MEMS controller and MEMS device

Abstract

The invention provides an MEMS controller and an MEMS device, and the MEMS controller comprises a packaging shell which comprises a first plate part, a second plate part and a side wall part, the first plate part, the second plate part and the side wall part jointly define a packaging cavity, the first plate part is provided with a first opening penetrating through the first plate part, and the second plate part is provided with a second opening penetrating through the second plate part; the power supply plate is fixed to the side wall part and arranged between the first plate part and the second plate part, the power supply plate divides the packaging cavity into a first cavity close to the first plate part and a second cavity close to the second plate part, the power supply plate is provided with a third opening penetrating through the power supply plate, and the third opening is used for communicating the first cavity with the second cavity; the control assembly is contained in the packaging cavity and comprises a base and a cantilever, the base is fixed to the second plate part, and the fixed end of the cantilever is fixed to the side, facing the power supply plate, of the base and electrically connected with the power supply plate through a conductive structure. Reliable one-way flow control can be achieved, and structural miniaturization is facilitated.

Description

Technical Field

[0001] This invention relates to the field of control device technology, specifically to a MEMS controller and a MEMS device. Background Technology

[0002] MEMS (Micro-Electro-Mechanical Systems) are devices with dimensions of a few millimeters or even smaller, and their internal structures are generally on the micrometer or even nanometer scale. MEMS are developed based on microelectronics technology (semiconductor manufacturing technology) and integrate technologies such as photolithography, etching, thin film processing, LIGA, silicon micromachining, non-silicon micromachining, and precision machining. MEMS technology is widely used in various fields, including but not limited to consumer electronics products such as miniature speakers and MEMS microphones. These products are widely used in devices such as laptops and smartphones due to their advantages of small size, low power consumption, and mass production capabilities.

[0003] In related technologies, in order to achieve reliable unidirectional flow control and other functions, a large number of functional components need to be integrated inside the MEMS controller, which limits the reduction of the size of the MEMS controller and is not conducive to the miniaturization of the MEMS controller. Summary of the Invention

[0004] The purpose of this invention is to provide a MEMS controller and MEMS device that improves the technical problem of unidirectional flow control that is difficult to balance miniaturization and reliability in the prior art.

[0005] The technical solution of the present invention is as follows: In a first aspect, the present invention provides a MEMS controller, comprising: The encapsulation shell includes a first plate portion, a second plate portion, and a side wall portion connecting the first plate portion and the second plate portion, which are disposed opposite to each other. The first plate portion, the second plate portion, and the side wall portion together enclose an encapsulation cavity. A first opening is provided on the first plate portion, and a second opening is provided on the second plate portion, which is also provided. A power supply board is housed within the encapsulation cavity. The power supply board is fixed to the side wall portion and disposed between the first plate portion and the second plate portion. The power supply board divides the encapsulation cavity into a first chamber near the first plate portion and a second chamber near the second plate portion. The power supply board has a third opening penetrating the power supply board, which connects the first chamber and the second chamber. A control component is housed within the encapsulation cavity. The control component includes a base located in the second chamber and a cantilever. The base is fixed to the second plate portion. The cantilever has a fixed end and a free end disposed opposite to each other. The fixed end of the cantilever is fixed to the side of the base facing the power supply board and is electrically connected to the power supply board through a conductive structure.

[0006] Preferably, the sidewall portion includes a first sidewall and a second sidewall, the first sidewall being connected to the side of the first plate portion facing the second plate portion, and the second sidewall being connected to the side of the second plate portion facing the first plate portion; The power supply board has a first surface and a second surface that are disposed opposite to each other. The third opening extends from the first surface through the second surface. The first surface of the power supply board is fixed to the first sidewall, and the second surface of the power supply board is fixed to the second sidewall.

[0007] Preferably, the conductive structure includes a first pad disposed on the side surface of the cantilever facing the power supply board, a second pad disposed on the side surface of the power supply board facing the cantilever, and a conductive connector electrically connecting the first pad and the second pad.

[0008] Preferably, the conductive connector is at least one of conductive silver paste, conductive silicone containing nano-silver particles, or solder balls.

[0009] Preferably, the MEMS controller further includes a sealing structure disposed on the side of the power supply board facing the control component, the sealing structure being connected between the power supply board and the control component and located outside the conductive connector.

[0010] Preferably, the control assembly further includes a flow-around element fixed to the side wall portion, and the flow-around element extends from the first chamber through the third opening to the second chamber. The projections of the first opening and the second opening are at least partially located on the flow-around element. The first opening and the second opening are respectively located on both sides of the flow-around element, and the projection of the free end of the cantilever perpendicular to the vibration direction of the cantilever is located on the flow-around element.

[0011] Preferably, one of the first opening and the second opening is a fluid inlet and the other is a fluid outlet, and the size of the flow-around element near the fluid inlet is smaller than the size of the flow-around element near the fluid outlet.

[0012] Preferably, the first plate portion and the second plate portion are disposed opposite to each other in a first direction, and the fixed end and the free end of the cantilever are disposed opposite to each other in a second direction perpendicular to the first direction; The cross-sectional shape of the flow-through component cut by the first plane is a polygon or a curved surface, and the first plane is parallel to the plane formed by the first direction and the second direction.

[0013] Preferably, the base includes a substrate layer and an insulating layer, the substrate layer being connected to the second plate portion, and the insulating layer being disposed on the side of the substrate layer away from the second plate portion; The cantilever includes a device layer, a first metal electrode, a piezoelectric film, and a second metal electrode stacked sequentially in a direction away from the insulating layer, with the device layer disposed on the side of the insulating layer away from the substrate layer.

[0014] Secondly, the present invention provides a MEMS device, including any of the above-mentioned MEMS controllers.

[0015] The beneficial effects of this invention are as follows: The MEMS controller and MEMS device of this invention utilize a power supply board to control the vibration of the free end of the cantilever, allowing fluid to be drawn in from one of the first and second openings and flow out from the other, thus achieving unidirectional fluid flow control. Furthermore, the power supply board is fixed to the side wall and directly electrically connected to the side of the cantilever away from the base via a conductive structure, eliminating the need for additional wire bonding areas required in related technologies, saving planar area, improving component integration and space utilization, and facilitating the miniaturization of the MEMS controller structure. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the MEMS controller in Embodiment 1 of the present invention.

[0017] Figure 2 for Figure 1 A partial structural diagram of the AA cross-section.

[0018] Figure 3 This is a schematic diagram of the structure of the MEMS controller in Embodiment 1 of the present invention.

[0019] Figure 4 for Figure 3 A partial structural diagram of the BB cross-section.

[0020] Figure 5 for Figure 3 A magnified view of a portion of the C-structure.

[0021] Figure 6 This is a schematic diagram of the working state of a MEMS controller according to Embodiment 1 of the present invention.

[0022] Figure 7 This is a schematic diagram of the working state of a MEMS controller according to Embodiment 1 of the present invention.

[0023] Figure 8This is a time-domain diagram of the flow velocity in the first and second openings of the MEMS controller in Embodiment 1 of the present invention.

[0024] Figure 9 This is a graph showing the relationship between the cumulative airflow rate and the operating time of the MEMS controller in Embodiment 1 of the present invention.

[0025] Figure 10 This is a schematic diagram of the structure of the MEMS controller in Embodiment 1 of the present invention.

[0026] Figure 11 This is a schematic diagram of the structure of a MEMS controller in Embodiment 1 of the present invention, which is used to achieve heat dissipation, with a first opening as a fluid inlet and a second opening as a fluid outlet.

[0027] Figure 12 This is a schematic diagram of the structure of a MEMS controller in Embodiment 1 of the present invention, which is used to achieve heat dissipation, with a first opening as the fluid outlet and a second opening as the fluid inlet. Detailed Implementation

[0028] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0029] Example 1 Please refer to Figure 1According to Embodiment 1 of the present invention, a MEMS controller 10 is provided, including a package shell 1, a power supply board 2, and a control component 3. The package shell 1 includes a first plate portion 11, a second plate portion 12, and a side wall portion 13. The first plate portion 11 and the second plate portion 12 are disposed opposite to each other. The side wall portion 13 connects the first plate portion 11 and the second plate portion 12. The first plate portion 11, the second plate portion 12, and the side wall portion 13 together form a package cavity 14. A first opening 111 is provided on the first plate portion 11, and the first opening 111 penetrates the first plate portion 11. A second opening 121 is provided on the second plate portion 12, and the second opening 121 penetrates the second plate portion 12. The power supply board 2 is housed within the encapsulation cavity 14 and fixed to the side wall portion 13. The power supply board 2 is disposed between the first plate portion 11 and the second plate portion 12. The power supply board 2 divides the encapsulation cavity 14 into two chambers, namely the first chamber 141 and the second chamber 142. The first chamber 141 is disposed near the first plate portion 11 and the second chamber 142 is disposed near the second plate portion 12. The power supply board 2 has a third opening 21 that penetrates the power supply board 2 and is used to connect the first chamber 141 and the second chamber 142. The control component 3 is housed within the encapsulation cavity 14. The control component 3 includes a base 31 and a cantilever 32. The base 31 and the cantilever 32 are located in the second chamber 142. The base 31 is fixed to the second plate portion 12. The cantilever 32 has a fixed end 321 and a free end 322 that are disposed opposite to each other. The fixed end 321 of the cantilever 32 is fixed to the side of the base 31 facing the power supply board 2. The cantilever 32 is electrically connected to the power supply board 2 through the conductive structure 4. Furthermore, the free end 322 of the cantilever 32 is closer to the third opening 21 than the fixed end 321 of the cantilever 32.

[0030] In this embodiment of the invention, one of the first opening 111 and the second opening 121 is a fluid inlet and the other is a fluid outlet. The power supply board 2 controls the vibration of the free end 322 of the cantilever 32, so that fluid can be drawn in from the fluid inlet and flow out from the fluid outlet, realizing unidirectional flow control of the fluid. Moreover, the power supply board 2 is fixed to the side wall portion 13 and directly electrically connected to the side of the cantilever 32 away from the base 31 through the conductive structure 4, that is, the power supply board 2 and the cantilever 32 are mounted face to face, eliminating the additional wire bonding area required by the wire bonding process in related technologies, saving planar area, improving component integration and space utilization, and making it more conducive to the miniaturization of the MEMS controller 10 structure.

[0031] As an example, please refer to Figure 1The first plate portion 11 and the second plate portion 12 are arranged opposite to each other in a first direction. The first plate portion 11, the power supply plate 2 and the second plate portion 12 are respectively arranged perpendicular to the first direction. The first direction is also the thickness direction of the cantilever 32 in the initial state and the vibration direction of the cantilever 32. The fixed end 321 and the free end 322 of the cantilever 32 in the initial state are arranged opposite to each other in a second direction. The second direction is perpendicular to the first direction.

[0032] In some embodiments, the sidewall portion 13 is a hollow cylindrical structure arranged around the first direction, thereby forming a stable fluid channel and guiding the fluid to flow along the intended path.

[0033] In some embodiments, the sidewall portion 13 includes a first sidewall 131 and a second sidewall 132. The first sidewall 131 and the second sidewall 132 are hollow cylindrical structures arranged around a first direction. The first sidewall 131 is connected to the side of the first plate portion 11 facing the second plate portion 12, and the second sidewall 132 is connected to the side of the second plate portion 12 facing the first plate portion 11. The power supply board 2 has a first surface 22 and a second surface 23 arranged opposite to each other in a first direction. A third opening 21 extends from the first surface 22 through the second surface 23. The first surface 22 of the power supply board 2 is fixed to the first sidewall 131, and the second surface 23 of the power supply board 2 is fixed to the second sidewall 132.

[0034] As one implementation, the first plate 11 and the first sidewall 131 are integrally formed, which can reduce assembly steps and avoid gaps or misalignments caused by separate connections.

[0035] As one implementation, the second plate 12 and the second sidewall 132 are integrally formed, which can reduce assembly steps and avoid gaps or misalignments caused by separate connections.

[0036] In some embodiments, the cantilever 32 includes a third surface 323 and a fourth surface 324 disposed opposite to each other in a first direction. The third surface 323 of the cantilever 32 faces the second surface 23 of the power supply board 2, and the fourth surface 324 of the cantilever 32 is connected to the base 31. The conductive structure 4 includes a first pad 41, a second pad 42, and a conductive connector 43. The first pad 41 is disposed on the third surface 323 of the cantilever 32, and the second pad 42 is disposed on the second surface 23 of the power supply board 2. The second pad 42 and the first pad 41 are fixed by the conductive connector 43. As an example, the conductive connector 43 can be at least one of conductive silver paste, conductive silicone containing nano-silver particles, or solder balls.

[0037] In this embodiment, the first pad 41 on the cantilever 32 and the second pad 42 on the power supply board 2 are directly mounted face-to-face through the conductive connector 43, thereby eliminating the planar dimensions required for wire bonding, making the package structure more compact, and facilitating the miniaturization of the MEMS controller 10.

[0038] In some embodiments, the MEMS controller 10 also includes a sealant 5 disposed between the power supply board 2 and the control component 3. The sealant 5 surrounds the power supply board 2 and is located on the outside of the conductive structure 4, which can effectively isolate external moisture and contaminants from entering, prevent short circuits or corrosion between the power supply board 2 and the control component 3, thereby improving the long-term reliability and environmental adaptability of the MEMS controller 10.

[0039] In some embodiments, the control assembly 3 further includes a flow-passing element 33 fixed to the side wall portion 13. The free end 322 of the cantilever 32 is closer to the flow-passing element 33 than the fixed end 321. A first opening 111 and a second opening 121 are respectively located on both sides of the flow-passing element 33 in a first direction, and the flow-passing element 33 extends from the first chamber 141 through a third opening 21 to the second chamber 142. The projection of the first opening 111 along the first direction is at least partially located on the flow-passing element 33, the projection of the second opening 121 along the first direction is at least partially located on the flow-passing element 33, and the dimension of the flow-passing element 33 near the fluid inlet is smaller than the dimension of the flow-passing element 33 near the fluid outlet. The projection of the free end 322 of the cantilever 32 perpendicular to the vibration direction of the cantilever 32 is located on the flow-passing element 33.

[0040] In this embodiment of the invention, the first opening 111 and the second opening 121 are respectively disposed on both sides of the flow-encircling member 33 and their projections are at least partially located on the flow-encircling member 33. The size of the flow-encircling member 33 on the side closer to the fluid inlet is smaller than the size on the side closer to the fluid outlet. The projection of the free end 322 of the cantilever 32 perpendicular to the vibration direction of the cantilever 32 is located on the flow-encircling member 33. The cooperation between the flow-encircling member 33 and the cantilever 32 causes a vortex to be formed around the flow-encircling member 33, thereby reducing the pressure at the fluid inlet and increasing the pressure at the fluid outlet. As a result, when the cantilever 32 vibrates, the fluid is drawn into the encapsulation shell 1 from the fluid inlet and discharged from the encapsulation shell 1 from the fluid outlet. As time accumulates, the net flow rates of the first opening 111 and the second opening 121 alternately increase, achieving a unidirectional flow control effect. This avoids the use of various active valves and / or passive valves, simplifies the overall structure, and significantly improves long-term operational reliability.

[0041] The projection of the free end 322 of the cantilever 32 along the direction perpendicular to the vibration direction of the cantilever 32 onto the flow-around member 33 means that the projection of the free end 322 of the cantilever 32 along the second direction is located on the flow-around member 33.

[0042] In some examples, please refer to Figure 1 , the projection of the free end 322 of the cantilever 32 in the second direction is completely located on the flow deflector 33, which can make the kinetic energy during the vibration of the cantilever 32 be more directly transferred to the flow field around the flow deflector 33, promote the formation of eddy currents, and thus improve the response speed and reliability of the unidirectional flow control.

[0043] It should be noted that in other embodiments, it can also be that a part of the projection of the free end of the cantilever in the second direction is located on the flow deflector, which can be set according to the actual situation and will not be elaborated here.

[0044] As an embodiment, the projection of the first opening 111 in the first direction can be partially located on the flow deflector 33 or can also be entirely located on the flow deflector 33. The projection of the second opening 121 in the first direction can be partially located on the flow deflector 33 or can also be entirely located on the flow deflector 33.

[0045] In some embodiments, by applying an alternating driving signal to the cantilever 32, the displacement of the free end 322 of the cantilever 32 in the first direction satisfies: , where f0 is the resonance frequency of the cantilever 32 and d0 is the amplitude of the vibration of the cantilever 32. Under the vibration of the cantilever 32, the pressure on both sides of the free end 322 of the cantilever 32 alternates, thus forming eddy currents. As time goes by, the eddy currents drive the fluid to move away from the free end 322 of the cantilever 32 and impact the surface of the flow deflector 33. After the fluid impacts the surface of the flow deflector 33, it moves along the outer contour of the cross-section of the flow deflector 33, and after a period of time, a relatively stable flow-around is formed. Due to the asymmetry of the flow deflector 33 itself, a pressure difference is formed in the first chamber 141 and the second chamber 142. The pressure of the encapsulation cavity 14 near the first opening 111 is p1, and the pressure of the encapsulation cavity 14 near the second opening 121 is p2. Please refer to Figure 6 as shown in Figure 6 (a) and Figure 7 (b). If p1 < p2, then finally the fluid enters the encapsulation cavity 14 from the first opening 111 and flows out from the second opening 121, forming a unidirectional flow. Please refer to Figure 7As shown in (b), if p1 > p2, the fluid will eventually enter the encapsulation cavity 14 through the second opening 121 and flow out through the first opening 111, thus forming a unidirectional flow. The relationship between p1 and p2 is determined by parameters such as the volume ratio of the first cavity 141 and the second cavity 142, the shape, size and placement of the cantilever 32, the shape, size and placement of the flow-around element 33, and the size, number and placement of the first opening 111 and the second opening 121, which ultimately determine the directionality of the unidirectional flow of the fluid. As an example, the volume distribution of the first chamber 141 and the second chamber 142 can be controlled by adjusting the position of the power supply board 2 in the first direction and the ratio of the height of the first chamber 141 in the first direction to the height of the second chamber 142 in the first direction; or, the pressure distribution of the fluid in the first chamber 141 and the second chamber 142 can be controlled by adjusting the position of the first opening 111 and the second opening 121 in the second direction, and / or the ratio of the width of the first opening 111 in the second direction to the width of the first opening 111 in the second direction; or, the pressure distribution of the fluid in the first chamber 141 and the second chamber 142 can be controlled by adjusting the shape, size and / or placement of the flow-around member 33.

[0046] Please refer to Figure 8 When fluid flows in through the first opening 111 and out through the second opening 121, the time-domain velocity diagram of the first opening 111 is as follows: Figure 8 As shown in (a), the flow velocity time-domain plot of the second opening 121 is as follows. Figure 8 As shown in (b), when fluid flows in through the second opening 121 and out through the first opening 111, the time-domain velocity diagram of the first opening 111 is as follows. Figure 8 As shown in (c), the flow velocity time-domain plot of the second opening 121 is as follows. Figure 8 As shown in (d).

[0047] Please refer to Figure 9 , Figure 9 Curve S100 is the fluid inlet flow rate curve of the MEMS controller 10 in this embodiment of the invention; curve S200 is the fluid outlet flow rate curve of the MEMS controller 10 in this embodiment of the invention; curve S300 is the fluid inlet flow rate curve of a comparative MEMS controller without a flow-around element; and curve S400 is the fluid outlet flow rate curve of a comparative MEMS controller without a flow-around element (the fluid inlet flow rate curve S300 and the fluid outlet flow rate curve S400 of the comparative MEMS controller without a flow-around element basically overlap). Figure 9As can be seen, in this embodiment of the invention, the airflow generated by the vibration of the cantilever 32 flows around the flow-around member 33, causing a pressure redistribution in the first chamber 141 and the second chamber 142. Although the transient velocity directions of the fluid inlet and outlet change periodically with the vibration of the cantilever 32, the net velocity directions of the fluid inlet and outlet are determined due to the pressure difference in the flow field between the first chamber 141 and the second chamber 142. Under the influence of the net flow rate, the net flow rates of the fluid inlet and outlet alternately increase over time, achieving a unidirectional flow control effect. Figure 9 It can also be seen that in the comparative example without a flow-around element, the pressure distribution in the first and second chambers changes almost symmetrically with the periodic vibration of the cantilever. Therefore, the flow velocities at the fluid inlet and outlet of the MEMS controller in the comparative example without a flow-around element also change symmetrically and periodically, and cannot accumulate effective net flow over time.

[0048] In some embodiments, the size of the fluid outlet is larger than the size of the fluid inlet. For example, the width of the fluid outlet in the second direction is greater than the width of the fluid inlet in the second direction. It should be noted that in other embodiments, the width of the fluid outlet in the third direction may also be greater than the width of the fluid inlet in the third direction; or, the width of the fluid outlet in the second direction may be greater than the width of the fluid inlet in the second direction, and the width of the fluid outlet in the third direction may also be greater than the width of the fluid inlet in the third direction. Wherein, the first direction, the second direction, and the third direction are mutually perpendicular.

[0049] In this embodiment, the interaction between the flow-around element 33 and the cantilever 32 generates vortices around the flow-around element 33, resulting in a lower pressure at the fluid inlet and a higher pressure at the fluid outlet. The smaller size of the fluid inlet can increase the inflow velocity and reduce backflow and disturbance at the fluid inlet under low-pressure drive, while the larger size of the fluid outlet can reduce the discharge resistance under high-pressure drive, allowing the fluid outlet to obtain a larger effective flow area under higher pressure. This fully utilizes the pressure difference to increase the net flow rate and overall flow velocity of the fluid, thereby enhancing the fluid drive efficiency and stability of unidirectional flow.

[0050] In some implementation methods, please refer to Figure 1 and Figure 3 , Figure 1 and Figure 3The structure shown is a cross-sectional view of the MEMS controller 10 cut by the first plane. The cross-sectional shape of the flow-around element 33 cut by the first plane can be, but is not limited to, a polygon or a curved surface, etc., and is an asymmetrical shape with one end larger than the other in the first direction. Furthermore, the smaller end of the flow-around element 33 in the first direction is closer to the fluid inlet side, and the larger end of the flow-around element 33 in the first direction is closer to the fluid outlet side. The first plane is parallel to the plane formed by the first and second directions, i.e., the first plane is perpendicular to the third direction. As an example, the cross-sectional shape of the flow-around element 33 can be as follows: Figure 1 The triangle shown, or as Figure 3 The streamline shape is shown. It should be noted that in other embodiments, the cross-section of the flow element cut by the first plane can also be a trapezoid or other polygonal shape, or a teardrop or other curved surface shape.

[0051] In some embodiments, the flow-around component 33 is integrally formed with the encapsulation shell 1, which can reduce assembly steps and avoid gaps or misalignments caused by separate connections. It should be noted that in other embodiments, the flow-around component can also be a separate component.

[0052] As one implementation method, please refer to Figure 2 and Figure 4 , Figure 2 The structure shown is that the MEMS controller 10 is... Figure 1 The cross-sectional view shown is taken at section AA. Figure 4 The structure shown is that the MEMS controller 10 is... Figure 3 The cross-sectional view shown is taken from section BB. The flow-encircling element 33 is fixed to the sidewall portion 13 at both ends in the third direction, ensuring that the position of the flow-encircling element 33 within the encapsulation cavity 14 remains fixed and does not shift. This stabilizes and guides eddy current formation and pressure differential distribution during cantilever 32 vibration, improving the reliability of unidirectional flow control. As one embodiment, please refer to... Figure 2 and Figure 4 The flow-around component 33 is fixed to the second side wall 132 at both ends in the third direction.

[0053] In some implementation methods, please refer to Figure 1The base 31 has a fifth surface 311 and a sixth surface 312 disposed opposite to each other in a first direction. The fifth surface 311 of the base 31 is fixed to the fourth surface 324 of the cantilever 32, and the sixth surface 312 of the base 31 is fixed to the second plate portion 12. The side of the base 31 and the cantilever 32 away from the flow-around member 33 in the second direction is fixed to the side wall portion 13. Through multi-directional positioning and fixing, the base 31 and the cantilever 32 are securely limited between the second plate portion 12 and the side wall portion 13, preventing the base 31 from shifting or deflecting, thereby ensuring the relative positional accuracy of the cantilever 32 and the flow-around member 33, improving assembly consistency and the reliability of flow field control. As one embodiment, the side of the base 31 and the cantilever 32 away from the flow-around member 33 in the second direction is fixed to the second side wall 132.

[0054] In some implementations, the driving mode of the cantilever 32 includes, but is not limited to, piezoelectric, electrostatic, electromagnetic, or thermoelectric modes.

[0055] In some implementation methods, please refer to Figure 5 The control component 3 can be implemented based on SOI (Silicon on Isolation) technology. The base 31 includes a substrate layer 313 and an insulating layer 314, and the cantilever 32 includes a device layer. The substrate layer 313 is connected to the second plate portion 12, the insulating layer 314 is disposed on the side of the substrate layer 313 away from the second plate portion 12, and the device layer is disposed on the side of the insulating layer 314 away from the substrate layer 313.

[0056] As one implementation method, please refer to Figure 5 The cantilever 32 is piezoelectrically driven and includes a device layer 325, a first metal electrode 326, a piezoelectric film 327, and a second metal electrode 328. These components are sequentially arranged in a first direction away from the insulating layer 314. The device layer 325 can be, but is not limited to, silicon; that is, it can be silicon-doped. The piezoelectric film 327 can be, but is not limited to, PZT (Lead Zirconate Titanate), AlN (Aluminum Nitride), AlScN (Aluminum Scandium Nitride), KNN (Potassium Sodium Niobate), ZnO (Zinc Oxide), or other piezoelectric materials.

[0057] In some implementations, the frequency of the drive signal received by the cantilever 32 is equal to the resonant frequency of the cantilever 32, thereby maximizing the vibration efficiency of the cantilever 32.

[0058] In some implementations, the frequency of the drive signal received by the cantilever 32 is within the ultrasonic frequency range, that is, the frequency of the drive signal received by the cantilever 32 is greater than 20KHz, so that there is no audible audio excitation and the effect of silent operation is achieved.

[0059] In some implementations, the control component 3 may include one or more cantilever 32.

[0060] As one implementation method, please refer to Figure 2 The control component 3 includes a cantilever 32.

[0061] As one implementation method, please refer to Figure 4 The control component 3 includes multiple cantilever arms 32, which are spaced apart and arranged parallel to each other in a third direction. The fixed ends 321 of each cantilever arm 32 are fixed to the base 31, and the free end 322 of each cantilever arm 32 is closer to the flow-passing element 33 than its fixed end 321. As an example, the fixed ends 321 of the multiple cantilever arms 32 are connected as a single unit, which not only simplifies assembly and ensures that the fixed ends 321 of each cantilever arm 32 are in the same position, reducing positional deviations caused by individual fixing, but also further improves the consistency of the control component 3's operation and its reliability. In some examples, the control component 3 includes two cantilever arms 32. It should be noted that in other embodiments, the control component may include three or more cantilever arms, which can be set according to actual conditions, and will not be elaborated here.

[0062] In some implementations, the projection of the cantilever 32 in the first direction can be, but is not limited to, a rectangle (see reference). Figure 2 Trapezoids, triangles, or apodized polygons, etc., can be set according to the actual situation, which will not be elaborated here.

[0063] In some implementations, the MEMS controller 10 includes one or more control components 3.

[0064] As one implementation method, please refer to Figure 1 and Figure 3 The MEMS controller 10 includes a control component 3.

[0065] As one implementation method, please refer to Figure 10The MEMS controller 10 includes multiple control components 3, which are arranged sequentially at intervals. The package 1 includes multiple first openings 111 and multiple second openings 121. The power supply board 2 includes multiple third openings 21. The number of first openings 111 is equal to the number of control components 3, and each first opening 111 corresponds to one control component 3. The number of second openings 121 is equal to the number of control components 3, and each second opening 121 corresponds to one control component 3. The number of third openings 21 is equal to the number of control components 3, and each third opening 21 corresponds to one control component 3. As an example, the multiple control components 3 are arranged sequentially at intervals in a first direction.

[0066] In some implementations, the MEMS controller 10 can be applied to various applications such as pumps, fans, and material transport. As one implementation, the MEMS controller 10 can be used as a heat sink for heat dissipation.

[0067] As an example, please refer to Figure 11 When the MEMS controller 10 controls the fluid to flow from the first opening 111 to the second opening 121, it places the object requiring heat dissipation (such as a CPU chip), i.e., the heat source 20, on one side of the second opening 121, and positions the heat source 20 perpendicular to the air outlet direction of the second opening 121. Driven by the MEMS controller 10, cool air flows in from one side of the first opening 111, flows around inside the encapsulation cavity 14, and flows out from one side of the second opening 121, blowing onto the surface of the heat source 20, thereby efficiently removing the heat from the heat source 20 and achieving active heat dissipation.

[0068] As an example, please refer to Figure 12 When the MEMS controller 10 controls the fluid to flow from the second opening 121 to the first opening 111, it places the object requiring heat dissipation (such as a CPU chip), i.e., the heat source 20, on one side of the first opening 111, and positions the heat source 20 perpendicular to the air outlet direction of the first opening 111. Driven by the MEMS controller 10, cool air flows in from one side of the second opening 121, flows around inside the encapsulation cavity 14, and flows out from one side of the first opening 111, blowing onto the surface of the heat source 20, thereby efficiently removing the heat from the heat source 20 and achieving active heat dissipation.

[0069] It should be noted that in other embodiments, the MEMS controller 10 can also be applied to other applications requiring unidirectional flow, such as loudspeakers, and can be configured according to actual conditions, which will not be elaborated here.

[0070] Example 2 The second embodiment of the present invention is a MEMS device, including the MEMS controller 10 provided in any of the above embodiments.

[0071] The above description is merely an embodiment of the present invention. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of the present invention, but these improvements all fall within the protection scope of the present invention.

[0072] The above description is merely an embodiment of the present invention. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of the present invention, but these improvements all fall within the protection scope of the present invention.

Claims

1. A MEMS controller, characterized by, The MEMS controller comprises: a package shell, comprising oppositely arranged first and second plate portions and a side wall portion connecting the first and second plate portions, the first and second plate portions and the side wall portion collectively defining a package cavity, the first plate portion being provided with a first opening extending through the first plate portion, and the second plate portion being provided with a second opening extending through the second plate portion; a power supply plate, accommodated in the package cavity, the power supply plate being fixed to the side wall portion and arranged between the first and second plate portions, the power supply plate dividing the package cavity into a first chamber close to the first plate portion and a second chamber close to the second plate portion, the power supply plate being provided with a third opening extending through the power supply plate, the third opening being configured to communicate the first and second chambers; and a control assembly, accommodated in the package cavity, the control assembly comprising a base in the second chamber and a cantilever, the base being fixed to the second plate portion, the cantilever having oppositely arranged fixed and free ends, the fixed end of the cantilever being fixed to the base on a side facing the power supply plate and electrically connected to the power supply plate through a conductive structure. The side wall portion comprises a first side wall connected to the first plate portion on a side facing the second plate portion and a second side wall connected to the second plate portion on a side facing the first plate portion.

2. The MEMS controller of claim 1, wherein, The power supply plate has oppositely arranged first and second surfaces, the third opening extending through the power supply plate from the first surface to the second surface, the first surface of the power supply plate being fixed to the first side wall, and the second surface of the power supply plate being fixed to the second side wall. The conductive structure comprises a first pad arranged on a side surface of the cantilever facing the power supply plate, a second pad arranged on a side surface of the power supply plate facing the cantilever, and a conductive connecting member electrically connecting the first and second pads.

3. The MEMS controller of claim 1, wherein, The conductive connecting member is at least one of conductive silver paste, conductive silicone containing nano-silver particles, or a tin ball.

4. The MEMS controller of claim 3, wherein, The MEMS controller further comprises a sealing structure arranged on a side of the power supply plate facing the control assembly, the sealing structure being connected between the power supply plate and the control assembly and located outside the conductive connecting member.

5. The MEMS controller of claim 3, wherein, The control assembly further comprises a flow-around member, the flow-around member being fixed to the side wall portion, and the flow-around member extending from the first chamber to the second chamber through the third opening, projections of the first and second openings being at least partially located on the flow-around member, the first and second openings being arranged on opposite sides of the flow-around member, and a projection of the free end of the cantilever along a direction perpendicular to a vibration direction of the cantilever being located on the flow-around member.

6. The MEMS controller of claim 1, wherein, One of the first and second openings is a fluid inlet, and the other is a fluid outlet, a dimension of the flow-around member close to the fluid inlet being smaller than a dimension of the flow-around member close to the fluid outlet.

7. The MEMS controller of claim 6, wherein, The first and second plate portions are arranged opposite to each other in a first direction, and the fixed and free ends of the cantilever are arranged opposite to each other in a second direction perpendicular to the first direction.

8. The MEMS controller of claim 6, wherein, ​ The cross section of the flow member, which is cut by a first plane parallel to the plane formed by the first direction and the second direction, is polygonal or curved.

9. The MEMS controller of claim 1, wherein, The base includes a substrate layer connected to the second plate portion and an insulating layer provided on a side of the substrate layer away from the second plate portion. The cantilever includes, in order from a side of the insulating layer away from the substrate layer, a device layer, a first metal electrode, a piezoelectric thin film, and a second metal electrode.

10. A MEMS device, characterized by Comprising: The MEMS controller of any one of claims 1-9.

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