Heat dissipation device
By using heat pipe components to construct a three-dimensional heat transport network in the heat dissipation device, the problem of low thermal conductivity of phase change materials is solved, achieving more efficient heat transfer and stable heat dissipation, and avoiding the deposition risk of traditional materials.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-21
- Publication Date
- 2026-03-31
AI Technical Summary
In existing heat dissipation devices, the phase change materials commonly used have low thermal conductivity. This causes the phase change materials in the vicinity of the heat source to melt rapidly, while the phase change materials in the area far from the heat source remain in a solid state for a long time, forming a significant temperature gradient and thermal resistance barrier, which limits the overall heat dissipation efficiency of the device.
A heat pipe assembly, including horizontal, transition, and vertical sections, is embedded within a phase change material. By connecting the heat pipes to flat plate heat pipes, heat transfer efficiency is improved. Furthermore, the properties of the heat pipes themselves are used to melt the phase change material located far from the flat plate heat pipes, thus constructing a highly efficient three-dimensional heat transport network.
It improves the heat dissipation performance of the heat dissipation device, reduces the proportion of solid phase change materials in areas far from the heat-generating components, enhances the stability and efficiency of heat transfer, and avoids the deposition risks associated with the use of materials such as graphene.
Smart Images
Figure CN121772192A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of thermal management technology for electronic devices, and more specifically, to a heat dissipation device. Background Technology
[0002] With the rapid development of fields such as artificial intelligence and aerospace, the integration of high-power electronic devices is becoming increasingly sophisticated, bringing more and more severe heat dissipation challenges. Furthermore, the operating power and heat dissipation requirements of electronic devices change accordingly under different operating modes, greatly increasing the complexity of thermal management systems.
[0003] Phase change heat dissipation technology utilizes the latent heat of phase change materials to achieve "time-space" dual-dimensional thermal management, becoming an effective way to solve the problem of intermittent high-power heat dissipation. However, although commonly used phase change materials, represented by paraffin, have high latent heat characteristics, their inherent thermal conductivity is generally lower than 0.3 W / (m·K), resulting in a serious lag in heat conduction inside the heat dissipation device: the phase change material in the area near the heat source melts due to rapid heat absorption, while the phase change material in the area far from the heat source remains in a solid state for a long time. This forms a significant temperature gradient and thermal resistance barrier, which greatly limits the overall heat dissipation efficiency of the heat dissipation device. Summary of the Invention
[0004] The technical problem to be solved by this application is to provide a heat dissipation device that breaks through the dimensional limitations of existing heat dissipation structures, constructs an efficient three-dimensional heat transport network, and thereby improves the heat dissipation performance of the heat dissipation device.
[0005] To solve the above-mentioned technical problems, this application adopts the following technical solution: This application provides a heat dissipation device, comprising: a housing having a receiving cavity, the bottom of the housing having an opening communicating with the receiving cavity; a phase change material disposed within the receiving cavity; a flat plate heat pipe connected to the housing and sealing the opening, the flat plate heat pipe being used to connect with a heating element; and a heat pipe embedded within the phase change material, the heat pipe comprising a horizontal section, a transition section, and a vertical section, the transition section connecting the horizontal section and the vertical section, and the horizontal section being connected to the flat plate heat pipe.
[0006] In one embodiment, the heat dissipation device includes at least one heat pipe group, each heat pipe group including at least two heat pipes, the two heat pipes being arranged along a first direction, the first direction, the extension direction of the horizontal segment, and the extension direction of the vertical segment being perpendicular to each other; in the heat pipe group, the horizontal segments of the two heat pipes are in contact with each other, and the area of the flat plate heat pipe corresponding to the horizontal segments of the two heat pipes forms an installation area, the installation area being used to connect with the flat plate heat pipe.
[0007] In one embodiment, the heat pipe has two transition sections and two vertical sections. The two ends of the horizontal section are respectively connected to the two transition sections, and the two vertical sections are respectively connected to the two transition sections.
[0008] In one embodiment, the heat pipe has one horizontal section, one transition section, and one vertical section. In the heat pipe group, the vertical sections of the two heat pipes are spaced apart along the extension direction of the horizontal section.
[0009] In one embodiment, the heat dissipation device includes a first heat dissipation fin, which is embedded in the phase change material.
[0010] In one embodiment, the heat dissipation device includes a first heat dissipation fin, which is embedded in the phase change material and disposed in the vertical section.
[0011] In one embodiment, the first heat dissipation fin is a plate-like structure, and the vertical section is provided with a plurality of the first heat dissipation fins, which are arranged at intervals along the axial direction of the vertical section.
[0012] In one embodiment, the first heat dissipation fin is a TPMS structure fin or a skeleton fin.
[0013] In one embodiment, the surface of the flat heat pipe facing the phase change material is provided with a second heat dissipation fin, which is embedded in the phase change material.
[0014] In one embodiment, the central region of the second heat dissipation fin has a receiving groove, and at least one horizontal section of the heat pipe is disposed in the receiving groove.
[0015] In one embodiment, the second heat dissipation fin includes multiple support ribs and multiple branches. The multiple support ribs are radially distributed and arranged around the receiving groove, and multiple branches are connected to both sides of the support ribs.
[0016] In one implementation, the height of the second heat dissipation fin is not less than the height of the horizontal segment along the extending direction of the vertical segment.
[0017] The technical solution of this application has the following beneficial effects: The heat pipe is embedded in the phase change material. The heat pipe includes a horizontal section, a transition section, and a vertical section. The transition section connects the horizontal and vertical sections, and the horizontal section connects to the flat plate heat pipe, thereby increasing the contact area between the heat pipe and the flat plate heat pipe. This allows more heat from the flat plate heat pipe to be transferred to the heat pipe. At the same time, the connection between the horizontal section and the flat plate heat pipe also improves the stability between the heat pipe and the flat plate heat pipe. Furthermore, since the heat pipe is embedded in the phase change material, after receiving a heat source, the heat pipe can use its own properties to transfer heat to the phase change material that is far away from the flat plate heat pipe, i.e., in the direction perpendicular to the flat plate heat pipe. This causes more of the phase change material to melt in the vertical direction, reducing the proportion of the phase change material that is still in a solid state in the area far from the heat-generating element, and improving the heat dissipation performance of the heat dissipation device. In addition, compared with heat dissipation methods such as filling the cavity with graphene or carbon fiber, there is a certain risk of deposition, which may lead to a deterioration of heat transfer performance. This application uses rigid heat pipes for heat dissipation, which is more reliable. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is an exploded structural diagram of the heat dissipation device provided in the embodiments of this application; Figure 2 This is a cross-sectional view of the heat dissipation device provided in an embodiment of this application; Figure 3 A schematic diagram of the structure of a heat pipe assembly and a first heat dissipation fin provided in an embodiment of this application; Figure 4 A schematic diagram of a structure for connecting a heat pipe to a first heat dissipation fin, provided in an embodiment of this application; Figure 5 A schematic diagram of the connection between the heat pipe assembly and the first heat dissipation fins provided in different embodiments of this application; Figure 6 This is a schematic diagram of another heat pipe and first heat dissipation fin provided in an embodiment of this application; Figure 7 A schematic diagram of another heat pipe and a first heat dissipation fin with a different structure provided in an embodiment of this application; Figure 8 This is a schematic diagram of another heat pipe assembly and first heat dissipation fin provided in an embodiment of this application; Figure 9This is a schematic diagram of the structure of the heat dissipation device provided in the embodiments of this application; Figure 10 This is a schematic diagram of the TPMS structure fin provided in the embodiments of this application; Figure 11 This is a schematic diagram of the IsoTruss structure fin provided in the embodiments of this application; Figure 12 This is a schematic diagram of the Octet structure fin provided in the embodiments of this application; Figure 13 This is a schematic diagram of the Weaire-Phelan structure fin provided in the embodiments of this application; Figure 14 Schematic diagrams of the heat dissipation devices provided in different embodiments of this application; Figure 15 Side view schematic diagram of the heat dissipation device provided in different embodiments of this application; Figure 16 A schematic diagram of the structure of a first type of second heat dissipation fin provided in different embodiments of this application; Figure 17 This is a schematic diagram of the structure of a second type of second heat dissipation fin provided in different embodiments of this application.
[0020] Icons: 1-Shell; 2-Flat plate heat pipe; 3-Heat pipe assembly; 31-Heat pipe; 311-Horizontal section; 312-Transition section; 313-Vertical section; 4-First heat dissipation fin; 5-Second heat dissipation fin; 51-Support rib; 52-Branch; 53-Receiving groove; 6-Cover plate; 7-Heating element. Detailed Implementation
[0021] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.
[0022] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0023] like Figure 1 , 2As shown in Figures 6, 8, and 9, embodiments of this application provide a heat dissipation device, comprising: a housing 1 having a receiving cavity, the bottom of the housing 1 having an opening communicating with the receiving cavity; a phase change material disposed within the receiving cavity, which melts upon contact with a heat source to achieve heat dissipation; the heat dissipation device further comprising a flat plate heat pipe 2 connected to the housing 1 and sealing the opening, the flat plate heat pipe 2 being used to connect to a heating element 7, the flat plate heat pipe 2 preferentially dissipating heat when the heating element 7 heats up, the heat generated by the heating element 7 effectively diffuses horizontally along the flat plate heat pipe 2, reducing the local heat of the heating element 7, and simultaneously promoting faster melting and heat absorption of the phase change material horizontally away from the heating element 7; the heat dissipation device further comprising a heat pipe 31 embedded within the phase change material, the heat pipe 31 encapsulating... It includes a horizontal section 311, a transition section 312, and a vertical section 313. The transition section 312 connects the horizontal section 311 and the vertical section 313. The horizontal section 311 is connected to the flat plate heat pipe 2, thereby increasing the contact area between the heat pipe 31 and the flat plate heat pipe 2, so that more heat from the flat plate heat pipe 2 can be transferred to the heat pipe 31. At the same time, the connection between the horizontal section 311 and the flat plate heat pipe 2 also improves the stability between the heat pipe 31 and the flat plate heat pipe 2. Meanwhile, since the heat pipe 31 is embedded in the phase change material, after receiving the heat source, the heat pipe 31 can use its own properties to transfer heat to the phase change material far away from the flat plate heat pipe 2, that is, in the direction perpendicular to the flat plate heat pipe 2, so that more phase change material in the longitudinal direction melts, reducing the area of the phase change material far away from the heating element 7 that is still in a solid state, and improving the heat dissipation performance of the heat dissipation device. In addition, compared with heat dissipation methods such as filling the cavity with graphene or carbon fiber, there is a certain risk of deposition, which may lead to a deterioration of heat transfer performance. However, the embodiments of this application use rigid heat pipes 31 for heat dissipation, which is more reliable.
[0024] Optionally, the horizontal section 311 and the flat plate heat pipe 2 can be connected by welding or screwing, and the heating element 7 is set on the side of the flat plate heat pipe 2 away from the receiving cavity, and the horizontal section 311 is directly opposite the heating element 7, so as to achieve efficient collection of heat generated by the heating element 7.
[0025] Optionally, the flat plate heat pipe 2 can be in the form of a rectangular, circular, or irregularly shaped thin plate, and can be made of various materials such as copper, stainless steel, nickel, and aluminum using 3D printing or machining. The interior of the flat plate heat pipe 2 is a closed chamber. The inner chamber wall is fabricated with a liquid wick structure through processes such as microgrooving channels, sintered powder, and sintered wire mesh. The liquid wick structure is a porous / microchannel structure with capillary force to provide the driving force for condensate reflux and increase the evaporation / condensation area, thereby maintaining the continuous and efficient operation of the two-phase cycle. The internal chamber of the flat plate heat pipe 2 is filled with a cooling medium such as ammonia or tetrafluoroethane.
[0026] Optionally, the microgroove flow channel structure can be created by 3D printing, or by direct machining, laser etching, or chemical etching on copper, stainless steel, nickel, or aluminum substrates to form trapezoidal / rectangular / triangular grooves; the sintering powder can be fine-grained copper powder placed in the chamber, compacted in the mold, and sintered at 850–950 °C in a hydrogen atmosphere to form a porous layer; the sintered wire mesh can be one or more layers of 100–400 mesh copper / stainless steel mesh, which are spot-welded for positioning and then sintered at high temperature.
[0027] Optionally, the flat plate heat pipe 2 relies on the phase change (evaporation and condensation) cycle of the internal cooling medium to achieve efficient heat transfer and diffusion from the heating element 7 to the condensation side. Evaporation (Endothermic) Stage: The side of the flat plate heat pipe 2 away from the receiving cavity is in close contact with the heating element 7. When the heating element 7 is working, the heat generated is transferred to the inner chamber wall of the evaporation section of the flat plate heat pipe 2 through heat conduction. The cooling working fluid is adsorbed onto the inner chamber wall by the liquid wick structure of the inner chamber wall under the action of the liquid wick. When heat is introduced, the liquid phase cooling working fluid absorbs heat and boils rapidly and turns into a gas phase (vapor). This process rapidly absorbs a large amount of heat due to the latent heat of vaporization, thereby effectively reducing the temperature of the heating element 7. The vapor diffuses to the rest of the part away from the heating element 7. When the vapor encounters the cooler inner wall surface, it releases the latent heat of vaporization and recondenses into a liquid working fluid. The released heat is conducted to the phase change material and heat pipe 31 through the side of the flat plate heat pipe 2 away from the heating element 7, and is finally carried away by the phase change material and heat pipe 31. The condensed liquid working fluid flows back to the side in contact with the heating element 7 under the action of capillary force generated after encountering the liquid wick, completing one cycle.
[0028] Optionally, the interior of the flat plate heat pipe 2 is a low-thickness chamber. The high-pressure steam generated by evaporation quickly diffuses into the area with lower pressure and lower temperature within the chamber. The low-thickness chamber makes the steam transmission path very short and the resistance low, so the heat can be quickly diffused throughout the entire chamber, improving the heat dissipation efficiency.
[0029] Optionally, the heat pipe 31 can be a high thermal conductivity round or flat tube made of materials such as copper, aluminum, or nickel, with an internal sealed cavity structure filled with a two-phase coolant such as ammonia or R134a. At the same time, the internal cavity wall can also be designed as a liquid wick structure such as microgroove channels, sintered powder, or sintered wire mesh to achieve efficient heat transfer along the vertical section 313. In addition, when the heat dissipation device is accidentally tilted or briefly reversed, the capillary force generated after the coolant comes into contact with the liquid wick can temporarily pull the liquid away, preventing the evaporation area from drying out and burning. If the condensation area is covered with a sintered layer, the capillary force generated after the liquid film of the coolant in the liquid state comes into contact with the sintered layer can be "absorbed" into the hole, keeping a thin layer of condensation on the outer surface, thus improving the overall heat transfer coefficient.
[0030] Optionally, the sealed cavity inside the heat pipe 31 can be divided into three regions: an evaporation region, an insulation region, and a condensation region. The horizontal section 311 and the transition section 312 can have an evaporation region and a portion of the insulation region, while the vertical section 313 has another portion of the insulation region. Alternatively, the horizontal section 311 can have an evaporation region, the transition section 312 can have an insulation region, and the vertical section 313 can have a condensation region. Of course, the interior of the heat pipe 31 can also only have an evaporation region and a condensation region. The external heating element 7 transfers heat to the liquid working fluid in the evaporation region through the horizontal section 311. The liquid working fluid absorbs latent heat, transforms into a gas, and passes through the insulation region to reach the condensation region. In the condensation region, the gaseous working fluid releases latent heat to the external cold source through the wall and condenses into a liquid. The condensate flows back to the evaporation section on the wall of the sealed cavity under the action of the liquid suction core, centrifugal force, and gravity, and continues to absorb latent heat and circulate continuously.
[0031] Optionally, the heating element 7 in this embodiment can be an electronic device, battery, or electrical appliance, etc., and the heating element 7 can be connected to the flat heat pipe 2 with low thermal resistance by welding. Of course, it can also be connected by thermally conductive adhesive.
[0032] Optionally, in some cases, the flat heat pipe 2 can be integrally fabricated with the housing 1 using 3D printing technology.
[0033] like Figure 1 and 2 As shown, optionally, the heat dissipation device also includes a cover plate 6. The cover plate 6 and the flat heat pipe 2 are located at both ends of the housing 1. By setting the cover plate 6, the cavity can be sealed to prevent the phase change material from flowing out of the cavity. Of course, the housing 1 and the cover plate 6 can also be integrally formed. The housing 1 and the cover plate 6 can be made of materials such as stainless steel and aluminum to play the role of supporting structure, and at the same time promote the conduction of heat between phase change materials in different areas to a certain extent.
[0034] Optionally, the phase change material can be completely filled into the cavity, or only partially filled.
[0035] Optionally, heat pipe 31 can be a gravity heat pipe.
[0036] like Figure 3 , 4As shown in Figure 8, in one embodiment, the heat dissipation device includes at least one heat pipe group 3. Each heat pipe group 3 includes two heat pipes 31, which are arranged along a first direction. The first direction, the extension direction of the horizontal segment 311, and the extension direction of the vertical segment 313 are perpendicular to each other. By configuring the two heat pipes 31 into a heat pipe group 3, the heat dissipation device can arrange the heat pipe groups 3 in groups within the housing 1, which improves assembly efficiency compared to arranging the heat pipes 31 one by one. In the heat pipe group 3, the horizontal segments 311 of the two heat pipes 31 are close together and arranged along the first direction. This makes the two horizontal segments 311 parallel and concentrated together along the first direction, forming a more concentrated contact surface. When connected to the flat plate heat pipe 2, the heat transfer efficiency is improved. The area corresponding to the horizontal segments 311 of the two heat pipes 31 on the flat plate heat pipe 2 forms an installation area. The installation area is used to connect with the flat plate heat pipe 2. By setting the installation area, it is convenient to position and assemble the heat pipe group 3 with the flat plate heat pipe 2, thereby improving the installation efficiency.
[0037] Optionally, the mounting area can be a positioning groove or a positioning hole, and the heating element 7 can be directly facing the mounting area.
[0038] Optionally, the number of installation areas corresponds to the number of heating elements 7, that is, there can be multiple heating elements 7. Of course, the number of heat pipe groups 3 also corresponds to the number of heating elements 7.
[0039] like Figures 3 to 5 As shown, in one embodiment, the heat pipe 31 has two transition sections 312 and two vertical sections 313. The two ends of the horizontal section 311 are respectively connected to the two transition sections 312, and the two vertical sections 313 are respectively connected to the two transition sections 312. One heat pipe 31 includes two transition sections 312 and two vertical sections 313, thereby increasing the contact area between a single heat pipe 31 and the phase change material, improving the heat exchange area. When two heat pipe groups 3 are grouped together, since the two horizontal sections 311 are attached and arranged along the first direction, the stability between the heat pipe group 3 and the flat plate heat pipe 2 is improved, and the heat exchange efficiency is also improved.
[0040] Optionally, since the first heat dissipation fins 4 need to be installed on the two adjacent vertical sections 313, the two vertical sections 313 on the same heat pipe 31 are spaced apart to provide sufficient installation space, while the transition section 312 is a curved structure to facilitate the connection of the horizontal section 311 and the vertical section 313.
[0041] like Figures 6 to 8As shown, in one embodiment, the heat pipe 31 has only one horizontal section 311, one transition section 312, and one vertical section 313. A heat pipe 31 with one vertical section 313 and one transition section 312 is easier to arrange and easier to set up based on different installation areas. In the heat pipe group 3, the vertical sections 313 of the two heat pipes 31 are spaced apart along the extension direction of the horizontal section 311. This allows the two heat pipes 31 in a heat pipe group 3 to be arranged spaced apart along the extension direction of the horizontal section 311, and the two transition sections 312 to face different directions. The two heat pipes 31 are bent so that their horizontal sections 311 fit together. Compared with a single heat pipe 31 having two vertical sections 313 and two transition sections 312, the heat pipe 31 has the same heat exchange area, but only has an additional horizontal section 311 that does not exchange heat. That is, the heat pipe 31 has one horizontal section 311, one transition section 312 and one vertical section 313. The heat pipe group 3 consisting of two heat pipes has the same heat exchange area as a single heat pipe 31 having two vertical sections 313 and two transition sections 312, but has a larger contact area with the flat plate heat pipe 2 and better stability.
[0042] like Figure 4 , 5 As shown in Figure 8, in one embodiment, the heat dissipation device includes a first heat dissipation fin 4, which is embedded in the phase change material. In the heat pipe assembly 3, at least two vertical sections 313 share the first heat dissipation fin 4, which occupies more phase change material, increases the contact area with the phase change material, and improves the heat dissipation effect. Of course, each vertical section 313 may also be provided with a first heat dissipation fin 4, which makes the layout more convenient, and with the same volume of the shell 1, more phase change material can be filled, increasing the density of the phase change material.
[0043] Optionally, the first heat dissipation fin 4 can be welded to the vertical section 313 or set on the transition section 312. Multiple first heat dissipation fins 4 can be set, which can be conventional sheet-like or an irregular structure manufactured by 3D printing.
[0044] like Figure 6 and 7 As shown, optionally, the first heat dissipation fin 4 can be a conventional rectangular, circular, or staggered pin fin shape sheet structure. like Figure 2 As shown, in one embodiment, the heat dissipation device includes a first heat dissipation fin 4, which is embedded in the phase change material. The first heat dissipation fin 4 is disposed in the vertical section 313. The heat dissipation fin 4 receives the heat from the vertical section 313 and transfers the heat to the phase change material. The first heat dissipation fin 4 can also melt the phase change material in the area away from the heat-generating element 7. Together with the vertical section 313, more phase change material is melted in the longitudinal direction within the housing 1, thereby improving the heat dissipation efficiency.
[0045] like Figure 6 and 7 As shown, in one embodiment, the first heat dissipation fin 4 is a plate-shaped structure, and a plurality of first heat dissipation fins 4 are provided on the vertical section 313. The plurality of first heat dissipation fins 4 are arranged at intervals along the axial direction of the vertical section 313 to increase the contact area with the phase change material, so that more phase change material can be melted and the heat dissipation effect is improved.
[0046] Optionally, there can be multiple first heat dissipation fins 4, arranged in parallel or spiral configurations. This type of arrangement is inexpensive to manufacture and can be produced by machining, and then coupled and integrated with the vertical section 313. In some cases, the variable parameters such as fin spacing, size, and shape can be optimized.
[0047] like Figures 10 to 13 As shown, in one embodiment, the first heat dissipation fin 4 is a TPMS structure fin or a skeleton fin. Compared with ordinary plate fins, TPMS structure fins have more contact area with phase change materials under the condition of a certain mass, thereby further improving the heat dissipation efficiency of the heat dissipation device; while skeleton fins have strong structural strength and occupy a low proportion of space in the cavity because their overall skeleton structure is strong.
[0048] like Figure 10 As shown, optionally, TPMS is a type of three-dimensional curved surface structure with periodic repeating units. This type of structure has high connectivity and periodicity, and can be precisely controlled by implicit functions, allowing direct control of basic parameters such as porosity and specific surface area through mathematical expressions. Compared with ordinary plate-shaped fins, TPMS fins have a larger contact area with the phase change material under the same mass, thereby improving heat dissipation efficiency. Truss-type skeleton fins can also be designed in combination with periodic lattice structures. These fins have excellent structural strength and low space occupation. TPMS fins and truss-type skeleton fins are made possible by the gradual maturation of 3D printing technology. Based on the surface characteristic equation, the corresponding irregular fin design is completed using software such as MATLAB and nTopology. In this step, by adjusting the formula parameters to set parameters such as unit size, number, and wall thickness, different porosities and density effects are obtained, resulting in a geometric file. Then, 3D printing technology is used to complete the fin manufacturing. The following lists several common surface equations, where x, y, and z are three-dimensional spatial coordinates, and c is a set value controlling the proportion of the spatially segmented volume. Examples of the constructed single unit and overall fin styles are shown below: Gyroid surface equation: sin(x)cos(y) + sin(y)cos(z) + cos(x)sin(z) = c, from which we can obtain Figure 10TPMS fins in the middle; Diamond surface equation: sin(x)sin(y)sin(z)+sin(x)cos(y)cos(z)+cos(z) sin(y)cos(z)+cos(x)cos(y)sin(z)=c; you can get Figure 11 TPMS fins in the middle; Split P equation: 1.1×(sin(2x)sin(z)cos(y)+sin(2y)sin(x)cos(z)+sin(2z)sin(y)cos(x))-0.2×(cos(2 x)cos(2y)+cos(2y)cos(2z)+cos(2z)cos(2x))-0.4×(cos(2x)+cos(2y)+cos(2z))=c, you can get Figure 12 TPMS fins in the middle; It can also be a truss-type skeleton fin, such as Figures 11 to 13 As shown, structures such as the IsoTruss structure, Octet structure, and Weaire-Phelan structure have stronger structural strength because the truss-type skeleton fins have an overall skeleton structure.
[0049] like Figure 14 and 15 As shown, in one embodiment, a second heat dissipation fin 5 is provided on the surface of the flat heat pipe 2 facing the phase change material. The second heat dissipation fin 5 is embedded in the phase change material. By providing the second heat dissipation fin 5 on the surface of the flat heat pipe 2 facing the phase change material, the area of the flat heat pipe 2 facing the cavity where the first heat dissipation fin 4 is not provided can be fully utilized, thereby increasing the heat transfer capacity between the flat heat pipe 2 and the phase change material, thereby improving the heat dissipation efficiency. At the same time, it also avoids the phase change material in the area far from the flat heat pipe 2 being solid.
[0050] Optionally, the second heat dissipation fin 5 can be welded to the flat heat pipe 2, or it can be fabricated together with the side of the flat heat pipe 2 facing the cavity using 3D printing technology.
[0051] Optionally, the first heat dissipation fin 4 can be fixed on the vertical section 313 and the transition section 312.
[0052] like Figure 16 and 17 As shown, in one embodiment, the central region of the second heat dissipation fin 5 has a receiving groove 53, and at least one horizontal section 311 of the heat pipe 31 is disposed in the receiving groove 53. By providing the receiving groove 53, an installation area is provided for the horizontal section 311, which facilitates the positioning of the heat pipe 31.
[0053] Optionally, the area of the receiving groove 53 is adapted to the area of the installation area.
[0054] Optionally, each receiving slot 53 can accommodate two horizontal sections 311, i.e., a heat pipe assembly 3 can be installed.
[0055] like Figure 16 and 17 As shown, in one embodiment, the second heat dissipation fin 5 includes multiple support ribs 51 and multiple branches 52. The multiple support ribs 51 are radially distributed and arranged around the receiving groove 53. Since the support ribs 51 have a certain height, the multiple support ribs 51 improve the heat transport capacity to the phase change material in the vertical direction. At the same time, since the multiple support ribs 51 are radially distributed around the receiving groove 53, each support rib 51 can also transfer the heat source in the central area to different directions, which also improves the heat dissipation in the horizontal direction. Meanwhile, multiple branches 52 are connected to both sides of the support ribs 51. The branches 52 are located between two adjacent support ribs 51, which transfer heat to areas not covered by the support ribs 51, making the heat transfer more comprehensive and uniform. This allows the phase change material in areas where the first heat dissipation fin 4 is not provided to melt, thereby making full use of the area in the receiving cavity that can be designed as a heat dissipation fin and improving the heat dissipation efficiency of the heat dissipation device.
[0056] Optionally, the branch 52 can be snowflake-shaped or have a zigzag rib structure.
[0057] Optionally, when viewed along the extension direction of the vertical segment 313, the second heat dissipation fin 5 is net-like or snowflake-like. The net-like shape can be spider web-like, or it can be a biomimetic shape such as leaf vein.
[0058] Optionally, the second heat dissipation fin 5 can be directly printed using 3D printing technology.
[0059] Optionally, the support rib 51 can be straight or wavy.
[0060] like Figure 15 As shown, in one embodiment, along the extension direction of the vertical section 313, the height of the second heat dissipation fin 5 is not less than the height of the horizontal section 311. Due to the existence of the horizontal section 311 and the fact that the horizontal section 311 has a certain thickness, the first heat dissipation fin 4 cannot be installed on the horizontal section 311. This results in a certain gap between the transition section 312 and the flat plate heat pipe 2 when no phase change material is filled. The heat can only be transferred to the phase change material by the flat plate heat pipe 2, which causes the phase change material far from the flat plate heat pipe 2 to melt more slowly or not at all. By designing the height of the second heat dissipation fin 5 to be no less than the height of the horizontal section 311, the second heat dissipation fin 5 can make full use of the area of the horizontal section 311 where the first heat dissipation fin 4 is not installed, thereby improving the heat dissipation efficiency of the heat dissipation device.
[0061] In one embodiment, the horizontal segment 311 has a contact surface that is in contact with the flat plate heat pipe 2. The contact surface is a plane, that is, the horizontal segment 311 is a flat heat pipe. This can increase the contact area with the flat plate heat pipe 2 and improve stability.
[0062] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.
[0063] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
[0064] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
Claims
1. A heat dissipating device, characterized by, The heat dissipation device comprises: a shell having a containing cavity, a bottom of the shell having an opening communicating with the containing cavity; a phase change material arranged in the containing cavity; a flat heat pipe connected with the shell and closing the opening, the flat heat pipe being used for connecting with a heat generating element; a heat pipe embedded in the phase change material, the heat pipe comprising a horizontal section, a transition section and a vertical section, the transition section connecting the horizontal section and the vertical section, the horizontal section being connected with the flat heat pipe.
2. The heat dissipating device according to claim 1, wherein The heat dissipation device comprises at least one heat pipe group, each of the heat pipe groups comprising at least two heat pipes, the two heat pipes being arranged along a first direction, the first direction, an extension direction of the horizontal section and an extension direction of the vertical section being perpendicular to each other. In the heat pipe group, the horizontal sections of the two heat pipes are in abutment, a mounting area of the flat heat pipe corresponding to the horizontal sections of the two heat pipes is formed, and the mounting area is used for connecting with the flat heat pipe.
3. The heat dissipating device according to claim 2, wherein The transition section and the vertical section of the heat pipe are both two, and the two ends of the horizontal section are respectively connected with the two transition sections, and the two vertical sections are respectively connected with the two transition sections.
4. The heat dissipating device of claim 2, wherein The horizontal section, the transition section and the vertical section of the heat pipe are all one, and in the heat pipe group, the vertical sections of the two heat pipes are arranged in the extension direction of the horizontal section.
5. The heat dissipating device according to claim 3 or 4, characterized in that The heat dissipation device comprises a first heat dissipation fin embedded in the phase change material. In the heat pipe group, at least two vertical sections share the first heat dissipation fin, or each vertical section is separately provided with the first heat dissipation fin.
6. The heat dissipating device of claim 1, wherein The heat dissipation device comprises a first heat dissipation fin embedded in the phase change material, and the first heat dissipation fin is arranged in the vertical section.
7. The heat dissipating device according to claim 6, wherein The first heat dissipation fin is a plate structure, the vertical section is provided with a plurality of first heat dissipation fins, and the plurality of first heat dissipation fins are arranged in the axial direction of the vertical section.
8. The heat dissipating device of claim 6, wherein, The first heat dissipation fin is a TPMS structure fin or a skeleton type fin.
9. The heat dissipating device according to any one of claims 1 to 4 and 6 to 8, characterized in that, The flat heat pipe is provided with a second heat dissipation fin on a surface facing the phase change material, and the second heat dissipation fin is embedded in the phase change material.
10. The heat dissipating device according to claim 9, wherein A central region of the second heat dissipation fin has a containing groove, and the horizontal section of at least one heat pipe is arranged in the containing groove.
11. The heat dissipating device according to claim 10, wherein The second heat dissipation fin comprises a plurality of supporting ribs and a plurality of branch parts, the plurality of supporting ribs are radially distributed and arranged around the containing groove, and the two sides of the supporting rib are connected with the plurality of branch parts.
12. The heat dissipating device of claim 9, wherein, In the extension direction of the vertical section, the height of the second heat dissipation fin is not less than the height of the horizontal section.