Electronic control device and method for manufacturing electronic control device

Abstract

This electronic control device is provided with: a circuit board on which an electronic component can be mounted and on which a ground pattern is formed; a conductive case that houses the circuit board; and an electromagnetic wave shielding material disposed between the ground pattern of the circuit board and the housing and electrically connecting the ground pattern and the housing. The circuit board or the housing has a conductor reference surface that can be pressed by the electromagnetic wave shielding material, and a conductor protruding portion that protrudes further toward the electromagnetic wave shielding material than the conductor reference surface. The electromagnetic wave shielding material is disposed in a state of being in contact with the conductor reference surface and the conductor protrusion.

Description

Technical Field

[0001] This invention relates to an electronic control device and a method for manufacturing the electronic control device. Background Technology

[0002] In recent years, the demand for Advanced Driver Assistance Systems (ADAS) and Autonomous Driving Systems (AD) has been increasing. The high operating frequencies of semiconductor components such as CPUs (Central Processing Units) in electronic control devices used in ADAS or AD present a problem of generating electromagnetic noise. As an example of a shielding structure to reduce electromagnetic noise radiated into the external environment, Patent Document 1 discloses a structure in which a dielectric is inserted between a circuit board housing electronic components and a metal casing protecting the circuit board.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2022-173233 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] Regarding shielding structures for reducing electromagnetic noise radiation to the external environment, a structure was studied that electrically connects the grounding pattern of a circuit board housing electronic components to a metal casing containing the circuit board using an electromagnetic shielding material. When the circuit board is mounted in the casing, the electromagnetic shielding material is sandwiched between the grounding pattern of the circuit board and the casing. In this case, even if the electromagnetic shielding material is pre-formed on a specific surface of the casing, and the contact between the electromagnetic shielding material and the grounding pattern of the circuit board is made using the pressing pressure during installation, there is a risk that the contact area between the electromagnetic shielding material and the grounding pattern may not be sufficiently guaranteed. Therefore, for example, as the CPU processing speed increases and the intensity of electromagnetic noise increases, there is a possibility that the shielding performance of the electromagnetic shielding material may be insufficient.

[0008] The purpose of this invention is to provide an electronic control device that, while shielding electromagnetic noise by electrically connecting the grounding pattern of a circuit board to a conductive housing using an electromagnetic wave shielding material, can improve the shielding performance of the electromagnetic wave shielding material against electromagnetic noise.

[0009] Technical solutions to the problem

[0010] To solve the above problems, for example, the structure described in the claimed technical solution may be adopted.

[0011] This application includes various technical solutions to address the aforementioned problems. One example is an electronic control device comprising: a circuit board with a grounding pattern capable of housing electronic components; a conductive housing containing the circuit board; and an electromagnetic wave shielding material disposed between the grounding pattern of the circuit board and the housing, electrically connecting the grounding pattern to the housing. The circuit board or housing has a conductor reference surface that can be pressed by the electromagnetic wave shielding material, and a conductor protrusion that protrudes beyond the electromagnetic wave shielding material compared to the conductor reference surface. The electromagnetic wave shielding material is configured to contact the conductor reference surface and the conductor protrusion.

[0012] Invention Effects

[0013] According to the present invention, when electromagnetic wave noise is shielded by electrically connecting the grounding pattern of the circuit board to the conductive housing using an electromagnetic wave shielding material, the shielding performance of the electromagnetic wave shielding material against electromagnetic wave noise can be improved.

[0014] Other technical issues, features, and effects not described above will become clear in the following description of the embodiments. Attached Figure Description

[0015] Figure 1 This is a perspective view of the electronic control device according to the first embodiment.

[0016] Figure 2 This is a plan view of the electronic control device according to the first embodiment.

[0017] Figure 3 This is an exploded perspective view of the electronic control device according to the first embodiment.

[0018] Figure 4 This is a schematic plan view of the circuit board in the first embodiment.

[0019] Figure 5 yes Figure 2 The diagram shows the VV cross-section of the electronic control device.

[0020] Figure 6 This is an enlarged cross-sectional view showing the configuration of the circuit board, housing base, and electromagnetic wave shielding material included in the electronic control device of the first embodiment.

[0021] Figure 7 This is a diagram illustrating the manufacturing method of the electronic control device according to the first embodiment.

[0022] Figure 8 This is a perspective view showing the configuration of the electromagnetic wave shielding material and the grounding pattern in the electronic control device of the first embodiment.

[0023] Figure 9It is an enlarged cross-sectional view showing the configuration of the electronic control device including the circuit board, housing base and electromagnetic wave shielding material, which represents the comparison method.

[0024] Figure 10 This is a perspective view showing a portion of the circuit board included in the electronic control device of the second embodiment.

[0025] Figure 11 This is a front view showing a portion of the circuit board included in the electronic control device of the second embodiment.

[0026] Figure 12 This is a perspective view showing a portion of the circuit board included in the electronic control device of the third embodiment.

[0027] Figure 13 This is a front view showing a portion of the circuit board included in the electronic control device of the third embodiment.

[0028] Figure 14 This is an enlarged cross-sectional view showing the configuration of the electronic control device according to the fourth embodiment, including the circuit board, housing base, and electromagnetic wave shielding material.

[0029] Figure 15 This is an enlarged cross-sectional view showing the configuration of the circuit board, housing base, and electromagnetic wave shielding material included in the electronic control device of the fifth embodiment.

[0030] Figure 16 This is an enlarged cross-sectional view showing the configuration of the circuit board, housing base, and electromagnetic wave shielding material included in the electronic control device of the sixth embodiment.

[0031] Figure 17 This is an enlarged cross-sectional view showing the configuration of the circuit board, housing base, and electromagnetic wave shielding material included in the electronic control device of the seventh embodiment.

[0032] Figure 18 This is an enlarged cross-sectional view showing the configuration of the circuit board, housing base, and electromagnetic wave shielding material included in the electronic control device of the eighth embodiment.

[0033] Figure 19 This is an enlarged cross-sectional view showing the configuration of the circuit board, housing base, and electromagnetic wave shielding material included in the electronic control device of the ninth embodiment.

[0034] Figure 20 This is an enlarged cross-sectional view showing the configuration of the circuit board, housing base, and electromagnetic wave shielding material included in the electronic control device of the tenth embodiment.

[0035] Figure 21This is an enlarged cross-sectional view showing the configuration of the circuit board, housing base, and electromagnetic wave shielding material included in the electronic control device of the eleventh embodiment.

[0036] Figure 22 This is an enlarged cross-sectional view showing the configuration of the circuit board, housing base, and electromagnetic wave shielding material included in the electronic control device of the twelfth embodiment.

[0037] Figure 23 This is an enlarged cross-sectional view showing the configuration of the circuit board, housing base, and electromagnetic wave shielding material included in the electronic control device of the thirteenth embodiment.

[0038] Figure 24 This is an enlarged cross-sectional view showing the configuration of the circuit board, housing base, and electromagnetic wave shielding material included in the electronic control device of the fourteenth embodiment.

[0039] Figure 25 This is an enlarged cross-sectional view showing the configuration of the circuit board, housing base, and electromagnetic wave shielding material included in the electronic control device of the fifteenth embodiment.

[0040] Figure 26 This is an enlarged cross-sectional view showing the configuration of the circuit board, housing base, and electromagnetic wave shielding material included in the electronic control device of the sixteenth embodiment. Detailed Implementation

[0041] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In this specification and drawings, elements having substantially the same function or structure are labeled with the same reference numerals, and repeated descriptions are omitted. Furthermore, the following description and drawings are examples for illustrating the present invention, and omissions and simplifications are sometimes made for ease of explanation. Additionally, to facilitate understanding of the invention, the positions, sizes, shapes, extents, etc., of the constituent elements shown in the drawings may not always accurately represent their actual positions, sizes, shapes, extents, etc.

[0042] <First Implementation>

[0043] Figure 1 This is a perspective view of the electronic control device according to the first embodiment. Figure 2 This is a plan view of the electronic control device according to the first embodiment. Figure 3 This is an exploded perspective view of the electronic control device according to the first embodiment. Figure 1 and Figure 3 The connector, which will be described later, is omitted here.

[0044] like Figures 1-3 As shown, the electronic control device 10 includes a circuit board 11 on which electronic components described later are mounted. Figure 3The conductive housing 12 houses the circuit board 11. The electronic control device 10 is, for example, an in-vehicle electronic control device for ADAS or AD used in motor vehicles or similar vehicles.

[0045] The housing 12 is formed into a flat, approximately cuboid shape with a relatively small height dimension (thickness dimension). The housing 12 has an opening 13 for connector connection. The housing 12 is composed of a metal housing base 15 and a metal housing cover 16. The housing base 15 and the housing cover 16 are fastened to each other by a plurality of bolts 31.

[0046] Further details, such as Figure 3 As shown, a plurality of cover bases 30 are formed on the housing base 15. The cover bases 30 are integrally formed with the housing base 15. Each cover base 30 is provided with a screw hole 34. On the other hand, a plurality of cover fixing holes 35 are formed on the housing cover 16. Each cover fixing hole 35 is a through hole for fixing the housing cover 16 to the housing base 15. A plurality of bolts 31 engage with the screw holes 34 of the cover bases 30 through their respective corresponding cover fixing holes 35. The housing cover 16 is fixed to the housing base 15 by tightening the respective bolts 31. By fixing the housing cover 16 to the housing base 15 with bolts 31 in this way, the housing base 15 and the housing cover 16 are electrically and mechanically connected.

[0047] The housing base 15 and housing cover 16 can be made of the same metal material or different metal materials. If the housing base 15 and housing cover 16 are made of different metal materials, the housing base 15 may be made of aluminum, for example, and the housing cover 16 may be made of iron after rust prevention treatment.

[0048] In this specification, for ease of explanation, the side where the housing base 15 is disposed is sometimes referred to as the lower side, and the side where the housing cover 16 is disposed is referred to as the upper side. When the electronic control device 10 is mounted in a vehicle, the orientation of the electronic control device 10 is arbitrary. Generally, it is preferable to mount the electronic control device 10 in the vehicle with the housing base 15 facing upwards and the housing cover 16 facing downwards.

[0049] The circuit board 11 is surrounded from the top and bottom by the housing base 15 and the housing cover 16. The circuit board 11 is, for example, a printed circuit board with a glass epoxy resin substrate. The circuit board 11 is formed in a generally rectangular shape.

[0050] Figure 4 This is a schematic plan view of the circuit board in the first embodiment.

[0051] like Figure 4As shown, three electronic components 17, 18, and 19, and two connectors 21 and 22 are mounted on circuit board 11. Circuit board 11 has a circuit area 25 and a grounding pattern 26. Each electronic component 17, 18, and 19 is mounted in the circuit area 25 of circuit board 11. Each connector 21 and 22 is mounted at the end of circuit board 11.

[0052] The various electronic components 17, 18, and 19 are, for example, LSI elements that perform functions such as a CPU. LSI stands for Large Scale Integration. These electronic components 17, 18, and 19 are both heat sources and noise sources. The circuit area 25 of the circuit board 11 is also an area that houses electronic components other than LSI elements. In other words, the circuit area 25 is a component mounting area for various electronic components. Figure 4 The wiring diagrams for electronic components other than the LSI element, as well as circuit wiring for signal transmission and power supply, are omitted. Wiring can be obtained through the opening 13 of the housing 12. Figure 1 Connect the cable-side connectors (not shown) to each connector 21, 22.

[0053] A grounding pattern 26 is formed around the circuit region 25 in a manner that surrounds the circuit region 25. Preferably, the grounding pattern 26 is a pattern formed of copper. The grounding pattern 26 is formed in a ring shape that surrounds the circuit region 25.

[0054] like Figure 3 As shown, the circuit board 11 is secured to the housing base 15 by a plurality of bolts 32. The bolts 32 are provided as an example of fasteners. The structure of mounting the circuit board 11 using bolts 32 will be described in detail below.

[0055] Multiple circuit board mounts 36 are formed on the housing base 15. The circuit board mounts 36 are integrally formed with the housing base 15. Screw holes 37 are provided on the upper surface of each circuit board mount 36. On the other hand, multiple circuit board mounting holes 33 are provided on the circuit board 11. Each circuit board mounting hole 33 is a through hole for fixing the circuit board 11 to the housing base 15. Each circuit board mounting hole 33 is formed on a grounding pattern 26. In the portion where the circuit board mounting holes 33 are formed, a portion of the grounding pattern 26 is formed as a circle with a diameter slightly larger than the inner diameter of the circuit board mounting holes 33, and the circuit board mounting holes 33 are formed within this circular area.

[0056] The aforementioned bolts 32 engage with the screw holes 37 of the circuit board base 36 through their respective corresponding circuit board mounting holes 33. The circuit board 11 is fixed to the housing base 15 by tightening the bolts 32. Additionally, protrusions 38 for circuit board positioning are formed on the housing base 15. Multiple protrusions 38 are formed at appropriate positions on the housing base 15. The circuit board 11 is screwed and fixed to the housing base 15 while being positioned by the multiple protrusions 38.

[0057] Heat dissipation bosses 27, 28, and 29 are integrally formed on the housing base 15. Boss 27 is connected to electronic component 17 via thermal grease (not shown). Boss 28 is connected to electronic component 18 via thermal grease (not shown), and boss 29 is connected to electronic component 19 via thermal grease (not shown). Thus, the heat generated by each electronic component 17, 18, and 19 is transferred to the housing base 15 via the thermal grease and dissipated from the outer surface of the housing base 15.

[0058] Additionally, a shielding base 39 is formed on the housing base 15. The shielding base 39 is positioned one level lower than the circuit board base 36. The shielding base 39 is used to clamp the electromagnetic wave shielding material 40 between the grounding pattern 26 of the circuit board 11 and the housing base 15. The electromagnetic wave shielding material 40 is disposed on the grounding pattern 26 of the circuit board 11 (see reference). Figure 4 The grounding pattern 26 is electrically connected to the housing base 15 between the circuit board 11 and the housing base 15. In addition, the electromagnetic wave shielding material 40 is disposed between the grounding pattern 26 of the circuit board 11 and the shielding platform 39 of the housing base 15 in a compressed and deformed state.

[0059] The electromagnetic wave shielding material 40 is composed of a resin containing a large amount of conductive filler, i.e., a conductive adhesive. The conductive filler is, for example, a metal filler, and more preferably, a metal filler that has undergone plating treatment. The substrate of the electromagnetic wave shielding material 40 is an elastic adhesive that, upon curing, becomes a rubber elastomer. Examples of elastic adhesives include silicone and polyurethane. Specifically, the electromagnetic wave shielding material 40 is, for example, a liquid or paste-like adhesive that cures into CIPG (Cured In-Place Gasket). The electromagnetic wave shielding material 40, cured into CIPG, also possesses moderate rubber elasticity (elasticity) after curing. Therefore, the electromagnetic wave shielding material 40 has the property of compressing and deforming under external force (elastic deformation), thereby shortening the distance between the conductive fillers and reducing impedance.

[0060] Shielding base 39 follows the grounding pattern 26 of circuit board 11 (reference) Figure 4The shape is formed. Therefore, by distributing an electromagnetic wave shielding material 40 between the grounding pattern 26 of the circuit board 11 and the shielding platform 39 of the housing base 15, the grounding pattern 26 of the circuit board 11 and the housing base 15 can be electrically connected via the electromagnetic wave shielding material 40.

[0061] Figure 5 yes Figure 2 The diagram shows the VV cross-section of the electronic control device. Figure 6 This is an enlarged cross-sectional view showing the configuration of the circuit board 11, housing base 15, and electromagnetic wave shielding material 40 of the electronic control device of the first embodiment. Figure 6 The state in which the vertical positional relationship is reversed is shown. Figure 5 The electronic control device shown is section VI. Therefore, in the following description, as... Figure 6 As shown, the description will focus on the side where the circuit board 11 is mounted as the lower side (downward direction) and the side where the housing base 15 is mounted as the upper side (upward direction). This will also apply to the second embodiment described later.

[0062] like Figure 5 and Figure 6 As shown, the electromagnetic wave shielding material 40 is disposed between the grounding pattern 26 of the circuit board 11 and the shielding platform 39 of the housing base 15, as described above. Figure 6 As shown, the electromagnetic wave shielding material 40 extends along the length of the grounding pattern 26 ( Figure 8 When viewed in the Y direction, it forms a semi-circular protrusion. Figure 6 The shape of the electromagnetic wave shielding material 40 in the text refers to the cross-sectional shape of the electromagnetic wave shielding material 40. Additionally, Figure 6 The shape of the electromagnetic wave shielding material 40 in the text represents the shape of the electromagnetic wave shielding material 40 before it is compressed and deformed.

[0063] The length direction Y of grounding pattern 26 (reference) Figure 8 ) is the width direction X of the grounding pattern 26 (reference) Figure 6 The orthogonal direction of the grounding pattern 26 can be applied to both the state of the circuit board 11 as a standalone unit and the state of the circuit board 11 mounted on the housing 12. The shielding platform 39 of the housing base 15 in the housing 12 is formed along the grounding pattern 26 of the circuit board 11. Therefore, the length direction of the grounding pattern 26 can also be expressed as the length direction of the shielding platform 39 in the housing base 15. Similarly, the width direction of the grounding pattern 26 can also be expressed as the width direction of the shielding platform 39 in the housing base 15.

[0064] The length direction Y and width direction X of the grounding pattern 26 are defined on an imaginary plane orthogonal to the thickness direction (height direction) of the circuit board 11. Figure 6In the middle, the length direction of the grounding pattern 26 is parallel to... Figure 6 The direction parallel to the depth direction, the width direction X of the grounding pattern 26 is parallel to... Figure 6 The left and right directions are parallel. Additionally, as mentioned above... Figure 4 When the circuit board 11 is viewed from the front as shown, the length direction of the grounding pattern 26, which is formed parallel to the long side direction of the circuit board 11, is also parallel to the long side direction of the circuit board 11.

[0065] Here, using Figure 7 The manufacturing method of the electronic control device according to the first embodiment is described.

[0066] Manufacturing methods of electronic control devices, such as Figure 7 As shown, it includes housing manufacturing step S1, circuit board manufacturing step S2, circuit board mounting step S3, and housing cover mounting step S4.

[0067] The housing manufacturing step S1 is the step of manufacturing the housing 12. Although not shown, the housing manufacturing step S1 includes at least a housing base manufacturing step and a housing cover manufacturing step, the housing base manufacturing step being the step of manufacturing the housing base 15. In the housing base manufacturing step, the housing base 15 is manufactured, for example, by casting aluminum. The housing cover manufacturing step is the step of manufacturing the housing cover 16. In the housing cover manufacturing step, the housing cover 16 is manufactured, for example, by machining a metal sheet.

[0068] Circuit board manufacturing step S2 is the step of manufacturing circuit board 11. Although not shown, circuit board manufacturing step S2 includes at least a pattern forming step and a component mounting step. The pattern forming step is the step of forming various patterns, including signal patterns, power patterns, and ground patterns 26, on circuit board 11. The component mounting step is the step of mounting various electronic components, including electronic components 17, 18, 19 and connectors 21, 22, on circuit board 11.

[0069] Circuit board mounting step S3 is the step of mounting circuit board 11 on housing base 15. In circuit board mounting step S3, multiple bolts 32 are used to mount circuit board 11 on circuit board mount 36 of housing base 15. Thus, circuit board 11 is mounted on housing base 15.

[0070] The housing cover installation step S4 is the step of installing the housing cover 16 onto the housing base 15. In the housing cover installation step S4, the housing cover 16 is installed onto the cover base 30 of the housing base 15 using multiple bolts 31. Thus, the housing cover 16 is installed on the housing base 15. In addition, the circuit board 11 is housed inside the housing 12.

[0071] Electromagnetic wave shielding material 40 is formed on housing base 15 in the housing manufacturing step S1 described above. In this case, housing manufacturing step S1 is equivalent to the step of forming electromagnetic wave shielding material 40 on the housing (housing base 15 in this example). Electromagnetic wave shielding material 40 is provided in a state of engagement with the surface of shielding platform 39 of housing base 15. Electromagnetic wave shielding material 40 is formed to protrude toward the circuit board 11 side. Such electromagnetic wave shielding material 40 is formed in the housing manufacturing step S1 described above, for example, by the method described below. First, housing base 15 is manufactured in the housing base manufacturing step. Next, a liquid or paste-like material (conductive adhesive) containing conductive filler, which is the raw material for electromagnetic wave shielding material 40, is applied to the surface of shielding platform 39 of housing base 15 using a coating nozzle (not shown). Next, the material on shielding platform 39 is cured, for example, by moisture, heating, or ultraviolet irradiation. The method for curing the material coated on the shielding platform 39 of the housing base 15 is determined by the properties of the material used as the raw material for the electromagnetic wave shielding material 40 (moisture curing, heat curing, ultraviolet curing, etc.). As a result, the electromagnetic wave shielding material 40 is formed in a semi-circular protruding state. The electromagnetic wave shielding material 40 has rubber elasticity as described above.

[0072] The grounding pattern 26 includes a first grounding pattern portion 26a, a second grounding pattern portion 26b, and a third grounding pattern portion 26c. The first grounding pattern portion 26a, the second grounding pattern portion 26b, and the third grounding pattern portion 26c are positioned opposite the shielding platform 39 of the housing base 15. The second grounding pattern portion 26b and the third grounding pattern portion 26c are positioned adjacent to the first grounding pattern portion 26a, sandwiching the first grounding pattern portion 26a in between. Furthermore, a predetermined interval is provided between the first grounding pattern portion 26a and the second grounding pattern portion 26b, and a predetermined interval is also provided between the first grounding pattern portion 26a and the third grounding pattern portion 26c, in the width direction X of the grounding pattern 26. That is, the first grounding pattern 26a, the second grounding pattern portion 26b, and the third grounding pattern portion 26c are formed as separate independent pattern portions on the circuit board 11.

[0073] The pattern surface 41 of the first ground pattern portion 26a is arranged to be exposed to the outside. Furthermore, the pattern surface 41 of the first ground pattern portion 26a is configured to form approximately the same plane as the main surface 11a of the circuit board 11. The pattern surface 41 of the first ground pattern portion 26a corresponds to the conductor reference surface pressed by the electromagnetic wave shielding material 40. When the circuit board 11 is mounted on the housing base 15, the pressing force of the electromagnetic wave shielding material 40 on the pattern surface 41 can be obtained. Specifically, in the circuit board mounting step S3 described above, when the circuit board 11 is mounted on the circuit board pedestal 36 of the housing base 15 using multiple bolts 32, the electromagnetic wave shielding material 40 is pressed onto the pattern surface 41 by the tightening of the multiple bolts 32. In this case, the electromagnetic wave shielding material 40 is in a state where the top 40a of the electromagnetic wave shielding material 40 is pressed against the pattern surface 41 of the first ground pattern 26a. Additionally, the electromagnetic wave shielding material 40 is in a state of compression deformation due to the pressing force applied when mounting the circuit board 11 on the housing base 15 in the circuit board mounting step S3 described above. Figure 6 The image shows the state of the electromagnetic wave shielding material 40 before compression deformation.

[0074] On the other hand, a conductor protrusion 45 is formed on the second ground pattern portion 26b, and a conductor protrusion 46 is formed on the third ground pattern portion 26c. The conductor protrusion 45 is formed to protrude from the pattern surface of the second ground pattern portion 26b. The conductor protrusion 46 is formed to protrude from the pattern surface of the third ground pattern portion 26c. Each conductor protrusion 45, 46 is formed in the circuit board manufacturing step S2 described above (refer to...). Figure 7The pattern is formed on the circuit board 11. Specifically, a mask (not shown) is provided on the circuit board 11 after the pattern forming step is completed. The mask has an opening at the location where solder paste is applied. With the mask provided on the circuit board 11, the first ground pattern 26a is covered by the mask, while the second ground pattern 26b and the third ground pattern 26c are exposed to the outside through the openings of the mask. In this state, after applying a predetermined amount of solder paste to the mask, a scraper (not shown) is used to allow the solder paste to flow into the openings of the mask. At this time, solder is supplied (applied) to the second ground pattern 26b and the third ground pattern 26c, but not to the first ground pattern 26a. Afterward, after removing the mask from the circuit board 11, in the component mounting step of the circuit board manufacturing step S2, various electronic components, including electronic components 17, 18, and 19, are mounted at predetermined positions on the circuit board 11. Then, the circuit board 11 is placed in a reflow oven. Thus, various electronic components are mounted on the circuit board 11 by reflow soldering. Additionally, a conductor protrusion 45 is formed on the second ground pattern portion 26b by depositing solder, and a conductor protrusion 46 is also formed on the third ground pattern portion 26c by depositing solder. In this case, circuit board manufacturing step S2 is equivalent to the step of forming a conductor reference surface and a conductor protrusion on the circuit board 11.

[0075] By depositing solder in this way to form the conductor protrusions 45 and 46, the solder deposits can be formed simultaneously during the step of mounting various electronic components on the circuit board 11 via reflow soldering. Therefore, an additional step for forming the conductor protrusions 45 and 46 is unnecessary. Consequently, the circuit board 11 with the conductor protrusions 45 and 46 formed can be manufactured inexpensively.

[0076] Each conductor protrusion 45, 46, when viewed from the length of the grounding pattern 26, forms a semi-circular protrusion. Figure 6 The shapes of the conductor protrusions 45 and 46 represent their cross-sectional shapes. Each conductor protrusion 45 and 46 is made of a material with a higher conductivity than that of the electromagnetic wave shielding material 40. Therefore, the conductivity of each conductor protrusion 45 and 46 is higher than that of the electromagnetic wave shielding material 40. As a result, when the grounding pattern 26 is electrically connected to the housing base 15 via the electromagnetic wave shielding material 40, the impedance of the electromagnetic wave shielding portion can be reduced. This improves the electrical connection between the grounding pattern 26 and the housing base 15, thereby enhancing the shielding performance of the electromagnetic wave shielding material 40 against electromagnetic waves. Furthermore, when the conductor protrusions are made of materials other than solder, specifically metals such as copper or aluminum, the conductivity of the conductor protrusions is also higher than that of the electromagnetic wave shielding material.

[0077] Figure 8This is a perspective view showing the configuration of the electromagnetic wave shielding material and grounding pattern in the electronic control device of the first embodiment.

[0078] like Figure 8 As shown, conductor protrusions 46 are formed along the grounding pattern 26. Similarly, conductor protrusions 45 are formed along the grounding pattern 26. Therefore, the length direction of each conductor protrusion 45, 46 is the same as the length direction Y of the grounding pattern 26. In addition, the width direction of each conductor protrusion 45, 46 is the same as the width direction X of the grounding pattern 26. The conductor protrusion 45 is disposed on one side of the width direction X of the grounding pattern 26, and the conductor protrusion 46 is disposed on the other side of the width direction X of the grounding pattern 26. That is, conductor protrusions 45 and 46 are disposed in pairs on both sides of the width direction X of the grounding pattern 26. In addition, each conductor protrusion 45, 46 is formed continuously in a linear fashion with the same length as the grounding pattern 26. Similarly, the electromagnetic wave shielding material 40 is formed continuously in a linear fashion with the same length as the grounding pattern 26.

[0079] In addition, such as Figure 6 As shown, each conductor protrusion 45, 46 is formed to protrude toward the electromagnetic wave shielding material 40 side (the housing base 15 side) in the thickness direction of the circuit board 11 compared with the pattern surface 41 of the first grounding pattern 26a.

[0080] On the other hand, the electromagnetic wave shielding material 40 is configured to contact the patterned surface 41 of the grounding pattern 26 and the conductor protrusions 45, 46. The conductor protrusions 45 are offset to one side from the top of the electromagnetic wave shielding material 40. Figure 6 The side portion 40b of the electromagnetic wave shielding material 40 (on the left side) contacts the side portion 40b of the electromagnetic wave shielding material 40. The conductor protrusion 46 is offset from the top 40a of the electromagnetic wave shielding material 40 to the other side ( Figure 6 The electromagnetic wave shielding material 40 (right side) is in contact with the side portion 40c.

[0081] Therefore, for example, and like Figure 9 Compared to the structure shown in the comparison method, where the electromagnetic wave shielding material 40 formed on the housing base 15 is pressed onto the grounding pattern 26 of the circuit board 11 to electrically connect the grounding pattern 26 to the housing base 15, the following effects can be obtained.

[0082] Figure 9 In the comparison shown, only the top 40a of the electromagnetic wave shielding material 40 contacts the grounding pattern 26. Furthermore, even if the electromagnetic wave shielding material 40 is compressed and deformed due to the pressing force F generated during the mounting of the circuit board 11 on the housing base 15 in the aforementioned circuit board mounting step S3, only the area near the top 40a of the electromagnetic wave shielding material 40 contacts the grounding pattern 26. Therefore, there is a risk that the contact area of ​​the electromagnetic wave shielding material 40 relative to the grounding pattern 26 cannot be sufficiently ensured.

[0083] In contrast, in the first embodiment, such as Figure 6 As shown, the top 40a of the electromagnetic wave shielding material 40 contacts the first grounding pattern portion 26a. Furthermore, the side portion 40b of the electromagnetic wave shielding material 40 contacts the conductor protrusion 45, and the side portion 40c of the electromagnetic wave shielding material 40 contacts the conductor protrusion 46. Additionally, the electromagnetic wave shielding material 40 is contacted by the pressing pressure generated during the mounting of the circuit board 11 on the housing base 15 in the circuit board mounting step S3. Figure 6 Compared to the state shown, compression deformation. In this case, circuit board mounting step S3 is equivalent to the step of using the above-described pressing force F to compress and deform the electromagnetic wave shielding material 40 so that the electromagnetic wave shielding material 40 contacts the conductor reference surface and the conductor protrusions 45, 46.

[0084] When the electromagnetic wave shielding material 40 is compressed and deformed as described above, the contact area of ​​the electromagnetic wave shielding material 40 relative to the first grounding pattern portion 26a increases. Furthermore, when the electromagnetic wave shielding material 40 is compressed and deformed, the contact area of ​​the electromagnetic wave shielding material 40 relative to the conductor protrusion 45 on the second grounding pattern portion 26b and the contact area of ​​the electromagnetic wave shielding material 40 relative to the conductor protrusion 46 on the third grounding pattern portion 26c both increase. Therefore, by considering the conductor protrusion 45 as part of the second grounding pattern portion 26b and the conductor protrusion 46 as part of the third grounding pattern portion 26c, the contact area of ​​the electromagnetic wave shielding material 40 relative to the grounding patterns 26 (26a, 26b, 26c) can be substantially increased. In addition, the electromagnetic wave shielding material 40 is electrically connected to the first grounding pattern portion 26a, electrically connected to the second grounding pattern portion 26b via the conductor protrusion 45, and electrically connected to the third grounding pattern portion 26c via the conductor protrusion 46. Therefore, the electrical connection between the housing base 15 and the grounding pattern 26 can be improved. As a result, grounding can be improved around the circuit area 25 in the circuit board 11, thereby improving the shielding performance of the electromagnetic wave shielding material 40 against electromagnetic wave noise.

[0085] In addition, in the first embodiment, such as Figure 6 and Figure 8 As shown, a pair of conductor protrusions 45 and 46 contact the electromagnetic wave shielding material 40 from both sides of the width direction X of the grounding pattern 26. This suppresses the positional shift of the electromagnetic wave shielding material 40 in the width direction X of the grounding pattern 26.

[0086] <Second Implementation>

[0087] The electronic control device of the second embodiment has a different structure of circuit board 11 compared to the first embodiment described above.

[0088] Figure 10This is a perspective view showing a portion of the circuit board 11 of the electronic control device according to the second embodiment. Figure 11 This is a front view showing a portion of the circuit board 11 included in the electronic control device of the second embodiment. Figure 10 and Figure 11 The structure of the circuit board 11 with the portion of the electromagnetic wave shielding material 40 pressed down is shown.

[0089] like Figure 10 and Figure 11 As shown, the ground pattern 26 of the circuit board 11 includes a first ground pattern portion 26a, a second ground pattern portion 26b, and a third ground pattern portion 26c. This is the same as in the first embodiment described above. However, in the first embodiment described above, as... Figure 8 As shown, each conductor protrusion 45, 46 is formed continuously in a linear fashion with the same length as the ground pattern 26. In contrast, in the second embodiment, multiple conductor protrusions 45, 46 are formed at predetermined intervals along the longitudinal direction Y of the ground pattern 26. In other words, each conductor protrusion 45, 46 is formed in multiple segments along the longitudinal direction Y of the ground pattern 26. Such a circuit board 11 can be obtained by changing the position, size, and number of openings in the mask used for applying solder paste to the second ground pattern portion 26b and the third ground pattern portion 26c in the circuit board manufacturing step S2 described above.

[0090] Multiple conductor protrusions 45 are arranged on one side of the width direction X of the grounding pattern 26. Figure 11 (On the upper side). Multiple conductor protrusions 46 are arranged on the other side of the width direction X of the grounding pattern 26 ( Figure 11 (The lower side). In addition, the plurality of conductor protrusions 45 and the plurality of conductor protrusions 46 are arranged at the same position as each other in the longitudinal direction Y of the grounding pattern 26. Therefore, when viewed from the width direction X of the grounding pattern 26, the plurality of conductor protrusions 45 and the plurality of conductor protrusions 46 are arranged to overlap each other.

[0091] By forming the conductor protrusions 45 and 46 at predetermined intervals along the longitudinal direction Y of the grounding pattern 26, the amount of material used to construct the conductor protrusions 45 and 46 can be reduced compared to the first embodiment described above. This allows for ensuring high shielding performance at a lower cost.

[0092] <Third Implementation Method>

[0093] The electronic control device of the third embodiment differs from that of the second embodiment in the arrangement of the conductor protrusions 45 and 46 in the circuit board 11.

[0094] Figure 12This is a perspective view showing a portion of the circuit board 11 of the electronic control device according to the third embodiment. Figure 13 This is a front view showing a portion of the circuit board 11 included in the electronic control device of the third embodiment. Figure 12 and Figure 13 The structure of the circuit board 11 with the portion of the electromagnetic wave shielding material 40 pressed down is shown.

[0095] like Figure 12 and Figure 13 As shown, multiple conductor protrusions 45 and 46 are formed at predetermined intervals along the longitudinal direction Y of the grounding pattern 26. This is the same as in the second embodiment described above. However, in the third embodiment, the multiple conductor protrusions 45 and 46 are arranged at different positions along the longitudinal direction Y of the grounding pattern 26. Therefore, when viewed from the width direction X of the grounding pattern 26, the multiple conductor protrusions 45 and 46 are arranged so as not to overlap each other.

[0096] When multiple conductor protrusions 45 and multiple conductor protrusions 46 are configured in this way, the same effect as the second embodiment described above can be obtained.

[0097] <Fourth Implementation>

[0098] The electronic control device of the fourth embodiment differs in structure from that of the first grounding pattern portion 26a in the grounding pattern 26 compared to the first, second, and third embodiments described above.

[0099] Figure 14 This is an enlarged cross-sectional view showing the configuration of the circuit board 11, housing base 15, and electromagnetic wave shielding material 40 in the electronic control device of the fourth embodiment. Additionally, Figure 14 The enlarged cross-sectional view and the above Figure 6 Similarly, the state of reversing and magnifying the vertical positional relationship is shown. Figure 5 Section VI of the electronic control device is shown. This will be discussed later. Figure 15 The same applies to the attached images.

[0100] like Figure 14 As shown, the first grounding pattern portion 26a of the grounding pattern 26 has a recess 47. The recess 47 is formed in a recessed state compared to the pattern surface 41 of the first grounding pattern portion 26a. Figure 14 The shape of the recess 47 indicates the cross-sectional shape of the recess 47. The surface of the recess 47 corresponds to the conductor reference plane. The recess 47 is formed by the circuit board manufacturing step S2 described above (refer to...). Figure 7In the process of forming the pattern, a portion of the first grounding pattern 26a is formed by machining after the pattern forming step. A recess 47 is formed at the contact portion with the electromagnetic wave shielding material 40. Specifically, the recess 47 is formed at the contact portion with the top of the semi-circularly protruding electromagnetic wave shielding material 40. The recess 47 extends along the length Y direction of the grounding pattern 26 (see reference). Figure 8 The pits 47 can be formed continuously over a longer period of time. However, the pits 47 can also be formed intermittently (discontinuously) at predetermined intervals along the length Y direction of the grounding pattern 26.

[0101] When a recess 47 is formed on the first grounding pattern portion 26a, the top of the electromagnetic wave shielding material 40 is pressed into the recess 47 by the pressing force F generated when the circuit board 11 is mounted on the housing base 15. As a result, the top of the electromagnetic wave shielding material 40 deforms to fit the shape of the recess 47 due to the compression deformation of the electromagnetic wave shielding material 40. Therefore, the contact area of ​​the electromagnetic wave shielding material 40 relative to the first grounding pattern portion 26a is increased. This ensures higher shielding performance.

[0102] <Fifth Implementation>

[0103] The electronic control device of the fifth embodiment differs from that of the fourth embodiment in that the structure of the first grounding pattern portion 26a in the grounding pattern 26 is different.

[0104] Figure 15 This is an enlarged cross-sectional view showing the configuration of the circuit board 11, housing base 15, and electromagnetic wave shielding material 40 of the electronic control device of the fifth embodiment.

[0105] like Figure 15 As shown, the first grounding pattern portion 26a of the grounding pattern 26 has a recess 47. Figure 15 The shape of the first grounding pattern portion 26a in the figure represents the cross-sectional shape of the first grounding pattern portion 26a. The method of forming the recess 47 is basically the same as that in the fourth embodiment described above. The side surface 47a of the recess 47 extends from the length direction Y of the grounding pattern 26 (refer to...) Figure 8 When observed, it forms a cone-shaped inclined state. Therefore, the size of the pit 47 in the width direction X of the grounding pattern 26 gradually increases from the bottom surface of the pit 47 toward the opening of the pit 47.

[0106] When the side 47a of the recess 47 is formed into a cone shape, the top of the electromagnetic wave shielding material 40 is easily fitted into the shape of the recess 47 when the aforementioned pressing force F is applied to press the top of the electromagnetic wave shielding material 40 into the recess 47. Therefore, the contact area of ​​the electromagnetic wave shielding material 40 with respect to the first grounding pattern portion 26a can be increased, ensuring higher shielding performance.

[0107] <Sixth Implementation Method>

[0108] The electronic control device of the sixth embodiment differs in structure from that of the fourth and fifth embodiments described above in that the first grounding pattern 26a in the grounding pattern 26 has a different structure.

[0109] Figure 16 This is an enlarged cross-sectional view showing the configuration of the circuit board 11, housing base 15, and electromagnetic wave shielding material 40 in the electronic control device of the sixth embodiment.

[0110] like Figure 16 As shown, the first grounding pattern portion 26a of the grounding pattern 26 has a recess 47. Figure 16 The shape of the first grounding pattern portion 26a in the figure represents the cross-sectional shape of the first grounding pattern portion 26a. The method of forming the recess 47 is basically the same as that in the fourth embodiment described above. The recess 47 extends from the length direction Y of the grounding pattern 26 (refer to...) Figure 8 It appears that the pit 47 is formed as a semi-circular depression. That is, when viewed from the length direction Y of the grounding pattern 26, the pit 47 forms a concave shape. In this case, the concave surface formed by the pit 47 corresponds to the conductor reference surface.

[0111] When the recess 47 is formed into a semi-circular shape, the top of the electromagnetic wave shielding material 40 is easily pressed into the recess 47 with the aforementioned pressing force F, making it easy for the top of the electromagnetic wave shielding material 40 to conform to the shape of the recess 47. Therefore, the contact area of ​​the electromagnetic wave shielding material 40 with respect to the first grounding pattern portion 26a can be increased, ensuring higher shielding performance.

[0112] <Seventh Implementation>

[0113] The electronic control device of the seventh embodiment differs in structure of the conductor protrusion from those of the first, second, and third embodiments described above.

[0114] Figure 17 This is an enlarged cross-sectional view showing the configuration of the electronic control device according to the seventh embodiment, including the circuit board 11, the housing base 15, and the electromagnetic wave shielding material 40.

[0115] like Figure 17 As shown, a conductor protrusion 51 is formed on the second grounding pattern portion 26b, and a conductor protrusion 52 is formed on the third grounding pattern portion 26c. Both conductor protrusions 51 and 52 are formed of copper blocks. Figure 17 The shapes of the conductor protrusions 51 and 52 in the diagram represent the cross-sectional shapes of the conductor protrusions 51 and 52. The conductor protrusions 51 and 52 are respectively along the length Y direction of the grounding pattern 26 (reference). Figure 8The conductor protrusions 51 and 52 can be formed continuously over a relatively long period. However, the individual conductor protrusions 51 and 52 can also be formed intermittently (discontinuously) at predetermined intervals along the length Y direction of the grounding pattern 26. In other words, the individual conductor protrusions 51 and 52 can also be divided into multiple segments along the length Y direction of the grounding pattern 26.

[0116] Conductor protrusions 51 and 52 are manufactured in the circuit board manufacturing step S2 (see reference). Figure 7 In the process of forming the pattern, copper blocks are formed on the second grounding pattern portion 26b and the third grounding pattern portion 26c by soldering after the pattern forming step. Alternatively, the copper blocks are manufactured, for example, by machining before the soldering process.

[0117] Conductor protrusion 51 extends along the length Y direction of grounding pattern 26 (reference) Figure 8 The conductor protrusion 51 appears to be trapezoidal. Therefore, the side surface 51a of the conductor protrusion 51 is tapered and inclined. Consequently, the size of the conductor protrusion 51 in the width direction X of the grounding pattern 26 gradually decreases from the bottom surface of the conductor protrusion 51 towards its upper surface. The conductor protrusion 52 has the same shape as the conductor protrusion 51. Therefore, the side surface 52a of the conductor protrusion 52 is tapered and inclined.

[0118] When the side surfaces 51a and 52a of the conductor protrusions 51 and 52 are respectively formed into conical shapes, when the electromagnetic wave shielding material 40 is pressed onto the grounding pattern 26 with the aforementioned pressure, the side surfaces 40b and 40c of the electromagnetic wave shielding material 40 easily mate with the corresponding side surfaces 51a and 52a of the conductor protrusions 51 and 52. Therefore, the contact area of ​​the electromagnetic wave shielding material 40 with respect to the first grounding pattern portion 26a can be increased, ensuring higher shielding performance.

[0119] Furthermore, when the conductor protrusions 51 and 52 are formed using copper blocks, it is easier to ensure a larger height dimension (protrusion dimension) for the conductor protrusions 51 and 52 compared to when the conductor protrusions 45 and 46 are formed using the aforementioned solder deposits. Therefore, it is advantageous to increase the contact area between the electromagnetic wave shielding material 40 and each conductor protrusion 51 and 52.

[0120] <Eighth Implementation Method>

[0121] The electronic control device of the eighth embodiment differs in shape from that of the seventh embodiment described above in that the conductor protrusions 51 and 52 are different.

[0122] Figure 18 This is an enlarged cross-sectional view of the configuration of the circuit board 11, housing base 15, and electromagnetic wave shielding material 40 in the electronic control device of the eighth embodiment.

[0123] like Figure 18 As shown, a conductor protrusion 51 is formed on the second grounding pattern portion 26b, and a conductor protrusion 52 is formed on the third grounding pattern portion 26c. Both conductor protrusions 51 and 52 are formed of copper blocks. Figure 18 The shapes of the conductor protrusions 51 and 52 represent the cross-sectional shapes of the conductor protrusions 51 and 52. The method of forming the conductor protrusions 51 and 52 is basically the same as that in the seventh embodiment described above.

[0124] Conductor protrusion 51 extends along the length Y direction of grounding pattern 26 (reference) Figure 8 The conductor protrusion 51 is formed into a triangle. Therefore, the side surface 51a of the conductor protrusion 51 is formed in a tapered, inclined state. Thus, the size of the conductor protrusion 51 in the width direction X of the grounding pattern 26 gradually decreases from the bottom surface of the conductor protrusion 51 towards the upper surface of the conductor protrusion 51. The conductor protrusion 52 has the same shape as the conductor protrusion 51. Therefore, the side surface 52a of the conductor protrusion 52 is formed in a tapered, inclined state.

[0125] As described above, from the length direction Y of the grounding pattern 26 (reference) Figure 8 When the conductor protrusions 51 and 52 are formed into triangles, the same effect as the seventh embodiment described above can be obtained.

[0126] <Ninth Implementation Method>

[0127] The electronic control device of the ninth embodiment differs in structure of the grounding pattern 26 from that of the first embodiment described above.

[0128] Figure 19 This is an enlarged cross-sectional view showing the configuration of the electronic control device according to the ninth embodiment, including the circuit board 11, the housing base 15, and the electromagnetic wave shielding material 40. Figure 19 The shape of the grounding pattern 26 in the figure represents the cross-sectional shape of the grounding pattern 26.

[0129] like Figure 19 As shown, the width W1 of the grounding pattern 26 is wider than the width W2 of the electromagnetic wave shielding material 40. The width W2 of the electromagnetic wave shielding material 40 is the size of the electromagnetic wave shielding material 40 before it is compressed and deformed by the pressure F. The pressure F is as described above. A pattern recess 55 is formed in the center of the width direction X of the grounding pattern 26. The pattern recess 55 is integrally formed with the grounding pattern 26. The pattern recess 55 is formed by the above-mentioned circuit board manufacturing step S2 (refer to...). Figure 7 In the process of pattern formation, a portion of the grounding pattern 26 is formed by machining after the pattern formation step.

[0130] The pattern recess 55 is formed such that the central portion of the grounding pattern 26 in the width direction X is approximately U-shaped (concave). Therefore, the thickness of the grounding pattern 26 is smaller in the central portion than in other portions. Furthermore, the pattern recess 55 is formed continuously for a relatively long period along the length direction of the grounding pattern 26. However, the pattern recess 55 may also be formed intermittently (discontinuously) at predetermined intervals along the length direction of the grounding pattern 26. The width W3 of the pattern recess 55 is narrower than the width W2 of the electromagnetic wave shielding material 40. The width W1 of the grounding pattern 26, the width W2 of the electromagnetic wave shielding material 40, and the width W3 of the pattern recess 55 are all dimensions defined in the width direction X of the grounding pattern 26.

[0131] The upper surface (main surface) 26d of the grounding pattern 26 is arranged in pairs on both sides of the pattern recess 55 when viewed from the length direction of the grounding pattern 26. The upper surface 26d of the grounding pattern 26 forms approximately the same plane as the main surface 11a of the circuit board 11. In other words, there is almost no height difference at the boundary between the upper surface 26d of the grounding pattern 26 and the main surface 11a of the circuit board 11. The upper surface 26d of the grounding pattern 26 is arranged to protrude towards the electromagnetic wave shielding material 40 compared to the bottom surface 55a of the pattern recess 55. In this case, the bottom surface 55a of the pattern recess 55 corresponds to the conductor reference surface, and the upper surface 26d of the grounding pattern 26 corresponds to the conductor protrusion. By forming the pattern recess 55 on the grounding pattern 26 in this way, the central part of the grounding pattern 26 in the width direction X is recessed due to the presence of the pattern recess 55, and the bottom surface 55a, which serves as the conductor reference surface, and the upper surface 26d, which serves as the conductor protrusion, are formed integrally with the grounding pattern 26 (integrated structure). Thus, for example, with Figure 6 Compared to the case where the conductor protrusions 45 and 46 and the grounding pattern 26 are formed as separate parts (separate structures), the circuit board 11 can be manufactured at a lower cost.

[0132] The cross-sectional shape of the recessed portion 55 is not limited to a roughly U-shape; for example, it can also be a semi-circular shape or a roughly V-shape. Furthermore, it is preferable that the width W1 of the grounding pattern 26 is greater than the width W2 of the electromagnetic wave shielding material 40.

[0133] In the electronic control device of the ninth embodiment, when the electromagnetic wave shielding material 40 is pressed onto the grounding pattern 26 with a pressing force F, the top of the electromagnetic wave shielding material 40 contacts the bottom surface 55a of the pattern recess 55, and the side surface of the electromagnetic wave shielding material 40 contacts the upper surface 26d of the grounding pattern 26. Therefore, compared with the above... Figure 9 Compared to the comparison shown, this method increases the contact area of ​​the electromagnetic wave shielding material 40 with the grounding pattern 26, improving the electrical connection between the housing base 15 and the grounding pattern 26. Therefore, it can improve the shielding performance of the electromagnetic wave shielding material 40 against electromagnetic noise.

[0134] Furthermore, in the ninth embodiment, when the electromagnetic wave shielding material 40 is pressed onto the grounding pattern 26 with a pressing force F, the electromagnetic wave shielding material 40 is pressed into the pattern recess 55, thereby compressing and deforming the electromagnetic wave shielding material 40 in a manner that matches the shape of the pattern recess 55. This suppresses positional shift of the electromagnetic wave shielding material 40 in the width direction X of the grounding pattern 26.

[0135] <Tenth Implementation>

[0136] The electronic control device of the tenth embodiment differs from that of the ninth embodiment in that part of the structure of the grounding pattern 26 is different.

[0137] Figure 20 This is an enlarged cross-sectional view showing the configuration of the circuit board 11, housing base 15, and electromagnetic wave shielding material 40 of the electronic control device according to the tenth embodiment. Figure 20 The shape of the grounding pattern 26 in the figure represents the cross-sectional shape of the grounding pattern 26.

[0138] like Figure 20 As shown, the grounding pattern 26 has a pattern recess 55 at its central portion in the width direction X. In this respect, including the method of forming the pattern recess 55, it is the same as in the ninth embodiment described above. However, in the ninth embodiment, the upper surface 26d of the grounding pattern 26 forms approximately the same plane as the main surface 11a of the circuit board 11. In contrast, in the tenth embodiment, the upper surface 26d of the grounding pattern 26 is configured to protrude towards the electromagnetic wave shielding material 40 (house base 15) compared to the main surface 11a of the circuit board 11. In other words, a height difference H is generated at the boundary between the upper surface 26d of the grounding pattern 26 and the main surface 11a of the circuit board 11, and both sides of the grounding pattern 26 protrude towards the electromagnetic wave shielding material 40 by an amount equivalent to this height difference H compared to the central portion of the grounding pattern 26. Furthermore, the recess size (depth size) of the pattern recess 55 based on the upper surface 26d of the grounding pattern 26 is approximately the same as the aforementioned height difference H.

[0139] In the tenth embodiment, the same effects as in the ninth embodiment can be achieved. Furthermore, compared to the ninth embodiment, the tenth embodiment ensures a larger thickness of the grounding pattern 26, thereby reducing the resistance of the grounding pattern 26.

[0140] <Eleventh Implementation Method>

[0141] The structure of the grounding pattern 26 in the electronic control device of the eleventh embodiment is different from that in the ninth and tenth embodiments described above.

[0142] Figure 21This is an enlarged cross-sectional view showing the configuration of the circuit board 11, housing base 15, and electromagnetic wave shielding material 40 in the electronic control device of the eleventh embodiment. Figure 21 The shape of the grounding pattern 26 in the figure represents the cross-sectional shape of the grounding pattern 26.

[0143] like Figure 21 As shown, a pattern protrusion 56 is formed at the center of the width direction X of the grounding pattern 26. The pattern protrusion 56 protrudes from the center of the width direction X of the grounding pattern 26 and is integrally formed with the grounding pattern 26. The center of the width direction X of the grounding pattern 26 is the portion pressed against the top of the electromagnetic wave shielding material 40. The pattern protrusion 56 is formed by the above-mentioned circuit board manufacturing step S2 (refer to...) Figure 7 The ground pattern 26 is formed by cutting, for example, after the pattern forming step, while retaining the pattern protrusion 56. The pattern protrusion 56 is formed continuously and for a relatively long length along the length direction of the ground pattern 26. However, the pattern protrusion 56 may also be divided into multiple portions at predetermined intervals along the length direction of the ground pattern 26. The pattern protrusion 56 is formed in a convex shape, protruding towards the electromagnetic wave shielding material 40 compared to the upper surface (main surface) 26e of the ground pattern 26. The upper surface 26e (main surface) of the ground pattern 26 is arranged in pairs on both sides of the pattern protrusion 56 when viewed from the length direction of the ground pattern 26. The upper surface 26e of the ground pattern 26 forms approximately the same plane as the main surface 11a of the circuit board 11. In this case, the upper surface 26e of the ground pattern 26 corresponds to the conductor reference plane, and the pattern protrusion 56 of the ground pattern 26 corresponds to the conductor protrusion. By forming a pattern protrusion 56 on the grounding pattern 26 in this way, the central portion of the grounding pattern 26 in the width direction X protrudes due to the presence of the pattern protrusion 56, and the upper surface 26e, which serves as the conductor reference surface, and the pattern protrusion 56, which serves as the conductor protrusion, are formed integrally with the grounding pattern 26.

[0144] In the electronic control device of the eleventh embodiment, when the electromagnetic wave shielding material 40 is pressed against the grounding pattern 26 by the pressing pressure generated when the circuit board 11 is mounted on the housing base 15, the pattern protrusion 56 becomes embedded in the electromagnetic wave shielding material 40. This state, where the pattern protrusion 56 is embedded in the electromagnetic wave shielding material 40, allows the rubber-elastic electromagnetic wave shielding material 40 to be pressed into the pattern protrusion 56 and elastically deformed. Furthermore, the electromagnetic wave shielding material 40 is compressed and deformed by the aforementioned pressing pressure, thereby becoming contact not only with the pattern protrusion 56 of the grounding pattern 26, but also with the upper surface 26e of the grounding pattern 26 on both sides of the pattern protrusion 56. Therefore, compared with the above... Figure 9Compared to the comparison shown, this method increases the contact area of ​​the electromagnetic wave shielding material 40 with the grounding pattern 26, improving the electrical connection between the housing base 15 and the grounding pattern 26. Therefore, it can improve the shielding performance of the electromagnetic wave shielding material 40 against electromagnetic noise.

[0145] Furthermore, in the eleventh embodiment, when the electromagnetic wave shielding material 40 is pressed onto the grounding pattern 26 with a pressing force F, the pattern protrusion 56 sinks into the electromagnetic wave shielding material 40, thereby restricting the movement of the electromagnetic wave shielding material 40 in the width direction X of the grounding pattern 26. Therefore, it is possible to suppress the positional displacement of the electromagnetic wave shielding material 40 in the width direction X of the grounding pattern 26.

[0146] <Twelfth Implementation>

[0147] The electronic control device of the twelfth embodiment differs from that of the eleventh embodiment in the number of pattern protrusions 56 provided on the grounding pattern 26.

[0148] Figure 22 This is an enlarged cross-sectional view showing the configuration of the circuit board 11, housing base 15, and electromagnetic wave shielding material 40 in the electronic control device of the twelfth embodiment. Figure 22 The shape of the grounding pattern 26 in the figure represents the cross-sectional shape of the grounding pattern 26.

[0149] like Figure 22 As shown, the grounding pattern 26 has a plurality of pattern protrusions 56 (56a, 56b, 56c, 56d, 56e). In the twelfth embodiment, as an example, five pattern protrusions 56a, 56b, 56c, 56d, and 56e are provided on the grounding pattern 26. The five pattern protrusions 56a, 56b, 56c, 56d, and 56e protrude from multiple positions in the width direction X of the grounding pattern 26 and are integrally formed with the grounding pattern 26. The five pattern protrusions 56a, 56b, 56c, 56d, and 56e are formed at predetermined intervals in the width direction X of the grounding pattern 26.

[0150] The five patterned protrusions 56a, 56b, 56c, 56d, and 56e are manufactured in the aforementioned circuit board manufacturing step S2 (see reference). Figure 7In the process of forming the ground pattern 26, after the pattern forming step, the ground pattern 26 is formed by cutting, for example, retaining five pattern protrusions 56a, 56b, 56c, 56d, and 56e. Pattern protrusion 56c is formed at the center of the ground pattern 26 in the width direction X. Pattern protrusions 56a and 56e are formed at both ends of the ground pattern 26 in the width direction X. Pattern protrusion 56b is formed in the ground pattern 26 in the width direction X, between pattern protrusions 56a and 56c. Pattern protrusion 56d is formed in the ground pattern 26 in the width direction X, between pattern protrusions 56c and 56e.

[0151] Each pattern protrusion 56a, 56b, 56c, 56d, and 56e is formed to protrude beyond the electromagnetic wave shielding material 40 compared to the upper surface (surface) 26e of the grounding pattern 26. The upper surface (main surface) 26e of the grounding pattern 26 is formed between two adjacent pattern protrusions in the width direction X of the grounding pattern 26. The upper surface 26e of the grounding pattern 26 can also be expressed as a concave bottom surface formed between two adjacent pattern protrusions in the width direction X of the grounding pattern 26. By forming multiple pattern protrusions 56 (56a, 56b, 56c, 56d, and 56e) on the grounding pattern 26 in this way, the upper surface 26e of the grounding pattern 26, which serves as the conductor reference surface, and the multiple pattern protrusions 56 (56a, 56b, 56c, 56d, and 56e), which serve as conductor protrusions, are integrally formed with the grounding pattern 26.

[0152] In the electronic control device of the twelfth embodiment, when the electromagnetic wave shielding material 40 is pressed against the grounding pattern 26 by the pressing pressure generated when the circuit board 11 is mounted on the housing base 15, the pattern protrusion 56c becomes embedded in the top of the electromagnetic wave shielding material 40. Additionally, the pattern protrusion 56b becomes embedded in one (…) of the electromagnetic wave shielding material 40. Figure 22 The state of the left side portion, the patterned protrusion 56d becomes another part embedded in the electromagnetic wave shielding material 40. Figure 22 The electromagnetic wave shielding material 40 is in the state of the right side portion. Furthermore, due to the aforementioned pressing pressure, the electromagnetic wave shielding material 40 is compressed and deformed, thereby becoming contact not only with the patterned protrusions 56b, 56c, and 56d of the grounding pattern 26, but also with the upper surface 26e of the grounding pattern 26 on both sides of the patterned protrusion 56c. Furthermore, depending on the magnitude of the pressing pressure, the side portion of the electromagnetic wave shielding material 40 can be made to contact the patterned protrusions 56a and 56e. Therefore, compared to the eleventh embodiment described above, the contact area of ​​the electromagnetic wave shielding material 40 with respect to the grounding pattern 26 can be increased, improving the electrical connection between the housing base 15 and the grounding pattern 26.

[0153] Furthermore, in the twelfth embodiment, when the electromagnetic wave shielding material 40 is pressed onto the grounding pattern 26 with a pressing force F, at least three pattern protrusions 56b, 56c, and 56d become embedded in the electromagnetic wave shielding material 40, thereby restricting the movement of the electromagnetic wave shielding material 40 in the width direction X of the grounding pattern 26. Therefore, it is possible to suppress the positional shift of the electromagnetic wave shielding material 40 in the width direction X of the grounding pattern 26.

[0154] in addition, Figure 22 In the grounding pattern 26, five pattern protrusions 56 (56a, 56b, 56c, 56d, 56e) are formed, but the number of pattern protrusions 56 can be more than two.

[0155] <Thirteenth Implementation Method>

[0156] Figure 23 This is an enlarged cross-sectional view of the configuration of the circuit board 11, housing base 15, and electromagnetic wave shielding material 60 of the electronic control device according to the thirteenth embodiment.

[0157] like Figure 23 As shown, electromagnetic wave shielding material 60 is disposed between the grounding pattern 26 of the circuit board 11 and the shielding platform 39 of the housing base 15. The grounding pattern 26 is formed in a comparison mode ( Figure 9 The grounding pattern 26 in the diagram is wider than that in the diagram.

[0158] The electromagnetic wave shielding material 60 is formed in a semi-circular protrusion when viewed from the length direction of the grounding pattern 26. Figure 23 The shape of the electromagnetic wave shielding material 60 in the text refers to the cross-sectional shape of the electromagnetic wave shielding material 60. Additionally, Figure 23 The shape of the electromagnetic wave shielding material 60 represents its shape before compression and deformation. The electromagnetic wave shielding material 60 is formed on the grounding pattern 26 of the circuit board 11. The electromagnetic wave shielding material 60 is positioned in contact with the upper surface (surface) 26f of the grounding pattern 26. The electromagnetic wave shielding material 60 is formed in the thickness direction of the circuit board 11 to protrude to one side of the housing base 15.

[0159] Such electromagnetic wave shielding material 60 is used in the above-mentioned circuit board manufacturing step S2 (refer to...) Figure 7In this process, for example, the electromagnetic wave shielding material 60 is formed on a circuit board 11 using the method described below. First, a circuit board 11 with a pattern-forming step already completed is prepared. Next, a liquid or paste-like material (conductive adhesive) containing conductive filler, which serves as the raw material for the electromagnetic wave shielding material 60, is applied to the surface of the ground pattern 26 of the circuit board 11 using a coating nozzle (not shown). Next, the material on the ground pattern 26 is cured, for example, by moisture, heating, or ultraviolet irradiation. The method for curing the material applied to the ground pattern 26 of the circuit board 11 is determined by the properties of the material used as the raw material for the electromagnetic wave shielding material 40 (moisture curing property, heat curing property, ultraviolet curing property, etc.). As a result, the electromagnetic wave shielding material 60 is formed in a semi-circular protruding state. The electromagnetic wave shielding material 60 is made of the same material as the electromagnetic wave shielding material 40 in the first embodiment described above, and therefore has rubber elasticity. In this case, the circuit board manufacturing step S2 is equivalent to the step of forming the electromagnetic wave shielding material 60 on the circuit board 11.

[0160] On the other hand, two conductor protrusions 61 and 62 are provided on the housing base 15. Each conductor protrusion 61 and 62 is formed by protruding a portion of the housing base 15 in a convex shape. Therefore, each conductor protrusion 61 and 62 can also be expressed as a housing protrusion. The conductor protrusions 61 and 62 protrude from a portion of a predetermined surface of the housing base 15, which is arranged opposite to the grounding pattern 26, and are integrally formed with the housing base 15. Specifically, the conductor protrusions 61 and 62 are provided to protrude from the surface 39a of the shielding platform 39. In this case, the surface 39a of the shielding platform 39 corresponds to the conductor reference surface. By forming the conductor protrusions 61 and 62 on the shielding platform 39 of the housing base 15 in this way, the surface 39a of the shielding platform 39, which serves as the reference plane, and the conductor protrusions 61 and 62 are integrally formed with the housing base 15 (integrated structure). Therefore, compared to forming the conductor protrusions separately (in a separate structure) on the housing base 15, the housing base 15 can be manufactured at a lower cost. The two conductor protrusions 61 and 62 can be formed in the housing manufacturing step S1 described above (refer to...). Figure 7 The shell base 15 can be formed through a shell base manufacturing step, or it can be formed by performing post-processing such as cutting on the shell base 15 obtained through the shell base manufacturing step. In this case, the shell manufacturing step S1 is equivalent to the step of forming the conductor reference surface and the conductor protrusion on the shell (shell base 15 in this example).

[0161] Each conductor protrusion 61, 62 is arranged in pairs along the width direction X of the grounding pattern 26. Each conductor protrusion 61, 62 is formed at positions opposite to both ends of the grounding pattern 26 along the width direction X. Furthermore, each conductor protrusion 61, 62 is formed such that a portion of the surface 39a of the shielding base 39 protrudes towards the electromagnetic wave shielding material 60 (the circuit board 11 side) in the thickness direction of the housing base 15. Therefore, the conductor protrusions 61, 62 protrude towards the electromagnetic wave shielding material 60 (the circuit board 11 side) compared to the surface 39a of the shielding base 39. In this case, the surface 39a of the shielding base 39 corresponds to a predetermined surface of the housing arranged opposite to the grounding pattern 26. Each conductor protrusion 61, 62 is located along the length direction of the grounding pattern 26 (… Figure 23 The grounding pattern 26 is formed continuously and relatively long along its depth direction. However, the individual conductor protrusions 61 and 62 may also be divided into multiple portions at predetermined intervals along the length of the grounding pattern 26. In addition, each conductor protrusion 61 and 62 is formed in a convex shape. Figure 23 The shapes of the conductor protrusions 61 and 62 in the diagram represent the cross-sectional shapes of the conductor protrusions 61 and 62 when viewed from the length direction of the grounding pattern 26.

[0162] In the electronic control device of the thirteenth embodiment, the top 60a of the electromagnetic wave shielding material 60 contacts the surface 39a of the shielding base 39, and the side portion 60b of the electromagnetic wave shielding material 60 protrudes toward the conductor protrusion 61, while the side portion 60c of the electromagnetic wave shielding material 60 contacts the conductor protrusion 62. This increases the contact area (electrical connection area) of the electromagnetic wave shielding material 60 relative to the housing base 15. Furthermore, the electromagnetic wave shielding material 60 is compressed and deformed by the pressing pressure generated when mounting the circuit board 11 on the housing base 15, further increasing the contact area (electrical connection area) of the electromagnetic wave shielding material 60 relative to the housing base 15. This improves the electrical connection between the housing base 15 and the grounding pattern 26. Consequently, the circuit area 25 (see reference 26) in the circuit board 11 is improved. Figure 4 Improve the grounding around the electromagnetic wave shielding material to enhance its shielding performance against electromagnetic noise.

[0163] Furthermore, in the thirteenth embodiment, a pair of conductor protrusions 61 and 62 contact the electromagnetic wave shielding material 60 from both sides of the width direction X of the grounding pattern 26. This suppresses positional shift of the electromagnetic wave shielding material 60 in the width direction X of the grounding pattern 26.

[0164] Furthermore, when viewed along the length of the grounding pattern 26, the shapes of the conductor protrusions 61 and 62 can be, for example, trapezoidal or triangular, to make the sides of each conductor protrusion 61 and 62 conical. Therefore, when the electromagnetic wave shielding material 60 is pressed onto the shielding base 39, the side portions 60b and 60c of the electromagnetic wave shielding material 60 easily mate with the sides of their respective conductor protrusions 61 and 62. This increases the contact area of ​​the electromagnetic wave shielding material 60 with the housing base 15, ensuring higher shielding performance.

[0165] <Fourteenth Implementation>

[0166] The electronic control device of the fourteenth embodiment differs in structure of the housing base 15 from that of the thirteenth embodiment described above.

[0167] Figure 24 This is an enlarged cross-sectional view showing the configuration of the circuit board 11, housing base 15, and electromagnetic wave shielding material 60 of the electronic control device according to the fourteenth embodiment. Figure 24 This indicates the state of the electromagnetic wave shielding material 60 before it is compressed and deformed by the pressure F.

[0168] like Figure 24 As shown, a housing recess 65 is formed on the housing base 15. The housing recess 65 can be formed in the housing manufacturing step S1 described above (refer to...). Figure 7 The housing base 15 is formed through a housing base manufacturing step, or it can be formed by subsequent processing such as cutting on the housing base 15 obtained through the housing base manufacturing step. The housing recess 65 is formed such that a portion of the surface 39b of the shielding platform 39 is recessed in a generally U-shape. The housing recess 65 is integrally formed with the housing base 15. The housing recess 65 is formed opposite to the grounding pattern 26. The surface 39b of the shielding platform 39 is arranged to protrude to the side of the electromagnetic wave shielding material 60 compared to the bottom surface 65a of the housing recess 65. The surfaces 39b of the shielding platform 39 are arranged in pairs on both sides of the housing recess 65 when viewed from the length direction of the grounding pattern 26. In this case, the bottom surface 65a of the housing recess 65 corresponds to the conductor reference surface, and the surface 39b of the shielding platform 39 corresponds to the conductor protrusion.

[0169] In the electronic control device of the fourteenth embodiment, the electromagnetic wave shielding material 60 is compressed and deformed (elastic deformation) by the pressing force F generated when the circuit board 11 is mounted on the housing base 15. As a result, with the circuit board 11 mounted on the housing base 15, the top of the electromagnetic wave shielding material 60 contacts the bottom surface 65a of the housing recess 65, and the side surface of the electromagnetic wave shielding material 60 contacts the surface 39b of the shielding platform 39. Thus, the same effect as in the thirteenth embodiment described above can be obtained.

[0170] The cross-sectional shape of the housing recess 65 is not limited to a general U-shape. For example, in order to facilitate the mating of the electromagnetic wave shielding material 60 with the housing recess 65 when the electromagnetic wave shielding material 60 is compressed and deformed by the pressing force F, the cross-sectional shape of the housing recess 65 may also be a semi-circular shape or a shape with tapered inclined sides.

[0171] <Fifteenth Implementation>

[0172] The electronic control device of the fifteenth embodiment differs in structure from that of the thirteenth embodiment described above in that the housing base 15 has a different structure.

[0173] Figure 25 This is an enlarged cross-sectional view showing the configuration of the circuit board 11, housing base 15, and electromagnetic wave shielding material 60 of the electronic control device according to the fifteenth embodiment.

[0174] like Figure 25 As shown, a conductor protrusion 66 is provided on the housing base 15. The conductor protrusion 66 can be provided in the housing manufacturing step S1 described above (refer to...). Figure 7 The conductor protrusion 66 is formed in the housing base manufacturing step, or it can be formed by performing post-processing such as cutting on the housing base 15 obtained in the housing base manufacturing step. The conductor protrusion 66 is formed on the surface 39c of the shielding base 39 at a position opposite to the center of the grounding pattern 26 in the width direction X. The conductor protrusion 66 is formed by protruding a portion of the housing base 15. Therefore, the conductor protrusion 66 can also be expressed as a housing protrusion. The conductor protrusion 66 is integrally formed with the housing base 15. The conductor protrusion 66 is formed in a state that protrudes towards the electromagnetic wave shielding material 60 (towards the circuit board 11) compared to the surface 39c of the shielding base 39. In this case, the surface 39c of the shielding base 39 corresponds to the specified surface of the housing arranged in a state opposite to the grounding pattern 26. In addition, the surface 39c of the shielding base 39 corresponds to the conductor reference surface. The conductor protrusion 66 is in the length direction of the grounding pattern 26 ( Figure 25 The conductor protrusions 66 are formed continuously along the grounding pattern 26 in the depth direction. However, the conductor protrusions 66 may also be divided into multiple portions at predetermined intervals along the length direction of the grounding pattern 26. The conductor protrusions 66 are formed in a convex shape. Figure 25 The shape of the conductor protrusion 66 in the diagram represents the cross-sectional shape of the conductor protrusion 66 when viewed from the length direction of the grounding pattern 26.

[0175] In the electronic control device of the fifteenth embodiment, when the electromagnetic wave shielding material 60 is pressed against the shielding platform 39 of the housing base 15 by the pressing pressure generated when mounting the circuit board 11 on the housing base 15, the conductor protrusion 66 becomes embedded in the electromagnetic wave shielding material 60. This state, where the conductor protrusion 66 is embedded in the electromagnetic wave shielding material 60, can be achieved by pressing the rubber-elastic electromagnetic wave shielding material 60 into the conductor protrusion 66 and elastically deforming it. Furthermore, the electromagnetic wave shielding material 60 is compressed and deformed by the aforementioned pressing pressure, thereby becoming in contact not only with the conductor protrusion 66 but also with the surfaces 39c of the shielding platform 39 on both sides of the conductor protrusion 66. Therefore, the contact area of ​​the electromagnetic wave shielding material 60 with the housing base 15 can be increased, improving the electrical connection between the housing base 15 and the grounding pattern 26. Consequently, the shielding performance of the electromagnetic wave shielding material 60 against electromagnetic noise can be improved.

[0176] Furthermore, in the fifteenth embodiment, when the electromagnetic wave shielding material 60 is pressed onto the shielding platform 39 of the housing base 15 with the aforementioned pressing force, the conductor protrusion 66 is embedded in the electromagnetic wave shielding material 60, thereby restricting the movement of the electromagnetic wave shielding material 60 in the width direction X of the grounding pattern 26. Therefore, it is possible to suppress the positional displacement of the electromagnetic wave shielding material 60 in the width direction X of the grounding pattern 26.

[0177] <Sixteenth Implementation>

[0178] The electronic control device of the sixteenth embodiment differs from that of the fifteenth embodiment in the number of conductor protrusions 66 provided on the housing base 15.

[0179] Figure 26 This is an enlarged cross-sectional view showing the configuration of the electronic control device according to the sixteenth embodiment, including the circuit board 11, the housing base 15, and the electromagnetic wave shielding material 60.

[0180] like Figure 26 As shown, the housing base 15 has a plurality of conductor protrusions 66 (66a, 66b, 66c, 66d, 66e). In the sixteenth embodiment, as an example, five conductor protrusions 66a, 66b, 66c, 66d, and 66e are provided on the housing base 15. The five conductor protrusions 66a, 66b, 66c, 66d, and 66e are arranged at predetermined intervals in the width direction X of the grounding pattern 26. The five conductor protrusions 66a, 66b, 66c, 66d, and 66e can be manufactured in the housing manufacturing step S1 described above (see reference). Figure 7The conductor protrusion 66c is formed through a housing base manufacturing step, or it can be formed by performing post-processing such as cutting on the housing base 15 obtained through the housing base manufacturing step. The conductor protrusion 66c is formed at a position opposite to the center portion of the grounding pattern 26 in the width direction X. The conductor protrusion 66b is formed in the width direction X of the grounding pattern 26, between the conductor protrusions 66a and 66c. The conductor protrusion 66d is formed in the width direction X of the grounding pattern 26, between the conductor protrusions 66c and 66e.

[0181] Each conductor protrusion 66a, 66b, 66c, 66d, and 66e is formed to protrude towards the electromagnetic wave shielding material 60 compared to the surface 39c of the shielding base 39. The surface 39c of the shielding base 39 is formed between two adjacent conductor protrusions in the width direction X of the grounding pattern 26. The surface 39c of the shielding base 39 can also be expressed as a concave bottom surface formed between two adjacent conductor protrusions in the width direction X of the grounding pattern 26.

[0182] In the electronic control device of the sixteenth embodiment, when the electromagnetic wave shielding material 60 is pressed against the shielding platform 39 of the housing base 15 by the pressing pressure generated when the circuit board 11 is mounted on the housing base 15, the conductor protrusion 66c is embedded in the top of the electromagnetic wave shielding material 60. Additionally, the conductor protrusion 66b is embedded in one (…) of the electromagnetic wave shielding material 60. Figure 26 The state of the left side portion, the conductor protrusion 66d becomes another part of the electromagnetic wave shielding material 60. Figure 26 The electromagnetic wave shielding material 60 is in the state of the right side portion. Furthermore, due to the aforementioned pressing pressure, the electromagnetic wave shielding material 60 is compressed and deformed, thereby becoming contact not only with the conductor protrusions 66b, 66c, and 66d of the housing base 15, but also with the surface 39c of the shielding platform 39 on both sides of the conductor protrusions 66c. Furthermore, depending on the magnitude of the pressing pressure, the side portion of the electromagnetic wave shielding material 60 can be made to contact the conductor protrusions 66a and 66e. Therefore, compared to the fifteenth embodiment described above, the contact area of ​​the electromagnetic wave shielding material 40 with respect to the grounding pattern 26 can be increased, improving the electrical connection between the housing base 15 and the grounding pattern 26.

[0183] Furthermore, in the sixteenth embodiment, when the electromagnetic wave shielding material 60 is pressed onto the shielding platform 39 of the housing base 15 using the aforementioned pressing pressure, at least three conductor protrusions 66b, 66c, and 66d become embedded in the electromagnetic wave shielding material 60, thereby restricting the movement of the electromagnetic wave shielding material 60 in the width direction X of the grounding pattern 26. Therefore, it is possible to suppress the positional shift of the electromagnetic wave shielding material 60 in the width direction X of the grounding pattern 26.

[0184] in addition, Figure 26In the case, five conductor protrusions 66 (66a, 66b, 66c, 66d, 66e) are formed on the housing base 15, but the number of conductor protrusions 66 can be two or more.

[0185] This invention is not limited to the embodiments described above, and includes various modifications. For example, the embodiments described above have been explained in detail to facilitate understanding of the invention, but the invention is not limited to having all the structures described in the embodiments. Furthermore, a portion of the structure of one embodiment can be replaced with a structure of another embodiment. Additionally, structures of other embodiments can be added to the structure of one embodiment. Furthermore, a portion of the structure of each embodiment can be deleted, have other structures added, or be replaced with other structures.

[0186] In addition, the preferred grounding pattern 26 is as described above. Figure 4 The terrain shown forms the perimeter of the circuit region 25, but the invention is not limited thereto; the grounding pattern 26 may also be formed as the three sides surrounding the circuit region 25.

[0187] in addition, Figure 17 In this invention, the conductor protrusion 51 is formed into a trapezoidal shape, with both sides of the conductor protrusion 51 tapered and inclined. However, the invention is not limited to this. For example, the conductor protrusion 51 that contacts the side portion 40b of the electromagnetic wave shielding material 40 may have only one side tapered and inclined. This is important for... Figure 17 The conductor protrusion 52 shown and Figure 18 The conductor protrusions 51 and 52 shown are the same.

[0188] Explanation of reference numerals in the attached figures

[0189] 10… Electronic control device, 11… Circuit board, 12… Housing, 15… Housing base (housing), 17, 18, 19… Electronic components, 26… Grounding pattern, 26a… First grounding pattern part, 26b… Second grounding pattern part, 26c… Third grounding pattern part, 26d… Surface (conductor protrusion), 26e… Upper surface (conductor reference plane), 39… Shielding platform, 39a… Surface (reference plane), 39b… Surface (conductor protrusion), 39c… Conductor reference plane, 40, 60… Electromagnetic wave shielding material, 41… Patterned surface (conductor reference plane), 45, 46, 51, 61, 62, 66… Conductor protrusion, 47… Recess, 47a, 51a, 52a… Side, 55… Patterned recess, 55a… Bottom surface (conductor reference plane), 56… Patterned convex part (conductor protrusion), 65… Housing recess, 65a… Bottom surface (conductor reference plane).

Claims

1. An electronic control device, characterized in that, include: A circuit board with a grounding pattern that can house electronic components; A conductive housing for accommodating the circuit board; and An electromagnetic wave shielding material is disposed between the grounding pattern on the circuit board and the housing, electrically connecting the grounding pattern to the housing. The circuit board or the housing has a conductor reference surface that can be pressed by the electromagnetic wave shielding material, and a conductor protrusion that protrudes to one side of the electromagnetic wave shielding material compared to the conductor reference surface. The electromagnetic wave shielding material is configured to contact the conductor reference surface and the conductor protrusion.

2. The electronic control device as described in claim 1, characterized in that: The electromagnetic wave shielding material has rubber elasticity and is disposed between the grounding pattern and the housing in a compressed and deformed state.

3. The electronic control device as described in claim 1, characterized in that: The conductor protrusions are formed in multiple portions at predetermined intervals along the length of the grounding pattern.

4. The electronic control device as described in claim 1, characterized in that: The grounding pattern includes a first grounding pattern portion, and a second grounding pattern portion and a third grounding pattern portion disposed adjacent to the first grounding pattern portion in such a way that the first grounding pattern portion is sandwiched in the middle. The conductor reference plane is formed by the first grounding pattern portion. The conductor protrusion is formed on the second grounding pattern portion and the third pattern portion, respectively.

5. The electronic control device as described in claim 4, characterized in that: The first grounding pattern portion has a pit at the point where it contacts the electromagnetic wave shielding material.

6. The electronic control device as described in claim 5, characterized in that: Viewed along the length of the grounding pattern, the side of the pit is cone-shaped.

7. The electronic control device as described in claim 5, characterized in that: Viewed along the length of the grounding pattern, the pit is formed in a semi-circular shape.

8. The electronic control device as claimed in claim 1, characterized in that: Viewed along the length of the grounding pattern, the electromagnetic wave shielding material is formed in a semi-circular shape.

9. The electronic control device as claimed in claim 1, characterized in that: Viewed along the length of the grounding pattern, the side of the conductor protrusion is tapered.

10. The electronic control device as claimed in claim 1, characterized in that: The conductor reference surface and the conductor protrusion are integrated with the grounding pattern.

11. The electronic control device as claimed in claim 10, characterized in that: The conductor reference surface and the conductor protrusion are integrated with the grounding pattern by recessing the central portion of the grounding pattern in the width direction.

12. The electronic control device as claimed in claim 10, characterized in that: The conductor reference surface and the conductor protrusion are integrated with the grounding pattern by making the central part or multiple parts of the grounding pattern protrude in the width direction.

13. The electronic control device as claimed in claim 1, characterized in that: The conductor reference surface and the conductor protrusion are integrally formed with the housing.

14. The electronic control device as described in claim 13, characterized in that: The conductor protrusion is integrally formed with the housing by protruding a portion of a predetermined surface of the housing, which is configured to be opposite to the grounding pattern.

15. The electronic control device as claimed in claim 13, characterized in that: The conductor reference surface and the conductor protrusion are integrally formed with the housing by recessing a portion of a predetermined surface of the housing, which is configured to be opposite to the grounding pattern.

16. The electronic control device as claimed in claim 14, characterized in that: The conductor protrusion is formed at a position opposite to the central portion of the grounding pattern in the width direction.

17. The electronic control device as claimed in claim 1, characterized in that: The conductor protrusions are formed in multiple portions at predetermined intervals in the width direction of the grounding pattern.

18. The electronic control device as claimed in claim 1, characterized in that: The conductivity of the conductor protrusion is higher than that of the electromagnetic wave shielding material.

19. The electronic control device as claimed in claim 1, characterized in that: The conductor protrusion is formed by a solder deposit or a copper block.

20. A method for manufacturing an electronic control device, characterized in that: The electronic control device includes: A circuit board with a grounding pattern that can house electronic components; A conductive housing that houses the circuit board; and An electromagnetic wave shielding material is disposed between the grounding pattern on the circuit board and the housing, electrically connecting the grounding pattern to the housing. The manufacturing method includes: The step of coating the circuit board or the housing with a paste or liquid material as the raw material for the electromagnetic wave shielding material and then curing the material to form the electromagnetic wave shielding material with rubber elasticity on the circuit board or the housing. The steps of forming a conductor reference surface on the circuit board or the housing that can be pressed by the electromagnetic wave shielding material, and a conductor protrusion that protrudes to one side of the electromagnetic wave shielding material compared to the conductor reference surface; and The steps include mounting the circuit board on the housing and using the pressing force generated by the mounting to compress and deform the electromagnetic wave shielding material so that the electromagnetic wave shielding material contacts the conductor reference surface and the conductor protrusion.

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