High-precision manual cutting process for frequency selection board of radar system

By using manual cutting techniques combined with tools such as angle aluminum, U-clamps, feeler gauges, planers, and pneumatic grinders, high-precision cutting of frequency selective plates is achieved, solving the problems of splicing seam control and material performance stability of frequency selective plates, and meeting the high-precision requirements of radar systems.

CN121756026APending Publication Date: 2026-03-31JIANGSU XINYANG NEW MATERIALS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-03-01
Publication Date
2026-03-31

AI Technical Summary

Technical Problem

In the existing technology, the cutting process of frequency selective boards cannot meet the requirements of high-precision splicing, and it is prone to mechanical stress and thermal effects, resulting in changes in material properties and positional deviations, making it difficult to adapt to the stringent usage requirements of radar systems.

Method used

The process involves manual cutting, protective treatment, positioning and fixing, precision testing, manual planing, power grinding and cleaning, and is combined with angle aluminum, U-clamps, feeler gauges, planers, pneumatic grinders and compressed air to achieve a high-precision matching of splicing seams ≤0.05mm.

Benefits of technology

It achieves precise control of the splicing seams of frequency selective boards, avoids material damage, ensures the stability of the electromagnetic performance and physicochemical properties of frequency selective boards, reduces processing equipment costs, and adapts to the needs of mass production.

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Abstract

The invention discloses a high-precision manual cutting process for a frequency selection board of a radar system in the technical field of electronic manufacturing, and the high-precision manual cutting process comprises the following steps: S1, protection treatment: a non-cutting area of the frequency selection board is protected, and the surface of the frequency selection board is provided with uniformly distributed grids and spacing areas between the adjacent grids; s2, positioning and fixing: the frequency selection board is fixed through a fixing assembly, so that a preset cutting part is exposed, and the preset cutting part corresponds to the spacing area; and S3, cutting amount detection, wherein the size of the exposed cutting part is detected through a precision detection tool, and the cutting amount is determined. The frequency selection plate is fixed through the angle passing aluminum and the U-shaped clamp, the cutting amount is accurately detected through the 0.3 mm feeler gauge, trimming planing of the planing tool is matched with polishing of the 2-inch pneumatic polisher, grid alignment and feeler gauge inspection are conducted during trial splicing, the gap of splicing seams is accurately controlled within 0.05 mm, the machining position accurately falls in the center of the grid interval, and the machining efficiency is improved. And the harsh requirement of a radar system on high-precision splicing of the frequency selection board is met.
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Description

Technical Field

[0001] This invention relates to the field of electronic manufacturing technology, and more specifically, to a high-precision manual cutting process for frequency selective boards in radar systems. Background Technology

[0002] Radar systems occupy a crucial position in various fields, including military and civilian applications. Their core performance, such as detection accuracy and anti-jamming capability, directly depends on the adaptability and reliability of each component. The frequency selection board, as a core component in a radar system responsible for frequency selection, filtering, and signal optimization, needs to be spliced ​​to achieve a preset size to meet assembly requirements. The splicing accuracy directly affects the stability and integrity of radar signal processing, thus placing extremely high precision requirements on the cutting process of the frequency selection board.

[0003] In the existing technology, the cutting of frequency selective plates mostly adopts traditional machining processes. This process controls the movement trajectory of the machining tool through a preset program to complete the cutting and shaping of the frequency selective plate.

[0004] However, this traditional machining process has certain problems in practical applications: on the one hand, the machining process is limited by both the precision of the mechanical structure and the preset program, making it impossible to flexibly adjust according to the real-time machining situation, and it is difficult to control the splicing seam within a very small range, thus failing to meet the high-precision splicing requirements of frequency selective boards; on the other hand, mechanical stress or thermal effects are easily generated during the machining process, causing changes in the original properties of the material, and the machining position is prone to deviation, affecting the overall use effect after splicing, making it difficult to adapt to the stringent usage requirements of frequency selective boards. Therefore, we urgently need a high-precision manual cutting process for frequency selective boards in radar systems to solve the above problems. Summary of the Invention

[0005] One objective of this invention is to provide a new technical solution for high-precision manual cutting of frequency selective boards for radar systems. By manually adjusting planing parameters in real time, accurately detecting the cutting amount with a feeler gauge, and using a planer and a pneumatic grinder in combination, material damage is avoided, and a high-precision matching with a splicing seam of ≤0.05mm is achieved, meeting the stringent requirements of radar systems.

[0006] The objective of this invention is achieved as follows: a high-precision manual cutting process for frequency selective boards in radar systems, comprising the following steps:

[0007] S1 protection treatment: The non-cut area of ​​the frequency selective plate is protected. The surface of the frequency selective plate is provided with uniformly distributed squares and the spacing area between adjacent squares.

[0008] S2 Positioning and Fixing: The frequency selection plate is fixed by the fixing component, so that the preset cutting part is exposed, and the preset cutting part corresponds to the spacing area;

[0009] S3 Cutting Amount Detection: The dimensions of the exposed cutting area are measured using a precision inspection tool to determine the cutting amount;

[0010] S4 Manual Planing: Use the cutting tool to plan the exposed cut areas to avoid damaging the grid.

[0011] S5 section grinding: The cut section after planing is ground using a power grinding tool;

[0012] S6 Cleaning Process: Removes dust and debris generated during the processing;

[0013] S7 splicing inspection: The frequency selection boards that have been treated as described above are spliced ​​to ensure that the squares are aligned and the gaps between the splicing seams are inspected.

[0014] Optionally, in step S1, a protective material is used to fully cover the non-cut area, the protective material including a release tarpaulin.

[0015] Optionally, in step S2, the fixing component includes an angle aluminum and a U-shaped clamp. The angle aluminum is arranged to fit the upper and lower edges of the frequency selection plate, and the frequency selection plate is fastened to the angle aluminum by the U-shaped clamp. The cut part protrudes from the edge of the angle aluminum.

[0016] Optionally, in step S3, the accuracy testing tool is a feeler gauge, which is connected to the edge of the grid during testing, and the relative position of the feeler gauge and the grid remains fixed during the testing process.

[0017] Optionally, in step S4, the cutting tool is a planer, and the planing area is the center of the spacing area.

[0018] Optionally, in step S5, the power grinding tool is a pneumatic grinder, which moves at a constant speed along the extension direction of the cut section during grinding.

[0019] Optionally, in step S6, compressed air is used to remove dust, and the cleaning range covers the surface of the frequency selective plate and the cut section.

[0020] Optionally, in step S7, the gap between the splices shall not exceed 0.03-0.06 mm, and a feeler gauge shall be used to detect the gap between the splices.

[0021] Optionally, the grid has a size of 4-6mm × 4-6mm, and the spacing between adjacent grids is 0.8-1.2mm.

[0022] Optionally, during the cutting quantity detection process, the exposed size of the frequency selection plate is gradually adjusted until the feeler gauge is stably connected, and the detection is performed no less than 3 times, with the average value taken as the basis for determining the cutting quantity.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0024] 1. According to one embodiment of this disclosure, the high-precision manual cutting process for frequency selection boards in radar systems achieves precise control of the splicing gap within 0.05mm by fixing the frequency selection board with angle aluminum and U-shaped clamps, accurately detecting the cutting amount with a 0.3mm feeler gauge, coordinating planing with a planer and grinding with a 2-inch pneumatic grinder, and checking the grid alignment and feeler gauge during trial splicing. The processing position is precisely located at the center of the grid spacing, meeting the stringent requirements of radar systems for high-precision splicing of frequency selection boards.

[0025] 2. According to one embodiment of this disclosure, the high-precision manual cutting process for the frequency selective board of a radar system flexibly adjusts the cutting force and method by manually controlling the planer, avoiding the influence of excessive mechanical stress or thermal effects on the frequency selective board material. At the same time, it is combined with compressed air to comprehensively remove dust and protect the grid structure, ensuring the stability of the special electromagnetic properties and physicochemical properties of the frequency selective board, without internal structural damage.

[0026] 3. According to one embodiment of this disclosure, the high-precision manual cutting process for frequency selective boards in radar systems adopts a combination of release cloth protection, simple tooling fixation, manual planing and basic testing tools. It does not require complex programming and equipment debugging processes, and is not only easy to operate and highly repeatable, but also greatly reduces the investment cost of processing equipment, and is suitable for the batch processing needs in actual production. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0028] Figure 1 This is a flowchart of a high-precision manual cutting process for a frequency selective board in a radar system, as described in one embodiment. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] like Figure 1 As shown, a high-precision manual cutting process for frequency selective boards in radar systems includes the following steps:

[0031] S1 protection treatment: Protects the non-cutting area of ​​the frequency selection board. The surface of the frequency selection board has evenly distributed squares and the spacing between adjacent squares.

[0032] Here, the purpose of this protective treatment is to prevent dust generated during subsequent planing and grinding processes from contaminating the non-cutting area, or to prevent processing tools from accidentally touching the area, thereby damaging the grid structure. As a key structure for the frequency selection board to realize core functions such as frequency selection, filtering, and anti-interference, the integrity of the grid directly determines the performance of the frequency selection board. In practical applications, the preferred grid size is 5mm×5mm with a spacing area width of 1mm, which is more suitable for the performance requirements of radar systems.

[0033] Furthermore, this protective treatment can protect the material surface of the non-cutting area of ​​the frequency selective board, preventing it from changing its original electromagnetic properties and physicochemical properties due to scratches or contamination, thus ensuring the consistency of the overall performance of the frequency selective board after splicing.

[0034] Furthermore, protecting non-cutting areas in advance can reduce the workload of subsequent cleaning processes, prevent powder residue from remaining in the gaps of the grid or on the surface of the material and thus improve the smoothness of the overall processing flow.

[0035] In step S1, the non-cut area is fully covered with protective material, including release fabric.

[0036] Here, the release cloth is soft, does not stick to the surface of the frequency selective plate, and is easy to peel off. It will not scratch the grid structure or leave any sticky substances during the covering and peeling process, and can maintain the original state of the frequency selective plate to the greatest extent.

[0037] Furthermore, the full-coverage protection method can achieve no blind spots in the non-cutting area. Regardless of the placement angle or operating posture of the frequency selective board during processing, it can effectively isolate dust, tools and non-cutting areas from contact, providing comprehensive and reliable protection.

[0038] Furthermore, release fabric is readily available, inexpensive, and reusable. While meeting protection requirements, it does not significantly increase processing costs, aligning with the advantages of economical and practical technology.

[0039] S2 Positioning and Fixing: The frequency selection board is fixed by the fixing component, so that the preset cutting part is exposed and the preset cutting part corresponds to the spacing area.

[0040] It is important to note that the fixing components must be placed on an absolutely flat surface, such as a glass plate, to ensure that the cutting interface of the frequency selective plate is in the same vertical plane after placement. This provides a fundamental guarantee for subsequent positioning, fixing, and overall processing accuracy.

[0041] Here, the positioning and fixing operation can limit the shaking or displacement of the frequency selection plate during processing, ensuring that the preset cutting part always accurately corresponds to the spacing area, fundamentally avoiding damage to the grid structure caused by the cutting position deviation, and more accurately ensuring that the cutting part falls in the center position.

[0042] Furthermore, exposing the pre-cut area provides ample operating space for subsequent planing and grinding processes, avoids fixed components from obstructing the processing area, and ensures that operators can accurately control the tools to carry out processing.

[0043] Furthermore, stable positioning can reduce secondary adjustments during processing, improve the efficiency of connecting various processes, avoid rework due to frequency selection board displacement, and reduce material waste.

[0044] In step S2, the fixing component includes an angle aluminum and a U-shaped clamp. The angle aluminum is arranged to fit the upper and lower edges of the frequency selection plate, and the frequency selection plate is fastened to the angle aluminum by the U-shaped clamp. The cut part protrudes from the edge of the angle aluminum.

[0045] Here, the angle aluminum has good rigidity and flatness. When it is arranged to fit the upper and lower edges of the frequency selector plate, it can provide uniform support for the frequency selector plate, avoid deformation of the frequency selector plate due to uneven force during the fixing process, and ensure the flatness of the original structure of the frequency selector plate.

[0046] Furthermore, the U-shaped clamp is easy to operate and can quickly achieve a firm connection between the frequency selector plate and the angle aluminum. The clamping force can be flexibly adjusted to ensure that there is no loosening during processing and that the frequency selector plate will not be squeezed and damaged due to excessive tightening.

[0047] Furthermore, the design of the cutting part protruding from the edge of the angle aluminum completely avoids the limitation of the angle aluminum on the movement trajectory of planing and grinding tools, ensuring that the tools can directly act on the cutting part and guaranteeing the smoothness and accuracy of the processing operation.

[0048] S3 Cutting Amount Detection: The dimensions of the exposed cutting area are detected using a precision detection tool to determine the cutting amount.

[0049] Here, the core of this cutting amount detection operation is to accurately obtain the dimensional data of the exposed cutting part, so as to provide a clear basis for the subsequent planing process, avoid the planing area from deviating from the grid spacing due to excessive or insufficient cutting amount, and ensure that the grid structure is not damaged. In actual detection, a 0.3mm feeler gauge is preferred, as its measurement accuracy is more in line with the detection requirements of the 1mm spacing area.

[0050] Furthermore, the detection can promptly identify minor deviations in the fixed position of the frequency selection board, allowing operators to adjust the fixing status in a timely manner and avoid inaccurate cutting quantity determination due to fixing deviations, which in turn affects the subsequent splicing accuracy.

[0051] Furthermore, specifying the cutting amount in advance can reduce reliance on operator experience during the planing process, reduce human error, and improve the stability and repeatability of the process.

[0052] In step S3, the accuracy testing tool is a feeler gauge. During testing, the feeler gauge is aligned with the edge of the grid, and the relative position of the feeler gauge and the grid remains fixed during the testing process.

[0053] Here, the feeler gauge has high-precision measurement characteristics and can accurately capture minute dimensional changes in the exposed cutting parts, fully meeting the measurement requirements of high-precision processing of frequency-selective plates. The preferred feeler gauge with a specification of 0.3mm can be more accurately adapted to the connection measurement of grid edges, providing reliable tool support for the accurate determination of cutting volume.

[0054] Furthermore, by using the edge of the grid as a reference to align the feeler gauge with it, the calculation benchmark for the cutting amount can be kept consistent, avoiding errors in the determination of the cutting amount due to inconsistent benchmarks, and ensuring that the trimming area falls precisely within the grid spacing.

[0055] Furthermore, keeping the relative position of the feeler gauge and the grid fixed during the testing process can avoid reference shifts during multiple measurements, ensuring the consistency and accuracy of the measurement results and laying the foundation for the precise implementation of subsequent planing procedures.

[0056] S4 Manual Planing: Uses cutting tools to plan the exposed cut areas to avoid damaging the grid.

[0057] Here, manual planing offers greater flexibility compared to traditional machining. Operators can make micro-adjustments to the planing path, force, and angle based on the real-time processing conditions, precisely avoiding the grid structure and strictly adhering to the principle of not damaging the original grid, thus enabling more precise control over the planing range.

[0058] Furthermore, given the complex structural characteristics of the frequency selector board, manual planing can effectively avoid the accumulated errors caused by tool path and tooling fixture limitations during machining, ensuring consistent machining accuracy across all parts of the frequency selector board.

[0059] Furthermore, operators can flexibly adjust the planing method according to the characteristics of the frequency selective plate material to avoid damage to the internal structure of the material due to excessive mechanical stress, and ensure that the material performance of the frequency selective plate remains stable after cutting.

[0060] In step S4, the cutting tool is a planer, and the planing area is the center of the spacing area.

[0061] Here, the planer's cutting method is gentle and the cutting force is easy to control, making it suitable for processing frequency-selective plate materials that are sensitive to mechanical stress. It can effectively avoid damage to the internal structure of the material due to excessive cutting force and can act more precisely on the center position.

[0062] Furthermore, limiting the planing area to the center of the spacing area can ensure that the distance between the squares on both sides of the splicing seam remains 1mm to the greatest extent, thus ensuring the overall structural integrity and functionality of the frequency selective board after splicing.

[0063] Furthermore, the planer's cutting edge is sharp and highly flat, resulting in a relatively smooth cutting surface after planing. This lays a good foundation for subsequent cross-section grinding, reduces grinding workload, and improves overall processing efficiency.

[0064] S5 section grinding: The cut section after planing is ground using a power grinding tool.

[0065] Here, the cut surface after planing is prone to leaving tiny burrs and unevenness. The core of the grinding process is to eliminate these defects, making the cut surface smoother and providing a good fit for subsequent splicing.

[0066] Furthermore, a flat cut cross-section can reduce stress concentration during splicing, avoid uneven stress on the frequency selective plate after splicing due to uneven cross-section, and improve the stability and service life of the spliced ​​structure.

[0067] Furthermore, the grinding process removes residual material debris after planing, preventing debris from adhering to the cross-section and affecting the splicing effect, and ensuring that the gap between the splices can be precisely controlled within the preset range.

[0068] In step S5, the power grinding tool is a pneumatic grinder, which moves at a constant speed along the extension direction of the cut section during grinding.

[0069] Here, a 2-inch pneumatic grinder is preferred, as it has stable power output and fine grinding effect, and can evenly and meticulously grind the cut section after planing to ensure that the flatness of the section meets the splicing accuracy requirements.

[0070] Furthermore, moving the grinding machine at a constant speed along the extension direction of the cutting section ensures that the grinding trajectory is continuous and uniform, making the flatness of the entire cutting section consistent and preventing new unevenness defects from being generated due to a messy grinding path.

[0071] Furthermore, pneumatic grinders are more efficient than manual grinders, and are easy to operate without complicated adjustments. They can improve overall process efficiency while ensuring grinding accuracy, making them suitable for batch processing needs.

[0072] S6 Cleaning Treatment: Removes dust and debris generated during the processing.

[0073] If the dust generated during planing and sanding remains on the surface of the frequency selective plate or in the grid gaps, it will affect the fit of the two sections during splicing, resulting in an increase in the gap between the splices. The purpose of cleaning is to effectively remove these dust particles and ensure the dimensional control of the splices.

[0074] Furthermore, dust adhering to the surface of the frequency selector board may interfere with its electromagnetic performance, affecting the normal functioning of core functions such as frequency selection and filtering. Cleaning can avoid this problem.

[0075] Furthermore, the cleaned frequency selective plate surface is free of debris, making it easier to accurately observe the actual condition of the splice seams during subsequent splicing inspections, thus ensuring the authenticity and reliability of the test results.

[0076] In step S6, compressed air is used to blow away the dust, and the cleaning range covers the surface of the frequency selective plate and the cut section.

[0077] Here, compressed air purging has the advantages of high cleaning efficiency and no residue. It can quickly blow away the powder and debris on the surface and cut section of the frequency selective plate without damaging the frequency selective plate material and grid structure, thus protecting the integrity of the grid.

[0078] Furthermore, the cleaning range covers the surface of the frequency selective plate and the cut cross-section, enabling comprehensive cleaning without dead angles, avoiding local powder residue from affecting the splicing effect, and fully meeting the cleaning requirements before splicing.

[0079] Furthermore, this cleaning method does not require the use of chemical cleaning agents, will not affect the physical and chemical properties of the frequency selective board, and will not produce secondary pollution, making it both environmentally friendly and ensuring the stable performance of the frequency selective board.

[0080] S7 splicing inspection: The frequency selection boards that have been treated as described above are spliced ​​to ensure that the squares are aligned and the gaps between the splicing seams are inspected.

[0081] The core function of trial splicing here is to visually verify the comprehensive processing effect of the previous protection, fixing, planing, grinding, cleaning and other processes, to promptly identify potential minor deviations, so that operators can make timely adjustments and avoid large-scale unqualified products after batch processing. When splicing, it is preferable to align the 5mm×5mm squares, and when testing, it is preferable to control the gap between the splices within 0.05mm.

[0082] Furthermore, aligning the squares ensures that the surface structure of the spliced ​​frequency selection board is regular, maintaining the original uniform distribution of the squares and ensuring that the signal transmission and frequency selection functions of the frequency selection board are not affected by the splicing.

[0083] Furthermore, splicing seam gap detection can accurately determine whether the splicing precision meets the stringent requirements of the radar system, ensuring that the splicing seam gap is controlled within an extremely small range and guaranteeing the overall effectiveness of the radar system.

[0084] The grid size is 4-6mm × 4-6mm, and the spacing between adjacent grids is 0.8-1.2mm.

[0085] Here, the grid design within this specification range can adapt to the functional requirements of the frequency selection board in the radar system. The spacing width provides reasonable operating space for manual planing, avoiding processing difficulties due to excessively small spacing. In practical applications, the preferred grid size is 5mm×5mm and the spacing width is 1mm. This size can stably ensure the signal processing efficiency of the frequency selection board and can more accurately match the performance design of the radar system.

[0086] Furthermore, the 5mm×5mm grid size is the optimal size verified by actual application, and the 1mm spacing area width ensures that the distance between the grids on both sides of the splicing seam is still 1mm after planing, which fully meets the functional requirements of the frequency selection board after splicing.

[0087] Furthermore, this optimized specification design is based on the actual application scenarios of frequency selection boards, and can achieve stable processing without additional adjustments, improving the practicality and reliability of the process, while reducing processing errors caused by improper specification adaptation.

[0088] During the cutting quantity detection process, the exposed size of the frequency selection plate is gradually adjusted until the feeler gauge is stably connected. The detection is performed no less than 3 times, and the average value is taken as the basis for judging the cutting quantity.

[0089] Here, the exposed dimensions of the frequency selector plate are gradually adjusted until the feeler gauge is stably connected. The key is to accurately find the position that matches the preset cutting amount to avoid deviations caused by a one-time adjustment. It is preferable to use a 0.3mm feeler gauge, which can more accurately connect with the edge of the 5mm×5mm square to ensure that the cutting amount corresponds precisely to the 1mm spacing area.

[0090] Furthermore, conducting at least three tests can effectively offset the random errors of a single measurement, improve the reliability of the cutting quantity determination, and prevent the trimming area from shifting out of the center of the grid spacing due to errors in a single measurement.

[0091] Furthermore, taking the average of multiple measurements as the basis for determining the cutting amount can comprehensively reflect the actual processing situation, making the determination of the cutting amount more accurate, providing a strong guarantee for the accurate implementation of subsequent planing processes, and ultimately ensuring that the splicing gap is preferably controlled within 0.05mm.

[0092] In this invention, the frequency selector plate is fixed by angle aluminum and U-shaped clamps to prevent displacement during processing. A 0.3mm feeler gauge is used to connect the exposed square edges and maintain their relative positions. The amount of planing is precisely determined to ensure that the processing area is centered at the 1mm square spacing. The operator manipulates the planer to flexibly adjust the force and method to avoid excessive mechanical stress that could damage the frequency selector plate material (its special electromagnetic properties and physicochemical properties are sensitive to processing stress). Then, a 2-inch pneumatic grinder is used to grind the planed section at a uniform speed to make it flat and smooth. After the processing debris is blown away by compressed air, the frequency selector plates are test-assembled and the 5mm×5mm squares are aligned. The joint is checked again with a feeler gauge. The real-time adjustment advantage of manual operation avoids the limitations and accumulated errors of the preset program in traditional machining. Through the precise coordination of each process, including fixing, testing, planing, grinding, cleaning, and inspection, the joint gap is finally controlled within 0.05mm, which ensures both the integrity of the frequency selector plate square structure and the stability of the material performance, meeting the high-precision splicing requirements of radar systems.

[0093] The above description of the embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make several improvements and modifications to the present invention without departing from the principles of the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A high-precision manual cutting process for frequency selective boards in radar systems, characterized in that: Includes the following steps: S1 protection treatment: The non-cut area of ​​the frequency selective plate is protected. The surface of the frequency selective plate is provided with uniformly distributed squares and the spacing area between adjacent squares. S2 Positioning and Fixing: The frequency selection plate is fixed by the fixing component, so that the preset cutting part is exposed, and the preset cutting part corresponds to the spacing area; S3 Cutting Amount Detection: The dimensions of the exposed cutting area are measured using a precision inspection tool to determine the cutting amount; S4 Manual Planing: Use the cutting tool to plan the exposed cut areas to avoid damaging the grid. S5 section grinding: The cut section after planing is ground using a power grinding tool; S6 Cleaning Process: Removes dust and debris generated during the processing; S7 splicing inspection: The frequency selection boards that have been treated as described above are spliced ​​to ensure that the squares are aligned and the gaps between the splicing seams are inspected.

2. The high-precision manual cutting process for frequency selective boards in radar systems according to claim 1, characterized in that: In step S1, a protective material is used to fully cover the non-cut area, the protective material including a release tarpaulin.

3. The high-precision manual cutting process for frequency selective boards in radar systems according to claim 1, characterized in that: In step S2, the fixing component includes an angle aluminum and a U-shaped clamp. The angle aluminum is arranged to fit the upper and lower edges of the frequency selection plate, and the frequency selection plate is fastened to the angle aluminum by the U-shaped clamp. The cut part protrudes from the edge of the angle aluminum.

4. The high-precision manual cutting process for frequency selective boards in radar systems according to claim 1, characterized in that: In step S3, the accuracy testing tool is a feeler gauge. During testing, the feeler gauge is aligned with the edge of the grid, and the relative position of the feeler gauge and the grid remains fixed during the testing process.

5. The high-precision manual cutting process for frequency selective boards in radar systems according to claim 1, characterized in that: In step S4, the cutting tool is a planer, and the planing area is the center of the spacing area.

6. The high-precision manual cutting process for frequency selective boards in radar systems according to claim 1, characterized in that: In step S5, the power grinding tool is a pneumatic grinder, which moves at a constant speed along the extension direction of the cut section during grinding.

7. The high-precision manual cutting process for frequency selective boards in radar systems according to claim 1, characterized in that: In step S6, compressed air is used to blow away the dust, and the cleaning range covers the surface of the frequency selective plate and the cut section.

8. The high-precision manual cutting process for frequency selective boards in radar systems according to claim 1, characterized in that: In step S7, the gap between the splices shall not exceed 0.03-0.06 mm, and a feeler gauge shall be used to check the gap between the splices.

9. The high-precision manual cutting process for frequency selective boards in radar systems according to claim 1, characterized in that: The grid has dimensions of 4-6mm × 4-6mm, and the spacing between adjacent grids is 0.8-1.2mm.

10. The high-precision manual cutting process for frequency selective boards in radar systems according to claim 1, characterized in that: During the cutting quantity detection process, the exposed size of the frequency selection plate is gradually adjusted until the feeler gauge is stably connected. The detection is performed no less than 3 times, and the average value is taken as the basis for judging the cutting quantity.