Preparation method of support plate structure, support plate structure and mobile terminal

Abstract

The embodiment of the invention provides a preparation method of a carrier plate structure, the carrier plate structure and a mobile terminal. The carrier plate structure is used for connecting an integrated circuit and a printed circuit board, and the method comprises the following steps: patterning a substrate to form a through hole penetrating through the thickness direction of the substrate, and preparing a conductive column in the through hole; preparing a layer-adding assembly on the temporary carrying platform, wherein the layer-adding assembly comprises a conductive part; stripping the layer-adding assembly from the temporary carrying table; the layer-adding assembly is fixedly arranged on at least one side of the substrate in the thickness direction of the substrate, and the conductive parts are electrically connected with the conductive columns. According to the embodiment of the invention, the yield of the carrier plate structure can be improved.

Description

Technical Field

[0001] This application relates to the field of integrated circuit technology, and in particular to a method for preparing a substrate structure, the substrate structure, and a mobile terminal. Background Technology

[0002] The substrate structure for integrated circuits (ICs), also known as the IC packaging substrate, is used directly to mount the IC. It not only provides support and protection for the IC but also enables the connection between the IC and the printed circuit board (PCB). In short, the substrate structure is a core element for supporting the IC and enabling high-speed communication and effective heat dissipation between the IC and the outside world. Through-glass vias (TGVs) are structures that achieve electrical interconnection between the IC and the PCB through holes in a glass substrate, providing three-dimensional interconnection capabilities. Due to their excellent electrical, optical, and mechanical stability, as well as low cost, TGVs have broad application prospects in advanced packaging, integration of passive devices, and optoelectronic device integration.

[0003] Current TGV technology is not yet mature. During the fabrication process, the glass substrate is prone to breakage, posing a high risk of fragmentation and making it difficult to guarantee the yield of the carrier structure. Summary of the Invention

[0004] This application provides a method for preparing a carrier plate structure, the carrier plate structure, and a mobile terminal, aiming to improve the yield of the carrier plate structure.

[0005] An embodiment of the first aspect of this application provides a method for fabricating a carrier board structure, the carrier board structure being used to connect an integrated circuit and a printed circuit board, the method comprising: The substrate is patterned to form through holes that penetrate the thickness direction of the substrate, and conductive pillars are fabricated within the through holes. A build-up assembly, including a conductive portion, is fabricated on a temporary stage. Peel the layered assembly off the temporary platform; The layer-addition component is fixedly disposed on at least one side of the substrate along its thickness direction, and the conductive portion is electrically connected to the conductive post.

[0006] According to the embodiment described in the first aspect of this application, the substrate includes a first surface and a second surface disposed opposite to each other along its thickness direction, the temporary stage includes a first temporary stage and a second temporary stage, the layer addition assembly includes a first layer addition assembly and a second layer addition assembly, the conductive portion includes a first conductive portion and a second conductive portion, the first layer addition assembly includes the first conductive portion, and the second layer addition assembly includes the second conductive portion. The step of fabricating the build-up component on the temporary stage includes: The first layer-addition component is fabricated on the first temporary stage; The second layer-addition component is prepared on the second temporary stage; The step of peeling the layered assembly off the temporary platform includes: Peel the first layering component off the first temporary platform; Peel the second layering component off the second temporary platform; According to any of the foregoing embodiments of the first aspect of this application, the step of fixing the layer-addition component to at least one side of the substrate along its thickness direction, and electrically connecting the conductive portion to the conductive post, includes: The first layering component is fixedly disposed on the first surface, and the first conductive part and the conductive post are electrically connected; The second layering component is fixedly disposed on the second surface, and the second conductive part and the conductive post are electrically connected.

[0007] According to any of the foregoing embodiments of the first aspect of this application, the step of fabricating the build-up component on the temporary stage includes: A flexible substrate is prepared on the temporary stage; The flexible substrate is patterned to form a first connecting hole that penetrates the thickness direction of the flexible substrate; An add-in structure is fabricated on the side of the flexible substrate away from the temporary stage. The add-in structure includes the conductive portion, at least a portion of which is embedded in the first connection hole. The flexible substrate and the add-in structure form the add-in assembly.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the step of fabricating a flexible substrate on the temporary stage includes: A flexible material is coated on one side of the temporary platform. The flexible material is cured to form the flexible substrate.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the flexible material includes polyimide.

[0010] According to any of the foregoing embodiments of the first aspect of this application, the step of patterning the flexible substrate to form a first connection hole penetrating the thickness direction of the flexible substrate includes: Photoresist is applied to the side of the flexible substrate facing away from the temporary stage; The photoresist is patterned to form a photoresist opening and a photoresist residue surrounding the photoresist opening; The flexible substrate is patterned via the photoresist opening to form the first connection hole on the flexible substrate.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the step of fixing the layer-addition component to at least one side of the substrate along its thickness direction and electrically connecting the conductive portion to the conductive post includes: The flexible substrate is bonded to at least one side of the substrate along its thickness direction using insulating adhesive, and the portion of the conductive part embedded in the first connection hole is bonded to the conductive post using conductive adhesive.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the step of peeling the layered assembly from the temporary stage includes: A laser beam is used to scan the interface between the add-on assembly and the temporary stage to peel off the add-on assembly and the temporary stage.

[0013] According to any of the foregoing embodiments of the first aspect of this application, prior to the step of peeling the layered assembly from the temporary stage: A protective film is attached to the side of the layering assembly facing away from the temporary stage.

[0014] According to any of the foregoing embodiments of the first aspect of this application, after the step of fixing the layer-addition component to at least one side of the substrate and electrically connecting the conductive portion to the conductive post: Remove the protective film.

[0015] According to any of the foregoing embodiments of the first aspect of this application, the material of the protective film includes plastic.

[0016] A second aspect of this application provides a carrier board structure for connecting an integrated circuit and a printed circuit board, the carrier board structure comprising: A substrate having a first surface and a second surface along its thickness direction, the substrate having a through hole extending through its thickness direction, the through hole having a conductive post embedded therein; An add-in assembly is fixedly bonded to the first surface and / or the second surface. The add-in assembly includes a flexible substrate and an add-in structure fixedly disposed on the side of the flexible substrate away from the substrate. The add-in structure includes a conductive portion, at least a portion of which is electrically connected to the conductive post.

[0017] According to the embodiment described in the second aspect of this application, the flexible substrate has a first connection hole, at least a portion of the conductive part is embedded in the first connection hole, and the portion of the conductive part embedded in the first connection hole is electrically connected to the conductive post through conductive adhesive.

[0018] According to any of the foregoing embodiments of the second aspect of this application, the conductive adhesive is a conductive anisotropic adhesive.

[0019] According to any of the foregoing embodiments of the second aspect of this application, the layered structure includes the conductive portion and multiple layers of insulating layers stacked together. The conductive portion includes a plurality of conductive sub-parts, each of which is disposed on a corresponding insulating layer, and the conductive sub-parts of adjacent insulating layers are connected by vias.

[0020] A third aspect of this application also provides a mobile terminal, including a carrier plate structure obtained by the method for preparing the carrier plate structure described in any embodiment of the first aspect of this application, or including a carrier plate structure described in any embodiment of the second aspect of this application.

[0021] In this embodiment, the substrate is patterned to form through-holes penetrating the thickness direction of the substrate, and conductive pillars are fabricated within the through-holes. This step provides the necessary conditions for the subsequent assembly of the add-on assembly with the substrate and for ensuring electrical conductivity between the conductive pillars and conductive parts. The add-on assembly is fabricated on a temporary stage, then peeled off from the temporary stage, and finally fixed to at least one side of the substrate along its thickness direction. The conductive parts and conductive pillars are aligned and electrically connected. The add-on assembly can be fixed to one side or opposite sides of the substrate along its thickness direction as needed, forming a complete connection between the conductive parts and conductive pillars. The electrical pathway enables the integrated circuit and printed circuit board located on opposite sides of the substrate structure to be electrically interconnected. In this embodiment, the add-on component can be directly fabricated on a temporary stage without temporary bonding. After the add-on component is fabricated, it only needs to be peeled off from the temporary stage and fixed to one side of the substrate. Compared with the method of fixing the add-on component to one side of the substrate and then debonding the add-on component from the temporary stage, the fabrication process is simplified. Moreover, the add-on component is fixed to one side of the substrate by assembly, which reduces the risk of substrate breakage compared with the method of fabricating directly on the substrate surface, thereby improving the yield of the substrate structure. Attached Figure Description

[0022] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar features.

[0023] Figure 1 This is a flowchart illustrating a method for preparing a carrier plate structure according to an embodiment of this application; Figure 2 This is a partial cross-sectional view of a carrier plate structure provided in an embodiment of this application; Figure 3 This is one of the illustrations showing the fabrication process of a carrier plate structure provided in the embodiments of this application; Figure 4 This is the second illustration of the fabrication process of a carrier plate structure provided in this application embodiment; Figure 5 This is the third illustration of the fabrication process of a carrier plate structure provided in this application embodiment; Figure 6 This is a flowchart illustrating a method for preparing a carrier plate structure according to another embodiment of this application; Figure 7 This is a flowchart of a method for preparing a carrier plate structure according to another embodiment of this application; Figure 8 This is a flowchart of a method for preparing a carrier plate structure according to another embodiment of this application; Figure 9 This is one of the illustrations showing the fabrication process of a carrier plate structure provided in another embodiment of this application; Figure 10 This is the second illustration of the fabrication process of a carrier plate structure provided in another embodiment of this application; Figure 11 This is a partial cross-sectional view of a carrier plate structure provided in the second aspect of this application.

[0024] Explanation of reference numerals in the attached figures: 1. Substrate; 11. Through-hole; 12. Conductive pillar; 13. First surface; 14. Second surface; 2. Add-on assembly; 21. Add-on structure; 211. Conductive part; 2111. First conductive part; 2112. Second conductive part; 2113. Insulating layer; 22. First add-on assembly; 23. Second add-on assembly; 20. Flexible substrate; 201. First connection hole; 3. Conductive adhesive; 4. Solder section; 100. Temporary platform; 101. First temporary platform; 102. Second temporary platform; 300. Protective film. Detailed Implementation

[0025] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0026] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," etc., indicating orientation or positional relationships are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0027] The directional terms appearing in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the embodiments of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0028] A through-glass via (TGV) is a structure that enables electrical interconnection between an integrated circuit (IC) and a printed circuit board (PCB) through a hole in a glass substrate 1. Similar to a through-silicon via (TSV), it offers three-dimensional interconnection capabilities. Due to its excellent electrical, optical, and mechanical stability, as well as low cost, TGV has broad application prospects in advanced packaging, integration of passive devices, and optoelectronic device integration. Specifically, the IC transmits electrical signals through a wiring layer on the upper surface of the glass substrate 1 to a conductive post 12 within the through-glass via 11. The conductive post 12 then transmits the electrical signals to a wiring layer on the other side of the glass substrate 1. This wiring layer transmits the electrical signals to solder pads, which interconnect with pins on the PCB, thus achieving electrical interconnection between the IC and the PCB.

[0029] However, TGV technology is not yet mature. During the fabrication process, the glass substrate 1 is prone to breakage, posing a high risk of fragmentation and making it difficult to guarantee the yield of the carrier structure.

[0030] To better understand this application, the following will be combined with... Figures 1 to 11 The preparation method of the carrier plate structure, the carrier plate structure, and the mobile terminal of the embodiments of this application are described in detail.

[0031] This application provides a method for fabricating a carrier board structure, which is used to connect integrated circuits and printed circuit boards, such as... Figure 1 and Figure 2 As shown, the method includes: Step S01: Pattern the substrate 1 to form a through-hole 11 penetrating the thickness direction of the substrate 1, and fabricate a conductive pillar 12 within the through-hole 11. (See reference...) Figure 3 .

[0032] Step S02: Prepare the layered assembly 2 on the temporary stage 100. The layered assembly 2 includes a conductive part 211.

[0033] Step S03: Peel the layered component 2 off the temporary stage 100. See the diagram illustrating the fabrication process from steps S02 to S03. Figure 4 .

[0034] Step S04: The layer-addition component 2 is fixedly disposed on at least one side of the substrate 1 along its thickness direction, and the conductive portion 211 is electrically connected to the conductive post 12. (See reference...) Figure 2 .

[0035] In this embodiment, step S01 involves patterning the substrate 1 to form a through-hole 11 penetrating the thickness direction of the substrate 1, and fabricating a conductive post 12 within the through-hole 11. This step provides the necessary conditions for the subsequent assembly of the add-on component 2 with the substrate 1 and for ensuring electrical conductivity between the conductive post 12 and the conductive part 211. Step S02 involves fabricating the add-on component 2 on the temporary stage 100, then step S03 involves peeling the add-on component 2 off the temporary stage 100, and finally step S04 involves fixing the add-on component 2 to at least one side of the substrate 1 along its thickness direction, aligning the conductive part 211 with the conductive post 12, and achieving electrical connection. Add-on components can be fixedly disposed on one side or opposite sides of the substrate 1 along its thickness direction as needed. A complete electrical path is formed between component 2, conductive part 211 and conductive post 12, thereby enabling the integrated circuit and printed circuit board located on both sides of the carrier structure to be electrically interconnected. In this embodiment, the add-on component 2 can be directly fabricated on the temporary stage 100 without temporary bonding. After the add-on component 2 is fabricated, it only needs to be peeled off from the temporary stage 100 and fixed to one side of the substrate 1. Compared with the method of fixing the add-on component 2 to one side of the substrate 1 and then debonding the add-on component 2 from the temporary stage 100, the fabrication process is simplified. Moreover, the add-on component 2 is fixed to one side of the substrate 1 by assembly. Compared with the method of fabricating directly on the surface of the substrate 1, the risk of substrate 1 breaking can be reduced, thereby improving the yield of the carrier structure.

[0036] It should be noted that the preparation order of steps S01 and S02 is not important. Step S01 can be performed first and then step S02, or step S02 can be performed first and then step S01, or steps S01 and S02 can be performed simultaneously. This application does not impose specific limitations on this.

[0037] Optionally, the through-hole 11 can be formed by etching, laser processing or other microfabrication processes.

[0038] Optionally, substrate 1 includes at least one of glass substrate, silicon substrate, ceramic substrate, polymer substrate, etc.

[0039] Optionally, substrate 1 can be a glass substrate. Exemplarily, substrate 1 is at least one of borosilicate glass, aluminoborosilicate glass, quartz glass, alkali-free glass, and alkaline glass. Specifically, glass substrates not only possess advantages in material properties such as high modulus, high flatness, a wide coefficient of thermal expansion, and good chemical and high-temperature resistance, but also optical and mechanical advantages. This not only facilitates the smooth progress of laser processing but also meets the high-precision manufacturing requirements of semiconductor devices, reducing the impact on chip performance and packaging quality caused by dimensional deviations and / or damage to the substrate during chip stacking and other processes. Compared to organic substrates, glass substrates have lower dielectric loss, which is beneficial for high-frequency signal transmission, better heat dissipation, greater bending resistance, and higher light transmittance.

[0040] Optionally, when substrate 1 is a glass substrate, the through-hole 11 is a through-glass via (TGV). A through-glass via is a structure that achieves electrical interconnection through holes in the glass substrate 1, similar to a through-silicon via (TSV), and has the capability for three-dimensional interconnection. TGVs have advantages such as excellent electrical properties, optical properties, mechanical stability, and low cost, and have broad application prospects in advanced packaging, integrated passive devices, and optoelectronic device integration.

[0041] Optionally, the conductive post 12 may be made of a metallic material, such as, but not limited to, at least one of copper (Cu), aluminum (Al), nickel (Ni), gold (Au), tin (Sn), silver (Ag).

[0042] Optionally, the conductive part 211 includes a metallic material, such as, but not limited to, at least one of copper (Cu), aluminum (Al), nickel (Ni), gold (Au), tin (Sn), silver (Ag).

[0043] Optionally, the conductive part 211 is made of the same material as the conductive post 12 to simplify the manufacturing process.

[0044] The conductive pillar 12 and the conductive part 211 can be formed in the corresponding insulating part or through hole 11 by means of electroplating or deposition.

[0045] In some optional embodiments, the substrate 1 includes a first surface 13 and a second surface 14 disposed opposite each other along its thickness direction; the temporary stage 100 includes a first temporary stage 101 and a second temporary stage 102; the layer-addition assembly 2 includes a first layer-addition assembly 22 and a second layer-addition assembly 23; the conductive portion 211 includes a first conductive portion 2111 and a second conductive portion 2112; the first layer-addition assembly 22 includes a first conductive portion 2111; and the second layer-addition assembly 23 includes a second conductive portion 2112. In this embodiment, as... Figure 4 and Figure 5As shown, step S02 includes: The first layering component 22 is fabricated on the first temporary stage 101; The second layering component 23 is prepared on the second temporary stage 102.

[0046] In this embodiment, the first layering component 22 and the second layering component 23 are respectively fixedly disposed on opposite sides of the substrate 1 along its thickness direction, so that an electrical path is formed between the first conductive portion 2111, the conductive post 12, and the second conductive portion 2112. During fabrication, the first layering component 22 can be fabricated first on the first temporary stage 101, and then the second layering component 23 can be fabricated on the second temporary stage 102; alternatively, the second layering component 23 can be fabricated first on the second temporary stage 102, and then the first layering component 22 can be fabricated on the first temporary stage 101; or the two steps can be performed simultaneously. When the two steps are performed sequentially, the first temporary stage 101 and the second temporary stage 102 can be the same stage. For example, the first layering component 22 can be fabricated on this stage first, and after peeling off the first layering component 22, the second layering component 23 can be fabricated on the same stage.

[0047] like Figures 4 to 5 As shown, the step of peeling the layered assembly 2 from the temporary stage 100 includes: The first add-layer component 22 is peeled off from the first temporary stage 101 so that the first add-layer component 22 can be fixed to the substrate 1. This eliminates the need to debond the first add-layer component 22 from the first temporary stage 101 after the first add-layer component 22 and the substrate 1 are assembled, simplifying the process.

[0048] The second add-in component 23 is peeled off from the second temporary stage 102 so that the second add-in component 23 can be fixed to the substrate 1. This eliminates the need to debond the second add-in component 23 from the second temporary stage 102 after the assembly of the second add-in component 23 with the substrate 1 is completed, simplifying the process.

[0049] like Figure 2 As shown, optionally, the step of fixing the layer-addition component 2 to at least one side of the substrate 1 along its thickness direction and electrically connecting the conductive portion 211 to the conductive post 12 includes: The first layering component 22 is fixedly disposed on the first surface 13, and the first conductive part 2111 and the conductive post 12 are electrically connected; The second layering component 23 is fixedly disposed on the second surface 14, and the second conductive part 2112 and the conductive post 12 are electrically connected.

[0050] In this embodiment, the first layering component 22 can be fixed to the first surface 13 firstly. During fixing, care should be taken to ensure that the side of the first conductive part 2111 facing the first surface 13 is accurately aligned and connected with the conductive post 12 to ensure electrical conductivity between the first conductive part 2111 and the conductive post 12. Then, the second layering component 23 can be fixed to the second surface 14. During fixing, care should also be taken to ensure that the side of the second conductive part 2112 facing the second surface 14 is accurately aligned and connected with the conductive post 12 to ensure electrical conductivity between the second conductive part 2112, the conductive post 12, and the first conductive part 2111. Alternatively, the second layering component 23 can be fixed to the second surface 14 first, followed by the first layering component 22 fixed to the first surface 13. This application does not specifically limit the order of these two steps.

[0051] In some alternative embodiments, such as Figure 4 and 6 As shown, in step S02: Step S021: Fabricate a flexible substrate 20 on a temporary stage 100; Step S022: Pattern the flexible substrate 20 to form a first connecting hole 201 that penetrates the thickness direction of the flexible substrate 20; Step S023: An augmentation structure 21 is prepared on the side of the flexible substrate 20 away from the temporary stage 100. The augmentation structure 21 includes a conductive part 211, at least a portion of the conductive part 211 is embedded in the first connection hole 201, and the augmentation structure 21 and the flexible substrate 20 form an augmentation component 2.

[0052] In these optional embodiments, the flexible substrate 20 is first fabricated in step S021. In step S021, the flexible substrate 20 is fabricated on a temporary stage 100. A suitable material for the flexible substrate 20, such as polyimide (PI) or polyester (PET), is selected to ensure sufficient flexibility and durability. The flexible substrate 20 is fixed on the temporary stage 100 using conventional coating, heating, or other processing techniques to ensure its flatness and stability for subsequent processing. Next, in step S022, the flexible substrate 20 is patterned to form a first connection hole 201 penetrating the thickness direction of the flexible substrate 20. An opening is precisely formed on the substrate using photolithography and etching processes. The hole diameter and depth are determined by predetermined design requirements, enabling the first connection hole 201 to effectively support subsequent conductive materials. Finally, in step S023, an add-on structure 21 is fabricated on the side of the flexible substrate 20 facing away from the temporary stage 100. The build-up structure 21 includes at least one conductive portion 211, and at least a portion of the conductive portion 211 is embedded within the first connection hole 201. This build-up structure 21 can be fabricated by deposition, spraying, or coating. The conductive portion 211 can be made of silver, copper, or other conductive materials to ensure good conductivity in subsequent electrical connections. The conductive portion 211 fills the first connection hole 201, forming a robust electrical connection, and the fabrication and embedding process of the conductive portion 211 enhances the overall mechanical strength and electrical properties of the substrate.

[0053] Optional, such as Figure 7 As shown, in step S021: Step S0211: Coat one side of the temporary stage 100 with a flexible material; Step S0212: Curing the flexible material to form a flexible substrate 20.

[0054] In these optional embodiments, a flexible material is first applied to one side of the temporary stage 100 in step S0211, and then the flexible material is cured in step S0212 to form a flexible substrate 20 on one side of the temporary stage 100. The flexible substrate 20 and the temporary stage 100 do not need to be temporarily bonded, which facilitates the subsequent direct peeling of the add-on component 2 from the temporary stage 100.

[0055] The curing method can be either heat curing or ultraviolet curing.

[0056] Optionally, the flexible material includes polyimide. After curing, polyimide possesses a certain degree of flexibility and strength, allowing the flexible substrate 20 to be removed from the temporary stage 100 using laser lift-off. During removal, the flexible substrate 20 is less prone to damage. Furthermore, since the cured polyimide forms a flexible substrate 20 to support the add-on structure 21, it ensures the structural stability and integrity of the add-on component 2 during transfer to the substrate 1. Additionally, when the substrate 1 is made of glass, the difference in thermal expansion coefficients between the polyimide and the substrate 1 is small, ensuring the add-on component 2 is stably fixed to the substrate 1 and reducing the risk of delamination.

[0057] In some alternative embodiments, such as Figure 8 As shown, in step S022: Step S0221: Cover the side of the flexible substrate 20 facing away from the temporary stage 100 with photoresist. Fix the flexible substrate 20 onto the temporary stage 100, ensuring the surface of the flexible substrate 20 is flat. Uniformly coat a layer of photoresist on the side of the flexible substrate 20 facing away from the temporary stage 100. The type of photoresist can be selected according to subsequent patterning requirements, such as positive or negative photoresist. Spin coating, dip coating, or other techniques can be used during the coating process to ensure that the photoresist coating is uniform and of appropriate thickness.

[0058] Step S0222: Pattern the photoresist to form photoresist openings and photoresist residue surrounding the openings. The photoresist is patterned through an exposure and development process. During exposure, a pre-designed pattern is projected onto the photoresist using a mask. After exposure, the photoresist is developed to form photoresist openings and photoresist residue surrounding the openings. The patterned photoresist openings expose the surface area of ​​the flexible substrate 20, becoming the area for subsequent processing.

[0059] Step S0223: Patterning the flexible substrate 20 through photoresist openings to form a first connection hole 201 on the flexible substrate 20. At the photoresist openings, a suitable etching technique (e.g., wet etching or dry etching) is used to pattern the flexible substrate 20. The etching process removes substrate material from the photoresist opening area to form the first connection hole 201 penetrating the thickness direction of the flexible substrate 20. The etching depth and hole diameter are determined by the size of the photoresist openings, as well as the etching time and power, and can be reasonably set according to requirements.

[0060] After patterning is completed, solvent or plasma cleaning is used to remove photoresist residue to ensure the substrate surface is clean and does not affect subsequent process steps.

[0061] In this embodiment, step S0221 is executed first, then step S0222 is executed, and finally step S0222 is executed.

[0062] In some optional embodiments, in step S04: The flexible substrate 20 is bonded to at least one side of the substrate 1 along its thickness direction using insulating adhesive, and the portion of the conductive part 211 embedded in the first connection hole 201 is bonded to the conductive post 12 using conductive adhesive 3.

[0063] The flexible substrate 20 is placed at a predetermined position on the substrate 1, ensuring proper alignment. At least one side of the flexible substrate 20 is bonded to the surface of the substrate 1 along at least one side of its thickness direction using insulating adhesive, ensuring a strong adhesive layer is formed between the flexible substrate 20 and the substrate 1.

[0064] Insulating adhesives can be selected from silicone, structural adhesives, pressure-sensitive adhesives, epoxy resins, or other suitable insulating materials. They have good adhesion and insulation properties and can effectively prevent current leakage or short circuits.

[0065] Next, to ensure the stability and conductivity of the electrical connection, conductive adhesive 3 is used to bond the portion of conductive part 211 embedded in the first connection hole 201 to conductive post 12. Optionally, conductive adhesive 3 is an anisotropic conductive adhesive, so that circuit continuity is formed only between conductive part 211 and conductive post 12 in the thickness direction, but not laterally in the direction of substrate 1, reducing the risk of short circuit. Alternatively, conductive adhesive 3 can be a conductive adhesive with good conductivity, such as silver paste, copper paste, etc. These conductive adhesives 3 can provide reliable electrical connection while maintaining the mechanical flexibility of flexible substrate 20. Through this method, the electrical connection between conductive part 211 and conductive post 12 is effectively achieved, and the overall structure maintains good flexibility and stability.

[0066] In some alternative embodiments, the step of peeling the add-on component 2 from the temporary stage 100 includes: A laser beam is used to scan the interface between the layer-addition component 2 and the temporary stage 100 to peel the layer-addition component 2 and the temporary stage 100 apart.

[0067] By precisely controlling the scanning parameters of the laser beam, the adhesive force between the add-on component 2 and the temporary stage 100 is broken, thereby achieving effective peeling of the add-on component 2 from the temporary stage 100. This method can replace debonding, which not only improves the accuracy and efficiency of the peeling process, but also reduces mechanical damage caused by physical contact, ensuring the integrity of the surface quality of the add-on component 2.

[0068] In some optional embodiments, prior to step S03: A protective film 300 is attached to the side of the layered component 2 facing away from the temporary stage 100, such as... Figure 9 and Figure 10As shown. The protective film 300 ensures that the add-on assembly 2 is not easily damaged during the transfer and bonding process to the substrate 1. The protective film 300 and the flexible substrate 20 are respectively sandwiched on both sides of the add-on structure 21, which can ensure the integrity of the entire add-on assembly 2 during the transfer process and prevent the structures from falling off.

[0069] Optionally, after the step of fixing the layer addition assembly 2 to at least one side of the substrate 1 and electrically connecting the conductive portion 211 to the conductive post 12: Remove the protective film 300.

[0070] Optionally, the protective film 300 may be made of plastic so that it can be directly applied to the side of the layered structure 21 away from the flexible substrate 20 by contact bonding. The plastic protective film 300 has a certain degree of flexibility and is not likely to damage the layered structure 21.

[0071] Optionally, after assembling the add-on assembly 2 and the substrate 1, the method further includes: preparing a solder portion 4 on the side of the second add-on assembly 23 facing away from the substrate 1, with one end of the solder portion 4 electrically connected to the second conductive portion 2112, and the other end of the solder portion 4 electrically connected to an integrated circuit or a printed circuit board. A schematic diagram of the solder portion 4 can be found in [reference needed]. Figure 11 .

[0072] Optionally, the solder portion 4 may protrude from the surface of the second layer addition component 23 away from the substrate 1, so as to facilitate the alignment and connection of the integrated circuit or printed circuit board with the solder portion 4.

[0073] Optionally, after the solder section 4 is prepared, a printed circuit board is soldered to the solder section 4 corresponding to one side of the substrate 1, and an integrated circuit (not shown in the figure) is soldered to the solder section 4 corresponding to the other side of the substrate 1.

[0074] Of course, the solder part 4 can also be soldered to the side of the first layering component 22 away from the substrate 1, or the solder part 4 can be soldered to both the side of the first layering component 22 and the side of the second layering component 23 away from the substrate 1.

[0075] Please refer to the following: Figures 1 to 11 The second aspect of this application also provides a carrier board structure for connecting integrated circuits and printed circuit boards. The carrier board structure includes: a substrate 1 having a first surface 13 and a second surface 14 along its thickness direction, the substrate 1 having a through hole 11 extending through its thickness direction, the through hole 11 having a conductive post 12 embedded therein; and an add-on assembly 2 fixedly bonded to the first surface 13 and / or the second surface 14. The add-on assembly 2 includes a flexible substrate 20 and an add-on structure 21 fixedly disposed on the flexible substrate 20 on the side opposite to the substrate 1. The add-on structure 21 includes a conductive portion 211, at least a portion of which is electrically connected to the conductive post 12.

[0076] In the second aspect of this application, the add-on assembly 2 can be fixedly bonded to the first surface 13 and / or the second surface 14 along the thickness direction of the substrate 1 as needed. The conductive part 211 and the conductive post 12 of the add-on assembly 2 are aligned and fixedly connected to form a complete electrical path between the conductive part 211 and the conductive post 12, thereby enabling the integrated circuit and the printed circuit board located on both sides of the carrier structure to achieve electrical interconnection. Compared with the method of directly preparing the add-on assembly 2 on the surface of the substrate 1, the second aspect of this application prepares the add-on assembly 2 on the temporary stage 100 in advance and then bonds the add-on assembly 2 to the substrate 1, which can reduce the risk of substrate 1 breaking and thus improve the yield of the carrier structure.

[0077] In some alternative embodiments, such as Figure 11 As shown, the flexible substrate 20 has a first connection hole 201, at least a portion of the conductive part 211 is embedded in the first connection hole 201, and the portion of the conductive part 211 embedded in the first connection hole 201 is electrically connected to the conductive adhesive 3 and the conductive post 12.

[0078] In these alternative embodiments, to ensure the stability and conductivity of the electrical connection, conductive adhesive 3 is used to bond the portion of the conductive part 211 embedded in the first connection hole 201 to the conductive post 12.

[0079] Optionally, the conductive adhesive 3 is a conductive anisotropic adhesive, so that the circuit is only formed between the conductive portion 211 and the conductive pillar 12 in the thickness direction, but not laterally in the direction of the substrate 1, reducing the risk of short circuit. Alternatively, the conductive adhesive 3 can be a conductive adhesive with good conductivity, such as silver paste or copper paste. These conductive adhesives 3 can provide reliable electrical connections while maintaining the mechanical flexibility of the flexible substrate 20. Through this method, the electrical connection between the conductive portion 211 and the conductive pillar 12 is effectively achieved, and the overall structure maintains good flexibility and stability.

[0080] In some optional embodiments, the add-on structure 21 includes a conductive portion 211 and multiple layers of insulating layers 2113. The conductive portion 211 includes multiple conductive sub-parts, each disposed on a corresponding insulating layer 2113. The insulating layer 2113 provides support and better electrical insulation performance for the conductive sub-parts. The conductive sub-parts of adjacent insulating layers 2113 are connected by vias, thereby enabling electrical conduction between the entire conductive portion 211. The conductive portion 211 and the conductive post 12 are electrically connected, thereby realizing the electrical interconnection between the integrated circuit and the printed circuit board through the carrier board structure.

[0081] A third aspect of this application also provides a mobile terminal, including a carrier plate structure prepared by the carrier plate structure preparation method of any embodiment of the first aspect of this application, or including a carrier plate structure as described in any embodiment of the second aspect of this application.

[0082] Since the mobile terminal of the third aspect of this application includes a carrier structure prepared by the carrier structure preparation method of any embodiment of the first aspect of this application or includes a carrier structure of the second aspect of this application, the mobile terminal of the third aspect of this application has the beneficial effects of the carrier structure prepared by the carrier structure preparation method of the first aspect of this application or has the beneficial effects of the carrier structure of any embodiment of the second aspect of this application, which will not be elaborated here.

[0083] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A method for preparing a carrier plate structure, characterized in that, The carrier board structure is used to connect integrated circuits and printed circuit boards, and the method includes: The substrate is patterned to form through holes that penetrate the thickness direction of the substrate, and conductive pillars are fabricated within the through holes. A build-up assembly, including a conductive portion, is fabricated on a temporary stage. Peel the layered assembly off the temporary platform; The layer-addition component is fixedly disposed on at least one side of the substrate along its thickness direction, and the conductive portion is electrically connected to the conductive post.

2. The method for preparing the carrier plate structure according to claim 1, characterized in that, The substrate includes a first surface and a second surface disposed opposite to each other along its thickness direction; the temporary stage includes a first temporary stage and a second temporary stage; the layer addition assembly includes a first layer addition assembly and a second layer addition assembly; the conductive portion includes a first conductive portion and a second conductive portion; the first layer addition assembly includes the first conductive portion; and the second layer addition assembly includes the second conductive portion. The step of fabricating the build-up component on the temporary stage includes: The first layer-addition component is fabricated on the first temporary stage; The second layer-addition component is prepared on the second temporary stage; The step of peeling the layered assembly off the temporary platform includes: Peel the first layering component off the first temporary platform; Peel the second layering component off the second temporary platform; Preferably, the step of fixing the layer-addition component to at least one side of the substrate along its thickness direction, and electrically connecting the conductive portion to the conductive post, includes: The first layering component is fixedly disposed on the first surface, and the first conductive part and the conductive post are electrically connected; The second layering component is fixedly disposed on the second surface, and the second conductive part and the conductive post are electrically connected.

3. The method for preparing the carrier plate structure according to claim 1, characterized in that, The step of fabricating the build-up component on the temporary stage includes: A flexible substrate is prepared on the temporary stage; The flexible substrate is patterned to form a first connecting hole that penetrates the thickness direction of the flexible substrate; An add-in structure is fabricated on the side of the flexible substrate away from the temporary stage. The add-in structure includes the conductive portion, at least a portion of which is embedded in the first connecting hole. The flexible substrate and the add-in structure form the add-in assembly. Preferably, the step of fabricating the flexible substrate on the temporary stage includes: A flexible material is coated on one side of the temporary platform. The flexible material is cured to form the flexible substrate; Preferably, the flexible material comprises polyimide.

4. The method for preparing the carrier plate structure according to claim 3, characterized in that, The step of patterning the flexible substrate to form a first connection hole penetrating the thickness direction of the flexible substrate includes: Photoresist is applied to the side of the flexible substrate facing away from the temporary stage; The photoresist is patterned to form a photoresist opening and a photoresist residue surrounding the photoresist opening; The flexible substrate is patterned via the photoresist opening to form the first connection hole on the flexible substrate.

5. The method for preparing the carrier plate structure according to claim 3, characterized in that, The step of fixing the layer-addition component to at least one side of the substrate along its thickness direction and electrically connecting the conductive portion to the conductive post includes: The flexible substrate is bonded to at least one side of the substrate along its thickness direction using insulating adhesive, and the portion of the conductive part embedded in the first connection hole is bonded to the conductive post using conductive adhesive.

6. The method for preparing the carrier plate structure according to claim 1, characterized in that, The step of peeling the layered assembly from the temporary stage includes: A laser beam is used to scan the interface between the add-on assembly and the temporary stage to peel off the add-on assembly and the temporary stage.

7. The method for preparing the carrier plate structure according to claim 1, characterized in that, Prior to the step of peeling the layered assembly from the temporary stage: A protective film is attached to the side of the layering assembly facing away from the temporary stage; Preferably, after the step of fixing the layer-addition component to at least one side of the substrate and electrically connecting the conductive portion to the conductive post: Remove the protective film; Preferably, the material of the protective film includes plastic.

8. A carrier board structure for connecting integrated circuits and printed circuit boards, characterized in that, The carrier plate structure includes: A substrate having a first surface and a second surface along its thickness direction, the substrate having a through hole extending through its thickness direction, the through hole having a conductive post embedded therein; An add-in assembly is fixedly bonded to the first surface and / or the second surface. The add-in assembly includes a flexible substrate and an add-in structure fixedly disposed on the side of the flexible substrate away from the substrate. The add-in structure includes a conductive portion, at least a portion of which is electrically connected to the conductive post.

9. The carrier plate structure according to claim 8, characterized in that, The flexible substrate has a first connection hole, and at least a portion of the conductive part is embedded in the first connection hole. The portion of the conductive part embedded in the first connection hole is electrically connected to the conductive post through conductive adhesive. Preferably, the conductive adhesive is a conductive anisotropic adhesive; Preferably, the added-layer structure includes the conductive portion and multiple layers of insulating layers stacked together. The conductive portion includes a plurality of conductive sub-parts, each of which is disposed on a corresponding insulating layer, and the conductive sub-parts of adjacent insulating layers are connected by vias.

10. A mobile terminal, characterized in that, The carrier plate structure includes the carrier plate structure prepared by the method of any one of claims 1-7, or includes the carrier plate structure as described in any one of claims 8-9.

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