Heat dissipation mechanism and manufacturing method thereof

Abstract

The present invention relates to a heat dissipation mechanism and a method of manufacturing the same, the heat dissipation mechanism according to the present invention comprising: a heat transfer plate main body having a refrigerant flow space of a predetermined thickness formed therein to release heat through one surface and the other surface, and a vacuum chamber provided to vertically communicate with the refrigerant flow space with respect to one of the one surface and the other surface, and to vacuumize the refrigerant flow space before or after filling the refrigerant flow space with the refrigerant, therefore, the refrigerant leakage phenomenon of the heat dissipation mechanism can be prevented, and the heat dissipation performance can be improved.

Description

Technical Field

[0001] The present invention relates to a heat dissipation mechanism and a method thereof, and more specifically, to a heat dissipation mechanism and a method thereof that can improve heat dissipation performance by actively transferring heat generated from a heat-generating device (e.g., electronic device) through a phase change of a refrigerant that is more efficient than the thermal conductivity of the refrigerant itself. Background Technology

[0002] In various industries such as communications, electronics, and electrical engineering, related technologies are undergoing continuous and rapid development in order to be applied to more advanced industries. This advanced technological development requires high energy output, and devices using high energy output inevitably face the problem of high heat generation. Therefore, it is necessary to simultaneously develop cooling systems suitable for this level of performance.

[0003] Cooling systems are used in a variety of industries (such as air conditioning, mobile communications, data centers, aviation, electric vehicles, energy storage devices, and displays). These cooling systems are a major contributor to electricity consumption, which is gradually increasing with industrial development.

[0004] Generally, heat dissipation devices are broadly classified into active cooling devices and passive cooling devices. Active cooling devices mainly utilize forced convection based on fans, while passive cooling devices can be divided into those that utilize natural convection without fans.

[0005] However, existing heat dissipation systems have limitations in dissipating the high heat generated by continuously evolving high-tech solutions. Therefore, innovative technologies are needed in related industries to address this problem, and heat dissipation mechanisms utilizing phase change materials are being developed as part of this effort.

[0006] Phase transition refers to the phenomenon where the intrinsic state of a liquid / gas / solid changes when it accumulates a large amount of energy or releases stored heat.

[0007] A phase transition refers to a change in the physical arrangement of molecules, rather than a chemical reaction such as chemical bonding or formation. The heat that does not cause a phase transition when energy is applied to a substance is called sensible heat, while the heat used when a phase transition occurs is called latent heat.

[0008] However, since temperature and pressure are directly proportional, there is a problem that the pressure in a heat dissipation mechanism increases as the temperature rises. Within a sealed heat dissipation mechanism, if the pressure increases due to high temperatures conducted from the heat source, the mechanism itself may rupture. To address this issue, it is necessary to prevent pressure increases, requiring a sufficient internal volume within the heat dissipation mechanism to achieve pressure equilibrium during the phase transition cycle of the material.

[0009] As mentioned above, in order to dissipate heat using the phase change material (refrigerant) inside the heat dissipation mechanism, a vacuuming process is required to regulate the internal pressure before filling the refrigerant.

[0010] Vacuuming is a process that uses a vacuum-operated device to create a vacuum through internal suction. In order to form ventilation holes, the ventilation hole area is shaped to protrude outwards more than the original design value. Then, the vacuuming process is performed, followed by a filling and finishing process to cover the interior, thus completing the process.

[0011] At this point, the grouting finishing process is as follows: use a grouting tool to press the additional protruding parts that are used to form ventilation holes, so that the inner circumferential surfaces of the ventilation holes abut against each other, thereby finishing the process.

[0012] However, initially, when the vent has a complete circular cross-section, the shape deformation is achieved by uniform pressure based on the caulking tool. Therefore, the inner circumferential surface of the vent can be completely caulked without individual leaks. But when the vent has a non-circular cross-section including an elliptical shape, the pressure transmitted by the caulking tool is uneven, resulting in uneven shape deformation and concerns about the occurrence of leaks.

[0013] First, if a leak occurs in the heat dissipation mechanism, the refrigerant may leak out, and due to the decrease in internal pressure, the refrigerant's phase change becomes difficult, resulting in a sharp decline in heat dissipation performance. Summary of the Invention Technical issues

[0014] In order to solve the aforementioned technical problems, the present invention aims to provide a heat dissipation mechanism and its manufacturing method that can improve the heat dissipation performance of a heat-generating device (electronic device).

[0015] Furthermore, another object of the present invention is to provide a heat dissipation mechanism including a vacuuming section and a method for manufacturing the same, wherein the vacuuming section is equipped to smoothly perform a caulking and finishing process for ventilation holes formed with elliptical or non-circular cross sections.

[0016] The technical problems that this invention aims to solve are not limited to those mentioned above. Those skilled in the art can clearly understand other technical problems not mentioned through the following description. Technical solution

[0017] An embodiment of the heat dissipation mechanism according to the present invention includes: a heat-conducting plate body having a refrigerant flow space of predetermined thickness formed therein to release heat through one surface and another surface, wherein the heat-conducting plate body includes: a vacuuming section configured to be perpendicularly connected to the refrigerant flow space relative to one of the one surface and the other surface, and for vacuuming the refrigerant flow space before or after filling the refrigerant with refrigerant.

[0018] Here, the refrigerant flow space of the heat-conducting plate body can be the space between a heat-conducting plate on one side forming one surface and a heat-conducting plate on the other side forming the other surface, and can be formed as a closed empty space for gas-liquid circulation, so that the refrigerant releases heat while filling and changing phase, and the vacuuming section can be provided in a ventilation hole formed in one of the heat-conducting plates on one side and the heat-conducting plate on the other side.

[0019] Furthermore, the vacuuming section may include: a ventilation pipe that is snapped from the inside to the outside of the ventilation hole and protrudes outward by a predetermined length; and a welding auxiliary ring that is clamped on the outer circumferential surface of the ventilation pipe for welding and fixing.

[0020] Furthermore, the ventilation duct may include: a duct body having a hollow duct shape; and a snap-fit ​​stepped portion located in the refrigerant flow space within the duct body, and having an outer diameter larger than the outer periphery of the duct body.

[0021] Furthermore, the outer diameter of the snap-fit ​​step portion can be formed to the size of the inner edge portion of the vent hole.

[0022] Furthermore, the welding auxiliary ring can be tightly fixed to the outer edge of one of the heat-conducting plates on one side and the other side where the ventilation hole is formed.

[0023] Furthermore, the vacuuming section may also include a shielding solder section, which welds and fixes the tube body to the ventilation hole.

[0024] Furthermore, the shielding solder portion can be a welding repair material that is welded to shield the hollow part of the tube body after the tube body is cut in a manner that matches the outer end of the welding auxiliary ring.

[0025] Furthermore, the shielding solder portion can be a welding repair material that is welded in a manner that completely covers the outer end of the welding auxiliary ring and is cut to match the outer end of the welding auxiliary ring in a hollow manner.

[0026] Furthermore, the vacuuming section may include: a ventilation pipe that is snapped into the ventilation hole from the outside to the inside and protrudes outward by a predetermined length, wherein the ventilation pipe includes: a pipe body having a hollow pipe shape; and a welded reinforcing part that is integrally formed with the pipe body and snapped into the outer edge of the ventilation hole.

[0027] Furthermore, an inclined tapered portion may be formed in the welded reinforcement portion adjacent to the ventilation hole, so that a space for applying welding repair material can be formed between the welded reinforcement portion and the outer edge of the ventilation hole.

[0028] Furthermore, when the pipe body is installed from the outside to the inside through the ventilation hole, the welded reinforcement can have an outer diameter that snaps onto the outer edge of the ventilation hole.

[0029] Furthermore, the vacuuming section may include: a shielding solder section, which is welded with a welding repair material after the tube body is cut to match the outer end of the welding reinforcement section, so as to shield the hollowness of the tube body; and a fixing solder section, which is welded with a welding repair material to fix the welding reinforcement section and the outer edge of the ventilation hole.

[0030] Furthermore, the fixed solder portion can be formed by applying a soldering material between the tapered portions of the weld reinforcement portion.

[0031] A method for manufacturing a heat dissipation mechanism according to an embodiment of the present invention includes: a sheet metal process for a heat-conducting plate body, processing a heat-conducting plate on one side and a heat-conducting plate on the other side that form a refrigerant flow space inside, and integrally forming a ventilation hole for filling refrigerant or performing vacuuming in one of the heat-conducting plates on one side and the other side; a joining process, after the sheet metal process for the heat-conducting plate body, joining the heat-conducting plate on one side and the heat-conducting plate on the other side, which are constructed using a single metal plate component or two metal plate components, to form the refrigerant flow space; and a vacuuming process, after the joining process, vacuuming the refrigerant flow space, wherein the vacuuming process includes: a vacuuming section setting process, setting a vacuuming section in the ventilation hole.

[0032] Here, the manufacturing method of the heat dissipation mechanism may further include: a bending process, wherein when the heat-conducting plate on one side and the heat-conducting plate on the other side are constructed using a single metal plate component, the single metal plate component is bent before the joining process, so that the heat-conducting plate on one side forms one side of the refrigerant flow space, and the heat-conducting plate on the other side forms the other side of the refrigerant flow space.

[0033] Furthermore, the vacuuming process can be a process in which, before the joining process, the ventilation pipe is pre-set to snap onto the inner edge end of the ventilation hole and protrude outward by a predetermined length, and the welding auxiliary ring is clamped on the outer peripheral surface of the ventilation pipe protruding outward from the ventilation hole.

[0034] Furthermore, the vacuuming process may include: a ventilation process, which uses the ventilation duct disposed in the ventilation hole to evacuate the refrigerant flow space; and a solder filling process, which cuts a portion of the ventilation duct after the ventilation process and then welds the hollow part of the ventilation duct.

[0035] Furthermore, the vacuuming process can be performed after the bonding process, by setting the ventilation pipe from the outside to the inside in a manner that snaps onto the outer edge of the ventilation hole, and by setting the ventilation pipe in a manner that snaps onto the outer edge of the ventilation hole.

[0036] Furthermore, the vacuuming process may include: a ventilation process, in which the refrigerant flow space is evacuated by means of the ventilation pipe disposed in the ventilation hole; a solder fixing process, in which, after the ventilation process, a welding reinforcement integrally formed with the ventilation pipe and the outer peripheral surface of the ventilation hole are welded together by means of a welding repair material; and a solder filling process, in which, after the ventilation process, a portion of the ventilation pipe is cut and then the hollow part of the ventilation pipe is welded. Beneficial effects

[0037] According to an embodiment of the heat dissipation mechanism and its manufacturing method of the present invention, the following effects are achieved: not only is refrigerant leakage of the completed heat dissipation mechanism prevented, but also a decrease in internal pressure is prevented, thereby ensuring product quality.

[0038] The effects of this invention are not limited to those mentioned above. Those skilled in the art can clearly understand other technical effects not mentioned by referring to the claims. Attached Figure Description

[0039] Figure 1a and Figure 1b The following are perspective views illustrating two embodiments of an antenna device having a heat dissipation mechanism according to an embodiment of the present invention on its rear side.

[0040] Figure 2a and Figure 2b They are shown separately. Figure 1a and Figure 1b An exploded perspective view of the rear part of the antenna device.

[0041] Figure 3 This is a perspective view of a finger protection assembly that externally protects a heat dissipation mechanism according to an embodiment of the present invention.

[0042] Figure 4 It is shown Figure 1a and Figure 2a The diagram shown is a perspective view of the manufacturing process of a heat dissipation mechanism according to an embodiment of the present invention.

[0043] Figure 5 This is a plan view showing the heat-conducting plate body in the structure of a heat dissipation mechanism according to an embodiment of the present invention.

[0044] Figure 6 yes Figure 1a and Figure 2a The diagram shows a perspective view and a partially enlarged plan view of a heat dissipation mechanism according to an embodiment of the present invention.

[0045] Figure 7 yes Figure 6 Floor plan.

[0046] Figure 8 It is along Figure 7 A cross-sectional view taken from the BB line.

[0047] Figure 9 This is a perspective view showing a heat dissipation mechanism according to another embodiment of the present invention.

[0048] Figure 10 yes Figure 9 An exploded 3D diagram.

[0049] Figure 11 yes Figure 9 A sectional perspective view (a), a partial enlarged view (b), a sectional view of the part (c), and a partial enlarged view (d).

[0050] Figure 12 This is a perspective view and a partially enlarged view of the vacuum section in the structure of the heat dissipation mechanism according to an embodiment of the present invention.

[0051] Figure 13 This is a cross-sectional view showing the vacuuming process of the vacuuming section in the structure of the heat dissipation mechanism according to an embodiment of the present invention.

[0052] Figure 14 yes Figure 13 Partial sectional 3D view.

[0053] Figure 15 This is a perspective view and a partially enlarged cross-sectional view of a vacuuming section showing another implementation example of the structure of a heat dissipation mechanism according to an embodiment of the present invention.

[0054] Figure 16 This is a flowchart illustrating a method for manufacturing a heat dissipation mechanism according to an embodiment of the present invention.

[0055] Figure 17 It is shown Figure 16 A detailed flowchart of the vacuum process (SA).

[0056] Figure 18 It is shown Figure 16 A detailed flowchart of the remaining process (SB).

[0057] Explanation of reference numerals in the attached figures Detailed Implementation

[0058] Hereinafter, an embodiment of the heat dissipation mechanism and its manufacturing method according to the present invention will be described in detail with reference to the accompanying drawings.

[0059] It should be noted that when assigning reference numerals to the constituent elements of the various figures, the same reference numerals should be assigned to the same constituent elements, even if they are marked on different figures. Furthermore, in describing embodiments of the present invention, detailed descriptions of related well-known structures or functions are omitted if it is determined that such detailed descriptions would impede understanding of the embodiments of the present invention.

[0060] In describing the constituent elements of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are used only to distinguish one constituent element from other constituent elements, and the nature, order, or sequence of the corresponding constituent elements are not limited by these terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary knowledge in the art to which this invention pertains. Terms identical to those defined in commonly used dictionaries should be interpreted as having the same meaning as they have in the context of the related art, and should not be construed as having an ideal or overly formal meaning unless expressly defined in this application.

[0061] Figure 1a and Figure 1b Two perspective views are provided to illustrate the rear portion of an antenna device equipped with a heat dissipation mechanism according to an embodiment of the present invention. Figure 2a and Figure 2b They are shown separately. Figure 1a and Figure 1bAn exploded perspective view of the rear of the antenna device. Figure 3 This is a perspective view of a finger protection assembly that externally protects a heat dissipation mechanism according to an embodiment of the present invention.

[0062] Typically, heat-generating devices (electronic devices) are manufactured in various forms throughout the industry. However, the applicant of this invention is a company engaged in the manufacturing of other wireless communication equipment. Hereinafter, when describing a heat dissipation mechanism according to an embodiment of the present invention, the representative heat-generating device (electronic device) for heat dissipation will be the antenna device 100, which is very familiar to the applicant of this invention, as a specific example.

[0063] However, it should be noted that the heat dissipation mechanism according to the embodiments of the present invention described below should not be construed as limited to the antenna device 100, and the specific terms “antenna device 100” and “related components thereto” used below must be interpreted to include the concept of all similar electronic devices and their components.

[0064] First, the antenna device 100 used as an example of a representative electronic device is as follows.

[0065] like Figure 1a and Figure 1b As shown, the antenna device 100 using the heat dissipation mechanism 200 according to an embodiment of the present invention includes: a heat dissipation housing body 110, which forms a receiving space with an opening in the front and is formed into a cuboid shape having a generally longer and thinner front and rear receiving width in the vertical direction.

[0066] Here, the heat dissipation housing body 110 can be equipped with a robust material to provide a place (internal space) for the installation of various internal components described later, and can protect the internal components from external impacts. In particular, preferably, it is equipped with a metal material with excellent thermal conductivity that can dissipate heat generated by the system during operation in the internal components to the outside using the thermal conductivity of its own material.

[0067] Although not shown, a motherboard can be stacked inside the receiving space of the heat sink housing body 110, using a clamshell as a medium, to serve as a substrate for a power amplifier unit (PAU) and a digital transceiver unit (DTU). The motherboard can have multiple micro bellows filter (MBF) elements mounted on its front surface and a heat-generating element mounted on its back surface.

[0068] Here, the motherboard may be fitted with components defined as heat-generating elements (not shown), such as radio frequency integrated circuits (RFICs) or power amplifiers (PAs), which generate significant heat when driven. However, it should be noted that in embodiments of the present invention, the electronic device is described only as an antenna device 100, and the heat-generating element is not limited to the above configuration. For example, a semiconductor, which is a typical heat-generating element, may be used as the heat-generating element.

[0069] An antenna cover panel 50 may be provided on the front surface of the receiving space of the heat dissipation housing body 110, thereby protecting the radiating element, which is an antenna element, from external influences, while allowing the radiating element to radiate smoothly.

[0070] Here, the antenna cover panel 50 is formed of a non-conductive material that allows the radiation beam of the radiating element to be easily transmitted. It can be classified as a component that obstructs the heat dissipation of the system operating heat generated in the containment space of the heat dissipation housing body 110 to the front side. Therefore, in order to increase the heat dissipation surface area for concentrating heat dissipation to the rear side of the heat dissipation housing body 110, the heat dissipation housing body 10 itself is designed to be longer in the vertical direction.

[0071] In addition, a heat dissipation mechanism 200, 1200 according to an embodiment of the present invention may be provided on the back side of the heat dissipation housing body 110.

[0072] According to embodiments of the present invention, the heat dissipation mechanisms 200 and 1200 are configured in the form of heat dissipation fins. Strictly speaking, they are similar to those of heat dissipation fins. Figure 1a and Figure 1b The fixed heat dissipation fins 200F, 200F-1, and 200F-2 shown are different in that they are equipped with a vapor chamber of thin thickness, which must include an absorber 300 that absorbs the liquid phase refrigerant in the refrigerant.

[0073] Typically, a wick component is provided inside a well-known vapor chamber. This wick component has a wick structure with multiple pores. The wick component can be manufactured by sintering metal powder to form multiple pores that allow the liquid refrigerant inside the heat-conducting panel component to move towards the side equipped with the heating element via capillary force, while simultaneously allowing the gaseous refrigerant to flow freely to the outside.

[0074] However, the liquid absorbent core component is not limited to the sintered metal liquid absorbent core component described above. In particular, within the scope of being able to absorb and disperse liquid refrigerant or promote vaporization, although it may have any name such as the absorber 300, it can be defined as a concept including all possible materials such as fibrous materials. This will be explained in more detail below.

[0075] Furthermore, the heat dissipation mechanisms 200 and 1200 according to embodiments of the present invention can be manufactured in two different ways using two different manufacturing methods.

[0076] That is, the heat dissipation mechanisms 200 and 1200 according to embodiments of the present invention include heat-conducting plate bodies 200-1, 200-2, 1200-1, and 1200-2 having refrigerant flow spaces 205 and 1205, wherein refrigerant is filled inside the refrigerant flow spaces 205 and 1205 and flows during a phase change. In one embodiment, such as... Figure 1a and Figure 2a As shown, the manufacturing method involves bending the heat-conducting plate bodies 200-1 and 200-2, which are equipped with a single metal plate component, using a bending process, and then joining the remaining edge portions except for the bent portion. In another embodiment, as shown... Figure 1b and Figure 2b As shown, the manufacturing method employs a direct joining of the heat-conducting plate bodies 1200-1 and 1200-2, which utilize two metal plate components, without a bending process.

[0077] In addition, such as Figure 3 As shown in (a) and (b), the heat dissipation mechanisms 200 and 1200 according to an embodiment of the present invention may further include: a finger protection component 60, which is configured to surround a portion of the rear side and upper side of the heat dissipation housing body 110, thereby preventing external objects (or people) from approaching the heat dissipation mechanisms 200 and 1200.

[0078] The finger protection assembly 60 may include: a rear finger protection panel 61, vertically mounted to cover the entire rear end of the heat dissipation mechanisms 200 and 1200; an upper surface finger protection panel 62, configured to connect its rear end to the upper end of the rear finger protection panel 61 and extend horizontally forward from the front end; a right finger protection panel 63, whose front end connects to the right rear end of the heat dissipation housing body 110, whose rear end connects to the right end of the rear finger protection panel 61, and is arranged to cover the rear right side of the heat dissipation housing body 110; a left finger protection panel 64, whose front end connects to the left rear end of the heat dissipation housing body 110, whose rear end connects to the left end of the rear finger protection panel 61, and is arranged to cover the rear left side of the heat dissipation housing body 110; and an upper front surface finger protection panel 65, arranged to cover the area between the front end of the upper surface finger protection panel 62 and the upper front end of the heat dissipation housing body 110.

[0079] Here, the right finger protection panel 63 and the left finger protection panel 64 may include an upper side protection panel disposed on the upper side based on the clamping bracket 5 (described later) and a lower side protection panel disposed on the lower side based on the clamping bracket 5.

[0080] Additionally, the finger protection assembly 60 may also include: protective mounting rods 66, 67, and 68, which provide predetermined threaded fastening holes (not marked in the attached drawings) for threaded engagement at various corner locations, while also reinforcing the rigidity of the corner locations.

[0081] Here, the rear finger protection panel 61 to the front finger protection panel 65 mentioned above can be equipped with plastic material for the purpose of reducing the weight of the overall antenna device 100, and the protective mounting rods 66, 67, and 68 mentioned above can be equipped with aluminum extrusion rods to enhance rigidity.

[0082] The protective mounting rods 66, 67, and 68 may include: a front protective mounting rod 66, disposed between the upper surface finger protection panel 62 and the upper front surface finger protection panel 65, to provide multiple screw fastening holes; a rear protective mounting rod 67, disposed between the upper surface finger protection panel 62 and the rear finger protection panel 61, to provide multiple screw fastening holes; and a lower protective mounting rod 68, disposed at the lower end of the rear finger protection panel 61, and having multiple screw fastening holes.

[0083] Furthermore, the finger protection component 60 requires air (external air) to flow into the external space in order to exchange heat with the heat dissipation mechanisms 200 and 1200 installed inside it, so it can form multiple ventilation holes (not marked in the attached drawings) in a mesh (or grid) shape.

[0084] like Figure 3As shown, the finger protection component 60, implemented with the configuration described above, can be arranged in a manner that surrounds all but the lower ends of the heat dissipation mechanisms 200, 1200, which are attached to the back of the heat dissipation housing body 110.

[0085] Additionally, clamping brackets 5 for guiding the installation of a support rod (not shown) may be provided at the left and right ends of the heat dissipation housing body 110, surrounding the outer side of the rear finger protection panel 61 in the configuration of the aforementioned finger protection assembly 60.

[0086] As described above, the clamping bracket 5 not only facilitates the installation of the support rod, but also functions as a handle that allows on-site personnel to grip and move the antenna device 100. Furthermore, handle holes 6 with perforations can be formed at the left and right ends for easy gripping.

[0087] The following is for reference Figure 1a , Figure 2a and Figures 4 to 8 A detailed description of a heat dissipation mechanism 200 according to an embodiment of the present invention will be provided, referring to... Figures 9 to 11 A heat dissipation mechanism 1200 according to another embodiment of the present invention will be described in detail.

[0088] Figure 4 It is shown Figure 1a and Figure 2a The diagram shown is a perspective view illustrating the manufacturing process of a heat dissipation mechanism according to an embodiment of the present invention. Figure 5 This is a plan view showing the heat-conducting plate body in the structure of a heat dissipation mechanism according to an embodiment of the present invention. Figure 6 yes Figure 1a and Figure 2a The diagram shows a perspective view and a partially enlarged plan view of a heat dissipation mechanism according to an embodiment of the present invention. Figure 7 yes Figure 6 Floor plan Figure 8 It is along Figure 7 A cross-sectional view taken from the BB line.

[0089] First, a detailed description of the heat dissipation mechanism 200 according to an embodiment of the present invention is as follows.

[0090] That is, such as Figure 1a and Figure 2a As shown, a plurality of heat dissipation mechanisms 200 according to an embodiment of the present invention can be arranged on the back of the heat dissipation housing body 110 in an upwardly inclined manner, facing the left and right ends respectively.

[0091] In addition, according to the embodiments of the present invention, multiple heat dissipation mechanisms 200 may be provided, and all of them are formed in a rectangular shape with the same specifications that are formed in the same length direction. The fixed heat dissipation fins 200F-1 and 200F-2 may be arranged on the back part of the heat dissipation housing body 110 that is not occupied by the heat dissipation mechanism 200.

[0092] Here, as Figure 1a and Figure 2a As shown, the fixed heat dissipation fins 200F-1 and 200F-2 include: an upper fixed heat dissipation fin 200F-1, which is arranged on the upper side of the back of the heat dissipation housing body 110 that is not occupied by the heat dissipation mechanism 200 according to an embodiment of the present invention; and a lower fixed heat dissipation fin 200F-2, which is arranged on the lower left and right sides of the back of the heat dissipation housing body 110 that is not occupied by the heat dissipation mechanism 200 according to an embodiment of the present invention.

[0093] It should be noted in advance that, unlike the heat dissipation mechanism 200 according to an embodiment of the present invention, the upper fixed heat dissipation fins 200F-1 and the lower fixed heat dissipation fins 200F-2 are configured to transfer heat without filling with refrigerant and based on the thermal conductivity of the metal material itself.

[0094] However, as Figure 1a and Figure 2a As shown, the fixed heat dissipation fins 200F-1 and 200F-2 do not need to be separately arranged on the top and bottom. Similar to the heat dissipation mechanism 1200 according to another embodiment of the present invention, the fixed heat dissipation fins 200F can also be provided only on the lower part not occupied by the heat dissipation mechanism 1200.

[0095] In addition, such as Figure 1a and Figure 2a As shown, a pressing portion 150 may be formed on the back side of the heat dissipation housing body 110 for pressing in a plurality of heat dissipation mechanisms 200 according to an embodiment of the present invention.

[0096] As described above, according to an embodiment of the present invention, the heat dissipation mechanism 200 is arranged obliquely upward toward the left and right ends with the center (refer to reference numeral 170) as the center. Multiple pressing parts 150 may also be provided, and they may be arranged in a manner that forms a "V" shape with the center (refer to reference numeral 170) as the reference.

[0097] That is, such as Figure 1a and Figure 2a As shown, according to an embodiment of the present invention, the heat dissipation mechanism 200 can be pressed into and attached to a plurality of press-in portions 150 formed on the back side of the heat dissipation housing body 110 by a press-in insertion (forced insertion) method.

[0098] At this time, although not shown, it is preferable that the press-in part 150 is pressed in after being treated with thermal epoxy resin to improve heat transfer efficiency.

[0099] Here, the press-in portion 150 may be arranged through one or more of the rearwardly recessed and protruding heat coupling surfaces (not shown) to accommodate the heat-generating surface of the heat-generating element 140 on the inner side of the back side of the heat sink housing body 110.

[0100] like Figures 4 to 8 As shown, a heat dissipation mechanism 200 according to an embodiment of the present invention includes: heat-conducting plate bodies 200-1 and 200-2, having a refrigerant flow space 205, providing a space for the refrigerant to circulate in a gas-liquid manner within a space that is filled with refrigerant and closed, so that the refrigerant releases heat during phase change.

[0101] Here, the heat-conducting plate bodies 200-1 and 200-2 are single metal plate components that can be formed in a predetermined manner to create a refrigerant flow space 205.

[0102] In particular, according to an embodiment of the present invention, the heat dissipation mechanism 200 can directly form at least the first refrigerant flow path 210 described later in a refrigerant flow space filled with refrigerant and in which the refrigerant flows through a refrigerant flow space in a predetermined manner by means of a bending process.

[0103] That is, the first refrigerant flow path 210, as a part of the single metal plate component that is shaped by bending in the predetermined manner, is formed to be separated only by a gap distance based on the material thickness of the metal plate component, for the heating element 140 or the pressing part 150 equipped with the heating element 140, so that the liquid phase refrigerant in the refrigerant is filled.

[0104] More specifically, the heat dissipation mechanism 200 according to an embodiment of the present invention can be manufactured by bending a single heat-conducting plate body 200-1, 200-2 with reference to a predetermined arbitrary reference line T described later (bending process (S20)) and then joining it (joining process (S40)) to form a sealed refrigerant flow space 205 inside.

[0105] However, the heat dissipation mechanism according to the present invention is not necessarily limited to the bending method of the above-described embodiment 200.

[0106] That is, as described above, by joining two separate metal plate components in a joining manner (joining process (S40)), it is also possible to manufacture a heat dissipation mechanism 1200 according to another embodiment of the present invention, which forms a sealed refrigerant flow space 1205 inside. This will be described in more detail later.

[0107] Here, the refrigerant flow space 205 may include a first refrigerant flow path 210 as described above, which is located on the lower side relative to the direction of gravity.

[0108] The first refrigerant flow path 210, as a part whose shape is deformed by the bending process (bending process (S20)), can be defined as a refrigerant filling and flow space that is separated from the pressing part 150 equipped with a heating element (heating body) by a distance based on the material thickness of the metal plate component, so that the refrigerant is filled with liquid refrigerant.

[0109] Specifically, the separation distance refers to the distance between the first refrigerant flow path 210 and the pressurization section 150 equipped with the heating element, and the separation distance may be the material thickness of the metal plate component.

[0110] However, according to an embodiment of the present invention, the first refrigerant flow path 210 in the heat dissipation mechanism 200 is defined as follows: the first refrigerant flow path 210 includes a common technical structure as an evaporation region, which is one end in the width direction from the heat-generating body 140, which is the object of heat dissipation, to the heat-generating plate body 200-1, 200-2 to receive heat.

[0111] Furthermore, in a heat dissipation mechanism 200 according to an embodiment of the present invention, the refrigerant flow space 205 may also include a plurality of second refrigerant flow paths 220 that guide the flow of liquid refrigerant toward the first refrigerant flow path 210 side.

[0112] Here, as the part equipped with the first refrigerant flow path 210, when the part formed by the bending (bending process) is defined as the evaporation region where the liquid phase refrigerant in the refrigerant evaporates, and the remaining part outside the evaporation region is defined as the condensation region, the second refrigerant flow path 220 can be equipped in the condensation region.

[0113] In this case, the second refrigerant flow path 220 is formed in multiple condensation areas other than the first refrigerant flow path 210, and serves as a flow path from the other end of the heat-conducting plate body 200-1, 200-2 in the width direction to the liquid phase refrigerant in the refrigerant that has condensed from the gaseous state to the liquid state, which can flow to the side of the first refrigerant flow path 210 by means of surface tension or gravity.

[0114] More specifically, if the gaseous refrigerant (gas phase refrigerant) condenses into a liquid refrigerant (liquid phase refrigerant) through a heat exchange process with the outside air in the condensation region, then the volume of the second refrigerant flow path 220 in its original position within the refrigerant flow space 205 where condensation occurs gradually increases. When flowing in the direction of gravity, it provides a flow path in a way that supplies a uniform amount of liquid phase refrigerant to the side of the first refrigerant flow path 210.

[0115] In particular, as described below, the second refrigerant flow path 220 can be defined as a network of inclined guides 215 where, when the liquid refrigerant condensed in the condensation region flows toward the first refrigerant flow path 210, surface tension can be used to suppress the dispersed flow toward the side of the second refrigerant flow path 220, which is its own flow path. That is, since the flow space of the multiple inclined guides 215 is smaller than the flow space of the second refrigerant flow path 220, surface tension comes into play, thereby suppressing the flow toward the side of the adjacent second refrigerant flow path 220.

[0116] Furthermore, the multiple second refrigerant flow paths 220 can be defined as being between multiple inclined guides 215 that symmetrically protrude from opposite sides of the refrigerant flow space of the heat-conducting plate bodies 200-1 and 200-2.

[0117] More specifically, the multiple second refrigerant flow paths 220 are defined as the spaces between multiple inclined guides 215 formed on the same side of the same heat-conducting plate body (200-1 or 200-2) in the heat-conducting plate bodies 200-1 and 200-2, respectively. This is different from the concept of the third refrigerant flow path 230, which is defined as the spaces between multiple inclined guides 215 that protrude from each other in the direction of decreasing thickness of the refrigerant flow space 205 side of the heat-conducting plate bodies 200-1 and 200-2 as described later.

[0118] Reference Figure 4 (a) According to an embodiment of the present invention, the heat dissipation mechanism 200 can simultaneously form the first refrigerant flow path 210 and the second refrigerant flow path 220, as well as the plurality of tilting guides 215 described below, by means of a heat-conducting plate body 200-1, 200-2 made of a single component using a predetermined thermally conductive material, through a stamping process (S10) described later.

[0119] At this time, the width of the heat-conducting plate bodies 200-1 and 200-2 in the left-right direction is less than Figure 4 In the case of a rectangle with a length in the vertical direction in the diagram, any baseline T is arranged to cross the center of the left and right ends in the vertical direction, and can be used for the bending process described later (see reference). Figure 4 The basis of (b) and (c)).

[0120] Reference Figure 4 (b) and (c) can be bent by bending jigs or the like, not shown, so that the heat-conducting plate 200-1 on the left side and the heat-conducting plate 200-2 on the right side, with any reference line T as a reference, come into contact with each other.

[0121] At this time, in addition to the first refrigerant flow path 210 and the second refrigerant flow path 220, a third refrigerant flow path 230 may also be formed according to the embodiment, and the joining process (S40) described later (see) Figure 3 The multiple strength reinforcements 240 required by (d) can be formed in a manner in which they face each other and are in surface contact.

[0122] Reference Figure 4 (d) If one side of the heat-conducting plate 200-1 and the other side of the heat-conducting plate body 200-1 and 200-2 are in surface contact with each other, they are joined together along their edge ends using a predetermined joining method. Then, each of the multiple strength-reinforcing parts 240 that are in surface contact with each other can be joined together using a predetermined joining method.

[0123] At this time, one end and the other end of the first refrigerant flow path 210 formed by the bending process (S20) can be connected to the outside of the refrigerant flow space 205, and the remaining parts (heat dissipation plate part 203) can be sealed together to completely block the refrigerant flow space from the outside.

[0124] To be more detailed, such as Figure 5 As shown, according to an embodiment of the present invention, the heat dissipation mechanism 200 uses an arbitrary reference line T, defined as a straight line in the vertical direction, as a reference. The heat-conducting plate bodies 200-1 and 200-2 may include: a heat-conducting plate 200-1 on one side, forming the left end before the bending process (S20); and a heat-conducting plate 200-2 on the other side, forming the right end before the bending process (S20). Here, the heat-conducting plate 200-1 on one side and the heat-conducting plate 200-2 on the other side can be understood as the heat-conducting plate bodies 200-1 and 200-2 before the bending process (S20).

[0125] However, the heat-conducting plate bodies 200-1 and 200-2 can be redefined as the configuration after the bending process (S20) described later.

[0126] For example, the heat-conducting plate bodies 200-1 and 200-2, as parts formed by the bending process (S20) and joining process (S40) described later, may include: a press-in end 201, and a middle portion formed on the back side of the heat dissipation housing body 110, which is the object of heat dissipation (see reference). Figure 2a The press-in portion 150, which is inclined upward to the left and right respectively, is press-fitted in with reference numeral 170 as the center; and the heat dissipation plate portion 203, which performs heat dissipation according to the phase change of the refrigerant by means of the edge ends of the heat-conducting plate bodies 200-1 and 200-2 other than the press-in end 201.

[0127] However, the heat sink portion 203, as a portion other than the aforementioned press-in end 201, is preferably defined as all areas that perform heat dissipation after heat exchange with the refrigerant filled inside.

[0128] Here, the heat sink portion 203 may have a plurality of strength reinforcement portions 240 protruding from the inner surface of one side heat conduction plate 200-1 and the inner surface of the other side heat conduction plate 200-2, which are separated along the thickness direction, and protruding towards the refrigerant flow space.

[0129] Furthermore, as described below, the multiple strength-enhancing portions 240 are formed simultaneously with the second refrigerant flow path 220, the third refrigerant flow path 230, and the multiple inclined guides 215 through a stamping process. After the bending process (S20) and the joining process (S40), when viewed from the outside, they can be understood as being formed by recessing from the outside of the heat sink portion 203 inward.

[0130] If the first refrigerant flow path 210 can be defined as a flow path that performs the following function: the refrigerant located on the lower side with the direction of gravity as the reference, and the refrigerant (liquid phase refrigerant) which mainly changes to liquid in the refrigerant flow space, flows downward along the direction of gravity and flows, then while capturing the liquid refrigerant, the liquid phase refrigerant is uniformly moved and dispersed throughout the entire evaporation region where it changes to the gas phase by the heat transferred from the heating element 140 of the heat dissipation housing body 110.

[0131] At this point, the uniform movement and dispersion of the liquid refrigerant in the function of the first refrigerant flow path 210 can refer to the concept of moving the liquid refrigerant, at least in a direction different from the direction of gravity, through the absorber 300 (described later). This will be explained in more detail in the section on the absorber 300.

[0132] The absorber 300, described later, is inserted inside the first refrigerant flow path 210, thereby promoting the capture and dispersion of the liquid refrigerant and its movement in a direction different from the direction of gravity.

[0133] Here, after the bending process (S20) described above, the first refrigerant flow path 210 can be formed symmetrically with respect to each other along the thickness direction of the refrigerant flow space with any reference line T as a reference.

[0134] As mentioned above, such as Figure 5 and Figure 6 As shown, the heat-conducting plate bodies 200-1 and 200-2 can be bent with reference to any reference line T on one side of the heat-conducting plate 200-1 and the other side of the heat-conducting plate 200-2, and can form a first refrigerant flow path 210 inside and a press-in end 201 outside that is combined with the press-in portion 150 formed on the back of the heat dissipation housing body 110 which is the object of heat dissipation.

[0135] Furthermore, as defined above, the heat-conducting plate bodies 200-1 and 200-2 may also include a heat dissipation plate portion 203, which is defined as the remaining portion other than the press-in end 201.

[0136] After the bending process (S20), the edges of the heat sink 203 are joined together in a predetermined manner to seal the refrigerant flow space 205.

[0137] Here, the predetermined joining method can be either welding or jointing. Preferably, laser welding can be used in the welding method. However, laser welding is not mandatory; any joining method is acceptable as long as it provides a seal sufficient to prevent leakage of the refrigerant filled inside.

[0138] In addition, such as Figure 6 As shown, the end of the press-in end 201 inserted into the press-in part 150 can be formed into a semi-circular arc-shaped cross section with a radius of R1.

[0139] The outer surface of the press-in end 201, which is formed in the shape described above, can be inserted and installed in a press-in manner after the press-in part 150 is treated with thermal epoxy resin.

[0140] Furthermore, when the pressing end 201 is inserted into the pressing part 150, at least a portion of the first refrigerant flow path 210 can flow into the inner side of the front end of the pressing part 150.

[0141] In addition, the second refrigerant flow path 220 can perform the following function: the refrigerant that has changed phase to gaseous state (gas phase refrigerant) flows towards the heat sink 203 side and exchanges heat with the outside air, and then condenses again into liquid phase refrigerant (liquid phase refrigerant), naturally flows to the first refrigerant flow path 210 side.

[0142] To be more detailed, such as Figures 4 to 8 As shown, the second refrigerant flow path 220 is provided in the condensation region formed at a location other than the first refrigerant flow path 210, and can be defined as the space between a plurality of inclined guides 215 that guide the flow of liquid refrigerant from the gas phase to the liquid phase to the evaporation region.

[0143] Here, as Figure 5 As shown, the plurality of inclined guides 215 defining the second refrigerant flow path 220 can be configured to protrude from the inner surfaces of one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 toward the refrigerant flow space 205 after the bending process (S20) described later.

[0144] The multiple inclined guides 215 can be configured in a straight line that slopes downward toward the first refrigerant flow path 210 in the direction of gravity. Therefore, the liquid refrigerant condensed on the heat sink portion 203 side can naturally condense and flow toward the first refrigerant flow path 210 side between the multiple downwardly inclined guides 215. By minimizing the interval of the gas-liquid circulation cycle corresponding to the phase change between the liquid and gaseous refrigerants, the phase change rate can be increased.

[0145] Here, multiple second refrigerant flow paths 220 or multiple inclined guides 215 can be arranged so that adjacent second refrigerant flow paths 220 or inclined guides 215 are arranged parallel to each other. The second refrigerant flow paths 220, in which liquid refrigerant condenses in a wider condensation region that is larger than the evaporation region generally defined by the first refrigerant flow path 210, are arranged closely and uniformly in parallel, or the flow of liquid refrigerant can be dispersed by the inclined guides 215, thereby providing the advantage of heat dissipation with uniform heat dissipation performance throughout the condensation region.

[0146] Furthermore, multiple inclined guides 215 are respectively formed on one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2, and each front end protruding toward the refrigerant flow space 205 can be formed in a form that is not joined together and is separated from each other in the refrigerant flow space 205.

[0147] As described above, since the second refrigerant flow path 220 performs the function of guiding the flow of liquid refrigerant in the direction of gravity, preferably, the second refrigerant flow path 220 has a thickness that allows the flow to naturally form in the direction of gravity without stopping the flow due to surface tension, an inherent property of liquids. Furthermore, the second refrigerant flow path 220 can be configured to suppress dispersed flow towards adjacent second refrigerant flow paths 220 due to surface tension or gravity after the liquid refrigerant has condensed to a predetermined size or larger.

[0148] Furthermore, at least one of one end and the other end of the plurality of second refrigerant flow paths 220 or the plurality of inclined guides 215 is connected to the first refrigerant flow path 210, and the end connected to the first refrigerant flow path 210 is located on the lower side relative to the direction of gravity.

[0149] Furthermore, the plurality of second refrigerant flow paths 220 or the plurality of inclined guides 215 may be configured such that at least one of one end and the other end is connected to the first refrigerant flow path 210, and the connection between one end and the other end is a straight line.

[0150] As described above, the distance between the first refrigerant flow path 210 (i.e., one end) that receives heat closest to the heating element and is the outer end (i.e., the other end) of the plurality of second refrigerant flow paths 220 that actively condense through heat exchange with the outside air is very short, and is formed in an optimal shape that minimizes the overlap length (flow resistance length) between the liquid phase refrigerant flow path and the gas phase refrigerant flow path through the straight shape of the second refrigerant flow path 220 itself.

[0151] In addition, as described above, the plurality of inclined guides 215 can be defined as a second refrigerant flow path 220 between the respective inclined guides 215 as a flow path for guiding the flow of liquid refrigerant in the direction of gravity.

[0152] Here, the second refrigerant flow path 220, defined as the adjacent gap space of the plurality of inclined guides 215, can be a refrigerant flow path that extends upwardly at an angle from the first refrigerant flow path 210 corresponding to the reference line T toward the end side in the width direction of the heat sink body 200-1, 200-2, respectively. This is so that the liquid refrigerant liquefied on the heat sink portion 203 side can easily move toward the first refrigerant flow path 210 side having the absorber 300 due to its own weight.

[0153] In addition, such as Figures 5 to 8 As shown, the heat dissipation mechanism 200 according to an embodiment of the present invention may further include a third refrigerant flow path 230.

[0154] Here, after the bending and joining processes are completed, the heat-conducting plate bodies 200-1 and 200-2 are joined together with a portion of one surface of one side of the heat-conducting plate 200-1 and a portion of one surface of the other side of the heat-conducting plate 200-2, with any reference line T as the reference, to form a refrigerant flow space 205. The refrigerant flow space 205 can be combined with the joining process (S40) to form a first refrigerant flow path 210, a second refrigerant flow path 220, and a third refrigerant flow path 230 as additional according to the embodiment.

[0155] The second refrigerant flow path 220 is formed on one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 respectively, and the third refrigerant flow path 230 can be defined as the space between the inclined guide 215 formed on one side heat-conducting plate 200-1 and the inclined guide 215 formed on the other side heat-conducting plate 200-2, which is the opposite of the definition of being formed between a plurality of adjacent inclined guides 215.

[0156] The third refrigerant flow path 230 serves to provide a gas flow path, allowing the refrigerant filling the refrigerant flow space 205 to easily diffuse and flow throughout the heat sink portion 203 after it undergoes phase transformation into a gaseous refrigerant in the evaporation region, which is the first refrigerant flow path 210. The gaseous refrigerant evaporated in the first refrigerant flow path 210, which is the evaporation region, moves towards the heat sink portion 203 and is smoothly and uniformly dispersed through the third refrigerant flow path 230, thereby performing heat dissipation and condensation.

[0157] For example, while the liquid refrigerant flows naturally through the space between the inclined guides 215 adjacent to the second refrigerant flow path 220, the gaseous refrigerant flows actively through the third refrigerant flow path 230, which is a space not occupied by the liquid refrigerant.

[0158] However, this does not mean that the liquid refrigerant is completely separated from the gaseous refrigerant through the third refrigerant flow path 230 and is not occupied. Preferably, it should be understood that the gaseous refrigerant flows more actively through the third refrigerant flow path 230.

[0159] That is, the phase change of the refrigerant is not formed by the complete separation of the liquid phase refrigerant and the gas phase refrigerant, so it is difficult to define accurately. However, in general, the second refrigerant flow path 220 is relatively large in the thickness direction, so it becomes the main flow path of the liquid phase refrigerant, and the third refrigerant flow path 230 can be the main flow path of the gas phase refrigerant.

[0160] In addition, such as Figures 4 to 8 As shown, the heat dissipation mechanism 200 of an embodiment of the present invention may further include: a plurality of strength reinforcing parts 240, formed in at least one of the heat-conducting plate 200-1 on one side and the heat-conducting plate 200-2 on the other side, and protruding a predetermined length from the inner surface of the heat-conducting plate 200-1 on one side and the heat-conducting plate 200-2 on the other side toward the refrigerant flow space 205 and formed in a manner opposite to each other.

[0161] Multiple strength reinforcements 240 are typically formed on at least one of the planar heat-conducting plates 200-1 on one side and heat-conducting plates 200-2 on the other side, which can enhance strength and prevent sagging or pressing due to external pressure.

[0162] Here, the front ends of the plurality of reinforcing portions 240, after being bent according to the bending process (S20), can be formed to protrude further into the refrigerant flow space 205 than the front ends of the plurality of inclined guides 215. In this case, the amount by which the front ends of the plurality of reinforcing portions 240 protrude towards the refrigerant flow space 205 is preferably such that, at least during the joining process (S40) following the bending process (S20), the opposing portions of one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 protrude to the extent that they can be joined together by a predetermined joining method. However, the plurality of reinforcing portions 240 do not necessarily have to be in surface contact with each other after bending; they can also be spaced apart within the refrigerant flow space as shown by the inclined guides 215 described above.

[0163] In addition, the heat dissipation mechanism 200 according to an embodiment of the present invention may further include: an absorber 300, which absorbs the liquid phase refrigerant in the state of the refrigerant guided by the second refrigerant flow path 220 and then uniformly disperses it to the first refrigerant flow path 210.

[0164] Here, the absorber 300 is a concept that includes a wicking element having a wicking structure provided inside a conventional vapor chamber, but it is not limited to this. It can be a concept that captures and transfers liquid refrigerant on the first refrigerant flow path 210, which is arranged at an inclination relative to the direction of gravity, thereby maximizing heat dissipation performance by overcoming the limitations of heat conduction material in heat dissipation fins that are formed in the conventional type of heat dissipation fins.

[0165] In addition, in the absorber 300, the closer to the pressure end 201, the easier it is for the heat transferred by the heating element 140 to make the phase change of the liquid refrigerant to the gaseous refrigerant more active. Preferably, it is installed as close as possible to the pressure end 201.

[0166] However, the absorber 300 does not necessarily have to be installed only close to the side of the pressurization end 201; it can also be installed in a way that it is evenly distributed throughout the entire evaporation area where the refrigerant can evaporate.

[0167] However, in the case of the heat dissipation mechanism 200 according to an embodiment of the present invention, after bending the heat-conducting plate bodies 200-1 and 200-2 equipped with a single component, the portions corresponding to the edge ends of the heat dissipation plate portion 203 are joined together, and an absorber 300 is provided in the portion through the openings at both ends of the first refrigerant flow path 210 side. For reasons of manufacturing method, the evaporation area of ​​the refrigerant can be limited to the first refrigerant flow path 210.

[0168] Here, the absorbent 300 may include one of a nonwoven fabric forming multiple pores (a liquid-absorbing core structure) and a nonwoven fabric combined with a braid made of copper wire.

[0169] That is, the absorber 300 can be made of nonwoven fabric made of fibrous material. In this case, the nonwoven fabric material itself is a very soft material, and when the liquid refrigerant is absorbed, it may be difficult to maintain its shape in the vertical direction due to the weight of the absorbed liquid refrigerant. Therefore, by maintaining the shape of the nonwoven fabric including a braid made of copper wire, it can be used to stably fix the nonwoven fabric, which is provided as the absorber 300, in the first refrigerant flow path 210 and prevent it from flowing.

[0170] And, as Figure 5 As shown, a heat dissipation mechanism 200 according to an embodiment of the present invention includes: a plurality of absorber fixing guides 250, which can be formed together with the first refrigerant flow path 210 to the third refrigerant flow path 230 and a plurality of inclined guides 215 or a plurality of strength reinforcing parts 240 during the stamping process (S10).

[0171] If a non-woven absorber 300 is used to absorb the liquid refrigerant, there is a concern that the multiple absorber fixing guides 250 may sag in the direction of gravity. To prevent this, they are formed to protrude toward the refrigerant flow space 205. When one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 are bent by the bending process (S20), they can press down on the absorber 250 and fix the absorber 250 stably.

[0172] Furthermore, the multiple absorber fixing guides 250 pressing the outer surface of the absorber 300 made of non-woven fabric can simultaneously perform the function of ensuring space for the flow of gaseous refrigerant (gas phase refrigerant) evaporating in the first refrigerant flow path 210.

[0173] As described above, an absorber 300 is provided inside the first refrigerant flow path 210. After the liquid refrigerant liquefied from the heat sink 203 side moves towards the part near the heating element 140 by the absorption force (or capillary force) of the absorber 300, the gaseous refrigerant that undergoes a phase change by the heat transferred from the heating element 140 can move back towards the heat sink 203 side.

[0174] The gaseous refrigerant that moves to the heat sink section 203 side is smoothly and evenly dispersed throughout the heat sink section 203 through the third refrigerant flow path 230 and performs heat dissipation while being condensed. The condensed liquid refrigerant can then easily move again along the second refrigerant flow path 220, which is relatively larger in the thickness direction, to the first refrigerant flow path 210, which is the direction of its own weight.

[0175] The heat generated from the heating element 140 is preferentially transferred to the first refrigerant flow path 210 side where the absorber 300 is provided. Most of the refrigerant stored in the first refrigerant flow path 210 side with the absorber 300 is in a liquid state. After changing to a gaseous state by the heat transferred from the heating element 140, it preferably flows through the third refrigerant flow path 230 to the heat dissipation plate portion 203 of the heat dissipation plate body 200-1, 200-2 and performs heat dissipation.

[0176] Furthermore, recent antenna devices employing Massive Multiple Input Multiple Output (MMIMO) technology are typically manufactured to be longer in the vertical length direction than in the width direction, and to utilize a minimum number of heat dissipation mechanisms 200 to cover the heat generated by the multiple heat-generating elements 140 spaced apart in the vertical direction, they are manufactured to be as long as possible in the vertical length direction.

[0177] However, when the heat-conducting plate bodies 1200-1 and 1200-2 are formed with a longer length along one side (e.g., the direction of gravity), the length of the first refrigerant flow path 1210 in the direction of gravity can only become longer. It is difficult to draw out and disperse sufficient liquid refrigerant from the lower side to the upper end part in the direction of gravity by relying solely on the absorption force of the absorber 300 itself. Furthermore, since the absorption rate of the liquid refrigerant along the direction of gravity is different, the heat dissipation performance may also be uneven depending on the position.

[0178] To address the uneven heat dissipation performance mentioned above, as described later... Figure 11 As shown, the heat dissipation mechanism 200 according to an embodiment of the present invention may further include: an auxiliary absorber 301, which is arranged in a portion of a plurality of inclined guides 215 forming a second refrigerant flow path 220.

[0179] The auxiliary absorber 301 performs the function of easily guiding the liquid refrigerant to be captured in the absorber 300 which is arranged longer along the length direction, relative to the upper end of the absorber 300 located on the upper side in the direction of gravity.

[0180] That is, such as Figure 11 As shown, after capturing the liquid refrigerant that condenses and falls from the heat dissipation plate portion 1203 located approximately above the direction of gravity, it is supplied to the upper end of the absorber 300. By dispersing and lifting the liquid refrigerant from the location where the liquid refrigerant is supplied upwards in the direction of gravity, it can perform the function of supplementing the heat dissipation performance of the parts of the existing absorber 300 with low absorption rate.

[0181] Furthermore, as the high-temperature gaseous refrigerant evaporates downwards in the direction of gravity and moves to the upper part of the refrigerant flow space, it may be difficult to eliminate the heat at the upper end of the refrigerant flow space due to the lack of sufficient condensation space (condensation area). The auxiliary absorber 301 performs the function of continuously supplying a portion of the liquid refrigerant flowing from the upper side to the lower side of the refrigerant flow space to the first refrigerant flow path 1210 side corresponding to the upper end side of the absorber 300, thereby achieving uniform heat dissipation overall.

[0182] However, for ease of understanding, Figure 11 The auxiliary absorber 301 shown is a single unit. Of course, considering the size of the heat dissipation mechanism 200 in the length direction according to an embodiment of the present invention, multiple auxiliary absorbers 301 can be provided at predetermined distances between the upper and lower sides in the direction of gravity.

[0183] Figure 9 This is a perspective view illustrating a heat dissipation mechanism according to another embodiment of the present invention. Figure 10 yes Figure 9 Decomposed 3D diagram, Figure 11 yes Figure 9 A sectional perspective view (a), a partial enlarged view (b), a sectional view of the part (c), and a partial enlarged view (d).

[0184] So far, reference Figure 1a and Figure 2a and Figures 4 to 8 The invention is described in detail primarily in an embodiment of a heat dissipation mechanism 200 according to an embodiment of the present invention, which is a manufacturing method in which a refrigerant flow space 205 is formed by a bending process (S20) followed by a joining process (S40).

[0185] However, the manufacturing method of the heat dissipation mechanism of the present invention is not limited to the above-described bending process (S20), as follows: Figure 1b and Figure 2b and Figures 9 to 11 As shown, a heat dissipation mechanism 1200 according to another embodiment is proposed and described by joining two separate metal plate components in a joint manner to form a refrigerant flow space 1205 including a first refrigerant flow path 1210 and a second refrigerant flow path 1220.

[0186] In a heat dissipation mechanism 1200 according to another embodiment of the present invention, such as Figures 9 to 11As shown, the heat-conducting plate bodies 1200-1 and 1200-2 can be formed by joining two separate metal plate components to form a refrigerant flow space 1205, and can include a heat-conducting plate 1200-1 forming one side of the refrigerant flow space 1205 in the thickness direction after joining, and a heat-conducting plate 1200-2 forming the other side of the refrigerant flow space 1205 in the thickness direction after joining.

[0187] Here, the first refrigerant flow path 1210 and the second refrigerant flow path 1220 can be formed symmetrically with reference to the mating surfaces of the heat-conducting plate 1200-1 on one side and the heat-conducting plate 1200-2 on the other side.

[0188] The mating surface of one side heat-conducting plate 1200-1 and the other side heat-conducting plate 1200-2 can be defined as the edge end of the area that can be mated, including the press-in end 1201 corresponding to the evaporation region and the heat dissipation plate portion 1203 corresponding to the condensation region.

[0189] That is, in the case of the heat dissipation mechanism 200 according to an embodiment of the present invention, the part joined by the joining process (S40) described later is the edge end of the heat dissipation plate part 203 other than the press-in end 201 side of the part formed by the bending process (S20). It should be noted that this part is different from the joining part of the heat dissipation mechanism 1200 according to another embodiment of the present invention, which joins two separate metal plate parts and seals them.

[0190] In addition, such as Figure 1b and Figure 2b As shown, according to another embodiment of the present invention, a heat dissipation mechanism 1200 is provided on a press-in portion 150 that is arranged elongatedly on the back side of the heat dissipation housing body 110 in a vertical manner. Therefore, the press-in end portion 1201 corresponding to the front end portion and the outer end portion of the heat dissipation plate portion 1203 corresponding to the rear end portion can be parallel to each other.

[0191] And, as Figure 9 As shown, the heat dissipation mechanism 1200 according to another embodiment of the present invention may further include: an auxiliary absorber 301 for improving the absorption rate of the liquid refrigerant in the absorber 300.

[0192] Here, similar to the heat dissipation mechanism 200 according to an embodiment of the present invention described above, the auxiliary absorber 301, in addition to performing the basic function of increasing the absorption rate of the absorber 300 itself, further, as shown in the heat dissipation mechanism 1200 according to another embodiment of the present invention, when the heat dissipation mechanism 1200 extends further upward than the upper end side of the heat dissipation housing body 110 to cover the upper end portion of the heat dissipation housing body 110, the liquid refrigerant condensed on the heat dissipation plate portion 1203 side corresponding to the upper part side of the heat dissipation housing body 110 can be easily captured to the upper end side of the absorber 300 and absorbed.

[0193] Figure 12 This is a perspective view and a partially enlarged view of the vacuuming section in the structure of the heat dissipation mechanism according to an embodiment of the present invention. Figure 13 This is a cross-sectional view showing the vacuuming process of the vacuuming section in the structure of the heat dissipation mechanism according to an embodiment of the present invention. Figure 14 yes Figure 13 Partial sectional 3D view.

[0194] like Figures 12 to 14 As shown, the heat dissipation mechanisms 200 and 1200 according to an embodiment of the present invention include: a vacuuming section 2000, equipped with a ventilation hole 1200-3 formed in one of the heat-conducting plates 200-1 and 1200-1 on one side and the heat-conducting plates 200-2 and 1200-2 on the other side, for creating a vacuum in the refrigerant flow spaces 205 and 1205 before or after filling the refrigerant into the refrigerant flow spaces 205 and 1205.

[0195] The vacuum unit 2000 can be understood as an additional structure equipped for adjusting the internal pressure by ventilating the air inside the heat-conducting plate bodies 200-1, 200-2, 1200-1, and 1200-2 that form refrigerant flow spaces 205 and 1205, as described later in the vacuuming process.

[0196] Here, the vacuum section 2000 may include: a ventilation pipe 2100, which is snapped from the inside to the outside of the ventilation hole 1200-3 and protrudes outward by a predetermined length; and a welding auxiliary ring 2200, which is clamped on the outer peripheral surface of the ventilation pipe 2100 for welding and fixing.

[0197] The ventilation duct 2100 is equipped with a hollow tube shape and is connected to a suction mechanism (not shown) to provide a channel for ventilation through the hollow.

[0198] In addition, because the thickness of the heat-conducting plates 200-1 and 1200-1 on one side and the heat-conducting plates 200-2 and 1200-2 on the other side is very thin, it is difficult to directly weld the ventilation hole 1200-3 itself, thus providing a place for solder to be placed in the shielding solder section 2300 described later.

[0199] Conversely, when the thickness of the heat-conducting plates 200-1 and 1200-1 on one side and 200-2 and 1200-2 on the other side is large, the thickness alone is sufficient to fix the ventilation pipe 2100, and the welding auxiliary ring 2200 can be eliminated from the necessary structure.

[0200] However, according to the embodiments of the present invention, the heat dissipation mechanisms 200 and 1200 can remove the commonly used aluminum (Al) material from the material of the metal plate components constituting the heat conduction plate bodies 200-1, 200-2, 1200-2. As mentioned above, the welding auxiliary ring 2200 can be considered as an essential component when its thickness is limited to the use of stainless steel (SUS) material with an elongation that can be manufactured to be very thin.

[0201] For reference, although aluminum is a metal material with excellent thermal conductivity, it has the problem of limited refrigerant capacity in the refrigerant flow spaces 205 and 1205.

[0202] For example, if the heat-conducting plate body is made of aluminum metal plate components, and water (including natural water, distilled water or ultrapure water) is used as a refrigerant to fill the refrigerant flow space 1205, there is a problem that a predetermined chemical reaction will occur, which will generate hydrogen gas by contact with water.

[0203] Therefore, according to embodiments of the present invention, the heat dissipation mechanisms 200 and 1200 are manufactured using metal plate components made of SUS material capable of using water as a refrigerant to manufacture heat-conducting plate bodies 200-1, 200-2, 1200-2, and 1200-2. Thus, in order to facilitate smooth installation during the vacuum process (SA) of the aforementioned ventilation duct 2100, a welding auxiliary ring 2200 may be necessary.

[0204] Furthermore, when the material of the heat-conducting plate bodies 200-1, 200-2, 1200-2, and 1200-2 is limited to SUS, as described above, when the press-in end 201 is inserted into the press-in portion 150 formed on the back side of the heat sink housing body 110, it has the advantage that at least a portion of the first refrigerant flow path 210 can flow into the inner side of the front end of the press-in portion 150.

[0205] As described above, when the heat-conducting plate bodies 200-1, 200-2, 1200-2, and 1200-2 are manufactured using SUS material, the elongation directly affected during processing is excellent. With the first refrigerant flow paths 210 and 1210, which trap the refrigerant (liquid refrigerant) that performs actual heat conduction, being configured as close as possible to the heating element 140, even without utilizing aluminum material, which has relatively excellent thermal conductivity, it has the advantage of heat dissipation performance that fully overcomes the relative disadvantage of its thermal conductivity.

[0206] For reference, pure aluminum has a much better elongation rate than SUS material. However, when aluminum is manufactured as an alloy to ensure material strength, its machinability is reduced. SUS material can be processed into a thinner thickness than the 200-1, 200-2, 1200-1, and 1200-2 heat-conducting plate bodies made of aluminum alloy.

[0207] As described above, when manufacturing thin heat-conducting plate bodies 200-1, 200-2, 1200-1, and 1200-2 using SUS material, a welding auxiliary ring 2200 is required as a necessary structure to assist in the welding of the aforementioned ventilation pipe 2100.

[0208] Here, as Figure 13 and Figure 14 As shown, the ventilation duct 2100 includes: a duct body 2101 having a hollow duct shape 2100S; and a snap-fit ​​stepped portion 1203 located in the refrigerant flow space 1205 in the duct body 2101, and having an outer perimeter that snaps into the edge portion of the ventilation hole 1200-3.

[0209] As described above, the length of the ventilation duct 2100 is approximately greater than the thickness of the refrigerant flow space 1205. Therefore, prior to the joining process (S40) described later, a heat-conducting plate (equivalent to) with ventilation holes 1200-3 is pre-formed... Figure 13 and Figure 14 The ventilation hole 1200-3 is passed through the inner side of the heat-conducting plate 200-1, 1200-1 on one side and protrudes outward by a predetermined length. The snap-fit ​​step portion 1203 can be configured to snap onto the edge end of the ventilation hole 1200-3 at a position corresponding to the inner side of the refrigerant flow space 1205.

[0210] Afterwards, after clamping the aforementioned welding auxiliary ring 2200 on the outer peripheral surface of the pipe body 2101 protruding to the outside of the ventilation hole 1200-3, the ventilation process of the pipe body 2101 using the ventilation pipe 2100 can be performed by the suction mechanism (SA-20).

[0211] In particular, such as Figure 13 and Figure 14As shown, the welding auxiliary ring 2200 can be tightly fixed to the outer side of one of the heat-conducting plates 200-1 and 1200-1 on one side and the heat-conducting plates 200-2 and 1200-2 on the other side, which have ventilation holes 1200-3.

[0212] In addition, such as Figure 13 (b) and Figure 14 As shown in (b), the vacuuming section 2000 may further include a shielding solder section 2300, which is welded to shield the hollow 2100S of the tube body 2101 after the tube body 2101 is cut in a manner that matches the outer end of the welding auxiliary ring 2200.

[0213] Preferably, the shielding solder section 2300 is welded in such a way that it completely covers the outer end of the welding auxiliary ring 2200 and the hollow 2100S of the tube body 2101. This is to prevent the ventilation tube 2100 from separating and detaching from the inside of the ventilation hole 1200-3 after installation.

[0214] Figure 15 This is a perspective view and a partially enlarged cross-sectional view of a vacuuming section showing another implementation example of the structure of a heat dissipation mechanism according to an embodiment of the present invention.

[0215] Reference Figures 12 to 14 The vacuum section 2000 described herein pre-connects the ventilation holes 1200-3 to the inner side of the heat-conducting plates 200-1 and 1200-1, which have ventilation holes 1200-3, and protrudes outward by a predetermined length before the bonding process. The snap-fit ​​step section 1203 is configured to snap onto the edge end of the ventilation hole 1200-3 at a position corresponding to the inner side of the refrigerant flow space 1205.

[0216] This is to increase the fixing force based on the welding filler process (SA-40) described later by additionally clamping the welding auxiliary ring 2200 to the ventilation pipe 2100, but it is not necessary to equip the welding auxiliary ring 2200 as described above.

[0217] That is, such as Figure 15 As shown, the vacuum section 2000 can be configured such that the welding reinforcement section 2103' corresponding to the welding auxiliary ring 2200 is integrally formed with the tube body 2101, and their joining directions are different.

[0218] To be more detailed, such as Figure 15 As shown, the vacuum section 2000 may include: a ventilation pipe 2100, which is snapped inward from the outside of the ventilation hole 1200-3 and protrudes outward by a predetermined length. The ventilation pipe 2100 may include: a pipe body 2101, which has a hollow pipe shape; and a welded reinforcing part 2103', which is formed by protruding in a manner where the outer diameter is relatively larger than that of the pipe body 2101, and is formed as a whole.

[0219] Here, the outer diameter of the welded reinforcement 2103' is relatively larger than the outer diameter of the tube body 2101. Therefore, when the tube body 2101 is installed from the outside to the inside through the ventilation hole 1200-3, it can be snapped onto the outer edge of the ventilation hole 1200-3.

[0220] At this time, a space for welding by the fixing solder portion 2301 (described later) can be formed between the weld reinforcement portion 2103' and a portion of the outer edge of the ventilation hole 1200-3. For this purpose, an inclined tapered portion 2104 can be formed in the weld reinforcement portion 2103' adjacent to the ventilation hole 1200-3 to form a space between the outer edge of the ventilation hole 1200-3 where welding repair material can be applied.

[0221] That is, such as Figure 15 As shown, the vacuuming section 2000 may include: a shielding solder section 2300, which is welded with a welding repair material after the tube body 2101 is cut to match the outer end of the welding reinforcement section 2103', so as to shield the hollow of the tube body 2101; and a fixing solder section 2301, which is welded with a welding repair material to fix the welding reinforcement section 2103' and the outer edge of the ventilation hole 1200-3.

[0222] According to the modified example described above, the vacuum section 2000 can be installed from the outside even after the bonding process of the heat-conducting plate 200-1 on one side and the heat-conducting plate 200-2 on the other side, thus simplifying the installation process, and has the advantage of being able to be stably fixed by means of the shielding solder section 2300 and the fixing solder section 2301.

[0223] However, the vacuum section 2000 according to the modified example can also be formed in any way. Even after being fixed by the solder fixing process (SA-30) to the ventilation hole 1200-3 formed in one of the heat-conducting plates 1200-1 on one side and 1200-2 on the other side, a snap-fit ​​end 2105 can be formed to prevent arbitrary detachment (separation) to the outside.

[0224] According to the modified example, the snap-fit ​​end 2105 of the vacuum section 2000 not only prevents arbitrary detachment to the outside, but also, when the welding repair material forming the fixed welding section 2301 melts, the welding repair material melts between the welding reinforcement section 2103' and the ventilation hole 1200-3 to further increase the joint area, thereby also performing the function of strengthening rigidity.

[0225] Figure 16 This is a flowchart illustrating a method for manufacturing a heat dissipation mechanism according to an embodiment of the present invention. Figure 17 It is shown Figure 16 A detailed flowchart of the vacuum ablation (SA) process. Figure 18It is shown Figure 16 A detailed flowchart of the remaining process (SB).

[0226] The manufacturing method of the heat dissipation mechanism according to an embodiment of the present invention includes, in sequence, a stamping process (S10), a joining process (S40), and a refrigerant filling process (S50).

[0227] First, the main description of the heat dissipation mechanism 200 according to an embodiment of the present invention, which further includes a bending process (S20), is as follows.

[0228] The manufacturing method of the heat dissipation mechanism 200 according to an embodiment of the present invention includes: a stamping process (S10) to press together the heat-conducting plate bodies 200-1 and 200-2, which are thermally conductive materials as single components, so that the first refrigerant flow path 210, the second refrigerant flow path 220 and the third refrigerant flow path 230 are respectively processed by recessing to a predetermined depth.

[0229] like Figure 4 As shown, the stamping process (S10) can be defined as a process of manufacturing a single heat-conducting plate body 200-1, 200-2 with the same specifications and dimensions in such a way that the first refrigerant flow path 210 to the third refrigerant flow path 230 and the multiple strength reinforcements 240 are symmetrically formed when they are bent together.

[0230] Additionally, a method for manufacturing a heat dissipation mechanism 200 according to an embodiment of the present invention may include: a bending process (S20), after a stamping process (S10), using a reference line T (not shown) as a reference for a first refrigerant flow path 210, folding a heat-conducting plate 200-1 on one side of the width direction and a heat-conducting plate 200-2 on the other side of the width direction using a bending jig; and a joining process (S40), after the bending process (S20), joining the edge ends corresponding to the heat dissipation plate portions 203 of the heat-conducting plate 200-1 and the heat-conducting plate 200-2, the second refrigerant flow path 220, and a plurality of strength reinforcing portions 240 formed in the third refrigerant flow path 230 together.

[0231] Furthermore, the manufacturing method of the heat dissipation mechanism 200 according to an embodiment of the present invention may further include: an absorber setting process (S30), wherein, prior to the bonding process (S40), an absorber 300 forming a capillary force of liquid refrigerant is set at a position corresponding to the first refrigerant flow path 210 near the press-in end 201.

[0232] Here, the absorber setting process (S30) is a process performed during the execution of the bending process (S20), and can be defined as the process of inserting the set absorber 300 into the partially formed first refrigerant flow path 210 before completing the bending process (S20).

[0233] That is, after the absorber 300 is configured in a manner corresponding to the portion of the first refrigerant flow path 210 formed before bending one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 in a manner with an arbitrary reference line T as a reference during the bending process (S20), it can additionally be configured to be stably fixed to the portion corresponding to the first refrigerant flow path 210 by completing the bending process (S20) and by means of a plurality of absorber fixing guides 250.

[0234] Subsequently, when the edge ends of one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 are joined by the joining process (S40) as described above, the two ends of the length direction of one end and the other end of the press-in end 201 constituting the first refrigerant flow path 210 are in an open state. After one end of the opening is filled for the vacuuming process (SA) to be performed later, and after the refrigerant is filled by the refrigerant filling process (S50) to be performed, as a detailed process of the vacuuming process (SA) to be performed later, a welding filling process (SA-40) can be performed to cover the other end of the opening that is not filled by the filling operation, thereby preventing internal refrigerant leakage.

[0235] Furthermore, the manufacturing method of the heat dissipation mechanism 200 according to an embodiment of the present invention may further include: a refrigerant filling process (S50), after the joining process (S40), filling refrigerant through one end or the other end (i.e., one of the two ends of the opening) in the length direction of the first refrigerant flow path 210; and a heat dissipation mechanism fastening process (S60), after the refrigerant filling process (S50), pressing the heat dissipation housing body 110 into the press-in portion 150 in a press-in manner.

[0236] The refrigerant filling process (S50) can be achieved by one of the openings formed at one end and the other end (i.e., both ends) along the length of the first refrigerant flow path 210. After the refrigerant is filled, it is completely sealed by the welding and sealing process (SA-40) described later, thereby preventing refrigerant leakage.

[0237] Furthermore, although not shown in the accompanying drawings, the method of heat dissipation mechanism 1200 according to another embodiment of the present invention may differ from the manufacturing method of heat dissipation mechanism 200 and the like according to an embodiment of the present invention, which includes the above-described bending process (S20), in the following ways.

[0238] That is, the manufacturing method of the heat dissipation mechanism 1200 according to another embodiment of the present invention may include: a stamping process (S10) in which two separate metal plate components are pressed together to form refrigerant flow spaces including a first refrigerant flow path 1210 and a second refrigerant flow path 1220 at a predetermined depth; a joining process (S40) in which, after the stamping process (S10), the edges of the heat-conducting plate bodies 1200-1 and 1200-2 equipped with the two separate metal plate components are joined together to simultaneously form refrigerant flow spaces 1205 corresponding to the first refrigerant flow path 1210 and the second refrigerant flow path 1220; and a refrigerant filling process (S50) in which refrigerant is filled into the refrigerant flow spaces.

[0239] According to an embodiment of the present invention, a method for manufacturing a heat dissipation mechanism 200 utilizes a single metal plate component to perform a stamping process (S10) to form a refrigerant flow space 205 including a first refrigerant flow path 210 and a second refrigerant flow path 220, and forms edge ends other than the pressed end 201 side by a bending process (S20), and then manufactures them in a joinable state by a subsequent joining process (S40).

[0240] In contrast, according to another embodiment of the present invention, after the two separate metal plate components are formed together with their edge ends as their outer shape by a stamping process (S10) to form portions corresponding to the first refrigerant flow path 1210 and the second refrigerant flow path 1220, the edge ends of the two separate metal plate components can be directly joined by a joining process (S40).

[0241] Of course, in the manufacturing method of the heat dissipation mechanism 1200 according to another embodiment of the present invention, it is obvious that the absorber setting process (S30) of setting absorber 300 or auxiliary absorber 301 can also be performed before the bonding process (S40).

[0242] Furthermore, in the case where the heat dissipation mechanism 1200 according to another embodiment of the present invention includes a plurality of strength reinforcements 1240, the joining process (S40) should be interpreted as the following concept: a process that includes joining the edge ends of two separate metal plate components in a predetermined manner, while simultaneously joining the plurality of strength reinforcements 1240 together.

[0243] However, the manufacturing method of the heat dissipation mechanism 1200 according to another embodiment of the present invention may further include: a vacuuming process (SA), which evacuates the refrigerant flow space 205, 1205 by means of a vacuuming section 2000 provided on one of the heat-conducting plates 200-1, 1200-1 on one side and one of the heat-conducting plates 200-2, 1200-2 on the other side.

[0244] Here, the cleaning process can be achieved by sequentially immersing the heat dissipation mechanisms 200, 200A, and 200B according to an embodiment of the present invention in a deposition tank, an ultrasonic tank, a rinsing tank, and a steam degreasing tank, and can be defined as a final drying process to remove moisture.

[0245] Vacuuming (SA) is a process that typically involves either evacuating the interior of a device operated by vacuuming, filling it with refrigerant, then heating and evaporating the refrigerant before evacuating it again (heating-type vacuuming), or filling the refrigerant, temporarily freezing (solidifying) it, and then performing vacuuming (freezing-type vacuuming).

[0246] For reference, in the vacuuming process of filling (injecting) refrigerant after vacuuming, which is the former method, the vacuum level changes during the filling (injection) of refrigerant. If a high vacuum is formed first and then the refrigerant is filled, it becomes a low vacuum state. In terms of low cost, this process is mainly suitable for mass production and manufacturing of low-priced products where price takes precedence over quality.

[0247] Furthermore, the latter method, which involves filling (injecting) the liquid refrigerant and then freezing it, followed by a vacuuming process, specifically involves filling and freezing the liquid refrigerant after the first vacuuming, and then performing a second vacuuming. Although this method is more complex than the former, it has the advantages of faster reaction speed, minimizing NCG, and improving the Qmax of high-vacuum products. Moreover, the freezing process of the liquid refrigerant can reduce the capacity of the vacuum equipment and increase the vacuum exhaust speed, making it suitable primarily for small-batch production and the manufacture of high-priced products.

[0248] Despite the differences in specific vacuuming methods as described above, the vacuuming process (SA) may include: a vacuuming section setting process (SA-10), in which a vacuuming section 2000 is set in the ventilation holes 1200-3; a ventilation process (SA-20), in which the refrigerant flow spaces 205, 1205 are vacuumed using the ventilation pipe 2100 provided in the ventilation holes 1200-3; and a welding and filling process (SA-40), in which a portion of the ventilation pipe 2100 is cut after the ventilation process (SA-20), and then the hollow portion 2100S of the ventilation pipe 2100 is welded.

[0249] Here, in the vacuum section setting process (SA-10), before the joining process (S40), the ventilation pipe 2100 is pre-attached to the inner edge end of the ventilation hole 1200-3 and protrudes outward by a predetermined length, and a welding auxiliary ring 2200 is clamped on the outer peripheral surface of the ventilation pipe 2100 protruding outward of the ventilation hole 1200-3.

[0250] In addition, the vacuuming process (SA) may also include: a ventilation process (SA-20) in which the refrigerant flow space 205 is vacuumed by using the ventilation pipe 2100 provided in the ventilation holes 1200-3; and a welding and filling process (SA-40) in which the hollow of the ventilation pipe 2100 is welded after the ventilation process (SA-20) and after a portion of the ventilation pipe 2100 is cut.

[0251] However, the vacuuming process (SA) described above is interpreted as utilizing... Figures 11 to 13 The process of the vacuum unit 2000 shown (i.e., the ventilation duct indicated by reference numeral "2100") is based on, as follows: Figure 14 The process of the vacuum section 2000 (i.e., the ventilation duct indicated by reference numeral "2100") in the modified example shown should be understood as the following different process.

[0252] More specifically, after the joining process (S40), the ventilation pipe 2100 is installed from the outside to the inside in a manner that snaps onto the outer edge of the aforementioned ventilation hole 1200-3. This can be interpreted as the process of the ventilation pipe 2100 snapping onto the outer peripheral surface of the ventilation hole 1200-3. This is because the pipe body 2101 of the ventilation pipe 2100 can be installed relative to the ventilation hole 1200-3 from the outside of one side of the heat-conducting plate 200-1, 1200-1.

[0253] Additionally, the vacuuming process (SA) of the vacuuming section 2000 according to the modified example may include: a ventilation process (SA-20), in which the refrigerant flow space 205 is vacuumed by using the ventilation pipe 2100 provided in the ventilation hole 1200-3; a solder fixing process (SA-30), in which, after the ventilation process (SA-20), the weld reinforcement 2103' integrally formed on the ventilation pipe 2100 is welded to the outer peripheral surface of the ventilation hole 1200-3 by means of a welding repair material; and a weld filling process (SA-40), in which, after the ventilation process (SA-20), a portion of the ventilation pipe 2100 is cut and then the hollow part of the ventilation pipe 2100 is welded.

[0254] Furthermore, the manufacturing method of the heat dissipation mechanisms 200 and 1200 according to embodiments of the present invention may further include at least one of the following processes: a leak test process (S70), used to test whether the refrigerant leaks after the welding and filling process (SA-40) of the vacuum process (SA); a performance inspection process (S80), which finally tests the performance of the heat dissipation mechanisms 200 and 1200 of the present invention; and a reliability test process (S90), which tests the reliability of the heat dissipation mechanisms 200 and 1200 of the present invention.

[0255] Additionally, although not shown, the manufacturing method of the heat dissipation mechanism according to an embodiment of the present invention may further include: a coating process (not shown), wherein a surface of the heat-conducting plate bodies 200-1, 200-2, 1200-1, 1200-2 of the refrigerant flow space 205, 1205 which is filled by the refrigerant flow process (S50) before the bending process (S20) (or absorber setting process (S30)) is coated with a hydrophobic coating material.

[0256] Here, hydrophobic coating materials are defined as coating layers, but depending on the type of refrigerant or the refrigerant flow path, hydrophilic coating materials may of course be used.

[0257] According to the heat dissipation mechanisms 200 and 1200 of the present invention having the above-described configuration, heat transfer and heat dissipation are achieved through the phase change of the refrigerant actively filled inside. Since the material limitations of the heat dissipation fins of existing heat dissipation devices can be overcome and higher heat dissipation performance can be achieved, it has the advantage of significantly improving the performance of the antenna device 100 or similar electronic devices.

[0258] Furthermore, when performing the vacuuming process (SA) for adjusting the internal pressure of the refrigerant flow spaces 205 and 1205, the vacuuming unit 2000 is equipped only in one of the heat-conducting plates 200-1 and 1200-1 on one side and the heat-conducting plates 200-2 and 1200-2 on the other side. Therefore, it can also provide the following advantages: it is possible to produce high-quality products without concerns about refrigerant leakage.

[0259] The embodiments of the heat dissipation mechanisms 200 and 1200 and their manufacturing method according to the present invention have been described in detail above with reference to the accompanying drawings. However, the embodiments of the present invention are not limited to the above-described embodiments, and it is natural that those skilled in the art to which this invention pertains can make various modifications and implement the invention within the equivalent scope. Therefore, the true scope of the present invention should be determined by the claims.

Claims

1. A heat dissipation mechanism, characterized in that, include: The heat-conducting plate body has a refrigerant flow space of predetermined thickness inside, so as to release heat through one surface and another surface. The heat-conducting plate body includes: The vacuuming section is configured to be perpendicularly connected to the refrigerant flow space relative to one of the one surface and the other surface, and is used to vacuum the refrigerant flow space before or after filling the refrigerant flow space with refrigerant.

2. The heat dissipation mechanism according to claim 1, characterized in that, The refrigerant flow space of the heat-conducting plate body is the space between one side of the heat-conducting plate forming one surface and the other side of the heat-conducting plate forming the other surface, and is formed as a closed, empty space for gas-liquid circulation, so that the refrigerant releases heat while filling and undergoing phase change. The vacuuming section is provided in a ventilation hole formed in one of the heat-conducting plates on one side and the other side.

3. The heat dissipation mechanism according to claim 2, characterized in that, The vacuuming unit includes: A ventilation duct, snapped in from the inside to the outside of the ventilation hole, and protruding outward by a predetermined length; and A welding auxiliary ring is clamped onto the outer circumferential surface of the ventilation pipe for welding and fixing.

4. The heat dissipation mechanism according to claim 3, characterized in that, The ventilation duct includes: The main body of the tube has a hollow tube shape; and The snap-fit ​​stepped portion is located in the refrigerant flow space within the tube body and has an outer diameter larger than the outer periphery of the tube body.

5. The heat dissipation mechanism according to claim 4, characterized in that, The outer diameter of the snap-fit ​​step is formed to fit the inner edge of the ventilation hole.

6. The heat dissipation mechanism according to claim 4, characterized in that, The welding auxiliary ring is fixed tightly to the outer edge of one of the heat-conducting plates on one side and the other side, where the ventilation holes are formed.

7. The heat dissipation mechanism according to claim 4, characterized in that, The vacuuming unit also includes: The shielding solder section is used to weld and fix the tube body to the ventilation hole.

8. The heat dissipation mechanism according to claim 7, characterized in that, The shielding solder section is a welding repair material that is welded to the hollow part of the tube body after the tube body is cut in a manner that matches the outer end of the welding auxiliary ring.

9. The heat dissipation mechanism according to claim 7, characterized in that, The shielding solder part is a welding repair material that is welded in a manner that completely covers the outer end of the welding auxiliary ring and is cut in a way that matches the outer end of the welding auxiliary ring.

10. The heat dissipation mechanism according to claim 2, characterized in that, The vacuuming unit includes: The ventilation duct is snapped inward from the outside of the ventilation hole and protrudes outward by a predetermined length. The ventilation duct includes: The main body of the tube has a hollow tube shape; and The welded reinforcement is integrally formed with the main body of the pipe and is snapped onto the outer edge of the ventilation hole.

11. The heat dissipation mechanism according to claim 10, characterized in that, An inclined tapered portion is formed in the welded reinforcement portion adjacent to the ventilation hole to form a space between the weld reinforcement portion and the outer edge of the ventilation hole, which is suitable for applying welding repair material.

12. The heat dissipation mechanism according to claim 10, characterized in that, When the pipe body is installed from the outside to the inside through the ventilation hole, the welded reinforcement has an outer diameter that snaps into the outer edge of the ventilation hole.

13. The heat dissipation mechanism according to claim 11, characterized in that, The vacuuming unit includes: The shielding solder section is formed by welding a soldering material onto the tube body after it has been cut to match the outer end of the welded reinforcement section, thereby shielding the hollow interior of the tube body; and The fixing welding part is welded by welding repair material to fix the welded reinforcement part to the outer edge of the ventilation hole.

14. The heat dissipation mechanism according to claim 13, characterized in that, The fixed solder portion is formed by applying a soldering material between the tapered portions of the weld reinforcement portion.

15. A method for manufacturing a heat dissipation mechanism, characterized in that, include: The sheet metal process of the heat-conducting plate body involves processing one side heat-conducting plate and the other side heat-conducting plate that form a refrigerant flow space inside, and integrally forming a ventilation hole for filling refrigerant or vacuuming in one of the one side heat-conducting plate and the other side heat-conducting plate. The joining process involves joining the heat-conducting plate and the heat-conducting plate on one side, which are constructed using a single metal plate component or two metal plate components, together after the sheet metal process of the heat-conducting plate body, to form the refrigerant flow space. as well as The vacuuming process, following the bonding process, evacuates the refrigerant flow space. The vacuuming process includes: During the vacuuming process, the vacuuming unit is placed in the ventilation hole.

16. The method for manufacturing the heat dissipation mechanism according to claim 15, characterized in that, Also includes: In the bending process, when the heat-conducting plate on one side and the heat-conducting plate on the other side are constructed using a single metal plate component, the single metal plate component is bent before the joining process so that the heat-conducting plate on one side forms one side of the refrigerant flow space and the heat-conducting plate on the other side forms the other side of the refrigerant flow space.

17. The method for manufacturing the heat dissipation mechanism according to claim 15, characterized in that, The vacuuming process involves, before the joining process, pre-setting the ventilation pipe to snap onto the inner edge of the ventilation hole and protrude outward by a predetermined length, and clamping the welding auxiliary ring onto the outer circumferential surface of the ventilation pipe protruding outward from the ventilation hole.

18. The method for manufacturing the heat dissipation mechanism according to claim 17, characterized in that, The vacuuming process includes: During the ventilation process, the refrigerant flow space is evacuated by utilizing the ventilation duct provided in the ventilation hole; and The filler process involves cutting a portion of the ventilation duct after the ventilation process and then welding the hollow part of the ventilation duct.

19. The method for manufacturing the heat dissipation mechanism according to claim 15, characterized in that, The vacuum section setting process is a process after the bonding process in which a ventilation pipe is set from the outside to the inside in a manner that snaps onto the outer edge of the ventilation hole, and the ventilation pipe is set onto the outer side edge of the ventilation hole.

20. The method for manufacturing the heat dissipation mechanism according to claim 19, characterized in that, The vacuuming process includes: During the ventilation process, the refrigerant flow space is evacuated by using the ventilation pipe provided in the ventilation hole; In the solder fixing process, after the ventilation process, welding is performed between the weld reinforcement integrally formed with the ventilation duct and the outer peripheral surface of the ventilation hole using solder repair material; and The filler process involves cutting a portion of the ventilation duct after the ventilation process and then welding the hollow part of the ventilation duct.

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