Low-temperature high-density magnetron sputtering coating equipment for modified plastic base material

Abstract

The invention relates to the technical field of magnetron sputtering, and particularly discloses a low-temperature high-density magnetron sputtering coating device for a modified plastic base material, the low-temperature high-density magnetron sputtering coating device comprises a vacuum chamber, one side of the vacuum chamber communicates with a feeding channel, the inner wall of the vacuum chamber penetrates through and is rotatably connected with a coating mechanism, and the two sides of the inner wall of the vacuum chamber are fixedly connected with partition plates; a first feeding port is formed in one side of the vacuum chamber, a second feeding port is formed in one side of the partition plate, first guide plates penetrate through and are fixedly connected to the two sides of the inner wall of the first feeding port and the two sides of the inner wall of the second feeding port, and a radio frequency plasma generator is fixedly connected to the part, away from the coating mechanism, of the top of the inner wall of the vacuum chamber; according to the low-temperature high-density magnetron sputtering coating equipment for the modified plastic base material, the base material is prevented from being deformed due to high temperature through the parallel coiled pipes in the bearing seat of the feeding channel, the structural integrity of a coating is improved, the coating mechanism is arranged, it is ensured that target material atoms are evenly released and deposited on the base material, and the sputtering density is improved.

Description

Technical Field

[0001] This invention relates to the field of magnetron sputtering technology, specifically to a low-temperature, high-density magnetron sputtering coating equipment for modified plastic substrates. Background Technology

[0002] With the rapid development of the automotive, electronics, and aerospace industries, modified plastics, with their excellent properties such as lightweight, high strength, corrosion resistance, and easy processing, are gradually replacing traditional metal materials as the core substrate for various parts. To further expand the application scenarios of modified plastics and improve their surface properties, such as wear resistance, conductivity, decoration, and corrosion resistance, surface coating treatment of modified plastic substrates has become the mainstream technology direction in the industry. Among them, magnetron sputtering coating technology is widely used in the surface modification processing of modified plastic substrates due to its advantages such as strong adhesion between the film and the substrate, good film uniformity, fast deposition rate, and the ability to prepare films of various materials. The core principle of magnetron sputtering coating technology is to use a magnetic field to confine the movement of electrons in a vacuum environment, so that the electrons collide with inert gas to generate plasma. The positive ions in the plasma bombard the surface of the target material under the action of an electric field, causing the target atoms or molecules to escape and deposit on the surface of the substrate to form a functional film.

[0003] Chinese patent CN120443122A discloses a magnetron sputtering coating equipment that can achieve good cooling of the substrate during sputtering, but it cannot achieve stable temperature control of the target material. Furthermore, the substrate is not pre-cleaned, and oil, impurities, and moisture on the substrate may reduce the quality of the coating and affect its density. Summary of the Invention

[0004] To solve the above technical problems, the present invention is achieved through the following technical solution: a low-temperature high-density magnetron sputtering coating device for modified plastic substrates, comprising a vacuum chamber, a feeding channel connected to one side of the vacuum chamber, a coating mechanism rotatably connected through the inner wall of the vacuum chamber, partitions fixedly connected to both sides of the inner wall of the vacuum chamber, a first feeding port opened on one side of the vacuum chamber, a second feeding port opened on one side of the partition, a first guide plate rotatably connected to both sides of the inner walls of the first and second feeding ports, a sealing switch gate fixedly connected to one side of the partition and one side of the inner wall of the vacuum chamber, and a radio frequency plasma generator fixedly connected to the top of the inner wall of the vacuum chamber away from the coating mechanism. The vacuum chamber has a portion of its side above the feed channel connected to the outlet of a first air inlet valve. The side of the vacuum chamber away from the first air inlet valve is connected to the outlet of a second air inlet valve. The portion of the vacuum chamber's side near the first air inlet valve is connected to the inlet of a first suction pump. The portion of the vacuum chamber's side near the second air inlet valve is connected to the inlet of a second suction pump. A temperature-controlled water tank and a recovery water tank are fixedly connected to the top of the vacuum chamber. The temperature-controlled water tank and the recovery water tank are connected via a first pipe. The recovery water tank has an inlet connected to a first circulation pump on one side. The outlet of the first circulation pump and a side of the temperature-controlled water tank are both connected to a second pipe, which is connected to the coating mechanism.

[0005] Preferably, positioning plates are fixedly connected to the portions of the inner walls of the first guide plate located below the coating mechanism, the first guide plate extends into the feed channel, and the bottom of the first guide plate is fixedly connected to the bottom of the inner wall of the vacuum chamber.

[0006] Preferably, a conveying mechanism is provided at the bottom of the inner wall of the feeding channel, a preheating mechanism is connected through and fixedly connected to the top of the inner wall of the feeding channel, a mounting frame is fixedly connected to the top of the conveying mechanism, second guide plates are fixedly connected to both sides of the mounting frame, an elastic buffer pad is fixedly connected to the top of the mounting frame, a support seat is fixedly connected to the top of the elastic buffer pad, a placement slot is opened on the top of the support seat, positioning components are fixedly connected to each diagonal of the placement slot, a trigger switch is fixedly connected to each diagonal of the placement slot, and limit channels are fixedly connected to both sides of each diagonal of the placement slot. After the personnel fix the substrate using the positioning components, they start the exhaust fan to blow the air heated by the preheating box evenly onto the substrate surface through the ventilation grille to remove moisture and residual organic matter. The first feed port sealing gate is opened, and the transport mechanism sends the substrate to the cleaning area. The feed port gates on both sides are closed, and the first air inlet valve and the radio frequency plasma generator are started to stimulate argon gas to form low-energy plasma, which sputters and cleans the substrate surface in all directions. The gas generated during cleaning is extracted by the first air pump. The second feed port gate is opened, and the substrate is transported to the positioning plate to ensure that it is aligned with the coating mechanism for coating operation. After coating, the substrate returns along the same route.

[0007] Preferably, a circulating cooling tank is fixedly connected to the bottom of the mounting frame. The inlet of a second circulating pump is connected to one side of the circulating cooling tank, and an outlet pipe is connected to the outlet of the second circulating pump. An inlet pipe is connected to the side of the circulating cooling tank away from the second circulating pump. A parallel serpentine tube is fixedly connected through and to the bottom of the inner wall of the placement tank. Both ends of the parallel serpentine tube pass through the bearing seat and are connected to the outlet pipe and the inlet pipe, respectively. A heat-conducting plate is fixedly connected to the bottom of the inner wall of the placement tank. During coating, the elastic buffer pad reduces equipment vibration and avoids uneven coating. The heat-conducting plate evenly absorbs the heat generated by the coating deposition and conducts it to the parallel serpentine tube. The second circulating pump drives the coolant to circulate between the parallel serpentine tube and the circulating cooling tank, continuously removing heat. This forms a dual temperature control system with the semiconductor cooling chip of the positioning component, eliminating local hot spots and temperature gradients.

[0008] Preferably, the positioning component includes a positioning seat with a positioning groove on one side. A thermoelectric cooler is fixedly connected to both sides of the inner wall of the positioning groove. A guide slide is fixedly connected to the top of the positioning seat. Springs are fixedly connected to both the guide slide and the side of the positioning seat. A trigger rod is fixedly connected to the side of the positioning seat. The bottom of the positioning seat is slidably connected to the top of the heat-conducting plate. The end of the spring furthest from the positioning seat is fixedly connected to the diagonal corner of the inner wall of the placement groove. When the substrate is placed in the placement groove of the carrier seat, the substrate first squeezes the guide slide, pushing the guide slide to compress the spring. The spring force achieves adaptive clamping of the substrate, allowing it to accurately fall into the positioning groove for positioning and fixing. The limiting channel restricts the movement of the positioning seat to prevent shaking and deviation. During clamping, the guide slide moves the positioning seat, which in turn moves the trigger rod and contacts the trigger switch. The trigger switch sends a command to activate the thermoelectric cooler. During coating, the thermoelectric cooler continues to work, cooling the heat generated by the coating deposition. After coating, the substrate is sucked out by a vacuum suction cup, and the substrate smoothly slides out along the circular slide at the top of the inner wall of the positioning seat.

[0009] Preferably, the preheating mechanism includes a preheating box with an air outlet at the bottom. An air venting grille is fixedly connected to the inner wall of the air outlet. An air outlet of an induced draft fan is fixedly connected to the top of the preheating box. The preheating box passes through and is fixedly connected to the feeding channel. The substrate is placed in the placement slot of the support seat. After the substrate contacts the guide slide, the guide slide is adaptively adjusted according to the size of the substrate under the action of a spring, so that the substrate falls accurately into the positioning slot and is fixed, avoiding displacement caused by transportation or equipment vibration. During the coating process, the semiconductor cooling chip continues to work to cool the heat generated by the coating deposition.

[0010] Preferably, the coating mechanism includes a target tube with sealing joints at both ends. A cooling pipe is connected to one side of the inner wall of the target tube, and cooling spray holes are evenly distributed on the side of the cooling pipe. The sealing joint at one end of the target tube is connected to the cooling pipe. The output end of a belt drive mechanism is sleeved and fixedly connected to the sealing joint at one end of the target tube. The input end of the belt drive mechanism is fixedly connected to the drive shaft of a drive motor. The sealing joint passes through the vacuum chamber and is rotatably connected to the vacuum chamber. One end of the sealing joint is connected to a second pipe, and the sealing joint is rotatably connected to the second pipe. The drive motor is fixedly connected to one side of the vacuum chamber via a bracket. During coating, the second inlet valve is activated to deliver argon gas to the target tube area of ​​the vacuum chamber. Simultaneously, the second feed port sealing switch gate closes the feed port. After plasma is generated by arc discharge in the vacuum chamber, the drive motor is started. Its drive shaft drives the input end of the belt drive mechanism to rotate, and through the output end of the belt drive mechanism, it drives the sealing joint and the target tube to rotate synchronously, so that the plasma bombards the target tube evenly. The sputtered target material atoms are evenly deposited on the surface of the substrate. When the target tube generates heat through sputtering, the first circulation pump transports the cooled water in the temperature-controlled water tank to one end of the sealing joint through the second pipe, and then sends it into the cooling pipe in the target tube. It is evenly sprayed out through the cooling nozzle to cool the inside of the target tube. The water after heat exchange is drawn out to the recovery water tank through the other end of the second pipe, and then flows back to the temperature-controlled water tank through the first pipe for recycling, forming a circulating cooling.

[0011] This invention provides a low-temperature, high-density magnetron sputtering coating apparatus for modified plastic substrates. It offers the following advantages: 1. This modified plastic substrate uses a low-temperature, high-density magnetron sputtering coating equipment. A partition divides the vacuum chamber into a cleaning zone and a deposition zone. With the sealing switch gates of the first and second feed inlets, the cleaning and deposition processes are isolated, preventing impurities such as water vapor and organic residue generated during cleaning from spreading to the deposition zone. This solves the problem of cleaning impurities interfering with deposition in traditional integrated vacuum chambers. The airflow heated by the preheating box is evenly blown through the ventilation grille, which can quickly remove water vapor and residual organic matter from the substrate surface. Subsequent radio frequency plasma all-round sputtering cleaning can peel off the oxide layer and microscopic impurities on the substrate surface, improving the surface activity of the substrate. After double cleaning, the film-substrate adhesion is improved, effectively avoiding coating peeling and flaking problems. At the same time, it provides a uniform surface for subsequent magnetron sputtering, improving the coating density. The transport mechanism realizes the automatic transfer of the substrate between the cleaning zone and the deposition zone.

[0012] 2. This modified plastic substrate uses a low-temperature, high-density magnetron sputtering coating equipment. It employs a spring-loaded, limit-guided, driveless positioning structure to achieve rapid and precise substrate fixation. After placement, the substrate is compressed by pressing the guide slide to release the spring, automatically falling into the positioning slot for clamping. No additional driving components are required, making operation convenient and efficient. The limit channel restricts the shaking and offset of the positioning seat during movement, improving clamping stability and preventing substrate displacement during transportation and coating. This provides a stable benchmark for uniform coating. Simultaneously, during positioning, the guide slide drives a trigger rod to activate a switch, automatically activating the semiconductor cooling chip on the inner wall of the positioning slot. This chip absorbs the heat generated by coating deposition in real time, precisely controlling the substrate surface temperature within a suitable range. This effectively avoids problems such as coarse coating grains and decreased density caused by high temperatures, ensuring coating uniformity and structural integrity, and improving the yield of finished coating products. After coating, a vacuum chuck, in conjunction with a circular slide, can quickly remove the substrate, further improving equipment efficiency.

[0013] 3. The modified plastic substrate is coated using a low-temperature, high-density magnetron sputtering equipment. An elastic buffer pad absorbs equipment vibration, preventing uneven coating caused by vibration. The heat-conducting plate evenly absorbs the heat deposited by the coating. Compared to the substrate directly contacting the cooling pipe, this method ensures a more uniform temperature distribution on the substrate surface. The coolant in the parallel serpentine tube circulates and dissipates heat under the drive of the second circulation pump, quickly removing heat and preventing the substrate from deforming due to high temperatures. The uniform heat distribution characteristics of the heat-conducting plate and the semiconductor cooling of the positioning components form a dual cooling system of active heat dissipation and precise temperature control. This effectively avoids internal stress caused by temperature gradients in the coating, preventing cracking and peeling of the coating, improving the integrity of the coating structure, and solving the problem of high defect rate caused by heat accumulation in thick film deposition.

[0014] 4. The modified plastic substrate is coated using a low-temperature, high-density magnetron sputtering equipment. Through the linkage design of the drive motor, belt drive, and target tube rotation, the target tube is rotated at a uniform speed, allowing the plasma to bombard the target tube surface uniformly from all directions. This ensures that target atoms are released and deposited evenly on the substrate surface, avoiding the problem of excessively thick or thin coatings in some areas, thus improving the coating quality and consistency. To address the large amount of heat generated by target tube sputtering, a highly efficient heat dissipation system of circulating water cooling and uniform spray cooling is adopted. Cooling water from the temperature-controlled water tank is transported to the internal cooling pipes of the target tube by a circulating pump and is uniformly sprayed out through cooling nozzles, fully exchanging heat with the inner wall of the target tube, improving cooling efficiency, and stabilizing the target tube temperature within a safe range. This prevents the target tube from softening, volatilizing, or being damaged due to high temperatures, extending the target tube's service life. Furthermore, the cooling water can be recycled and reused, reducing water consumption. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the low-temperature high-density magnetron sputtering coating equipment for modified plastic substrates according to the present invention; Figure 2 This is a schematic diagram of the internal structure of the vacuum chamber of the present invention; Figure 3 This is a schematic diagram of the internal connection structure of the feed channel of the present invention; Figure 4 This is a schematic diagram of the connection structure of the transmission mechanism of the present invention; Figure 5 This is a schematic diagram of the preheating mechanism of the present invention; Figure 6 This is a schematic diagram of the connection structure of the positioning component of the present invention; Figure 7 This is a schematic diagram of the parallel serpentine tube connection structure of the present invention; Figure 8 This is a schematic diagram of the connection structure of the coating mechanism of the present invention.

[0016] In the diagram: 1. Vacuum chamber; 2. Feeding channel; 3. Coating mechanism; 4. Partition plate; 5. First feed inlet; 6. Second feed inlet; 7. First guide plate; 8. Sealing switch gate; 9. Radio frequency plasma generator; 10. First air inlet valve; 11. Second air inlet valve; 12. First vacuum pump; 13. Second vacuum pump; 14. Temperature-controlled water tank; 15. Recycle water tank; 16. First pipeline; 17. First circulation pump; 18. Second pipeline; 19. Positioning plate; 21. Transmission mechanism; 22. Preheating mechanism; 23. Mounting bracket; 24. Elastic buffer pad; 25. Bearing seat; 26. Placement slot; 27. Positioning assembly; 28. Circulating cooling box; 29. ​​Second circulating pump; 210. Water outlet pipe; 211. Water inlet pipe; 212. Parallel serpentine pipe; 213. Heat-conducting plate; 214. Second guide plate; 215. Trigger switch; 216. Limit channel; 221. Preheating box; 222. Air outlet; 223. Air venting grille; 224. Exhaust fan; 271. Positioning seat; 272. Positioning groove; 273. Semiconductor cooling chip; 274. Guide slide; 275. Spring; 276. Trigger rod; 31. Target tube; 32. Cooling pipe; 33. Sealing joint; 34. Belt drive mechanism; 35. Drive motor; 36. Cooling nozzle. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] For the first embodiment, please refer to... Figures 1-5This invention provides a technical solution: a low-temperature, high-density magnetron sputtering coating apparatus for modified plastic substrates, comprising a vacuum chamber 1, a feeding channel 2 connected to one side of the vacuum chamber 1, a coating mechanism 3 rotatably connected through the inner wall of the vacuum chamber 1, partitions 4 fixedly connected to both sides of the inner wall of the vacuum chamber 1, a first feeding port 5 opened on one side of the vacuum chamber 1, a second feeding port 6 opened on one side of the partition 4, a first guide plate 7 fixedly connected through both sides of the inner walls of the first feeding port 5 and the second feeding port 6, a sealing switch gate 8 fixedly connected to one side of the partition 4 and one side of the inner wall of the vacuum chamber 1, and a radio frequency device fixedly connected to the top part of the inner wall of the vacuum chamber 1 away from the coating mechanism 3. The plasma generator 9 has a vacuum chamber 1 with a portion of its side above the feed channel 2 connected to the outlet of a first air inlet valve 10. The side of the vacuum chamber 1 away from the first air inlet valve 10 is connected to the outlet of a second air inlet valve 11. The side of the vacuum chamber 1 near the first air inlet valve 10 is connected to the inlet of a first vacuum pump 12. The side of the vacuum chamber 1 near the second air inlet valve 11 is connected to the inlet of a second vacuum pump 13. A temperature-controlled water tank 14 and a recovery water tank 15 are fixedly connected to the top of the vacuum chamber 1, respectively. The temperature-controlled water tank 14 and the recovery water tank 15 are connected through a first pipe 16. The recovery water tank 15 has an inlet connected to a first circulation pump 17 on one side. The outlet of the circulating pump 17 is connected to a second pipe 18 on one side of the temperature-controlled water tank 14. The second pipe 18 is connected to the coating mechanism 3. Positioning plates 19 are fixedly connected to the inner walls of the first guide plate 7 below the coating mechanism 3. The first guide plate 7 extends into the feed channel 2. The bottom of the first guide plate 7 is fixedly connected to the bottom of the inner wall of the vacuum chamber 1. A transmission mechanism 21 is provided at the bottom of the inner wall of the feed channel 2. A preheating mechanism 22 is fixedly connected through and fixedly connected to the top of the inner wall of the feed channel 2. A mounting bracket 23 is fixedly connected to the top of the transmission mechanism 21. Second guide plates 214 are fixedly connected to both sides of the mounting bracket 23. An elastic [mechanism] is fixedly connected to the top of the mounting bracket 23. The cushioning pad 24 has a support seat 25 fixedly connected to its top. The support seat 25 has a placement groove 26 on its top. Positioning components 27 are fixedly connected to the opposite corners of the placement groove 26. Trigger switches 215 are fixedly connected to the opposite corners of the placement groove 26. Limiting channels 216 are fixedly connected to both sides of the opposite corners of the placement groove 26. The preheating mechanism 22 includes a preheating box 221. An air outlet 222 is connected to the bottom of the preheating box 221. A ventilation grille 223 is fixedly connected to the inner wall of the air outlet 222. The air outlet of the blower 224 is fixedly connected to the top of the preheating box 221. The preheating box 221 passes through the feeding channel 2 and is fixedly connected to the feeding channel 2.

[0019] In use, partition 4 divides vacuum chamber 1 into a cleaning zone and a deposition zone. After the operator positions the substrate using positioning component 27, the blower 224 is started. The air generated by blower 224 is heated to a certain temperature by preheating box 221 and blown evenly onto the substrate surface through air vents 222 and air grilles 223 to remove moisture and residual organic matter from the substrate surface. Then, the sealing gate 8 at the first inlet 5 is opened, and the substrate is transported from the first inlet 5 into the vacuum chamber 1 below the radio frequency plasma generator 9 for cleaning via the transfer mechanism 21. Then, the sealing gate 8 at the first inlet 5 and the sealing gate 8 at the second inlet 6 are closed to prevent the gas generated during cleaning from affecting the subsequent deposition in the deposition zone. To achieve the desired coating deposition effect, the first inlet valve 10 and the radio frequency plasma generator 9 are activated to generate low-energy plasma from argon gas. This plasma bombards the surface of the substrate from all directions, sputtering away impurities such as oil and organic matter. Then, the first suction pump 12 is turned on to extract the gas generated during cleaning. After cleaning, the sealing switch gate 8 at the second inlet 6 is opened to transport the cleaned substrate to the positioning plate 19. The positioning plate 19 ensures that the workpiece is aligned with the coating mechanism 3 before the coating operation begins. Once the coating is complete, the substrate is returned via the transfer mechanism 21 to finish the coating process. This process ensures a cleaner substrate surface, improves the adhesion between the deposited film and the substrate, and ultimately makes the magnetron sputtered coating layer denser.

[0020] For the second embodiment, please refer to... Figures 1-6 Based on the first embodiment, the present invention provides a technical solution: the positioning component 27 includes a positioning seat 271, a positioning groove 272 is provided on one side of the positioning seat 271, a semiconductor cooling chip 273 is connected through and fixedly connected to both sides of the inner wall of the positioning groove 272, a guide slide 274 is fixedly connected to the top of the positioning seat 271, a spring 275 is fixedly connected to both the guide slide 274 and the side of the positioning seat 271, a trigger rod 276 is fixedly connected to the side of the positioning seat 271, the bottom of the positioning seat 271 is slidably connected to the top of the heat conduction plate 213, and the end of the spring 275 away from the positioning seat 271 is fixedly connected to the diagonal of the inner wall of the placement groove 26.

[0021] In use, the substrate is placed in the placement groove 26 on the support seat 25. The substrate first contacts the guide slide 274, and the substrate first presses against the guide slide 274. Then, the guide slide 274 compresses the spring 275, thereby clamping the substrate and allowing it to fall accurately into the positioning groove 272 for positioning and fixation. The limiting channel 216 can prevent the positioning seat 271 from shaking or shifting during movement, further increasing the stability of clamping. Therefore, stable fixation can be achieved without additional drive, avoiding substrate shifting caused by equipment vibration during transportation and coating, and thus improving the stability of substrate coating. During coating, heat is continuously generated due to the deposition of the coating. When clamping, the guide slide 274 drives the positioning seat 271 to move. The movement of the positioning seat 271 drives the trigger rod 276 to move. The movement of the trigger rod 276 will contact the trigger switch 215. The trigger switch 215 receives the instruction and causes the semiconductor cooling chip 273 to start working. At this time, the semiconductor cooling chips 273 on both sides of the inner wall of the positioning groove 272 work to cool the heat generated by the deposition of the coating, effectively avoiding the degradation of the coating quality due to excessive temperature, and ensuring the uniformity and density of the coating. After the coating is completed, the substrate is sucked out by a vacuum suction cup. The substrate slides out on the round slide at the top of the inner wall of the positioning seat 271. Through the above operation, not only is the accuracy and stability of the substrate positioning improved, but a good temperature control environment is also provided for the coating process, thereby improving the working efficiency and coating quality of the entire coating equipment.

[0022] Third embodiment, please refer to Figures 1-7 Based on the second embodiment, the present invention provides a technical solution: a circulating cooling box 28 is fixedly connected to the bottom of the mounting bracket 23, the inlet of the second circulating pump 29 is connected to one side of the circulating cooling box 28, the outlet of the second circulating pump 29 is connected to the outlet pipe 210, the side of the circulating cooling box 28 away from the second circulating pump 29 is connected to the inlet pipe 211, a parallel serpentine tube 212 is fixedly connected through and through the bottom of the inner wall of the placement groove 26, both ends of the parallel serpentine tube 212 pass through the bearing seat 25 and are respectively connected to the outlet pipe 210 and the inlet pipe 211, and a heat-conducting plate 213 is fixedly connected to the bottom of the inner wall of the placement groove 26.

[0023] During use, as the coating process unfolds, the coating layer gradually deposits on the substrate surface and releases heat. The elastic buffer pad 24 reduces vibrations generated during equipment operation, preventing uneven coating caused by vibration. The heat-conducting plate 213 first absorbs the generated heat evenly. Compared to the direct contact between the heat-conducting plate 213 and the substrate, the parallel serpentine tube 212 further ensures the levelness of the workpiece. The heat-conducting plate 213 conducts heat to the parallel serpentine tube 212. The coolant in the parallel serpentine tube 212 circulates under the drive of the second circulation pump 29. As the coolant flows through the parallel serpentine tube 212, it carries away heat and returns to the circulating cooling tank 28 through the water inlet pipe 211 for cooling. After cooling, the coolant is transported again through the outlet pipe 210 and the second circulation pump 29 to the parallel serpentine pipe 212. This cycle is repeated to continuously cool and dissipate the heat generated by the deposition of the coating, effectively preventing the substrate from deforming due to excessive temperature, which would affect the coating quality. This further ensures the uniformity and density of the coating, improving the quality and stability of the coating. The heat dissipation characteristics of the heat-conducting plate 213 are used to eliminate local hot spots, and together with the semiconductor cooling chip 273 of the positioning component 27, a dual temperature control system is formed, which effectively prevents the coating from cracking or peeling due to temperature gradients, thereby further improving the structural integrity and stability of the coating layer.

[0024] For the fourth embodiment, please refer to [link / reference]. Figures 1-8 Based on the third embodiment, the present invention provides a technical solution: the coating mechanism 3 includes a target tube 31, both ends of the target tube 31 are connected to a sealing joint 33, a cooling pipe 32 is connected to one side of the inner wall of the target tube 31, cooling spray holes 36 are evenly opened on the side of the cooling pipe 32, the sealing joint 33 at one end of the target tube 31 is connected to the cooling pipe 32, the output end of the belt drive mechanism 34 is sleeved and fixedly connected to the sealing joint 33 at one end of the target tube 31, the input end of the belt drive mechanism 34 is fixedly connected to the drive shaft of the drive motor 35, the sealing joint 33 passes through the vacuum chamber 1 and is rotatably connected to the vacuum chamber 1, one end of the sealing joint 33 is connected to the second pipe 18, the sealing joint 33 is rotatably connected to the second pipe 18, and the drive motor 35 is fixedly connected to one side of the vacuum chamber 1 by a bracket.

[0025] During operation, when coating is being performed, the second inlet valve 11 is activated to deliver argon gas to the portion of the target tube 31 within the vacuum chamber 1. Simultaneously, the sealing switch gate 8 at the second feed inlet 6 closes the second feed inlet 6, allowing an arc discharge to occur inside, generating plasma. Then, the drive motor 35 is activated, and the drive shaft of the drive motor 35 rotates, causing the input end of the belt drive mechanism 34 to rotate. The output end of the belt drive mechanism 34 rotates, causing the sealing joint 33 to rotate, which in turn rotates the target tube 31. This ensures that the plasma is uniformly bombarded onto the target tube 31. During rotation, the target tube 31 is uniformly sputtered, and the sputtered target atoms are uniformly deposited on the substrate surface within the vacuum chamber 1, forming a uniform and dense coating layer, effectively preventing excessively thick local coatings. The problem of excessively thin coatings is greatly improved, enhancing the quality and uniformity of the coating. During sputtering, the high-energy plasma bombardment of the target tube 31 generates a large amount of heat. Water cooled in the temperature-controlled water tank 14 is transported through the second pipe 18 to the sealing joint 33 at one end via the first circulation pump 17, and then to the cooling pipe 32. Finally, the cooling water is evenly sprayed out through the cooling nozzle 36 to cool the inside of the target tube 31. After heat exchange, the water is extracted through the second pipe 18 at the other end and transported to the recovery water tank 15. Then, it is transported back to the temperature-controlled water tank 14 through the first pipe 16 for recycling. This cycle is repeated continuously to cool and dissipate heat from the target tube 31, improving its cooling efficiency and preventing damage or impact on coating quality due to excessive temperature, thus extending its service life.

[0026] Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A low-temperature, high-density magnetron sputtering coating apparatus for modified plastic substrates, characterized in that: The system includes a vacuum chamber (1), one side of which is connected to a feed channel (2). A coating mechanism (3) is rotatably connected through the inner wall of the vacuum chamber (1). Partitions (4) are fixedly connected to both sides of the inner wall of the vacuum chamber (1). A first feed port (5) is opened on one side of the vacuum chamber (1), and a second feed port (6) is opened on one side of the partition (4). A first guide plate (7) is rotatably connected to both sides of the inner walls of the first feed port (5) and the second feed port (6). A sealing switch gate (8) is fixedly connected to one side of the partition (4) and one side of the inner wall of the vacuum chamber (1). A radio frequency plasma generator (9) is fixedly connected to the top of the inner wall of the vacuum chamber (1) away from the coating mechanism (3). The part of the side of the vacuum chamber (1) above the feed channel (2) is connected to the outlet of a first air inlet valve (10). The vacuum chamber (1) is connected to the outlet of the second air inlet valve (11) on the side away from the first air inlet valve (10). The side of the vacuum chamber (1) near the first air inlet valve (10) is connected to the air inlet of the first air pump (12). The side of the vacuum chamber (1) near the second air inlet valve (11) is connected to the air inlet of the second air pump (13). The top of the vacuum chamber (1) is fixedly connected to a temperature-controlled water tank (14) and a recovery water tank (15). The temperature-controlled water tank (14) and the recovery water tank (15) are connected through a first pipe (16). The side of the recovery water tank (15) is connected to the inlet of the first circulation pump (17). The outlet of the first circulation pump (17) and the side of the temperature-controlled water tank (14) are both connected to a second pipe (18). The second pipe (18) is connected to the coating mechanism (3).

2. The low-temperature high-density magnetron sputtering coating equipment for modified plastic substrates according to claim 1, characterized in that: Positioning plates (19) are fixedly connected to the inner walls of the first guide plate (7) on both sides below the coating mechanism (3). The first guide plate (7) extends into the feed channel (2). The bottom of the first guide plate (7) is fixedly connected to the bottom of the inner wall of the vacuum chamber (1).

3. The low-temperature high-density magnetron sputtering coating equipment for modified plastic substrates according to claim 1, characterized in that: The bottom of the inner wall of the feeding channel (2) is provided with a transmission mechanism (21), the top of the inner wall of the feeding channel (2) is connected to a preheating mechanism (22), the top of the transmission mechanism (21) is fixedly connected to a mounting bracket (23), the two sides of the mounting bracket (23) are fixedly connected to a second guide plate (214), the top of the mounting bracket (23) is fixedly connected to an elastic buffer pad (24), the top of the elastic buffer pad (24) is fixedly connected to a bearing seat (25), the top of the bearing seat (25) is provided with a placement groove (26), the opposite corners of the placement groove (26) are fixedly connected to positioning components (27), the opposite corners of the placement groove (26) are fixedly connected to trigger switches (215), and the opposite corners of the placement groove (26) are fixedly connected to limit channels (216).

4. The low-temperature high-density magnetron sputtering coating equipment for modified plastic substrates according to claim 3, characterized in that: The bottom of the mounting bracket (23) is fixedly connected to a circulating cooling box (28). One side of the circulating cooling box (28) is connected to the inlet of the second circulating pump (29). The outlet of the second circulating pump (29) is connected to the outlet pipe (210). The side of the circulating cooling box (28) away from the second circulating pump (29) is connected to the inlet pipe (211). The bottom of the inner wall of the placement groove (26) is connected to a parallel serpentine tube (212). Both ends of the parallel serpentine tube (212) are connected to the bearing seat (25) and are respectively connected to the outlet pipe (210) and the inlet pipe (211). The bottom of the inner wall of the placement groove (26) is fixedly connected to a heat-conducting plate (213).

5. The low-temperature high-density magnetron sputtering coating equipment for modified plastic substrates according to claim 3, characterized in that: The positioning component (27) includes a positioning seat (271), a positioning groove (272) is provided on one side of the positioning seat (271), a semiconductor cooling chip (273) is connected through and fixedly connected to both sides of the inner wall of the positioning groove (272), a guide slide (274) is fixedly connected to the top of the positioning seat (271), a spring (275) is fixedly connected to both the guide slide (274) and the side of the positioning seat (271), and a trigger rod (276) is fixedly connected to the side of the positioning seat (271).

6. The low-temperature high-density magnetron sputtering coating equipment for modified plastic substrates according to claim 5, characterized in that: The bottom of the positioning seat (271) is slidably connected to the top of the heat-conducting plate (213), and the end of the spring (275) away from the positioning seat (271) is fixedly connected to the diagonal of the inner wall of the placement groove (26).

7. The low-temperature high-density magnetron sputtering coating equipment for modified plastic substrates according to claim 3, characterized in that: The preheating mechanism (22) includes a preheating box (221), the bottom of which is connected to an air outlet (222), the inner wall of which is fixedly connected to a ventilation grille (223), the top of which is fixedly connected to the air outlet of an induced draft fan (224), and the preheating box (221) passes through the feeding channel (2) and is fixedly connected to the feeding channel (2).

8. The low-temperature high-density magnetron sputtering coating equipment for modified plastic substrates according to claim 1, characterized in that: The coating mechanism (3) includes a target tube (31), both ends of which are connected to a sealing joint (33). A cooling pipe (32) is connected to one side of the inner wall of the target tube (31). Cooling nozzles (36) are evenly opened on the side of the cooling pipe (32). The sealing joint (33) at one end of the target tube (31) is connected to the cooling pipe (32). The output end of a belt drive mechanism (34) is sleeved and fixedly connected to the sealing joint (33) at one end of the target tube (31). The input end of the belt drive mechanism (34) is fixedly connected to the drive shaft of a drive motor (35).

9. The low-temperature high-density magnetron sputtering coating equipment for modified plastic substrates according to claim 8, characterized in that: The sealing joint (33) passes through the vacuum chamber (1) and is rotatably connected to the vacuum chamber (1). One end of the sealing joint (33) is connected to the second pipe (18). The sealing joint (33) is rotatably connected to the second pipe (18). The drive motor (35) is fixedly connected to one side of the vacuum chamber (1) by a bracket.

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