Integrated circuit package capable of independently assembling passive component and manufacturing method thereof

Abstract

The invention provides an integrated circuit package capable of independently assembling passive components and a manufacturing method thereof. The integrated circuit package capable of independently assembling passive components comprises an integrated circuit which is used for being mounted on a circuit board; the heat dissipation structure is independently manufactured and is provided with a first-layer flat plate, a second-layer flat plate, a third-layer flat plate, a fourth-layer flat plate and a fifth-layer flat plate, the cavity is positioned on one side of the first-layer flat plate, and the cavity is provided with at least one opening for assembling a passive element; wherein the passive element is arranged in the cavity from the opening of the heat dissipation structure during assembly, and is electrically connected with the circuit board or the integrated circuit through the electrical conductor of the passive element; wherein heat generated by the integrated circuit is transmitted through the heat dissipation structure.

Description

TECHNICAL FIELD

[0001] The present invention relates to an integrated circuit package with independently assembled passive devices and a manufacturing method thereof, in particular, to an integrated circuit package with independently assembled passive devices and a manufacturing method thereof, in which the heat dissipation structure is independently manufactured and the passive devices are independently assembled. BACKGROUND

[0002] As shown in Figure 1 US Patent US11770916 discloses an inductor structure 1, which is coated with a metal strip 3 made of high thermal conductivity material outside the inductor. The metal strip 3 is designed to enhance the heat conduction between the inductor and the integrated circuit chip, thereby improving the heat dissipation efficiency. The metal strip 3 can be made of copper, silver, aluminum or other high thermal conductivity materials, and its width can be adjusted as needed to ensure effective thermal connection with the underlying integrated circuit chip.

[0003] However, this prior art has some obvious shortcomings. First, the metal strip 3 is installed by coating the inductor after the inductor is manufactured. Since the metal strip 3 needs to be precisely bent to fit the shape of the inductor, it is difficult to ensure perfect fit between the metal strip 3 and the surface of the inductor during manufacturing. Especially at the bending part, it is difficult to achieve a precise 90-degree angle, which leads to uneven or excessive gaps between the metal strip 3 and the inductor, thereby affecting the heat conduction efficiency.

[0004] Secondly, a thermal interface material (TIM) is needed to connect the metal strip 3 and the inductor. Since the TIM has relatively low thermal conductivity (usually 1-2 W / mK), and there is a gap between the starting point and the end point of the metal strip 3, this further increases the thermal resistance, weakening the overall heat conduction efficiency. In addition, since the metal strip 3 mainly surrounds the side of the inductor, heat needs to be transferred along a longer path, which makes the heat conduction path from the integrated circuit chip to the heat sink longer, increasing the thermal resistance and affecting the heat dissipation effect.

[0005] In addition, if you want to change the inductor supplier or use different specifications and sizes of inductors, you often need to develop or customize another new metal strip 3, which lacks flexibility in manufacturing, is complex in process and high in cost.

[0006] In view of the shortcomings of the prior art, the present invention provides a design of an integrated circuit package with independently assembled passive devices, which can greatly improve the heat dissipation effect and the flexibility of manufacturing through a simple manufacturing process. SUMMARY

[0007] In one aspect, the present application provides an integrated circuit package with independently assembled passive components, comprising: an integrated circuit configured to be mounted on a circuit board; and a heat dissipation structure independently manufactured and having: a first plate configured to be in thermal contact with the integrated circuit; and a cavity located on one side of the first plate, the cavity having an opening to assemble a passive component; wherein the passive component is assembled by being inserted into the cavity from the opening of the heat dissipation structure and electrically connected to the circuit board or the integrated circuit through an electrical conductor of the passive component; and wherein heat generated by the integrated circuit is dissipated through the heat dissipation structure.

[0008] In another aspect, the present application provides a method of manufacturing an integrated circuit package with independently assembled passive components, comprising: mounting an integrated circuit on a circuit board; independently manufacturing a heat dissipation structure in advance, the heat dissipation structure having a first plate and a cavity located on one side of the first plate, the cavity having at least one opening; mounting the heat dissipation structure on the integrated circuit such that the first plate is in thermal contact with the integrated circuit; and assembling at least one passive component by inserting it into the cavity from the at least one opening of the cavity and electrically connecting the circuit board or the integrated circuit through an electrical conductor of the passive component.

[0009] In one embodiment, the passive component comprises an inductor.

[0010] In one embodiment, the material of the heat dissipation structure is a formable metal, including steel, copper, silver, gold, aluminum, tungsten, zinc, or stainless steel.

[0011] In one embodiment, the process of forming the heat dissipation structure comprises casting, milling, turning, stamping, or forging.

[0012] In one embodiment, the material of the heat dissipation structure is a non-metallic material, including aluminum nitride, silicon carbide, or graphite.

[0013] In one embodiment, the first plate is attached to the top surface of the integrated circuit through a thermal interface material.

[0014] In one embodiment, the passive component is optionally inserted into the cavity from the at least one opening or removed from the cavity through the at least one opening.

[0015] In one embodiment, the top surface of the passive component is flush or substantially flush with the top surface of the heat dissipation structure, so that the passive component and the heat dissipation structure are simultaneously in contact with an external heat sink.

[0016] In one embodiment, the heat dissipation structure further comprises a first layer of flat plate and at least a second layer of flat plate, connected to each other by one or more metal pillars, so that the plurality of passive components are layered and stacked on the first layer of flat plate and the at least a second layer of flat plate, to accommodate a plurality of passive components or to improve heat dissipation efficiency.

[0017] In one embodiment, the passive component is further connected to the circuit board by a heat-conducting column, wherein the material of the heat-conducting column is formable metal, including copper, silver, gold or aluminum.

[0018] Compared with the prior art, the present application has obvious advantages. First, in the manufacturing process, since the heat dissipation structure of the present application is "independent" and retains the gap for installing inductors of different brands or standard sizes, the entire heat dissipation metal part does not need to be redesigned when the inductor is replaced, simplifying the development process of different inductor designs and different electrical specifications.

[0019] Secondly, the heat dissipation structure of the present application can be designed as a flat or multi-layer extended metal part that fits the top surface of the IC to effectively conduct the heat generated by the IC to the external heat dissipation path (such as Heat Sink, mechanism shell, etc.).

[0020] In addition, if the inductor also generates heat, the heat dissipation structure of the present application can simultaneously contact the upper surface or side of the inductor, further conducting the heat out; or compensate for tolerances through thermal paste (TIM, Solder) to improve heat transfer efficiency.

[0021] Furthermore, the heat dissipation structure of the present application can be single-layer, double-layer or extended up and down, and even can stack the second layer, third layer of passive components.

[0022] In summary, the present application overcomes the shortcomings of the prior art in manufacturing difficulty, heat conduction path, thermal resistance and heat dissipation efficiency, simplifying the manufacturing process and flexibility. Through innovative structural design and manufacturing method, the present application provides a more effective heat dissipation solution, manufacturing process and manufacturing flexibility, especially suitable for high power density and high heat electronic components, improving the reliability and performance of the device.

[0023] The following specific embodiments will be described in detail, which can better understand the purpose, technical content, characteristics and effects of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 A schematic diagram showing an inductor structure of the prior art US patent US11770916.

[0025] Figure 2A With Figure 2B Respectively show the front and side cross-sectional schematic diagram of an embodiment of an integrated circuit package according to the present application, which can independently assemble passive components.

[0026] Figure 3A , Figure 3B and Figure 3C The diagrams show a front cross-sectional view, a side cross-sectional view, and a perspective view of an embodiment of an integrated circuit package 20 capable of independently assembling passive components according to the present invention.

[0027] Figure 4 This is a front cross-sectional view of an embodiment of an integrated circuit package 30 capable of independently assembling passive components according to the present invention.

[0028] Figure 5 This is a front cross-sectional view of an embodiment of an integrated circuit package 40 capable of independently assembling passive components according to the present invention.

[0029] Figure 6 This diagram shows a front cross-sectional view of an embodiment of an integrated circuit package 50 capable of independently assembling passive components according to the present invention.

[0030] Figure 7A and Figure 7B The front and side cross-sectional views are shown respectively, according to an embodiment of an integrated circuit package 60 capable of independently assembling passive components according to the present invention.

[0031] Figure 8A and Figure 8B The front and side cross-sectional views are shown respectively, according to another embodiment of an integrated circuit package 70 capable of independently assembling passive components according to the present invention.

[0032] Figure 9A and Figure 9B The front and side cross-sectional views are shown respectively, according to an embodiment of an integrated circuit package 80 capable of independently assembling passive components according to the present invention.

[0033] Figure 10A and Figure 10B The diagrams show front and side cross-sectional views of an integrated circuit package 90 capable of independently assembling passive components according to the present invention.

[0034] Figure 11 This diagram shows a cross-sectional view of an integrated circuit package 100 that can be independently assembled with passive components according to the present invention.

[0035] Figure 12 This diagram shows a cross-sectional view of an integrated circuit package 110 that can be independently assembled with passive components according to the present invention.

[0036] Figure 13 This diagram shows a cross-sectional view of an integrated circuit package 120 that can be independently assembled with passive components according to the present invention.

[0037] Figure 14 This diagram shows a cross-sectional view of an integrated circuit package 130 that can be independently assembled with passive components according to the present invention.

[0038] Figure 15A , Figure 15C , Figure 15E and Figure 15G This is a cross-sectional schematic diagram of different steps in the manufacturing process of an integrated circuit package 20 capable of independently assembling passive components according to the present invention. Figure 15B , Figure 15D , Figure 15F and Figure 15H This is the corresponding 3D schematic diagram.

[0039] Figures 16A-16H This is a cross-sectional schematic diagram of different steps in the manufacturing process of an integrated circuit package 20 capable of independently assembling passive components according to the present invention.

[0040] Explanation of symbols in the diagram

[0041] 1: Inductor Structure

[0042] 3: Metal strip

[0043] 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 110, 120, 130: Integrated circuit packages that can be independently assembled with passive components.

[0044] 11: Circuit board

[0045] 12: Inductor

[0046] 13: Electronic components

[0047] 14: Heat-conducting column

[0048] 16: Radiator

[0049] 101, 201, 301, 401, 501, 601, 701, 801, 901, 1001, 1101, 1201, 1301: Integrated Circuits

[0050] 102, 202, 302, 402, 502, 602, 702, 802, 902, 1002, 1102, 1202, 1302: Heat dissipation structure

[0051] 121: Electrical conductor

[0052] 1021, 2021, 3021, 4021, 5021, 6021, 7021, 8021, 9021, 10021, 11021, 12021, 13021: First layer flat plate

[0053] 1022, 2022, 3022, 4022, 5022, 6022, 7022, 8022, 9022, 10022, 11022, 12022, 13022: Cavity

[0054] 11024: Second layer flat plate Detailed Implementation

[0055] The accompanying drawings in this invention are all schematic and are mainly intended to show the interrelationships between the various electronic components. The shapes and sizes are not drawn to scale.

[0056] Figure 2A and Figure 2B The images show front and side cross-sectional views of an embodiment of an integrated circuit package capable of independently mounting passive components according to the present invention. Figure 2A As shown, the integrated circuit package 10, capable of independently mounting passive components, includes an integrated circuit 101 and a heat dissipation structure 102. The integrated circuit 101 is mounted on a circuit board 11. The heat dissipation structure 102 is independently manufactured and has a first plate 1021 and a cavity 1022. The first plate 1021 is disposed on top of the integrated circuit 101 and is in thermal contact with the integrated circuit 101. The cavity 1022 is located on the other side of the first plate 1021 opposite to the integrated circuit 101, and the cavity 1022 has at least one opening for mounting a passive component 12.

[0057] like Figure 2A Further, the cavity 1022 in the integrated circuit package 10, which can independently mount passive components, includes an opening that provides space for mounting the passive component 12. During actual assembly, the passive component 12 can be inserted through the opening in the cavity 1022 and mounted on top of the first-layer plate 1021. The electrical conductor 121 of the passive component 12 extends to the circuit board 11 to complete the electrical connection with the circuit board 11. Alternatively, the electrical conductor 121 can also be optionally directly electrically connected to the electrical terminals of the integrated circuit 101.

[0058] like Figure 2B As shown, the first plate 1021 of the heat dissipation structure 102 directly contacts the top surface of the integrated circuit 101 to absorb the heat generated by the integrated circuit 101. This heat is transferred to the cavity 1022 via the metal material of the heat dissipation structure 102, and further dispersed through thermal contact with the passive component 12. This design not only improves heat dissipation performance, but also simplifies the replacement process of the passive component 12, meeting the requirements of different application scenarios for inductance parameters.

[0059] also, Figure 2A and Figure 2BThe diagram also shows another electronic component 13, which is optionally mounted on the circuit board 11 and electrically or mechanically coupled to the integrated circuit 101 or the passive component 12. This modular design allows for flexible configuration of different components according to application requirements, further enhancing the applicability and functional flexibility of the integrated circuit package.

[0060] In one embodiment, the passive element 12 is an inductor.

[0061] In one embodiment, the heat dissipation structure 102 is made of a formable metal, including steel, copper, silver, gold, aluminum, tungsten, zinc, or stainless steel.

[0062] In one embodiment, the process of forming the heat dissipation structure 102 includes casting, milling, turning, stamping or forging.

[0063] In one embodiment, the heat dissipation structure 102 is made of a non-metallic material, including aluminum nitride, silicon carbide, or graphite.

[0064] In one embodiment, the first plate 1021 is bonded to the top surface of the integrated circuit 101 via a thermal interface material.

[0065] In one embodiment, the passive element 12 may be optionally inserted into the cavity 1022 through the opening, or removed from the cavity 1022 through the opening.

[0066] It should be noted that thermal interface material (TIM) is a common material in electronic devices, primarily used to fill the gaps between heat-generating components and heat dissipation structures. Because the contact surfaces between heat-generating components (such as integrated circuits and power semiconductor devices) and heat dissipation structures are usually not perfectly flat, air gaps are created between these irregular surfaces, leading to reduced heat conduction efficiency. Thermal interface materials are used to fill these gaps, reduce thermal resistance, and allow heat to be transferred more effectively from the heat-generating components to the heat dissipation structure. There are various types of thermal interface materials, including common ones such as thermally conductive adhesives, thermally conductive pads, thermally conductive tapes, thermally conductive gels, thermally conductive phase change materials, and metal-based thermal interface materials. The thermal conductivity of thermal interface materials is approximately 1 to 2 W / m·K.

[0067] Figure 3A , Figure 3B and Figure 3C The diagrams show a front cross-sectional view, a side cross-sectional view, and a perspective view of an embodiment of an integrated circuit package 20 capable of independently assembling passive components according to the present invention.

[0068] like Figure 3AAs shown, the integrated circuit package 20, which can be independently mounted with passive components, includes an integrated circuit 201 and a heat dissipation structure 202. The integrated circuit 201 is used to mount on the circuit board 11 and generates electrical signals and heat.

[0069] The heat dissipation structure 202 is manufactured independently and has a first plate 2021 and a cavity 2022. The first plate 2021 is disposed on the top surface of the integrated circuit 201 and makes thermal contact with the integrated circuit 201 through a layer of thermal interface material (not shown in the figure). The cavity 2022 is located on the other side of the first plate 2021 and has at least one opening for mounting passive components 12.

[0070] like Figure 3B As shown, the electrical conductor 121 of the passive component 12 extends to the integrated circuit 201 to complete the electrical connection. This design allows the passive component 12 to effectively conduct heat and electrical signals while the electrical conductor 121 is in contact with the integrated circuit 201. Furthermore, the cavity 2022 is designed to accommodate passive components 12 of different sizes, providing high assembly flexibility.

[0071] like Figure 3C As shown, a three-dimensional schematic diagram of the integrated circuit package 20 clearly illustrates the relative configuration between the heat dissipation structure 202 and the integrated circuit 201. The first plate 2021 of the heat dissipation structure 202 provides a wide and stable thermal contact area, ensuring that the heat generated by the integrated circuit 201 is effectively guided to the structure surrounding the cavity 2022 and ultimately further dissipated by an external heat sink (not shown).

[0072] also, Figure 3C The electronic component 13 shown is optionally mounted on the circuit board 11 and electrically connected to the integrated circuit 201 or the passive component 12. This modular design further enhances the flexibility and applicability of the system design.

[0073] The design features of the above embodiments include: First, the heat dissipation structure 202 is independently manufactured and has a cavity 2022, which can adapt to various passive component specifications; Second, the first-layer plate 2021 contacts the integrated circuit 201 through a thermal interface material, effectively improving heat dissipation efficiency; Third, the electrical conductor 121 of the passive component 12 is connected to the integrated circuit 201, providing reliable electrical performance; Fourth, the modular structure design allows for multi-layer assembly or component replacement to meet different application requirements.

[0074] Figure 4 This diagram shows a front cross-sectional view of an embodiment of an integrated circuit package 30 capable of independently mounting passive components according to the present invention. Figure 4As shown, the integrated circuit package 30, which can be independently assembled with passive components, includes an integrated circuit 301 and a heat dissipation structure 302. The integrated circuit 301 is mounted on the circuit board 11 and is electrically connected to the circuit board 11.

[0075] The heat dissipation structure 302 is manufactured independently and has a first plate 3021 and a cavity 3022. The first plate 3021 is disposed on top of the integrated circuit 301 and is in close contact with the top surface of the integrated circuit 301 through a layer of thermal interface material (not shown) to effectively conduct heat. The cavity 3022 is located above the first plate 3021 and forms a space for accommodating a passive component 12. The cavity 3022 has at least one opening, allowing the passive component 12 to be inserted into or removed from the cavity 3022 through the opening.

[0076] The electrical conductor 121 of the passive component 12 passes through the side of the first plate 3021 of the heat dissipation structure 302 and extends to the circuit board 11 to complete the electrical connection with the circuit board 11.

[0077] The heat dissipation structure 302 in this embodiment differs from heat dissipation structure 202. Above the first plate 3021 is a completely open cavity, lacking other parts of heat dissipation structure 202, making it more adaptable to passive components 12 of different specifications. The first plate 3021 of this heat dissipation structure 302 can be adjusted in size and shape according to application requirements to accommodate more types of passive components, such as inductors, capacitors, or other electronic components. Furthermore, the design of the cavity 3022 better supports the disassembly and assembly of passive components 12, providing convenient maintenance and replacement. Moreover, the heat dissipation structure 302 is connected to the circuit board 11, allowing the heat generated by the integrated circuit 301 to be dissipated to the circuit board 11 through more conduction paths, achieving better heat dissipation.

[0078] like Figure 4 As shown, another electronic component 13 is optionally disposed on the circuit board 11 and operates in conjunction with the integrated circuit 301 or the passive component 12. The layout of this electronic component 13, combined with the modular design of the heat dissipation structure 302, makes the overall package structure more flexible in functional design.

[0079] Figure 5 This diagram shows a front cross-sectional view of an embodiment of an integrated circuit package 40 capable of independently mounting passive components according to the present invention. (See diagram for reference.) Figure 5 As shown, the integrated circuit package 40, which can be independently assembled with passive components, includes an integrated circuit 401 and a heat dissipation structure 402. The integrated circuit 401 is mounted on the circuit board 11 and is electrically connected to the circuit board 11.

[0080] The heat dissipation structure 402 is manufactured independently and has a first plate 4021 and a cavity 4022. The first plate 4021 is disposed on the top surface of the integrated circuit 401 and is in close contact with the integrated circuit 401 through a layer of thermal interface material (not shown) to effectively conduct heat. The cavity 4022 is located above the first plate 4021 and has at least one opening for accommodating a passive component 12. The design of this opening allows the passive component 12 to be inserted into or removed from the cavity 4022, achieving greater assembly and maintenance flexibility.

[0081] The electrical conductor 121 of the passive component 12 extends through the side of the first plate 4021 of the heat dissipation structure 402 and to the circuit board 11 to complete the electrical connection with the circuit board 11. This design not only ensures stable electrical performance, but also conducts heat from the passive component 12 through the upper surface of the heat dissipation structure 402, achieving more efficient heat dissipation performance.

[0082] like Figure 5 As further shown, the heat dissipation structure 402 is connected to the circuit board 11, forming an additional heat conduction path. When the integrated circuit 401 generates heat, this heat can be conducted to the cavity 4022 via the first plate 4021 or directly to the circuit board 11 through the heat dissipation structure 402. This design significantly enhances heat dissipation and dispersion, contributing to improved stability and lifespan of the integrated circuit package 40.

[0083] The modular design of this embodiment further enhances the application flexibility and versatility of the heat dissipation structure 402. The cavity 4022 of the heat dissipation structure 402 can be adjusted in shape and size according to application requirements to accommodate passive components 12 of different specifications, such as inductors or capacitors. In addition, the detachable design of the cavity 4022 allows users to flexibly replace the passive components 12 according to actual needs, further improving maintenance efficiency.

[0084] Figure 6 This diagram shows a front cross-sectional view of an embodiment of an integrated circuit package 50 capable of independently assembling passive components according to the present invention.

[0085] like Figure 6 As shown, the integrated circuit package 50, which can be independently assembled with passive components, includes an integrated circuit 501 and a heat dissipation structure 502. The integrated circuit 501 is mounted on the circuit board 11 and is electrically connected to the circuit board 11.

[0086] The heat dissipation structure 502 is manufactured independently and has a first plate 5021 and a cavity 5022. The first plate 5021 is disposed on top of the integrated circuit 501 and makes thermal contact with the integrated circuit 501 through a layer of thermal interface material (not shown). The cavity 5022 is located above the first plate 5021 and has at least one opening for accommodating a passive component 12. This design allows the passive component 12 to be loaded or removed from the opening of the cavity 5022 to meet different application requirements.

[0087] The electrical conductor 121 of the passive component 12 passes through the first plate 5021 of the heat dissipation structure 502 and extends to the circuit board 11 to complete the electrical connection with the circuit board 11.

[0088] The design of the heat dissipation structure 502 enhances the overall thermal conductivity of the package. When the integrated circuit 501 generates heat, this heat is not only transferred upwards via the first plate 5021 to the passive components 12 and the area around the cavity 5022, but can also diffuse outwards to the external environment through the sidewalls of the heat dissipation structure 502. Furthermore, the direct contact between the heat dissipation structure 502 and the circuit board 11 provides an additional heat conduction path, effectively improving heat dissipation efficiency and ensuring stable system operation.

[0089] The modular design in this embodiment allows the heat dissipation structure 502 to be adjusted according to application requirements to accommodate passive components 12 of different sizes and specifications. The open design of the cavity 5022 also supports the rapid replacement and maintenance of passive components 12, further enhancing the flexibility and convenience of the system.

[0090] Figure 7A and Figure 7B The images show front and side cross-sectional views of an embodiment of an integrated circuit package 60 capable of independently mounting passive components according to the present invention. Figure 7A and Figure 7B As shown, the integrated circuit package 60, which can be independently assembled with passive components, includes an integrated circuit 601 and a heat dissipation structure 602. The integrated circuit 601 is mounted on the circuit board 11.

[0091] The heat dissipation structure 602 is manufactured independently and has a first plate 6021 and a cavity 6022. The first plate 6021 is disposed on top of the integrated circuit 601 and makes thermal contact with the top surface of the integrated circuit 601 through a layer of thermal interface material (not shown in the figure). The cavity 6022 is located above the first plate 6021, accommodates multiple passive components 12, and has at least one opening, allowing the passive components 12 to be inserted or removed from the cavity through the opening, thereby achieving greater assembly flexibility.

[0092] The passive component 12 includes an electrical conductor 121 that extends beyond the outer side of the first plate of the heat dissipation structure 602 and connects to the heat-conducting pillar 14, thereby reaching the circuit board 11 to complete the electrical connection. The upper surface of the passive component 12 is substantially flush with the top surface of the heat dissipation structure 602, allowing the passive component 12 to contact an external heat sink (not shown) to further enhance heat dissipation efficiency.

[0093] The heat-conducting pillars 14 are disposed between the passive component 12 and the circuit board 11. They are made of a metal with high thermal conductivity, such as copper, silver, gold, or aluminum. Besides serving as an electrical and mechanical connection between the passive component 12 and the circuit board 11, they also form an additional heat conduction path from the integrated circuit 601 to the circuit board 11, then to the passive component 12, and finally to the heat dissipation structure 602, significantly improving heat dissipation efficiency. Furthermore, the modular design of the heat-conducting pillars 14 allows for adjustments to their number and layout according to application requirements with varying passive component heights 12, providing a flexible electrical, mechanical connection, and heat dissipation solution.

[0094] Electronic component 13 is mounted on circuit board 11 and is electrically connected to circuit board 11 through electrical conductor 131.

[0095] Figure 7A and Figure 7B The features of the embodiment shown compared to other embodiments include: first, the modular design of the heat dissipation structure 602 allows for the insertion and removal of multiple passive components 12; second, the arrangement of the heat-conducting pillars 14 provides a flexible electrical, mechanical connection and heat dissipation solution.

[0096] Figure 8A and Figure 8B The front and side cross-sectional views are shown respectively, according to another embodiment of an integrated circuit package 70 capable of independently assembling passive components according to the present invention.

[0097] like Figure 8A and Figure 8B As shown, the integrated circuit package 70, which can be independently assembled with passive components, includes two integrated circuits 701 and a heat dissipation structure 702. Both integrated circuits 701 are mounted on the circuit board 11.

[0098] The heat dissipation structure 702 is manufactured independently and includes a first plate 7021 and a cavity 7022. The first plate 7021 is disposed on top of the integrated circuit 701 and makes thermal contact with the top surface of the integrated circuit 701 through a thermal interface material (not shown in the figure). In this embodiment, the cavity 7022 is located above the first plate 7021 and has an opening that accommodates two passive components 72. Both passive components 72 can be inserted into or removed through the opening of the cavity 7022 to meet different application requirements.

[0099] The electrical conductor 121 of the passive component 12 is connected to the circuit board 11 through the outer side of the first plate 7021 of the heat dissipation structure 702 and connected to the heat-conducting pillar 14 to complete the electrical connection. At the same time, the electrical conductor 121 ensures stable electrical performance between the passive component 12 and the circuit board 11.

[0100] The heat-conducting pillars 14 are disposed between the passive component 12 and the circuit board 11. They are made of a metal with high thermal conductivity, such as copper, silver, gold, or aluminum. Besides serving as an electrical and mechanical connection between the passive component 12 and the circuit board 11, they also form an additional heat conduction path from the integrated circuit 701 to the circuit board 11, then to the passive component 12, and finally to the heat dissipation structure 702, significantly improving heat dissipation efficiency. Furthermore, the modular design of the heat-conducting pillars 14 allows for adjustments to their number and layout according to application requirements with varying passive component heights 12, providing a flexible electrical, mechanical connection, and heat dissipation solution.

[0101] Electronic component 13 is mounted on circuit board 11 and is electrically connected to circuit board 11 through electrical conductor 131.

[0102] like Figure 8A and Figure 8B As shown, the heat dissipation structure 702 of this embodiment has a plurality of passive components 12. The upper surface of the passive components 12 is approximately flush with the top surface of the heat dissipation structure 702, so that they can simultaneously contact an external heat sink (not shown in the figure) to further enhance heat dissipation performance.

[0103] Figure 9A and Figure 9B The front and side cross-sectional views are shown respectively, according to an embodiment of an integrated circuit package 80 capable of independently assembling passive components according to the present invention.

[0104] like Figure 9A and Figure 9B As shown, the integrated circuit package 80, which can be independently assembled with passive components, includes two integrated circuits 801 and a heat dissipation structure 802. The integrated circuits 801 are mounted on the circuit board 11.

[0105] The heat dissipation structure 802 has a first plate 8021 and a cavity 8022. The first plate 8021, in addition to being in thermal contact with the corresponding two integrated circuits 801, also houses two electronic components 13. The cavity 8022 is disposed on the first plate 8021 of the heat dissipation structure 802 and is used to accommodate multiple passive components 12. The cavity 8022 has at least one opening, allowing for the assembly and disassembly of the passive components 12.

[0106] The electrical conductor 121 of the passive component 12 is connected to the circuit board 11 through the outer side of the first plate 8021 of the heat dissipation structure 802 and connected to the heat-conducting pillar 14 to complete the electrical connection. At the same time, the electrical conductor 821 ensures stable electrical performance between the passive component 12 and the circuit board 11.

[0107] The heat-conducting pillars 14 are disposed between the passive component 12 and the circuit board 11. They are made of a metal with high thermal conductivity, such as copper, silver, gold, or aluminum. Besides serving as an electrical and mechanical connection between the passive component 12 and the circuit board 11, they also form an additional heat conduction path from the integrated circuit 801 to the circuit board 11, then to the passive component 12, and finally to the heat dissipation structure 802, significantly improving heat dissipation efficiency. Furthermore, the modular design of the heat-conducting pillars 14 allows for adjustments to their number and layout according to application requirements with varying passive component heights 12, providing a flexible electrical, mechanical connection, and heat dissipation solution.

[0108] Electronic component 13 is mounted on circuit board 11, and its electrical conductor 131 is connected to circuit board 11 to complete the electrical connection.

[0109] In addition, the electrical conductors 131 of the two electronic components 13 on the first plate 8021 are connected to the circuit board 11 and / or the two electronic components 13 disposed on the circuit board 11 through the outside of the side of the first plate 8021 of the heat dissipation structure 802 and connected to the heat conduction column 14, so as to complete the electrical connection.

[0110] Figure 10A and Figure 10B The diagrams show front and side cross-sectional views of an integrated circuit package 90 capable of independently mounting passive components according to the present invention, illustrating its integration with a heat sink 16. Figure 10A and Figure 10B As shown, the integrated circuit package 90, which can be independently assembled with passive components, includes an integrated circuit 901 and a heat dissipation structure 902.

[0111] Integrated circuit 901 is mounted on circuit board 11. Heat dissipation structure 902 is manufactured separately and includes a first plate 9021 and a cavity 9022. The first plate 9021 is disposed on top of integrated circuit 901 and is in thermal contact with integrated circuit 901. Cavity 9022 is located on one side of the first plate 9021 and has at least one opening for mounting passive component 12.

[0112] The electrical conductor 121 of the passive component 12 is connected to the circuit board 11. Meanwhile, the top 921 of the passive component 12 is substantially flush with the top surface of the heat dissipation structure 902 and is in thermal contact with the heat sink 16 (e.g., but not limited to direct connection or connection via a thermal interface material). The heat sink 16 may be made of a metal or other highly thermally conductive material to rapidly dissipate the heat generated by the integrated circuit 901 and the passive component 12 to the external environment.

[0113] like Figure 10A and Figure 10B As shown, the heat dissipation structure 902 is designed to allow for the assembly and disassembly of the passive component 12. Its cavity 9022 provides flexible mounting space, accommodating passive components 12 of different shapes or sizes. This design further enhances heat dissipation efficiency and improves the modularity and flexibility of the system.

[0114] In short, Figure 10A and Figure 10B This demonstrates how the integrated circuit package 90 of the present invention, through its combination with the heat sink 16, effectively transfers the heat energy of both the integrated circuit 901 and the passive component 12, achieving optimal heat dissipation.

[0115] Figure 11 This diagram shows a cross-sectional view of an integrated circuit package 100 capable of independently mounting passive components according to the present invention. Figure 11 As shown, the integrated circuit package 100 includes an integrated circuit 1001 and a heat dissipation structure 1002.

[0116] Integrated circuit 1001 is mounted on circuit board 11. Heat dissipation structure 1002 is manufactured independently and includes a first plate 10021 and a cavity 10022. The first plate 10021 is disposed on top of integrated circuit 1001 and is in thermal contact with integrated circuit 1001. Cavity 10022 is located on one side of the first plate 10021 and has at least one opening for mounting passive component 12.

[0117] During assembly, the passive component 12 is connected to the circuit board 11 or integrated circuit 1001 via its electrical conductor 121 and is detachably installed within the cavity 10022 of the heat dissipation structure 1002. This design allows for flexible assembly of the passive component 12 and is suitable for passive components of different sizes or shapes.

[0118] The first plate 10021 of the heat dissipation structure 1002 is attached to the top surface of the integrated circuit 1001, thereby effectively conducting the heat generated by the integrated circuit 1001 to the heat dissipation structure 1002, further improving the overall heat dissipation efficiency.

[0119] like Figure 11 As shown, the heat dissipation structure 1002 in this embodiment is designed with flexibility. It not only supports the independent assembly of passive components 12, but also effectively improves the heat dissipation performance of integrated circuit 1001 and the overall packaging system through its structural features. The heat dissipation structure 1002 can be thermally connected to electronic components 13 to further conduct heat energy, either transferring heat energy to or from electronic components 13. This design greatly enhances the modularity and application flexibility of integrated circuit package 100, meeting the heat dissipation requirements of modern electronic devices.

[0120] Figure 12 This diagram shows a cross-sectional view of an integrated circuit package 110 capable of independently mounting passive components according to the present invention. Figure 12 As shown, the integrated circuit package 110 includes an integrated circuit 1101 and a heat dissipation structure 1102.

[0121] Integrated circuit 1101 is mounted on circuit board 11 and is used to support the operation of electronic components. The heat dissipation structure 1102 is manufactured independently and includes a first plate 11021, a cavity 11022, and two second plates 11024. The first plate 11021 is disposed on the top surface of integrated circuit 1101 and is in thermal contact with integrated circuit 1101 to achieve heat conduction.

[0122] Cavity 11022 is located on one side of the first plate 11021 and has at least one opening for mounting a passive component 12. The passive component 12 is electrically connected to the circuit board 11 or integrated circuit 1101 via its electrical conductor 121. During assembly, the passive component 12 can be inserted into the cavity 11022 through the opening of the heat dissipation structure 1102 and can be selectively removed from the cavity 11022. In a preferred embodiment, the cavity 11022 has three openings; that is, if the cavity 11022 is considered as a cuboid, three of the six planes surrounding the cavity 11022 are completely cleared before mounting the passive component 12 to facilitate placement of the passive component 12 into the cavity 11022.

[0123] In this embodiment, the heat dissipation structure 1102, compared to the embodiment with only the first plate 11021, also includes at least one second plate 11024 (there are two second plates 11024 in this embodiment), so that multiple passive components 12 are stacked on the first plate 11021 and at least one second plate 11024 to accommodate multiple passive components 12 or improve heat dissipation efficiency.

[0124] The heat dissipation structure 1102 is designed to improve the heat dissipation efficiency of the integrated circuit 1101. Through its thermal contact with the integrated circuit 1101, the heat generated by the operation of the integrated circuit 1101 can be quickly conducted to the heat dissipation structure 1102, and further dispersed to the external environment to reduce the operating temperature.

[0125] The design features of this embodiment lie in the flexible assembly of the passive components 12 and the effective heat conduction capability of the heat dissipation structure 1102. The modular and multi-layer flat design of the heat dissipation structure 1102 can accommodate passive components 12 of different sizes and quantities, improving the assembly efficiency and flexibility of the integrated circuit package 110, and meeting the high standards of heat dissipation performance required by modern electronic devices. In this embodiment, each passive component 12 is electrically connected to the circuit board 11 through its electrical conductor 121.

[0126] Figure 13 This diagram shows a cross-sectional view of an integrated circuit package 120 capable of independently mounting passive components according to the present invention. The integrated circuit package 120 includes an integrated circuit 1201 and a heat dissipation structure 1202.

[0127] Integrated circuit 1201 is mounted on circuit board 11 and electrically connected thereto. Heat dissipation structure 1202 is manufactured independently and includes a first plate 12021 and a cavity 12022. The first plate 12021 is positioned on top of integrated circuit 1201 and is in thermal contact with integrated circuit 1201 to achieve effective heat conduction.

[0128] Cavity 12022 is located on one side of the first-layer plate 12021 and has at least one opening suitable for mounting passive component 12. Passive component 12 is electrically connected to circuit board 11 or integrated circuit 1201 via its electrical conductor 121. During assembly, passive component 12 can be inserted into cavity 12022 through opening in heat dissipation structure 1202 and can be selectively removed from cavity 12022.

[0129] Furthermore, the top surface of the heat dissipation structure 1202 contacts the heat sink 16, allowing the heat sink 16 to more effectively dissipate the heat generated during the operation of the integrated circuit 1201 to the external environment. The upper surface of the passive component 12 is flush with or nearly flush with the top surface of the heat dissipation structure 1202, ensuring that both the passive component 12 and the heat dissipation structure 1202 are in contact with the external heat sink 16. This design improves overall heat dissipation efficiency, ensuring stable operation of the integrated circuit 1201 at lower temperatures.

[0130] In this embodiment, the combination of heat dissipation structure 1202 and heat sink 16 provides an efficient heat dissipation solution. Simultaneously, the modular design allows for rapid assembly and maintenance of passive components 12, adapting to different application requirements and enhancing the flexibility and reliability of the integrated circuit package 120.

[0131] Figure 14 This diagram shows a cross-sectional view of an integrated circuit package 130 capable of independently mounting passive components according to the present invention. The integrated circuit package 130 includes an integrated circuit 1301 and a heat dissipation structure 1302.

[0132] Integrated circuit 1301 is mounted on circuit board 11 and electrically connected to it via an electrical conductor. Heat dissipation structure 1302 is manufactured independently and includes a first plate 13021 and a cavity 13022. The first plate 13021 is positioned on top of integrated circuit 1301 and is in thermal contact with integrated circuit 1301 to effectively conduct heat generated by integrated circuit 1301.

[0133] Cavity 13022 is located on one side of the first-layer flat plate 13021 and has at least one opening for accommodating passive component 12. Passive component 12 is electrically connected to circuit board 11 or integrated circuit 1301 through its electrical conductor 121. During assembly, passive component 12 can be inserted into cavity 13022 through opening of heat dissipation structure 1302 and can be selectively removed from cavity 13022 for convenient maintenance and replacement.

[0134] Furthermore, the top surface of the heat dissipation structure 1302 contacts the heat sink 16, allowing the heat sink 16 to further dissipate the heat generated during the operation of the integrated circuit 1301 to the external environment. The upper surface of the passive component 12 is flush with or nearly flush with the top surface of the heat dissipation structure 1302, ensuring that both the passive component 12 and the heat dissipation structure 1302 are in contact with the external heat sink 16. This design improves heat dissipation efficiency, ensuring that the integrated circuit 1301 can operate stably at a suitable temperature.

[0135] The integrated circuit package 130 in this embodiment features a modular design, providing efficient heat dissipation while simplifying the assembly and replacement of passive components 12. This design is suitable for a variety of applications requiring high heat dissipation efficiency and flexible assembly.

[0136] Figure 15A , Figure 15C , Figure 15E and Figure 15G This is a cross-sectional schematic diagram of different steps in the manufacturing process of an integrated circuit package 20 capable of independently assembling passive components according to the present invention, supplemented with a three-dimensional schematic diagram. Figure 15B , Figure 15D , Figure 15F and Figure 15H (in Figure 15B , Figure 15D , Figure 15F and Figure 15H The three-dimensional diagrams correspond to the following: Figure 15A , Figure 15C , Figure 15E and Figure 15G (This is a frontal sectional view).

[0137] like Figure 15A and Figure 15B As shown, an integrated circuit 201 and an electronic component 13 are provided first. Both the integrated circuit 201 and the electronic component 13 are mounted on a circuit board 11. The electronic component 13 may also include, for example, an electrical conductor 131 (not shown) suitable for electrical connection with the circuit board 11.

[0138] like Figure 15C and Figure 15DAs shown, a heat dissipation structure 202 is independently manufactured, comprising a first plate 2021 and a cavity 2022. The material of the heat dissipation structure 202 can be a metallic material, such as aluminum, copper, aluminum nitride, etc., or a non-metallic material, such as aluminum nitride, silicon carbide, or graphite. The manufacturing process can include, for example, casting, milling, turning, stamping, or forging.

[0139] like Figure 15E and Figure 15F As shown, the heat dissipation structure 202 is mounted on the integrated circuit 201, and the first plate 2021 is in thermal contact with the top surface of the integrated circuit 201 to promote the transfer of heat generated by the integrated circuit 201.

[0140] like Figure 15G and Figure 15H As shown, a passive component 22 (such as an inductor) is installed into the cavity 2022 of the heat dissipation structure 202. This step can be performed through the opening of the heat dissipation structure 202, and the electrical conductor 221 of the passive component 22 is electrically connected to the circuit board 11 or the integrated circuit 201.

[0141] A thermal interface material can be coated between the first plate 2021 of the heat dissipation structure 202 and the top surface of the integrated circuit 201 to further improve heat dissipation efficiency. Finally, after the structure 20 is assembled, it can optionally be externally connected to a heat sink.

[0142] The above description illustrates the implementation details of integrated circuit packaging and its manufacturing methods. Each step and material selection can be adjusted according to specific needs to achieve optimal heat dissipation and electrical connection effects.

[0143] Figures 16A-16H This is a cross-sectional schematic diagram of different steps in the manufacturing process of an integrated circuit package 20 capable of independently assembling passive components according to the present invention, wherein... Figure 16B , Figure 16D , Figure 16F and Figure 16H The side sectional view diagrams correspond to the following. Figure 16A , Figure 16C , Figure 16E and Figure 16G A front cross-sectional view is provided. This embodiment provides a method for manufacturing an integrated circuit package 60 capable of independently assembling passive components. The method includes the following steps:

[0144] First, such as Figure 16A and Figure 16B As shown, an integrated circuit 601 is provided and mounted on a circuit board 11. The integrated circuit 601 includes two heat-conducting pillars 14 for connection with passive components 12 during subsequent assembly. An electronic component 13 is also provided on the circuit board 11, and the electronic component 13 includes two electrical conductors 131 for electrically connecting the electronic component 13 to the circuit board 11.

[0145] Next, as Figure 16C and Figure 16D As shown, a heat dissipation structure 602 is independently manufactured. The heat dissipation structure 602 includes a first plate 6021 and a cavity 6022. The first plate 6021 is disposed at the bottom of the heat dissipation structure 602 for contacting the integrated circuit 601, and the cavity 6022 is located above the first plate and has at least one opening.

[0146] like Figure 16E and Figure 16F As shown, the heat dissipation structure 602 is assembled on top of the integrated circuit 601, so that the first plate 6021 of the heat dissipation structure 602 is in thermal contact with the top surface of the integrated circuit 601. At this time, the electronic component 13 still maintains electrical connection with the circuit board 11.

[0147] Finally, as Figure 16G and Figure 16H As shown, two passive components 12 are installed in the cavity 6022 of the heat dissipation structure 602, and connected to the heat-conducting pillar 14 through the electrical conductor 121 of the passive component 12 to connect the passive component 12 and the circuit board 11.

[0148] This manufacturing method can effectively improve the heat dissipation efficiency of integrated circuit packaging and enable flexible assembly of passive components.

[0149] The present invention has been described above with reference to embodiments, but these descriptions are merely illustrative to those skilled in the art and are not intended to limit the scope of the invention. Various equivalent variations can be conceived by those skilled in the art within the same spirit of the invention. For example, the number of passive components in the cavity may differ from that shown in the drawings, or the number of electronic components or integrated circuits on the circuit board may differ from that shown in the drawings. The scope of the present invention should cover all such and other equivalent variations.

Claims

1. An integrated circuit package capable of independently assembling passive components, comprising: An integrated circuit for mounting on a circuit board; and A heat dissipation structure, which is independently manufactured and has the following characteristics: A first-layer flat plate is disposed on the integrated circuit and in thermal contact with the integrated circuit; and A cavity, located on one side of the first-layer plate, having at least one opening for mounting a passive component; During assembly, the passive component is inserted into the cavity through at least one opening in the heat dissipation structure and is electrically connected to the circuit board or the integrated circuit through an electrical conductor of the passive component. The heat generated by the integrated circuit is dissipated through the heat dissipation structure.

2. The integrated circuit package capable of independently assembling passive components as described in claim 1, wherein, The passive component includes an inductor.

3. The integrated circuit package capable of independently assembling passive components as described in claim 1, wherein, The heat dissipation structure is made of formable metals, including steel, copper, silver, gold, aluminum, tungsten, zinc, or stainless steel.

4. The integrated circuit package capable of independently assembling passive components as described in claim 3, wherein, The manufacturing process for forming this heat dissipation structure includes casting, milling, turning, stamping, or forging.

5. The integrated circuit package capable of independently assembling passive components as described in claim 1, wherein, The heat dissipation structure is made of non-metallic materials, including aluminum nitride, silicon carbide, or graphite.

6. The integrated circuit package capable of independently assembling passive components as described in claim 1, wherein, The first-layer flat plate is bonded to the top surface of the integrated circuit via a thermal interface material.

7. The integrated circuit package capable of independently assembling passive components as described in claim 1, wherein, The passive component can be optionally inserted into the cavity through the at least one opening, or removed from the cavity through the at least one opening.

8. The integrated circuit package capable of independently assembling passive components as described in claim 1, wherein, The upper surface of the passive component is flush or nearly flush with the top surface of the heat dissipation structure, so that the passive component and the heat dissipation structure are simultaneously in contact with an external heat sink.

9. The integrated circuit package capable of independently assembling passive components as described in claim 1, wherein, The heat dissipation structure also includes at least one second plate, which allows multiple passive components to be stacked on the first plate and the at least one second plate to accommodate multiple passive components or improve heat dissipation efficiency.

10. The integrated circuit package capable of independently assembling passive components as described in claim 1, wherein, The passive component is also connected to the circuit board via a heat-conducting pillar, wherein the heat-conducting pillar is made of a formable metal, including copper, silver, gold or aluminum.

11. A method for manufacturing an integrated circuit package capable of independently assembling passive components, comprising: An integrated circuit is mounted on a circuit board; A heat dissipation structure is pre-manufactured independently. The heat dissipation structure has a first plate and a cavity. The cavity is located on one side of the first plate and has at least one opening. The heat dissipation structure is mounted on the integrated circuit, so that the first plate layer and the integrated circuit make thermal contact. At least one passive component is inserted into the cavity through at least one opening, and the circuit board or integrated circuit is electrically connected through an electrical conductor of the passive component.

12. The method for manufacturing an integrated circuit package capable of independently assembling passive components as described in claim 11, wherein, The passive component includes an inductor.

13. The method for manufacturing an integrated circuit package capable of independently assembling passive components as described in claim 11, wherein, The heat dissipation structure is made of formable metals, including steel, copper, silver, gold, aluminum, tungsten, zinc, or stainless steel.

14. The method for manufacturing an integrated circuit package capable of independently assembling passive components as described in claim 13, wherein, The manufacturing process for forming this heat dissipation structure includes casting, milling, turning, stamping, or forging.

15. The method for manufacturing an integrated circuit package capable of independently assembling passive components as described in claim 11, wherein, The heat dissipation structure is made of non-metallic materials, including aluminum nitride, silicon carbide, or graphite.

16. The method for manufacturing an integrated circuit package capable of independently assembling passive components as described in claim 11, wherein, The first-layer flat plate is bonded to the top surface of the integrated circuit via a thermal interface material.

17. The method for manufacturing an integrated circuit package capable of independently assembling passive components as described in claim 11, wherein, The passive component can be optionally inserted into the cavity through the at least one opening, or removed from the cavity through the at least one opening.

18. The method for manufacturing an integrated circuit package capable of independently assembling passive components as described in claim 11, wherein, The upper surface of the passive component is flush or nearly flush with the top surface of the heat dissipation structure, so that the passive component and the heat dissipation structure are simultaneously in contact with an external heat sink.

19. The method for manufacturing an integrated circuit package capable of independently assembling passive components as described in claim 11, wherein, The heat dissipation structure also includes at least one second plate, which allows multiple passive components to be stacked on the first plate and the at least one second plate to accommodate multiple passive components or improve heat dissipation efficiency.

20. The method for manufacturing an integrated circuit package capable of independently assembling passive components as described in claim 11, wherein, The passive component is also connected to the circuit board via a heat-conducting pillar, wherein the heat-conducting pillar is made of a formable metal, including copper, silver, gold or aluminum.

Images