Chamfering device, chamfering method, and method for manufacturing monocrystalline silicon ingot

Abstract

Provided are a chamfering device, a chamfering method, and a method for manufacturing a single crystal silicon ingot, with which it is possible to easily chamfer the outer peripheral edge of the end surface of a cylindrical ingot. A chamfering device is provided with: a driving rotating body that rotates a cylindrical ingot by transmitting a circumferential rotational force to the outer circumferential surface of the ingot; a processing tool for processing the ingot; and a moving device that moves the machining tool in the axial direction with respect to the ingot in accordance with the position of the ingot in the axial direction. And a chamfering step for chamfering the outer peripheral edge of the end surface of the ingot by means of the machining tool and the moving device while rotating the ingot by means of the driving rotating body.

Description

Technical Field

[0001] This invention relates to a chamfering apparatus, a chamfering method, and a method for manufacturing a single-crystal silicon ingot. Background Technology

[0002] A chamfering device is known to have a machining tool for machining an ingot and a moving device for moving the machining tool relative to the ingot (see, for example, Patent Document 1).

[0003] Existing technical documents Patent documents Patent document 1: Japanese Patent Application Publication No. 2009-233794. Summary of the Invention

[0004] The problem that the invention aims to solve Sometimes it is desirable to be able to easily chamfer the outer periphery of the end face of a cylindrical ingot.

[0005] Therefore, the object of the present invention is to provide a chamfering device, a chamfering method, and a method for manufacturing a single crystal silicon ingot that can easily chamfer the outer periphery of the end face of a cylindrical ingot.

[0006] Methods used to solve problems One technical solution of the present invention is described below.

[0007] [1] A chamfering device comprising: a driving rotating body that rotates the cylindrical ingot by transmitting a circumferential rotational force to the outer peripheral surface of the ingot; a processing tool for processing the ingot; and a moving device that moves the processing tool relative to the ingot in the aforementioned axial direction according to the axial position of the ingot. While rotating the aforementioned ingot using the aforementioned driving rotating body, the outer periphery of the end face of the aforementioned ingot is chamfered using the aforementioned processing tool and the aforementioned moving device.

[0008] [2] As described in [1], the aforementioned outer peripheral surface of the aforementioned ingot is placed on the aforementioned driving rotating body.

[0009] [3] The chamfering device as described in [1] or [2] has a rotating body driving device that enables the aforementioned driving rotating body to rotate to either side of one side or the other side.

[0010] [4] The chamfering device as described in any one of [1] to [3] has a lower driven rotating body, which is another rotating body that is disposed at a position offset from the aforementioned driving rotating body in the aforementioned circumferential direction of the aforementioned ingot, and that carries the aforementioned outer peripheral surface of the aforementioned ingot and is driven by the aforementioned outer peripheral surface of the aforementioned ingot.

[0011] [5] The chamfering device as described in any one of [1] to [4], wherein the aforementioned processing tool is a grinding stone having a planar processing surface for chamfering the aforementioned ingot, and the aforementioned chamfering device has a grinding stone driving device for rotating the aforementioned processing tool about a rotation axis perpendicular to the aforementioned processing surface, and a swinging device for swinging the aforementioned processing tool parallel to the aforementioned processing surface.

[0012] [6] The chamfering device as described in any one of [1] to [5] comprises: a chip collection port located below the aforementioned machining tool; and a machining tool cover that covers the aforementioned machining tool and guides the chips generated by the chamfering performed by the aforementioned machining tool to the aforementioned chip collection port. The aforementioned processing tool moves along the aforementioned axis together with the aforementioned chip collection port using the aforementioned moving device.

[0013] [7] The chamfering device as described in [6] comprises: a chip collection tube having a first end forming the aforementioned chip collection port; and a suction device for drawing air from the aforementioned chip collection port via a second end of the aforementioned chip collection tube. The aforementioned chip collection tube has a flexible portion between the aforementioned first end and the aforementioned second end, and by means of the deformation of the aforementioned flexible portion, the aforementioned processing tool and the aforementioned chip collection port are allowed to move from the standby position to the processing start position corresponding to the position of the aforementioned end face of the aforementioned ingot.

[0014] [8] As described in [6] or [7], the aforementioned processing tool is a grinding stone having a planar processing surface for beveling the aforementioned ingot, and the aforementioned processing tool cover has a pair of side walls that are opposed to each other in the horizontal direction and are respectively located on the plane containing the processing surface of the aforementioned processing tool, an upper wall located on the aforementioned plane containing the aforementioned processing surface above the aforementioned pair of side walls, a back wall located on the opposite side of the aforementioned ingot when viewed from the aforementioned processing surface and connected to the aforementioned pair of side walls and the aforementioned upper wall, and an open portion formed on the lower side of the aforementioned processing surface of the aforementioned processing tool and serving as the movement path of the aforementioned chips.

[0015] [9] The chamfering device as described in [8] comprises: a chip collection tube having a first end forming the aforementioned chip collection port; and a suction device for drawing air from the aforementioned chip collection port via a second end of the aforementioned chip collection tube. The aforementioned chip collection tube has a protruding edge at the first end.

[0016]

[10] The chamfering device according to any one of [1] to [9], wherein the outer peripheral surface of the aforementioned ingot is placed on the aforementioned driving rotating body, comprises: a lower driven rotating body, which is a rotating body that is disposed at a position offset from the aforementioned driving rotating body in the aforementioned circumferential direction of the aforementioned ingot and which places the aforementioned outer peripheral surface of the aforementioned ingot and is driven by the aforementioned outer peripheral surface of the aforementioned ingot; and an upper driven rotating body, which is another rotating body that restricts the upward movement of the aforementioned ingot by contact with the upper surface of the aforementioned outer peripheral surface of the aforementioned ingot and is driven by the aforementioned outer peripheral surface of the aforementioned ingot. With the aid of the aforementioned moving device, the aforementioned processing tool and the aforementioned upper driven rotating body move in opposite directions.

[0017]

[11] The chamfering device as described in any one of [1] to

[10] has a detector that moves together with the aforementioned processing tool and detects that the relative distance between the outer periphery of the aforementioned end face of the aforementioned ingot and the aforementioned axial direction of the aforementioned processing tool reaches a predetermined distance, and the aforementioned moving device moves the aforementioned processing tool from a standby position to a processing start position determined according to the detection result obtained by the aforementioned detector.

[0018]

[12] The chamfering device as described in any one of [1] to

[11] includes a first aforementioned processing tool, a second aforementioned processing tool, a first aforementioned moving device for moving the first aforementioned processing tool, and a second aforementioned moving device for moving the second aforementioned processing tool. While rotating the aforementioned ingot by means of the aforementioned driving rotating body, it performs chamfering of the outer periphery of the first aforementioned end face of the aforementioned ingot by the aforementioned first processing tool and the aforementioned first moving device, and chamfering of the outer periphery of the second aforementioned end face of the aforementioned ingot by the aforementioned second processing tool and the aforementioned second moving device.

[0019]

[13] The chamfering device as described in

[12] rotates the aforementioned ingot by means of the aforementioned driving rotating body, while simultaneously performing chamfering of the aforementioned outer periphery of the first aforementioned end face of the aforementioned ingot by the aforementioned first processing tool and the aforementioned first moving device, and chamfering of the aforementioned outer periphery of the second aforementioned end face of the aforementioned ingot by the aforementioned second processing tool and the aforementioned second moving device.

[0020]

[14] The chamfering device as described in any one of [1] to

[13] has a length measuring device for measuring the length of the aforementioned axial direction of the aforementioned ingot.

[0021]

[15] A chamfering method is a chamfering method using a chamfering device, the chamfering device comprising: a driving rotating body that rotates the ingot by transmitting a circumferential rotational force to the outer peripheral surface of a cylindrical ingot; a processing tool for processing the ingot; and a moving device that moves the processing tool relative to the ingot in the aforementioned axial direction according to the axial position of the ingot. The aforementioned chamfering method includes a chamfering step, in which the aforementioned ingot is rotated by means of the aforementioned driving rotating body, and the outer periphery of the end face of the aforementioned ingot is chamfered by means of the aforementioned processing tool and the aforementioned moving device.

[0022]

[16] In the chamfering method described in

[15] , the aforementioned processing tool is a grinding stone having a planar processing surface for chamfering the aforementioned ingot, and the aforementioned chamfering device has a grinding stone driving device for rotating the aforementioned processing tool about a rotation axis perpendicular to the aforementioned processing surface, and a swinging device for swinging the aforementioned processing tool parallel to the aforementioned processing surface. The aforementioned chamfering step is performed while the aforementioned processing tool is rotated by the aforementioned grinding stone driving device and swung by the aforementioned swinging device.

[0023]

[17] The chamfering method as described in

[15] or

[16] , wherein the chamfering device has a detector that moves together with the aforementioned processing tool and detects that the relative distance between the outer periphery of the aforementioned end face of the aforementioned ingot and the aforementioned axial direction of the aforementioned processing tool reaches a predetermined distance, the chamfering method has a processing start position moving step, wherein the aforementioned processing tool is moved from a standby position to a processing start position determined according to the detection result obtained by the aforementioned detector.

[0024]

[18] The chamfering method as described in any one of

[15] to

[17] , wherein the chamfering apparatus comprises a first processing tool, a second processing tool, a first moving device for moving the first processing tool, and a second moving device for moving the second processing tool, wherein in the chamfering step, the ingot is rotated by means of the driving rotating body while the chamfering of the outer periphery of the first end face of the ingot performed by the first processing tool and the first moving device, and the chamfering of the outer periphery of the second end face of the ingot performed by the second processing tool and the second moving device, are carried out.

[0025]

[19] In the chamfering method described in

[18] , the aforementioned ingot is rotated by means of the aforementioned driving rotating body while simultaneously performing chamfering of the outer periphery of the first end face of the aforementioned ingot by the aforementioned first processing tool and the aforementioned first moving device, and chamfering of the outer periphery of the second end face of the aforementioned ingot by the aforementioned second processing tool and the aforementioned second moving device.

[0026]

[20] The chamfering method as described in

[18] or

[19] includes, after the aforementioned chamfering step, a chamfer width measurement step that measures the difference between the chamfer width of the outer periphery of the first end face of the aforementioned ingot and the chamfer width of the outer periphery of the second end face of the aforementioned ingot. If the difference in the aforementioned chamfer width measured by the aforementioned chamfer width measurement step is greater than or equal to a threshold, the rotation direction of the aforementioned ingot is reversed and the aforementioned chamfering step is performed.

[0027]

[21] A method for manufacturing a single-crystal silicon ingot, wherein the single-crystal silicon ingot, which is the ingot described in any one of

[15] to

[20] , is chamfered.

[0028] [Invention Effects] According to the present invention, a chamfering apparatus, a chamfering method, and a method for manufacturing a single-crystal silicon ingot are provided, which can easily chamfer the outer periphery of the end face of a cylindrical ingot. Attached Figure Description

[0029] Figure 1 This is a front view showing a chamfering device according to an embodiment of the present invention.

[0030] Figure 2 yes Figure 1 The right-side view of the chamfering device shown.

[0031] Figure 3 yes Figure 1 A top view of the chamfering device shown.

[0032] Figure 4 yes Figure 1 A three-dimensional view of the processing area of ​​the chamfering device shown.

[0033] Figure 5 This is an explanation Figure 1 A diagram illustrating the measurement procedure for the length measuring device of the chamfering apparatus shown. Detailed Implementation

[0034] The following is a reference to the appendix. Figure 1 The embodiments of the present invention are illustrated below.

[0035] like Figures 1-4As shown, in one embodiment of the present invention, the chamfering device 1 includes: a driving rotating body 3, which rotates the ingot 2 by transmitting a circumferential rotational force to the outer peripheral surface 2a of the cylindrical ingot 2; a processing tool 4 for processing the ingot 2; and a moving device 5, which moves the processing tool 4 axially relative to the ingot 2 according to the axial position of the ingot 2; while rotating the ingot 2 by means of the driving rotating body 3, the outer peripheral edge 2c of the end face 2b of the ingot 2 is chamfered by means of the processing tool 4 and the moving device 5. In addition, in this embodiment, the direction along the central axis O of the ingot 2 is referred to as the axial direction, and the direction around the central axis O is referred to as the circumferential direction.

[0036] Based on the above structure, the ingot 2 can be chamfered while rotating it in the circumferential direction, thus enabling the chamfering device 1 to easily chamfer the outer periphery 2c of the end face 2b of the cylindrical ingot 2.

[0037] The outer peripheral surface 2a of the spindle 2 is mounted on the driving rotating body 3. According to the above structure, the spindle 2 can be rotated in the circumferential direction with a simple construction. In this embodiment, the driving rotating body 3 is a roller having an axis parallel to the central axis O.

[0038] The chamfering device 1 includes a rotating body drive device 6 that rotates the driving rotating body 3, and the rotating body drive device 6 can rotate the driving rotating body 3 to either one side or the other side. According to the above structure, the spindle 2 can be rotated to either one side or the other side in the circumferential direction as needed. In this embodiment, the rotating body drive device 6 consists of a power source 6a and a power transmission mechanism 6b. In this embodiment, the power source 6a is a fluid-pumped or electric rotary motor.

[0039] The chamfering device 1 has a lower driven rotating body 7, which is another rotating body that is disposed at a position offset from the driving rotating body 3 in the circumferential direction of the spindle 2, and which supports the outer peripheral surface 2a of the spindle 2 and is driven by the outer peripheral surface 2a of the spindle 2. According to the above structure, the spindle 2 can be stably held while rotating in the circumferential direction with a simple construction. In this embodiment, the lower driven rotating body 7 is a roller with an axis parallel to the central axis O.

[0040] The machining tool 4 is a grinding stone with a planar machining surface 4a for chamfering the ingot 2. The chamfering device 1 includes: a grinding stone driving device 8 that rotates the machining tool 4 about a rotation axis P perpendicular to the machining surface 4a; and a swinging device 9 that swings the machining tool 4 parallel to (e.g., horizontally) the machining surface 4a. According to the above structure, chamfering can be performed while suppressing uneven wear of the machining surface 4a of the grinding stone by means of swinging.

[0041] The chamfering device 1 includes: a chip collection port 10a located below the machining tool 4; and a machining tool cover 11 that covers the machining tool 4 and guides the chips generated by the chamfering performed by the machining tool 4 to the chip collection port 10a; the machining tool 4 moves axially together with the chip collection port 10a by means of a moving device 5. According to the above structure, the chips generated by the chamfering performed by the machining tool 4 can be collected into the chip collection port 10a, thus facilitating chip handling.

[0042] The chamfering device 1 includes: a chip collecting tube 10 having a first end 10b forming a chip collecting port 10a; and a suction device 12 that draws air from the chip collecting port 10a via a second end 10c (on the opposite side of the first end 10b) of the chip collecting tube 10; the chip collecting tube 10 has a flexible portion 10d between the first end 10b and the second end 10c, which, by means of deformation of the flexible portion 10d, allows the machining tool 4 to move together with the chip collecting port 10a from a standby position to a machining start position corresponding to the position of the end face 2b of the spindle 2. According to the above structure, efficient chip collection by suction can be achieved with a simple construction. In this embodiment, the flexible portion 10d has a folded-back portion 10e that folds back in a U-shape in the axial direction, and is in the form of a corrugated tube.

[0043] The machining tool 4 is a grinding stone with a flat machining surface 4a that bevels the spindle 2. The machining tool cover 11 has: a pair of side walls 11a, which are horizontally opposite each other and located on the plane containing the machining surface 4a of the machining tool 4; a top wall 11b, located above the pair of side walls 11a and on the plane containing the machining surface 4a; a back wall 11c, located on the opposite side of the spindle 2 when viewed from the machining surface 4a, and connected to the pair of side walls and the top wall 11b; and an opening 11d, formed below the machining surface 4a of the machining tool 4, serving as a path for chip movement. According to the above structure, the chips can be well guided to the chip collection port 10a by means of the machining tool cover 11. Alternatively, the machining device cover 11 can also be made with a lower wall having an opening 11d that surrounds the chip collection port 10a. Furthermore, in this case, the opening 11d can also be circular in size, the same as the chip collection port 10a.

[0044] The chamfering device 1 includes: a chip collecting tube 10 having a first end 10b forming a chip collecting port 10a; and a suction device 12 that draws air from the chip collecting port 10a via a second end 10c of the chip collecting tube 10; the chip collecting tube 10 has a protruding edge at the first end 10b. According to the above structure, chips can be better guided towards the chip collecting port 10a by means of the suction device 12, the machining tool cover 11, and the protruding edge.

[0045] The chamfering device 1 comprises a drive rotating body 3 on which the outer peripheral surface 2a of the spindle 2 is placed. It includes a lower driven rotating body 7, which is a rotating body that is offset from the drive rotating body 3 in the circumferential direction of the spindle 2, and is mounted on and driven by the outer peripheral surface 2a of the spindle 2; and an upper driven rotating body 13, which is another rotating body that restricts the upward movement of the spindle 2 by contacting the upper surface of the outer peripheral surface 2a of the spindle 2 and is driven by the outer peripheral surface 2a of the spindle 2. The processing tool 4 moves together with the upper driven rotating body 13 via a moving device 5. According to this structure, in addition to restricting the downward movement of the spindle 2 by the drive rotating body 3 and the lower driven rotating body 7, it is also possible to restrict the upward movement of the spindle 2 by the upper driven rotating body 13, thus allowing the spindle 2 to be held more stably while rotating in the circumferential direction. In this embodiment, the upper driven rotating body 13 is a roller with a shaft parallel to the central axis O. In order to facilitate the restriction of the upward movement of the ingot 2, the upper driven rotating body 13 can also be configured to be pressed against the upper surface of the ingot 2.

[0046] The chamfering device 1 has a first upper driven rotating body 13 and a second upper driven rotating body 13 arranged at positions offset from each other in the circumferential direction. According to the above structure, the spindle 2 can be rotated in the circumferential direction while being held more stably by means of the driving rotating body 3, the lower driven rotating body 7, the first upper driven rotating body 13 and the second upper driven rotating body 13.

[0047] The chamfering device 1 includes a detector 14, which moves together with the machining tool 4 to detect when the relative distance between the outer periphery 2c of the end face 2b of the spindle 2 and the axial direction of the machining tool 4 reaches a predetermined distance. The moving device 5 moves the machining tool 4 from a standby position to a machining start position determined based on the detection result obtained by the detector 14. With this structure, the machining tool 4 can be easily moved to an appropriate position corresponding to the axial position of the spindle 2. In this embodiment, the detector 14 detects the presence of an object in a direction that intersects (preferably orthogonal) the axial direction. Furthermore, in this embodiment, the detector 14 is an opposing type consisting of a transmitter 14a and a receiver 14b that are positioned opposite each other.

[0048] The moving device 5 has a base 5a and a translation device 5b that moves the base 5a axially. The grinding stone drive device 8, the swing device 9, the machining tool cover 11, the portion of the chip collection pipe 10 located on the side of the flexible portion 10d near the chip collection port 10a, and the retainer of the detector 14 and the upper driven rotating body 13 are integrally mounted on the base 5a. Based on the above structure, the moving device 5 can be realized with a simple construction. In this embodiment, the power source for the translation device 5b is a fluid-pumped or electric rotary motor.

[0049] The chamfering device 1 includes a first machining tool 4, a second machining tool 4, a first moving device 5 for moving the first machining tool 4, and a second moving device 5 for moving the second machining tool 4. While rotating the spindle 2 by means of a driving rotating body 3, it performs chamfering of the outer periphery 2c of the first end face 2b of the spindle 2 by the first machining tool 4 and the first moving device 5, and chamfering of the outer periphery 2c of the second end face 2b of the spindle 2 (opposite to the first end face 2b) by the second machining tool 4 and the second moving device 5. According to the above structure, chamfering of the outer periphery 2c of both end faces 2b of the spindle 2 can be easily achieved. In this embodiment, the device is positioned on the right side (…). Figure 1 (right side of the middle) Figure 4 The machining tool 4 shown is designated as the first machining tool 4, and the machining tool 4 located on the left is designated as the second machining tool 4.

[0050] The chamfering device 1 rotates the spindle 2 by means of the drive rotating body 3, while simultaneously performing chamfering on the outer periphery 2c of the first end face 2b of the spindle 2 by the first machining tool 4 and the first moving device 5, and chamfering on the outer periphery 2c of the second end face 2b of the spindle 2 by the second machining tool 4 and the second moving device 5. According to the above structure, while rotating the spindle 2, it is clamped in from both sides by the machining tools 4 for chamfering, so the pushing force of the machining tools 4 relative to the spindle 2 used for chamfering can be easily uniformized from left to right, thus reducing the difference in chamfering amount between the left and right sides.

[0051] The chamfering device 1 includes a length measuring device 15 for measuring the axial length of the spindle 2. With this structure, the axial length of the spindle 2 at the completion of chamfering can be easily determined. In this embodiment, the length measuring device 15 consists of a first distance sensor 15a disposed on one side of the spindle 2's axial direction and a second distance sensor 15b disposed on the other side of the spindle 2's axial direction. Figure 5 As shown, with the axial length of spindle 2 as D, the distance between the first distance sensor 15a and the end face 2b on one side of the axial direction of spindle 2 as A, the distance between the second distance sensor 15b and the end face 2b on the other side of the axial direction of spindle 2 as B, and the distance between the first distance sensor 15a and the second distance sensor 15b as C, the relationship D = C - (A + B) holds. Since C is known, D can be determined by measuring A with the first distance sensor 15a and measuring B with the second distance sensor 15b. In this embodiment, the first distance sensor 15a and the second distance sensor 15b are both reflective types.

[0052] The operation of the chamfering device 1 (rotary drive device 6, moving device 5, detector 14, grinding stone drive device 8, swing device 9, suction device 12, length measuring device 15, etc.) is controlled by a control device (computer) not shown. In this embodiment, the chamfering device 1 has a door 16 that opens and closes the processing area R of the spindle 2. The operation of the door 16 is controlled by the control device in this embodiment. In this embodiment, the door 16 is composed of a pair of sliding doors 16a extending from the front to the back of the chamfering device 1, and the suction device 12 is disposed on the back side of the chamfering device 1.

[0053] like Figures 1-4 As shown, in this embodiment, the chamfering method uses a chamfering device 1, which includes: a driving rotating body 3, which rotates the ingot 2 by transmitting a circumferential rotational force to the outer peripheral surface 2a of the cylindrical ingot 2; a processing tool 4, which processes the ingot 2; and a moving device 5, which moves the processing tool 4 axially relative to the ingot 2 according to the axial position of the ingot 2. The chamfering method includes a chamfering step in which the outer peripheral edge 2c of the end face 2b of the ingot 2 is chamfered while the ingot 2 is rotated by the driving rotating body 3, using the processing tool 4 and the moving device 5. According to the above structure, the ingot 2 can be chamfered while being rotated circumferentially, so a chamfering method that can easily chamfer the outer peripheral edge 2c of the end face 2b of the cylindrical ingot 2 can be realized.

[0054] The machining tool 4 is a grinding stone with a planar machining surface 4a for chamfering the ingot 2. The chamfering device 1 includes a grinding stone drive 8 that rotates the machining tool 4 about a rotation axis P perpendicular to the machining surface 4a, and a swinging device 9 that swings the machining tool 4 parallel to the machining surface 4a. The chamfering step is performed while the machining tool 4 is rotated by the grinding stone drive 8 and swung by the swinging device 9. With the above structure, chamfering can be performed while suppressing uneven wear on the machining surface 4a of the grinding stone by means of the swinging motion.

[0055] The chamfering device 1 includes a detector 14 that moves together with the machining tool 4 and detects when the relative distance between the outer periphery 2c of the end face 2b of the spindle 2 and the axial direction of the machining tool 4 reaches a predetermined distance. The chamfering method includes a machining start position moving step that moves the machining tool 4 from a standby position to a machining start position determined based on the detection result obtained by the detector 14. With the above structure, the machining tool 4 can be easily moved to an appropriate position corresponding to the axial position of the spindle 2.

[0056] The chamfering device 1 includes a first machining tool 4, a second machining tool 4, a first moving device 5 for moving the first machining tool 4, and a second moving device 5 for moving the second machining tool 4. During the chamfering step, while the spindle 2 is rotated by a driving rotating body 3, chamfering is performed on the outer periphery 2c of the first end face 2b of the spindle 2 by the first machining tool 4 and the first moving device 5, and on the outer periphery 2c of the second end face 2b of the spindle 2 by the second machining tool 4 and the second moving device 5. With this structure, chamfering of the outer periphery 2c of both end faces 2b of the spindle 2 can be easily achieved.

[0057] In the chamfering step, while the spindle 2 is rotated by the drive rotating body 3, chamfering of the outer periphery 2c of the first end face 2b of the spindle 2 is performed simultaneously by the first processing tool 4 and the first moving device 5, and chamfering of the outer periphery 2c of the second end face 2b of the spindle 2 is performed by the second processing tool 4 and the second moving device 5. With this structure, the difference in chamfering amount between the left and right sides can be reduced.

[0058] The chamfering method, after the chamfering step, involves measuring the chamfer width W of the outer periphery 2c of the first end face 2b of the ingot 2 (refer to...). Figure 5 In the chamfer width measurement step, if the difference in chamfer width W between the second end face 2b and the outer periphery 2c of the spindle 2 is greater than or equal to a threshold, the rotation direction of the spindle 2 is reversed and the chamfering step is performed. Based on this structure, the difference in chamfer width W that occurs when the spindle 2 moves to one side of the axial direction or the other side of the axial direction due to the surface condition of the outer periphery 2a of the spindle 2, etc., can be suppressed. For example, if the outer periphery 2a of the spindle 2 is formed by cutting a shallow spiral groove centered on the central axis O in the preceding chamfering process, such movement occurs when the spindle 2 rotates during chamfering due to a threaded feed action between the roller, which acts as the driving rotating body 3, and the outer periphery 2a of the spindle 2.

[0059] In this embodiment, the method for manufacturing a single-crystal silicon ingot uses the chamfering method of this embodiment to chamfer the single-crystal silicon ingot that serves as ingot 2. Based on the above structure, a method for manufacturing a single-crystal silicon ingot that can easily chamfer the outer periphery 2c of the end face 2b of the cylindrical ingot 2 can be realized.

[0060] The embodiments of the present invention have been described above, but the present invention is not limited to the foregoing embodiments. Various modifications can be made to the foregoing embodiments without departing from the spirit of the present invention.

[0061] Explanation of reference numerals in the attached figures 1. Chamfering device 2 ingots 2a Outer peripheral surface 2b end face 2c peripheral edge 3. Driving the rotating body 4. Machining tools 4a Machined surface 5. Mobile devices 5a base 5b Translation device 6. Rotating body drive device 6a Power Source 6b Power transmission mechanism 7. Lower driven rotating body 8. Grinding stone drive unit 9. Swinging device 10. Chip collection tube 10a Chip collection port 10b First end 10c second end 10d flexible portion 10e Turnback Section 11. Machining tool cover 11a Side wall 11b Upper wall 11c Back wall 11d Open Department 12 Suction Device 13 Upper driven rotating body 14 Detectors 14a Transmitter 14b receiver 15. Length measuring device 15a First Distance Sensor 15b Second Distance Sensor 16 Doors 16a Sliding door Distances between A, B, C, and D O Central axis P Rotation axis R processing area W is the chamfer width.

Claims

1. A chamfering device, have: A driving rotating body is a rotating body that rotates the aforementioned ingot by transmitting circumferential rotational force to the outer circumferential surface of a cylindrical ingot. Processing tools, for processing the aforementioned ingots; and The moving device moves the machining tool relative to the ingot along the aforementioned axial direction based on the axial position of the ingot. While rotating the aforementioned ingot using the aforementioned driving rotating body, the outer periphery of the end face of the aforementioned ingot is chamfered using the aforementioned processing tool and the aforementioned moving device.

2. The chamfering device as described in claim 1, characterized in that, The aforementioned outer peripheral surface of the aforementioned ingot is placed on the aforementioned driving rotating body.

3. The chamfering device as described in claim 1, characterized in that, It has a rotating body drive device that rotates the aforementioned driving rotating body. The aforementioned rotating body driving device can cause the aforementioned driving rotating body to rotate to either one side or the other side.

4. The chamfering device as described in claim 1, characterized in that, It has a lower driven rotating body, which is another rotating body that is disposed at a position offset from the aforementioned driving rotating body in the aforementioned circumferential direction of the aforementioned ingot, and that carries the aforementioned outer peripheral surface of the aforementioned ingot and is driven by the aforementioned outer peripheral surface of the aforementioned ingot.

5. The chamfering device as described in claim 1, characterized in that, The aforementioned processing tool is a grinding stone with a flat processing surface for chamfering the aforementioned ingot. The aforementioned chamfering device includes a grinding stone drive device that rotates the aforementioned machining tool about a rotation axis perpendicular to the aforementioned machining surface, and a swinging device that swings the aforementioned machining tool parallel to the aforementioned machining surface.

6. The chamfering device as described in claim 1, characterized in that, have: The chip collection port is located below the aforementioned machining tool; and A tool cover is provided to cover the aforementioned machining tool and guide the chips generated by the chamfering performed by the aforementioned machining tool to the aforementioned chip collection port. With the aid of the aforementioned moving device, the aforementioned processing tool and the aforementioned chip collection port move together in the aforementioned axial direction.

7. The chamfering device as described in claim 6, characterized in that, have: The chip collection tube has a first end forming the aforementioned chip collection port; and The suction device draws air from the aforementioned chip collection port through the second end of the aforementioned chip collection tube. The aforementioned chip collection tube has a flexible portion between the aforementioned first end and the aforementioned second end, and by means of the deformation of the aforementioned flexible portion, the aforementioned processing tool and the aforementioned chip collection port are allowed to move from the standby position to the processing start position corresponding to the position of the aforementioned end face of the aforementioned ingot.

8. The chamfering device as described in claim 6, characterized in that, The aforementioned processing tool is a grinding stone with a flat processing surface for chamfering the aforementioned ingot. The aforementioned machining tool cover has a pair of side walls that are horizontally opposed to each other and located on a plane containing the machining surface of the aforementioned machining tool, an upper wall located on the aforementioned plane containing the aforementioned machining surface above the aforementioned machining tool, a back wall located on the opposite side of the aforementioned ingot when viewed from the aforementioned machining surface and connected to the aforementioned pair of side walls and the aforementioned upper wall, and an opening formed on the lower side of the aforementioned machining surface of the aforementioned machining tool and serving as the movement path of the aforementioned chips.

9. The chamfering device as described in claim 8, characterized in that, have: The chip collection tube has a first end forming the aforementioned chip collection port; and The suction device draws air from the aforementioned chip collection port through the second end of the aforementioned chip collection tube. The aforementioned chip collection tube has a protruding edge at the first end.

10. The chamfering device as claimed in claim 1, characterized in that, The aforementioned outer peripheral surface of the aforementioned ingot is placed on the aforementioned driving rotating body; have: The lower driven rotating body is a rotating body that is disposed at a position offset from the aforementioned driving rotating body in the aforementioned circumferential direction of the aforementioned ingot, and which carries the aforementioned outer peripheral surface of the aforementioned ingot and is driven by the aforementioned outer peripheral surface of the aforementioned ingot; and The upper driven rotating body is another rotating body that restricts the upward movement of the aforementioned ingot by contacting the upper surface of the aforementioned outer peripheral surface of the aforementioned ingot and is driven by the aforementioned outer peripheral surface of the aforementioned ingot. With the aid of the aforementioned moving device, the aforementioned processing tool moves together with the aforementioned upper driven rotating body.

11. The chamfering device as claimed in claim 1, characterized in that, The device includes a detector that moves together with the aforementioned machining tool and detects when the relative distance between the outer periphery of the aforementioned end face of the aforementioned ingot and the aforementioned axial direction of the aforementioned machining tool reaches a predetermined distance. The aforementioned moving device moves the aforementioned processing tool from the standby position to the processing start position determined based on the detection result obtained by the aforementioned detector.

12. The chamfering device as claimed in claim 1, characterized in that, The device comprises a first aforementioned processing tool, a second aforementioned processing tool, a first aforementioned moving device for moving the first aforementioned processing tool, and a second aforementioned moving device for moving the second aforementioned processing tool. While rotating the aforementioned ingot with the aid of the aforementioned driving rotating body, chamfering of the outer periphery of the first end face of the aforementioned ingot is performed by the aforementioned first processing tool and the aforementioned first moving device, and chamfering of the outer periphery of the second end face of the aforementioned ingot is performed by the aforementioned second processing tool and the aforementioned second moving device.

13. The chamfering device as described in claim 12, characterized in that, While rotating the aforementioned ingot with the aid of the aforementioned driving rotating body, the aforementioned outer periphery of the first end face of the aforementioned ingot is chamfered by the aforementioned first processing tool and the aforementioned first moving device, and the aforementioned outer periphery of the second end face of the aforementioned ingot is chamfered by the aforementioned second processing tool and the aforementioned second moving device.

14. The chamfering device as described in claim 1, characterized in that, A length measuring device for measuring the length of the aforementioned axial direction of the aforementioned ingot.

15. A chamfering method, which is a chamfering method using a chamfering device. The aforementioned chamfering device has: A driving rotating body is a rotating body that rotates the aforementioned ingot by transmitting circumferential rotational force to the outer circumferential surface of a cylindrical ingot. Processing tools, for processing the aforementioned ingots; and The moving device moves the machining tool relative to the ingot along the aforementioned axial direction based on the axial position of the ingot. The aforementioned chamfering method includes a chamfering step, in which the aforementioned ingot is rotated by means of the aforementioned driving rotating body, and the outer periphery of the end face of the aforementioned ingot is chamfered by means of the aforementioned processing tool and the aforementioned moving device.

16. The chamfering method as described in claim 15, characterized in that, The aforementioned processing tool is a grinding stone with a flat processing surface for chamfering the aforementioned ingot. The aforementioned chamfering device includes a grinding stone drive device that rotates the aforementioned machining tool about a rotation axis perpendicular to the aforementioned machining surface, and a swinging device that swings the aforementioned machining tool parallel to the aforementioned machining surface. The aforementioned chamfering step is performed while the aforementioned grinding stone drive device is used to rotate the aforementioned processing tool and the aforementioned swing device is used to swing the aforementioned processing tool.

17. The chamfering method as described in claim 15, characterized in that, The aforementioned chamfering device includes a detector that moves together with the aforementioned machining tool and detects when the relative distance between the outer periphery of the aforementioned end face of the aforementioned ingot and the aforementioned axial direction of the aforementioned machining tool reaches a predetermined distance. The aforementioned chamfering method includes a machining start position moving step, in which the aforementioned machining tool is moved from a standby position to a machining start position determined based on the detection result obtained by the aforementioned detector.

18. The chamfering method as described in claim 15, characterized in that, The aforementioned chamfering device includes a first aforementioned machining tool, a second aforementioned machining tool, a first aforementioned moving device for moving the first aforementioned machining tool, and a second aforementioned moving device for moving the second aforementioned machining tool. In the aforementioned chamfering step, while the aforementioned ingot is rotated by the aforementioned driving rotating body, chamfering of the outer periphery of the first aforementioned end face of the aforementioned ingot is performed by the aforementioned first processing tool and the aforementioned first moving device, and chamfering of the outer periphery of the second aforementioned end face of the aforementioned ingot is performed by the aforementioned second processing tool and the aforementioned second moving device.

19. The chamfering method as described in claim 18, characterized in that, In the aforementioned chamfering step, while the aforementioned ingot is rotated by the aforementioned driving rotating body, the aforementioned outer periphery of the first aforementioned end face of the aforementioned ingot is chamfered by the aforementioned first processing tool and the aforementioned first moving device, and the aforementioned outer periphery of the second aforementioned end face of the aforementioned ingot is chamfered by the aforementioned second processing tool and the aforementioned second moving device.

20. The chamfering method as described in claim 18, characterized in that, Following the aforementioned chamfering step, a chamfer width measurement step is performed, which measures the difference between the chamfer width of the outer periphery of the first end face of the ingot and the chamfer width of the outer periphery of the second end face of the ingot. If the difference between the chamfer width measured by the aforementioned chamfer width measurement step and the aforementioned chamfer step is above a threshold, the rotation direction of the aforementioned ingot is reversed and the aforementioned chamfer step is performed.

21. A method for manufacturing a single-crystal silicon ingot, characterized in that, The single-crystal silicon ingot, which is the aforementioned ingot, is beveled using the beveling method described in claim 15.

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