dam 32 and the first dam 31 have different heights.
[0066] For example, the thickness of the raised portion 313 in the second dam 32 is less than the thickness of the raised portion 313 in the first dam 31. For instance, the raised portion 313 in the first dam 31 includes a first raised portion, a second raised portion, and a third raised portion stacked sequentially in a direction away from the substrate 10. The raised portion 313 in the second dam 32 includes a first raised portion and a second raised portion layer stacked sequentially in a direction away from the substrate 10. In this way, the organic encapsulation layer 41 can be confined as close as possible to the side of the first dam 31 closest to the light-emitting composite layer 20, thereby improving the ability of the first barrier dam 131 to prevent overflow of the organic encapsulation layer 141.
[0067] The structure of the display panel provided in this application has been described in detail above. The fabrication method of the display panel is described below. It is understood that this fabrication method corresponds to the structure of the display panel; therefore, the structure mentioned in this fabrication method can be referred to the above description of the display panel, and will not be repeated here.
[0068] Figure 7 The diagram shown is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application. Figure 8 The diagram shown is a cross-sectional structural schematic of an intermediate product in the display panel manufacturing process according to an embodiment of this application. Figure 9 The diagram shown is a cross-sectional structural schematic of an intermediate product in the display panel manufacturing process according to another embodiment of this application. Figure 7 As shown in the figure, this application embodiment provides a method for manufacturing a display panel, which includes the following steps.
[0069] Step S1001, see Figure 8 An initial structural layer is prepared on substrate 10.
[0070] The initial structural layer includes pixel circuit 21 and multiple etch stop portions, with the etch stop portions surrounding pixel circuit 21.
[0071] For example, pixel circuit 21 includes conductive portions. Step S1001 is specifically performed by fabricating a semiconductor layer, a plurality of first insulating material layers, and a plurality of conductive material layers on substrate 10, wherein the insulating material layers and conductive material layers are alternately disposed, and at least a portion of the conductive material layers includes conductive portions and etching barrier portions.
[0072] In one embodiment, before fabricating the semiconductor layer on the substrate 10, a buffer layer is further fabricated on the substrate 10. The semiconductor layer includes conductive portions and etch-stop portions. In this case, one of the etch-stop portions and the conductive portion are fabricated in the same layer, and the remaining etch-stop portions are fabricated in the same layer corresponding to the conductive portions.
[0073] Step S1002, see Figure 9 Dry etching is performed on the initial structural layer between adjacent etched blocking parts to form grooves G.
[0074] The groove G penetrates at least a portion of the initial structural layer along the thickness direction of the substrate 10. The sidewalls of the groove G have pits, and the initial structural layers between adjacent grooves G form dams 30.
[0075] For example, using a hard mask and a photolithographic mask for protection, side etching is performed by adjusting the etch selectivity and lateral etch rate to form pits. The etch selectivity and lateral etch rate can be set according to actual needs, and are not further limited here.
[0076] For example, the groove G extends through the buffer layer.
[0077] The width of the dam 30 and the spacing between adjacent dams 30 can be set according to actual needs, so that the width of the dam 30 and the spacing between adjacent dams 30 are optimally balanced.
[0078] Step S1003, see Figure 6 At least a portion of the light-emitting functional layer is prepared on the side of the pixel circuit 21 away from the substrate 11.
[0079] Step S1003 includes two cases: one is to fabricate the entire light-emitting functional layer on the side of the pixel circuit 21 away from the substrate 11. For example, this entire light-emitting functional layer includes a second electrode layer 221, a light-emitting layer 222, and a second electrode layer 223 stacked sequentially. The other case is to fabricate a partial light-emitting functional layer on the side of the pixel circuit 21 away from the substrate 11, this partial light-emitting functional layer including a light-emitting layer 222 and a second electrode layer 223. In this case, the initial structural layer obtained according to step S1001 includes the second electrode layer 221.
[0080] The light-emitting layer 222 and the first electrode layer 223 in the light-emitting functional layer are disconnected on the side wall of the dam 30, thereby blocking the intrusion path of water and oxygen and improving the reliability of the display panel.
[0081] Step S1004, see below. Figure 6 An encapsulation structure 40 is fabricated on the side of the light-emitting functional layer facing away from the substrate 10. The encapsulation structure 40 includes an organic encapsulation layer 41, which at least covers the sidewall of the groove G near the pixel circuit 21.
[0082] The fabrication steps provided in this application correspond to the display panel provided in any of the above embodiments. Through the fabrication method provided in this application, a dam 30 is formed around the pixel circuit and sub-pixels. The dam 30 can prevent the overflow of organic encapsulation material, enabling the island-bridge structure display panel to possess organic encapsulation capabilities. Simultaneously, pits are formed on the sidewalls of the dam 30, causing the vapor-deposited layer formed by subsequent processes to break at the sidewalls of the dam 30, thereby cutting off the intrusion path of external water and oxygen, and thus improving the reliability of the display panel 100.
[0083] In some embodiments, step S1004 specifically includes: using inkjet printing technology to prepare an organic encapsulation layer 41 on the side of the sub-pixel 22 and the dam 30 away from the substrate 10, so as to prevent the organic encapsulation material from overflowing through the dam 30 and to ensure that the organic encapsulation material does not overflow to the bridging line 50 and affect the encapsulation effect and tensile strength.
[0084] In one embodiment, before fabricating the organic encapsulation layer 41 on the side of the sub-pixel 22 and the dam 30 away from the substrate 10 using an inkjet printing process, step S1004 further includes: fabricating a first inorganic encapsulation layer 42 on the side of the sub-pixel 22 and the dam 30 away from the substrate 10 using a vapor deposition process. After fabricating the organic encapsulation layer 41 on the side of the sub-pixel 22 and the dam 30 away from the substrate 10 using an inkjet printing process, step S1004 further includes: fabricating a second inorganic encapsulation layer 43 on the side of the sub-pixel 22 and the dam 30 away from the substrate 10 using a vapor deposition process.
[0085] The display panel provided in this application embodiment can be used in a display device. This display device can be, for example, any product or component with display functionality, such as a mobile terminal, tablet computer, computer monitor, television, wearable device, or information kiosks.
[0086] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.
[0087] It should also be noted that in this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered equivalent solutions to this application. Although several exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations therein.
Claims
1. A display panel, characterized in that, include: The substrate includes multiple islands; Multiple light-emitting combination layers are respectively disposed on the island portion, and the light-emitting combination layer includes a pixel circuit functional layer and a light-emitting functional layer located on the pixel circuit functional layer; At least one dam is located on the island and surrounds the light-emitting composite layer, and a groove is formed between the dam and the light-emitting composite layer; An encapsulation structure is located on the side of the light-emitting functional layer away from the substrate. The encapsulation structure includes an organic encapsulation layer, which at least covers the sidewall of the groove near the light-emitting composite layer. as well as A bridging wire connects the pixel circuit functional layer on the adjacent island portion.
2. The display panel according to claim 1, characterized in that, The dam includes at least one partition unit; The partition unit includes a first etch-blocking portion and an insulating portion stacked together. The first etch-blocking portion is located on the side of the insulating portion facing away from the substrate. A first sidewall of the first etch-blocking portion facing the light-emitting composite layer and a second sidewall of the insulating portion facing the light-emitting composite layer constitute at least a portion of the sidewall of the dam. In the same partition unit, the second sidewall of the insulating portion gradually becomes concave in the direction away from the first etch-blocking portion; and / or The partition unit includes a stacked second etched blocking portion and an insulating portion, the second etched blocking portion being located on the side of the insulating portion away from the substrate; the third sidewall of the second etched blocking portion away from the light-emitting composite layer and the fourth sidewall of the insulating portion away from the light-emitting composite layer constitute at least a portion of the sidewall of the dam, and in the same partition unit, the fourth sidewall of the insulating portion gradually concave in the direction away from the second etched blocking portion.
3. The display panel according to claim 2, characterized in that, The partition unit includes a first etched blocking part and a second etched blocking part, wherein the first etched blocking part and the second etched blocking part are in the same layer and made of the same material; Preferably, the first etching barrier and the second etching barrier are an integral structure; or, the first etching barrier and the second etching barrier are spaced apart. Preferably, the materials of the first etching barrier and the second etching barrier include at least one of metal and semiconductor.
4. The display panel according to claim 3, characterized in that, The at least one partition unit includes a plurality of partition units, which are stacked sequentially in a direction away from the substrate; Preferably, the plurality of partition units include a first partition unit and a second partition unit disposed adjacent to each other, the first partition unit being located on the side of the second partition unit closer to the substrate; in a direction parallel to the substrate, the second sidewall of the insulating portion of the second partition unit facing the light-emitting composite layer is recessed relative to the first sidewall of the first etch-blocking portion of the first partition unit, and the fourth sidewall of the insulating portion of the second partition unit facing away from the light-emitting composite layer is recessed relative to the third sidewall of the second etch-blocking portion of the first partition unit.
5. The display panel according to claim 3 or 4, characterized in that, The dam also includes a raised section, which is located on the side of the partition unit away from the substrate; Preferably, the orthographic projection of the raised portion on the substrate is located within the orthographic projection range of the partition unit on the substrate; Preferably, the raised portion includes a first raised sub-portion; the pixel circuit functional layer includes a planarization layer, and the first raised sub-portion and the planarization layer are in the same layer and made of the same material; Preferably, the raised portion further includes a second raised sub-portion located on the side of the first raised sub-portion closer to the substrate; the pixel circuit functional layer further includes an interlayer dielectric layer, and the second raised sub-portion is in the same layer and made of the same material as the interlayer dielectric layer; Preferably, the raised portion further includes a third raised sub-portion located on the side of the first raised sub-portion facing away from the substrate; the light-emitting functional layer includes a pixel definition layer, and the third raised sub-portion is in the same layer and made of the same material as the pixel definition layer.
6. The display panel according to claim 2, characterized in that, The pixel circuit functional layer includes alternating conductive layers and a first insulating layer; at least a portion of the conductive layer includes a third etch barrier portion, the fifth sidewall of the third etch barrier portion facing the dam and the sixth sidewall of the first insulating layer facing the dam constitute a portion of the sidewall of the plurality of light-emitting composite layers; the sixth sidewall of the first insulating layer that is in contact with the third etch barrier portion and located on the side of the third etch barrier portion closer to the substrate gradually concave in the direction away from the third etch barrier portion; Preferably, the sixth sidewall of the first insulating layer that is in contact with the third etch barrier and located on the side of the third etch barrier away from the substrate is recessed relative to the fifth sidewall of the third etch barrier; Preferably, the partition unit includes the first etched blocking portion, and at least a portion of the first etched blocking portion and the third etched blocking portion are in the same layer and made of the same material; Preferably, the pixel circuit functional layer further includes an active layer and a second insulating layer, wherein the second insulating layer is located on the side of the active layer near the substrate and is in contact with the active layer; The active layer is located on the side of the conductive layer near the substrate, or between adjacent conductive layers; the active layer includes a fourth etch barrier portion, the seventh sidewall of the fourth etch barrier portion facing the dam and the eighth sidewall of the second insulating layer facing the dam constitute part of the sidewall of the plurality of light-emitting composite layers; in the direction away from the fourth etch barrier portion, the eighth sidewall of the second insulating layer facing the dam gradually becomes concave.
7. The display panel according to claim 1, characterized in that, The pixel circuit functional layer includes a pixel circuit, and the light-emitting functional layer includes sub-pixels; the pixel circuit and the sub-pixels are electrically connected. Preferably, a lead wire is provided on the side of the dam closest to the substrate; the lead wire connects the pixel circuit and the bridging wire; Preferably, a buffer layer is disposed on the substrate, the buffer layer is located between the substrate and the pixel circuit, and between the substrate and the dam, and the lead wire is located between the buffer layer and the substrate; Preferably, at least one of the dams furthest from the light-emitting composite layer includes a conductive hole that penetrates a portion of the dam along the thickness direction of the substrate, and the lead wire is connected to the bridging wire through the conductive hole; Preferably, the light-emitting functional layer includes a stacked light-emitting layer and a first electrode layer, wherein the light-emitting layer is located on the side of the first electrode layer near the substrate; the light-emitting layer and the first electrode layer are respectively disconnected on the sidewall of the groove.
8. The display panel according to claim 1, characterized in that, The encapsulation structure further includes a first inorganic encapsulation layer located on the side of the organic encapsulation layer near the substrate; the first inorganic encapsulation layer is continuous at the sidewall of the light-emitting composite layer and / or the sidewall of the dam. Preferably, the orthographic projection of the organic encapsulation layer on the substrate is located within the orthographic projection range of the first inorganic encapsulation layer on the substrate; Preferably, the first inorganic encapsulation layer extends to the side of the dam furthest from the light-emitting composite layer, closer to the light-emitting composite layer; Preferably, the encapsulation structure further includes a second inorganic encapsulation layer located on the side of the organic encapsulation layer opposite to the substrate, wherein the orthographic projection of the second inorganic encapsulation layer on the substrate covers the orthographic projection of the organic encapsulation layer on the substrate.
9. A method for manufacturing a display panel, characterized in that, include: An initial structural layer is fabricated on a substrate, the initial structural layer including pixel circuits and a plurality of etch barriers surrounding the pixel circuits; Dry etching is performed on the initial structural layer between adjacent etching barriers to form a groove. The groove penetrates at least a portion of the initial structural layer along the thickness direction of the substrate. The sidewalls of the groove have pits, and the initial structural layer between adjacent grooves forms a dam. At least a portion of the light-emitting functional layer is fabricated on the side of the pixel circuit opposite to the substrate; An encapsulation structure is fabricated on the side of the light-emitting functional layer away from the substrate. The encapsulation structure includes an organic encapsulation layer that at least covers the sidewall of the groove near the pixel circuit.
10. The preparation method according to claim 9, characterized in that, The pixel circuit includes a conductive portion; the fabrication of the initial structural layer on the substrate includes: A semiconductor layer, a plurality of first insulating material layers, and a plurality of conductive material layers are fabricated on the substrate, wherein the insulating material layers and the conductive material layers are alternately disposed, and at least a portion of the conductive material layers includes the conductive portion and the etching barrier portion.