Display panel, manufacturing method thereof and display device

By setting undercut isolation pillars in the OLED display panel and adjusting the height of the insulating layer, the problem of water and oxygen intrusion into the cross-section of the light-emitting functional layer was solved, resulting in a denser inorganic encapsulation layer and improved display performance.

CN121751939APending Publication Date: 2026-03-27BOE TECHNOLOGY GROUP CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-27
Publication Date
2026-03-27

AI Technical Summary

Technical Problem

The light-emitting functional layer section at the cutout location of the OLED display panel is susceptible to water and oxygen intrusion, leading to poor display quality.

Method used

An isolation pillar with an undercut structure is set in the OLED display panel to disconnect the light-emitting functional layer. By setting a height difference in the first insulating layer, the inorganic encapsulation layer is made denser at the undercut structure position to prevent water and oxygen intrusion.

Benefits of technology

It effectively isolates water and oxygen intrusion, improves display effect, prevents cracks in the inorganic encapsulation layer at the undercut structure location, and ensures the normal light-emitting function of the display area.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a display panel, a manufacturing method thereof and a display device. The display panel comprises a substrate; the at least one insulating layer is arranged on the substrate; the isolation column is arranged on one side, far away from the substrate, of the insulation layer; an undercut structure is formed on the side surface of the isolation column; the light-emitting functional layer is arranged on one side, far away from the substrate, of the isolation column and is disconnected at the position of the undercut structure; the inorganic packaging layer is arranged on one side, far away from the substrate, of the light-emitting functional layer; wherein the surface height of a first insulating layer in the at least one insulating layer, which is located in a first area where the isolation column is located, is lower than the surface height of second areas located at two sides of the isolation column, and the first insulating layer is the insulating layer, which is closest to the isolation column, in the at least one insulating layer. Water and oxygen can be prevented from invading the display panel, and then the display effect is improved.
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Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of display, in particular to a display panel, a manufacturing method thereof and a display device. BACKGROUND

[0002] Organic Light-Emitting Diode (OLED) display panels have advantages such as high color performance, high contrast, fast response time, thinness and flexibility, and are currently widely used. In order to realize a full-screen, a camera or other sensors can be arranged by digging a hole in the display area (AA area) of the OLED display panel.

[0003] The light-emitting functional layer in the OLED display panel is usually arranged in an integral layer. When the AA area of the display panel is dug, the light-emitting functional layer forms a section at the cutting line position of the hole, which may cause water and oxygen to invade from the section of the light-emitting functional layer, resulting in display problems. SUMMARY

[0004] Embodiments of the present application provide a display panel, a manufacturing method thereof and a display device, which are used to solve the problem that the light-emitting functional layer of the existing OLED display panel generates a section at the cutting line position of the hole, causing water and oxygen to invade and resulting in display problems.

[0005] To solve the above technical problems, the present application is implemented as follows:

[0006] In a first aspect, embodiments of the present application provide a display panel, comprising:

[0007] a substrate substrate;

[0008] at least one insulating layer disposed on the substrate substrate;

[0009] an isolation column disposed on a side of the insulating layer away from the substrate substrate; a side surface of the isolation column forms an undercut structure;

[0010] a light-emitting functional layer disposed on a side of the isolation column away from the substrate substrate and disconnected at the position of the undercut structure;

[0011] an inorganic encapsulation layer disposed on a side of the light-emitting functional layer away from the substrate substrate;

[0012] wherein the surface height of the first insulating layer in the at least one insulating layer is lower than the surface height of the second area on both sides of the isolation column, and the first insulating layer is the insulating layer closest to the isolation column in the at least one insulating layer.

[0013] Optionally, the display panel has a display area, a cutout area located inside the display area, and a transition area located between the cutout area and the display area; the isolation column is located in the transition area and is arranged around the cutout area.

[0014] Optionally, the display panel further comprises:

[0015] A first heightening pattern is arranged in the second area on both sides of the isolation column.

[0016] Optionally, the display panel comprises a plurality of insulating layers; the first heightening pattern is arranged between the plurality of insulating layers.

[0017] Optionally, the first heightening pattern comprises at least one layer of gate metal pattern, and / or the first heightening pattern comprises at least one layer of source-drain metal pattern.

[0018] Optionally, the display panel further comprises:

[0019] A second heightening pattern is arranged on the side of the isolation column close to the substrate and in the first area; the height of the second heightening pattern is lower than that of the first heightening pattern.

[0020] Optionally, at least one of the insulating layers forms an etching groove in the first area where the isolation column is located; the orthographic projection of the isolation column on the substrate is located in the orthographic projection area of the etching groove on the substrate.

[0021] Optionally, the first insulating layer forms the etching groove.

[0022] Optionally, the isolation column comprises a first film layer, a second film layer and a third film layer arranged in sequence in the direction away from the substrate, the side surface of the second film layer is inwardly recessed relative to the first film layer and the third film layer, forming the undercut structure.

[0023] Alternatively, the isolation column comprises a fourth film layer, a first film layer, a second film layer and a third film layer arranged in sequence in the direction away from the substrate, the side surface of the second film layer is inwardly recessed relative to the first film layer and the third film layer, forming the undercut structure.

[0024] Optionally, the isolation column comprises at least one layer of source-drain metal pattern.

[0025] Optionally, the display panel comprises a plurality of isolation columns, the plurality of isolation columns are arranged in sequence and spaced apart from each other in the direction from the edge of the transition area to the display area.

[0026] In a second aspect, an embodiment of the present application provides a manufacturing method of a display panel, used for manufacturing the display panel of the first aspect, and the manufacturing method comprises:

[0027] providing a substrate substrate;

[0028] forming at least one insulating layer on the substrate substrate;

[0029] forming an isolation column on a side of the insulating layer away from the substrate substrate, and a side surface of the isolation column is formed with an undercut structure;

[0030] forming a light-emitting functional layer on a side of the isolation column away from the substrate substrate, and the light-emitting functional layer is disconnected at a position of the undercut structure;

[0031] forming an inorganic encapsulation layer on a side of the light-emitting functional layer away from the substrate substrate;

[0032] wherein a surface height of a first region where the isolation column is located of the first insulating layer is lower than a surface height of a second region on both sides of the isolation column, and the first insulating layer is the insulating layer closest to the isolation column in the at least one insulating layer.

[0033] In a third aspect, an embodiment of the present application provides a display device comprising the display panel of the first aspect.

[0034] In the embodiment of the present application, the isolation column with the undercut structure can disconnect the light-emitting functional layer, and even if the section formed by cutting the light-emitting functional layer is invaded by water and oxygen, the light-emitting functional layer in the display region will not be affected, and the effect of isolating water and oxygen can be achieved. In addition, the surface height of the first region where the isolation column is located of the first insulating layer is lower than the surface height of the second region on both sides of the isolation column, so that the height difference between the light-emitting functional layer of the first region where the isolation column is located and the light-emitting functional layer of the second region on both sides of the isolation column is small, so that when the inorganic encapsulation layer is formed, more accumulation will be generated at the interface between the first region and the second region of the inorganic material, and the film layer of the inorganic encapsulation layer at the position of the undercut structure will be more dense, so that the inorganic encapsulation layer is not easy to crack at the position of the undercut structure, further preventing water and oxygen from invading, and thus improving the display effect. BRIEF DESCRIPTION OF DRAWINGS

[0035] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The detailed description is made with reference to the accompanying drawings.

[0036] Figure 1A structural schematic diagram of an OLED display panel in the related art;

[0037] Figure 2 A top view of a display panel of an embodiment of the present application;

[0038] Figure 3 A sectional view of a display panel of an embodiment of the present application;

[0039] Figure 4 A sectional view of a display panel of an embodiment of the present application;

[0040] Figure 5 A sectional view of a display panel of an embodiment of the present application;

[0041] Figure 6 A sectional view of a display panel of an embodiment of the present application;

[0042] Figure 7 A sectional view of a display panel of an embodiment of the present application;

[0043] Figure 8 A sectional view of a display panel of an embodiment of the present application;

[0044] Figure 9 A sectional view of a display panel of an embodiment of the present application;

[0045] Figure 10 A sectional view of a display panel of an embodiment of the present application;

[0046] Figure 11 A comparison schematic diagram of a display panel of an embodiment of the present application and a display panel in the related art at a position of an isolation column;

[0047] Figure 12 A sectional view of a display area of a display panel of an embodiment of the present application;

[0048] Figure 13 A flowchart of a manufacturing method of a display panel of an embodiment of the present application;

[0049] Figure 14 A sectional view of a display panel of an embodiment of the present application; DETAILED DESCRIPTION

[0050] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application.

[0051] Please refer toFigure 1 , Figure 1 This is a schematic diagram of an OLED display panel structure in related technologies. In these technologies, an isolation pillar with an undercut structure can be set on the OLED display panel to separate the light-emitting functional layer. Even if water or oxygen intrudes into the cut surface of the light-emitting functional layer, it will not affect the light-emitting functional layer within the display area, thus achieving the effect of isolating water and oxygen. However, due to the undercut structure of the isolation pillar, the subsequently formed inorganic encapsulation layer may develop a depression at the undercut location. The inorganic encapsulation layer film at the undercut location is relatively thin and prone to cracking. Moisture can propagate along the crack path to the interface of the light-emitting functional layer, producing GDSH (ghost black spots at the aperture edge) phenomenon, thereby causing display defects.

[0052] To solve the above problems, please refer to... Figure 2 , Figure 3 and Figure 4 This invention provides a display panel, comprising:

[0053] Substrate 10; the substrate 10 can be a rigid substrate, such as a glass substrate, or a flexible substrate, such as a polyimide (PI) substrate, to achieve flexible display.

[0054] At least one insulating layer 20 is disposed on the substrate 10;

[0055] An isolation pillar 30 is disposed on the side of the insulating layer 20 away from the substrate 10, and the side of the isolation pillar 30 has an undercut structure.

[0056] The light-emitting functional layer 40 is disposed on the side of the isolation pillar 30 away from the substrate 10 and is broken at the position of the undercut structure; in addition to the light-emitting layer (EL), the light-emitting functional layer 40 may also include at least one of the following: hole transport layer, hole injection layer, electron transport layer, electron injection layer, etc.

[0057] An inorganic encapsulation layer 50 is disposed on the side of the light-emitting functional layer 40 away from the substrate 10;

[0058] Wherein, the surface height of the first insulating layer in the at least one insulating layer 20 located in the first region where the isolation pillar 30 is located is lower than the surface height of the second region located on both sides of the isolation pillar, and the first insulating layer is the insulating layer closest to the isolation pillar among the at least one insulating layer.

[0059] contrast Figure 1 and Figure 4As can be seen, in related technologies, the surface height of the insulating layer closest to the isolation pillar in the first region where the isolation pillar is located is higher than the surface height of the second region located on both sides of the isolation pillar. This can lead to a possible depression in the subsequently formed inorganic encapsulation layer at the undercut position, where the inorganic encapsulation layer film is thinner and more prone to cracking. However, in this embodiment of the invention, the surface height of the first insulating layer in the first region where the isolation pillar 30 is located is lower than the surface height of the second region located on both sides of the isolation pillar. This results in more accumulation of inorganic material at the interface between the first and second regions during the formation of the inorganic encapsulation layer. The inorganic encapsulation layer film at the undercut position is denser, making it less prone to cracking at the undercut position.

[0060] In this embodiment of the invention, by setting an isolation pillar with an undercut structure, the light-emitting functional layer can be disconnected. Even if water and oxygen invade the cross-section formed by the cutting, it will not affect the light-emitting functional layer in the display area, thus achieving the effect of isolating water and oxygen. Furthermore, the surface height of the first insulating layer in the first region where the isolation pillar is located is lower than the surface height of the second regions located on both sides of the isolation pillar. This reduces the height difference between the light-emitting functional layer in the first region where the isolation pillar is located and the light-emitting functional layer in the second regions on both sides of the isolation pillar. Consequently, when forming the inorganic encapsulation layer, more inorganic material will accumulate at the interface between the first and second regions. The film layer of the inorganic encapsulation layer at the undercut structure location will be denser, making it less prone to cracking at the undercut structure location, further preventing water and oxygen intrusion, and thus improving the display effect.

[0061] In some embodiments, optionally, the display panel has a display area a, a punch-hole area b located inside the display area a, and a transition area c located between the punch-hole area b and the display area a; the isolation pillar 30 is located in the transition area c and is disposed around the punch-hole area b.

[0062] Optionally, the at least one insulating layer 20 may be located in the display area a and the transition area c, the light-emitting functional layer 40 may be located in the display area a and the transition area c, and the inorganic encapsulation layer 50 may be located in the display area a and the transition area c.

[0063] Optionally, the cutout area can be used to mount a camera or other sensors.

[0064] In this embodiment of the invention, by setting an isolation pillar with an undercut structure, the light-emitting functional layer can be disconnected. Even if water and oxygen invade the cross-section formed by the cutting in the transition area of ​​the light-emitting functional layer, it will not affect the light-emitting functional layer in the display area, thus achieving the effect of isolating water and oxygen. Furthermore, the surface height of the first insulating layer in the first region where the isolation pillar is located is lower than the surface height of the second regions located on both sides of the isolation pillar. This reduces the height difference between the light-emitting functional layer in the first region where the isolation pillar is located and the light-emitting functional layer in the second regions on both sides of the isolation pillar. Consequently, when forming the inorganic encapsulation layer, more inorganic material will accumulate at the interface between the first and second regions. The film layer of the inorganic encapsulation layer at the undercut structure location will be denser, making it less prone to cracking at the undercut structure location, further preventing water and oxygen intrusion, and thus improving the display effect.

[0065] Of course, in other embodiments of the present invention, the isolation pillars are not limited to being arranged around the cut-out area. For example, in some embodiments, they may be arranged around the entire display area, located in the non-display area outside the display area.

[0066] In addition to the light-emitting functional layer, the display panel in this embodiment of the invention may also include an anode and a cathode. The anode and cathode are located within the display area, and the anode, the light-emitting functional layer, and the cathode within the display area constitute the light-emitting unit of the display panel.

[0067] The inorganic encapsulation layer in this embodiment of the invention may include: a first inorganic encapsulation layer (CVD1) and / or a second inorganic encapsulation layer (CVD2) for the display panel.

[0068] The display panel in this embodiment of the invention may further include a driving circuit layer for driving the light-emitting unit to emit light. The substrate, the driving circuit layer, and the aforementioned insulating layer constitute the backplane of the display panel. The driving circuit layer may include a thin-film transistor and a capacitor. The thin-film transistor includes a gate, an active layer, a source, and a drain.

[0069] The insulating layer in the embodiments of the present invention may be an insulating layer on the backplane, including at least one of the following: a barrier layer, a buffer layer, an interlayer dielectric layer (ILD), and a passivation layer (PVX).

[0070] In some embodiments, alternatively, please refer to Figure 4The isolation pillar 30 includes a first film layer 31, a second film layer 32, and a third film layer 33 sequentially disposed along a direction away from the substrate 10. The side surface of the second film layer 32 is recessed inward relative to the first film layer 31 and the third film layer 33, forming the undercut structure. Of course, the film layer structure of the isolation pillar 30 is not limited to this. For example, in some other embodiments of the present invention, the isolation pillar 30 may also include only the third film layer 33 and the second film layer 32, with the side surface of the second film layer 32 recessed inward relative to the third film layer 33 to form the undercut structure. Please refer to... Figure 10 , Figure 10 In the embodiment shown, the isolation pillar 30 includes a fourth film layer 34, a first film layer 31, a second film layer 32 and a third film layer 33 arranged sequentially in a direction away from the substrate 10. The side of the second film layer 32 is recessed inward relative to the first film layer 31 and the third film layer 33 to form the undercut structure.

[0071] In some embodiments, optionally, the first film layer 31, the second film layer 32, and the third film layer 33 of the isolation column 30 can be Ti / Al / Ti, respectively.

[0072] In some embodiments, optionally, the isolation pillar 30 includes at least one layer of source-drain (SD) metal pattern. That is, the isolation pillar 30 can be formed with the source-drain metal pattern of the display area of ​​the display panel in a single patterning process, for example, with the source-drain electrode of the thin-film transistor in a single patterning process, thereby reducing process steps and lowering costs.

[0073] like Figure 10 In the illustrated embodiment, the fourth film layer can be a source / drain (SD) metal pattern. The first, second, and third films form a source / drain (SD) metal pattern. In some embodiments, the first film layer 31, the second film layer 32, and the third film layer 33 can be Ti / Al / Ti, respectively, while the fourth film layer can be a Ti / Al / Ti three-layer structure.

[0074] In some embodiments, alternatively, please refer to Figure 2 and Figure 3 The display panel includes a plurality of isolation pillars 30, which are arranged at intervals from the edge of the transition area to the display area. Figure 2 In the illustrated embodiment, the display panel includes one isolation column. Figure 3 In the illustrated embodiment, the display panel includes seven isolation columns; however, the number of isolation columns is not limited to this. The more isolation columns there are, the better the effect of isolating water and oxygen.

[0075] Please refer to Figure 5 and Figure 8In some embodiments of the present invention, optionally, the display panel further includes: a first raised pattern 60 located in the transition region and disposed around the perforated region, and disposed in the second region on both sides of the isolation pillar 30, that is, the orthographic projection of the first raised pattern 60 on the substrate 10 does not overlap with the orthographic projection of the isolation pillar 30 on the substrate 10, and the isolation pillar 30 and the first raised pattern 60 are staggered. By setting the first raised pattern 60, the height of the insulating layer in the second region on both sides of the isolation pillar 30 can be increased, thereby making the surface height of the first insulating layer in the second region on both sides of the isolation pillar 30 higher than the surface height of the first insulating layer in the first region where the isolation pillar 30 is located.

[0076] Figure 5 and Figure 8 In the described embodiment, the display panel includes a first raised graphic 60. In other embodiments of the present invention, the display panel may include multiple stacked first raised graphics 60. Please refer to [reference needed]. Figure 6 and Figure 7 , Figure 6 In the illustrated embodiment, the display panel may include two stacked first raised graphics 60. Figure 7 In the illustrated embodiment, the display panel may include a first raised graphic 60 arranged in three stacked layers.

[0077] In some embodiments, optionally, the display panel includes multiple insulating layers 20, for example... Figure 8 In the embodiment shown, the display panel includes two insulating layers, namely a first insulating layer 21 and a second insulating layer 22. Figure 5 and Figure 6 In the illustrated embodiment, the display panel includes three insulating layers: a first insulating layer 21, a second insulating layer 22, and a third insulating layer 23. Figure 7 In the illustrated embodiment, the display panel includes four insulating layers: a first insulating layer 21, a second insulating layer 22, a third insulating layer 23, and a fourth insulating layer 24. The first raised pattern 60 is disposed between the multiple insulating layers 20. Optionally, if the display panel includes multiple first raised patterns, the multiple first raised patterns are separated by the insulating layers.

[0078] In some embodiments, optionally, the first raised pattern 60 includes at least one layer of gate metal pattern (see reference). Figure 5 , Figure 6 and Figure 7 ), and / or, the first raised pattern includes at least one layer of source / drain metal pattern (see reference). Figure 8In other words, at least one layer of the first raised pattern 60 can be formed with the gate metal layer or source / drain metal pattern in the display area of ​​the display panel through a single patterning process, for example, with the gate or source / drain of a thin-film transistor through a single patterning process, thereby reducing process steps and lowering costs.

[0079] In this embodiment of the invention, the height of the gate metal pattern is generally between 2500 Å and 3000 Å. Therefore, setting one layer of gate metal pattern in the second region is equivalent to raising the insulating layer of the second region by 2500 Å to 3000 Å. Adding another layer of gate metal pattern in the second region is equivalent to raising the insulating layer of the second region by an additional 2500 Å to 3000 Å. The height of the source / drain metal pattern is generally higher than 3000 Å. Therefore, setting one layer of source / drain metal pattern in the second region is equivalent to raising the insulating layer of the second region by more than 3000 Å, resulting in a more significant raising effect.

[0080] In some embodiments, the source / drain metal pattern used to form the first raised pattern 60 and the source / drain metal pattern used to form the second film layer 32 of the isolation pillar 30 are not the same source / drain metal layer. The source / drain metal pattern used to form the first raised pattern 60 can be SD1, and the source / drain metal pattern used to form the second film layer 32 of the isolation pillar 30 can be SD2 or SD3. Alternatively, the source / drain metal pattern used to form the first raised pattern 60 can be SD2, and the source / drain metal pattern used to form the second film layer 32 of the isolation pillar 30 can be SD3. SD1 can be an auxiliary... Figure 12 The first source / drain metal layer 208 in the SD2 may be an attached layer. Figure 12 The second source / drain metal layer 211 in the SD3 is attached Figure 12 Not shown, it is the source / drain metal layer formed after SD2, which is insulated from SD2 through PLN and connected to SD2 through vias on PLN.

[0081] In some embodiments, alternatively, please refer to Figure 14The display panel further includes: a second raised pattern 70, located in the transition region and surrounding the perforated region, disposed on the side of the isolation pillar 30 near the substrate 10, located in the first region; the height of the second raised pattern 70 is lower than the height of the first raised pattern 60. That is, the first region where the isolation pillar is located can also be raised, but the raised height of the first region needs to be less than the raised height of the second regions on both sides of the isolation pillar, ensuring that the surface height of the first insulating layer in the first region where the isolation pillar 30 is located is lower than the surface height of the second regions on both sides of the isolation pillar. It should be noted that if the first raised pattern 60 includes one or more, the second raised pattern 70 also includes one or more, and the total height of one or more second raised patterns 70 is lower than the total height of one or more first raised patterns 60.

[0082] In some embodiments, please refer to Figure 9 Optionally, at least one layer of the insulating layer 20 forms an etching groove 20a in the first region where the isolation pillar 30 is located, and the orthographic projection of the isolation pillar 30 on the substrate 10 lies within the orthographic projection area of ​​the etching groove 20a on the substrate 10. By forming the etching groove 20a on at least one layer of the insulating layer in the first region, the surface height of the first insulating layer in the first region can be reduced, thereby making the surface height of the first insulating layer in the first region where the isolation pillar 30 is located lower than the surface height of the second regions located on both sides of the isolation pillar. Figure 9 In the embodiment shown, in addition to creating a groove in the insulating layer 20 of the first region, a first raised pattern 60 is also provided in the second region.

[0083] Optionally, the etching groove is formed on the first insulating layer, that is, on the insulating layer closest to the isolation pillar 30, while other insulating layers may not be formed. Of course, it is also possible to form etching grooves on multiple insulating layers simultaneously.

[0084] Please refer to Figure 11 , Figure 11 This is a comparative schematic diagram of the display panel of this invention and the isolation pillar positions of display panels in related technologies. Figure 11 It can be seen that the inorganic encapsulation layer in the related technology will produce a depression at the undercut position, the film layer is relatively thin, and it is prone to cracking, and the moisture content at the undercut structure of the isolation pillar is severe. However, the inorganic encapsulation layer in the embodiment of the present invention has a denser film layer at the undercut structure position, making it less prone to cracking at the undercut structure position, and the moisture and oxygen content at the undercut structure of the isolation pillar is relatively low.

[0085] The display panel in this embodiment of the invention can be an OLED display panel, but other types of display panels are also possible.

[0086] The specific structure of the display area of ​​the display panel in this embodiment of the invention will be described below with reference to the cross-sectional view of the display panel. Please refer to... Figure 12 , Figure 12 This is a cross-sectional view of a display panel according to an embodiment of the present invention. The display panel includes: a substrate 200, and, sequentially disposed on the substrate 200, a buffer layer 201, an active layer 202, a first gate insulating layer 203, a first gate metal layer (including a gate electrode 204a and a first capacitor electrode 204b), a first gate insulating layer 205, a second gate metal layer (including a second capacitor electrode 206), an interlayer dielectric layer 207, a first source / drain metal layer 208 (including a source and a drain), a passivation layer (PVX) 209, and a first planarization layer. (PLN1) 210, second source / drain metal layer 211, second planarization layer (PLN2) 212, anode 213, pixel definition layer 214, light-emitting layer (EL) 215, cathode 216, first inorganic encapsulation layer (CVD1) 217, organic encapsulation layer (IJP) 218, second inorganic encapsulation layer (CVD2) 219, inorganic insulating layer (buffer) 220, touch insulating layer (TLD) 221, touch trace 222 and planarization layer (OC) 223.

[0087] Among them, the anode 213, the light-emitting layer (EL) 215, and the cathode 216 are used to form the light-emitting unit.

[0088] The active layer 202, gate 204a, source, and drain are used to form a thin-film transistor in the driving circuit. The driving circuit is used to drive the light-emitting unit to emit light. The first capacitor electrode 204b and the second capacitor electrode 206 are used to form the capacitor in the driving circuit.

[0089] In the embodiments of the present invention, the active layer can be made of low-temperature polycrystalline oxide (LTPO) material, that is, the display panel is an LTPO display panel.

[0090] In the above embodiments, the first raised pattern can be made of the same material as at least one of the first gate metal layer, the second gate metal layer, the first source / drain metal layer, and the second source / drain metal layer.

[0091] The second raised pattern in the above embodiments can also be made of the same layer and material as at least one of the first gate metal layer, the second gate metal layer, the first source / drain metal layer and the second source / drain metal layer.

[0092] Please refer to Figure 13This invention also provides a method for manufacturing a display panel, used to manufacture the display panel described in any of the above embodiments, the method comprising:

[0093] Step S1: Provide a substrate;

[0094] Step S2: Form at least one insulating layer on the substrate;

[0095] Step S3: An isolation pillar is formed on the side of the insulating layer away from the substrate, and an undercut structure is formed on the side of the isolation pillar;

[0096] Step S4: A light-emitting functional layer is formed on the side of the isolation pillar away from the substrate, and the light-emitting functional layer is broken at the location of the undercut structure;

[0097] Step S5: An inorganic encapsulation layer is formed on the side of the light-emitting functional layer away from the substrate.

[0098] Wherein, the surface height of the first insulating layer in the at least one insulating layer located in the first region where the isolation post is located is lower than the surface height of the second region located on both sides of the isolation post, and the first insulating layer is the insulating layer closest to the isolation post among the at least one insulating layer.

[0099] In this embodiment of the invention, by setting an isolation pillar with an undercut structure, the light-emitting functional layer can be disconnected. Even if water and oxygen invade the cross-section formed by the cutting, it will not affect the light-emitting functional layer in the display area, thus achieving the effect of isolating water and oxygen. Furthermore, the surface height of the first insulating layer in the first region where the isolation pillar is located is lower than the surface height of the second regions located on both sides of the isolation pillar. This reduces the height difference between the light-emitting functional layer in the first region where the isolation pillar is located and the light-emitting functional layer in the second regions on both sides of the isolation pillar. Consequently, when forming the inorganic encapsulation layer, more inorganic material will accumulate at the interface between the first and second regions. The film layer of the inorganic encapsulation layer at the undercut structure location will be denser, making it less prone to cracking at the undercut structure location, further preventing water and oxygen intrusion, and thus improving the display effect.

[0100] Optionally, the display panel has a display area, a cutout area located within the display area, and a transition area located between the cutout area and the display area; the isolation pillar is located in the transition area and is disposed around the cutout area.

[0101] Optionally, the method for manufacturing the display panel in this embodiment of the invention further includes:

[0102] A first raised shape is formed, which is disposed in the second region on both sides of the isolation column.

[0103] Optionally, the display device of this embodiment includes multiple insulating layers; the first raised pattern is disposed between the multiple insulating layers.

[0104] Optionally, the first raised pattern includes at least one layer of gate metal pattern, and / or the first raised pattern includes at least one layer of source / drain metal pattern.

[0105] Optionally, the method for manufacturing the display panel in this embodiment of the invention further includes:

[0106] A second raised pattern is formed, which is disposed on the side of the isolation pillar near the substrate and located in the first region; the height of the second raised pattern is lower than the height of the first raised pattern.

[0107] Optionally, at least one of the insulating layers forms an etching groove in the first region where the isolation pillar is located, and the orthographic projection of the isolation pillar on the substrate is located within the orthographic projection region of the etching groove on the substrate.

[0108] Optionally, the first insulating layer forms the etched groove.

[0109] Optionally, the isolation pillar includes a first film layer, a second film layer, and a third film layer disposed sequentially along a direction away from the substrate, wherein the side of the second film layer is recessed inward relative to the first film layer and the third film layer to form the undercut structure;

[0110] Alternatively, the isolation pillar includes a fourth film layer, a first film layer, a second film layer, and a third film layer arranged sequentially in a direction away from the substrate, wherein the side of the second film layer is recessed inward relative to the first film layer and the third film layer to form the undercut structure.

[0111] Optionally, the isolation pillar includes at least one layer of source / drain metal pattern.

[0112] Optionally, the display panel includes a plurality of isolation pillars, which are arranged at intervals from the edge of the transition area to the display area.

[0113] This invention also provides a display device, including the display panel described in any of the above embodiments. The display device in this invention can be a mobile phone, tablet computer, personal computer, television, vehicle-mounted display device, etc.

[0114] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of the present invention.

Claims

1. A display panel, characterized in that, include: Substrate; At least one insulating layer is disposed on the substrate; An isolation pillar is disposed on the side of the insulating layer away from the substrate; the side of the isolation pillar has an undercut structure. A light-emitting functional layer is disposed on the side of the isolation pillar away from the substrate and is disconnected at the location of the undercut structure; An inorganic encapsulation layer is disposed on the side of the light-emitting functional layer away from the substrate. Wherein, the surface height of the first insulating layer in the at least one insulating layer located in the first region where the isolation post is located is lower than the surface height of the second region located on both sides of the isolation post, and the first insulating layer is the insulating layer closest to the isolation post among the at least one insulating layer.

2. The display panel according to claim 1, characterized in that, The display panel has a display area, a cutout area located inside the display area, and a transition area located between the cutout area and the display area; the isolation pillar is located in the transition area and is disposed around the cutout area.

3. The display panel according to claim 1 or 2, characterized in that, Also includes: The first raised shape is set in the second region on both sides of the isolation column.

4. The display panel according to claim 3, characterized in that, It includes multiple insulating layers; the first raised pattern is disposed between the multiple insulating layers.

5. The display panel according to claim 3, characterized in that, The first raised pattern includes at least one layer of gate metal pattern, and / or the first raised pattern includes at least one layer of source drain metal pattern.

6. The display panel according to claim 3, characterized in that, Also includes: The second raised pattern is disposed on the side of the isolation pillar near the substrate, located in the first region; The height of the second raised graphic is lower than the height of the first raised graphic.

7. The display panel according to claim 1, characterized in that, At least one of the insulating layers forms an etched groove in the first region where the isolation pillar is located, and the orthographic projection of the isolation pillar on the substrate is located within the orthographic projection region of the etched groove on the substrate.

8. The display panel according to claim 7, characterized in that, The first insulating layer forms the etched groove.

9. The display panel according to claim 1, characterized in that, The isolation pillar includes a first film layer, a second film layer, and a third film layer arranged sequentially in a direction away from the substrate. The side of the second film layer is recessed inward relative to the first film layer and the third film layer to form the undercut structure. Alternatively, the isolation pillar includes a fourth film layer, a first film layer, a second film layer, and a third film layer arranged sequentially in a direction away from the substrate, wherein the side of the second film layer is recessed inward relative to the first film layer and the third film layer to form the undercut structure.

10. The display panel according to claim 1 or 9, characterized in that, The isolation pillar includes at least one layer of source / drain metal pattern.

11. The display panel according to claim 2, characterized in that, It includes multiple isolation columns, which are arranged at intervals from the edge of the transition area to the display area.

12. A method for manufacturing a display panel, characterized in that, The method for manufacturing a display panel as described in any one of claims 1-11 includes: Provide substrates; At least one insulating layer is formed on the substrate. An isolation pillar is formed on the side of the insulating layer away from the substrate, and an undercut structure is formed on the side of the isolation pillar; A light-emitting functional layer is formed on the side of the isolation pillar away from the substrate, and the light-emitting functional layer is broken at the location of the undercut structure; An inorganic encapsulation layer is formed on the side of the light-emitting functional layer away from the substrate. Wherein, the surface height of the first insulating layer in the at least one insulating layer located in the first region where the isolation post is located is lower than the surface height of the second region located on both sides of the isolation post, and the first insulating layer is the insulating layer closest to the isolation post among the at least one insulating layer.

13. A display device, characterized in that, Includes the display panel as described in any one of claims 1-11.