Wafer processing device

Abstract

The invention provides a wafer processing device. The wafer processing device comprises a bearing mechanism, a moving mechanism, a spraying mechanism and a driving mechanism, the bearing mechanisms are arranged along a first direction, the bearing mechanisms are used for bearing wafers, and the moving mechanism is arranged opposite to the bearing mechanisms. The spraying mechanism and the bearing mechanism are adjacently arranged, the stroke of the spraying mechanism moving to the spraying area is shorter than the stroke of a traditional mounting arm moving to the spraying area, the spraying mechanism can conveniently and rapidly move to the spraying area and rapidly reset, and the production efficiency is improved. The multiple nozzles in the spraying mechanism are connected with the independent liquid guide pipes correspondingly, the multiple independent nozzles can be independently replaced, the nozzles are fast and efficient to maintain, the number of times of bending of the independently-moving liquid guide pipes is smaller than that of overall movement of multiple liquid guide pipes on a traditional installation arm, mutual abrasion caused when the multiple liquid guide pipes move at the same time is avoided, and the service life of the liquid guide pipes is prolonged.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more particularly to a wafer processing apparatus. Background Technology

[0002] Photoresist coating and developing equipment is used in conjunction with the lithography machine in the photolithography process for coating, developing, and baking. In early integrated circuit processes and lower-end semiconductor processes, photoresist coating and developing equipment was usually used independently. However, with the continuous improvement of automation in integrated circuit manufacturing processes, on large production lines of 8 inches and above, photoresist coating and developing equipment is generally used in conjunction with lithography equipment to form a complete wafer processing and lithography production line, working with the lithography machine to complete the intricate lithography process. The photoresist coating and developing equipment mainly consists of three major systems: photoresist coating, developing, and baking. A robotic arm completes the transfer and processing of wafers between these systems, completing the processes of photoresist coating, curing, lithography, developing, and hardening.

[0003] In recent years, with the rapid development of semiconductor technology, various types of photoresist treatment solutions are used to treat the surface of semiconductor wafers in order to improve the performance of semiconductor products. Due to the existence of multiple treatment solutions, there are nozzles containing various types of photoresist on the mounting arm. Moving all the nozzles together requires a large operating space and installation space. The distance that the mounting arm moves multiple sets of nozzles to the wafer is relatively long, and the operation time of moving the nozzles is long. When the mounting arm moves multiple nozzles at one time, it is difficult to rotate the piping connected to each nozzle. In this structure, if any nozzle needs to be repaired, all nozzles must be moved to the standby area set outside the coating treatment section, causing equipment downtime. The traditional mounting arm-driven nozzle wafer processing efficiency is low. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer processing apparatus that improves wafer processing efficiency and solves the problem of difficult nozzle maintenance in the prior art.

[0005] To achieve the above objectives, the present invention provides a wafer processing apparatus for performing resist coating and developing on wafers, comprising a carrier mechanism, a moving mechanism, a spraying mechanism, and a driving mechanism; the carrier mechanism is arranged along a first direction and is used to carry the wafer; the moving mechanism is arranged opposite to the carrier mechanism; the spraying mechanism is disposed on the moving mechanism and is used to spray a processing liquid onto the wafer; the driving mechanism is arranged opposite to the carrier mechanism, and the moving mechanism is located between the driving mechanism and the carrier mechanism, the driving mechanism is arranged along the first direction, and the driving mechanism is used to drive the spraying mechanism to move along a second direction and a third direction. The extending direction of the moving mechanism is the first direction, the lifting direction of the driving mechanism is the second direction, the horizontal extending direction of the driving mechanism is the third direction, the second direction is perpendicular to the horizontal plane containing the first direction, and the third direction is perpendicular to both the first and second directions.

[0006] The beneficial effects of this invention are as follows: The spraying mechanism and the supporting mechanism are arranged adjacent to each other. The travel distance of the spraying mechanism to the spraying area is shorter than that of a traditional mounting arm, facilitating rapid movement and resetting of the spraying mechanism and improving production efficiency. Multiple nozzles in the spraying mechanism are each connected to an independent liquid guide tube. These independent nozzles can be replaced independently, making nozzle maintenance quick and efficient. Furthermore, the independently moving liquid guide tubes involve fewer bends compared to the combined movement of multiple liquid guide tubes on a traditional mounting arm, avoiding mutual wear when multiple liquid guide tubes move simultaneously and extending their service life.

[0007] In some embodiments, the moving mechanism includes a slide rail, a sliding plate, and a driving unit; the slide rail extends along the first direction, the sliding plate is disposed on the slide rail and slidably connected to the slide rail, the driving unit is disposed at one end of the slide rail and is used to drive the sliding plate to slide on the slide rail, and the spraying mechanism is disposed on the sliding plate.

[0008] In some embodiments, the moving mechanism further includes a retaining plate; the retaining plate is connected to a first side of the sliding plate, the first side being located at one end of the sliding plate near the supporting mechanism, and the retaining plate is used to support the spraying mechanism. Its advantage is that by connecting the retaining plate to the first side of the sliding plate, the retaining plate allows the spraying mechanism to be placed in a vertical position, facilitating the fixing operation of the spraying mechanism by the drive mechanism.

[0009] In some embodiments, the spraying mechanism includes multiple nozzles and multiple liquid guide tubes; the multiple nozzles and the multiple liquid guide tubes are connected in a one-to-one correspondence, the multiple nozzles are disposed on the retaining plate, and the multiple liquid guide tubes are connected to the sliding plate. Its advantages are: multiple nozzles are connected and supplied with liquid by corresponding independent liquid guide tubes; the nozzles can move independently; when one or more nozzles need maintenance or replacement, only the nozzle at the corresponding position needs to be replaced. In this embodiment, multiple independently arranged nozzles are arranged on the retaining plate, allowing for quick positioning of the nozzle to be replaced without cumbersome inspection procedures, thus improving production efficiency.

[0010] In some embodiments, the retaining plate has multiple equidistant placement slots for placing multiple nozzles. The advantages are that the multiple equidistant placement slots on the retaining plate allow for the equidistant placement of the nozzles, with the nozzles distributed equidistantly on the retaining plate. The distance between the nozzles is a fixed value. When the sliding plate on the slide rail moves by the fixed value or several times the fixed value, the multiple nozzles can be switched within the operating area of ​​the drive mechanism, ensuring precise nozzle switching.

[0011] In some embodiments, the liquid guide tube has a buffer portion distributed on a second side of the sliding plate, the second side being located at the end of the sliding plate away from the supporting mechanism. Its advantages are: the buffer portion of the liquid guide tube adapts and extends as the nozzle moves, allowing the nozzle at one end to have sufficient range of motion; the buffer portion of the liquid guide tube is distributed on the second side of the sliding plate, keeping multiple liquid guide tubes within the open space on the second side of the sliding plate, preventing multiple liquid guide tubes from becoming tangled and avoiding protrusions of the liquid guide tubes on the distribution surface of multiple nozzles, effectively preventing interference between the drive mechanism and the liquid guide tubes during movement.

[0012] In some embodiments, the driving mechanism includes a plurality of driving components arranged sequentially, the plurality of driving components being disposed on one side of the moving mechanism and arranged along the first direction; the driving components include a first driving part, a second driving part, a third driving part, and a holding part; the first driving part is disposed opposite to the slide rail, the second driving part is disposed on the first driving part, the first driving part drives the second driving part to move up and down in the second direction, the third driving part is disposed on the second driving part, the second driving part drives the third driving part to move in the third direction, one end of the third driving part is connected to the holding part, and the holding part is used to fix the nozzle.

[0013] In some embodiments, a control unit is further included, electrically connected to the moving mechanism and the driving mechanism; the control unit sends a signal to control the moving mechanism to drive the spraying mechanism to move in the first direction to the driving mechanism; the control unit sends a signal to control the driving mechanism to fix and drive the spraying mechanism to move. Its advantages are: the control signal from the control unit is input to the moving mechanism, which drives the spraying mechanism to move in the first direction from its initial position, adapting the spraying mechanism to the driving mechanism so that the driving mechanism accurately fixes the spraying mechanism; the control signal from the control unit is input to the driving mechanism, allowing the driving mechanism to accurately fix the spraying mechanism and drive the spraying mechanism to move.

[0014] In some embodiments, the carrier mechanism includes a plurality of carrier components arranged sequentially along a first direction, and each carrier component includes a carrier stage for carrying a wafer.

[0015] In some embodiments, the carrier assembly further includes a cover surrounding the carrier stage, with a storage tank between the carrier stage and the cover for storing excess processing fluid. The advantages are: the cover surrounding the carrier stage forms an isolation area from the outside; during wafer coating, splashed liquid is isolated by the cover, preventing droplets from splashing everywhere and affecting adjacent carrier stages; simultaneously, the storage tank collects and temporarily stores the processing fluid, facilitating subsequent processing.

[0016] In some embodiments, the support assembly further includes a plurality of lifting rods disposed around the periphery of the support platform. The plurality of lifting rods are located within the storage slot and are used to receive the wafer onto the support platform. The advantages are that the plurality of lifting rods provide multiple support points; when the wafer is moved above the support platform, the plurality of lifting rods rise, and the support points at the top of the lifting rods contact and support the wafer; after the plurality of lifting rods receive the wafer, the plurality of lifting rods descend, allowing the wafer to be stably placed on the support platform. Attached Figure Description

[0017] Figure 1 A schematic diagram of the structure of a first embodiment of the wafer processing apparatus provided by the present invention; Figure 2 A schematic diagram of the drive mechanism of a first embodiment of the wafer processing apparatus provided by the present invention; Figure 3 A schematic diagram of the drive mechanism structure of a second embodiment of the wafer processing apparatus provided by the present invention; Figure 4 A side view of a second embodiment of the wafer processing apparatus provided by the present invention.

[0018] Icons: 01-Bearing mechanism; 0101-Bearing platform; 0102-Cover; 0103-Lifting rod; 02-Moving mechanism; 0201-Slide rail; 0202-Sliding plate; 0203-Holding plate; 03-Spraying mechanism; 0301-Nozzle; 0302-Liquid guide tube; 04-Drive mechanism; 0401-First drive unit; 0402-Second drive unit; 0403-Third drive unit; 0404-Holding unit. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0020] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this invention are only used to explain the relative positional relationship and movement of the components in a specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0021] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0022] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0023] In recent years, with the rapid development of semiconductor technology, various types of photoresist treatment solutions are used to treat the surface of semiconductor wafers in order to improve the performance of semiconductor products. Due to the existence of multiple treatment solutions, there are nozzles containing various types of photoresist on the mounting arm. Moving all the nozzles together and having multiple sets of nozzles on the mounting arm requires a large operating space and installation space. The distance that the mounting arm moves multiple sets of nozzles to the wafer is relatively far, and the operation time of moving the nozzles is long. When the mounting arm moves multiple nozzles at once, it is difficult to rotate the piping connected to each nozzle. In this structure, if any nozzle needs to be repaired, all nozzles must be moved to the standby area set outside the coating treatment section, causing equipment downtime.

[0024] To address the aforementioned problems, embodiments of the present invention provide the following technical solutions to overcome them.

[0025] Example 1 Figure 1 This is a schematic diagram of the structure of a first embodiment of the wafer processing apparatus provided by the present invention. Figure 2 This is a schematic diagram of the drive mechanism connection for a first embodiment of the wafer processing apparatus provided by the present invention. Please refer to... Figure 1 and Figure 2 As shown in the specific embodiment of the present invention, a wafer processing apparatus is used to perform resist coating and developing processing on wafers. The wafer processing apparatus includes a carrier mechanism 01, a moving mechanism 02, a spraying mechanism 03, and a driving mechanism 04. The carrier mechanism 01 is arranged along a first direction and is used to carry the wafer. The moving mechanism 02 is arranged opposite to the carrier mechanism 01. The spraying mechanism 03 is disposed on the moving mechanism 02 and is used to spray the processing liquid onto the wafer. The driving mechanism 04 is arranged opposite to the carrier mechanism 01, and the moving mechanism 02 is located between the driving mechanism 04 and the carrier mechanism 01. The driving mechanism 04 is arranged along the first direction and is used to drive the spraying mechanism 03 to move along a second direction and a third direction. The extending direction of the moving mechanism 02 is the first direction, the lifting direction of the driving mechanism 04 is the second direction, the horizontal extending direction of the driving mechanism 04 is the third direction, the second direction is perpendicular to the horizontal plane containing the first direction, and the third direction is perpendicular to both the first and second directions.

[0026] Specifically, the carrier mechanism 01 is used to carry the wafer. The carrier mechanism 01 is arranged along the extension direction of the moving mechanism 02. The carrier mechanism 01 is arranged opposite to the moving mechanism 02 and the driving mechanism 04, and the moving mechanism 02 is located between the driving mechanism 04 and the carrier mechanism 01. The driving mechanism 04 is arranged along the extension direction of the moving mechanism 02. The moving mechanism 02 is used to drive the spraying mechanism 03 to move. When the spraying mechanism 03 moves to the operating area of ​​the driving mechanism 04, the driving mechanism 04 drives the spraying mechanism 03 to move along a second direction and a third direction. The spraying mechanism 03 sprays the processing liquid onto the wafer.

[0027] In this invention, the moving mechanism 02 drives the spraying mechanism 03 to reciprocate, moving the spraying mechanism 03 to the operating area of ​​the driving mechanism 04. Both the driving mechanism 04 and the supporting mechanism 01 are arranged along the extension direction of the displacement mechanism. The driving mechanism 04 drives the spraying mechanism 03 to move towards the supporting mechanism 01, and the processing liquid of the spraying mechanism 03 sprays the wafers on the supporting mechanism 01. The moving mechanism 02 and the spraying mechanism 03 have a compact overall structure, saving installation space. The linear movement of the spraying mechanism 03 requires little operating space, further saving installation space. The spraying mechanism 03 is arranged adjacent to the supporting mechanism 01. The travel distance of the spraying mechanism 03 to the spraying area is shorter than that of a traditional mounting arm, facilitating rapid movement and resetting of the spraying mechanism 03, thus improving production efficiency. The multiple nozzles 0301 in the spraying mechanism 03 are connected to independent liquid guide tubes 0302. The multiple independent nozzles 0301 can be replaced independently. The nozzles 0301 are quick to maintain and the maintenance time is short. Moreover, the independently moving liquid guide tubes 0302 have fewer bends than the multiple liquid guide tubes 0302 moving as a whole on the traditional mounting arm. This effectively avoids bending fatigue failure of the liquid guide tubes 0302 and avoids mutual wear when multiple liquid guide tubes 0302 move at the same time, thereby extending the service life of the liquid guide tubes 0302.

[0028] In some embodiments, such as Figure 2 As shown, the moving mechanism 02 includes a slide rail 0201, a sliding plate 0202, and a driving unit (not shown); the slide rail 0201 extends along the first direction, the sliding plate 0202 is disposed on the slide rail 0201 and slidably connected to the slide rail 0201, the driving unit is disposed at one end of the slide rail 0201 and is used to drive the sliding plate 0202 to slide on the slide rail 0201, and the spraying mechanism 03 is disposed on the sliding plate 0202.

[0029] Specifically, the slide rail 0201 extends along the first direction, one end of the slide rail 0201 is connected to the drive unit, and the sliding plate 0202 is slidably connected to the slide rail 0201. The drive unit at one end of the slide rail 0201 provides power and is used to drive the sliding plate 0202 to reciprocate on the slide rail 0201, thereby moving the spraying mechanism 03 on the sliding plate 0202 to the operating area of ​​the drive mechanism 04, so that the drive mechanism 04 fixes the spraying mechanism 03.

[0030] Furthermore, such as Figure 2 As shown, the moving mechanism 02 also includes a retaining plate 0203; the retaining plate 0203 is connected to a first side of the sliding plate 0202, the first side being located at one end of the sliding plate 0202 near the bearing mechanism 01, and the retaining plate 0203 is used to support the spraying mechanism 03.

[0031] Specifically, a retaining plate 0203 is connected to the first side of the sliding plate 0202. The retaining plate 0203 supports the spraying mechanism 03. The retaining plate 0203 keeps the spraying mechanism 03 in a vertical position, which facilitates the fixing operation of the drive mechanism 04 on the spraying mechanism 03.

[0032] In some embodiments, such as Figure 2 As shown, the spraying mechanism 03 includes a plurality of nozzles 0301 and a plurality of liquid guide tubes 0302; the plurality of nozzles 0301 and the plurality of liquid guide tubes 0302 are connected in a one-to-one correspondence, the plurality of nozzles 0301 are disposed on the retaining plate 0203, and the plurality of liquid guide tubes 0302 are connected to the sliding plate 0202.

[0033] Specifically, multiple nozzles 0301 are connected to a sliding plate 0202 via multiple flexible liquid guide tubes 0302. The liquid guide tubes 0302 supply liquid to the nozzles 0301. When no high-pressure processing liquid is introduced into the liquid guide tube 0302 connected to the nozzle 0301, the corresponding nozzle 0301 is in a standby state. When high-pressure processing liquid is introduced into the liquid guide tube 0302 connected to the nozzle 0301, the nozzle 0301 is in a working state and sprays the processing liquid in a jet shape. All nozzles 0301 are held vertically by a retaining plate 0203, which facilitates the drive mechanism 04 to fix the selected nozzle 0301. Multiple nozzles 0301 are connected and supplied with liquid by corresponding independent liquid guide pipes 0302. The nozzles 0301 can move independently. When one or more nozzles 0301 need maintenance or replacement, only the nozzle 0301 at the corresponding position needs to be replaced. Traditional mounting arms move multiple nozzles to the external standby area of ​​the coating treatment unit, requiring centralized inspection of multiple nozzles to determine which needs replacement, resulting in long maintenance times. In this embodiment, multiple independently configured nozzles 0301 are arranged on the retaining plate 0203, enabling rapid positioning of the nozzle 0301 to be replaced. This eliminates the need for cumbersome inspection procedures, allowing for quick nozzle replacement and improving production efficiency. Traditional mounting arms moving multiple nozzles require sufficient operating space. The moving mechanism 02 and spraying mechanism 03 have a compact overall structure. The linear movement of the spraying mechanism 03 requires minimal operating space, resulting in a small installation footprint and saving installation space. Multiple nozzles 0301 independently supply the processing fluid. Each selected nozzle 0301 carries only a single processing fluid during movement. The mounting arm carries multiple nozzles in a single movement configuration, preventing other processing fluids from dripping onto the wafer, thus improving wafer processing yield. Multiple liquid guide tubes 0302 can provide different processing fluids or the same processing fluid.

[0034] Furthermore, such as Figure 2 As shown, the retaining plate 0203 has multiple equidistant placement slots, which are used to place multiple nozzles 0301.

[0035] Specifically, multiple equidistant placement slots on the retaining plate 0203 are used for the equidistant placement of nozzles 0301. Multiple nozzles 0301 are distributed equidistantly on the retaining plate 0203, and the distance between multiple nozzles 0301 is a fixed value. When the sliding plate 0202 on the slide rail 0201 moves to the above fixed value or several times the fixed value, the multiple nozzles 0301 can be replaced in the operating area of ​​the drive mechanism 04. The replacement of multiple nozzles 0301 is precise and highly operable.

[0036] Furthermore, such as Figure 2As shown, the liquid guide tube 0302 has a buffer section, which is distributed on the second side of the sliding plate 0202. The second side is located at the end of the sliding plate 0202 away from the bearing mechanism 01.

[0037] Specifically, the buffer portion of the liquid guide tube 0302 extends adaptively when the nozzle 0301 moves, allowing the nozzle 0301 at one end to have sufficient range of motion. The buffer portion of the liquid guide tube 0302 is distributed on the second side of the sliding plate 0202. When the nozzle 0301 is placed on the holding plate 0203 and kept in standby state, the multiple liquid guide tubes 0302 are kept in the open space on the second side of the sliding plate 0202, avoiding the multiple liquid guide tubes 0302 from being tangled and avoiding the liquid guide tubes 0302 from protruding on the distribution surface of the multiple nozzles 0301, effectively avoiding mutual interference between the drive mechanism 04 and the liquid guide tube 0302 during the movement. The buffer section of the liquid guide tube 0302 has an extendable structure such as a C-shaped, W-shaped, or spiral stack. When the independent nozzle 0301 moves, the liquid guide tube 0302 connected to the nozzle 0301 moves accordingly. The buffer section of the liquid guide tube 0302 extends without driving other independently set liquid guide tubes 0302. Compared with the way the mounting arm carries the entire tube body, the independently set liquid guide tube 0302 effectively delays fatigue damage under long-term large-amplitude bending conditions and extends the service life of the liquid guide tube 0302.

[0038] In some embodiments, such as Figure 2 As shown, the drive mechanism 04 includes a plurality of drive components arranged sequentially. The plurality of drive components are disposed on one side of the moving mechanism 02 and arranged along the first direction. The drive components include a first drive part 0401, a second drive part 0402, a third drive part 0403, and a holding part 0404. The first drive part 0401 is disposed opposite to the slide rail 0201. The second drive part 0402 is disposed on the first drive part 0401. The first drive part 0401 drives the second drive part 0402 to move up and down in the second direction. The third drive part 0403 is disposed on the second drive part 0402. The second drive part 0402 drives the third drive part 0403 to move in the third direction. One end of the third drive part 0403 is connected to the holding part 0404. The holding part 0404 is used to fix the nozzle 0301.

[0039] Specifically, the drive components are arranged along the extension direction of the moving mechanism 02. The first drive unit 0401 in the drive components drives the second drive unit 0402 to move up and down in the second direction. The second drive unit 0402 drives the third drive unit 0403 to extend upward and move backward in the third direction. One end of the third drive unit 0403 is connected to the holding unit 0404. In the initial state, the holding unit 0404 is located above the nozzle 0301. When spraying is required, the holding unit 0404 fixes the selected independent nozzle 0301. At this time, the nozzle 0301 is in standby state. The first drive unit 0401 controls the second drive unit 0402 to rise in the second direction. The second drive unit 0402 controls the third drive unit 0403 to move horizontally upward in the third direction, so that the holding unit 0404 moves above the wafer. The nozzle 0301 sprays out the processing liquid to process the wafer. The holding part 0404 fixes the nozzle 0301 in a vertically detachable manner. After the nozzle 0301 completes the spraying operation, the first drive part 0401, the second drive part 0402 and the third drive part 0403 are reset, and the holding part 0404 resets the nozzle 0301.

[0040] Furthermore, two or more drive components operate the spraying mechanism 03 together. The spraying mechanism 03 moves on the moving mechanism 02, allowing two or more drive components to simultaneously fix the nozzles 0301 at corresponding positions, and move the two or more nozzles 0301 at corresponding positions to the carrying mechanism 01, so that the two or more nozzles 0301 can process the wafer at the same time, thereby further improving the wafer processing efficiency.

[0041] In some embodiments, a control unit (not shown) is further included, which is electrically connected to the moving mechanism 02 and the driving mechanism 04; the control unit sends a signal to control the moving mechanism 02 to drive the spraying mechanism 03 to move to the driving mechanism 04 in the first direction; the control unit sends a signal to control the driving mechanism 04 to be fixed and drive the spraying mechanism 03 to move.

[0042] Specifically, the control unit sends a control signal to the moving mechanism 02, which moves the spraying mechanism 03 in the first direction from its initial position, and aligns the spraying mechanism 03 with the drive mechanism 04 so that the drive mechanism 04 precisely fixes the spraying mechanism 03. The control unit also sends a control signal to the drive mechanism 04, which accurately fixes the spraying mechanism 03 and drives it to move. The moving mechanism 02 drives the spraying mechanism 03 to reciprocate on top of it.

[0043] In some embodiments, such as Figure 1 and Figure 2As shown, the carrier mechanism 01 includes a plurality of carrier components arranged sequentially, the plurality of carrier components being arranged along a first direction, and the carrier component including a carrier platform 0101, the carrier platform 0101 being used to carry a wafer.

[0044] Specifically, the support platform 0101 is used to support the wafers, and multiple support platforms 0101 are arranged along a first direction, thereby arranging multiple wafers in the first direction. Among them, the support platform 0101 is disk-shaped, and the disk-shaped support platform 0101 provides a circular support surface for stable support of the wafers.

[0045] In some embodiments, such as Figure 1 and Figure 2 As shown, the support assembly also includes a cover 0102 surrounding the support platform 0101, and a storage tank is provided between the support platform 0101 and the cover 0102 for storing excess treatment liquid.

[0046] Specifically, the cover 0102 surrounding the support stage 0101 forms an isolation area from the outside. When the wafer is sprayed, the splashed liquid is isolated by the cover 0102 to prevent the droplets from splashing everywhere and affecting the adjacent support stage 0101. At the same time, a storage tank is set between the support stage 0101 and the cover 0102 to collect and temporarily store the processing liquid, which is convenient for subsequent processing of the processing liquid.

[0047] In some embodiments, such as Figure 1 and Figure 2 As shown, the supporting assembly also includes a plurality of lifting rods 0103 disposed around the support platform 0101. The plurality of lifting rods 0103 are disposed in the storage slot and are used to support the substrate onto the support platform 0101.

[0048] Specifically, multiple lifting rods 0103 are installed in the storage tank. The lifting rods 0103 can rise and fall, and multiple lifting rods 0103 provide multiple support points. When the wafer is moved above the support platform 0101, the multiple lifting rods 0103 rise. The support points at the top of the lifting rods 0103 are used to contact and support the wafer. After the multiple lifting rods 0103 receive the wafer, the multiple lifting rods 0103 fall, so that the wafer is stably placed on the support platform 0101.

[0049] Example 2 Figure 3 A schematic diagram of the drive mechanism structure of a second embodiment of the wafer processing apparatus provided by the present invention. Figure 4This is a side view of a second embodiment of the wafer processing apparatus provided by the present invention. In this embodiment, the driving mechanism 04 includes a plurality of driving components arranged sequentially. The plurality of driving components are disposed on one side of the moving mechanism 02 and arranged along the first direction. The driving components include a first driving part 0401, a rod having a certain angle with the horizontal plane, and a holding part 0404. The rod is disposed on the first driving part 0401, and the rod is driven to tilt and move along the plane containing the second direction and the third direction. One end of the rod is connected to the holding part 0404.

[0050] Among them, such as Figure 3 and Figure 4 As shown, the top surfaces of the multiple nozzles 0301 in the spraying mechanism 03 are all inclined surfaces, so that the rod drives the holding part 0404 to fix the nozzles 0301.

[0051] Among them, such as Figure 2 and Figure 4 As shown, the retaining plate 0203 has multiple equidistant placement slots, one side of which is open. The placement slots are used to place multiple nozzles 0301. The nozzles 0301 are placed in the placement slots with one open side on the retaining plate 0203. After the nozzles 0301 are fixed by the retaining part 0404, they can be moved out to one side to avoid obstructing the movement of the nozzles 0301.

[0052] Specifically, such as Figure 3 and Figure 4 As shown, the first driving unit 0401 drives the rod to tilt and move. In the initial state, the holding unit 0404 fixes the nozzle 0301 at the corresponding position. The first driving unit 0401 drives the rod to move, so that the holding unit 0404 and the nozzle 0301 move to the top of the support platform 0101 that supports the wafer. The nozzle 0301 sprays the processing liquid onto the wafer. After the spraying operation is completed, the first driving unit 0401 drives the rod, the holding unit 0404 and the nozzle 0301 to reset.

[0053] like Figure 3 and Figure 4 As shown, in this embodiment, the first driving unit 0401 drives the rod to tilt and move simultaneously in the first and second directions, allowing the holding unit 0404 and the nozzle 0301 to move directly to the spraying area above the support platform 0101, completing the wafer spraying. In this embodiment, the driving mechanism 04 has less power input and fewer movement steps, enabling rapid spraying of the wafer by the nozzle 0301. The rod's rapid reset facilitates the rapid movement of the nozzle 0301, achieving rapid wafer spraying and further improving wafer processing efficiency. The first driving unit 0401 has fewer moving parts overall, making the rod's operation more stable and convenient for movement, resulting in good performance.

[0054] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. A wafer processing apparatus for performing resist coating and developing processes on wafers, characterized in that, It includes a load-bearing mechanism, a moving mechanism, a spraying mechanism, and a drive mechanism; The support mechanism is arranged along a first direction and is used to support the wafer. The moving mechanism is positioned opposite to the carrying mechanism; The spraying mechanism is mounted on the moving mechanism and is used to spray the processing liquid onto the wafer; The driving mechanism is disposed opposite to the supporting mechanism, and the moving mechanism is located between the driving mechanism and the supporting mechanism. The driving mechanism is arranged along the first direction and is used to drive the spraying mechanism to move along the second direction and the third direction.

2. The wafer processing apparatus according to claim 1, characterized in that: The moving mechanism includes a slide rail, a sliding plate, and a drive unit; The slide rail extends along the first direction, the sliding plate is disposed on the slide rail and slidably connected to the slide rail, the driving unit is disposed at one end of the slide rail and is used to drive the sliding plate to slide on the slide rail, and the spraying mechanism is disposed on the sliding plate.

3. The wafer processing apparatus according to claim 2, characterized in that: The moving mechanism also includes a retaining plate; The retaining plate is connected to a first side of the sliding plate, the first side being located at the end of the sliding plate near the bearing mechanism, and the retaining plate is used to support the spraying mechanism.

4. The wafer processing apparatus according to claim 3, characterized in that: The spraying mechanism includes multiple nozzles and multiple liquid guide tubes; The plurality of nozzles are connected to the plurality of liquid guide tubes in a one-to-one correspondence, the plurality of nozzles are disposed on the retaining plate, and the plurality of liquid guide tubes are connected to the sliding plate.

5. The wafer processing apparatus according to claim 4, characterized in that: The retaining plate has multiple equidistant placement slots, which are used to place multiple nozzles.

6. The wafer processing apparatus according to claim 4, characterized in that: The liquid guide tube has a buffer section, which is distributed on the second side of the sliding plate, the second side being located at the end of the sliding plate away from the bearing mechanism.

7. The wafer processing apparatus according to claim 5 or 6, characterized in that: The driving mechanism includes a plurality of driving components arranged sequentially, the plurality of driving components being disposed on one side of the moving mechanism and arranged along the first direction; The drive assembly includes a first drive section, a second drive section, a third drive section, and a holding section; The first driving part is disposed opposite to the slide rail, the second driving part is disposed on the first driving part, the first driving part drives the second driving part to move up and down in the second direction, the third driving part is disposed on the second driving part, the second driving part drives the third driving part to move in the third direction, one end of the third driving part is connected to the holding part, and the holding part is used to fix the nozzle.

8. The wafer processing apparatus according to claim 7, characterized in that: It also includes a control unit, which is electrically connected to the moving mechanism and the driving mechanism; The control unit sends a signal to control the moving mechanism to drive the spraying mechanism to move in the first direction to the driving mechanism; The control unit sends a signal to control the drive mechanism to be fixed and to drive the spraying mechanism to move.

9. The wafer processing apparatus according to claim 8, characterized in that: The carrier mechanism includes a plurality of carrier components arranged sequentially along a first direction. Each carrier component includes a carrier platform for carrying a wafer.

10. The wafer processing apparatus according to claim 9, characterized in that: The support assembly also includes a cover surrounding the support platform, and a storage tank is provided between the support platform and the cover for storing excess treatment fluid.

11. The wafer processing apparatus according to claim 10, characterized in that: The support assembly also includes a plurality of lifting rods disposed around the periphery of the support platform. The plurality of lifting rods are disposed within the storage slot and are used to support the wafer onto the support platform.

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